Method for fabricating light emitting device

Abstract

To provide a method for fabricating a lightweight light-emitting device having a light-emitting region on a curved surface.SOLUTION: A light-emitting element is formed with a flexible substrate supported as a flat plate, and the deformation of the substrate or recovery, the light-emitting area is provided on a curved surface.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a light-emitting device, and in particular to a method for manufacturing a light-emitting device having a light-emitting region on a curved surface. It concerns the method. [Background technology]

[0002] The inner surface of a non-permeable substrate that is pre-formed into a curved shape is coated with electroluminescent material. A light-emitting device provided with an electroluminescent element (also called an EL element) is known (Patent Document 1). .

[0003] In addition, an organic EL element was created on a flexible substrate bonded to a peelable flat plate, and the device was then A flexible substrate is peeled off from a flat plate and curved to fit the shape of a container, etc., to manufacture a light-emitting device. A manufacturing method thereof is known (Patent Document 2).

[0004] In addition, a flexible EL element sheet is sandwiched between inner and outer shape retention plates having curved portions. A light emitting device in which this is done is known (Patent Document 3). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2003-264084 A [Patent Document 2] JP 2000-311781 A [Patent Document 3] JP 2006-39471 A Summary of the Invention [Problem to be solved by the invention]

[0006] The organic EL element includes a layer containing a light-emitting organic compound between a pair of electrodes. The layer containing the organic compound is extremely thin, ranging from several tens to several hundreds of nanometers. If the thickness is not uniform, problems such as uneven brightness and short circuits between a pair of electrodes can occur. This may be the case.

[0007] Therefore, the curved organic EL element is placed on a non-moisture permeable substrate that has been molded into a curved shape. When a layer containing a light-emitting organic compound is to be formed on the inner surface of the plate, the above-mentioned problems may occur. Therefore, processing technology is required to prevent this from occurring.

[0008] In addition, the organic EL element has elasticity that tends to return to a flat shape, so it is difficult to apply the light to a complex curved surface (e.g., a surface with a variable curvature). In some cases, the material may not be able to bend to fit the shape of the housing of a device that has a curved surface that changes shape.

[0009] The method of sandwiching a flexible organic EL element between two shape-retaining plates and bending it allows for complex It can conform to curved surfaces, but it requires two shape-retaining plates, which increases the weight and cost. It ends up like this.

[0010] One aspect of the present invention has been made in light of the above technical background. An object of the present invention is to provide a method for manufacturing a lightweight light-emitting device having a curved optical region. [Means for solving the problem]

[0011] In order to solve the above problems, one aspect of the present invention is a method for manufacturing a flexible substrate in a state where the flexible substrate is supported in a flat plate shape. The present invention relates to a method for forming a light-emitting element and providing a light-emitting region on a curved surface by deformation or recovery of the substrate. The invention was created with the aim of realizing the creation of a light-emitting device having the configuration exemplified in this specification. I came up with a manufacturing method.

[0012] That is, one aspect of the present invention is to prepare a flexible substrate having a desired curved surface in advance. A first step of forming a light-emitting element having a layer containing a light-emitting organic compound between a pair of electrodes. A second step of forming a light emitting element on the substrate supported in a flat plate shape; A third step of deforming or recovering the portion having the light emitting region to a shape having a curved surface. The present invention relates to a method for manufacturing a light-emitting device having a light-emitting region on a curved surface, the method including:

[0013] The method for manufacturing a light-emitting device according to one embodiment of the present invention includes forming a flexible substrate having a desired curved surface in advance. forming a light emitting element in a state in which the substrate is supported in a flat plate shape; The light-emitting region is curved by deforming or recovering the portion having the curved surface. and providing the light emitting region of the light emitting element on the surface. The light emitting element can be bent without using a support plate or contacting other members for deformation. As a result, a method for manufacturing a lightweight light-emitting device having a light-emitting region on a curved surface can be achieved. can be provided.

[0014] Another embodiment of the present invention is a light-emitting element including a layer containing a light-emitting organic compound between a pair of electrodes. a first step of forming a semiconductor device in contact with a first substrate supported in a flat, flexible state; The second substrate is heat-shrinkable at a first temperature T1, and the light-emitting element of the first substrate is not formed. The second step is provided on the side of the second substrate, and the second substrate is heated to a second temperature T2, thereby emitting light from the light-emitting element. and a third step of providing the light region on the curved surface. This is a method for producing the above.

[0015] The method for manufacturing a light-emitting device according to one embodiment of the present invention includes a step of forming a light-emitting element on a flexible substrate in a state where the flexible substrate is supported in a flat plate shape. A step of forming an optical element, a step of bonding a heat-shrinkable substrate to the substrate, and a bonding method for bonding the substrate and the heat-shrinkable substrate. and deforming the heat-shrinkable substrate to provide a light-emitting region on the curved surface. This allows the light emitting region of the light emitting element to be formed without using a shape retaining plate or the like. Other members can be provided on the curved surface without contacting the light emitting element. It is possible to provide a method for manufacturing a lightweight light-emitting device having a curved surface.

[0016] Another embodiment of the present invention is a light-emitting element including a layer containing a light-emitting organic compound between a pair of electrodes. a first step of forming a semiconductor device in contact with a first substrate supported in a flat, flexible state; At a first temperature T1, a heat-shrinkable second substrate is placed on the side of the first substrate on which the light-emitting element is formed. The second step of forming the light emitting element on the curved surface is performed by subjecting the second substrate to a second temperature T2. and a third step of forming a light-emitting device having a curved light-emitting region. .

[0017] The method for manufacturing a light-emitting device according to one embodiment of the present invention includes a step of forming a light-emitting element on a flexible substrate in a state where the flexible substrate is supported in a flat plate shape. A step of forming an optical element, a step of bonding a heat-shrinkable substrate to the substrate, and a bonding method for bonding the substrate and the heat-shrinkable substrate. and deforming the heat-shrinkable substrate to provide a light-emitting region on the curved surface. This allows the light emitting region of the light emitting element to be formed without using a shape retaining plate or the like. Other members can be provided on the curved surface without contacting the light emitting element. It is possible to provide a method for manufacturing a lightweight light-emitting device having a curved surface.

