Sensor

Abstract

To reduce a bezel region of a display panel arranged so as to be superimposed onto a sensor.SOLUTION: A sensor includes: a first substrate; a first coil including a first long side part extending along a first direction forming a predetermined angle which is larger than 0 degree and is smaller than 90 degrees in a long side direction of the first substrate; a second coil including a second long side extending along a second direction crossing the first direction; a first lead wire connected to the first coil; and a second lead wire connected to the second coil, wherein the first substrate is a multilayer substrate having three or more layers including first to third layers, the first long side part is provided on the second layer, the second long side part is provided on the third layer, and the first and second lead wires are provided on the first layer.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a sensor, and more particularly to a sensor used by being arranged superimposed on a display device. [Background technology]

[0002] There is known a position detection device that detects the position of a position indicator by detecting an alternating magnetic field emitted from the position indicator with a sensor. Specific types of this type of position detection device are the EM type, which requires a battery to be provided in the position indicator, and the EMR (registered trademark) type, which generates power in the position indicator by electromagnetic waves emitted by the position detection device via the sensor. In the EM type, electromagnetic waves are transmitted only from the position indicator to the position detection device, whereas in the EMR (registered trademark) type, electromagnetic waves are transmitted and received in both directions.

[0003] The sensor of the position detection device is composed of a collection of a plurality of first coils (loop electrodes) each extending in a first direction and a second coil (loop electrode) each extending in a second direction intersecting the first direction. Usually, the first and second directions correspond to the long and short sides of a rectangular detection area, respectively, but Patent Document 1 discloses a technique for forming each coil at an angle to the long side of the detection area.

[0004] In addition, a position detection device requires a controller, but as described in Patent Document 1, conventionally, the lead wires for connecting the controller to each coil are arranged outside the detection area, and the corresponding coils are connected at the edge of the detection area. Therefore, an invalid area in which the position of the position indicator cannot be detected is formed outside the detection area. However, with the recent trend toward narrower bezels in display devices, it is no longer acceptable to have such a large invalid area, and there has been a demand for reducing the invalid area.

[0005] Regarding such a problem, Patent Document 2 discloses a technique in which the connection points between the lead wires and each coil are provided in the center of the detection area, not on the edge, and the lead wires are arranged between each coil. This technique makes it possible to minimize the ineffective area provided outside the detection area. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent No. 4648860 [Patent Document 2] Patent No. 4405247 Summary of the Invention [Problem to be solved by the invention]

[0007] In tablet terminals, the position detection device and the display device are arranged in a stacked manner, and the display device usually has a gate line extending along the long side direction of the detection area. In this case, when the gate line of the display device is driven by a predetermined signal, the coil extending along the long side direction of the detection area is affected by this signal over its entire length, and the magnetic flux generated by this coil may affect the operation of the display device and may be recognized by the user as moire. According to the technology of Patent Document 1, the coils of the position detection device are not parallel to the gate line of the display device, so that it is possible to reduce the influence of the magnetic flux generated by the coil on the operation of the display device.

[0008] Therefore, in order to reduce the influence of the magnetic flux generated by the coils of the position detection device on the operation of the display device and to minimize the invalid area provided outside the detection area, the inventors of the present application have considered providing the connection points between the lead wires and each coil in the center of the detection area, rather than the edge, as in Patent Document 2, in the configuration of Patent Document 1 in which each coil is formed obliquely with respect to the long side direction of the detection area. However, it has been found that adopting such a configuration reduces the visibility of the display device and reduces the layout efficiency of various circuits provided in the tablet terminal. This problem will be described in detail below.

[0009] A tablet terminal generally comprises a display module and a circuit section arranged on the rear surface of the display module (the surface opposite the display surface). A display panel of the display device and a sensor in which a coil of a position detection device is provided are arranged within the display module. Various circuits such as a processor of the tablet terminal, a controller of the position detection device, and a control circuit of the display device are arranged within the circuit section.

[0010] First, to explain the decrease in visibility of the display device, in the configuration of Patent Document 1, the sensor is disposed on the display surface side of the display panel. In this arrangement, if the connection point between the lead wire and the coil is provided in the center of the detection area instead of on the edge thereof as in Patent Document 2, the lead wire must also be disposed in the center of the detection area, which decreases the visibility of the display device.

[0011] Next, to explain the decrease in layout efficiency of various circuits, a rectangular flexible board is used to connect the controller of the position detection device to the lead wires in the sensor. This flexible board is folded so as to wrap around one side of the sensor, and is connected to the lead wires of the sensor inside the display module and to the controller on the back side of the display module.

[0012] A group of terminals connected to the lead-out wires are disposed at the end of the flexible substrate on the lead-out wire side. If the lead-out wires are disposed between the coils as in Patent Document 2, and the coils are disposed at an angle as in Patent Document 1, the lead-out wires will also be disposed at an angle. This means that the group of terminals connected to the lead-out wires must also be disposed at an angle, and therefore the entire flexible substrate will be disposed at an angle, and as a result, the controller will also have to be disposed at an angle.

[0013] FIG. 19 is a diagram showing a state in which the flexible substrate and the controller are arranged at an angle. The figure shows the back surface of the display module 100 in which a sensor (not shown) is arranged, the controller 102 constituting a position detection device together with the sensor, and the flexible substrate 101 connecting the sensor and the controller 102. Also, the area A shown in the figure shows an area in which other circuits in the circuit section can be arranged. As can be seen from the shape of the area A, when the flexible substrate 101 and the controller 102 are arranged at an angle to the back surface of the display module 100, an area in which other circuits cannot be arranged is generated around the flexible substrate 101, and the arrangement efficiency of various circuits is reduced accordingly. Note that, even in the example of FIG. 19, if the flexible substrate 101 is made to have a special shape (for example, a parallelogram), the controller 102 can be provided parallel to the back surface of the display module 100, but it is difficult to process the flexible substrate 101 into a special shape, and the pressure bonding work is also difficult. In addition, since the length of the wiring on the flexible substrate 101 becomes non-uniform, it may be difficult to design a correction process (step S2 in FIG. 9) described later.

[0014] Therefore, one object of the present invention is to provide a sensor that can suppress a decrease in visibility of the display device and a decrease in the layout efficiency of various circuits, even when each coil is formed diagonally with respect to the long side direction of the detection area and the connection point between the lead wire and the coil is located in the center rather than the edge of the detection area. [Means for solving the problem]

[0015] A sensor according to a first aspect of the present invention is a sensor including a first substrate used while being arranged on the rear side of a display panel, a first coil extending along a first direction that forms a predetermined angle with a long side direction of the first substrate that is greater than 0 degrees and less than 90 degrees and has a first long side portion with first and second ends provided midway, a second coil having a second long side portion extending along a second direction that intersects the first direction, a first lead-out line having one end connected to the first end and the other end connected to wiring on a second substrate arranged so that one end extends perpendicularly from one side of the first substrate outward, and a second lead-out line having one end connected to the second end and the other end connected to the wiring on the second substrate.

