Positioning device, mounting device, positioning method, and positioning system

Abstract

To provide a positioning device capable of improving the accuracy of the correction of a positional deviation caused by heat distortion.SOLUTION: The positioning device includes a first light guide body including a first feature part, a first imaging device for imaging a first object through the first light guide body, and an arithmetic device. The first imaging device images a first object image relating to the first object and a first image relating to the first feature part. The arithmetic device determines the relative position of the first object with respect to a second object on the basis of the first object image and the first image.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present disclosure relates to a positioning device, a mounting device, a positioning method, and a positioning system. [Background technology]

[0002] For example, Patent Document 1 discloses a positioning device that includes a tool for suctioning a component, a stage on which a board is placed, a top-bottom simultaneous observation camera having an upper camera and a lower camera, and a target located above the top-bottom simultaneous observation camera. The target and the stage are each provided with a target mark.

[0003] In the positioning device of Patent Document 1, the amount of misalignment of the upper camera and the amount of misalignment of the lower camera are calculated by capturing images of a target mark with an upper camera and a lower camera. Then, the amount of relative misalignment between the upper camera and the lower camera is calculated, and the component and the board can be aligned based on the amount of relative misalignment. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 3569820 Summary of the Invention [Problem to be solved by the invention]

[0005] However, it is difficult to grasp the positional deviation caused by thermal distortion of the optical system in a top and bottom simultaneous observation camera. Therefore, there is still room for improvement in terms of correcting the positional deviation caused by thermal distortion.

[0006] The present disclosure is intended to solve the above-mentioned problems and to provide a positioning device capable of improving the accuracy of correcting positional deviation caused by thermal distortion. [Means for solving the problem]

[0007] The positioning device of the present disclosure comprises a first light guide having a first characteristic portion, a first imaging device that images a first object through the first light guide, and a computing device, wherein the first imaging device captures a first object image of the first object and a first image of the first characteristic portion, and the computing device determines a relative position of the first object with respect to a second object based on the first object image and the first image.

[0008] In the mounting device according to the present disclosure, the first object is a component, the second object is a board, and the mounting device further includes a holding head that holds the component and a positioning device, and the holding head mounts the component on the board.

[0009] A positioning method according to the present disclosure includes a first imaging device capturing a first image of a first feature provided on a first light guide through a first light guide, a first imaging device capturing a first object image of a first object through the first light guide, and a computing device determining a relative position of the first object with respect to a second object based on the first object image and the first image.

[0010] The positioning system according to the present disclosure is a positioning system including a positioning device and a processing device that communicates with the positioning device via a network, wherein the positioning device includes a first light guide having a first feature portion, a first imaging device that images a first object through the first light guide, and a first communication unit, and the processing device includes a second communication unit and a calculation device, wherein the first imaging device images a first object image of the first object and a first image of the first feature portion, the first communication unit transmits the first object image and the first image to the second communication unit, the second communication unit receives the first object image and the first image, and the calculation device determines a relative position of the first object with respect to the second object based on the first object image and the first image. Effect of the Invention

[0011] According to the present disclosure, it is possible to provide a positioning device that can improve the accuracy of correcting positional deviation caused by thermal distortion. [Brief description of the drawings]

[0012] [Figure 1] Schematic diagram of a mounting device according to a first embodiment of the present disclosure. [Diagram 2] A perspective view of an imaging unit [Diagram 3] End view of the imaging unit [Figure 4] Top view of the imaging unit [Diagram 5] Calibration fixture side view [Figure 6] A side view of the imaging unit and the calibration jig. [Figure 7] A side view of the imaging unit and the calibration jig. [Figure 8A] Schematic diagram of a mounting device during mounting operation [Figure 8B] Schematic diagram of a mounting device during mounting operation [Figure 8C] Schematic diagram of a mounting device during mounting operation [Figure 8D] Schematic diagram of a mounting device during mounting operation [Figure 8E] Schematic diagram of a mounting device during mounting operation [Figure 8F] Schematic diagram of a mounting device during mounting operation [Figure 9A] A diagram showing the first image [Figure 9B] A diagram showing the second image [Figure 10A] Part images [Figure 10B] Diagram showing location image [Figure 10C] FIG. 10A and FIG. 10B are overlapped. [Figure 11A] Diagram showing the reference position of the recognition mark [Figure 11B] Diagram showing the reference position of the recognition mark [Figure 12] FIG. 11A and FIG. 11B are superimposed. [Figure 13A] FIG. 13 is a diagram showing movement of the field of view of the first imaging device; [Figure 13B] Diagram showing the determined position of parts [Figure 13C] A diagram showing the amount of positional deviation to be corrected [Figure 14] A diagram showing a light guide that is a separate member from the reflecting surface. [Figure 15] FIG. 13 is a diagram showing the third and fourth opposing positions of the imaging units; [Figure 16] Block diagram of a positioning system according to a second embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0014] [Embodiment 1] (Overall composition) Fig. 1 is a schematic diagram of a mounting device 1 according to a first embodiment of the present disclosure. Fig. 2 is a perspective view of an imaging unit 6. In the figure, the Z direction is the up-down direction, and the X and Y directions are perpendicular to each other and to the Z direction.

[0015] As shown in FIG. 1, the mounting apparatus 1 is an apparatus that mounts a component 11 on a substrate 12. The component 11 is a thin plate-like member, such as a die or an IC chip. The component 11 is formed of a material such as silicon, gallium nitride, or silicon carbide. The substrate 12 is a plate-like member, and may be circular or rectangular. The substrate 12 is formed of a material such as silicon, glass, stainless steel, or resin. The component 11 and the substrate 12 are provided with recognition marks for alignment.

[0016] The mounting apparatus 1 includes a component supply unit 2, a pickup head 3, a reversing unit 4, a holding head 5, an imaging unit 6, a calibration jig 7, a stage 8, and a control unit C.

[0017] The component supply unit 2 is configured to supply the components 11. The component supply unit 2 supports, for example, a wafer and supplies the components 11 from the wafer.

[0018] The pick-up head 3 holds the component 11 supplied from the component supply unit 2 and delivers it to the holding head 5. Specifically, the pick-up head 3 holds one side of the component 11 and delivers the component 11 to the holding head 5 so that the holding head 5 holds the other side.

[0019] The reversing unit 4 is configured to reverse the front and back of the component 11. The reversing unit 4 changes the pickup head 3 holding one side of the component 11 from a downward orientation to an upward orientation (indicated by a dotted line). As a result, the component 11 is also changed from a downward orientation to an upward orientation, and is held by the holding head 5 in the upward orientation.

[0020] The holding head 5 holds the component 11 received from the pick-up head 3 and mounts it on the board 12. The holding head 5 has a suction tool 51, and uses the suction tool 51 to suck and hold the component 11. The holding head 5 is movable relative to the pick-up head 3 and the stage 8 by a head moving device 52.

[0021] The imaging unit 6 is configured to capture images for aligning the component 11 and the board 12. As shown in Fig. 2, the imaging unit 6 has a first imaging device 61, a second imaging device 62, a first light guiding body 63, a second light guiding body 64, and an imaging moving device 69. The light guiding bodies 63 and 64 are members through which light passes.

[0022] The first imaging device 61 images an area above the imaging unit 6 through the first light guide 63, and the second imaging device 62 images an area below the imaging unit 6 through the second light guide 64. That is, the imaging unit 6 has two fields of view, an upper field and an lower field. As shown in FIG. 1, when the component 11 is located above the board 12, the component 11 is located above the imaging unit 6, and the board 12 is located below the imaging unit 6. Therefore, the first imaging device 61 images the component 11 through the first light guide 63, and the second imaging device 62 images the board 12 through the second light guide 64.

[0023] The first light guide 63 is provided with a first characteristic portion 67, and the second light guide 64 is provided with a second characteristic portion 68. The characteristic portions 67, 68 are portions of the light guides 63, 64 that can be imaged by the imaging devices 61, 62, respectively. The characteristic portions 67, 68 may be, for example, recognition marks or surface shapes such as unevenness provided on the surfaces of the light guides 63, 64, or may be edges or corners of the light guides 63, 64. Therefore, the first imaging device 61 further images the first characteristic portion 67, and the second imaging device 62 further images the second characteristic portion 68.

