Light-emitting device

Abstract

To provide a light-emitting device whose adhesion state is stable even after long use.SOLUTION: A light-emitting device includes a semiconductor laser element, a package including a hermetically sealed space and having the semiconductor laser element in the space, an optical member fixed to the package, a first adhesive to fix the optical member to the package, and a second adhesive having higher resistance against light than the first adhesive. The first adhesive and the second adhesive are bonded to the optical member between an emission surface of the package and an incidence surface of the optical member. In the optical member, one or more first bonded regions where the first adhesive is bonded, and one or more second bonded regions where the second adhesive is bonded have light-transmitting property.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a light emitting device. [Background technology]

[0002] Patent Document 1 discloses that a package that places a semiconductor laser element in a hermetically sealed space and an optical member are joined with an ultraviolet curing resin adhesive after adjusting their positions. According to Patent Document 1, since the position can be adjusted and fixed, it is possible to mount with high precision.

[0003] Furthermore, light emitting devices having light emitting elements such as semiconductor laser elements are incorporated into various products such as projectors and car headlights for use. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication 2017-201684 Summary of the Invention [Problem to be solved by the invention]

[0005] To realize a light emitting device with stable adhesion. [Means for solving the problem]

[0006] The light emitting device disclosed includes a semiconductor laser element, a package having an airtightly sealed space in which the semiconductor laser element is disposed, an optical member fixed to the package, a first adhesive for fixing the optical member to the package, and a second adhesive having better resistance to light than the first adhesive, wherein light from the semiconductor laser element is emitted to the outside from an exit surface of the package, the light emitted to the outside from the exit surface of the package is incident on an incident surface of the optical member and is emitted from the exit surface of the optical member, the first adhesive and the second adhesive are bonded to the optical member between the exit surface of the package and the incident surface of the optical member, in the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are provided at positions closer to the incident surface of the optical member than the exit surface of the optical member, and in the optical member, the one or more first bonding regions and the one or more second bonding regions are translucent. Effect of the Invention

[0007] According to the present invention, a light emitting device with a stable adhesive state can be realized. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of a light emitting device according to an embodiment. [Diagram 2] FIG. 2 is a perspective view of a package according to the embodiment. [Diagram 3] FIG. 3 is a perspective view of the package according to the embodiment with a lid member removed. [Figure 4] FIG. 4 is a perspective view of the light emitting device according to the embodiment, from which optical members are removed. [Diagram 5] FIG. 5 is a top view of the light emitting device according to the embodiment. [Figure 6] FIG. 6 is a top view of the package according to the embodiment. [Figure 7] FIG. 7 is a top view of the package according to the embodiment with a lid member removed. [Figure 8]FIG. 8 is a cross-sectional view of the light emitting device taken along line VIII-VIII in FIG. [Figure 9] FIG. 9 is a cross-sectional view showing a modification of the light emitting device according to the embodiment. [Figure 10] FIG. 10 is a graph showing the results of an experiment measuring the light resistance of an adhesive. [Figure 11] FIG. 11 is a graph showing the measurement results of the light resistance of the adhesive. [Figure 12] FIG. 12 is a graph showing the measurement results of the light resistance of the adhesive. [Figure 13] FIG. 13 is a graph showing the measurement results of the light resistance of the adhesive. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] In this specification and claims, polygons such as triangles and quadrangles are referred to as polygons, including shapes in which the corners of the polygons have been processed by rounding, chamfering, removing corners, rounding, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle parts of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while leaving the polygon as the base are included in the interpretation of "polygon" described in this specification and claims.

[0010] This is not limited to polygons, but also applies to words expressing specific shapes such as trapezoids, circles, and irregular shapes. The same is true when dealing with each side that forms the shape. In other words, even if the corners or middle part of a side have been processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0011] In addition, in this specification or claims, when there are multiple equivalents to a certain component and each is to be expressed separately, the component may be distinguished by adding "first" or "second" to the beginning of the component. In addition, when the objects or viewpoints distinguished between this specification and the claims are different, the same addition may not refer to the same object between this specification and the claims.

[0012] For example, if there are objects in this specification that are distinguished by being marked with "first," "second," and "third," and the claims are written with reference to only the "first" and "third" in this specification, the objects marked with "first" and "second" in the claims may refer to the objects marked with "first" and "third" in this specification.

[0013] Hereinafter, the embodiments for carrying out the present invention will be described with reference to the drawings. However, although the embodiments shown embody the technical ideas of the present invention, they do not limit the present invention. In the following description, the same names and symbols indicate the same or similar components, and duplicated descriptions may be omitted as appropriate. Note that the sizes and positional relationships of the components shown in each drawing may be exaggerated for ease of understanding.

[0014] <Embodiment> A light emitting device 1 according to an embodiment will be described. FIGS. 1 to 8 are drawings for explaining an exemplary embodiment of the light emitting device 1. FIG. 1 is a perspective view of the light emitting device 1. FIG. 2 is a perspective view of a package 10 in the light emitting device 1. FIG. 3 is a perspective view of the package 10 from which a lid member 15 has been removed. FIG. 4 is a perspective view of the light emitting device 1 from which an optical member 70 has been removed in order to explain the location of an adhesive 80 provided in the package 10. FIG. 5 is a top view of the light emitting device 1. FIG. 6 is a top view of the package 10. FIG. 7 is a top view in the same state as FIG. 3. FIG. 8 is a cross-sectional view taken along the VIII-VIII cross-sectional line in FIG. 5.

[0015] In addition, the hatched area surrounded by a dotted line in Fig. 5 indicates a bonding region 71 of optical member 70. Moreover, in Fig. 6, the hatched area surrounded by a solid line indicates a bonding region 17 of lid member 15. In addition to the hatching related to bonding region 17, the hatched area between the dotted line and the outline of lid member 15 indicates an area where metal film 16 of lid member 15 is provided.

[0016] The light emitting device 1 has, as its components, a package 10, a semiconductor laser element 20, a submount 30, a reflective member 40, a protective element 50, a plurality of wirings 60, an optical member 70, and an adhesive 80. The package 10 also has a base 11 and a lid member 15.

[0017] The semiconductor laser element 20, the submount 30, the protective element 50, and the multiple wirings 60 are arranged in a hermetically sealed closed space formed by the package 10. The optical member 70 is fixed to the package 10 by an adhesive 80.

[0018] In the illustrated example of the light emitting device 1, four semiconductor laser elements 20 are arranged side by side in a space hermetically sealed by a base 11 and a lid member 15. Each of the semiconductor laser elements 20 is disposed on the base 11 via a submount 30. A reflecting member 40 is disposed in a position to reflect light emitted from the semiconductor laser elements 20. The light emitted from the semiconductor laser elements 20 passes through the lid member 15 and is emitted to the outside of the package 10.

[0019] Moreover, the optical member 70 is bonded to the lid member 15 by an adhesive 80. Moreover, two types of adhesives 80, a first adhesive 81 and a second adhesive 82, are used to bond the optical member 70 and the lid member 15. The light emitted to the outside of the package 10 passes through the optical member 70 and is emitted to the outside of the light emitting device 1.

