Method for creating template, program, detector, lithography device, and article producing method

Abstract

To provide a technology advantageous for reducing degree of matching between a template and a fake pattern.SOLUTION: A method for creating a template for template matching includes a generation process that extracts candidate points of feature points of a mark pattern from an image obtained through imaging to generate a provisional template, a searching process that searches for fake patterns having a correlation with the provisional template higher than a reference value from the image other than the mark pattern, and a determination process that corrects the provisional template based on the feature points of the fake patterns obtained in the searching process and decides the corrected provisional template as a template; in the searching process, the correlation with the fake patterns obtained through search is calculated while deforming the provisional template.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a method for creating a template, a program, a detection apparatus, a lithography apparatus, and a method for manufacturing an article. [Background technology]

[0002] In a lithography apparatus that transfers a pattern from a master to a substrate to form a pattern on the substrate, alignment between the master and the substrate is necessary. Alignment generally includes measuring the position of a mark formed on the substrate, and the measurement can be performed by pattern matching using a template (template matching).

[0003] On a substrate, there are various patterns other than the registered pattern that serves as a template, and some of these patterns may be similar to the registered pattern, which may result in erroneous detection of a pattern other than the mark that should be detected. In Patent Document 1, a temporary template is created from the feature points of the template, and a false pattern different from the mark to be detected is searched for using the temporary template. From the feature points of the registered pattern and the feature points of the false pattern, feature points that are non-edge parts of the mark and edge parts of the false pattern are extracted, and the temporary template is corrected so as not to erroneously detect the false pattern.

[0004] Furthermore, if the shape of the mark varies due to process factors, etc., the measurement accuracy may decrease if the template is used as is. Patent Document 2 describes how the accuracy of pattern matching can be improved by modifying the template to absorb the variation in the shape of the mark. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 5351409 [Patent Document 2] Patent Publication No. 2021-060251 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the conventional technology, when a template is registered, a pattern that is different in size from the registered mark is not detected as a false pattern. Therefore, no measures are taken to prevent erroneous measurement of false patterns of different sizes during measurement. In pattern matching during measurement, the template may be enlarged or reduced to increase the degree of correlation, so the false patterns of different sizes are erroneously detected. In this way, the conventional technology cannot deal with erroneous detection of false patterns of different sizes.

[0007] The present invention provides an advantageous technique for reducing the degree of matching between templates and spurious patterns. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided a method for creating a template for template matching, comprising: a generating step of extracting candidate points for feature points of a mark pattern from an image obtained by imaging and generating a temporary template; a searching step of searching, from the image, for a false pattern other than the mark pattern and having a degree of correlation with the temporary template higher than a reference value; and a determining step of correcting the temporary template based on the feature points of the false pattern obtained in the searching step and determining the corrected temporary template as a template, wherein in the searching step, a degree of correlation with the false pattern obtained by searching is calculated while deforming the temporary template. Effect of the Invention

[0009] According to the present invention, it is possible to provide a technique that is advantageous in reducing the degree of matching between a template and a false pattern. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram showing the configuration of an exposure apparatus. [Diagram 2] 13 is a flowchart of a processing procedure for measuring a substrate position. [Diagram 3] 1 is a flow chart of a method for creating a template. [Figure 4] 13 is a flowchart of a false pattern search process. [Diagram 5] 1A to 1C are diagrams illustrating a temporary template creating process. [Figure 6] FIG. 13 is a diagram for explaining a false pattern search process. [Figure 7] 1 is a flow chart of a method for creating a template. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0012] First Embodiment One aspect of the present invention relates to a detection device for detecting the position of a substrate. The detection device according to the present invention can be typically applied to alignment between an original and a substrate in a lithography apparatus such as an exposure apparatus or an imprint apparatus, but can also be applied to other apparatuses such as a processing apparatus, an inspection apparatus, and a microscope. The exposure apparatus is an apparatus that projects a pattern of an original onto a substrate via a projection optical system to form a pattern on the substrate. The imprint apparatus is an apparatus that brings a pattern surface of an original into contact with an imprint material on the substrate to form a pattern on the substrate. An example in which the detection device according to the present invention is applied to an exposure apparatus, which is one of the lithography apparatuses, will be described below.

