Curable composition, cured product thereof, and semiconductor device using the same

Abstract

To provide a curable composition which gives a cured product having a high refractive index and excellent light transmissivity in a short wavelength region.SOLUTION: The curable composition contains the following components (A), (B), (C) and (D): (A) a compound represented by the following formula (1) (where each R1 independently represents a hydrogen atom, a C1-12 monovalent hydrocarbon group having no aliphatic unsaturated bond, a C2-12 alkenyl group, an acryloyl group, a methacryloyl group or a glycidyl group; and at least one R1 represents a C2-12 alkenyl group, an acryloyl group or a methacryloyl group); (B) an organopolysiloxane having two or more alkenyl groups in one molecule; (C) an organosilicon compound having three or more SiH groups in one molecule; and (D) a hydrosilylation reaction catalyst.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a curable composition, a cured product thereof, and a semiconductor device using the cured product. [Background technology]

[0002] Silicone resins are widely used as materials for optical devices or optical components, particularly as encapsulating materials and lens materials for light-emitting diode (LED) elements.

[0003] Materials for such optical components are required to have a high refractive index in order to improve light extraction efficiency and reduce the thickness of lenses, but with existing silicone resins, even when phenyl silicone is used, the refractive index of the cured product is only about 1.58 (Patent Documents 1 and 2).

[0004] In addition, although curable compositions incorporating a fluorene skeleton having a high refractive index have been proposed (Patent Documents 3 to 5), the refractive index of each of them remains at 1.56 or less, and further improvement in the refractive index has been desired. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2010-132795 A [Patent Document 2] JP 2014-133833 A [Patent Document 3] JP 2007-224193 A [Patent Document 4] JP 2012-82305 A [Patent Document 5] JP 2012-229356 A Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention has been made to solve the above problems, and has an object to provide a curable composition that gives a cured product having a high refractive index and excellent light transmittance in the short wavelength region, and a cured product thereof. [Means for solving the problem]

[0007] In order to solve the above problems, the present invention provides a curable composition comprising the following components (A), (B), (C) and (D): (A) A compound represented by the following formula (1): [ka] (In the formula, R 1 are each independently a hydrogen atom, a monovalent hydrocarbon group having 1 to 12 carbon atoms and no aliphatic unsaturated bonds, an alkenyl group having 2 to 12 carbon atoms, an acryloyl group, a methacryloyl group, or a glycidyl group, and R 1 At least one of the groups is an alkenyl group having 2 to 12 carbon atoms, an acryloyl group, or a methacryloyl group.) (B) Organopolysiloxane having two or more alkenyl groups in one molecule (C) Organosilicon compounds having three or more SiH groups in one molecule (D) Hydrosilylation reaction catalyst

[0008] Such a curable composition of the present invention can give a cured product that has a high refractive index and excellent light transmittance in the short wavelength region.

[0009] In the curable composition of the present invention, the component (B) is preferably a compound represented by the following formula (2). [ka] (In the formula, R 2 and R 3 are each independently a methyl group or a phenyl group, a is an integer of 0 to 50, and b is an integer of 0 to 100. However, when a is 0, R 3is a phenyl group, and b is 1 to 100. The siloxane units in parentheses may be arranged in any order.

[0010] Such a curable composition can give a cured product having a higher refractive index and excellent light transmittance in the short wavelength region.

[0011] The curable composition of the present invention further comprises The component (C) is An organohydrogenpolysiloxane represented by the following formula (3): An organohydrogenpolysiloxane represented by the following formula (4), and An organosilicon compound represented by the following formula (5): It is preferable that the material is one or more selected from the group consisting of: [ka] (R 4 are each independently a methyl group or a phenyl group, c is an integer of 1 to 3, and d is an integer of 1 to 3. The order of the siloxane units in parentheses is arbitrary. [(C 6 H 5 )SiO 3 / 2 ] e [H(C 6 H 5 )(CH 3 )SiO 1 / 2 ] e+2 (4) (In the formula, e is an integer of 1 to 3.) [ka] (In the formula, n is an integer of 1 to 3. The wavy line represents a bond.)

[0012] Such a curable composition can give a cured product having a higher refractive index and excellent light transmittance in the short wavelength region.