[0020] First, each component will be described. (base 11) The base 11 has an arrangement area in which other components are arranged, and a side wall surrounding the arrangement area. The base 11 also has a recess, which is formed by the arrangement area and the side wall. The recess is recessed from the top surface of the base 11 toward the bottom surface. Here, the surface that forms the bottom of the depression of the recess is called the bottom surface. The bottom surface can be a major part of the arrangement area.

[0021] When viewed from above, the outer shape of the base 11 is rectangular. Moreover, when viewed from above, the outer shape of the recessed portion of the recess is rectangular. Moreover, when viewed from above, the outer shape of the bottom surface of the base 11 is rectangular. The outer shape of the bottom surface is smaller than the outer shape of the recessed portion. Note that none of these outer shapes need to be rectangular.

[0022] The base 11 has a bottom surface portion 12 and a side surface portion 13. The bottom surface portion 12 is a portion that constitutes the bottom surface of the base 11. The bottom surface portion 12 includes the bottom surface and the lower surface of the base 11. The bottom surface portion 12 is formed in a flat plate shape. This flat plate is smaller than the outer surface of the base 11 when viewed from above.

[0023] The side surface portion 13 is a portion that constitutes the side wall of the base portion 11. Thus, the side surface portion 13 surrounds the bottom surface of the base portion 11 and extends upward from the bottom surface. The side surface portion 13 includes one or more outer surfaces, one or more inner surfaces, and an upper surface that intersects with the outer and inner surfaces of the base portion 11. The side surface portion 13 also includes the lower surface of the base portion 11.

[0024] Here, the number of inner or outer faces of the base 11 depends on the shape surrounding the bottom. For example, if the shape surrounding the bottom is rectangular, inner faces are formed corresponding to each of the four sides of the rectangle, and the number of inner faces is multiple. Also, for example, if the shape surrounding the bottom is circular, inner faces are formed corresponding to one circle, and the number of inner faces is one. The same applies to the outer faces.

[0025] A plurality of wiring regions 14 are provided on the base 11. Moreover, one or more wiring regions 14 are provided in the recessed portion of the recess, and one or more wiring regions 14 are provided outside the recessed portion. Moreover, the wiring regions 14 provided in the recessed portion are electrically connected to the wiring regions 14 provided outside the recessed portion.

[0026] In the illustrated example of the light emitting device 1, a plurality of wiring regions 14 are provided in a recessed portion of a recess formed by a bottom surface and an inner side surface. Also, a plurality of wiring regions 14 are provided on the lower surface of the base 11, which is outside the recessed portion. Note that the wiring regions 14 are not limited to the lower surface of the base 11, and may be provided on, for example, the upper surface or the outer surface.

[0027] The bottom surface portion 12 and the side surface portion 13 of the base 11 are formed using different materials as the main material. For example, the side surface portion 13 may be made of ceramic and the bottom surface portion 12 may be made of metal as the main material. The base 11 is formed by joining the bottom surface portion 12 and the side surface portion 13. It is also possible to use a base 11 in which the bottom surface portion 12 and the side surface portion 13 are integrally formed. In this case, for example, ceramic may be used as the main material.

[0028] Examples of ceramics include aluminum nitride, silicon nitride, aluminum oxide, silicon carbide, etc. Examples of metals that can be used include copper, aluminum, iron, etc., and composites such as copper molybdenum, copper-diamond composite material, and copper tungsten, etc. The metal used for the bottom portion 12 is preferably one that has better heat dissipation properties (higher thermal conductivity) than the ceramic used for the side portion 13.

[0029] A metal film is provided on the wiring region 14 of the base 11 and on the areas corresponding to the wiring regions electrically connected thereto. Metal is also provided on the areas passing through the interior for electrical connection, thereby achieving electrical connection.

[0030] (Cover member 15) The cover member 15 has a lower surface and an upper surface, and is configured in a rectangular parallelepiped flat plate shape. However, it does not have to be a rectangular parallelepiped. Furthermore, the cover member 15 has translucency that transmits light. Therefore, the cover member 15 can also be called a translucent member. However, a translucent member that does not function as a cover may be used.

[0031] Here, translucency refers to a light transmittance of 80% or more. However, it is not necessary for the transmittance to be 80% or more for all wavelengths of light. Furthermore, the cover member 15 may have a non-translucent region (a region that does not have translucency) in part.

[0032] Moreover, the cover member 15 has a metal film 16 provided on a partial area on its surface. This metal film 16 is provided for bonding with other components. Therefore, a part or all of the area where the metal film 16 is provided becomes a bonding area for bonding with other components. The metal film 16 is provided on the lower surface of the cover member 15. The metal film 16 is provided in a ring shape along the outer edge of the cover member 15. The area directly above the metal film 16 is translucent.

[0033] The cover member 15 can be made of sapphire. Sapphire is a material that is transparent, has a relatively high refractive index, and is also relatively strong. In addition to sapphire, for example, glass can also be used. The metal film 16 can be made of, for example, Ti / Pt / Au.

[0034] (Semiconductor laser element 20) The semiconductor laser element 20 has a rectangular outer shape when viewed from above. A side surface intersecting one of the two short sides of the rectangle serves as an emission end surface for light emitted from the semiconductor laser element 20. The upper and lower surfaces of the semiconductor laser element 20 have areas larger than that of the emission end surface.

[0035] The light (laser light) emitted from the semiconductor laser element 20 has a spreading property and forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emission end face. The FFP refers to the shape and light intensity distribution of the emitted light at a position away from the emission end face.

[0036] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the light intensity distribution of the FFP, is called the light traveling along the optical axis. Also, in the light intensity distribution of the FFP, the peak intensity value is 1 / e 2The light having an intensity equal to or greater than this will be referred to as the main portion of the light.

[0037] The shape of the FFP of the light emitted from the semiconductor laser element 20 is an ellipse in which the stacking direction perpendicular to the layer direction of the multiple semiconductor layers including the active layer is longer than the layer direction of the multiple semiconductor layers including the active layer. Note that the layer direction is referred to as the horizontal direction of the FFP, and the stacking direction is referred to as the vertical direction of the FFP.

[0038] Based on the light intensity distribution of the FFP, the angle equivalent to the full width at half maximum of the light intensity distribution is defined as the light divergence angle of the semiconductor laser element. The light divergence angle in the vertical direction of the FFP is defined as the vertical divergence angle, and the light divergence angle in the horizontal direction of the FFP is defined as the horizontal divergence angle.

[0039] For example, a semiconductor laser element that emits blue light, a semiconductor laser element that emits green light, or a semiconductor laser element that emits red light can be used as the semiconductor laser element 20. Also, a semiconductor laser element that emits light other than these may be used.

[0040] Here, blue light refers to light whose emission peak wavelength is in the range of 420nm to 494nm, green light refers to light whose emission peak wavelength is in the range of 495nm to 570nm, and red light refers to light whose emission peak wavelength is in the range of 605nm to 750nm.