[0013] FIG. 1 is a diagram showing the configuration of an exposure apparatus 1 to which a detection device 2 of the present invention is applied. In this specification and the drawings, directions are shown in an XYZ coordinate system with a horizontal plane as the XY plane. In general, a substrate W, which is a substrate to be exposed, is placed on a stage STG so that its surface is parallel to the horizontal plane (XY plane). Therefore, in the following, the directions perpendicular to each other in a plane along the surface of the substrate W are referred to as the X-axis and Y-axis, and the direction perpendicular to the X-axis and Y-axis is referred to as the Z-axis. In the following, the directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are referred to as the X-direction, Y-direction, and Z-direction, respectively.

[0014] The exposure apparatus 1 is an apparatus that irradiates the reticle R with exposure light from an illumination system IL after aligning the reticle R and the substrate W, and projects the pattern of the reticle R onto the substrate W by a projection optical system PO, thereby transferring the pattern onto the substrate W. The substrate W is mounted on a stage STG that can move in the XY directions via a chuck CH that fixes the substrate. The stage STG may also be configured to be movable in the Z direction for adjusting the focus of the exposure light. An alignment mark AM is formed on the substrate W, and alignment is performed with the alignment mark AM as a target. The detection device 2 includes an alignment scope SC for observing the alignment mark AM. The alignment scope SC may include an imaging unit that captures an image of the alignment mark AM by imaging a partial area including the alignment mark AM formed on the substrate W held by the stage STG. The light emitted from the light source LI has its amount of light adjusted via an ND filter ND, is guided to a half mirror M by a fiber or a dedicated optical system, and illuminates the alignment mark AM via a projection optical system or the like. The light source LI and the ND filter ND are controlled by a light amount adjustment unit LP. The image of the alignment mark AM passes through a half mirror M and is projected onto a photosensor S in a camera CAM.

[0015] The image of the alignment mark AM received by the photosensor S is photoelectrically converted. The accumulation time, which is the time it takes for the photosensor S to accumulate light, can be controlled by the sensor control device AMP. The accumulation time is instructed to the sensor control device AMP from the host control device HP via the alignment processing device AP in the alignment measurement device AC. The timing for accumulating light is instructed to the sensor control device AMP from the stage processing device SP in the stage control device STC via the alignment processing device AP. The stage STG is driven by a motor MOT. The stage processing device SP measures the position of the stage STG using an interferometer PM and controls the motor MOT based on the results of the measurement.

[0016] The signal photoelectrically converted by the photosensor S is A / D converted by the sensor control device AMP and stored in the memory MEM as an image, which is digital signal information. The alignment processing device AP can function as a processing unit that processes the image stored in the memory MEM to detect the position of the alignment mark AM. Pattern matching using a template is used as a method for detecting the position of the alignment mark AM. The calculator CMP calculates the degree of correlation (degree of matching) between the image stored in the memory MEM and the template TP saved in the alignment processing device AP, and detects the position of the alignment mark AM that has a high degree of correlation with respect to the shape of the template. The detected position of the alignment mark AM is transmitted to the host control device HP. The host control device HP controls the stage control device STC based on the position of the alignment mark AM. This allows the stage STG to be aligned.

[0017] The host controller HP functions as a control unit that comprehensively controls each part of the detection apparatus 2. The host controller HP may also include a function of controlling the exposure process of the exposure apparatus 1. The host controller HP may typically be configured as a computer (information processing device) including a processor and a storage device (memory). In this embodiment, as described above, the alignment processing device AP functions as a processing unit that performs processing to obtain the position of the alignment mark AM by pattern matching, but the alignment processing device AP and the host controller HP do not need to be configured as independent devices. For example, the function of the alignment processing device AP may be performed by the host controller HP.

[0018] The configuration of the exposure apparatus 1 in this embodiment is roughly as described above. When the exposure apparatus 1 is used as an exposure apparatus for manufacturing semiconductor devices, it is important to align the reticle R, which is an original on which a circuit pattern is formed, with the substrate W onto which the circuit pattern of the reticle R is projected with high accuracy. As an alignment technique, there are two types of alignment methods, pre-alignment and fine alignment, using an alignment mark AM provided on the substrate W. The role of pre-alignment is to detect the amount of feed deviation when the substrate W is fed from the substrate transport device onto the stage STG, and roughly align the position of the substrate W so that fine alignment can be performed normally. The role of fine alignment is to correctly measure the position of the substrate W placed on the stage STG, and precisely align the substrate W so that the alignment error with the reticle R falls within an allowable range.