[0013] The present invention also provides a cured product which is a cured product of the curable composition of the present invention.

[0014] The cured product of the present invention can exhibit a high refractive index and excellent light transmittance in the short wavelength region.

[0015] The cured product of the present invention preferably has a light transmittance of 70% or more at a wavelength of 450 nm at 25° C. when the product has a thickness of 1 mm.

[0016] A cured product having such a light transmittance can be suitably used for, for example, protection, sealing or adhesion of light emitting diode elements, wavelength changing or adjustment, or as a lens, etc.

[0017] The present invention also provides a semiconductor device, The cured product of the present invention covering the semiconductor element. The present invention provides a semiconductor device comprising:

[0018] The semiconductor device of the present invention has a high light extraction efficiency because the refractive index of the cured material covering the semiconductor element is high. Furthermore, the cured material covering the semiconductor element has excellent light transmittance in the short wavelength region, so it is also useful as a semiconductor device that requires light transmittance, such as a light emitting diode element. Effect of the Invention

[0019] As described above, the curable composition of the present invention can provide a cured product having a high refractive index and excellent light transmittance in the short wavelength region. Therefore, the cured product can be suitably used for, for example, protection, sealing or adhesion of light-emitting diode elements, wavelength change or adjustment, or lenses. It is also useful as a lens material, a sealing material for optical devices or optical parts, a display material, or other materials for various optical parts. [Brief description of the drawings]

[0020] [Figure 1] 1 is a schematic cross-sectional view showing an example of an optical semiconductor device using a cured product of the curable composition of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] As described above, there has been a demand for the development of a curable composition that gives a cured product that has a high refractive index and excellent light transmittance in the short wavelength region.

[0022] As a result of extensive investigations into the above-mentioned problems, the present inventors have found that the above-mentioned problems can be solved by a curable composition containing a component (A) represented by the following formula (1) and the following components (B) to (D), and have completed the present invention.

[0023] That is, the present invention relates to a curable composition comprising the following components (A), (B), (C) and (D): (A) A compound represented by the following formula (1): [ka] (In the formula, R 1 are each independently a hydrogen atom, a monovalent hydrocarbon group having 1 to 12 carbon atoms and no aliphatic unsaturated bonds, an alkenyl group having 2 to 12 carbon atoms, an acryloyl group, a methacryloyl group, or a glycidyl group, and R 1 At least one of the groups is an alkenyl group having 2 to 12 carbon atoms, an acryloyl group, or a methacryloyl group.) (B) Organopolysiloxane having two or more alkenyl groups in one molecule (C) Organosilicon compounds having three or more SiH groups in one molecule (D) Hydrosilylation reaction catalyst

[0024] The present invention also relates to a cured product, which is a cured product of the curable composition of the present invention.

[0025] The present invention also provides a semiconductor device, The cured product of the present invention covering the semiconductor element. The semiconductor device is characterized by comprising:

[0026] The present invention will be described in detail below, but the present invention is not limited thereto.

[0027] [Curable composition] The curable composition of the present invention contains the following components (A) to (D): The curable composition of the present invention (also referred to as an addition-curable silicone composition) can be prepared by mixing the following components (A) to (D) and, if necessary, other components, by a conventionally known method.

[0028] Each component will be described in detail below.

[0029] [Component (A)] The component (A) in the curable composition of the present invention is a compound represented by the following formula (1). [ka] (In the formula, R 1 are each independently a hydrogen atom, a monovalent hydrocarbon group having 1 to 12 carbon atoms and no aliphatic unsaturated bonds, an alkenyl group having 2 to 12 carbon atoms, an acryloyl group, a methacryloyl group, or a glycidyl group, and R 1 At least one of the groups is an alkenyl group having 2 to 12 carbon atoms, an acryloyl group, or a methacryloyl group.)

[0030] R 1 Examples of the monovalent hydrocarbon group having 1 to 12 carbon atoms and no aliphatic unsaturated bond include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, neopentyl, hexyl, and octyl; cycloalkyl groups such as cyclohexyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; and aralkyl groups such as benzyl, phenylethyl, and phenylpropyl. 1 Other options for the alkenyl group having 2 to 12 carbon atoms include a vinyl group, an allyl group, a propenyl group, a butenyl group, a hexenyl group, and an octenyl group.