[0041] Examples of semiconductor laser elements that emit blue light or green light include semiconductor laser elements that include nitride semiconductors. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. Examples of semiconductor laser elements that emit red light include those that include InAlGaP, GaInP, GaAs, and AlGaAs semiconductors.

[0042] The semiconductor laser element 20 is a single emitter having one emitter, but may be a multi-emitter having two or more emitters. When the semiconductor laser element 20 has multiple emitters, laser light that forms an elliptical FFP is emitted from the emission end face associated with each emitter.

[0043] (Submount 30) The submount 30 has two bonding surfaces and is configured in a rectangular parallelepiped shape. One bonding surface is provided on the opposite side to the other bonding surface. The distance between the two bonding surfaces is smaller than the distance between the other two opposing surfaces. The shape of the submount 30 does not have to be limited to a rectangular parallelepiped. The submount 30 can be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. A metal film for bonding is provided on the bonding surfaces.

[0044] (Reflective member 40) The reflecting member 40 has a light reflecting surface that reflects light. The light reflecting surface is inclined with respect to the lower surface. In other words, the light reflecting surface is neither vertical nor parallel when viewed from the lower surface. For example, the light reflecting surface is flat and provided on an inclined surface that forms a 45 degree inclination angle with the lower surface. The light reflecting surface may be curved rather than flat. The inclination angle does not have to be limited to 45 degrees. In the case of a curved surface, there may be localized portions that are vertical or parallel when viewed from the lower surface.

[0045] The reflecting member 40 may be mainly made of glass or metal. The main material is preferably a material that is resistant to heat, and may be, for example, glass such as quartz or BK7 (borosilicate glass), or metal such as aluminum. It may also be formed using Si as the main material. The light reflecting surface may be, for example, a metal such as Ag or Al, or Ta. 2 O 5 / SiO 2 , TiO 2 / SiO 2 , Nb 2 O 5 / SiO 2 The dielectric multilayer film may be formed using the above dielectric multilayer films.

[0046] The light reflectance of the light reflecting surface for the peak wavelength of the laser light to be reflected is 95% or more. It is also possible to achieve a light reflectance of 99% or more. These light reflectances are 100% or less or less than 100%.

[0047] (Protection element 50) The protective element 50 is intended to prevent an excessive current from flowing through a specific element (such as the semiconductor laser element 20) and causing the element to be destroyed. An example of the protective element 50 is a Zener diode. The Zener diode may be made of Si.

[0048] (Wiring 60) The wiring 60 is configured in a linear shape with both ends being joints. In other words, both ends of the linear portion become joints with other components. The wiring 60 is, for example, a metal wire. For example, gold, aluminum, silver, copper, etc. can be used as the metal.

[0049] (Optical member 70) The optical member 70 has an upper surface, a lower surface, and a side surface. It also has a lens surface. The lens surface intersects with a plane. For example, the upper surface intersects with the side surface and is composed of a plane, and the lens surface intersects with the side surface. In this case, it can be said that the upper surface of the optical member 70 has an area composed of a plane and an area composed of a lens surface. Note that instead of or in addition to the upper surface, the lower surface may have a lens surface. Also, the upper surface may be composed of only a lens surface.

[0050] The optical member 70 has a shape in which a semicircular lens is arranged on the upper surface of a flat plate shape as a whole. If these are called the flat plate portion and the lens portion, respectively, the flat upper surface that intersects with the side surface corresponds to the upper surface of the flat plate portion, and the upper surface composed of the lens surface corresponds to the upper surface of the lens portion. The optical member 70 is formed by integrating the flat plate portion and the lens portion. Alternatively, they may be formed as separate bodies and then joined together.

[0051] The external shape of the optical member 70 is rectangular when viewed from above or below. However, it does not have to be rectangular. The lens portion can also be said to be the portion that overlaps with the lens surface when viewed from above. The portion of the optical member 70 other than the lens portion will be called the non-lens portion.

[0052] The lens surface is configured with a plurality of lenses arranged in a row. The lens surface is configured with a plurality of lenses lined up. The lens surface is configured with a plurality of lenses lined up in the same direction. The length of the lens surface in the direction in which the lenses are lined up is longer than the major axis of each lens (the length in the direction perpendicular to the direction in which the lenses are lined up). It may be shorter.

[0053] The optical member 70 has translucency. In addition, both the lens portion and the non-lens portion of the optical member 70 have translucency. In addition, the optical member 70 as a whole has translucency. The optical member 70 can be formed using glass such as BK7.

[0054] (Adhesive 80) The adhesive 80 includes two types of adhesives, a first adhesive 81 and a second adhesive 82. Of the two types of adhesives, the first adhesive 81 is an ultraviolet curing resin, and the second adhesive 82 is a thermosetting resin. The combination of the first adhesive 81 and the second adhesive 82 is not limited to this. Hereinafter, anything that can be applied to both the first adhesive 81 and the second adhesive 82 will be described as the adhesive 80.

[0055] An adhesive having better resistance to light than the first adhesive is used for the second adhesive 82. Here, "having better resistance to light" means having better resistance after the adhesive 80 is bonded and the light emitting device 1 is mounted. In addition, an adhesive having better resistance to visible light (wavelength range of 400 nm or more and 760 nm or less) than the first adhesive is used for the second adhesive 82. In addition, an adhesive having better resistance to blue light than the first adhesive is used for the second adhesive 82.

[0056] For example, the cured adhesive 80 is subjected to a predetermined energy density [W / mm 2 If the first adhesive loses its function as an adhesive in a shorter time than the second adhesive when irradiated with light of the same energy density, then it can be said that the second adhesive 82 has better resistance to light than the first adhesive 81.

[0057] The ultraviolet curable resin may be an adhesive such as an epoxy resin or an acrylate resin, and the thermosetting resin may be an adhesive such as an epoxy resin or a silicone resin.

[0058] (Light emitting device 1) Next, the light emitting device 1 will be described. The light emitting device 1 has a semiconductor laser element 20, a package 10 in which the semiconductor laser element 20 is disposed, and an optical member 70 fixed to the package 10. The optical member 70 is fixed to the package 10 using an adhesive 80. At least two types of adhesives 80, a first adhesive 81 and a second adhesive 82, are used to fix the optical member 70. Instead of the semiconductor laser element 20, other light emitting elements such as LEDs may be used.

[0059] In addition to the semiconductor laser element 20, a submount 30, a reflective member 40, and a protective element 50 are arranged in the package 10. These components are arranged on a base 11 of the package 10. The semiconductor laser element 20 and the protective element 50 are electrically connected to the wiring region 14 by wiring 60.

[0060] Moreover, after the semiconductor laser element 20, the submount 30, the reflecting member 40, the protective element 50, and the wiring 60 are arranged on the base 11, the base 11 and the lid member 15 are joined to seal the space in which the semiconductor laser element 20 is arranged, thereby completing the package 10. This sealed space is formed by joining the base 11 and the lid member 15. Moreover, the metal film 16 of the lid member 15 becomes a joining region that is joined to the base 11.

