Display-integrated drive package and method for manufacturing the same

Abstract

To provide a display-integrated drive package that, when increasing the size of a screen by using a micro-LED, simplifies the structure and wiring and facilitates connectivity.SOLUTION: The present invention relates to a display-integrated drive package that can be used for a display and illumination, and a method for manufacturing the same. The display-integrated drive package can include: a display unit that comprises a plurality of light-emitting devices forming a plurality of pixels so that the entire screen or a part of the screen is displayed; and a driving unit that has the display unit formed on one face and a terminal unit formed on the other surface, and drives the light-emitting devices.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a display-integrated driver package and a manufacturing method thereof, and more particularly to a display-integrated driver package that can be used for display applications, lighting applications, and the like, and a manufacturing method thereof. [Background technology]

[0002] Generally, conventional display panels require the use of a large-area glass panel or a large-area backlight panel to form a large screen, which limits how large the display can be. In addition, if there is a problem such as a defective pixel in a part of the display, it is difficult to replace only that part.

[0003] In order to solve these problems, attempts have been made to develop a technology that uses micro LEDs to form unit display panels and unit backlight panels, and connects them together to enlarge the screen.

[0004] However, such a unit panel connection technology has many problems, such as the increased number of unit display panels or unit backlight panels to be connected makes it very difficult to connect the display panels or backlight panels to separate driver ICs or MCUs (Main Control Units) that drive the pixels of the display panels or backlight panels, resulting in very complicated wiring and structures and limited connectivity. Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention aims to provide a display-integrated driver package and a manufacturing method thereof that can be widely applied to not only notebook computers, monitors, TVs, etc., but also large-screen display devices, backlight panels, lighting devices, etc., since a display unit and a driver unit are integrated into one package, the package can be applied to small IT devices such as AR and VR, small projectors, etc., and each package can be easily connected to each other in a seamless form without a bezel to enlarge the screen. However, these problems are merely examples, and the scope of the present invention is not limited thereto. [Means for solving the problem]

[0006] In order to solve the above problems, a display-integrated driver package according to the concept of the present invention may include: a display unit consisting of a plurality of light-emitting elements forming a plurality of pixels so that the entire screen or a portion of the screen can be displayed; and a driver unit having the display unit on one side and a terminal unit on the other side, which drives the light-emitting elements.

[0007] According to the present invention, the display unit may be in the form of an LED chip obtained by cutting a wafer for LEDs on which micro LEDs or LEDs are formed so as to realize monochromatic or RGB color.

[0008] Furthermore, according to the present invention, the driving unit may be in the form of a semiconductor chip obtained by cutting a CMOS (Complementary Metal-Oxide Semiconductor) wafer on which a driver IC circuit or an MCU (Main Control Unit) circuit is formed so as to control the display unit.

[0009] According to the present invention, the driving part may have at least one micro bump formed on one surface thereof so as to be electrically connected to the light emitting element.

[0010] According to the present invention, the driving portion may have at least one TSV (through-substrate via) formed between the microbump and the terminal portion.

[0011] Also, according to the present invention, the terminal portion may include at least one of a ball grid array, a pad, and a lead frame so as to be electrically connectable to an external substrate.

[0012] In addition, according to the present invention, the display unit may be arranged side by side with other display-integrated driver packages to form a large screen, and the images of each screen may be connected and displayed as one, so that the first width of the display unit may be substantially the same as the second width of the driver, or the bezel width of the display unit may be less than half the first pitch of the light-emitting elements of the display unit.

[0013] According to the present invention, the third width of the terminal portion may be substantially the same as the first width or may be smaller than the first width.

[0014] Meanwhile, a manufacturing method of a display-integrated driving package according to the idea of ​​the present invention for solving the above problems may include the steps of: (a1) preparing a CMOS (Complementary Metal-Oxide Semiconductor) wafer on which a driver IC circuit or an MCU (Main Control Unit) circuit is formed; (b1) preparing an LED wafer on which micro LEDs or LEDs are formed; (c1) bonding the CMOS wafer and the LED wafer so that a driving unit of the CMOS wafer and a display unit of the LED wafer can be electrically connected to each other; and (d1) cutting the bonded CMOS wafer and the LED wafer into the form of a unit package.

