Light-emitting device

Abstract

To provide a light-emitting device of which an outgoing position of light emitted from a plurality of light-emitting elements is mounted with high accuracy.SOLUTION: A light-emitting device comprises: a lens member that has a lens surface; a plurality of light-emitting elements containing a first light-emitting element that includes a light-emitting peak to a first wavelength from a first light-emitting point and a second light-emitting element that includes a light-emitting peak from a second light-emitting point arranged to a position where is far from the lens member from a first flat surface passing through the first light-emitting point in a plan surface that is vertical to an optical shaft of the lens surface to a second wavelength that is different from the first wavelength; and a submount in which the plurality of light-emitting elements is arranged. An outer edge of an upper surface of the submount passes a first flat surface, a second flat surface passing through the second light-emitting point that is a plan surface vertical to the optical shaft of the lens surface, and a point is inside an area that is surrounded by a first straight line passing through the first light-emitting point in parallel to the optical shaft of the lens surface, and a second straight line passing through the second light-emitting point in parallel to the optical shaft of the lens surface, and is far from the lens member from the first flat surface, and is near from the lens member from the second surface. A first light and a second light pass the lens surface.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a light emitting device. [Background technology]

[0002] Conventionally, there are light emitting devices in which a plurality of components are mounted in a package. The plurality of components include, for example, a plurality of light emitting elements. In addition to the light emitting elements, for example, a Zener diode, a thermistor, or a photodiode may also be included.

[0003] For example, Patent Document 1 discloses a light emitting device including a submount, a plurality of laser diodes arranged on the upper surface of the submount, and a single collimator lens that collimates the laser light emitted from each of the plurality of laser diodes. By mounting a plurality of light emitting elements in a package, a small light emitting device can be realized. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2017-147420 A Summary of the Invention [Problem to be solved by the invention]

[0005] A light emitting device in which the emission positions of light emitted from a plurality of light emitting elements are mounted with high precision is provided. [Means for solving the problem]

[0006] In an exemplary but non-limiting embodiment, a light emitting device of the present disclosure includes a lens member having at least one lens surface; a plurality of light emitting elements including a first light emitting element that emits a first light having an emission peak at a first wavelength from a first light emitting point; and a second light emitting element that emits a second light having an emission peak at a second wavelength different from the first wavelength from a second light emitting point that is disposed at a position farther from the lens member than a first plane that is perpendicular to an optical axis of the at least one lens surface and passes through the first light emitting point; and a submount having an upper surface on which the plurality of light emitting elements are arranged side by side, In a top view seen from the normal direction of the top surface of the submount, the outer edge of the top surface passes through a point farther from the lens member than the first plane and closer to the lens member than the second plane, inside an area surrounded by the first plane, a second plane that is a plane perpendicular to the optical axis of the at least one lens surface and passes through the second light-emitting point, a first straight line that is parallel to the optical axis of the at least one lens surface and passes through the first light-emitting point, and a second straight line that is parallel to the optical axis of the at least one lens surface and passes through the second light-emitting point, and the first light and the second light pass through the at least one lens surface. Effect of the Invention

[0007] According to the light emitting device of the present disclosure, it is possible to provide a light emitting device in which the emission positions of light emitted from a plurality of light emitting elements are precisely implemented. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of a light emitting device according to the present embodiment. [Diagram 2] FIG. 2 is a top view of the light emitting device according to this embodiment with the package cap removed. [Diagram 3] FIG. 3 is a top view of the substrate of the light emitting device according to this embodiment. [Figure 4] 4 is a cross-sectional view of the light emitting device taken along the line IV-IV in FIG. [Diagram 5] FIG. 5 is an enlarged top view of the inside of the package of the light emitting device according to this embodiment. [Figure 6] FIG. 6 is an enlarged view of the upper surface of the submount on which three light emitting elements are arranged. [Figure 7] FIG. 7 is an enlarged plan view of the side on which the light emission surfaces of the three light emitting elements are located. [Figure 8] FIG. 8 is an enlarged view of the upper surface of the submount on which two light emitting elements are arranged. [Figure 9] FIG. 9 is an enlarged plan view of the side where the light emission surfaces of the two light emitting elements are located. [Figure 10] FIG. 10 is a schematic diagram showing how the plate-shaped submount substrate is cut in an oblique direction. [Figure 11A] FIG. 11A is a top view of the submount 30_1 according to the present embodiment. [Figure 11B] FIG. 11B is a perspective view of the submount 30_2 according to this embodiment. [Figure 11C] FIG. 11C is a top view of the submount 30_3 according to this embodiment. [Figure 12] FIG. 12 is a top view of a light emitting device according to a modified example of this embodiment with the cap of the package removed. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] In this specification and claims, polygons such as triangles and quadrangles are not limited to polygons in the strict mathematical sense, but also include shapes in which the corners of the polygon have been processed, such as rounded corners, chamfered corners, or rounded corners. In addition, shapes in which processing has been applied to the middle part of a side, not just the corners (edges) of a polygon, are also referred to as polygons. In other words, shapes in which partial processing has been applied while leaving the polygon as the base are included in the "polygon" described in this specification and claims.

[0010] This is not limited to polygons, but also applies to words that describe specific shapes such as trapezoids, circles, and irregular shapes. The same is true when dealing with each side that forms the shape. In other words, even if the corners or middle part of a side have been processed, the "side" includes the processed part. When distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" should be added, for example, "strict quadrangle."

[0011] In this specification or claims, when there are multiple elements identified by a certain name and each element is to be expressed separately, an ordinal number such as "first" or "second" may be added to the beginning of each element. For example, if a claim states that "light-emitting elements are arranged on a substrate," the specification may state that "a first light-emitting element and a second light-emitting element are arranged on a substrate." The ordinal numbers "first" and "second" are used simply to distinguish between two light-emitting elements. The order of these ordinal numbers has no particular meaning. Element names with the same ordinal number may not refer to the same element between the specification and the claims. For example, when elements specified by the terms "first light-emitting element", "second light-emitting element", and "third light-emitting element" are described in the specification, the "first light-emitting element" and "second light-emitting element" in the claims may correspond to the "first light-emitting element" and "third light-emitting element" in the specification. In addition, when the term "first light-emitting element" is used but the term "second light-emitting element" is not used in claim 1 described in the claims, the invention according to claim 1 may be provided with one light-emitting element, and the light-emitting element is not limited to the "first light-emitting element" in the specification, but may be the "second light-emitting element" or the "third light-emitting element".

[0012] In this specification or claims, terms indicating a specific direction or position (e.g., "upper", "lower", "right", "left", "front", "rear" and other terms including these terms) may be used. These terms are used merely for the purpose of making it easier to understand the relative direction or position in the referenced drawings. As long as the relationship of the relative direction or position by terms such as "upper" and "lower" in the referenced drawings is the same, the drawings other than this disclosure, the actual product, the manufacturing device, etc. may not be arranged in the same manner as in the referenced drawings.

[0013] The dimensions, dimensional ratios, shapes, arrangement intervals, etc. of elements or members shown in the drawings may be exaggerated for clarity. In addition, in order to avoid the drawings becoming excessively complicated, some elements may be omitted from the illustration.

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Although the embodiment embodies the technical idea of ​​the present invention, it does not limit the present invention. The numerical values, shapes, materials, steps, and the order of the steps shown in the description of the embodiment are merely examples, and various modifications are possible as long as no technical contradiction occurs. In the following description, elements identified by the same name and symbol are the same or similar elements, and duplicate descriptions of those elements may be omitted.

