Black photosensitive resin composition, black partition wall using the same, display device, and manufacturing method for black partition wall

Abstract

To provide a black photosensitive resin composition that offers high optical density, allows low-temperature curing, and enables pattern formation at ultra-high resolution of 2 μm or less, a black partition wall manufactured using the same, a display device including the black partition wall, and a method of manufacturing the black partition wall.SOLUTION: Provided is a black photosensitive resin composition that comprises (A) a binder resin, (B) a black colorant comprising Lactam Black, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) a solvent, with an optical density (OD) of 1.5 or more per 1 μm. Also provided are a black partition wall manufactured using the same, a display device including the black partition wall, and a method of manufacturing the black partition wall.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a black photosensitive resin composition, a black partition wall using the same, a display device, and a method for producing the black partition wall. [Background technology]

[0002] Recently, there has been growing interest in self-emitting micro organic light emitting diode (hereinafter referred to as OLED) display panels as a display panel applicable to VR (Virtual Reality), AR (Augmented Reality) and MR (Mixed Reality) devices.

[0003] In the case of micro OLED display panels, whose pixels are about 10 times smaller than those of general OLED display panels, it is difficult to precisely form the red (R), green (G), and blue (B) light-emitting layers using existing fine metal mask (FMM) technology, so color filters are used.

[0004] The color filters applied to micro OLED display panels are made of photosensitive organic materials, but the particles dispersed in such organic materials have a wide bandwidth transmission spectrum for each RGB, resulting in low color gamut and light leakage in fine structures.

[0005] As an alternative to improve the low color gamut, inorganic color filters can be considered, but inorganic color filters have a narrow bandwidth transmission spectrum for each RGB, resulting in high color gamut, but they also have the disadvantage of excessive light leakage. Therefore, there is a need to develop technology that can provide high color gamut while completely blocking light leakage.

[0006] On the other hand, photosensitive resin compositions are essential materials for manufacturing display devices using color filters, liquid crystal display elements, organic light-emitting elements, etc. For example, color filters used in color liquid crystal display devices require a photosensitive resin film for forming a black matrix such as a black partition layer at the boundary between colored layers such as red, green, and blue in order to enhance contrast and color development effects, and this photosensitive resin film is mainly formed from a black photosensitive resin composition.

[0007] However, when a cured film such as a black partition wall layer is produced using a conventionally known black photosensitive resin composition, the curing step (baking) is generally carried out at a high temperature exceeding 150° C. Therefore, when a cured film is formed directly on a display device, there is a problem that elements provided inside the display device may be deteriorated.

[0008] In response to this, research is ongoing to develop a black photosensitive resin composition for micro OLEDs that can be cured at low temperatures, completely block light leakage, and realize patterns compatible with ultra-high resolution. Summary of the Invention [Problem to be solved by the invention]

[0009] One embodiment of the present invention is to provide a black photosensitive resin composition that has high optical density, can be cured at a low temperature, and can form a pattern with an ultra-high resolution of 2 μm or less.

[0010] Another embodiment provides a black partition wall manufactured using the photosensitive resin composition.

[0011] Yet another embodiment provides a display device including a black partition wall.

[0012] Another embodiment provides a method for manufacturing a black partition wall. [Means for solving the problem]

[0013] One embodiment of the present invention provides a black photosensitive resin composition comprising (A) a binder resin, (B) a black colorant including lactam black, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) a solvent, and having an optical density (OD) per μm of 1.5 or more.

[0014] The black colorant may be contained in an amount of 60% by weight to 80% by weight based on the total amount of the black photosensitive resin composition.

[0015] The black colorant may consist of lactam black millbase.

[0016] The black photosensitive resin composition may have an optical density (OD) per 1 μm of 2.0 or more.

[0017] The black photosensitive resin composition may be curable at a temperature of 100° C. or less.

[0018] The binder resin may include an acrylic binder resin.

[0019] The acrylic binder resin may have a double bond equivalent of 340 g / mol or more.

[0020] The black photosensitive resin composition can contain, relative to the total amount of the black photosensitive resin composition, (A) 1 wt % to 10 wt % of a binder resin, (B) 60 wt % to 80 wt % of a black colorant, (C) 0.5 wt % to 5 wt % of a photopolymerizable monomer, (D) 0.1 wt % to 3 wt % of a photopolymerization initiator, and (E) a remaining amount of solvent.

[0021] The black photosensitive resin composition may further contain additives such as malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a labeling agent, a surfactant, a polymerization inhibitor, or a combination thereof.

[0022] Another embodiment provides a black partition wall manufactured using a black photosensitive resin composition.

[0023] Yet another embodiment provides a display device including a black partition wall.

[0024] The display device may be a micro OLED display device including an OLED layer deposited on a silicon wafer, an inorganic layer laminated on the OLED layer, a protective adhesive layer laminated on the inorganic layer, and a color filter layer laminated on the protective adhesive layer and converting white light generated in the OLED layer into a plurality of colored lights, the color filter layer including a red color filter, a green color filter, and a blue color filter, and black partitions are positioned between the respective color filters.

[0025] The display device may be a micro OLED display device further including a micro lens array disposed on the protective adhesive layer and surrounding the color filter layer and the black partitions.