[0015] Meanwhile, a manufacturing method of a display-integrated driving package according to the idea of ​​the present invention for solving the above problems may include: (a2) a step of cutting a CMOS (Complementary Metal-Oxide Semiconductor) wafer on which a driver IC circuit or an MCU (Main Control Unit) circuit is formed into the shape of a semiconductor chip; (b2) a step of cutting an LED wafer on which micro LEDs or LEDs are formed into the shape of an LED chip; and (c2) a step of bonding the semiconductor chip and the LED chip so that the cut semiconductor chip and the cut LED chip can be electrically connected to each other. Effect of the Invention

[0016] According to one embodiment of the present invention, the display unit and the driving unit are integrated into one package, and can be applied to small IT devices such as AR and VR, small projectors, etc., and it is easy to enlarge the screen by connecting a plurality of units to each other in a seamless form without a bezel, so that it can be widely applied to large screen display devices, backlight panels, lighting devices, etc. as well as notebook computers, monitors, TVs, etc. Of course, the scope of the present invention is not limited by such effects. [Brief description of the drawings]

[0017] [Figure 1] 1 is an external perspective view of a display-integrated driver package according to some embodiments of the present invention; [Diagram 2] FIG. 2 is a cross-sectional view showing the display-integrated driver package of FIG. [Diagram 3] FIG. 2 is an exploded perspective view showing the display-integrated driving package of FIG. 1. [Figure 4] FIG. 2 is a diagram showing a state in which the display-integrated driving packages of FIG. 1 are connected to each other to form a large screen. [Diagram 5]2A to 2C are cross-sectional views showing an example of a manufacturing process for the display-integrated driver package of FIG. 1 in stages. [Figure 6] 2A to 2C are cross-sectional views showing an example of a manufacturing process for the display-integrated driver package of FIG. 1 in stages. [Figure 7] 2A to 2C are cross-sectional views showing an example of a manufacturing process for the display-integrated driver package of FIG. 1 in stages. [Figure 8] 2A to 2C are cross-sectional views showing an example of a manufacturing process for the display-integrated driver package of FIG. 1 in stages. [Figure 9] 2A to 2C are cross-sectional views showing an example of a manufacturing process for the display-integrated driver package of FIG. 1 in stages. [Figure 10] 10A to 10C are cross-sectional views showing another example of the manufacturing process of the display-integrated driver package of FIG. [Figure 11] 10A to 10C are cross-sectional views showing another example of the manufacturing process of the display-integrated driver package of FIG. [Figure 12] 10A to 10C are cross-sectional views showing another example of the manufacturing process of the display-integrated driver package of FIG. [Figure 13] 10A to 10C are cross-sectional views showing another example of the manufacturing process of the display-integrated driver package of FIG. [Figure 14] 1 is a flow chart illustrating a method for manufacturing a display-integrated driver package according to some embodiments of the present invention. [Figure 15] 10 is a flowchart illustrating a method for manufacturing a display-integrated driver package according to some other embodiments of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Various preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0019] The embodiments of the present invention are provided to more completely explain the present invention to those having ordinary skill in the art, and the following embodiments may be modified into various other forms, and the scope of the present invention is not limited to the following embodiments. Rather, these embodiments are provided to make the present disclosure more complete and complete, and to fully convey the idea of ​​the present invention to those skilled in the art. In addition, the thickness and size of each layer in the drawings are exaggerated for convenience and clarity of explanation.

[0020] Throughout the specification, when a component, such as a film, region, or substrate, is referred to as being located "on," "connected to," "stacked to," or "coupled to" another component, it can be interpreted that the component is directly in contact with the other component, or that there can be another component intervening therebetween. Conversely, when a component is referred to as being located "directly on," "directly connected to," or "directly coupled to" another component, it is interpreted that there is no other component intervening therebetween. Like numbers refer to like components. As used herein, the term "and / or" includes any one and all combinations of one or more of the applicable listed items.