[0016] A sensor according to a second aspect of the present invention is the sensor according to the first aspect, wherein the second substrate is formed with a group of terminals arranged in parallel along a long side direction of the first substrate, and the other end of the first outgoing line and the other end of the second outgoing line are each connected to wiring on the second substrate via the group of terminals.

[0017] A sensor according to a third aspect of the present invention is the sensor according to the first aspect, wherein the first substrate is a multilayer substrate having a plurality of layers including first to third layers, the first long side portion is provided on the second layer, the second long side portion is provided on the third layer, and the first and second lead-out wires are provided on the first layer.

[0018] A sensor according to a fourth aspect of the present invention is the sensor according to the first aspect, wherein the first and second coils are formed so that at least a portion of a short side of the first coil and at least a portion of a short side of the second coil overlap in a planar view.

[0019] A sensor according to a fifth aspect of the present invention is the sensor according to the fourth aspect, wherein the first and second coils are formed such that an acute angle portion of the first coil and an obtuse angle portion of the second coil overlap in a planar view.

[0020] A sensor according to a sixth aspect of the present invention is the sensor according to the second aspect, wherein the first and second lead-out wires are each, in a plan view, provided within a detection area of ​​the sensor in which the first and second coils are installed, and each of the first and second lead-out wires has a first portion having one end connected to a corresponding one of the first and second ends and extending in the second direction, a second portion having one end connected to the other end of the first portion and extending in the first direction, and a third portion having one end connected to the other end of the second portion and extending in the second direction, the first substrate is a multilayer substrate having a plurality of layers including first and second layers, the first coil and the second portion are provided in the first layer, and the second coil and the first and third portions are provided in the second layer.

[0021] A sensor according to a seventh aspect of the present invention includes a rectangular first substrate and an integrated circuit, wherein the first substrate is formed with a plurality of first coils each having a first long side extending along a first direction that forms a predetermined angle with a long side direction of the first substrate that is greater than 0 degrees and less than 90 degrees, and a plurality of second coils each having a second long side extending along a second direction that intersects the first direction, and the integrated circuit is configured to supply different voltages or currents to each of the plurality of first and second coils depending on whether the shape of each of the plurality of first and second coils is a parallelogram or a trapezoid.

[0022] According to an eighth aspect of the present invention, there is provided a sensor comprising: a rectangular first substrate; and an integrated circuit; the first substrate is formed with a plurality of first coils each having a first long side extending along a first direction that forms a predetermined angle with a long side direction of the first substrate that is greater than 0 degrees and less than 90 degrees; and a plurality of second coils each having a second long side extending along a second direction that intersects with the first direction; the integrated circuit includes a memory that stores information indicating whether each of a plurality of intersections formed by each of the plurality of first coils and each of the plurality of second coils is located in the center of a detection area, and the integrated circuit is configured to execute an intersection detection step of detecting a first intersection that is closest to a position of a stylus among the plurality of intersections formed by each of the plurality of first coils and each of the plurality of second coils based on levels observed in each of the plurality of first and second coils; and a determination step of determining whether the first intersection is located on the edge of the detection area based on the information stored in the memory. Effect of the Invention

[0023] According to the first aspect of the present invention, since the first substrate is disposed on the rear side of the display panel, the connection points between the first and second lead wires and the first coil are provided in the center of the detection area, not in the edge part, and thus it is possible to suppress the deterioration of the visibility of the display device due to the first and second lead wires. In addition, since it is possible to freely wire the first and second lead wires, it is possible to arrange the second substrate so that one end of the lead wire extends outward at a right angle from one side of the first substrate, and thus it is possible to suppress the deterioration of the arrangement efficiency of various circuits.

[0024] According to the second aspect of the present invention, the length of the wiring formed on the second substrate can be made uniform regardless of the extension direction of the lead line, making it possible to perform correction processing in the controller based only on the difference in the wiring length on the first substrate.

[0025] According to the third and sixth aspects of the present invention, even if the first coil is a separate coil that does not intersect with the second coil, it is possible to connect it to wiring on the second substrate via the first and second lead wires.

[0026] According to the fourth aspect of the present invention, it is possible to preferably acquire signal changes of three or more coils used for coordinate calculation up to the vicinity of the short side portions, thereby making it possible to improve the accuracy of position detection, particularly near the edges of the detection area.

[0027] According to the fifth and seventh aspects of the present invention, it is possible to equalize the distribution of magnetic flux density at the end or throughout the entire detection area.

[0028] According to the eighth aspect of the present invention, it becomes possible to determine whether or not the position of the stylus is located on the edge of a detection area without undergoing a rotational transformation. [Brief description of the drawings]

[0029] [Figure 1] 1 is an exploded view of a tablet terminal 1 according to a first embodiment of the present invention. [Diagram 2] 1A is a side view of the tablet terminal 1, and FIG. [Diagram 3] FIG. 1 is a schematic cross-sectional view of a sensor 13 according to a first embodiment of the present invention. [Figure 4] 3 is a diagram showing a specific configuration of wiring included in a wiring layer L1 of the sensor 13 according to the first embodiment of the present invention. FIG. [Diagram 5] 3 is a diagram showing a specific configuration of wiring included in a wiring layer L2 of the sensor 13 according to the first embodiment of the present invention. FIG. [Figure 6] 4 is a diagram showing a specific configuration of wiring included in a wiring layer L3 of the sensor 13 according to the first embodiment of the present invention. FIG. [Figure 7] 4 is a diagram showing a specific configuration of wiring included in a wiring layer L4 of the sensor 13 according to the first embodiment of the present invention. FIG. [Figure 8]3A to 3C are diagrams illustrating a position detection process performed by the integrated circuit 20 according to the first embodiment of the present invention. [Figure 9] FIG. 4 is a flowchart of a position detection process performed by the integrated circuit 20 according to the first embodiment of the present invention. [Figure 10] 8 is a diagram showing the coils 40a and 40b shown in FIGS. 4 to 7 superimposed on each other. [Figure 11] 8 is a diagram showing the coils 40a and 40b shown in FIGS. 4 to 7 superimposed on each other. [Figure 12] 10(a) is a diagram showing an example in which an adjustment portion A1 is provided at an acute angle portion SAa of a coil 40a, and FIG. 10(b) is a diagram showing an example in which an adjustment portion A2 is provided at an obtuse angle portion OAa of a coil 40a. [Figure 13] 13 is a diagram showing a specific configuration of wiring included in a wiring layer L1 of a sensor 13 according to a second embodiment of the present invention. FIG. [Figure 14] 13 is a diagram showing a specific configuration of wiring included in a wiring layer L2 of a sensor 13 according to a second embodiment of the present invention. FIG. [Figure 15] FIG. 13 is a diagram for explaining an outline of a position detection process performed by an integrated circuit 20 according to a third embodiment of the present invention. [Figure 16] FIG. 11 is a diagram showing two tables that are pre-stored in a memory in an integrated circuit 20 according to a third embodiment of the present invention. [Figure 17] FIG. 16 is an enlarged view of a part of FIG. [Figure 18] FIG. 11 is a flowchart of a position detection process performed by an integrated circuit 20 according to a third embodiment of the present invention. [Figure 19] FIG. 13 is a diagram showing a state in which a flexible board and a controller are arranged at an angle. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0031] Fig. 1 is an exploded view of a tablet terminal 1 according to a first embodiment of the present invention. Fig. 2(a) is a side view of the tablet terminal 1, and Fig. 2(b) is a rear view of the tablet terminal 1. In Figs. 1 and 2(a), the upper side corresponds to the display surface (touch surface) of the tablet terminal 1, and the lower side corresponds to the rear surface of the tablet terminal 1.

