Extended substrate processing systems and methods with additional processing chamber connectability

Abstract

To provide substrate processing systems and methods with expanded substrate processing capabilities.SOLUTION: The substrate processing systems have expanded substrate processing capabilities. In some examples, this may be accomplished by providing a near-side substrate handling chamber (e.g., with six facets or side walls) and a far-side substrate handling chamber (e.g., with five facets or side walls). The near-side substrate handling chamber may be connected with additional substrate processing chambers. The near-side substrate handling chamber may be connected to the far-side substrate handling chamber by an additional far-side load-lock module. These features enable a manufacturer to increase the number of substrate processing chambers in a substrate processing system or line.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates generally to substrate processing systems having expanded substrate processing capabilities. Some more specific aspects of the technology relate to substrate processing systems that include a front substrate handling chamber and a rear substrate handling chamber interconnected by an additional rear load lock module. This arrangement and these additional components increase the number of substrate processing chambers in the system and the substrate processing capabilities. [Background technology]

[0002] A material layer is generally deposited onto a substrate during the manufacture of semiconductor devices, such as during the manufacture of integrated circuits and electronic devices. Material layer deposition is generally accomplished by supporting the substrate in a substrate processing chamber arrangement, heating the substrate to a desired deposition temperature, and flowing one or more material layer precursors through the chamber arrangement and across the substrate. As the precursors flow across the substrate, a material layer typically grows gradually onto the surface of the substrate according to the temperature of the substrate and the environmental conditions within the chamber arrangement.

[0003] Existing substrate processing systems 100 include "cluster-type" systems of the type generally shown in Figure 1. Such substrate processing systems 100 include a substrate handling chamber 102 that operatively connects to two to four substrate processing chambers 104 via gate valves 106. Each substrate processing chamber 104 is equipped to receive a substrate on a substrate support 108 that holds the substrate during processing (e.g., during material layer deposition as described above).

[0004] The substrate handling chamber 102 includes a robotic arm 110 that is used to move substrates into and out of the various substrate processing chambers 104 through a gate valve 106. In use, the gate valve 106 is opened and an end effector 110A of the robotic arm 110 extends through the open gate valve 106 to insert a substrate into or remove a substrate from the internal chamber of the substrate processing chamber 104 (e.g., to place a substrate on or remove a substrate from the substrate support 108). When the robotic arm 110 is retracted from the substrate processing chamber 104, the gate valve 106 is closed, thereby sealing the substrate processing chamber 104 from the substrate handling chamber 102. Other desired actions can then be performed within the substrate processing chamber 104 and / or the substrate handling chamber 102.

[0005] 1 further shows that the substrate processing system 100 includes a load lock module 112. The load lock module 112 is connected to the substrate handling chamber 102 by a gate valve 116. The load lock module 112 includes a substrate holding component 114 to hold the substrate on its way into the substrate handling chamber 102 for further processing and on its way out of the substrate handling chamber 102 (after processing is completed). An end effector 110A of the robot arm 110 moves through the gate valve 116 (when open) to move the substrate from the load lock module 112 into the substrate handling chamber 102 (for layer deposition and other processing) and from the substrate handling chamber 102 into the load lock module 112 (after processing is completed). The load lock module 112 and gate valve 116 keep the substrate isolated from the environment of the substrate handling chamber 102 until the conditions (e.g., temperature, pressure, atmospheric content, etc.) within the substrate handling chamber 102 are ready for the substrate to be inserted.

[0006] The load lock module 112 is further coupled to an equipment front end module 120 via another gate valve 118. The equipment front end module 120 includes a robot arm 122. An end effector 122A of the robot arm 122 moves through the gate valve 118 (when open) to move substrates from the equipment front end module 120 into the load lock module 112 (for layer deposition and other processing) and from the load lock module 112 back into the equipment front end module 120 (after processing is completed). The robot arm 122 of the equipment front end module 120 also picks up new substrates for processing from one of the load ports 124A-124C and returns processed substrates to one of the load ports 124A-124C, for example to be transported elsewhere for further processing.

[0007] While conventional semiconductor manufacturing systems and methods of this type are generally acceptable for their intended purposes, there is room for improvement. Improvements that reduce manufacturing costs, shorten processing times, and / or improve manufacturing efficiency would be welcomed in the art. Summary of the Invention

[0008] Aspects of the present technology relate to substrate processing systems and methods having expanded substrate processing capabilities. As noted above, some more specific aspects of the present technology relate to substrate processing systems and methods that include and use a front substrate handling chamber and a rear substrate handling chamber interconnected by an additional rear load lock module. This arrangement and these additional components increase the number of substrate processing chambers and substrate processing capabilities in the overall substrate processing system.

[0009] A semiconductor or other substrate processing system according to at least some embodiments of the present technology may include a first substrate handling chamber having (a) a first surface, (b) a second surface extending at an oblique angle relative to the first surface, (c) a third surface extending at an oblique angle relative to the first surface, (d) a fourth surface extending at an oblique angle relative to the second surface, (e) a fifth surface extending at an oblique angle relative to the third surface, and (f) a sixth surface connected between the fourth surface and the fifth surface. A first load lock module is connected to the first surface, and the first load lock module includes one or more first substrate supports for holding a substrate moving into and out of the first substrate handling chamber through the first surface. A second load lock module is connected to the sixth surface. The system further includes a second substrate handling chamber having (a) a seventh side connected to the second load lock module, (b) an eighth side extending at an oblique angle relative to the seventh side, (c) a ninth side extending at an oblique angle relative to the seventh side, (d) a tenth side extending at an oblique angle relative to the eighth side, and (e) an eleventh side extending at an oblique angle relative to the ninth side. The second load lock module includes one or more second substrate supports for holding substrates transferred between the first substrate handling chamber and the second substrate handling chamber through the sixth side and the seventh side.

[0010] In addition to or in the alternative to one or more of the features discussed above, the eleventh surface may extend at an oblique angle relative to the tenth surface.

[0011] In addition to or in the alternative to one or more of the features discussed above, each of the second side, the third side, the eighth side, the ninth side, the tenth side, and the eleventh side may be connected to a gate valve configured to interface with a respective substrate processing module.

[0012] In addition to or as an alternative to one or more of the features discussed above, examples of substrate processing systems according to the present technology may include (i) a first substrate processing chamber releasably coupled to the second side, (ii) a second substrate processing chamber releasably coupled to the third side, (iii) a third substrate processing chamber releasably coupled to the eighth side, (iv) a fourth substrate processing chamber releasably coupled to the ninth side, (v) a fifth substrate processing chamber releasably coupled to the tenth side, and / or (vi) a sixth substrate processing chamber releasably coupled to the eleventh side.

[0013] In addition to or in the alternative to one or more of the features discussed above, one or more (and optionally each) of the first substrate processing chamber, the second substrate processing chamber, the third substrate processing chamber, the fourth substrate processing chamber, the fifth substrate processing chamber, and / or the sixth substrate processing chamber may include at least four substrate supports.

[0014] In addition to or as an alternative to one or more of the features discussed above, one or more (and optionally each) of the first substrate processing chamber, the second substrate processing chamber, the third substrate processing chamber, the fourth substrate processing chamber, the fifth substrate processing chamber, and / or the sixth substrate processing chamber may include at least two substrate supports.