[0026] The protective adhesive layer may have a thickness of 1 μm or less.

[0027] The color filter layer may have a thickness of 1.1 μm to 1.6 μm.

[0028] The thickness of the black partition wall may be 0.5 μm to 1.2 μm.

[0029] The inorganic layer may have a thickness of 2 μm or less.

[0030] In another embodiment, a method for manufacturing a black partition wall includes the steps of applying a black photosensitive resin composition, pre-baking the composition at a temperature of 100° C. or less after the application, exposing the composition to i-rays after the pre-baking, and developing the composition.

[0031] Other specific details of the embodiment of the present invention are included in the following detailed description. Effect of the Invention

[0032] A micro OLED display device including black barrier ribs prepared by low-temperature curing of the lactam black-containing black photosensitive resin composition according to one embodiment of the present invention has excellent light leakage blocking properties and can realize ultra-high resolution patterns, and can be applied to VR (Virtual Reality), AR (Augmented Reality), and MR (Mixed Reality) devices that have recently been released on the market. That is, one embodiment of the present invention provides a black photosensitive resin composition for forming black barrier ribs that can be cured at low temperatures and has excellent chemical resistance, more specifically, a black photosensitive resin composition that has high reliability and patternability at a pre-bake temperature of 100° C. or less and photo-curing only (i-line exposure), and the difference from existing materials is that it can be cured at low temperatures of 100° C. or less, has the characteristics of being able to realize ultra-high resolution patterns of 2 μm or less, and is a black material with an optical density ( / μm) of 1.5 or more, specifically 2.0 or more. [Brief description of the drawings]

[0033] [Figure 1] FIG. 1 is a schematic diagram showing the structure of a micro OLED display device according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0034] Hereinafter, an embodiment of the present invention will be described in detail, however, this is presented as an example and the present invention is not limited thereto, and an embodiment of the present invention is not limited to what is defined by the claims below.

[0035] In this specification, unless otherwise specified, an "alkyl group" means a C1 to C20 alkyl group, an "alkenyl group" means a C2 to C20 alkenyl group, a "cycloalkenyl group" means a C3 to C20 cycloalkenyl group, a "heterocycloalkenyl group" means a C3 to C20 heterocycloalkenyl group, an "aryl group" means a C6 to C20 aryl group, an "arylalkyl group" means a C6 to C20 arylalkyl group, an "alkylene group" means a C1 to C20 alkylene group, an "arylene group" means a C6 to C20 arylene group, an "alkylarylene group" means a C6 to C20 alkylarylene group, a "heteroarylene group" means a C3 to C20 heteroarylene group, and an "alkoxyylene group" means a C1 to C20 alkoxyylene group.

[0036] In this specification, unless otherwise specified, "substitution" means that at least one hydrogen atom is replaced with a halogen atom (F, Cl, Br, I), a hydroxy group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an amino group, an azide group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C "C1-C20 alkyl group, C2-C20 alkenyl group, C2-C20 alkynyl group, C6-C20 aryl group, C3-C20 cycloalkyl group, C3-C20 cycloalkenyl group, C3-C20 cycloalkynyl group, C2-C20 heterocycloalkyl group, C2-C20 heterocycloalkenyl group, C2-C20 heterocycloalkynyl group, C3-C20 heteroaryl group, or one substituted with a substituent that is a combination of these.

[0037] In addition, unless otherwise specified in this specification, "hetero" means that at least one heteroatom selected from the group consisting of N, O, S and P is contained in the formula.

[0038] In addition, unless otherwise specified in this specification, "(meth)acrylate" means both "acrylate" and "methacrylate", and "(meth)acrylic acid" means both "acrylic acid" and "methacrylic acid".

[0039] Unless otherwise defined in this specification, "combination" means a mixture or copolymerization, "copolymerization" means block copolymerization or random copolymerization, and "copolymer" means block copolymerization or random copolymerization.

[0040] In the chemical formulae shown in this specification, unless otherwise defined, when a chemical bond is not shown at a position where a chemical bond should be shown, this means that a hydrogen atom is bonded at that position.

[0041] In this specification, unless otherwise defined, "*" means a moiety linked to the same or different atom or chemical formula.

[0042] A black photosensitive resin composition according to one embodiment includes (A) a binder resin, (B) a black colorant including lactam black, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) a solvent, and has an optical density (OD) per μm of 1.5 or more.

[0043] Conventionally, color photoresists are negative photosensitive liquid materials that are realized in red, green, and blue color patterns, and technological development has been conducted in the direction of gradually changing the composition of the liquid material. For example, efforts have been made to improve color purity by changing the type and content of the pigment dispersion liquid, which is the coloring material that realizes the color pattern, to improve patterning by changing the composition of the binder resin and photopolymerization initiator, and to improve coating properties and color uniformity by using other additives such as a leveling agent.

[0044] The photosensitive resin composition according to one embodiment is a black photosensitive resin composition capable of forming black partition walls located between red, green, and blue color filters, and is designed to realize pixels corresponding to high color reproduction and high resolution, prevent light leakage, and realize ultra-high resolution patterns so as to be optimized for next-generation displays such as VR (Virtual Reality), AR (Augmented Reality), and MR (Mixed Reality). Furthermore, the composition has high reliability and patternability by only low-temperature heat treatment and photo-curing, and is therefore very advantageous from the viewpoint of process.

