Manufacturing method for conductive multilayer glass composite

Abstract

To provide a manufacturing method for a conductive multilayer glass composite for which a glass substrate is used as a member constituting an interposer and which can be laminated on a base substrate by efficiently proceeding with punching and layer thinning of the glass substrate.SOLUTION: A manufacturing method for a conductive multilayer glass composite includes: a first punching step of forming a punched portion with respect to a first glass substrate placed on a support glass plate part comprising a through hole in a thickness direction at a predetermined position in advance; a first thinning etching step of thinning the first glass substrate by applying etching processing to the first glass substrate in which the punched portion is formed; a first conducting step of forming a conductive portion in the punched portion of the first glass substrate; an additional placing step of newly placing a second glass substrate on the first glass substrate; a second punching step of forming a punched portion with respect to the second glass substrate; a second thinning etching step of thinning the second glass substrate by applying etching processing to the second glass substrate in which the punched portion is formed; and a second conducting step of forming a conductive portion in the punched portion of the second glass substrate.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a method for producing a conductive laminated glass composite, and more particularly to a method for producing a composite of a glass interposer formed by laminating glass and a glass plate serving as a base. [Background technology]

[0002] Semiconductor elements such as various memories, CPUs, and GPUs mounted on a circuit board have terminals for electrical connection. The pitch of the connection terminals and the pitch of the connection parts of the circuit board that are electrically connected to the semiconductor elements usually differ by several to several tens of times. Therefore, a relay board for connection called an interposer is used to electrically connect the semiconductor elements and the circuit board. The semiconductor elements are mounted on one side of the interposer, and the circuit board is connected to the other side.

[0003] Organic resin materials have been used as materials for interposers. However, in order to improve the processing power of semiconductor elements and respond to high integration, there is a demand for fine wiring formation in interposers. However, with interposers that use conventional organic resin materials, the resin absorbs moisture and expands and contracts greatly depending on the temperature, making it difficult to handle fine wiring.

[0004] Currently, to address the issues with organic resin materials, interposers using silicon and glass as base materials are being developed. These inorganic materials are less susceptible to moisture absorption, and their thermal expansion coefficients are similar to those of semiconductor elements, reducing the effects of expansion and contraction due to temperature.

[0005] However, interposers using silicon as a base material require surface protection, and the materials, processing costs, etc. are expensive. For this reason, glass interposers are currently in vogue (see Patent Documents 1 and 2, etc.).

[0006] Therefore, a glass substrate is used as a component of the interposer, and there has been a demand for thinner glass substrates and for stacking multiple substrates on a base substrate to produce a more compact conductive laminated glass composite. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2018-113392 A [Patent Document 2] JP 2018-170372 A Summary of the Invention [Problem to be solved by the invention]

[0008] As a result of extensive research into the processes of drilling and thinning glass substrates, the inventors have developed a method for efficiently carrying out the drilling and thinning processes and laminating a drilled and thinned glass substrate onto a base substrate.

[0009] The present invention has been made in consideration of the above-mentioned points, and provides a manufacturing method for a conductive laminated glass composite in which a glass substrate is used as a component constituting an interposer, and the glass substrate can be efficiently perforated and thinned so as to be laminated on a support glass plate (base substrate). [Means for solving the problem]

[0010] That is, the manufacturing method of the conductive laminated glass composite of the embodiment is characterized by comprising a first drilling step of forming a perforation portion in a first glass substrate placed on a support glass plate portion having a through hole in the thickness direction at a predetermined position, a first thinning etching step of etching the first glass substrate with the perforation portion formed therein to thin the first glass substrate, a first conductive step of forming a conductive portion in the perforation portion of the first glass substrate, an additional mounting step of placing a second glass substrate on the first glass substrate, a second drilling step of forming a perforation portion in the second glass substrate, a second thinning etching step of etching the second glass substrate with the perforation portion formed therein to thin the second glass substrate, and a second conductive step of forming a conductive portion in the perforation portion of the second glass substrate.

