Heat medium liquid vapor discharge prevention device

Abstract

To provide a heat medium liquid vapor discharge prevention device that prevents vapor of a heat medium liquid for exchanging heat inside a semiconductor manufacturing apparatus from being discharged into the atmosphere.SOLUTION: A heat medium liquid vapor discharge prevention device 6 includes: a heat medium liquid circulation line 22 for circulating a heat medium liquid between a semiconductor manufacturing apparatus 2 and a temperature adjusting device 5 for adjusting temperature of the heat medium liquid; and a sealed expansion tank 32 connected to the heat medium liquid circulation line 22 and absorbing a volume change of the heat medium liquid due to fluctuation of the temperature. The heat medium liquid circulation line 22 and the sealed expansion tank 32 are filled with the heat medium liquid.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a heat transfer liquid vapor emission prevention device that prevents vapor of a heat transfer liquid for heat exchange in a semiconductor manufacturing device from being emitted into the atmosphere. [Background technology]

[0002] Semiconductor manufacturing equipment (e.g., etching equipment, CVD equipment, PVD equipment, etc.) for manufacturing semiconductor devices is configured to execute a manufacturing process while controlling the processing temperature. In such semiconductor manufacturing equipment, the processing temperature of the wafer is adjusted by flowing a heat transfer medium liquid at a desired temperature through a flow path formed in the processing chamber. The temperature of the heat transfer medium liquid is adjusted by a temperature adjustment device, and the heat transfer medium liquid circulates between the temperature adjustment device and the semiconductor manufacturing equipment. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-253454 A Summary of the Invention [Problem to be solved by the invention]

[0004] Conventionally, a heat transfer liquid tank for storing the heat transfer liquid is connected to a heat transfer liquid circulation line that circulates the heat transfer liquid between a semiconductor manufacturing device and a temperature control device. A part of the heat transfer liquid in the heat transfer liquid tank evaporates and exists as vapor. When the heat transfer liquid expands due to a temperature change, the vapor of the heat transfer liquid is released into the atmosphere from a relief valve provided in the heat transfer liquid tank. Since the heat transfer liquid has a large global warming potential and there are concerns about adverse effects on the environment, it is desirable to prevent the vapor of the heat transfer liquid from being released into the atmosphere.

[0005] SUMMARY OF THE PRESENT DISCLOSURE In view of the above, the present invention provides a heat transfer liquid vapor leakage prevention device that prevents the vapor of a heat transfer liquid for heat exchange in a semiconductor manufacturing device from being discharged into the atmosphere. [Means for solving the problem]

[0006] In one aspect, there is provided a heat transfer liquid vapor discharge prevention device that prevents vapor of a heat transfer liquid for heat exchange in semiconductor manufacturing equipment from being discharged into the atmosphere, the heat transfer liquid discharge prevention device comprising: a heat transfer liquid circulation line that circulates the heat transfer liquid between the semiconductor manufacturing equipment and a temperature adjustment device that adjusts the temperature of the heat transfer liquid; and a sealed expansion tank that is connected to the heat transfer liquid circulation line and absorbs volumetric changes due to fluctuations in temperature of the heat transfer liquid, and the insides of the heat transfer liquid circulation line and the sealed expansion tank are filled with the heat transfer liquid. According to the present invention, since the volume change caused by the temperature fluctuation of the heat transfer liquid is absorbed by the sealed expansion tank, it is possible to prevent the vapor of the heat transfer liquid from being released into the atmosphere while maintaining the pressure in the heat transfer liquid circulation line. Furthermore, since the total amount of the heat transfer liquid circulating in the heat transfer liquid circulation line does not decrease, there is no need to replenish the heat transfer liquid, and costs can be reduced. In one embodiment, the sealed expansion tank is a diaphragm type sealed expansion tank. According to the present invention, the diaphragm type sealed expansion tank is compact (small) and does not take up much space, allowing the heat transfer medium vapor leakage prevention device to be made small.

[0007] In one aspect, there is provided a heat transfer liquid vapor discharge prevention device that prevents vapor of a heat transfer liquid for heat exchange in a semiconductor manufacturing equipment from being discharged into the atmosphere, the heat transfer liquid discharge prevention device including a heat transfer liquid circulation line that circulates the heat transfer liquid between the semiconductor manufacturing equipment and a temperature adjustment device that adjusts the temperature of the heat transfer liquid, and a trap device that is connected to the heat transfer liquid circulation line and captures vapor of the heat transfer liquid. According to the present invention, since the vapor of the heat transfer liquid is captured by the trap device, it is possible to prevent the vapor of the heat transfer liquid from being released into the atmosphere.

[0008] In one aspect, the trap device includes a heat transfer liquid tank for storing the heat transfer liquid, a heat transfer liquid vapor transfer line for transferring the vapor in the heat transfer liquid tank, a trap condenser connected to the heat transfer liquid vapor transfer line for condensing the vapor to produce the heat transfer liquid, and a heat transfer liquid recovery line for returning the heat transfer liquid produced in the trap condenser to the heat transfer liquid tank. According to the present invention, the vapor of the heat transfer liquid in the heat transfer liquid tank is transferred to the trap condenser and condensed, so that it is possible to prevent the vapor of the heat transfer liquid from being released into the atmosphere. Furthermore, according to the present invention, the heat transfer liquid produced in the trap condenser is recovered in the heat transfer liquid tank, so that the total amount of the heat transfer liquid circulating in the heat transfer liquid circulation line does not decrease, making it unnecessary to replenish the heat transfer liquid, and thus realizing cost reduction. In one aspect, the heat transfer medium liquid circulation line includes a heat transfer medium liquid outward piping through which the heat transfer medium liquid flows from the temperature adjustment device toward the semiconductor manufacturing equipment, and a heat transfer medium liquid return piping through which the heat transfer medium liquid flows from the semiconductor manufacturing equipment toward the temperature adjustment device, and the trap device is connected to the heat transfer medium liquid outward piping. According to the present invention, since the trap device is connected to the heat transfer medium supply pipe, heat transfer medium at a stable temperature can be supplied to the semiconductor manufacturing equipment.