[0061] Such a light emitting device 1 is manufactured through a process of creating a package 10 in which a semiconductor laser element 20 is arranged, or through a process of preparing a package 10 in which a semiconductor laser element 20 is arranged, followed by a process of fixing an optical member 70 to the package 10.

[0062] In creating the package 10, the semiconductor laser element 20 is placed on the bottom surface (placement region) of the base 11. Note that a plurality of semiconductor laser elements 20 may be placed. Also, a plurality of semiconductor laser elements 20 may be placed side by side with their emission end faces facing the same direction. Alternatively, the emission end faces may be placed opposite each other. Also, the semiconductor laser elements 20 may be placed such that the side faces intersecting with the emission end faces of adjacent semiconductor laser elements 20 face each other.

[0063] In the illustrated example of the light emitting device 1, four semiconductor laser elements 20 are arranged side by side, facing the same light emitting end face. In addition, in a top view, the semiconductor laser elements 20 are arranged side by side in the longitudinal direction of the package 10. In addition, between adjacent semiconductor laser elements 20, the side faces that intersect with the respective light emitting end faces and face each other are parallel to each other in a top view.

[0064] Moreover, each of the four semiconductor laser elements 20 is configured as a semiconductor laser element that emits blue light. When multiple semiconductor laser elements 20 are arranged in the package 10, all of the semiconductor laser elements 20 do not have to be configured to emit light of the same color. Furthermore, the color of the emitted light is not limited to blue, and may be another color. Furthermore, multiple semiconductor laser elements that emit light of different colors may be arranged to form the package 10 that emits light of multiple colors.

[0065] The submount 30 is bonded to the semiconductor laser element 20 at one bonding surface. The other bonding surface on the opposite side is bonded to the bottom surface of the base 11. Only one semiconductor laser element 20 is disposed on one submount 30. Therefore, when a plurality of semiconductor laser elements 20 are provided, a plurality of submounts 30 are provided in the same number as the number of semiconductor laser elements 20. Note that a plurality of semiconductor laser elements 20 may be disposed on one submount 30.

[0066] In the illustrated example of the light emitting device 1, one semiconductor laser element 20 is disposed on one submount 30, and the same number of submounts 30 as the number of semiconductor laser elements 20 are bonded to the bottom surface of the base 11. In addition, the emission end surface of each semiconductor laser element 20 is disposed near the side end of the submount 30 so that the main part of the light emitted from the semiconductor laser element 20 is not irradiated onto the upper surface of the submount 30.

[0067] The submount 30 is bonded to the base 11 after the semiconductor laser element 20 is bonded to the submount 30. Alternatively, the semiconductor laser element 20 may be bonded to the submount 30 after the submount 30 is bonded to the base 11. The semiconductor laser element 20 may be disposed directly on the bottom surface of the base 11 without the submount 30.

[0068] The reflecting member 40 is disposed on the bottom surface of the base 11. The reflecting member 40 is disposed in such a direction that the light emitted from the semiconductor laser element 20 is irradiated onto the light reflecting surface. The main part of the light emitted from the semiconductor laser element 20 is irradiated onto the light reflecting surface of the reflecting member 40.

[0069] One reflecting member 40 corresponds to one semiconductor laser element 20, and a main portion of light from one semiconductor laser element 20 is irradiated onto a light reflecting surface of one reflecting member 40. When a plurality of semiconductor laser elements 20 are provided, a plurality of reflecting members 40 are provided in the same number as the number of semiconductor laser elements 20. Note that a single reflecting member 40 may be irradiated with a main portion of light from a plurality of semiconductor laser elements 20.

[0070] In the illustrated example of the light emitting device 1, one semiconductor laser element 20 corresponds to one reflecting member 40, and four reflecting members 40 are bonded to the bottom surface of the base 11. The reflecting members 40 are also arranged in the same direction as the semiconductor laser elements 20. The light reflecting surface is inclined at an angle of 45 degrees with respect to the traveling direction of light passing through the optical axis.

[0071] In the illustrated example of the light emitting device 1, the light reflecting surface of the reflecting member 40 reflects 98% or more of the irradiated main portion of light. The reflecting member 40 reflects upward the light emitted laterally from the semiconductor laser element 20. Note that the light emitting device 1 does not necessarily have to have the reflecting member 40. In this case, for example, the light emitting end surface of the semiconductor laser element 20 faces upward.

[0072] The protective element 50 is disposed in the wiring region 14 of the base 11. Also, the protective element 50 is disposed in a wiring region 14 provided in a recessed portion of the recess. Also, the protective element 50 is disposed on two wiring regions 14, thereby electrically connecting the protective element 50. Note that the protective element 50 may be disposed on one wiring region 14, and connected to the other wiring region 14 by wiring. In the illustrated example of the light emitting device 1, the protective element 50 is disposed across the two wiring regions 14 in a top view.

[0073] The wiring 60 is bonded to the wiring region 14 of the base 11. It is also bonded to the wiring region 14 provided in the recessed portion of the recess. It is also bonded to the semiconductor laser element 20. It is also bonded to the submount 30. The wiring 60 is provided to electrically connect the semiconductor laser element 20 to the wiring region 14. When multiple semiconductor laser elements 20 are provided, the multiple semiconductor laser elements 20 are electrically connected in series. They may also be electrically connected in parallel.

[0074] The lid member 15 is disposed on the upper surface of the base 11. By bonding the lid member 15, a closed space surrounded by the base 11 and the lid member 15 is created. The components disposed on the base 11, such as the semiconductor laser element 20 and the reflecting member 40, are confined in this space. Furthermore, the lid member 15 is bonded to the base 11 under a specified atmosphere, and this closed space becomes a hermetically sealed space. The semiconductor laser element 20 is disposed in the hermetically sealed space, which makes it possible to suppress quality deterioration due to dust collection.

[0075] The lid member 15 is bonded to the base 11 at the metal film 16. A metal film for bonding is also provided in the region where the base 11 is bonded to the lid member 15. The base 11 and the lid member 15 are bonded using a metal bonding material. For example, a metal bonding agent such as AuSn is placed in the bonding region of the base 11, and the bonding region of the lid member 15 is placed thereon to bond the base 11 and the lid member 15. Note that as the metal bonding material, in addition to a brazing metal such as AuSn, solder or the like can also be used.

[0076] Lid member 15 is translucent to the light emitted from semiconductor laser element 20. A major portion of the light emitted from semiconductor laser element 20 passes through a translucent region of lid member 15 and is emitted from the upper surface of lid member 15 to the outside of package 10. The lower surface of lid member 15 can be considered as an incident surface for light emitted from semiconductor laser element 20. The upper surface of lid member 15 can be considered as an exit surface for light emitted from semiconductor laser element 20.

