Heat conduction member and manufacturing method thereof

Abstract

To provide a heat conduction member capable of suppressing the rise of a reactive force even if a contact pressure of a heat dissipation target increases.SOLUTION: A heat conduction member 101 consists of a first heat conduction member 111 and a second heat conduction member 131 and is interposed between a heat dissipation target 11 such an electronic component and a heat sink 31. The first heat conduction member 111 has elasticity, includes at the side of one face 111A a contact part 112 which is in contact with the heat sink 31 mounted to the heat dissipation target 11, and includes a recessed hold part 113 on a face 111B at the opposite side of the one face 111A. The second heat conduction member 131 has viscoelasticity and receives the heat dissipation target 11 while being held by the hold part 113. The first heat conduction member 111 includes, on a bottom face BM of the hold part 113, a plurality of projections 114 which is elastically deformed in contact with the heat dissipation target 11 when a compression amount of the second heat conduction member 131 corresponding to a contact pressure of the heat dissipation target 11 reaches a predetermined amount. The second heat conduction member 131 wraps around the bottom face BM of the hold part 113.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a thermally conductive member and a method for manufacturing the same. [Background technology]

[0002] Heat sinks are widely used as a method for dissipating heat generated in heat dissipation targets such as electronic components and electronic equipment. Heat sinks receive heat from the heat dissipation target, dissipate the heat, and protect the heat dissipation target such as electronic components from damage caused by heat.

[0003] When attaching a heat sink to an electronic component, an elastic thermally conductive material is sometimes used to cushion the heat from external shocks and to dampen vibrations. Grease, gel sheets, rubber sheets, and other materials with high thermal conductivity are used as thermally conductive materials. Grease in particular has excellent adhesion to the area where it is used and provides highly efficient thermal conductivity. On the other hand, grease is difficult to handle.

[0004] In this regard, the heat conduction member described in Patent Document 1 is provided with a container-shaped heat conductive elastomer (31) made of a heat conductive rubber material, and is combined with a soft heat conduction member (40) whose main component is grease (see paragraphs 0025, 0050-0051, and Fig. 2-5). As shown in Fig. 5 of Patent Document 1, the soft heat conduction member (40) is housed in a heat conductive elastomer (31) placed in a heat sink (52), and receives a heat dissipation target (50). Heat generated by the heat dissipation target (50) is transferred from the soft heat conduction member (40) through the heat conductive elastomer (31) to the heat sink (52), and is dissipated by the heat sink (52). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2022 / 186046 Summary of the Invention [Problem to be solved by the invention]

[0006] In a heat conductive member in which grease (e.g., soft heat conductive member 40) is contained in a container (e.g., heat conductive elastomer 31) made of heat conductive rubber material as described in Patent Document 1, when the contact pressure of the heat dissipation target against the grease increases, the grease behaves as if it is escaping from the container, increasing the reaction force. In this state, the viscoelasticity of the grease decreases, weakening the buffering and vibration damping effects that the heat conductive member inherently possesses. Improvements are required.

[0007] An object of the present disclosure is to obtain a thermally conductive member capable of suppressing an increase in reaction force even when the contact pressure of a heat dissipation target increases. [Means for solving the problem]

[0008] One embodiment of the thermal conduction member comprises a first thermal conduction member having elasticity and a contact portion on one side that contacts a heat sink attached to a heat dissipation target and a concave retaining portion on the surface opposite the first side, and a second thermal conduction member having viscoelasticity and being held by the retaining portion to receive the heat dissipation target, wherein the first thermal conduction member has a plurality of protrusions on a bottom surface of the retaining portion that contact the heat dissipation target and elastically deform when the compression amount of the second thermal conduction member in response to the contact pressure of the heat dissipation target reaches a predetermined amount, and the second thermal conduction member extends around to the bottom surface of the retaining portion.

[0009] As an example of the manufacturing method for the thermal conduction member of the above-mentioned embodiment, the first thermal conduction member and the second thermal conduction member are prepared, and the second thermal conduction member is filled into the holding portion so that the second thermal conduction member flows around to the bottom surface of the holding portion of the first thermal conduction member.

[0010] Another embodiment of the thermal conduction member comprises a first thermal conduction member having an elastic contact portion on one side that contacts a heat sink attached to a heat dissipation target, a concave accommodating portion on the one side and a concave retaining portion on the side opposite the one side, the accommodating portion and the retaining portion being separated by a partition, and a second thermal conduction member having viscoelasticity, a part of which is held by the retaining portion to receive the heat dissipation target and another part of which is accommodated in the accommodating portion and contacts the heat sink, wherein the inner wall of the wall portion separating the accommodating portion has an inclined surface that slopes from an edge that defines the outer periphery of the first thermal conduction member on the one side toward the partition, and the contact portion provided on the edge is in line contact with the heat sink.

[0011] As an example, the manufacturing method of the thermal conduction member of another aspect described above includes preparing the first thermal conduction member and the second thermal conduction member, filling the holding portion of the first thermal conduction member with the second thermal conduction member, and filling the accommodating portion of the first thermal conduction member with the second thermal conduction member.

[0012] A second alternative embodiment of the thermal conduction member comprises a first thermal conduction member having elasticity, the first thermal conduction member having a contact portion on one side that contacts a heat sink attached to a heat dissipation target, the first thermal conduction member having a concave accommodating portion on the one side and a concave holding portion on the side opposite the first thermal conduction member, the accommodating portion and the holding portion being separated by a partition having a plurality of through holes, and a second thermal conduction member having viscoelasticity, the second thermal conduction member extending from the holding portion to the accommodating portion via the through holes, the portion held by the holding portion receiving the heat dissipation target, and the other portion accommodated in the accommodating portion contacting the heat sink.

[0013] As an example, the manufacturing method of the second alternative embodiment of the thermal conduction member includes preparing the first thermal conduction member and the second thermal conduction member, and filling the second thermal conduction member into the holding portion from the holding portion side of the first thermal conduction member so that the second thermal conduction member is filled into the accommodating portion through the through hole.

[0014] A third alternative embodiment of the thermal conduction member comprises a first thermal conduction member having elasticity and a contact portion on one side that contacts a heat sink attached to a heat dissipation target, a concave accommodating portion on the one side and a concave holding portion on the side opposite the one side, the accommodating portion and the holding portion being separated by a partition, and a second thermal conduction member having viscoelasticity, a part of which is held in the holding portion and receives the heat dissipation target, and another part of which is accommodated in the accommodating portion and contacts the heat sink.