[0019] As described above, in pre-alignment, it is necessary to detect the feed deviation that occurs when the substrate W is fed from the substrate transport device onto the stage STG. For this reason, the alignment scope SC in pre-alignment has a wide detection range relative to the mark size. Pattern matching processing is used as a method for detecting the alignment mark in such a wide detection range and calculating the XY coordinates. There are roughly two types of pattern matching processing used in this technical field. One is a method in which an image of the alignment mark captured by a camera equipped with an accumulation type photoelectric conversion element is binarized, and matching is performed with a pre-stored template, and the position with the highest correlation is determined as the mark position. The other is a method in which a correlation calculation is performed with a template having grayscale information while the grayscale image is kept as it is. For the latter, a normalized cross-correlation method is often used.

[0020] A processing procedure for substrate position measurement in the first embodiment will be described with reference to the flowchart of Fig. 2. Fig. 2 is a flowchart of a method for performing substrate position measurement using a template created in advance from an alignment mark design or a device design.

[0021] The method starts in S101, and in S102, a substrate W is carried into the apparatus and mounted on a stage STG. In S103, the stage processing device SP moves the stage STG to a pre-alignment position for the substrate W. The pre-alignment position is a position where an alignment mark that is the same as a template created in advance based on the alignment mark design falls within the imaging field of the alignment scope SC.

[0022] In S104, the alignment scope SC captures and acquires an image of the alignment mark on the substrate W. It is assumed that the imaging conditions of the alignment mark, such as the amount of light irradiated onto the alignment mark and the focus position, have been determined in advance by measurement.

[0023] In S105, the alignment processing device AP detects the position of the alignment mark AM from the alignment mark image acquired in S104 by pattern matching (template matching) using a template created in advance. The template is composed of a plurality of feature points according to a predetermined alignment mark design. In the pattern matching process, the calculator CMP calculates the degree of correlation (matching degree) between each pixel in the detection range of the image stored in the memory MEM and the template. From the correlation degree of each pixel, the calculator CMP detects a position within the detection range that is similar to the alignment mark AM as the alignment mark position. If the correlation degree of each pixel is equal to or lower than a threshold value (NO in S106), the template may be transformed by enlarging / reducing, rotating, etc. (S107).

[0024] In S108, the alignment processing device AP determines a fine alignment position from the position measurement result calculated in a state of high correlation obtained by deformation of the template, and the host control device HP moves the stage STG to that position. After that, in S109, the alignment processing device AP executes fine alignment. Note that even if fine alignment is not performed, the substrate position measurement may be terminated based only on the pattern matching result.

[0025] A method for creating a template for template matching will be described with reference to FIG.

[0026] In S201, the alignment processing device AP extracts candidate points for feature points of the registered pattern from an image obtained by imaging using the alignment scope SC. Specifically, the host control device HP controls the stage control device STC to move the stage STG to a position where the alignment mark on the substrate can be observed. A mark pattern, which is a pattern of the alignment mark AM, that is, a registered pattern, is illuminated by a light beam emitted from the light source LI through an ND filter ND and a half mirror M. FIG. 5(a) shows an example of a registered pattern. The light beam reflected by the registered pattern passes through the half mirror M and is projected onto the photosensor S in the camera CAM. The image of the alignment mark AM received by the photosensor S is photoelectrically converted. The accumulation time, which is the time for accumulating light in the photosensor S, can be controlled by the sensor control device AMP. The accumulation time is instructed from the host control device HP to the sensor control device AMP via the alignment processing device AP in the alignment measurement device AC. Furthermore, the timing of accumulating light is instructed to the sensor control device AMP from the stage processing device SP in the stage control device STC via the alignment processing device AP. The signal photoelectrically converted by the photosensor S is A / D converted by the sensor control device AMP and stored in the memory MEM as an image, which is digital signal information. The alignment processing device AP differentiates the obtained image in the X and Y directions. FIG. 5(b) shows an example of the results of differentiating the image of the registered pattern shown in FIG. 5(a) in the X and Y directions. In FIG. 5(b), coordinates with high differential values ​​are indicated by ×. The alignment processing device AP extracts the coordinates with high differential values ​​indicated by × as candidate points for template feature points.