[0015] A light emitting device 100 according to the present embodiment will be described. FIGS. 1 to 5 are drawings for explaining an exemplary embodiment of the light emitting device 100. FIG. 1 is a perspective view of the light emitting device 100 according to the present embodiment. FIG. 2 is a top view of the light emitting device 100 with the cap 16 of the package 10 removed. FIG. 3 is a top view of the substrate 90. FIG. 4 is a cross-sectional view taken along the IV-IV cross-sectional line in FIG. 1. FIG. 5 is an enlarged top view of the inside of the package 10. In FIGS. 4 and 5, the laser light LB emitted from the light emitting element 20 is indicated by a dotted arrow. For convenience of explanation, 1D and 2D arrows in a two-dimensional plane are indicated in the attached drawings. The 2D arrow indicates a direction parallel to the direction in which the optical axis L of the lens member 80 extends, and the 1D arrow indicates a direction perpendicular to the direction of the 2D arrow.

[0016] The light emitting device 100 of this embodiment comprises multiple components including a package 10, multiple light emitting elements 20, one or multiple submounts 30, one or multiple protection elements 60A, a temperature measurement element 60B, one or multiple wirings 70, a lens member 80, and a substrate 90.

[0017] In the illustrated example of the light emitting device 100, three light emitting elements 20, one submount 30, three protective elements 60A, a temperature measuring element 60B, and a plurality of wirings 70 are arranged in the space inside the package 10. Moreover, the divergent light emitted from the three light emitting elements 20 is laterally emitted to the outside from the package 10, and then collimated by the lens member 80.

[0018] First, each component will be described.

[0019] (Package 10) The package 10 has a base 11 including a mounting surface 11M, and a sidewall 12 surrounding the mounting surface 11M. The mounting surface 11M of the base 11 is an area on which other components are arranged. The package 10 also has a substrate 15 and a cap 16 fixed to the substrate 15. The substrate 15 has the base 11, and the cap 16 has the sidewall 12. In the following description, the substrate 15 and the substrate 90 may be referred to as a first substrate 15 and a second substrate 90, respectively, to distinguish them from each other.

[0020] In the illustrated example, cap 16 includes an upper surface portion (lid portion) facing mounting surface 11M with other components arranged on mounting surface 11M sandwiched therebetween, and a side surface portion (frame portion) surrounding the other components arranged on mounting surface 11M. The side surface portion of cap 16 includes side wall portion 12. Note that side wall portion 12 does not have to be configured as a part of cap 16. For example, package 10 can be replaced with a package configured of one member in which base portion 11 and side wall portion 12 are integrated, and another member having an upper surface portion.

[0021] When viewed from above in the normal direction of the mounting surface 11M of the base 11, the outside of the base 11 and the cap 16 The shapes of all of these are rectangular. However, none of these external shapes need to be rectangular, and they may be polygonal shapes other than quadrangles, or shapes that include curves, bends, or irregularities in part or in whole.

[0022] The base 11 has one or more upper surfaces. The one or more upper surfaces of the base 11 include a mounting surface 11M. The one or more upper surfaces of the base 11 include an upper surface having a peripheral area 11P that surrounds one or more components arranged on the mounting surface 11M. In the example of the light emitting device 100 shown in the figure, the mounting surface 11M and the upper surface having the peripheral area 11P are the same. Note that the mounting surface 11M and the peripheral area 11P do not have to be on the same plane, and for example, the mounting surface 11M and the peripheral area 11P may be provided on different upper surfaces having a height difference.

[0023] The peripheral region 11P is a region to which the cap 16 is bonded. In a top view, the peripheral region 11P is provided between the outline of the base 11 and an arrangement region for arranging a plurality of components on the mounting surface 11M. In the illustrated example of the light emitting device 100, the arrangement region of the mounting surface 11M is approximately rectangular in top view, and the peripheral region 11P is provided in a rectangular ring shape surrounding the arrangement region. The lower surface of the side portion of the cap 16 is bonded to the upper surface of the peripheral region 11P. A metal film for bonding with the cap 16 may be provided in the peripheral region 11P.

[0024] 4, the package 10 has a light-transmitting region 13 which is a region having light-transmitting properties. The package 10 also has a light-extraction surface 10A which includes the light-transmitting region 13. This light-extraction surface 10A is included in one of one or more outer surfaces of the side wall portion 12 of the package 10. Note that having light-transmitting properties means a property in which the transmittance of the main light incident thereon is 80% or more.

[0025] The package 10 may have translucency in one or more outer surfaces other than the translucent region 13. The package 10 may also have a non-translucent region (a region that does not have translucency) in part. The entire side wall 12 of the package 10 does not need to be translucent. In the illustrated example, the package 10 has four outer surfaces according to a rectangle, and all four surfaces are translucent, but only one surface is the light extraction surface 10A.

[0026] The cap 16 may be entirely made of a light-transmitting material, or only the side surface may be made of a light-transmitting material. A portion including the light extraction surface 10A may be made of a first light-transmitting material, and the other portion may be made of a second light-transmitting material or a non-light-transmitting material.

[0027] The cap 16 may be formed by integrally forming an upper surface portion and a side surface portion. For example, the cap 16 having a desired shape, such as a box-like shape, can be produced from a light-transmitting material such as glass, plastic, or quartz by using a processing technique such as molding or etching. The cap 16 may be formed by joining an upper surface portion (lid portion) and a side surface portion (frame portion) formed separately using different materials as main materials. For example, the upper surface portion may be mainly made of monocrystalline or polycrystalline silicon, and the side surface portion may be mainly made of glass. The cap 16 may have, for example, a height of 0.6 mm or more and 2.5 mm or less, and a length of one side of the rectangular shape in a top view of 1.2 mm or more and 8 mm or less. Also, for example, the height may be 2 mm or less, and a length of one side of the rectangular shape in a top view of 4 mm or less.

[0028] In the illustrated example of the light emitting device 100, the light extraction surface 10A is perpendicular to the direction in which the mounting surface 11M extends. Note that the perpendicular here includes a difference of ±5 degrees or less. Also, the light extraction surface 10A does not need to be perpendicular to the direction in which the mounting surface 11M of the base 11 extends, and may be inclined.

[0029] A plurality of wiring areas 14 are provided on the mounting surface 11M. In FIG. Instead of giving reference numbers to each of the wiring regions 14, all of the wiring regions 14 are hatched in the same manner. The multiple wiring regions 14 can be electrically connected to a wiring region provided on the lower surface of the base 11 through via holes passing through the inside of the base 11. The wiring region electrically connected to the wiring region 14 is not limited to the lower surface of the base 11, but can be provided on another outer surface (upper surface or outer side surface) of the base 11 as long as it is outside the placement area of ​​the mounting surface 11M. The multiple wiring regions 14 can be a patterned film or layer formed from a conductor such as a metal.

[0030] The multiple wiring regions 14 may include, when viewed from above, one or more wiring regions 14 provided on one side of the placement area of ​​the mounting surface 11M, sandwiching a central region therebetween, and one or more wiring regions 14 provided on the other side in the opposite direction to the one side.

