Electrical component, busbar unit, drive unit, and mobile body

Abstract

To provide an electrical component comprising a metal member and a resin member covering the metal member, the electrical component capable of inhibiting occurrence of insulation breakdown, as well as a busbar unit, a drive unit, and a mobile body comprising the drive unit.SOLUTION: An electrical component comprises a metal member and a resin member comprising a polyamide resin composition that covers the metal member, wherein the polyamide resin composition comprises a component unit (a1) derived from a specified amount of terephthalic acid, and a component unit (b1) derived from 1,3-bis(aminomethyl)cyclohexane or 1,4-bis(aminomethyl)cyclohexane in an amount of 50 mol% or more relative to the diamine-derived component unit (b).SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an electric component, a busbar unit, a drive unit, and a moving body. [Background technology]

[0002] Polyamide resin compositions have been known as molding materials. Polyamide resin compositions are widely used as materials for various parts such as automobile parts and electric / electronic parts, and are known to have excellent mechanical strength in molded articles.

[0003] For example, Patent Document 1 discloses a polyamide resin composition containing a specific amount of semicrystalline polyamide polymer and a specific amount of short reinforcing fibers, the semicrystalline polyamide polymer containing component units derived from terephthalic acid and component units derived from 1,3-bis(aminomethyl)cyclohexane or 1,4-bis(aminomethyl)cyclohexane. Patent Document 1 states that the glass transition temperature of the polyamide polymer can be increased while the melting point is lowered, thereby improving the processability of the polyamide resin composition.

[0004] For example, Patent Document 2 discloses a copolyamide containing, as a diamine component, 4 to 38 mol % of component units derived from bis(aminomethyl)cyclohexane relative to the total number of moles of the diamine component, and, as a dicarboxylic acid component, 64 to 100 mol % of component units derived from terephthalic acid relative to the total number of moles of the dicarboxylic acid component. Patent Document 2 states that the copolyamide has a high glass transition temperature and can be used in applications under high temperature environments. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2018-531296 [Patent Document 2] JP 2017-075303 A Summary of the Invention [Problem to be solved by the invention]

[0006] Incidentally, in an electrical component for supplying electricity to other components by passing an electric current through a metal member, the polyamide resin composition can be used in a resin member for insulating and coating the metal member.

[0007] When a polyamide resin composition is melted during molding of a resin member for insulating a metal member, it is desirable that the polyamide resin does not thermally decompose. If the above-mentioned thermal decomposition occurs, problems such as variation in weight of the resin member, reduction in strength of the resin member, and mold contamination due to gas generated by thermal decomposition occur. Therefore, there is a demand for a polyamide resin composition containing a polyamide resin whose melting point is sufficiently lower than the thermal decomposition temperature.

[0008] In order to shorten the molding time of the resin member, it is desirable that the polyamide resin composition has high fluidity in a mold during molding, and therefore it is desirable to use a polyamide resin composition having a longer flow length in the mold.

[0009] In addition, when a current is passed through the metal member, Joule heat is generated, and the resin member covering the metal member is exposed to high temperatures. In this case, when a voltage is applied to the resin member exposed to high temperatures, a problem occurs in that dielectric breakdown is likely to occur.

[0010] The present invention has been made in consideration of the above circumstances, and has an object to provide an electrical component having a resin member containing a polyamide resin composition having a melting point sufficiently lower than the thermal decomposition temperature and a longer flow length in a mold, which can suppress the occurrence of insulation breakdown in the resin member, a bus bar unit, a drive unit, and a moving body including the drive unit. [Means for solving the problem]

[0011] In order to solve the above problems, one aspect of the present invention relates to the following electrical components [1] to [5]. [1] A metal member; A resin member containing a polyamide resin composition and coating the metal member, The polyamide resin composition includes a polyamide resin (A) including a component unit (a) derived from a dicarboxylic acid and a component unit (b) derived from a diamine, The component unit (a) derived from a dicarboxylic acid is A component unit (a1) derived from terephthalic acid, the content of which is 10 mol % or more and 100 mol % or less relative to the total number of moles of the component unit (a) derived from the dicarboxylic acid; and a component unit (a2) derived from an aromatic dicarboxylic acid other than an aliphatic dicarboxylic acid, an alicyclic dicarboxylic acid, or a terephthalic acid, the content of which relative to the total number of moles of the component unit (a) derived from the dicarboxylic acid is 0 mol % or more and 90 mol % or less, The diamine-derived component unit (b) is a component unit (b1) derived from 1,3-bis(aminomethyl)cyclohexane or 1,4-bis(aminomethyl)cyclohexane, the content of which is 50 mol % or more and 100 mol % or less relative to the total number of moles of the component unit (b) derived from the diamine; and a component unit (b2) derived from an alkylene diamine having 4 to 12 carbon atoms, the content of which is 0 mol % or more and 50 mol % or less relative to the total number of moles of the component unit (b) derived from the diamine, Electrical components. [2] The electrical component according to [1], wherein the content of the component unit (b1) derived from the 1,3-bis(aminomethyl)cyclohexane or the 1,4-bis(aminomethyl)cyclohexane is 65 mol % or more and 95 mol % or less, based on the total number of moles of the component unit (b) derived from the diamine. [3] The electrical component according to [1] or [2], wherein the content of the component unit (a1) derived from the terephthalic acid is 20 mol % or more and 100 mol % or less, based on the total number of moles of the component unit (a) derived from the dicarboxylic acid. [4] The electrical component according to any one of [1] to [3], wherein the polyamide resin (A) has a glass transition temperature (Tg) of 160° C. or higher. [5] The electrical part according to any one of [1] to [4], which is an automotive part.

[0012] In order to solve the above problem, another aspect of the present invention relates to a busbar unit as described below in [6]. [6] A metal busbar; a retaining member comprising a polyamide resin composition, covering the bus bar and retaining the bus bar, The polyamide resin composition includes a polyamide resin (A) including a component unit (a) derived from a dicarboxylic acid and a component unit (b) derived from a diamine, The component unit (a) derived from a dicarboxylic acid is A component unit (a1) derived from terephthalic acid, the content of which is 10 mol % or more and 100 mol % or less relative to the total number of moles of the component unit (a) derived from the dicarboxylic acid; and a component unit (a2) derived from an aromatic dicarboxylic acid other than an aliphatic dicarboxylic acid, an alicyclic dicarboxylic acid, or a terephthalic acid, the content of which relative to the total number of moles of the component unit (a) derived from the dicarboxylic acid is 0 mol % or more and 90 mol % or less, The diamine-derived component unit (b) is a component unit (b1) derived from 1,3-bis(aminomethyl)cyclohexane or 1,4-bis(aminomethyl)cyclohexane, the content of which is 50 mol % or more and 100 mol % or less based on the total number of moles of the component unit (b) derived from the diamine; and a component unit (b2) derived from an alkylene diamine having 4 to 12 carbon atoms, the content of which is 0 mol % or more and 50 mol % or less relative to the total number of moles of the component unit (b) derived from the diamine, Busbar unit.

[0013] In order to solve the above problem, another aspect of the present invention relates to a drive unit as described below in [7]. [7] A motor; an inverter that supplies power to the motor; A drive unit having a bus bar unit electrically connecting the motor and the inverter, The busbar unit is the busbar unit according to [6]. Drive unit.

[0014] Another aspect of the present invention for solving the above problem relates to a moving object as described below in [8]. [8] The aircraft, [7] and a drive unit according to the present invention. Mobile body. Effect of the Invention

[0015] According to the present invention, which has been made in consideration of the above circumstances, it is possible to provide an electrical component having a resin member containing a polyamide resin composition having a melting point sufficiently lower than the thermal decomposition temperature and a longer flow length in a mold, which can suppress the occurrence of insulation breakdown in the resin member, a bus bar unit, a drive unit, and a moving body including the drive unit. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a schematic diagram illustrating an exemplary configuration of an electrical component according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a configuration diagram showing an exemplary configuration of a moving body (vehicle) according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, an embodiment of the present invention will be described in detail. However, the present invention is not limited to the following embodiment.

[0018] 1. Electrical parts (metal-resin composites) Fig. 1 is a schematic diagram showing an exemplary embodiment of an electric component 100 according to the present embodiment. As shown in Fig. 1, the electric component 100 is a metal-resin composite body including a metal member 110 and a resin member 120 that coats the metal member 110.

[0019] 1-1.Metal parts There are no particular limitations on the material and shape of the metal member 110, so long as it is a conductive metal member. For example, the material of the metal member 110 can be iron, copper, nickel, gold, silver, platinum, cobalt, zinc, lead, tin, titanium, chromium, aluminum, magnesium, manganese, or alloys such as stainless steel, brass, and phosphor bronze.