[0018] In this specification, the EL layer refers to a layer provided between a pair of electrodes of a light-emitting element. Therefore, the light-emitting layer containing an organic compound, which is a light-emitting material, sandwiched between the electrodes is one of the EL layers. This is an embodiment.

[0019] In addition, in the present specification, when a substance A is dispersed in a matrix made of another substance B, The substance B that constitutes the trix is ​​called the host material, and the substance A that is dispersed in the matrix is ​​called the guest material. In addition, each of Substance A and Substance B may be a single substance. It may be a mixture of two or more substances.

[0020] In this specification, the term "light emitting device" refers to an image display device or a light source (including a lighting device). ) Also, when a connector is attached to a light emitting device, such as an FPC (Flexible Print Circuit) ed circuit) or TCP (Tape Carrier Package) modules with a printed wiring board at the end of the TCP, or a substrate on which a light emitting element is formed, and an IC is attached by the COG (Chip On Glass) method. Modules in which an integrated circuit is directly mounted are also included in the light emitting device. Effect of the Invention

[0021] According to one embodiment of the present invention, a method for manufacturing a lightweight light-emitting device having a light-emitting region on a curved surface can be provided. do. [Brief description of the drawings]

[0022] [Figure 1] 1 is a flow diagram illustrating a method for manufacturing a light-emitting device according to an embodiment. [Diagram 2] 1A to 1C illustrate a method for manufacturing a light-emitting device according to an embodiment. [Diagram 3]1 is a flow diagram illustrating a method for manufacturing a light-emitting device according to an embodiment. [Figure 4] 1A to 1C illustrate a method for manufacturing a light-emitting device according to an embodiment. [Diagram 5] 1 is a flow diagram illustrating a method for manufacturing a light-emitting device according to an embodiment. [Figure 6] 1A to 1C illustrate a method for manufacturing a light-emitting device according to an embodiment. [Figure 7] 1A and 1B are diagrams illustrating a housing that accommodates a light-emitting device according to an embodiment. [Figure 8] 1A to 1C are diagrams illustrating light-emitting elements that can be applied to a light-emitting device according to an embodiment. [Figure 9] 1A to 1C are diagrams illustrating electronic devices and lighting devices each using a light-emitting device according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] The embodiment will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiment, and various changes and modifications may be made in the form and details without departing from the spirit and scope of the present invention. It will be easily understood by those skilled in the art that the above-mentioned invention can be obtained by the following embodiments. The present invention should not be construed as being limited to the contents described below. The same reference numerals are used in different drawings to indicate the same parts or parts having similar functions. A repeated explanation will be omitted.

[0024] (Embodiment 1) In this embodiment, a manufacturing method of a light-emitting device according to one embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a flowchart illustrating a method for manufacturing a light-emitting device according to one embodiment of the present invention. FIG. 2 is a schematic diagram showing the configuration of a light emitting device during each step of the manufacturing process.

[0025] The method for producing the light emitting device 100 having a light emitting region on a curved surface, which will be described as an example in this embodiment, is as follows. As shown below.

[0026] In the first step, a flexible substrate 110 having a desired curved surface is prepared. (See Figure 1(i1) and Figure 2(A)).

[0027] In a second step, a light-emitting device is prepared by providing a layer containing a light-emitting organic compound between a pair of electrodes. The electrode 130 is formed in contact with the substrate 110 supported in a flat plate shape (FIG. 1(i2), FIG. 1(i 3), see Figures 2(B) and 2(C).

[0028] In the third step, the substrate 110 is deformed or restored to a shape having a curved surface. As a result, the light emitting region of the light emitting element 130 of the light emitting device 100 is provided on a curved surface (FIG. 1(i4) and See Figure 2(D).

[0029] The substrate support mechanism 10 supports the substrate 110 in a flat plate shape.

[0030] The method for manufacturing a light-emitting device exemplified in this embodiment is a method for manufacturing a flexible substrate having a desired curved surface in advance. The method includes forming a light emitting element 130 on a flexible substrate 110 supported in a flat plate shape; The plate 110 is deformed into a shape having a curved surface, or the plate 110 is restored to a shape having a curved surface. Thus, the light emitting element 1 is formed by forming a light emitting region on the curved surface. The 30 luminous regions can be illuminated without using a shape-retaining plate or other components for deformation. The light emitting region can be provided on the curved surface without contacting the element 130. It is possible to provide a method for manufacturing a lightweight light-emitting device 100 having the above-mentioned structure.

[0031] A light-emitting device according to one embodiment of the present invention can be formed into a shape having a curved surface. The substrate 110 is deformed and restored to its original shape, and the substrate support mechanism 1 holds the substrate 110 in a flat shape. The structure of 0 will be explained.

[0032] Substrate that spontaneously deforms into or recovers a curved shape The substrate 110 exemplified in this embodiment is used as a substrate support in the process of forming the light emitting element 130. The substrate is supported in a flat plate shape by the substrate supporting mechanism 10 and is released from the substrate supporting mechanism 10 in a later process. This allows the curved shape to be restored.

[0033] The substrate 110 that spontaneously deforms or recovers to a shape having a curved surface may be, for example, Metal or plastic plates or plate-shaped composite materials that have been molded to fit the The following can be mentioned.

[0034] Specific examples of metal plates include spring steel, stainless steel, brass, nickel silver, phosphor bronze, and beryllium blue. In addition to materials for leaf springs such as copper, examples include elastic metal plates.

[0035] Examples of plastic sheets include acrylic sheets, polycarbonate sheets, and various engravings. gineering plastics, etc.

[0036] Plate-shaped composite materials include glass fiber and resin composite materials, metal plates, or plastic plates. Laminated materials of other materials, etc.

[0037] The substrate 110 may be made of another material, for example, a very thin glass plate (for example, a plate having a thickness of several tens of μm). ) and impurity (e.g. water or oxygen) permeation-resistant membranes (e.g. inorganic material membranes, specifically silicon oxide , silicon nitride, etc.).

[0038] In addition, when the light emitted by the light emitting element 130 is extracted to the side where the substrate 110 is provided, the light is converted into visible light. A material having light-transmitting properties with respect to the substrate 110 and the electrode of the light-emitting element 130 on the substrate 110 side is Use.

