Display device

Abstract

To provide an angle adjusting device which can maintain a desired angle.SOLUTION: The present invention relates to an angle adjusting device which can fix the relative positions of a first component and a second component and hold the positions. A supporting tool, which is formed by combining the angle adjusting device and a component such as a flat plate, can hold a shape of being expanded in a flat surface as a whole, a shape of being bent, or a shape of maintaining a desired angle. Also, the angle adjusting device can allow a device to bend in one direction and can prohibit the device to bent in the opposite direction. A device having the angle adjusting device can be therefore prevented from bending unexpectedly and can be avoided from being broken.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an object, a method, or a manufacturing method. Alternatively, the present invention relates to a process, a machine, a manufacture, or a composition of matter. In particular, one aspect of the present invention relates to a semiconductor device, a light-emitting device, a display device, an electronic device, a lighting device, a driving method thereof, or a manufacturing method thereof. In particular, one aspect of the present invention relates to an angle adjustment device, a support for a flexible part, and a display device having the support for the flexible part.

[0002] In this specification and the like, a semiconductor device refers to any device that can function by utilizing semiconductor characteristics. A transistor, a semiconductor circuit, an arithmetic device, a memory device, and the like are examples of a semiconductor device. A light-emitting device, a display device, a lighting device, and an electronic device may include a semiconductor device. [Background technology]

[0003] Electronic devices such as mobile phones, smartphones, tablet computers, and laptop computers are made to an appropriate size according to their functions, ease of use, design, portability, and the like. On the other hand, it is inconvenient to carry multiple electronic devices with overlapping functions. Therefore, a form that can integrate the functions of multiple electronic devices is desired. For example, Patent Document 1 discloses a tri-fold type light-emitting panel. By using this light-emitting panel, it is possible to integrate the functions of multiple electronic devices and create an electronic device with a variable size. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2015-130320 A Summary of the Invention [Problem to be solved by the invention]

[0005] In a display device with a foldable display unit, at least a part of a display panel formed on a flexible substrate is fixed to a support, and the support is bent to perform a folding operation, etc. In this case, if the support is bent in a direction opposite to the design intent, the display panel and the hinge portion of the support may be destroyed, so it is preferable that the display device is designed not to be easily bent in the opposite direction.

[0006] The display device is used in various deformed states. For example, it is assumed that the display device is used in a flat state, a folded state, or a state bent at a desired angle (intermediate state). Therefore, it is preferable that the support can maintain its shape regardless of the state.

[0007] Therefore, an object of one embodiment of the present invention is to provide an angle adjustment device that adjusts the relative angle between components. Or, an object of the present invention is to provide an angle adjustment device that can fix the relative angle between components to a desired angle. Or, an object of the present invention is to provide a support for supporting a flexible component. Or, an object of the present invention is to provide a support for performing a bending operation without impairing the reliability of the flexible component. Or, an object of the present invention is to provide a new support for a flexible component. Or, an object of the present invention is to provide a new light-emitting device.

[0008] Another object is to provide a foldable display device with excellent portability. Another object is to provide a foldable display device with excellent display visibility. Another object is to provide a foldable display device with a power saving function. Another object is to provide a novel display device.

[0009] Note that the description of these problems does not preclude the existence of other problems. One embodiment of the present invention does not necessarily solve all of these problems. In addition, problems other than those described above will become apparent from the description of the specification, etc., and problems other than those described above can be extracted from the description of the specification, etc. [Means for solving the problem]

[0010] One aspect of the present invention relates to an angle adjustment device capable of maintaining a desired angle, a support having the angle adjustment device, or a display device having the support.

[0011] One aspect of the present invention includes a first foundation part, a second foundation part, a first connecting part, a second connecting part, a first columnar part, a second columnar part, a third columnar part, and a fourth columnar part, the first foundation part and the second foundation part each having a first region and a second region, the first connecting part and the second connecting part each having a first opening and a notch, the first opening and the notch are formed along the length of the first connecting part and the second connecting part, This is an angle adjustment device in which the base parts are arranged side by side in the hand direction, a first columnar part or a third columnar part is inserted into the first opening, a second columnar part or a fourth columnar part is inserted into the cutout, a first region of the first base part is connected to a second region of the second base part via the first columnar part, the first connecting part and the fourth columnar part, and the first region of the second base part is connected to the second region of the first base part via the third columnar part, the second connecting part and the second columnar part.

[0012] The first basic part and the second basic part each have a first surface, a second surface, a third surface, a fourth surface, and a fifth surface, the first surface and the second surface have the same shape, the third surface and the fourth surface have the same shape, the first surface is parallel to the second surface, the first surface is located opposite to the second surface, the third surface is adjacent to the first surface, and the fourth surface is adjacent to the second surface; The angle between the third surface and the first surface is greater than 180° and less than 270°, the angle between the fourth surface and the second surface is greater than 180° and less than 270°, and the angle between the third surface and the fourth surface is greater than 180° and less than 360°, the fifth surface is adjacent to each of the first surface to the fourth surface, and the first region and the second region can be provided on the fifth surface.

[0013] The first columnar part is inserted into the first opening of the first connecting part, the second columnar part is inserted into the cutout of the second connecting part, the third columnar part is inserted into the first opening of the second connecting part, and the fourth columnar part is inserted into the cutout of the first connecting part, and the long axes of the first columnar part through the fourth columnar part can be parallel.

[0014] The first columnar part can be fixed to a first region of the first base part, the second columnar part can be fixed to a second region of the first base part, the third columnar part can be fixed to the first region of the second base part, and the fourth columnar part can be fixed to the second region of the second base part.

[0015] The first connecting part and the second connecting part have elasticity and can elastically deform the shape of the cutout portion.

[0016] The cutout portion has a third region, a fourth region, and a fifth region, the fourth region being between the third region and the fifth region, the fifth region being between the third region and the first opening, and the top surface shapes of the third region to the fifth region may be a shape including an arc.

[0017] The relative angle between the first base part and the second base part can be switched by switching the position of the second columnar part from one of the third area or the fourth area of ​​the second connecting part to the other, and by switching the position of the fourth columnar part from one of the third area or the fourth area of ​​the first connecting part to the other.

[0018] When the second columnar part is in the third region of the second connecting part and the fourth columnar part is in the third region of the first connecting part, the first surface of the first base part can be aligned opposite the second surface of the second base part.

[0019] When the second columnar part is in the third region of the second connecting part and the fourth columnar part is in the third region of the first connecting part, the third surface of the first base part can face the fourth surface of the second base part.

[0020] The device further includes a third connecting part, a fourth connecting part and a fifth columnar part, the third connecting part and the fourth connecting part having second openings, the third connecting part is fixed to the first base part, the fourth connecting part is fixed to the second base part, a fifth columnar part is inserted into the second opening of the third connecting part and the second opening of the fourth connecting part, the long axis of the fifth columnar part is parallel to each of the long axes of the first base part to the fourth columnar part, and the fifth columnar part can be located near the area where the first base part and the second base part contact each other.

[0021] A support for a flexible component can be formed by providing the angle adjustment device on a hinge portion, and a display device can be formed by providing a flexible display panel on the support.

[0022] The display panel preferably comprises a light emitting device. Effect of the Invention

[0023] By using one embodiment of the present invention, it is possible to provide an angle adjustment device that adjusts the relative angle between components. It is possible to provide an angle adjustment device that can fix the relative angle between components to a desired angle. Or, it is possible to provide a support for supporting a flexible component. Or, it is possible to provide a support for performing a bending operation without impairing the reliability of the flexible component. Or, it is possible to provide a novel support for a flexible component. Or, it is possible to provide a novel light-emitting device.

[0024] Alternatively, it is possible to provide a foldable display device with excellent portability. Alternatively, it is possible to provide a foldable display device with excellent visibility of the display. Alternatively, it is possible to provide a foldable display device with a power saving function. Alternatively, it is possible to provide a foldable display device with excellent ease of holding. Alternatively, it is possible to provide a novel display device.

[0025] Note that the description of these effects does not preclude the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. Note that effects other than these will become apparent from the description in the specification, drawings, claims, etc., and it is possible to extract effects other than these from the description in the specification, drawings, claims, etc. [Brief description of the drawings]

[0026] [Figure 1] FIG. 1 is a diagram illustrating an angle adjustment device. [Diagram 2] Fig. 2A is a diagram illustrating a base part, and Fig. 2B is a diagram illustrating a connecting part. [Diagram 3] 3A to 3C are diagrams illustrating a connecting part. [Figure 4] FIG. 4 is a diagram illustrating the angle adjustment device. [Diagram 5] 5A to 5D are diagrams illustrating an angle adjustment device. [Figure 6] 6A and 6B are diagrams illustrating an angle adjustment device. [Figure 7] 7A to 7D are diagrams illustrating an angle adjustment device. [Figure 8] 8A and 8B are diagrams illustrating an angle adjustment device. [Figure 9] 9A to 9C are diagrams illustrating an angle adjustment device. [Figure 10] 10A and 10B are diagrams illustrating an angle adjustment device. [Figure 11] 11A to 11C are diagrams illustrating a support tool. [Figure 12] 12A and 12B are diagrams illustrating a support. [Figure 13] 13A and 13B are diagrams illustrating a support tool. [Figure 14] 14A and 14B are diagrams illustrating a display device. [Figure 15] 15A and 15B are diagrams illustrating a display device. [Figure 16] 16A to 16C are diagrams illustrating a support tool. [Figure 17] 17A to 17C are diagrams illustrating a support tool. [Figure 18] 18A and 18B are diagrams illustrating a display device. [Figure 19] 19A to 19D are diagrams illustrating a display device. [Figure 20] FIG. 20 is a diagram illustrating an example of the configuration of a display panel. [Figure 21] FIG. 21 is a diagram illustrating an example of the configuration of a display panel. [Figure 22] FIG. 22 is a diagram illustrating an example of the configuration of a display panel. [Diagram 23] Figure 23A is a block diagram of a display panel, and Figures 23B and 23C are circuit diagrams of a pixel. [Figure 24] Figures 24A, 24C and 24D are circuit diagrams of the pixel, and Figure 24B is a timing chart illustrating the operation of the pixel. [Diagram 25] 25A to 25E are diagrams for explaining examples of pixel configurations. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that the form and details of the present invention can be modified in various ways without departing from the spirit and scope of the present invention. Therefore, the present invention is not interpreted as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same reference numerals are used in common between different drawings for the same parts or parts having similar functions, and repeated explanations may be omitted. In addition, hatching of the same elements constituting the drawings may be omitted or changed as appropriate between different drawings.

[0028] In addition, even if a circuit diagram shows a single element, the element may be configured as a plurality of elements as long as there is no functional problem. For example, a plurality of transistors operating as a switch may be connected in series or parallel. A capacitor may also be divided and placed in multiple positions.

[0029] In addition, one conductor may have multiple functions such as wiring, an electrode, and a terminal, and in this specification, multiple names may be used for the same element. Even if elements are shown as being directly connected to each other on a circuit diagram, the elements may actually be connected to each other via one or more conductors, and in this specification, such a configuration is also included in the category of direct connection.

[0030] In this specification, a display panel is typically used as a flexible component, but other components may also be used, such as solar cells, primary batteries, secondary batteries, antennas, charging coils, speakers, microphones, cables, lighting, various terminals, various wiring, various sensors, various circuits, and composite devices of any of these.

[0031] In addition, in this specification, the display device refers to any device having a display function. In other words, electronic devices having a display unit are included in the display device. For example, electronic devices having a display unit such as mobile phones, smartphones, smart watches, tablet computers, and television devices are included in the display device.

[0032] (Embodiment 1) In this embodiment, an angle adjustment device, a support, and a display device according to one embodiment of the present invention will be described with reference to the drawings.

