Mounting device and mounting method

Abstract

To provide a mounting device that can suppress the generation of a mounting failure and is in a compact, and provide a mounting method using them.SOLUTION: A mounting device 1 comprises: a first metal molding 10 that is constructed by holding substrates SB1 and SB2 onto which electron components CH11, CH12, CH21, and CH22 are mounted; a second metal molding 20 that includes at least one of movable mechanisms 22A, 22B, 22C, and 22D connected to an internal space 23; and a pressing force transmission mechanism PR that presses a viscous member 23V sealed into the internal space 23 of the second metal molding 20. In a state where the first metal molding 10 and the second metal molding 20 are molded, the electron components CH11, CH12, CH21, and CH22 are pressed by the movable mechanisms 22A, 22B, 22C, and 22D via the viscous member 23V on the basis of a pressing force for pressing the viscous member 23V by the pressing force transmission mechanism PR.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a mounting apparatus and a mounting method. [Background technology]

[0002] When mounting electronic components on a substrate via a bonding material, a mounting device is known that simultaneously presses a plurality of electronic components against at least one substrate. In such a mounting device, each of the plurality of electronic components may be individually pressed to prevent mounting failures caused by insufficient or excessive pressure on the electronic components due to differences in dimensions of the plurality of electronic components.

[0003] For example, Patent Document 1 discloses a semiconductor mounting device that includes a plurality of pressure blocks for individually pressurizing a plurality of semiconductor elements, a plurality of shafts for linearly moving the plurality of pressure blocks, a plurality of pressurizing blocks for pressurizing the plurality of blocks via the plurality of shafts, and an elastic body for collectively pressurizing the plurality of pressurizing blocks, in which air pressure or compressed gas pressure is supplied to a pressurizing valve to expand the elastic body toward the plurality of pressurizing blocks, thereby pressurizing the plurality of pressurizing blocks. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2002-110744 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the semiconductor mounting device described in Patent Document 1 needs to include a compressor or a high-pressure tank for supplying air pressure or compressed gas pressure, and piping for passing the air or compressed gas, etc. Therefore, the device may become large in size.

[0006] The present invention has been made in view of the above circumstances, and has an object to provide a compact mounting device capable of suppressing the occurrence of mounting defects, and a mounting method using the same. [Means for solving the problem]

[0007] A mounting device according to one embodiment of the present invention is a mounting device for mounting one or more electronic components on at least one substrate, and includes a first mold configured to hold a substrate on which an electronic component is placed, a second mold arranged opposite the first mold and having at least one movable mechanism connected to an internal space of the second mold, and a pressure transmission mechanism that presses a viscous member sealed in the internal space of the second mold, and when the first mold and the second mold are closed, the electronic component is pressurized by the movable mechanism through the viscous member based on the pressing force with which the pressure transmission mechanism presses the viscous member.

[0008] Another embodiment of the mounting method of the present invention is a mounting method for mounting one or more electronic components on at least one substrate, the mounting method including: preparing a first mold configured to hold a substrate on which an electronic component is placed; preparing a second mold arranged opposite the first mold, the second mold having at least one movable mechanism connected to an internal space of the second mold; and preparing a pressure transmission mechanism that presses a viscous member sealed in the internal space of the second mold, the mounting method further including: closing the first and second molds, pressing the viscous member with the pressure transmission mechanism, and, when the first and second molds are closed, pressurizing the electronic component by the movable mechanism via the viscous member based on the pressing force with which the pressure transmission mechanism presses the viscous member. Effect of the Invention

[0009] According to the present invention, it is possible to provide a compact mounting device capable of suppressing the occurrence of mounting defects, and a mounting method using the same. [Brief description of the drawings]

[0010] [Figure 1] 1 is a diagram showing an overall outline of a mounting apparatus according to an embodiment of the present invention; [Diagram 2] 1 is a flowchart illustrating a part of an implementation method according to an embodiment of the present invention. [Diagram 3] 1 is a flowchart illustrating a part of an implementation method according to an embodiment of the present invention. [Figure 4] 4 is a graph showing a temperature profile of a mounting method according to an embodiment of the present invention. [Diagram 5] FIG. 1 is a diagram showing a mounting apparatus in one step of a mounting method. [Figure 6] FIG. 1 is a diagram showing a mounting apparatus in one step of a mounting method. [Figure 7] FIG. 1 is a diagram showing a mounting apparatus in one step of a mounting method. [Figure 8] FIG. 1 is a diagram showing a mounting apparatus in one step of a mounting method. [Figure 9] FIG. 1 is a diagram showing a mounting apparatus in one step of a mounting method. [Figure 10] FIG. 1 is a diagram showing a mounting apparatus in one step of a mounting method. [Figure 11] FIG. 1 is a diagram showing a mounting apparatus in one step of a mounting method. [Figure 12] FIG. 13 is a diagram showing an overall outline of a mounting apparatus according to a modified example of the present invention. [Figure 13] FIG. 13 is a diagram showing an overall outline of a mounting apparatus according to a modified example of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The following describes the embodiments of the present invention. In the following description of the drawings, the same or similar components are denoted by the same or similar reference numerals. The drawings are illustrative, and the dimensions, shapes, and numbers of each part are schematic, and the technical scope of the present invention should not be interpreted as being limited to the embodiments.

[0012] <Mounting equipment> First, the configuration of a mounting apparatus 1 according to an embodiment of the present invention will be described with reference to Fig. 1. Fig. 1 is a diagram showing an overall outline of a mounting apparatus according to an embodiment of the present invention.

[0013] The mounting device 1 performs mounting processing on the workpieces W1 and W2. The workpiece W1 includes electronic components CH11 and CH12, bonding materials SN11 and SN12, and a substrate SB1. The workpiece W2 includes electronic components CH21 and CH22, bonding materials SN21 and SN22, and a substrate SB2. That is, the mounting device 1 mounts the electronic component CH11 on the substrate SB1 via the bonding material SN11, mounts the electronic component CH12 on the substrate SB1 via the bonding material SN12, mounts the electronic component CH21 on the substrate SB2 via the bonding material SN21, and mounts the electronic component CH22 on the substrate SB2 via the bonding material SN22. Inside the mounting device 1, the workpiece W1 is installed so that the substrate SB1 faces the lower mold 10 and the electronic components CH11 and CH12 face the upper mold 20, and the workpiece W2 is installed so that the substrate SB2 faces the lower mold 10 and the electronic components CH21 and CH22 face the upper mold 20. Before the mounting process is performed by the mounting apparatus 1, the electronic components CH11 and CH12 are placed on the board SB1, and the electronic components CH21 and CH22 are placed on the board SB2. After the mounting process is performed by the mounting apparatus 1, the electronic components CH11 and CH12 are bonded to the board SB1, and the electronic components CH21 and CH22 are bonded to the board SB2. In the following description, the sides on which the electronic components CH11, CH12, CH21, and CH22 are provided are referred to as the front surfaces of the boards SB1 and SB2, and the opposite sides are referred to as the back surfaces of the boards SB1 and SB2.

[0014] The electronic components CH11, CH12, CH21, and CH22 are, for example, semiconductor chips. The substrates SB1 and SB2 are DBA (Direct Bonded Aluminum) substrates (high heat dissipation ceramic insulating substrate with aluminum circuit) or DBC (Direct Bonded Copper) substrates (high heat dissipation ceramic insulating substrate with copper circuit). The bonding materials SN11, SN12, SN21, and SN22 are, for example, sintering materials containing silver (Ag) nanoparticles. The mounting device 1 is a sintering device that heats and pressurizes the bonding materials SN11, SN12, SN21, and SN22 to sinter them. The thicknesses of the substrates SB1 and SB2 are, for example, different from each other, but may be the same. The heights of the electronic components CH11 and CH12 are, for example, different from each other, but may be the same. The heights of the electronic components CH21 and CH22 are, for example, different from each other, but may be the same. The bonding materials SN11, SN12, SN21, and SN22 may have the same thickness. Furthermore, the number of electronic components per substrate is at least one and is not limited to two.