[0015] As an example, the manufacturing method of the third alternative embodiment of the thermal conduction member includes preparing the first thermal conduction member and the second thermal conduction member, filling the holding portion of the first thermal conduction member with the second thermal conduction member, and filling the accommodating portion of the first thermal conduction member with the second thermal conduction member. Effect of the Invention

[0016] Even if the contact pressure of the heat dissipation target increases, an increase in the reaction force can be suppressed. [Brief description of the drawings]

[0017] [Figure 1] 1A and 1B are vertical cross-sectional views illustrating a usage mode of the heat conduction member of the present embodiment interposed between a heat dissipation target and a heat sink. [Diagram 2] 1 is a vertical cross-sectional view showing a heat conduction member interposed between a heat dissipation target and a heat sink according to a first embodiment; [Diagram 3] FIG. 4A is an enlarged schematic diagram showing a material from which a first thermal conductive member is formed, and FIG. 4B is an enlarged schematic diagram showing a material from which a second thermal conductive member is formed. [Figure 4] FIG. [Diagram 5] 11A to 11C are vertical cross-sectional views showing state transitions in response to an increase in contact pressure of a heat dissipation target. [Figure 6] FIG. 4 is a perspective view of a first heat conducting member shown as a reference example. [Figure 7] 13A and 13B are schematic diagrams showing, as a reference example, vertical cross-sectional views of state transitions in response to an increase in contact pressure of a heat dissipation target. [Figure 8] FIG. 11 is a vertical cross-sectional view showing a heat conduction member interposed between a heat dissipation target and a heat sink as a second embodiment. [Figure 9] 5(A) to 5(C) are vertical cross-sectional views showing the manufacturing process of the heat conductive member. [Figure 10] 1A is an enlarged vertical cross-sectional view of a reference example showing a contact state of a heat sink and a thermally conductive member, and FIG. 1B is a vertical cross-sectional view of the present embodiment. [Figure 11] FIG. 11 is a vertical cross-sectional view showing a heat conduction member interposed between a heat dissipation target and a heat sink as a third embodiment. [Figure 12] FIG. 4 is a perspective view showing a first heat conducting member. [Figure 13] An enlarged cross-sectional view taken along line AA in Figure 12. [Figure 14] 1A and 1B are vertical cross-sectional views showing the manufacturing process of a heat conductive member. [Figure 15] FIG. 13 is a vertical cross-sectional view showing a heat conduction member interposed between a heat dissipation target and a heat sink as a fourth embodiment. [Figure 16] 1A and 1B are vertical cross-sectional views showing the manufacturing process of a thermal conductive member. [Figure 17] FIG. 13 is a vertical cross-sectional view showing a heat conduction member interposed between a heat dissipation target and a heat sink as a fifth embodiment. [Figure 18] 5(A) to 5(C) are vertical cross-sectional views showing the manufacturing process of the heat conductive member. [Figure 19] FIG. 13 is a vertical cross-sectional view showing a heat conduction member interposed between a heat dissipation target and a heat sink as a sixth embodiment. [Figure 20] 5(A) to 5(C) are vertical cross-sectional views showing the manufacturing process of the heat conductive member. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] The heat conducting member and the manufacturing method thereof according to the present embodiment will be described in the following order. [First embodiment] 1. Configuration (1) First heat conductive member (2) Second heat conductive member (3) Protrusion 2. Manufacturing method 3. Effects (1) Thermal conductivity (2) Insulation (3) Ease of assembly (4)Low reaction force (5) Maintaining low reaction force 4. Variations [Second embodiment] 1. Configuration (1) Storage section (2) Inclined surface 2. Manufacturing method 3. Effects (1) Maintaining low reaction force (a) Contributions of the Detention Center (b) Contribution of inclined surface (2) Adhesion 4. Variations [Third embodiment] 1. Configuration 2. Manufacturing method 3. Effects (1) Improved assembly workability (2) Maintaining low reaction force 4. Variations [Fourth embodiment] 1. Configuration 2. Manufacturing method 3. Effects 4. Variations [Fifth embodiment] 1. Configuration 2. Manufacturing method 3. Effects 4. Variations [Sixth embodiment] 1. Configuration 2. Manufacturing method 3. Effects 4. Variations

[0019] As shown in FIG. 1, the thermal conduction members 101-601 of the present embodiment are interposed between a heat dissipation target 11, such as an electronic component or electronic device, and a heat sink 31, and transfer heat from the heat dissipation target 11 to the heat sink 31, thereby contributing to promoting the heat dissipation effect of the heat sink 31.

[0020] The heat conducting members 101-601 include first heat conducting members 111-611 and second heat conducting members 131-631, and are configured by combining these members. The first heat conducting members 111-611 have a container-like shape formed from an elastic member. The second heat conducting members 131-631 are viscoelastic members whose main component is grease, and are housed and held in the first heat conducting members 111-611. The first heat conducting members 111-611 and the second heat conducting members 131-631 are kept in contact with each other.

[0021] As an example, heat dissipation target 11 is an electronic component mounted on substrate 12, and generates heat through its own operation. Substrate 12 is fixed to heat sink 31 by fastening bolts 51 with thermally conductive members 101-601 sandwiched between heat dissipation target 11 and heat sink 31. In thermally conductive members 101-601, first thermally conductive members 111-611 are in surface contact with mounting surface 32 of heat sink 31, and second thermally conductive members 131-631 are in surface contact with heat dissipation target 11, thereby realizing thermal conduction from heat dissipation target 11 to heat sink 31.

[0022] Hereinafter, first to sixth embodiments of the heat conductive members 101 to 601 and the manufacturing methods thereof will be described. First, the allocation of symbols in each embodiment will be explained.

[0023] The heat dissipation target 11, the substrate 12, and the heat sink 31 are common to the individual embodiments, and therefore are denoted by the same reference numerals throughout the embodiments.

[0024] The heat conductive members 101 to 601 and their constituent parts are designated by three-digit reference numbers.

[0025] The hundreds digit in the third digit indicates the embodiment. For example, a first embodiment is a number in the 100s, a second embodiment is a number in the 200s, a third embodiment is a number in the 300s, and so on. Numbers in the 900s indicate that they are not the present embodiment but a reference example.

[0026] The last two digits of the three digits are the symbols given to the heat conductive member and its components. In this case, common numbers are used for parts common to each embodiment or corresponding parts. For example, the first heat conductive member in the second embodiment is given the symbol "211". The symbol "2" in the hundreds digit indicates that it is the second embodiment, and the symbol "11" in the last two digits indicates that it is the first heat conductive member. Similarly, the first heat conductive member is given the symbol "111" in the first embodiment, the symbol "311" in the third embodiment, the symbol "411" in the fourth embodiment, the symbol "511" in the fifth embodiment, the symbol "611" in the sixth embodiment, and the symbol "911" in the reference example.

