Heat transfer unit

Abstract

To provide a new heat transfer unit having excellent physical properties.SOLUTION: A heat transfer unit 1 has a housing 3 having an inflow port 10 and an outflow port 11 of a fluid and made of a ceramic material. In the heat transfer unit 1, a heat transfer body 2 has through holes 40 and is housed in the housing 3. The heat transfer body 2 is disposed between the inflow port 10 and the outflow port 11, and the inflow port 10 and the outflow port 11 communicate with each other through the through holes 40.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a heat transfer unit. [Background technology]

[0002] Conventionally, media that transfer heat in heat exchangers have been known. For example, Patent Document 1 shows a porous sintered body in which a plurality of aluminum substrates are sintered and integrated. In addition, Patent Document 2 shows a technology related to a heat exchanger made of a ceramic structure. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2022 / 190611 [Patent Document 2] JP 2015-140972 A Summary of the Invention [Problem to be solved by the invention]

[0004] The porous sintered body in Patent Document 1 is made of aluminum or an aluminum alloy, and therefore is lightweight and has excellent thermal conductivity, but has low heat resistance, and therefore may be damaged during the manufacturing process of the heat transfer member. In addition, the heat exchanger in Patent Document 2 is made of ceramic, and therefore is brittle and has low thermal conductivity.

[0005] The present disclosure has been made in consideration of these points, and has an object to provide a new heat transfer unit having excellent physical properties. [Means for solving the problem]

[0006] The heat transfer unit of the present disclosure comprises: A heat transfer body; A heat transfer unit comprising: a housing having an inlet and an outlet for a fluid and made of a ceramic material; The heat transfer body has a through hole and is housed in the housing, The heat transfer body is disposed between the inlet and the outlet, and the inlet and the outlet are in communication with each other via the through hole.

[0007] In the heat transfer unit of the present disclosure, A ceramic layer may be formed on a surface of the heat transfer body and on a surface where the through hole is in contact with the heat transfer body.

[0008] In the heat transfer unit of the present disclosure, The heat transfer unit includes a bonding layer including a ceramic material, The housing and the heat transfer body may be joined via the joining layer.

[0009] In the heat transfer unit of the present disclosure, The heat transfer body may be formed by laminating metal structures.

[0010] In the heat transfer unit of the present disclosure, The metal structure is composed of a plurality of metal members having longitudinal axes arranged in the same plane, The through hole may be formed between the metal members.

[0011] In the heat transfer unit of the present disclosure, The bonding layer may include alumina.

[0012] In the heat transfer unit of the present disclosure, The metal structure may include aluminum.

[0013] In the heat transfer unit of the present disclosure, The ceramic layer may contain alumina.

[0014] In the heat transfer unit of the present disclosure, The ceramic layer may have a thickness of 1 to 100 μm.

[0015] In the heat transfer unit of the present disclosure, Each corner of the metal member may be curved.

[0016] In the heat transfer unit of the present disclosure, The metal structure may have an array structure in which metal members are arranged in a row with their longitudinal axes extending in substantially the same direction.

[0017] In the heat transfer unit of the present disclosure, The heat transfer body may have a space factor of 30 to 80%. Effect of the Invention

[0018] According to the heat transfer unit of the present disclosure, a new heat transfer unit having excellent physical properties can be obtained. [Brief description of the drawings]

[0019] [Figure 1] 1 is a schematic cross-sectional view illustrating a configuration of a heat transfer unit according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a side view of a portion of an overall metal structure according to an embodiment of the present disclosure. [Diagram 3] FIG. 11 is a plan view showing a partial configuration of the entire metal structure including an array structure in a modified example of the metal structure according to the embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. Fig. 1 to Fig. 3 are diagrams showing a part of a heat transfer unit according to an embodiment of the present disclosure. Of these, Fig. 1 is a schematic cross-sectional view showing the configuration of the heat transfer unit according to the present embodiment, and Fig. 2 is a side view of a part of the entire metal structure shown in Fig. 1. Fig. 3 is a plan view showing the configuration of a part of the entire metal structure including an array structure in a modified example of the metal structure according to the present embodiment.