[0020] These materials can be selected depending on the application of the electrical component 100. For example, when thermal conductivity is required, aluminum, aluminum alloys, magnesium, magnesium alloys, copper, and copper alloys are preferred, and copper and copper alloys are more preferred. When weight reduction and strength are required, aluminum, aluminum alloys, magnesium, and magnesium alloys are preferred. From the viewpoint of electrical conductivity, aluminum, aluminum alloys, copper, and copper alloys are preferred.

[0021] Metal member 110 is covered with resin member 120. For example, when electrical component 100 shown in Fig. 1 is a busbar unit, a part of metal member 110, which is a conductor serving as a busbar, is covered with resin member 120, which serves as a holding member for attaching the busbar to another member. This insulates the part of metal member 110 covered with resin member 120. In this case, metal member 110 may have a polygonal or circular cross section, but is preferably polygonal, and is more preferably a plate-shaped member having a rectangular cross section.

[0022] Electrical component 100 shown in FIG. 1 has four bus bars (metallic members 110), each of which is a plate-like member having a rectangular cross section, arranged in a vertical direction (Z direction in FIG. 1), and these four bus bars are integrally covered with resin member 120 having a substantially rectangular parallelepiped shape. Note that the configuration of electrical component 100 is not limited to this, and the shape, number and arrangement of the bus bars (for example, the bus bars may be arranged in a horizontal direction (X direction or Y direction in FIG. 1)), the shape of resin member 120, and the like can be adjusted as appropriate. Furthermore, when electrical component 100 includes three or more bus bars (metallic members 110), the intervals between the bus bars (metallic members 110) may be the same or different.

[0023] It is preferable that the surface of the metal member 110 is roughened. The method of roughening is not particularly limited, and the surface may be roughened by a chemical treatment such as immersion in a treatment solution containing a base or acid or etching, or a physical treatment such as laser or blasting.

[0024] The surface of the roughened metal member 110 is preferably such that the center-to-center distance (pitch) of the plurality of convex portions formed by the surface roughening treatment is 5 nm or more and 500 μm or less. When the center-to-center distance of the plurality of convex portions is 5 nm or more, the recesses between the convex portions are appropriately large, so that the resin member 120 can easily penetrate into the recesses during bonding, and the bonding strength between the metal member 110 and the resin member 120 can be further improved. When the center-to-center distance of the plurality of convex portions is 500 μm or less, the recesses do not become too large, so that the occurrence of gaps at the metal-resin interface of the electric component 100 can be further suppressed, and the airtightness can be further improved. From the same viewpoint, the center-to-center distance of the plurality of convex portions is more preferably 5 μm or more and 250 μm or less. The center-to-center distance of the plurality of convex portions is the average value of the distances between the center of one convex portion and the center of the adjacent convex portion.

[0025] The center-to-center distance of the multiple protrusions can be measured by removing the resin member 120 from the electrical component 100 by mechanical peeling, solvent cleaning, or the like, and observing the surface of the exposed metal member 110 using an electron microscope or laser microscope, or a surface roughness measuring device.

[0026] Specifically, when the center-to-center distance of the multiple protrusions is less than 0.5 μm, it can be observed with an electron microscope, and when the center-to-center distance of the multiple protrusions is 0.5 μm or more, it can be observed with a laser microscope or a surface roughness measuring device. For example, in a photograph of the surface of a metal part taken with an electron microscope or a laser microscope, 50 arbitrary protrusions are selected and the center-to-center distance of each of these protrusions is measured. Then, all the measured values ​​of the center-to-center distance of the protrusions are added up and divided by 50 (average) to obtain the "center-to-center distance of the multiple protrusions."

[0027] The average value of the ten-point average roughness (Rz) of the roughened surface of the metal member 110 over an evaluation length of 4 mm is not particularly limited, but it is preferable that it exceeds 2 μm, more preferably is greater than 2 μm and not greater than 50 μm, and even more preferably is greater than 2.5 μm and not greater than 45 μm.

[0028] The average value of the ten-point mean roughness (Rz) can be measured in accordance with JIS B0601 (ISO 4287). Specifically, the ten-point mean roughness (Rz) on a total of six straight line sections, including three arbitrary straight line sections parallel to each other and three arbitrary straight line sections perpendicular to the above, is measured, and the average of these is taken as the average value of Rz.

[0029] The average length of the roughness curve element (RSm) of the roughened surface of the metal member 110 is preferably 0.5 μm or more and 500 μm or less. In particular, from the viewpoint of further increasing the bonding strength, it is preferable that the center-to-center distance of a plurality of convex portions is less than 0.5 μm and the average length of the roughness curve element (RSm) is 0.5 μm or more and 500 μm or less. The average length of the roughness curve element can be measured according to JIS B0601 (ISO 4287) as described above.

[0030] 1-2.Resin materials The resin member 120 contains a polyamide resin composition. The resin member 120 is an insulating member, and covers the metal member 110 to provide an insulating coating for the metal member 110.

[0031] 1-2-1. Polyamide resin composition In the present embodiment, the polyamide resin composition contains a polyamide resin (A).

[0032] <Polyamide resin (A)> In this embodiment, the polyamide resin (A) contains a component unit (a) derived from a dicarboxylic acid and a component unit (b) derived from a diamine. The component unit (a) derived from the dicarboxylic acid contains a component unit (a1) derived from terephthalic acid, the content of which is from 10 mol % to 100 mol % relative to the total number of moles of the component unit (a) derived from the dicarboxylic acid, and a component unit (a2) derived from an aliphatic dicarboxylic acid, an alicyclic dicarboxylic acid, or an aromatic dicarboxylic acid other than terephthalic acid, the content of which is from 0 mol % to 90 mol % relative to the total number of moles of the component unit (a) derived from the dicarboxylic acid. The diamine-derived component unit (b) includes component units (a1) derived from 1,3-bis(aminomethyl)cyclohexane or 1,4-bis(aminomethyl)cyclohexane, the content of which is from 50 mol% to 100 mol% relative to the total number of moles of the diamine-derived component units (b), and component units (b2) derived from an alkylene diamine having from 4 to 12 carbon atoms, the content of which is from 0 mol% to 50 mol% relative to the total number of moles of the diamine-derived component units (b). The present inventors have found that a polyamide resin composition containing a polyamide resin (A) having these characteristics has a melting point (Tm) that is sufficiently lower than the thermal decomposition temperature, can extend the flow length in a mold, and can suppress dielectric breakdown of a resin member.

[0033] As described above, the diamine-derived component unit (b) of the polyamide resin (A) in this embodiment includes the component unit (b1) derived from 1,3-bis(aminomethyl)cyclohexane or 1,4-bis(aminomethyl)cyclohexane and the component unit (b2) derived from an alkylene diamine having 4 to 12 carbon atoms, and the content of the component unit (b1) relative to the diamine-derived component unit (b) is greater than the content of the component unit (b2). This makes it easier to increase the glass transition temperature (Tg) of the polyamide resin (A) while lowering the melting point (Tm) of the polyamide resin (A) compared to when the content of the component unit (b2) is greater than the content of the component unit (b1).

[0034] 1,3-bis(aminomethyl)cyclohexane or 1,4-bis(aminomethyl)cyclohexane has a three-dimensionally bulky structure. Therefore, when the component unit (b) derived from the diamine contains more of the component unit (b1), it is possible to inhibit the linear alkylene diamines from aligning with each other to form a crystal structure. For this reason, the melting point of the polyamide resin (A) is likely to be lower than when the content of the component unit (b2) is higher. This allows the melting point (Tm) to be sufficiently lower than the temperature at which the thermal decomposition of the polyamide resin (A) occurs, and the melting temperature of the polyamide resin composition can be prevented from reaching the temperature at which the polyamide resin (A) thermally decomposes (thermal decomposition temperature). As a result, the thermal decomposition of the polyamide resin (A) during molding can be suppressed, and molding processability can be further improved.

[0035] In addition, 1,3-bis(aminomethyl)cyclohexane and 1,4-bis(aminomethyl)cyclohexane have a rigid cyclic structure in the molecular structure, so that molecular mobility is unlikely to increase even when the temperature rises. Therefore, by making the content of the component unit (b1) relative to the component unit (b1) derived from diamine 50 mol % or more, the glass transition temperature (Tg) of the polyamide resin (A) can be sufficiently increased. The reason why the dielectric breakdown of the resin member can be suppressed by sufficiently increasing the glass transition temperature (Tg) is considered to be as follows.