[0027] In the drawings of the first to sixth embodiments described below, the configuration is upside down compared to that shown in Fig. 1. This is to coincide with the manufacturing process of the thermally conductive members 101-601 and the process of attaching the heat sink 31 to the heat dissipation target 11 with the thermally conductive members 101-601 interposed therebetween. The assembly after the heat sink 31 is fixed to the heat dissipation target 11 with the thermally conductive members 101-601 interposed therebetween is maintained in the orientation of the original arrangement of the heat dissipation target 11.

[0028] [First embodiment] The first embodiment will be described with reference to FIGS.

[0029] 1. Configuration (1) First heat conductive member 2 and 4, the first heat conducting member 111 has a contact portion 112 on one surface 111A side, which contacts the mounting surface 32 of the heat sink 31, and has a concave holding portion 113 on a surface 111B opposite to the one surface 111A. The contact portion 112 is provided in the shape of a flat surface so as to be in surface contact with the heat sink 31. The holding portion 113 has an upper surface opening OP larger than the heat dissipation target 11 so as to be able to receive the heat dissipation target 11.

[0030] The first heat conducting member 111 has elasticity, thermal conductivity, and insulation. As shown in Fig. 3(A), in order to satisfy these properties, the first heat conducting member 111 is formed from a material obtained by adding various fillers to elastic silicone rubber SR and mixing them. By adding and mixing various fillers, it is possible to impart thermal conductivity and insulation to the silicone rubber SR.

[0031] As the filler that provides thermal conductivity, for example, metal or carbon can be used. Specifically, aluminum, copper, silver, carbon fiber, diamond, graphite, etc. As shown in Fig. 3(A), in this embodiment, such a filler is added to the silicone rubber SR as thermally conductive particles TC. In Fig. 3(A), the thermally conductive particles TC are typically shown by black dots.

[0032] Examples of fillers that provide insulation include metal oxides, metal nitrides, metal carbides, and metal hydroxides. Specifically, aluminum oxide (alumina), magnesium oxide (magnesia), zinc oxide, boron nitride, aluminum nitride, silicon carbide, and aluminum hydroxide. As shown in FIG. 3(A), in this embodiment, such fillers are added to the silicone rubber SR as insulating particles IP. In FIG. 3(A), the insulating particles IP are typically indicated by black circles.

[0033] (2) Second heat conductive member 2 and 5(A) to (C), second heat conducting member 131 is held by holding portion 113 provided on surface 111B opposite to first heat conducting member 111, and receives heat dissipation target 11. In this case, second heat conducting member 131 has viscoelasticity so that it can elastically and softly receive heat dissipation target 11. Heat dissipation target 11 is received in such a manner that it is embedded in second heat conducting member 131, and is softly held with good intimate contact between second heat conducting member 131 and second heat conducting member 131.

[0034] The second heat conducting member 131 has viscoelasticity, thermal conductivity, and insulating properties. As shown in Fig. 3(B), in order to satisfy these properties, the second heat conducting member 131 is formed by adding various fillers to, for example, grease G having viscoelasticity and mixing it. The grease G is a viscoelastic body in which a thickener is dispersed in a raw material base oil. By adding various fillers to and mixing the grease G, it is possible to impart thermal conductivity and insulating properties.

[0035] As the filler that provides thermal conductivity, for example, metal or carbon can be used. Specifically, aluminum, copper, silver, carbon fiber, diamond, graphite, etc. As shown in Fig. 3(B) in this embodiment, such a filler is added to the grease G as thermally conductive particles TC. In Fig. 3(B), the thermally conductive particles TC are typically shown by black dots.

[0036] Examples of fillers that provide insulation include metal oxides, metal nitrides, metal carbides, and metal hydroxides. Specifically, aluminum oxide (alumina), magnesium oxide (magnesia), zinc oxide, boron nitride, aluminum nitride, silicon carbide, and aluminum hydroxide. As shown in FIG. 3(B), in this embodiment, such fillers are added to the grease G as insulating particles IP. In FIG. 3(B), the insulating particles IP are typically indicated by black circles.

[0037] (3) Protrusion As shown in Fig. 2, Fig. 4, and Fig. 5(A) to (C), the first heat conducting member 111 has a plurality of protrusions 114 on the bottom surface BM of the holding part 113. These protrusions 114 are arranged in a matrix pattern over the entire surface of the bottom surface BM of the holding part 113, and protrude from the bottom surface BM in a protruding manner. The base portions of the protrusions 114 located on the bottom surface BM side can have various cross-sectional shapes such as a rectangle, a circle, an ellipse, or an oval. In contrast, the protrusions 114 have a tapered shape, and the tip portions are formed in a point shape. Therefore, contact with the protrusions 114 is a point contact.

[0038] The height of the protrusion 114 is, for example, 0.5 mm or more. However, the height of the protrusion 114 is appropriately set from the viewpoint of achieving the effect of maintaining a low reaction force, which will be described later.

[0039] When the projection 114 comes into point contact with the contact object, in this embodiment, the heat dissipation object 11, the contact area is, for example, 10 mm 2 , preferably 1 mm 2 However, the size and shape of the projection 114 from the base to the tip and the contact area when it comes into point contact with the contact object are appropriately set from the viewpoint of achieving the effect of maintaining low reaction force, which will be described later.

[0040] The second heat conducting member 131 also enters between the multiple protrusions 114 and reaches around to the bottom surface BM of the holding portion 113 .

[0041] 2 and 5(A) to (C), heat dissipation target 11 is received by second heat conductive member 131. At this time, when the tightening force of bolts 51 for attaching heat sink 31 to heat dissipation target 11 is increased, the contact pressure of heat dissipation target 11 with second heat conductive member 131 increases. Then, second heat conductive member 131 is compressed, and the amount of compression increases in accordance with the increase in the contact pressure of heat dissipation target 11.

[0042] As shown in FIG. 5(B), in this embodiment, each part is configured so that heat dissipation target 11 comes into contact with the tip of protrusion 114 when the compression amount of second heat conductive member 131 reaches a predetermined amount.

[0043] As shown in FIG. 5(C), when the compression amount of second heat conducting member 131 is further increased, protrusion 114 is elastically deformed.

[0044] 2. Manufacturing method To manufacture the thermal conduction member 101, a first thermal conduction member 111 and a second thermal conduction member 131 are prepared, and the first thermal conduction member 111 is placed on the mounting surface 32 of the heat sink 31 facing the heat dissipation target 11 so that the contact portion 112 provided on one surface 111A contacts the mounting surface 32 of the heat sink 31 facing the heat dissipation target 11.