[0021] -Heat Transfer Unit 1- As shown in Fig. 1, a heat transfer unit 1 according to this embodiment includes a heat transfer body 2, and a housing 3 made of a ceramic material, having a fluid inlet 10 and an outlet 11. In Fig. 1, solid arrows indicate the trajectory of a fluid passing through the heat transfer body 2, and hollow arrows indicate the flow direction of the fluid flowing in and out of the housing 3.

[0022] The housing 3 is a hollow rectangular parallelepiped member, and is formed with an inlet 10 which is an opening through which a fluid flows into the housing 3, and an outlet 11 which is an opening through which a fluid flows out of the housing 3. The fluid that flows into the housing 3 from the inlet 10 flows out of the housing 3 from the outlet 11.

[0023] The heat transfer body 2 is a member that has a through hole 40 and is housed in the housing 3, and the metal members 6a between the adjacent metal structures 6 are bonded to each other at their contact points or abutting surfaces. In other words, the heat transfer body 2 is formed by stacking the multiple metal structures 6. In the present embodiment, the heat transfer body 2 will be described as having six layers.

[0024] The heat transfer body 2 is a member disposed between the inlet 10 and the outlet 11 of the housing 3. The heat transfer body 2 communicates with the inlet 10 and the outlet 11 of the housing 3 via a through hole 40. The heat transfer body 2 contacts the inner surface of the housing 3 at the end of the metal structure 6 in the planar direction and is joined to the inner surface of the housing 3 via a joining layer 5.

[0025] In the heat transfer body 2, the number of other metal members 6a present across the metal structures 6 is limited to 1 / 100 the number of metal structures 6 (1 cm 2 In this case, the fluid can efficiently pass through the through holes 40 of the heat transfer body 2, and the metal structure 6 and the heat transfer body 2 can reduce the pressure loss of the fluid.

[0026] Furthermore, the space factor in the cross section when the heat transfer body 2 is cut in the surface direction at any point is 30% to 80%. In this case, it is possible to achieve good fluid diffusibility while keeping the pressure loss of the fluid in the heat transfer body 2 small. Here, the space factor is calculated by the area occupied by the metal members 6a when the heat transfer body 2 is cut in the surface direction / (area occupied by the metal members 6a+area of ​​the through holes 40)×100(%).

[0027] The metal structure 6 is formed by a metal member 6a having a longitudinal axis, which is arranged on the same plane and bonded to a plurality of other metal members 6a at their contact points or abutting surfaces. Here, the number "plurality" is not particularly limited, and may be 10 to 20,000.

[0028] The metal member 6a is a member having a longitudinal axis and a lateral axis, and is a member having a shape such as a rectangle, an approximately rectangular shape, a cylindrical shape, or an elliptical cylindrical shape. Therefore, when the metal member 6a is a rectangle, an approximately rectangular shape, or the like, the cross section perpendicular to the longitudinal axis of the metal member 6a is expressed as a rectangle, a square, a circle, or the like. It is more preferable that the metal member 6a is a member having a shape such as a cylindrical shape or an elliptical cylinder. In this case, unevenness is generated on the surface of the metal structure 6, and when a fluid flows, a vortex is generated on the surface of the metal structure 6. As a result, the fluid diffusibility can be increased while maintaining a small pressure loss of the fluid in the metal structure 6. In addition, in this case, the cross section perpendicular to the longitudinal axis of the metal member 6a is expressed as a circle, an ellipse, or the like.

[0029] The metal structure 6 may have a length in a cross section of the metal member 6a perpendicular to the longitudinal axis of the metal member 6a that is substantially equal to a length perpendicular to the surface direction of the metal structure 6. In this case, the homogeneity of the metal structure 6 is improved, and the pressure loss and fluid diffusivity of the metal structure 6 and the heat transfer body 2 are stabilized.

[0030] The metal structure 6 may be flat or three-dimensional. The length perpendicular to the surface direction of the metal structure 6 (the thickness of the metal structure 6) may be the same or approximately the same as the length in a cross section perpendicular to the longitudinal axis of the metal member 6a. In this case, the homogeneity of the metal structure 6 is improved, and the pressure loss and fluid diffusibility of the metal structure 6 and the heat transfer body 2 are stabilized. Here, the length in a cross section perpendicular to the longitudinal axis of the metal member 6a may be expressed as a circle equivalent diameter. In this specification, the "circle equivalent diameter" refers to the diameter of a circle having the same area as the area of ​​a cross section perpendicular to the longitudinal axis of the metal member 6a.