[0039] The curved surface of the substrate 110 can be deformed into a flat plate shape. It is possible to recover a surface from a given state. Such a surface is called a "developable surface." A developable surface is one that can be drawn at any point on the surface with at least one straight line passing through that point. A surface that can be drawn.

[0040] The thickness of the substrate 110 and the radius of curvature of the curved surface of the substrate 110 depend on the thickness of the substrate 110 and the curvature of the curved surface of the substrate 110. It is sufficient to set the thickness of the substrate 110 according to the configuration of the optical element. For example, the thickness of the substrate 110 is set to 40 μm or more and 30 μm or less. If the thickness is set to 0 μm or less and the radius of curvature is set to 20 mm or more, the substrate 110 can be formed into a shape having a curved surface. This can prevent the light emitting element 130 from being damaged when the light emitting element 130 is restored.

[0041] 《Substrate support mechanism》 The substrate support mechanism 10 supports a substrate 110 that spontaneously deforms or recovers to a curved shape. As shown in FIG. 2A, a substrate 110, which has been previously molded into a convex shape, is supported by a substrate support. The mechanism 10 is supported along the surface of the plate to prepare it flat. In addition, a substrate that has been molded to have a downward convex shape is prepared in the same manner as a flat plate. It is also possible.

[0042] As a method for supporting the substrate 110 in a flat plate shape, for example, a clamping mechanism is used to hold the substrate 110 The end of the clamp is clamped to move the substrate 110 along the surface of the substrate support mechanism 10. Alternatively, the two components may be supported in a flat plate shape.

[0043] Alternatively, magnetic force may be used. The substrate 110 is moved along the surface of the substrate support mechanism 10 using magnetic force. Alternatively, the magnetic force attracts the fixture to the surface of the substrate support mechanism 10, so that the substrate The substrate 110 is supported in a flat shape by being sandwiched between the fixing tool and the substrate support mechanism 10. You may hold it.

[0044] The substrate 110, which is previously provided with a curved surface, is then attached to a rigid substrate using a removable adhesive. The laminate is bonded to a flat substrate for production to form a flat laminate, and the laminate is used to form a light emitting element 130. According to this method, the substrate support mechanism 10 supports the substrate 110. It can be treated in the same way as a flat substrate.

[0045] Each step of a manufacturing method of a light-emitting device according to one embodiment of the present invention will be described below.

[0046] First Step A substrate that is pre-formed with a desired curved surface and that spontaneously deforms or recovers to a curved shape 110 is supported in a flat plate shape along the surface of the substrate support mechanism 10 (FIG. 2(A) and FIG. 2(B)).

[0047] The second step The light emitting element 130 is attached to the substrate 110 supported in a flat plate shape along the surface of the substrate support mechanism 10. The two are then joined together (see Figure 2(C)).

[0048] The light-emitting element 130 has a layer containing a light-emitting organic compound between a first electrode and a second electrode. The configuration of the light emitting element 130 will be described in detail in the fifth embodiment.

[0049] The light emitting element 130 may be formed, for example, by forming one electrode in contact with the substrate 110, A layer containing a light-emitting organic compound is formed on the one electrode, and For example, a method of laminating the other electrode on a layer containing the other electrode is given.

[0050] Alternatively, a layer that can be peeled off from the layer laminated thereon may be formed on the surface. There is a method of using a fabrication substrate.

[0051] A peelable layer is formed on the surface of a substrate for production, and one electrode is formed on the peelable layer. a layer containing a light-emitting organic compound is formed on the one electrode, and the light-emitting organic compound is The other electrode is laminated on the layer containing the substance.

[0052] Next, the substrate 110 prepared in a flat plate shape is attached to the other electrode side of the light emitting element 130 using an adhesive. Furthermore, the light emitting element 130 is peeled off from the peelable layer of the fabrication substrate. In this way, the light emitting element 130 is transferred onto the substrate 110 supported in a flat plate shape. Light emitting element 130 may be formed on substrate 110 .

[0053] Alternatively, a flexible second substrate is attached to the other electrode side of the light emitting element 130 using an adhesive. Next, the light emitting element 130 is peeled off from the peelable layer of the fabrication substrate. Then, the light emitting element 130 is transferred to the second substrate. The light emitting element 130 is attached to one of the electrodes using an adhesive. The element 130 may be formed on the substrate 110 .

[0054] According to the method for forming a light emitting element on a substrate having a peelable layer formed on the surface thereof, A film that cannot be provided directly on the substrate 110 having a heat resistance exceeding that of the substrate 110 (for example, A film that can be formed only at a temperature above 1000 K can be provided between the substrate 110 and the light emitting element 130. do.

[0055] Specifically, a film that suppresses the diffusion of impurities into the light emitting element 130 (for example, an oxide film, a nitride film, etc.) Specifically, a silicon oxide film or a silicon nitride film is placed between the light emitting element 130 and the plastic film. It can be provided in.

[0056] Also, a circuit, such as a circuit for supplying power to the light emitting element 130, may be laminated on the peelable layer. The wiring and the transistor for driving the light emitting element 130 can be formed. Circuits that cannot be provided directly on the substrate 110 can be provided between the substrate 110 and the light emitting element 130. For example, an active matrix type light emitting device (also called a display device) can be formed on a substrate. Can be crafted at 110 or higher.

[0057] The reliability of the light emitting element 130 may be compromised by impurities (e.g., water, oxygen, etc.). In order to prevent impurities from diffusing into the light emitting element 130, an encapsulant having gas barrier properties and flexibility is used. A stop film may be provided between the substrate 110 and the light emitting element 130 .

[0058] As a sealing film with gas barrier properties and flexibility, a glass plate with a thickness of several tens to several hundreds of μm is used. Examples include plastic films coated with inorganic layers that have gas barrier properties, metal foils, etc. In addition, a plastic film having an inorganic film with gas barrier properties formed thereon can be used. The film is a film having good gas barrier properties formed on a peelable layer of the above-mentioned substrate for preparation. It can be produced by transferring it onto a plastic film.