[0031] R 1 Among these, one or more (preferably 2 to 4, more preferably 2) are an alkenyl group having 2 to 12 carbon atoms (preferably an allyl group), an acryloyl group or a methacryloyl group.

[0032] Specific preferred examples of the component (A) are shown below, but are not limited thereto. The curable composition of the present invention may contain one type of component (A) or may contain a combination of two or more types of components (A). [ka]

[0033] The blending amount of the component (A) is preferably from 5 to 50 mass %, and more preferably from 20 to 40 mass %, based on the total mass of the curable composition.

[0034] [(B) Component] The component (B) in the curable composition of the present invention is an organopolysiloxane having two or more alkenyl groups in each molecule.

[0035] Specific examples of component (B) include, but are not limited to, a dimethylsiloxane-methylvinylsiloxane copolymer capped at both molecular chain terminals with trimethylsiloxy groups, a dimethylsiloxane-diphenylsiloxane-methylvinylsiloxane copolymer capped at both molecular chain terminals with trimethylsiloxy groups, and a dimethylsiloxane-diphenylsiloxane copolymer capped at both molecular chain terminals with dimethylvinylsiloxy groups. Component (B) can be used either alone or in combination of two or more types.

[0036] The component (B) is preferably a compound represented by the following formula (2), that is, a linear organopolysiloxane. [ka] (In the formula, R 2 and R 3are each independently a methyl group or a phenyl group, a is an integer of 0 to 50, and b is an integer of 0 to 100. However, when a is 0, R 3 is a phenyl group, and b is 1 to 100. The siloxane units in parentheses may be arranged in any order.

[0037] In the above formula (2), a is an integer from 0 to 50, preferably from 1 to 10, more preferably from 1 to 7, and even more preferably from 2 to 4. b is an integer from 0 to 100, preferably from 0 to 50, more preferably from 0 to 10, and even more preferably from 0. However, when a is 0, R 3 is a phenyl group, and b is 1 to 100.

[0038] The organopolysiloxane represented by the above formula (2) can be obtained, for example, by hydrolyzing and condensing a bifunctional silane such as dichlorodiphenylsilane or dialkoxydiphenylsilane, and then capping the ends with siloxane units containing aliphatic unsaturated groups, either after or simultaneously with the hydrolysis and condensation.

[0039] The curable composition of the present invention may contain one type of the component (B), or may contain a combination of two or more types of the component (B).

[0040] The blending amount of the component (B) is preferably from 5 to 50 mass %, and more preferably from 20 to 40 mass %, based on the total mass of the curable composition.

[0041] [(C) component] The component (C) in the curable composition of the present invention is an organosilicon compound having three or more, preferably 3 to 5, and more preferably 3, SiH groups in one molecule, and functions as a crosslinking agent by undergoing a hydrosilylation reaction with the above-mentioned component (B).

[0042] The component (C) is An organohydrogenpolysiloxane represented by the following formula (3): An organohydrogenpolysiloxane represented by the following formula (4), and An organosilicon compound represented by the following formula (5): It is preferable that the material is one or more selected from the group consisting of: [ka] (R 4 are each independently a methyl group or a phenyl group, c is an integer of 1 to 3, and d is an integer of 1 to 3. The order of the siloxane units in parentheses is arbitrary. [(C 6 H 5 )SiO 3 / 2 ] e [H(C 6 H 5 )(CH 3 )SiO 1 / 2 ] e+2 (4) (In the formula, e is an integer of 1 to 3.) [ka] (In the formula, n is an integer of 1 to 3. The wavy line represents a bond.)

[0043] The organosilicon compound represented by formula (5) above can be obtained, for example, by mixing an excess amount, preferably more than 3 mol and not more than 30 mol, more preferably more than 4.5 mol and not more than 15 mol, of a compound represented by formula (7) below with 1 mol of a compound represented by formula (6) below, and carrying out a hydrosilylation reaction in the presence of both.