[0011] Furthermore, in the manufacturing method of the conductive laminated glass composite, another glass substrate may be placed on the second glass substrate having a conductive portion formed in the perforation, and the glass substrates may be laminated after forming a perforation in the new glass substrate, thinning the glass substrate by etching, and forming a conductive portion in the perforation, and the laminated glass substrates may be electrically connected through the conductive portion formed in the perforation.

[0012] Furthermore, in the manufacturing method of the conductive laminated glass composite, in the first drilling step in the first glass substrate, the formation of the drilled portion in the first glass substrate is an etching process, and the first drilling step, the first thin-wall etching step, and the first conductive step include a first concave portion forming step of forming a first concave portion by etching in a first surface portion of the first glass substrate that faces the support glass plate portion, a protective metal film applying step of applying a protective metal film to the first concave portion, and a protective metal film applying step of applying a protective metal film to the first concave portion. The method may include a first metal film portion applying step of coating the first glass substrate with a protective metal film and applying a first metal film portion, a first placing step of placing the first glass substrate on a support glass plate portion, a second recess portion forming step of forming a second recess portion by etching in a second surface portion opposite the first recess portion of the first surface portion of the first glass substrate and connecting the first recess portion and the second recess portion to form a perforation portion, and a second metal film portion applying step of applying the second metal film portion along the second recess portion to connect it to the first metal film portion.

[0013] Furthermore, in the method for producing the conductive laminated glass composite, in the second perforation step in the second glass substrate, the perforations in the second glass substrate may be formed by etching.

[0014] Furthermore, in the manufacturing method of the conductive laminated glass composite, in the first drilling step in the first glass substrate, the perforated portion of the first glass substrate is formed by irradiating a laser, and the first drilling step, the first thinning etching step, and the first conductive step may include a placing step of placing the first glass substrate on a support glass plate portion, a mask member placing step of placing a mask member on the first glass substrate, a laser irradiation step of irradiating the first glass substrate with a laser to form the perforated portion, a thinning step of removing the mask member and etching the first glass substrate with the perforated portion formed therein, and a conductive portion forming step of forming a conductive portion in the perforated portion of the first glass substrate.

[0015] Furthermore, in the method for manufacturing the conductive laminated glass composite, in the second drilling step in the second glass substrate, the drilled portion in the second glass substrate may be formed by irradiating with a laser.

[0016] Furthermore, in the method for producing the conductive laminated glass composite, the conductive portion may be a conductive resin member.

[0017] Furthermore, in the method for producing the conductive laminated glass composite, the conductive portion may be a plated metal foil.

[0018] Furthermore, in the manufacturing method of the conductive laminated glass composite, a conductive resin member may be interposed between the through hole of the support glass plate portion and the perforated portion of the first glass substrate, and between the perforated portion of the first glass substrate and the perforated portion of the second glass substrate. Effect of the Invention

[0019] According to the manufacturing method of the conductive laminated glass composite of the present invention, there are provided a first drilling step of forming a perforated portion in a first glass substrate placed on a support glass plate portion having a through hole in a thickness direction at a predetermined position, a first thinning etching step of etching the first glass substrate with the perforated portion formed therein to thin the first glass substrate, a first conductive step of forming a conductive portion in the perforated portion of the first glass substrate, an additional mounting step of placing a second glass substrate on the first glass substrate, a second drilling step of forming a perforated portion in the second glass substrate, a second thinning etching step of etching the second glass substrate with the perforated portion formed therein to thin the second glass substrate, and a second conductive step of forming a conductive portion in the perforated portion of the second glass substrate. Therefore, a glass substrate is used as a member constituting an interposer, and the perforated and thinned glass substrate can be laminated on the support glass plate portion by efficiently proceeding with drilling and thinning. [Brief description of the drawings]