[0059] The third step The substrate 110 is released from the substrate support mechanism 10. The substrate 110 is provided with a desired curved surface. The substrate 110 spontaneously deforms or recovers to a curved shape. 30 light emitting regions can be provided on the curved surface (see FIG. 2(D)).

[0060] When the substrate 110 deformed into a flat plate spontaneously recovers its curved shape, the surface expands and contracts. In order to suppress the stress applied to the light emitting element 130, the substrate 110 The thickness of the substrate 110 is preferably 40 μm or more and 300 μm or less. The radius of curvature of the curved surface is preferably 20 mm or more.

[0061] The substrate 110 spontaneously deforms or recovers so that the surface on which the light emitting device 130 is formed becomes concave. In this case, the compressive stress applied to the side of the light emitting element 130 that is in contact with the substrate 110 is This is larger than the compressive stress applied to the non-bonded side.

[0062] In addition, the substrate 110 may spontaneously deform or become convex on the surface on which the light emitting element 130 is formed. When the light emitting element 130 is restored, the tensile stress applied to the side of the light emitting element 130 in contact with the substrate 110 is This is larger than the tensile stress applied to the side not in contact with 110.

[0063] Although non-uniform stress is applied to the light emitting element 130 in this manner, the thickness of the light emitting element 130 is extremely thin. Therefore, the thickness of the light emitting element 13 can be set to, for example, about 100 nm or more and 600 nm or less. As a result, the light emitting device 130 can be formed by spontaneously bonding the substrate 110. It is not easily destroyed by deformation or recovery.

[0064] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. .

[0065] (Embodiment 2) In this embodiment, a manufacturing method of a light-emitting device according to one embodiment of the present invention will be described with reference to FIGS. FIG. 3 is a flowchart illustrating a method for manufacturing a light-emitting device according to one embodiment of the present invention. FIG. 4 is a schematic diagram showing the configuration of a light emitting device during each step of the manufacturing process.

[0066] The method for manufacturing the light emitting device 200 having a light emitting region on a curved surface, which will be described as an example in this embodiment, is as follows. As shown below.

[0067] In a first step, a light-emitting device is prepared by providing a layer containing a light-emitting organic compound between a pair of electrodes. The electrode 230 is formed in contact with a first substrate 210 having flexibility and supported in a flat plate shape (see FIG. 3(j1) and Figure 4(A).

[0068] In the second step, the heat sink 210 is placed between the light emitting element 230 and the first substrate 210. A compressible second substrate 220 is provided at a first temperature T1 (see FIG. 3(j2) and FIG. 4(B)). In other words, the second substrate 220 is a substrate on which the light emitting element 230 of the first substrate 210 is formed. Place it on the side where no one is present.

[0069] In the third step, the second substrate 220 is heated to a second temperature T2, thereby forming the light-emitting element 2 A light emitting region 30 is provided on the curved surface (see FIG. 3(j3) and FIG. 4(C)).

[0070] The substrate support mechanism 10 supports the substrate 210 in a flat plate shape.

[0071] The method for manufacturing the light emitting device 200 exemplified in this embodiment includes the steps of: supporting a flexible substrate 210 in a flat plate shape; forming the light emitting element 230 while holding the substrate 210; and The heat-shrinkable substrate 220 is then deformed to form a light-emitting region. and providing the light emitting region of the light emitting element 230 on the curved surface. The light emitting element 230 is attached to the light emitting element 230 without using a shape retaining plate or the like and without connecting other members to the light emitting element 230 for deformation. As a result, a light-weight light-emitting device having a light-emitting region on a curved surface can be provided. A method for making the optical device 200 may be provided.

[0072] A heat-shrinkable substrate 22 that can be used in the manufacturing method of the light-emitting device 200 according to one embodiment of the present invention. The structure of 0 will be explained.

[0073] The heat-shrinkable substrate 220 shrinks when heated from a first temperature T1 to a second temperature T2, Change its dimensions. For example, shrink film (uniaxially stretched film or biaxially stretched film) In particular, uniaxially oriented films can be used because the shrinkage direction is controlled in one direction. Therefore, it is suitable for forming a developable surface.

[0074] The heat-shrinkable substrate 220 can be made of a polyvinyl chloride film, a polypropylene film, or a combination of both. film, polyethylene film, polystyrene film or polyethylene terephthalate Examples include laminated films containing films selected from the above. These films can be used at temperatures higher than room temperature (e.g., 80°C to 120°C). For example, the first temperature T1 is room temperature, and the second temperature T2 is can be at a temperature higher than room temperature.

[0075] In addition, the light emitted by the light emitting element 230 is reflected by the heat shrinkable substrate 220 attached to the flexible substrate 210. When the laminated side is taken out, a material having transparency to visible light is placed on a heat-shrinkable substrate 2. 20, used for the flexible substrate 210 and the electrode of the light emitting element 230 on the substrate 210 side.

[0076] Each step of a manufacturing method of a light-emitting device according to one embodiment of the present invention will be described below.

[0077] First Step A light-emitting element 230 having a layer containing a light-emitting organic compound between a pair of electrodes is supported by a substrate supporting mechanism. The first substrate 210 is supported in a flat plate shape on the substrate 10 and has flexibility (see FIG. 4(A)). )reference).

[0078] The second step The first substrate 220 on which the light emitting element 230 is provided is released from the substrate support mechanism 10. Then, the heat-shrinkable second substrate 220 is placed between the light-emitting element 230 and the first substrate 220 at a first temperature T1. The second substrate 220 is disposed so as to sandwich the plate 210 (see FIG. 4(B)). It is provided on the side of the first substrate 210 on which the light emitting element 230 is not formed.

[0079] The third step The second substrate 220 is heated to a second temperature T2, whereby it shrinks and bends the light-emitting region of the light-emitting element 230. The heat shrinkable substrate is heated by heating the substrate. These include blowing gas onto the material, or transporting it through a furnace filled with heated gas. do.

[0080] <Modification> In a modification of this embodiment, a light emitting device 200 having a curved surface selectively provided in the light emitting region is manufactured. The method will be described with reference to FIG. 4(D) and FIG. 4(E).