[0044] [ka]

[0045] [ka]

[0046] The catalyst used in the hydrosilylation reaction may be a known one. For example, platinum-based catalysts such as carbon powder carrying platinum metal, platinum black, platinic chloride, chloroplatinic acid, reaction products of chloroplatinic acid and monohydric alcohols, complexes of chloroplatinic acid and olefins, platinum bisacetoacetate, etc.; platinum group metal catalysts such as palladium-based catalysts and rhodium-based catalysts. In addition, there are no particular limitations on the addition reaction conditions, purification conditions, use of solvents, etc., and known methods may be used.

[0047] The component (C) may consist of one type of compound, or may consist of a combination (mixture) of two or more types of compounds.

[0048] The amount of component (C) that is blended may be any amount sufficient to cure the curable composition of the present invention in the presence of a hydrosilylation catalyst, component (D), described below. Typically, the amount blended is such that the molar ratio of aliphatic unsaturated bonds in components (A) and (B) to SiH groups in component (C) is 0.2 to 5, and preferably 0.8 to 2.

[0049] [(D) component] The hydrosilylation catalyst which is the component (D) contained in the curable composition of the present invention may be the same as that used in the preparation of the organosilicon compound represented by the above formula (5).

[0050] The amount of component (D) blended in the curable composition of the present invention is preferably an amount that corresponds to 1 to 500 ppm, and more preferably 1 to 100 ppm, in terms of platinum group metal atoms, based on the total mass of the composition.

[0051] [Other ingredients] In addition to the above components (A) to (D), the curable composition of the present invention may contain other components such as an antioxidant, an inorganic filler, etc. The optional components will be described below.

[0052] [Antioxidants] In the cured product of the curable composition of the present invention, the aliphatic unsaturated bonds in the above components (A) and (B) may remain unreacted, and may be oxidized by oxygen in the air, causing discoloration of the cured product. Therefore, by adding an antioxidant to the curable composition of the present invention as necessary, such discoloration can be prevented in advance.

[0053] As the antioxidant, known ones can be used, for example, 2,6-di-t-butyl-4-methylphenol, 2,5-di-t-amylhydroquinone, 2,5-di-t-butylhydroquinone, 4,4'-butylidenebis(3-methyl-6-t-butylphenol), 2,2'-methylenebis(4-methyl-6-t-butylphenol), 2,2'-methylenebis(4-ethyl-6-t-butylphenol), etc. As the antioxidant, one of these compounds may be used alone, or two or more of them may be used in combination.

[0054] When this antioxidant is used, its amount is not particularly limited, but it is usually preferably about 1 to 10,000 ppm, particularly about 10 to 1,000 ppm, based on the total mass of the above components (A), (B) and (C). By using an amount within the above range, the antioxidant ability is fully exhibited, and a cured product with excellent optical properties can be obtained without coloring, clouding, oxidative deterioration, etc.

[0055] [Inorganic filler] In order to adjust the viscosity of the curable composition of the present invention, the hardness of the cured product obtained from the curable composition of the present invention, etc., to improve the strength, or to improve the dispersion of the phosphor, an inorganic filler such as nanosilica, fused silica, crystalline silica, titanium oxide, nanoalumina, or alumina may be added.

[0056] When an inorganic filler is used, the blending amount is preferably 0.1 to 20 parts by mass, and more preferably 1 to 10 parts by mass, per 100 parts by mass of the total of the above components (A), (B) and (C).

[0057] [Adhesion improver] The curable composition of the present invention may contain an adhesion improver. Examples of the adhesion improver include a silane coupling agent or an oligomer thereof, and a polysiloxane having the same reactive group as the silane coupling agent.

[0058] The adhesion improver is an optional component that is blended into the composition to improve the adhesion of the curable composition of the present invention and its cured product to a substrate. Here, the substrate refers to metal materials such as gold, silver, copper, and nickel, ceramic materials such as aluminum oxide, aluminum nitride, and titanium oxide, and polymer materials such as silicone resins and epoxy resins. As the adhesion improver, one of these may be used alone, or two or more may be used in combination.

[0059] When an adhesion improver is used, its amount is preferably 1 to 30 parts by mass, and more preferably 1 to 10 parts by mass, per 100 parts by mass of the total of the above components (A), (B), and (C). With such an amount, the thermosetting silicone composition of the present invention and its cured product effectively improve adhesion to substrates and are less likely to become discolored.

