Electronic component and manufacturing method thereof

Abstract

To provide an electronic component and a manufacturing method thereof capable of reducing the electrical resistance of a coil.SOLUTION: An electronic component according to an embodiment of the present invention includes a substrate and a coil portion that is annular in a plan view in a thickness direction of the substrate, the coil portion includes a first wiring layer having a coil pattern formed on a first substrate surface of both end faces in the thickness direction of the substrate, a second wiring layer having a coil pattern formed on a second substrate surface different from the first substrate surface of both end faces of the substrate, and a conductive portion that covers each surface of the first wiring layer and the second wiring layer and electrically connects the first wiring layer and the second wiring layer through a via hole that penetrates the substrate.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to an electronic component and a method for manufacturing the same. [Background technology]

[0002] Conventionally, in the field of electronic components such as inductors, as electronic devices become smaller and more functional, developments have been made to reduce the size and reduce the resistance of electronic components mounted on the electronic devices. For example, Patent Document 1 discloses an electronic component (power inductor) in which a coil is embedded inside a body containing metal powder and insulating resin.

[0003] In the electronic component described in Patent Document 1, a coil is formed by forming a first metal plating film having a spiral coil pattern and a second metal plating film covering the top and side surfaces of the first metal plating film on both the top and bottom surfaces of a substrate. The coil is disposed inside a body containing metal powder and insulating resin. The spiral ends of the coil are exposed on two opposing side surfaces of the body, and external electrodes are provided on the two side surfaces so as to contact the ends. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2021-103796 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the electronic component described in the above-mentioned Patent Document 1, the first metal plating film on the upper surface side of the substrate and the first metal plating film on the lower surface side are electrically connected through via holes formed in the substrate, thereby electrically connecting the coil pattern wirings on both the upper and lower surfaces of the substrate. In this connection, it is preferable to fill the first metal plating film all around the opening edge of the via hole. When the first metal plating film is formed in this manner, the opening area of ​​the via hole is limited by the width of the first metal plating film, so it is difficult to reduce the electrical resistance (connection resistance) between the coil pattern wirings through the via hole.

[0006] The present invention has been made in consideration of the above circumstances, and has an object to provide an electronic component capable of reducing the electrical resistance of a coil, and a manufacturing method thereof. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, the electronic component of the present invention comprises a substrate and a coil portion that is annular in a planar view seen from a thickness direction of the substrate, the coil portion comprising a first wiring layer having a coil pattern formed on a first substrate surface among both end faces in the thickness direction of the substrate, a second wiring layer having a coil pattern formed on a second substrate surface different from the first substrate surface among both end faces of the substrate, and a conductive portion covering each surface of the first wiring layer and the second wiring layer and electrically connecting the first wiring layer and the second wiring layer through a via hole that penetrates the substrate.

[0008] In addition, the electronic component of the present invention is characterized in that, in the above invention, the coil portion comprises a first via pad portion having a maximum width less than the wiring width of the first wiring layer, forming one end portion in the wiring direction of the first wiring layer, and surrounding an opening of the via hole on the first substrate surface side, and a second via pad portion having a maximum width less than the wiring width of the second wiring layer, forming one end portion in the wiring direction of the second wiring layer, and surrounding an opening of the via hole on the second substrate surface side.

[0009] In addition, the electronic component of the present invention is characterized in that, in the above invention, each of the coil patterns of the first wiring layer and the second wiring layer has a spiral shape when viewed in a planar view from the thickness direction of the base material, and the conductive portion contacts one end of the spiral shape of the first wiring layer and one end of the spiral shape of the second wiring layer through the via hole.

[0010] In addition, the electronic component according to the present invention is characterized in that, in the above invention, it further comprises an insulating layer covering a surface of the conductive portion.

[0011] In addition, the electronic component of the present invention, in the above invention, further comprises a main body portion containing magnetic powder and containing the coil portion, a first external electrode provided on the outer surface of the main body portion and electrically connected to the first wiring layer, and a second external electrode provided on the outer surface of the main body portion in a pair with the first external electrode and electrically connected to the second wiring layer.

[0012] In addition, the electronic component of the present invention is characterized in that, in the above invention, the main body portion encapsulates the coil portion in a manner that exposes a connection end portion with the first external electrode of the first wiring layer and a connection end portion with the second external electrode of the second wiring layer.

[0013] In addition, the electronic component of the present invention, in the above invention, further comprises: an extraction wiring portion spaced apart from the second wiring layer and extending from the second substrate surface in a thickness direction of the substrate; an electrode conductive portion covering a surface of a connection end of the first wiring layer that overlaps with the extraction wiring portion in a planar view seen in the thickness direction of the substrate and a surface of the extraction wiring portion, and electrically connecting the connection end and the extraction wiring portion through an electrode via hole penetrating the substrate; a first internal terminal electrically connecting the first wiring layer and the first external electrode through the electrode conductive portion; and a second internal terminal electrically connecting the second wiring layer and the second external electrode through the conductive portion covering a surface of a connection end of the second wiring layer that forms a pair with the connection end of the first wiring layer.

[0014] In addition, the electronic component of the present invention, in the above invention, further comprises a first base layer formed on the first substrate surface and a second base layer formed on the second substrate surface, the first base layer being interposed between the first substrate surface and the first wiring layer, and the second base layer being interposed between the second substrate surface and the second wiring layer.

[0015] In addition, the electronic component of the present invention is characterized in that, in the above invention, the first base layer has the same coil pattern as the first wiring layer, and the second base layer has the same coil pattern as the second wiring layer.

[0016] In addition, the electronic component of the present invention is characterized in that, in the above invention, the first underlayer and the second underlayer are conductor layers containing at least one of nickel, chromium and titanium, and the first wiring layer, the second wiring layer and the conductive portion are conductor layers containing copper.

[0017] In addition, the electronic component of the present invention is characterized in that, in the above invention, the conductive portion has a first coating layer covering a surface of the first wiring layer, a second coating layer covering a surface of the second wiring layer, and a via conductor portion filled inside the via hole.

[0018] Furthermore, a method for manufacturing an electronic component according to the present invention includes a base layer forming step of forming a base layer on a first substrate surface at one end side in a thickness direction of the substrate and a second substrate surface at the other end side; a pattern forming step of forming a coil pattern on the base layer on the first substrate surface and the base layer on the second substrate surface; a first plating step of plating a surface of the base layer forming the coil pattern on the first substrate surface to form a first wiring layer having a first opening leading to the first substrate surface, and plating a surface of the base layer forming the coil pattern on the second substrate surface to form a second wiring layer having a second opening leading to the second substrate surface at a position overlapping with the first opening in the thickness direction of the substrate; a via hole forming step of forming via holes penetrating the substrate inside each of the first opening and the second opening; and a second plating step of plating a conductor layer covering each surface of the first wiring layer and the second wiring layer, while filling the interior of the via hole with a via conductor portion grown from the conductor layer, thereby electrically connecting the first wiring layer and the second wiring layer.

[0019] In addition, in the method for producing an electronic component according to the present invention, in the above invention, the via hole forming step forms the via hole by laser processing or etching. Effect of the Invention

[0020] Advantageous Effects of Invention According to the present invention, it is possible to provide an electronic component capable of reducing the electrical resistance of a coil, and a manufacturing method thereof. [Brief description of the drawings]

[0021] [Figure 1] FIG. 1 is a perspective view showing a configuration example of an electronic component according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic cross-sectional view showing a configuration example of the electronic component shown in FIG. 1 taken along line AA. [Diagram 3] FIG. 3 is a schematic cross-sectional view showing a configuration example of the electronic component shown in FIG. 1 taken along line BB. [Figure 4]FIG. 4 is a schematic cross-sectional view showing a configuration example of the electronic component shown in FIG. 2 taken along line CC. [Diagram 5] FIG. 5 is a schematic cross-sectional view showing a configuration example of the electronic component shown in FIG. 2 taken along line DD. [Figure 6] FIG. 6 is a schematic cross-sectional view showing a configuration example of the electronic component shown in FIG. 4 taken along line EE. [Figure 7] FIG. 7 is a flow diagram showing an example of a method for manufacturing the coil portion according to the first embodiment of the present invention. [Figure 8] FIG. 8 is a flow diagram showing an example of a method for manufacturing an electronic component including a coil portion according to the first embodiment of the present invention. [Figure 9A] FIG. 9A is a schematic diagram showing an example of a coil pattern formed on a first underlayer on a first substrate surface. [Figure 9B] FIG. 9B is a schematic diagram showing an example of a coil pattern formed on the second underlayer on the second substrate surface. [Figure 10] FIG. 10 is a schematic cross-sectional view showing a configuration example of an electronic component according to the second embodiment of the present invention. [Figure 11] FIG. 11 is a schematic cross-sectional view showing a configuration example of the electronic component shown in FIG. 10 taken along the line FF. [Figure 12] FIG. 12 is a flow diagram showing an example of a method for manufacturing a coil portion according to the second embodiment of the present invention. [Figure 13] FIG. 13 is a flow diagram showing an example of a method for manufacturing an electronic component provided with a coil portion according to the second embodiment of the present invention. [Figure 14] FIG. 14 is a schematic cross-sectional view showing a configuration example of an electronic component according to a modified example of the first embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Hereinafter, preferred embodiments of an electronic component and a method for manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings. Note that the present invention is not limited to the present embodiment. It should be noted that the drawings are schematic, and the dimensional relationships and ratios of each element may differ from the actual ones. The drawings may also include parts with different dimensional relationships and ratios. In addition, the same components are denoted by the same reference numerals in each drawing.

[0023] (Embodiment 1) First, the configuration of the electronic component according to the first embodiment of the present invention will be described. FIG. 1 is a perspective view showing a configuration example of the electronic component according to the first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing a configuration example of the AA line cross-section of the electronic component shown in FIG. 1. FIG. 3 is a schematic cross-sectional view showing a configuration example of the BB line cross-section of the electronic component shown in FIG. 1. FIG. 4 is a schematic cross-sectional view showing a configuration example of the CC line cross-section of the electronic component shown in FIG. 2. FIG. 5 is a schematic cross-sectional view showing a configuration example of the DD line cross-section of the electronic component shown in FIG. 2. FIG. 6 is a schematic cross-sectional view showing a configuration example of the EE line cross-section of the electronic component shown in FIG. 4. FIG. 6 shows a partial cross-sectional view showing an enlarged electrical connection structure between the first wiring layer 20 and the second wiring layer 25 constituting the coil portion 3 of the electronic component 1 according to the first embodiment of the present invention.

[0024] The electronic component 1 according to the first embodiment of the present invention is, for example, an inductor, and includes a substrate 2, a coil portion 3 formed on the substrate 2, a main body portion 4 containing the coil portion 3, an exterior coat 5 covering the outer surface of the main body portion 4, and a pair of external electrodes (a first external electrode 6 and a second external electrode 7). As shown in FIGS. 2 to 6, the coil portion 3 includes a first wiring layer 20 on one end surface side in the thickness direction of the substrate 2 and a second wiring layer 25 on the other end surface side, and a conductive portion 30 that electrically connects the first wiring layer 20 and the second wiring layer 25 through a via hole 13 formed in the substrate 2. Furthermore, the coil portion 3 includes a first underlayer 41 interposed between the substrate 2 and the first wiring layer 20, a second underlayer 42 interposed between the substrate 2 and the second wiring layer 25, and a first insulating layer 51 and a second insulating layer 52 that cover the surface of the conductive portion 30.

[0025] In this specification, for convenience of explanation, an X direction, a Y direction, and a Z direction of the electronic component 1 are set. Specifically, as shown in FIG. 1, the X direction is one of the directions (hereinafter referred to as a lateral direction) perpendicular to the up-down direction of the electronic component 1. The Y direction is one of the lateral directions of the electronic component 1 and perpendicular to the X direction. The Z direction is the up-down direction of the electronic component 1. The thickness direction of the substrate 2 is the same direction as the Z direction. Hereinafter, the thickness direction of the substrate 2 may be abbreviated as substrate thickness direction or thickness direction.