[0024] Returning to FIG. 1, the imaging moving device 69 moves the imaging unit 6 relative to the holding head 5 and the stage 8. The imaging moving device 69 can move the imaging unit 6 between an imaging position when imaging is performed and a retreat position different from the imaging position. The imaging position is a position between the component 11 and the board 12 when the component 11 is located above the board 12. At the imaging position, specifically, the light guides 63 and 64 are located between the component 11 and the board 12, and the imaging devices 61 and 62 are located to the sides of the light guides 63 and 64. The retreat position is a position away from the movement path of the holding head 5 in the mounting operation. At the retreat position, for example, the light guides 63 and 64 are located at a position moved in the +X direction relative to the imaging position. The imaging devices 61 and 62 may also move in the +X direction together with the light guides 63 and 64. In summary, when the imaging devices 61 and 62 capture images, the imaging unit 6 is located at the imaging position, and when the holding head 5 mounts the component 11 on the board 12, the imaging unit 6 is located at the retracted position.

[0025] The calibration jig 7 is a jig for adjusting the optical path length from the imaging devices 61, 61 to the characteristic parts 67, 68 so as to facilitate imaging of the characteristic parts 67, 68. The calibration jig 7 has two reflecting surfaces R1, R11 (a third reflecting surface R1 and a fourth reflecting surface R11). When the calibration jig 7 is disposed around the imaging unit 6, the reflecting surfaces R1, R11 face the characteristic parts 67, 68, respectively. Therefore, the third reflecting surface R1 reflects the optical path from the first characteristic part 67 so as to return to the first characteristic part 67, and the fourth reflecting surface R11 reflects the optical path from the second characteristic part 68 so as to return to the second characteristic part 68.

[0026] The stage 8 supports the substrate 12. The stage 8 may have a heater that heats the substrate 12 and the component 11 close to the substrate 12. Providing the heater facilitates bonding between the component 11 and the substrate 12. On the other hand, heating by the heater may cause thermal distortion of the imaging unit 6.

[0027] The control unit C is a component that controls the mounting apparatus 1. The control unit C includes, for example, a general-purpose processor such as a CPU, MPU, FPGA, DSP, or ASIC that realizes a predetermined function by executing a program. The control unit C realizes its function by executing a program stored in a memory (not shown). The control unit C is not limited to a unit that realizes a predetermined function through the cooperation of hardware and software, and may be a hardware circuit designed specifically to realize the predetermined function.

[0028] The control unit C includes a calculation device C1 and a storage unit C2. The calculation device C1 determines the relative position of the component 11 with respect to the board 12 based on the image captured by the imaging unit 6. The storage unit C2 stores information such as images captured by the imaging devices 61 and 62. The storage unit C2 may be, for example, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, DVD or other optical disk storage, magnetic cassette, magnetic tape, magnetic disk storage or other magnetic storage device.

[0029] The imaging unit 6, the calibration jig 7, and the control unit C including the calculation device C1 together constitute a positioning device 9 of the mounting apparatus 1. The positioning device 9 is a device that positions the component 11 held by the holding head 5 with respect to the board 12.

[0030] Next, the imaging unit 6 will be described in more detail with reference to Figures 2 to 4. Figure 3 is an end view of the imaging unit 6 of Figure 2 as seen from the -Y direction. Figure 4 is a top view of the imaging unit 6.

[0031] The two imaging devices 61 and 62 each include, for example, imaging elements 61a and 62a such as CCD cameras and an optical system such as a lens. As shown in Fig. 2, the first imaging device 61 and the second imaging device 62 are located on the lateral side (-Y side) of the first light guide 63 and the second light guide 64.

[0032] The imaging unit 6 has a first reflecting optical system 65 and a second reflecting optical system 66 in addition to a first light guiding body 63 and a second light guiding body 64. The light guiding bodies 63, 64 and the reflecting optical systems 65, 66 will be described below.

[0033] The first light guide 63 has a structure that transmits light that can be imaged by the first imaging device 61 from one surface to another surface. The first light guide 63 is, for example, a triangular prism and may be called a first prism. In the first embodiment, the first light guide 63 is an isosceles right-angled triangular prism. The first light guide 63 has a first incident surface P1 that is an upper surface, a first reflecting surface P2 that is an inclined surface, and a first exit surface P3 that is a side surface. A first feature portion 67 is provided on the first incident surface P1. The first incident surface P1 and the first exit surface P3 are orthogonal to each other, and the first reflecting surface P2 is provided at an angle with respect to the first incident surface P1. Specifically, the first reflecting surface P2 is inclined by 45° around the Y axis with respect to the first incident surface P1.

[0034] The second light guide 64 has a structure that transmits light that can be imaged by the second imaging device 62 from one surface to another surface. The second light guide 64 may be similar to the first light guide 63, and may be called a second prism. The second light guide 64 has a second entrance surface P11 that is a lower surface, a second reflection surface P12 that is an inclined surface, and a second exit surface P13 that is a side surface. A second feature portion 68 is provided on the second entrance surface P11. The second entrance surface P11 and the second exit surface P13 are perpendicular to each other, and the second reflection surface P12 is provided at an angle with respect to the second entrance surface P11. Specifically, the second reflection surface P12 is inclined at 45° around the Y axis with respect to the second entrance surface P11. In terms of the positional relationship with the first light guide 63, the second entrance surface P11, the second reflecting surface P12, and the second exit surface P13 are parallel to the first entrance surface P1, the first reflecting surface P2, and the first exit surface P3, respectively.

[0035] The first light guide 63 and the second light guide 64 may be integrally formed. In the first embodiment, the first light guide 63 and the second light guide 64 have a configuration in which two triangular prisms are bonded to each other at their inclined surfaces. Therefore, the second reflecting surface P12 faces the first reflecting surface P2 and is in a relationship of front and back of the same plane.

[0036] The first reflecting optical system 65 is, for example, a reflecting prism or a reflecting mirror. The first reflecting optical system 65 has a fifth reflecting surface P5. The fifth reflecting surface P5 is inclined at 45° around the Z axis with respect to the first exit surface P3.

[0037] The second reflecting optical system 66 may be, for example, a reflecting prism or a reflecting mirror, similar to the first reflecting optical system 65. The second reflecting optical system 66 has a sixth reflecting surface P15. The sixth reflecting surface P15 is inclined at 45° around the Z axis with respect to the second exit surface P13.

[0038] Here, the first optical path L1 that passes through the first light guide 63 and the first reflection optical system 65 and enters the first imaging device 61 from the first characteristic portion 67 of the first incident surface P1 will be described. As shown in FIG. 3, the first optical path L1 enters perpendicular to the first incident surface P1. The first optical path L1 is reflected by the first reflecting surface P2 from the first incident surface P1 toward the first exit surface P3. Specifically, the first optical path L1 extending in the -Z direction is bent 90° in the +X direction by the first reflecting surface P2. The first optical path L1 exits from the first light guide 63 through the first exit surface P3. As shown in FIG. 4, the exiting first optical path L1 is reflected by the fifth reflecting surface P5 from the first exit surface P3 toward the first imaging device 61. Specifically, the first optical path L1 extending in the +X direction is bent 90° in the -Y direction by the fifth reflecting surface P5.

[0039] Next, the second optical path L11 that passes through the second light guide 64 and the second reflection optical system 66 and enters the second imaging device 62 from the second feature portion 68 of the second incident surface P11 will be described. As shown in FIG. 3, the second optical path L11 is incident perpendicularly to the second incident surface P11. The second optical path L11 is reflected by the second reflecting surface P12 from the second incident surface P11 toward the second exit surface P13. Specifically, the second optical path L11 extending in the +Z direction is bent 90° by the second reflecting surface P12 in the -X direction. The second optical path L11 exits from the second light guide 64 through the second exit surface P13. As shown in FIG. 4, the exiting second optical path L11 is reflected by the sixth reflecting surface P15 from the second exit surface P13 toward the second imaging device 62. Specifically, the second optical path L11 extending in the -X direction is bent by 90 degrees to the -Y direction by the sixth reflecting surface P15.

[0040] 2, when the component 11 is located above the light guides 63 and 64 and the board 12 is located below them, the first optical path L1 passes through the first light guide 63 and the first reflection optical system 65, and enters the first imaging device 61 from the component 11. The second optical path L11 passes through the second light guide 64 and the second reflection optical system 66, and enters the second imaging device 62 from the board 12. At that time, the first reflection surface P2, together with the fifth reflection surface P5, reflects the light from the component 11 toward the first imaging device 61. The second reflection surface P12, together with the sixth reflection surface P15, reflects the light from the board 12 toward the second imaging device 62.