[0021] In this specification, terms such as "first" and "second" are used to describe various members, parts, regions, layers, and / or portions, but it is clear that these members, parts, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one member, part, region, layer, or portion from another region, layer, or portion. Thus, a first member, part, region, layer, or portion described in detail below can refer to a second member, part, region, layer, or portion without departing from the teachings of the present invention.

[0022] FIG. 1 is an external perspective view showing a display-integrated driver package 100 according to some embodiments of the present invention, FIG. 2 is a cross-sectional view showing the display-integrated driver package 100 of FIG. 1, and FIG. 3 is an exploded perspective view showing the display-integrated driver package 100 of FIG. 1.

[0023] First, as shown in FIGS. 1 to 3, a display-integrated driver package 100 according to some embodiments of the present invention may include a display unit 10 and a driver unit 20.

[0024] The display unit 10 may be a part including a plurality of light emitting elements R, G, and B forming a plurality of pixels so that the entire screen or a portion of the screen can be displayed.

[0025] The display unit 10 may be in the form of an LED chip LC obtained by cutting an LED wafer LW (see FIG. 6 ), such as a sapphire substrate, a silicon carbide substrate, a silicon substrate, a germanium substrate, a gallium arsenide substrate, a gallium phosphide substrate, an indium phosphide or spinel substrate, or a gallium nitride substrate, on which micro LEDs or LEDs having a size of, for example, 100 micrometers or less are formed to realize monocolor or RGB color.

[0026] The display unit 10 may include a plurality of light emitting elements R, G, and B mounted and electrically connected to the driver 20 so as to receive driving power from the driver 20 .

[0027] More specifically, the light emitting elements R, G, and B may include a flip chip type LED (Light Emitting Diode) having a first pad and a second pad formed on the bottom surface, or a protective member (not shown) for protecting the light emitting elements R, G, and B.

[0028] Here, the light emitting elements R, G, and B are not limited to red LEDs, green LEDs, and blue LEDs, and may be blue or white LEDs in a flip chip form, or may be non-flip type LED chips with pads formed on the top surface or flip chip type inorganic light emitting chips of various colors, and may be configured by integrating a plurality of LED chips with a driving circuit unit that drives the plurality of LED chips. The light emitting elements R, G, and B may be any type of LED, such as a general LED, a mini LED, or a micro LED.

[0029] That is, although not shown, other types of light emitting devices, such as a light emitting device in which a bonding wire is applied to a terminal or a light emitting device in which a bonding wire is applied only partially to a first terminal or a second terminal, a horizontal type light emitting device, and a vertical type light emitting device, are all applicable, but in order to realize a miniaturized and ultra-thin product, a flip chip type is preferable.

[0030] The light-emitting element can be constructed by epitaxially growing a nitride semiconductor such as InN, AlN, InGaN, AlGaN, or InGaAlN on a sapphire substrate or a silicon carbide substrate by a vapor phase growth method such as MOCVD. The light-emitting element can be formed using semiconductors such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, or AlInGaP in addition to nitride semiconductors. These semiconductors can be used as a laminate in which an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer are formed in this order. The light-emitting layer (active layer) can be a laminate semiconductor with a multiple quantum well structure or a single quantum well structure, or a laminate semiconductor with a double heterostructure. The light-emitting element can be selected from any wavelength depending on the application, such as display application or lighting application.

[0031] Here, the growth substrate may be an insulating, conductive or semiconducting substrate as required. For example, the growth substrate may be sapphire, SiC, Si, MgAl2O4, MgO, LiAlO2, LiGaO2, or GaN. For epitaxial growth of GaN material, a GaN substrate, which is a homogeneous substrate, may be applied.

[0032] In addition, the protective member may be a light-transmitting molding member formed by casting a light-transmitting material including at least silicon or epoxy.

[0033] However, the protective member is not limited to a translucent molding member, and other members such as a light conversion member including a fluorescent material or quantum dots, a color filter member, an optical system, a reflective wall member, etc. may be used.