[0015] In addition to or in the alternative to one or more of the features discussed above, (a) the fourth side may have an edge-to-edge dimension that is shorter than an edge-to-edge dimension of each of the first side, the second side, the third side, and the sixth side, and / or (b) the fifth side may have an edge-to-edge dimension that is shorter than an edge-to-edge dimension of each of the first side, the second side, the third side, and the sixth side.

[0016] In addition to or in the alternative to one or more of the features discussed above, the edge-to-edge dimension of the fourth side and the edge-to-edge dimension of the fifth side may be substantially equal, and / or the edge-to-edge dimension of the first side, the edge-to-edge dimension of the second side, the dimension of the third side, and the edge-to-edge dimension of the sixth side may be substantially equal.

[0017] In addition to or in the alternative to one or more of the features discussed above, the sixth side may have an edge-to-edge dimension that is substantially equal to an edge-to-edge dimension of the seventh side.

[0018] In addition to or in the alternative to one or more of the features discussed above, an edge-to-edge dimension of each of the eighth, ninth, tenth, and eleventh sides may be substantially equal to an edge-to-edge dimension of the seventh side.

[0019] In addition to or in the alternative to one or more of the above-mentioned features, an oblique angle defined between the first and second faces may be substantially equal to an oblique angle defined between the first and third faces, and / or an oblique angle defined between the seventh and eighth faces may be substantially equal to an oblique angle defined between the seventh and ninth faces.

[0020] In addition to or in the alternative to one or more of the features discussed above, an oblique angle defined between the first and second surfaces may be substantially equal to an oblique angle defined between the seventh and eighth surfaces.

[0021] In addition to or in the alternative to one or more of the above features, the perimeter of the second substrate handling chamber extending around the seventh, eighth, ninth, tenth, and eleventh sides forms a regular pentagon.

[0022] In addition to or in the alternative to one or more of the above features, a perimeter of the first substrate handling chamber extending around the first side, the second side, the third side, the fourth side, the fifth side, and the sixth side forms a hexagon having four sides of a first length and two sides of a second length that is shorter than the first length.

[0023] In addition to or in the alternative to one or more of the features discussed above, the first load lock module and the second load lock module may be compatible with each other.

[0024] In addition to or in the alternative to one or more of the features discussed above, each of the first load lock module and the second load lock module may include substrate transport ports arranged in a 2x2 matrix.

[0025] In addition to or as an alternative to one or more of the above features, the fourth side and / or the fifth side may constitute a completely closed and sealed wall.

[0026] In addition to or as an alternative to one or more of the features discussed above, the fourth side may include at least one substrate transport slot and / or the fifth side may include at least one substrate transport slot.

[0027] Semiconductor or other substrate processing methods may use substrate processing systems having any of the features and / or combinations of features described above.

[0028] A semiconductor or other substrate processing method according to at least some embodiments of the present technology may include moving a first substrate from a first load lock module into a first substrate handling chamber, the first substrate handling chamber including (a) a first surface, (b) a second surface extending at an oblique angle relative to the first surface, (c) a third surface extending at an oblique angle relative to the first surface, (d) a fourth surface extending at an oblique angle relative to the second surface, (e) a fifth surface extending at an oblique angle relative to the third surface, and (f) a sixth surface connected between the fourth surface and the fifth surface, and the first substrate being moved from the first load lock module into the first substrate handling chamber through the first surface. The method may further include (i) moving a first substrate from a first substrate handling chamber into a first substrate processing module, the first substrate processing module being connected to one of the second side or the third side; (ii) performing a first treatment process on the first substrate in the first substrate processing module; (iii) moving the first substrate from the first substrate processing module into the first substrate handling chamber; (iv) moving the first substrate from the first substrate handling chamber through the sixth side into a second load lock module connected to the sixth side; and (v) moving the first substrate from the second load lock module into the second substrate handling chamber. The second substrate handling chamber may include (a) a seventh side connected to the second load lock module, (b) an eighth side extending at an oblique angle relative to the seventh side, (c) a ninth side extending at an oblique angle relative to the seventh side, (d) a tenth side extending at an oblique angle relative to the eighth side, and (e) an eleventh side extending at an oblique angle relative to the ninth side. In this method, a first substrate is moved from the second load lock module through the seventh side into the second substrate handling chamber.The method may further include (i) moving the first substrate from the second substrate handling chamber into a second substrate processing module, the second substrate processing module being connected to one of the eighth side, the ninth side, the tenth side, or the eleventh side; and (ii) performing a second treatment process on the first substrate in the second substrate processing module.

[0029] In addition to or in the alternative to one or more of the above features, methods according to at least some embodiments of the present technology include (a) moving a first substrate from a second substrate processing module into a second substrate handling chamber; (b) moving the first substrate from the second substrate handling chamber through the seventh side and into a second load lock module; (c) moving the first substrate from the second load lock module through the sixth side and into the first substrate handling chamber; and (d) moving the first substrate from the first substrate handling chamber through the first side and into the first load lock module.

[0030] In addition to or in the alternative to one or more of the features described above, methods according to at least some embodiments of the present technology may use a semiconductor or other substrate processing system having any of the features and / or combinations of features described above.

[0031] This Summary is provided to introduce selected concepts related to the technology in a simplified form. These concepts are described in more detail below in the Detailed Description of the Disclosure. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0032] These and other features, aspects, and advantages of the inventions disclosed herein are described below with reference to drawings of certain specific embodiments, which are intended to illustrate but not to limit the invention. [Brief description of the drawings]

[0033] [Figure 1] FIG. 1 is a schematic diagram of a basic prior art cluster-type substrate processing system. [Diagram 2] FIG. 2 is a schematic diagram of a substrate processing system in accordance with some embodiments and aspects of the present technology. [Figure 3A] FIG. 3A shows a larger view of a first substrate handling chamber according to some embodiments and aspects of the present technology. [Figure 3B] FIG. 3B is a larger view of a second substrate handling chamber according to some embodiments and aspects of the present technology. [Figure 3C] FIG. 3C provides a diagram comparing the first and second substrate handling chambers, according to some examples and aspects of the present technology. [Figure 4] FIG. 4 is a schematic diagram of another substrate processing system in accordance with some embodiments and aspects of the present technique. [Diagram 5] FIG. 5 provides a schematic diagram of a substrate transport slot in a load lock module, in accordance with some embodiments and aspects of the present technology. [Figure 6] 6 provides a diagram of another exemplary first substrate handling chamber according to some examples and aspects of the present technology. It will be appreciated that the elements in the figures are illustrated for simplicity and clarity and are not necessarily drawn to scale. For example, the relative size of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of the illustrated embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0034] Reference is now made to the drawings in which like reference numbers identify analogous structural features or aspects of the present disclosure.

[0035] 2 illustrates generally an overhead view of a substrate processing system 200 (e.g., a cluster-type semiconductor processing system) having expanded substrate processing capabilities in accordance with some embodiments of the present technology, which expands substrate processing capabilities by adding at least an additional substrate handling chamber and one or more additional substrate processing chambers compared to the basic substrate processing system 100 shown in FIG.