[0033] One aspect of the present invention is an angle adjustment device having a first foundation part and a second foundation part and a mechanism for switching the relative angle between them. Another aspect of the present invention is a support having the angle adjustment device.

[0034] The angle adjustment device can fix and hold the relative positions of the first and second foundation parts. For example, a support that combines the angle adjustment device with a part such as a flat plate can hold the entire structure in a flat, folded, or at a desired angle.

[0035] In addition, the angle adjustment device allows bending in one direction and prevents bending in the opposite direction, so that unexpected bending of a device having the angle adjustment device can be prevented, and damage to the device can be prevented.

[0036] <Angle adjustment device> 1A is a diagram illustrating an angle adjustment device 100 according to one embodiment of the present invention. The angle adjustment device 100 includes base components 101a and 101b, connecting components 102a and 102b, and columnar components 103a, 103b, 104a, and 104b. The base component 101a is connected to the base component 101b via other components. The columnar components 103a, 103b, 104a, and 104b can be cylindrical or polygonal cylindrical components, and this embodiment describes an example in which cylindrical components are used.

[0037] 2A is a perspective view illustrating the shapes of base components 101a and 101b. Base components 101a and 101b may have the same shape, and have surfaces 111, 112, 113, 114, and 115, respectively. Surfaces 111 and 112 may have the same shape. Surfaces 113 and 114 may have the same shape.

[0038] Surface 111 and surface 112 are parallel and positioned opposite each other. Surface 113 is positioned adjacent to surface 111. Surface 114 is positioned adjacent to surface 112. Surface 113 is inclined at an angle greater than 180° and less than 270° with respect to surface 111. Surface 114 is inclined at an angle greater than 180° and less than 270° with respect to surface 112. Surface 113 is inclined at an angle greater than 180° and less than 360° with respect to surface 114. Surface 115 is positioned adjacent to each of surfaces 111 to 114.

[0039] By adjusting the inclination angles of surfaces 113 and 114, it is possible to adjust the relative angle generated between base parts 101a and 101b by the operation of angle adjustment device 100. Here, the relative angle means the angle generated between the same parts when the positions of base parts 101a and 101b are changed according to the mechanism of the angle adjustment device.

[0040] Furthermore, the surface 115 has regions 151 and 152. Openings may be provided in the regions 151 and 152. In this embodiment, the regions 151 and 152 of the base part 101a are referred to as regions 151a and 152a. The regions 151 and 152 of the base part 101b are referred to as regions 151b and 152b.

[0041] It is preferable that the base components 101a and 101b and the columnar components 103a, 103b, 104a, and 104b do not deform during operation, and are preferably made of a hard material such as metal, resin, ceramics, or a composite containing at least one of these materials.

[0042] 2B is a top view illustrating the shapes of the connecting parts 102a and 102b. The connecting parts 102a and 102b can have the same shape, and each has an opening 121 and a notch 122.

[0043] In the top view, the center of the opening 121 can be provided on a straight line that is parallel to the longitudinal direction of the cutout portion 122 and passes through the center of the cutout portion 122. The shapes of the connecting parts 102a and 102b can be symmetrical with respect to the straight line. The columnar part 103a or the columnar part 103b can be inserted into the opening 121.

[0044] The cutout portion 122 has regions 122a, 122b, and 122c. The columnar part 104a or the columnar part 104b can be inserted into the region 122a or the region 122b. The region 122a and the region 122b are connected, and each of the upper surface shapes has two arcs.

[0045] 2B, one arc of the region 122a has point A, the other arc has point B, one arc of the region 122b has point C, the other arc has point D, and points A and B face each other, and points C and D face each other. In this case, it is preferable that the distance L1 between points A and B and between points C and D is approximately the same as or smaller than the diameter of a cross section perpendicular to the major axis of the columnar parts 104a and 104b. In addition, a region where the region 122a and the region 122b are connected is provided with a region in which the width in the minor axis direction of the cutout portion 122 is L2, which is smaller than L1.

[0046] Since the columnar part 104a or the columnar part 104b can be clamped between the two arcs, the position of the columnar part 104a or the columnar part 104b inserted into the cutout part 122 can be easily fixed.

[0047] Moreover, the region 122c is provided between the opening 121 and the region 122b. The regions 122b and 122c are connected, and the top surface of the region 122c has an arc shape.

[0048] The connecting components 102a and 102b are preferably made of a hard material such as metal, resin, or a composite thereof, and a material having elasticity. Here, let the shortest distance between the point E on the arc of the region 122c and the outer periphery excluding the notch 122 of the connecting component 102a (or 102b) be L4. At this time, by setting L4 to an appropriate value, a part of the connecting component 102a (or 102b) can be elastically deformed with the vicinity of the region 122c as a fulcrum, and the lengths of L1 and L2 can be changed.

[0049] For example, in the connecting component 102a, as shown in FIG. 3A, it is assumed that the columnar component 104b is inserted into the region 122b in the initial state. Next, as shown in FIG. 3B, when a force acting in the direction of the region 122a acts on the columnar component 104b, the connecting component 102a elastically deforms with the vicinity of the region 122c as a fulcrum, and temporarily L1 changes to L1' (L1 < L1'). Also, L2 changes to L2' (L2 < L2').

[0050] Then, as shown in FIG. 3C, when a force acting in the same direction further acts on the columnar component 104b, when the columnar component 104b enters the region 122a, the elastic deformation of the connecting component returns to its original state. Therefore, the columnar component 104b is inserted into the region 122a. If a force acting in the opposite direction acts on the columnar component 104b, it can return from the state shown in FIG. 3C to the state shown in FIG. 3A. The regions 122a and 122b can also be referred to as stable positions of the columnar component 104b in the notch 122. In the present embodiment, an example in which two stable positions, the region 122c and the region 122b, are provided in the shown notch 122 is shown, but the number of stable regions may be three or more.

[0051] The degree of the above elastic deformation can be adjusted by the length of L4 shown in FIG. 2B. The longer the length of L4, the more difficult it is to elastically deform, and the shorter the length of L4, the easier it is to elastically deform. Therefore, the length of L4 may be adjusted according to the application.

[0052] The degree of the elastic deformation can also be adjusted by adjusting the length L3, which is the shortest distance between point F of the region between region 122c and region 122b and the outer periphery of connecting part 102a (or 102b) excluding notch 122. The degree of the elastic deformation may also be adjusted by changing the thickness (length in the depth direction in FIG. 2B) of connecting part 102a (or 102b).

[0053] 4 is an exploded view of the angle adjustment device 100. In one embodiment of the angle adjustment device 100, the surface 111 of the base part 101a and the surface 112 of the base part 101b are arranged so as to be in contact with each other.

[0054] One of the longitudinal ends of the columnar part 103a is connected to the region 151a. One of the longitudinal ends of the columnar part 104a is connected to the region 152a. One of the longitudinal ends of the columnar part 103b is connected to the region 151b. One of the longitudinal ends of the columnar part 104b is connected to the region 152b.

[0055] At this time, the respective long axes of the columnar parts 103a, 103b and the columnar parts 104a, 104b are parallel and perpendicular to the surface 115 of the base part 101a and the base part 101b. Also, the columnar parts 103a, 103b and the columnar parts 104a, 104b may be fixed to the base part 101a and the base part 101b. Alternatively, the columnar parts 103a, 103b and the columnar parts 104a, 104b may be in a state in which they can rotate about the center line. Alternatively, the columnar parts 103a, 104a and the base part 101a may be one structure. Also, the columnar parts 103b, 104b and the base part 101b may be one structure.

[0056] In the above state, the columnar part 103b is inserted into the opening 121 of the connecting part 102b, and the columnar part 104a is inserted into the region 122a of the cutout part 122 of the connecting part 102b. Also, the columnar part 103a is inserted into the opening 121 of the connecting part 102a, and the columnar part 104b is inserted into the region 122a of the cutout part 122 of the connecting part 102a. With this configuration, the shape shown in FIG. 1 is obtained.

[0057] At this time, the connecting part 102b is in a state where it can rotate about the center line of the columnar part 103b as an axis, and the connecting part 102a is in a state where it can rotate about the center line of the columnar part 103a as an axis.

[0058] Here, as shown in Fig. 5A, the side between faces 111 and 113 of base part 101a is defined as side H, and base parts 101a and 101b are rotated about side H as a central axis to change the state in which faces 111 of base part 101a and faces 112 of base part 101b are in contact (Fig. 5A) to a state in which faces 113 of base part 101a and faces 114 of base part 101b are in contact (Fig. 5B). Side H can also be considered as the side between faces 112 and 114 of base part 101b.

[0059] When the same operation as above is applied to the configuration of one embodiment of the present invention shown in Fig. 1, as shown in Fig. 5C and Fig. 5D, connecting part 102b moves so as to rotate about the center line of columnar part 103b as an axis, and the position of columnar part 104a inserted into cutout part 122 changes from region 122a to region 122b. Also, connecting part 102a moves so as to rotate about the center line of columnar part 103a as an axis, and the position of columnar part 104b inserted into cutout part 122 changes from region 122a to region 122b.

[0060] In addition, in order to change from the state of FIG. 5C to the state of FIG. 5D, or vice versa, it is necessary to apply a force that elastically deforms the connecting parts 102a and 102b. Therefore, the state of FIG. 5C or the state of FIG. 5D can be maintained unless the force is applied. It can be said that the change from the state of FIG. 5C to the state of FIG. 5D, or vice versa, changes the relative angle between the base part 101a and the base part 101b. Therefore, one embodiment of the present invention can be used as an angle adjustment device.

[0061] 6A and 6B, connecting parts 131a and 131b may be added to the angle adjustment device of one embodiment of the present invention, and a physical rotation axis (columnar part 105) may be provided at the position of side H.

[0062] Fig. 6A is a diagram showing the state in which the connecting parts 131a and 131b are assembled to the base parts 101a and 101b. Fig. 6B is an exploded view thereof. By providing the connecting parts 131a and 131b and the columnar part 105, the operation of the angle adjustment device 100 can be made smoother, and the mechanical strength can be further increased.

[0063] The base components 101a and 101b are provided with cutouts 106 into which the columnar component 105 can be inserted in an area corresponding to the position of side H shown in FIG. 5A and its periphery. The cutouts 106 are divided into a cutout area provided in the base component 101a and a cutout area provided in the base component 101b. A cylindrical component can be used as the columnar component 105, and at least one of its ends is inserted into the cutout 106. It is preferable that the central axis of the columnar component 105 overlaps with the side H shown in FIG. 5A.

[0064] The connecting part 131a has openings 141a and 142a, and the columnar part 104a is inserted into the opening 141a. The connecting part 131b has openings 141b and 142b, and the columnar part 104b is inserted into the opening 141b. Parts of the connecting part 131a and the connecting part 131b are positioned to overlap, and the columnar part 105 is inserted into the openings 142a and 142b.

[0065] 6A and 6B, since the connecting part 131b is located on the inside and the connecting part 131a is located on the outside when viewed from the base parts 101a and 101b side, a spacer 132 is provided on the connecting part 131a to stabilize its position. It is preferable that the thickness of the spacer 132 is the same as that of the connecting part 131b or thicker than the thickness of the connecting part 131b. When the connecting part 131b is located on the outside and the connecting part 131a is located on the inside when viewed from the base parts 101a and 101b side, the spacer 132 may be provided on the connecting part 131b.