[0034] Here, the fluorescent material must basically conform to stoichiometry, and each element can be replaced by other elements in each group on the periodic table. For example, Sr can be replaced by Ba, Ca, Mg, etc. of the alkaline earth (II) group, and Y can be replaced by Tb, Lu, Sc, Gd, etc. of the lanthanum group. In addition, the activator Eu can be replaced by Ce, Tb, Pr, Er, Yb, etc. depending on the desired energy level, and a sub-activator can be added to modify the properties or the activator alone.

[0035] Quantum dots can also be nanometer-sized particles that can have optical properties arising from quantum confinement, and can comprise, for example, one or more of Group IV elements, II-VI compounds, II-V compounds, III-VI compounds, III-V compounds, IV-VI compounds, I-III-VI compounds, II-IV-VI compounds, and II-IV-V compounds.

[0036] The quantum dots may comprise one or more of ZnO, ZnS, ZnSe, ZnTe, CdO, CdS, CdSe, CdTe, MgS, MgSe, GaAs, GaN, GaP, GaSe, GaSb, HgO, HgS, HgSe, HgTe, InAs, InN, InP, InSb, AlAs, AlN, AlP, AlSb, TlN, TlP, TlAs, TlSb, PbO, PbS, PbSe, PbTe, Ge, and Si.

[0037] In addition, quantum dots can be composed of a core (3-10 nm) such as CdSe or InP, a shell (0.5-2 nm) such as ZnS or ZnSe, and a ligand to stabilize the core and shell, and can have optical properties that can realize various colors depending on the size.

[0038] The quantum dots may also be included in physical structures or other forms, including monomers that can be polymerized into desired physical structures, such as films.

[0039] More specifically, the quantum dots may be formed in various fluid forms, such as a sheet form, a paste form together with various binders, and then cured, or a liquid form, such as a gel or gel state.

[0040] Furthermore, the light conversion member may contain two or more kinds of phosphors and quantum dot materials having different emission wavelengths, and the phosphors and quantum dots may be used in combination.

[0041] The driving unit 20 may be a part that drives the light-emitting elements R, G, and B, and has the display unit 10 formed on one side so that it can be integrated with the display unit 10, and a terminal unit 22 formed on the other side so that it can be electrically connected to an external substrate S.

[0042] The driving unit 20 may be in the form of a semiconductor chip SC obtained by cutting a CMOS (Complementary Metal-Oxide Semiconductor) wafer SW, such as a silicon (Si) substrate, a germanium (Ge) or a gallium arsenide (GaAs) substrate, on which a driver IC circuit or an MCU (Main Control Unit) circuit is formed to control the display unit 10.

[0043] At least one micro bump 21 is formed on one surface of the driving unit 20 by a method such as electroless plating or electrolytic plating so that the driving unit 20 can be electrically connected to the light-emitting elements R, G, and B, respectively, and at least one TSV (T) (through-substrate via) can be formed between the micro bump 21 and the terminal unit 22.

[0044] The driving unit 20 includes at least one driving circuit or MCU (Main Control Unit) circuit that functions as a type of driver IC, and the driving circuit can be formed in various forms such as supplying power, controlling the driving voltage, processing feedback signals, controlling the driving brightness of the light-emitting elements R, G, and B, and correcting the light intensity of the light-emitting elements R, G, and B to match the reference light intensity of other light-emitting elements.

[0045] The driving unit 20 may include a semiconductor substrate formed on a semiconductor wafer such as a silicon wafer using an integrated circuit process.

[0046] Such a semiconductor substrate can be formed with multiple semiconductor layers, and the driving circuits formed in each layer can be electrically connected using a redistribution layer (RDL) metal layer.

[0047] The driving unit 20 is formed on one surface of a semiconductor substrate for inputting and outputting signals of the driving circuit, and may have a plurality of terminal units 22 for receiving power signals or input / output signals. The terminal units 22 may be made of an electrically conductive material such as Cu, Ni, Ag, or Au having excellent electrical conductivity, and may be in the form of various solder balls, bumps, pads, or the like.

[0048] The terminal portion 22 may include at least one of a ball grid array, a micropad, and a lead frame so as to be electrically connectable to an external substrate S.