[0032] As shown in Figs. 1 and 2, the tablet terminal 1 has a structure in which a shield plate 11, a spacer 12, a sensor 13, a display panel 16, and glass 18 are laminated in this order from the rear side within a display module rear cover 10 having a bathtub shape with a closed rear side. At least the sides of the sensor 13 and the display panel 16 are covered by a display module frame 17 for protection and fixing. The display module frame 17 is, for example, an adhesive tape. Although not shown, the tablet terminal 1 is further configured to have a housing that covers the entire tablet terminal 1 (including an integrated circuit 20 and a folded substrate 21 described later) except for the surface of the glass 18. The surface of the glass 18 constitutes the display surface and touch surface of the tablet terminal 1.

[0033] As shown in Fig. 2, an integrated circuit 20 (controller) that constitutes a position detection device together with the sensor 13 is provided on the back of the display module rear cover 10. Although not shown, in addition to the integrated circuit 20, a processor (processing circuit) that controls the entire tablet terminal 1 and is responsible for executing any application, a control circuit for the display panel 16, and the like are also provided on the back of the display module rear cover 10. Area A shown in Fig. 2(b) indicates an area where these circuits can be arranged.

[0034] The tablet terminal 1 is also configured to have a bent substrate 21 (second substrate) for connecting the integrated circuit 20 and the sensor 13. The bent substrate 21 is a flexible printed circuit (FPC) made of, for example, a thin plastic film, and is configured to be bendable. By utilizing this property, the bent substrate 21 is arranged in the tablet terminal 1 in a bent state so as to wrap around one side of the sensor 13 and the display panel 16, as shown in FIG. 2(a). One end of the bent substrate 21 is introduced into the display module rear cover 10 through the opening 10a of the display module rear cover 10 shown in FIG. 1, and is connected to terminals 42a, 42b (described later) of the sensor 13. The other end of the bent substrate 21 is connected to the integrated circuit 20 on the rear surface of the display module rear cover 10.

[0035] The sensor 13 and the integrated circuit 20 constitute the above-mentioned EM type or EMR (registered trademark) type position detection device, and play a role in detecting the position of the stylus 2 (position indicator) within a predetermined detection area. The detection area is a rectangular area set to have an area slightly larger than the display area of ​​the display panel 16 described later, and is arranged so as to overlap the entire display area. The integrated circuit 20 detects the position of the stylus 2 within the detection area by detecting the pen signal (alternating magnetic field) sent by the stylus 2 via the sensor 13. In addition, if it is compatible with the EMR (registered trademark) type, it also performs a process of generating power within the stylus 2 by sending electromagnetic waves via the sensor 13. In this case, the stylus 2 will send the pen signal using the power thus generated. Other details of the sensor 13 and the integrated circuit 20 (particularly the structure of the sensor 13 and the specific method of position detection by the integrated circuit 20) will be described in detail later.

[0036] The display panel 16 is a display device composed of liquid crystal, organic electroluminescence, electronic paper, or the like. The specific type of the display panel 16 is not particularly limited. The specific display content of the display panel 16 is controlled by the above-mentioned processor and control circuit. Although not shown, the display panel 16 is composed of a rectangular display area in which a plurality of pixels are arranged in a matrix, and a bezel area set around the display area. Wiring for connecting each pixel to the control circuit is arranged in the bezel area.

[0037] Here, one of the features of the present invention is that the sensor 13 (substrate 13A described later) is disposed on the back side of the display panel 16. By adopting such an arrangement, even if lead wires 41a, 41b of coils 40a, 40b described later are provided in the center of the detection area inside the sensor 13, it is possible to avoid a decrease in visibility of the display panel 16 due to the presence of the lead wires 41a, 41b. If the lead wires 41a, 41b can be provided in the center of the detection area, the area in which the position of the stylus 2 located around the detection area cannot be detected (the invalid area described above) can be reduced, and as a result, the bezel area can also be reduced. Therefore, in this embodiment, the lead wires 41a, 41b are provided in the center of the detection area T, as will be described in detail later with reference to Figures 4 to 7.

[0038] The shield plate 11 is a magnetic body arranged on the back surface of the sensor 13, and functions as an electromagnetic shield to prevent electromagnetic waves generated by the sensor 13 from leaking to the back surface side. The shield plate 11 also serves as a magnetic path for magnetic flux generated by the sensor 13. The spacer 12 is, for example, double-sided tape, and serves to insulate the wiring provided in the sensor 13 from the shield plate 11, and to fix the sensor 13 to the shield plate 11.

[0039] The sensor 13 and the integrated circuit 20 will be described in detail below with reference to FIGS.

[0040] 3 is a schematic cross-sectional view of the sensor 13. As shown in the figure, the sensor 13 includes a rectangular multilayer substrate 13A (first substrate) in which a wiring layer L1 (first layer), an insulating layer 30, a wiring layer L2 (second layer), an insulating layer 31, a wiring layer L3 (third layer), an insulating layer 32, and a wiring layer L4 are laminated in this order from the display surface side. The wiring layers L1 and L4 are the outermost layers, and the wiring layers L2 and L3 are inner layers that are not the outermost layers.