[0041] By providing the reflective optical systems 65 and 66, the imaging devices 61 and 62 can be arranged so that the optical axes (i.e., the optical paths L1 and L11) of the imaging devices 61 and 62 are parallel to each other. In the first embodiment, the imaging devices 61 and 62 are arranged so that the first optical path L1 incident on the first imaging device 61 and the second optical path L11 incident on the second imaging device 62 both extend in the Y direction.

[0042] The features 67 and 68 will be described in more detail. The features 67 and 68 may have different shapes relative to each other. The features 67 and 68 may be a single point, a set of multiple points, or a line. When the features 67 and 68 are a set of multiple points or a line, the positional deviation of the features 67 and 68 due to rotation around the Z axis can be visualized in addition to the positional deviation in the XY plane.

[0043] The characteristic portions 67 and 68 may be formed on the same Z axis. In the first embodiment, the characteristic portions 67 and 68 are recognition marks formed on the same Z axis near the centers of the incident surfaces P1 and P11. When the axis on which the characteristic portions 67 and 68 are provided coincides with the first optical path L1 and the second optical path L11, the relative misalignment of the imaged characteristic portions 67 and 68 due to thermal distortion becomes clearer.

[0044] Next, the calibration jig 7 will be described in more detail with reference to Fig. 5 to Fig. 7. Fig. 5 is a side view of the calibration jig 7. Fig. 6 is a side view of the imaging unit 6 and the calibration jig 7 when the calibration jig 7 is located at the facing position S1. Fig. 7 is a side view of the imaging unit 6 and the calibration jig 7 when the calibration jig 7 is located at the separated position S2.

[0045] As shown in FIG. 5, in the first embodiment, the calibration jig 7 is an angular U-shaped member that opens in the Y direction. The calibration jig 7 has a first member 71 and a second member 72 that extend parallel to each other in the horizontal direction. The first member 71 and the second member 72 are integrally formed. The first member 71 is located above the second member 72 with a gap therebetween. Therefore, a recess 73 is formed between the first member 71 and the second member 72. The first light guide 63 and the second light guide 64 can be housed in the recess 73.

[0046] The calibration jig 7 has a third reflecting surface R1 and a fourth reflecting surface R11. The third reflecting surface R1 is formed on an inner wall surface of a first member 71, and the fourth reflecting surface R11 is formed on an inner wall surface of a second member 72. The third reflecting surface R1 and the fourth reflecting surface R11 face each other via a recess 73 and extend parallel to each other.

[0047] The calibration jig 7 further includes a reflecting surface moving device 74. The reflecting surface moving device 74 moves the calibration jig 7, for example, in the Y direction relative to the imaging unit 6 (FIG. 1). The reflecting surface moving device 74 allows the calibration jig 7 to move between a facing position S1 and a separate position S2 different from the facing position S1. In the following description of the movement of the calibration jig 7, a case will be described where the imaging unit 6 is in the imaging position.

[0048] As shown in FIG. 6, when the calibration jig 7 is located at the facing position S1, the first light guide 63 and the second light guide 64 are accommodated in the recess 73. At the facing position S1, the third reflecting surface R1 faces the first characteristic portion 67, and the fourth reflecting surface R11 faces the second characteristic portion 68. Therefore, the light from the first incident surface P1 is reflected by the third reflecting surface R1 and returned to the first incident surface P1. The light from the second incident surface P11 is reflected by the fourth reflecting surface R11 and returned to the second incident surface P11. Therefore, the first imaging device 61 images the first characteristic portion 67 through the first optical path L1 reflected from the first incident surface P1 to the third reflecting surface R1. The second imaging device 62 images the second characteristic portion 68 through the second optical path L11 reflected from the second incident surface P11 to the fourth reflecting surface R11.

[0049] 7, when the calibration jig 7 is disposed at the separated position S2, the first light guide 63 and the second light guide 64 are separated from the recess 73. At the separated position S2, the third reflection surface R1 is separated from the first characteristic portion 67, and the fourth reflection surface R11 is separated from the second characteristic portion 68. When the component 11 held by the holding head 5 is positioned above the board 12, the first incident surface P1 faces the component 11, and the second incident surface P11 faces the board 12. Thus, the first imaging device 61 images the component 11, and the second imaging device 62 images the board 12.

[0050] When the third reflecting surface R1 is located at the facing position S1, the light from the first feature portion 67 is reflected by the third reflecting surface R1 and is imaged on the imaging element 61a in the first imaging device 61. For example, in the case where the first feature portion 67 is provided on the first incident surface P1, when the third reflecting surface R1 is located at the facing position S1, the third reflecting surface R1 is located at the midpoint between the position of the component 11 when the component 11 is located above the board 12 and the position of the first feature portion 67. Specifically, the third reflecting surface R1 is perpendicular to the first optical path L1 at the midpoint between the position of the component 11 and the position of the first feature portion 67. When the fourth reflecting surface R11 is located at the facing position S1, the light from the second feature portion 68 is reflected by the fourth reflecting surface R11 and is imaged on the imaging element 62a in the second imaging device 62. For example, in the case where the second feature portion 68 is provided on the second incidence surface P11, when the fourth reflection surface R11 is located at the facing position S1, the fourth reflection surface R11 is located at the midpoint between the position of the substrate 12 when the component 11 is located above the substrate 12 and the position of the second feature portion 68. Specifically, the fourth reflection surface R11 is perpendicular to the second optical path L11 at the midpoint between the position of the substrate 12 and the position of the second feature portion 68. With this configuration, it becomes easier to make the optical path length from the component 11 to the first imaging device 61 the same as the optical path length from the first feature portion 67 to the first imaging device 61. In addition, it becomes easier to make the optical path length from the substrate 12 to the second imaging device 62 the same as the optical path length from the second feature portion 68 to the second imaging device 62.

[0051] The calibration jig 7 may have a cooling device that cools the third reflecting surface R1 and the fourth reflecting surface R11. Furthermore, the third reflecting surface R1 and the fourth reflecting surface R11 and the first member 71 and the second member 72 may be made of a material with a small thermal expansion coefficient. With this configuration, the positional relationship between the third reflecting surface R1 and the fourth reflecting surface R11 becomes less susceptible to the effects of heat.

[0052] (operation) In the above configuration, an example of the mounting operation of the mounting apparatus 1 will be described with reference to Figures 8A to 8F. Figures 8A to 8F are schematic diagrams of the mounting apparatus 1 during the mounting operation.

[0053] First, as shown in Fig. 8A, the control unit C makes the pickup head 3 hold the component 11 in the component supply unit 2, and makes the reversing unit 4 reverse the pickup head 3 from downward to upward. The control unit C may select the component 11 to be held based on information such as a production program, for example. The control unit C drives the head moving device 52 to move the holding head 5 close to the pickup head 3. The control unit C drives the imaging moving device 69 to move the imaging unit 6 from the retracted position K2 to the imaging position K1. The control unit C drives the reflecting surface moving device 74 to move the calibration jig 7 from the separated position S2 to the facing position S1.

[0054] Next, as shown in FIG. 8B, the control unit C drives the head moving device 52 to lower the holding head 5, and causes the holding head 5 to receive the component 11 held by the pickup head 3. Since the imaging unit 6 is located at the imaging position K1 and the calibration jig 7 is located at the opposing position S1, the light guides 63 and 64 are accommodated in the recess 73. That is, the third reflection surface R1 and the first characteristic portion 67 face each other, and the fourth reflection surface R11 and the second characteristic portion 68 face each other. Then, the control unit C causes the first imaging device 61 to capture a first image D1 related to the first characteristic portion 67, and causes the second imaging device 62 to capture a second image D2 related to the second characteristic portion 68. The control unit C causes the images D1 and D2 to be stored in the storage unit C2.

[0055] Next, as shown in FIG. 8C, the control unit C drives the head moving device 52 to move the holding head 5 holding the component 11 above the board 12. The head moving device 52 may move the holding head 5 while the imaging devices 61 and 62 are capturing the images D1 and D2. That is, the movement of the holding head 5 and the capturing of the images D1 and D2 may be performed in parallel. The control unit C drives the reflecting surface moving device 74 to move the calibration jig 7 from the facing position S1 to the separated position S2. The movement of the calibration jig 7 may be performed while the holding head 5 is moving. Furthermore, the control unit C causes the reversing unit 4 to reverse the pickup head 3 from the upward to the downward direction.