[0027] In S202, the alignment processing device AP determines feature points of the template from the candidate points of the feature points extracted in S201, and generates a temporary template. The alignment processing device AP can determine the feature points constituting the temporary template based on, for example, a predetermined total number of feature points or intervals between feature points. In one example, the alignment processing device AP selects, as the temporary template, feature points that are spatially evenly arranged from the extracted candidate points, as shown in FIG. 5(c). The selected feature points of the temporary template that constitute the temporary template are stored in the memory MEM and can be used for template matching. Note that the method of extracting the candidate points of the feature points and the method of determining the feature points constituting the template are not limited to the above-mentioned methods.

[0028] In S203, the alignment processing device AP searches the image for a false pattern other than the mark pattern, the false pattern having a correlation with the temporary template higher than a reference value. Here, the image to be searched is the image used in S201 (the image obtained by imaging with the alignment scope SC) (first image), but it may be another image (second image). An example of using the second image will be described later as the second embodiment. In S203, the correlation with the false pattern obtained by the search is calculated while deforming the temporary template generated in S202.

[0029] The details of the false pattern search step in S203 will be described with reference to the flowchart of FIG. 4. In this embodiment, the deformation of the temporary template may include changing the positions of all feature points constituting the temporary template. As an example, the change in the positions of such feature points is performed by moving each feature point away from or toward the center or center of gravity of the temporary template. However, the deformation of the temporary template is not limited to this. For example, the deformation of the temporary template may be performed by moving each feature point so that the temporary template rotates at a predetermined rotation angle around the center or center of gravity of the temporary template.

[0030] In step S301, the alignment processing device AP acquires all template deformation patterns. As an example, the template deformation patterns may include the following seven patterns. (a) No deformation; (b) Deformation of the virtual template by moving it 1, 2, or 3 pixels away from the center. (c) Deformation of the provisional template by 1, 2, or 3 pixels closer to the center.

[0031] In S302, the alignment processing device AP judges whether the temporary template has been deformed using all the template deformation patterns. If the temporary template has been deformed using all the deformation patterns, the sequence of S203 is terminated. If the temporary template has not yet been deformed using all the deformation patterns, the process proceeds to S303. In S303, the alignment processing device AP selects one pattern from among the unexecuted deformation patterns. Thereafter, in S304, the alignment processing device AP deforms the temporary template using the deformation pattern selected in S303. FIG. 6(a) shows an example of the original temporary template. This is the same as that shown in FIG. 5(c). FIG. 6(b) shows an example of the temporary template after deformation to move the temporary template one pixel closer to the center.

[0032] In S305, the alignment processing device AP uses the deformed temporary template to search the target image and calculate the degree of correlation. If the target image contains a false pattern whose shape is different from that of the registered pattern, as shown in Fig. 6(c), the false pattern cannot be detected by the undeformed temporary template, and the false pattern is not subject to template correction, which will be described later. In contrast, in this embodiment, the deformed temporary template increases the degree of correlation of the false pattern, making it possible to find patterns around the registered pattern that may cause erroneous measurement.

[0033] Returning to the explanation of Fig. 3, in S204, the alignment processing device AP judges whether or not there is a false pattern having a higher correlation with the temporary template than a reference value other than the mark pattern (registered pattern) to be detected. If there is no false pattern having a higher correlation with the temporary template than a reference value other than the registered pattern, the process proceeds to S205. In S205, the alignment processing device AP determines the temporary template generated in S202 as the actual template.

[0034] If it is determined in S204 that a false pattern having a correlation degree with the temporary template higher than a reference value exists other than the registered pattern, the process proceeds to a correction loop including S206 and S207. In S207 in the correction loop, the alignment processing device AP corrects the temporary template based on the information of the false pattern so that the correlation degree between the temporary template and the false pattern falls below a reference value. The "information of the false pattern" may be information of a portion that exists only in one of the registered pattern and the false pattern. Here, it is assumed that information of a portion that exists only in the false pattern is used. For example, in the case of a false pattern as shown in FIG. 6(c), the feature points that exist only in the false pattern as shown by the dashed lines are registered in the template as non-edge position feature points as indicated by circles in FIG. 6(d). As described in Japanese Patent Publication No. 5351409 (Patent Document 1), the non-edge position feature points in the template are useful for reducing the degree of matching with a false pattern in which the non-edge position of the registered pattern becomes an edge position. The feature points indicated by crosses in FIG. 6(d) are feature points of the original temporary template. After S207 ends, the process returns to S203.