[0031] In addition, the multiple wiring regions 14 may include multiple wiring regions 14 that are arranged side by side with gaps in one direction when viewed from above, and multiple wiring regions 14 that are arranged side by side with gaps in a direction perpendicular to the one direction.

[0032] Furthermore, the multiple wiring regions 14 may include multiple sets of wiring regions 14, with two wiring regions 14 that form a pair being considered as one set. The two wiring regions 14 that form one set are electrically connected to one component and are used to receive power supply from outside the package 10. In the example of Fig. 5, the pair of wiring regions 14 electrically connected to the protection element 60A is arranged in the direction of the 2D arrow, and the pair of wiring regions 14 electrically connected to the temperature measurement element 60B is arranged in the direction of the 1D arrow perpendicular to the 2D direction.

[0033] In addition, the multiple wiring regions 14 may include one or more sets of wiring regions 14 arranged side by side in one direction when viewed from above, and one or more sets of wiring regions 14 arranged side by side in a direction perpendicular to the one direction.

[0034] In addition, when viewed from above, one or more sets of wiring areas 14 arranged side by side in one direction and one or more sets of wiring areas 14 arranged side by side in a direction perpendicular to the one direction may be provided on one side of a central area in the placement area of ​​the mounting surface 11M.

[0035] The first substrate 15 can be formed mainly from ceramic. Examples of ceramics used for the first substrate 15 include aluminum nitride, silicon nitride, aluminum oxide, silicon carbide, and the like.

[0036] In this embodiment, the first substrate 15 may be formed of, for example, a ceramic substrate having a plurality of metal vias therein. The first substrate 15 preferably includes a material having better heat dissipation properties than ceramic (a material having a high thermal conductivity) in a portion that is in thermal contact with a heat-generating component. Examples of such materials may include copper, aluminum, iron, copper molybdenum, copper tungsten, and a copper-diamond composite material.

[0037] (Light emitting element 20) An example of the light-emitting element 20 is a semiconductor laser element. The light-emitting element 20 may have a rectangular outer shape when viewed from above. When the light-emitting element 20 is an edge-emitting semiconductor laser element, a side surface intersecting one of the two short sides of the rectangle is a light-emitting end surface (light-emitting surface 21). In this example, the upper and lower surfaces of the light-emitting element 20 have areas larger than that of the light-emitting surface 21.

[0038] The light emitting element 20 in this embodiment is a single emitter having one emitter. The light emitting element 20 may be a multi-emitter having two or more emitters. When the light emitting element 20 is a semiconductor laser element having multiple emitters, one common electrode is provided on one of the upper and lower surfaces of the light emitting element 20, and electrodes corresponding to each emitter are provided on the other surface. It is possible.

[0039] The light emitted from the light emitting surface 21 of the light emitting element 20 is divergent light having a spread. However, it does not have to be divergent light. When a semiconductor laser element is used for the light emitting element 20, the divergent light (laser light) emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emitting surface 21. The FFP refers to the shape and light intensity distribution of the emitted light at a position away from the light emitting surface.

[0040] The light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the light intensity distribution of the FFP, is called the light traveling along the optical axis. Also, the optical path of the light traveling along the optical axis is called the optical axis of that light. Also, in the light intensity distribution of the FFP, the light with a 1 / e2 Light having an intensity equal to or greater than this will be referred to as the "major portion" of light.

[0041] In the elliptical shape of the FFP of light emitted from the light emitting element 20, which is a semiconductor laser element, the short axis direction of the ellipse is the parallel direction of the FFP, and the long axis direction is the vertical direction of the FFP. A plurality of layers including an active layer that constitute the semiconductor laser element are stacked in the vertical direction of the FFP.

[0042] Based on the light intensity distribution of the FFP, the angle equivalent to the full width at half maximum of the light intensity distribution is defined as the light divergence angle of the semiconductor laser element. The light divergence angle in the direction perpendicular to the FFP is called the perpendicular divergence angle, and the light divergence angle in the direction parallel to the FFP is called the parallel divergence angle.

[0043] For example, a semiconductor laser element that emits blue light, a semiconductor laser element that emits green light, or a semiconductor laser element that emits red light can be used as the light emitting element 20. Also, a semiconductor laser element that emits light other than these may be used.

[0044] Here, blue light refers to light whose emission peak wavelength is in the range of 420nm to 494nm, green light refers to light whose emission peak wavelength is in the range of 495nm to 570nm, and red light refers to light whose emission peak wavelength is in the range of 605nm to 750nm.

[0045] Examples of semiconductor laser elements that emit blue light or green light include semiconductor laser elements that include nitride semiconductors. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. Examples of semiconductor laser elements that emit red light include those that include InAlGaP, GaInP, GaAs, and AlGaAs semiconductors.

[0046] (Submount 30) An example of the shape of the submount 30 in this embodiment is a hexahedron. The submount 30 has an upper surface 30M on which other components can be arranged, and a lower surface located opposite to the upper surface 30M. The upper surface 30M and the lower surface can each function as a bonding surface. The distance between the upper surface 30M and the lower surface, that is, the thickness of the submount, is shorter than the distance between the other two opposing surfaces. In a top view seen from the normal direction of the upper surface 30M of the submount 30, the shape of the outer edge of the upper surface 30M of the submount 30 is, for example, a parallelogram. However, as will be described later, the shape of the outer edge is not limited to a parallelogram. The submount 30 can be formed using, for example, aluminum nitride or silicon carbide. A metal film for bonding is provided on the bonding surface, which is the upper surface 30M or the lower surface.

[0047] The upper surface 30M of the submount 30 is provided with a plurality of wiring regions electrically connected to other components. 5, instead of labeling all the wiring areas 31 with reference numbers, all the wiring areas 31 are hatched in the same manner.

[0048] (Protection element 60A) The protective element 60A is a circuit element for preventing an excessive current from flowing through a specific element (for example, the light emitting element 20) and causing the element to be destroyed. A typical example of the protective element 60A is a constant voltage diode such as a Zener diode. A Si diode can be used as the Zener diode.

[0049] (Temperature measuring element 60B) The temperature measuring element 60B is an element used as a temperature sensor for measuring the surrounding temperature. For example, a thermistor can be used as the temperature measuring element 60B.

[0050] (Wiring 70) The wiring 70 is composed of a conductor having a linear shape with joints at both ends. In other words, the wiring 70 has joints at both ends of the linear portion that are joined to other components. The wiring 70 is, for example, a metal wire. Examples of metals include gold, aluminum, silver, copper, etc.

[0051] (Lens member 80) The lens member 80 is formed with at least one lens surface, that is, one or more lens surfaces. The lens member 80 collimates the incident light. For example, the one or more lens surfaces are designed to receive light diverging from a focal position, convert the diverging light into collimated light by refraction, and emit the collimated light from the lens member 80. The lens surface is spherical or aspherical. A lens surface is formed on the light incident side surface and / or the light exit side surface of the lens member 80. An optical film such as an anti-reflection film or a protective film may be provided on the light incident side surface and / or the light exit side surface of the lens member 80. In the example of the lens member 80 shown in FIG. 2, a concave lens surface 80A is formed on the light incident side, and a convex lens surface 80B is formed on the light exit side. Note that multiple lens surfaces may be formed on the light incident side surface, and the lens member 80 may form one or more lens surfaces on the light incident side surface. Furthermore, a plurality of lens surfaces may be formed on the surface on the light-emitting side, and the lens member 80 may have one or a plurality of lens surfaces formed on the surface on the light-emitting side.