[0056] 8D, the component 11 reaches above the board 12, the imaging unit 6 is located at the imaging position K1, and the calibration jig 7 is located at the separated position S2, so that the light guides 63 and 64 are located between the component 11 and the board 12. Then, the control unit C causes the first imaging device 61 to capture a component image D3 related to the component 11, and causes the second imaging device 62 to capture a board image D4 related to the board 12. Specifically, the first imaging device 61 captures a component image D3 including the recognition mark 13 (FIG. 7) provided on the component 11, and the second imaging device 62 captures a board image D4 including the recognition mark 14 (FIG. 7) provided on the board 12. The control unit C stores the images D3 and D4 in the storage unit C2.

[0057] When capturing images D1 to D4, the imaging unit 6 is located at imaging position K1. That is, the position of the imaging unit 6 when capturing images D1 and D2 is the same as the position of the imaging unit 6 when capturing images D3 and D4.

[0058] The arithmetic unit C1 of the control unit C determines the relative position of the component 11 with respect to the board 12 based on the images D1 to D4. Specifically, the arithmetic unit C1 acquires the images D1 to D4 by referring to the storage unit C2. Then, the arithmetic unit C1 determines the position of the component 11 based on the first image D1 and the component image D3, and determines the position of the board 12 based on the second image D2 and the board image D4. The arithmetic unit C1 calculates the amount of positional deviation between the determined positions of the component 11 and the board 12. Then, the control unit C drives the head moving device 52 to move the holding head 5 holding the component 11 relative to the board 12 so as to correct the amount of positional deviation, thereby aligning the component 11 with the board 12.

[0059] 8E and 8F, the control unit C drives the imaging moving device 69 to move the imaging unit 6 from the imaging position K1 to the retreat position K2. Thereafter, the control unit C drives the head moving device 52 to lower the positioned holding head 5, and mounts the component 11 on the board 12.

[0060] Here, the operation of the arithmetic device C1 will be described in more detail with reference to Figs. 9A to 13C. Fig. 9A is a diagram showing a first image D1, and Fig. 9B is a diagram showing a second image D2. Fig. 10A is a diagram showing a component image D3, and Fig. 10B is a diagram showing a board image D4. Fig. 10C is a diagram in which Figs. 10A and 10B are superimposed. Fig. 11A is a diagram showing the mark reference position of the recognition mark 13 of the component 11, and Fig. 11B is a diagram showing the mark reference position of the recognition mark 14 of the board 12. Fig. 12 is a diagram in which Figs. 11A and 11B are superimposed. Fig. 13A is a diagram showing the movement of the field of view of the first imaging device 61. Fig. 13B is a diagram showing the determined position of the component 11. Fig. 13C is a diagram showing the amount of positional deviation to be corrected.

[0061] In the following, a state will be described in which the light guides 63, 64 are deformed by thermal distortion, and the optical axes of the imaging devices 61, 62 are deviated from a predetermined reference due to the deformation of the light guides 63, 64. As shown in FIG. 9A, in the first image D1, an imaging position 67A of the first feature portion 67 is away from a first reference position 67R. As shown in FIG. 9B, in the second image D2, an imaging position 68A of the second feature portion 68 is away from a second reference position 68R. The reference positions 67R, 68R are imaging positions of the feature portions 67, 68 in the images D1, D2 (i.e., in the fields of view of the imaging devices 61, 62) when the light guides 63, 64 are not deformed and the optical axes of the imaging devices 61, 62 are not deviated from the reference. The reference positions 67R, 68R may be at the center of the fields of view of the imaging devices 61, 62. The calculation device C1 calculates, based on the first image D1, a first positional deviation amount V1 between the imaging position 67A of the first feature portion 67 and a first reference position 67R. The calculation device C1 calculates, based on the second image D2, a second positional deviation amount V2 between the imaging position 68A of the second feature portion 68 and a second reference position 68R.

[0062] When the direction or magnitude of the first positional misalignment amount V1 and the second positional misalignment amount V2 differ, a relative positional misalignment occurs between the first imaging device 61 and the second imaging device 62.

[0063] As shown in FIG. 10A, in the component image D3, the recognition mark 13 of the component 11 is captured at the imaging position 13A. As shown in FIG. 10B, in the board image D4, the recognition mark 14 of the board 12 is captured at the imaging position 14A. If there is no relative positional misalignment between the first imaging device 61 and the second imaging device 62, the component image D3 and the board image D4 can be superimposed as shown in FIG. 10C. Then, the calculation device C1 calculates a third positional misalignment amount V3 between the imaging position 13A of the recognition mark 13 of the component 11 and the imaging position 14A of the recognition mark 14 of the board 12. The control unit C moves the component 11 (i.e., the holding head 5) relative to the board 12 so as to correct the third positional misalignment amount V3, thereby allowing the component 11 and the board 12 to be aligned.

[0064] 9A and 9B, in reality, a relative positional misalignment occurs between the first imaging device 61 and the second imaging device 62. Therefore, it is difficult to align the component 11 and the board 12 using only the third positional misalignment amount V3.

[0065] Therefore, it is required to correct the relative positional deviation between the first imaging device 61 and the second imaging device 62. The calculation device C1 determines the position of the recognition mark 13 of the component 11 based on the first positional deviation amount V1 and the component image D3, and determines the position of the recognition mark 14 of the board 12 based on the second positional deviation amount V2 and the board image D4. Specifically, as shown in FIG. 11A, the calculation device C1 calculates a mark reference position 13B by subtracting the first positional deviation amount V1 by the first imaging device 61 from the imaging position 13A of the recognition mark 13 of the component 11. As shown in FIG. 11B, the calculation device C1 calculates a mark reference position 14B by subtracting the second positional deviation amount V2 by the second imaging device 62 from the imaging position 14A of the recognition mark 14 of the board 12. The mark reference position is a position where the recognition mark is assumed to be imaged when the optical axes of the imaging devices 61 and 62 are not deviated from the reference.

[0066] 12, the calculation device C1 calculates a fourth positional deviation amount V4 between the mark reference position 13B and the mark reference position 14B. Then, the control unit C moves the holding head 5 holding the component 11 by the fourth positional deviation amount V4 relative to the board 12 so as to correct the fourth positional deviation amount V4, thereby aligning the component 11 with the board 12. Note that the control unit C may move the board 12 relative to the component 11 in a direction opposite to the direction shown in FIG.

[0067] As another approach, the correction can be performed by focusing on the fields of view of the imaging devices 61 and 62. The calculation device C1 corrects the fields of view of the imaging devices 61 and 62 in the images D3 and D4 by the positional deviation amounts V1 and V2, and determines the positions of the recognition marks 13 and 14 in the corrected images. In the first embodiment, the field of view of the first imaging device 61 in the component image D3 is corrected by using the board image D4 as a reference, but the component image D3 may be used as a reference, or another reference may be provided. As shown in FIG. 13A, the calculation device C1 corrects the field of view of the first imaging device 61 in the component image D3 by moving it by the first positional deviation amount V1 and the second positional deviation amount V2 in the opposite direction. By such an operation, the field of view of the first imaging device 61 can be aligned with the field of view of the second imaging device 62. FIG. 13B shows a corrected component image based on the corrected field of view of the first imaging device 61, and shows a determined position 13D of the recognition mark 13 of the component 11 in the corrected component image.

[0068] Next, the calculation device C1 calculates the amount of positional deviation between the determined position of the component 11 and the determined position of the board 12. As shown in Fig. 13C, since the board image D4 is used as a reference in the first embodiment, the calculation device C1 calculates a fourth positional deviation amount V4 between the determined position 13D of the recognition mark 13 of the component 11 and the imaged position 14A of the board 12. Therefore, the control unit C aligns the component 11 and the board 12 so as to correct the fourth positional deviation amount V4.

[0069] Even if the optical system of the imaging unit 6 or the components that support them are distorted by heat, reducing the reliability of the captured image, the above operation allows for more accurate alignment of the component 11 and the board 12.

[0070] (effect) According to the positioning device 9 and the mounting device 1 according to the first embodiment, the following effects can be achieved.