[0045] Each component will be specifically described below.

[0046] (A) Binder resin The binder resin may include an acrylic binder resin.

[0047] The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin containing one or more acrylic repeating units.

[0048] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxy groups, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof.

[0049] The first ethylenically unsaturated monomer may be contained in an amount of 5% by weight to 50% by weight, for example 10% by weight to 40% by weight, based on the total amount of the acrylic binder resin.

[0050] Examples of the second ethylenically unsaturated monomer include aromatic vinyl compounds such as styrene, α-methylstyrene, vinyl toluene, and vinylbenzyl methyl ether; unsaturated carboxylate compounds such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, and phenyl (meth)acrylate; unsaturated carboxylate aminoalkyl ester compounds such as 2-aminoethyl (meth)acrylate and 2-dimethylaminoethyl (meth)acrylate; carboxylate vinyl ester compounds such as vinyl acetate and vinyl benzoate; unsaturated carboxylate glycidyl ester compounds such as glycidyl (meth)acrylate; cyanide vinyl compounds such as (meth)acrylonitrile; and unsaturated amide compounds such as (meth)acrylamide. These can be used alone or in combination of two or more.

[0051] Specific examples of acrylic binder resins include (meth)acrylic acid / benzyl methacrylate copolymers, (meth)acrylic acid / benzyl methacrylate / styrene copolymers, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymers, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymers, and the like, but are not limited thereto. These may be used alone or in combination of two or more kinds.

[0052] The acrylic binder resin may have a weight average molecular weight of 3,000 g / mol to 20,000 g / mol and a double bond equivalent of 340 g / mol or more. When the weight average molecular weight and double bond equivalent of the acrylic binder resin are within the above ranges, the resin has excellent pattern formability, and the thin film produced has excellent mechanical and thermal properties.

[0053] The binder resin may further include an epoxy-based binder resin.

[0054] The binder resin can improve heat resistance by further containing an epoxy-based binder resin. Examples of the epoxy-based binder resin include, but are not limited to, phenol novolac epoxy resin, tetramethylbiphenyl epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin, and combinations thereof.

[0055] Furthermore, the binder resin containing the epoxy-based binder resin ensures the dispersion stability of colorants such as pigments described below, and at the same time, enables pixels of a desired resolution to be formed during the development process.

[0056] The epoxy binder resin can be included in an amount of 1% by weight to 10% by weight, for example 5% by weight to 10% by weight, based on the total amount of the binder resin. When the epoxy binder resin is included in this range, the residual film rate and chemical resistance are greatly improved.

[0057] The epoxy equivalent weight of the epoxy-based binder resin can be 150 g / eq to 200 g / eq. When an epoxy-based binder resin having an epoxy equivalent weight within this range is contained in the binder resin, it has an advantageous effect on improving the hardening degree of the formed pattern and on fixing the colorant in the structure in which the pattern is formed.

[0058] The binder resin can be dissolved in the form of a solid content in a solvent described below to form a photosensitive resin composition. In this case, the binder resin in the form of a solid content can be about 0.1% by weight to 30% by weight, for example, 20% by weight to 30% by weight, based on the total amount of the binder resin solution dissolved in the solvent.

[0059] The binder resin may be contained in an amount of 0.1% by weight to 20% by weight, specifically 0.5% by weight to 15% by weight, for example 1% by weight to 10% by weight, based on the total amount of the photosensitive resin composition. When the binder resin is contained within the range, excellent sensitivity, developability, resolution, and linearity of the pattern can be obtained.

[0060] (B) Black colorant The black colorant in the photosensitive resin composition according to an embodiment may include lactam black in order to enhance light blocking properties and easily realize a black color.

[0061] Generally, carbon black is used alone as a black colorant to improve light blocking properties, but when carbon black is used alone, it is not preferred because although it has excellent optical density, other properties such as electrical properties deteriorate. In particular, when carbon black is used alone, it reduces the transmittance of ultraviolet (UV) light, making it impossible to form low-temperature curing and high-resolution patterns, and it may be difficult to apply it to micro OLED display devices, which are next-generation displays used in VR (Virtual Reality), AR (Augmented Reality) and MR (Mixed Reality) devices.

[0062] There have been attempts to use organic black pigments (e.g., color mixtures such as RGB black) as black colorants, but although the light blocking ability may be somewhat lower than when carbon black is used alone, it has been confirmed that it has sufficient light blocking performance and improves other properties such as electrical properties. However, although the optical density is insufficient and it is better than when carbon black is used alone, the transmittance in the ultraviolet (UV) region is still insufficient, resulting in poor patterns, and it may be difficult to apply it to next-generation displays such as micro OLED displays.

[0063] This tendency also occurs when the black colorant in the photosensitive resin composition further contains carbon black in addition to the organic black pigment.