[0045] Then, second heat conductive member 131 is filled into holding portion 113 provided on first heat conductive member 111. At this time, care is taken to ensure that second heat conductive member 131 reaches bottom surface BM of holding portion 113. In this way, heat conductive member 101 is completed.

[0046] Next, to attach the heat sink 31 to the heat dissipation target 11, the heat dissipation target 11 is placed on the second heat conductive member 131, and the bolts 51 inserted from the side of the substrate 12 (see FIG. 1) are screwed into the heat sink 31 and tightened. This causes the heat dissipation target 11 to be received by the second heat conductive member 131, completing the assembly of the heat dissipation target 11 and the heat sink 31.

[0047] 3. Effects The thermal conduction member 101 of the present embodiment has the four basic functional effects of improving thermal conductivity, improving insulation, improving ease of assembly, and improving low reaction force, as well as the functional effect of maintaining low reaction force.

[0048] (1) Thermal conductivity The first heat conducting member 111 and the second heat conducting member 131 are made by adding a filler, heat conducting particles TC, which provides thermal conductivity to the main components of the members, silicone rubber SR and grease G. The first heat conducting member 111 is in surface contact with the heat sink 31, and the second heat conducting member 131 is in contact with the first heat conducting member 111, receiving the heat dissipation target 11 in a manner that envelops it.

[0049] Therefore, the heat conductive member 101 exhibits good thermal conductivity, efficiently transfers the heat generated in the heat dissipation target 11 to the heat sink 31, and contributes to the heat dissipation in the heat sink 31.

[0050] (2) Insulation Both first heat conducting member 111 and second heat conducting member 131 are made by adding and mixing a filler, insulating particles IP, which provide insulation to silicone rubber SR and grease G that constitute the main components of the material.

[0051] Therefore, the heat conducting member 101 exhibits good insulating properties, and when the heat dissipation target 11 is an electronic component or an electronic device, it can be protected.

[0052] (3) Ease of assembly Second heat conductive member 131 is a viscoelastic body and has poor shape retention, making it difficult to handle. In the present embodiment, second heat conductive member 131 is housed in holding portion 113 of first heat conductive member 111, whose shape is maintained, so that heat conductive member 101 has excellent handleability.

[0053] Therefore, when attaching heat sink 31 to heat dissipation target 11, heat conductive member 101 of the present embodiment contributes to improving the efficiency of assembly work in attaching heat sink 31 to heat dissipation target 11 with heat conductive member 101 interposed therebetween.

[0054] (4)Low reaction force Second heat conducting member 131 has viscoelasticity. Heat dissipation target 11 is supported by being embedded in second heat conducting member 131 having such properties. In this case, second heat conducting member 131 exerts a low reaction force property that receives the contact pressure of heat dissipation target 11 with a low reaction force.

[0055] Therefore, second heat conducting member 131 produces a buffering effect and a vibration damping effect on heat dissipation target 11, and can protect heat dissipation target 11 from damage caused by excessive external force or its own vibration.

[0056] (5) Maintaining low reaction force 6 shows a reference example of a first heat conductive member denoted by a reference numeral in the 900 series. A first heat conductive member 911 of the reference example is provided with a concave holding portion 913 having an upper opening OP, but differs from first heat conductive member 111 of the present embodiment in that it does not have protrusions 114 on its bottom surface BM.

[0057] As shown in Fig. 7, in the heat conduction member 901 of the reference example using the first heat conduction member 911, when the contact pressure of the heat dissipation target 11 against the second heat conduction member 931 increases, the grease G that constitutes the main component of the second heat conduction member 931 is compressed and enters a highly compressed state. Then, in the first heat conduction member 911, the grease G behaves as if it is escaping, increasing the reaction force. In this state, the viscoelasticity of the grease G decreases, and the buffering and vibration damping effects that the second heat conduction member 931 inherently has are weakened. As a result, the heat dissipation target 11 cannot be sufficiently protected.

[0058] Heat conduction member 101 of the present embodiment is the same as that of the reference example in that, when the contact pressure of heat dissipation target 11 against second heat conduction member 131 increases, grease G, which is the main component of second heat conduction member 131, is compressed. Compare FIG. 2 with FIG. 5(A). In contrast, heat conduction member 101 of the present embodiment causes heat dissipation target 11 to come into contact with protrusions 114 provided on bottom surface BM of holding portion 113 when the compression amount of second heat conduction member 131, which is mainly composed of grease G, reaches a predetermined amount. This point differs from heat conduction member 901 of the reference example, which does not have protrusions 114 on bottom surface BM of holding portion 913.

[0059] Here, when the compression amount of second heat conductive member 131 reaches a predetermined amount, it means the stage before grease G, which is the main component of second heat conductive member 131, is compressed to such an extent that its viscoelasticity is significantly reduced. This stage is related to the height of protrusions 114.

[0060] That is, since the grease G has reached the bottom surface BM of the holding portion 113, when the heat dissipation target 11 comes into contact with the protrusion 114, the amount of grease G held in the region from the tip of the protrusion 114 to the bottom surface BM of the holding portion 113 depends on the height of the protrusion 114. In this embodiment, the height of the protrusion 114 is set so that the amount of grease G at this time is an amount that does not significantly reduce the viscoelasticity. Therefore, in the state shown in FIG. 5(B) at the moment when the heat dissipation target 11 comes into contact with the protrusion 114, the viscoelasticity of the second heat conductive member 131 does not significantly decrease due to the action of the grease G that has reached the bottom surface BM of the holding portion 113.

[0061] When the contact pressure of heat dissipation target 11 against second heat conductive member 131 increases further from the state shown in Fig. 5(B), protrusions 114 elastically deform as if being crushed, and transition to the state shown in Fig. 5(C). Even at this time, grease G still exists between bottom surface BM of holding part 113 and heat dissipation target 11, so the viscoelasticity of second heat conductive member 131 is not significantly affected.

[0062] Moreover, the elastic deformation of the protrusions 114 contributes to slowing down the compression speed of the grease G while exerting a cushioning effect on the heat dissipation target 11. From this point of view as well, the low reaction force property of the heat conductive member 101 is maintained.

[0063] As analyzed above, according to the heat conductive member 101 of the present embodiment, it is possible to suppress an increase in the reaction force even if the contact pressure of the heat dissipation target 11 increases. As a result, it is possible to provide the heat dissipation target 11 with even greater protection.

[0064] 4. Variations Various modifications and variations are possible when implementing the present invention.

[0065] For example, in this embodiment, various materials are given for use in the first thermal conductive member 111 and the second thermal conductive member 131, but these materials are merely examples, and various other materials can be used in practice.