[0060] Specific examples of suitable adhesion improvers include those represented by the following formulas, but are not limited thereto.

[0061] [ka]

[0062] [ka]

[0063] [others] In order to ensure a long pot life, an addition reaction inhibitor such as 1-ethynylcyclohexanol or 3,5-dimethyl-1-hexyn-3-ol may be added.

[0064] Furthermore, a light stabilizer can be used to provide resistance to photodegradation caused by light energy from sunlight, fluorescent lamps, etc. As this light stabilizer, a hindered amine stabilizer that captures radicals generated by photooxidative degradation is suitable, and by using it in combination with an antioxidant, the antioxidant effect is further improved. Specific examples of light stabilizers include bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, 4-benzoyl-2,2,6,6-tetramethylpiperidine, etc.

[0065] [Physical Properties] The viscosity of the curable composition of the present invention measured by a rotational viscometer at 23° C. is preferably 0.1 to 500 Pa s, and more preferably 1 to 400 Pa s. When the viscosity is within such a range, the resulting composition tends to have good workability and handleability, and is less likely to develop bubbles or air entrapment during molding and curing.

[0066] In the curable composition of the present invention, the refractive index of light having a wavelength of 589.3 nm at 25° C. is preferably 1.59 or more.

[0067] [Cured product] The curable composition of the present invention can be cured to form the cured product of the present invention. That is, the present invention provides a cured product that is a cured product of the curable composition of the present invention.

[0068] The cured product has high hardness, mechanical strength, and crack resistance, and is excellent in light transmittance in the short wavelength region and gas barrier property. The curing conditions for the curable composition of the present invention are not particularly limited, but are preferably 60 to 180° C. and 5 to 180 minutes.

[0069] The cured product obtained from the curable composition of the present invention preferably has a light transmittance of 70% or more at a wavelength of 450 nm at 25° C. in a thickness of 1 mm.

[0070] A cured product of the present invention having such optical properties can be suitably used for applications such as protection, sealing or adhesion of light-emitting diode elements, changing or adjusting wavelength, or for lenses, and is also useful as a material for various optical components, such as a lens material, a sealing material for optical devices or optical components, and a display material.

[0071] [Semiconductor Devices] The present invention further includes a semiconductor device; The cured product of the present invention covering the semiconductor element. The present invention provides a semiconductor device comprising:

[0072] Hereinafter, with reference to FIG. 1, an example of a semiconductor device using a cured product of the curable composition of the present invention (hereinafter, also referred to as "the semiconductor device of the present invention") will be described, but the semiconductor device of the present invention is not limited to this example.

[0073] FIG. 1 is a schematic cross-sectional view showing an example of the semiconductor device of the present invention. In the semiconductor device 1 of the present invention, a semiconductor chip 4 is die-bonded onto a package 3 on which a silver-plated substrate 2 is formed, and the semiconductor chip 4 is wire-bonded by a bonding wire 5. The semiconductor chip 4 is covered with a cured product 6 of the curable composition of the present invention described above. That is, the semiconductor device 1 of FIG. 1 includes a semiconductor chip 4, which is a semiconductor element, and a cured product 6 of the present invention that covers the semiconductor chip. The semiconductor chip 4 can be covered, for example, by applying the curable composition (addition curing silicone composition) of the present invention described above onto the package 3 on which the semiconductor chip 4 is die-bonded so as to cover the semiconductor chip 4, and curing the coating of the curable composition by heating. It is to be noted that the curing may be performed by a known curing method under other known curing conditions.

[0074] In this case, from the viewpoint of being less susceptible to the effects of external stress and minimizing adhesion of dirt and the like, it is preferable that the curable composition forms a cured product having a hardness of 70 or more Shore D as specified by JIS upon curing.

[0075] Since the curable composition of the present invention can form a cured product having a high refractive index and excellent light transmittance in the short wavelength region, the semiconductor device of the present invention using this curable composition has excellent light extraction efficiency. EXAMPLES

[0076] The present invention will be specifically described below using examples and comparative examples, but the present invention is not limited to these.