[0036] The dielectric breakdown strength (resistance to dielectric breakdown) of a resin member is likely to decrease when the molecular motion of the molecules constituting the resin member becomes active. The molecular motion is likely to become significantly active when the temperature of the resin member rises and becomes higher than the glass transition temperature (Tg) of the resin. Therefore, when the resin member is exposed to high heat due to Joule heat generated by current flowing through the metal member and the temperature of the resin member exceeds the glass transition temperature (Tg), it is considered that the dielectric breakdown strength of the resin member is likely to decrease rapidly. For this reason, in a resin member using a polyamide resin composition containing a polyamide resin whose glass transition temperature (Tg) is not sufficiently high, the temperature of the resin member is likely to exceed the glass transition temperature (Tg) due to the generation of the Joule heat, and the dielectric breakdown strength is considered to decrease significantly. And, when a voltage is applied to the resin member in this state, it is considered that dielectric breakdown of the resin member occurs.

[0037] In contrast, by sufficiently increasing the glass transition temperature (Tg) of the polyamide resin (A), the temperature of the resin member 120 is less likely to rise to or exceed the glass transition temperature (Tg) of the polyamide resin (A) due to the generation of Joule heat, and it is believed that this makes it possible to suppress a decrease in the dielectric breakdown strength of the resin member.

[0038] Furthermore, the polyamide resin (A) in the present embodiment can increase the fluidity in a mold when melted, thereby making it possible to increase the flow length.

[0039] As described above, by including the above-mentioned component unit (b1) in an amount of 50 mol% or more based on the total number of moles of the component unit (b) derived from the diamine, the alkylene diamines having a linear structure (crystalline portion) are aligned with each other, and the formation of a crystalline structure can be inhibited. This makes it possible to delay crystallization in the mold, thereby increasing the fluidity in the mold when melted, and making the flow length longer.

[0040] (Component unit (a) derived from dicarboxylic acid) In this embodiment, the component unit (a) derived from a dicarboxylic acid includes a component unit (a1) derived from terephthalic acid and a component unit (a2) derived from an aliphatic dicarboxylic acid, an alicyclic dicarboxylic acid, or an aromatic dicarboxylic acid other than terephthalic acid.

[0041] Examples of the aliphatic dicarboxylic acid include aliphatic dicarboxylic acids having 4 to 20 carbon atoms. The number of carbon atoms is preferably 6 to 12. Examples of such aliphatic dicarboxylic acids include adipic acid, azelaic acid, and sebacic acid. Among these, adipic acid and sebacic acid are preferred.

[0042] Examples of the alicyclic dicarboxylic acids include cyclohexanedicarboxylic acid and its esters.

[0043] Examples of aromatic dicarboxylic acids other than terephthalic acid include isophthalic acid, 2-methylterephthalic acid, and naphthalenedicarboxylic acid.

[0044] The component unit (a2) is preferably a component unit derived from cyclohexanedicarboxylic acid or naphthalenedicarboxylic acid, and more preferably a component unit derived from naphthalenedicarboxylic acid, which can suppress the increase in molecular motion and further increase the glass transition temperature (Tg) of the polyamide resin (A), thereby improving the dielectric breakdown characteristics.

[0045] The component units (a) derived from dicarboxylic acid preferably contain 10 mol % or more and 100 mol % or less of the component units (a1) and 0 mol % or more and 90 mol % or less of the component units (a2) relative to the total number of moles of the component units (a) derived from dicarboxylic acid, more preferably contain 20 mol % or more and 100 mol % or less of the component units (a1) and 0 mol % or more and 80 mol % or less of the component units (a2), and even more preferably contain 90 mol % or more and 100 mol % or less of the component units (a1) and 0 mol % or more and 10 mol % or less of the component units (a2).

[0046] (Component unit (b) derived from diamine) In this embodiment, the component unit (b) derived from a diamine includes a component unit (b1) derived from 1,3-bis(aminomethyl)cyclohexane (1,3-BAC) or 1,4-bis(aminomethyl)cyclohexane (1,4-BAC) and a component unit (b2) derived from an alkylene diamine having 4 to 12 carbon atoms. In this specification, when 1,3-bis(aminomethyl)cyclohexane and 1,4-bis(aminomethyl)cyclohexane are described without distinction, they may be simply referred to as "BAC (bis(aminomethyl)cyclohexane)".

[0047] When the alkylenediamine in the component unit (b2) has an odd carbon number, the component unit (b1) is preferably a component unit derived from 1,4-bis(aminomethyl)cyclohexane. According to the findings of the present inventors, when the alkylenediamine bonded to terephthalic acid (having 8 carbon atoms) has an odd carbon number, the crystallinity of the polyamide resin (A) is prevented from being excessively decreased by using 1,4-bis(aminomethyl)cyclohexane, which has a more linear molecular structure, as BAC (bis(aminomethyl)cyclohexane). This makes it difficult for the moldability of the polyamide resin (A) to be reduced.

[0048] In addition, when the carbon number of the alkylenediamine in the component unit (b2) is an even number, the component unit (b1) is preferably a component unit derived from 1,3-bis(aminomethyl)cyclohexane. According to the findings of the present inventors, when the carbon number of the alkylenediamine bonded to terephthalic acid (having 8 carbon atoms) is an even number, the crystallinity of the polyamide resin (A) can be appropriately reduced by using 1,3-bis(aminomethyl)cyclohexane having a molecular structure with a lower linearity as BAC (bis(aminomethyl)cyclohexane). This makes it easier for the melting point (Tm) of the polyamide resin (A) to be lowered, and the melting temperature of the polyamide resin composition can be more effectively prevented from reaching the temperature at which the polyamide resin (A) thermally decomposes (thermal decomposition temperature).

[0049] The number of carbon atoms of the alkylenediamine in the component unit (b2) is 4 or more and 12 or less, preferably 6 or more and 12 or less, more preferably 8 or more and 12 or less, and even more preferably 10 or more and 12 or less. In particular, when the number of carbon atoms is 8 or more, the alkylenediamines are less likely to align with each other and the formation of a crystal structure can be suppressed compared to when the number of carbon atoms is less than 8, so that the melting point (Tm) of the polyamide resin (A) tends to be lower in the polyamide resin (A) having a high content of the component unit (b1). This prevents the difference between the melting point (Tm) and the crystallization temperature of the polyamide resin (A) from becoming too large, and makes it easier to crystallize the polyamide resin (A) during molding. In addition, the melting point (Tm) of the polyamide resin (A) can be made sufficiently lower than the thermal decomposition temperature.

[0050] The alkylenediamine having 4 to 12 carbon atoms may be a straight-chain alkylenediamine or a branched-chain alkylenediamine (an alkylenediamine having a side chain).

[0051] Examples of the linear alkylenediamine include 1,4-diaminobutane, 1,7-diaminoheptane, 1,8-diaminooctane, 1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, 1,12-diaminododecane, etc. Among these, 1,6-diaminohexane, 1,8-diaminooctane, 1,9-nonanediamine, and 1,10-diaminodecane are preferred. The linear alkylenediamine may be contained in one type or in two or more types.

[0052] Examples of the branched alkylene diamine include 2,2-dimethyldiaminopropane, 1,1-dimethyl-1,4-diaminobutane, 1-ethyl-1,4-diaminobutane, 1,2-dimethyl-1,4-diaminobutane, 1,3-dimethyl-1,4-diaminobutane, 1,4-dimethyl-1,4-diaminobutane, 2,3-dimethyl-1,4-diaminobutane, 2-methyl-1,5-diaminopentane, 2,5-dimethyl-1,6-diaminohexane, 2,4 -Dimethyl-1,6-diaminohexane, 3,3-dimethyl-1,6-diaminohexane, 2,2-dimethyl-1,6-diaminohexane, 2,2,4-trimethyl-1,6-diaminohexane, 2,4,4-trimethyl-1,6-diaminohexane, 2,4-diethyl-1,6-diaminohexane, 2,3-dimethyl-1,7-diaminoheptane, 2,4-dimethyl-1,7-diaminoheptane, 2,5-dimethyl-1,7-diaminoheptane, 2,2- Dimethyl-1,7-diaminoheptane, 2-methyl-4-ethyl-1,7-diaminoheptane, 2-ethyl-4-methyl-1,7-diaminoheptane, 2,2,5,5-tetramethyl-1,7-diaminoheptane, 3-isopropyl-1,7-diaminoheptane, 3-isooctyl-1,7-diaminoheptane, 2-methyl-1,8-diaminooctane, 1,3-dimethyl-1,8-diaminooctane, 1,4-dimethyl-1,8-diaminooctane, 2, These include 4-dimethyl-1,8-diaminooctane, 3,4-dimethyl-1,8-diaminooctane, 4,5-dimethyl-1,8-diaminooctane, 2,2-dimethyl-1,8-diaminooctane, 3,3-dimethyl-1,8-diaminooctane, 4,4-dimethyl-1,8-diaminooctane, 3,3,5-trimethyl-1,8-diaminooctane, 2,4-diethyl-1,8-diaminooctane, and 5-methyl-1,9-diaminononane. Among these, 2-methyl-1,5-diaminopentane and 2-methyl-1,8-diaminooctane are preferred.