[0066] Here, it is preferable that the connecting part 131a is fixed to the base part 101a. Alternatively, the connecting part 131a may be fixed to a columnar part 104a fixed to the base part 101a. Also, it is preferable that the connecting part 131b is fixed to the base part 101b. Alternatively, the connecting part 131b may be fixed to a columnar part 104b fixed to the base part 101b. Alternatively, the base part 101a, the columnar part 104a and the connecting part 131a may be a single structure. Also, the base part 101b, the columnar part 104b and the connecting part 131b may be a single structure.

[0067] Moreover, it is preferable that the columnar part 105 is fixed to either the connecting part 131a or the connecting part 131b. Alternatively, the columnar part 105 may be fixed to either the cutout region provided in the base part 101a constituting the cutout 106 or the cutout region provided in the base part 101b. With this configuration, the base parts 101a and 101b can rotate around the columnar part 105 as an axis as shown in Figs. 7A and 7B.

[0068] In the state of FIG. 7A, columnar part 105 is the rotation axis, and surface 111 of base part 101a and surface 112 of base part 101b are in contact with each other, so that rotation in the opposite direction can be suppressed.

[0069] 7C and 7D show a configuration in which the columnar parts 103a and 103b and the connecting parts 102a and 102b are added to the configuration shown in Fig. 6A and Fig. 6B, and the change in shape due to the operation of the columnar parts 103a and 103b and the connecting parts 102a and 102b are added to the configuration shown in Fig. 6A and Fig. 6B. By using this configuration, the reliability and strength of the operation of the angle adjustment device 100 can be improved.

[0070] Although the minimum configuration in which a pair of basic parts 101a and 101b are used has been described above, the total number of basic parts 101a and 101b may be 3 or more. Figures 8A and 8B show, as an example, a configuration in which the total number of basic parts 101a and 101b is 7. Figures 8A and 8B show only basic parts 101a and 101b.

[0071] In this embodiment, the expression "folding" is used for the operation for changing the state of Fig. 8A to the state of Fig. 8B, and the expression "unfolding" is used for the operation for changing the state of Fig. 8B to the state of Fig. 8A.

[0072] The relative angle between base parts 101a and 101b caused by bending can be changed by adjusting the inclination angles of faces 113 and 114 in base parts 101a and 101b. The smaller the inclination of face 113 relative to face 114, the smaller the angle becomes, and the greater the inclination of face 113 relative to face 114, the larger the angle becomes. In addition, by adjusting the number of base parts 101a and 101b, the maximum angle at which bending can be achieved by the entire angle adjustment device can be adjusted.

[0073] 8A and 8B, the base components 101a and 101b are arranged alternately, and therefore the notches 106 are provided in all spaces between the adjacent base components 101a and 101b.

[0074] 9A and 9B are diagrams showing a state in which connecting parts 131a and 131b are combined with the configurations of FIGS. 8A and 8B, with FIG. 9A showing the unfolded state and FIG. 9B showing the folded state.

[0075] Here, connecting parts 131a and 131b have a configuration different from that shown in Fig. 6B. As shown in Fig. 9C, connecting part 131a has opening 143a symmetrical to opening 142a with opening 141a at the center. Also, connecting part 131b has opening 143b symmetrical to opening 142b with opening 141b at the center.

[0076] 9A and 9B, a connecting part 131a is provided on base part 101a, and a connecting part 131b is provided on base part 101b. Furthermore, openings 142a and 142b overlap, and a columnar part 105 is inserted into both of them. Furthermore, openings 143a and 143b overlap, and a columnar part 105 is inserted into both of them.

[0077] 10A and 10B are diagrams showing a state in which connecting parts 102a, 102b are combined with the configurations of FIGS. 9A and 9B, with FIG. 10A showing the unfolded state and FIG. 10B showing the folded state.

[0078] 10A and 10B, base parts 101a and base parts 101b are arranged alternately, and therefore, connecting parts 102a and 102b are provided between all adjacent base parts 101a and base parts 101b.

[0079] This configuration allows the device to be folded in a number of different ways and to maintain these shapes, making it suitable for use as a hinge for the support device described below.

[0080] <Support> Fig. 11A is a perspective view illustrating a support tool 200 equipped with an angle adjustment device 100 according to one embodiment of the present invention. The support tool 200 has two angle adjustment devices 100 (angle adjustment devices 100a and 100b), flat plate portions 161 and 162, and a bending portion 165. Fig. 11A corresponds to the state in which the support tool 200 is unfolded.

[0081] The bending portion 165 has a plurality of pillars 166, and one of the ends in the longitudinal direction of the pillars 166 is connected to the base part 101a or the base part 101b of the angle adjustment device 100a. The other end of the pillars 166 in the longitudinal direction is connected to the base part 101a or the base part 101b of the angle adjustment device 100b. Such a combination of the bending portion 165 and the angle adjustment device 100 can be called a hinge. The flat plate part 161 is connected to one end of the hinge, and the flat plate part 162 is connected to the other end of the hinge.

[0082] Fig. 11B is a perspective view showing a cross section at the position of line segment A1-A2 shown in Fig. 11A. The cross section perpendicular to the long axis of the columnar body 166 is trapezoidal or approximately trapezoidal, and as shown in Fig. 11C, the columnar body 166 has a side surface 167a (a surface including one leg of the trapezoid), a side surface 167b (a surface including the other leg of the trapezoid), a side surface 167c (a surface including the lower base of the trapezoid), and a side surface 167d (a surface including the upper base of the trapezoid). The bent portion 165 has a plurality of columnar bodies 166, and in two adjacent columnar bodies 166, the side surface 167a of one columnar body 166 and the side surface 167b of the other columnar body 166 are adjacent to each other.

[0083] The pillars 166 are connected such that their side surfaces 167c (surfaces including the lower base of the trapezoid) are continuous to form a substantial surface. The side surface 167c of the pillar 166 at one end of the hinge is connected to be continuous with the first surface of the flat plate portion 161. The side surface 167c of the pillar 166 at the other end of the hinge is connected to be continuous with the first surface of the flat plate portion 162. The shape of the side surface 167d (surfaces including the upper base of the trapezoid) of each pillar 166 is arbitrary as long as it does not interfere with the other pillars 166 and the flat plate portions 161 and 162. Therefore, the cross section perpendicular to the long axis of the pillar 166 may be triangular or approximately triangular.

[0084] As described above, the flat plate portion 161, the bent portion 165 (bottom surfaces of the multiple columnar bodies 166), and the flat plate portion 162 are continuous planes, and the distance between any point A3 on the flat plate portion 162 and any point A4 on the flat plate portion 161 shown in FIG. 11B is constant regardless of the state of the bent portion 165. Therefore, when attaching a flexible part or the like to a support, it is preferable to attach it to the plane. In one embodiment of the support of the present invention, the shape can be maintained even in the unfolded state as shown in FIGS. 11A and 11B. It is more preferable that the plane is designed to be lower than the plane including the axes of the multiple columnar parts 105, and that the plane including the axes of the multiple columnar parts 105 is close to the neutral plane of the flexible part.

[0085] Fig. 12A is a diagram showing an example of a transitional state (intermediate state) when the support 200 is transformed from an unfolded state to a folded state, or vice versa. Fig. 12B is a perspective view showing a cross section taken along line segment B1-B2 shown in Fig. 12A.

[0086] 12A and 12B show a configuration in which two adjacent columns 166 have a region where side surface 167a of one column 166 faces side surface 167b of the other column 166, and a region in which side surface 167a of one column 166 does not face side surface 167b of the other column 166, in two other adjacent columns 166. A support according to one embodiment of the present invention is capable of retaining its shape even in a transitional state as shown in FIGS. 12A and 12B.

[0087] Fig. 13A is a diagram showing a state in which the support 200 is folded. Fig. 13B is a perspective view showing a cross section taken along line C1-C2 shown in Fig. 13A.

[0088] 13A and 13B show a configuration in which side surface 167a of one column faces side surface 167b of the other column in every pair of adjacent columns 166. A support according to one embodiment of the present invention can retain its shape even in a folded state as shown in FIGS. 13A and 13B.

[0089] <Display device> The support 200 can be used to support a flexible part. If a display panel is used as the flexible part, a flexible display device can be formed.

[0090] 14A and 14B are diagrams for explaining an example of a display device that can be folded in half. Note that the angle adjustment devices 100a and 100b of the support 200 are illustrated in a simplified manner. Fig. 14A shows the display device in an unfolded state, and Fig. 14B shows it in a folded state.

[0091] The display panel 170 is flexible, and may be, for example, an EL display device provided on a thin plate of resin or glass.

[0092] Display panel 170 can be provided along a continuous flat surface portion of flat plate portion 161, bent portion 165 (bottom surfaces of multiple pillars 166), and flat plate portion 162, as shown in Fig. 11A etc. Therefore, as shown in Fig. 14B, in the folded state, the display surface of the display panel forms a convex curved surface.

[0093] 14A and 14B show angle adjustment devices 100a, 100b, flat plate portion 161, flat plate portion 162, etc., but these may be stored in the housing of the display device.

[0094] 15A and 15B are diagrams for explaining an example of a display device that can be folded in three. Note that the angle adjustment devices 100a, 100b, 100c, and 100d of the support 200 are illustrated in a simplified manner. Fig. 15A shows the display device in an unfolded state, and Fig. 15B shows it in a folded state.

[0095] The tri-fold display device differs from the bi-fold display device in that the support is provided with angle adjustment devices 100c and 100d and a flat plate portion 163. The flat plate portion 163 is connected to the flat plate portion 162 via the angle adjustment devices 100c and 100d.

[0096] 15A and 15B show angle adjustment devices 100a, 100b, 100c, 100d, flat plate portion 161, flat plate portion 162, and flat plate portion 163, etc., but these may be stored in the housing of the display device.

[0097] 15B, a concave curved surface is formed on the display surface of the display panel from flat plate portion 162 to flat plate portion 163. Therefore, it is preferable that angle adjustment devices 100c and 100d have a different configuration from angle adjustment devices 100a and 100b.

[0098] For example, the angle adjustment devices 100c and 100d may have the configurations shown in Figures 16A to 16C. Note that the angle adjustment device shown in Figures 16A to 16C is configured by connecting the angle adjustment device 100c and the angle adjustment device 100d shown in Figures 15A and 15B, so only one of the reference symbols is shown.

[0099] The angle adjustment device 100c has a plurality of pillars 181 each having a rectangular or approximately rectangular cross section perpendicular to the long axis. The pillars 181 have a first side surface (a surface including one side of the approximately rectangle) and a second side surface (a surface including a side opposite to the one side of the approximately rectangle). The plurality of pillars 181 are configured such that the first side surface of one pillar 181 of two adjacent pillars is adjacent to the second side surface of the other pillar 181.

[0100] The respective pillars 181 are connected so that their third side faces (faces including a side substantially perpendicular to one side) are continuous to form a surface. The third side face of the pillar 181 at one end of the angle adjustment device 100c is connected so as to be continuous with the first face of the flat plate portion 162. The third side face of the pillar 181 at the other end of the angle adjustment device 100c is connected so as to be continuous with the first face of the flat plate portion 163. The shape of the fourth side face (face facing the third side face) of each pillar 181 may be any shape as long as it does not interfere with other pillars and the housing.

[0101] 16A, two adjacent columns 181 can be bent by deforming the first side surface of one column 181 and the second side surface of the other column 181 in a direction away from each other. At this time, the third side surfaces of the multiple columns 181 are connected at a certain angle, forming a region whose cross section is generally arc-shaped as a whole. Therefore, the flexible display panel can form a concave curved surface in the portion that overlaps with this region.

[0102] 16A, when a deformation operation (unfolding operation) is performed from the state shown in Fig. 16A, in two adjacent columns 181, the first side surface of one column 181 and the second side surface of the other column 181 move in a direction approaching each other, and the radius of curvature of the approximately circular arc changes to become larger, as shown in Fig. 16B. At this time, the radius of curvature of the curved portion of the display panel also changes to become larger.