[0077] In the illustrated example of light emitting device 1, Ni plating is provided in the bonding regions on the upper surface of base 11 and the lower surface of lid member 15, bonding lid member 15 to base 11. In addition, the region of lid member 15 where metal film 16 is provided or above the bonding region is translucent. In other words, in package 10, light emitted from above lid member 15 toward metal film 16 passes through the translucent region of lid member 15 to reach metal film 16.

[0078] In the package 10 thus produced, the light emitted from the semiconductor laser element 20 is reflected by the reflecting member 40, passes through the lid member 15 disposed above, and is emitted upward from the package 10. Moreover, 90% or more of the main portion of the light emitted from the semiconductor laser element 20 is emitted to the outside of the package 10. In the example of the light emitting device 1 shown in the figure, 98% or more is emitted to the outside of the package 10.

[0079] Next, in the step of fixing the optical member 70 to the package 10, the optical member 70 is fixed to the package 10. Also, the optical member 70 is fixed to the lid member 15 of the package 10. Also, the optical member 70 is disposed on the upper surface of the package 10, in other words, on the upper surface of the lid member 15.

[0080] The optical member 70 is fixed to the package 10 via an adhesive 80. The adhesive 80 is provided on the upper surface of the package 10, and the optical member 70 is bonded and fixed to the adhesive 80 from above. The adhesive 80 bonds the package 10 and the optical member 70 together.

[0081] Fixing using the adhesive 80 includes a step of bonding using a first adhesive 81 and a step of bonding using a second adhesive 82. First, the first adhesive 81 and the second adhesive 82 are applied to the bonding portion of the package 10 with the optical member 70. In this state, the adhesive has not yet hardened.

[0082] Next, with the optical member 70 and the first adhesive 81 in contact with each other, the first adhesive 81 is cured to bond the package 10 and the optical member 70 via the first adhesive 81. As a result, the first adhesive 81 hardens and the second adhesive is in an unhardened state.

[0083] The first adhesive 81 is used to adjust the position and height of the optical member 70 relative to the package 10. In other words, the position and height of the optical member 70 relative to the package 10 are adjusted, and the first adhesive 81 is allowed to harden while the optical member 70 is stopped in that position, thereby fixing the optical member 70 to the package 10 with the position and height adjusted.

[0084] In order to stop the optical member 70 and the package 10 in a state in which their positions have been adjusted, for example, the package 10 is placed on a stage of a mounting device, and the optical member 70 is held by a collet of the mounting device. Since the ultraviolet curing resin can be bonded quickly, the light emitting device 1 can be manufactured efficiently.

[0085] The arrangement of the optical member 70 is adjusted so that the light emitted from the semiconductor laser element 20 is optically controlled with high precision by the lens surface of the optical member 70. Therefore, the arrangement is adjusted according to each individual light emitting device 1 to be manufactured. Note that the adjustment may be performed for a group of multiple light emitting devices 1.

[0086] Depending on the adjustment, the thickness of the intervening first adhesive 81 (the distance from the upper surface of the package 10 to the lower surface of the optical member 70) can be 200 μm or more. On the other hand, since the irradiation range of the main part of the light becomes wider as the optical path length to the lens surface becomes longer, it is preferable to adjust the thickness of the first adhesive 81 to be 500 μm or less at most.

[0087] Furthermore, even if the first adhesive 81 is thin, the thickness can be 100 μm or more. However, the thickness is not limited to this and may be 100 μm or less. Also, it may be 500 μm or more. A resin adhesive such as an ultraviolet curing resin generates organic gas during a curing process, but by sealing the semiconductor laser element 20 with the lid member 15 in the package 10 and bonding the lid member 15 and the optical member 70 together, quality deterioration due to dust collection can be suppressed.

[0088] Next, the second adhesive 82 in contact with the optical member 70 is cured, and the package 10 and the optical member 70 are joined via the second adhesive 82. As a result, the first adhesive 81 and the second adhesive 82 are in a hardened state.

[0089] The package 10 and the optical member 70 are already fixed with the first adhesive 81. The thermosetting resin requires a process of heating the joint area, and therefore takes longer to bond than the ultraviolet curing resin, but since the optical member 70 does not need to be supported by a mounting device, the curing process for multiple light emitting devices 1 can be performed all at once. After fixing with the ultraviolet curing resin, efficient manufacturing is possible.

[0090] In the light emitting device 1, light emitted from the exit surface of the package 10 to the outside enters the incident surface of the optical member 70 and exits from the exit surface of the optical member 70. In addition, the adhesive 80 is bonded to the optical member 70 between the exit surface of the package 10 and the incident surface of the optical member 70.

[0091] Similarly, the adhesive 80 is bonded to the package 10 between the emission surface of the package 10 and the incidence surface of the optical member 70. Note that another component may be further provided between the package 10 and the optical member 70, and the optical member 70 may be fixed to the package 10 via this intermediate member. In this case, the adhesive 80 is bonded to the intermediate member instead of the package 10.

[0092] The adhesive 80 is bonded to the optical member 70 without entering the optical path of the main portion of the light from the semiconductor laser element 20 from the emission surface of the package 10 until it enters the incident surface of the optical member 70. In other words, the adhesive 80 is provided so as to avoid a position through which the light passing from the emission surface of the package 10 to the incident surface of the optical member 70 passes. This makes it possible to suppress deterioration of the adhesive 80.

[0093] Furthermore, the entrance surface of the optical member 70 into which the light emitted to the outside from the exit surface of the package 10 enters, or the exit surface of the optical member 70 from which the light that has passed through the entrance surface of the optical member 70 exits, is a lens surface. This allows, for example, the light exiting the package 10 to be collimated and emitted from the light emitting device 1. The entrance surface and the exit surface may be lens surfaces.

[0094] In the illustrated example of the light emitting device 1, the emission surface of the optical member 70 is a lens surface. The adhesive 80 is provided on the outer periphery of the lens surface. When the light emitting device 1 is viewed from the light emission side, the adhesive 80 provided on the package 10 before contacting the optical member 70 does not overlap with the lens surface of the optical member 70 after it has been bonded to the package 10. In this example, the light emitting device 1 is viewed from the light emission side in a top view.

[0095] 9 shows an example of the light emitting device 2 in which the incident surface of the optical member is a lens surface. The illustrated light emitting device 2 can be configured with the same components as the illustrated light emitting device 1, except that the shape of the optical member 270 is different from that of the optical member 70.

[0096] Here, in a state where the package 10 and the optical member 70 are fixed together via the adhesive 80, the region of the optical member 70 where the adhesive 80 comes into contact is referred to as a bonding region 71. In addition, the region where the first adhesive 81 comes into contact is referred to as a first bonding region 72, and the region where the second adhesive 82 comes into contact is referred to as a second bonding region 73.

[0097] In addition, the region of the package 10 with which the adhesive 80 comes into contact will also be referred to as the bonding region 17. In the illustrated example of the light emitting device 1, the lid member 15 has the bonding region 17. In addition, the region with which the first adhesive 81 comes into contact will be referred to as the third bonding region 18, and the region with which the second adhesive 82 comes into contact will be referred to as the fourth bonding region 19.