[0053] The diamine-derived component unit (b) preferably contains the component unit (b1) which is 50 mol% or more and 100 mol% or less and the component unit (b2) which is 0 mol% or more and 50 mol% or less, more preferably contains 55 mol% or more and 100 mol% or less of (b1) and 0 mol% or more and 45 mol% or less of the component unit (b2), and further preferably contains 65 mol% or more and 95 mol% or less of the component unit (b1) and 5 mol% or more and 35 mol% or less of the component unit (b2). When the component unit (b1) is 55 mol% or more with respect to the diamine-derived component unit (b), the melting point (Tm) of the polyamide resin (A) can be lowered and the glass transition temperature (Tg) can be further increased. In addition, when the component unit (b1) is 65 mol% or more with respect to the diamine-derived component unit (b), the above effect is significantly exhibited.

[0054] From the viewpoint of further suppressing an increase in the melting point (Tm) of the polyamide resin (A), when the alkylene diamine has 6 or more and 7 or less carbon atoms, the diamine-derived component units (b) preferably contain 55 mol % or more and 100 mol % or less of the component units (b1) and 0 mol % or more and 45 mol % or less of the component units (b2), relative to the total number of moles of the diamine-derived component units (b), and more preferably contain 65 mol % or more and 95 mol % or less of the component units (b1) and 5 mol % or more and 35 mol % or less of the component units (b2).

[0055] From the same viewpoint, when the alkylene diamine has 8 or more and 12 or less carbon atoms, the diamine-derived component units (b) preferably comprise 65 mol % or more and 100 mol % or less of the component units (b1) and 0 mol % or more and 35 mol % or less of the component units (b2), relative to the total number of moles of the diamine-derived component units (b), and more preferably comprise 75 mol % or more and 95 mol % or less of the component units (b1) and 5 mol % or more and 25 mol % or less of the component units (b2).

[0056] The diamine-derived component unit (b) may contain a small amount of other diamine-derived component units. Examples of other diamines include C4-C20 alicyclic diamine-derived component units and aromatic diamines.

[0057] Examples of the alicyclic diamine having 4 to 20 carbon atoms include 1,4-diaminocyclohexane, 1,3-diaminocyclohexane, 1,3-bis(aminomethyl)cyclohexane, 2,5-bisaminomethylnorbornane, and 2,6-bisaminomethylnorbornane, etc. Examples of the aromatic diamine include metaxylylenediamine, etc.

[0058] The content of the component units derived from other diamines is preferably 0 mol % or more and 5 mol % or less, more preferably 0 mol % or more and less than 2 mol %, even more preferably 0 mol % or more and less than 1 mol %, and particularly preferably 0 mol % based on the total number of moles of the component units (b) derived from diamines.

[0059] The respective constituent units of the polyamide resin (A) and their ratios can be calculated from the charge ratios during preparation of the polyamide resin (A) or can be measured by the NMR method.

[0060] 1 In the case of H-NMR measurement, for example, a nuclear magnetic resonance apparatus (ECX400 manufactured by JEOL Ltd.) is used, the solvent is deuterated orthodichlorobenzene, the sample concentration is 20 mg / 0.6 mL, the measurement temperature is 120° C., and the observation nucleus is 1 The conditions were: H (400 MHz), sequence was single pulse, pulse width was 5.12 μsec (45° pulse), repetition time was 7.0 sec, and the number of integrations was 500 or more. The reference chemical shift was set to 0 ppm for hydrogen in tetramethylsilane, but similar results can also be obtained by setting the peak derived from residual hydrogen in deuterated orthodichlorobenzene at 7.10 ppm as the reference value for the chemical shift. 1 Peaks such as H can be assigned by conventional methods.

[0061] 13 In the case of C-NMR measurement, for example, a nuclear magnetic resonance apparatus (ECP500 manufactured by JEOL Ltd.) is used as the measurement apparatus, a mixed solvent of ortho-dichlorobenzene / heavy benzene (80 / 20% by volume) is used as the solvent, the measurement temperature is 120°C, and the observation nucleus is 13 The conditions are: C (125 MHz), single pulse proton decoupling, 45° pulse, repetition time 5.5 seconds, number of integrations 10,000 or more, and chemical shift reference value 27.50 ppm. Assignment of various signals is performed based on the usual method, and quantification can be performed based on the integration value of signal intensity.

[0062] The component unit (a) derived from a dicarboxylic acid in the polyamide resin (A) may contain a component unit derived from a dicarboxylic acid derived from biomass, and the component unit (b) derived from a diamine may contain a component unit derived from a diamine derived from biomass. The polyamide resin (A) may be a biomass-derived polyamide resin (A) obtained by polymerizing a raw material group including a raw material derived from biomass.

[0063] In order to improve the thermal stability during compounding or molding and to further increase the mechanical strength, at least a part of the molecular terminal groups of the polyamide resin (A) may be blocked with a terminal blocking agent. When the molecular terminal is a carboxyl group, the terminal blocking agent is preferably a monoamine, and when the molecular terminal is an amino group, the terminal blocking agent is preferably a monocarboxylic acid.

[0064] Examples of monoamines include aliphatic monoamines including methylamine, ethylamine, propylamine, and butylamine, alicyclic monoamines including cyclohexylamine and dicyclohexylamine, and aromatic monoamines including aniline and toluidine. Examples of monocarboxylic acids include aliphatic monocarboxylic acids having 2 to 30 carbon atoms including acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecylic acid, myristic acid, palmitic acid, stearic acid, oleic acid, and linoleic acid, aromatic monocarboxylic acids including benzoic acid, toluic acid, naphthalenecarboxylic acid, methylnaphthalenecarboxylic acid, and phenylacetic acid, and alicyclic monocarboxylic acids including cyclohexanecarboxylic acid. The aromatic monocarboxylic acid and the alicyclic monocarboxylic acid may have a substituent on the ring structure portion.

[0065] (Physical properties of polyamide resin (A)) In the present embodiment, the polyamide resin (A) may be a crystalline polyamide resin or may be an amorphous polyamide resin.

[0066] In this specification, the term "crystalline polyamide resin" refers to a polyamide resin whose melting point is clearly measured by a differential scanning calorimeter (DSC). More specifically, the term refers to a polyamide resin whose heat of fusion (ΔH) measured by differential scanning calorimetry (DSC) exceeds 5 J / g. In addition, in this specification, the term "amorphous polyamide resin" refers to a polyamide resin whose melting point is not substantially measured by a differential scanning calorimeter (DSC). More specifically, the term refers to a polyamide resin whose heat of fusion (ΔH) measured by differential scanning calorimetry (DSC) is 0 J / g or more and 5 J / g or less. The method for measuring the heat of fusion (ΔH) will be described later.

[0067] When the polyamide resin (A) is a crystalline polyamide resin, the polyamide resin (A) preferably has a melting point (Tm) measured by a differential scanning calorimeter (DSC) of 295°C or more and 320°C or less, more preferably 300°C or more and 315°C or less. When the melting point (Tm) is 295°C or more, the tensile strength and heat resistance of the polyamide resin composition and the resin member 120 can be further increased. When the melting point (Tm) is 320°C or less, the polyamide resin composition can be easily molded without excessively increasing the molding temperature, and the moldability can be improved. When the melting point is 320°C or less, the polyamide resin (A) is less likely to undergo a thermal decomposition reaction when melted. The melting point (Tm) of the polyamide resin (A) can be adjusted to the above range by adjusting the composition of the polyamide resin (A).

[0068] In addition, the polyamide resin (A) preferably has a glass transition temperature (Tg) of 160°C or higher, more preferably 170°C or higher, as measured by a differential scanning calorimeter (DSC). When the glass transition temperature (Tg) is 160°C or higher, the temperature at which the molecular mobility in a high-temperature environment becomes significantly active increases, so that the molecular mobility can be suppressed and the dielectric breakdown of the resin member 120 can be further suppressed. The upper limit of the glass transition temperature (Tg) is not particularly limited, but is preferably 220°C or lower, more preferably 200°C or lower. When the glass transition temperature (Tg) is 220°C or lower, the fluidity of the resin composition can be easily maintained without excessively increasing the mold temperature during molding, and molding processability can be improved.