[0036] 2 includes (a) a first substrate handling chamber 300 (the "near" substrate handling chamber) including a first robot arm 320 having an end effector 320A, (b) a first load lock module 400 (the "near" load lock module) connected to one edge or face of the first substrate handling chamber 300, (c) a second load lock module 500 (the "rear" load lock module) connected to an opposite edge or face of the first substrate handling chamber 300, and (d) a second substrate handling chamber 600 (the "rear" substrate handling chamber) including a second robot arm 620 having an end effector 620A. The second load lock module 500 extends between and connects the first substrate handling chamber 300 and the second substrate handling chamber 600. The first load lock module 400 in this embodiment is also connected to an equipment front end module 700 that includes a third robot arm 720 having an end effector 720A. The equipment front end module 700 may include or be connected to a nitrogen gas source for providing a nitrogen gas atmosphere within the equipment front end module 700. The equipment front end module 700 receives new substrates for processing into the substrate processing system 200 and also discharges processed substrates from the substrate processing system 200 via one or more loading ports 800A-800D (using the robot arm 720 to move substrates between the loading ports 800A-800D and the first load lock module 400). Although four loading ports 800A-800D are shown in the embodiment of FIG. 2, more or fewer loading ports may be provided in other embodiments of the technology.

[0037] Each of the first substrate handling chamber 300 and the second substrate handling chamber 600 is connected with a plurality of substrate processing chambers 900. The substrate is transferred into the substrate processing chambers 900 where one or more layers of material are deposited onto the surface of the substrate and / or other desired substrate processing is performed. FIG. 2 shows each substrate processing chamber 900 including four substrate supports 902 onto which the substrate can be placed during processing. More or fewer substrate supports 902 may be provided in each substrate processing chamber 900 (e.g., the substrate processing chamber 900 may be a dual chamber module (DCM) or a quad chamber module (QCM)). The substrate processing chamber 900 according to some embodiments of the technology may include another four substrate supports 902 located vertically below the four substrate supports 902 shown in the top view of FIG. 2. Each of the substrate processing chambers 900 may have the same structure, or one or more of the substrate processing chambers 900 may have a different structure from the other substrate processing chambers 900 present.

[0038] Each of the first substrate handling chamber 300 and the second substrate handling chamber 600 is connected to its respective substrate processing chamber 900 via one or more gate valves 1000. Although two gate valves 1000 are shown connecting the substrate handling chambers 300, 600 with each of their respective substrate processing chambers 900, in other embodiments of the technology, each substrate processing chamber 900 may be provided with more or fewer gate valves 1000. The substrate processing chambers 900 according to some embodiments of the technology may be connected to their respective substrate handling chambers 300, 600 by another two gate valves 1000, for example, located vertically below the two gate valves 1000 shown in the top view of FIG. 2. When closed, the gate valves 1000 sealingly separate the substrate handling chambers 300, 600 from their respective substrate processing chambers 900 (so that independent atmospheric conditions may be maintained within each chamber). When open, the gate valve 1000 provides an opening (e.g., a substrate transport slot) through which the end effector 320A, 620A of the robot arm 320, 620 can extend to move a substrate into and out of the substrate processing chamber 900. The openings through the gate valve 1000 align with substrate transport slots provided in the substrate processing chamber 900 and the substrate handling chambers 300, 600 to allow the substrate to be moved between the substrate processing chamber 900 and the substrate handling chambers 300, 600 through the gate valve 1000. Each of the gate valves 1000 may have the same structure, or one or more of the gate valves 1000 may have a different structure than the other gate valves 1000 present.

[0039] One side of the first load lock module 400 connects to the equipment front end module 700 by one or more gate valves 1100A (two are shown in FIG. 2 ) and the opposite side of the first load lock module 400 connects to the first substrate handling chamber 300 by one or more gate valves 1100B. The first load lock module 400 further includes one or more substrate supports 402 (two are shown in FIG. 2 ) for holding a substrate while the substrate waits to be moved into the equipment front end module 700 or the first substrate handling chamber 300. When closed, the gate valves 1100A, 1100B sealingly isolate the load lock module 400 from the equipment front end module 700 and the substrate handling chamber 300 (so that independent atmospheric conditions may be maintained in each chamber). When open, the gate valve 1100A provides an opening (e.g., a substrate transport slot) through which the end effector 720A of the robot arm 720 can extend to move a substrate into and out of the equipment front end module 700. The opening through the gate valve 1100A aligns with substrate transport slots provided in the equipment front end module 700 and the first load lock module 400 to allow substrates to be moved between the equipment front end module 700 and the first load lock module 400 through the gate valve 1100A. When open, the gate valve 1100B provides an opening (e.g., a substrate transport slot) through which the end effector 320A of the robot arm 320 can extend to move a substrate into and out of the substrate handling chamber 300. An opening through the gate valve 1100B aligns with a substrate transport slot provided in the substrate handling chamber 300 and the first load lock module 400 to allow substrates to be moved between the substrate handling chamber 300 and the first load lock module 400 through the gate valve 1100B.Each of the gate valves 1100A, 1100B may have the same structure, or one or more of the gate valves 1100A, 1100B may have a different structure than the other gate valves 1100A, 1100B that are present.

[0040] In the substrate processing system 200 of Figure 2, one side of the second load lock module 500 is connected to the first substrate handling chamber 300 by one or more gate valves 1200A (two are shown in Figure 2), and the opposite side of the second load lock module 500 is connected to the second substrate handling chamber 600 by one or more gate valves 1200B. The second load lock module 500 further includes one or more substrate supports 502 (two are shown in Figure 2) for holding a substrate while it waits to be transferred between the two substrate handling chambers 300, 600. When closed, the gate valves 1200A, 1200B sealingly separate the second load lock module 500 from the two substrate handling chambers 300, 600 (so that independent atmospheric conditions may be maintained in each chamber). When open, the gate valve 1200A provides an opening (e.g., a substrate transport slot) through which the end effector 320A of the robot arm 320 can extend to move a substrate into and out of the first substrate handling chamber 300. The openings through the gate valve 1200A align with substrate transport slots provided in the first substrate handling chamber 300 and the second load lock module 500 to allow substrates to be moved between the substrate handling chamber 300 and the second load lock module 500 through the gate valve 1200A. When open, the gate valve 1200B provides an opening (e.g., a substrate transport slot) through which the end effector 620A of the robot arm 620 can extend to move a substrate into and out of the second substrate handling chamber 600. An opening through gate valve 1200B aligns with a substrate transport slot provided in the second substrate handling chamber 600 and the second load lock module 500 to allow substrates to be moved between the second substrate handling chamber 600 and the second load lock module 500 through gate valve 1200B.Each of the gate valves 1200A, 1200B may have the same structure, or one or more of the gate valves 1200A, 1200B may have a different structure than the other gate valves 1200A, 1200B present. The gate valves 1200A and / or 1200B may also have the same structure as the gate valves 1100A and / or 1100B, or may have a different structure.

[0041] The first lock-load module 400 may have the same structure as the second load-lock module 500, and / or the first load-lock module 400 and the second load-lock module 500 may be interchangeable (e.g., the load-lock modules 400, 500 may be swapped in position and / or may have a modular structure). In other embodiments, the first lock-load module 400 and the second load-lock module 500 may have a different structure and / or may not be interchangeable (e.g., the load-lock modules 400, 500 may not be swapped in position within the substrate processing system 200). Either or both of the load-lock modules 400, 500 may have multi-station cooling capabilities and / or may be of the pass-through type.