[0071] As described above, the positioning device 9 of the first embodiment includes the first light guide 63 provided with the first characteristic portion 67, the first imaging device 61 that images the first object (component 11) through the first light guide 63, and a calculation device C1. The first imaging device 61 images a first object image (component image D3) of the component 11 and a first image D1 of the first characteristic portion 67. The calculation device C1 determines the relative position of the component 11 with respect to the second object (board 12) based on the component image D3 and the first image D1.

[0072] With this configuration, by capturing an image of the first feature portion 67, it is possible to grasp a positional deviation caused by thermal distortion of the first light guide 63 and the first imaging device 61. It is also possible to grasp a positional deviation caused by a deviation of the optical axis of the first imaging device 61 relative to the first light guide 63. The computing device C1 corrects the position of the component 11 captured in the component image D3 based on the grasped amount of positional deviation, thereby improving the accuracy of positional deviation correction by the positioning device 9. This makes it possible to more accurately align the component 11 and the board 12.

[0073] The positioning device 9 of the first embodiment further includes a second light guide 64 provided with a second feature portion 68, and a second imaging device 62 that images the board 12 through the second light guide 64. The second imaging device 62 images a second object image (board image D4) of the board 12 and a second image D2 of the second feature portion 68. The calculation device C1 determines the position of the component 11 based on the component image D3 and the first image D1, and determines the position of the board 12 based on the board image D4 and the second image D2.

[0074] With this configuration, it is possible to grasp positional deviation caused by thermal distortion of the second light guide 64 and the second imaging device 62 by imaging the second feature portion 68. It is also possible to grasp positional deviation caused by deviation of the optical axis of the second imaging device 62 relative to the second light guide 64. The calculation device C1 corrects the position of the board 12 imaged in the board image D4 based on the grasped amount of positional deviation, thereby further improving the accuracy of positional deviation correction in the positioning device 9.

[0075] The positioning device 9 of the first embodiment further includes an imaging moving device 69. When the component 11 is positioned above the board 12, the imaging moving device 69 moves the first light guide 63 and the second light guide 64 between the component 11 and the board 12. The imaging moving device 69 moves the first imaging device 61 and the second imaging device 62 to the sides of the first light guide 63 and the second light guide 64. The positioning device 9 further includes a first reflecting surface P2 that reflects light from the component 11 toward the first imaging device 61, and a second reflecting surface P12 that reflects light from the board toward the second imaging device 62.

[0076] With this configuration, the imaging devices 61 and 62 can capture images of the component 11 and the board 12 based on the light reflected laterally by the reflecting surfaces P2 and P12. This makes it possible to suppress movement of the imaging devices 61 and 62 during imaging operations. This makes it possible to maintain the positional relationship between the imaging devices 61 and 62 and the light guides 63 and 64.

[0077] In the positioning device 9 of the first embodiment, the first feature 67 is formed on the surface (first incident surface P1) of the first light guide 63. The first optical path L1 of the first imaging device 61 is incident orthogonally to the first incident surface P1. The second feature 68 is formed on the surface (second incident surface P11) of the second light guide 64. The second optical path L11 of the second imaging device 62 is incident orthogonally to the second incident surface P11.

[0078] With this configuration, it becomes easier to focus the first imaging device 61 on the first characteristic portion 67 on the first entrance surface P1. Also, it becomes easier to focus the second imaging device 62 on the second characteristic portion 68 on the second entrance surface P11.

[0079] In the positioning device 9 of the first embodiment, the first light guide 63 is a first prism having a first reflecting surface P2, and the second light guide 64 is a second prism having a second reflecting surface P12.

[0080] With this configuration, the configuration of the positioning device 9 can be simplified and positional misalignment between the first light guide 63 and the first reflecting surface P2 or between the second light guide 64 and the second reflecting surface P12 can be suppressed.

[0081] The positioning device 9 of the first embodiment further includes a third reflecting surface R1, a fourth reflecting surface R11, and a reflecting surface moving device 74. The reflecting surface moving device 74 can move the third reflecting surface R1 between a first facing position (facing position S1) facing the first feature portion 67 and a first distant position (separate position S2) different from the facing position S1. The reflecting surface moving device 74 can move the fourth reflecting surface R11 between a second facing position (facing position S1) facing the second feature portion 68 and a second distant position (separate position S2) different from the facing position S1.

[0082] With this configuration, images of the feature parts 67 and 68 can be captured based on the optical paths L1 and L11 reflected by the reflecting surfaces R1 and R11. Furthermore, by providing the reflecting surfaces R1 and R11, the optical path lengths between the feature parts 67 and 68 and the imaging devices 61 and 62 can be adjusted.

[0083] In the positioning device 9 of the first embodiment, when the reflecting surface moving device 74 moves the third reflecting surface R1 to the facing position S1, the first imaging device 61 captures the first image D1. When the reflecting surface moving device 74 moves the third reflecting surface R1 to the distant position S2, the first imaging device 61 captures the component image D3. When the reflecting surface moving device 74 moves the fourth reflecting surface R11 to the facing position S1, the second imaging device 62 captures the second image D2. When the reflecting surface moving device 74 moves the fourth reflecting surface R11 to the distant position S2, the second imaging device 62 captures the board image D4.

[0084] With this configuration, it is possible to change the object imaged by the imaging devices 61, 62 while keeping the positions of the imaging devices 61, 62 and the light guides 63, 64 fixed.

[0085] In the positioning device 9 of the first embodiment, when the third reflecting surface R1 is located at the opposing position S1, light from the first feature portion 67 is reflected by the third reflecting surface R1 and is imaged on the imaging element 61a in the first imaging device 61. Furthermore, when the fourth reflecting surface R11 is located at the opposing position S1, light from the second feature portion 68 is reflected by the fourth reflecting surface R11 and is imaged on the imaging element 62a in the second imaging device 62.

[0086] With this configuration, it is possible to align the optical path length when the first imaging device 61 images the component 11 and when it images the first characteristic portion 67. It is also possible to align the optical path length when the second imaging device 62 images the board 12 and when it images the second characteristic portion 68. Therefore, it is possible to omit changing the focal position when changing the object imaged by the imaging devices 61 and 62.

[0087] The positioning device 9 of the first embodiment further includes a positioning head (holding head 5 ) that positions the component 11 relative to the board 12 .

[0088] With this configuration, the alignment between the component 11 and the board 12 can be performed more accurately.

[0089] In the positioning device 9 of the first embodiment, the first light guide 63 is movable between an imaging position K1 between the position of the component 11 and the position of the board 12 when the component 11 is located above the board 12, and a retracted position K2 different from the imaging position K1. When the holding head 5 positions the component 11 with respect to the board 12, the first light guide 63 is located at the retracted position K2.

[0090] With this configuration, it is possible to prevent the first light guide 63 from interfering with the positioning of the component 11.

[0091] The positioning device 9 of the first embodiment further includes a head moving device 52 that moves the holding head 5 above the substrate 12. The head moving device 52 is capable of moving the holding head 5 while the first imaging device 61 is capturing the first image D1.

[0092] With this configuration, the first image D1 is captured while the component 11 is moving toward above the board 12, so that the movement time of the component 11 can be utilized effectively.

[0093] In the mounting apparatus 1 of the first embodiment, the first object is a component 11, and the second object is a board 12. The mounting apparatus 1 further includes a holding head 5 that holds the component 11, and a positioning device 9. The holding head 5 mounts the component 11 on the board 12.

[0094] With this configuration, component 11 can be mounted on board 12 after more accurate alignment of component 11 with board 12.

[0095] In the mounting apparatus 1 of the first embodiment, the first light guide 63 is movable between an imaging position K1 between the position of the component 11 and the position of the board 12 when the component 11 is located above the board 12, and a retracted position K2 different from the imaging position K1. When the holding head 5 mounts the component 11 on the board 12, the first light guide 63 is located at the retracted position K2.

[0096] With this configuration, it is possible to prevent the first light guide 63 from interfering with the mounting of the component 11.

[0097] The mounting apparatus 1 of the first embodiment further includes a head moving device 52 that moves the holding head 5 above the substrate 12. The head moving device 52 is capable of moving the holding head 5 while the first imaging device 61 is capturing the first image D1.

[0098] With this configuration, by capturing the first image D1 while the component 11 is moving toward the top of the board 12, the movement time of the component 11 can be effectively utilized, and the mounting efficiency of the component 11 can be improved.