[0009] In one embodiment, the trap device includes a heat transfer liquid tank that stores the heat transfer liquid, and a cooling water pipe that is disposed within the heat transfer liquid tank and that condenses the vapor within the heat transfer liquid tank. According to the present invention, the vapor of the heat transfer liquid in the heat transfer liquid tank is condensed in the heat transfer liquid tank and stored in the heat transfer liquid tank as the heat transfer liquid, so that the vapor of the heat transfer liquid can be prevented from being released into the atmosphere. Furthermore, since the total amount of the heat transfer liquid circulating in the heat transfer liquid circulation line does not decrease, there is no need to replenish the heat transfer liquid, and costs can be reduced. Furthermore, since a cooling water pipe for condensing the vapor of the heat transfer liquid is disposed in the heat transfer liquid tank, space can be saved for the entire trap device. In one aspect, the heat transfer medium liquid circulation line includes a heat transfer medium liquid outward piping through which the heat transfer medium liquid flows from the temperature adjustment device toward the semiconductor manufacturing equipment, and a heat transfer medium liquid return piping through which the heat transfer medium liquid flows from the semiconductor manufacturing equipment toward the temperature adjustment device, and the trap device is connected to the heat transfer medium liquid outward piping. According to the present invention, since the trap device is connected to the heat transfer medium supply pipe, heat transfer medium at a stable temperature can be supplied to the semiconductor manufacturing equipment. In one embodiment, an inlet for allowing the heat transfer liquid to flow from the heat transfer liquid circulation line into the heat transfer liquid tank is located at a position lower than the liquid level of the heat transfer liquid in the heat transfer liquid tank. According to the present invention, the heat transfer liquid supplied to the heat transfer liquid tank flows into the heat transfer liquid within the heat transfer liquid tank, so that flash evaporation of the heat transfer liquid within the heat transfer liquid tank can be prevented.

[0010] In one aspect, the trap device includes a heat transfer medium liquid tank that stores the heat transfer medium liquid, a heat transfer medium liquid vapor transfer line that transfers the vapor in the heat transfer medium liquid tank, and an adsorption device connected to the heat transfer medium liquid vapor transfer line and having an adsorbent that adsorbs the vapor. According to the present invention, the vapor of the heat transfer liquid in the heat transfer liquid tank is transferred to the adsorption device and adsorbed by the adsorbent, so that the vapor of the heat transfer liquid can be prevented from being released into the atmosphere. In one aspect, the heat transfer medium liquid circulation line includes a heat transfer medium liquid outward piping through which the heat transfer medium liquid flows from the temperature adjustment device toward the semiconductor manufacturing equipment, and a heat transfer medium liquid return piping through which the heat transfer medium liquid flows from the semiconductor manufacturing equipment toward the temperature adjustment device, and the trap device is connected to the heat transfer medium liquid outward piping. According to the present invention, since the trap device is connected to the heat transfer medium supply pipe, heat transfer medium at a stable temperature can be supplied to the semiconductor manufacturing equipment. In one embodiment, the adsorbent is activated carbon. According to the present invention, the adsorbent is activated carbon having an extremely high adsorption capacity, so that the amount of heat transfer liquid vapor adsorbed per unit volume is large, and the volume of the adsorption device can be made small. Effect of the Invention

[0011] According to the present invention, the heat transfer liquid vapor release prevention device includes a sealed expansion tank that absorbs volume changes caused by temperature fluctuations of the heat transfer liquid, and the heat transfer liquid circulation line and the inside of the sealed expansion tank are filled with heat transfer liquid, so that it is possible to prevent the heat transfer liquid vapor from being released into the atmosphere. According to the present invention, the heat transfer liquid vapor discharge prevention device includes a trap device connected to the heat transfer liquid circulation line, and therefore can prevent the vapor of the heat transfer liquid from being discharged into the atmosphere. [Brief description of the drawings]

[0012] [Figure 1] 1 is a schematic diagram illustrating an embodiment of a semiconductor manufacturing system including a heat transfer liquid vapor release prevention device. [Diagram 2] FIG. 1 illustrates an embodiment of a closed expansion tank that absorbs volume changes due to temperature fluctuations of a heat transfer liquid. [Diagram 3] FIG. 13 is a schematic diagram showing another embodiment of a semiconductor manufacturing system including a heat transfer liquid vapor emission prevention device. [Figure 4] 11 is a schematic diagram showing yet another embodiment of a semiconductor manufacturing system including a heat transfer liquid vapor emission prevention device. FIG. [Diagram 5] 11 is a schematic diagram showing yet another embodiment of a semiconductor manufacturing system including a heat transfer liquid vapor emission prevention device. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 is a schematic diagram showing one embodiment of a semiconductor manufacturing system 1 including a heat transfer liquid vapor emission prevention device 6. The semiconductor manufacturing system 1 includes a semiconductor manufacturing apparatus 2 (e.g., an etching apparatus, a CVD apparatus, a PVD apparatus, or the like) having a processing chamber 3 for performing a semiconductor manufacturing process, a temperature adjustment device 5 for adjusting the temperature of a heat transfer liquid for heat exchange in the semiconductor manufacturing apparatus 2, and a heat transfer liquid vapor emission prevention device 6 for preventing the vapor of the heat transfer liquid from being emitted into the atmosphere.

[0014] The semiconductor manufacturing equipment 2 is connected to the temperature adjustment device 5 via a heat transfer liquid vapor release prevention device 6. The heat transfer liquid circulates between the processing chamber 3 of the semiconductor manufacturing equipment 2 and the temperature adjustment device 5 via the heat transfer liquid vapor release prevention device 6. As the heat transfer liquid, a liquid such as a fluorine-based inert liquid (for example, perfluorocarbon (PFC), hydrochlorofluorocarbon (HCFC), hydrofluorocarbon (HFC), hydrofluoroolefin (HFO)) is used.