[0035] In S206, the alignment processing device AP determines whether the number of corrections in S207 is within a specified number of times. If the number of corrections is within the specified number of times, the process proceeds to S207. If the number of corrections exceeds the specified number of times, a template registration error occurs and the process ends.

[0036] In this manner, the correction loop including S203, S204, S205, and S207 is repeated until there is no false pattern having a correlation degree with the provisional template higher than the reference value, or until the number of corrections exceeds a specified number.

[0037] This sequence makes it possible to determine a corrected template that can reliably detect the mark to be detected. With this sequence, in a situation where the shapes of the registered pattern and the false pattern vary, it is possible to reliably match the shape variation of the registered pattern by deforming the template, while preventing erroneous measurement of the false pattern, which also varies in shape.

[0038] The determined template is stored in the memory MEM, and is called up by the alignment processing device AP when detecting (measuring) the mark position, and is used in the template matching described with reference to FIG.

[0039] <Second embodiment> In the above-described first embodiment, the target image for false pattern search in S203 was the image used in S201 (the image obtained by imaging using the alignment scope SC) (first image). However, the target image for false pattern search in S203 may be another image (second image). In the second embodiment, a wide-area image including the first image and one or more images of the peripheral area of ​​the first image is used as the second image. By using the wide-area image, it becomes possible to register a template taking into consideration false patterns in the periphery of the mark outside the imaging field of view. A method for creating a template for template matching in the second embodiment will be described with reference to FIG. 7.

[0040] In Fig. 7, step S701 for creating a wide-area image is interposed between S202 and S203. The rest is the same as Fig. 3 according to the first embodiment.

[0041] In S701, the host control device HP controls the stage control device STC to move the stage STG while causing the alignment scope SC to perform imaging at multiple positions. This results in multiple images. The multiple images may include an image for creating a temporary template (i.e., the image used in S201) and one or more images of the surrounding area of ​​the image. Alternatively, instead of the image for creating a temporary template (i.e., the image used in S201), an image obtained by capturing an image again at the same position as the image capturing position of the image may be used. The alignment processing device AP combines the multiple images obtained to create a wide-area image.

[0042] Thereafter, in S203, the alignment processing device AP searches the created wide-area image for a false pattern other than the mark pattern (registered pattern) that has a correlation with the temporary template higher than a reference value. If a false pattern other than the registered pattern that has a correlation with the temporary template higher than a reference value exists in the combined image (NO in S204), a correction loop is entered that returns to S203 via S206 and S207. The correction loop is repeated until there is no false pattern in the wide-area image that has a correlation with the temporary template higher than a reference value, or until the number of corrections exceeds a reference number. In this way, by searching for a false pattern in an image with a wider area than the image for creating the temporary template (i.e., the image used in S201), it becomes possible to register a template that takes into account false patterns in the periphery of the mark that are outside the imaging field of view in one imaging.

[0043] In the above example, a wide-area image is created by combining multiple images obtained by imaging, but instead of combining multiple images, each of the multiple images may be searched using a temporary template to check whether or not a false pattern exists in the image. In this case, since a false pattern may straddle the boundaries of multiple images, it is necessary to change the stage position and perform imaging so that the imaging ranges overlap.

[0044] <Embodiment of the article manufacturing method> The device manufacturing method according to the embodiment of the present invention is suitable for manufacturing devices such as microdevices, such as semiconductor devices, and elements having fine structures. The device manufacturing method according to the present embodiment includes a step of forming a pattern on a substrate using the exposure apparatus, and a step of processing the substrate on which the pattern has been formed in the step. Furthermore, the manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The device manufacturing method according to the present embodiment is advantageous in at least one of device performance, quality, productivity, and production cost compared to conventional methods.

[0045] <Other embodiments> The present invention can also be realized by a process in which a program for implementing one or more of the functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. The present invention can also be realized by a circuit (e.g., ASIC) for implementing one or more of the functions.