[0049] Therefore, as shown in FIG. 2, the operating process of the display-integrated driving package 100 of the present invention will be described. The display-integrated driving package 100 of the present invention can receive input / output signals from an external substrate S via the terminal portion 22 and input them to a driver IC circuit or an MCU (Main Control Unit) circuit of the driving unit 20.

[0050] Next, an output power signal from a driver IC circuit or an MCU (Main Control Unit) circuit may be supplied to the light-emitting elements R, G, and B via a first pad (not shown) and a second pad (not shown), respectively. When light is generated in the light-emitting elements R, G, and B to which such an output power signal has been applied, the light path may be guided by a protective member (not shown) surrounding the light-emitting elements R, G, and B, or light conversion may be performed to convert the wavelength of the light.

[0051] Therefore, the driver IC circuit or MCU (Main Control Unit) is packaged by the chip scale package (CSP) process. By mounting an LED chip LC forming the display unit 10 on a semiconductor chip SC on which a circuit for a display control unit (LED display unit) is formed, it is possible to realize, for example, a local dimming backlight including control elements and color control of a number of displays. This reduces the length of wiring and greatly improves light extraction efficiency. By minimizing the optical distance of the display and the backlight, it is possible to realize a thin display and design an ultra-thin package of multi-color or single-color light emitting diodes with a minimized number of components. By forming various optical systems such as a light diffusion lens or an optical system in the form of a side reflection light on the light emitting surface, the light directivity angle can be improved and a thinner and more uniform surface light source can be realized with fewer light emitting elements. By realizing a number of local dimmings in which the number of local dimmings and the number of light emitting sources are the same, the black and white brightness ratio (black contrast) can be maximized. This can dramatically improve the mounting space constraints, circuit complexity, and difficulty in increasing unit cost when manufacturing a module. By including a control element (drive circuit) having a structure that maximizes the number of control steps for light brightness, it is possible to achieve a brightness ratio of even more steps. For accurate control, a feedback terminal, a terminal for multiple functions, a power supply, a ground terminal, etc. can be variously configured.

[0052] Meanwhile, as shown in FIG. 2, the first width W1 of the display unit 10 may be substantially equal to the second width W2 of the driver 20 so that the images of each screen displayed can be connected together to form a large screen, or the bezel width BW of the display unit 10 may be less than half the first pitch P1 of the light-emitting elements R, G, and B of the display unit 10.

[0053] The third width W3 of the terminal portion 22 may be substantially the same as the first width W1 or may be smaller than the first width W1.

[0054] Therefore, when the display unit 10 of the display-integrated driver package 100 of the present invention is arranged in contact with the display unit 10 of another adjacent display-integrated driver package 100, there is no bezel width BW or the bezel width BW on both sides is smaller than the first pitch P1 of the light-emitting elements R, G, B of the display unit 10, so that images displayed on each display unit 10 can be realized as if they were a single image.

[0055] FIG. 4 is a diagram showing a state in which the display-integrated driver packages 100 of FIG. 1 are connected to each other to form a large screen.

[0056] Therefore, as shown in FIG. 4, by integrating the display unit 10 and the driving unit 20 into a single package, it can be used alone in small IT devices such as AR and VR, small projectors, etc., and since it is easy to enlarge the screen by connecting multiple units to each other in a seamless form without a bezel, it can be widely used in large screen display devices, backlight panels, lighting devices, etc. as well as laptops, monitors, TVs, etc.

[0057] 5 to 9 are cross-sectional views showing an example of a manufacturing process for the display-integrated driver package of FIG. 1 in stages.

[0058] As shown in Figures 5 to 9, an example of a manufacturing process of the display-integrated driving package 100 of Figure 1 will be described step by step. First, as shown in Figure 5, a CMOS (Complementary Metal-Oxide Semiconductor) wafer SW on which a driver IC circuit or an MCU (Main Control Unit) circuit is formed can be prepared.

[0059] At this time, the CMOS wafer SW may include a driving section 20 having microbumps 21 formed on one side by a method such as electroless plating or electrolytic plating, terminal sections 22 formed on the other side by a method such as soldering, and a TSV (T) formed between the microbumps 21 and the terminal sections 22.