[0081] In a first step, a light-emitting device is prepared by providing a layer containing a light-emitting organic compound between a pair of electrodes. The element 230 is formed in contact with a first substrate 210 that is supported in a flat plate shape and has flexibility.

[0082] In a second step, the heat shrinkable second substrate 220a and the second The substrate 220b is selectively provided so as to sandwich the first substrate 210 between the light emitting element 230 and the substrate 220b. (See Figure 4(D)).

[0083] In a third step, the second substrate 220a and the second substrate 220b are heated to a second temperature T 2, the light emitting region of the light emitting element 230 is provided on a curved surface (see FIG. 4(E)).

[0084] The method for manufacturing the light emitting device 200 exemplified in this embodiment includes the steps of: supporting a flexible substrate 210 in a flat plate shape; A step of forming a light emitting element 230 while holding the substrate 210; The deformation or recovery of the heat-shrinkable second substrate 220a and the second substrate 220b and providing the light emitting region on the curved surface. This allows the curved surface to be able to maintain its shape. No plate or other member is used, and no other member is brought into contact with the light emitting element 230 for deformation. As a result, it is possible to provide a light emitting region on a curved surface. It is possible to provide a method for manufacturing the light-weight light-emitting device 200.

[0085] The arrows shown in FIG. 4(D) indicate the distance between the heat-shrinkable second substrate 220a and the second substrate 220 The direction of shrinkage is indicated by b. The heat-shrinkable second substrate is attached to the first substrate 210 in such a manner that the desired curved surface is formed. Paste it so that the edge of the piece is in the center. This allows you to create a curved surface in the intended area. .

[0086] In addition, the terminal portion 280a and the terminal portion 280b electrically connected to the light emitting element 230 are It is preferable to provide the terminal portion in a portion where the curved surface of the optical device is not formed, since the flexibility of the terminal portion is not impaired. This makes it possible to further bend the terminal portion and connect it to a connector or the like. The terminal part formed on the flat part is stronger than the terminal part formed on the curved part. It is easy to connect to external devices. For example, the terminals are arranged on a flat surface, and the It is easy to connect to a flexible printed circuit board. By so doing, rigidity can be imparted to the terminal portion.

[0087] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. .

[0088] (Embodiment 3) In this embodiment, a manufacturing method of a light-emitting device according to one embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a flowchart illustrating a method for manufacturing a light-emitting device according to one embodiment of the present invention. FIG. 6 is a schematic diagram showing the configuration of a light emitting device during each step of the manufacturing process.

[0089] The method for producing the light emitting device 300 having a light emitting region on a curved surface, which will be described as an example in this embodiment, is as follows. As shown below.

[0090] In a first step, a light-emitting device is prepared by providing a layer containing a light-emitting organic compound between a pair of electrodes. The electrode 330 is formed in contact with a first substrate 310 having flexibility and supported in a flat plate shape (see FIG. 5(k1) and Figure 6(A).

[0091] In a second step, a heat-shrinkable second substrate 320 is heated to a first temperature T1. The light emitting element 330 is sandwiched between the light emitting element 310 and the light emitting element 330 (see FIG. 5(k2) and FIG. 6(B)). In other words, the second substrate 320 is a substrate on which the light emitting element 330 of the first substrate 310 is formed. Place it on the side.

[0092] In the third step, the second substrate 320 is heated to a second temperature T2, thereby forming the light-emitting element 3 The light emitting region 30 is provided on the curved surface (see FIG. 5(k3) and FIG. 6(C)).

[0093] The substrate support mechanism 10 supports the substrate 310 in a flat plate shape.

[0094] The method for manufacturing the light-emitting device exemplified in this embodiment is to support a flexible substrate 310 in a flat plate shape. forming a light emitting element 330 in the above-mentioned state; and attaching a heat shrinkable substrate 320 to the substrate 310. The heat-shrinkable substrate 320 is then deformed to form a curved light-emitting area. This provides the light emitting region of the light emitting element 330 with a shape No need to use a holding plate or the like, and no need to bring other members into contact with the light emitting element 330 for deformation. As a result, a light-emitting device having a light-emitting region on a curved surface can be provided. It is possible to provide a method for producing the above-mentioned.

[0095] A heat-shrinkable substrate 32 that can be used in the manufacturing method of the light-emitting device 300 according to one embodiment of the present invention. 0 can be applied with a configuration similar to that of the heat-shrinkable substrate 220 described as an example in the second embodiment. .

[0096] In addition, when the light emitted by the light emitting element 330 is extracted to the heat-shrinkable substrate 320 side, the light is converted into visible light. A material having light-transmitting properties is applied to the heat-shrinkable substrate 320 and the substrate 320 of the light-emitting element 330. Used for the side electrode.

[0097] Each step of a manufacturing method of a light-emitting device according to one embodiment of the present invention will be described below.

[0098] First Step A light emitting element 330 having a layer containing a light emitting organic compound between a pair of electrodes is supported by a substrate supporting mechanism. The first substrate 310 is supported in a flat plate shape on the substrate 10 and has flexibility (see FIG. 6(A)). )reference).

[0099] The second step The first substrate 310 on which the light emitting element 330 is provided is released from the substrate support mechanism 10. Then, the heat-shrinkable second substrate 320 is placed between the first substrate 310 and the light-emitting element at a first temperature T1. In other words, the second substrate 320 is disposed between the first substrate 320 and the second substrate 330 (see FIG. 6B). It is provided on the side of the first substrate 310 on which the light emitting element 330 is formed.

[0100] The third step The second substrate 320 is heated to a second temperature T2 to shrink the light emitting region of the light emitting element 330. It is provided on a curved surface (see FIG. 6(C)).

[0101] As the heat shrinkable second substrate 320 shrinks, the heat shrinkable second substrate 320 shrinks. Stress is applied to the surface of the light emitting element 330. This stress may destroy the light emitting element 330. In this case, a protective layer is provided on the light emitting element 330 so that the stress is not directly transmitted to the light emitting element 330. In particular, the protective layer covering the light emitting element 330 may be fixed to the substrate 310. This configuration is effective.