[0041] The wiring in wiring layer L1 is connected to the wiring in wiring layer L2 by via conductors 33 that penetrate insulating layer 30. Similarly, the wiring in wiring layer L3 is connected to the wiring in wiring layer L4 by via conductors 34 that penetrate insulating layer 32. Moreover, the wiring in wiring layer L1 is connected to the wiring in wiring layer L4 by via conductors 35 that penetrate insulating layers 30-32 and wiring layers L2 and L3.

[0042] 4 to 7 are diagrams showing specific configurations of the wiring included in the wiring layers L1 to L4. The X-axis direction and the Y-axis direction shown in these figures are the long side direction and the short side direction of the substrate 13A, respectively. The A-axis direction is a direction (first direction) that forms a predetermined angle greater than 0 degrees and smaller than 90 degrees with the long side direction of the substrate 13A, and the B-axis direction is a direction (second direction) that intersects with the A-axis direction. Typically, as shown in FIGS. 4 to 7, the A-axis direction forms an angle of 45 degrees with the X-axis direction, and the A-axis direction and the B-axis direction are orthogonal, but the specific directions of the A-axis direction and the B-axis direction are not limited to this. For example, the B-axis direction may coincide with the Y-axis direction.

[0043] In the following description, the coordinate system formed by the X-axis and Y-axis directions may be referred to as the "normal coordinate system," and the coordinate system formed by the A-axis and B-axis directions may be referred to as the "diagonal coordinate system." A rectangle with vertices at the four coordinates (X1, Y1), (X2, Y1), (X1, Y2), and (X2, Y2) of the normal coordinate system shown in the figure represents the detection area T of the sensor 13.

[0044] 4 and 5, a plurality of coils 40a are formed in the wiring layers L1 and L2. Typically, each of the plurality of coils 40a has a shape of a parallelogram surrounded by long side portions LEa1 and LEa2 extending along the A-axis direction and two short side portions SEa extending along the X-axis direction. However, some of the coils 40a have a shape of a trapezoid surrounded by long side portions LEa1 and LEa2 extending along the A-axis direction, a short side portion SEa extending along the X-axis direction, and a short side portion SEa extending along the Y-axis direction, and further, two coils 40a located at two of the four corners of the substrate 13A have a shape of a triangle surrounded by a long side portion LEa1 extending along the A-axis direction, a short side portion SEa extending along the X-axis direction, and a short side portion SEa extending along the Y-axis direction.

[0045] A main portion of each coil 40a is formed in the wiring layer L2, but a portion is formed in the wiring layer L1. The portion formed in the wiring layer L1 and the portion formed in the wiring layer L2 are connected to each other by via conductors 33 shown by black circles in Figs. 4 and 5. The portion formed in the wiring layer L1 includes a portion that overlaps with an adjacent coil 40a (first overlapping portion OLa shown in Fig. 4). As a result, the multiple coils 40a are arranged such that two adjacent coils 40a overlap each other in a planar view.

[0046] The long side LEa1 (first long side) of each coil 40a is disconnected in the middle of the portion formed in the wiring layer L2. The two open ends resulting from this disconnection constitute the ends EN1, EN2 (first and second ends) of the coil 40a, respectively, and are connected to the corresponding lead wires 41a (described later).

[0047] 6 and 7, a plurality of coils 40b are formed in the wiring layers L3 and L4. Each of the plurality of coils 40b is typically configured to have a shape of a parallelogram surrounded by long side portions LEb1 and LEb2 extending along the B-axis direction and two short side portions SEb extending along the X-axis direction. However, some of the coils 40b have a shape of a trapezoid surrounded by long side portions LEb1 and LEb2 extending along the B-axis direction, a short side portion SEb extending along the X-axis direction, and a short side portion SEb extending along the Y-axis direction, and further, two coils 40b located at two of the four corners of the substrate 13A have a shape of a triangle surrounded by a long side portion LEb1 extending along the B-axis direction, a short side portion SEb extending along the X-axis direction, and a short side portion SEb extending along the Y-axis direction.

[0048] A major portion of each coil 40b is formed in the wiring layer L3, but a portion is formed in the wiring layer L4. The portion formed in the wiring layer L3 and the portion formed in the wiring layer L4 are connected to each other by via conductors 34 shown by black circles in Figs. 6 and 7. The portion formed in the wiring layer L4 includes a portion that overlaps with an adjacent coil 40b (a second overlapping portion OLb shown in Fig. 7). As a result, the multiple coils 40b are arranged such that two adjacent coils 40b overlap each other in a plan view.

[0049] The long side LEb1 (second long side) of each coil 40b is disconnected in the middle of the portion formed in the wiring layer L3. The two open ends resulting from this disconnection constitute the ends EN1 and EN2 of the coil 40b, respectively, and are connected to the corresponding lead wires 41b (described later).

[0050] 4, the wiring layer L1 further includes a terminal group including a plurality of lead wires 41a and 41b and a plurality of terminals 42a and 42b. All of these are disposed within the detection region T. The plurality of terminals 42a and 42b are arranged in parallel along the X-axis direction near one long side of the substrate 13A.

[0051] Here, as shown in Fig. 4, the bent substrate 21 is arranged such that one end portion extends at a right angle from one long side of the substrate 13A toward the outside of the substrate 13A in a plan view. In addition, a plurality of terminals 23 corresponding one-to-one to each of the plurality of terminals 42a, 42b are provided at one end portion of the bent substrate 21. Each terminal 23 is individually connected to the integrated circuit 20 via the wiring 22 formed on the bent substrate 21, and is electrically connected to a corresponding one of the plurality of terminals 42a, 42b by crimping. With the above structure, each of the plurality of lead wires 41a, 41b is individually connected to the integrated circuit 20 via a corresponding one of the plurality of terminals 42a, 42b, the corresponding terminal 23, and the corresponding wiring 22.

[0052] The folded substrate 21 and the substrate 13A may be formed as an integrated substrate. In this case, the plurality of lead wires 41a, 41b may be directly connected to the corresponding wiring 22 without providing the plurality of terminals 42a, 42b and the plurality of terminals 23.

[0053] A plurality of lead wires 41a (first and second lead wires) are provided corresponding to the ends EN1, EN2 of each coil 40a. Therefore, the number of lead wires 41a is twice the number of coils 40a. Each lead wire 41a is connected to the corresponding end EN1 or end EN2 through a via conductor 33 indicated by a black circle in FIG. 4 and FIG. 5. In this way, the ends EN1, EN2 of each coil 40a are connected to the integrated circuit 20.

[0054] The plurality of lead wires 41b are provided corresponding to the ends EN1, EN2 of each coil 40b. Therefore, the number of lead wires 41b is twice the number of coils 40b. Each lead wire 41b is once led to the wiring layer L4 through a via conductor 35 shown by a black square in Figs. 4 to 7, and is routed to the position of the corresponding end EN1 or end EN2 in the wiring layer L4, and then connected to the corresponding end EN1 or end EN2 through a via conductor 34 shown by a black circle in Figs. 6 and 7. As a result, the ends EN1, EN2 of each coil 40b are also connected to the integrated circuit 20.