[0031] Furthermore, the ratio of the length in the longitudinal direction to the length in the lateral direction of the metal member 6a (the length in the cross section of the metal member 6a perpendicular to the longitudinal axis of the metal member 6a) may be 1 to 13. In this case, the fluid can efficiently pass through the through holes 40 of the heat transfer body 2. As a result, the pressure loss of the metal structure 6 and the heat transfer body 2 can be kept small, while the fluid diffusibility can be improved.

[0032] Here, the length of the metal member 6a in the short axis direction may be 0.1 mm to 4.0 mm. When the length of the metal member 6a in the short axis direction is 0.1 mm to 4.0 mm, the fluid can efficiently pass through the through holes 40 of the heat transfer body 2. As a result, the fluid diffusibility can be improved while keeping the pressure loss of the fluid in the metal structure 6 and the heat transfer body 2 small.

[0033] The metal member 6a is made of aluminum or an aluminum alloy, such as aluminum, copper, manganese, silicon, magnesium, zinc, nickel, or an alloy containing at least one of these metals.

[0034] In addition, it is preferable that the corners of the metal member 6a are rounded. In other words, each corner of the metal member 6a is formed to be curved. The rounded corners of the metal member 6a cause unevenness on the surface of the metal structure 6, and when a fluid flows, vortices are generated on the surface of the metal structure 6. As a result, it is possible to increase the fluid diffusibility while keeping the pressure loss of the fluid in the metal structure 6 and the heat transfer body 2 small.

[0035] The surface of the metal member 6a may have projections and recesses. Due to the projections and recesses on the surface of the metal member 6a, small through holes 40 are formed in the heat transfer body 2. In this case, the fluid diffusibility can be increased while keeping the pressure loss of the fluid in the metal structure 6 and the heat transfer body 2 small.

[0036] The through hole 40 is a hole formed in the stacking direction of the heat transfer body 2, and is a through hole formed in a straight line or a meandering shape in the stacking direction of the heat transfer body 2. When the heat transfer body 2 is accommodated inside the housing 3 to form the heat transfer unit 1, an opening (first opening) on ​​one end side of the through hole 40 opens toward the inlet 10 or the outlet 11. On the other hand, an opening (second opening) on ​​the other end side of the through hole 40 opens toward the opposite side to the first opening, and thus opens toward the inlet 10 or the outlet 11.

[0037] A plurality of through holes 40 are formed in the heat transfer body 2. The unevenness of the wall surface of the heat transfer body 2 forming each through hole 40 is not the same. Therefore, the fluid passing through each through hole 40 moves from the first opening to the second opening while following a different trajectory for each through hole 40.

[0038] The ceramic layer 4 is a layer containing a ceramic material made of a material made of nonmetallic elements such as silicon and diamond among solid materials, and an inorganic compound material such as an oxide, carbide, or nitride which is a combination of a metallic element and a nonmetallic element, and is formed on the outer surface of the heat transfer body 2 and on the uneven surface of the wall surface of the heat transfer body 2 which forms the through hole 40 (the surface where the through hole 40 and the heat transfer body 2 contact each other). The ceramic layer 4 is not particularly limited, but preferably contains alumina (aluminum oxide).

[0039] The thickness of the ceramic layer 4 is 1 to 100 μm, and may be 1 to 80 μm, 5 to 60 μm, 10 to 50 μm, or 20 to 40 μm. Even if the ceramic layer 4 is formed on the outer surface of the heat transfer body 2 and on the uneven surface of the wall surface of the heat transfer body 2 that forms the through holes 40, the ceramic layer 4 does not block the through holes 40. The thickness of the ceramic layer 4 does not need to be constant.

[0040] The bonding layer 5 is a part of the ceramic layer 4, and is formed in a portion that bonds a part of the end of the heat transfer body 2 in the planar direction to a part of the inner surface of the housing 3. The bonding layer 5 thermally bonds the heat transfer body 2 and the housing 3 via alumina. As a result, the heat transfer body 2 bonded to the housing 3 via the bonding layer 5 is fixed at a predetermined position on the housing 3.