[0015] The mounting device according to an embodiment of the present invention is not limited to a sintering device as long as it applies pressure to electronic components, and may be any other suitable device such as a flip chip bonder. The electronic components according to an embodiment of the present invention are not limited to semiconductor chips, and may be passive elements such as resistors, inductors, capacitors, and quartz crystal oscillators, or active elements such as diodes, transistors, thyristors, and operational amplifiers.

[0016] The substrate according to an embodiment of the present invention is not limited to a ceramic substrate, but may be, for example, a semiconductor substrate such as a silicon substrate, a metal substrate such as a lead frame, or an insulating substrate such as a PCB (Printed Circuit Board) substrate. The substrate may be an electronic component, and in this case, the mounting device according to an embodiment of the present invention is a device for bonding electronic components together. The bonding material according to an embodiment of the present invention is not limited to a sintering material, but may be a semi-sintering material, a metal solder, an organic adhesive, or an inorganic adhesive. The form of the bonding material is, for example, a powder aggregate, but may also be liquid, semi-solid, solid, or film-like.

[0017] The number of substrates according to an embodiment of the present invention is not limited to two, but may be at least one. Similarly, the number of electronic components is not limited to four, but may be at least one on one substrate. One or more electronic components are mounted on one substrate.

[0018] 1, the mounting apparatus 1 includes a press device 3 and a die 2 attached to the press device 3. In the illustrated example, the mounting apparatus 1 further includes degassing chambers 31 and 32, but this is not essential. The press device 3 includes a pair of upper and lower platens 4 and 5 connected by a tie bar, and a lower plunger PR1.

[0019] The mold 2 includes an upper mold base 21E fixed to the upper platen 5, and a lower mold base 11F fixed to the lower platen 4. The main plates constituting the mold 2 (support plates 21D, 21C, upper mold chase 21B, lower mold chase 11B, ejector pin plate 11C, retainer plate 11D, etc.) are fixed between the upper mold base 21E and the lower mold base 11F.

[0020] In the following description, the various plates and their parts fixed to lower die base 11F are collectively referred to as lower die 10, and the various plates and their parts fixed to upper die base 21E are collectively referred to as upper die 20. Lower die 10 is an example of a "first die," and upper die 20 is an example of a "second die."

[0021] The lower die 10 mainly includes a lower die base 11F, a support pillar 11E, a retainer plate 11D, an ejector pin plate 11C, a lower die chase 11B, etc. The lower die chase 11B is fixed above the lower die base 11F via a plurality of support pillars 11E that protrude in a columnar shape from the lower die base 11F.

[0022] An ejector pin plate 11C and a retainer plate 11D are disposed below the lower die chase 11B. The ejector pin plate 11C and the retainer plate 11D have holes through which the support pillars 11E pass. The ejector pin plate 11C and the retainer plate 11D are fixed to each other and configured to be slidable up and down between the lower die chase 11B and the lower die base 11F.

[0023] Various parts including the cavity plate 11A are fixed to the lower die chase 11B. In the illustrated example, the cavity plate 11A, a side block 18 for fixing the cavity plate 11A, a heat insulating member 15 arranged to surround the lower surface and side surfaces of the cavity plate 11A, a spring 17B, and a spring sleeve 17A are fixed to the lower die chase 11B.

[0024] A plurality of lifter pins 12A, 12B that can be protruded and retracted from the cavity plate 11A, and a set pin 16 that abuts against the upper die 20 when the die is clamped are fixed to the ejector pin plate 11C and the retainer plate 11D.

[0025] The cavity plate 11A is provided at a position closest to the upper die 20, and contacts the space between the lower die 10 and the upper die 20 when the die is opened. A heater 14 is provided inside the cavity plate 11A. When the lower die 10 and the upper die 20 are closed, the heater 14 heats the substrates SB1 and SB2 via the cavity plate 11A. This heats the bonding materials SN11, SN12, SN21, and SN22.

[0026] The heat insulating member 15 is provided between the cavity plate 11A and the lower die chase 11B, and between the cavity plate 11A and the side block 18. The heat insulating member 15 suppresses direct heat conduction from the cavity plate 11A to the lower die chase 11B, and suppresses heat conduction from the cavity plate 11A to the lower die chase 11B via the side block 18.

[0027] In other words, the heat insulating member 15 is disposed so as to separate the gas piping provided in the lower die chase 11B from the heater 14, and suppresses the rise in temperature of the nitrogen gas supplied from the gas supply port 13. The heat insulating member 15 is also disposed so as to separate the spring 17B from the heater 14, and suppresses the decrease in the elastic force of the spring 17B. In other words, the heat insulating member 15 speeds up the temperature rise caused by the heater 14 by limiting the heating target to the cavity plate 11A, and also makes it difficult for other members to be affected by the heat.

[0028] The side block 18 is provided on the side of the lower die chase 11B facing the upper die 20. When viewed from above from the upper die 20, the side block 18 is provided on the outer side of the cavity plate 11A. The side block 18 abuts against the upper die 20 when the lower die 10 and the upper die 20 are closed. In the illustrated example, a gas supply port 13 for supplying a gas such as nitrogen (N2) gas is provided on the insulating plate 15 side outer than the heater 14 of the cavity plate 11A.

[0029] The gas supply port 13 supplies gas such as nitrogen (N2) gas toward the electronic components CH11, CH12, CH21, CH22 and the boards SB1, SB2. The gas supply port 13 is provided on the surface of the cavity plate 11A facing the upper die 20, and opens toward the upper die 20. Therefore, the gas supply port 13 quickly removes oxidizing gas from around the workpieces W1, W2 during heating, and places the workpieces W1, W2 under a nitrogen atmosphere.

[0030] The gas supply ports 13 apply nitrogen gas to the workpieces W1 and W2 during cooling, thereby gas-cooling the workpieces W1 and W2. When viewed from above from the upper die 20, a plurality of gas supply ports 13 are provided on the outside of the workpieces W1 and W2. Gas piping through which the nitrogen gas supplied by the gas supply ports 13 passes is provided in the lower die chase 11B. The gas supply ports 13 are an example of a "gas supply mechanism" that supplies an inert gas to the space between the lower die 10 and the upper die 20.

[0031] The inert gas supplied by the gas supply port is not limited to nitrogen gas, and may be, for example, carbon dioxide, fluorocarbon, or a rare gas. The gas supply port may be opened toward the electronic component, the bonding material, or the substrate, and the inert gas may be directly sprayed onto the electronic component, the bonding material, or the substrate. The gas supply port may be provided in the cavity plate of the upper mold, or may be provided in the cavity plates of both the lower mold and the upper mold. The gas supply port may be provided in at least one side block of the lower mold or the upper mold, or may be provided in a degassing chamber described later. In addition, the inert gas may not be used.

[0032] The spring 17B constantly biases the ejector pin plate 11C and the retainer plate 11D upward toward the lower die chase 11B. The base end (upper end) of the spring sleeve 17A is a stepped bolt (or a washer, sleeve and bolt) and is fixed to the lower surface of the lower die chase 11B. The tip end (lower end) of the spring sleeve 17A is provided with a flange.

[0033] The retainer plate 11D has a through hole larger than the tip of the spring sleeve 17A. The ejector pin plate 11C has a counterbore having the same diameter as the through hole, and a through hole through which the base end of the spring sleeve 17A is inserted at the center of the counterbore. The spring sleeve 17A is inserted through the through hole of the retainer plate 11D and the through hole of the ejector pin plate 11C.

[0034] The spring 17B is provided in a spiral shape around the spring sleeve 17A between the flange of the spring sleeve 17A and the countersunk portion of the ejector pin plate 11C. In other words, the spring sleeve 17A is inserted into the spiral spring 17B. The spring 17B exerts an elastic force in a direction that moves the ejector pin plate 11C and the flange at the tip of the spring sleeve 17A away from each other.