[0015] As an example, the temperature control device 5 has a cooling section that cools the heat transfer liquid and is composed of a vapor compression refrigerator, and a heating section that heats the heat transfer liquid and is composed of a heater. As another example, the temperature control device 5 has a cooling section and a heating section that are each composed of a vapor compression refrigerator. In this case, the refrigerator also functions as a heat pump. In the temperature control device 5 of this embodiment, the cooling section and the heating section are composed of a single vapor compression refrigerator. The temperature control device 5 includes an evaporator 11 that evaporates a refrigerant liquid to generate a refrigerant gas, a compressor 12 that compresses the refrigerant gas, a condenser 13 that condenses the compressed refrigerant gas to generate a refrigerant liquid, an expansion valve 14 arranged between the condenser 13 and the evaporator 11, and a refrigerant pipe 17. The refrigerant pipe 17 extends between the evaporator 11 and the compressor 12, between the compressor 12 and the condenser 13, and between the condenser 13 and the evaporator 11. The expansion valve 14 is arranged between the condenser 13 and the evaporator 11 of the refrigerant pipe 17. The refrigerant gas generated in the evaporator 11 is sucked into the compressor 12 and compressed by the compressor 12. The compressed refrigerant gas is guided to the condenser 13.

[0016] The temperature adjustment device 5 further includes a hot gas bypass valve 15 arranged between the compressor 12 and the evaporator 11, and a hot gas bypass piping 18 that sends refrigerant gas (also referred to as hot gas) compressed by the compressor 12 to the evaporator 11. The hot gas bypass piping 18 branches off from the refrigerant piping 17 at a position between the compressor 12 and the condenser 13, and merges with the refrigerant piping 17 at a position between the expansion valve 14 and the evaporator 11. The hot gas bypass valve 15 is arranged in the hot gas bypass piping 18.

[0017] The semiconductor manufacturing system 1 further includes a coolant circulation line 20 that circulates the coolant between a coolant supply source (not shown) and the temperature adjustment device 5. The coolant circulation line 20 is connected to the condenser 13, and the coolant supplied from the coolant supply source is guided through the coolant circulation line 20 into the condenser 13.

[0018] Basically, the temperature control device 5 operates with either the expansion valve 14 or the hot gas bypass valve 15 open. When the hot gas bypass valve 15 is closed and the expansion valve 14 is open, the refrigerant circulates between the evaporator 11, the compressor 12, the condenser 13, and the expansion valve 14 through the refrigerant pipe 17. When the expansion valve 14 is open, in the condenser 13, heat exchange occurs between the cooling liquid guided through the cooling liquid circulation line 20 and the refrigerant gas compressed by the compressor 12. As a result of the heat exchange between the cooling liquid and the refrigerant gas, the cooling liquid is heated, while the refrigerant gas is cooled to become a refrigerant liquid.

[0019] The refrigerant liquid cooled in the condenser 13 is guided to the evaporator 11 through the expansion valve 14, and the evaporator 11 has a function of cooling the heat transfer medium liquid by the refrigerant liquid. In this way, when the expansion valve 14 is open, the temperature adjustment device 5 operates as a cooling section that cools the heat transfer medium liquid by evaporating the refrigerant liquid in the evaporator 11.

[0020] When the expansion valve 14 is closed and the hot gas bypass valve 15 is opened, the refrigerant circulates between the evaporator 11, the compressor 12, and the hot gas bypass valve 15 through a part of the refrigerant piping 17 and the hot gas bypass piping 18. More specifically, the refrigerant passes through the evaporator 11 and the compressor 12, branches off from the refrigerant piping 17 at a position between the compressor 12 and the condenser 13, and flows into the hot gas bypass piping 18. The refrigerant passes through the hot gas bypass piping 18 and the hot gas bypass valve 15, and flows into the refrigerant piping 17 at a position between the expansion valve 14 and the evaporator 11.

[0021] When the hot gas bypass valve 15 is open, the refrigerant gas compressed by the compressor 12 is guided to the evaporator 11 through the hot gas bypass valve 15 without passing through the condenser 13. The evaporator 11 has a function of heating the heat transfer medium liquid by the refrigerant gas. In this way, when the hot gas bypass valve 15 is open, the temperature adjustment device 5 operates as a heating section that heats the heat transfer medium liquid in the evaporator 11.

[0022] The heat transfer liquid vapor release prevention device 6 includes a heat transfer liquid circulation line 22 for circulating the heat transfer liquid between the semiconductor manufacturing equipment 2 and the temperature adjustment device 5, a heat transfer liquid tank 30 for storing the heat transfer liquid, and a sealed expansion tank 32 for absorbing a volume change due to a temperature fluctuation of the heat transfer liquid. The heat transfer liquid tank 30 and the sealed expansion tank 32 are connected to the heat transfer liquid circulation line 22. The processing chamber 3 of the semiconductor manufacturing equipment 2 is connected to the evaporator 11 of the temperature adjustment device 5 via the heat transfer liquid circulation line 22, and the heat transfer liquid circulates between the processing chamber 3 and the evaporator 11. In one embodiment, the heat transfer liquid vapor release prevention device 6 does not need to include the heat transfer liquid tank 30.

[0023] The heat transfer liquid is guided to the evaporator 11 through the heat transfer liquid circulation line 22, and exchanges heat with the refrigerant liquid or refrigerant gas in the evaporator 11. When the expansion valve 14 is open, the heat transfer liquid exchanges heat with the refrigerant liquid in the evaporator 11. As a result of the heat exchange between the heat transfer liquid and the refrigerant liquid, the heat transfer liquid is cooled, while the refrigerant liquid is heated to become a refrigerant gas. Therefore, when the expansion valve 14 is open, the heat transfer liquid is cooled by the cooling liquid via the refrigerant.