[0103] When the deformation operation is further performed from the state shown in Fig. 16B, the first surface of flat plate portion 162, the third side surface of each columnar body 181, and the first surface of flat plate portion 163 are connected so as to be flat, as shown in Fig. 16C. At this time, the curved surface portion of the display panel also becomes flat, and the display panel is in a flat, unfolded state as a whole. If the deformation operation is performed in the reverse order to the above, the display panel can be folded.

[0104] Since the cross section of the columnar body 181 is rectangular, when two adjacent columnar bodies 181 are unfolded flat, the first side surface of one columnar body 181 comes into contact with the second side surface of the other columnar body 181. Therefore, the angle adjustment device 100c does not cause the display panel to bend in the reverse direction, and a mechanism for suppressing reverse bending may not be necessary. A spacer may be provided to maintain a gap between the housings when the display panel is bent.

[0105] 17A to 17C are diagrams illustrating other examples of angle adjustment devices 100c and 100d. Note that, although the angle adjustment device 100d will be described below, the angle adjustment device 100c has a similar configuration.

[0106] Angle adjustment device 100d has gears 186a and 186b. Gear 186a is fixed to flat plate portion 162. Gear 186b is fixed to flat plate portion 163. The central axis of gear 186a preferably overlaps with the first surface of flat plate portion 162. In addition, the central axis of gear 186b preferably overlaps with the first surface of flat plate portion 163.

[0107] 17A, assume that gears 186a and 186b are engaged at a specific position when in a folded state. At this time, the central axis of gear 186a is on the first surface of flat plate portion 162, and the central axis of gear 186b is on the first surface of flat plate portion 161, so that a gap is generated between flat plate portion 162 and flat plate portion 163 (between the opposing display surfaces of the display panel). Therefore, the flexible display panel can form a concave curved surface with a radius of curvature that is approximately 1 / 2 of the gap.

[0108] When a transformation operation (unfolding operation) is performed from the state of Fig. 17A, the flat plate portion 162 and the flat plate portion 163 are synchronized in response to the meshing of the gears 186a and 186b, and move so as to open with the angle adjustment device 100d as a fulcrum (see Fig. 17B). At this time, the display panel also changes so that the radius of curvature of the curved surface portion increases.

[0109] When the deformation operation is further performed from the state shown in Fig. 17B, the first surface of flat plate portion 162 and the first surface of flat plate portion 163 are connected so as to become flat, as shown in Fig. 17C. At this time, the curved surface portion of the display panel also becomes flat, and the display panel is in a flat, unfolded state as a whole. If the deformation operation is performed in the reverse order to the above, the display panel can be folded.

[0110] A mechanism for maintaining the meshing of the gears 186a and 186b may be provided. When unfolded flat, the side of the flat plate portion 162 and the side of the flat plate portion 163 come into contact with each other. Therefore, the angle adjustment device 100d does not cause the display panel to bend in the reverse direction, so a mechanism for suppressing reverse bending may not be necessary. A spacer may be provided to maintain the gap between the flat plate portion 162 and the flat plate portion 163 when folded. Alternatively, a mechanism for maintaining the gap may be provided to the gears 186a and 186b.

[0111] <Application Examples> 18A is a diagram showing an example of application of the flexible display device shown in the present embodiment as an information terminal such as a smartphone. Elements common to the display device described above are given the same reference numerals. Display device 250 shown in FIG. 18A has display panel 170, audio input / output units 235a and 235b, cameras 236a and 236b, sensor 237, and sensor 220.

[0112] When one of the voice input / output units 235a, 235b functions as a microphone, the other can function as a speaker. Therefore, when using the telephone function, conversation can be carried out without inconvenience no matter which way the device is held. The microphone function and the speaker function can be switched by the sensor 220 that detects the tilt. Similarly, the cameras 236a, 236b can be prioritized by the sensor 220.

[0113] The input / output units 235a and 235b may have both a device that functions as a microphone and a device that functions as a speaker, or may have one device that has both functions.

[0114] In addition, both the input / output units 235a and 235b can function as microphones to record stereo sound, and both the input / output units 235a and 235b can function as speakers to play stereo sound.

[0115] In addition, it is also possible to capture a 3D image by operating both the cameras 236a and 236b. The sensor 237 is an optical sensor, and can adjust the brightness of the display to make it easier to see according to the illuminance of the surroundings.

[0116] 18B, a display panel 171 may be provided on the rear surface of the display device 250, opposite to the front surface on which the display panel 170 is provided. The display panel 171 can display the same image as the display panel 170, and can also be used as a sub-display that displays simple information, pictures, patterns, photographs, etc., or as lighting. A display panel using a light-emitting device or a liquid crystal device can be used for the display panel 171, and low-power electronic paper can also be used. A display panel using a hard substrate as a support can also be used for the display panel 171.

[0117] 19A, a display panel 171 may be provided on the flat plate portion 161, a display panel 172 may be provided on the flat plate portion 162, and a display panel 173 may be provided on the flat plate portion 163. The display panels 172 and 173 may be the same as the display panel 171.

[0118] 19B, a flexible display panel 175 may be provided on the rear surface of the display device 250. In this case, since the display panel 175 can be bent, it can be provided across the flat plate portions 161 to 163 in the same manner as the display panel 170 provided on the front surface.

[0119] 19C, a solar cell 240 may be provided on the rear surface of the display device 250. The power generated by the solar cell 240 can be used to charge the battery in the display device 250, and can also be supplied to the outside via an external interface 245.

[0120] 19C shows an example of a solar cell having a hard support. As the solar cell, for example, a silicon solar cell with a crystalline silicon photoelectric conversion layer, or a solar cell with a tandem structure of a silicon solar cell and a perovskite solar cell can be used.

[0121] Alternatively, as shown in Fig. 19D, it may be a solar cell having a flexible substrate as a support. As the solar cell, for example, a thin-film solar cell 141 such as an amorphous silicon solar cell, a CIGS (Cu-In-Ga-Se) type solar cell, an organic solar cell, or a perovskite type solar cell can be used. The solar cell having a flexible substrate as a support can be provided across the flat plate portions 161 to 163, similar to the display panel 171.

[0122] (Embodiment 2) In this embodiment, a structure example of a display panel that can be used for a display device of one embodiment of the present invention will be described.

[0123] <Configuration example> 20 shows a top view of a display panel 700. A flexible supporting substrate 745 is applied to the display panel 700, and the display panel 700 can be used as a flexible display. The display panel 700 has a pixel portion 702 provided over the flexible supporting substrate 745. A source driver circuit portion 704, a pair of gate driver circuit portions 706, wirings 710, and the like are provided over the supporting substrate 745. The pixel portion 702 is provided with a plurality of display devices.

[0124] Further, an FPC terminal portion 708 to which an FPC 716 (Flexible printed circuit) is connected is provided on a part of the support substrate 745. Various signals and the like are supplied to each of the pixel portion 702, the source driver circuit portion 704, and the gate driver circuit portion 706 by the FPC 716 via the FPC terminal portion 708 and wiring 710.

[0125] A pair of gate driver circuit units 706 are provided on both sides of the pixel unit 702. The gate driver circuit unit 706 and the source driver circuit unit 704 may each be formed separately on a semiconductor substrate or the like and be in the form of a packaged IC chip. The IC chip can be mounted on a support substrate 745 by COF (Chip On Film) technology or the like.

[0126] It is preferable that OS transistors be used as transistors in the pixel portion 702, the source driver circuit portion 704, and the gate driver circuit portion 706.

[0127] A light-emitting device or the like can be used as the display device provided in the pixel unit 702. Examples of the light-emitting device include self-luminous light-emitting devices such as LEDs (Light Emitting Diodes), OLEDs (Organic LEDs), QLEDs (Quantum-dot LEDs), and semiconductor lasers. In addition, liquid crystal devices such as transmissive liquid crystal devices, reflective liquid crystal devices, and semi-transmissive liquid crystal devices can also be used as the display device. In addition, display devices using shutter-type or optical interference-type MEMS (Micro Electro Mechanical Systems) devices, microcapsule types, electrophoretic types, electrowetting types, or electronic liquid powder (registered trademark) types can also be used.

[0128] 20 shows an example in which a portion of the support substrate 745 on which the FPC terminal portion 708 is provided has a protruding shape. A part of the support substrate 745 including the FPC terminal portion 708 can be folded back to the back side in an area P1 in FIG. 20. By folding back a part of the support substrate 745, the display panel 700 can be mounted on an electronic device or the like in a state in which the FPC 716 is disposed so as to overlap the back side of the pixel portion 702, thereby enabling space saving and miniaturization of the electronic device or the like.

[0129] An IC 717 is mounted on an FPC 716 connected to the display panel 700. The IC 717 has a function as, for example, a source driver circuit. In this case, the source driver circuit unit 704 in the display panel 700 can be configured to include at least one of a protection circuit, a buffer circuit, a demultiplexer circuit, and the like.

[0130] <Cross-section example> A configuration using an organic EL display device will be described below with reference to Figures 21 and 22. Figures 21 and 22 are schematic cross-sectional views of the display panel 700 shown in Figure 20 taken along dashed line ST.

[0131] First, common parts of the display panels shown in FIG. 21 and FIG. 22 will be described.

[0132] 21 and 22 show cross sections including a pixel portion 702, a gate driver circuit portion 706, and an FPC terminal portion 708. The pixel portion 702 includes a transistor 750 and a capacitor 790. The gate driver circuit portion 706 includes a transistor 752.

[0133] The transistor 750 and the transistor 752 are transistors in which an oxide semiconductor is used for a semiconductor layer in which a channel is formed. Note that the present invention is not limited to this, and a transistor in which silicon (amorphous silicon, polycrystalline silicon, or single crystal silicon) or an organic semiconductor is used for the semiconductor layer can also be used.

[0134] The transistor used in this embodiment has an oxide semiconductor film that is highly purified and in which formation of oxygen vacancies is suppressed. The off-state current of the transistor can be significantly reduced. Therefore, a pixel including such a transistor can hold an electric signal such as an image signal for a long time and can set a long interval for writing an image signal or the like. Thus, the frequency of a refresh operation can be reduced, leading to reduced power consumption.

[0135] In addition, the transistor used in this embodiment can achieve a relatively high field-effect mobility and thus can be driven at high speed. For example, by using such a transistor capable of high speed driving in a display panel, a switching transistor in a pixel portion and a driver transistor used in a driver circuit portion can be formed over the same substrate. That is, a configuration without using a driver circuit formed using a silicon wafer or the like is possible, and the number of components in a display device can be reduced. In addition, by using a transistor capable of high speed driving in the pixel portion, a high-quality image can be provided.

[0136] The capacitor 790 has a lower electrode formed by processing the same film as the first gate electrode of the transistor 750, and an upper electrode formed by processing the same metal oxide film as the semiconductor layer. The upper electrode has a low resistance like the source region and drain region of the transistor 750. In addition, a part of an insulating film functioning as the first gate insulating layer of the transistor 750 is provided between the lower electrode and the upper electrode. That is, the capacitor 790 has a stacked structure in which an insulating film functioning as a dielectric film is sandwiched between a pair of electrodes. In addition, a wiring obtained by processing the same film as the source electrode and drain electrode of the transistor 750 is connected to the upper electrode.

[0137] In addition, an insulating layer 770 functioning as a planarization film is provided over the transistor 750, the transistor 752, and the capacitor 790.

[0138] The transistor 750 in the pixel portion 702 and the transistor 752 in the gate driver circuit portion 706 may have different structures. For example, a top-gate transistor may be used for one of them, and a bottom-gate transistor may be used for the other. Note that the source driver circuit portion 704 is similar to the gate driver circuit portion 706.