[0020] [Figure 1] 1A is a first schematic cross-sectional view, FIG. 1B is a second schematic cross-sectional view, and FIG. 1C is a third schematic cross-sectional view showing a processing step of a glass substrate for perforating holes by etching. [Diagram 2] 1A is a fourth schematic cross-sectional view, FIG. 1B is a fifth schematic cross-sectional view, and FIG. 1C is a sixth schematic cross-sectional view showing a processing step of a glass substrate for perforating holes by etching. [Diagram 3] 1A is a seventh schematic cross-sectional view, and FIG. 1B is an eighth schematic cross-sectional view showing a processing step of a glass substrate for perforating holes by etching. [Figure 4] 1A is a ninth schematic cross-sectional view, and FIG. 1B is a tenth schematic cross-sectional view showing a processing step of a glass substrate for perforating holes by etching. [Diagram 5] FIG. 2 is a cross-sectional schematic diagram of a conductive laminated glass composite according to the first embodiment. [Figure 6] 1A and 1B are a first schematic cross-sectional view and a second schematic cross-sectional view, respectively, showing a process of processing a glass substrate for drilling holes using a laser. [Figure 7] 1A and 1B are a third schematic cross-sectional view and a fourth schematic cross-sectional view, respectively, showing a process of processing a glass substrate for drilling holes using a laser. [Figure 8]1A and 1B are schematic cross-sectional views showing a process of processing a glass substrate for drilling holes using a laser, respectively. FIG. [Figure 9] FIG. 2 is a cross-sectional schematic view of a conductive laminated glass composite according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] The conductive laminated glass composite manufactured by the manufacturing method of the embodiment is a composite in which a glass substrate having a perforation portion (through hole) penetrating the front and back surfaces of the glass substrate and a conductive metal material disposed in the perforation portion is connected to a support glass plate portion (base substrate), and is an integrated object mainly including an interposer and a support glass plate portion (base substrate) for supporting the interposer. The glass interposer referred to here is a member that serves as a relay substrate for electrically wiring and connecting various semiconductor elements such as memories, CPUs, and GPUs mounted on a circuit board to the circuit board. In particular, since the glass interposer itself is formed only of glass and a conductive material for wiring, it does not include materials with different thermal expansion coefficients such as resins, and deformation due to heat exposure during use is reduced.

[0022] In the manufacturing method of the embodiment, holes are drilled in the glass substrate by two methods: etching with a chemical such as hydrofluoric acid, and laser irradiation. Figures 1 to 5 show an example of drilling by etching (conductive laminated glass composite 1A of the first embodiment), and Figures 6 to 9 show an example of drilling by laser (conductive laminated glass composite 1B of the second embodiment). The manufacturing methods common to both are summarized as follows.

[0023] A support glass plate having a through hole in a thickness direction at a predetermined position is prepared in advance. Then, a perforation portion is formed in a first glass substrate placed on the support glass plate (base substrate) ("first perforation process"). The first perforation process is broadly divided into etching and laser irradiation as described below. The first glass substrate having the perforation portion formed therein is thinned by etching ("first thinning etching process"). The first thinning etching process advances the thinning of the first glass substrate. A conductive portion is formed in the perforation portion of the first glass substrate ("first conductive process"). A conductive material described below is used for the conductive portion, and conductivity within the perforation portion is ensured. Through a series of processes, perforation and conductive process are performed in the first glass substrate directly above the support glass plate (base substrate).

[0024] Next, a second glass substrate is placed on the first glass substrate ("additional placement process"). That is, a second glass substrate is placed on the first glass substrate that has been processed into a predetermined shape through the above-mentioned process, and the same process as for the first glass substrate is performed on this second glass substrate. That is, a perforation is formed in the second glass substrate ("second perforation process"). The second glass substrate with the perforation formed therein is thinned by etching ("second thinning etching process"). A conductive portion is formed in the perforation of the second glass substrate ("second conductive process").

[0025] Furthermore, the conductive laminated glass composite has 5 to 10 glass substrates laminated on a support glass plate (base substrate). In this case, a third glass substrate is placed on the second glass substrate, and similarly to the first and second glass substrates, the third glass substrate is subjected to perforation, etching to thin the substrate, and conductive portions in the perforation. Then, the fourth and fifth glass substrates are laminated in order, and similar processing is performed.

[0026] In the conductive laminated glass composite manufactured by the manufacturing method of the first embodiment, in the first drilling step in the first glass substrate, the formation of the drilled portion in the first glass substrate is an etching process. The first drilling step, the first thin-wall etching step, and the first conductive step correspond to the following processes. A first concave portion is formed by an etching process on a first surface portion of the first glass substrate that faces the support glass plate portion ("first concave portion forming step"). A protective metal film is applied to the first concave portion ("protective metal film application step"). A first metal film portion is applied by covering the protective metal film along the first concave portion ("first metal film portion application step"). The first glass substrate is placed on the support glass plate portion ("first placement step").