[0064] Therefore, the present inventors have confirmed that the above-mentioned problems can be solved by using lactam black instead of carbon black or organic black pigments as conventional black colorants, and have completed the present invention. Specifically, the content of the lactam black-containing black colorant contained in the black photosensitive resin composition according to one embodiment can be 60% by weight to 80% by weight, for example 60% by weight to 70% by weight, based on the total amount of the black photosensitive resin composition. In this case, it is extremely easy to control the optical density (OD) per 1 μm to 1.5 or more, more specifically 2.0 or more, and further, it is possible to prevent a decrease in the transmittance in the ultraviolet (UV) region, and it is also easy to form low-temperature curing and high-resolution patterns of 2 μm or less, and it can be easily applied to micro OLED display devices of next-generation displays.

[0065] For example, the black colorant may consist of lactam black millbase.

[0066] The lactam black mill base can contain lactam black as a solid component, a dispersant, and a solvent as described below. Specifically, lactam black can be surface-treated with a dispersant before use, or a dispersant can be added together with lactam black during the preparation of the composition. The content of the solid lactam black can be 5% by weight to 40% by weight, for example 8% by weight to 30% by weight, based on the total amount of the lactam black mill base.

[0067] The dispersant may be a nonionic dispersant, a negative ionic dispersant, a positive ionic dispersant, etc. Specific examples of the dispersant include polyalkylene glycol and its ester, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonate, carboxylate, carboxylate, alkylamide alkylene oxide adduct, alkylamine, etc., which may be used alone or in combination of two or more.

[0068] Examples of commercially available dispersant products include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc. manufactured by BYK; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc. manufactured by EFKA Chemical; and Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc., or PB711 and PB821 manufactured by Ajinomoto Co., Ltd.

[0069] The dispersant may be contained in an amount of 0.1% by weight to 15% by weight based on the total weight of the black photosensitive resin composition. When the dispersant is contained within the range, the dispersibility of the composition is excellent, and therefore the stability, developability, and patternability during the production of black partition walls are excellent.

[0070] Lactam black can be pretreated with a water-soluble inorganic salt and a wetting agent before use. When lactam black is pretreated before use, the average particle size of lactam black can be reduced.

[0071] The pretreatment can be carried out through a step of kneading lactam black with a water-soluble inorganic salt and a wetting agent, and a step of filtering and washing the pigment obtained from the kneading step.

[0072] The kneading can be carried out at a temperature of 40° C. to 100° C., and the filtration and washing can be carried out by washing the inorganic salt with water or the like, and then filtering.

[0073] Examples of water-soluble inorganic salts include, but are not limited to, sodium chloride, potassium chloride, etc. The wetting agent functions as a medium through which the pigment and the water-soluble inorganic salt are uniformly mixed and the pigment can be easily pulverized, and examples thereof include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and diethylene glycol monomethyl ether, and alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycol, and these can be used alone or in combination of two or more.

[0074] The lactam black after the kneading step can have an average particle size of 5 nm to 200 nm, for example, 5 nm to 150 nm. When the average particle size of the lactam black is within the range, the lactam black has excellent stability in the mill base and is not likely to reduce pixel resolution.

[0075] Besides lactam black, the black colorant may further include organic black pigments such as carbon black and / or color mixtures such as RGB black as previously mentioned.

[0076] (C) Photopolymerizable monomer The photopolymerizable monomer in the black photosensitive resin composition according to one embodiment may be a single compound or a mixture of two different compounds.

[0077] When the photopolymerizable monomer is a mixture of two different compounds, one of the two compounds may be a compound containing at least two functional groups represented by the following Chemical Formula 1. [ka] In chemical formula 1, R 6 is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group, L 8 is a single bond or a substituted or unsubstituted C1 to C10 alkylene group.

[0078] For example, a compound containing at least two functional groups represented by Chemical Formula 1 can contain 2 to 6 functional groups represented by Chemical Formula 1. In this case, sufficient polymerization occurs upon exposure in the pattern formation step, and a pattern having excellent heat resistance, light resistance, and chemical resistance can be formed.

[0079] For example, the compound having at least two functional groups represented by Chemical Formula 1 may be a compound represented by Chemical Formula 2 or Chemical Formula 3 below. [ka] [ka] In Chemical Formula 2 and Chemical Formula 3, p, q, r and s each independently represents an integer of 1 to 10.

[0080] When the photopolymerizable monomer is a mixture of two different compounds, the other of the two compounds may be a monofunctional or polyfunctional ester compound of (meth)acrylic acid having at least one ethylenically unsaturated double bond.

[0081] Examples of the monofunctional or polyfunctional ester compound of (meth)acrylic acid having at least one ethylenically unsaturated double bond include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol di ... The epoxy (meth)acrylate may be tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy (meth)acrylate, ethylene glycol monomethyl ether (meth)acrylate, trimethylolpropane tri(meth)acrylate, tris(meth)acryloyloxyethyl phosphate, novolac epoxy (meth)acrylate, or a combination thereof.