[0139] The FPC terminal portion 708 has a wiring 760, a part of which functions as a connection electrode, an anisotropic conductive film 780, and an FPC 716. The wiring 760 is electrically connected to a terminal of the FPC 716 via the anisotropic conductive film 780. Here, the wiring 760 is formed of the same conductive film as the source and drain electrodes of the transistor 750 and the like.

[0140] Next, a display panel 700 shown in FIG. 21 will be described.

[0141] 21 includes a supporting substrate 745 and a supporting substrate 740. As the supporting substrate 745 and the supporting substrate 740, for example, a flexible substrate such as a glass substrate or a plastic substrate can be used.

[0142] A transistor 750, a transistor 752, a capacitor 790, and the like are provided over an insulating layer 744. A support substrate 745 and the insulating layer 744 are attached to each other by an adhesive layer 742.

[0143] The display panel 700 also includes a light emitting device 782, a colored layer 736, a light blocking layer 738, and the like.

[0144] The light-emitting device 782 includes a conductive layer 772, an EL layer 786, and a conductive layer 788. The conductive layer 772 is electrically connected to a source electrode or a drain electrode of the transistor 750. The conductive layer 772 is provided over an insulating layer 770 and functions as a pixel electrode. An insulating layer 730 is provided to cover an end portion of the conductive layer 772, and an EL layer 786 and a conductive layer 788 are stacked over the insulating layer 730 and the conductive layer 772.

[0145] The conductive layer 772 can be formed using a material that is reflective to visible light. For example, a material containing aluminum, silver, or the like can be used. The conductive layer 788 can be formed using a material that transmits visible light. For example, an oxide material containing indium, zinc, tin, or the like can be used. Therefore, the light-emitting device 782 is a top-emission light-emitting device that emits light to the side opposite to the formation surface (the supporting substrate 740 side).

[0146] The EL layer 786 includes an organic compound or an inorganic compound such as quantum dots, etc. The EL layer 786 includes a light-emitting material that emits blue light when a current flows through it.

[0147] Examples of luminescent materials include fluorescent materials, phosphorescent materials, thermally activated delayed fluorescence (TADF) materials, inorganic compounds (quantum dot materials, etc.), etc. Examples of materials that can be used for quantum dots include colloidal quantum dot materials, alloy-type quantum dot materials, core-shell type quantum dot materials, core-type quantum dot materials, etc.

[0148] The light-shielding layer 738 and the colored layer 736 are provided on one surface of the insulating layer 746. The colored layer 736 is provided at a position overlapping with the light-emitting device 782. The light-shielding layer 738 is provided in a region of the pixel portion 702 that does not overlap with the light-emitting device 782. The light-shielding layer 738 may also be provided overlapping with the gate driver circuit portion 706, etc.

[0149] The supporting substrate 740 is bonded to the other surface of the insulating layer 746 by an adhesive layer 747. The supporting substrate 740 and the supporting substrate 745 are bonded to each other by a sealing layer 732.

[0150] Here, a light-emitting material that emits white light is applied as the EL layer 786 of the light-emitting device 782. The white light emitted by the light-emitting device 782 is colored by the coloring layer 736 and emitted to the outside. The EL layer 786 is provided across pixels that exhibit different colors. In the pixel portion 702, pixels provided with the coloring layer 736 that transmits any of red (R), green (G), and blue (B) are arranged in a matrix form, so that the display panel 700 can display full colors.

[0151] A conductive film having transparency and reflectivity may be used as the conductive layer 788. In this case, a microresonator (microcavity) structure may be realized between the conductive layer 772 and the conductive layer 788, and a configuration may be adopted in which light of a specific wavelength is intensified and emitted. In this case, an optical adjustment layer for adjusting the optical distance may be disposed between the conductive layer 772 and the conductive layer 788, and the thickness of the optical adjustment layer may be made different between pixels of different colors, thereby increasing the color purity of the light emitted from each pixel.

[0152] When the EL layer 786 is formed in an island shape for each pixel or in a striped shape for each pixel row, that is, when the EL layer 786 is formed by coloring, the colored layer 736 or the optical adjustment layer described above may not be provided.

[0153] Here, it is preferable to use an inorganic insulating film functioning as a barrier film with low moisture permeability for each of the insulating layers 744 and 746. By sandwiching the light-emitting device 782, the transistor 750, and the like between the insulating layers 744 and 746, deterioration of these elements is suppressed, and a highly reliable display panel can be realized.

[0154] A display panel 700A shown in Fig. 22 includes a resin layer 743 between the adhesive layer 742 and the insulating layer 744 shown in Fig. 21. Also, a protective layer 749 is provided instead of the support substrate 740.

[0155] The resin layer 743 is a layer containing an organic resin such as polyimide or acrylic. The insulating layer 744 contains an inorganic insulating film such as silicon oxide, silicon oxynitride, or silicon nitride. The resin layer 743 and the support substrate 745 are attached to each other by an adhesive layer 742. The resin layer 743 is preferably thinner than the support substrate 745.

[0156] The protective layer 749 is attached to the sealing layer 732. A glass substrate or a resin film can be used as the protective layer 749. In addition, as the protective layer 749, an optical member such as a polarizing plate (including a circular polarizing plate) or a scattering plate, an input device such as a touch sensor panel, or a configuration in which two or more of these are laminated may be used.

[0157] In addition, the EL layer 786 of the light-emitting device 782 is provided in an island shape on the insulating layer 730 and the conductive layer 772. By creating the EL layer 786 so that each subpixel has a different light emission color, a color display can be realized without using the colored layer 736.

[0158] A protective layer 741 is provided to cover the light-emitting device 782. The protective layer 741 has a function of preventing impurities such as water from diffusing into the light-emitting device 782. The protective layer 741 has a laminated structure in which an insulating layer 741a, an insulating layer 741b, and an insulating layer 741c are laminated in this order from the conductive layer 788 side. In this case, it is preferable to use an inorganic insulating film having a high barrier property against impurities such as water for the insulating layer 741a and the insulating layer 741c, and an organic insulating film functioning as a planarizing film for the insulating layer 741b. It is also preferable that the protective layer 741 is provided so as to extend to the gate driver circuit section 706.

[0159] In addition, it is preferable that the organic insulating film covering the transistor 750, the transistor 752, and the like is formed in an island shape inside the sealing layer 732. In other words, it is preferable that the end of the organic insulating film is located inside the sealing layer 732 or in a region overlapping with the end of the sealing layer 732. FIG. 22 shows an example in which the insulating layer 770, the insulating layer 730, and the insulating layer 741b are processed into an island shape. For example, in the portion overlapping with the sealing layer 732, the insulating layer 741c and the insulating layer 741a are provided in contact with each other. In this way, by configuring the surface of the organic insulating film covering the transistor 750 and the transistor 752 not to be exposed outside the sealing layer 732, it is possible to suitably prevent water or hydrogen from diffusing from the outside to the transistor 750 and the transistor 752 through the organic insulating film. This suppresses fluctuations in the electrical characteristics of the transistors, and realizes a display device with extremely high reliability.

[0160] 22, the bendable region P1 has a portion where inorganic insulating films such as the insulating layer 744 are not provided, in addition to the support substrate 745 and the adhesive layer 742. In the region P1, the insulating layer 770 containing an organic material covers the wiring 760 to prevent the wiring 760 from being exposed. By providing as little inorganic insulating film as possible in the bendable region P1 and by using a configuration in which only a conductive layer containing a metal or alloy and a layer containing an organic material are laminated, it is possible to prevent cracks from occurring when the panel is bent. By not providing the support substrate 745 in the region P1, a portion of the display panel 700A can be bent with an extremely small radius of curvature.

[0161] 22, a conductive layer 761 is provided over the protective layer 741. The conductive layer 761 can be used as a wiring or an electrode.

[0162] In addition, when a touch sensor is provided over the display panel 700A, the conductive layer 761 can function as an electrostatic shielding film for preventing electrical noise generated when a pixel is driven from being transmitted to the touch sensor. In this case, a predetermined constant potential may be applied to the conductive layer 761.

[0163] Alternatively, the conductive layer 761 can be used as, for example, an electrode of a touch sensor. This allows the display panel 700A to function as a touch panel. For example, the conductive layer 761 can be used as an electrode or wiring of a capacitive touch sensor. In this case, the conductive layer 761 can be used as a wiring or electrode to which a detection circuit is connected, or a wiring or electrode to which a sensor signal is input. In this way, by fabricating a touch sensor on the light-emitting device 782, the number of components can be reduced, and the manufacturing costs of electronic devices and the like can be reduced.

[0164] The conductive layer 761 is preferably provided in a portion that does not overlap with the light-emitting device 782. For example, the conductive layer 761 can be provided in a portion that overlaps with the insulating layer 730. This eliminates the need to use a transparent conductive film with relatively low conductivity as the conductive layer 761, and allows the use of a metal or alloy with high conductivity, thereby improving the sensitivity of the sensor.

[0165] Note that the type of the touch sensor that can be configured using the conductive layer 761 is not limited to the capacitance type, and various types such as a resistive film type, a surface acoustic wave type, an infrared type, an optical type, and a pressure sensitive type can be used. Alternatively, two or more of these types may be used in combination.

[0166] <Components> Components such as transistors that can be applied to a display device will be described below.

[0167] [Transistor] The transistor includes a conductive layer functioning as a gate electrode, a semiconductor layer, a conductive layer functioning as a source electrode, a conductive layer functioning as a drain electrode, and an insulating layer functioning as a gate insulating layer.

[0168] Note that the structure of a transistor included in a display device of one embodiment of the present invention is not particularly limited. For example, a planar transistor, a staggered transistor, or an inverted staggered transistor may be used. In addition, the transistor may have either a top-gate type or a bottom-gate type structure. Alternatively, gate electrodes may be provided above and below a channel.

[0169] The crystallinity of a semiconductor material used in a transistor is not particularly limited, and any of an amorphous semiconductor, a single crystal semiconductor, and a semiconductor having crystallinity other than a single crystal (a microcrystalline semiconductor, a polycrystalline semiconductor, or a semiconductor having a crystalline region in part) may be used. The use of a single crystal semiconductor or a semiconductor having crystallinity is preferable because it can suppress deterioration of transistor characteristics.

[0170] In particular, a transistor using a metal oxide film for a semiconductor layer in which a channel is formed will be described below.

[0171] As a semiconductor material used for a transistor, a metal oxide having an energy gap of 2 eV or more, preferably 2.5 eV or more, more preferably 3 eV or more can be used. A representative example is an oxide semiconductor containing indium, for example, CAAC-OS or CAC-OS described later can be used. CAAC-OS has stable atoms constituting the crystal, and is suitable for transistors that emphasize reliability. In addition, CAC-OS has high mobility characteristics, and is suitable for transistors that operate at high speed.

[0172] Because the energy gap of the semiconductor layer is large, OS transistors can exhibit extremely low off-current characteristics of several yA / μm (current value per 1 μm of channel width). OS transistors also have characteristics different from Si transistors, such as the absence of impact ionization, avalanche breakdown, and short channel effects, making it possible to form highly reliable circuits. Furthermore, OS transistors are less susceptible to variations in electrical characteristics caused by non-uniformity in crystallinity, which is a problem with Si transistors.

[0173] The semiconductor layer can be a film represented by In-M-Zn oxide containing, for example, indium, zinc, and M (M is one or more selected from metals such as aluminum, titanium, gallium, germanium, yttrium, zirconium, lanthanum, cerium, tin, neodymium, and hafnium). The In-M-Zn oxide can be formed by, for example, sputtering, ALD (Atomic layer deposition), or MOCVD (Metal organic chemical vapor deposition).