[0024] The heat transfer liquid cooled by the evaporator 11 of the temperature adjustment device 5 is guided to the processing chamber 3 of the semiconductor manufacturing equipment 2 through the heat transfer liquid circulation line 22. The cooled heat transfer liquid flows through a flow path (not shown) formed in the processing chamber 3 to cool the processing chamber 3. The heat transfer liquid that has passed through the processing chamber 3 is heated by the heat of the processing chamber 3 and is returned to the evaporator 11 through the heat transfer liquid circulation line 22. The heated heat transfer liquid is cooled by the evaporator 11. In this way, the heat transfer liquid circulates between the processing chamber 3 of the semiconductor manufacturing equipment 2 and the evaporator 11 of the temperature adjustment device 5 to cool the processing chamber 3.

[0025] When the hot gas bypass valve 15 is open, the heat transfer liquid exchanges heat with the refrigerant gas flowing through the evaporator 11. As a result of the heat exchange between the heat transfer liquid and the refrigerant gas, the heat transfer liquid is heated, while the refrigerant gas is cooled. Therefore, when the hot gas bypass valve 15 is open, the heat transfer liquid is heated by the refrigerant gas.

[0026] The heat transfer liquid heated by the evaporator 11 of the temperature adjustment device 5 is guided to the processing chamber 3 of the semiconductor manufacturing equipment 2 through the heat transfer liquid circulation line 22. The heated heat transfer liquid flows through a flow path (not shown) formed in the processing chamber 3, and heats the processing chamber 3. The heat transfer liquid that has passed through the processing chamber 3 loses heat to the processing chamber 3 and is cooled, and is returned to the evaporator 11 through the heat transfer liquid circulation line 22. The cooled heat transfer liquid is heated in the evaporator 11. In this way, the heat transfer liquid circulates between the processing chamber 3 of the semiconductor manufacturing equipment 2 and the evaporator 11 of the temperature adjustment device 5, and heats the processing chamber 3.

[0027] The heat transfer liquid circulation line 22 includes a heat transfer liquid forward piping 23 through which the heat transfer liquid flows from the temperature adjustment device 5 toward the semiconductor manufacturing equipment 2, and a heat transfer liquid return piping 24 through which the heat transfer liquid flows from the semiconductor manufacturing equipment 2 toward the temperature adjustment device 5. In this embodiment, the heat transfer liquid tank 30 is connected to the heat transfer liquid forward piping 23, and the heat transfer liquid cooled or heated by the evaporator 11 is temporarily stored in the heat transfer liquid tank 30. Since the heat transfer liquid tank 30 is connected to the heat transfer liquid forward piping 23, it is possible to send heat transfer liquid at a stable temperature to the semiconductor manufacturing equipment 2.

[0028] The sealed expansion tank 32 is connected to the heat medium liquid return pipe 24. However, the arrangement of the heat medium liquid tank 30 and the sealed expansion tank 32 is not limited to this embodiment, and the heat medium liquid tank 30 and the sealed expansion tank 32 may be connected to either the heat medium liquid forward pipe 23 or the heat medium liquid return pipe 24.

[0029] The heat transfer liquid vapor release prevention device 6 includes a heat transfer liquid pump 26 that pumps the heat transfer liquid to the semiconductor manufacturing equipment 2, and a temperature measuring device 27 that measures the temperature of the heat transfer liquid flowing through the heat transfer liquid circulation line 22. The heat transfer liquid pump 26 and the temperature measuring device 27 are disposed in the heat transfer liquid circulation line 22. In this embodiment, the heat transfer liquid pump 26 and the temperature measuring device 27 are disposed in the heat transfer liquid outbound piping 23.

[0030] The semiconductor manufacturing system 1 further includes a control device 10 that controls the operations of the temperature adjustment device 5 and the heat transfer liquid vapor discharge prevention device 6. The control device 10 is electrically connected to the expansion valve 14 and hot gas bypass valve 15 of the temperature adjustment device 5, and the heat transfer liquid pump 26 and temperature measuring device 27 of the heat transfer liquid vapor discharge prevention device 6. The temperature of the heat transfer liquid flowing through the heat transfer liquid circulation line 22 measured by the temperature measuring device 27 is sent to the control device 10.

[0031] The control device 10 is configured to operate the expansion valve 14 and the hot gas bypass valve 15 based on the temperature of the heat transfer liquid flowing through the heat transfer liquid circulation line 22 to adjust the temperature of the heat transfer liquid flowing through the heat transfer liquid circulation line 22. For example, when the temperature of the heat transfer liquid flowing through the heat transfer liquid circulation line 22 is higher than a set value, the control device 10 opens the expansion valve 14 to cause the temperature adjustment device 5 to cool the heat transfer liquid. When the temperature of the heat transfer liquid flowing through the heat transfer liquid circulation line 22 is lower than a set value, the control device 10 opens the hot gas bypass valve 15 to cause the temperature adjustment device 5 to heat the heat transfer liquid.

[0032] The control device 10 includes a storage device 10a in which a program is stored, and an arithmetic device 10b that executes calculations according to instructions included in the program. The control device 10 is composed of at least one computer. The storage device 10a includes a main storage device such as a random access memory (RAM), and an auxiliary storage device such as a hard disk drive (HDD) or a solid state drive (SSD). Examples of the arithmetic device 10b include a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). However, the specific configuration of the control device 10 is not limited to these examples.