[0098] The first adhesive 81 and the second adhesive 82 are each provided in one or more locations. The optical member 70 has a plurality of bonding regions 71 that are separated from each other (not in contact with each other). The optical member 70 also has a first bonding region 72 and a second bonding region 73 that are separated from each other. The same can be said for the package 10.

[0099] The same can be said for package 10, in other words, the same can be said even if optical member 70 is replaced with package 10, bonding region 71 is replaced with bonding region 17, first bonding region 72 is replaced with third bonding region 18, and second bonding region 73 is replaced with fourth bonding region 19.

[0100] In the illustrated example of the light emitting device 1, the first adhesive 81 and the second adhesive 82 are provided at a plurality of locations. The bonding regions 71 at the respective locations are separated from each other. In addition, in the optical member 70 whose outer shape is rectangular when viewed from the incident surface side, the first adhesive 81 is provided at one diagonal of the rectangle, and the second adhesive 82 is provided at the other diagonal of the rectangle. The first adhesive 81 is provided at two locations in total at one diagonal of the rectangle, and the optical member 70 has two first bonding regions 72 corresponding thereto. The second adhesive 82 is provided at two locations in total at the other diagonal of the rectangle, and the optical member 70 has two second bonding regions 73 corresponding thereto. The two first bonding regions 72 and the two second bonding regions 73 are separated from each other. The two first bonding regions 72 are also separated from each other, and the two second bonding regions 73 are also separated from each other. The same can be said about the package 10.

[0101] By providing the first adhesive 81 and the second adhesive 82 at a distance from each other, it is possible to avoid interference with one adhesive 80 when adhering the other adhesive 80. Furthermore, by providing the first adhesive 81 and the second adhesive 82 at diagonal corners, it is possible to achieve stable bonding with one adhesive 80. Note that the first adhesive 81 and the second adhesive 82 do not have to be provided at diagonal corners. For example, the first adhesive 81 may be provided on one of two opposing sides, and the second adhesive 82 may be provided on the other.

[0102] For example, when the optical member 70 is bonded to a package 10 that does not have a lid member 15 and does not seal the space in which the semiconductor laser element 20 is disposed, providing the adhesive 80 at a distance in this manner makes sealing impossible. By sealing the semiconductor laser element 20 with the lid member 15 and bonding the lid member 15 to the optical member 70, the first adhesive 81 and the second adhesive 82 can be provided at a distance while suppressing quality deterioration due to dust collection.

[0103] In addition, in the optical member 70, the one or more first bonding regions 72 and the one or more second bonding regions 73 are provided at positions closer to the incident surface of the optical member 70 than to the exit surface of the optical member 70. In addition, the optical member 70 has one or more first bonding regions 72 and one or more second bonding regions 73 on a flat surface. When bonding the optical member 70 to the flat surface of the package 10, having a flat bonding region 71 can reduce unevenness in adhesive strength across the bonding regions.

[0104] Moreover, the optical member 70 has one or more first bonding regions 72 and one or more second bonding regions 73 on the same virtual plane. This makes it possible to reduce the difference in thickness between the first adhesive 81 and the second adhesive 82, and to reduce unevenness in the adhesive strength between the first bonding region 72 and the second bonding region 73.

[0105] Moreover, the optical member 70 has one or more first bonding regions 72 and one or more second bonding regions 73 on a plane opposite to the exit surface of the optical member 70. Moreover, since the light irradiation range is wider on the exit surface of the optical member 70 than on the entrance surface of the optical member 70, it is preferable that the first bonding regions 72 and the second bonding regions 73 are not provided on a plane close to the exit surface of the optical member 70, for example, on a plane intersecting with the exit surface of the optical member 70.

[0106] In the illustrated example of the light emitting device 1, the optical member 70 has one or more first bonding regions 72 and one or more second bonding regions 73 on the same plane as the incident surface of the optical member 70. This makes it possible to realize, for example, a light emitting device in which a lens surface is provided on the upper surface or the exit surface.

[0107] In the illustrated example of the light emitting device 2, the optical member 270 has one or more first bonding regions 72 and one or more second bonding regions 73 at positions closer to the exit surface of the package 10 than the entrance surface of the optical member 270. This makes it possible to realize, for example, a light emitting device in which a lens surface is provided on the lower surface or entrance surface.

[0108] The light emitting device 1 includes a first adhesive 81 in which the first bonding region 72 is located at a corner of the optical member 70 and the third bonding region 17 is located at a corner of the package 10 in a top view. The light emitting device 1 also includes a first adhesive 81 in which the first bonding region 72 is located at a corner of the optical member 70 and the third bonding region 17 is not located at a corner of the package 10 in a top view. The same can be said for the second adhesive 82. In this way, the outer shape of the optical member 70 in a top view can be made smaller than the package 10.

[0109] The first bonding region 72 and the second bonding region 73 each have a circular shape. The third bonding region 18 and the fourth bonding region 19 also have a circular shape. Note that the first adhesive 81 and the second adhesive 82 are hardened in a shape pressed between the package 10 and the optical member 70, so the "circular shape" here cannot be said to be a strict circle.

[0110] Each of the first bonding regions 72 has the same shape and size. That is, the amount of the first adhesive 81 disposed in each of the first bonding regions 72 is the same, and the pressure action due to pressing is also approximately the same. However, since the position of the optical member 70 is adjusted, it cannot be said that the pressure action is strictly the same. Similarly, each of the second bonding regions 73 has the same shape and size.

[0111] The area of ​​the first bonding region 72 is 0.5 to 1.5 times the area of ​​the second bonding region 73, and preferably 0.8 to 1.2 times. The area of ​​the third bonding region 18 is 0.5 to 1.5 times the area of ​​the fourth bonding region 19, and preferably 0.8 to 1.2 times. By preventing a large difference in the areas of the two bonding regions in this way, the non-lens portion can be made smaller, and the optical member 70 can be made more compact.

[0112] The light emitting device 1 has a first bonding region 72 that partially overlaps the wiring region 14 in a top view. The light emitting device 1 also has a second bonding region 73 that partially overlaps the wiring region 14 in a top view. The same can be said for the third bonding region 18 and the fourth bonding region 19. By providing the bonding region of the adhesive 80 at a position that overlaps the wiring region 14, the light emitted from the package 10 is not obstructed and the size of the package 10 can be reduced.

[0113] In the light emitting device 1, none of the bonding regions of the adhesive 80 is provided in a top view at a position where a virtual straight line passing through the optical axis of the light emitted from each of the semiconductor laser elements 20 passes. In this way, the non-lens portion can be made smaller, and the optical member 70 can be made compact.

[0114] In top view, a virtual line connecting the first bonding region 72 and the second bonding region 73, which are spaced apart from each other in the longitudinal direction of the package 10, at the shortest distance intersects with all of the virtual lines passing through the optical axes of the light emitted from each of the multiple semiconductor laser elements 20. In top view, a virtual line connecting the first bonding region 72 and the second bonding region 73, which are spaced apart from each other in the lateral direction of the package 10, at the shortest distance does not intersect with all of the virtual lines passing through the optical axes of the light emitted from each of the multiple semiconductor laser elements 20.