[0026] The substrate 2 is an insulating substrate on which the coil portion 3 is formed. In detail, as shown in FIGS. 2 and 3, the substrate 2 has a first substrate surface 11 on which the first wiring layer 20 of the coil portion 3 is formed, and a second substrate surface 12 on which the second wiring layer 25 of the coil portion 3 is formed. The first substrate surface 11 is one of both end surfaces in the substrate thickness direction. The second substrate surface 12 is the other end surface of both end surfaces, and is an end surface different from the first substrate surface 11 (the end surface opposite in the substrate thickness direction). Also, as shown in FIGS. 3 and 6, the substrate 2 has a via hole 13 for electrically connecting the first wiring layer 20 and the second wiring layer 25 of the coil portion 3. The via hole 13 is formed to penetrate the substrate 2 within a predetermined region of the substrate 2 that overlaps with both the first via pad portion 21 of the first wiring layer 20 and the second via pad portion 26 of the second wiring layer 25 in the substrate thickness direction. The shape of the via hole 13 is not particularly limited, and may be, for example, circular, oval such as an ellipse or a rounded rectangle, or rectangular when viewed in a plan view from the thickness direction of the substrate.

[0027] The base material 2 may be a rigid base material such as a glass epoxy base material, but is preferably a flexible base material from the viewpoint of miniaturization of the coil portion 3. Examples of the constituent material of the base material 2 include insulating materials such as polyimide and paraxylene-based polymer (parylene).

[0028] The coil portion 3 is a conductor unit having a ring shape in a plan view seen from the thickness direction of the substrate, and is disposed inside the main body portion 4 as shown in Fig. 1. In detail, as shown in Figs. 2 and 3, the coil portion 3 includes a first wiring layer 20 on the first substrate surface 11, a second wiring layer 25 on the second substrate surface 12, and a conductive portion 30 that electrically connects the first wiring layer 20 and the second wiring layer 25.

[0029] The first wiring layer 20 is a conductor layer having a coil pattern formed on the first substrate surface 11 of the substrate 2, as shown in Figs. 2 to 4. In detail, the first wiring layer 20 is formed on the first substrate surface 11, as shown in Figs. 2 to 4, by performing metal plating on a substrate layer (first substrate layer 41 shown in Fig. 6) formed in a coil pattern on the first substrate surface 11. The coil pattern of the first wiring layer 20 has a spiral shape in a plan view seen from the substrate thickness direction (direction perpendicular to the paper surface of Fig. 4), as shown in Fig. 4, for example, and more specifically, has a spiral shape wound with multiple turns around a central axis (not shown) parallel to the Z direction (see Fig. 1) of the electronic component 1. In addition, examples of the conductor constituting the first wiring layer 20 include metals such as copper and iron, and alloys containing one or more of these metals. From the viewpoint of ease of forming the coil pattern, the first wiring layer 20 is preferably a conductor layer containing copper.

[0030] 2 to 4, the first wiring layer 20 includes a first via pad portion 21. The first via pad portion 21 is a region of the first wiring layer 20 that includes the via hole 13 of the substrate 2 in a plan view from the substrate thickness direction, and forms one end of the first wiring layer 20 in the wiring direction (for example, an inner peripheral end of a spiral coil pattern) as shown in FIG. 4. In the present embodiment 1, the wiring direction of the first wiring layer 20 is the longitudinal direction (swirl direction) of the spiral coil pattern. As shown in FIG. 4, the first via pad portion 21 has a first opening 23 formed therein. As shown in FIG. 6, the first via pad portion 21 surrounds the opening of the via hole 13 on the first substrate surface 11 side inside the first opening 23. At this time, the first opening 23 of the first via pad portion 21 includes the entire area of ​​the via hole 13 in a plan view from the substrate thickness direction, and preferably coincides with the via hole 13.

[0031] The first via pad portion 21 as described above may have a width larger than the wiring width of the first wiring layer 20 by being formed to have a shape such as a circle in a plan view seen from the thickness direction of the substrate. However, from the viewpoint of reducing the magnetic flux loss of the coil portion 3, it is preferable that the first via pad portion 21 is formed to have a maximum width equal to or smaller than the wiring width of the first wiring layer 20, as shown in FIG. 4, for example. From the viewpoint of reducing the electrical resistance (DC resistance) between the first wiring layer 20 and the second wiring layer 25 of the coil portion 3, it is preferable that the first opening 23 of the first via pad portion 21 is formed so that its opening area is maximized up to the area of ​​the first via pad portion 21 (the area of ​​the first via pad portion 21 in a plan view seen from the thickness direction of the substrate), as shown in FIG. 4, for example.

[0032] 2 and 4, the first wiring layer 20 includes a first connection end 22. The first connection end 22 is an end on the opposite side to the first via pad portion 21 in the wiring direction of the first wiring layer 20, and forms an outer peripheral end of a spiral coil pattern as shown in Fig. 4, for example. This first connection end 22 is exposed from one side surface (one end surface in the X direction) of the main body portion 4 as shown in Figs. 2 and 4, for example, and is electrically connected to the first external electrode 6 provided on that side surface.

[0033] The second wiring layer 25 is a conductor layer having a coil pattern formed on the second substrate surface 12 of the substrate 2, as shown in FIGS. 2, 3, and 5. In detail, the second wiring layer 25 is formed on the second substrate surface 12 by performing metal plating on a substrate layer (second substrate layer 42 shown in FIG. 6) formed in a coil pattern on the second substrate surface 12, as shown in FIGS. 2, 3, and 5. The coil pattern of the second wiring layer 25 has a spiral shape wound with multiple turns around a central axis parallel to the Z direction of the electronic component 1 in a plan view seen from the substrate thickness direction (direction perpendicular to the paper surface of FIG. 5), as shown in FIG. 5, for example. Specifically, the coil pattern of the second wiring layer 25 has a spiral shape in which the coil pattern of the first wiring layer 20 shown in FIG. 4 is inverted in the X direction of the electronic component 1 (left-right direction on the paper surface of FIG. 4). The conductor constituting the second wiring layer 25 is the same as that of the first wiring layer 20 described above.

[0034] 2, 3, and 5, the second wiring layer 25 includes a second via pad portion 26 corresponding to the first via pad portion 21 of the first wiring layer 20 described above. The second via pad portion 26 is a region of the second wiring layer 25 that includes the via hole 13 of the substrate 2 and overlaps with the first via pad portion 21 of the first wiring layer 20 in a plan view seen from the substrate thickness direction. As shown in FIG. 5, the second via pad portion 26 forms one end portion of the wiring direction of the second wiring layer 25 (for example, an inner peripheral end portion of a spiral-shaped coil pattern). In the present embodiment 1, the wiring direction of the second wiring layer 25 is the longitudinal direction (spiral direction) of the spiral-shaped coil pattern. As shown in FIG. 5, the second via pad portion 26 has a second opening 28 formed therein. As shown in FIG. 6, the second via pad portion 26 surrounds the opening of the via hole 13 on the second substrate surface 12 side inside the second opening portion 28. In this case, the second opening 28 of the second via pad portion 26, like the first opening 23 of the first via pad portion 21 described above, includes the entire area of ​​the via hole 13 when viewed in a planar view from the thickness direction of the substrate, and preferably coincides with the via hole 13.

[0035] The second via pad portion 26 as described above may have a width larger than the wiring width of the second wiring layer 25, as in the case of the first via pad portion 21. However, from the viewpoint of reducing the magnetic flux loss of the coil portion 3, it is preferable to form the second via pad portion 26 so as to have a maximum width equal to or smaller than the wiring width of the second wiring layer 25, as shown in Fig. 5, for example. From the viewpoint of reducing the electrical resistance between the first wiring layer 20 and the second wiring layer 25 of the coil portion 3, it is preferable to form the second opening 28 of the second via pad portion 26 so that its opening area is maximized up to the area of ​​the second via pad portion 26 (the area of ​​the second via pad portion 26 in a plan view seen from the thickness direction of the substrate), as shown in Fig. 5, for example.

[0036] 2 and 5, the second wiring layer 25 includes a second connection end 27. The second connection end 27 is an end on the opposite side to the second via pad portion 26 in the wiring direction of the second wiring layer 25, and forms an outer peripheral end of a spiral coil pattern as shown in Fig. 5, for example. This second connection end 27 is exposed from one side surface in the X direction of the main body portion 4 (the side surface opposite to the above-mentioned first connection end portion 22) as shown in Figs. 2 and 5, for example, and is electrically connected to the second external electrode 7 provided on that side surface.

[0037] The number of turns (windings) and wiring width of the coil section 3 including the above-mentioned first wiring layer 20 and second wiring layer 25 are set according to the characteristics such as electrical resistance and inductance required for the electronic component 1. That is, the coil patterns of the first wiring layer 20 and the second wiring layer 25 are set according to the above-mentioned characteristics required for the electronic component 1.

[0038] The conductive portion 30 covers the surfaces of the first wiring layer 20 and the second wiring layer 25 of the coil portion 3, and electrically connects the first wiring layer 20 and the second wiring layer 25 through the via holes 13 of the substrate 2. In detail, as shown in Figures 2 to 6, the conductive portion 30 has a first covering layer 31 covering the surface of the first wiring layer 20, a second covering layer 32 covering the surface of the second wiring layer 25, and a via conductor portion 33 filled inside the via holes 13.

[0039] The first covering layer 31 is formed on the surface of the first wiring layer 20 as shown in FIGS. 2 to 4 by performing metal plating using the coil pattern-shaped first wiring layer 20 formed on the first substrate surface 11 of the substrate 2 as a base layer. As a result, the first covering layer 31 covers the surface of the first wiring layer 20 while having the same coil pattern (see FIG. 4) as the above-mentioned first wiring layer 20. The second covering layer 32 is formed on the surface of the second wiring layer 25 as shown in FIGS. 2, 3, and 5 by performing metal plating using the coil pattern-shaped second wiring layer 25 formed on the second substrate surface 12 of the substrate 2 as a base layer. As a result, the second covering layer 32 covers the surface of the second wiring layer 25 while having the same coil pattern (see FIG. 5) as the above-mentioned second wiring layer 25. Note that each surface of the first wiring layer 20 and the second wiring layer 25 includes a surface (e.g., an upper surface) intersecting with the Z direction and a surface (e.g., a side surface) intersecting with the X direction or the Y direction.

[0040] The via conductor 33 is formed by filling the inside of the via hole 13 of the base material 2 with metal plating in addition to forming the first covering layer 31 and the second covering layer 32 described above, so as to be integrated with both the first covering layer 31 and the second covering layer 32, as shown in Fig. 3. In detail, as shown in Fig. 6, the via conductor 33 is composed of a conductor portion filling the first opening 23 of the first wiring layer 20, a conductor portion filling the second opening 28 of the second wiring layer 25, and a conductor portion filling the via hole 13. The via conductor 33 electrically connects the first covering layer 31 on the first wiring layer 20 and the second covering layer 32 on the second wiring layer 25 by these conductor portions. That is, the conductive portion 30 contacts one end of the spiral shape of the first wiring layer 20 (first via pad portion 21 shown in FIG. 6) and one end of the spiral shape of the second wiring layer 25 (second via pad portion 26 shown in FIG. 6) through the via hole 13, thereby electrically connecting the first wiring layer 20 and the second wiring layer 25.