[0069] The heat of fusion (ΔH) of the polyamide resin (A) measured by differential scanning calorimetry (DSC) is preferably 20 J / g or more and 80 J / g or less. When the heat of fusion (ΔH) of the polyamide resin (A) is 20 J / g or more, the crystallinity is increased, so that the heat resistance and bonding strength of the resin member are likely to be increased. When the heat of fusion (ΔH) is 80 J / g or less, the crystallinity of the polyamide resin (A) can be appropriately reduced, so that the shrinkage rate of the resin member can be reduced and the difference in the linear expansion coefficient between the resin member and the metal member can be reduced. This can further improve the heat shock resistance of the molded product.

[0070] The heat of fusion (ΔH), melting point (Tm) and glass transition temperature (Tg) of the polyamide resin (A) can be measured using a differential scanning calorimeter (DSC220C, manufactured by Seiko Instruments Inc.).

[0071] Specifically, about 5 mg of polyamide resin (A) is sealed in a measuring aluminum pan and heated from room temperature to 350°C at 10°C / min. In order to completely melt the resin, it is held at 350°C for 3 minutes and then cooled to 30°C at 10°C / min. After leaving it at 30°C for 5 minutes, it is heated a second time to 350°C at 10°C / min. The temperature (°C) of the endothermic peak in this second heating is the melting point (Tm) of polyamide resin (A), and the transition point corresponding to the glass transition is the glass transition temperature (Tg). The heat of fusion (ΔH) is calculated from the area of ​​the endothermic peak during melting in the first heating process in accordance with JIS K7122.

[0072] The polyamide resin (A) preferably has an intrinsic viscosity [η] of 0.6 dl / g or more and 1.5 dl / g or less, as measured in 96.5% sulfuric acid at a temperature of 25°C. When the polyamide resin (A) has an intrinsic viscosity [η] of 0.6 dl / g or more, the mechanical strength (tensile strength, etc.) of the molded product is easily increased, and when the intrinsic viscosity [η] is 1.5 dl / g or less, the fluidity of the resin composition during molding is not easily impaired. From the same viewpoint, the polyamide resin (A1) more preferably has an intrinsic viscosity [η] of 0.8 dl / g or more and 1.2 dl / g or less. The intrinsic viscosity [η] can be adjusted by the amount of terminal blocking of the polyamide resin (A1), etc.

[0073] The intrinsic viscosity [η] of polyamide resin (A) can be measured as follows. 0.5 g of polyamide resin (A) is dissolved in 50 ml of 96.5% sulfuric acid solution to prepare a sample solution. The flow time of the obtained solution at 25°C ± 0.05°C is measured using an Ubbelohde viscometer and calculated based on the following formula. [η]=ηSP / (C*(1+0.205ηSP)) [η]: Intrinsic viscosity (dl / g) ηSP: Specific viscosity C: Sample concentration (g / dl) t: Time required for sample solution to flow (seconds) t0: Number of seconds that blank sulfuric acid flows (seconds) ηSP=(t-t0) / t0

[0074] The polyamide resin (A) can be produced by the same method as known polyamide resins, for example, by polycondensing dicarboxylic acid and diamine in a homogeneous solution. Specifically, the polyamide resin (A) can be produced by heating dicarboxylic acid and diamine in the presence of a catalyst to obtain a low-order condensate as described in WO 03 / 085029, and then applying shear stress to the melt of the low-order condensate to polycondense it.

[0075] Specific examples of the polyamide resin (A) include polyamide BACT / 6T, polyamide BACT / 8T, polyamide BACT / 9T, polyamide BACT / 10T, polyamide BACT / 11T, polyamide BACT / 12T, and the like. More specifically, these include polyamide (1,3-BAC) T / 6T, polyamide (1,3-BAC) T / 8T, polyamide (1,3-BAC) T / 9T, polyamide (1,3-BAC) T / 10T, polyamide (1,3-BAC) T / 11T, polyamide (1,3-BAC) T / 12T, polyamide (1,4-BAC) T / 6T, polyamide (1,4-BAC) T / 8T, polyamide (1,4-BAC) T / 9T, polyamide (1,4-BAC) T / 10T, polyamide (1,4-BAC) T / 11T, and polyamide (1,4-BAC) T / 12T.

[0076] The content of the polyamide resin (A) is preferably 50.00% by mass or more and 100.00% by mass or less, more preferably 70.00% by mass or more and 100.00% by mass or less, and even more preferably 80.00% by mass or more and 100.00% by mass or less, based on the total mass of the polyamide resin in the polyamide resin composition. When the content is 50.00% by mass or more, the tensile strength of the resin member 120 and the insulating properties in a high-temperature environment can be further improved. In addition to the polyamide resin (A), the polyamide resin composition may further contain a polyamide resin different from the polyamide resin (A).

[0077] <Other ingredients> The polyamide resin composition may contain other known components.

[0078] Examples of other components include flame retardants, flame retardant auxiliaries, nucleating agents, lubricants, colorants, heat stabilizers, corrosion resistance improvers, anti-drip agents, ion scavengers, elastomers (rubbers), antistatic agents, release agents, antioxidants (phenols, amines, sulfurs, phosphorus, etc.), heat stabilizers other than those mentioned above (lactone compounds, vitamin E, hydroquinones, etc.), light stabilizers (benzotriazoles, triazines, benzophenones, benzoates, hindered amines, oxanilides, etc.), other polymers (polyolefins, ethylene-propylene copolymers, olefin copolymers such as ethylene-1-butene copolymers, olefin copolymers such as propylene-1-butene copolymers, polystyrene, polycarbonate, polyacetal, polysulfone, polyphenylene oxide, fluororesins, silicone resins, LCP, etc.).

[0079] (Flame retardant) In the present embodiment, the polyamide resin composition may contain a flame retardant. When the polyamide resin composition contains a flame retardant, the flame retardancy of the polyamide resin composition can be improved.

[0080] Examples of the flame retardant include organic halogen flame retardants, combinations of organic halogen flame retardants and one or more selected from the group consisting of antimony oxide, zinc borate, zinc stannate, and iron oxide, organic phosphorus flame retardants, combinations of organic phosphorus flame retardants and silicone compounds, combinations of inorganic phosphorus such as red phosphorus, organopolysiloxane, and organic metal compounds, hindered amine flame retardants, inorganic flame retardants such as magnesium hydroxide, alumina, calcium borate, and low melting point glass, etc. These may be used alone or in combination of two or more. Of these, the flame retardant is preferably an organic phosphorus flame retardant.

[0081] Examples of the organophosphorus flame retardant include phosphate compounds, phosphine compounds, phosphinate compounds, phosphine oxide compounds, and phosphazene compounds.

[0082] Examples of the phosphate compound include phosphoric acid esters such as trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, triphenyl phosphate, tricresyl phosphate, trixylyl phosphate, cresyl diphenyl phosphate, xylyl diphenyl phosphate, tolyl dixylyl phosphate, tris(norylphenyl)phosphate, and (2-ethylhexyl)diphenyl phosphate; hydroxyl groups such as resorcinol diphenyl phosphate and hydroquinone diphenyl phosphate; These include condensed phosphate ester compounds such as resorcinol bis(diphenyl phosphate), hydroquinone bis(diphenyl phosphate), bisphenol-A bis(diphenyl phosphate), bisphenol-S bis(diphenyl phosphate), resorcinol bis(dixylyl phosphate), hydroquinone bis(dixylyl phosphate), bisphenol-A bis(ditolyl phosphate), biphenol-A bis(dixylyl phosphate) and bisphenol-S bis(dixylyl phosphate).

[0083] Examples of the phosphine compound include trilaurylphosphine, triphenylphosphine, tritolylphosphine, and the like.

[0084] The phosphinate compound is represented by the following general formula (I).

[0085] [ka]

[0086] In formula (1), R 1 and R 2 each independently represents a linear or branched alkyl group or aryl group having 1 to 6 carbon atoms. M represents at least one metal atom selected from the group consisting of Mg, Ca, Al, Sb, Sn, Ge, Ti, Zn, Fe, Zr, Ce, Bi, Sr, Mn, Li, Na, and K. m represents an integer of 1 to 4.

[0087] Specific examples of the phosphinate compound include aluminum diethylphosphinate, magnesium diethylphosphinate, and the like.

[0088] Examples of the phosphine oxide compound include triphenylphosphine oxide and tritolylphosphine oxide.