[0066] In this embodiment, a specific shape is shown for the protrusion 114 provided on the bottom surface BM of the holding part 113. Such a shape of the protrusion 114 is merely an example, and it is possible to give various shapes to the protrusion 114, such as a cone shape, a shape in which the tip is planar rather than point-shaped, etc.

[0067] Any other variations or modifications are possible when implementing the present invention.

[0068] [Second embodiment] The second embodiment will be described with reference to Figures 6 to 10. The same parts as those in the first embodiment are designated by reference numerals having the same last two digits, and the description will be omitted as appropriate.

[0069] 1. Configuration As shown in Fig. 8, this embodiment is common to the first embodiment in that first heat conducting member 211 has contact portion 212 on one surface 211A side and holding portion 213 on the opposite surface 211B. Second heat conducting member 231 itself is also common to the first embodiment. This embodiment differs from the first embodiment in the following two points.

[0070] (1) Storage section The first heat conducting member 211 has a concave accommodation portion 215 on the side of one surface 211A, and the accommodation portion 215 and the holding portion 213 are partitioned by a partition wall 216. The partition wall 216 is a complete wall provided in the middle portion of the arrangement direction of the accommodation portion 215 and the holding portion 213, and is disposed at a position closer to the one surface 211A side than the opposite surface 211B. The complete wall means a wall without holes. The accommodation portion 215 and the holding portion 213 are not in communication with each other and are completely isolated by the partition wall 216.

[0071] (2) Inclined surface An inclined surface 217 is provided on one surface 211A of first thermal conductive member 211. Inclined surface 217 is provided on inner wall 218a of wall portion 218 that partitions accommodation portion 215. Wall portion 218 has an edge E that defines outer periphery 211O of first thermal conductive member 211 on the one surface 211A side. Inclined surface 217 is a surface that inclines from edge E toward partition wall 216. When viewed from partition wall 216, inclined surface 217 has a shape that widens toward edge E.

[0072] Due to the shape of first heat conduction member 211 having inclined surface 217, contact portion 212 is provided at edge E. In the case of the present embodiment, inclined surface 217 maintains an inclined shape up to edge E, so edge E has a linear shape. Therefore, contact portion 212 is in line contact with mounting surface 32 of heat sink 31. The contact width due to the line contact is, for example, 0.1 to 3 mm.

[0073] The inclined surface 217 has an angle of, for example, 45 degrees with respect to the planar surface 211A including the contact portion 212. This angle is merely an example, and the inclined surface 217 can be set to any desired angle within a range of 10 to 80 degrees with respect to the surface 211A.

[0074] 2. Manufacturing method To manufacture the thermal conductive member 201, as shown in Figures 9(A) and (B), a first thermal conductive member 211 and a second thermal conductive member 231 are prepared, and the second thermal conductive member 231 is filled into the holding portion 213 provided in the first thermal conductive member 211.

[0075] Before or after filling holding portion 213 with second thermal conductive member 231, second thermal conductive member 231 is filled into accommodation portion 215 of first thermal conductive member 211, as shown in Fig. 9(C). Then, first thermal conductive member 211 is placed on mounting surface 32 of heat sink 31 facing heat dissipation target 11 so that contact portion 212 provided on one surface 211A is in contact with first thermal conductive member 211. In this way, thermal conductive member 201 is completed.

[0076] Next, to attach the heat sink 31 to the heat dissipation target 11, the heat dissipation target 11 is placed on the second heat conductive member 231, and the bolts 51 inserted from the side of the substrate 12 (see FIG. 1) are screwed into the heat sink 31 and tightened. This causes the heat dissipation target 11 to be received by the second heat conductive member 231, completing the assembly of the heat dissipation target 11 and the heat sink 31.

[0077] 3. Effects The heat conductive member 201 of the present embodiment has four basic effects, namely, improved thermal conductivity, improved insulation, improved ease of assembly, and improved low reaction force, and also has the effects of maintaining low reaction force and improving adhesion. The four basic effects are the same as those of the first embodiment.

[0078] (1) Maintaining low reaction force (a) Contributions of the Detention Center In heat conduction member 201 of the present embodiment, when the contact pressure of heat dissipation target 11 against second heat conduction member 231 increases, second heat conduction member 231 held in holding portion 213 is compressed and enters a highly compressed state. Then, partition wall 216 elastically deforms, and second heat conduction member 231 housed in housing portion 215 is compressed. In this manner, the portion of second heat conduction member 231 held in holding portion 213 is compressed, and then the portion housed in housing portion 215 is compressed.

[0079] Therefore, according to heat conductive member 201 of the present embodiment, the low resilience of second heat conductive member 231 can be maintained, as compared with heat conductive member 901 of the reference example illustrated in FIGS.

[0080] (b) Contribution of inclined surface Moreover, first heat conductive member 211 has inclined surface 217 on inner wall 218a of wall portion 218 of accommodation portion 215. Therefore, when the contact pressure of heat dissipation target 11 against second heat conductive member 231 increases and partition wall 216 is pressed and elastically deformed, wall portion 218 receives a moment that rotates in a direction in which it collapses inward about contact portion 212 as a fulcrum. As a result, partition wall 216 deforms inward as it is pressed and elastically deforms, and the compression of second heat conductive member 231 accommodated in accommodation portion 215 can be delayed by that amount.

[0081] From this point of view, the low resilience of second heat conductive member 231 can be maintained as compared with heat conductive member 901 of the reference example illustrated in FIGS.

[0082] (2) Adhesion 7, in heat conductive member 901 shown as a reference example, flat contact portion 912 of first heat conductive member 911 is in surface contact with mounting surface 32 of heat sink 31. For this reason, as shown in FIG 10(A), as the smoothness of mounting surface 32 of heat sink 31 is low and surface irregularities 32a become large, the degree of adhesion of first heat conductive member 911 to mounting surface 32 decreases.

[0083] 10(B), according to heat conduction member 201 of the present embodiment, contact portion 212 of first heat conduction member 211, which is harder than second heat conduction member 231, is in line contact with mounting surface 32 of heat sink 31 only, while second heat conduction member 231, which is more flexible and accommodated in accommodation portion 215, is in surface contact. Second heat conduction member 231, which is mainly made of grease G, penetrates into irregularities 32a of mounting surface 32 of heat sink 31 due to its viscoelasticity.

[0084] Therefore, according to heat conductive member 201 of the present embodiment, the adhesion of heat conductive member 201 to mounting surface 32 of heat sink 31 can be improved, and the thermal conductivity can be further improved.

[0085] 4. Variations Various modifications and variations are possible when implementing the present invention.