[0041] The above-mentioned via conductor 33 may be formed by a metal plating grown on the surface of the first wiring layer 20, may be formed by a metal plating grown on the surface of the second wiring layer 25, or may be formed by a combination of these two metal platings. In addition, examples of the conductor constituting the conductive part 30 having the above-mentioned first covering layer 31, second covering layer 32, and via conductor 33 include metals such as copper and iron, or alloys containing one or more of these metals. From the viewpoint of ease of forming the above-mentioned metal plating, the conductive part 30 is preferably a conductor layer containing copper, similar to the above-mentioned first wiring layer 20 and second wiring layer 25.

[0042] As shown in FIG. 6, the coil section 3 includes a first underlayer 41 and a second underlayer 42. The first underlayer 41 and the second underlayer 42 are underlayers for metal plating on the first substrate surface 11 and the second substrate surface 12 of the substrate 2, respectively. In detail, as shown in FIG. 6, the first underlayer 41 is a underlayer formed on the first substrate surface 11 and is interposed between the first substrate surface 11 and the first wiring layer 20. From the viewpoint of ease of forming the above-mentioned first wiring layer 20 and the first coating layer 31, it is preferable that the first underlayer 41 has the same coil pattern as the first wiring layer 20. As shown in FIG. 6, the second underlayer 42 is a underlayer formed on the second substrate surface 12 and is interposed between the second substrate surface 12 and the second wiring layer 25. From the viewpoint of ease of forming the above-mentioned second wiring layer 25 and second covering layer 32, it is preferable that the second foundation layer 42 has the same coil pattern as the second wiring layer 25.

[0043] Examples of the conductor constituting each of the first underlayer 41 and the second underlayer 42 include metals such as nickel, chromium, titanium, and copper, or alloys containing one or more of these metals. In particular, each of the first underlayer 41 and the second underlayer 42 is preferably a conductor layer containing at least one of nickel, chromium, and titanium.

[0044] As shown in Figs. 2, 3, and 6, the coil portion 3 includes a first insulating layer 51 and a second insulating layer 52 that cover the surfaces of the conductive portion 30 and the substrate 2. For convenience of explanation, the first insulating layer 51 and the second insulating layer 52 are omitted in Figs. 4 and 5. The first insulating layer 51 is an insulating layer that covers the surface of the first covering layer 31 of the conductive portion 30 and the surface of the substrate 2 (for example, the first substrate surface 11 that is the back surface of the second substrate surface 12 on which the second connection end portion 27 is provided). As shown in Figs. 2 and 3, the first insulating layer 51 insulates between the first covering layers 31 that are adjacent to each other along the spiral-shaped first wiring layer 20 on the first substrate surface 11 of the substrate 2. The second insulating layer 52 is an insulating layer that covers the surface of the second covering layer 32 of the conductive portion 30 and the surface of the substrate 2 (for example, the second substrate surface 12 that is the back surface of the first substrate surface 11 on which the first connection end portion 22 is provided). 2 and 3, the second insulating layer 52 insulates between adjacent second covering layers 32 along the spiral-shaped second wiring layer 25 on the second substrate surface 12 of the substrate 2. Examples of the constituent materials of the first insulating layer 51 and the second insulating layer 52 include insulating materials such as parylene.

[0045] The main body 4 contains magnetic powder and includes the coil 3 therein, as shown in Fig. 1. In detail, the main body 4 is made of insulating resin (i.e., magnetic material) containing magnetic powder, and has a three-dimensional structure such as a rectangular parallelepiped or cube, as shown in Fig. 1. Examples of the magnetic powder contained in the main body 4 include metal powder such as iron, and alloy powder containing a metal such as iron. Examples of the insulating resin containing the magnetic powder include thermosetting resins such as epoxy resins.

[0046] The main body 4 as described above contains the coil 3 in such a manner that the first connection end 22 of the first wiring layer 20 and the second connection end 27 of the second wiring layer 25 are exposed from each of a pair of side surfaces that are both end surfaces in the X direction of the electronic component 1, as shown in FIG. 2. As shown in FIG. 2, the first connection end 22 is a connection end between the first wiring layer 20 and the first external electrode 6, and the second connection end 27 is a connection end between the second wiring layer 25 and the second external electrode 7. Also, as shown in FIGS. 2 to 5, the main body 4 is present in an inner region surrounded by the coil 3 and is wound by the coil 3. Such a main body 4 functions both as a structure (housing) containing the coil 3 as described above and as a magnetic core.

[0047] The exterior coat 5 covers the outer surface of the above-mentioned main body 4 except for the area where the external electrodes are provided. For example, the exterior coat 5 is made of an insulating resin such as an epoxy resin, and is provided on the outer surface of the main body 4 so as to cover the upper, lower and side surfaces of the main body 4 except for the area where the first external electrode 6 or the second external electrode 7 is provided, as shown in Figs.

[0048] The first external electrode 6 and the second external electrode 7 are a pair of external electrodes provided on the outer surface of the main body 4 and electrically connected to the coil 3 in the main body 4, as shown in FIG. 1. For example, the first external electrode 6 is provided in an L-shaped cross section in a region of the outer surface of the main body 4, from a side surface on one end side in the X direction (hereinafter referred to as a first side surface) to a part of the lower surface, as shown in FIG. 2. The first external electrode 6 is electrically connected to a first connection end 22 of the first wiring layer 20 exposed on the first side surface of the main body 4. The second external electrode 7 is provided in an L-shaped cross section in a region of the outer surface of the main body 4, from a side surface on the other end side in the X direction (hereinafter referred to as a second side surface) to a part of the lower surface, as shown in FIG. 2, so as to be paired with the first external electrode 6 and spaced apart. The second side surface is a side surface located on the opposite side of the first side surface in the X direction. The second external electrode 7 is electrically connected to a second connection end 27 of the second wiring layer 25 exposed on a second side surface of the main body 4.

[0049] Examples of the conductor constituting each of the above-mentioned first external electrode 6 and second external electrode 7 include metals such as copper, tin, nickel, etc., and alloys containing these metals. Furthermore, each of the first external electrode 6 and second external electrode 7 may be composed of a single conductor layer or multiple conductor layers.

[0050] Next, a method for manufacturing the electronic component 1 according to the first embodiment of the present invention will be described. FIG. 7 is a flow diagram showing an example of a method for manufacturing the coil part according to the first embodiment of the present invention. FIG. 7 shows a flow diagram seen from the same viewpoint (X direction) as FIG. 3 (a schematic cross-sectional view showing the BB line cross-section (see FIG. 1) of the electronic component 1) described above. FIG. 8 is a flow diagram showing an example of a method for manufacturing the electronic component including the coil part according to the first embodiment of the present invention. FIG. 8 shows a flow diagram seen from the same viewpoint (Y direction) as FIG. 2 (a schematic cross-sectional view showing the AA line cross-section (see FIG. 1) of the electronic component 1) described above. The coil part 3 (see FIGS. 2 to 6) is manufactured by sequentially performing each step shown in FIG. 7, and then the electronic component 1 (see FIG. 1) including the coil part 3 described above is manufactured by sequentially performing each step shown in FIG. 8.

[0051] In detail, as shown in FIG. 7, in the method for manufacturing the electronic component 1, first, in order to manufacture the coil portion 3, a base layer formation process is performed in which a base layer is formed on the first substrate surface 11 and the second substrate surface 12 of the substrate 2 (step S101).

[0052] In the underlayer forming step S101, a thin conductive film is formed on both end faces in the thickness direction of the substrate 2 carried into an apparatus such as a vacuum chamber by a method such as sputtering. For example, the conductor may be nickel (Ni), chromium (Cr), titanium (Ti), copper (Cu), etc. The thin conductive film may be a thin film containing at least one of nickel, chromium, titanium, and copper, such as a Ni-Cr film, a Ni-Cr-Cu film, and a Ni-Ti film. Among these, a thin film (conductive layer) containing at least one of nickel, chromium, and titanium is preferable. As a result, as shown in FIG. 7, a first underlayer 41 is formed on the first substrate surface 11 of the substrate 2, and a second underlayer 42 is formed on the second substrate surface 12 of the substrate 2.

[0053] The order of formation of the first undercoat layer 41 and the second undercoat layer 42 is not particularly limited, and the second undercoat layer 42 may be formed after the formation of the first undercoat layer 41, the first undercoat layer 41 may be formed after the formation of the second undercoat layer 42, or the first undercoat layer 41 and the second undercoat layer 42 may be formed simultaneously.

[0054] After the underlayer formation process of step S101 is performed, a pattern formation process is performed to form a coil pattern in the underlayer (first underlayer 41) on the first substrate surface 11 of the substrate 2 and the underlayer (second underlayer 42) on the second substrate surface 12 (step S102).

[0055] In the pattern formation process of step S102, as shown in FIG. 7, a first resist 101 is formed on the first underlayer 41 of the first substrate surface 11, and a second resist 102 is formed on the second underlayer 42 of the second substrate surface 12. For example, each of the first resist 101 and the second resist 102 may be formed by laminating a dry film, or may be formed by applying a photoresist. The order of formation of the first resist 101 and the second resist 102 is not particularly limited, and either resist may be formed first, or these resists may be formed simultaneously. The first resist 101 and the second resist 102 formed as described above are each subjected to exposure, development, and other processes to form the desired coil pattern, as shown in FIG. 7.

[0056] FIG. 9A is a schematic diagram showing an example of a coil pattern formed on the first underlayer on the first substrate surface. FIG. 9B is a schematic diagram showing an example of a coil pattern formed on the second underlayer on the second substrate surface. As shown in FIG. 9A, a first coil pattern 111 having a spiral shape in plan view as viewed from the substrate thickness direction (direction perpendicular to the paper surface of FIG. 9A) is formed on the first underlayer 41 on the first substrate surface 11 by the first resist 101 after the above-mentioned processing. The inner peripheral end of this spiral-shaped first coil pattern 111 includes a first opening pattern 111a for forming a first opening 23 in the first via pad portion 21 of the first wiring layer 20 shown in FIG. 4. Also, as shown in FIG. 9B, a second coil pattern 112 having a spiral shape in plan view as viewed from the substrate thickness direction (direction perpendicular to the paper surface of FIG. 9B) is formed on the second underlayer 42 on the second substrate surface 12 by the second resist 102 after the above-mentioned processing. The inner peripheral end of this spiral-shaped second coil pattern 112 includes a second opening pattern 112a for forming a second opening 28 in the second via pad portion 26 of the second wiring layer 25 shown in FIG.

[0057] After the pattern formation process of step S102 is performed, a first plating process is performed to form a first wiring layer 20 having a first coil pattern 111 on the first substrate surface 11 of the substrate 2, and to form a second wiring layer 25 having a second coil pattern 112 on the second substrate surface 12 of the substrate 2 (step S103).

[0058] In the first plating step of step S103, as shown in FIG. 7, the surface of the first underlayer 41 forming the first coil pattern 111 (see FIG. 9A) on the first substrate surface 11 of the substrate 2 is plated, thereby forming the first wiring layer 20 having the first coil pattern 111 on the surface of the first substrate layer 41. The first wiring layer 20 thus formed has a first opening 23 leading to the first substrate surface 11 corresponding to the first opening pattern 111a of the first coil pattern 111, as shown in FIG. 7, for example. In addition, in parallel with the formation of the first wiring layer 20, the surface of the second underlayer 42 forming the second coil pattern 112 (see FIG. 9B) on the second substrate surface 12 of the substrate 2 is plated, thereby forming the second wiring layer 25 having the second coil pattern 112 on the surface of the second underlayer 42. The second wiring layer 25 thus formed has a second opening 28 that leads to the second substrate surface 12, corresponding to the second opening pattern 112a of the second coil pattern 112, as shown in Fig. 7. The second opening 28 is formed at a position overlapping with the first opening 23 in the substrate thickness direction (the vertical direction on the paper surface of Fig. 7) as shown in Fig. 7.

[0059] The plating process carried out in the first plating step includes plating with a metal such as copper or iron, and plating with an alloy containing a metal such as copper or iron. Among these, copper plating or plating with an alloy containing copper is preferred from the viewpoint of ease of forming the first wiring layer 20 and the second wiring layer 25.

