Semiconductor module

Abstract

To improve cooling efficiency of a semiconductor module.SOLUTION: In a semiconductor module 1, a semiconductor element is provided on the side of one surface of a substrate 10, and a cooling section for cooling the substrate 10 is provided on the side of an other surface 12 of the substrate. The cooling section includes a jacket and a plurality of protruding bodies 30. The plurality of protruding bodies 30 are provided so as to protrude from the side of the other surface 12 of the substrate in an internal space of the jacket. Regarding a first protruding body 31 adjacent to an inner wall 21a of the jacket in a circulation direction V of a fluid (a direction from an inflow port 211 through a central part 21A of the jacket to an outflow port 213) in the plurality of protruding bodies 30, the side of a surface opposed to the inner wall 21a of the jacket is a flat surface.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present invention relates to a semiconductor module. [Background technology]

[0002] As a conventional cooling structure for a semiconductor module, for example, Patent Document 1 discloses a technique in which a plurality of rectangular prism-shaped fins are arranged in a staggered pattern on the heat dissipation surface of a substrate to allow cooling water to flow therethrough. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-50058 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional cooling structures, the cooling water tends to flow more toward the peripheral wall of the water-cooled jacket, where the flow resistance is smaller, and has difficulty flowing to the central area where cooling is required, and the desired cooling performance cannot be obtained.

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor module that can solve the above problems. [Means for solving the problem]

[0006] In order to solve the above problems, the semiconductor module of the present invention is a semiconductor module in which a semiconductor element is provided on one side of a substrate and a cooling section for cooling the substrate is provided on the other side of the substrate, the cooling section having a jacket and a plurality of protrusions, the plurality of protrusions are provided so as to protrude from the other side of the substrate in the internal space of the jacket, and a first protrusion among the plurality of protrusions adjacent to the inner wall of the jacket along the fluid flow direction has a flat surface on the surface side facing the inner wall of the jacket.

[0007] According to the present invention, the cooling section has a jacket and a plurality of protrusions, the plurality of protrusions are provided so as to protrude from the other surface side of the substrate in the internal space of the jacket, and a first protrusion among the plurality of protrusions adjacent to the inner wall of the jacket along the fluid flow direction has a flat surface on the surface side facing the inner wall of the jacket, so that the flow resistance of the first protrusion on the surface side facing the inner wall of the jacket can be relatively increased. This makes it possible to relatively reduce the flow of fluid from the first protrusion side to the inner wall side of the jacket and relatively increase the flow of fluid to the central portion side, thereby improving the cooling efficiency of the semiconductor module.

[0008] The first protrusion adjacent to the inner wall of the jacket has an inclined guide surface for guiding fluid from the inner wall side of the jacket to the central side of the jacket, making it possible to guide fluid from the inner wall side of the jacket to the central side.

[0009] The first protrusion adjacent to the inner wall of the jacket has a triangular prism shape, and the side of the triangular prism that faces the inner wall of the jacket is a flat surface that is parallel to the inner wall.This makes it possible to further reduce the flow of fluid from the first protrusion side to the inner wall of the jacket and to further increase the flow of fluid toward the central side, thereby further improving the cooling efficiency of the semiconductor module.

[0010] The other two inclined side surfaces of the triangular prism of the first protrusion adjacent to the inner wall of the jacket function as inclined guide surfaces for guiding fluid from the inner wall side of the jacket to the central side of the jacket, making it possible to reliably guide fluid from the inner wall side of the jacket to the central side.

[0011] The jacket is a box-shaped body that can be attached and detached to the other side of the substrate, and has an inlet through which fluid flows, a circulation section which is the internal space of the box-shaped body through which the fluid flowing in from the inlet flows, and an outlet through which the fluid flowing in the circulation section flows out.By providing a number of protrusions in the circulation section, the jacket ensures that the fluid flows reliably, thereby ensuring cooling of the semiconductor module.