[0033] The sealed expansion tank 32 of this embodiment is a diaphragm-type sealed expansion tank, and includes an expansion tank body 33 and a diaphragm 34 that separates the inside of the expansion tank body 33. The diaphragm 34 is made of an elastic material such as rubber or silicone. The diaphragm 34 is configured to separate the inside of the expansion tank body 33 into a first fluid chamber S1 that communicates with the heat transfer medium liquid circulation line 22 (in this embodiment, the heat transfer medium liquid return pipe 24) and a second fluid chamber S2 on the opposite side of the first fluid chamber S1.

[0034] The insides of the heat transfer medium liquid circulation line 22, the heat transfer medium liquid tank 30, and the sealed expansion tank 32 are sealed (or closed) from the atmosphere and filled with a heat transfer medium liquid. More specifically, the first fluid chamber S1 of the heat transfer medium liquid circulation line 22, the heat transfer medium liquid tank 30, and the sealed expansion tank 32 is filled with the heat transfer medium liquid. The second fluid chamber S2 of the sealed expansion tank 32 is filled with a gas such as nitrogen or air.

[0035] The heat transfer liquid is adjusted by the temperature adjustment device 5 to a temperature appropriate for cooling or heating the processing chamber 3 of the semiconductor manufacturing equipment 2. In one embodiment, the temperature of the heat transfer liquid is adjusted within a range of −20° C. to 80° C. by the temperature adjustment device 5. Since the volume of the heat transfer liquid changes due to fluctuations in its temperature, the volumes of the heat transfer liquid in the heat transfer liquid circulation line 22, the heat transfer liquid tank 30, and the sealed expansion tank 32 change due to fluctuations in temperature.

[0036] The sealed expansion tank 32 is configured to absorb a volume change caused by a temperature change of the heat transfer medium liquid. FIG. 2 is a diagram showing an embodiment of the sealed expansion tank 32 that absorbs a volume change caused by a temperature change of the heat transfer medium liquid. As shown in FIG. 2, when the temperature of the heat transfer medium liquid rises and the volume increases (the heat transfer medium liquid expands), the pressure of the heat transfer medium liquid circulation line 22 (in this embodiment, the heat transfer medium liquid return pipe 24) and the heat transfer medium liquid in the first fluid chamber S1 is applied to the diaphragm 34. Since the diaphragm 34 has elasticity, it deforms in the direction from the first fluid chamber S1 to the second fluid chamber S2, and increases the pressure of the gas in the second fluid chamber S2.

[0037] When the temperature of the heat transfer liquid drops and the volume decreases (the heat transfer liquid contracts), the pressure of the heat transfer liquid in the heat transfer liquid circulation line 22 (in this embodiment, the heat transfer liquid return pipe 24) and the first fluid chamber S1 applied to the diaphragm 34 decreases. The diaphragm 34 deforms in the direction from the second fluid chamber S2 to the first fluid chamber S1, reducing the pressure of the gas in the second fluid chamber S2. In this way, the sealed expansion tank 32 can absorb the volume change caused by the fluctuation in the temperature of the heat transfer liquid by the diaphragm 34 deforming until the pressure of the heat transfer liquid in the first fluid chamber S1 and the pressure of the gas in the second fluid chamber S2 reach an equilibrium state.

[0038] According to this embodiment, the sealed expansion tank 32 absorbs the volume change caused by the temperature fluctuation of the heat transfer liquid, so that it is possible to prevent the heat transfer liquid vapor from being released into the atmosphere while maintaining the pressure inside the heat transfer liquid circulation line 22. In addition, since the total amount of heat transfer liquid circulating through the heat transfer liquid circulation line 22 does not decrease, there is no need to replenish the heat transfer liquid, and costs can be reduced. In addition, the diaphragm type sealed expansion tank 32 is compact (small), so it does not take up much space and the heat transfer liquid vapor release prevention device 6 can be made smaller.

[0039] 3 is a schematic diagram showing another embodiment of the semiconductor manufacturing system 1 including a heat transfer liquid vapor discharge prevention device 6. The configuration and operation of this embodiment that are not specifically described are the same as those of the above-mentioned embodiment, and therefore redundant description will be omitted. The heat transfer liquid vapor discharge prevention device 6 of this embodiment includes a trap device 40 that captures vapor of the heat transfer liquid.

[0040] The trapping device 40 is connected to the heat transfer medium liquid circulation line 22. More specifically, the trapping device 40 is connected to the heat transfer medium liquid forward piping 23 of the heat transfer medium liquid circulation line 22. By connecting the trapping device 40 to the heat transfer medium liquid forward piping 23, it is possible to send heat transfer medium liquid at a stable temperature to the semiconductor manufacturing apparatus 2. However, the arrangement of the trapping device 40 is not limited to this embodiment, and the trapping device 40 may be connected to either the heat transfer medium liquid forward piping 23 or the heat transfer medium liquid return piping 24.

[0041] The trap device 40 includes a heat transfer liquid tank 42 for storing the heat transfer liquid, a trap condenser 44 for condensing the vapor of the heat transfer liquid to generate the heat transfer liquid, a heat transfer liquid vapor transfer line 47 for transferring the vapor of the heat transfer liquid in the heat transfer liquid tank 42 to the trap condenser 44, and a heat transfer liquid recovery line 48 for returning the heat transfer liquid generated in the trap condenser 44 to the heat transfer liquid tank 42. The heat transfer liquid tank 42 is disposed in the heat transfer liquid outward piping 23 of the heat transfer liquid circulation line 22, and the heat transfer liquid cooled or heated in the evaporator 11 is temporarily stored in the heat transfer liquid tank 42.

[0042] The heat transfer medium liquid circulation line 22 and the trap device 40 are sealed (or closed) from the atmosphere. More specifically, the heat transfer medium liquid forward piping 23, the heat transfer medium liquid return piping 24, the heat transfer medium liquid tank 42, the trap condenser 44, the heat transfer medium liquid vapor transfer line 47, and the heat transfer medium liquid recovery line 48 are sealed (or closed) from the atmosphere.