[0055] Here, some of the plurality of lead wires 41a, 41b have bent parts (for example, partial wirings 41aa, 41ab, 41ba shown in FIG. 4 and partial wiring 41bb shown in FIG. 7) extending in a direction different from both the A-axis direction and the B-axis direction. By allowing the existence of such bent parts, the degree of freedom of the wiring layout is increased, and it becomes possible to arrange the lead wires 41a, 41b efficiently. It is also possible to reduce the difference in wiring length between the lead wires 41a, 41b. Note that, although the lead wires 41a, 41b are provided with bent parts in this embodiment, the terminals 42a, 42b may be provided with bent parts extending in a direction different from both the X-axis direction and the Y-axis direction. By doing so, the same effect can be obtained.

[0056] Fig. 8 is a diagram for explaining the position detection process performed by the integrated circuit 20 using the sensor 13 having the above-mentioned structure. Also, Fig. 9 is a flow chart of the position detection process performed by the integrated circuit 20. Hereinafter, the position detection process using the sensor 13 will be described in detail with reference to these figures.

[0057] First, the integrated circuit 20 acquires the detection level (reception intensity) of the pen signal in each of the coils 40a, 40b by repeating a process of sequentially scanning the coils 40a, 40b (step S1). Next, the integrated circuit 20 corrects the acquired detection level based on the wiring length of each of the lead lines 41a, 41b (step S2). This correction process is necessary because the wiring length of each of the lead lines 41a, 41b is not constant. In other words, the longer the wiring length of the lead lines 41a, 41b, the higher the wiring resistance becomes, and therefore the level of the pen signal that reaches the integrated circuit 20 becomes smaller. Therefore, a correction process of the detection level based on the wiring length of each of the lead lines 41a, 41b is built into the integrated circuit 20 in advance.

[0058] Next, the integrated circuit 20 detects the coordinates (a, b) of the oblique coordinate system indicating the position P of the stylus 2 by the three-point method or the four-point method based on the corrected detection level (step S3). The three-point method is a method in which, for example, for the A axis, a predetermined interpolation curve is generated based on the detection levels of the pen signal in each of three coils 40a including the coil 40a with the highest detection level of the pen signal and the other two coils 40a located on both sides of the coil 40a, and the apex of the interpolation curve is set as the A axis coordinate. In the four-point method, the detection level of yet another coil 40a (for example, the coil 40a with the higher detection level of the two coils 40a located on both sides of the three coils 40a) is used to generate the interpolation curve. The same is true for the B axis.

[0059] The integrated circuit 20, which has acquired the coordinates (a, b) in the oblique coordinate system, converts the acquired coordinates (a, b) in the oblique coordinate system into coordinates (x, y) in the normal coordinate system by the rotation transformation shown in the following formula (1) (step S4). Note that θ in formula (1) is the angle (e.g., 45°) between the X-axis and the A-axis as shown in FIG. 8. Furthermore, formula (1) is formulated on the premise that the A-axis and the B-axis are orthogonal. If the A-axis and the B-axis are not orthogonal, formula (1) needs to be modified in consideration of the angle between the A-axis and the B-axis.

[0060]

number

[0061] The integrated circuit 20 is configured to output the coordinates (x, y) in the normal coordinate system obtained by the above conversion to the processor (step S4). This makes it possible to notify the processor of the coordinates (x, y) in the normal coordinate system.

[0062] As described above, according to this embodiment, since the substrate 13A is disposed on the rear side of the display panel 16, even though the connection points (ends EN1, EN2) between the lead-out wires 41a, 41b and the coils 40a, 40b are provided in the center rather than the edge of the detection area T, it is possible to suppress a decrease in visibility of the display panel 16 caused by the lead-out wires 41a, 41b.

[0063] Furthermore, according to this embodiment, since it is possible to freely wire the lead wires 41a, 41b, it is possible to arrange the bent substrate 21 so that one end of the bent substrate 21 extends at a right angle from one side of the substrate 13A toward the inside of the substrate 13A in a plan view. Therefore, as shown in Fig. 2(b), the bent substrate 21 and the integrated circuit 20 can be arranged straight on the back surface of the display module rear cover 10, and as can be understood by comparing the area A shown in Fig. 2(b) with the area A shown in Fig. 19, it is possible to suppress a decrease in the arrangement efficiency of various circuits including the integrated circuit 20.

[0064] Furthermore, according to this embodiment, since the terminals 42a, 42b are arranged in parallel along the X-axis direction near one long side of the substrate 13A, the lengths of the wiring 22 formed on the folded substrate 21 can be made uniform regardless of the extending direction of the leads 41a, 41b. Therefore, it becomes possible to perform the correction process in step S2 shown in FIG. 9 based only on the difference in the wiring length on the substrate 13A.

[0065] To explain this effect in detail, generally, the assembly of the tablet terminal 1 is performed by a company different from the vendor of the sensor 13 and the integrated circuit 20, and the company that performs the assembly prepares the bent substrate 21. Therefore, it is preferable to use a simple bent substrate 21 in which the length of the wiring 22 is uniform, and by doing so, the vendor of the sensor 13 and the integrated circuit 20 can design the correction process in step S2 shown in FIG. 9 without considering the difference in the length of the wiring 22 formed on the bent substrate 21. According to the present embodiment, since it is possible to use such a simple bent substrate 21, the vendor of the sensor 13 and the integrated circuit 20 can design the correction process in step S2 shown in FIG. 9 without considering the difference in the length of the wiring 22 formed on the bent substrate 21.

[0066] Other features of the tablet terminal 1 according to the present embodiment and the effects achieved thereby will be described below.

[0067] Figures 10 and 11 are diagrams showing the coils 40a and 40b shown in Figures 4 to 7 superimposed on each other. However, since it would be difficult to understand if all were shown superimposed, half of the coils 40a and 40b are shown in each of Figures 10 and 11. Furthermore, the coils 40a are shown by solid lines, and the coils 40b are shown by dashed lines.

[0068] 10 and 11, the multiple coils 40a, 40b according to the present embodiment are formed such that at least a part of the short side portion SEa of the coil 40a overlaps with at least a part of the short side portion SEb of the coil 40b in a plan view. In particular, in this example, the coils 40a, 40b are formed such that the short side portion SEa of each coil 40a extending in the X-axis direction completely overlaps with any of the short side portions SEb of the multiple coils 40b.