[0086] For example, in first heat conduction member 211 of the present embodiment, edge E is formed to have a linear shape, and contact portion 212 is in line contact with mounting surface 32 of heat sink 31. In practice, edge E does not necessarily have to have a linear shape. Edge E may have a somewhat expanded area or a curved shape.

[0087] The inclined surface 217 does not have to be a flat surface, and may be a curved surface, for example, whose cross section is curved in a concave or convex shape.

[0088] The inclined surface 217 may have any shape as long as it can generate a moment in wall portion 218 of first heat conduction member 211 that rotates in a direction that causes it to collapse inward with contact portion 212 as a fulcrum when the contact pressure of heat dissipation target 11 against second heat conduction member 231 increases and partition wall 216 is pushed and elastically deformed.

[0089] Any other variations or modifications are possible when implementing the present invention.

[0090] [Third embodiment] The third embodiment will be described with reference to Figures 6, 7, and 11 to 14. The same parts as those in the first and second embodiments are designated by reference numerals having the same last two digits, and the description will be omitted as appropriate.

[0091] 1. Configuration This embodiment has many points in common with the second embodiment, except that a plurality of through holes 321 are provided in partition wall 316 of first thermal conductive member 311.

[0092] 11 to 13, through hole 321 has a perfect circular shape, completely penetrates partition wall 316, and communicates between holding portion 313 and accommodation portion 315. Second heat conductive member 331 extends from holding portion 313 to accommodation portion 315 via through hole 321.

[0093] 12 and 13, the multiple through holes 321 are arranged in a matrix over the entire surface of the partition wall 316. However, the through holes 321 are arranged only inward from the outer periphery of the partition wall 316, and are not provided so as to reach the boundary between the partition wall 316 and the inclined surface 317.

[0094] 2. Manufacturing method To manufacture the heat conduction member 301, as shown in Figures 14(A) and (B), a first heat conduction member 311 and a second heat conduction member 331 are prepared, and the first heat conduction member 311 is placed on the mounting surface 32 of the heat sink 31 facing the heat dissipation target 11 so that the contact portion 312 provided on one surface 311A ​​is in contact with the mounting surface 32 of the heat sink 31.

[0095] Then, second heat conductive member 331 is filled from the side of holding portion 313 provided on first heat conductive member 311. Then, second heat conductive member 331 passes through through hole 321 and wraps around to fill housing portion 315. In this way, heat conductive member 301 is completed.

[0096] Next, to attach the heat sink 31 to the heat dissipation target 11, the heat dissipation target 11 is placed on the second heat conductive member 331, and the bolts 51 inserted from the side of the substrate 12 (see FIG. 1) are screwed into the heat sink 31 and tightened. This causes the heat dissipation target 11 to be received by the second heat conductive member 331, completing the assembly of the heat dissipation target 11 and the heat sink 31.

[0097] 3. Effects Heat conductive member 301 of the present embodiment has the following effects: improved thermal conductivity, improved insulation, improved ease of assembly, improved low reaction force, maintenance of low reaction force, and improved adhesion. These effects are similar to those of heat conductive member 201 of the second embodiment. Of these effects, the improvement of ease of assembly and maintenance of low reaction force are particularly noteworthy.

[0098] (1) Improved assembly workability When filling the holding portion 313 and the accommodating portion 315 of the first heat conductive member 311 with the second heat conductive member 331, it is only necessary to fill the second heat conductive member 331 from the side of the holding portion 313. This is because the second heat conductive member 331 filled from the side of the holding portion 313 passes through the multiple through holes 321 and wraps around to the accommodating portion 315, so that both the holding portion 313 and the accommodating portion 315 are filled.

[0099] Therefore, according to the heat conduction member 301 of the present embodiment, the manufacture of the heat conduction member 301 and the manufacture of the assembly of the heat dissipation target 11 and the heat sink 31 with the heat conduction member 301 interposed therebetween can be facilitated, thereby improving the ease of assembly.

[0100] (2) Maintaining low reaction force In the second embodiment, when the contact pressure of the heat dissipation target 11 against the second heat conduction member 231 increases, the second heat conduction member 231 held in the holding portion 213 is compressed, and accordingly the partition wall 216 is elastically deformed, and the second heat conduction member 231 accommodated in the accommodation portion 215 is compressed.

[0101] In contrast, in the present embodiment, since holding portion 313 and accommodation portion 315 are in communication with each other via a plurality of through holes 321, second heat conduction member 331 held by holding portion 313 and second heat conduction member 331 accommodated in accommodation portion 315 are compressed as a unit. At this time, according to the present embodiment, the volume of second heat conduction member 331 as a whole is larger than that of second heat conduction member 931 merely held by holding portion 913 as illustrated in Figs. 6 and 7. Therefore, the viscoelasticity of grease G, which is the main component of second heat conduction member 331, is reduced, and the process until the buffering effect and vibration damping effect inherent to second heat conduction member 331 are reduced can be delayed.

[0102] Therefore, according to the heat conduction member 301 of the present embodiment, in cooperation with the contribution of the inclined surface 317, the low resilience of the second heat conduction member 331 can be maintained compared to the heat conduction member 901 of the reference example illustrated in Figures 6 and 7.

[0103] In addition, when the contact pressure of heat dissipation target 11 against second heat conductive member 331 increases, whether or not partition 316 is elastically deformed by the pressing pressure of heat conductive member 301 held by holding part 313, and if so, how much elastic deformation occurs, can be appropriately adjusted by changing the size, number, and arrangement of through holes 321. The elastic deformation of partition 316 also contributes to maintaining the low resilience of second heat conductive member 331.

[0104] 4. Variations Various modifications and variations are possible when implementing the present invention.

[0105] For example, the shape, number, arrangement, etc. of the through holes 321 are not limited to those in the above embodiment, and any shape, number, arrangement, etc. may be adopted. For example, it is possible to give the through holes 321 various arrangements, such as a circular shape in a broad sense, such as an ellipse or an oval shape, a polygonal shape, such as a triangle, a rectangle, a trapezoid, or a star shape, or a staggered arrangement or a random arrangement.

[0106] Any other variations or modifications are possible when implementing the present invention.

[0107] [Fourth embodiment] The fourth embodiment will be described with reference to Figures 15 and 16. The same parts as those in the first to third embodiments are designated by reference numerals having the same last two digits, and the description will be omitted as appropriate.

[0108] 1. Configuration This embodiment has many points in common with the third embodiment. The only difference is that wall 418 that divides housing portion 415 does not have inclined surfaces 217, 317 as in the second and third embodiments. Therefore, the end surface of first heat conducting member 411 on the side of one surface 411A forms flat contact portion 412 that is included within planar surface 411A.