[0043] A portion of the heat transfer liquid in the heat transfer liquid tank 42 evaporates and exists as vapor, and the heat transfer liquid in the heat transfer liquid tank 42 is in a vapor-liquid equilibrium state. One end of the heat transfer liquid vapor transfer line 47 is connected to the heat transfer liquid tank 42, and the other end is connected to the trap condenser 44. The connection portion between the heat transfer liquid vapor transfer line 47 and the heat transfer liquid tank 42 is located higher than the liquid level L1 of the heat transfer liquid in the heat transfer liquid tank 42. The connection portion between the heat transfer liquid vapor transfer line 47 and the trap condenser 44 is located higher than the liquid level L2 of the heat transfer liquid in the trap condenser 44.

[0044] When the temperature of the heat transfer liquid in the heat transfer liquid tank 42 rises and the volume of the heat transfer liquid increases (the heat transfer liquid expands), the vapor of the heat transfer liquid in the heat transfer liquid tank 42 is transferred to the trap condenser 44 through the heat transfer liquid vapor transfer line 47. The trap condenser 44 is provided with a cooling water pipe 45 disposed therein. The cooling water pipe 45 is connected to a cooling water supply source (not shown), and cooling water supplied from the cooling water supply source flows through the cooling water pipe 45. The cooling water may be tap water (city water). The vapor of the heat transfer liquid transferred to the trap condenser 44 is cooled by the cooling water pipe 45 to become a heat transfer liquid (liquid phase) and is stored in the trap condenser 44.

[0045] One end of the heat transfer liquid recovery line 48 is connected to the trap condenser 44, and the other end is connected to the heat transfer liquid tank 42. The connecting portion between the heat transfer liquid recovery line 48 and the trap condenser 44 is located at a position lower than the liquid level L2 of the heat transfer liquid in the trap condenser 44. The connecting portion between the heat transfer liquid recovery line 48 and the heat transfer liquid tank 42 is located at a position lower than the liquid level L1 of the heat transfer liquid in the heat transfer liquid tank 42.

[0046] A heat transfer liquid recovery pump 49 is disposed in the heat transfer liquid recovery line 48, which pumps the heat transfer liquid in the trap condenser 44 to the heat transfer liquid tank 42. The heat transfer liquid in the trap condenser 44 is returned to the heat transfer liquid tank 42 through the heat transfer liquid recovery line 48 by the heat transfer liquid recovery pump 49. However, if the heat transfer liquid in the trap condenser 44 can be returned to the heat transfer liquid tank 42 at the position head, the heat transfer liquid recovery pump 49 does not need to be provided. The heat transfer liquid in the heat transfer liquid tank 42 is pumped by the heat transfer liquid pump 26 and guided to the processing chamber 3 of the semiconductor manufacturing equipment 2 through the heat transfer liquid forward piping 23. The heat transfer liquid recovery pump 49 is electrically connected to the control device 10, and the operation of the heat transfer liquid recovery pump 49 is controlled by the control device 10.

[0047] According to this embodiment, the vapor of the heat transfer liquid in the heat transfer liquid tank 42 is transferred to the trap condenser 44 and condensed, so that it is possible to prevent the vapor of the heat transfer liquid from being released into the atmosphere. Furthermore, according to this embodiment, by recovering the heat transfer liquid produced in the trap condenser 44 in the heat transfer liquid tank 42, the total amount of the heat transfer liquid circulating through the heat transfer liquid circulation line 22 does not decrease, so there is no need to replenish the heat transfer liquid, and it is possible to achieve cost reduction.

[0048] Fig. 4 is a schematic diagram showing yet another embodiment of the semiconductor manufacturing system 1 including a heat transfer liquid vapor release prevention device 6. The configuration and operation of this embodiment that are not particularly described are the same as those of the embodiment described with reference to Fig. 3, so duplicated descriptions will be omitted. The trap device 40 of this embodiment includes a cooling water pipe 50 arranged in the heat transfer liquid tank 42 instead of the trap condenser 44, which condenses the vapor of the heat transfer liquid in the heat transfer liquid tank 42. In this embodiment, the trap device 40 does not include the heat transfer liquid vapor transfer line 47 and the heat transfer liquid recovery line 48.

[0049] The heat transfer liquid tank 42 is disposed in the heat transfer liquid circulation line 22 (specifically, the heat transfer liquid forward piping 23), and the heat transfer liquid cooled or heated in the evaporator 11 is temporarily stored in the heat transfer liquid tank 42. An inlet A for allowing the heat transfer liquid to flow from the heat transfer liquid circulation line 22 (specifically, the heat transfer liquid forward piping 23) into the heat transfer liquid tank 42 is located at a position lower than the liquid level L1 of the heat transfer liquid in the heat transfer liquid tank 42. As a result, the heat transfer liquid supplied to the heat transfer liquid tank 42 flows into the heat transfer liquid in the heat transfer liquid tank 42, so that flash evaporation of the heat transfer liquid in the heat transfer liquid tank 42 can be prevented.

[0050] The heat transfer medium liquid circulation line 22 and the trap device 40 are sealed (or closed) from the atmosphere. More specifically, the heat transfer medium liquid forward piping 23, the heat transfer medium liquid return piping 24, and the heat transfer medium liquid tank 42 are sealed (or closed) from the atmosphere.

[0051] A part of the heat transfer liquid in the heat transfer liquid tank 42 evaporates and exists as vapor, and the heat transfer liquid in the heat transfer liquid tank 42 is in a state of vapor-liquid equilibrium. The cooling water pipe 50 is connected to a cooling water supply source (not shown), and cooling water supplied from the cooling water supply source flows through the cooling water pipe 50. The cooling water pipe 50 is disposed at a position higher than the liquid level L1 of the heat transfer liquid in the heat transfer liquid tank 42.