[0035] In other words, the spring 17B constantly biases the ejector pin plate 11C and the retainer plate 11D toward the lower die chase 11B via the spring sleeve 17A. The spring 17B is an example of an elastic member, and the elastic member is not limited to a spring as long as it can exert the above-mentioned elastic force. The elastic member may be, for example, rubber or a leaf spring.

[0036] The lifter pins 12A and 12B are inserted into through holes that penetrate the cavity plate 11A, the lower die chase 11B, the ejector pin plate 11C, and the heat insulating member 15. The lifter pins 12A and 12B are the same length, and three or more pins are used to hold the workpiece W1 in parallel. The top end is on the upper die 20 side, and the bottom end is on the lower die base 11F side. The bottom ends of the lifter pin 12B and the set pin 16 are sandwiched between the ejector pin plate 11C and the retainer plate 11D and screwed in place. The lifter pin 12B and the set pin 16 move up and down in conjunction with the ejector pin plate 11C and the retainer plate 11D.

[0037] The lifter pins 12A support the substrate SB1 by bringing their tips into contact with the rear surface of the substrate SB1, and the lifter pins 12B support the substrate SB2 by bringing their tips into contact with the rear surface of the substrate SB2. The lifter pins 12A and 12B are configured to be vertically movable, and move the substrates SB1 and SB2 closer to or farther from the cavity plate 11A.

[0038] Specifically, the lifter pins 12A, 12B are configured to be able to advance and retreat from the cavity plate 11A to the upper die 20. When the lifter pins 12A, 12B advance into the space between the lower die 10 and the upper die 20 (when the die is opened), the workpieces W1, W2 supported by the lifter pins 12A, 12B move away from the cavity plate 11A. When the lifter pins 12A, 12B retreat from the space between the lower die 10 and the upper die 20 (when the die is closed), the workpieces W1, W2 are supported in contact with the cavity plate 11A.

[0039] When the ejector pin plate 11C and the retainer plate 11D approach the cavity plate 11A (move upward), the tips of the lifter pins 12A and 12B protrude from the cavity plate 11A. That is, the tips of the lifter pins 12A and 12B advance into the space between the lower mold 10 and the upper mold 20.

[0040] When the ejector pin plate 11C and the retainer plate 11D move away from the cavity plate 11A (move downward), the tips of the lifter pins 12A and 12B are stored inside the cavity plate 11A, and the surfaces of the end portions of the lifter pins 12A and 12B become flush with the surface of the cavity plate 11A. In other words, the lifter pins 12A and 12B have retreated from the space between the lower die 10 and the upper die 20. The lifter pins 12A and 12B are an example of a "holding portion." Note that the holding portion is not limited to a lifter pin. The holding portion may be a long, thin plate-like member that holds the end of the workpiece.

[0041] The set pin 16 is inserted through a through hole that penetrates the side block 18, the lower die chase 11B, and the ejector pin plate 11C. The set pin 16 has a tip end on the upper die 20 side and a base end on the lower die base 11F side. The base end of the set pin 16 is sandwiched between the ejector pin plate 11C and the retainer plate 11D. The tip end of the set pin 16 faces the side block 28 of the upper die 20.

[0042] When the lower die 10 and the upper die 20 are closed, the set pins 16 are pressed by the side blocks 28 to push down the ejector pin plate 11C and the retainer plate 11D. By pushing down the ejector pin plate 11C and the retainer plate 11D, the lifter pins 12B are pushed down in conjunction with each other, and the substrates SB1 and SB2 on the lifter pins 12B move downward. In order to push down the ejector pin plate 11C and the retainer plate 11D in parallel, it is preferable to arrange about four set pins 16 at the four corners.

[0043] The upper die 20 mainly includes an upper die base 21E, an upper support plate 21D, a lower support plate 21C, an upper die chase 21B, and a pressure adjusting mechanism 9. The upper and lower support plates 21B and 21C are fixed to the upper die base 21E. The upper die chase 21B is fixed to the upper die base 21E via the upper support plate 21D and the lower support plate 21C. The pressure adjusting mechanism 9 adjusts the pressing force of the lower plunger PR1 of the press device 3 and transmits it to the works W1 and W2.

[0044] Various parts including the cavity plate 21A are fixed to the upper die chase 21B. In the illustrated example, the upper die chase 21B is provided with the cavity plate 21A, a side block 28 for fixing the cavity plate 21A, a heat insulating member 25 arranged to surround the upper and side surfaces of the cavity plate 21A, and a part of the pressure adjusting mechanism 9.

[0045] The cavity plate 21A is disposed at a position closest to the lower mold 10. A heater 24 is disposed inside the cavity plate 21A. The heater 24 heats the movable pieces 22Ac, 22Bc, 22Cc, and 22Dc (described later) through the cavity plate 21A. When the lower mold 10 and the upper mold 20 are closed, the heater 24 heats the electronic components CH11, CH12, CH21, and CH22 through the movable pieces 22Ac, 22Bc, 22Cc, and 22Dc and the film F. This heats the bonding materials SN11, SN12, SN21, and SN22.

[0046] The side block 28 is provided on the side of the upper die chase 21B facing the lower die 10. When viewed from above from the upper die 20, the side block 28 is provided on the outer side of the cavity plate 21A. The side block 28 is a portion of the upper die 20 that comes into contact with the lower die 10 when the lower die 10 and the upper die 20 are closed. In other words, when the lower die 10 and the upper die 20 are closed, the side block 28 comes into contact with the set pin 16. Note that when the lower die 10 and the upper die 20 are closed, the side block 28 may be spaced apart from the set pin 16.

[0047] The heat insulating member 25 is provided between the cavity plate 21A and the upper die chase 21B, and between the cavity plate 21A and the side block 28. The heat insulating member 25 suppresses direct heat conduction from the cavity plate 21A to the upper die chase 21B, and suppresses heat conduction from the cavity plate 21A to the upper die chase 21B via the side block 28. The heat insulating member 25 partitions the heater 24 and the internal space 23, thereby suppressing characteristic changes and thermal deterioration due to temperature rise of the viscous member 23V. In other words, the heat insulating member 25 speeds up the temperature rise by the heater 24 by limiting the heating target to the cavity plate 21A, and makes other members less susceptible to the effects of heat.

[0048] When performing the mounting process, a film F is stretched on the surface of the cavity plate 21A facing the lower die 10. The lower surface of the cavity plate is provided with suction holes (not shown) for sucking the film F and adsorbing the film F. The suction holes are connected to an external vacuum suction pump and the suction is controlled to be turned on and off.

[0049] Examples of film F that can be suitably used include film materials having excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), fluorine-impregnated glass cloth, PP (polypropylene), and PVDC (polyvinylidine chloride).

[0050] The film F prevents powder and gas generated from the bonding materials SN11, SN12, SN21, and SN22 from entering the gaps in the upper die 20, thereby suppressing malfunction of the upper die 20. In addition, the film F functions as a buffer between the movable pieces 22Ac, 22Bc, 22Cc, and 22Dc and the electronic components CH11, CH12, CH21, and CH22, and has the effect of suppressing damage to the electronic components CH11, CH12, CH21, and CH22 when pressure is applied.

[0051] The pressure adjusting mechanism 9 includes an upper plunger PR2 driven by a lower plunger PR1 of the press device 3, a viscous member 23V compressed by the upper plunger PR2, and movable mechanisms 22A, 22B, 22C, and 22D that pressurize the workpieces W1 and W2 by receiving pressure from the viscous member 23V. The various parts that make up the pressure adjusting mechanism 9 are arranged across an upper die chase 21E and upper and lower support plates 21B and 21C.