[0102] Alternatively, the light emitting element 330 is formed on the substrate 310 on which the partition wall is provided, and the partition wall is a protective layer. Alternatively, the partition wall may be bonded to a heat-shrinkable second substrate 320. The second substrate 320 bears the stress caused by the contraction, and the light emitting element 330 is destroyed. This can prevent the phenomenon of the chipping occurring.

[0103] In addition, examples of materials that can be used for the protective layer include flexible films bonded with adhesives. A resin layer is made by applying a liquid material, and a layer is made by using sputtering or chemical vapor deposition. An example of such a membrane is a membrane.

[0104] In addition, the second substrate 320 and / or the protective layer may prevent impurities (e.g., water and oxygen) from being absorbed into the light-emitting element. It is also possible to configure the film to function as a sealing film to suppress the phenomenon of diffusion to 330.

[0105] <Modification> In a modification of this embodiment, a convex curved surface and a concave curved surface are selectively provided in the light emitting region. A method for manufacturing the light emitting device 300 will be described with reference to FIG. 6(D) and FIG. 6(E). do.

[0106] In a first step, a light-emitting device is prepared by providing a layer containing a light-emitting organic compound between a pair of electrodes. The element 330 is formed in contact with a first substrate 310 that is supported in a flat plate shape and has flexibility.

[0107] In a second step, the heat shrinkable second substrate 320a and the second The substrate 320b is provided so as to sandwich the light emitting element 330 between the substrate 320b and the first substrate 310. The heat-shrinkable second substrate 320c and the second substrate 320d are disposed between the light-emitting element 330 and the first substrate 320a. The substrate 310 is selectively provided between the first and second electrodes 311 and 312 (see FIG. 6(D)).

[0108] In the third step, the second substrate 320a, the second substrate 320b, and the second substrate 320 c and the second substrate 320d are heated to a second temperature T2, is provided on the curved surface (see FIG. 6(E)).

[0109] The method for manufacturing the light emitting device 300 exemplified in this embodiment includes the steps of: supporting a flexible substrate 310 in a flat plate shape; A step of forming a light emitting element 330 while holding the substrate 310; and providing a light-emitting region on the curved surface by deformation of the heat-shrinkable substrate. This allows the curved surface to be formed without using a shape retention plate or other components for deformation. can be provided at an intended portion of the light emitting element 330 without contacting the light emitting element 330. As a result, a method for manufacturing a light-weight light-emitting device 300 having a curved light-emitting region is provided. can be done.

[0110] The arrows shown in FIG. 6(D) indicate the heat-shrinkable second substrate 320a, the second substrate 320b, The direction in which the second substrate 320c and the second substrate 320d shrink is shown. The substrate is attached so that the ridge of the curved surface to be formed is located at the center. It is possible to form curved surfaces on parts.

[0111] In addition, the light emitting device 300 is bent along the dashed line AB to form a convex curved surface and a concave curved surface. Such a light emitting device can be folded compactly by stacking the light emitting devices. It can be stored inside the housing of a foldable information terminal device and used as a backlight for the display. Alternatively, it may be an active matrix display device.

[0112] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. .

[0113] (Embodiment 4) In this embodiment, a light-emitting device formed by a method for manufacturing a light-emitting device according to one embodiment of the present invention will be described. An example of the structure of a housing that can accommodate the device will be described with reference to FIG.

[0114] The housing 490 illustrated in this embodiment is a combination of an exterior 450, an outer lid 460, and an exterior 450 and an outer lid The inner lid 455 is provided between the inner lid 460 and the inner lid 455. The inner lid 455 is formed by bonding or sealing structure (e.g., O-ring). The inner lid 455 is in close contact with the exterior 450 via the sealing member 452, and a sealed space is formed between the inner lid 455 and the exterior 450. It is done.

[0115] The light-emitting device 400 formed by the manufacturing method according to one embodiment of the present invention includes an inner lid 455 and an outer casing 45 The light-emitting area is placed facing the exterior 450 in the sealed space formed between the outer casing 450 and the outer casing 450. There are.

[0116] Both the inner lid 455 and the outer casing 450 are made of materials that are impermeable to impurities (e.g., water and oxygen). With this configuration, the light emitting device 4 stored in a sealed space can be 00 can be prevented from becoming contaminated by impurities, which reduces its reliability.

[0117] Materials that can be used for the inner lid 455 and the outer casing 450 include, for example, metal, glass, or ceramic. In addition to dense inorganic materials such as glass plates, layers to suppress the permeation of impurities (specifically, The dense inorganic material layer or diamond-like carbon, silicon oxide, silicon nitride, etc. Examples include plastics modified with a layer containing

[0118] In addition, a material for capturing impurities is placed in the sealed space formed between the inner lid 455 and the exterior 450. In addition, the light emitting device 400 may be driven by a device that stores a storage material (for example, a desiccant or an oxygen absorber). The circuit 453 for detecting the light emission is electrically connected to the terminal portion 480 of the light emitting device 400. good.

[0119] The light emitting device 400 has a light emitting area on a curved surface, and can display characters and images in the light emitting area. The exterior 450 has a light-transmitting area at a position where it overlaps with the light-emitting device 400, and the exterior 450 is transparent to the user. The display can be seen from the outside of the exterior 450. Since the display extends to the side of the housing, There is a lot of information that can be displayed.

[0120] In addition to the sealed space formed between the inner lid 455 and the exterior 450, Another space may be formed between the outer lids 460. The housing 490 illustrated in this embodiment has an inner A secondary battery 457 is provided in the space formed between the lid 455 and the outer lid 460. By locating parts requiring maintenance or inspection in a space separate from the enclosed space, The frequency with which the space becomes contaminated with impurities can be reduced.

[0121] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. .

[0122] (Embodiment 5) In this embodiment, a substrate supported in a flat shape by the manufacturing method of a light-emitting device according to one embodiment of the present invention is An example of the configuration of a light emitting element formed in contact with a plate will be described with reference to FIG.

[0123] The light-emitting element exemplified in this embodiment has a first electrode, a second electrode, and a light-emitting organic layer disposed therebetween. The layer containing the compound (hereinafter referred to as the EL layer) is provided on either the first electrode or the second electrode. One functions as an anode and the other as a cathode. The EL layer is configured as follows: Select an appropriate value according to the type and material.