[0052] The vapor of the heat transfer liquid in the heat transfer liquid tank 42 is cooled by the cooling water pipe 50 to become a heat transfer liquid (liquid phase), and is stored in the heat transfer liquid tank 42. The heat transfer liquid in the heat transfer liquid tank 42 is pumped by the heat transfer liquid pump 26 and guided to the processing chamber 3 of the semiconductor manufacturing equipment 2 through the heat transfer liquid circulation line 22 (specifically, the heat transfer liquid outbound piping 23).

[0053] According to this embodiment, the vapor of the heat transfer liquid in the heat transfer liquid tank 42 is condensed in the heat transfer liquid tank 42 and stored in the heat transfer liquid tank 42 as the heat transfer liquid, so that it is possible to prevent the vapor of the heat transfer liquid from being released into the atmosphere. Furthermore, since the total amount of the heat transfer liquid circulating through the heat transfer liquid circulation line 22 does not decrease, there is no need to replenish the heat transfer liquid, and costs can be reduced. Furthermore, since the cooling water pipe 50 for condensing the vapor of the heat transfer liquid is arranged in the heat transfer liquid tank 42, it is possible to achieve space saving for the trap device 40 as a whole.

[0054] Fig. 5 is a schematic diagram showing yet another embodiment of the semiconductor manufacturing system 1 including a heat transfer liquid vapor release prevention device 6. The configuration and operation of this embodiment that are not particularly described are the same as those of the embodiment described with reference to Fig. 3, so duplicated descriptions will be omitted. The trap device 40 of this embodiment includes an adsorption device 52 having an adsorbent 54 that adsorbs the vapor of the heat transfer liquid, instead of the trap condenser 44. In this embodiment, the trap device 40 does not include a heat transfer liquid recovery line 48.

[0055] The heat transfer medium liquid tank 42 is disposed in the heat transfer medium liquid circulation line 22 (specifically, the heat transfer medium liquid forward piping 23), and the heat transfer medium liquid cooled or heated in the evaporator 11 is temporarily stored in the heat transfer medium liquid tank 42. The heat transfer medium liquid circulation line 22 and the trap device 40 are sealed (or closed) from the atmosphere. More specifically, the heat transfer medium liquid forward piping 23, the heat transfer medium liquid return piping 24, the heat transfer medium liquid tank 42, the adsorption device 52, and the heat transfer medium liquid vapor transfer line 47 are sealed (or closed) from the atmosphere.

[0056] A part of the heat transfer liquid in the heat transfer liquid tank 42 evaporates and exists as vapor, and the heat transfer liquid in the heat transfer liquid tank 42 is in a vapor-liquid equilibrium state. The heat transfer liquid in the heat transfer liquid tank 42 is pumped by the heat transfer liquid pump 26 and guided to the processing chamber 3 of the semiconductor manufacturing equipment 2 through the heat transfer liquid outbound piping 23.

[0057] One end of the heat transfer medium liquid vapor transfer line 47 is connected to the heat transfer medium liquid tank 42, and the other end is connected to the adsorption device 52. The connection portion between the heat transfer medium liquid vapor transfer line 47 and the heat transfer medium liquid tank 42 is located at a position higher than the liquid level L1 of the heat transfer medium liquid in the heat transfer medium liquid tank 42. The connection portion between the heat transfer medium liquid vapor transfer line 47 and the adsorption device 52 is located at the bottom of the adsorption device 52.

[0058] When the temperature of the heat transfer liquid in the heat transfer liquid tank 42 rises and the volume of the heat transfer liquid increases (the heat transfer liquid expands), the vapor of the heat transfer liquid in the heat transfer liquid tank 42 is transferred to the adsorption device 52 through the heat transfer liquid vapor transfer line 47. The adsorption device 52 includes an adsorption tank 53 and an adsorbent 54 accommodated inside the adsorption tank 53. The heat transfer liquid vapor transfer line 47 communicates with the inside of the adsorption tank 53, i.e., the adsorbent 54. In this embodiment, the adsorption tank 53 and the adsorbent 54 have a cylindrical shape, but the shapes of the adsorption tank 53 and the adsorbent 54 are not limited to this embodiment.

[0059] The heat transfer liquid vapor transferred to the adsorption device 52 flows into the adsorption tank 53. The adsorbent 54 is configured to adsorb the heat transfer liquid vapor. The heat transfer liquid vapor flowing into the adsorption tank 53 is adsorbed by the adsorbent 54 and remains in the adsorbent 54. In this embodiment, the adsorbent 54 is activated carbon. Since activated carbon has an extremely high adsorption capacity, it can adsorb a large amount of heat transfer liquid vapor per unit volume, and the volume of the adsorption device 52 can be reduced. However, the adsorbent 54 is not limited to this embodiment, and may be another type of adsorbent such as zeolite.

[0060] According to this embodiment, the vapor of the heat transfer liquid in the heat transfer liquid tank 42 is transferred to the adsorption device 52 and adsorbed by the adsorbent 54, so that the vapor of the heat transfer liquid can be prevented from being released into the atmosphere.

[0061] An opening 53a is formed in the upper part of the adsorption tank 53, and a seal member 55 is fitted into the opening 53a. The seal member 55 is a member for sealing the adsorption tank 53. By removing the seal member 55 from the opening 53a, the adsorbent 54 can be taken out of the adsorption tank 53 through the opening 53a.

[0062] The adsorbent 54 removed from the adsorption tank 53 is subjected to a process of recovering the heat transfer liquid adsorbed by the adsorbent 54 in a heat transfer liquid recovery device (not shown). For example, the heat transfer liquid recovery device includes a heater (not shown) that heats the adsorbent 54 and causes the heat transfer liquid adsorbed by the adsorbent 54 to separate as vapor, and a condensation tank (not shown) that condenses the vapor of the heat transfer liquid separated from the adsorbent 54 and recovers it as heat transfer liquid.