[0012] Of the multiple protrusions, the second protrusion adjacent to the inner wall of the jacket on the inlet side has a flat surface on the side facing the inner wall of the jacket, so that the fluid flowing in from the inlet collides with the flat surface of the second protrusion, forming turbulence and making the flow more complex, thereby improving the cooling efficiency of the semiconductor module.

[0013] The second protrusion adjacent to the inner wall of the jacket has an inclined guide surface for guiding fluid from the inner wall side of the jacket to the central side of the jacket, making it possible to guide fluid from the inner wall side of the jacket to the central side.

[0014] The second protrusion adjacent to the inner wall of the jacket has a triangular prism shape, and the side of the triangular prism that faces the inner wall of the jacket is a flat surface that is parallel to the inner wall.This allows the fluid flowing in from the inlet to flow in such a way that it collides reliably with the flat surface of the second protrusion, forming turbulence and making the flow more complex, thereby improving the cooling efficiency of the semiconductor module.

[0015] The other two inclined side surfaces of the triangular prism of the second protrusion adjacent to the inner wall of the jacket face the central part of the jacket and function as inclined guide surfaces for guiding fluid from the inner wall side of the jacket to the central part of the jacket, thereby making it possible to reliably guide fluid from the inner wall side of the jacket to the central part.

[0016] Of the multiple protrusions, the third protrusion on the central side of the jacket and the fourth protrusion adjacent to the inner wall of the jacket on the outlet side are arranged in a staggered pattern and have a rectangular prism shape, with the side surface being an inclined surface that is inclined toward the flow direction, making it possible to reliably guide the fluid from the central side of the jacket to the outlet side. Effect of the Invention

[0017] As described above, according to the present invention, it is possible to improve the cooling efficiency of a semiconductor module. [Brief description of the drawings]

[0018] [Figure 1] 1 is a perspective view showing an outline of an overall configuration of a semiconductor module according to an embodiment of the present invention; [Diagram 2] FIG. 2 is an exploded perspective view showing an outline of the overall configuration of the semiconductor module. [Diagram 3] 2 is a perspective view showing the configuration of the other surface side of the semiconductor module. FIG. [Figure 4] 13 is a rear view showing the configuration of the other surface side of the semiconductor module. FIG. [Diagram 5] 5 is an enlarged rear view showing a part of FIG. 4 illustrating the configuration of the other surface side of the semiconductor module (an enlarged rear view of the vicinity of an inner wall 21a on one side). FIG. [Figure 6] 5 is another enlarged rear view showing a part of FIG. 4 illustrating the configuration of the other surface side of the semiconductor module (an enlarged rear view of the vicinity of the inner wall 21a on the other side). FIG. [Figure 7] 4 showing the configuration of the other surface side of the semiconductor module (an enlarged rear view of the vicinity of an inner wall 21b). FIG. [Figure 8] 5 is a further enlarged rear view showing a part of FIG. 4 illustrating the configuration of the other surface side of the semiconductor module (an enlarged rear view of the vicinity of the inner wall on the outlet 213 side). FIG. [Figure 9] 11 is a rear view showing the configuration of the other surface side of the semiconductor module according to the comparative example of the present invention. FIG. [Figure 10] 5 is an enlarged rear view showing a part of FIG. 4 illustrating the configuration of the other surface side of the semiconductor module (an enlarged rear view of the vicinity of an inner wall 21a on one side). FIG. [Figure 11] 5 is another enlarged rear view showing a part of FIG. 4 illustrating the configuration of the other surface side of the semiconductor module (an enlarged rear view of the vicinity of the inner wall 21a on the other side). FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a perspective view showing an outline of the overall configuration of a semiconductor module according to an embodiment of the present invention, Fig. 2 is an exploded perspective view showing an outline of the overall configuration of the semiconductor module, Fig. 3 is a perspective view showing the configuration of the other surface side of the semiconductor module, Fig. 4 is a rear view showing the configuration of the other surface side of the semiconductor module, Fig. 5 is an enlarged rear view showing a part of Fig. 4 showing the configuration of the other surface side of the semiconductor module, Fig. 6 is another enlarged rear view showing a part of Fig. 4 showing the configuration of the other surface side of the semiconductor module, Fig. 7 is yet another enlarged rear view showing a part of Fig. 4 showing the configuration of the other surface side of the semiconductor module, Fig. 8 is yet another enlarged rear view showing a part of Fig. 4 showing the configuration of the other surface side of the semiconductor module, Fig. 9 is a rear view showing the configuration of the other surface side of a semiconductor module according to a comparative example of the present invention, Fig. 10 is an enlarged rear view showing a part of Fig. 4 showing the configuration of the other surface side of the semiconductor module, and Fig. 11 is another enlarged rear view showing a part of Fig. 4 showing the configuration of the other surface side of the semiconductor module. In the following description, the direction perpendicular to the flow direction V of the fluid in the horizontal direction is referred to as the lateral direction, and is clearly indicated in the drawings.