[0069] According to this configuration, the integrated circuit 20 can appropriately acquire signal changes of three or more coils 40a, 40b used for coordinate calculation up to the vicinity of each short side. Therefore, it is possible to perform coordinate calculation by the three-point method using three or more coils (or the four-point method using four or more coils) even in the vicinity of the edge of the detection area T, where coordinate calculation was conventionally only performed by the two-point method, and it is possible to improve the coordinate accuracy when the stylus 2 is located at the end (near the edge) of the detection area T. In this case, if the integrated circuit 20 is configured to perform coordinate calculation using both the detection results by the three coils 40a and the detection results by the three coils 40b, it is possible to further improve the coordinate accuracy. In addition, in the example of FIG. 10 and FIG. 11, the coils 40a, 40b are formed so that the short side portion SEa of each coil 40a extending in the X-axis direction completely overlaps with any short side portion SEb of the multiple coils 40b, so that it is possible to further improve the coordinate accuracy.

[0070] As illustrated at the positions of X-axis coordinates X3 and X4 in FIG. 11, the multiple coils 40a and 40b according to this embodiment are formed such that the acute angle portion SAa of the coil 40a, which is a parallelogram, and the obtuse angle portion OAb of the coil 40b, which is a parallelogram, overlap in a plan view. The same is true for the obtuse angle portion OAa of the coil 40a, which is a parallelogram, and the acute angle portion SAb of the coil 40b, which is a parallelogram. The acute angles SAa and SAb and the obtuse angles OAa and OAb are also shown in FIGS. 4 to 7. In addition, the integrated circuit 20 according to this embodiment is configured to simultaneously supply current to the acute angle portion and the obtuse angle portion (i.e., the coil including the acute angle portion and the coil including the obtuse angle portion) that are arranged at the same position in a plan view when transmitting an electromagnetic wave via the sensor 13.

[0071] When the integrated circuit 20 compatible with the EMR (registered trademark) system transmits electromagnetic waves via the sensor 13, the magnetic flux density is high at the acute angle portions SAa and SAb and low at the obtuse angle portions OAa and OAb. Therefore, there is a risk that uneven magnetic flux density will occur at the ends or the entire detection area T, but with the above configuration, the parts with high magnetic flux density (acute angle portions SAa and SAb) and the parts with low magnetic flux density (obtuse angle portions OAa and OAb) are located in the same place in a plan view, making it possible to equalize the distribution of magnetic flux density at the ends or the entire detection area T.

[0072] It should be noted that such uniformity of the magnetic flux density can also be achieved by other configurations, which will be described in detail below.

[0073] FIG. 12(a) is a diagram showing an example in which an adjustment unit A1 is provided at an acute angle SAa of a coil 40a. The adjustment unit A1 is configured by a short-circuit wire at the acute angle SAa provided between a long side portion (long side portion LEa1 in this case) constituting the acute angle SAa and a short side portion SEa. By providing such an adjustment unit A1 at each acute angle of the coils 40a and 40b, the difference in magnetic flux density at the corners (particularly the difference with an obtuse angle portion) can be reduced. Therefore, it becomes possible to equalize the distribution of magnetic flux density.

[0074] FIG. 12(b) is a diagram showing an example in which an adjustment section A2 is provided at the obtuse angle section OAa of the coil 40a. The adjustment section A2 is formed by a line segment connecting an end of a long side section (in this case, the long side section LEa2) constituting the obtuse angle section OAa obtained by extending the long side section from the obtuse angle section OAa toward the outside of the detection region T, and an end of a short side section SEa constituting the obtuse angle section OAa obtained by shortening the short side section SEa toward the corresponding acute angle section. By providing such an adjustment section A2 at each obtuse angle section of the coils 40a and 40b, the difference in magnetic flux density at the corners (particularly the difference with the acute angle section) can be reduced. Therefore, it is possible to equalize the distribution of magnetic flux density.

[0075] Next, a second embodiment of the present invention will be described. The tablet terminal 1 according to this embodiment differs from the tablet terminal 1 according to the first embodiment in the configuration of the sensor 13. Since the tablet terminal 1 according to this embodiment is otherwise similar to the first embodiment, the same components are given the same reference numerals, and the following description will focus on the differences from the first embodiment.

[0076] 13 and 14 are diagrams showing a specific configuration of the wiring included in the wiring layers L1 and L2 of the sensor 13 according to this embodiment. The sensor 13 according to this embodiment is configured to have a plurality of coils 50a and 50b instead of the plurality of coils 40a and 40b. The plurality of coils 50a and 50b differ from the sensor 13 according to the first embodiment in that the coils 50a do not overlap each other when viewed in a plan view, and the coils 50b do not overlap each other when viewed in a plan view. By configuring in this way, in this embodiment, the coil 50a is formed only in the single wiring layer L2, and the coil 50b is formed only in the single wiring layer L1. It is of course possible to form the coil 50a in the wiring layer L1 and the coil 50b in the wiring layer L2.

[0077] Lead wire 51a of coil 50a and lead wire (not shown) of coil 50b are formed in areas of wiring layers L1 and L2 that do not interfere with coils 50a and 50b. As a result, in this embodiment, wiring layers L3 and L4 and insulating layers 31 and 32 are omitted from the layers of substrate 13A shown in Fig. 3, and wiring layers L1 and L2 are the outermost layers. Also, via conductors 34 and 35 shown in Fig. 3 are not provided in sensor 13 according to this embodiment.

[0078] 13 and 14 show only four of the multiple lead wires 51a connected to the two coils 50a1 and 50a2 among the multiple lead wires 51a provided corresponding to each coil 50a. As shown in the figures, one end of each of these four lead wires 51a is connected to each of four terminals 52a provided in an area corresponding to the inside of the coil 50b1, which is one of the multiple coils 50b. As in the first embodiment, the four terminals 52a are arranged in parallel along the X-axis direction near one long side of the substrate 13A, and are each connected to a terminal 23 (see FIG. 4) formed on the folded substrate 21. Although not shown, the same applies to the terminals 52a connected to the other lead wires 51a and the terminals connected to the lead wires of each coil 50b.

[0079] 13 and 14, the coil 50a1 has a portion that overlaps in plan with the coil 50b1, inside which the corresponding terminal 52a is formed. The two lead wires 51a connected to the coil 50a1 are formed to extend in the B-axis direction in a region corresponding to the inside of the coil 50b1 in plan, and are connected to the ends EN1 and EN2 of the coil 50a1 by the via conductors 33, respectively.