[0041] Furthermore, the ratio of alumina in the cross section of the bonding layer 5 when the heat transfer body 2 is cut in the surface direction at any point is 50 to 100%, and may be 70 to 100%. In this case, the heat transfer body 2 can have good thermal conductivity and can withstand heat exchange with high-temperature fluid. Here, the ratio of alumina is represented by the space factor of alumina relative to the space factor of the bonding layer 5 when the heat transfer body 2 is cut in the surface direction.

[0042] According to the heat transfer unit 1 of the present embodiment having the above-mentioned configuration, the heat transfer unit 1 includes the heat transfer body 2 and the housing 3 having the inlet 10 and the outlet 11 of the fluid and made of a ceramic material, in which the heat transfer body 2 has a through hole 40 and is housed in the housing 3, the heat transfer body 2 is disposed between the inlet 10 and the outlet 11, and the inlet 10 and the outlet 11 communicate with each other through the through hole 40. More specifically, in the conventional technology, the porous sintered body is made of aluminum or an aluminum alloy, so that it is lightweight and has excellent thermal conductivity, but has low heat resistance. Therefore, there is a risk of damage during the manufacturing process of the heat transfer member. In addition, a heat exchanger made of ceramic is fragile and has low thermal conductivity. In contrast, the heat transfer unit 1 of the present embodiment includes a heat transfer body 2 and a housing 3 made of a ceramic material, having an inlet 10 and an outlet 11 for a fluid, the heat transfer body 2 having a through hole 40 and housed in the housing 3, the heat transfer body 2 being disposed between the inlet 10 and the outlet 11, and the inlet 10 and the outlet 11 being in communication with each other via the through hole 40, so that the fluid flowing into the housing 3 can efficiently pass through the through hole 40 of the heat transfer unit 1, and the heat transfer unit 1 can reduce pressure loss of the fluid. In addition, since the housing 3 is made of a ceramic material, high heat resistance can be obtained, and damage to the heat transfer unit 1 during the manufacturing process can be reduced, and the housing 3 can also withstand heat exchange of high-temperature fluid.

[0043] In the heat transfer unit 1 of the present embodiment, as described above, the ceramic layer 4 may be formed on the surface of the heat transfer body 2 and on the surface of the heat transfer body 2 and on the surface of the through hole 40. Since the melting point of ceramics is high, damage to the heat transfer unit 1 during the heating process during manufacture can be reduced, and the heat transfer body 2 can withstand heat exchange with high-temperature fluids.

[0044] Furthermore, as described above, in the heat transfer unit 1 of the present embodiment, the heat transfer unit 1 may include a bonding layer 5 containing a ceramic material, and the housing 3 and the heat transfer body 2 may be bonded to each other via the bonding layer 5. In this case, since the bonding layer 5 contains a ceramic material, damage to the bonding layer 5 due to high temperatures during the manufacturing process can be reduced.

[0045] Furthermore, in the heat transfer unit 1 of this embodiment, as described above, the heat transfer body 2 may be formed by stacking the metal structures 6. In this case, since the housing 3 is made of a ceramic material and the heat transfer body 2 is made of the metal structures 6, it is possible to achieve both the heat resistance of the ceramic material and the thermal conductivity of the metal, and it is also possible to withstand heat exchange of high-temperature fluids. Furthermore, the heat transfer body 2 can efficiently exchange heat with the fluid in the stacking direction of the metal structures 6 (the flow direction of the fluid).

[0046] In the heat transfer unit 1 of the present embodiment, as described above, the metal structure 6 may be composed of a plurality of metal members 6a having longitudinal axes arranged on the same plane, and the through holes 40 may be formed between the metal members 6a. In this case, the fluid can pass through the through holes 40, so that the fluid can be efficiently moved from the inlet 10 of the housing 3 toward the outlet 11.

[0047] In the heat transfer unit 1 of the present embodiment, the bonding layer 5 may contain alumina as described above. In this case, the heat resistance of the bonding layer 5 is improved, so that the heat transfer body 2 can withstand heat exchange with a high-temperature fluid.

[0048] In the heat transfer unit 1 of this embodiment, the metal structure 6 may contain aluminum as described above. In this case, since aluminum has high thermal conductivity, it is possible to increase the heat exchange performance while reducing the pressure loss of the fluid in the metal structure 6. As a result, it can be suitably used as a heat exchange member or the like. Note that the metal member 6a may be a metal other than aluminum as long as it has such a function.