[0089] Examples of phosphazene compounds include hexaphenoxycyclotriphosphazene, monophenoxypentakis(4-cyanophenoxy)cyclotriphosphazene, diphenoxytetrakis(4-cyanophenoxy)cyclotriphosphazene, triphenoxytris(4-cyanophenoxy)cyclotriphosphazene, tetraphenoxybis(4-cyanophenoxy)cyclotriphosphazene, pentaphenoxy(4-cyanophenoxy)cyclotriphosphazene, monophenoxypentakis(4-methoxyphenoxy)cyclotriphosphazene, C) Cyclotriphosphazene, diphenoxytetrakis(4-methoxyphenoxy)cyclotriphosphazene, triphenoxytris(4-methoxyphenoxy)cyclotriphosphazene, tetraphenoxybis(4-methoxyphenoxy)cyclotriphosphazene, pentaphenoxy(4-methoxyphenoxy)cyclotriphosphazene, monophenoxypentakis(4-methylphenoxy)cyclotriphosphazene, diphenoxytetrakis(4-methylphenoxy)cyclotriphosphazene, triphenoxy Xytris(4-methylphenoxy)cyclotriphosphazene, tetraphenoxybis(4-methylphenoxy)cyclotriphosphazene, pentaphenoxy(4-methylphenoxy)cyclotriphosphazene, triphenoxytris(4-ethylphenoxy)cyclotriphosphazene, triphenoxytris(4-propylphenoxy)cyclotriphosphazene, monophenoxypentakis(4-cyanophenoxy)cyclotriphosphazene, diphenoxytetrakis(4-hydroxyphenoxy)cyclotriphosphazene These include triphenoxytris(4-hydroxyphenoxy)cyclotriphosphazene, tetraphenoxybis(4-hydroxyphenoxy)cyclotriphosphazene, pentaphenoxy(4-hydroxyphenoxy)cyclotriphosphazene, triphenoxytris(4-phenylphenoxy)cyclotriphosphazene, triphenoxytris(4-methacrylphenoxy)cyclotriphosphazene and triphenoxytris(4-acrylphenoxy)cyclotriphosphazene.

[0090] The content of the flame retardant is preferably from 5% by mass to 40% by mass, and more preferably from 10% by mass to 20% by mass, based on the total mass of the polyamide resin composition.

[0091] (Flame retardant assistant) The polyamide resin composition preferably contains a flame retardant auxiliary from the viewpoint of exhibiting a high flame retardant effect with the addition of a small amount of flame retardant. Examples of the flame retardant auxiliary include metal oxides and metal hydroxides. Among these, zinc borate, boehmite, zinc stannate, iron oxide, and tin oxide are preferred, and zinc borate is more preferred.

[0092] The content of the flame retardant auxiliary is preferably 0.1 mass% or more and 5.0 mass% or less, more preferably 0.5 mass% or more and 5.0 mass% or less, and even more preferably 1.0 mass% or more and 3.0 mass% or less, based on the total mass of the polyamide resin composition.

[0093] (Nucleating agent) When the polyamide resin (A) is a crystalline polyamide resin, the nucleating agent can promote the crystallization of the polyamide resin (A), thereby enabling the tensile strength and elastic modulus of the resin member 120 to be further increased.

[0094] Examples of the nucleating agent include metal salt-based compounds including sodium 2,2-methylenebis(4,6-di-t-butylphenyl)phosphate, aluminum tris(pt-butylbenzoate), and stearates, sorbitol-based compounds including bis(p-methylbenzylidene)sorbitol and bis(4-ethylbenzylidene)sorbitol, and inorganic substances including talc, calcium carbonate, and hydrotalcite. Among these, talc is preferable from the viewpoint of further increasing the crystallinity of the resin member 120. These nucleating agents may be used alone or in combination of two or more.

[0095] Talc generally contains hydrous magnesium silicate (SiO2: 58-64%, MgO: 28-32%, Al2O3: 0.5-5%, Fe2O3: 0.3-5%) as a main component. The average particle size of talc is not particularly limited, but is preferably 1-15 μm. When the average particle size of talc is within the above range, talc is easily dispersed in the polyamide resin (A) without impairing the fluidity of the polyamide resin composition. From the same viewpoint, the average particle size of talc is more preferably 1-7.5 μm. The average particle size of talc can be measured by a laser diffraction method, for example, a laser diffraction method using a Shimadzu particle size distribution analyzer SALD-2000A manufactured by Shimadzu Corporation.

[0096] The content of the nucleating agent is preferably 0.10 parts by mass or more and 5.00 parts by mass or less, more preferably 0.10 parts by mass or more and 3.00 parts by mass or less, based on the total mass of the polyamide resin composition. When the content of the nucleating agent is within the above range, the crystallinity of the polyamide resin (A) can be sufficiently increased, and sufficient mechanical strength can be easily obtained.

[0097] (lubricant) The lubricant enhances the injection flowability of the polyamide resin composition and improves the appearance of the resulting resin member 120. The lubricant may be a metal salt of a fatty acid, such as a metal salt of an oxycarboxylic acid or a metal salt of a higher fatty acid.

[0098] The oxycarboxylic acid constituting the oxycarboxylic acid metal salt may be an aliphatic oxycarboxylic acid or an aromatic oxycarboxylic acid. Examples of the aliphatic oxycarboxylic acid include aliphatic oxycarboxylic acids having 10 to 30 carbon atoms, such as α-hydroxymyristic acid, α-hydroxypalmitic acid, α-hydroxystearic acid, α-hydroxyeicosanoic acid, α-hydroxydocosanoic acid, α-hydroxytetraeicosanoic acid, α-hydroxyhexaeicosanoic acid, α-hydroxyoctaeicosanoic acid, α-hydroxytriacontanoic acid, β-hydroxymyristic acid, 10-hydroxydecanoic acid, 15-hydroxypentadecanoic acid, 16-hydroxyhexadecanoic acid, 12-hydroxystearic acid, and ricinoleic acid. Examples of the aromatic oxycarboxylic acid include salicylic acid, m-oxybenzoic acid, p-oxybenzoic acid, gallic acid, mandelic acid, and trovaic acid.

[0099] Examples of the metal constituting the metal oxycarboxylate include alkali metals such as lithium, and alkaline earth metals such as magnesium, calcium and barium.

[0100] Of these, the metal oxycarboxylate is preferably a metal salt of 12-hydroxystearic acid, and more preferably magnesium 12-hydroxystearate and calcium 12-hydroxystearate.

[0101] Examples of the higher fatty acid constituting the higher fatty acid metal salt include higher fatty acids having 15 to 30 carbon atoms, such as stearic acid, oleic acid, behenic acid, behenic acid, and montanic acid.

[0102] Examples of the metals constituting the higher fatty acid metal salts include calcium, magnesium, barium, lithium, aluminum, zinc, sodium, and potassium.

[0103] Of these, the higher fatty acid metal salts are preferably calcium stearate, magnesium stearate, barium stearate, calcium behenate, sodium montanate, and calcium montanate.

[0104] The content of the lubricant is preferably 0.01% by mass or more and 1.30% by mass or less based on the total mass of the polyamide resin composition. When the content of the lubricant is 0.01% by mass or more, the flowability during molding is likely to be improved, and the appearance of the obtained molded product is likely to be improved. When the content of the lubricant is 1.30% by mass or less, gas due to decomposition of the lubricant is unlikely to be generated during molding, and the appearance of the product is likely to be good.

[0105] (Coloring agent) The colorant imparts a desired color tone to the resin member 120. The colorant is not particularly limited, and may be a pigment. Examples of the pigment include inorganic pigments such as carbon black, alumina, titanium oxide, chromium oxide, iron oxide, zinc oxide, and barium sulfate, and organic pigments such as azo pigments, phthalocyanine pigments, quinacridone pigments, perylene pigments, anthraquinone pigments, thioindigo pigments, and indanthrene pigments.

[0106] The content of the colorant is preferably from 0.01% by mass to 5.00% by mass, and more preferably from 0.10% by mass to 2.00% by mass, based on the total mass of the polyamide resin composition.

[0107] <Physical properties of polyamide resin composition> When the polyamide resin composition is injected into a barflow mold having a width of 10 mm and a thickness of 0.5 mm under the following conditions, the flow length (mm) in the mold is preferably 20 mm or more and 100 mm or less, and more preferably 30 mm or more and 100 mm or less. Injection molding machine: Sodick Plastic Co., Ltd., Tupearl TR40S3A Injection pressure setting: 2000kg / cm 2 Cylinder setting temperature: Melting point (Tm) of polyamide resin (A) + 10℃ Mold temperature: 160℃

[0108] <Manufacturing method> The polyamide resin composition can be produced by a known resin kneading method, for example, by mixing the above-mentioned polyamide resin (A) and other components as necessary with a Henschel mixer, V blender, ribbon blender, or tumbler blender, or by mixing and then melt-kneading with a single-screw extruder, multi-screw extruder, kneader, or Banbury mixer, followed by granulation or pulverization. At this time, the melting temperature during melt kneading is preferably at least 10°C above the melting point (Tm) of the polyamide resin (A) and at most 20°C above the melting point (Tm) of the polyamide resin (A).