[0052] The lens member 80 may be formed from a light-transmitting material, such as glass or plastic. The shape of the portion of the lens member 80 through which light does not transmit may be arbitrary, but it is preferable that the lens member 80 has a shape that allows it to be fixed to other components. In the example of the lens member 80 shown in FIG. 2, the optical axis L and the lower surface of the lens member 80 are parallel. In addition, the lower surface of the lens member 80 has a flat region that can function as a bonding region.

[0053] (Second substrate 90) In the example shown in Fig. 3, the second substrate 90 has a plurality of wiring regions 96. In Fig. 3, the wiring regions 96 provided on the second substrate 90 are shown with similar hatching. The wiring regions 96 of the second substrate 90 are electrically connected to a wiring region provided on the lower surface of the second substrate 90. The wiring region electrically connected to the wiring region 96 is not limited to the lower surface of the second substrate 90, and may be provided on other outer surfaces (upper surface and outer side surfaces) of the second substrate 90.

[0054] The second substrate 90 may be formed mainly from ceramic. Examples of ceramics that may be used for the second substrate 90 include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.

[0055] The second substrate 90 preferably includes a portion formed of a material having better heat dissipation properties (a material having a high thermal conductivity) than ceramic. In the example of the second substrate 90 shown in FIG. 3, the second substrate 90 has a thermally conductive member 97 embedded therein. The thermally conductive member 97 fills an opening penetrating from the upper surface to the lower surface of the second substrate 90. The thermally conductive member 97 is provided in a region facing the lower surface of the first substrate 15. The thermally conductive member 97 may be formed of, for example, copper, aluminum, iron, copper molybdenum, copper tungsten, or a copper-diamond composite material. The thermally conductive member 97 may have any shape. In the example of the second substrate 90 shown in FIG. 3, the thermally conductive member 97 is disposed in a central region sandwiched between a group of a plurality of wiring regions 96 arranged in two groups, upper and lower, in FIG. 3.

[0056] The second substrate 90 has a structure that can support the components of the light emitting device 100 and can be electrically connected to electronic components included in these components. The second substrate 90 may support elements other than the components of the light emitting device 100, such as electronic components or optical components.

[0057] (Light emitting device 100) Next, the light emitting device 100 will be described.

[0058] In the example of the light emitting device 100 described below, each of the plurality of light emitting elements 20 is an edge-emitting semiconductor laser element (laser diode).

[0059] In the light emitting device 100, a plurality of light emitting elements 20 are disposed inside the package 10. The plurality of light emitting elements 20 are disposed on the mounting surface 11M of the first substrate 15 and are surrounded by the sidewall portion 12 of the package 10. Each light emitting element 20 is disposed on the mounting surface 11M via a submount 30.

[0060] The multiple light emitting elements 20 are arranged so that their emission end faces face the light extraction surface 10A of the package 10. The multiple light emitting elements 20 are also arranged in a central region of the mounting surface 11M. In addition, when viewed from above, one or more wiring regions 14 provided on one side and the opposite side of this central region do not overlap with the optical path of light emitted from the light emitting elements 20 toward the light extraction surface 10A.

[0061] In the light emitting device 100, one or more protective elements 60A are disposed inside the package 10. One or more protective elements 60A are disposed on the mounting surface 11M. The protective element 60A is disposed on one or two wiring regions 14. The protective element 60A is also electrically connected to the two wiring regions 14. In the illustrated example of the light emitting device 100, the protective element 60A is disposed on each of the wiring regions 14 so as to straddle the two wiring regions 14.

[0062] In addition, the protection element 60A is disposed at a position closer to the peripheral region 11P of the package 10 than the submount 30. Therefore, the distance from the protection element 60A to the sidewall portion 12 is shorter than the distance from the protection element 60A to the submount 30.

[0063] The protective element 60A is disposed to protect the light emitting element 20. In the light emitting device 100, one protective element is provided for one light emitting element 20. That is, the same number of protective elements 60A as the number of light emitting elements 20 are disposed.

[0064] 5, three protection elements 60A corresponding to the three light-emitting elements 20, respectively, are disposed on the mounting surface 11M of the base 11. More specifically, the protection elements 60A are mounted on a pair of wiring regions 14 provided on the mounting surface 11M of the base 11. The anode of the protection element 60A is electrically connected to one of the pair of wiring regions 14, and the cathode of the protection element 60A is electrically connected to the other of the pair of wiring regions 14.

[0065] One of the p-side electrode and the n-side electrode of the light-emitting element 20 is electrically connected to the wiring region 31 provided on the upper surface 30M of the submount 30. One end of the wiring 70 is joined to the wiring region 31, and the other end of the wiring 70 is joined to one of a pair of wiring regions 14 provided on the mounting surface 11M of the base 11. In addition, one end of another wiring 70 is joined to the other of the p-side electrode and the n-side electrode of the light-emitting element 20, and the other end of the other wiring 70 is joined to the other of the pair of wiring regions 14 provided on the mounting surface 11M of the base 11. According to this example of the electrical connection relationship, the protection element 60A can be connected in parallel to the light-emitting element 20.

[0066] The distance from the position where the wiring 70 for electrically connecting the light emitting element 20 is joined to the wiring region 14 to the light emitting element 20 is shorter than the distance from the protective element 60A electrically connected to the wiring region 14 to the light emitting element 20. In addition, in a top view, the distance from the outer edge of the wiring region 14 to the protective element 60A arranged in the wiring region 14 is shorter than the distance from the outer edge of the wiring region 14 to the wiring 70 joined to the wiring region 14. In this way, the protective element 60A can be arranged in a position close to the side wall portion 12, and the package 10 can be made smaller.

[0067] The structure of the submount 30 and the arrangement of the multiple light emitting elements 20 in this embodiment will be described in more detail with reference to FIGS. 6 to 11C.

[0068] Fig. 6 is an enlarged view of the upper surface 30M of the submount 30 on which the three light-emitting elements 20 are arranged. Fig. 7 is an enlarged plan view of the outer edge of the submount 30 on the side where the light emission surfaces 21 of the three light-emitting elements 20 are located.

[0069] In the illustrated example, the multiple light-emitting elements 20 are arranged side by side with the light emitting surfaces 21 facing the same direction. The multiple light-emitting elements 20 can be arranged side by side with the light emitting surfaces 21 parallel to each other. Light emitted from the light emitting surfaces 21 of the multiple light-emitting elements 20 travels toward the side surface of the package 10 having the light extraction surface 10A. However, the light emitting surfaces 21 of the multiple light-emitting elements 20 do not need to be parallel to each other.

[0070] In the illustrated example, the plurality of light-emitting elements 20 include three semiconductor laser elements 20A, 20B, and 20C having different emission peak wavelengths. The emission peak wavelength of the semiconductor laser element 20A is shorter than that of the semiconductor laser element 20B, and the emission peak wavelength of the semiconductor laser element 20B is shorter than that of the semiconductor laser element 20C. The semiconductor laser element 20A emits a first light having an emission peak at a first wavelength from a light-emitting point 22A located on the light-emitting surface. The semiconductor laser element 20B emits a second light having an emission peak at a second wavelength different from the first wavelength from a light-emitting point 22B located on the light-emitting surface. The semiconductor laser element 20C emits a third light having an emission peak at a third wavelength different from the first wavelength and the second wavelength from a light-emitting point 22C located on the light-emitting surface.