[0052] The movable mechanisms 22A, 22B, 22C, and 22D are connected to the internal space 23 and are configured to be movable up and down. The movable mechanisms 22A, 22B, 22C, and 22D have the upper die base 21E side as a base end and the lower die 10 side as a tip end. The movable mechanism 22A receives the internal pressure of the internal space 23, which is increased by the plunger PR pressing the viscous member 23V, at a base end connected to the internal space 23, and moves up and down. The movable mechanism 22A contacts the electronic component CH11 at a tip end via the film F, and pressurizes the electronic component CH11 by the internal pressure of the internal space 23 transmitted from the base end to the tip end. That is, the electronic component CH11 is pressurized by the movable mechanism 22A via the viscous member 23V based on the pressing force of the plunger PR pressing the viscous member 23V. As a result, the bonding material SN11 is pressurized by the movable mechanism 22A via the electronic component CH11.

[0053] Similarly, the electronic component CH12 is pressurized by the movable mechanism 22B through the viscous member 23V based on the pressing force of the plunger PR pressing the viscous member 23V, and the bonding material SN12 is pressurized by the movable mechanism 22B through the electronic component CH12. The electronic component CH21 is pressurized by the movable mechanism 22C through the viscous member 23V based on the pressing force of the plunger PR pressing the viscous member 23V, and the bonding material SN21 is pressurized by the movable mechanism 22C through the electronic component CH21. The electronic component CH21 is pressurized by the movable mechanism 22D through the viscous member 23V based on the pressing force of the plunger PR pressing the viscous member 23V, and the bonding material SN21 is pressurized by the movable mechanism 22D through the electronic component CH21. The internal pressure of the internal space 23 acting on each of the movable mechanisms 22A, 22B, 22C, and 22D is approximately equal regardless of the positions of the movable mechanisms 22A, 22B, 22C, and 22D in the opposing direction of the lower mold 10 and the upper mold 20. Therefore, the bonding materials SN11, SN12, SN21, and SN22 are pressurized with approximately equal pressure regardless of the difference in thickness of the boards SB1 and SB2, the difference in height of the electronic components CH11, CH12, CH21, and CH22, and the difference in thickness of the bonding materials SN11, SN12, SN21, and SN22.

[0054] The movable mechanism 22A has a piston 22Aa, a rod 22Ab, and a movable piece 22Ac. The movable mechanism 22B has a piston 22Ba, a rod 22Bb, and a movable piece 22Bc. The movable mechanism 22C has a piston 22Ca, a rod 22Cb, and a movable piece 22Cc. The movable mechanism 22D has a piston 22Da, a rod 22Db, and a movable piece 22Dc.

[0055] The piston 22Aa is provided at the base end of the movable mechanism 22A. The piston 22Aa is connected to the internal space 23. That is, the piston 22Aa is in contact with the viscous material 23V. The piston 22Aa is provided slidably relative to the upper die chase 21B and the lower support plate 21C. The piston 22Aa and the lower support plate 21C are in liquid-tight contact so that the viscous material 23V does not leak. The piston 22Aa receives the internal pressure of the internal space 23 that changes when the plunger RP presses the viscous material 23V, and moves in the vertical direction.

[0056] The rod 22Ab is provided between the piston 22Aa and the movable piece 22Ac. The rod 22Ab is provided slidably with respect to the cavity plate 21A, the upper die chase 21B, and the heat insulating member 25. The rod 22Ab is connected to the piston 22Aa at its base end, and its tip end is rounded like a bullet and is in point contact with the movable piece 22Ac. The rod 22Ab transmits pressure between the piston 22Aa and the movable piece 22Ac.

[0057] The movable piece 22Ac is provided at the tip of the movable mechanism 22A. The movable piece 22Ac is provided slidably relative to the cavity plate 21A. The tip of the movable piece 22Ac protrudes from the cavity plate 21A. The movable piece 22Ac is a movable nest that moves up and down and is prevented from falling. When the lower mold 10 and the upper mold 20 are closed, the tip of the movable piece 22Ac comes into contact with the upper surface of the electronic component CH11 via the film, and applies the pressure transmitted from the piston 22Aa to the electronic component CH11.

[0058] The structure and function of the pistons 22Ba, 22Ca, 22Da are similar to that of the piston 22Aa, so a description of the pistons 22Ba, 22Ca, 22Da will be omitted. The structure and function of the rods 22Bb, 22Cb, 22Db are similar to that of the rod 22Ab, so a description of the rods 22Bb, 22Cb, 22Db will be omitted. The structure and function of the movable pieces 22Bc, 22Cc, 22Dc are similar to that of the movable piece 22Ac, so a description of the movable pieces 22Bc, 22Cc, 22Dc will be omitted. The sides of the movable pieces 22Ac, 22Bc, 22Cc, 22Dc that come into contact with the electronic components CH11, CH12, CH21, CH22 are covered with a continuous film F.

[0059] The internal space 23 is formed between the lower support plate 21C and the upper support plate 21D. The pistons 22Aa, 22Ba, 22Ca, and 22D of the movable mechanisms 22A, 22B, 22C, and 22D, and the upper plunger PR2 of the plunger PR are connected to the internal space 23. That is, the inner wall of the internal space 23 is formed by the lower support plate 21C, the upper support plate 21D, the pistons 22Aa, 22Ba, 22Ca, and 22D, and the upper plunger PR2. The internal space 23 is independent from the external space of the upper mold 20. That is, the internal space 23 is a closed system in which the viscous member 23V does not enter or leave the upper mold 20.

[0060] The viscous member 23V is sealed in the internal space 23. The viscous member 23V is a fluid with a higher viscosity than water. For example, the viscosity coefficient of the viscous member 23V at 25°C is 1 Pa·s or more and 200 Pa·s or less. This allows the viscous member 23V to maintain sufficient viscosity even if the temperature of the viscous member 23V is increased by the heater 24. However, the viscosity coefficient of the viscous member 23V may be 1 Pa·s or more and 200 Pa·s or less in the temperature range in which the viscous member 23V is used. The material of the viscous member 23V is, for example, silicone oil, but is not limited thereto. Due to its viscosity, the viscous member 23V is less likely to leak from the gap between the lower support plate 21C and the upper plunger PR2 and the gap between the lower support plate 21C and the pistons 22Aa, 22Ba, 22Ca, and 22Da than water or air. In addition, since the compressibility of the viscous member 23V is smaller than that of a gas such as air, by sealing the viscous member 23V in the internal space 23 instead of a gas, the loss of the pressing force of the plunger PR in the internal space 23 can be reduced. The material of the viscous member 23V is preferably a material with excellent heat resistance. Specifically, the material of the viscous member 23V is preferably a material that has a small change in viscosity in the temperature change range of the upper chase 21B, the lower support plate 21C, and the upper support plate 21D when the heater 24 heats the cavity plate 21A.

[0061] The plunger PR is an example of a "pressure transmission mechanism" that presses the viscous member 23V sealed in the internal space 23 of the upper die 20. The plunger PR has a lower plunger PR1 and an upper plunger PR2.

[0062] The lower plunger PR1 is detachably mounted on a plunger unit, which is a known transfer drive source (not shown, see JP-A-9-155911, JP-A-2013-26360, and JP-A-2019-1122 as examples) provided at the bottom of a movable platen that moves the lower mold 10 up and down. In the case of normal transfer molding, a pressure equalizing mechanism is incorporated in the plunger unit, but in the case of the present invention, the pressure equalizing mechanism may not be necessary. The lower plunger PR1 is inserted into a through hole that penetrates the cavity plate 11A, the lower mold chase 11B, the ejector pin plate 11C, the retainer plate 11D, the heat insulating member 15, the support pillar 11E, and the lower mold base 11F. The lower plunger PR1 has a tip end on the upper mold 20 side and a base end on the opposite side. The tip end of the lower plunger PR1 has a larger diameter than the base end of the lower plunger PR1. In addition, a pot (not shown) may be provided in the lower die 10, and the tip of the lower plunger PR1 may be disposed and guided inside the pot. The lower plunger PR1 is configured to be movable up and down by a plunger unit (not shown). When the lower plunger PR1 moves down to the limit of its movable range, the tip of the lower plunger PR1 is housed in the cavity plate 11A, for example, but the top surface of the tip of the lower plunger PR1 may be at the same surface height as the top surface of the cavity plate 11A. The lower plunger PR1 and the upper plunger PR2 are disposed opposite each other, and when the lower plunger PR1 moves up, the tip of the lower plunger PR1 protrudes from the cavity plate 11A. When the lower die 10 and the upper die 20 are closed and the lower plunger PR1 moves up, the tip of the lower plunger PR1 abuts against the tip of the upper plunger PR2. When the lower plunger PR1 moves up further, the lower plunger PR1 presses the upper plunger PR2 upward. A base end portion of the lower plunger PR1 is connected to a plunger unit (not shown). The lower plunger PR1 is an example of a "first pressure transmitting portion."