[0109] 1-2-2. Structure of resin parts The ratio of the covering area of ​​the resin member 120 to the surface area of ​​the metal member 110 is preferably 40% or more and 95% or less, and more preferably 50% or more and 90% or less.

[0110] The length of the resin member 120 in the extension direction of the metal member 110 (the X-axis direction in FIG. 1) is not particularly limited, but from the viewpoint of increasing rigidity in a direction perpendicular to the extension direction, the length is preferably 60% or more and 99% or less of the length of the metal member 110 in the extension direction, and more preferably 60% or more and 90% or less.

[0111] The shape of the resin member 120 is not particularly limited, and may be a rectangular parallelepiped, columnar, spherical, conical, etc. In this embodiment, the resin member 120 is a rectangular parallelepiped.

[0112] Although the positional relationship between the resin member 120 and the metal member 110 is not particularly limited, it is preferable that the resin member 120 is formed so that the center of the extension direction of the metal member 110 (X-axis direction in FIG. 1) coincides with the center of the extension direction of the resin member 120. In other words, it is preferable that both the metal member 110 and the resin member 120 are line-symmetric with respect to the central axis of the electrical component 100.

[0113] 1-3. Manufacturing method of electrical parts The above-mentioned electric parts can be manufactured, for example, by an insert molding method. Specifically, the electric parts can be manufactured, for example, by a manufacturing method including a step of (1) preparing a metal member, a step of (2) placing the above-mentioned metal member in a mold and injecting and filling a molten polyamide resin composition into the mold, and a step of (3) cooling the polyamide resin composition. Each step will be described below.

[0114] 1-3-1.Preparing metal parts First, the above-mentioned metal member is prepared. At this time, at least a part of the surface of the metal member may be subjected to a roughening treatment, or a metal member having an uneven structure on at least a part of the surface may be prepared.

[0115] The method of roughening the surface of the metal member is not particularly limited. For example, the method of using laser processing, the method of immersing the metal member in an aqueous inorganic base solution such as NaOH or an aqueous inorganic acid solution such as HCl or HNO3, the method of treating the metal member by anodization, the substitution crystallization method of etching with an acid-based etching agent (preferably an aqueous acid-based etching agent solution containing an inorganic acid, ferric ions, cupric ions, and if necessary, manganese ions, aluminum chloride hexahydrate, sodium chloride, etc.), the method of immersing the metal member in an aqueous solution of hydrazine hydrate, ammonia, water-soluble amine compound, etc., and the hot water treatment method can be used.

[0116] This step may include a step of roughening the surface of the metal member.

[0117] 1-3-2. Installation of metal parts and injection filling of resin composition Next, a metal member is placed in a mold, and the molten polyamide resin composition is injected into the mold to fill the interior of the mold, thereby forming a composite between the softened or molten polyamide resin composition and the prepared metal member.

[0118] Specifically, the prepared metal member is placed in a cavity (space) in an injection mold. Then, the polyamide resin composition is injected and filled into the cavity of the mold so that at least a part of the polyamide resin composition is in contact with the metal member. This allows the injected molten polyamide resin composition to come into contact with the surface of the metal member. The temperature of the injection mold at this time is not particularly limited as long as it is a temperature at which the polyamide resin composition can be melted to a state suitable for injection molding, and is, for example, 100 to 350°C.

[0119] As the mold, a known injection molding mold, for example, a mold for high speed heat cycle molding (RHCM, heat & cool molding) or a core-back mold for foam molding can be used.

[0120] 1-3-3. Cooling Thereafter, the polyamide resin composition in contact with the surface of the metal member is cooled and solidified, thereby obtaining an electrical component in which the resin member containing the polyamide resin composition is composited with the metal member.

[0121] 1-4.Other In this embodiment, the number of metal members 110 is four, but is not limited to this. Also, in this embodiment, both ends of the metal members 110 in the extension direction (X-axis direction in FIG. 1) are not covered with the resin members 120, but the present invention is not limited to this. For example, the resin members 120 may be formed biased to one side from the center of the metal members 110 in the extension direction, and cover the end of the metal member 110 on the one side.

[0122] Furthermore, the electrical component 100 may be used for purposes other than as a busbar unit.

[0123] For example, the electrical component 100 can be used in electrical components for moving bodies (e.g., automobiles), such as terminals, terminal blocks, high-voltage connectors, motors, power conversion devices (inverters, converters), ECU boxes, electrical components, etc. Since the electrical component 100 can suppress the occurrence of dielectric breakdown in the resin member 120, it is suitable for use in electrical components for electric automobiles, which require a higher voltage, among the above-mentioned applications.

[0124] The electrical component 100 can also be used as an electrical component for electronic devices, medical devices, and the like.

[0125] 2. Busbar unit In this embodiment, the above-mentioned metal member 110 is used as a bus bar 210, and the resin member 120 is used as a holding member for holding the bus bar, so that the electrical component 100 can be a bus bar unit 200.

[0126] 3. Drive unit and moving body 2 is a configuration diagram showing an exemplary configuration of a moving body (vehicle) 300 having a drive unit 330 including a busbar unit 200. In this embodiment, the moving body 300 has a body 310, a power source 320 such as a secondary battery that supplies power for driving the body 310, and a drive unit 330 that drives the body 310 with the power supplied from the power source 320.

[0127] Drive unit 330 has inverter 332 that controls power (current) from power source 320, motor 334 that rotates by receiving power controlled by inverter 332, and busbar unit 200 that has a busbar that electrically connects inverter 332 and motor 334. Motor 334 is housed in motor case 336 together with reducer 335 that converts the rotation speed obtained by motor 334 into a rotation speed for driving machine body 310. Busbar unit 200 is attached to motor case 336, and a busbar communicates from the inside to the outside of motor case 336 via busbar unit 200.

[0128] A cooling liquid (coolant oil) for cooling motor 334 is stored inside motor case 336. In addition, the connection between bus bar unit 200 and motor case 336 is airtightly treated with a sealing member such as an O-ring, thereby preventing oil from leaking from the inside of motor case 336 to the outside.

[0129] 2 shows an example in which the moving body 300 is a vehicle such as an automobile, the moving body 300 is not particularly limited as long as it is an object that has a body and a drive unit and is capable of moving. For example, the moving body 300 may be a train, a ship, an airplane, a drone, a robot, or the like, in addition to vehicles such as an automobile, a motorcycle, and an electric bicycle.

[0130] 4. Electrical component manufacturing examples The present invention will be described below with reference to a specific manufacturing example of the electric component 100. Note that the following manufacturing example should not be construed as limiting the scope of the present invention.

[0131] 4-1. Synthesis of polyamide resin (A) <Polyamide resin (PA-1) ((1,3-BAC)T / 6T)> 259.5g (1562mmol) of terephthalic acid, 45.4g (390.5mmol) of 1,6-diaminohexane, 166.6g (1171.5mmol) of 1,3-bis(aminomethyl)cyclohexane, 0.37g (3.29mmol) of sodium hypophosphite monohydrate as a catalyst, and 81.8g of distilled water were placed in an autoclave with a capacity of 1L and purged with nitrogen. Stirring was started at 190°C, and the internal temperature was raised to 250°C over 3 hours. At this time, the internal pressure of the autoclave was raised to 3.0MPa. After continuing the reaction for 1 hour, the low-order condensation product was discharged into the atmosphere from a spray nozzle installed at the bottom of the autoclave and extracted. After that, the low-order condensation product was cooled to room temperature, pulverized to a particle size of 1.5mm or less in a pulverizer, and dried at 110°C for 24 hours.

[0132] Next, this low-order condensate was placed in a tray-type solid-phase polymerization apparatus, and after nitrogen replacement, the temperature was raised to 215°C over about 1 hour and 30 minutes. After that, the reaction was allowed to proceed for 1 hour and 30 minutes, and the temperature was lowered to room temperature. The obtained prepolymer was then melt-polymerized in a twin-screw extruder with a screw diameter of 30 mm and L / D=36 at a barrel setting temperature of 330°C, a screw rotation speed of 200 rpm, and a resin supply rate of 6 kg / h to obtain a polyamide resin (PA-1).

[0133] <Polyamide resin (PA-2) ((1,3-BAC)T / 6T)> Polyamide resin (PA-2) was obtained in the same manner as in the synthesis of polyamide resin (PA-1), except that the amount of 1,6-diaminohexane added was changed to 72.6 g (624.8 mmol) and the amount of 1,3-bis(aminomethyl)cyclohexane added was changed to 133.3 g (937.2 mmol).

[0134] <Polyamide resin (PA-3) ((1,3-BAC)T / 6T)> Polyamide resin (PA-3) was obtained in the same manner as in the synthesis of polyamide resin (PA-1), except that the amount of 1,6-diaminohexane added was changed to 18.2 g (156.2 mmol) and the amount of 1,3-bis(aminomethyl)cyclohexane added was changed to 200.0 g (1405.8 mmol).