[0027] A second recess is formed by etching on a second surface of the first glass substrate opposite the first recess, and the first and second recesses are connected to form a perforation ("second recess forming step"). A second metal film is deposited along the second recess and connected to the first metal film ("second metal film depositing step").

[0028] As shown in FIG. 1(A), a glass substrate 10 to be processed is prepared. For example, non-alkali glass, borosilicate glass, etc. are used for the glass substrate 10 (first glass substrate) in order to ensure the reliability of the substrate having a semiconductor. In consideration of the influence of corrosion due to the subsequent etching process, the final thickness of the glass substrate 10 is 10 to 50 μm, preferably 10 to 30 μm, and more preferably 10 to 20 μm. At the start of processing in FIG. 1(A), the initial thickness of the glass substrate 10 is set to about 50 μm in consideration of the influence of etching. For convenience in the drawing, the lower side of the glass substrate 10 is designated as a first surface portion 11, and the opposite side is designated as a second surface portion 12.

[0029] As shown in FIG. 1(B), a surface protective film 21 is provided on the first surface 11 of the glass substrate 10 to etch the area where the first recess 13 is to be formed (to form the first recess 13). Chromium is used for the surface protective film 21 because of its resistance to etching of the glass substrate 10 with hydrofluoric acid, and the area where the first recess 13 is to be formed is opened as an opening 24 in the surface protective film 21. A known pattern formation method is used to form the opening 24 on the first surface 11. For example, processes such as resist coating, heating (pre-baking), exposure, development, and heating (post-baking) are performed. The same applies to the formation of the opening 24 on the second surface 12.

[0030] As shown in FIG. 1(C), the first surface 11 of the glass substrate 10 is exposed at the opening 24 of the surface protective film 21, so that the hydrofluoric acid entering through the opening 24 starts to form a recess on the first surface 11 of the glass substrate 10, and the recess gradually becomes larger. In this way, the first recess 13 having a sufficient area according to the thickness of the glass substrate 10 is formed on the first surface 11 of the glass substrate 10 ("first recess forming step"). The surface protective film 21 may be formed on the second surface 12 of the glass substrate 10, or the second surface 12 may be exposed without forming the surface protective film 21. In the embodiment, hydrofluoric acid is used to etch the glass substrate 10. Instead of hydrofluoric acid, a strong base solution such as caustic soda may be used for etching. In this case, the material of the surface protective film 21 and the protective metal film 23 can be appropriately changed to a base-resistant material.

[0031] 1, a first recess 13 of a predetermined size is formed in a first surface 11, which is one surface of a glass substrate 10. Then, as shown in FIG. 2(A), the surface protective film 21 formed on the first surface 11 is removed.

[0032] 2(B), first, a protective metal film 23 is formed on the inner circumferential surface 16 of the first recessed hole 13 and in the vicinity of the opening of the first recessed hole 13 ("protective metal film coating step"). A first metal film portion 26 is coated on the entire first recessed hole 13 and on the first surface portion 11 around the first recessed hole 13 so as to cover the protective metal film 23 ("first metal film portion coating step"). The first metal film portion 26 and a second metal film portion 27 described later are composed of plated metal foil such as copper, silver, gold, platinum, nickel, lead, etc.

[0033] The purpose of protective metal film 23 is to reduce the corrosive effect of etching on first metal film portion 26 around first recessed hole 13 when forming second recessed hole 14 described below. First recessed hole 13 is formed to a specified size through the process of Fig. 1. Therefore, the shape of completed first recessed hole 13 is maintained, and further, when second recessed hole 14 is formed, application of protective metal film 23 prevents etching from progressing excessively from the second recessed hole 14 side toward the first recessed hole 13 side, thereby preventing the shape of the recess from becoming too large.