[0063] The upper plunger PR2 is provided in the upper die 20. The upper plunger PR2 is inserted into a through hole that penetrates the cavity plate 21A, the upper die chase 21B, the lower support plate 21C, and the heat insulating member 25. The upper plunger PR2 has a tip end on the lower die 10 side and a base end on the opposite side. The base end (upper end surface) of the upper plunger PR2 has a larger diameter than the tip end of the upper plunger PR2 and is provided so as to be slidable relative to the upper die chase 21B and the lower support plate 21C. Note that a pot (not shown) may be provided in the upper die 20, and the base end of the upper plunger PR2 may be disposed inside the pot for guiding. The base end of the upper plunger PR2 is connected to the internal space 23. The tip end (lower end surface) of the upper plunger PR2 is exposed to the cavity plate 21A. The upper plunger PR2 is pressed by the lower plunger PR1 to press the viscous member 23V. The upper plunger PR2 is an example of a “second pressure transmitting portion.” The upper plunger PR2 is paired with the lower plunger PR1 to form a pair of plungers.

[0064] In the cross section shown in FIG. 1, only one lower plunger and one upper plunger are shown, but the plunger may have multiple lower plungers and multiple upper plungers. Such multiple lower plungers and multiple upper plungers are arranged, for example, in a line in the depth direction of FIG. 1. Each of the multiple upper plungers is paired with the same number of lower plungers, forming multiple pairs of plungers. The multiple pairs of plungers can transmit pressure independently of each other. However, the number of lower plungers may be different from the number of upper plungers. One upper plunger may be pressed by multiple lower plungers, or multiple upper plungers may be pressed by one lower plunger. Multiple upper plungers may be pressed by a smaller number of lower plungers, or multiple upper plungers may be pressed by a larger number of lower plungers. Thus, the plunger may have at least one lower plunger and at least one upper plunger. In addition, when the plunger has a plurality of upper plungers, the upper mold may have a plurality of internal spaces partitioned from each other and a plurality of viscous members sealed in each of the plurality of internal spaces. The plurality of internal spaces may be arranged, for example, in a line in the depth direction of the drawing of FIG. 1. Each of the plurality of viscous members may be pressed by a separate upper plunger. In such a configuration, even if electronic components are mounted on one board, the amount of pressure applied to the electronic components can be changed depending on the mounting position because the viscous members through which the electronic components are pressed are different.

[0065] The pressure transmission mechanism is not limited to the plunger PR having a lower plunger PR1 and an upper plunger PR2, and pressing the viscous member 23V from below the internal space 23. The pressure transmission mechanism may be configured to press the viscous member 23V from above the internal space 23, or may be configured to press the viscous member 23V from the lateral direction of the internal space 23. Here, the lateral direction is a direction intersecting the direction in which the lower mold 10 and the upper mold 20 face each other. The pressure transmission mechanism may be configured to press the viscous member 23V from multiple directions of the internal space 23.

[0066] The degassing chambers 31 and 32 are annular vacuum chambers that can be opened and closed and surround the lower mold 10 and the upper mold 20. The degassing chamber 31 is erected on the lower mold base 11F of the lower mold 10. When viewed from above from the upper mold 20, the degassing chamber 31 is provided outside the side block 18. A degassing path 33 through which the degassed gas passes is provided between the degassing chamber 31 and the lower mold chase 11B, the ejector pin plate 11C, the retainer plate 11D, the support pillar 11E, and the side block 18. The degassing chamber 32 is erected downward on the upper mold base 21E of the upper mold 20. When viewed from above from the lower mold 10, the degassing chamber 32 is provided outside the side block 28. A degassing path 34 through which the degassed gas passes is provided between the degassing chamber 32 and the upper mold chase 21B, the lower support plate 21C, the upper support plate 21D, and the side block 28. The degassing path 34 is connected to a degassing path 27 provided in the upper mold base 21E. The degassing path 27 is connected to a degassing port 29 provided in the upper mold base 21E. The degassing port 29 is connected to a vacuum pump outside the mold. The atmosphere of the lower mold 10 and the upper mold 20 in the degassing chambers 31, 32 is degassed by the degassing port 29.

[0067] <Implementation method> Next, a mounting method using the mounting device 1 according to this embodiment will be described with reference to Figs. 2 to 11. Figs. 2 and 3 are flowcharts showing a part of the mounting method according to one embodiment of the present invention. Fig. 4 is a graph showing a temperature profile of the mounting method according to one embodiment of the present invention. Figs. 5 to 11 are diagrams showing the mounting device in one step of the mounting method. In the graph of Fig. 4, the horizontal axis indicates time and the vertical axis indicates the temperature of the workpiece.

[0068] First, the lower die 10 and the upper die 20 are prepared (S11), and preheating of the lower die 10 and the upper die 20 is started (S12). As shown in Fig. 4, the temperatures of the workpieces W1 and W2 at this time are room temperature (RT).

[0069] Next, the workpieces W1 and W2 are placed on the lifter pins 12A and 12B (S13). Next, the degassing chambers 31 and 32 are closed to start degassing (S14), and the supply of nitrogen gas is started (S15). The bonding materials SN11, SN12, SN21, and SN22 are degassed before being heated to the sintering temperature, and the atmosphere is made of nitrogen gas, thereby suppressing oxidation of the bonding materials SN11, SN12, SN21, and SN22. As shown in FIG. 5, when the degassing chambers 31 and 32 are closed, the tip of the set pin 16 abuts against the side block 28 of the upper die 20. However, since the side blocks 18 and 28 of the lower die 10 and the upper die 20 are spaced apart from each other, the workpieces W1 and W2 are spaced apart above the cavity plate 11A. The substrates SB1 and SB2 are heated by thermal radiation from the cavity plate 11A of the lower die 10, and the electronic components CH11, CH12, CH21, and CH22 are heated little by little by thermal radiation although they are not in contact with the movable pieces 22Ac, 22Bc, 22Cc, and 22Dc of the upper die 20. As shown in Fig. 4, the temperature of the workpieces W1 and W2 at this time is about 100°C to 150°C.

[0070] Next, the mold is closed a little further, and the lifter pins 12A and 12B are lowered, and the substrates SB1 and SB2 are brought into contact with the cavity plate 11A of the lower mold 10 (S16). As shown in Fig. 6, as the lower mold 10 and the upper mold 20 approach each other, the tip of the set pin 16 comes into contact with the side block 28 of the upper mold 20, and the set pin 16 is pushed down. The pushed-down set pin 16 pushes down the ejector pin plate 11C and the retainer plate 11D connected to the base end of the set pin 16, and pushes down the lifter pins 12A and 12B whose base ends are connected to the ejector pin plate 11C and the retainer plate 11D. As a result, the workpieces W1 and W2 come into contact with the cavity plate 11A. The substrates SB1 and SB2 are heated by thermal conduction from the cavity plate 11A of the lower mold 10, and the electronic components CH11, CH12, CH21, and CH22 are heated by thermal radiation, although they are not in contact with the movable pieces 22Ac, 22Bc, 22Cc, and 22Dc of the upper mold 20. As shown in Fig. 4, the temperature of the workpieces W1 and W2 at this time is raised from a preheating temperature of 100°C to 150°C to a sintering treatment temperature of 250°C to 300°C.