[0135] <Polyamide resin (PA-4) ((1,4-BAC)T / 6T)> Polyamide resin (PA-4) was obtained in the same manner as in the synthesis of polyamide resin (PA-2), except that 1,3-bis(aminomethyl)cyclohexane was changed to 1,4-bis(aminomethyl)cyclohexane.

[0136] <Polyamide resin (PA-5) ((1,3-BAC)T / 9T)> Polyamide resin (PA-5) was obtained in the same manner as in the synthesis of polyamide resin (PA-1), except that 1,6-diaminohexane was replaced with 61.8 g (390.5 mmol) of 1,9-nonanediamine.

[0137] <Polyamide resin (PA-6) ((1,3-BAC)T / 9T)> Polyamide resin (PA-6) was obtained in the same manner as in the synthesis of polyamide resin (PA-2), except that 98.9 g (624.8 mmol) of 1,9-nonanediamine was used instead of 1,6-diaminohexane.

[0138] <Polyamide resin (PA-7) ((1,3-BAC)T / 9T)> Polyamide resin (PA-7) was obtained in the same manner as polyamide resin (PA-3) except that 1,6-diaminohexane was replaced with 24.7 g (156.2 mmol) of 1,9-nonanediamine.

[0139] <Polyamide resin (PA-8) ((1,4-BAC)T / 9T)> Polyamide resin (PA-8) was obtained in the same manner as in the synthesis of polyamide resin (PA-6), except that 1,3-bis(aminomethyl)cyclohexane was changed to 1,4-bis(aminomethyl)cyclohexane.

[0140] <Polyamide resin (PA-9) ((1,3-BAC)T / 10T)> Polyamide resin (PA-9) was obtained in the same manner as in the synthesis of polyamide resin (PA-1), except that 1,6-diaminohexane was replaced with 67.3 g (390.5 mmol) of 1,10-decanediamine.

[0141] <Polyamide resin (PA-10) ((1,3-BAC)T / 10T)> Polyamide resin (PA-10) was obtained in the same manner as in the synthesis of polyamide resin (PA-2), except that 1,6-diaminohexane was replaced with 107.7 g (624.8 mmol) of 1,10-decanediamine.

[0142] <Polyamide resin (PA-11) ((1,3-BAC)T / 10T)> Polyamide resin (PA-11) was obtained in the same manner as in the synthesis of polyamide resin (PA-3), except that 26.9 g (156.2 mmol) of 1,10-decanediamine was used instead of 1,6-diaminohexane.

[0143] <Polyamide resin (PA-12) ((1,4-BAC)T / 10T)> Polyamide resin (PA-12) was obtained in the same manner as in the synthesis of polyamide resin (PA-10), except that 1,3-bis(aminomethyl)cyclohexane was changed to 1,4-bis(aminomethyl)cyclohexane.

[0144] 4-2.Other ingredients 4-2-1.Flame retardants Aluminum phosphinate (EXOLIT OP1230, Clariant) was used.

[0145] 4-2-2.Flame retardant assistant Zinc borate (Firebrake 500, Borax Corporation) was used.

[0146] 4-2-3.Nucleating agent Talc (average particle size 6 μm) was used as a nucleating agent.

[0147] 4-2-4. Lubricants Sodium montanate (LICOMONT NAV101, Clariant) was used as a lubricant.

[0148] 4-2-5. Reinforcement material Glass fiber (FT756D, manufactured by Owing Corning, containing a sizing agent having a carboxyl group) was used as a reinforcing material.

[0149] 4-3. Preparation of polyamide resin composition The above materials were mixed in a tumbler blender in the composition ratios (unit: parts by mass) shown in Table 1, and melt-kneaded using a 30 mmφ vented twin-screw extruder under a cylinder temperature condition of melting point (Tm) of polyamide resins (PA-1) to (PA-12) + 20°C. The kneaded product was then extruded in the form of strands and cooled in a water tank. The strands were then taken up and cut by a pelletizer to obtain pellet-shaped polyamide resin compositions 1 to 12.

[0150] [Table 1]

[0151] [Table 2]

[0152] [Table 3]

[0153] A copper metal member (120 mm x 30 mm x 3 mm) was placed in a metal insert molding die attached to an injection molding machine (SE75EV, manufactured by Sumitomo Heavy Industries, Ltd.). Next, the above-mentioned various polyamide resin compositions were injection molded in the die under the conditions of cylinder setting temperature: melting point (Tm) of polyamide resin (A) + 10°C, die temperature 160°C, and injection speed 50 mm / sec to produce an electric part having a metal member 110 and a resin member 120 covering the metal member 110. [Industrial Applicability]

[0154] The electrical component of the present invention can suppress the occurrence of dielectric breakdown, and is therefore useful, for example, for components (such as automobile components) that require insulating resin members. [Explanation of symbols]

[0155] 100 Electrical Parts 110 Metallic parts 120 Resin parts 200 Busbar Unit 310 Aircraft 320 power supply 330 Drive Unit 332 Inverter 334 Motor 335 Reducer 336 Motor case

Claims

1. A metal member; A resin member containing a polyamide resin composition and coating the metal member, The polyamide resin composition includes a polyamide resin (A) including a component unit (a) derived from a dicarboxylic acid and a component unit (b) derived from a diamine, The component unit (a) derived from a dicarboxylic acid is a component unit (a1) derived from terephthalic acid, the content of which is from 10 mol % to 100 mol % relative to the total number of moles of the component unit (a) derived from the dicarboxylic acid; and a component unit (a2) derived from an aromatic dicarboxylic acid other than an aliphatic dicarboxylic acid, an alicyclic dicarboxylic acid, or a terephthalic acid, the content of which relative to the total number of moles of the component unit (a) derived from the dicarboxylic acid is 0 mol % or more and 90 mol % or less, The diamine-derived component unit (b) is a component unit (b1) derived from 1,3-bis(aminomethyl)cyclohexane or 1,4-bis(aminomethyl)cyclohexane, in which the content of the component unit (b) derived from the diamine is 50 mol % or more and 100 mol % or less based on the total number of moles; and a component unit (b2) derived from an alkylene diamine having 4 to 12 carbon atoms, the content of which is 0 mol % or more and 50 mol % or less relative to the total number of moles of the component unit (b) derived from the diamine. Electrical components.

2. the content of the component unit (b1) derived from the 1,3-bis(aminomethyl)cyclohexane or the 1,4-bis(aminomethyl)cyclohexane is 65 mol % or more and 95 mol % or less based on the total number of moles of the component unit (b) derived from the diamine; 2. The electrical component of claim 1.

3. the content of the component unit (a1) derived from the terephthalic acid is 20 mol % or more and 100 mol % or less based on the total number of moles of the component unit (a) derived from the dicarboxylic acid; 3. An electrical component according to claim 1 or 2.

4. The electrical component according to claim 1 or 2, wherein the polyamide resin (A) has a glass transition temperature (Tg) of 160° C. or higher.

5. 3. The electrical component according to claim 1 or 2, which is an automotive component.

6. A metal bus bar; a retaining member comprising a polyamide resin composition, covering the bus bar and retaining the bus bar, The polyamide resin composition includes a polyamide resin (A) including a component unit (a) derived from a dicarboxylic acid and a component unit (b) derived from a diamine, The component unit (a) derived from a dicarboxylic acid is a component unit (a1) derived from terephthalic acid, the content of which is from 10 mol % to 100 mol % relative to the total number of moles of the component unit (a) derived from the dicarboxylic acid; and a component unit (a2) derived from an aromatic dicarboxylic acid other than an aliphatic dicarboxylic acid, an alicyclic dicarboxylic acid, or a terephthalic acid, the content of which relative to the total number of moles of the component unit (a) derived from the dicarboxylic acid is 0 mol % or more and 90 mol % or less, The diamine-derived component unit (b) is a component unit (b1) derived from 1,3-bis(aminomethyl)cyclohexane or 1,4-bis(aminomethyl)cyclohexane, in which the content of the component unit (b) derived from the diamine is 50 mol % or more and 100 mol % or less based on the total number of moles; and a component unit (b2) derived from an alkylene diamine having 4 to 12 carbon atoms, the content of which is 0 mol % or more and 50 mol % or less relative to the total number of moles of the component unit (b) derived from the diamine. Busbar unit.

7. A motor; an inverter that supplies power to the motor; A drive unit having a bus bar unit electrically connecting the motor and the inverter, The busbar unit is the busbar unit according to claim 6. Drive unit.

8. The aircraft and A drive unit according to claim 7, Mobile body.

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