[0077] [Examples 1 to 4, Comparative Examples 1 and 2] The curable compositions of Examples 1 to 4 and Comparative Examples 1 and 2 were prepared according to the following procedure.

[0078] First, the following components (A), (B) and (C) were mixed at 150°C for 2 hours in the compositions shown in Table 1 (numbers indicate parts by mass), and then cooled to 25°C. After cooling, components (D) and (E) were added to the mixture and mixed. The mixture thus obtained was then subjected to degassing under reduced pressure. In this manner, each curable composition was prepared. The viscosity and refractive index of each curable composition are also shown in Table 1. The viscosity is a value measured at 23°C using a B-type rotational viscometer, and the refractive index is a value measured at 25°C using a digital refractometer RX-9000α manufactured by Atago Co., Ltd. for light with a wavelength of 589.3 nm.

[0079] In the following examples, the symbols representing the composition of organopolysiloxane are as follows: M ViΦ :(CH 2 =CH)(C 6 H 5 )(CH 3 )SiO 1 / 2 M HΦ :H(C 6 H 5 )(CH 3 )SiO 1 / 2 D 2Φ :(C 6 H 5 ) 2 SiO2 / 2 T Φ :(C 6 H 5 )SiO 3 / 2

[0080] Component (A) (A-1) A compound represented by the following structural formula: [ka]

[0081] (A-2) A compound represented by the following structural formula: [ka]

[0082] (B) Component (B-1)M ViΦ 2 D 2Φ 3 A linear organopolysiloxane represented by the formula:

[0083] (C) Component (C-1)T Φ M HΦ 3 A branched organohydrogenpolysiloxane represented by the formula:

[0084] (C-2) A compound represented by the following structural formula: [ka]

[0085] (D) Component (D-1) Toluene solution of platinum 1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex (platinum content 0.5% by mass)

[0086] (E) Component (E-1) Ethynylcyclohexanol (reaction regulator)

[0087] [Table 1]

[0088] For each of the obtained curable compositions, the performance of the cured product was evaluated according to the following methods. The results are shown in Table 2.

[0089] <Methods for evaluating the performance of cured products> (1) Hardness Each curable composition was poured into a mold assembled with glass plates to a thickness of 6 mm, and post-cured at 150° C. for 4 hours to obtain a cured product. The hardness (Shore D) of each cured product was measured in accordance with ASTM D 2240.

[0090] (2)450nm light transmittance For each of the 1 mm-thick cured products prepared in the same manner as in the above hardness measurement, the light transmittance at 450 nm of each cured product at 25° C. was measured using a spectrophotometer. Air was used as the blank.

[0091] [Table 2]

[0092] The results shown in Table 1 indicate that the refractive index of the curable compositions of Examples 1 to 4, which are examples of the curable composition of the present invention, was improved by 0.02 points or more compared to the curable compositions of Comparative Examples 1 and 2, which did not contain the component (A). In addition, the results shown in Table 2 indicate that in Examples 1 to 4, the fluorene skeleton represented by the above formula (1) was incorporated into the cured product, thereby obtaining a cured product with a high hardness of Shore D70 or more.

[0093] Furthermore, as is clear from Table 2, the cured products of Examples 1 to 4 had a 450 nm light transmittance of 70% or more, and thus maintained high transparency. In particular, Examples 3 and 4 showed superior light transmittance.