[0020] [Configuration corresponding to claim 1] As shown in Figs. 1 to 6, the semiconductor module 1 according to the embodiment of the present invention is a semiconductor module 1 in which a semiconductor element 100 is provided on one surface 11 of a substrate 10 and a cooling unit 20 for cooling the substrate 10 is provided on the other surface 12 of the substrate 10. The cooling unit 20 has a jacket 21 and a plurality of protrusions 30. The plurality of protrusions 30 are provided so as to protrude from the other surface 12 of the substrate 10 in the internal space 21' of the jacket 21. The first protrusion 31 of the plurality of protrusions 30 adjacent to the inner wall 21a of the jacket 21 along the fluid flow direction V has a flat surface 31a' on the surface 31a side facing the inner wall 21a of the jacket 21. The substrate 10 is rectangular, and the first protrusions 31 having the flat surface 31a' are on both sides of the central portion 21A of the jacket 21. The semiconductor module 1 is, for example, a power module used for vehicle mounting, and has an electric capacity of 140kw to 850kw.

[0021] [Configuration corresponding to claim 2] The first protrusion 31 adjacent to the inner wall 21a of the jacket 21 has an inclined guide surface 31b' for guiding fluid from the inner wall 21a side of the jacket 21 to the central portion 21A side of the jacket 21.

[0022] [Configuration corresponding to claim 3] The first protrusion 31 adjacent to the inner wall 21a of the jacket 21 has a triangular prism shape, and the surface 31a side of the triangular prism that faces the inner wall 21a of the jacket 21 is a flat surface 31a' that is arranged parallel to the inner wall 21a.

[0023] [Configuration corresponding to claim 4] The other two inclined side surfaces 31b, 31c of the triangular prism shape of the first protruding body 31 adjacent to the inner wall 21a of the jacket 21 function as inclined guide surfaces 31b' for guiding fluid from the inner wall 21a side of the jacket 21 to the central part 21A side of the jacket 21. The other two inclined side surfaces 31b, 31c of the triangular prism shape of the first protruding body 31 are surfaces facing the central part 21A side of the jacket 21.

[0024] [Configuration corresponding to claim 5] The jacket 21 is a box that can be attached to and detached from the other surface 12 of the substrate 10, and has an inlet 211 through which a fluid flows, a flow section 212 that is an internal space 21' of the box and through which the fluid flowing in from the inlet 211 flows, and an outlet 213 through which the fluid flowing in the flow section 212 flows out, and a plurality of protrusions 30 are provided in the flow section 212. The jacket 21 is detachably fastened to the other surface 12 of the substrate 10 via fasteners such as bolts and screws. The flow direction V is defined as a direction from the inlet 211 through the central portion 21A of the jacket 21 to the outlet 213. The inlet 211 is provided in the central portion of the inner wall 21b of the jacket 21, and the outlet 213 is provided in the central portion of the inner wall 21b of the jacket 21.

[0025] [Configuration corresponding to claim 6] Of the multiple protrusions 30, the second protrusion 32 adjacent to the inner wall 21b of the jacket 21 on the inlet 211 side has a surface 32a facing the inner wall 21b of the jacket 21, which is a flat surface 32a', as shown in FIG.