[0124] At least one of the first electrode and the second electrode is made of a conductive film that transmits visible light. It is formed using.

[0125] Examples of conductive films that transmit visible light include indium tin oxide and thin metal films that transmit light ( For example, a thin film having a thickness of about 5 nm to 30 nm can be used.

[0126] <Light emitting element configuration example 1.> An example of the structure of a light-emitting element is shown in FIG. The EL layer is sandwiched between the cathode 1102 and the cathode 1102 .

[0127] When a voltage higher than the threshold voltage of the light-emitting element is applied between the anode 1101 and the cathode 1102, E Holes are injected into the L layer from the anode 1101 side, and electrons are injected from the cathode 1102 side. The injected electrons and holes recombine in the EL layer, causing the luminescent material contained in the EL layer to emit light. .

[0128] In this specification, a layer having one region where electrons and holes injected from both ends recombine is referred to as a layer having one region where electrons and holes recombine from both ends. As a first example of the configuration of the light-emitting element, a light-emitting element shown in FIG. can be said to have one light-emitting unit.

[0129] The light-emitting unit 1103 may include at least one light-emitting layer containing a light-emitting material. The layer other than the light-emitting layer may be, for example, a hole-injecting layer. materials with high hole transporting properties, materials with poor hole transporting properties (blocking properties), Materials with high electron transport properties, materials with high electron injection properties, and materials with bipolar properties (transport of electrons and holes) In particular, a layer containing a material having a hole injection property provided in contact with the anode is preferable. The layer containing a material with high electron injection properties and the layer containing a material with high electron injection properties that is provided in contact with the cathode are These layers reduce the barrier to carrier injection from the GaN layer to the light-emitting unit. It can be called a layer.

[0130] An example of a specific configuration of the light-emitting unit 1103 is shown in FIG. The unit 1103 includes a hole injection layer 1113, a hole transport layer 1114, an emissive layer 1115, and an electron transport layer 1116. A transport layer 1116 and an electron injection layer 1117 are laminated in this order from the anode 1101 side. do.

[0131] <Light emitting element configuration example 2.> Another example of the configuration of the light-emitting element is shown in FIG. Between the cathode 1102 and the cathode 1101, an EL layer including a light-emitting unit 1103 is sandwiched. An intermediate layer 1104 is provided between the cathode 1102 and the light-emitting unit 1103. The light-emitting unit 1103 of the light-emitting element of the configuration example 2 has the light-emitting element of the configuration example 1 described above. The same configuration as that of the light-emitting unit provided with the light-emitting element can be applied. For details, see the configuration example of the light-emitting element. Please refer to the description in 1.

[0132] The intermediate layer 1104 includes at least a charge generation region. For example, the first charge generation region 1104 c, the electron relay layer 1104b and the electron injection buffer 1104a are arranged in this order from the cathode 1102 side. Next, a laminated structure can be applied.

[0133] The behavior of electrons and holes in the intermediate layer 1104 will be described. When a voltage higher than the threshold voltage of the light-emitting element is applied between the electrodes, holes and electrons are generated in the first charge generation region. The holes are generated in the region 1104c, and the electrons are sent to the cathode 1102 and the electron relay layer 1104b. Each one moves.

[0134] The electron relay layer 1104b has a high electron transporting property and transports the electric charge generated in the first charge generating region 1104c. The electron injection buffer 1104a promptly transfers the child to the electron injection buffer 1104a. The barrier preventing the injection of electrons into the light-emitting unit 1103 is alleviated.

[0135] The electron relay layer 1104b is formed by bonding the material constituting the first charge generating region 1104c to the electrons. The substances constituting the injection buffer 1104a come into contact with each other at the interface, so that the functions of each substance are not impaired. This can prevent interactions such as the mixture being mixed together.

[0136] The range of materials that can be used for the cathode of the light-emitting device of the second configuration example is as wide as that of the cathode of the first configuration example. The range of materials that can be used for the cathode of the second embodiment is wider than that of the intermediate layer. This is because all that is required is to receive the holes generated by the FET, and materials with a relatively large work function can be used. .

[0137] <Light emitting element configuration example 3.> Another example of the configuration of the light-emitting element is shown in FIG. The device has an EL layer having two light-emitting units between 1101 and a cathode 1102. An intermediate layer 11 is provided between the first light-emitting unit 1103a and the second light-emitting unit 1103b. 04 is provided.

[0138] The number of light-emitting units provided between the anode and the cathode is not limited to two. The light emitting element has n layers of light emitting units 1103 (n is a natural number of 2 or more), which is called a tandem structure. The light-emitting device has a mold structure, and an intermediate layer 1104 is provided between the stacked light-emitting units.

[0139] The light-emitting unit 1103 of the light-emitting element configuration example 3 is the same as the light-emitting unit of the light-emitting element configuration example 1. The intermediate layer 1104 of the light-emitting element according to the third structural example can be formed as follows: A configuration similar to that of the intermediate layer 1104 in the configuration example 2 of the light-emitting element can be applied.

[0140] When a voltage higher than the threshold voltage of the light-emitting element is applied between the anode 1101 and the cathode 1102, Holes and electrons are generated in the intermediate layer 1104, and the holes are guided to the light-emitting unit 1102 on the cathode 1102 side. The electrons move to the light-emitting unit provided on the anode side.

[0141] The holes injected into the light-emitting unit provided on the cathode side are injected from the cathode side of the light-emitting unit. The electrons injected into the luminescent unit recombine with the luminescent material, causing the luminescent material to emit light. The holes and electrons generated in the intermediate layer 1104 emit light in different light-emitting units. Leads to...

[0142] In addition, by providing the light-emitting units in contact with each other, the same structure as the intermediate layer is formed between them. In this case, the light-emitting units can be provided in contact with each other. When a charge generating region is formed on one surface, the charge generating region is a first charge generating region of the intermediate layer. Since it functions as a green area, the light-emitting units can be provided in contact with each other.

[0143] In addition, an intermediate layer can be provided between the cathode and the n-th light-emitting unit.