[0082] Examples of commercially available monofunctional or polyfunctional ester compounds of (meth)acrylic acid having at least one ethylenically unsaturated double bond are as follows. Examples of monofunctional esters of (meth)acrylic acid include ARONIX (registered trademark) M-101, M-111, M-114, etc. manufactured by Toa Gosei Chemical Industry Co., Ltd., KAYARAD (registered trademark) TC-110S, TC-120S, etc. manufactured by Nippon Kayaku Co., Ltd., and V-158, V-2311, etc. manufactured by Osaka Organic Chemical Industry Co., Ltd. Examples of bifunctional esters of (meth)acrylic acid include ARONIX (registered trademark) M-210, M-240, M-6200, etc. manufactured by Toa Gosei Chemical Industry Co., Ltd., KAYARAD (registered trademark) HDDA, HX-220, R-604, etc. manufactured by Nippon Kayaku Co., Ltd., and V-260, V-312, V-335HP, etc. manufactured by Osaka Organic Chemical Industry Co., Ltd. Examples of trifunctional esters of (meth)acrylic acid include ARONIX (registered trademark) M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc. manufactured by Toagosei Chemical Industry Co., Ltd., KAYARAD (registered trademark) TMPTA, DPCA-20, -30, -60, -120, etc. manufactured by Nippon Kayaku Co., Ltd., and V-295, -300, -360, -GPT, -3PA, -400, etc. manufactured by Osaka Organic Chemical Industry Co., Ltd. These products can be used alone or in combination of two or more kinds.

[0083] The photopolymerizable monomer can also be used after being treated with an acid anhydride in order to impart better developability.

[0084] The photopolymerizable monomer can be included in the black photosensitive resin composition in an amount of 0.5% by weight to 10% by weight, for example, 0.5% by weight to 5% by weight, for example, 1% by weight to 5% by weight. When the photopolymerizable monomer is included within the range, curing occurs sufficiently upon exposure in the pattern formation process, and the pattern has excellent reliability, excellent heat resistance, light resistance, and chemical resistance, as well as excellent resolution and adhesion.

[0085] (D) Photopolymerization initiator The black photosensitive resin composition according to an embodiment includes a photopolymerization initiator. The photopolymerization initiator may be an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, a triazine-based compound, an oxime-based compound, or the like.

[0086] Examples of acetophenone compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, pt-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-4-(methylthio)phenyl)-2-mopolynopropan-1-one, 2-benzyl-2-dimethylamino-1-4-mopolynophenyl)-butan-1-one, and the like.

[0087] Examples of benzophenone-based compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

[0088] Examples of thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropylthioxanthone.

[0089] Examples of the benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal.

[0090] Examples of triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, azine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphth1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphth1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine, and the like.

[0091] Examples of oxime compounds that can be used include O-acyloxime compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, and O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one. Specific examples of O-acyloxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butan-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octan-1-one oxime-O-acetate, and 1-(4-phenylsulfanylphenyl)-butan-1-one oxime-O-acetate.

[0092] As the photopolymerization initiator, in addition to the compound, carbazole compounds, diketone compounds, sulfonium borate compounds, diazo compounds, imidazole compounds, non-imidazole compounds, etc. can be used.

[0093] The photopolymerization initiator may be included in an amount of 0.1% by weight to 5% by weight, for example, 0.1% by weight to 3% by weight, based on the total amount of the black photosensitive resin composition. When the photopolymerization initiator is included within the range, photopolymerization is sufficiently carried out upon exposure in the pattern formation process for manufacturing a color filter, resulting in excellent sensitivity and improved transmittance.

[0094] (E) Solvent The solvent may be any material that is compatible with, and does not react with, the pigment dispersion containing the black colorant, the binder resin, the photopolymerizable monomer, and the photopolymerization initiator.

[0095] Examples of the solvent include alcohols such as methanol and ethanol, ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methyl phenyl ether, and tetrahydrofuran, glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol dimethyl ether, cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate, carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, and diethylene glycol diethyl ether, propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate, aromatic hydrocarbons such as toluene and xylene, methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl ketones such as methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, 2-heptanone, etc.; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, isobutyl acetate, etc.; lactic acid esters such as methyl lactate, ethyl lactate, etc.; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, etc.; alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.; 3-oxypropionic acid methyl ethyl, 3-oxypropionic acid alkyl esters such as ethyl 3-oxypropionate, 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate, 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, and ethyl 2-ethoxypropionate,2-alkoxypropionic acid alkyl esters such as methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate; monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyethyl acetate, and methyl 2-hydroxy-3-methylbutanoate; Examples of the solvent include ketone acid esters such as ethyl pyruvate, and high-boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethylsulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate.

[0096] Among these, taking into consideration compatibility and reactivity, glycol ethers such as ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, etc., ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate, esters such as ethyl 2-hydroxypropionate, carbitols such as diethylene glycol monomethyl ether, and propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, etc. can be used.

[0097] The solvent may be contained in an amount of, for example, 10% by weight to 40% by weight, for example, 10% by weight to 30% by weight, based on the total amount of the photosensitive resin composition. When the solvent is contained within the range, the black photosensitive resin composition has an appropriate viscosity, and therefore the fairness during the production of the black partition wall is excellent.

[0098] (F) Other additives Meanwhile, the black photosensitive resin composition may further contain additives such as malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a labeling agent, a surfactant, a polymerization inhibitor, or a combination thereof.

[0099] The silane coupling agent may have a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group or an epoxy group in order to improve adhesion to a substrate.