[0109] 2. Manufacturing method To manufacture the heat conduction member 401, as shown in Figures 16(A) and (B), a first heat conduction member 411 and a second heat conduction member 431 are prepared, and the first heat conduction member 411 is placed on the mounting surface 32 of the heat sink 31 facing the heat dissipation target 11 so that the contact portion 412 provided on one surface 411A is in contact with the mounting surface 32 of the heat sink 31.

[0110] Then, second heat conductive member 431 is filled from the side of holding portion 413 provided on first heat conductive member 411. Then, second heat conductive member 431 passes through through hole 421 and wraps around to fill housing portion 415. In this way, heat conductive member 401 is completed.

[0111] Next, to attach the heat sink 31 to the heat dissipation target 11, the heat dissipation target 11 is placed on the second heat conductive member 431, and the bolts 51 inserted from the side of the substrate 12 (see FIG. 1) are screwed into the heat sink 31 and tightened. This causes the heat dissipation target 11 to be received by the second heat conductive member 431, completing the assembly of the heat dissipation target 11 and the heat sink 31.

[0112] 3. Effects Heat conducting member 401 of the present embodiment has the same effects as those of the third embodiment, except that it does not have the effects provided by inclined surface 317.

[0113] 4. Variations Various modifications and variations are possible when implementing the present invention.

[0114] [Fifth embodiment] The fifth embodiment will be described with reference to Figures 17 and 18. The same parts as those in the first to fourth embodiments are designated by reference numerals having the same last two digits, and the description will be omitted as appropriate.

[0115] 1. Configuration This embodiment has many points in common with the fourth embodiment, except that the partition wall 516 does not have the through holes 321 and 421.

[0116] 2. Manufacturing method To manufacture the thermal conductive member 501, as shown in Figures 18(A) and (B), a first thermal conductive member 511 and a second thermal conductive member 531 are prepared, and the second thermal conductive member 531 is filled into a holding portion 513 provided on the first thermal conductive member 511.

[0117] Before or after filling holding portion 513 with second thermal conductive member 531, second thermal conductive member 531 is filled into accommodation portion 515 of first thermal conductive member 511, as shown in Fig. 18(C). Then, first thermal conductive member 511 is placed on mounting surface 32 of heat sink 31 facing heat dissipation target 11 so that contact portion 512 provided on one surface 511A is in contact with first thermal conductive member 511. In this way, thermal conductive member 501 is completed.

[0118] Next, to attach the heat sink 31 to the heat dissipation target 11, the heat dissipation target 11 is placed on the second heat conductive member 531, and the bolts 51 inserted from the side of the substrate 12 (see FIG. 1) are screwed into the heat sink 31 and tightened. This causes the heat dissipation target 11 to be received by the second heat conductive member 531, completing the assembly of the heat dissipation target 11 and the heat sink 31.

[0119] 3. Effects Heat conductive member 501 of the present embodiment has the same effects as those of the fourth embodiment, except that it does not have the effects provided by through holes 321, 421.

[0120] 4. Variations Various modifications and variations are possible when implementing the present invention.

[0121] [Sixth embodiment] The sixth embodiment will be described with reference to Figures 19 and 20. The same parts as those in the first to fifth embodiments are designated by reference numerals having the same last two digits, and the description will be omitted as appropriate.

[0122] 1. Configuration A heat conductive member 601 of the present embodiment has a configuration that combines the first and fifth embodiments. More specifically, just as the first embodiment has the protrusions 114 on the bottom surface BM of the first heat conductive member 111, the heat conductive member 601 has protrusions 614 on the bottom surface BM of a holding portion 613 formed by a partition wall 616.

[0123] The protrusions 614 are arranged in a matrix pattern over the entire bottom surface BM of the holding portion 613, and protrude from the bottom surface BM in a protruding manner. The base portions of the protrusions 614 located on the bottom surface BM side can have various cross-sectional shapes such as rectangular, circular, elliptical, and oval. In contrast, the protrusions 614 have a tapered shape, and the tip portions are formed in a point shape. Therefore, contact with the protrusions 614 is point contact.

[0124] The second heat conducting member 631 also enters between the multiple protrusions 614 and reaches the bottom surface BM of the holding portion 613 .

[0125] 2. Manufacturing method 20(A)(B), in order to manufacture heat conductive member 601, a first heat conductive member 611 and a second heat conductive member 631 are prepared, and second heat conductive member 631 is filled into holding portion 613 provided in first heat conductive member 611. At this time, care is taken to ensure that second heat conductive member 631 reaches bottom surface BM of holding portion 613.

[0126] Before or after filling the holding portion 613 with the second thermal conductive member 631, the second thermal conductive member 631 is filled into the accommodation portion 615 of the first thermal conductive member 611, as shown in Fig. 20(C). Then, the first thermal conductive member 611 is placed on the mounting surface 32 of the heat sink 31 facing the heat dissipation target 11 so that the contact portion 612 provided on the one surface 611A side is in contact with the first thermal conductive member 611. In this way, the thermal conductive member 601 is completed.

[0127] Next, to attach the heat sink 31 to the heat dissipation target 11, the heat dissipation target 11 is placed on the second heat conductive member 631, and the bolts 51 inserted from the side of the substrate 12 (see FIG. 1) are screwed into the heat sink 31 and tightened. This causes the heat dissipation target 11 to be received by the second heat conductive member 631, completing the assembly of the heat dissipation target 11 and the heat sink 31.

[0128] 3. Effects The heat conducting member 601 of the present embodiment has the same effects as those of the first and fifth embodiments.

[0129] 4. Variations Various modifications and variations are possible when implementing the present invention.

[0130] In this embodiment, a specific shape is shown for the protrusion 614 provided on the bottom surface BM of the holding part 613. Such a shape of the protrusion 614 is merely an example, and various shapes can be given to the protrusion 614, such as a cone shape, a shape in which the tip is not dot-shaped but planar, etc.