[0094] The present invention includes the following aspects. [1] A curable composition comprising the following components (A), (B), (C) and (D): (A) A compound represented by the following formula (1): [ka] (In the formula, R 1 are each independently a hydrogen atom, a monovalent hydrocarbon group having 1 to 12 carbon atoms and no aliphatic unsaturated bonds, an alkenyl group having 2 to 12 carbon atoms, an acryloyl group, a methacryloyl group, or a glycidyl group, and R 1 At least one of the groups is an alkenyl group having 2 to 12 carbon atoms, an acryloyl group, or a methacryloyl group.) (B) Organopolysiloxane having two or more alkenyl groups in one molecule (C) Organosilicon compounds having three or more SiH groups in one molecule (D) Hydrosilylation reaction catalyst [2] The curable composition according to [1], wherein the component (B) is a compound represented by the following formula (2): [ka] (In the formula, R 2 and R 3 are each independently a methyl group or a phenyl group, a is an integer of 0 to 50, and b is an integer of 0 to 100. However, when a is 0, R 3 is a phenyl group, and b is 1 to 100. The siloxane units in parentheses may be arranged in any order. [3] The component (C) is An organohydrogenpolysiloxane represented by the following formula (3): An organohydrogenpolysiloxane represented by the following formula (4), and An organosilicon compound represented by the following formula (5): The curable composition according to [1] or [2], characterized in that the curable composition is one or more selected from the group consisting of: [ka] (R 4 are each independently a methyl group or a phenyl group, c is an integer of 1 to 3, and d is an integer of 1 to 3. The order of the siloxane units in parentheses is arbitrary. [(C 6 H 5 )SiO 3 / 2 ] e [H(C 6 H 5 )(CH 3 )SiO 1 / 2 ] e+2 (4) (In the formula, e is an integer of 1 to 3.) [ka] (In the formula, n is an integer of 1 to 3. The wavy line represents a bond.) [4] A cured product, which is a cured product of the curable composition according to any one of [1] to [3]. [5] The cured product according to [4], characterized in that the light transmittance at a wavelength of 450 nm and at 25°C at a thickness of 1 mm is 70% or more. [6] A semiconductor element; The cured product according to [4] or [5] above that coats the semiconductor element. A semiconductor device comprising:

[0095] The present invention is not limited to the above-described embodiment. The above-described embodiment is merely an example, and anything that has substantially the same configuration as the technical idea described in the claims of the present invention and exhibits similar effects is included in the technical scope of the present invention. [Explanation of symbols]

[0096] Reference Signs List 1: semiconductor device, 2: silver-plated substrate, 3: package, 4: semiconductor chip, 5: bonding wire, 6: cured product of curable composition

Claims

1. A curable composition comprising the following components (A), (B), (C) and (D): (A) A compound represented by the following formula (1): 【Chemistry 1】 (In the formula, R １ are each independently a hydrogen atom, a monovalent hydrocarbon group having 1 to 12 carbon atoms and no aliphatic unsaturated bonds, an alkenyl group having 2 to 12 carbon atoms, an acryloyl group, a methacryloyl group, or a glycidyl group; R １ At least one of the groups is an alkenyl group having 2 to 12 carbon atoms, an acryloyl group, or a methacryloyl group. (B) Organopolysiloxane having two or more alkenyl groups in each molecule (C) Organosilicon compounds having three or more SiH groups in one molecule (D) Hydrosilylation reaction catalyst

2. The curable composition according to claim 1, wherein the component (B) is a compound represented by the following formula (2): 【Chemistry 2】 (In the formula, R ２ and R ３ are each independently a methyl group or a phenyl group, a is an integer from 0 to 50, and b is an integer from 0 to 100. However, when a is 0, R ３ is a phenyl group, and b is 1 to 100. The order of the bracketed siloxane units is arbitrary.

3. The component (C) is An organohydrogenpolysiloxane represented by the following formula (3): An organohydrogenpolysiloxane represented by the following formula (4), and An organosilicon compound represented by the following formula (5): The curable composition according to claim 1, characterized in that the curable composition is one or more selected from the group consisting of: 【Chemistry 3】 (R ４ are each independently a methyl group or a phenyl group, c is an integer of 1 to 3, and d is an integer of 1 to 3. The order of the siloxane units in parentheses is arbitrary. [(C ６ H ５ )SiO ３／２ ] ｅ [H(C ６ H ５ )(CH ３ )SiO １／２ ] ｅ＋２ (4) (In the formula, e is an integer from 1 to 3.) 【Chemistry 4】 (In the formula, n is an integer from 1 to 3. The wavy line represents a bond.)

4. A cured product, which is a cured product of the curable composition according to any one of claims 1 to 3.

5. 5. The cured product according to claim 4, which has a light transmittance of 70% or more at a wavelength of 450 nm at 25° C. when the product is 1 mm thick.

6. A semiconductor element; The cured product according to claim 4 which covers the semiconductor element. A semiconductor device comprising:

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