[0060] Next, as shown in FIG. 6, an LED wafer LW on which micro LEDs or LEDs are formed can be prepared.

[0061] At this time, the LED wafer LW may include a plurality of light emitting elements R, G, and B, such as micro LEDs or mini LEDs.

[0062] Next, as shown in FIG. 7, the CMOS wafer SW and the LED wafer LW are aligned using a chip pattern, a bump pattern, an alignment mark, etc. in a wafer-to-wafer manner, and then, as shown in FIG. 8, the CMOS wafer SW and the LED wafer LW can be bonded using heating, eutectic, laser bonding, etc. so that the driving unit of the CMOS wafer SW and the display unit 10 of the LED wafer LW can be electrically connected to each other.

[0063] Next, as shown in FIG. 9, the bonded CMOS wafer SW and LED wafer LW can be cut into unit packages along cutting lines L using a blade or laser cutter.

[0064] For example, unit package sizes may be made to be approximately 0.5 inches to 2 inches for convenient use and management.

[0065] Therefore, by bonding the display unit 10 and the driving unit 20 using the wafer-to-wafer method and mounting multiple light-emitting elements R, G, and B collectively on the driving unit 20, productivity can be greatly improved and manufacturing time and costs can be greatly reduced.

[0066] 10 to 13 are cross-sectional views showing another example of a manufacturing process for the display-integrated driver package 100 of FIG. 1 in stages.

[0067] As shown in Figures 10 to 13, another example of the manufacturing process of the display-integrated driving package 100 of Figure 1 will be described step by step. First, as shown in Figure 10, a CMOS (Complementary Metal-Oxide Semiconductor) wafer SW on which a driver IC circuit or an MCU (Main Control Unit) circuit is formed can be cut into the shape of a semiconductor chip SC along a cutting line L using a blade or laser cutting.

[0068] At this time, the CMOS wafer SW may include a driving section 20 having microbumps 21 formed on one side by a method such as electroless plating or electrolytic plating, terminal sections 22 formed on the other side by a method such as soldering, and a TSV (T) formed between the microbumps 21 and the terminal sections 22.

[0069] Next, as shown in FIG. 11, the LED wafer LW on which the micro LEDs or LEDs are formed can be cut along cutting lines L into LED chips LC using a blade, laser cutting, or the like.

[0070] At this time, the LED wafer LW may include a plurality of light emitting elements R, G, and B, such as micro LEDs or mini LEDs.

[0071] Next, as shown in FIG. 12, the cut semiconductor chips SC and the cut LED chips LC are aligned using a chip pattern, a bump pattern, an alignment mark, etc. in a chip-to-chip manner, and then, as shown in FIG. 13, the semiconductor chips SC and the LED chips LC can be bonded so that the cut semiconductor chips SC and the cut LED chips LC can be electrically connected to each other.

[0072] Therefore, by bonding the display unit 10 and the driving unit 20 using a chip-to-chip method and mounting multiple light-emitting elements R, G, and B collectively on the driving unit 20, productivity can be greatly improved and manufacturing time and costs can be greatly reduced.

[0073] However, the manufacturing method of the display-integrated driver package 100 according to various embodiments of the present invention is not necessarily limited to this, and various types and forms of manufacturing methods can be applied.

[0074] FIG. 14 is a flow chart illustrating a method for manufacturing a display-integrated driver package 100 according to some embodiments of the present invention.

[0075] As shown in FIGS. 1 to 14, a manufacturing method of a display-integrated driver package 100 according to some embodiments of the present invention may include the steps of: (a1) preparing a CMOS (Complementary Metal-Oxide Semiconductor) wafer SW on which a driver IC circuit or an MCU (Main Control Unit) circuit is formed; (b1) preparing an LED wafer LW on which a micro LED or an LED is formed; (c1) bonding the CMOS wafer SW and the LED wafer LW such that a driver unit of the CMOS wafer SW and a display unit 10 of the LED wafer LW can be electrically connected to each other; and (d1) cutting the bonded CMOS wafer SW and LED wafer LW into unit packages along cutting lines L.