[0131] Any other variations or modifications are possible when implementing the present invention. [Explanation of symbols]

[0132] 11 Heat dissipation target 12 Substrate 31 Heat sink 32 Mounting surface 32a unevenness 51 Volts 101 Thermal conductive materials 111 First heat conductive member 111A One side 111B Opposite side 112 Contact part 113 Holding part 114 Protrusion 131 Second heat conductive member 201 Thermal Conductive Materials 211 First heat conductive member 211A One side 211B Opposite side 211O outer circumference 212 Contact part 213 Holding part 215 Storage unit 216 Bulkhead 217 Slope 218 Wall section 218a Interior wall 231 Second heat conductive member 301 Thermal Conductive Materials 311 First heat conductive member 311A One side 311B Opposite side 311O outer circumference 312 Contact part 313 Holding part 315 Storage Unit 316 Bulkhead 317 Slope 318 Wall 318a Interior wall 321 Through hole 331 Second heat conductive member 401 Thermal Conductive Materials 411 First heat conductive member 411A One side 411B Opposite side 412 Contact part 413 Holding part 415 Storage unit 416 Bulkhead 418 Wall 421 Through hole 431 Second heat conductive member 501 Thermal Conductive Materials 511 First heat conductive member 511A One side 511B Opposite side 512 Contact part 513 Holding part 515 Storage unit 516 Bulkhead 518 Wall 531 Second heat conductive member 601 Thermal Conductive Materials 611 First heat conductive member 611A One side 611B Opposite side 612 Contact part 613 Holding part 614 Protrusion 615 Storage unit 616 Bulkhead 618 Wall section 631 Second heat conductive member 901 Thermal Conductive Materials 911 First heat conductive member 913 Holding part 931 Second heat conductive member BM bottom E edge Grease IP insulating particles OP Top opening SR Silicone Rubber TC Thermally Conductive Particles

Claims

1. a first heat conducting member having elasticity, the first heat conducting member having a contact portion on one side thereof that contacts a heat sink attached to a heat dissipation target, and a concave holding portion on a surface opposite to the first surface; a second heat conducting member having viscoelasticity and held by the holding portion to receive the heat dissipation target; Equipped with the first heat conducting member has a plurality of protrusions on a bottom surface of the holding portion, the protrusions being in contact with the heat dissipation target and elastically deforming when a compression amount of the second heat conducting member corresponding to a contact pressure of the heat dissipation target reaches a predetermined amount; The second heat conducting member extends to a bottom surface of the holding portion. Thermal conductive material.

2. The second thermal conductive member is a grease containing thermally conductive particles. The thermal conductive member according to claim 1 .

3. The first thermally conductive member includes thermally conductive particles. The thermal conductive member according to claim 1 .

4. The protrusion is in point contact with the heat dissipation target. The thermal conductive member according to claim 1 .

5. a first heat conducting member having elasticity, the first heat conducting member having a contact portion on one side thereof that contacts a heat sink attached to a heat dissipation target, the first heat conducting member having a concave accommodation portion on the one side thereof, and a concave holding portion on a side opposite to the first heat conducting member, the accommodation portion and the holding portion being partitioned by a partition wall; a second heat conducting member having viscoelasticity, a portion of which is held by the holding portion and receives the heat dissipation target, and another portion of which is accommodated in the accommodation portion and contacts the heat sink; Equipped with an inner wall of a wall portion that defines the accommodation portion has an inclined surface that is inclined from an edge that defines an outer periphery of the first thermal conductive member toward the partition wall on the one surface side, The contact portion provided on the edge is in line contact with the heat sink. Thermal conductive material.

6. The second thermal conductive member is a grease containing thermally conductive particles. The heat conductive member according to claim 5 .

7. The first thermally conductive member includes thermally conductive particles. The heat conductive member according to claim 5 .

8. the partition wall has a plurality of through holes that communicate the holding portion and the storage portion, the second heat conductive member extends from the holding portion to the housing portion through the through hole; The heat conductive member according to claim 5 .

9. a first heat conducting member having elasticity, the first heat conducting member having a contact portion on one side thereof that contacts a heat sink attached to a heat dissipation target, the first heat conducting member having a concave accommodation portion on the one side thereof and a concave holding portion on a side opposite to the first heat conducting member, the first heat conducting member separating the accommodation portion from the holding portion by a partition wall having a plurality of through holes; a second heat conducting member having viscoelasticity, the second heat conducting member extending from the holding portion to the housing portion through the through hole, a portion held by the holding portion receiving the heat dissipation target, and another portion housed in the housing portion contacting the heat sink; A heat conductive member comprising:

10. The second thermal conductive member is a grease containing thermally conductive particles. The heat transfer member according to claim 9.

11. The first thermally conductive member includes thermally conductive particles. The heat transfer member according to claim 9.

12. a first heat conducting member having elasticity, the first heat conducting member having a contact portion on one side thereof that contacts a heat sink attached to a heat dissipation target, the first heat conducting member having a concave accommodation portion on the one side thereof, and a concave holding portion on a side opposite to the first heat conducting member, the accommodation portion and the holding portion being partitioned by a partition wall; a second heat conducting member having viscoelasticity, a portion of which is held by the holding portion and receives the heat dissipation target, and another portion of which is accommodated in the accommodation portion and contacts the heat sink; A heat conductive member comprising:

13. The second thermal conductive member is a grease containing thermally conductive particles. The thermally conductive member according to claim 12.

14. The first thermally conductive member includes thermally conductive particles. The thermally conductive member according to claim 12.

15. the first heat conducting member has a plurality of protrusions on a bottom surface of the holding portion, the protrusions being in contact with the heat dissipation target and elastically deforming when a compression amount of the second heat conducting member corresponding to a contact pressure of the heat dissipation target reaches a predetermined amount; The second heat conducting member extends to a bottom surface of the holding portion. The thermally conductive member according to claim 12.

16. The protrusion is in point contact with the heat dissipation target. The thermally conductive member according to claim 15.

17. A method for producing a heat conductive member according to any one of claims 1 to 4, comprising the steps of: providing the first thermally conductive member and the second thermally conductive member; filling the holding portion with the second thermal conductive member so as to wrap around to a bottom surface of the holding portion of the first thermal conductive member; A method for manufacturing a thermally conductive member.

18. A method for producing a heat conductive member according to any one of claims 5 to 7 and 12 to 14, comprising the steps of: providing the first thermally conductive member and the second thermally conductive member; filling the holding portion of the first thermal conductive member with the second thermal conductive member; filling the housing portion of the first thermal conductive member with the second thermal conductive member; A method for manufacturing a thermally conductive member.

19. A method for producing a heat conductive member according to any one of claims 8 to 11, comprising the steps of: providing the first thermally conductive member and the second thermally conductive member; filling the second thermal conductive member into the holding portion from a side of the holding portion of the first thermal conductive member so as to be filled into the accommodation portion through the through hole; A method for manufacturing a thermally conductive member.

20. A method for producing a heat conductive member according to claim 15 or 16, comprising the steps of: providing the first thermally conductive member and the second thermally conductive member; filling the holding portion with the second thermal conductive member so as to wrap around to a bottom surface of the holding portion of the first thermal conductive member; filling the housing portion of the first thermal conductive member with the second thermal conductive member; A method for manufacturing a thermally conductive member.

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