[0049] In the heat transfer unit 1 of the present embodiment, the ceramic layer 4 may contain alumina as described above. In this case, the heat resistance of the ceramic layer 4 is improved, so that the heat transfer body 2 can withstand heat exchange with a high-temperature fluid.

[0050] In the heat transfer unit 1 of the present embodiment, as described above, the ceramic layer 4 may have a thickness of 1 to 100 μm, 5 to 80 μm, or 10 to 60 μm. In this case, the heat transfer body 2 can withstand heat exchange with a high-temperature fluid while maintaining the thermal conductivity.

[0051] In the heat transfer unit 1 of the present embodiment, each corner of the metal member 6a may be curved as described above. In this case, unevenness is generated on the surface of the metal structure 6, and when a fluid flows, vortices are generated on the surface of the metal structure 6. As a result, the fluid diffusibility can be increased while keeping the pressure loss of the fluid in the metal structure 6 small.

[0052] In the heat transfer unit 1 of the present embodiment, as described above, the metal structure 6 may have an arrangement structure 7 in which the metal members 6a are arranged in a line with the longitudinal axis extending in substantially the same direction. In this case, since the arrangement direction of the multiple metal members 6a is aligned and bonded, uniform unevenness is generated on the surfaces of the metal structure 6 and the heat transfer body 2, and when a fluid flows, vortices are generated on the surfaces of the metal structure 6 and the heat transfer body 2. As a result, the fluid diffusibility can be increased while keeping the pressure loss of the fluid in the metal structure 6 and the heat transfer body 2 small.

[0053] In the heat transfer unit 1 of the present embodiment, as described above, the space factor of the heat transfer body 2 may be 30 to 80%. In this case, the fluid can efficiently pass through the metal structure 6 and the through holes 40 of the heat transfer body 2. As a result, the pressure loss of the metal structure 6 and the heat transfer body 2 can be kept small, while the fluid diffusibility can be increased.

[0054] In the heat transfer unit 1 of the present embodiment, the ratio of the alumina contained in the bonding layer 5 may be 50 to 100%, or may be 70 to 100%, as described above. In this case, the desired heat resistance can be achieved in the bonding layer 5, so that the heat transfer body 2 can appropriately withstand heat exchange with a high-temperature fluid.

[0055] It should be noted that the heat transfer unit 1 according to this embodiment is not limited to the above-mentioned embodiment.

[0056] For example, in the present embodiment, the inlet 10 and the outlet 11 are formed at opposing positions in the housing 3, but the present invention is not limited thereto. For example, the inlet 10 and the outlet 11 may be formed diagonally in the housing 3.

[0057] In addition, in this embodiment, the arrangement direction of the multiple metal members 6a is not limited. For example, as shown in FIG. 3, the metal structure 6 according to the modified example may include an arrangement structure 7 in which multiple metal members 6a are arranged on the same surface (the direction in which the longitudinal axis extends is substantially the same) and are connected to multiple other metal members 6a at their contact surfaces. In this case, the multiple arrangement structures 7 may be arranged on the same surface and connected at contact points. Also, the multiple arrangement structures 7 may be arranged on the same surface and connected to multiple other arrangement structures 7 at contact points. In this case, since the arrangement directions of the multiple metal members 6a are aligned and connected, uniform unevenness is generated on the surfaces of the metal structure 6 and the heat transfer body 2, and when a fluid flows, a vortex is generated on the surfaces of the metal structure 6 and the heat transfer body 2. As a result, the pressure loss of the fluid in the metal structure 6 and the heat transfer body 2 can be kept small while the fluid diffusibility can be increased.

[0058] In the present embodiment, the heat transfer body 2 is a member disposed between the inlet 10 and the outlet 11 of the housing 3, and is in contact with the inner surface of the housing 3 at the end of the metal structure 6 in the planar direction and bonded via the bonding layer 5, but the present invention is not limited thereto. For example, the heat transfer body 2 may be in contact with the inner surface of the housing 3 not only at the end of the metal structure 6 in the planar direction but also at the end of the metal structure 6 in the stacking direction. In this case, for example, when the metal structure 6 is in contact with the inner surface of the housing 3 at both ends in the stacking direction, at least three surfaces, the inner surfaces at both ends and the inner surface of the housing 3, are in contact with the heat transfer section 2. Also, when the metal structure 6 is in contact with the inner surface of the housing 3 at one end in the stacking direction, at least two surfaces, the inner surface at one end and the inner surface of the housing 3, are in contact with the heat transfer section 2.