[0071] Next, the lower die 10 and the upper die 20 are further closed, and the movable mechanisms 22A, 22B, 22C, and 22D come into contact with the electronic components CH11, CH12, CH21, and CH22 (S21). As shown in FIG. 7, the side blocks 18 and 28 of the lower die 10 and the upper die 20 come into contact with each other, and when the closing of the die is completed, the set pin 16 is pushed down to the maximum. The movable piece 22Ac of the movable mechanism 22A comes into contact with the electronic component CH11 via a film, and the piston 22Aa of the movable mechanism 22A is pushed up. The movable piece 22Bc of the movable mechanism 22B comes into contact with the electronic component CH12 via a film, and the piston 22Ba of the movable mechanism 22B is pushed up. The movable piece 22Cc of the movable mechanism 22C comes into contact with the electronic component CH21 via a film, and the piston 22Ca of the movable mechanism 22C is pushed up. The movable piece 22Dc of the movable mechanism 22D comes into contact with the electronic component CH22 via the film, and the piston 22Da of the movable mechanism 22D is pushed up. The depth of the pistons 22Aa, 22ba, 22Ca, and 22Da entering the internal space 23 differs from one another due to the difference in dimensions of the substrates SB1 and SB2, the bonding materials SN11, SN12, SN21, and SN22, and the electronic components CH11, CH12, CH21, and CH22. The contact of the movable mechanisms 22A, 22B, 22C, and 22D with the electronic components CH11, CH12, CH21, and CH22 improves the adhesion between the cavity plate 11A of the lower mold 10 and the substrates SB1 and SB2. Therefore, compared to step S16 in which the substrates SB1 and SB2 were placed on the cavity plate 11A, the efficiency of heat conduction from the lower mold 10 to the substrates SB1 and SB2 is improved, and the heating efficiency of the bonding materials SN11, SN12, SN21, and SN22 by the lower mold 10 is improved. Also, the electronic components CH11, CH12, CH21, and CH22 are heated by heat conduction from the movable pieces 22Ac, 22Bc, 22Cc, and 22Dc of the upper mold 20. Therefore, compared to steps S13 to S16 in which the electronic components CH11, CH12, CH21, and CH22 were heated by thermal radiation, the heating efficiency of the bonding materials SN11, SN12, SN21, and SN22 by the upper mold 20 is improved. As shown in FIG. 4, the temperature of the workpieces W1 and W2 at this time is raised from a preheating temperature of 100°C to 150°C to a sintering temperature of 250°C to 300°C.

[0072] Next, the viscous material 23V is pressed by the plunger PR (S22). As shown in FIG. 8, when the lower mold 10 and the upper mold 20 are closed, if the lower plunger PR1 is pressed up by a known transfer mechanism, the tip of the upper plunger PR2 comes into contact with the tip of the lower plunger PR1, and the upper plunger PR2 is pressed up by the lower plunger PR1. Note that, even if the lower plunger PR1 is not pressed up by the transfer mechanism when the lower mold 10 and the upper mold 20 are closed, the tip of the upper plunger PR2 may come into contact with the tip of the lower plunger PR1. The lower plunger PR1 presses the viscous material 23V with a predetermined pressing force via the upper plunger PR2. The internal pressure of the internal space 23, which is pressed and raised by the upper plunger PR2, is evenly applied to the pistons 22Aa, 22ba, 22Ca, and 22Da. The movable mechanism 22A moves based on the internal pressure of the internal space 23 applied to the piston 22Aa, i.e., the pressing force of the plunger PR, and pressurizes the electronic component CH11. Similarly, the movable mechanisms 22B, 22C, and 22D pressurize the electronic components CH12, CH21, and CH22. Pressurization of the electronic components CH11, CH12, CH21, and CH22 pressurizes the bonding materials SN11, SN12, SN21, and SN22. As shown in FIG. 4, the temperature of the workpieces W1 and W2 at this time is about 250°C to 300°C, which is the sintering treatment temperature. The bonding materials SN11, SN12, SN21, and SN22 are sintered by heating and pressing for a predetermined time. The sintered bonding material SN11 bonds the electronic component CH11 to the board SB1, the sintered bonding material SN12 bonds the electronic component CH12 to the board SB1, the sintered bonding material SN21 bonds the electronic component CH21 to the board SB2, and the sintered bonding material SN22 bonds the electronic component CH22 to the board SB2. In other words, the electronic components CH11 and CH12 are mounted on the board SB1, and the electronic components CH21 and CH22 are mounted on the board SB2.

[0073] Next, the plunger PR is lowered (S23). As shown in FIG. 9, the lower plunger PR1 is pulled down. The tip of the lower plunger PR1 separates from the tip of the upper plunger PR2. The viscous member 23V is released from the pressing force of the plunger PR and presses down the upper plunger PR2. As shown in FIG. 4, the temperature of the workpieces W1 and W2 at this time is about 250°C to 300°C, which is the sintering temperature. Note that in this process, the contact between the lower plunger PR1 and the upper plunger PR2 may be maintained, or the contact between the two plungers may be released in the mold opening process described later.

[0074] Next, the mold is opened to raise the lifter pins 12A and 12B, and the substrates SB1 and SB2 are separated from the cavity plate 11A of the lower mold 10 (S24). As shown in FIG. 10, the side block 28 of the upper mold 20 is separated from the side block 18 of the lower mold 10. The spring 17B applies an elastic force in a direction to move the ejector pin plate 11C closer to the lower mold chase 11B to which the base end (the screw-in side of the stepped bolt, the upper side) of the spring sleeve 17A is screwed. Since the position of the lower mold chase 11B is fixed by the support pillar 11E, the ejector pin plate 11C and the retainer plate 11D connected to the ejector pin plate 11C are pushed up. As a result, the ejector pin plate 11C and the retainer plate 11D are lifted up, and the lifter pins 12A and 12B, whose base ends are sandwiched between the ejector pin plate 11C and the retainer plate 11D, are also lifted up. The tips of the lifter pins 12A and 12B protrude from the cavity plate 11A and come into contact with the substrates SB1 and SB2, and the workpieces W1 and W2 move away from the cavity plate 11A. The gas supply port 13 supplies nitrogen gas toward the workpieces W1 and W2. The workpieces W1 and W2 are cooled by being separated from the cavity plate 11A, which is a heat source, and receiving the supply of nitrogen gas. As shown in FIG. 4, the temperature of the workpieces W1 and W2 at this time is about 250°C to 300°C, which is the sintering processing temperature.

[0075] Next, the supply of nitrogen gas is stopped, and degassing is stopped (S25). When the workpieces W1 and W2 are cooled to about 100°C to 150°C as shown in Fig. 4, the supply of nitrogen gas from the gas supply port 13 is stopped, and then degassing from the degassing port 29 is stopped as shown in Fig. 10. This completes the cooling of the workpieces W1 and W2 in the mounting device 1.

[0076] Finally, the mold is further opened, and the degassing chambers 31 and 32 are opened to remove the workpieces W1 and W2 (S26). As shown in Fig. 11, the degassing chambers 31 and 32 are separated from each other, and the workpieces W1 and W2 are released. The workpieces W1 and W2 are collected from above the lifter pins 12A and 12B.

[0077] Next, the configuration of a modified example of a mounting device according to an embodiment of the present invention will be described with reference to Fig. 12 and Fig. 13. Fig. 12 and Fig. 13 are diagrams showing an overall overview of a mounting device according to a modified example of the present invention. Note that the same or similar components are given the same or similar reference symbols, and their description will be omitted as appropriate. Also, similar actions and effects due to similar components will not be mentioned one by one.