[0099] The positioning method of the first embodiment includes the first imaging device 61 capturing an image of a first image D1 of a first feature portion 67 provided on the first light guiding body 63 through the first light guiding body 63. The positioning method also includes the first imaging device 61 capturing an image of a component image D3 of the component 11 or a board image D4 of the board 12 through the first light guiding body 63 through the first light guiding body 63. The positioning method also includes the calculation device C1 determining a relative position of the component 11 with respect to the board 12 based on the component image D3 and the first image D1.

[0100] With this configuration, the alignment between the component 11 and the board 12 can be performed more accurately.

[0101] In the first embodiment, the positioning device 9 is applied to the mounting device 1, but the present invention is not limited thereto. The positioning device 9 may be applied to a device that only places the component 11 on the substrate 12. In this case, another device may bond, adhere, or fix the component 11. The positioning device 9 may be applied to another device. When the positioning device 9 is applied to a device other than the mounting device 1, the holding head 5 may be called a positioning head. In this case, the positioning head may perform a process for exerting the function of the other device, such as component placement and pressure application, instead of mounting. Specifically, the positioning device 9 may be applied to an imprinting device that transfers a fine shape to a transfer target. In this case, a fine shape (first target) to be transferred to the transfer target is formed on the positioning head, and the positioning head performs pressure on the transfer target (second target) in addition to positioning the fine shape relative to the transfer target. The transfer target may be called the first target, and the fine shape may be called the second target.

[0102] In the first embodiment, an example has been described in which the object on which the component 11 is positioned and mounted is the board 12, but the present invention is not limited to this. For example, the positioning device 9 may position the component 11 with respect to an object (second object) such as another component or a surface. In this case, the board image D4 may be referred to as an object image (second object image).

[0103] In the first embodiment, the positioning device 9 has two imaging devices 61 and 62, but the present invention is not limited to this. For example, the positioning device 9 may have an imaging device that images only one of the component 11 or the board 12, and one light guide corresponding to the imaging device. In this case, one of the component 11 or the board 12 may be referred to as a first object.

[0104] In the first embodiment, the positioning device 9 has two light guides 63, 64, each of which has the characteristic portions 67, 68. However, the present invention is not limited to this. For example, the positioning device 9 may have one light guide provided with a characteristic portion. In this case, the imaging devices 61, 62 capture images of the same characteristic portion.

[0105] In the first embodiment, the characteristic portions 67 and 68 are formed on the upper surface of the light guide 63 and the lower surface of the light guide 64, but the present invention is not limited thereto. The characteristic portions 67 and 68 may be formed in the optical paths L1 and L11 between the imaging devices 61 and 62 and the imaging target. For example, the characteristic portions 67 and 68 may be formed on other surfaces of the light guides 63 and 64, such as the emission surfaces P3 and P13, to which the optical paths L1 and L11 are perpendicular, or on the reflection surfaces P2 and P12. The characteristic portions 67 and 68 may be formed inside the light guides 63 and 64. In this case, the optical paths L1 and L11 of the imaging devices 61 and 62 are perpendicular to the surfaces (virtual planes) on which the characteristic portions 67 and 68 are formed. By providing the characteristic portions 67 and 68 on the light guides 63 and 64, the interval between the characteristic portions 67 and 68 can be reduced. Therefore, the amount of relative positional deviation between the characteristic portions 67 and 68 can be reduced, and the relative positioning error between the component 11 and the board 12 can be reduced.

[0106] In the first embodiment, a correction method for measuring or correcting horizontal movement of the field of view caused by optical axis blur has been described in which one characteristic portion 67, 68 is provided for one imaging device 61, 62, but the present invention is not limited to this. Characteristic portions may be provided at multiple points for one imaging device, and in addition to the horizontal movement, the rotational movement (rotation angle) of the field of view caused by optical axis blur may be measured or corrected in a similar manner.

[0107] In the first embodiment, the imaging unit 6 has the reflecting surfaces P2, P12, P5, and P15, but the present invention is not limited to this. For example, the imaging devices 61 and 62 may be inserted between the incident surfaces P1 and P11 to capture the images D1 to D4. On the other hand, by providing the reflecting surfaces P2, P12, P5, and P15, the movement of the imaging devices 61 and 62 relative to the light guides 63 and 64 can be omitted.

[0108] In the first embodiment, the light guides 63 and 64 have the reflecting surfaces P2 and P12, respectively, but the present invention is not limited thereto. For example, one light guide 63 may have the first reflecting surface P2 and the second reflecting surface P12 on the back side of the first reflecting surface P2. In this case, the other light guide 64 has a flat surface through which light passes instead of the second reflecting surface P12. In addition, the light guide 64 may have the second reflecting surface P12 and the first reflecting surface P2 on the back side of the second reflecting surface P12, and the light guide 63 may have a flat surface through which light passes instead of the first reflecting surface P2.

[0109] In the first embodiment, the light guides 63 and 64 are prisms that are integral with the reflecting surfaces P2 and P12, respectively. However, the present invention is not limited to this. The light guides 63 and 64 may be separate members from the reflecting surfaces P2 and P12. FIG. 14 shows the light guides 63 and 64 that are separate members from the reflecting surfaces P2 and P12, as viewed from the same direction as FIG. 3. For example, as shown in FIG. 14, the light guides 63 and 64 may be lenses that are separate members from the reflecting surfaces P2 and P12. The reflecting surfaces P2 and P12 may be formed by reflectors disposed between the lenses.

[0110] In the first embodiment, the calibration jig 7 has been described with respect to an example in which the first member 71 and the second member 72, i.e., the third reflecting surface R1 and the fourth reflecting surface R11, are integrally formed, but the present invention is not limited to this. For example, the third reflecting surface R1 and the fourth reflecting surface R11 may be formed by separate members. In this case, the facing position S1 and the separated position S2 are defined on the respective reflecting surfaces R1 and R11.

[0111] In the first embodiment, an example has been described in which the calibration jig 7 has the reflecting surface moving device 74, but the present invention is not limited to this. The calibration jig 7 may be fixed. For example, the calibration jig 7 may be fixed at the position shown in FIG. 8A. In this case, the imaging unit 6 moves relative to the calibration jig 7 by the operation of the imaging moving device 69.

[0112] The imaging moving device 69 can move the first feature portion 67 between a third facing position facing the third reflecting surface R1 and a third distant position different from the third facing position. The imaging moving device 69 can move the second feature portion 68 between a fourth facing position facing the fourth reflecting surface R11 and a fourth distant position different from the fourth facing position. The third facing position and the fourth facing position of the imaging unit 6 are shown in FIG. 15, and the third distant position and the fourth distant position of the imaging unit 6 are shown in FIG. 8A. In terms of the relative positional relationship between the calibration jig 7 and the imaging unit 6, the third facing position and the fourth facing position may correspond to the facing position S1 shown in FIG. 6, and the third distant position and the fourth distant position may correspond to the distant position S2 shown in FIG. 7. That is, the light guides 63, 64 may be housed in the recess 73 at the third opposing position and the fourth opposing position, and the light guides 63, 64 may be separated from the recess 73 at the third separated position and the fourth separated position. Alternatively, the light guides 63, 64 may move integrally, and the third opposing position and the fourth opposing position may be common, and the third separated position and the fourth separated position may be common.

[0113] When the imaging moving device 69 moves the first feature 67 to the third opposing position, the first imaging device 61 captures the first image D1. When the imaging moving device 69 moves the first feature 67 to the third distant position, the first imaging device 61 captures the component image D3. When the imaging moving device 69 moves the second feature 68 to the fourth opposing position, the second imaging device 62 captures the second image D2. When the imaging moving device 69 moves the second feature 68 to the fourth distant position, the second imaging device 62 captures the board image D4. Specifically, the imaging unit 6 captures the images D3 and D4 at the position shown in FIG. 8A, and captures the images D1 and D2 at the position shown in FIG. 15.

[0114] In the first embodiment, the first image D1 and the component image D3 are different images, and the second image D2 and the board image D4 are different images. However, the present invention is not limited to this. For example, the first imaging device 61 may capture one image of both the first characteristic portion 67 and the component 11, and the second imaging device 62 may capture one image of both the second characteristic portion 68 and the board 12.