[0071] In this embodiment, the first light is blue light, the second light is green light, and the third light is red light. In other words, the semiconductor laser element 20A emits blue light, the semiconductor laser element 20B emits green light, and the semiconductor laser element 20C emits red light. In this embodiment, in a top view, the semiconductor laser element 20C emitting red light has a longer length in the optical axis direction of at least one lens surface of the lens member 80 than the semiconductor laser element 20B emitting green light or the semiconductor laser element 20A emitting blue light. Note that the optical axis of one lens surface of the lens member 80 may coincide with the optical axis L of the lens member 80. By adjusting the length, the output of the laser light can be adjusted, but the relationship of the lengths is not limited to this example. The form in which the three light-emitting elements 20 are configured with three colors of light, RGB, can be adopted, for example, for color image display applications. Note that the color of light emitted by each light-emitting element 20 is However, the present invention is not limited to this, and depending on the application, the light source is not limited to visible light.

[0072] In the illustrated example, in a top view from the normal direction of the upper surface 30M of the submount 30, the distance w1 between the light emitting point 22A and the light emitting point 22B in the 1D arrow direction is, for example, 100 μm or more and 150 μm or less, and the distance w2 between the light emitting point 22B and the light emitting point 22C is, for example, 100 μm or more and 150 μm or less. The smaller the distance between the light emitting points is, the smaller the shape of the submount 30 can be in the 1D direction, and the light emitting device 100 can be made smaller. For ease of explanation, the light emitting point is described as an ellipse near the center of the light emitting surface in the 1D arrow direction, but the present disclosure is not limited thereto. The light emitting point can be shifted in the 1D arrow direction with the center of the light emitting surface as a reference in the top view.

[0073] Here, some imaginary planes and straight lines are defined. A plane perpendicular to the optical axis L of at least one lens surface of the lens member 80 and passing through the light emitting point 22A of the semiconductor laser element 20A is called the first plane. A plane perpendicular to the optical axis L of this lens surface and passing through the light emitting point 22B of the semiconductor laser element 20B is called the second plane. A plane perpendicular to the optical axis L of this lens surface and passing through the light emitting point 22C of the semiconductor laser element 20C is called the third plane. A straight line parallel to the optical axis L of this lens surface and passing through the light emitting point 22A of the semiconductor laser element 20A is called the first straight line. A straight line parallel to the optical axis L of this lens surface and passing through the light emitting point 22B of the semiconductor laser element 20B is called the second straight line. A straight line parallel to the optical axis L of this lens surface and passing through the light emitting point 22C of the semiconductor laser element 20C is called the third straight line.

[0074] 6 and 7, the first to third planes are indicated by dashed lines m1, m2, and m3, respectively, as viewed from above. Similarly, the first to third straight lines are indicated by dashed lines n1, n2, and n3, respectively. Hereinafter, the first to third planes are referred to as planes m1, m2, and m3, respectively, and the first to third straight lines are referred to as straight lines n1, n2, and n3, respectively.

[0075] The light emitting point 22B of the semiconductor laser element 20B is disposed at a position farther from the lens member 80 than the plane m1. The light emitting point 22C of the semiconductor laser element 20C is disposed at a position farther from the lens member 80 than the plane m2. In this manner, in the optical axis L direction of the lens surface, the light emitting point 22B of the semiconductor laser element 20B is set back from the light emitting point 22A of the semiconductor laser element 20A, and the light emitting point 22C of the semiconductor laser element 20C is set back from the light emitting point 22B of the semiconductor laser element 20B. The shift amount of the light emitting point can be appropriately adjusted depending on the emission peak wavelength of the light emitting element, the interval between two adjacent light emitting points, the optical characteristics of the lens member 80 including the refractive index, and the like. In this embodiment, the shift amount of the light emitting point 22C of the semiconductor laser element 20C relative to the light emitting point 22A of the semiconductor laser element 20A in the optical axis L direction of the lens surface, that is, the interval d1 between the plane m1 and the plane m3, can be, for example, 50 μm or more and 100 μm or less. When adjusting light from the perspective of optical control, such as reducing chromatic aberration or adjusting the optical path length of each light, adjustment by shifting the light-emitting point can be performed without the need for new optical components, which can contribute to a reduction in the number of components.

[0076] In the light emitting device 100, the submount 30 to which the multiple light emitting elements 20 are bonded is disposed inside the package 10. The submount 30 is bonded to the light emitting elements 20 at one bonding surface, i.e., the upper surface 30M, and is bonded to the mounting surface 11M at the other bonding surface on the opposite side.

[0077] The submount 30 has an upper surface 30M on which a plurality of light emitting elements 20 are arranged side by side. In the illustrated example, the shape of the upper surface 30M of the submount 30 is a parallelogram. Of two pairs of parallel sides constituting this parallelogram, one of the two parallel sides is parallel to the optical axis L of at least one lens surface of the lens member 80. In this embodiment, the height w3 of the parallelogram of the upper surface 30M is approximately 500 μm. In the direction of the optical axis L (the direction of the arrow in 2D), A distance d2 from vertex P1 to vertex P2 of the parallelogram in the drawing may be 50 μm or more and 100 μm or less.

[0078] 7, the outer edge 30B of the upper surface 30M of the submount 30 passes through a point inside an area s1 surrounded by the plane m1, the plane m2, the straight line n1, and the straight line n2, which is farther from the lens member 80 than the plane m1 and closer to the lens member 80 than the plane m2, in a top view seen from the normal direction of the upper surface 30M of the submount 30. The outer edge 30B of the upper surface 30M of the submount 30 further passes through a point inside an area s2 surrounded by the plane m2, the plane m3, the straight line n2, and the straight line n3, which is farther from the lens member 80 than the plane m2 and closer to the lens member 80 than the plane m3, in a top view.

[0079] The submount 30 has a top surface 30M and a side surface 30A intersecting with the top surface 30M. The side surface 30A is an end surface of the submount 30 on the side where the light emitting point of the light emitting element 20 is located. The semiconductor laser element 20A is disposed so that the light emitting point 22A protrudes from the outer edge 30B located at the boundary between the top surface 30M and the side surface 30A of the submount 30. The semiconductor laser element 20B is disposed so that the light emitting point 22B protrudes from the outer edge 30B. The semiconductor laser element 20C is disposed so that the light emitting point 22C protrudes from the outer edge 30B.

[0080] The three semiconductor laser elements 20A, 20B, and 20C are arranged on the submount 30 so that the three light emitting points 22A, 22B, and 22C are aligned along one of the four sides of the parallelogram of the upper surface 30M. In the top view, the optical axis direction (the direction of the arrow in 2D) of at least one lens surface of the lens member 80 intersects with the direction in which the outer edge 30B of the submount 30 extends at an angle other than 90°. In other words, the side surface 30A of the submount 30 forms an angle other than 90° with respect to the inner surface of the side wall portion 12 of the package 10. In this embodiment, this inclination angle with respect to the direction of the arrow in 1D can be determined based on the shift amount of the light emitting points described above and the interval between two adjacent light emitting elements. This inclination angle can be adjusted, for example, in the range of more than 5° and not more than 20°. Even if the shift amount of the light emitting points is the same, by increasing the inclination angle, it is possible to make the interval between two adjacent light emitting elements, that is, the interval between two light emitting points, smaller.