[0060] After the first plating step of step S103 is performed, a removal step is performed to remove unnecessary underlayer and resist from the substrate 2 (step S104). In the removal step of step S104, as shown in FIG. 7, the first resist 101 and the second resist 102 are removed from the first substrate surface 11 and the second substrate surface 12 of the substrate 2 by a method such as peeling or etching. Next, the portions of the first substrate layer 41 and the second substrate layer 42 exposed by removing the first resist 101 and the second resist 102 are removed from the first substrate surface 11 and the second substrate surface 12 by a method such as etching. As a result, the first substrate layer 41 interposed between the first substrate surface 11 and the first wiring layer 20 and the second substrate layer 42 interposed between the second substrate surface 12 and the second wiring layer 25 remain on the substrate 2. The remaining first underlayer 41 has a coil pattern similar to that of the first wiring layer 20, and the remaining second underlayer 42 has a coil pattern similar to that of the second wiring layer 25. For convenience of explanation, only cross-sectional views of the first wiring layer 20, the second wiring layer 25, the first underlayer 41, and the second underlayer 42 as viewed from the X direction are shown in FIG.

[0061] After the removal step of step S104, a via hole forming step is performed to form a via hole 13 in the base material 2 (step S105). In the via hole forming step of step S105, as shown in Fig. 7, the via hole 13 is formed so as to penetrate the base material 2 inside each of the first opening 23 of the first wiring layer 20 and the second opening 28 of the second wiring layer 25. It is preferable that the via hole 13 thus formed has the same inner diameter as each of the first opening 23 and the second opening 28 as shown in Fig. 7, and forms a series of through holes leading to the first opening 23 and the second opening 28.

[0062] For example, in the via hole forming step S105, the via hole 13 may be formed in the base material 2 by a laser processing method. In this case, the base material 2 is irradiated with laser light to an inner region surrounded by the first opening 23 and the second opening 28, thereby melting and removing the inner region. As a result, the above-mentioned via hole 13 is formed in the base material 2.

[0063] In the via hole forming process in step S105, the via hole 13 may be formed in the substrate 2 by etching. In this case, the entire region of the substrate 2 other than the inner region surrounded by the first opening 23 and the second opening 28 is covered with an etching mask, and the inner region is corroded (dissolved) and removed by wet etching in which the inner region is brought into contact with an etching solution. As a result, the above-mentioned via hole 13 is formed in the substrate 2. The etching mask is removed from the substrate 2 after the via hole 13 is formed. For example, the etching mask may be formed by laminating a dry film or by applying a photoresist.

[0064] After the via hole formation process of step S105 is performed, a second plating process is performed (step S106) in which the conductor layer covering each surface of the first wiring layer 20 and the second wiring layer 25 is plated, and the via conductor portion grown from the conductor layer is filled inside the via hole 13, thereby electrically connecting the first wiring layer 20 and the second wiring layer 25.

[0065] In the second plating step of step S106, as shown in FIG. 7, the surface of the first wiring layer 20 formed on the first substrate surface 11 of the substrate 2 is plated with a first covering layer 31, which is a conductor layer covering the surface, and the surface of the second wiring layer 25 formed on the second substrate surface 12 of the substrate 2 is plated with a second covering layer 32, which is a conductor layer covering the surface. At the same time, the via conductor portion 33 grown from at least one of the first covering layer 31 and the second covering layer 32 is filled into the via hole 13 of the substrate 2 through the first opening 23 of the first wiring layer 20 and the second opening 28 of the second wiring layer 25. As a result, as shown in FIG. 7, a conductive portion 30 is formed that covers the surfaces of the first wiring layer 20 and the second wiring layer 25 and electrically connects the first wiring layer 20 and the second wiring layer 25 through the via hole 13. For convenience of explanation, only a cross-sectional view of the conductive portion 30 seen from the X direction is shown in FIG. 7.

[0066] The plating treatment for the first covering layer 31 and the second covering layer 32 may be metal plating such as copper or iron, or alloy plating containing metal such as copper or iron. Among these, copper plating or alloy plating containing copper is preferred, as in the case of the first wiring layer 20 and the second wiring layer 25.

[0067] After the second plating step in step S106 is performed, a base material removing step is performed to remove a partial region of the base material 2 (step S107). In the base material removing step in step S107, for example, the conductor layers themselves, such as the first wiring layer 20 and the second wiring layer 25, formed on the base material 2 are made to function as an etching mask, and the regions of the base material 2 necessary for maintaining the first wiring layer 20 and the second wiring layer 25 are left, while the regions where the first wiring layer 20 and the second wiring layer 25 are not present are removed by an etching method. As a result, the base material 2 is formed into a shape similar to the first wiring layer 20 and the second wiring layer 25 projected in the base material thickness direction, as shown in FIG.

[0068] For example, the necessary region includes a region on the first substrate surface 11 where the first wiring layer 20 is formed, and a region on the second substrate surface 12 where the second wiring layer 25 is formed. In addition, the region of the substrate 2 that is removed by the etching method includes an inner region surrounded by the spiral-shaped first wiring layer 20 and second wiring layer 25, a region outside the first wiring layer 20 and second wiring layer 25, a region between adjacent first wiring layers 20 on the first substrate surface 11, and a region between adjacent second wiring layers 25 on the second substrate surface 12. The regions between the first wiring layers 20 and the regions between the second wiring layers 25 may be left without being removed by a method such as covering them with an etching mask.

[0069] After the substrate removing step of step S107, a coating step is performed in which the surfaces of the conductive portion 30 and the substrate 2 are covered with an insulating layer (step S108). In the coating step of step S108, the region of the surface of the conductive portion 30 on the first substrate surface 11 side of the substrate 2 (for example, the surface of the first coating layer 31 and the upper end surface of the via conductor portion 33) and the exposed region of the substrate 2 (the first substrate surface 11 exposed without the presence of a conductive layer such as the first wiring layer 20) are coated with an insulating material such as parylene. As a result, as shown in FIG. 7, a first insulating layer 51 is formed that covers the exposed region of the substrate 2 and covers the surface of the conductive portion 30 on the first substrate surface 11 side. In addition, the region of the surface of the conductive portion 30 on the second substrate surface 12 side of the substrate 2 (for example, the surface of the second coating layer 32 and the lower end surface of the via conductor portion 33) and the exposed region of the substrate 2 (the second substrate surface 12 exposed without the presence of a conductive layer such as the second wiring layer 25) are coated with an insulating material such as parylene. 7, a second insulating layer 52 is formed to cover the exposed region of the substrate 2 and to cover the surface of the conductive portion 30 on the second substrate surface 12 side. In this manner, the coil portion 3 having the first wiring layer 20, the second wiring layer 25, the conductive portion 30, etc. is manufactured.

[0070] Thereafter, as shown in Fig. 8, an encapsulation step is performed in which the coil portion 3 together with the substrate 2 is embedded in the magnetic material (step S201). In the encapsulation step of step S201, the substrate 2 and the coil portion 3 are set in an apparatus such as a molding die, and the magnetic material is injected (pressed) into the apparatus and hardened. This produces a compact of the magnetic material 115 that embeds the coil portion 3 together with the substrate 2, as shown in Fig. 8. In this compact, the magnetic material 115 is filled in the inner region surrounded by the first wiring layer 20 and the second wiring layer 25 of the coil portion 3, the outer region of the coil portion 3, the region between the first insulating layer 51 and the second insulating layer 52 of the coil portion 3, and the like.

[0071] The magnetic material 115 may be a mixture of magnetic powder and insulating resin. For example, the magnetic powder may be a metal powder such as iron, or an alloy powder containing a metal such as iron. For example, the insulating resin may be a thermosetting resin such as epoxy resin.

[0072] After the encapsulation step of step S201, an exterior coating step is performed in which an exterior coat 5 is provided on the outer surface of the molded body of the magnetic material 115 (step S202). In the exterior coating step of step S202, the molded body of the magnetic material 115 is diced along the X direction, thereby forming a pair of side surfaces facing each other with the coil portion 3 sandwiched in the Y direction (direction perpendicular to the paper surface of FIG. 8) on the molded body. Then, the pair of side surfaces, upper surface, and lower surface of the molded body are coated with an insulating resin such as epoxy resin. As a result, the exterior coat 5 is formed on the outer surface of the molded body as shown in FIG. 8. For example, the exterior coat 5 is provided on the outer surface of the molded body except for the region where the first external electrode 6 and the second external electrode 7 are formed in the process of step S204 described later, specifically, on the upper surface, a pair of side surfaces facing each other in the Y direction, and a part of the lower surface.

[0073] After the exterior packaging step of step S202, a singulation step is performed in which the compact of the magnetic material 115 is singulated (step S203). In the singulation step of step S203, the compact of the magnetic material 115 is singulated by dicing into the main body 4 containing the coil portion 3 as shown in FIG. 8. At this time, the main body 4 contains the coil portion 3 with the first connection end 22 of the first wiring layer 20 and the second connection end 27 of the second wiring layer 25 exposed from a pair of side surfaces in the X direction (left-right direction on the paper surface of FIG. 8) as shown in FIG. 8. In addition, an exterior coat 5 is provided on the upper surface of the main body 4, a pair of side surfaces facing in the Y direction, and a part of the lower surface by the exterior packaging step of step S202.

[0074] After the singulation process of step S203, an electrode formation process is performed in which a pair of external electrodes electrically connected to the coil portion 3 is provided on the outer surface of the main body portion 4 (step S204). In the electrode formation process of step S204, metals such as copper, tin, nickel, etc., or alloys containing the metals are plated on the exposed areas of the outer surface of the main body portion 4 where the exterior coat 5 is not formed. As a result, as shown in FIG. 8, a first external electrode 6 and a second external electrode 7 are formed on the exposed areas. For example, the first external electrode 6 is provided in an L-shaped cross section on an area of ​​the outer surface of the main body portion 4 extending from a first side surface in the X direction to a part of the lower surface, and is electrically connected to the first connection end portion 22 exposed from the first side surface. The second external electrode 7 is provided in an L-shaped cross section on an area of ​​the outer surface of the main body portion 4 extending from a second side surface in the X direction to a part of the lower surface, and is electrically connected to the second connection end portion 27 exposed from the second side surface. As shown in Fig. 8, an exterior coat 5 is interposed between the first external electrode 6 and the second external electrode 7. This ensures insulation between the first external electrode 6 and the second external electrode 7. In this manner, the electronic component 1 according to the first embodiment of the present invention is manufactured.

[0075] As described above, the electronic component 1 according to the first embodiment of the present invention includes a substrate 2 and a coil portion 3 having an annular shape in a plan view seen from the substrate thickness direction, the coil portion 3 including a first wiring layer 20 having a coil pattern formed on a first substrate surface 11 which is one end surface in the substrate thickness direction, a second wiring layer 25 having a coil pattern formed on a second substrate surface 12 which is the other end surface in the substrate thickness direction, and a conductive portion 30 electrically connecting the first wiring layer 20 and the second wiring layer 25. In this electronic component 1, the conductive portion 30 covers the surfaces of the first wiring layer 20 and the second wiring layer 25, and electrically connects the first wiring layer 20 on the first substrate surface 11 side to the second wiring layer 25 on the second substrate surface 12 side through a via hole 13 penetrating the substrate 2.

[0076] Therefore, there is no need to provide a margin between both ends in the width direction of each of the first wiring layer 20 and the second wiring layer 25 and the opening edge of the via hole 13, and the opening area of ​​the via hole 13 can be easily increased, and the via conductor portion 33 of the conductive portion 30 can be sufficiently filled inside the via hole 13 around the entire circumference of the opening edge of the via hole 13. As a result, the cross-sectional area of ​​the via conductor portion 33 of the conductive portion 30 that electrically connects the first wiring layer 20 on the first substrate surface 11 side and the second wiring layer 25 on the second substrate surface 12 side through the via hole 13 can be increased according to the opening area of ​​the via hole 13, so that the electrical resistance (connection resistance) between the first wiring layer 20 and the second wiring layer 25 can be reduced, and as a result, the electrical resistance of the coil portion 3 can be reduced.