[0100] Examples of silane coupling agents include trimethoxysilylbenzic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycitoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and the like. These can be used alone or in combination of two or more.

[0101] The silane coupling agent may be contained in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is contained within the range, the adhesiveness, storage stability, etc. are excellent.

[0102] Furthermore, the photosensitive resin composition may further contain a surfactant, for example, a fluorine-based surfactant and / or a silicon-based surfactant, if necessary, to improve coating properties and prevent defects.

[0103] As the fluorosurfactant, commercially available products such as BM-1000 and BM-1100 manufactured by BM Chemie, Makerpack F142D, F172, F173, F183, F554, and F556 manufactured by DIC Corporation, Prolade FC-135, FC-170C, FC-430, and FC-431 manufactured by 3M Japan Ltd., Surflon (registered trademark) S-112, S-113, S-131, S-141, and S-145 manufactured by AGC Inc., and SH-28PA, -190, -193, SZ-6032, and SF-8428 manufactured by Toray Silicones Co., Ltd. can be used.

[0104] As the silicone surfactant, those commercially available under the names BYK-307, BYK-333, BYK-361N, BYK-051, BYK-052, BYK-053, BYK-067A, BYK-077, BYK-301, BYK-322, BYK-325, etc. manufactured by BYK Chem can be used.

[0105] The surfactant can be used in an amount of 0.001 to 5 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the surfactant is within the range, the coating is uniform, no stains occur, and the wetting of the IZO substrate or glass substrate is excellent.

[0106] The polymerization inhibitor may include, but is not limited to, a hydroquinone-based compound, a catechol-based compound, or a combination thereof. When the black photosensitive resin composition according to an embodiment further includes a hydroquinone-based compound, a catechol-based compound, or a combination thereof, room temperature crosslinking can be prevented during exposure after coating the black photosensitive resin composition.

[0107] For example, the hydroquinone-based compound, the catechol-based compound, or a combination thereof may include, but is not necessarily limited to, hydroquinone, methylhydroquinone, methoxyhydroquinone, t-butylhydroquinone, 2,5-di-t-butylhydroquinone, 2,5-bis(1,1-dimethylbutyl)hydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl)hydroquinone, catechol, t-butylcatechol, 4-methoxyphenol, pyrocarol, 2,6-di-t-butyl-4-methylphenol, 2-naphthol, Tris(N-hydroxy-N-nitrosophenylaminato-O,O')aluminium, or a combination thereof.

[0108] The hydroquinone compound, the catechol compound or a combination thereof can be used in the form of a dispersion, and the polymerization inhibitor in the form of a dispersion can be contained in an amount of 0.001% by weight to 3% by weight, for example, 0.01% by weight to 1% by weight, based on the total amount of the black photosensitive resin composition. When the polymerization inhibitor is contained within the range, it is possible to solve the room temperature aging problem and prevent the sensitivity reduction and surface peeling phenomenon at the same time.

[0109] The black photosensitive resin composition may also contain other additives such as antioxidants and stabilizers in a certain amount within a range that does not impair the physical properties.

[0110] The black photosensitive resin composition according to an embodiment may be a positive type or a negative type, but is preferably a negative type in order to more completely remove residues in areas where the pattern is not pooled after exposure and development of the light-blocking composition.

[0111] In another embodiment, a black partition wall is provided, which is manufactured by exposing, developing and curing the above-mentioned photosensitive resin composition.

[0112] The method for manufacturing the black partition wall is as follows.

[0113] (1) Coating and coating film formation step The photosensitive resin composition is applied to a substrate such as a glass substrate or an ITO substrate that has been subjected to a predetermined pretreatment to a desired thickness using a method such as spin or slit coating, roll coating, screen printing, or applicator, and then heated at 100°C for 1 to 10 minutes to remove the solvent, thereby forming a photosensitive resin film. This step can improve image quality stains, etc.

[0114] (2) Exposure step To form the required pattern on the obtained photosensitive resin film, the active rays of i-line are irradiated through a photomask. The light source used for irradiation can be a low pressure mercury lamp, a high pressure mercury lamp, an ultra-high pressure mercury lamp, a metal halide lamp, an argon gas laser, etc., and in some cases, X-rays, electron beams, etc. can also be used.

[0115] The exposure dose varies depending on the type and amount of each component of the composition and the thickness of the dried film, but is 500 mJ / cm when using a high-pressure mercury lamp. 2 (for a 365 nm sensor) or less. This step allows fine tuning of the pixel size, making it possible to achieve higher resolution.

[0116] (3) Development step The development method involves using an alkaline aqueous solution as a developer following the exposure step to dissolve and remove the unnecessary parts, leaving only the exposed parts to form a pattern. This step creates a profile and achieves high resolution.

[0117] (4) Post-processing steps There is a post-heating process to obtain a pattern with excellent heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength and storage stability from the image pattern obtained by development in the process. For example, after development, it can be heated in a convection oven at 250°C for 1 hour. This step ensures uniformity and improves clarity.

[0118] Yet another embodiment provides a display device including a black partition wall.

[0119] The display may be a micro-organic light emitting device (OLED) display.