[0081] The first light (blue light) emitted from the light emitting point 22A of the semiconductor laser element 20A, the second light (green light) emitted from the light emitting point 22B of the semiconductor laser element 20B, and the third light (red light) emitted from the light emitting point 22C of the semiconductor laser element 20C each pass through at least one lens surface of the lens member 80. In addition, the first light, the second light, and the third light pass through one lens surface of the lens member 80. The at least one lens surface of the lens member 80 collimates the first, second, and third light.

[0082] At least one of the first light, the second light, and the third light has light traveling on the optical axis L of one lens surface of the lens member 80, and the rest do not have light traveling on the optical axis L of this lens surface. In the illustrated example, of the first light, the second light, and the third light passing through one lens surface of the lens member 80, the second light has light traveling on the optical axis L of this lens surface, and the first light and the third light do not have light traveling on the optical axis L of this lens surface. In addition, the distance from the light emitting point 22A of the first light to the optical axis L of this lens surface and the distance from the light emitting point 22C of the third light to the optical axis L of this lens surface can be the same.

[0083] In this embodiment, the number of light-emitting elements 20 is not limited to three, and may be two or four or more. Fig. 8 is an enlarged view of the upper surface 30M of the submount 30 on which two light-emitting elements 20 are arranged. Fig. 9 is an enlarged plan view of the outer edge of the submount 30 on the side where the light emission surfaces 21 of the two light-emitting elements 20 are located.

[0084] In the illustrated example, the multiple light-emitting elements 20 include two semiconductor laser elements 20A and 20B having different emission peak wavelengths. The emission peak wavelength of the semiconductor laser element 20A is shorter than that of the semiconductor laser element 20B. In the illustrated example, the semiconductor laser element 20A emits blue light, and the semiconductor laser element 20B emits green light. As another combination, for example, the semiconductor laser element 20A may emit blue light and the semiconductor laser element 20B may emit red light, or the semiconductor laser element 20A may emit green light and the semiconductor laser element 20B may emit red light.

[0085] In the illustrated example, when viewed from above, the distance w1 between two light-emitting points 22A and 22B in a direction (arrow direction in 1D) perpendicular to the optical axis L direction (arrow direction in 2D) of at least one lens surface is, for example, 100 μm or more and 150 μm or less.

[0086] The light emitting point 22B of the semiconductor laser element 20B is disposed at a position farther from the lens member 80 than the plane m1. In the direction of the optical axis L of the lens surface, the light emitting point 22B of the semiconductor laser element 20B is set back from the light emitting point 22A of the semiconductor laser element 20A. In the illustrated example, the shift amount of the light emitting point 22B of the semiconductor laser element 20B from the light emitting point 22A of the semiconductor laser element 20A in the direction of the optical axis L of the lens surface, that is, the distance d1 between the plane m1 and the plane m2, is, for example, not less than 50 μm and not more than 100 μm.

[0087] As illustrated in Figure 9, the outer edge 30B of the upper surface 30M of the submount 30, when viewed from above in the normal direction of the upper surface 30M of the submount 30, passes through a point inside the region s1 surrounded by the plane m1, the plane m2, the line n1, and the line n2, which is farther from the lens member 80 than the plane m1 and closer to the lens member 80 than the plane m2.

[0088] The semiconductor laser element 20A is disposed so that a light emitting point 22A protrudes from an outer edge 30B located at the boundary between an upper surface 30M and a side surface 30A of the submount 30. The semiconductor laser element 20B is disposed so that a light emitting point 22B protrudes from the outer edge 30B.

[0089] The two semiconductor laser elements 20A and 20B are arranged on the submount 30 so that the two light emitting points 22A and 22B are aligned along one of the four sides of the parallelogram of the upper surface 30M. In the top view, the optical axis L direction of at least one lens surface of the lens member 80 intersects with the direction in which the outer edge 30B extends at an angle other than 90°. In this embodiment, the inclination angle with respect to the direction of the arrow 1D can be determined based on the shift amount of the light emitting points described above and the interval between two adjacent light emitting elements. The inclination angle can be adjusted, for example, in the range of more than 5° and not more than 20°.

[0090] A first light (blue light) emitted from light emitting point 22A of semiconductor laser element 20A and a second light (green light) emitted from light emitting point 22B of semiconductor laser element 20B each pass through one lens surface of lens member 80. The one lens surface of lens member 80 collimates the first light and the second light.

[0091] Neither the first light nor the second light has any light traveling on the optical axis L of at least one lens surface of the lens member 80. At least one of the first light and the second light may have any light traveling on the optical axis L of at least one lens surface of the lens member 80. In the illustrated example, neither the first light nor the second light passing through one lens surface of the lens member 80 has any light traveling on the optical axis L of this lens surface.

[0092] When multiple light beams with different wavelengths are incident on a lens surface of a single lens to perform optical control such as collimation, a problem of chromatic aberration may occur. Note that chromatic aberration refers to axial chromatic aberration in which the image formation position of light varies in the optical axis direction depending on the wavelength of the light. By shifting and adjusting the light emitting point of the light emitting element 20, the chromatic aberration can be reduced.

[0093] According to the structure of the submount and the arrangement of the multiple light-emitting elements of this embodiment, the ratio of the distance d2 from the apex P1 to the apex P2 of the parallelogram to the height w3 of the parallelogram, that is, the inclination angle, can be adjusted according to the amount of protrusion of the light-emitting point of the light-emitting element while considering the interval between the two light-emitting elements. In this way, by forming the submount 30 according to the shift of the light-emitting point, it is possible to prevent a part of the divergent light from hitting the upper surface of the submount, that is, to prevent the vignetting of the divergent light by the submount. According to the light-emitting device 100 of this embodiment, a light-emitting device in which the emission position of the light emitted from the multiple light-emitting elements is precisely mounted is realized.

[0094] A submount can be produced by dividing a plate-shaped submount substrate into a plurality of parts. A plurality of submounts having the same shape can be obtained from one submount substrate. FIG. 10 is a top view that shows a schematic diagram of a cutting line when cutting a plate-shaped submount substrate 99. As shown in FIG. 10, by cutting and dividing the plate-shaped submount substrate 99 in a direction parallel to the edge of the submount substrate and in a direction obliquely intersecting that direction, a plurality of submounts each having a parallelogram-shaped upper surface can be obtained. The cutting can be performed by, for example, laser processing. According to this method, the parts to be used as submounts are densely arranged in the submount substrate and are divided by linear cutting lines. The use of a submount having a parallelogram-shaped upper surface is advantageous in terms of ease of production.

[0095] Other structural examples of the submount in this embodiment will be described with reference to Fig. 11A to Fig. 11C. Fig. 11A is a top view of the submount 30_1. Fig. 11B is a perspective view of the submount 30_2. Fig. 11C is a top view of the submount 30_3.

[0096] The shape of the submount in the present disclosure does not necessarily have to be a parallelogram, and various shapes can be adopted depending on the mounting conditions in the package, as long as, when viewed from above, the direction of the optical axis L of at least one lens surface of the lens member 80 and the direction in which the outer edge 30B of the submount 30 extends intersect at an angle other than 90°.

[0097] 11A, only the side (or outer edge 30B) located at the boundary between the upper surface 30M and the side surface 30A of the submount 30_1 is inclined, and the opposite side 30E of the side is not inclined. The shape of the upper surface 30M of the submount 30 may be trapezoidal.