[0077] Furthermore, in the electronic component 1 of embodiment 1 of the present invention, the coil portion 3 includes a first via pad portion 21 that forms one end portion in the wiring direction of the first wiring layer 20 and surrounds the opening of the via hole 13 on the first substrate surface 11 side, and a second via pad portion 26 that forms one end portion in the wiring direction of the second wiring layer 25 and surrounds the opening of the via hole 13 on the second substrate surface 12 side, and in this coil portion 3, the maximum width of the first via pad portion 21 is made equal to or less than the wiring width of the first wiring layer 20, and the maximum width of the second via pad portion 26 is made equal to or less than the wiring width of the second wiring layer 25.

[0078] This makes it possible to prevent the first via pad portion 21 and the second via pad portion 26 from extending into the inner region surrounded by the first wiring layer 20 and the second wiring layer 25, i.e., the inner region of the coil portion 3. This makes it possible to prevent a reduction in the volume of the inner region of the coil portion 3, and therefore to prevent a reduction in the volume of the magnetic body (magnetic core of the main body portion 4) present in the inner region, and as a result, the magnetic flux loss of the coil portion 3 can be reduced.

[0079] Moreover, in the manufacturing method for an electronic component according to the first embodiment of the present invention, in an underlayer forming step, an underlayer is formed on a first substrate surface 11 at one end side in the thickness direction of the substrate 2 and a second substrate surface 12 at the other end side; in a pattern forming step, a coil pattern is formed on the underlayer (first underlayer 41) on the first substrate surface 11 and the underlayer (second underlayer 42) on the second substrate surface 12; in a first plating step, the surface of the first underlayer 41 forming the coil pattern on the first substrate surface 11 is plated to form a first wiring layer 20 having a first opening 23 communicating with the first substrate surface 11, and a second underlayer (second underlayer 42) forming the coil pattern on the second substrate surface 12 is plated. The surface of the second underlayer 42 is plated to form a second wiring layer having a second opening 28 that leads to the second substrate surface 12 at a position that overlaps with the first opening 23 in the substrate thickness direction, and then, in a via hole formation process, a via hole 13 that penetrates the substrate 2 is formed inside each of the first opening 23 and the second opening 28. In a second plating process, a conductor layer (first coating layer 31 and second coating layer 32) covering each surface of the first wiring layer 20 and the second wiring layer 25 is plated, while a via conductor portion 33 grown from the conductor layer is filled inside the via hole 13, thereby electrically connecting the first wiring layer 20 and the second wiring layer 25.

[0080] Therefore, the via hole 13 can be formed in the base material 2, targeting the inner region surrounded by the openings (first opening 23 and second opening 28) of the first wiring layer 20 and the second wiring layer 25. This prevents the first opening 23 and the second opening 28 from being misaligned relative to the via hole 13, and prevents at least one of the first wiring layer 20 and the second wiring layer 25 from entering the opening region of the via hole 13. Therefore, the entire circumference of the opening edge of the via hole 13 can be extended to the edges of the inner surfaces of the first opening 23 and the second opening 28, so that the opening area of ​​the via hole 13 can be easily increased and the via conductor portion 33 can be sufficiently filled inside the via hole 13 around the entire circumference of the opening edge of the via hole 13. As a result, the cross-sectional area of ​​the via conductor portion 33 can be increased in accordance with the opening area of ​​the via hole 13, thereby reducing the electrical resistance between the first wiring layer 20 and the second wiring layer 25 via the via conductor portion 33, and ultimately reducing the electrical resistance of the coil portion 3.

[0081] In addition, after the position of the first opening 23 of the first wiring layer 20 on the first substrate surface 11 and the position of the second opening 28 of the second wiring layer 25 on the second substrate surface 12 are determined, the via hole 13 is formed in the inner region of the substrate 2 surrounded by the first opening 23 and the second opening 28. Therefore, even if the maximum width of the first via pad portion 21 of the first wiring layer 20 where the first opening 23 is formed is made equal to or less than the wiring width of the first wiring layer 20, and the maximum width of the second via pad portion 26 of the second wiring layer 25 where the second opening 28 is formed is made equal to or less than the wiring width of the second wiring layer 25, the opening area of ​​the via hole 13 can be easily increased in accordance with the respective opening areas of the first opening 23 and the second opening 28. This prevents the first via pad portion 21 and the second via pad portion 26 from extending into the inner region of the coil portion 3, thereby preventing a reduction in the volume of the inner region of the coil portion 3, and therefore preventing a reduction in the volume of the magnetic material present in the inner region, thereby reducing magnetic flux loss in the coil portion 3.

[0082] (Embodiment 2) Next, an electronic component according to a second embodiment of the present invention will be described. FIG. 10 is a schematic cross-sectional view showing an example of the configuration of the electronic component according to the second embodiment of the present invention. FIG. 10 is a schematic cross-sectional view showing a cross-sectional structure of the electronic component as viewed from the same viewpoint as in FIG. 2 described above. FIG. 11 is a schematic cross-sectional view showing an example of the configuration of the electronic component shown in FIG. 10 along the line FF. As shown in FIGS. 10 and 11, the electronic component 1A according to the second embodiment of the present invention includes a coil portion 3A instead of the coil portion 3 of the electronic component 1 according to the first embodiment described above, includes a first external electrode 6A and a second external electrode 7A instead of the first external electrode 6 and the second external electrode 7, and further includes an electrode via hole 14 in the substrate 2. Moreover, the coil portion 3A includes a first connection end 22A and a second connection end 27A instead of the first connection end 22 and the second connection end 27 of the coil portion 3 according to the above-mentioned embodiment 1, and further includes an extraction wiring portion 61, an electrode conductive portion 62, a first internal terminal 63, a second internal terminal 64, and an insulating layer 65. The other configurations are the same as those of embodiment 1, and the same components are denoted by the same reference numerals.

[0083] In the coil portion 3A, the first connection end 22A of the first wiring layer 20 is not exposed from the main body portion 4 and is contained within the main body portion 4, as shown in Figures 10 and 11. For example, as shown in Figure 10, the first connection end 22A is electrically connected to the first external electrode 6A on the lower surface of the main body portion 4 via the drawn-out wiring portion 61, the electrode conductive portion 62, and the first internal terminal 63. Note that, for convenience of explanation, the first insulating layer 51 is omitted in Figure 11.

[0084] 10 and 11, the first connection end 22A has an opening 15 that leads to the electrode via hole 14. The electrode via hole 14 is formed to penetrate the substrate 2 in a predetermined region of the substrate 2 that overlaps with both the first connection end 22A of the first wiring layer 20 and the drawn wiring portion 61 in the substrate thickness direction. As shown in FIG. 10, the first connection end 22A surrounds the opening of the electrode via hole 14 on the first substrate surface 11 side inside the opening 15. In this case, the opening 15 of the first connection end 22A includes the entire region of the electrode via hole 14 in a plan view seen from the substrate thickness direction, and preferably coincides with the electrode via hole 14.

[0085] The shapes of the electrode via holes 14 and the openings 15 are not particularly limited, and may be, for example, circular, oval such as an ellipse or a rounded rectangle, or rectangular in plan view from the thickness direction of the substrate. In the second embodiment, the first wiring layer 20 has the same configuration as that of the first embodiment, except that it includes the first connection end 22A.

[0086] 10 and 11, the second connection end 27A of the second wiring layer 25 in the coil portion 3A is not exposed from the main body portion 4 but is contained within the main body portion 4. For example, as shown in FIG. 10, the second connection end 27A is electrically connected to the second external electrode 7A on the lower surface of the main body portion 4 via the second internal terminal 64. In the present embodiment 2, the second wiring layer 25 has the same configuration as that of the above-mentioned embodiment 1, except that it is provided with the second connection end 27A.

[0087] The lead wiring portion 61 is a part of a conductor layer for electrically connecting the first wiring layer 20 on the first substrate surface 11 side and the first external electrode 6A on the lower surface side of the main body portion 4. In detail, as shown in FIG. 10, the lead wiring portion 61 is formed by performing metal plating on a foundation layer (not shown) formed on the second substrate surface 12 of the substrate 2 so as to extend from the second substrate surface 12 in the substrate thickness direction (downward in the plane of the paper in FIG. 10) at a distance from the second wiring layer 25. The foundation layer of the lead wiring portion 61 is a part of the foundation layer of the second wiring layer 25 (the second foundation layer 42 shown in FIG. 6). The conductor constituting the lead wiring portion 61 is the same as that of the second wiring layer 25 described above. Also, as shown in FIGS. 10 and 11, an opening 61a leading to the electrode via hole 14 is formed in the lead wiring portion 61. 10, the lead wiring portion 61 surrounds the opening of the electrode via hole 14 on the second substrate surface 12 side inside this opening 61a. In this case, the opening 61a of the lead wiring portion 61 includes the entire area of ​​the electrode via hole 14 in a plan view seen from the substrate thickness direction, and preferably coincides with the electrode via hole 14. The shape of the opening 61a of the lead wiring portion 61 is not particularly limited, and may be the same as the shapes of the electrode via hole 14 and opening 15 described above, for example.

[0088] As shown in FIGS. 10 and 11, the electrode conductive portion 62 covers the surface of the first connection end 22A of the first wiring layer 20 and the surface of the lead wiring portion 61, and electrically connects the first connection end 22A and the lead wiring portion 61 through the electrode via hole 14 of the substrate 2. In detail, as shown in FIG. 10, the first connection end 22A is a connection end of the first wiring layer 20 that overlaps with the lead wiring portion 61 in a plan view seen from the substrate thickness direction. As shown in FIGS. 10 and 11, the electrode conductive portion 62 is composed of a first covering layer that covers the surface of the first connection end 22A, a second covering layer that covers the surface of the lead wiring portion 61, and a via conductor portion that fills the inside of the electrode via hole 14. Note that each surface of the first connection end 22A and the lead wiring portion 61 includes a surface that intersects with the Z direction and a surface that intersects with the X direction or the Y direction.

[0089] The first covering layer of the electrode conductive portion 62 is a part of the first covering layer 31 covering the surface of the first wiring layer 20 as shown in Figs. 10 and 11. The second covering layer of the electrode conductive portion 62 is formed in the same manner as the second covering layer 32 covering the surface of the second wiring layer 25 as shown in Fig. 10. The via conductor portion of the electrode conductive portion 62 is formed so as to be integrated with both the first covering layer and the second covering layer of the electrode conductive portion 62 as shown in Fig. 10 by filling the inside of the electrode via hole 14 of the substrate 2 with metal plating in addition to the formation of the above-mentioned first covering layer 31 and second covering layer 32. That is, the via conductor portion of the electrode conductive portion 62 is composed of a conductor portion filling the opening 15 of the first connection end portion 22A, a conductor portion filling the opening 61a of the lead-out wiring portion 61, and a conductor portion filling the electrode via hole 14. The formation of the via conductor portion of the electrode conductive portion 62 proceeds in parallel with the formation of the via conductor portion 33 in the via hole 13 described above.

[0090] The via conductor of the electrode conductive part 62 may be formed by metal plating grown on the surface of the first connection end 22A, may be formed by metal plating grown on the surface of the lead wiring part 61, or may be formed by a combination of these two metal platings. Examples of the conductor forming the electrode conductive part 62 include metals such as copper and iron, and alloys containing one or more of these metals. From the viewpoint of ease of forming the metal plating, the electrode conductive part 62 is preferably a conductor layer containing copper, similar to the conductive part 30 described above.