[0115] In the optical member 70, the first bonding region 72 and the second bonding region 73 have light-transmitting properties. Furthermore, the plurality of first bonding regions 72 and the plurality of second bonding regions 73 have light-transmitting properties. Furthermore, all bonding regions 71 of the optical member 70 have light-transmitting properties. However, it is not necessary for all of them to have light-transmitting properties, and the optical member 70 may have one or more first bonding regions 72 and one or more second bonding regions 73 having light-transmitting properties. The same can be said about the package 10.

[0116] Furthermore, in the optical member 70 of the light emitting device 1, a range through which a virtual straight line that passes through the first bonding region 72 and proceeds in a direction perpendicular to the first bonding region 72 passes has translucency. This range also includes any straight line that passes through the first bonding region 72. Furthermore, a range through which a virtual straight line passes in the optical member 70 when the first bonding region 72 is replaced with the third bonding region 18 has translucency.

[0117] The same is true for the second bonding region 73. That is, in the optical member 70 of the light emitting device 1, a range through which a virtual straight line that passes through the second bonding region 73 and proceeds in a direction perpendicular to the second bonding region 73 passes has translucency. Also, a range through which a virtual straight line passes in the optical member 70 when the second bonding region 73 is replaced with the fourth bonding region 19 has translucency.

[0118] For example, in the illustrated example of the light emitting device 1, since the plane includes the first bonding region 72 and the second bonding region 73, the range through which an imaginary straight line passing through the first bonding region 72 in a direction perpendicular to the plane including the first bonding region 72 passes, and the range through which an imaginary straight line passing through the second bonding region 73 in a direction perpendicular to the plane including the second bonding region 73 passes, each has translucency. In Fig. 5, the portion overlapping with the bonding region 71 indicates this range.

[0119] In this way, since the bonding region 71 of the optical member 70 has light transmissivity, the light incident from the emission surface of the optical member 70 can pass through the optical member 70 and enter the adhesive 80. For example, in the space in which the light emitting device 1 is mounted, it is considered that return light based on the light emitted by the light emitting device 1, emitted light from other light emitting devices, etc. enter the adhesive 80.

[0120] Furthermore, in lid member 15 of light emitting device 1, a range through which an imaginary straight line that passes through third bonding region 18 and proceeds in a direction perpendicular to third bonding region 18 passes, except for metal film 16. This range also includes any straight line that passes through first bonding region 72. Furthermore, a range through lid member 15 through which an imaginary straight line passes when third bonding region 18 is replaced with first bonding region 72, except for metal film 16, is translucent.

[0121] In addition, in cover member 15 of light emitting device 1, an imaginary straight line that passes through third bonding region 18 and proceeds in a direction perpendicular to third bonding region 18 passes through metal film 16. In addition, when third bonding region 18 is replaced with first bonding region 72, an imaginary straight line passes through metal film 16. The same applies to fourth bonding region 19. In addition, the same applies to when fourth bonding region 19 is replaced with second bonding region 73.

[0122] In this way, because bonding region 17 of lid member 15 has translucency, light reflected by metal film 16 of lid member 15 can pass through lid member 15 and enter adhesive 80. For example, in the space in which light emitting device 1 is mounted, return light based on light emitted by light emitting device 1, emitted light from other light emitting devices, etc. may enter metal film 16 and further enter adhesive 80.

[0123] When the light emitting device 1 is viewed from the light emission side, the bonding region 71 and bonding region 17 formed by the adhesive 80 provided at one location have an area that overlaps with the metal film 16. In at least one bonding region 71, this overlapping area occupies 50% or more of the bonding region 71. Furthermore, in at least one bonding region 17, this overlapping area occupies 50% or more of the bonding region 17.

[0124] This is indicated by the area where two hatched lines overlap in Fig. 6. In the illustrated example of the light emitting device 1, in top view from the light emission side, 70% or more of the bonding areas 71 (one is the first bonding area 72 and the other is the second bonding area 73) and the bonding areas 17 (one is the third bonding area 18 and the other is the fourth bonding area 19) related to the adhesive 80 provided at two corners of the package U overlap with the metal film 16.

[0125] Moreover, 20% or more of each of the bonding regions 71 and bonding regions 17 overlap with the metal film 16. In the example of the light emitting device 1 shown in the figure, 30% or more of the bonding regions 71 (one is the first bonding region 72 and the other is the second bonding region 73) and bonding regions 17 (one is the third bonding region 18 and the other is the fourth bonding region 19) related to the adhesive 80 provided in two locations away from the corners of the package U overlap with the metal film 16.

[0126] Within this region, the optical member 70 and the cover member 15 are translucent over the range from the optical member 70 to the metal film 16. In FIG. 6, the overlapping area of ​​the two hatched lines indicates this range. The adhesive 80 also transmits light to a certain degree. For example, at the time when the light emitting device 1 is manufactured, the first adhesive 81 has a transmittance of more than 0% and not more than 10%. The second adhesive 82 has a transmittance of 80% or more and less than 100%.

[0127] Since the adhesive 80 is provided in such a position, by using the second adhesive 82 which has better resistance to light than the first adhesive 81, stable fixation between the package 10 and the optical member 70 is maintained even if the adhesive strength of the first adhesive 81 deteriorates due to the influence of returned light or the like and sufficient adhesive strength is no longer obtained.

[0128] Figure 10 shows the results of an experiment in which an optical member was placed on a metal and bonded with a first adhesive and a second adhesive, and laser light was emitted from above and irradiated onto the adhesive through the optical member. Figure 10 shows the energy density [W / mm 2The correlation between [time to burn] and [hours] is shown in the graph.

[0129] In this experiment, a thermocouple was placed near the adhesive, and the temperature change of the thermocouple was measured. The temperature was adjusted assuming the situation when the light emitting device 1 is actually operating. As a result of the measurement, the temperature of the thermocouple started to rise suddenly from a stable state at a certain point, and the temperature rose by 2 to 3 degrees or more. When the joint was observed, the adhesive had turned black.

[0130] Here, the measurement results for plot P shown in Fig. 10 are shown in Figs. 11 to 13. In this measurement, the ambient temperature of the joint was adjusted to 75 degrees before starting the measurement. In addition, after starting the measurement and confirming that the temperature of the thermocouple was stable at around 75 degrees, the laser light was irradiated. As shown in Fig. 12, the laser light irradiation started 30 to 40 seconds after the start of the measurement, and as a result, the temperature of the thermocouple rose to around 82 degrees.

[0131] The temperature rise caused by the laser light irradiation slowed down at around 82 degrees and stabilized at a roughly constant temperature. As shown in Figure 11, the temperature rose slightly over a long period of time. Then, after 40,000 seconds, the temperature suddenly began to rise from the stable state. The measurement was stopped at 42,000 seconds, at which point it was confirmed that the adhesive had turned black.