[0098] In the example of FIG. 11B, only the side (or outer edge 30B) located at the boundary between the upper surface 30M and the side surface 30A of the submount 30_2 is inclined, and the opposite side of the side is not inclined. The difference between the example of FIG. 11A and the example of FIG. 11B is that the submount 30_2 has a step structure 30D on the side where the light emitting point of the light emitting element is located. The step structure 30D has the side surface 30A on the inner surface. In this way, the end face of the submount on the side where the light emitting point of the light emitting element is located does not necessarily need to be flat. It is sufficient to form the step structure 30D to a degree that can suppress a part of the divergent light from hitting the upper surface of the submount, that is, to suppress the vignetting of the divergent light by the submount, thereby securing a triangular prism-shaped space below the light emitting point of the light emitting element.

[0099] In the example of FIG. 11C, the shape of the upper surface 30M of the submount 30_3 is generally rectangular. However, when viewed from above, one side of the rectangle that is part of the outer edge of the submount 30 on the side where the light emitting point of the light emitting element is located has a recess. This recess forms two recesses 30F on the side surface 30A of the submount 30. The recesses 30F are grooves that extend in the thickness direction of the submount 30. The depth of the recesses 30F in the optical axis direction of the light emitted from the light emitting surface 21 is , is adjusted according to the shift amount of the light emitting element described above. In this way, instead of adopting a parallelogram shape in a top view, a recess 30F may be provided on the side surface 30A of the submount 30. With such a structure, it is possible to suppress vignetting of the laser light caused by protruding the light emitting point.

[0100] Referring again to Figures 1 to 5 .

[0101] The light emitting elements 20 emit light toward the side. The light emitting elements 20 emit divergent light from the light emitting surface 21 toward the outer surface having the light extraction surface 10A among one or more outer surfaces of the package 10. The light emitted from the light emitting surface 21 travels along an optical axis parallel to the mounting surface 11M. The light emitted from the light emitting elements 20 passes through the side wall portion 12 of the package 10 and is emitted toward the side from the light-transmitting region 13. If the number of components arranged on the mounting surface 11M increases, the external shape of the package 10 becomes larger, but the side surface can be made smaller in size than the top surface. If the external shape of the side surface can be made smaller than the top surface, the size of the surface on which the light extraction surface 10A is provided can be reduced by making the light exit from the side.

[0102] In the light emitting device 100, the temperature measuring element 60B is disposed inside the package 10. The temperature measuring element 60B is disposed on the mounting surface 11M. The temperature measuring element 60B is disposed on the wiring area 14. The temperature measuring element 60B is also electrically connected to the two wiring areas 14. The temperature measuring element 60B is disposed for the purpose of measuring the temperature of the light emitting element 20.

[0103] The distance from the temperature measuring element 60B to the light emitting element 20 is shorter than the distance from the protection element 60A to the light emitting element 20. By disposing the temperature measuring element 60B at a position close to the light emitting element 20, the measurement accuracy of the temperature of the light emitting element 20 can be improved.

[0104] When the protection element 60A is electrically connected to a set of wiring regions 14 arranged side by side in one direction, the temperature measurement element 60B is electrically connected to a set of wiring regions 14 arranged side by side in a direction perpendicular to the one direction.

[0105] The sets of wiring regions 14 electrically connected to the protection elements 60A are arranged side by side in the same direction. In one set of wiring regions 14 electrically connected to the protection elements 60A, the two wiring regions 14 are arranged so that they are approximately equal in distance from the submount 30 in top view.

[0106] On the other hand, in one set of wiring regions 14 electrically connected to the temperature measuring element 60B, the two wiring regions 14 have different distances from the submount 30 in a top view, and the difference is equal to or greater than the width of the temperature measuring element 60B.

[0107] The wiring region 14 to which the protective element 60A is electrically connected is joined with a wiring 70 for electrical connection with the light emitting element 20, whereas the wiring region 14 to which the temperature measuring element 60B is electrically connected is not joined with the wiring 70 for electrical connection with the light emitting element 20. Taking this into consideration, the direction in which the wiring regions 14 are arranged is changed accordingly.

[0108] In the light emitting device 100, the wiring 70 joins the wiring region 14 of the package 10 and the light emitting element 20 on the side of the light emitting element 20 (the side including the surface opposite to the light emitting surface 21 of the light emitting element 20) with a straight line parallel to the light emitting surface 21 of the light emitting element 20 as a boundary in a top view. This makes it easier to prevent the wiring 70 from entering the optical path of light.

[0109] In the light emitting device 100, a sealed closed space is created inside the package 10. Furthermore, by bonding the first substrate 15 and the cap 16 under a predetermined atmosphere, a hermetically sealed closed space is created inside the package 10. By hermetically sealing the space in which the light emitting element 20 is disposed, quality deterioration due to dust collection can be suppressed. Note that, when the entire light emitting device 100 is used in an environment or atmosphere in which there is no need to worry about quality deterioration due to the influence of dust collection or moisture in the air, the cap 16 is not necessary. For example, when the entire light emitting device 100 is sealed by an enclosure, there is no need to cover the light emitting element 20 with the cap 16.

[0110] In the light emitting device 100, the package 10 is mounted on the second substrate 90. Furthermore, the first substrate 15 of the package 10 is mounted on the second substrate 90. Various electronic components arranged on the mounting surface 11M can be electrically connected to an external circuit of the light emitting device 100 via the multiple wiring regions 14 of the first substrate 15 and the multiple wiring regions 96 of the second substrate 90.

[0111] In the light emitting device 100, the lens member 80 is mounted on the second substrate 90. Note that the lens member 80 is not limited to the second substrate 90, and for example, the first substrate 15 of the illustrated light emitting device 100 may be made the same size as the second substrate 90, and the lens member 80 may be mounted on the first substrate 15. The lens member 80 is located outside the package 10 and is not surrounded by the sidewall portion 12. This allows the size of the package 10 to be reduced.

[0112] The lower surface of the lens member 80 is lower than the mounting surface 11M. By bonding the lower surface of the lens member 80 to the upper surface of the second substrate 90, the lower surface of the lens member 80 can be disposed at a position lower than the mounting surface 11M. By disposing it in this manner, the light emitted from the package 10 can be made incident on the lens member 80 at a position lower than the plane including the mounting surface 11M.

[0113] Light emitted from the multiple light emitting elements 20 and then emitted to the outside of the package 10 from the light transmitting region 13 is incident on the lens member 80. In addition, the lens member collimates the incident light and emits it.

[0114] The central axis of the light extracted from the light extraction surface 10A faces the direction in which the mounting surface 11M of the base 11 extends. The optical axis L of the lens surface from which the light is emitted in the lens member 80 and the central axis of the light extracted from the light extraction surface 10A are at the same height from the mounting surface 11M of the base 11.

[0115] The central axis of the light extracted from the light extraction surface 10A is perpendicular to the light extraction surface 10A. The optical axis L of the lens surface from which the light is emitted in the lens member 80 is also perpendicular to the light extraction surface 10A. Note that the perpendicular here includes a difference of ±5 degrees. Also, the central axis of the light does not necessarily have to be perpendicular to the light extraction surface 10A.