[0042] Additional aspects of this substrate processing system 200 will be described in more detail below in conjunction with Figures 3A-3C. Figure 3A provides an expanded view of the first substrate handling chamber 300 from Figure 2, and Figure 3B provides an expanded view of the second substrate handling chamber 600 from Figure 2 ("zoomed in" compared to the appearance of these components in Figure 2). Figure 3C provides a comparison of features of the first substrate handling chamber 300 and the second substrate handling chamber 600 in this exemplary substrate processing system 200. Where the same reference numbers used in Figures 3A-3C are used as in Figure 2, the same or similar parts are referenced, and much of the repetitive description may be omitted.

[0043] 3A shows the first substrate handling chamber 300 having a number of "faces" (i.e., exposed exterior surfaces to which other substrate processing system 200 components, such as, for example, gate valves 1000, 1100B, 1200A, etc.) may be connected. This may be an entire side or face of the first substrate handling chamber 300, but a "face" need not extend the entire vertical height and / or horizontal width of a side of the first substrate handling chamber 300. Instead, a "face" may only provide a mounting surface for connecting that side or face of the first substrate handling chamber 300 with another component. The first substrate handling chamber 300 of this example includes (a) a first surface 301, (b) a second surface 302 extending at an oblique angle A(1,2) relative to the first surface 301, (c) a third surface 303 extending at an oblique angle A(1,3) relative to the first surface 301, (d) a fourth surface 304 extending at an oblique angle A(2,4) relative to the second surface 302, (e) a fifth surface 305 extending at an oblique angle A(3,5) relative to the third surface 303, and (f) a sixth surface 306 connected between the fourth surface 304 and the fifth surface 305. Each of the angles A(4,6) and A(5,6) (the angle of the sixth surface 306 relative to the fourth surface 304 and the angle of the sixth surface 306 relative to the fifth surface 305) are also oblique angles. 3A, the periphery of the first substrate handling chamber 300 may have a generally hexagonal shape (and / or at least its faces 301-306 may be arranged in a generally hexagonal shape). However, in this specifically illustrated embodiment, the first face 301, the second face 302, the third face 303, and the sixth face 306 are the same size and are larger than the fourth face 304 and the fifth face 305. The fourth face 304 and the fifth face 305 may also be the same size.

[0044] As mentioned above, the first load lock module 400 connects with the first substrate handling chamber 300, and this connection is made at the first side 301 (through the gate valve 1100B). The first side 301 may therefore have substrate transport slots corresponding to the locations of the gate valve 1100B and substrate transport slots provided in the load lock module 400. In some embodiments, the first side 301 may have substrate transport slots arranged in a 2×2 matrix, for example, similar to the substrate transport ports 412 located in the load lock modules 400, 500 shown in FIG. 5 (and described in more detail below). Substrates move in and out of the first substrate handling chamber 300 through the first side 301 and through the gate valve 1100B.

[0045] As also described above, the first substrate handling chamber 300 connects with the second load lock module 500, and this connection is made at the sixth side 306 (through the gate valve 1200A). The sixth side 306 may extend parallel to the first side 301 and may be located on an opposite side of the first substrate handling chamber 300 from the first side 301. The sixth side 306 may have substrate transport slots corresponding to the locations of the substrate transport slots provided in the gate valve 1200A and the load lock module 500. In some embodiments, the sixth side 306 may have substrate transport slots arranged in a 2×2 matrix, for example, similar to the substrate transport ports 412 located in the load lock modules 400, 500 shown in FIG. 5 (and described in more detail below). Substrates move in and out of the first substrate handling chamber 300 and into and out of the second load lock module 500 through the sixth side 306 and through the gate valve 1200A.

[0046] 3B shows the second substrate handling chamber 600 having multiple "faces" (i.e., exposed exterior surfaces to which other substrate processing system 200 components, such as, for example, gate valves 1000, 1200B, etc., may be connected). This can be an entire side or face of the second substrate handling chamber 600, but a "face" need not extend the entire vertical height and / or horizontal width of a side of the second substrate handling chamber 600. Instead, a "face" may only provide a mounting surface for connecting that side or face of the second substrate handling chamber 600 with another component. This example second substrate handling chamber 600 includes (a) a seventh side 607 (connecting with the second load lock module 500 through a gate valve 1200B), (b) an eighth side 608 extending at an oblique angle A(7,8) relative to the seventh side 607, (c) a ninth side 609 extending at an oblique angle A(7,9) relative to the seventh side 607, (d) a tenth side 610 extending at an oblique angle A(8,10) relative to the eighth side 608, and (e) an eleventh side 611 extending at an oblique angle A(9,11) relative to the ninth side 609. The tenth side 610 may also extend at an oblique angle A(10,11) relative to the eleventh side 611. As shown in FIG. 3B, the periphery of the second substrate handling chamber 600 may have a generally pentagonal shape (and / or at least its sides 607-611 may be arranged in a generally pentagonal shape). In this specifically illustrated embodiment, the seventh side 607, the eighth side 608, the ninth side 609, the tenth side 610, and the eleventh side 611 are the same size. Thus, the pentagonal shape of the second substrate handling chamber 600 shown in FIG. 3B is a regular pentagonal shape, and all corners A(7,8), A(7,9), A(8,10), A(9,11), and A(10,11) are the same size (e.g., about 108 degrees).

[0047] As described above, the second load lock module 500 connects with the second substrate handling chamber 600, and this connection is made at the seventh side 607 (through the gate valve 1200B). Substrates move between the second substrate handling chamber 600 and the first substrate handling chamber 300 through the second load lock module 500, through the gate valves 1200A and 1200B, and through the sixth side 306 and the seventh side 607. The sixth side 306 and the seventh side 607 may extend parallel to each other (and parallel to the first side 301) and may connect to opposite sides of the second load lock module 500. The seventh side 607 may have substrate transport slots corresponding to the locations of the substrate transport slots provided in the gate valve 1200B and the load lock module 500. In some embodiments, the seventh side 607 may have substrate transport slots arranged in a 2×2 matrix, for example similar to the substrate transport ports 412 positioned in the load lock modules 400, 500 shown in FIG. 5 (and described in more detail below).

[0048] 2-3B further show that each of the second side 302, the third side 303, the eighth side 608, the ninth side 609, the tenth side 610, and the eleventh side 611 are connected to one or more gate valves 1000. The gate valves 1000 are further configured to connect to respective substrate processing chambers 900. More specifically, as shown in FIG. 2 , (a) the first substrate processing chamber 900 may be releasably coupled to the second side 302 via a gate valve 1000, (b) the second substrate processing chamber 900 may be releasably coupled to the third side 303 via a gate valve 1000, (c) the third substrate processing chamber 900 may be releasably coupled to the eighth side 608 via a gate valve 1000, (d) the fourth substrate processing chamber 900 may be releasably coupled to the ninth side 609 via a gate valve 1000, (e) the fifth substrate processing chamber 900 may be releasably coupled to the tenth side 610 via a gate valve 1000, and (f) the sixth substrate processing chamber 900 may be releasably coupled to the eleventh side 611 via a gate valve 1000. Each of the substrate processing chambers 900 may include at least one substrate support 902 (and in some embodiments, at least two substrate supports 902, at least four substrate supports 902, or even up to eight (or more) substrate supports 902).