[0115] In the first embodiment, the component 11 and the board 12 are aligned by overlapping the recognition mark 13 with the recognition mark 14, but the present invention is not limited to this. The component 11 and the board 12 may be aligned so that the recognition marks 13 and 14 have a predetermined positional relationship.

[0116] In the first embodiment, the reference positions 67R, 68R are the image capturing positions of the characteristic portions 67, 68 when no positional misalignment occurs in the imaging unit 6, but the present invention is not limited to this. The reference positions 67R, 68R may be the positions of the characteristic portions 67, 68 in the first image D1 captured in the previous mounting operation. In this case, the calculation device C1 may calculate the reference positions 67R, 68R by adding the amount of positional misalignment in the current mounting operation to the amount of positional misalignment in the previous mounting operation.

[0117] In the first embodiment, the controller C moves the holding head 5 so as to correct the fourth positional deviation amount V4 calculated by the calculator C1, but the present invention is not limited to this. For example, the controller C may move the stage 8 on which the substrate 12 is placed.

[0118] In the first embodiment, the retreat position K2 is a position moved in the +X direction with respect to the imaging position, but is not limited thereto. For example, the retreat position K2 may be a position moved in the +Y direction with respect to the imaging position.

[0119] (Embodiment 2) A positioning system according to embodiment 2 of the present disclosure will be described. Note that in embodiment 2, differences from embodiment 1 will be mainly described. In embodiment 2, configurations that are the same as or equivalent to embodiment 1 will be described with the same reference numerals.

[0120] 16 is a block diagram of a positioning system 100 according to a second embodiment of the present disclosure. In the second embodiment, the positioning device 109 is the same as the positioning device 9 in the first embodiment unless otherwise specified. The positioning device 109 differs from the positioning device 9 in that the calculation device C1 is omitted from the control unit C.

[0121] 16, the positioning system 100 includes a positioning device 109 and a processing device 110. The positioning device 109 includes a first communication unit 121. The processing device 110 includes a second communication unit 122 and a calculation device C1.

[0122] The communication units 121 and 122 transmit and receive information via a network. The communication units 121 and 122 include a circuit that performs communication in compliance with a predetermined communication standard (for example, LAN, Wi-Fi (registered trademark), Bluetooth (registered trademark), etc.).

[0123] The first communication unit 121 transmits the images D1 to D4 stored in the memory unit C2 to the second communication unit 122. The second communication unit 122 receives the images D1 to D4 transmitted from the first communication unit 121. The calculation device C1 determines the relative position of the component 11 with respect to the board 12 based on the images D1 to D4 received by the second communication unit 122. The second communication unit 122 transmits the determined relative position of the component 11 with respect to the board 12 to the first communication unit 121. The first communication unit 121 receives the relative position transmitted from the second communication unit 122. The control unit C of the positioning device 109 moves the position of the stage 8 or the holding head 5 based on the received relative position.

[0124] (effect) According to the positioning system 100 according to the second embodiment, the following effects can be achieved.

[0125] As described above, the positioning system 100 of the second embodiment includes the positioning device 109 and the processing device 110 that communicates with the positioning device 109 via a network. The positioning device 109 includes the first light guide 63 in which the first feature portion 67 is provided, the first imaging device 61 that images the component 11 through the first light guide 63, and the first communication unit 121. The processing device 110 includes the second communication unit 122 and the arithmetic unit C1. The first imaging device 61 images a component image D3 related to the component 11 and a first image D1 related to the first feature portion 67. The first communication unit 121 transmits the component image D3 and the first image D1 to the second communication unit 122. The second communication unit 122 receives the component image D3 and the first image D1. The arithmetic unit C1 determines the relative position of the component 11 with respect to the board 12 based on the component image D3 and the first image D1.

[0126] With this configuration, even if the calculation device C1 is provided in an external device away from the positioning device 9, the alignment between the component 11 and the board 12 can be performed more accurately.

[0127] A positioning device in a first aspect includes a first light guide having a first feature portion, a first imaging device that images a first object through the first light guide, and a computing device, wherein the first imaging device captures a first object image of the first object and a first image of the first feature portion, and the computing device determines a relative position of the first object with respect to the second object based on the first object image and the first image.

[0128] As a positioning device in a second aspect, the positioning device in the first aspect further includes a second light guide having a second feature portion and a second imaging device that images a second object through the second light guide, wherein the first imaging device images the first object, the second imaging device images a second object image of the second object and a second image of the second feature portion, and the calculation device determines the position of the first object based on the first object image and the first image, and determines the position of the second object based on the second object image and the second image.

[0129] As a positioning device in a third aspect, the positioning device in the second aspect further includes an imaging movement device, which moves the first light guide and the second light guide between the first object and the second object when the first object is positioned above the second object, moves the first imaging device and the second imaging device to the side of the first light guide and the second light guide, and further includes a first reflecting surface that reflects light from the first object toward the first imaging device, and a second reflecting surface that reflects light from the second object toward the second imaging device.

[0130] As a positioning device in a fourth aspect, in the positioning device in the third aspect, a first characteristic portion is formed on the surface of a first light guide or inside the first light guide, and the optical path of a first imaging device is incident perpendicular to the surface on which the first characteristic portion is formed, and a second characteristic portion is formed on the surface of a second light guide or inside the second light guide, and the optical path of a second imaging device is incident perpendicular to the surface on which the second characteristic portion is formed.

[0131] As a positioning device in the fifth aspect, in the positioning device in the third or fourth aspect, the first light guide is a first prism, the first prism has a first reflecting surface, and the second light guide is a second prism, the second prism has a second reflecting surface.

[0132] As a positioning device in a sixth aspect, in the positioning device in the third or fourth aspect, the first light guide is a first prism, the first prism has a first reflecting surface and a second reflecting surface on the rear side of the first reflecting surface, and the second light guide is a second prism.

[0133] As a positioning device in a seventh aspect, in the positioning device in any of the second to sixth aspects, a third reflective surface, a fourth reflective surface, and a reflective surface moving device are further provided, and the reflective surface moving device is capable of moving the third reflective surface between a first opposed position facing the first feature and a first separated position different from the first opposed position, and the reflective surface moving device is capable of moving the fourth reflective surface between a second opposed position facing the second feature and a second separated position different from the second opposed position.

[0134] As a positioning device in an eighth aspect, in the positioning device in the seventh aspect, when the reflective surface moving device moves the third reflective surface to the first opposing position, the first imaging device captures a first image, when the reflective surface moving device moves the third reflective surface to the first remote position, the first imaging device captures a first object image, when the reflective surface moving device moves the fourth reflective surface to the second opposing position, the second imaging device captures a second image, and when the reflective surface moving device moves the fourth reflective surface to the second remote position, the second imaging device captures a second object image.

[0135] As a positioning device in a ninth aspect, in the positioning device in the seventh or eighth aspect, when the third reflective surface is located at the first opposing position, light from the first feature is reflected by the third reflective surface and is imaged on the imaging element in the first imaging device, and when the fourth reflective surface is located at the second opposing position, light from the second feature is reflected by the fourth reflective surface and is imaged on the imaging element in the second imaging device.

[0136] As a positioning device in a tenth aspect, in any of the positioning devices in the third to sixth aspects, a calibration jig having a third reflective surface and a fourth reflective surface is further provided, and the imaging moving device is capable of moving the first feature portion between a third opposed position facing the third reflective surface and a third separated position different from the third opposed position, and the imaging moving device is capable of moving the second feature portion between a fourth opposed position facing the fourth reflective surface and a fourth separated position different from the fourth opposed position.

[0137] As a positioning device in an eleventh aspect, in the positioning device in the tenth aspect, when the imaging moving device moves the first feature to the third opposing position, the first imaging device captures a first image, when the imaging moving device moves the first feature to the third separated position, the first imaging device captures a first object image, when the imaging moving device moves the second feature to the fourth opposing position, the second imaging device captures a second image, and when the imaging moving device moves the second feature to the fourth separated position, the second imaging device captures a second object image.

[0138] In a twelfth aspect, the positioning device in any one of the first to eleventh aspects further comprises a positioning head that positions the first object relative to the second object.

[0139] As a positioning device in a 13th aspect, in the positioning device in the 12th aspect, the first light guide is movable between an imaging position between the position of the first object and the position of the second object when the first object is located above the second object, and a retracted position different from the imaging position, and when the positioning head positions the first object relative to the second object, the first light guide is located in the retracted position.