[0116] In the illustrated example of the light emitting device 100, a plurality of light emitting elements 20 are disposed inside the package 10. The light emitted from the plurality of light emitting elements 20 and emitted from the light-transmitting region 13 to the outside of the package 10 enters one lens surface on the light incident side of the lens member 80 and is emitted from one lens surface on the light exit side. The light emitted from one lens surface is collimated by the lens member 80. In the illustrated example of the light emitting device 100, the light emitted from the three light emitting elements 20 and emitted from the light-transmitting region 13 to the outside of the package 10 enters the lens surface on the light incident side of the lens member 80, and each of the light is collimated and emitted from the lens surface on the light exit side. By collimating and controlling the light from the plurality of light emitting elements 20 by one lens surface, the lens member 80 can be made smaller than if a lens surface were provided separately for each light emitting element 20. This can contribute to the miniaturization of the light emitting device 100.

[0117] In the example shown in FIG. 2, the outer edge of the submount 30 on the side where the light emitting point of the light emitting element 20 is located approaches the side wall portion 12 of the package 10 from the top to the bottom of the drawing. The submount 30 is disposed in the package 10 as shown in FIG. 12. The three light-emitting elements 20 are disposed on the submount 30 in the order of, for example, RGB from the top. However, conversely, as shown in FIG. 12, the submount 30 is disposed in the package 10 so that the outer edge of the submount 30 on the side where the light-emitting point of the light-emitting element 20 is located moves away from the side wall 12 of the package 10 from the top to the bottom of the drawing. In this case, the three light-emitting elements 20 are disposed on the submount 30 in the order of, for example, BGR from the top. Needless to say, such a configuration example is also within the scope of the present disclosure.

[0118] In the present embodiment, an example in which the semiconductor laser element 20A emits blue light, the semiconductor laser element 20B emits green light, and the semiconductor laser element 20C emits red light has been described, but the present disclosure is not limited thereto. For example, the semiconductor laser element 20A may emit red light, the semiconductor laser element 20B may emit green light, and the semiconductor laser element 20C may emit blue light. In this case, the order of arrangement of the RGB semiconductor laser elements is reversed from that of the above-mentioned example, and among the three light emitting points 22A, 22B, and 22C, the light emitting point 22A of the semiconductor laser element 20A that emits red light is arranged so as to protrude the most, that is, so as to be closest to the side wall portion 12. By combining such an arrangement with an achromatic lens, it is possible to reduce chromatic aberration. An achromatic lens has a structure in which a plurality of lenses with different optical characteristics are bonded together, and is generally used to correct chromatic aberration. For example, if red laser light diverges more in the thickness direction of the submount than blue or green laser light, the red laser light is more likely to hit parts of the substrate 90 or lens member 80 other than the lens surface than the blue or green laser light.

[0119] By protruding the light emitting point of the red semiconductor laser element to the maximum extent, it is possible to effectively suppress vignetting of the laser light, but this protrusion also generates chromatic aberration. By utilizing an achromatic lens designed to correct this chromatic aberration, it is possible to reduce chromatic aberration while suppressing vignetting of the red laser light.

[0120] Although the embodiments of the present invention have been described above, the light-emitting device of the present invention is not strictly limited to the light-emitting device of the embodiment. In other words, the present invention can be realized only if it is limited to the external shape and structure of the light-emitting device disclosed in the embodiment. For example, it may be a light-emitting device without a protective element. In addition, it can be applied without necessarily having all the components. For example, if some of the components of the light-emitting device disclosed in the embodiment are not described in the claims, the freedom of design by a person skilled in the art, such as substitution, omission, modification of the shape, and change of the material, is recognized for those some components, and the invention described in the claims is specified to be applied. [Industrial Applicability]

[0121] The light emitting device according to each embodiment can be used in head mounted displays, projectors, lighting, displays, and the like. [Explanation of symbols]

[0122] 10:Package 10A: Light extraction surface 11: Base 11M: Mounting surface 11P: Peripheral area 12: Side wall 13: Translucent area 14: Wiring area 15: Substrate (first substrate) 16: Cap 20: Light emitting element 30, 30_1, 30_2, 30_3: Submount 30A: Side 30B: Outer edge 30M:Top surface 31: Wiring area 60A: Protective element 60B: Temperature measuring element 70: Wiring 80: Lens parts 90: Substrate (second substrate) 96: Wiring area 97:Heat conductive materials 100: Light emitting device

Claims

1. The top surface and a first set of wiring regions including a first wiring region and a second wiring region arranged on the top surface side by side in a first direction; a second set of wiring regions including a third wiring region and a fourth wiring region arranged on the top surface side by side in a second direction perpendicular to the first direction in a top view; Equipped with A substrate, wherein the first set of wiring regions and the second set of wiring regions are arranged side by side in the first direction.

2. In the second direction, a width of the first wiring region is the same as a width of the second wiring region; The substrate according to claim 1 , wherein a width of the third wiring region in the second direction is greater than a width of the fourth wiring region.

3. When viewed from above, the third wiring region has a rectangular shape in which a width in the first direction is greater than a width in the second direction; The substrate according to claim 1 , wherein the fourth wiring region has a rectangular shape in a top view, the width in the first direction being greater than the width in the second direction.

4. the first set of wiring regions is a wiring region in which a first electronic component is disposed and which is for electrically connecting to the first electronic component; the second set of wiring regions is a wiring region in which a second electronic component is disposed and for electrically connecting to the second electronic component; The substrate according to claim 1 , wherein the first electronic component and the second electronic component are different electronic components.

5. The substrate according to claim 4 , wherein the first electronic component and the second electronic component have different external sizes when viewed from above.

6. the upper surface has an arrangement area in which a light emitting element is arranged, The substrate according to claim 4 , wherein the first set of wiring regions and the second set of wiring regions are provided at a position spaced apart from the placement region in the second direction.

7. The substrate of claim 6 , wherein the first wiring region and the second wiring region each have an area provided for bonding wiring for electrically connecting the light-emitting element to the first set of wiring regions.

8. The substrate of claim 7 , wherein the second set of wiring regions is not bonded with wiring for electrically connecting the light emitting elements to the second set of wiring regions.

9. the first electronic component is a protection element, The substrate according to claim 4 , wherein the second electronic component is a temperature measuring element.

10. a substrate including: an upper surface having a placement area; a first set of wiring areas including a first wiring area and a second wiring area arranged on the upper surface side by side in a first direction; and a second set of wiring areas including a third wiring area and a fourth wiring area arranged on the upper surface side by side in a second direction perpendicular to the first direction in a top view; A light emitting element disposed in the arrangement region; a first electronic component disposed in the first set of wiring regions and electrically connected to the first set of wiring regions; a second electronic component disposed in the second set of wiring regions and electrically connected to the second set of wiring regions; Equipped with the first set of wiring regions and the second set of wiring regions are arranged side by side in the first direction; The first set of wiring regions and the second set of wiring regions are provided at a position away from the placement region in the second direction.

11. In each of the first wiring region and the second wiring region, a region is provided to which wiring for electrically connecting the light emitting element to the wiring region of the first set is bonded, The light emitting device according to claim 10 , wherein no wiring is bonded to the second set of wiring regions for electrically connecting the light emitting elements to the second set of wiring regions.

12. the first electronic component is disposed in the first wiring region and the second wiring region; The light emitting device according to claim 10 , wherein the second electronic component is arranged in the third wiring region and is not arranged in the fourth wiring region.

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