[0049] Returning to FIG. 3A, at least some portions of the sides or faces of the first substrate handling chamber 300 may have a generally hexagonal shape (or at least its faces 301-306 may be arranged along the sides of a generally hexagonal shape), but need not be regular hexagonal. For example, as shown in FIG. 3A, the first face 301 may have a width W1, the second face 302 may have a width W2, the third face 303 may have a width W3, and the sixth face 306 may have a width W6, and these widths (W1, W2, W3, W6) may be substantially equal. As used herein in this context, the term "substantially equal" means that the two widths being compared are equal to each other or within 5% of each other (e.g., W1=W2±(W2×0.05)). Additionally, the fourth surface 304 may have a width W4 and the fifth surface 305 may have a width W5, and these widths W4 and W5 may be substantially equal. However, in this embodiment, widths W4 and W5 are smaller (shorter) than and are not substantially equal to widths W1, W2, W3, and W6. These "widths" constitute the edge-to-edge dimensions of surfaces 301-306 (which may correspond to the edge-to-edge dimensions of an entire side or surface of the substrate handling chamber 300, or the edge-to-edge dimensions of the portion of the side or surface that interfaces with another component).

[0050] Similarly, as shown in FIG. 3B, the seventh surface 607 may have a width W7, the eighth surface 608 may have a width W8, the ninth surface 609 may have a width W9, the tenth surface 610 may have a width W10, and the eleventh surface 611 may have a width W11, and these widths (W7, W8, W9, W10, and W11) may be substantially equal (as defined above). These "widths" constitute the edge-to-edge dimensions of the surfaces 607-611 (which may correspond to the edge-to-edge dimensions of the entire side or surface of the substrate handling chamber 600, or the edge-to-edge dimensions of the portion of the side or surface that interfaces with another component). Additionally, in at least some embodiments of the technology, the sixth surface 306 may have a width W6 (edge-to-edge dimension) that is substantially equal to the width W7 (edge-to-edge dimension) of the seventh surface 607. Thus, in at least some embodiments of the present technology, the first surface 301, the second surface 302, the third surface 303, the sixth surface 306, the seventh surface 607, the eighth surface 608, the ninth surface 609, the tenth surface 610, and the eleventh surface 611 may be substantially equal (e.g., have substantially equal edge-to-edge dimensions).

[0051] The angles defined by the faces of the first substrate handling chamber 300 are not all substantially equal in the exemplary configurations shown in FIGS. 2 and 3A (as used herein, in this context, the term "substantially equal" means that the two angles being compared are equal or within 5 degrees of each other (e.g., angle 1 = angle 2 ± 5 degrees)). In at least some examples of this technology (and in the configurations shown in FIGS. 2 and 3A), (i) angle A(1,2) may be substantially equal to angle A(1,3), (ii) angle A(2,4) may be substantially equal to angle A(3,5), and (iii) angle A(4,6) may be substantially equal to angle A(5,6). Additionally, if desired, angles A(2,4), A(3,5), A(4,6), and A(5,6) may be substantially equal to each other. In this illustrated example, angles A(1,2) and A(1,3) may be less than (and optionally not substantially equal to) angles A(2,4), A(3,5), A(4,6), and A(5,6).

[0052] 3C shows the size and shape of the pentagonal structure of the second substrate handling chamber 600 as dashed lines superimposed on the hexagonal size and shape of the first substrate handling chamber 300 for size and shape comparison in this example. As shown in this figure, (i) widths W1, W2, and W3 are substantially equal to widths W7, W8, and W9, respectively, and (ii) angles A(1,2) and A(1,3) are substantially equal to angles A(7,8) and A(7,9), respectively. In one more specific example, these angles A(1,2), A(1,3), A(7,8), and A(7,9) may be approximately 108 degrees. Angles A(2,4), A(3,5), A(4,6), and A(5,6) may be somewhat larger and substantially equal, for example, to approximately 126 degrees.

[0053] As is evident from the above discussion, the substrate processing system 200 described in conjunction with Figures 2-3C has increased substrate processing capacity based at least on one or more additional substrate processing chambers 900 connected to the second side 302 and / or the third side 303 of the first (nearby) substrate handling chamber 300. In some embodiments of the present technology, the fourth side 304 and the fifth side 305 of the substrate handling chamber 300 may constitute fully closed and sealed walls. In such a configuration, the fourth side 304 and / or the fifth side 305 may be left empty to provide room for access to, for example, the first substrate handling chamber 300, the second load lock module 500, and / or parts of the substrate processing chamber 900 for maintenance, repair, etc.

[0054] However, in other embodiments of the technology, the fourth side 304 and / or the fifth side 305 may provide structure to allow further expansion of the substrate processing capacity of the substrate processing system. As shown by dashed lines in Figures 2 and 3A, the fourth side 304 and / or the fifth side 305 may be equipped with at least one substrate transport slot 252. The substrate transport slot 252, when present, may be sealed (e.g., by a removable seal plate) in a substrate processing system 200 arrangement of the type shown in Figure 2 when no substrate processing chamber 900 is attached to the fourth side 304 and / or the fifth side 305. The substrate transport slots 252 in the fourth side 304 and / or the fifth side 305 may also be smaller than the corresponding slots in the other sides 301, 302, 303, 306, 607, 608, 609, 610, 611 (although this need not be the case in all embodiments of the technology).

[0055] FIG. 4 provides a schematic diagram of another exemplary substrate processing system 250 having further expanded processing capabilities utilizing the fourth side 304 and / or the fifth side 305 in the manner described above. Where the same reference numbers used in FIGS. 2-3C are used in FIG. 4, the same or similar parts are referenced, and much of the repetitive description may be omitted. As shown in FIG. 4, in this exemplary substrate processing system 250, the fourth side 304 is coupled to a substrate processing chamber 950 via one or more gate valves 940, and / or the fifth side 305 is coupled to a substrate processing chamber 950 via one or more gate valves 940. The substrate processing chamber 950 coupled to the fourth side 304 and / or the fifth side 305 may be somewhat smaller (e.g., where the fourth side 304 and / or the fifth side 305 are smaller than the other sides) as shown in FIG. Alternatively, substrate processing chamber 950 may be sized, shaped, and / or equipped the same as any one or more of substrate processing chambers 900. Alternatively, if desired, fourth side 304 and / or fifth side 305 may be sized, shaped, and equipped in the same manner as second side 302 and / or third side 303. Gate valve 940 may have the same structure as any of gate valves 1000, 1100A, 1100B, 1200A, and / or 1200B, or may have a different structure.