[0144] The light-emitting element described above emits light from a light-emitting organic compound contained in the light-emitting unit. The emission color can be selected by changing the type of luminescent organic compound.

[0145] In addition, the width of the emission spectrum can be expanded by using multiple luminescent materials with different luminescent colors. It is possible.

[0146] For example, in order to obtain white light emission, at least two layers containing a light-emitting material are provided. The layers are configured to emit light of colors that are complementary to each other. Specific examples of complementary colors include blue and yellow, or blue-green and red. etc.

[0147] Furthermore, to obtain white light with good color rendering, the emission spectrum must extend over the entire visible light range. For example, one light emitting element may have a layer that emits blue light and a layer that emits green light. The light emitting layer may include a layer that emits red light and a layer that emits red light.

[0148] <Method of manufacturing light-emitting element> One embodiment of a method for manufacturing a light-emitting element will be described. The EL layer is formed by combining the above-mentioned materials. The EL layer can be formed by various methods (e.g., drying For example, a vacuum deposition method, an ink jet method, or a spray method can be used. Alternatively, different methods may be used for forming each layer. A second electrode is formed over the EL layer to complete a light-emitting element.

[0149] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. .

[0150] (Embodiment 6) In this embodiment, a light-emitting device formed by a method for manufacturing a light-emitting device according to one embodiment of the present invention is An electronic device and a lighting device to which the present invention is applied will be described with reference to FIG.

[0151] FIG. 9A shows an example of a mobile phone. A mobile phone 7400 is provided in a housing 7401. In addition to the built-in display unit 7402, operation buttons 7403, external connection port 7404, The mobile phone 7400 is equipped with a light emitting device, a microphone 7406, and the like. The display portion 7402 is fabricated by using the same.

[0152] In the mobile phone 7400 shown in FIG. 9A, information is displayed by touching the display portion 7402 with a finger or the like. You can also make calls, enter text, and perform any other operations. The operation can be performed by touching the display portion 7402 with a finger or the like.

[0153] In addition, by operating the operation button 7403, the power can be turned on and off, and the display unit 7402 can be displayed. For example, you can change the type of image displayed from the main menu to the email composition screen. You can switch to the screen.

[0154] Here, a light-emitting device manufactured by a method according to one embodiment of the present invention is incorporated in the display portion 7402. Therefore, it is possible to provide a highly reliable mobile phone with a curved display. can.

[0155] FIG. 9B shows an example of a wristband-type display device. The portable display device 7100 is The electronic device includes a housing 7101, a display unit 7102, an operation button 7103, and a transmission / reception device 7104. do.

[0156] The portable display device 7100 can receive a video signal by a transmitting / receiving device 7104. Video can be displayed on the display unit 7102. Audio signals can also be sent to other receiving devices. It is also possible.

[0157] In addition, the operation button 7103 can be used to turn the power on and off and to switch the image to be displayed. , or adjust the volume of the audio.

[0158] Here, a light-emitting device manufactured by a method according to one embodiment of the present invention is incorporated in the display portion 7102. Therefore, it is possible to provide a highly reliable portable display device having a curved display section. can be done.

[0159] 9(C) to (E) show examples of lighting devices. 220 includes a base 7201 having an operation switch 7203 and a The light emitting portion is configured to be

[0160] A lighting device 7200 shown in FIG. 9C includes a light-emitting unit 7202 having a corrugated light-emitting surface. This makes it a lighting device with a sophisticated design.

[0161] The light-emitting portion 7212 of the lighting device 7210 shown in FIG. 9D has two convexly curved light-emitting elements. Therefore, the lighting units are arranged symmetrically around the lighting device 7210. It can illuminate the position.

[0162] The lighting device 7220 shown in FIG. 9(E) includes a light-emitting portion 7222 that is curved in a concave shape. In order to collect light emitted from the light emitting unit 7222 on the front surface of the lighting device 7220, It is suitable for brightly lighting the surrounding area.

[0163] In addition, the light-emitting units of the lighting devices 7200, 7210, and 7220 Since it is flexible, the light-emitting part can be made of plastic materials or movable frames. The light emitting surface of the light emitting portion may be freely curved depending on the application.

[0164] In the above, the illumination device in which the light-emitting unit is supported by the base is illustrated. The housing can be fixed to the ceiling or hung from the ceiling. The light surface can be curved, so a specific area can be brightened by curving the light-emitting surface in a concave shape. The light can be curved convexly to illuminate an entire room.

[0165] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. . [Explanation of symbols]

[0166] 10 Board support mechanism 100 Light emitting device 110 Substrate 130 Light emitting element 200 Light emitting device 210 Substrate 220 Substrate 220a Board 220b Board 230 Light-emitting element 280a terminal section 280b Terminal section 300 Light emitting device 310 Substrate 320 Substrate 320a board 320b board 320c board 320d board 330 Light emitting element 400 Light Emitting Device 450 Exterior 453 Circuit 455 Inner lid 457 Secondary battery 460 Outer lid 480 Terminal section 490 Case 1101 Anode 1102 Cathode 1103 Light Emitting Unit 1103a Light Emitting Unit 1103b Light Emitting Unit 1104 Middle Class 1104a Electron injection buffer 1104b Electronic Relay Layer 1104c Charge generation region 1113 Hole injection layer 1114 Hole transport layer 1115 Light-emitting layer 1116 Electron transport layer 1117 Electron injection layer 7100 Portable display devices 7101 Case 7102 Display section 7103 Operation button 7104 Transmitting and receiving equipment 7200 Lighting Equipment 7201 Daibu 7202 Light emitting part 7203 Operation switch 7210 Lighting equipment 7212 Light emitting part 7220 Lighting Equipment 7222 Light emitting part 7400 Mobile Phone 7401 Case 7402 Display section 7403 Operation button 7404 External connection port 7405 Speaker 7406 Mike

Claims

[Claim 1] A first step of preparing a flexible substrate having a desired curved surface; a second step of forming a light-emitting element having a layer containing a light-emitting organic compound between a pair of electrodes in contact with the substrate supported in a flat plate shape; a third step of deforming or restoring a portion of the substrate, where the light emitting region of the light emitting element is provided, to a shape having a curved surface.

Images