[0080] On the other hand, as can be seen from Figs. 13 and 14, the coil 50a2 does not have a portion that overlaps with the coil 50b1, the corresponding terminal 52a of which is formed inside the coil 50b1, in plan view. Hereinafter, such a coil is referred to as a "detached coil." The two lead wires 51a connected to the detached coil 50a2 cannot be connected to the coil 50a2 in the area corresponding to the inside of the coil 50b1 in plan view. Therefore, the connection between these lead wires 51a and the coil 50a2 is realized via the wiring layer L2 on the way. This will be explained in detail below.

[0081] Each of the two lead wires 51a connected to the coil 50a2 is configured to have a first portion 51a1 having one end connected to a corresponding one of the ends EN1, EN2 of the coil 50a2 and extending in the B-axis direction, a second portion 51a2 having one end connected to the other end of the first portion 51a1 and extending in the A-axis direction, and a third portion 51a3 having one end connected to the other end of the second portion 51a2 and extending in the B-axis direction.

[0082] The third portion 51a3 is a portion formed in a region corresponding to the inside of the coil 50b1 in a plan view. The other end of the third portion 51a3 is connected to the corresponding terminal 52a.

[0083] The second portion 51a2 is a portion formed in a region corresponding to the inside of the coil 50a3 shown in FIG. 14. The coil 50a3 is a coil that has a portion overlapping with the coil 50b1 of the multiple coils 50a in a plan view, and also has a portion overlapping with the coil 50b2 of the multiple coils 50b that has a portion overlapping with the coil 50a2 in a plan view. In the example of FIG. 13 and FIG. 14, the coil 50a1 also meets this condition, so the coil 50a1 may also serve as the coil 50a3. The other end of the second portion 51a2 is connected to one end of the third portion 51a3 by the via conductor 33 in the region where the coils 50b1 and 50a3 overlap.

[0084] The first portion 51a1 is formed in a region corresponding to the inside of the coil 50b2 described above. The other end of the first portion 51a1 is connected to one end of the second portion 51a2 by a via conductor 33 in the region where the coils 50a2 and 50b2 overlap. One end of the first portion 51a1 is connected to a corresponding one of the ends EN1 and EN2 of the coil 50a2 by the via conductor 33.

[0085] As described above, according to this embodiment, since the lead wire 51a is provided with the first to third portions 51a1 to 51a3, it becomes possible to connect the detached coil 50a2 to the lead wire 51a. Therefore, even when using a two-layer substrate rather than a multi-layer substrate, it becomes possible to bend the detached coil 50a2 and connect it to the wiring 22 (see FIG. 4) on the substrate 21. Note that, although the present embodiment focuses on the detached coil of the coil 50a, the same applies to the detached coil of the coil 50b.

[0086] The same effect can be achieved by providing one or more wiring layers different from the wiring layers in which the coils 50a and 50b are formed, and arranging the leads of the coils 50a and 50b therein. This configuration is nothing more than a configuration in which the shape of the coils 40a and 40b in the first embodiment is changed to the same shape as the coils 50a and 50b.

[0087] Next, a third embodiment of the present invention will be described. The tablet terminal 1 according to this embodiment differs from the tablet terminal 1 according to the first embodiment in terms of the operation of the integrated circuit 20. Since the tablet terminal 1 according to this embodiment is otherwise similar to the first embodiment, the same components are given the same reference numerals, and the following description will focus on the differences from the first embodiment.

[0088] FIG. 15 is a diagram for explaining an outline of the position detection process performed by the integrated circuit 20 according to this embodiment. The black and white dots shown in the figure indicate the intersections IS of the coils 40a and 40b. The intersections IS indicated by the white dots are located at the edge of the detection area T. When detecting the position of the stylus 2 based on the level of the pen signal, the integrated circuit 20 according to this embodiment judges whether the stylus 2 is located at the edge of the detection area T. If it is judged that the stylus 2 is located at the edge of the detection area T, the coordinates (x, y) of the normal coordinate system are obtained by the method (method using rotational transformation) explained in the first embodiment, whereas if it is judged that the stylus 2 is not located at the edge of the detection area T (i.e., if it is judged that the stylus 2 is located at the center of the detection area T), the coordinates (x, y) of the normal coordinate system are obtained by a simpler method.

[0089] FIG. 16 is a diagram showing two tables stored in advance in a memory (not shown) in the integrated circuit 20 according to this embodiment. The table shown in FIG. 16(a) is a table that stores, for each intersection IS, a coordinate in an oblique coordinate system, a coordinate in a normal coordinate system, and an edge flag indicating whether the intersection IS is located at the edge of the detection area T in association with each other, and is hereinafter referred to as an "intersection table." On the other hand, the table shown in FIG. 16(b) is a table that stores, in association with each other, a difference in coordinates in an oblique coordinate system and a difference in coordinates in a normal coordinate system, and is hereinafter referred to as a "difference table." The integrated circuit 20 according to this embodiment uses these tables to perform a process of converting coordinates (a, b) in the oblique coordinate system into coordinates (x, y) in the normal coordinate system.

[0090] Fig. 17 is an enlarged view of a part of Fig. 15. Fig. 18 is a flow diagram of the position detection process performed by integrated circuit 20 according to this embodiment. The position detection process performed by integrated circuit 20 according to this embodiment will be described in detail below with reference to these drawings. Note that the following description will be given assuming that position P shown in Fig. 17 is the current position of stylus 2.

[0091] The processes in steps S1 to S3 are as described in the first embodiment. After detecting the coordinates (a, b) of the position P in the oblique coordinate system in step S3, the integrated circuit 20 next detects an intersection point ISP that is the intersection point IS closest to the coordinates (a, b) and calculates the coordinates (a, b) in the oblique coordinate system. S ,b S ) is obtained (step S10, intersection detection step). Then, by referring to the intersection table, the obtained coordinate (a S ,b S It is judged whether the coordinate (a) is an edge of the detection area T (steps S11 and S12, judgment steps). S ,b S If the edge flag stored in association with the detected region T is “True”, it is determined to be the edge of the detection region T, and if the edge flag is “False”, it is determined to be not the edge of the detection region T.

[0092] If it is determined in step S12 that it is an edge, the integrated circuit 20 converts the coordinates (a, b) in the oblique coordinate system into coordinates (x, y) in the normal coordinate system by rotational transformation, as in the first embodiment, and outputs them to the processor (step S4).