[0078] The mounting device 200 shown in FIG. 12 mounts one electronic component CH3 on one board SB3 via one bonding material SN3. The mounting device 300 shown in FIG. 13 mounts multiple electronic components CH41, CH42 on one board SB4 by one movable mechanism 22E. The movable mechanism 22E presses the multiple electronic components CH41, CH42 simultaneously. According to the mounting device 300, even if the interval between the electronic components CH41 and 42 is narrow and it is difficult to provide multiple movable mechanisms for individually pressing the multiple electronic components CH41, CH42, it is possible to simultaneously press the multiple electronic components CH41, CH42. Note that the tip surface of the movable piece of the movable mechanism 22E may be provided with unevenness according to the heights of the multiple electronic components CH41, CH42. According to this, when the height of the electronic component CH41 and the height of the electronic component CH42 are different, the difference in pressure applied to each of the multiple electronic components CH41, CH42 by the movable mechanism 22E can be reduced. In addition, the tip surface of the movable piece of the movable mechanism 22E may be made of an elastic material. In this way, when the height of the electronic component CH41 and the height of the electronic component CH42 are different, the tip surface of the movable piece deforms according to the heights of the electronic components CH41, CH42, so that the difference in pressure applied to each of the electronic components CH41, CH42 by the movable mechanism 22E can be reduced.

[0079] In this way, the mounting device according to one embodiment of the present invention is not limited to a configuration in which multiple electronic components are mounted on one board, but may be configured to mount one or more electronic components on at least one board. Also, the mounting device according to one embodiment of the present invention is not limited to a configuration in which multiple electronic components are pressed by a corresponding number of movable mechanisms, but may be configured to press multiple electronic components by at least one movable mechanism.

[0080] Some or all of the embodiments of the present invention will be described below. Note that the present invention is not limited to the following descriptions.

[0081] [Appendix 1] A mounting device for mounting one or more electronic components on at least one board, comprising: a first mold configured to hold the board; a second mold arranged opposite the first mold, the second mold having at least one movable mechanism connected to an internal space of the second mold; and a pressure transmission mechanism that presses a viscous member sealed in the internal space of the second mold, wherein when the molds are closed, the electronic component is pressurized by the movable mechanism through the viscous member based on the pressing force with which the pressure transmission mechanism presses the viscous member.

[0082] According to this aspect, the internal pressure of the internal space of the second mold is changed by pressing the viscous member sealed in the internal space of the second mold by the pressure transmission mechanism. At least one movable mechanism moves based on the internal pressure of the internal space of the second mold and pressurizes at least one electronic component. Therefore, by adjusting the pressing force of the pressure transmission mechanism, the pressure applied by the at least one movable mechanism to the at least one electronic component can be adjusted. Therefore, it is possible to suppress the occurrence of mounting defects caused by excess or deficiency of pressure applied to the electronic component. For example, even if the heights of the multiple electronic components or the thicknesses of the multiple boards change, it is possible to apply an appropriate pressure to the electronic component. In addition, the viscous member that moves the movable mechanism is sealed in the internal space of the second mold, and does not flow in from the outside of the second mold, nor does it flow out to the outside of the second mold. Therefore, it is possible to achieve a smaller size than a mounting device that moves the movable mechanism via a fluid supplied from the outside of the second mold.

[0083] [Appendix 2] The pressure transmission mechanism has a first pressure transmission part provided in the first mold and a second pressure transmission part provided in the second mold and connected to the internal space of the second mold, and the second pressure transmission part is pressed by the first pressure transmission part to press the viscous member.A mounting device described in [Appendix 1].

[0084] According to this embodiment, the second mold can be made of a mold and a press machine used in transfer molding.

[0085] [Appendix 3] The at least one electronic component is a plurality of electronic components including a first electronic component and a second electronic component adjacent to the first electronic component, and the at least one movable mechanism is a plurality of movable mechanisms including a first movable mechanism and a second movable mechanism, and when the first mold and the second mold are closed, the first electronic component is pressurized by the first movable mechanism via the viscous member based on the pressing force of the pressure transmission mechanism pressing the viscous member, and the second electronic component is pressurized by the second movable mechanism, thereby mounting the plurality of electronic components on one substrate.

[0086] According to this aspect, since the first and second movable mechanisms are movable based on the internal pressure of the internal space of the second mold, the pressures applied by the first and second movable mechanisms to the first and second electronic components do not depend on the positions of the first and second movable mechanisms. In other words, even if the positions of the first and second movable mechanisms are different from each other, the first and second movable mechanisms receive the internal pressure of the internal space approximately equally and simultaneously pressurize the first and second electronic components based on the internal pressure of the received internal space. Therefore, the difference between the pressure applied to the first electronic component and the pressure applied to the second electronic component can be reduced. For example, even if the heights of the first and second electronic components are different or the thickness of the board varies depending on the positions of the first and second electronic components, the first and second electronic components can be simultaneously pressurized with approximately the same pressure.

[0087] [Appendix 4] The mounting device described in [Appendix 1] or [Appendix 2], wherein the at least one electronic component is a plurality of electronic components including a first electronic component and a second electronic component adjacent to the first electronic component, and the at least one movable mechanism is a plurality of movable mechanisms including a first movable mechanism, and when the first mold and the second mold are closed, the first electronic component and the second electronic component are pressurized by the first movable mechanism via the viscous member based on the pressing force with which the pressure transmission mechanism presses the viscous member, thereby mounting the plurality of electronic components on one substrate.

[0088] According to this embodiment, even if the distance between the first electronic component and the second electronic component is narrow, the first electronic component and the second electronic component can be mounted at the same time.

[0089] [Appendix 5] The mounting device according to any one of [Appendix 1] to [Appendix 4], wherein the viscous material is silicone oil.

[0090] [Appendix 6] A mounting device described in any one of [Appendix 1] to [Appendix 5], wherein at least one movable mechanism has at least one piston connected to the internal space of the second mold and movable by receiving the internal pressure of the internal space, and at least one movable piece that applies the pressure transmitted from the at least one piston to at least one electronic component, and the second mold further has a heater that heats the at least one movable piece, and a heat-insulating member that separates the heater from the internal space.

[0091] According to this aspect, when the heater heats at least one movable piece, it is possible to suppress a rise in temperature of the viscous member, and therefore it is possible to suppress a change in the characteristics of the viscous member and thermal deterioration.

[0092] [Appendix 7] A mounting device described in any one of [Appendix 1] to [Appendix 6], wherein at least one of the first mold and the second mold has a gas supply port that supplies an inert gas toward at least one electronic component and at least one substrate.

[0093] According to this aspect, when the at least one electronic component and the at least one substrate are heated, the oxidizing gas can be quickly removed from the surroundings of the at least one electronic component and the at least one substrate, and an inert gas atmosphere can be created. Therefore, poor bonding caused by oxidation of the bonding material can be suppressed. In addition, when the at least one electronic component and the at least one substrate are cooled, gas cooling can be performed by applying an inert gas to the at least one electronic component and the at least one substrate. Since the cooling speed of the mounted product is improved, the time required to remove the mounted product from the mounting device is shortened, and production efficiency can be improved.

[0094] [Appendix 8] A mounting apparatus described in any one of [Appendix 1] to [Appendix 7], further comprising an openable and closable degassing chamber surrounding the first mold and the second mold.

[0095] According to this embodiment, the at least one electronic component and the at least one substrate can be placed in a vacuum atmosphere or an inert gas atmosphere, so that oxidation can be suppressed. Therefore, the at least one electronic component and the at least one substrate can be heated to a high temperature.

[0096] [Appendix 9] A mounting device described in any one of [Appendix 1] to [Appendix 8], wherein the first mold has a cavity plate provided on the side facing the second mold, and a holding portion configured to be movable forward and backward from the cavity plate relative to the second mold and holding at least one substrate, wherein when the first mold and the second mold are in an open state, the holding portion advances into the space between the first mold and the second mold, and the at least one substrate supported by the holding portion is separated from the cavity plate, and when the first mold and the second mold are in a closed state, the holding portion retreats from the space between the first mold and the second mold, and the at least one substrate is supported in contact with the cavity plate.

[0097] [Appendix 10] A mounting device described in any one of [Appendix 1] to [Appendix 9], in which, when performing the mounting process, a film is stretched on the surface of the second mold facing the first mold, and the movable mechanism contacts the electronic component at its tip via the film.