[0056] 5 illustrates a schematic of exemplary load lock modules 400, 500 that may be used in accordance with some embodiments of the present technology. The load lock module 400 includes opposing faces 400A and 400B, and the load lock module 500 includes opposing faces 500A and 500B (see also FIG. 4). Each of these opposing faces 400A, 400B, 500A, 500B has four substrate transport ports 412 arranged in a 2×2 matrix (the two substrate transport ports 412 for faces 400B, 500B are shown in dashed lines in FIG. 5). When used as a first load lock module 400: (a) face 400A may engage with an arrangement of four gate valves 1100A sealingly coupling face 400A with the equipment front end module 700, and (b) face 400B may engage with an arrangement of four gate valves 1100B sealingly coupling face 400B with the first face 301 of the first substrate handling chamber 300. When used as a second load lock module 500: (a) face 500A may engage with an arrangement of four gate valves 1200A sealingly coupling face 500A with the sixth face 306 of the first substrate handling chamber 300, and (b) face 500B may engage with an arrangement of four gate valves 1200B sealingly coupling face 500B with the seventh face 607 of the second substrate handling chamber 600. Each of the equipment front end module 700, the first side 301 of the first substrate handling chamber 300, the sixth side 306 of the first substrate handling chamber 300, and the seventh side 607 of the second substrate handling chamber 600 may include substrate transport slots arranged in a 2×2 matrix that aligns with the corresponding four substrate transport ports 412 on the sides 400A, 400B, 500A, 500B. A similar 2×2 matrix of substrate transport slots may be provided in one or more of the substrate processing chamber 900, the second side 302, the third side 303, the eighth side 608, the ninth side 609, the tenth side 610, and the eleventh side 611.

[0057] Figures 2-4 show faces 301-306 and 607-611 that are flush with, correspond to, and / or span the entire width of corresponding sides or faces of substrate handling chambers 300, 600. However, faces 301-306 and 607-611 need not have those characteristics, e.g., as noted above, faces 301-306 and 607-611 need not span the entire width (and / or height) of a side or face of substrate handling chamber 300, 600. Figure 6 illustrates one embodiment. Where the same reference numbers are used in Figure 6 as used in Figures 2-5, the same or similar parts are referenced and much of the redundant description has been omitted.

[0058] Figure 6 illustrates a substrate handling chamber 350 similar to that shown in Figure 3A, however, in the embodiment of Figure 6, first side 301, second side 302, third side 303, and sixth side 306 are provided on protruding members 351, 352, 353, and 356, respectively, that extend outwardly from a major side or face 360 ​​of the substrate handling chamber 350. As shown in Figure 6, first side 301, second side 302, third side 303, and sixth side 306 do not extend the full width of their corresponding major main side or face 360 ​​(e.g., width W1 of face 301 is less than width WS of major main side or face 360 ​​on which protruding member 351 for first side 301 is provided). Similarly, one or more of protruding members 351, 352, 353, and / or 356 may not need to extend the entire vertical height of a side or face 360 ​​of substrate handling chamber 350. Instead, if desired, protruding members 351, 352, 353, and 356, including faces 301, 302, 303, and 306, may constitute outwardly extending components (e.g., mounting surfaces) that are located on only a portion of their respective major side or face 360, and are configured to engage, for example, one or more gate valves 1000, 1100B, 1200A. The faces (e.g., at least 301, 302, 303, and 306) may include a metal plate (e.g., aluminum or aluminum alloy) that forms a surface for engaging a surface of one of gate valves 1000, 1100B, 1200A.

[0059] However, the exemplary substrate handling chamber 350 of FIG. 6 also includes (a) a first surface 301, (b) a second surface 302 extending at an oblique angle A(1,2) relative to the first surface 301, (c) a third surface 303 extending at an oblique angle A(1,3) relative to the first surface 301, (d) a fourth surface 304 extending at an oblique angle A(2,4) relative to the second surface 302, (e) a fifth surface 305 extending at an oblique angle A(3,5) relative to the third surface 303, and (f) a sixth surface 306 connected between the fourth surface 304 and the fifth surface 305. Each of angles A(4,6) and A(5,6) (the angle of sixth surface 306 relative to fourth surface 304 and the angle of sixth surface 306 relative to fifth surface 305) is also an oblique angle. Furthermore, in this specifically illustrated embodiment, first surface 301, second surface 302, third surface 303, and sixth surface 306 are the same size and are larger than fourth surface 304 and fifth surface 305. Fourth surface 304 and fifth surface 305 may also be the same size. Surfaces 301, 302, 303, and 306 may further include one or more substrate-transport slots, as described above.

[0060] Similarly, one or more of the faces 607-611 of the second substrate handling chamber 600 may be provided on protruding members similar to the protruding members 351, 352, 353, and 356. In this manner, one or more of the faces 607-611 of the second substrate handling chamber 600 may not span the entire width and / or vertical height of a main major side or face of the second substrate handling chamber 600 on which it is provided.

[0061] 2-3B, a method of operation of a portion of the substrate processing system 200 (and 250) in accordance with an embodiment of the present technology will now be described. Initially, a substrate for processing within the substrate processing system 200, 250 is loaded into the substrate processing system 200, 250 through one of the loading ports 800A-800D. The robotic arm 720 of the equipment front end module 700 picks up the substrate from that loading port 800A-800D and moves it into the interior chamber of the equipment front end module 700. The substrate can be retained within the equipment front end module 700 for any desired period of time.

[0062] To begin processing, one of the gate valves 1100A is opened, the robot arm 720 of the equipment front end module 700 picks up a substrate from its holding location in the equipment front end module 700 (if necessary), and the robot arm 720 moves the substrate through the gate valve 1100A to the substrate support 402 in the first load lock module 400. The robot arm 720 is retracted back into the equipment front end module 700, and the gate valve 1100A is closed. The substrate can be held on the substrate support 402 for any desired length of time.

[0063] When further processing is scheduled, the gate valve 1100B may be opened. The substrate may be picked up from the substrate support 402 in the first load lock module 400 by the robot arm 320 of the first substrate handling chamber 300 and moved into the interior of the first substrate handling chamber 300 through the first side 301 of the first substrate handling chamber 300. The substrate may be held within the first substrate handling chamber 300 for any desired length of time (e.g., placed on a support within the substrate handling chamber 300, if desired).

[0064] From there, the substrate may be transferred into one of the substrate processing chambers 900 coupled to the second side 302 or the third side 303. To do so, one of the gate valves 1000 is opened, and the robot arm 320 moves the substrate from the substrate handling chamber 300 through the gate valve 1000 into one of the substrate processing chambers 900 and places the substrate on the substrate support 902. The robot arm 320 is then retracted from the substrate processing chamber 900, and the gate valve 1000 is closed. A first treatment process (e.g., a layer deposition process) is performed on the substrate while the substrate processing chamber 900 is sealed off from the substrate handling chamber 300 by the gate valve 1000. In a similar manner, the substrate may be placed into the substrate processing chamber 950 through the gate valve 940 coupled to the fourth side 304 and / or the fifth side 305 in the substrate processing system 250 equipped in that manner.