[0174] When forming a film of an In-M-Zn oxide by a sputtering method, it is preferable that the atomic ratio of the metal elements of the sputtering target satisfies In≧M and Zn≧M. As the atomic ratio of the metal elements of such a sputtering target, In:M:Zn=1:1:1, In:M:Zn=1:1:1.2, In:M:Zn=3:1:2, In:M:Zn=4:2:3, In:M:Zn=4:2:4.1, In:M:Zn=5:1:6, In:M:Zn=5:1:7, In:M:Zn=5:1:8, etc. are preferable. Note that the atomic ratio of the semiconductor layer to be formed includes a variation of ±40% of the atomic ratio of the metal elements contained in the above sputtering target.

[0175] The semiconductor layer is a metal oxide film with a low carrier density. For example, the semiconductor layer is a metal oxide film with a carrier density of 1×10 17 / cm 3 Less than or equal to 1×10 15 / cm 3 Less than 1×10, more preferably 13 / cm 3 Less than or equal to 1×10 11 / cm 3 Less than 1×10, more preferably 10 / cm 3 Less than 1 x 10 -9 / cm 3The above metal oxides can be used. Such metal oxides are called high-purity intrinsic or substantially high-purity intrinsic metal oxides. The oxide semiconductor has a low density of defect states and is therefore a metal oxide having stable characteristics.

[0176] Note that the present invention is not limited to these, and an oxide semiconductor having an appropriate composition may be used depending on the semiconductor characteristics and electrical characteristics (field-effect mobility, threshold voltage, etc.) of a transistor that is required. In order to obtain the semiconductor characteristics of a transistor that is required, it is preferable to set the carrier density, impurity concentration, defect density, atomic ratio of a metal element to oxygen, interatomic distance, density, and the like of the semiconductor layer to be appropriate.

[0177] When silicon or carbon, which is one of the group 14 elements, is contained in the metal oxide constituting the semiconductor layer, oxygen vacancies increase in the semiconductor layer, causing it to become n-type. For this reason, the concentration of silicon or carbon in the semiconductor layer (concentration obtained by secondary ion mass spectrometry) is set to 2×10 18 atoms / cm 3 Less than or equal to 2 x 10 17 atoms / cm 3 The following applies.

[0178] In addition, when an alkali metal or an alkaline earth metal is bonded to a metal oxide, carriers may be generated, which may increase the off-state current of a transistor. For this reason, the concentration of an alkali metal or an alkaline earth metal in a semiconductor layer obtained by secondary ion mass spectrometry is set to 1×10 18 atoms / cm 3 Less than or equal to 2 x 10 16 atoms / cm 3 To the following:

[0179] In addition, when nitrogen is contained in the metal oxide that constitutes the semiconductor layer, electrons that act as carriers are generated, the carrier density increases, and the transistor tends to become n-type. As a result, transistors that use metal oxides that contain nitrogen tend to have normally-on characteristics. For this reason, the nitrogen concentration in the semiconductor layer obtained by secondary ion mass spectrometry is 5×1018 atoms / cm 3 It is preferable to do the following:

[0180] Furthermore, when hydrogen is contained in an oxide semiconductor constituting a semiconductor layer, it reacts with oxygen bonded to a metal atom to form water, which may form oxygen vacancies in the oxide semiconductor. When oxygen vacancies are present in a channel formation region in an oxide semiconductor, the transistor may have normally-on characteristics. Furthermore, defects in which hydrogen has entered the oxygen vacancies may function as donors and generate electrons that serve as carriers. In addition, some of the hydrogen may bond with oxygen that is bonded to a metal atom to generate electrons that serve as carriers. Therefore, a transistor using an oxide semiconductor that contains a large amount of hydrogen is likely to have normally-on characteristics.

[0181] A defect in which hydrogen has entered an oxygen vacancy can function as a donor for an oxide semiconductor. However, it is difficult to quantitatively evaluate the defect. Thus, an oxide semiconductor may be evaluated by its carrier concentration instead of its donor concentration. Thus, in this specification and the like, a carrier concentration assuming a state in which no electric field is applied may be used as a parameter of an oxide semiconductor instead of the donor concentration. In other words, the "carrier concentration" described in this specification and the like may be rephrased as the "donor concentration".

[0182] Therefore, it is preferable that hydrogen in the oxide semiconductor be reduced as much as possible. Specifically, the hydrogen concentration in the oxide semiconductor measured by secondary ion mass spectrometry (SIMS) is 1×10 20 atoms / cm 3 Less than 1 x 10 19 atoms / cm 3 less than 5×10 18 atoms / cm 3 less than 1×10 18 atoms / cm 3When an oxide semiconductor in which impurities such as hydrogen are sufficiently reduced is used for a channel formation region of a transistor, stable electrical characteristics can be obtained.

[0183] Oxide semiconductors (metal oxides) are classified into single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors. Examples of non-single-crystal oxide semiconductors include C-Axis Aligned Crystalline Oxide Semiconductor (CAAC-OS), polycrystalline oxide semiconductors, nanocrystalline oxide semiconductors (nc-OS), amorphous-like oxide semiconductors (a-like OS), and amorphous oxide semiconductors. Among non-single-crystal structures, the amorphous structure has the highest density of defect states, and the CAAC-OS has the lowest density of defect states.

[0184] An oxide semiconductor film having an amorphous structure has, for example, a disordered atomic arrangement and does not include a crystalline component, or an oxide film having an amorphous structure has, for example, a completely amorphous structure and does not include a crystalline portion.

[0185] The semiconductor layer may be a mixed film having two or more of an amorphous structure region, a microcrystalline structure region, a polycrystalline structure region, a CAAC-OS region, and a single crystal structure region. The mixed film may have a single layer structure or a multilayer structure including two or more of the above-mentioned regions.

[0186] Further, a semiconductor layer of the transistor disclosed in one embodiment of the present invention may be formed using a cloud-aligned composite oxide semiconductor (CAC-OS).

[0187] Note that the semiconductor layer of the transistor disclosed in one embodiment of the present invention can preferably be formed using the above-described non-single-crystal oxide semiconductor or a CAC-OS. As the non-single-crystal oxide semiconductor, an nc-OS or a CAAC-OS can preferably be used.

[0188] In one aspect of the present invention, it is preferable to use CAC-OS as the semiconductor layer of the transistor. By using CAC-OS, high electrical characteristics or high reliability can be imparted to the transistor.

[0189] Note that the semiconductor layer may be a mixed film having two or more of the regions of CAAC-OS, polycrystalline oxide semiconductor, nc-OS, pseudo-amorphous oxide semiconductor, and amorphous oxide semiconductor. The mixed film may have, for example, a single-layer structure or a laminated structure including any two or more of the above-described regions.

[0190] <Configuration of CAC-OS> Hereinafter, the configuration of CAC (Cloud-Aligned Composite)-OS that can be used for the transistor disclosed in one aspect of the present invention will be described.

[0191] CAC-OS is, for example, a configuration of a material in which elements constituting a metal oxide are unevenly distributed in a size of 0.5 nm or more and 10 nm or less, preferably 1 nm or more and 2 nm or less, or in the vicinity thereof. Hereinafter, in the metal oxide, one or more metal elements are unevenly distributed, and a region having the metal element is in a state of being mixed in a size of 0.5 nm or more and 10 nm or less, preferably 1 nm or more and 2 nm or less, or in the vicinity thereof, which is also referred to as a mosaic state or a patch state.

[0192] Note that the metal oxide preferably contains at least indium. Particularly preferably, it contains indium and zinc. In addition to these, one or more selected from aluminum, gallium, yttrium, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium may be included.

[0193] For example, the CAC-OS in In-Ga-Zn oxide (In-Ga-Zn oxide among CAC-OS may be specifically referred to as CAC-IGZO) is an indium oxide (hereinafter, InO X1 (X1 is a real number greater than 0).) or indium zinc oxide (hereinafter, In X2 Zinc Y2 O Z2 (X2, Y2, and Z2 are real numbers greater than 0.) and gallium oxide (GaO X3 (X3 is a real number greater than 0). ) or gallium zinc oxide (Ga X4 Zinc Y4 O Z4 (X4, Y4, and Z4 are real numbers greater than 0).) The material is separated into a mosaic shape, and the mosaic shape of InO X1 , or In X2 Zinc Y2 O Z2 However, the structure is such that the particles are uniformly distributed in the film (hereinafter, also referred to as a cloud-like structure).

[0194] In other words, CAC-OS is X3 The region where In is the main component and X2 Zinc Y2 O Z2 , or InO X1 In the present specification, for example, when the atomic ratio of In to element M in the first region is greater than the atomic ratio of In to element M in the second region, the first region is said to have a higher In concentration than the second region.

[0195] IGZO is a common name and may refer to a compound made of In, Ga, Zn, and O. A typical example is InGaO3(ZnO). m1 (m1 is a natural number), or In (1+x0) Ga (1-x0) O3(ZnO) m0 (-1≦x0≦1, m0 is an arbitrary number).

[0196] The crystalline compound has a single crystal structure, a polycrystalline structure, or a CAAC structure, where multiple IGZO nanocrystals have a c-axis orientation and are connected without being oriented in the ab plane.

[0197] On the other hand, CAC-OS is a material composition of metal oxide. CAC-OS is a material composition containing In, Ga, Zn, and O, in which some regions observed as nanoparticles mainly composed of Ga and some regions observed as nanoparticles mainly composed of In are randomly distributed in a mosaic pattern. Therefore, in CAC-OS, the crystal structure is a secondary element.

[0198] Note that the CAC-OS does not include a laminated structure of two or more films with different compositions, such as a two-layer structure consisting of a film mainly containing In and a film mainly containing Ga.

[0199] In addition, GaO X3 The region where In is the main component and X2 Zinc Y2 O Z2 , or InO X1 In some cases, it may be difficult to observe a clear boundary between the region in which the main component is the

[0200] In addition, when one or more elements selected from aluminum, yttrium, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, etc. are contained instead of gallium, the CAC-OS has a configuration in which some regions observed to be in the form of nanoparticles mainly composed of the metal element and some regions observed to be in the form of nanoparticles mainly composed of In are randomly dispersed in a mosaic pattern.

[0201] CAC-OS can be formed, for example, by a sputtering method under conditions where the substrate is not intentionally heated. When CAC-OS is formed by a sputtering method, any one or more selected from an inert gas (typically argon), oxygen gas, and nitrogen gas may be used as a deposition gas. The lower the flow rate ratio of oxygen gas to the total flow rate of deposition gas during deposition, the more preferable it is, for example, 0% or more and less than 30%, preferably 0% or more and 10% or less.

[0202] CAC-OS has the characteristic that no clear peaks are observed when it is measured using the θ / 2θ scan by the out-of-plane method, which is one of the X-ray diffraction (XRD) measurement methods. In other words, the X-ray diffraction measurement shows that there is no orientation in the ab plane direction or the c axis direction in the measurement area.

[0203] In addition, in the electron beam diffraction pattern obtained by irradiating CAC-OS with an electron beam (also called nano-beam electron beam) with a probe diameter of 1 nm, a ring-shaped region with high brightness and multiple bright spots are observed within the ring-shaped region. Therefore, the electron beam diffraction pattern shows that the crystal structure of CAC-OS has an nc (nano-crystal) structure that does not have orientation in the planar direction and cross-sectional direction.

[0204] For example, in the case of CAC-OS of In-Ga-Zn oxide, EDX mapping obtained using EDX (Energy Dispersive X-ray spectroscopy) revealed that GaO X3 The region where In is the main component and X2 Zinc Y2 O Z2 , or InO X1 It can be seen that the region in which the main component is the crystalline silicon is unevenly distributed and mixed.