[0026] [Configuration corresponding to claim 7] The second protrusion 32 adjacent to the inner wall 21b of the jacket 21 has an inclined guide surface 32b' for guiding the fluid from the inner wall 21b side of the jacket 21 to the central portion 21A side of the jacket 21.

[0027] [Configuration corresponding to claim 8] The second protrusion 32 adjacent to the inner wall 21b of the jacket 21 has a triangular prism shape, and the surface 32a of the triangular prism shape that faces the inner wall 21b of the jacket 21 is a flat surface 32a' that is arranged parallel to the inner wall 21b.

[0028] [Configuration corresponding to claim 9] The other two inclined side surfaces 32b, 32c of the triangular prism shape of the second protrusion 32 adjacent to the inner wall 21b of the jacket 21 are surfaces facing the central portion 21A of the jacket 21 and function as inclined guide surfaces 32b', 32c' for guiding fluid from the inner wall 21b side of the jacket 21 to the central portion 21A side of the jacket 21.

[0029] [Configuration corresponding to claim 10] Of the multiple protrusions 30, the third protrusion 33 on the central portion 21A side of the jacket 21 and the fourth protrusion 34 adjacent to the inner wall 21c of the jacket 21 on the outlet 213 side are arranged in a staggered pattern in the shape of a rectangular prism, as shown in Figure 8, and the side surface 34a side is an inclined surface that is inclined with respect to the flow direction V.

[0030] [Effect corresponding to claim 1] As described above, according to the present invention, the cooling section 20 has the jacket 21 and the multiple protrusions 30, and the multiple protrusions 30 are provided so as to protrude from the other surface 12 side of the substrate 10 in the internal space 21' of the jacket 21, and the first protrusion 31 adjacent to the inner wall 21a of the jacket 21 along the fluid flow direction V among the multiple protrusions 30 has a flat surface 31a' on the surface 31a side facing the inner wall 21a of the jacket 21, so that the flow resistance of the surface 31a side of the first protrusion 31 facing the inner wall 21a of the jacket 21 can be relatively increased. This makes it possible to relatively reduce the flow of fluid from the first protrusion 31 side to the inner wall 21a side of the jacket 21 and relatively increase the flow of fluid to the central portion 21A side, thereby improving the cooling efficiency of the semiconductor module 1.

[0031] [Effect corresponding to claim 2] In addition, the first protrusion 31 adjacent to the inner wall 21a of the jacket 21 has inclined guide surfaces 31b', 31c' for guiding fluid from the inner wall 21a side of the jacket 21 to the central portion 21A side of the jacket 21, making it possible to guide fluid from the inner wall 21a side of the jacket 21 to the central portion 21A side. [Effect corresponding to claim 3]

[0032] Furthermore, the first protrusion 31 adjacent to the inner wall 21a of the jacket 21 has a triangular prism shape, and the surface 31a of the triangular prism shape that faces the inner wall 21a of the jacket 21 is a flat surface 31a' that is arranged parallel to the inner wall 21a. This makes it possible to further reduce the flow of fluid from the first protrusion 31 side to the inner wall 21a side of the jacket 21 and further increase the flow of fluid toward the central portion 21A side, thereby further improving the cooling efficiency of the semiconductor module 1.

[0033] That is, as shown in Figures 9 to 11, if the first protrusion 31 is made into a rectangular prism shape and the side surface 31' is made into an inclined surface inclined with respect to the flow direction V, the flow of fluid will be concentrated toward the inner wall 21a side where there is less flow path resistance, reducing the amount of fluid flowing toward the central portion 21A side, thereby reducing the cooling efficiency of the semiconductor module 1.

[0034] [Effect corresponding to claim 4] Furthermore, the other two inclined side surfaces 31b, 31c of the triangular prism shape of the first protrusion 31 adjacent to the inner wall 21a of the jacket 21 function as inclined guide surfaces 31b', 31c' for guiding fluid from the inner wall 21a side of the jacket 21 to the central portion 21A side of the jacket 21, thereby making it possible to reliably guide fluid from the inner wall 21a side of the jacket 21 to the central portion 21A side.