[0140] As a positioning device in a 14th aspect, in the positioning device in the 12th or 13th aspect, a head moving device is further provided which moves the positioning head above the second object, and the head moving device is capable of moving the positioning head while the first imaging device is capturing the first image.

[0141] In the mounting device of the 15th aspect, the first object is a component and the second object is a substrate, and the mounting device further comprises a holding head that holds the component and a positioning device of any of the first to 11th aspects, and the holding head mounts the component on the substrate.

[0142] As a mounting device in a 16th aspect, in the mounting device in the 15th aspect, the first light guide is movable between an imaging position between the component and the board when the component is located above the board and a retracted position different from the imaging position, and the first light guide is located in the retracted position when the holding head mounts the component on the board.

[0143] As a mounting apparatus in a 17th aspect, in the mounting apparatus in the 15th or 16th aspect, a head moving device is further provided which moves the holding head above the substrate, and the head moving device is capable of moving the holding head while the first imaging device is capturing the first image.

[0144] A positioning method in an 18th aspect includes a first imaging device capturing a first image of a first feature provided on the first light guide through the first light guide, the first imaging device capturing a first object image of a first object through the first light guide, and a computing device determining a relative position of the first object with respect to the second object based on the first object image and the first image.

[0145] A positioning system in a 19th aspect is a positioning system comprising a positioning device and a processing device that communicates with the positioning device via a network, wherein the positioning device has a first light guide having a first feature portion, a first imaging device that images the first object through the first light guide, and a first communication unit, and the processing device has a second communication unit and a calculation device, wherein the first imaging device images a first object image of the first object and a first image of the first feature portion, the first communication unit transmits the first object image and the first image to the second communication unit, the second communication unit receives the first object image and the first image, and the calculation device determines the relative position of the first object with respect to the second object based on the first object image and the first image.

[0146] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art, and such changes and modifications should be understood to be included within the scope of the present invention as defined by the appended claims, unless they depart therefrom. [Industrial Applicability]

[0147] The component mounting device of the present disclosure has the effect of positioning components at predetermined positions on a board, and is particularly useful as a positioning device used when mounting components such as high-speed, large-capacity memories, application processors, and CPUs. [Explanation of symbols]

[0148] 1 Mounting equipment 2. Parts Supply Department 3 Pickup Head 4 Reversing unit 5 Retaining Head 6 Imaging unit 7 Calibration fixture 8 Stage 9 Positioning device 11 parts 12 Substrate 61 First Imaging Device 62 Second Imaging Device 63 1st light guide 64 Second light guide 67 First feature 68 Second feature P1 1st entrance plane P2 1st reflective surface P11 2nd entrance plane P12 Second reflective surface R1 3rd reflective surface R11 4th reflective surface D1 1st image D2 2nd image D3 Parts Image D4 Board Image

Claims

1. A first light guide provided with a first characteristic portion; A first imaging device that captures an image of a first object through the first light guide; A computing device, The first imaging device captures a first object image related to the first object and a first image related to the first feature portion; The computing device determines a relative position of the first object with respect to a second object based on the first object image and the first image.

2. a second light guide provided with a second characteristic portion; A second imaging device that images the second object through the second light guide, The first imaging device images the first object, The second imaging device captures a second object image related to the second object and a second image related to the second feature portion; The positioning device of claim 1 , wherein the computing device determines a position of the first object based on the first object image and the first image, and determines a position of the second object based on the second object image and the second image.

3. Further comprising an imaging moving device; when the first object is positioned above the second object, the imaging moving device moves the first light guide and the second light guide between the first object and the second object, and moves the first imaging device and the second imaging device to the sides of the first light guide and the second light guide; The positioning device of claim 2 , further comprising: a first reflecting surface that reflects light from the first object toward the first imaging device; and a second reflecting surface that reflects light from the second object toward the second imaging device.

4. the first characteristic portion is formed on a surface of the first light guide or inside the first light guide, an optical path of the first imaging device is incident perpendicular to a surface on which the first feature portion is formed; the second characteristic portion is formed on a surface of the second light guide or inside the second light guide, The positioning apparatus according to claim 3 , wherein an optical path of the second imaging device is incident perpendicular to a surface on which the second feature portion is formed.

5. the first light guide is a first prism; the first prism has the first reflecting surface; the second light guide is a second prism; The positioning device of claim 3 , wherein the second prism has the second reflective surface.

6. the first light guide is a first prism; the first prism has the first reflecting surface and the second reflecting surface on the rear side of the first reflecting surface, The positioning device of claim 3 , wherein the second light guide is a second prism.

7. Further comprising a third reflecting surface, a fourth reflecting surface, and a reflecting surface moving device; the reflecting surface moving device is capable of moving the third reflecting surface between a first facing position facing the first feature portion and a first distant position different from the first facing position, The positioning device according to claim 2 , wherein the reflecting surface moving device is capable of moving the fourth reflecting surface between a second facing position facing the second feature portion and a second separated position different from the second facing position.

8. when the reflecting surface moving device moves the third reflecting surface to the first opposing position, the first imaging device captures the first image; when the reflecting surface moving device moves the third reflecting surface to the first remote position, the first imaging device captures the first object image; when the reflecting surface moving device moves the fourth reflecting surface to the second opposing position, the second imaging device captures the second image; The positioning device according to claim 7 , wherein when the reflective surface moving device moves the fourth reflective surface to the second remote position, the second imaging device captures the second object image.

9. When the third reflecting surface is located at the first opposing position, light from the first characteristic portion is reflected by the third reflecting surface and forms an image on an imaging element in the first imaging device, The positioning device according to claim 7 , wherein when the fourth reflecting surface is located at the second opposing position, light from the second feature portion is reflected by the fourth reflecting surface and is imaged on an imaging element in the second imaging device.

10. a calibration tool having a third reflecting surface and a fourth reflecting surface; the imaging moving device is capable of moving the first feature portion between a third opposing position facing the third reflecting surface and a third remote position different from the third opposing position, The positioning device according to claim 3 , wherein the imaging moving device is capable of moving the second feature portion between a fourth facing position facing the fourth reflecting surface and a fourth remote position different from the fourth facing position.

11. When the imaging moving device moves the first feature to the third opposing position, the first imaging device captures the first image; When the imaging moving device moves the first feature to the third remote position, the first imaging device captures the first object image; When the imaging moving device moves the second feature to the fourth opposing position, the second imaging device captures the second image; The positioning apparatus of claim 10 , wherein the second imaging device captures the second object image as the imaging movement device moves the second feature to the fourth spaced position.

12. The positioning apparatus of claim 1 , further comprising a positioning head configured to position the first object relative to the second object.

13. the first light guide is movable between an imaging position between a position of the first object and a position of the second object when the first object is located above the second object, and a retreat position different from the imaging position, The positioning device according to claim 12 , wherein the first light guide is located at the retracted position when the positioning head positions the first object relative to the second object.

14. a head moving device that moves the positioning head above the second object, The positioning device of claim 12 , wherein the head moving device is capable of moving the positioning head while the first imaging device is capturing the first image.

15. the first object is a part, the second object is a substrate; A holding head for holding the component; The positioning device according to any one of claims 1 to 11, A mounting apparatus in which the holding head mounts the component onto the board.

16. the first light guide is movable between an imaging position between the component and the board when the component is located above the board and a retreat position different from the imaging position, The mounting apparatus according to claim 15 , wherein the first light guide is located at the retracted position when the holding head mounts the component on the board.

17. a head moving device that moves the holding head above the substrate, The mounting apparatus according to claim 15 , wherein the head moving device is capable of moving the holding head while the first imaging device is capturing the first image.

18. A first imaging device captures a first image of a first feature provided on the first light guide through the first light guide; The first imaging device captures a first object image relating to a first object through the first light guide; and determining, by a computing device, a relative position of the first object with respect to a second object based on the first object image and the first image.

19. A positioning system comprising a positioning device and a processing device in communication with the positioning device via a network, The positioning device includes: A first light guide provided with a first characteristic portion; A first imaging device that captures an image of a first object through the first light guide; A first communication unit; having The processing device includes: A second communication unit; A computing device; having The first imaging device captures a first object image related to the first object and a first image related to the first feature portion; The first communication unit transmits a first object image and the first image to the second communication unit; The second communication unit receives a first object image and the first image, The computing device determines a relative position of the first object with respect to a second object based on a first object image and the first image.

Images