[0065] Once this processing step is completed, the substrate may be scheduled for further processing in another one of the substrate processing chambers 900, such as one connected to the second substrate handling chamber 600. In such a method, the substrate must be moved from the substrate processing chamber 900 housed into the second substrate handling chamber 600. To do so, the process includes (i) opening gate valve 1000 to the substrate processing chamber 900 containing the substrate, (ii) picking up the substrate using the robot arm 320, (iii) moving the substrate from the substrate processing chamber 900 into the first substrate handling chamber 300, (iv) closing gate valve 1000, (v) opening gate valve 1200A, (vi) moving the substrate from the first substrate handling chamber 300 to the second load lock module 500 through the sixth face 306 and gate valve 1200A, (vii) placing the substrate on the substrate support 502, (viii) retracting the robot arm 320 back into the first substrate handling chamber 300, and (ix) closing gate valve 1200A. If necessary, the substrate may be stored in the first substrate handling chamber 300 for a period of time before being transferred into the second load lock module 500 and / or may be stored in the second load lock module 500 before being further transferred into the second substrate handling chamber 600.

[0066] To further transfer the substrate into the second substrate handling chamber 600, (i) one of the gate valves 1200B is opened, (ii) the robot arm 620 extends through the open gate valve 1200B and picks up the substrate, (iii) the robot arm 620 moves the substrate through the seventh face 607 into the second substrate handling chamber 600, and (iv) the gate valve 1200B is closed. Then, the gate valve 1000 connecting one of the eighth face 608, the ninth face 609, the tenth face 610, or the eleventh face 611 to the substrate processing chamber 900 is opened, and the robot arm 620 moves the substrate through the open gate valve 1000 into the substrate processing chamber. The robot arm 620 is then retracted through the gate valve 1000 and back into the second substrate handling chamber 600, and the gate valve 1000 is closed. Another processing process (e.g., another layer deposition process) occurs on the substrate while the substrate processing chamber 900 is sealed off from the substrate handling chamber 600 by the gate valve 1000.

[0067] Once processing within that substrate processing chamber 900 is complete, the substrate may then be removed from the substrate processing system 200. This may be accomplished in the general manner described above by moving the substrate from (a) the substrate processing chamber 900 coupled to one of the faces 608, 609, 610, or 611, (b) into the second substrate handling chamber 600, (c) into the second load lock module 500, (d) into the first substrate handling chamber 300, (e) into the first load lock module 400, (f) into the instrument front end module 700, and (g) into one of the loading ports 800A-800D. The various gate valves 1000, 1200B, 1200A, 1100B, and 1100A are opened and closed at appropriate times in the general manner described above to allow transfer of the substrate through the various components under appropriate pressure conditions and at appropriate atmospheric conditions.

[0068] The process described above involves processing the substrate in one substrate processing chamber 900 connected to the first substrate handling chamber 300 and one substrate processing chamber 900 connected to the second substrate handling chamber 600. In other embodiments of this technique, many other options are possible. As an example, the substrate may be processed in two or more substrate processing chambers 900 coupled to the first substrate handling chamber 300 and / or in two or more substrate processing chambers 900 coupled to the second substrate handling chamber 600. As another example, for some substrates, processing may only be required in one or more substrate processing chambers 900 coupled to the second substrate handling chamber 600. In that case, the substrate may simply "pass" through the first substrate handling chamber 300 on the way to the second load lock module 500 and the second substrate handling chamber 600 (without proceeding into the associated substrate processing chamber 900 coupled to the first substrate handling chamber 300). As another example, a substrate may be processed in a substrate processing chamber 900 associated with a first substrate handling chamber 300 after having already been processed in a substrate processing chamber 900 associated with a second substrate handling chamber 600. Additionally or alternatively, a single substrate may be passed through the second load lock module 500 multiple times between the first substrate handling chamber 300 and the second substrate handling chamber 600 in the processing method before being fully processed.

[0069] In the above described process, the first robot arm 320 of the first substrate handling chamber 300 has (a) a first load lock module 400 that engages with the first side 301 (through any of the gate valves 1100B and engaging any substrate supports 402 present in the first load lock module 400) and (b) a substrate processing chamber 900 that engages with the second side 302 and the third side 303 (through any of the gate valves 1000 present and engaging any substrate supports 402 present in the substrate processing chamber 900). 902), (c) the substrate processing chamber 950, if present, engaging the fourth side 304 and / or the fifth side 305 (through any of the gate valves 940 present and engaging any substrate supports present within the substrate processing chamber 950), and (d) the second load lock module 500, engaging the sixth side 306 (through any of the gate valves 1200A and engaging any substrate supports 502 within the second load lock module 500).

[0070] At least the faces 301, 302, 303, 306, 607, 608, 609, 610, and / or 611, the gate valves 1000, 1100A, 1100B, 1200A, and / or 1200B, the load lock modules 400 and / or 500, the substrate processing chambers 900 and / or 950, and / or structures for connecting these components may have common and / or modular type connection structures, for example, to maximize compatibility and modularity. The two load lock modules 400 / 500 may have the same structure, components, and / or functionality, or may have some differences (e.g., only one load lock module 400, 500 has a cooling plate and / or heater, neither of the load lock modules 400, 500 has a cooling plate and / or heater, or both load lock modules 400, 500 have a cooling plate and / or heater).

[0071] Although the present disclosure has been provided in the context of certain embodiments and examples, those skilled in the art will understand that the present disclosure extends beyond the specifically described embodiments to other alternative embodiments and / or uses of the present embodiments and obvious modifications and their equivalents. In addition, while several variations of the embodiments of the present disclosure have been shown and described in detail, other modifications that are within the scope of the present disclosure will be readily apparent to those skilled in the art based on the present disclosure. It is also contemplated that various combinations or subcombinations of the specific features and aspects of the embodiments may be made and still fall within the scope of the present disclosure. It should be understood that various features and aspects of the disclosed embodiments can be combined with or substituted for one another to form varying modes of the embodiments of the present disclosure. It is therefore intended that the scope of the present disclosure should not be limited by the specific embodiments described above.

[0072] Any headings provided herein, if any, are for convenience only and do not necessarily affect the scope or meaning of the devices and methods disclosed herein. [Explanation of symbols]

[0073] 100 Substrate Processing System 102 Substrate handling chamber 104 Substrate treatment chamber 106 Gate valve 108 Substrate support 110 Robot Arm 110A End Effector 112 Load Lock Module 114 Substrate Retention Components 116 Gate valve 118 Gate valve 120 Equipment Front-End Module 122 Robot Arm 122A End Effector 124A Load Port 124B Loading Port 124C Loading Port 200 Substrate Processing System 250 Substrate Processing System 252 Substrate transport slot 300 Substrate handling chamber 301 First Side 302 Second Side 303 The Third Side 304 The Fourth Side 305 The Fifth Side 306 The Sixth Side 320 Robot Arm 320A End Effector 350 Substrate Handling Chamber 351 Protruding member 352 Protruding member 353 Protruding member 360 pages 400 Load Lock Module 400A surface 400B side 402 Base material support 412 Substrate transport port 500 Load Lock Module 500A side 500B side 502 Base material support 600 Substrate Handling Chamber 607 The Seventh Side 608 The Eighth Side 609 The 9th Side 610 The Tenth Face 611 The 11th Side 620 Robot Arm 620A End Effector 700 Instrument Front-End Module 720 Robot Arm 720A End Effector 800A Loading Port 800B Loading Port 800C Loading Port 800D Loading Port 900 Substrate Processing Chamber 902 Base material support 940 Gate Valve 950 Substrate Processing Chamber 1000 Gate Valve 1100A Gate Valve 1100B Gate Valve 1200A Gate Valve 1200B Gate Valve 1240C Loading Port