[0035] [Effect corresponding to claim 5] Furthermore, the jacket 21 is a box-shaped body that can be attached and detached to the other surface 12 of the substrate 10, and has an inlet 211 through which a fluid flows, a flow section 212 which is the internal space 21' of the box-shaped body and through which the fluid flowing in from the inlet 211 flows, and an outlet 213 through which the fluid flowing in the flow section 212 flows out. Since the flow section 212 is provided with a plurality of protrusions 30, the jacket 21 ensures that the fluid flows and the semiconductor module 1 is cooled reliably.

[0036] [Effect corresponding to claim 6] Furthermore, among the multiple protrusions 30, the second protrusion 32 adjacent to the inner wall 21b of the jacket 21 on the inlet 211 side has a flat surface on the surface 32a side facing the inner wall 21b of the jacket 21, so that the fluid flowing in from the inlet 211 collides with the flat surface of the second protrusion 32, forming turbulence and making the flow more complex, thereby improving the cooling efficiency of the semiconductor module 1.

[0037] [Effect corresponding to claim 7] Furthermore, the second protrusion 32 adjacent to the inner wall 21b of the jacket 21 has inclined guide surfaces 32b', 32c' for guiding fluid from the inner wall 21b side of the jacket 21 to the central portion 21A side of the jacket 21, making it possible to guide fluid from the inner wall 21b side of the jacket 21 to the central portion 21A side.

[0038] [Effect corresponding to claim 8] Furthermore, the second protrusion 32 adjacent to the inner wall 21b of the jacket 21 has a triangular prism shape, and the surface 32a of the side of the triangular prism that faces the inner wall 21b of the jacket 21 is a flat surface 32a' that is arranged parallel to the inner wall 21b. As a result, the fluid flowing in from the inlet 211 flows in so as to reliably collide with the flat surface of the second protrusion 32, forming turbulence and making the flow more complex, thereby making it possible to improve the cooling efficiency of the semiconductor module 1.

[0039] [Effect corresponding to claim 9] Furthermore, the other two inclined side surfaces 32b, 32c of the triangular prism shape of the second protrusion 32 adjacent to the inner wall 21b of the jacket 21 are surfaces facing the central portion 21A of the jacket 21 and function as inclined guide surfaces 32b', 32c' for guiding fluid from the inner wall 21b side of the jacket 21 to the central portion 21A side of the jacket 21, thereby making it possible to reliably guide fluid from the inner wall 21b side of the jacket 21 to the central portion 21A side.

[0040] [Effect corresponding to claim 10] Furthermore, among the multiple protrusions 30, the third protrusion 33 on the central portion 21A side of the jacket 21 and the fourth protrusion 34 adjacent to the inner wall 21c of the jacket 21 on the outlet 213 side are arranged in a staggered pattern and have a rectangular prism shape, with the side surface 34a being an inclined surface inclined with respect to the flow direction V, thereby making it possible to reliably guide the fluid from the central portion 21A side of the jacket 21 to the outlet 213 side.

[0041] That is, in the semiconductor module 1 of the present invention, the fluid flowing in from the inlet 211 flows in so as to collide with the flat surface of the second protrusion 32, forming a turbulent flow, while also achieving reliable flow from the inner wall 21a side of the jacket 21 to the central portion 21A side, and from the central portion 21A side to the outlet 213 side, thereby dramatically improving the cooling efficiency of the semiconductor module 1.

[0042] [Modifications and applications] Of course, the present invention is not limited to the above-described embodiment, and various modifications and applications are possible without departing from the scope of the claims.

[0043] That is, for example, in the embodiment described above, the first protrusion 31 having the flat surface 31a' is located on both sides of the central portion 21A of the jacket 21, but the required effect is also achieved when it is located on only one side.