[0205] CAC-OS has a different structure from IGZO compounds in which metal elements are uniformly distributed, and has different properties from IGZO compounds. X3 The main components are In X2 Zinc Y2 O Z2 , or InO X1 The structure is such that the regions having each element as the main component are separated from each other in a mosaic pattern.

[0206] Here, In X2 Zinc Y2 O Z2 , or InO X1 The area where GaO is the main component X3 This region has a higher electrical conductivity than the region where In is the main component. X2 Zinc Y2 O Z2 , or InO X1 When carriers flow through the region where In is the main component, the conductivity of the metal oxide is expressed. X2 Zinc Y2 O Z2 , or InO X1 A high field-effect mobility (μ) can be achieved by distributing the regions in which the main component is a cloud-like structure in the metal oxide.

[0207] On the other hand, GaO X3 The region where the main components are In X2 Zinc Y2 O Z2 , or InO X1 This region has higher insulating properties than the region where GaO is the main component. X3 By distributing regions in which the main components are such as those mentioned above in the metal oxide, leakage current can be suppressed and good switching operation can be achieved.

[0208] Therefore, when CAC-OS is used in a semiconductor device, GaO X3 Insulation caused by X2 Zinc Y2 O Z2 , or InO X1The conductivity caused by the MOSFET and the MOSFET's resistance to the MOSFET's resistance work in a complementary manner, resulting in a high on-state current (I on ), and high field-effect mobility (μ).

[0209] In addition, semiconductor elements using CAC-OS have high reliability, making CAC-OS ideal for a variety of semiconductor devices including displays.

[0210] In addition, since a transistor having a CAC-OS semiconductor layer has high field-effect mobility and high driving capability, a display device with a narrow frame width (also called a narrow frame) can be provided by using the transistor in a driver circuit, typically a scan line driver circuit that generates a gate signal. In addition, a display device with a small number of wirings connected to the display device can be provided by using the transistor in a signal line driver circuit (particularly, a demultiplexer connected to an output terminal of a shift register in the signal line driver circuit).

[0211] Moreover, unlike transistors using low-temperature polysilicon, transistors having CAC-OS in the semiconductor layer do not require a laser crystallization process. This makes it possible to reduce manufacturing costs even for display devices using large-area substrates. Furthermore, in large-sized display devices with high resolution such as ultra-high vision ("4K resolution", "4K2K", "4K") and super-high vision ("8K resolution", "8K4K", "8K"), it is preferable to use transistors having CAC-OS in the semiconductor layer in the driving circuit and display section, since it is possible to write in a short time and reduce display defects.

[0212] Alternatively, silicon may be used for the semiconductor in which the channel of the transistor is formed. Although amorphous silicon may be used as the silicon, it is preferable to use silicon having crystallinity. For example, it is preferable to use microcrystalline silicon, polycrystalline silicon, single crystal silicon, or the like. In particular, polycrystalline silicon can be formed at a lower temperature than single crystal silicon, and has higher field effect mobility and higher reliability than amorphous silicon.

[0213] <Conductive layer> Materials that can be used for conductive layers such as the gate, source, and drain of a transistor, as well as various wirings and electrodes that constitute a display device include metals such as aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten, or alloys containing these as main components. Films containing these materials can be used as a single layer or a laminated structure. For example, there are a single layer structure of an aluminum film containing silicon, a two-layer structure in which an aluminum film is laminated on a titanium film, a two-layer structure in which an aluminum film is laminated on a tungsten film, a two-layer structure in which a copper film is laminated on a copper-magnesium-aluminum alloy film, a two-layer structure in which a copper film is laminated on a titanium film, a two-layer structure in which a copper film is laminated on a tungsten film, a three-layer structure in which a titanium film or titanium nitride film is laminated on the titanium film or titanium nitride film, and a three-layer structure in which an aluminum film or copper film is laminated on the titanium film or titanium nitride film, and a three-layer structure in which an aluminum film or copper film is laminated on the molybdenum film or molybdenum nitride film is laminated on the molybdenum film or molybdenum nitride film is laminated on the molybdenum film or molybdenum nitride film. Alternatively, oxides such as indium oxide, tin oxide, zinc oxide, etc. may be used. Furthermore, copper containing manganese is preferably used because it enhances the controllability of the shape by etching.

[0214] <Insulating layer> Examples of insulating materials that can be used for each insulating layer include resins such as acrylic and epoxy, resins having siloxane bonds, and inorganic insulating materials such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, and aluminum oxide.

[0215] Moreover, the light emitting device is preferably provided between a pair of insulating films with low water permeability, which can prevent impurities such as water from entering the light emitting device and suppress deterioration of the reliability of the device.

[0216] Examples of the insulating film having low water permeability include a film containing nitrogen and silicon, such as a silicon nitride film or a silicon nitride oxide film, and a film containing nitrogen and aluminum, such as an aluminum nitride film. In addition, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, etc. may also be used.

[0217] For example, the water vapor permeability of a low-permeability insulating film is 1×10 -5 [g / (m 2 ·day)] or less, preferably 1 × 10 -6 [g / (m 2 ·day)] or less, preferably 1×10 -7 [g / (m 2 ·day)] or less, and more preferably 1×10 -8 [g / (m 2 ·day)] or less.

[0218] The above is a description of the components.

[0219] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be appropriately combined with other configuration examples or drawings.

[0220] This embodiment mode can be implemented by appropriately combining at least a part of it with other embodiment modes described in this specification.

[0221] (Embodiment 3) In this embodiment, a configuration example of a display device will be described with reference to FIGS. 23A, 23B, and 23C.

[0222] 23A includes a pixel portion 502, a driver circuit portion 504, a protective circuit 506, and a terminal portion 507. Note that the protective circuit 506 does not necessarily have to be provided.

[0223] The pixel section 502 has a plurality of pixel circuits 501 that drive a plurality of display devices arranged in X rows and Y columns (X and Y are each independently a natural number of 2 or more).

[0224] The driver circuit unit 504 has driver circuits such as a gate driver 504a that outputs scanning signals to the gate lines GL_1 to GL_X and a source driver 504b that supplies data signals to the data lines DL_1 to DL_Y. The gate driver 504a may have at least a shift register. The source driver 504b is configured using, for example, a plurality of analog switches. The source driver 504b may also be configured using a shift register.

[0225] The terminal portion 507 refers to a portion provided with terminals for inputting power, control signals, image signals, and the like from an external circuit to the display device.

[0226] The protection circuit 506 is a circuit that, when a potential outside a certain range is applied to a wiring connected to the protection circuit 506, brings the wiring into a conductive state with another wiring. The protection circuit 506 shown in Fig. 23A is connected to various wirings, such as a gate line GL that is a wiring between a gate driver 504a and a pixel circuit 501, or a data line DL that is a wiring between a source driver 504b and a pixel circuit 501. Note that in Fig. 23A, the protection circuit 506 is hatched to distinguish it from the pixel circuit 501.

[0227] Furthermore, the gate driver 504a and the source driver 504b may be provided on the same substrate as the pixel unit 502, or a substrate on which a gate driver circuit or a source driver circuit is separately formed (e.g., a drive circuit substrate formed of a single crystal semiconductor or a polycrystalline semiconductor) may be mounted on the substrate by COF, TCP (Tape Carrier Package), COG (Chip On Glass), or the like.

[0228] Furthermore, the pixel circuits 501 shown in FIG. 23A can have the configurations shown in FIGS. 23B and 23C, for example.

[0229] 23B includes a liquid crystal device 570, a transistor 550, and a capacitor 560. The pixel circuit 501 is also connected to a data line DL_n, a gate line GL_m, a potential supply line VL, and the like.

[0230] The potential of one of a pair of electrodes of the liquid crystal device 570 is set appropriately according to the specifications of the pixel circuit 501. The orientation state of the liquid crystal device 570 is set by written data. A common potential (common potential) may be applied to one of the pair of electrodes of the liquid crystal device 570 of each of the multiple pixel circuits 501. Also, a different potential may be applied to one of the pair of electrodes of the liquid crystal device 570 of the pixel circuits 501 in each row.

[0231] 23C includes transistors 552 and 554, a capacitor 562, and a light-emitting device 572. The pixel circuit 501 is connected to a data line DL_n, a gate line GL_m, a potential supply line VL_a, a potential supply line VL_b, and the like.

[0232] A high power supply potential VDD is applied to one of the potential supply lines VL_a and VL_b, and a low power supply potential VSS is applied to the other. A current flowing through the light emitting device 572 is controlled in accordance with the potential applied to the gate of the transistor 554, thereby controlling the light emission brightness from the light emitting device 572.

[0233] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be appropriately combined with other configuration examples or drawings.

[0234] This embodiment mode can be implemented by appropriately combining at least a part of it with other embodiment modes described in this specification.

[0235] (Embodiment 4) In the following, a pixel circuit including a memory for correcting a gray scale displayed in a pixel and a display device having the same will be described.

[0236] <Circuit configuration> 24A shows a circuit diagram of a pixel circuit 400. The pixel circuit 400 includes a transistor M1, a transistor M2, a capacitor C1, and a circuit 401. The pixel circuit 400 is also connected to a wiring S1, a wiring S2, a wiring G1, and a wiring G2.

[0237] The transistor M1 has a gate connected to the wiring G1, one of a source and a drain connected to the wiring S1, and the other connected to one electrode of the capacitor C1. The transistor M2 has a gate connected to the wiring G2, one of a source and a drain connected to the wiring S2, and the other connected to the other electrode of the capacitor C1 and the circuit 401.

[0238] The circuit 401 is a circuit including at least one display device. Various devices can be used as the display device, but typically, a light-emitting device such as an organic EL device or an LED device, a liquid crystal device, or a MEMS (Micro Electro Mechanical Systems) device can be applied.

[0239] The node connecting the transistor M1 and the capacitor C1 is referred to as a node N1, and the node connecting the transistor M2 and the circuit 401 is referred to as a node N2.

[0240] In the pixel circuit 400, the potential of the node N1 can be maintained by turning off the transistor M1. Also, the potential of the node N2 can be maintained by turning off the transistor M2. Also, by writing a predetermined potential to the node N1 via the transistor M1 while the transistor M2 is in the off state, the potential of the node N2 can be changed according to the change in the potential of the node N1 due to capacitive coupling via the capacitor C1.

[0241] Here, the transistor including an oxide semiconductor, as exemplified in Embodiment 2, can be used as one or both of the transistors M1 and M2. Therefore, the potentials of the nodes N1 and N2 can be held for a long period of time due to an extremely low off-state current. Note that when the period during which the potentials of the nodes are held is short (specifically, when the frame frequency is 30 Hz or more), a transistor including a semiconductor such as silicon may be used.

[0242] <Driving method example> Next, an example of an operation method of the pixel circuit 400 will be described with reference to Fig. 24B. Fig. 24B is a timing chart relating to the operation of the pixel circuit 400. Note that, for ease of explanation, the influence of various resistances such as wiring resistance, parasitic capacitance of transistors or wiring, threshold voltage of transistors, and the like is not taken into consideration here.

[0243] 24B, one frame period is divided into a period T1 and a period T2. The period T1 is a period in which a potential is written to the node N2, and the period T2 is a period in which a potential is written to the node N1.

[0244] In the period T1, a potential that turns on the transistor is applied to both the wiring G1 and the wiring G2. In addition, a fixed potential V ref is supplied to the line S2, and the first data potential V w supplies.

[0245] The node N1 is connected to a potential V refThe node N2 is supplied with a first data potential V w Therefore, the capacitance C1 has a potential difference V w -V ref is held.