[0076] FIG. 15 is a flow chart illustrating a method for manufacturing a display-integrated driver package 100 according to some other embodiments of the present invention.

[0077] As shown in FIGS. 1 to 15, a manufacturing method of a display-integrated driver package 100 according to some other embodiments of the present invention may include the steps of (a2) cutting a CMOS (Complementary Metal-Oxide Semiconductor) wafer SW having a driver IC circuit or an MCU (Main Control Unit) circuit formed thereon into a semiconductor chip SC along a cutting line L, (b2) cutting an LED wafer LW having a micro LED or LED formed thereon into a LED chip LC along the cutting line L, and (c2) bonding the semiconductor chip SC and the LED chip LC so that the cut semiconductor chip SC and the cut LED chip LC can be electrically connected to each other.

[0078] The present invention has been described with reference to the embodiments shown in the drawings, but these are merely illustrative, and those skilled in the art will appreciate that various modifications and equivalent embodiments are possible. Therefore, the true technical scope of protection of the present invention should be determined by the technical ideas of the appended claims. [Explanation of symbols]

[0079] 10 Display section R, G, B light emitting elements LW LED Wafer LC LED Chip 20 Drive unit 21 Microbump 22 Terminal section SW CMOS wafer SC Semiconductor Chip T TSV S External Board W1 1st width W2 Second width BW Bezel width P1 First pitch W3 3rd width L cutting line 100 Display integrated drive package

Claims

1. a display unit including a plurality of light emitting elements forming a plurality of pixels so that the entire screen or a portion of the screen can be displayed; The display unit is formed on one side of the display unit, a terminal unit is formed on the other side of the display unit, and a driver unit for driving the light emitting element is provided.

2. The display unit includes:

2. The display-integrated driver package according to claim 1, in the form of an LED chip obtained by cutting an LED wafer on which micro LEDs or LEDs are formed so as to realize mono-color or RGB color.

3. The drive unit is 2. The display-integrated driver package according to claim 1, which is in the form of a semiconductor chip obtained by cutting a CMOS (Complementary Metal-Oxide Semiconductor) wafer on which a driver IC circuit or an MCU (Main Control Unit) circuit is formed to control the display unit.

4. The drive unit is The display-integrated driver package according to claim 3 , further comprising at least one micro bump formed on one surface thereof so as to be electrically connected to the light emitting elements.

5. The drive unit is The display-integrated driver package according to claim 4 , wherein at least one through-substrate via (TSV) is formed between the microbump and the terminal portion.

6. The display-integrated driver package according to claim 1 , wherein the terminal portion includes at least one of a ball grid array, a pad, and a lead frame so as to be electrically connectable to an external substrate.

7. The display-integrated driver package of claim 1, wherein the first width of the display unit is substantially the same as the second width of the driver unit, or the bezel width of the display unit is less than half the first pitch of the light-emitting elements of the display unit, so that the display unit is arranged side by side with other display-integrated driver packages to form a large screen and the images of each screen displayed can be connected and displayed as one.

8. The display-integrated driver package according to claim 7 , wherein the third width of the terminal portion is substantially the same as or smaller than the first width.

9. (a1) preparing a CMOS (Complementary Metal-Oxide Semiconductor) wafer on which a driver IC circuit or an MCU (Main Control Unit) circuit is formed; (b1) preparing an LED wafer having micro LEDs or LEDs formed thereon; (c1) bonding the CMOS wafer and the LED wafer such that a drive section of the CMOS wafer and a display section of the LED wafer are electrically connectable to each other; (d1) cutting the bonded CMOS wafer and the LED wafer into unit packages.

10. (a2) cutting a CMOS (Complementary Metal-Oxide Semiconductor) wafer on which a driver IC circuit or an MCU (Main Control Unit) circuit is formed into semiconductor chips; (b2) cutting the LED wafer on which the micro LEDs or LEDs are formed into LED chips; (c2) bonding the cut semiconductor chip and the cut LED chip so that the cut semiconductor chip and the cut LED chip are electrically connectable to each other.

Images