[0044] In addition, in the above-described embodiment, the second protrusion 32 adjacent to the inner wall 21b of the jacket 21 on the inlet 211 side also has a flat surface 32a' on the surface 32a facing the inner wall 21b of the jacket 21, but the required effect can be achieved even if the shape of the second protrusion 32 is a rectangular prism, as with the third protrusion 33 on the central portion 21A side and the fourth protrusion 34 adjacent to the inner wall 21c of the jacket 21 on the outlet 213 side. [Explanation of symbols]

[0045] V: Distribution direction 1: Semiconductor module 10: Substrate 11: First Side 12: Other Sides 20: Cooling section 21: Jacket 21a:Inner wall 21A: Central part 21b:Inner wall 21´:Interior space 211:Inlet 212: Distribution Department 213: Outlet 30: Projection body 31: 1st protrusion 31a: Opposing surface 31a´:Flat surface 31b: Side 31b´: Guide surface 31c: Side 31c´: Guideway 32:Second protrusion 32a: Opposing surface 32a´:Flat surface 32b: Side 32b´: Guide surface 32c: Side 32c´: Guideway 33: Third protrusion 34:Fourth protrusion 34a: Side 100: Semiconductor element

Claims

1. A semiconductor module including a semiconductor element provided on one surface side of a substrate and a cooling unit for cooling the substrate provided on the other surface side of the substrate, The cooling unit includes: a jacket and a plurality of protrusions; the plurality of protrusions are provided in the internal space of the jacket so as to protrude from the other surface side of the substrate, A semiconductor module, characterized in that a first protrusion among the multiple protrusions, which is adjacent to the inner wall of the jacket along the fluid flow direction, has a flat surface on the side facing the inner wall of the jacket.

2. 2. The semiconductor module according to claim 1, wherein the first protrusion adjacent to the inner wall of the jacket has an inclined guide surface for guiding the fluid from the inner wall side of the jacket to the central portion side of the jacket.

3. The semiconductor module according to claim 1, characterized in that the first protrusion adjacent to the inner wall of the jacket has a triangular prism shape, and the side of the triangular prism shape that faces the inner wall of the jacket is the flat surface that is arranged parallel to the inner wall.

4. The semiconductor module described in claim 3, characterized in that the other two inclined side surfaces of the triangular prism of the first protrusion adjacent to the inner wall of the jacket function as inclined guide surfaces for guiding the fluid from the inner wall side of the jacket to the central side of the jacket.

5. The semiconductor module described in claim 1, characterized in that the jacket is a box-shaped body that can be attached and detached to the other side of the substrate, and has an inlet through which the fluid flows, a circulation section which is an internal space of the box-shaped body and through which the fluid flowing in from the inlet flows, and an outlet through which the fluid flowing in the circulation section flows out, and the multiple protrusions are provided in the circulation section.

6. 2. The semiconductor module according to claim 1, wherein a second protrusion among the plurality of protrusions adjacent to the inner wall of the jacket on the inlet side has a flat surface on the side facing the inner wall of the jacket.

7. 7. The semiconductor module according to claim 6, wherein the second protrusion adjacent to the inner wall of the jacket has an inclined guide surface for guiding the fluid from the inner wall side of the jacket to the central portion side of the jacket.

8. The semiconductor module described in claim 6, characterized in that the second protrusion adjacent to the inner wall of the jacket has a triangular prism shape, and the side of the triangular prism shape that faces the inner wall of the jacket is the flat surface that is arranged parallel to the inner wall.

9. The semiconductor module described in claim 8, characterized in that the other two inclined side surfaces of the triangular prism of the second protrusion adjacent to the inner wall of the jacket are surfaces facing the central part of the jacket and function as inclined guide surfaces for guiding the fluid from the inner wall side of the jacket to the central part of the jacket.

10. The semiconductor module described in claim 6, characterized in that among the multiple protrusions, a third protrusion on the central side of the jacket and a fourth protrusion adjacent to the inner wall of the jacket on the outlet side are arranged in a staggered pattern in the shape of a rectangular prism, and the side surface forms an inclined surface inclined with respect to the flow direction.

Images