[0046] The disclosure of the present specification includes at least the following techniques. (Item 1) 1. A method for creating a template for template matching, comprising the steps of: A generation step of extracting candidate points for feature points of the mark pattern from the image obtained by imaging and generating a temporary template; a searching step of searching the image for a false pattern having a correlation degree with the temporary template higher than a reference value other than the mark pattern; a determination step of correcting the temporary template based on feature points of the false pattern obtained in the search step, and determining the corrected temporary template as a template; having in the searching step, a correlation between the temporary template and a false pattern obtained by the search is calculated while the temporary template is being transformed; A method comprising: (Item 2) 2. The method according to item 1, characterized in that the deformation of the feature points includes changing the positions of all feature points that constitute the temporary template. (Item 3) 3. The method according to item 2, characterized in that changing the positions of the feature points includes moving each feature point away from or towards the center or center of gravity of the temporary template. (Item 4) 3. The method according to claim 2, wherein changing the positions of the feature points includes moving each feature point so as to rotate the temporary template around a center or center of gravity of the temporary template. (Item 5) 5. The method according to any one of items 1 to 4, characterized in that the searching step includes acquiring a wide-area image including the image and one or more images of a surrounding area of ​​the image, and searching for the false pattern from the wide-area image. (Item 6) A program for causing a computer to execute each step of the method according to any one of items 1 to 5. (Item 7) A detection device for detecting a mark formed on a substrate, comprising: a stage for holding and moving the substrate; an imaging unit that images a partial region of the substrate held by the stage; A processing unit performs processing for detecting the mark by pattern matching using a template created according to the method according to any one of items 1 to 5 for the image of the partial region obtained by the imaging; and A detection device comprising: (Item 8) Item 7 is provided with the detection device, a detection device detects a mark formed on a substrate, aligns the stage based on a result of the detection, and transfers a pattern of an original onto the substrate held by the stage after the alignment is performed; 13. A lithography apparatus comprising: (Item 9) forming a pattern on a substrate using the lithography apparatus according to item 8; processing the substrate on which the pattern is formed; and manufacturing an article from the substrate on which the processing has been performed.

[0047] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0048] 1: exposure device, 2: detection device, STG: stage, SC: alignment scope, AP: alignment processing device, STC: stage control device, HP: host control device

Claims

1. 1. A method for creating a template for template matching, comprising the steps of: A generation step of extracting candidate points for feature points of the mark pattern from the image obtained by imaging and generating a temporary template; a searching step of searching the image for a false pattern having a correlation degree with the temporary template higher than a reference value other than the mark pattern; a determination step of correcting the temporary template based on feature points of the false pattern obtained in the search step, and determining the corrected temporary template as a template; having in the searching step, a correlation between the temporary template and a false pattern obtained by the search is calculated while the temporary template is being transformed; A method comprising:

2. The method of claim 1 , wherein the deformation of the feature points includes changing the positions of all feature points that constitute the temporary template.

3. The method of claim 2 , wherein modifying the location of the feature points comprises moving each feature point away from or towards a center or centroid of the temporary template.

4. The method of claim 2 , wherein modifying the positions of the feature points includes moving each feature point such that the temporary template rotates about a center or center of gravity of the temporary template.

5. 2. The method of claim 1, wherein the searching step includes obtaining a wide-area image including the image and one or more images of a surrounding area of ​​the image, and searching for the spurious pattern in the wide-area image.

6. A program for causing a computer to execute each step of the method according to any one of claims 1 to 5.

7. A detection device for detecting a mark formed on a substrate, comprising: a stage for holding and moving the substrate; an imaging unit that images a partial region of the substrate held by the stage; a processing unit that performs processing to detect the mark by pattern matching using a template created according to the method according to any one of claims 1 to 5 for the image of the partial region obtained by the imaging; A detection device comprising:

8. A detection device according to claim 7, a detection device detects a mark formed on a substrate, aligns the stage based on a result of the detection, and transfers a pattern of an original onto the substrate held by the stage after the alignment is performed; 13. A lithography apparatus comprising:

9. forming a pattern on a substrate using a lithographic apparatus according to claim 8; processing the substrate on which the pattern is formed; and manufacturing an article from the substrate on which the processing has been performed.

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