[0246] In the next period T2, a potential that turns on the transistor M1 is applied to the wiring G1, and a potential that turns off the transistor M2 is applied to the wiring G2. data A predetermined constant potential is applied to the wiring S2, or the wiring S2 may be in a floating state.

[0247] The node N1 receives a second data potential V data At this time, the second data potential V data In response to this, the potential of the node N2 changes by a potential dV. w The potential obtained by adding the second data potential V to the potential dV is input. Note that although the potential dV is shown to be a positive value in FIG. 24B, it may be a negative value. data is the potential V ref It may be lower.

[0248] Here, the potential dV is roughly determined by the capacitance value of the capacitor C1 and the capacitance value of the circuit 401. When the capacitance value of the capacitor C1 is sufficiently larger than the capacitance value of the circuit 401, the potential dV is equal to the second data potential V data The potential becomes close to

[0249] In this way, the pixel circuit 400 can combine two types of data signals to generate a potential to be supplied to the circuit 401 including a display device, so that the pixel circuit 400 can perform gray scale correction within the pixel circuit 400.

[0250] The pixel circuit 400 can also generate a potential that exceeds the maximum potential that can be supplied to the wirings S1 and S2. For example, when a light-emitting device is used, a high dynamic range (HDR) display can be performed. When a liquid crystal device is used, overdrive driving can be realized.

[0251] <Application Examples> [Example using liquid crystal device] The pixel circuit 400LC shown in Fig. 24C includes a circuit 401LC. The circuit 401LC includes a liquid crystal device LC and a capacitor C2.

[0252] The liquid crystal device LC has one electrode connected to the node N2 and one electrode connected to the capacitance C2, and the other electrode connected to the potential V com2 The other electrode of the capacitor C2 is connected to the wiring that is supplied with the potential V com1 Connect with the wiring given.

[0253] The capacitor C2 functions as a storage capacitor. If the capacitor C2 is not required, it can be omitted.

[0254] Since the pixel circuit 400LC can supply a high voltage to the liquid crystal device LC, it is possible to, for example, realize high-speed display by overdriving, apply a liquid crystal material with a high driving voltage, etc. In addition, by supplying a correction signal to the wiring S1 or wiring S2, it is also possible to correct the gradation according to the operating temperature or the deterioration state of the liquid crystal device LC, etc.

[0255] [Example using a light-emitting device] The pixel circuit 400EL shown in Fig. 24D includes a circuit 401EL. The circuit 401EL includes a light emitting device EL, a transistor M3, and a capacitor C2.

[0256] The transistor M3 has a gate connected to the node N2 and one electrode of the capacitor C2, a source and a drain connected to a wiring to which a potential VH is applied, and the other connected to one electrode of the light-emitting device EL. comThe other electrode of the light-emitting device EL is connected to a wiring to which a potential V L Connect with the wiring given.

[0257] The transistor M3 has a function of controlling the current supplied to the light emitting device EL. The capacitor C2 functions as a storage capacitor. The capacitor C2 can be omitted if not required.

[0258] In this example, the anode side of the light emitting device EL is connected to the transistor M3, but the cathode side of the light emitting device EL may be connected to the transistor M3. H and potential V L The value of can be changed appropriately.

[0259] In the pixel circuit 400EL, a large current can be passed through the light-emitting device EL by applying a high potential to the gate of the transistor M3, and thus, for example, HDR display can be realized. In addition, by supplying a correction signal to the wiring S1 or wiring S2, it is also possible to correct variations in the electrical characteristics of the transistor M3 and the light-emitting device EL.

[0260] It should be noted that the circuits are not limited to those illustrated in FIGS. 24C and 24D, and may be configured to include additional transistors, capacitors, and the like.

[0261] This embodiment mode can be implemented by appropriately combining at least a part of it with other embodiment modes described in this specification.

[0262] (Embodiment 5) A configuration example of a pixel in a display panel of one embodiment of the present invention will be described below.

[0263] 25A to 25E show configuration examples of the pixel 300. In FIG.

[0264] The pixel 300 has a plurality of pixels 301. Each of the plurality of pixels 301 functions as a sub-pixel. Since one pixel 300 is composed of a plurality of pixels 301 each exhibiting a different color, full color display can be performed on the display unit.

[0265] Each of the pixels 300 shown in Figures 25A and 25B has three sub-pixels. The pixel 301 in the pixel 300 shown in Figure 25A exhibits a combination of colors: red (R), green (G), and blue (B). The pixel 301 in the pixel 300 shown in Figure 25B exhibits a combination of colors: cyan (C), magenta (M), and yellow (Y).

[0266] Each of the pixels 300 shown in Fig. 25C to Fig. 25E has four sub-pixels. The pixel 301 of the pixel 300 shown in Fig. 25C has a color combination of red (R), green (G), blue (B), and white (W). The brightness of the display unit can be increased by using a sub-pixel that has a white color. The pixel 301 of the pixel 300 shown in Fig. 25D has a color combination of red (R), green (G), blue (B), and yellow (Y). The pixel 301 of the pixel 300 shown in Fig. 25E has a color combination of cyan (C), magenta (M), yellow (Y), and white (W).

[0267] By increasing the number of sub-pixels that function as one pixel and appropriately combining sub-pixels that exhibit colors such as red, green, blue, cyan, magenta, and yellow, it is possible to improve the reproducibility of intermediate tones, thereby improving the display quality.

[0268] In addition, the display device according to one embodiment of the present invention can reproduce color gamuts of various standards. For example, the color gamuts can be reproduced according to the PAL (Phase Alternating Line) standard and the NTSC (National Television System Committee) standard used in television broadcasting, the sRGB (standard RGB) standard and the Adobe RGB standard widely used in display devices used in electronic devices such as personal computers, digital cameras, and printers, the ITU-R BT.709 (International Telecommunication Union Radiocommunication Sector Broadcasting Service (Television) 709) standard used in HDTV (High Definition Television, also called high vision), the DCI-P3 (Digital Cinema Initiatives P3) standard used in digital cinema projection, and the ITU-R BT.2020 (REC.2020 (Recommendation 2020)) standard used in UHDTV (Ultra High Definition Television, also called super high vision).

[0269] Moreover, when the pixels 300 are arranged in a matrix of 1920×1080, a display device capable of full-color display at a resolution of so-called full high-definition (also called "2K resolution", "2K1K", or "2K"). When the pixels 300 are arranged in a matrix of 3840×2160, for example, a display device capable of full-color display at a resolution of so-called ultra high-definition (also called "4K resolution", "4K2K", or "4K"). When the pixels 300 are arranged in a matrix of 7680×4320, for example, a display device capable of full-color display at a resolution of so-called super high-definition (also called "8K resolution", "8K4K", or "8K"). By increasing the number of pixels 300, a display device capable of full-color display at a resolution of 16K or 32K can also be realized.

[0270] This embodiment mode can be implemented by appropriately combining at least a part of it with other embodiment modes described in this specification. [Explanation of symbols]

[0271] 100: angle adjustment device, 100a: angle adjustment device, 100b: angle adjustment device, 100c: angle adjustment device, 100d: angle adjustment device, 101a: base part, 101b: base part, 102a: connecting part, 102b: connecting part, 103a: columnar part, 103b: columnar part, 104a: columnar part, 104b: columnar part, 105: columnar part, 111: surface, 112: surface, 113: surface, 114: surface, 115: surface, 121: opening, 122: part, 122a: area, 122b: area, 122c: area, 131a: connecting part, 131b: connecting part, 132: spacer, 141 : thin-film solar cell, 141a: opening, 141b: opening, 142a: opening, 142b: opening, 143a: opening, 143b: opening, 151: region, 151a: region, 151b: region, 152: region, 152a: region, 152b: region, 161: flat plate portion, 162: flat plate portion, 163: flat plate portion, 165: bent portion, 166: columnar body, 167a: side, 167b: side, 167c: side, 167d: side, 170: display panel, 171: display panel, 172: display panel, 173: display panel, 175: display panel, 181: columnar body, 186a: gear, 186 b: gear, 200: support, 220: sensor, 235a: input / output unit, 235b: input / output unit, 236a: camera, 236b: camera, 237: sensor, 240: solar cell, 245: external interface, 250: display device, 300: pixel, 301: pixel, 400: pixel circuit, 400EL: pixel circuit, 400LC: pixel circuit, 401: circuit, 401EL: circuit, 401LC: circuit, 501: pixel circuit, 502: pixel section, 504: drive circuit section, 504a: gate driver, 504b: source driver, 506: protection circuit, 507: terminal section, 55 0: transistor, 552: transistor, 554: transistor, 560: capacitor, 562: capacitor, 570: liquid crystal device, 572: light emitting device, 700: display panel, 700A: display panel, 702: pixel section, 704: source driver circuit section, 706: gate driver circuit section, 708: FPC terminal section, 710: wiring, 716: FPC, 717: IC, 730: insulating layer, 732: sealing layer, 736: colored layer, 738: light shielding layer, 740: support substrate, 741: protective layer, 741a: insulating layer, 741b: insulating layer, 741c: insulating layer, 742: adhesive layer,743: resin layer, 744: insulating layer, 745: supporting substrate, 746: insulating layer, 747: adhesive layer, 749: protective layer, 750: transistor, 752: transistor, 760: wiring, 761: conductive layer, 770: insulating layer, 772: conductive layer, 780: anisotropic conductive film, 782: light emitting device, 786: EL layer, 788: conductive layer, 790: capacitor,

Claims

1. The display device includes a support having an angle adjustment device and a flat plate, and a flexible display panel. The angle adjustment device is a first base part, a second base part, a first connecting part, a second connecting part, and first to fourth columnar parts; the first foundation part and the second foundation part each have a first region and a second region; the first connecting part and the second connecting part each have a first opening part and a cutout part having the same shape; the first opening and the cutout are arranged side by side in a longitudinal direction of the first connecting part and the second connecting part, the first columnar part or the third columnar part is inserted into the first opening, the second columnar part or the fourth columnar part is inserted into the cutout portion, the first region of the first base part is connected to the second region of the second base part via the first columnar part, the first connecting part, and the fourth columnar part; A display device, wherein the first region of the second base component is connected to the second region of the first base component via the third columnar component, the second connecting component and the second columnar component.

2. In claim 1, the cutout portion has a third region, a fourth region, and a fifth region; the fourth region is between the third region and the fifth region, the fifth region is between the third region and the first opening, A display device, wherein the third region, the second region, and the third region each have an arc-shaped top surface.

3. In claim 2, switching a position of the second columnar component from one of the third region and the fourth region of the second connecting component to the other; A display device that switches the relative angle between the first base part and the second base part by switching the position of the fourth columnar part from one of the third region or the fourth region of the first connecting part to the other.

4. In claim 2 or 3, the second post-shaped component is in the fourth region of the second connecting component; When the fourth columnar component is in the fourth region of the first connecting component, A display device, wherein a first surface of the first base part is capable of contacting a second surface of the second base part.

5. In any one of claims 2 to 3, the second post-shaped component is in the third region of the second connecting component; When the fourth columnar component is in the third region of the first connecting component, A display device, wherein a third surface of the first base part is capable of contacting a fourth surface of the second base part.

6. In any one of claims 1 to 5, a third connecting part, a fourth connecting part, and a fifth columnar part; the third connecting part and the fourth connecting part have a second opening; the third connecting part is fixed to the first base part; the fourth connecting part is fixed to the second base part; the fifth columnar part is inserted into the second opening of the third connecting part and the second opening of the fourth connecting part; a long axis of the fifth columnar component is parallel to long axes of the first to fourth columnar components, The fifth columnar part is located near a region where the first base part and the second base part are in contact with each other.

Images