[0063] In one embodiment, the heat transfer liquid recovered in the condensation tank of the heat transfer liquid recovery device may be returned to the heat transfer liquid circulation line 22 or the heat transfer liquid tank 42 and reused as the heat transfer liquid for heat exchange in the semiconductor manufacturing equipment 2. This makes it possible to reduce the cost of the heat transfer liquid.

[0064] The above-described embodiments have been described for the purpose of enabling a person having ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments are naturally possible for a person skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope according to the technical idea defined by the claims. [Explanation of symbols]

[0065] 1. Semiconductor manufacturing systems 2. Semiconductor manufacturing equipment 3 Processing chamber 5 Temperature control device 6. Heat transfer liquid vapor release prevention device 10 Control device 10a storage device 10b Arithmetic unit 11 Evaporator 12 Compressor 13 Condenser 14 Expansion valve 15 Hot gas bypass valve 17 Refrigerant piping 18 Hot gas bypass piping 20 Coolant Circulation Line 22 Heat transfer fluid circulation line 23 Heat transfer fluid inflow piping 24 Heat transfer medium return piping 26 Heat transfer fluid pump 27 Temperature measuring device 30 Heat transfer fluid tank 32 Closed expansion tank 33 Expansion tank body 34 Diaphragm 40 Trap Device 42 Heat transfer fluid tank 44 Trap condenser 45 Cooling water pipe 47 Heat transfer medium liquid vapor transfer line 48 Heat transfer fluid recovery line 49 Heat transfer fluid recovery pump 50 Cooling water pipe 52 Adsorption device 53 Adsorption Tank 53a opening 54 Adsorbent 55 Sealing material S1 First fluid chamber S2 Second fluid chamber

Claims

1. A heat transfer liquid vapor release prevention device that prevents vapor of a heat transfer liquid for heat exchange in a semiconductor manufacturing device from being released into the atmosphere, comprising: a heat transfer medium circulation line for circulating the heat transfer medium liquid between the semiconductor manufacturing equipment and a temperature control device for controlling a temperature of the heat transfer medium liquid; a sealed expansion tank connected to the heat transfer liquid circulation line and configured to absorb a volume change caused by a temperature change of the heat transfer liquid; the heat transfer liquid circulation line and the inside of the closed expansion tank are filled with the heat transfer liquid.

2. The heat transfer medium liquid vapor leakage prevention device according to claim 1 , wherein the sealed expansion tank is a diaphragm type sealed expansion tank.

3. A heat transfer liquid vapor release prevention device that prevents vapor of a heat transfer liquid for heat exchange in a semiconductor manufacturing device from being released into the atmosphere, comprising: a heat transfer medium circulation line for circulating the heat transfer medium liquid between the semiconductor manufacturing equipment and a temperature control device for controlling a temperature of the heat transfer medium liquid; a heat transfer liquid vapor release prevention device comprising a trap device connected to the heat transfer liquid circulation line for trapping vapor of the heat transfer liquid;

4. The trapping device comprises: a heat transfer medium tank for storing the heat transfer medium; a heat transfer medium liquid vapor transfer line for transferring the vapor in the heat transfer medium liquid tank; a trap condenser connected to the heat transfer liquid vapor transfer line for condensing the vapor to produce the heat transfer liquid; 4. The heat transfer liquid vapor leakage prevention device according to claim 3, further comprising a heat transfer liquid recovery line for returning the heat transfer liquid produced in the trap condenser to the heat transfer liquid tank.

5. The heat transfer medium liquid circulation line is a heat transfer medium liquid outgoing pipe through which the heat transfer medium liquid flows from the temperature adjustment device toward the semiconductor manufacturing device; a heat transfer medium return pipe through which the heat transfer medium flows from the semiconductor manufacturing apparatus toward the temperature adjustment apparatus, The heat transfer liquid vapor discharge prevention device according to claim 4 , wherein the trap device is connected to the heat transfer liquid inlet pipe.

6. The trapping device comprises: a heat transfer medium tank for storing the heat transfer medium; 4. The heat transfer liquid vapor leakage prevention device according to claim 3, further comprising a cooling water pipe arranged in said heat transfer liquid tank for condensing said vapor in said heat transfer liquid tank.

7. The heat transfer medium liquid circulation line is a heat transfer medium liquid outgoing pipe through which the heat transfer medium liquid flows from the temperature adjustment device toward the semiconductor manufacturing device; a heat transfer medium return pipe through which the heat transfer medium flows from the semiconductor manufacturing apparatus toward the temperature adjustment apparatus, The heat transfer liquid vapor discharge prevention device according to claim 6 , wherein the trap device is connected to the heat transfer liquid inlet pipe.

8. 8. The heat transfer liquid vapor discharge prevention device according to claim 6, wherein an inlet for flowing the heat transfer liquid from the heat transfer liquid circulation line into the heat transfer liquid tank is located at a position lower than a liquid level of the heat transfer liquid in the heat transfer liquid tank.

9. The trapping device comprises: a heat transfer medium tank for storing the heat transfer medium; a heat transfer medium liquid vapor transfer line for transferring the vapor in the heat transfer medium liquid tank; 4. The heat transfer medium liquid vapor leakage prevention device according to claim 3, further comprising an adsorption device connected to the heat transfer medium liquid vapor transfer line and having an adsorbent for adsorbing the vapor.

10. The heat transfer medium liquid circulation line is a heat transfer medium liquid outgoing pipe through which the heat transfer medium liquid flows from the temperature adjustment device toward the semiconductor manufacturing device; a heat transfer medium return pipe through which the heat transfer medium flows from the semiconductor manufacturing apparatus toward the temperature adjustment apparatus, The heat transfer liquid vapor discharge prevention device according to claim 9 , wherein the trap device is connected to the heat transfer liquid inlet pipe.

11. The heat transfer liquid vapor leakage prevention device according to claim 9 or 10, wherein the adsorbent is activated carbon.

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