[0091] The first internal terminal 63 is a part of a conductor layer for electrically connecting the first wiring layer 20 on the first substrate surface 11 side and the first external electrode 6A on the lower surface side of the main body 4. In detail, as shown in FIG. 10, the first internal terminal 63 is formed by performing metal plating using the electrode conductive portion 62 formed on the surface of the drawn wiring portion 61 as a base layer, so as to extend from the electrode conductive portion 62 in the substrate thickness direction (downward in the paper surface of FIG. 10). The extending end (lower end) of this first internal terminal 63 is exposed from the lower surface of the main body 4. As shown in FIG. 10, such a first internal terminal 63 electrically connects the first wiring layer 20 in the main body 4 and the first external electrode 6A on the lower surface of the main body 4 via the electrode conductive portion 62.

[0092] The second internal terminal 64 is a part of a conductor layer for electrically connecting the second wiring layer 25 on the second substrate surface 12 side and the second external electrode 7A on the lower surface side of the main body 4. In detail, as shown in FIG. 10, the second internal terminal 64 is formed by performing metal plating using the second coating layer 32 of the conductive portion 30 formed on the surface of the second wiring layer 25 as a base layer, so as to extend from the second coating layer 32 in the substrate thickness direction (downward in the paper surface of FIG. 10). The extending end (lower end) of the second internal terminal 64 is exposed from the lower surface of the main body 4, similar to the above-mentioned first internal terminal 63. That is, the coil portion 3A is included in the main body 4 in a state in which the extending ends of the first internal terminal 63 and the second internal terminal 64 are exposed from the lower surface of the main body 4. As shown in Figure 10, such a second internal terminal 64 electrically connects the second wiring layer 25 in the main body 4 to the second external electrode 7A on the underside of the main body 4 via the second coating layer 32 of the conductive portion 30 which covers the surface of the second connection end 27A of the second wiring layer 25 which pairs with the above-mentioned first connection end 22A.

[0093] The conductors constituting each of the above-mentioned first internal terminal 63 and second internal terminal 64 are similar to those of the above-mentioned electrode conductive portion 62. The first internal terminal 63 and the second internal terminal 64 may be formed in a truncated pyramid shape tapered from the coil portion 3 side toward the lower surface side of the main body portion 4 as shown in Fig. 10, for example, or may be formed in a truncated pyramid shape tapered from the coil portion 3 side toward the lower surface side of the main body portion 4, or may be formed in a columnar shape such as a cylindrical column or a rectangular column.

[0094] 10, the insulating layer 65 covers the surfaces of the electrode conductive portion 62, the first internal terminal 63, and the second internal terminal 64. As a result, the insulating layer 65 insulates the electrode conductive portion 62, the first internal terminal 63, and the second internal terminal 64 from the main body portion 4. The constituent material of the insulating layer 65 is the same as that of the first insulating layer 51 and the second insulating layer 52 described above.

[0095] The first external electrode 6A and the second external electrode 7A are a pair of external electrodes provided on the lower surface of the main body 4 and electrically connected to the coil portion 3A in the main body 4, as shown in FIG. 10. The first external electrode 6A is provided in a region including an exposed region of an extended end of the first internal terminal 63 on the lower surface (one end surface in the Z direction) of the main body 4, for example, in a first lower surface region having a predetermined distance from the lower end of the first side surface in the X direction. The first external electrode 6A is electrically connected to the first connection end 22A of the first wiring layer 20 through the first internal terminal 63 exposed on the first lower surface region of the main body 4. The second external electrode 7A is provided in a pair with the first external electrode 6A and spaced apart from each other on the lower surface of the main body 4, as shown in FIG. 10, in a region including an exposed region of an extended end of the second internal terminal 64 on the lower surface of the main body 4, for example, in a second lower surface region having a predetermined distance from the lower end of the second side surface in the X direction. The second external electrode 7A is electrically connected to the second connection end 27A of the second wiring layer 25 via a second internal terminal 64 exposed in the second lower surface region of the main body 4. The conductors constituting the first external electrode 6A and the second external electrode 7A are similar to the first external electrode 6 and the second external electrode 7 of the first embodiment described above.

[0096] In the second embodiment, the exterior coat 5 covers the outer surface of the main body 4 except for the lower surface regions where the first external electrode 6A and the second external electrode 7A are provided. For example, as shown in Figs. 10 and 11, the exterior coat 5 is provided on the entire upper and side surfaces of the main body 4 and on the lower surface region of the main body 4 excluding the first and second lower surface regions (such as the lower surface region between the first and second lower surface regions).

[0097] Next, a method for manufacturing an electronic component 1A according to a second embodiment of the present invention will be described. FIG. 12 is a flow diagram showing an example of a method for manufacturing a coil portion according to the second embodiment of the present invention. FIG. 12 illustrates each step of the method for manufacturing the coil portion 3A, from the formation of the coil patterns of the first wiring layer 20 and the second wiring layer 25 to the formation of the first internal terminal 63 and the second internal terminal 64. FIG. 13 is a flow diagram showing an example of a method for manufacturing an electronic component including a coil portion according to the second embodiment of the present invention. In the second embodiment of the present invention, first, the above-mentioned coil portion 3A (see FIGS. 10 and 11) is manufactured by sequentially performing each step of steps S101 to S108 shown in FIGS. 7 and 12, and then the electronic component 1A including the above-mentioned coil portion 3A is manufactured by sequentially performing each step of steps S201 to S204 shown in FIG. 13.

[0098] In detail, first, in order to manufacture the coil portion 3A, a base layer forming step S101 is performed similarly to the first embodiment, and then, in a pattern forming step S102, a coil pattern is formed on the first base layer 41 on the first substrate surface 11 of the substrate 2 and the second base layer 42 on the second substrate surface 12. At this time, the first coil pattern on the first substrate surface side is formed so that the pattern for forming the opening 15 and the first connection end portion 22A shown in FIG. 12 is included in the first resist 101 (see FIG. 7) on the first substrate surface 11 side. In addition, the second coil pattern on the second substrate surface 12 side is formed so that the pattern for forming the second connection end portion 27A and the lead-out wiring portion 61 shown in FIG. 12 is included in the second resist 102 (see FIG. 7) on the second substrate surface 12 side.

[0099] The first coil pattern is similar to that of the first embodiment, except that it includes the patterns of the opening 15 and the first connection end 22A. The second coil pattern is similar to that of the first embodiment, except that it includes the patterns of the second connection end 27A and the lead-out wiring portion 61. The method of forming the first coil pattern and the second coil pattern is similar to that of the first embodiment.

[0100] After performing the pattern forming process of step S102, the first plating process of step S103 and the removal process of step S104 are performed in sequence. As a result, as shown in FIG. 12, the first wiring layer 20 having the first connection end 22A is formed on the first undercoat layer 41 on the first substrate surface 11 side, and the second wiring layer 25 having the second connection end 27A and the lead-out wiring portion 61 spaced from the second wiring layer 25 are formed on the second undercoat layer 42 on the second substrate surface 12 side. As shown in FIG. 12, the first connection end 22A has an opening 15 formed therein. Also, as shown in FIG. 12, the lead-out wiring portion 61 has an opening 61a formed therein that overlaps with the opening 15 of the first connection end 22A in the substrate thickness direction (the vertical direction of the paper surface of FIG. 12). The configuration of the first wiring layer 20 is the same as that of the above-mentioned embodiment 1, except that it has the first connection end 22A in which the opening 15 is formed. The configuration of the second wiring layer 25 is the same as that of the above-described first embodiment, except that it has the second connection end portion 27A.

[0101] In the second embodiment, the plating process itself performed in the first plating step in step S103 is similar to that in the first embodiment described above, and the removal step in step S104 is similar to that in the first embodiment described above.

[0102] After the first plating step of step S103 and the removal step of step S104 are performed in sequence, a via hole forming step of step S105 is performed, whereby the same via hole 13 as in the above-mentioned embodiment 1 is formed in the base material 2, and the electrode via hole 14 is formed in the base material 2 as shown in FIG. 12. At this time, the electrode via hole 14 is formed so as to penetrate the base material 2 inside each of the opening 15 of the first connection end 22A and the opening 61a of the lead-out wiring portion 61, as shown in FIG. 12. The electrode via hole 14 thus formed preferably has the same inner diameter as each of the openings 15 and the opening 61a, as shown in FIG. 12, and forms a series of through holes leading to the openings 15 and the opening 61a. The electrode via hole 14 may be formed in the base material 2 by a laser processing method, as in the above-mentioned via hole 13, or may be formed in the base material 2 by an etching method.

[0103] After the via hole forming step S105 is performed, a second plating step S106 is performed as shown in Fig. 12, thereby forming the conductive portion 30 as in the above-mentioned embodiment 1, and forming the electrode conductive portion 62 in the first connection end 22A and the lead-out wiring portion 61. At this time, the conductor layer covering each surface of the first connection end 22A and the lead-out wiring portion 61 is plated, and the via conductor portion grown from the conductor layer is filled into the electrode via hole 14, thereby forming the electrode conductive portion 62 that electrically connects the first connection end 22A of the first wiring layer 20 and the lead-out wiring portion 61.

[0104] The plating process of the electrode conductive portion 62 itself is the same as that of the conductive portion 30 of the above-mentioned embodiment 1. In the conductive portion 30 of the present embodiment 2, the first covering layer 31 is formed so as to cover the surface of the first wiring layer 20 in a region other than the first connection end 22A and to be integrated with the electrode conductive portion 62 on the surface of the first connection end 22A, as shown in Fig. 12. The second covering layer 32 is formed so as to cover the surface of the second wiring layer 25 including the second connection end 27A and to be separated from the electrode conductive portion 62 on the surface of the drawn-out wiring portion 61, as shown in Fig. 12.

[0105] After the second plating process of step S106 is performed, as shown in FIG. 12, an internal terminal formation process of step S106a is performed, thereby forming a first internal terminal 63 electrically connected to the first connection end 22A of the first wiring layer 20 via the electrode conductive portion 62, and a second internal terminal 64 electrically connected to the second connection end 27A of the second wiring layer 25 via the conductive portion 30.

[0106] In the internal terminal forming process of step S106a, metal plating is performed using the electrode conductive portion 62 on the drawn-out wiring portion 61 as a base layer, thereby forming a first internal terminal 63 extending from this base layer (electrode conductive portion 62) in the thickness direction of the substrate (downward in the plane of FIG. 12). In parallel with this, metal plating is performed using the conductive portion 30 (second coating layer 32) on the second wiring layer 25 as a base layer, thereby forming a second internal terminal 64 extending from this base layer (second coating layer 32) in the thickness direction of the substrate (the same direction as the first internal terminal 63). The plating process itself for forming these first internal terminal 63 and second internal terminal 64 is the same as that for the electrode conductive portion 62 described above.

[0107] After the internal terminal forming step of step S106a is performed, a base material removing step (see step S107 in FIG. 7) similar to that of the first embodiment described above is performed, thereby leaving the region of the base material 2 necessary for maintaining the first wiring layer 20 and the second wiring layer 25, and removing the other region. Thereafter, a covering step (see step S108 in FIG. 7) similar to that of the first embodiment described above is performed, thereby forming a first insulating layer 51 covering the surface of the first substrate surface 11 side of the conductive portion 30 described above, and a second insulating layer 52 covering the surface of the second substrate surface 12 side described above. In parallel with this, an insulating layer 65 (see FIG. 10) covering the surfaces of the electrode conductive portion 62, the first internal terminal 63, and the second internal terminal 64 shown in FIG. 12 is formed. The method of forming the insulating layer 65 itself is the same as that of the first insulating layer 51 and the second insulating layer 52 described above.