Claims

1. 1. A semiconductor processing system comprising: a first substrate handling chamber, (a) a first surface; (b) a second surface extending at an oblique angle relative to the first surface; and (c) a third surface extending at an oblique angle relative to the first surface; and (d) a fourth surface extending at an oblique angle relative to the second surface; and (e) a fifth surface extending at an oblique angle relative to the third surface; and (f) a sixth side connected between the fourth side and the fifth side; and a first load lock module connected to the first face, the first load lock module including one or more first substrate supports for holding a substrate moving through the first face into and out of the first substrate handling chamber; a second load lock module connected to the sixth surface; a second substrate handling chamber, (a) a seventh surface connected to the second load lock module; (b) an eighth surface extending at an oblique angle relative to the seventh surface; and (c) a ninth surface extending at an oblique angle relative to the seventh surface; and (d) a tenth surface extending at an oblique angle relative to the eighth surface; and (e) an eleventh surface extending at an oblique angle relative to the ninth surface; the second load lock module includes one or more second substrate supports for holding a substrate transferred between the first substrate handling chamber and the second substrate handling chamber through the sixth side and the seventh side.

2. The semiconductor processing system of claim 1 , wherein said eleventh surface extends at an oblique angle relative to said tenth surface.

3. 2. The semiconductor processing system of claim 1 , wherein each of the second side, the third side, the eighth side, the ninth side, the tenth side, and the eleventh side is connected to a gate valve configured to connect with a respective substrate processing module.

4. a first substrate processing chamber releasably coupled to the second surface; a second substrate processing chamber releasably coupled to the third surface; and a third substrate processing chamber releasably coupled to the eighth surface; and a fourth substrate processing chamber releasably coupled to the ninth surface; and a fifth substrate processing chamber releasably coupled to the tenth surface; and 10. The semiconductor processing system of claim 1, further comprising a sixth substrate processing chamber releasably coupled to said eleventh surface.

5. 5. The semiconductor processing system of claim 4, wherein each of the first substrate processing chamber, the second substrate processing chamber, the third substrate processing chamber, the fourth substrate processing chamber, the fifth substrate processing chamber, and the sixth substrate processing chamber includes at least four substrate supports.

6. 5. The semiconductor processing system of claim 4, wherein each of the first substrate processing chamber, the second substrate processing chamber, the third substrate processing chamber, the fourth substrate processing chamber, the fifth substrate processing chamber, and the sixth substrate processing chamber includes at least two substrate supports.

7. 2. The semiconductor processing system of claim 1 , wherein the fourth side has an edge-to-edge dimension that is shorter than an edge-to-edge dimension of each of the first side, the second side, the third side, and the sixth side, and the fifth side has an edge-to-edge dimension that is shorter than the edge-to-edge dimension of each of the first side, the second side, the third side, and the sixth side.

8. 8. The semiconductor processing system of claim 7, wherein the edge-to-edge dimension of the fourth side and the edge-to-edge dimension of the fifth side are substantially equal, and the edge-to-edge dimension of the first side, the edge-to-edge dimension of the second side, the edge-to-edge dimension of the third side, and the edge-to-edge dimension of the sixth side are substantially equal.

9. 2. The semiconductor processing system of claim 1, wherein said sixth side has an edge-to-edge dimension substantially equal to an edge-to-edge dimension of said seventh side.

10. 10. The semiconductor processing system of claim 9, wherein an edge-to-edge dimension of each of said eighth side, said ninth side, said tenth side, and said eleventh side is substantially equal to said edge-to-edge dimension of said seventh side.

11. 2. The semiconductor processing system of claim 1, wherein the oblique angle defined between the first surface and the second surface is substantially equal to the oblique angle defined between the first surface and the third surface, and the oblique angle defined between the seventh surface and the eighth surface is substantially equal to the oblique angle defined between the seventh surface and the ninth surface.

12. 12. The semiconductor processing system of claim 11, wherein the oblique angle defined between the first surface and the second surface is substantially equal to the oblique angle defined between the seventh surface and the eighth surface.

13. 2. The semiconductor processing system of claim 1 , wherein a perimeter of the second substrate handling chamber extending around the seventh side, the eighth side, the ninth side, the tenth side, and the eleventh side forms a regular pentagon.

14. 2. The semiconductor processing system of claim 1, wherein a perimeter of the first substrate handling chamber extending around the first side, the second side, the third side, the fourth side, the fifth side, and the sixth side forms a hexagon having four sides of a first length and two sides of a second length that is shorter than the first length.

15. 2. The semiconductor processing system of claim 1, wherein said first load lock module and said second load lock module are interchangeable with each other.

16. 2. The semiconductor processing system of claim 1, wherein said first load lock module and said second load lock module each include substrate transport ports arranged in a 2x2 matrix.

17. 2. The semiconductor processing system of claim 1, wherein said fourth side and said fifth side form a completely enclosed and sealed wall.

18. 10. The semiconductor processing system of claim 1, wherein said fourth side includes at least one substrate transport slot and said fifth side includes at least one substrate transport slot.

19. 1. A semiconductor processing method comprising: moving a first substrate from a first load lock module into a first substrate handling chamber, the first substrate handling chamber including (a) a first surface, (b) a second surface extending at an oblique angle relative to the first surface, (c) a third surface extending at an oblique angle relative to the first surface, (d) a fourth surface extending at an oblique angle relative to the second surface, (e) a fifth surface extending at an oblique angle relative to the third surface, and (f) a sixth surface connected between the fourth surface and the fifth surface, the first substrate being moved from the first load lock module into the first substrate handling chamber through the first surface; moving the first substrate from the first substrate handling chamber into a first substrate processing module, the first substrate processing module being connected to one of the second side or the third side; performing a first treatment process on the first substrate in the first substrate treatment module; moving the first substrate from the first substrate processing module into the first substrate handling chamber; moving the first substrate from the first substrate handling chamber through the sixth side and into a second load lock module connected to the sixth side; moving the first substrate from the second load lock module into a second substrate handling chamber, the second substrate handling chamber including: (a) a seventh surface connected to the second load lock module; (b) an eighth surface extending at an oblique angle relative to the seventh surface; (c) a ninth surface extending at an oblique angle relative to the seventh surface; (d) a tenth surface extending at an oblique angle relative to the eighth surface; and (e) an eleventh surface extending at an oblique angle relative to the ninth surface, the first substrate being moved from the second load lock module into the second substrate handling chamber through the seventh surface; moving the first substrate from the second substrate handling chamber into a second substrate processing module, the second substrate processing module being connected to one of the eighth surface, the ninth surface, the tenth surface, or the eleventh surface; and performing a second treatment process on the first substrate in the second substrate treatment module.

20. moving the first substrate from the second substrate processing module into the second substrate handling chamber; moving the first substrate from the second substrate handling chamber through the seventh face and into the second load lock module; moving the first substrate from the second load lock module through the sixth face and into the first substrate handling chamber; 20. The semiconductor processing method of claim 19, further comprising: moving the first substrate from the first substrate handling chamber, through the first face, and into the first load lock module.

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