[0098] [Appendix 11] A mounting device described in [Appendix 2], wherein the first pressure transmission unit has one or more lower plungers, the second pressure transmission unit has upper plungers in the same number as the lower plungers, and the lower plungers and the upper plungers are arranged opposite each other to form a pair.

[0099] [Appendix 12] The mounting apparatus is a sintering apparatus, the mounting apparatus being described in any one of [Appendix 1] to [Appendix 11].

[0100] According to this aspect, even in a sintering device that requires high temperature and high pressure, the difference between the pressure applied to the first electronic component and the pressure applied to the second electronic component can be reduced, thereby suppressing the occurrence of mounting defects.

[0101] [Appendix 13] A mounting method for mounting one or more electronic components on at least one substrate, the mounting method including: preparing a first mold configured to hold a substrate on which an electronic component is placed; preparing a second mold arranged opposite the first mold, the second mold having a plurality of movable mechanisms connected to an internal space of the second mold; and preparing a pressure transmission mechanism that presses a viscous material sealed in the internal space of the second mold, the plurality of electronic components including a first electronic component and a second electronic component, and the plurality of movable mechanisms including a first movable mechanism and a second movable mechanism, the mounting method further including: closing the first mold and the second mold, pressing the viscous material with the pressure transmission mechanism, and, when the first mold and the second mold are closed, pressurizing the electronic components with the movable mechanism via the viscous material based on the pressing force with which the pressure transmission mechanism presses the viscous material.

[0102] According to this aspect, the internal pressure of the internal space of the second mold is changed by pressing the viscous member sealed in the internal space of the second mold by the pressure transmission mechanism. At least one movable mechanism moves based on the internal pressure of the internal space of the second mold and pressurizes at least one electronic component. Therefore, by adjusting the pressing force of the pressure transmission mechanism, the pressure applied by the at least one movable mechanism to the at least one electronic component can be adjusted. Therefore, it is possible to suppress the occurrence of mounting defects caused by excess or deficiency of pressure applied to the electronic component. For example, even if the heights of the multiple electronic components or the thicknesses of the multiple boards change, it is possible to apply an appropriate pressure to the electronic component. In addition, the viscous member that moves the movable mechanism is sealed in the internal space of the second mold, and does not flow in from the outside of the second mold, nor does it flow out to the outside of the second mold. Therefore, it is possible to achieve a smaller size than a mounting device that moves the movable mechanism via a fluid supplied from the outside of the second mold.

[0103] As described above, it is possible to provide a compact mounting device capable of suppressing the occurrence of mounting defects and a mounting method using the same.

[0104] The above-described embodiments are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangements, materials, conditions, shapes, sizes, etc., are not limited to those illustrated, and can be changed as appropriate. In addition, configurations shown in different embodiments can be partially substituted or combined with each other. [Explanation of symbols]

[0105] 1...Mounting device 10…Lower mold 11A…Cavity plate 11B...Lower Chase 11C…Ejector pin plate 11D…Retainer plate 11E…Support pillar 11F…Lower base 12A, 12B... Lifter pins 13…Gas supply port 14…Heater 15…Heat insulation material 16...Set pin 17A…Spring sleeve 17B…Spring 18…Side block 20…Upper mold 21A…Cavity plate 21B…Upper Chase 21C…Lower support plate 21D…Upper support plate 21E…Upper base 22A, 22B, 22C, 22D…Movable mechanism 22Aa, 22Ba, 22Ca, 22Da...Piston 22Ab, 22Bb, 22Cb, 22Db…Rod 22Ac, 22Bc, 22Cc, 22Dc...Movable pieces 23…Interior space 23V…Viscous material 24…Heater 25…Heat insulation material 27…Vacuum path 28…Side block 29…Ventilator 31, 32…Degassing chamber 33, 34…Vacuum path PR…Plunger PR1…Lower plunger PR2...Upper plunger

Claims

1. A mounting apparatus for mounting one or more electronic components on at least one substrate, comprising: A first mold configured to hold the substrate on which the electronic component is placed; A second mold disposed opposite to the first mold and having at least one movable mechanism connected to an internal space of the second mold; a pressure transmission mechanism that presses a viscous member sealed in the internal space of the second mold; Equipped with when the first mold and the second mold are closed, the electronic component is pressed by the movable mechanism through the viscous member based on a pressing force applied by the pressure transmission mechanism to the viscous member. Mounting equipment.

2. The pressure transmission mechanism includes: A first pressure transmitting portion provided in the first mold; a second pressure transmitting portion provided in the second mold and connected to the internal space of the second mold; having the second pressure transmission portion is pressed by the first pressure transmission portion to press the viscous member; The mounting device according to claim 1 .

3. the at least one electronic component is a plurality of electronic components including a first electronic component and a second electronic component adjacent to the first electronic component, the at least one movable mechanism is a plurality of movable mechanisms including a first movable mechanism and a second movable mechanism; in a state in which the first mold and the second mold are closed, the first electronic component is pressurized by the first movable mechanism and the second electronic component is pressurized by the second movable mechanism via the viscous member based on the pressing force applied by the pressure transmission mechanism to the viscous member, Mounting the plurality of electronic components on one substrate; The mounting device according to claim 1 .

4. the at least one electronic component is a plurality of electronic components including a first electronic component and a second electronic component adjacent to the first electronic component, the at least one movable mechanism is a plurality of movable mechanisms including a first movable mechanism, in a state in which the first mold and the second mold are closed, the first electronic component and the second electronic component are pressurized by the first movable mechanism through the viscous member based on the pressing force applied by the pressure transmission mechanism to the viscous member, Mounting the plurality of electronic components on one substrate; The mounting device according to claim 1 .

5. The viscous material is silicone oil. The mounting device according to claim 1 .

6. The at least one movable mechanism includes: At least one piston connected to the internal space of the second mold and movable by receiving the internal pressure of the internal space; at least one movable piece that applies pressure transmitted from the at least one piston to the at least one electronic component; having The second mold is a heater for heating the at least one movable piece; a heat insulating member that separates the heater from the internal space; Further comprising The mounting device according to claim 1 .

7. At least one of the first mold and the second mold has a gas supply port for supplying an inert gas toward the at least one electronic component and the at least one substrate. The mounting device according to claim 1 .

8. Further comprising an openable and closable degassing chamber surrounding the first mold and the second mold. The mounting device according to claim 1 .

9. The first mold is a cavity plate provided on a side facing the second mold; a holding part configured to be movable from the cavity plate to the second mold and holding the at least one substrate; having When the first mold and the second mold are opened, the holding portion advances into a space between the first mold and the second mold, and the at least one substrate supported by the holding portion is separated from the cavity plate; When the first mold and the second mold are closed, the holding portion is withdrawn from a space between the first mold and the second mold, and the at least one substrate is supported in contact with the cavity plate. The mounting device according to claim 1 .

10. When performing the mounting process, a film is stretched on a surface of the second mold facing the first mold, the movable mechanism contacts the electronic component at a tip portion via the film; The mounting device according to claim 1 .

11. The first pressure transmission portion has one or more lower plungers, The second pressure transmission portion has upper plungers in the same number as the lower plungers, The lower plunger and the upper plunger are disposed opposite each other to form a pair. The mounting device according to claim 2 .

12. The mounting apparatus is a sintering apparatus. The mounting device according to claim 1 .

13. A mounting method for mounting one or more electronic components on at least one substrate, comprising the steps of: providing a first mold configured to hold the substrate on which the electronic component is placed; preparing a second mold disposed opposite to the first mold, the second mold having at least one movable mechanism connected to an internal space of the second mold; providing a pressure transmission mechanism for pressing a viscous member sealed in the internal space of the second mold; Including, The mounting method includes: closing the first mold and the second mold; pressing the viscous member by the pressure transmission mechanism; pressurizing the electronic component by the movable mechanism through the viscous member based on a pressing force applied by the pressure transmission mechanism to the viscous member in a state in which the first mold and the second mold are closed; Further comprising: How to implement it.

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