[0108] In this manner, the coil portion 3A (see Figs. 10 and 11) of the present embodiment 2 is manufactured. Thereafter, as shown in Fig. 13, an encapsulation process in step S201, an exterior packaging process in step S202, and a singulation process in step S203 are performed in sequence. In the present embodiment 2, the encapsulation process in step S201 is the same as that of the above-described embodiment 1, except that the coil portion to be encapsulated in the magnetic material is replaced by the coil portion 3A of embodiment 2 from the coil portion 3 of embodiment 1.

[0109] In the second embodiment, in the exterior coating process of step S202, an exterior coat 5 is provided on the outer surfaces of the magnetic material molded body containing the coil portion 3A, including the upper surface, a pair of side surfaces facing in the X direction (left-right direction on the paper in FIG. 13), a pair of side surfaces facing in the Y direction (direction perpendicular to the paper in FIG. 13), and a part of the lower surface. The method of forming this exterior coat 5 is the same as in the first embodiment described above.

[0110] In the present embodiment 2, in the singulation process of step S203, the magnetic material compact is singulated into the main body 4 containing the coil portion 3A as shown in FIG. 13. At this time, the main body 4 contains the coil portion 3A with the extended ends of the first internal terminal 63 and the second internal terminal 64 exposed from the lower surface as shown in FIG. 13. In addition, the upper surface of the main body 4, a pair of side surfaces facing in the X direction, a pair of side surfaces facing in the Y direction, and a part of the lower surface are provided with the exterior coat 5 by the exterior process of step S202. The method of singulation of the magnetic material compact itself is the same as that of the above-mentioned embodiment 1.

[0111] After the singulation process of step S203 is performed, an electrode formation process of step S204 is performed as shown in FIG. 13, thereby providing a pair of external electrodes on the outer surface of the main body 4, which are electrically connected to the coil portion 3A.

[0112] In this embodiment 2, in the electrode formation process of step S204, as shown in FIG. 13, a first external electrode 6A and a second external electrode 7A are formed on the exposed lower surface area of ​​the outer surface of the main body 4 where the exterior coating 5 is not formed.

[0113] The first external electrode 6A is provided in a first lower surface region having a predetermined width from the side surface on one end side in the X direction on the lower surface of the main body 4. As shown in FIG. 13, an extended end of a first internal terminal 63 of the coil portion 3A is exposed in this first lower surface region. The first external electrode 6A is electrically connected to the first connection end 22A of the first wiring layer 20 via the first internal terminal 63 exposed in this first lower surface region. The second external electrode 7A is provided in a second lower surface region having a predetermined width from the side surface on the other end side in the X direction on the lower surface of the main body 4. As shown in FIG. 13, an extended end of a second internal terminal 64 of the coil portion 3A is exposed in this second lower surface region. The second external electrode 7A is electrically connected to the second connection end 27A of the second wiring layer 25 via the second internal terminal 64 exposed in this second lower surface region.

[0114] 13, an exterior coat 5 is interposed between the first external electrode 6A and the second external electrode 7A, thereby ensuring insulation between the first external electrode 6A and the second external electrode 7A. In this manner, the electronic component 1A according to the second embodiment of the present invention is manufactured.

[0115] As described above, the electronic component 1A of embodiment 2 of the present invention comprises an extraction wiring portion 61 spaced from the second wiring layer 25 and extending from the second substrate surface 12 in the substrate thickness direction, an electrode conductive portion 62 covering each surface of the first connection end 22A and the extraction wiring portion 61 of the first wiring layer 20 and electrically connecting the first connection end 22A and the extraction wiring portion 61 through an electrode via hole 14 penetrating the substrate 2, a first internal terminal 63 electrically connecting the first wiring layer 20 and the first external electrode 6A through the electrode conductive portion 62, and a second internal terminal 64 electrically connecting the second wiring layer 25 and the second external electrode 7A through a conductive portion 30 covering the surface of the second connection end 27A of the second wiring layer 25, and is otherwise configured in the same manner as embodiment 1.

[0116] Therefore, the same effects as those of the first embodiment can be obtained, and the first external electrode 6A and the second external electrode 7A provided on the lower surface of the main body 4 at a distance from each other can be electrically connected to the first connection end 22A and the second connection end 27A of the coil portion 3A contained in the main body 4. Therefore, the first external electrode 6A and the second external electrode 7A can serve as both a pair of external electrodes electrically connected to the first connection end 22A and the second connection end 27A of the coil portion 3A and a pair of external electrodes for mounting the electronic component 1A on a circuit board. This eliminates the need to provide the pair of external electrodes on the side surfaces of the main body 4. As a result, the solder fillet formed when mounting the electronic component 1A on a circuit board can be made smaller than when a pair of external electrodes is provided on the side surfaces of the main body 4, and the mounting area of ​​the electronic component 1A can be reduced.

[0117] (Modification) Next, a modified example of the electronic component according to the first embodiment of the present invention will be described. Fig. 14 is a schematic cross-sectional view showing one configuration example of an electronic component according to a modified example of the first embodiment of the present invention. As shown in Fig. 14, the electronic component 1B according to this modification includes a multi-layered base material (e.g., three-layered base materials 2-1 to 2-3) instead of the base material 2 of the electronic component 1 according to the first embodiment described above, and includes a laminated coil portion 3B instead of the spiral coil portion 3. The other configurations are the same as those of the first embodiment, and the same components are denoted by the same reference numerals.

[0118] The substrates 2-1 to 2-3 are an example of a multi-layer substrate on which the laminated coil section 3B is formed. For example, as shown in FIG. 14, the substrates 2-1 to 2-3 are arranged to be laminated in the Z direction (the thickness direction of each of the substrates 2-1 to 2-3) via the respective wiring layers of the coil section 3B. At this time, the substrate 2-1 is interposed between the first wiring layer 20B and the intermediate wiring layer 29-1, the substrate 2-2 is interposed between the intermediate wiring layer 29-1 and the intermediate wiring layer 29-2, and the substrate 2-3 is interposed between the intermediate wiring layer 29-2 and the second wiring layer 25B. That is, of both end faces in the thickness direction of the substrate 2-1, the first substrate surface is the substrate surface on which the first wiring layer 20B exists, and the second substrate surface is the substrate surface on which the intermediate wiring layer 29-1 exists. Of both end faces in the thickness direction of the substrate 2-2, the first substrate surface is the substrate surface on which the intermediate wiring layer 29-1 exists, and the second substrate surface is the substrate surface on which the intermediate wiring layer 29-2 exists. Of both end faces in the thickness direction of the base material 2-3, the first base material surface is the base material surface on which the intermediate wiring layer 29-2 exists, and the second base material surface is the base material surface on which the second wiring layer 25B exists.

[0119] 14, the base material 2-1 has a via hole 13-1 for electrically connecting the first wiring layer 20B and the intermediate wiring layer 29-1. The base material 2-2 has a via hole 13-2 for electrically connecting the intermediate wiring layer 29-1 and the intermediate wiring layer 29-2. The base material 2-3 has a via hole 13-1 for electrically connecting the intermediate wiring layer 29-2 and the second wiring layer 25B. For example, the via holes 13-1 to 13-3 are formed so as not to overlap each other in a plan view seen from the thickness direction of the base materials 2-1 to 2-3 as shown in FIG.

[0120] The constituent material of each of the base materials 2-1 to 2-3 is the same as that of the base material 2 of the above-mentioned embodiment 1. The structure of each of the via holes 13-1 to 13-3 is the same as that of the via hole 13 of the above-mentioned embodiment 1. Furthermore, the number of layers of the base material on which the coil portion 3B is formed is not limited to the number of layers of the base materials 2-1 to 2-3 shown in Fig. 14 (three layers), and may be two or more layers.

[0121] The coil portion 3B is a conductor unit having an annular shape in a plan view seen from the thickness direction of the base materials 2-1 to 2-3, and is disposed inside the main body portion 4 as shown in Fig. 14. In detail, as shown in Fig. 14, the coil portion 3B is a laminated coil portion including a plurality of wiring layers laminated in the thickness direction of the base material via a plurality of base materials. For example, the coil portion 3B includes, as the plurality of wiring layers, a first wiring layer 20B having a first connection end 22B, a second wiring layer 25B having a second connection end 27B, and intermediate wiring layers 29-1 and 29-2 laminated between the first wiring layer 20B and the second wiring layer 25B.

[0122] The first wiring layer 20B is a conductor layer having a coil pattern formed on the first substrate surface of the substrate 2-1. For example, the coil pattern of the first wiring layer 20B forms a loop wound 0.5 to 1 turn around a central axis (not shown) parallel to the Z direction of the electronic component 1B in a plan view seen from the thickness direction of the substrate 2-1 (the vertical direction of the paper surface of FIG. 14). At this time, of both ends in the wiring direction of the first wiring layer 20B, one end is a first connection end 22B electrically connected to the first external electrode 6, and the other end is a via pad portion corresponding to the via hole 13-1. The configuration of the via pad portion is the same as that of the first via pad portion 21 of the above-mentioned embodiment 1. The relationship between the via pad portion and the via hole 13-1 is the same as that between the first via pad portion 21 and the via hole 13 of the above-mentioned embodiment 1.

[0123] The intermediate wiring layer 29-1 is a conductor layer interposed between the second substrate surface of the substrate 2-1 and the first substrate surface of the substrate 2-2. For example, the coil pattern of the intermediate wiring layer 29-1 forms a ring shape overlapping the first wiring layer 20B described above in a plan view seen from the thickness direction of the substrate 2-1. At this time, one end of the intermediate wiring layer 29-1 in the wiring direction is a via pad portion overlapping the via hole 13-1 in a plan view seen from the thickness direction of the substrate 2-1, as shown in FIG. 14. The configuration of the via pad portion is the same as that of the second via pad portion 26 of the first embodiment described above, and the relationship between the via pad portion and the via hole 13-1 is the same as that between the second via pad portion 26 of the first embodiment described above. In addition, the other end of the intermediate wiring layer 29-1 in the wiring direction is a via pad portion overlapping the via hole 13-2 in a plan view seen from the thickness direction of the substrate 2-2, as shown in FIG. 14. The configuration of this via pad portion is similar to that of the first via pad portion 21 of the above-described embodiment 1, and the relationship between this via pad portion and the via hole 13-2 is similar to the relationship between the first via pad portion 21 and the via hole 13 of the above-described embodiment 1.

[0124] The intermediate wiring layer 29-2 is a conductor layer interposed between the second substrate surface of the substrate 2-2 and the first substrate surface of the substrate 2-3. For example, the coil pattern of the intermediate wiring layer 29-2 is a ring-shaped coil overlapping the intermediate wiring layer 29-1 in a plan view from the thickness direction of the substrate 2-2. At this time, one end of the intermediate wiring layer 29-2 in the wiring direction is a via pad portion overlapping the via hole 13-2 in a plan view from the thickness direction of the substrate 2-2, as shown in FIG. 14. The configuration of the via pad portion is the same as that of the second via pad portion 26 of the first embodiment described above, and the relationship between the via pad portion and the via hole 13-2 is the same as that between the second via pad portion 26 of the first embodiment described above. In addition, the other end of the intermediate wiring layer 29-2 in the wiring direction is a via pad portion overlapping the via hole 13-3 in a plan view from the thickness direction of the substrate 2-3, as shown in FIG. 14. The configuration of this via pad portion is similar to that of the first via pad portion 21 of the above-described embodiment 1, and the relationship between this via pad portion and the via hole 13-2 is similar to the relationship between the first via pad portion 21 and the via hole 13 of the above-described embodiment 1.