[0120] Referring to FIG. 1, a micro organic light emitting device (OLED) display device includes an OLED layer deposited on a silicon wafer, an inorganic layer laminated on the OLED layer, a protective adhesive layer laminated on the inorganic layer, and a color filter layer laminated on the protective adhesive layer to convert white light generated in the OLED layer into a plurality of colored lights, the color filter layer including a red color filter, a green color filter, and a blue color filter, and black partitions may be interposed between each of the color filters.

[0121] Conventionally, an OLED layer in which an OLED is deposited on a glass substrate or a polyimide substrate has been used, but in the micro OLED display device according to an embodiment, an OLED is deposited on a silicon wafer, which is advantageous for realizing a micro display. Such micro displays are attracting attention as next-generation displays, and micro displays are expected to be applied to devices such as MR. In fact, Apple, Meta, LG Display, etc. have already entered the next-generation MR device market or have announced their intention to enter it.

[0122] For example, the micro OLED display device can further include a microlens array, which is located on the adhesive layer and surrounds the color filter layer and the black partition wall.

[0123] In a micro OLED display device with this structure, white OLED is deposited on a highly integrated silicon wafer, and it can be driven on a pixel-by-pixel basis. It is also advantageous in ensuring high color reproduction and high resolution because it is easy to control the transmission wavelength through the color filter layer patterned with a resolution of 3μm or less.

[0124] For example, the protective adhesive layer may be a cured layer of a composition containing a binder resin, a photopolymerization initiator, a photopolymerizable monomer, a solvent, etc., and the lower inorganic layer may eliminate unevenness to prevent the occurrence of cracks and increase the attachment strength of the color filter layer.

[0125] For example, the thickness of the protective adhesive layer may be 1 μm or less, in which case the effect can be maximized.

[0126] For example, the thickness of the color filter layer can be from 1.1 μm to 1.6 μm.

[0127] For example, the thickness of the black partition wall can be 0.5 μm to 1.2 μm.

[0128] When the respective thicknesses of the color filter layer and the black partition wall are controlled as above, it is more advantageous to realize a micro OLED display device.

[0129] For example, the thickness of the inorganic layer may be 2 μm or less. Even in a white OLED, light does not always diffuse only in a direction perpendicular to the OLED layer, so that red, green, and blue color mixture inevitably occurs. Conventionally, an inorganic layer has been deposited on an OLED layer to prevent such color mixture. However, since color mixture cannot be completely prevented even by depositing an inorganic layer, in one embodiment, the inorganic layer is thinned, for example, the thickness of the inorganic layer is controlled to 2 μm or less, thereby preventing minute light leakage. Furthermore, high resolution can be achieved by positioning black partitions between color filter layers.

[0130] Furthermore, the black photosensitive resin composition that is the material for the black partition walls is a black material, and thus has problems with photocuring characteristics, etc. However, as described above, the black photosensitive resin composition according to one embodiment can produce a cured film simply by low-temperature curing during pre-baking and photocuring with i-lines, and therefore there is a huge difference in achievable resolution compared to display devices having conventional black partition walls.

[0131] Hereinafter, preferred embodiments of the present invention will be described, however, the following embodiment is merely a preferred embodiment of the present invention and the present invention is not limited to the following embodiment. EXAMPLES

[0132] (Photosensitive resin composition production) Examples 1 to 6, Comparative Examples 1 and 2 A photopolymerization initiator was dissolved in a solvent according to the composition shown in Table 1 below, and then stirred at room temperature for 2 hours. A binder resin and a photopolymerizable monomer were added thereto, and then stirred at room temperature for 1 hour. Other additives and a black colorant were added thereto, and then stirred at room temperature for 1 hour, after which the entire solution was stirred for 2 hours. The solution was filtered three times to remove impurities, and a photosensitive resin composition was produced. [Table 1]

[0133] (A) Binder resin Acrylic binder resin (SP-RY92-M10, Resoc) Double bond equivalent of 340g / mol or more

[0134] (B) Black colorant (B-1) Lactam black mill base (BC4001, manufactured by Sakata Inx Corporation, solid content 15% by weight) (B-2) Carbon black mill base (CI-M463, manufactured by Sakata Inx Corporation, solid content 15% by weight) (B-3) Red pigment mill base (BA6228, manufactured by Sakata Inx Corporation, solid content 15% by weight) (B-4) Green pigment mill base (BJ1564, manufactured by Sakata Inx Corporation, solid content 15% by weight) (B-5) Blue pigment mill base (BB6136, manufactured by Sakata Inx Corporation, solid content 15% by weight)

[0135] (C) Photopolymerizable monomer Dipentaerythritol hexa(meth)acrylate (DPHA, manufactured by Nippon Kayaku Co., Ltd.)