[0093] On the other hand, if the integrated circuit 20 determines in step S12 that the intersection is not an edge, it first acquires relative coordinates (Δa, Δb) that indicate the relative position of the stylus 2 with respect to the intersection ISP in the oblique coordinate system (step S13). As shown in FIG. 17, the relative coordinates Δa are the coordinates a and a S The relative coordinate Δb is the difference between coordinate b and coordinate b S This corresponds to the difference between

[0094] The integrated circuit 20 then has coordinates (a S ,b S ) into the normal coordinate system coordinates (x S ,y S ) (step S14, the first step). Specifically, by referring to the intersection table shown in FIG. 16(a), the coordinates (a S ,b S ) and obtain the coordinates in the normal coordinate system corresponding to the coordinate (x S ,y S ) in the diagonal coordinate system. The integrated circuit 20 also maps the relative coordinates (Δa, Δb) in the diagonal coordinate system to the relative coordinates (Δx, Δy) in the normal coordinate system (step S15, second step). Specifically, by referring to the difference table shown in FIG. 16(b), the relative coordinates in the normal coordinate system corresponding to the relative coordinates (Δa, Δb) are obtained and are acquired as the relative coordinates (Δx, Δy).

[0095] Then, the integrated circuit 20 calculates the obtained coordinate (x S ,y S Based on the coordinates (Δx, Δy) and the relative coordinates (Δx, Δy), the coordinates (x, y) of the position P in the normal coordinate system are calculated and output to the processor (step S16). S The X coordinate x of position P is obtained by adding the relative coordinate Δx to SThe Y coordinate y of position P is obtained by adding the relative coordinate Δy to

[0096] According to this embodiment, the integrated circuit 20 can determine whether or not the position of the stylus 2 is located on the edge of the detection area T without undergoing rotational transformation. Therefore, when the stylus 2 is located in the center of the detection area T, it becomes possible to transform the coordinates (a, b) in the oblique coordinate system into the coordinates (x, y) in the normal coordinate system by a simple method (steps S13 to S16) that does not rely on rotational transformation.

[0097] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and it goes without saying that the present invention can be embodied in various forms without departing from the spirit of the present invention.

[0098] For example, when electromagnetic waves by the EMR (registered trademark) method are transmitted from the sensor 13, the integrated circuit 20 may be configured to supply different voltages or currents to each of the multiple coils (the coils 40a and 40b in the first and third embodiments, and the multiple coils 50a and 50b in the second embodiment) according to the shape of each coil (specifically, according to whether the coils are a parallelogram, a trapezoid, or a triangle). Specifically, the integrated circuit 20 may be configured to supply a relatively large voltage or current to a parallelogram coil, a relatively medium voltage or current to a trapezoid coil, and a relatively large voltage or current to a triangular coil. In another example, the integrated circuit 20 may be configured to adjust at least one of the voltage or current supplied to each coil according to the length of each of the multiple coils. Depending on the shape and length of the coil, the density of the magnetic flux generated may differ from coil to coil even when the same voltage or current is supplied. However, with this configuration, it is possible to suppress such differences in magnetic flux density and equalize the distribution of magnetic flux density at the ends or throughout the detection area T.

[0099] In addition, in each of the above embodiments, the number of turns of each of the coils 40a, 40b, 50a, and 50b is one, but the number of turns of a relatively short coil (for example, the substantially trapezoidal coil 40a shown in Figs. 4 and 5) may be greater than the number of turns of a relatively long coil (for example, the substantially parallelogram coil 40a shown in Figs. 4 and 5). This makes it possible to uniform the density of the magnetic flux generated in each coil. [Explanation of symbols]

[0100] 1. Tablet device 2 Stylus 10 Display module rear cover 10a Opening of display module rear cover 10 11 Shield plate 12 Spacer 13 Sensors 13A Board 16 Display Panel 17 Display module frame 18. Glass 20 Integrated Circuits 21 Bent PCB 22 Wiring on bent substrate 21 23 Terminal on bent substrate 21 30~32 Insulation layer 33~35 Via conductor 40a, 40b, 50a, 50b, 50a1, 50a2, 50a3, 50b1, 50b2 coils 41a, 41b, 51a Lead wire 41aa, 41ab, 41bb Partial wiring 42a, 42b, 52a Terminals of sensor 13 51a1: First portion of lead wire 51a 51a2: Second portion of lead wire 51a 51a3: the third portion of the lead wire 51a A1,A2 adjustment section EN1,EN2 end IS,ISP intersection L1~L4 wiring layer LEa1, LEa2, LEb1, LEb2 Long side OAa,OAb Obtuse angle part OLa First overlap OLb Second overlap SAa, SAb Sharp angle SEa,SEb Short side T detection area

Claims

1. A first substrate; a first coil including a first long side portion extending along a first direction that forms a predetermined angle greater than 0 degrees and less than 90 degrees with a long side direction of the first substrate; a second coil including a second long side extending along a second direction intersecting the first direction; a first lead wire connected to the first coil; a second lead wire connected to the second coil; the first substrate is a multilayer substrate having three or more layers including first to third layers, the first long side portion is provided on the second layer, the second long side portion is provided on the third layer, the first and second lead lines are provided on the first layer; Sensor.

2. the first layer is an outermost layer located outermost among the plurality of layers, At least one of the second and third layers is an inner layer that is not the outermost layer. The sensor of claim 1 .

3. The first and second coils are formed such that at least a part of a short side of the first coil overlaps with at least a part of a short side of the second coil in a plan view. The sensor of claim 1 .

4. A plurality of the first coils and a plurality of the second coils are formed on the first substrate, each of the first coils has a first overlapping portion that overlaps with an adjacent one of the first coils in a plan view; each of the second coils has a second overlapping portion that overlaps with another adjacent second coil in a plan view; the first overlapping portion of each of the plurality of first coils or the second overlapping portion of each of the plurality of second coils is provided on the first layer; The sensor of claim 3.

5. The first and second coils are formed such that an acute angle portion of the first coil and an obtuse angle portion of the second coil overlap in a plan view. The sensor of claim 4.

6. the first and second lead lines are connected to an integrated circuit; the integrated circuit is configured to simultaneously supply current to the acute angle portion and the obtuse angle portion; The sensor of claim 5.

7. The first and second coils have an adjustment portion for reducing a difference in magnetic flux density occurring at a corner portion. The sensor of claim 1 .

8. A plurality of the first coils are formed on the first substrate, The number of turns of the relatively short first coils among the plurality of first coils is greater than the number of turns of the relatively long first coils. The sensor of claim 1 .

9. the first and second lead lines are connected to an integrated circuit; A plurality of the first coils having different lengths are formed on the first substrate, The integrated circuit is configured to adjust at least one of a voltage or a current supplied to each of the plurality of first coils for each of the plurality of first coils. The sensor of claim 1 .

10. The first and second lead wires are provided within a detection region of the sensor in which the first and second coils are installed, as viewed in a plan view. The sensor of claim 1 .

11. the first lead-out line and the second lead-out line are each connected to wiring on a second substrate connected to an integrated circuit via a terminal group provided in a detection region of the sensor; The sensor of claim 10.

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