[0125] The second wiring layer 25B is a conductor layer having a coil pattern formed on the second substrate surface of the substrate 2-3. For example, the coil pattern of the second wiring layer 25B forms a loop wound 0.5 to 1 turn around a central axis parallel to the Z direction of the electronic component 1B in a plan view from the thickness direction of the substrate 2-3. At this time, of both ends in the wiring direction of the second wiring layer 25B, one end is a via pad portion corresponding to the via hole 13-3, and the other end is a second connection end 27B electrically connected to the second external electrode 7. The configuration of the via pad portion is the same as that of the second via pad portion 26 of the first embodiment described above. The relationship between the via pad portion and the via hole 13-3 is the same as that between the second via pad portion 26 and the via hole 13 of the first embodiment described above.

[0126] Although not shown, a base layer formed in a coil pattern is interposed between each substrate surface of the above-mentioned substrates 2-1 to 2-3 and each wiring layer (first wiring layer 20B, intermediate wiring layers 29-1 and 29-2, and second wiring layer 25B) of the coil portion 3B. Each wiring layer of the coil portion 3B is formed by performing metal plating on the base layer. The conductors constituting each wiring layer of the coil portion 3B are similar to the first wiring layer 20 and the second wiring layer 25 of the above-mentioned embodiment 1.

[0127] The number of turns (windings) and wiring width of the wiring layer in the coil portion 3B are set according to the characteristics required for the electronic component 1B, such as electrical resistance and inductance. The number of stacked wiring layers in the coil portion 3B is not limited to four layers as shown in Fig. 14, and may be two or more layers. From the viewpoint of reducing stress applied to the base material, it is preferable that the number of stacked wiring layers in the coil portion 3B is an even number, with two wiring layers formed on both end faces of the base material in the thickness direction as a unit.

[0128] 14, the coil portion 3B includes a conductive portion 30B that electrically connects the wiring layers of the coil portion 3B. The conductive portion 30B covers the surfaces of the first wiring layer 20B and the intermediate wiring layer 29-1, and electrically connects the first wiring layer 20B and the intermediate wiring layer 29-1 through the via hole 13-1 of the substrate 2-1. The conductive portion 30B covers the surfaces of the intermediate wiring layers 29-1 and 29-2, and electrically connects the intermediate wiring layers 29-1 and 29-2 through the via hole 13-2 of the substrate 2-2. The conductive portion 30B covers the surfaces of the intermediate wiring layer 29-2 and the second wiring layer 25B, and electrically connects the intermediate wiring layer 29-2 and the second wiring layer 25B through the via hole 13-3 of the substrate 2-3.

[0129] As shown in FIG. 14, the conductive portion 30B as described above has a via conductor portion 33-1 inside the via hole 13-1, a via conductor portion 33-2 inside the via hole 13-2, and a via conductor portion 33-3 inside the via hole 13-3. Each of these via conductor portions 33-1 to 33-3 is similar to the via conductor portion 33 of the above-mentioned embodiment 1. The electrical connection structure between the wiring layers by the conductive portion 30B is similar to that of the conductive portion 30 of the above-mentioned embodiment 1. The conductor constituting the conductive portion 30B is similar to that of the conductive portion 30 of the above-mentioned embodiment 1. Although not particularly shown, an insulating layer similar to the first insulating layer 51 and the second insulating layer 52 of the above-mentioned embodiment 1 is formed on each surface of the conductive portion 30B and the base materials 2-1 to 2-3.

[0130] As described above, in this modification, the coil portion contained in the main body 4 of the electronic component 1B is a laminated coil portion 3B, and the wiring layers of this coil portion 3B are electrically connected to each other at the conductive portion 30B through the via holes 13-1 to 13-3 of the substrates 2-1 to 2-3, respectively, and the rest is configured in the same manner as in embodiment 1. Therefore, in the case of the electronic component 1B including the laminated coil portion 3B, it is possible to enjoy the same effects as those of embodiment 1 described above.

[0131] In the above-mentioned first and second embodiments, a two-layer coil having a spiral-shaped wiring layer on both end faces in the thickness direction of the substrate is exemplified as the coil contained inside the main body of the electronic component, but the present invention is not limited thereto. For example, the coil of the electronic component according to the present invention may be a single-layer coil having a spiral-shaped wiring layer on one end face in the thickness direction of the substrate, or a multi-layer coil in which spiral-shaped wiring layers formed on both end faces in the thickness direction of the substrate are arranged in the thickness direction. In particular, from the viewpoint of reducing the stress applied to the substrate, it is preferable that the number of layers of the wiring layers included in the coil is an even number, with two wiring layers formed on both end faces in the thickness direction of the substrate as a unit.

[0132] In the above-mentioned second embodiment, the first internal terminal 63 and the second internal terminal 64 are formed by the internal terminal forming step in step S106a, and then the coil portion 3A is sealed inside the compact (main body portion 4) of the magnetic material 115, but the present invention is not limited to this. For example, after sealing the coil portion 3A inside the compact of the magnetic material 115, a first opening hole leading from the lower surface of the compact to the electrode conductive portion 62 and a second opening hole leading to the conductive portion 30 (second coating layer 32) on the surface of the second connection end portion 27A may be formed by a device such as a drill, and the insides of the first opening hole and the second opening hole may be plated to form the first internal terminal 63 and the second internal terminal 64. In addition, the coil portion 3A may not be provided with the first internal terminal 63 and the second internal terminal 64, and the electrode conductive portion 62 electrically connected to the first connection end 22A and the second coating layer 32 formed on the surface of the second connection end 27A may be exposed from the underside of the main body portion 4, the exposed portion of the electrode conductive portion 62 may be electrically connected to the first external electrode 6A, and the exposed portion of the second coating layer 32 may be electrically connected to the second external electrode 7A.

[0133] In the above-mentioned first and second embodiments, the wiring pattern of the coil part included in the main body part of the electronic component is exemplified by the spiral coil pattern shown in Fig. 4 and Fig. 5, but the present invention is not limited to this. For example, the coil pattern of the coil part in the present invention may be a circular pattern, an oval pattern such as an ellipse or a rounded rectangle, or a rectangular pattern in a plan view seen from the thickness direction of the substrate.

[0134] The present invention is not limited to the above-mentioned first and second embodiments and modifications, and also includes configurations in which the above-mentioned components are appropriately combined. In addition, other embodiments, examples, operation techniques, etc. made by those skilled in the art based on the above-mentioned first and second embodiments or modifications are all included in the scope of the present invention. [Explanation of symbols]

[0135] 1, 1A, 1B Electronic Components 2, 2-1~2-3 Base material 3, 3A, 3B Coil section 4 Main body 5 Exterior Coat 6, 6A 1st external electrode 7, 7A 2nd external electrode 11 First base material side 12 2nd base material side 13, 13-1~13-3 Beer Hall 14 Electrode via hole 15 Opening 20, 20B 1st wiring layer 21 First via pad section 22, 22A, 22B First connection end 23 First opening 25, 25B 2nd wiring layer 26 2nd via pad section 27, 27A, 27B Second connection end 28 Second Opening 29-1, 29-2 Intermediate wiring layer 30, 30B Continuity part 31 First coating layer 32 Second coating layer 33, 33-1 to 33-3 Via conductor section 41 1st base layer 42 Second base layer 51 First insulating layer 52 Second insulating layer 61 Wiring section 61a opening 62 Electrode conduction part 63 1st internal terminal 64 2nd internal terminal 65 Insulating Layer 101 1st Resist 102 Second Resist 111 First coil pattern 111a First opening pattern 112 Second coil pattern 112a Second opening pattern 115 Magnetic materials

Claims

1. A substrate; A coil portion having an annular shape in a plan view seen from a thickness direction of the base material; Equipped with The coil portion includes: a first wiring layer having a coil pattern formed on a first substrate surface of both end surfaces of the substrate in a thickness direction; a second wiring layer having a coil pattern formed on a second substrate surface different from the first substrate surface among the both end surfaces of the substrate; a conductive portion covering each surface of the first wiring layer and the second wiring layer and electrically connecting the first wiring layer and the second wiring layer through a via hole penetrating the base material; An electronic component comprising:

2. The coil portion includes: a first via pad portion having a maximum width equal to or less than a wiring width of the first wiring layer, forming one end portion of the first wiring layer in a wiring direction, and surrounding an opening of the via hole on the first substrate surface side; a second via pad portion having a maximum width equal to or less than a wiring width of the second wiring layer, forming one end portion of the second wiring layer in a wiring direction, and surrounding an opening of the via hole on the second substrate surface side; The electronic component according to claim 1 , further comprising:

3. each of the coil patterns of the first wiring layer and the second wiring layer has a spiral shape in a plan view seen from a thickness direction of the base material; the conductive portion contacts one end of the spiral shape of the first wiring layer and one end of the spiral shape of the second wiring layer through the via hole; 3. The electronic component according to claim 1 or 2.

4. Further comprising an insulating layer covering a surface of the conductive portion.

3. The electronic component according to claim 1 or 2.

5. A main body portion containing magnetic powder and containing the coil portion; a first external electrode provided on an outer surface of the main body and electrically connected to the first wiring layer; a second external electrode provided on an outer surface of the main body portion in a pair with the first external electrode and electrically connected to the second wiring layer; The electronic component according to claim 1 or 2, further comprising:

6. the main body portion encloses the coil portion in a manner that a connection end of the first wiring layer to the first external electrode and a connection end of the second wiring layer to the second external electrode are exposed.

6. The electronic component according to claim 5.

7. a lead wiring portion extending from the second substrate surface in a thickness direction of the substrate and spaced apart from the second wiring layer; an electrode conductive portion that covers a surface of the connection end portion of the first wiring layer that overlaps with the lead-out wiring portion in a plan view seen from the thickness direction of the base material and a surface of the lead-out wiring portion, and electrically connects the connection end portion and the lead-out wiring portion through an electrode via hole that penetrates the base material; a first internal terminal electrically connecting the first wiring layer and the first external electrode via the electrode conductive portion; a second internal terminal electrically connecting the second wiring layer and the second external electrode via the conductive portion covering a surface of a connection end portion of the second wiring layer that is paired with the connection end portion of the first wiring layer; The electronic component according to claim 5 , further comprising:

8. A first undercoat layer formed on the first substrate surface; A second undercoat layer formed on the second substrate surface; Further equipped with the first underlayer is interposed between the first substrate surface and the first wiring layer, and the second underlayer is interposed between the second substrate surface and the second wiring layer; 3. The electronic component according to claim 1 or 2.

9. the first underlayer has the same coil pattern as the first wiring layer; The second underlayer has the same coil pattern as the second wiring layer.

9. The electronic component according to claim 8.

10. the first underlayer and the second underlayer are conductor layers containing at least one of nickel, chromium, and titanium; the first wiring layer, the second wiring layer and the conductive portion are conductor layers containing copper; 9. The electronic component according to claim 8.

11. The conductive portion is a first covering layer covering a surface of the first wiring layer; a second covering layer covering a surface of the second wiring layer; a via conductor portion filled in the via hole; 3. The electronic component according to claim 1, further comprising:

12. a base layer forming step of forming a base layer on a first substrate surface at one end side and a second substrate surface at the other end side in a thickness direction of the substrate; a pattern forming step of forming a coil pattern on an underlayer on the first substrate surface and an underlayer on the second substrate surface; a first plating step of plating a surface of a base layer forming the coil pattern on the first substrate surface to form a first wiring layer having a first opening portion communicating with the first substrate surface, and plating a surface of a base layer forming the coil pattern on the second substrate surface to form a second wiring layer having a second opening portion communicating with the second substrate surface at a position overlapping with the first opening portion in a thickness direction of the substrate; a via hole forming step of forming via holes penetrating the base material on the inside of each of the first opening and the second opening; a second plating step of plating a conductor layer covering each surface of the first wiring layer and the second wiring layer, while filling the interior of the via hole with a via conductor portion grown from the conductor layer, thereby electrically connecting the first wiring layer and the second wiring layer; A method for manufacturing an electronic component, comprising:

13. In the via hole forming step, the via hole is formed by a laser processing method or an etching method. The method for manufacturing an electronic component according to claim 12 .

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