[0059] In the present embodiment, a configuration in which one heat transfer body 2 is disposed inside the housing 3 has been described as an example, but the present invention is not limited thereto. For example, a plurality of heat transfer bodies 2 may be disposed inside the housing 3.

[0060] Furthermore, regarding the contact form between the heat transfer body 2 and the inner surface of the housing 3 in the heat transfer unit 1 in this embodiment, when viewed from the inlet 10 direction toward the outlet 11 direction, the heat transfer body 2 may be in contact with a total of three inner surfaces of the hollow rectangular housing 3, including two opposing inner surfaces, two opposing inner surfaces, and one inner surface adjacent to the two opposing inner surfaces, for a total of four inner surfaces of the hollow rectangular housing 3.

[0061] In the present embodiment, the housing 3 has been described as a rectangular parallelepiped member, but the present invention is not limited to this. For example, the housing 3 may be cylindrical. In this case, for example, the heat transfer body 2 disposed inside the housing 3 is in contact with at least a part of the inner peripheral surface of the housing 3.

[0062] The manufacturing method in this embodiment is not limited to the above. For example, a plurality of metal members 6a are arranged in a plane and sintered together using sintering equipment heated to 900° C. to obtain the metal structure 6.

[0063] For example, a plurality of metal structures 6 are stacked, and the metal structures 6 are sintered using sintering equipment heated to 900° C. to obtain the heat transfer body 2 .

[0064] For example, a ceramic layer can be formed on the heat transfer body 2 by performing anodizing (anodic oxidation) on the surface of the heat transfer body 2 and the surface of the through hole 40 where the through hole 40 is in contact with the heat transfer body 2 .

[0065] For example, after the heat transfer body 2 is enclosed inside the housing 3, the housing 3 is sintered and the bonding layer 5 is thermally bonded using sintering equipment heated to 900° C., thereby obtaining the heat transfer unit 1.

[0066] Furthermore, the metal member 6a may be partially or entirely hollow or cylindrical. [Explanation of symbols]

[0067] 1 Heat transfer unit 2. Heat Transfer Material 3. Chassis 4 Ceramic layer 40 Through hole 5 Bonding layer 6 Metal structure 6a Metallic parts 7 Array Structure 10 Inlet 11 Outlet

Claims

1. A heat transfer body; A heat transfer unit comprising: a housing having an inlet and an outlet for a fluid and made of a ceramic material; The heat transfer body has a through hole and is housed in the housing, the heat transfer body is disposed between the inlet and the outlet, and the inlet and the outlet are in communication with each other via the through hole.

2. The heat transfer unit according to claim 1 , wherein a ceramic layer is formed on a surface of the heat transfer body and on a surface where the through hole is in contact with the heat transfer body.

3. The heat transfer unit includes a bonding layer including a ceramic material, The heat transfer unit according to claim 1 , wherein the housing and the heat transfer body are joined via the joining layer.

4. The heat transfer unit according to claim 1 , wherein the heat transfer body is formed by laminating metal structures.

5. The metal structure is composed of a plurality of metal members having longitudinal axes arranged in the same plane, The heat transfer unit according to claim 4 , wherein the through hole is formed between the metal members.

6. The heat transfer unit of claim 3 , wherein the bonding layer comprises alumina.

7. The heat transfer unit according to claim 4 or 5, wherein the metal structure comprises aluminum.

8. The heat transfer unit of claim 2 , wherein the ceramic layer comprises alumina.

9. The heat transfer unit according to claim 2 or 8, wherein the ceramic layer has a thickness of 1 to 100 μm.

10. The heat transfer unit according to claim 5 , wherein each corner of the metal member is curved.

11. The heat transfer unit according to claim 5 or 10, wherein the metal structure has an arrangement structure in which metal members are arranged in a row with their longitudinal axes extending in substantially the same direction.

12. The heat transfer unit according to any one of claims 1 to 5, wherein the heat transfer body has a space factor of 30 to 80%.

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