[0132] From this result, it was inferred that the adhesive's temperature rose due to the light irradiation, causing it to burn. Therefore, the time when the thermocouple's temperature suddenly began to rise from a stable state was estimated as the time when the adhesive began to burn, and the irradiation time up to this point was taken as the time until the adhesive burned, and the experimental results are shown in Figure 10.

[0133] As can be seen from the results in Figure 10, the first adhesive had a thermal conductivity of 1.0 [W / mm 2 ] within 100 hours of exposure to light with an energy density of 1000 times that of the 1000 times that of the 10000 times that of the 100000 times ...

[0134] It is also seen that the second adhesive has better resistance to light than the first adhesive. Therefore, even if the first adhesive 81 is burned and loses its adhesive strength, the optical member 70 is maintained in place in the light emitting device 1. This makes it possible to realize a light emitting device 1 with a stable adhesive state even after long-term use.

[0135] The first adhesive 81 and the second adhesive 82 are not limited to those used in the experiment, and any appropriate adhesive may be selected. Based on the experiment results, the following combinations of the first adhesive 81 and the second adhesive 82 employed in the light emitting device 1 are considered.

[0136] For example, a combination of a first adhesive 81 that burns within 10 hours and a second adhesive 82 that does not burn within 100 hours when irradiated with light of a predetermined energy density can be given. 2 When exposed to light with an energy density of 1000 nm, the first adhesive burned within 3 hours, while the second adhesive did not burn even after 250 hours.

[0137] Another example is a combination of a first adhesive 81 that burns within one hour when irradiated with light of a predetermined energy density, and a second adhesive 82 that does not burn within 10 hours. 2 When exposed to light with an energy density of 1000 nm, the first adhesive burned in 50 minutes, while the second adhesive did not burn even after 11 hours.

[0138] Another example is a combination of a first adhesive 81 that burns within 30 minutes when irradiated with light of a predetermined energy density, and a second adhesive 82 that does not burn within 5 hours. 2 When exposed to light with an energy density of 1000 nm, the first adhesive burned within 15 minutes, while the second adhesive did not burn even after five hours.

[0139] The second adhesive 82 has a resistance of at least 5.0 [W / mm 2 ] or less than that of the first adhesive 81. Although it depends on the environment in which the light emitting device 1 is mounted, the light emitting device 1 has a higher resistance to light than the first adhesive 81. 2 Alternatively, the second adhesive 82 may have better resistance to light than the first adhesive 81 when irradiated with light in the range of energy densities not exceeding 100 nm.

[0140] In the light emitting device 1, the first adhesive 81 has some advantage over the second adhesive 82, such as an effect that cannot be obtained with the second adhesive 82, an effect that is difficult to obtain with the second adhesive 82, or the efficiency of obtaining the same effect is reduced. For example, in the light emitting device 1, the first adhesive 81 is used to efficiently bond the optical member 70 whose position has been adjusted.

[0141] Although the embodiments of the present invention have been described above, the light-emitting device of the present invention is not strictly limited to the light-emitting device of the embodiment. In other words, the present invention can be realized without being limited to the external shape and structure of the light-emitting device disclosed in the embodiment. In addition, the present invention can be applied without necessarily having all the components. For example, if some of the components of the light-emitting device disclosed in the embodiment are not described in the claims, the freedom of design by those skilled in the art, such as substitution, omission, modification of the shape, and change of the material, is recognized for those some components, and the invention described in the claims is specified to be applied. [Industrial Applicability]

[0142] The light emitting device described in each embodiment can be used in projectors, vehicle headlights, head mounted displays, lighting, displays, and the like. [Explanation of symbols]

[0143] 1, 2 Light emitting device 10 Packages 11 Base 12 Bottom part 13 Side part 14 Wiring area 15 Lid member 16 Metal Film 17 Joint area 18 Third junction area 19 4th junction area 20 Semiconductor laser element 30 Submount 40 Reflective material 50 Protection element 60 Wiring 70, 270 Optical components 71 Joint area 72 1st junction area 73 Second joint area 80 Adhesive 81 First Adhesive 82 Second Adhesive

Claims

1. A light-emitting element; a package in which the light emitting element is disposed; an optical member having a lens portion having a lens surface including a first lens and a non-lens portion that does not overlap with the lens surface in a top view, the optical member being fixed to the package; one or more adhesives that secure the optical element to the package; having Light from the light emitting element is emitted to the outside from an emission surface of the package, the light emitted from the emission surface of the package to the outside is incident on the incidence surface of the optical member and is emitted from the lens surface of the optical member; the one or more adhesives are bonded to the optical element between an output surface of the package and an input surface of the optical element; In the optical member, one or more bonding regions to which the one or more adhesives are bonded are provided at positions closer to an incidence surface of the optical member than to the lens surface of the optical member, The light emitting device, wherein, in a top view, the one or more bonding regions overlap the lens portion and the non-lens portion.

2. the one or more adhesives include a first adhesive and a second adhesive that are spaced apart from each other; The one or more bonding regions include one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded; The light emitting device according to claim 1 , wherein a portion of the one or more first bonding regions and a portion of the one or more second bonding regions overlap with a portion of the lens portion in a top view.

3. the lens surface includes a second lens; The first lens and the second lens are lenses located at both ends of the lens surface. When viewed from above, a portion of the one or more first joint regions overlaps a portion of the first lens, The light emitting device according to claim 2 , wherein a portion of the one or more second bonding regions overlaps a portion of the second lens in a top view.

4. the first adhesive and the second adhesive are different types of adhesives; When viewed from above, a portion of the one or more first joint regions overlaps a portion of the second lens, The light emitting device according to claim 3 , wherein a portion of the one or more second bonding regions overlaps a portion of the first lens in a top view.

5. the package has one or more wiring regions; The light emitting device according to claim 1 , wherein a portion of the one or more bonding regions overlaps with the one or more wiring regions in a top view.

6. the package has one or more wiring regions; a portion of the one or more first junction regions overlaps with the one or more wiring regions in a top view; The light emitting device according to claim 2 , wherein a portion of the one or more second junction regions overlaps with the one or more wiring regions in a top view.

7. The light emitting device according to claim 1 , wherein a portion of the one or more bonding regions overlaps one of four corners of the first lens in a top view.

8. When viewed from above, a portion of the one or more first bonding regions overlaps one of four corners of the first lens, The light emitting device according to claim 3 , wherein a portion of the one or more second bonding regions overlaps one of four corners of the second lens in a top view.

9. the lens surface includes a third lens surface disposed between the first lens and the second lens in a top view; the lens surface is configured in a shape in which a plurality of lenses including a first lens, a second lens, and a third lens are arranged in the same direction, The light emitting device according to claim 3 , wherein a width of the first lens in a direction in which the plurality of lenses are arranged is larger than a width of the third lens when viewed from above.

10. The light emitting device according to claim 9 , wherein a width of the second lens in a direction in which the plurality of lenses are arranged in a top view is larger than a width of the third lens.

Images