[0136] (D) Photopolymerization initiator Oxime initiator (SPI-03W, Sanyo)

[0137] (E) Solvent Propylene glycol monomethyl ether acetate (PGMEA, Sigma-Aldrich)

[0138] (F) Other Additives (F-1) Labeling agent (F-556, manufactured by DIC) (F-2) Surfactant (KBM-503, Shin-Etsu Chemical Co., Ltd.) (F-3) Polymerization inhibitor (MHQ, manufactured by JHChem)

[0139] Rating 1 The photosensitive resin compositions according to Examples 1 to 6, Comparative Example 1 and Comparative Example 2 were applied to a 10cm x 10cm ITO glass (resistance 30Ω), heated on a hot plate at 100°C for 1 minute using a proxy type, and then heated again for 1 minute using a contact type to form a photosensitive resin film with a thickness of 1μm. The optical density (OD) of the resin film was measured using an X-Rite 361T densitometer, and the results are shown in Table 2 below. [Table 2]

[0140] Rating 2 The substrate coated with the photosensitive resin film was exposed to light using a mask engraved with patterns of various sizes, while varying the exposure dose using an exposure device (UX-1200SM-AKS02 manufactured by Ushio Corporation), and then developed with a 2.38% TMAH solution (aqueous developer) at room temperature to dissolve and remove the exposed areas. The substrate was then washed with pure water for 50 seconds to form a pattern, resulting in a hardened film.

[0141] The obtained cured film was observed for the minimum size of the pattern using a micro-optical microscope (Olympus STM6-LM) to measure the resolution of the pattern. That is, the minimum pattern size after curing was measured at the optimal exposure when the line width (CD: critical dimension, unit: μm) of the 2 μm patterned strip was less than 3 μm. When the line width was 1.5 μm or less, it was evaluated as ◎, when the line width was 2 μm or less, it was evaluated as ○, when it was more than 2 μm and less than 3 μm, it was evaluated as △, and when it was 3 μm or more, it was evaluated as X, and the results are shown in Table 3 below. [Table 3]

[0142] From Tables 2 and 3, it can be seen that the black photosensitive resin composition according to one embodiment is a composition that has high optical density and can be cured at a low temperature of 100° C. or less, and can realize an ultra-high resolution pattern of less than 3 μm, and is applicable to a micro OLED display device.

[0143] The present invention is not limited to the embodiments and examples disclosed in this specification, and can be manufactured in various different forms, and a person having ordinary knowledge in the technical field to which the present invention belongs can understand that the present invention can be embodied in other specific forms without changing the technical idea or essential characteristics of the present invention. Therefore, the embodiments and examples disclosed in this specification should be understood to be illustrative in all respects and not restrictive.

Claims

1. Binder resin, black colorants, including Lactam Black; Photopolymerizable monomers, a photoinitiator, and Contains a solvent, A black photosensitive resin composition having an optical density (OD) per 1 μm of 1.5 or more.

2. 2. The black photosensitive resin composition according to claim 1, wherein the black colorant is contained in an amount of 60% by weight to 80% by weight based on the total amount of the black photosensitive resin composition.

3. 2. The black photosensitive resin composition of claim 1, wherein the black colorant is comprised of the lactam black millbase.

4. The black photosensitive resin composition according to claim 3, wherein the black photosensitive resin composition has an optical density (OD) per 1 μm of 2.0 or more.

5. The black photosensitive resin composition according to claim 1 , which is curable at a temperature of 100° C. or less.

6. The black photosensitive resin composition according to claim 1 , wherein the binder resin comprises an acrylic binder resin.

7. The black photosensitive resin composition according to claim 6 , wherein the acrylic binder resin has a double bond equivalent of 340 g / mol or more.

8. The black photosensitive resin composition contains The binder resin is 1% by weight to 10% by weight, 60% to 80% by weight of the black colorant, 0.5% by weight to 5% by weight of the photopolymerizable monomer; 0.1% to 3% by weight of the photoinitiator, and The black photosensitive resin composition according to claim 1 , further comprising a balance of the solvent.

9. The black photosensitive resin composition according to claim 1, further comprising an additive selected from the group consisting of malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a labeling agent, a surfactant, a polymerization inhibitor, and combinations thereof.

10. A black partition wall produced using the black photosensitive resin composition according to any one of claims 1 to 9.

11. A display device comprising the black partition wall according to claim 10.

12. The black partition wall according to claim 10; The present invention includes an OLED layer deposited on a silicon wafer, an inorganic layer laminated on the OLED layer, a protective adhesive layer laminated on the inorganic layer, and a color filter layer laminated on the protective adhesive layer and converting white light generated in the OLED layer into a plurality of colored lights, the color filter layer includes a red color filter, a green color filter, and a blue color filter; The black partitions are located between each of the color filters.

13. The micro OLED display device of claim 12 , further comprising a microlens array located on the protective adhesive layer and surrounding the color filter layer and the black partition.

14. The micro OLED display of claim 12, wherein the protective adhesive layer has a thickness of 1 μm or less.

15. The micro OLED display device of claim 12, wherein the color filter layer has a thickness of 1.1 μm to 1.6 μm.

16. The micro OLED display device according to claim 12, wherein the thickness of the black partition is 0.5 μm to 1.2 μm.

17. The micro OLED display of claim 12, wherein the inorganic layer has a thickness of 2 μm or less.

18. A step of applying the black photosensitive resin composition according to any one of claims 1 to 9; After the coating, pre-baking at a temperature of 100° C. or less; After the pre-baking, exposing to i-line; Developing step A method for manufacturing a black partition wall comprising the steps of:

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