[0034] A known pattern formation method is used to form the protective metal film 23 and the first metal film portion 26 on the first surface portion 11 of the glass substrate 10. For example, processes such as resist coating, heating (pre-bake), exposure, development, and heating (post-bake) are performed. Thus, as shown in FIG. 2(B), a pattern (a groove-shaped notch in the figure) is formed in the protective metal film 23 and the first metal film portion 26.

[0035] In FIG. 2(C), the glass substrate 10 of FIG. 2(B) is placed on a supporting substrate ("first placing step"). In the illustrated embodiment, a support glass plate 50 (base substrate) described later is used as the supporting substrate. The conductive laminated glass composite 1A of the first embodiment is formed by combining the laminated glass substrate 10 and the support glass plate 50. In the support glass plate 50 (base substrate), reference numeral 51 denotes a hole in the support glass plate 50 (base substrate), and reference numeral 52 denotes a base electrode. Then, a conductive material 31 and a reinforcing agent 33 are filled to block the first concave portion 13, and a metal member 32 is interposed between the support glass plate 50 and the glass substrate 10. The support glass plate 50 and the conductive material 31 will be described later in FIG. 5.

[0036] The glass substrate 10 is thinned by etching, which will be described later, to a thickness of about 10 μm. In this case, since it is difficult to transport and process the thinned glass substrate 10 alone, the glass substrate 10 is placed on a supporting substrate in the initial stage of processing in order to improve the ease of handling of the glass substrate 10, its resistance to bending deformation, and its ease of transportation.

[0037] In Fig. 3(A), the glass substrate 10 is thinned by etching (also called slimming, which is a process for reducing the thickness of the glass substrate through an etching process) on the second surface 12 side of the glass substrate 10 in Fig. 2(B) described above, and processed to the final thickness of the glass substrate 10. The final thickness of the glass substrate 10 is preferably 10 to 20 µm. When thinning (slimming) by etching, in order to avoid the influence of etching on the support glass plate portion 50 (base substrate), a corrosion protection film is attached to the support glass plate portion 50 or a resin coating material is applied thereto.

[0038] After the thinning (slimming) by etching, as shown in FIG. 3(B), a surface protective film 21 is provided on the second surface 12 of the glass substrate 10 in order to etch the area where the second recessed hole 14 is to be formed (to form the second recessed hole 14). The area where the second recessed hole 14 is to be formed is opened as an opening 24 in the surface protective film 21. Since the second surface 12 of the glass substrate 10 is exposed at the opening 24 in the surface protective film 21, a recess begins to be formed on the second surface 12 of the glass substrate 10 by the hydrofluoric acid penetrating from the opening 24, and the recess gradually becomes larger. In this way, the second recessed hole 14 of a sufficient size according to the thickness of the glass substrate 10 is also formed on the second surface 12 of the glass substrate 10 ("second recessed hole forming process").

[0039] Then, second recessed hole 14 finally reaches first recessed hole 13, and perforated hole 15 is formed connecting first surface 11 to second surface 12 of glass substrate 10. Protective metal film 23 adheres to first recessed hole 13, and therefore acts as an obstacle to etching penetrating from second surface 12, making it extremely difficult for etching to proceed toward first recessed hole 13. Therefore, the shape of first recessed hole 13 is maintained, and etching of second surface 12 is completed.

[0040] In FIG. 4(A), the surface protective film 21 provided for protection from etching is removed. As for the protective metal film 23, the bottom portion of the second recessed hole portion 14 is removed, and the first metal film portion 26 on the first recessed hole portion 13 side is exposed in the perforated portion 15. Then, the second metal film portion 27 is deposited along the recessed shape of the second recessed hole portion 14 ("second metal film portion deposition process"). A known pattern formation method is also used when forming the second metal film portion 27. For example, processes such as resist coating, heating (pre-baking), exposure, development, and heating (post-baking) are performed. As shown in the figure, a pattern (a groove-shaped cut in the figure) is formed in the second metal film portion 27.

[0041] Through the processing steps up to this point, the first drilling step, the first thin-wall etching step, and the first conductive step are completed for the glass substrate 10 (first glass substrate) that is first placed on the support glass plate part 50 (base substrate). The protective metal film 23 formed on the first surface part 11 excluding the first recessed hole part 13 of the glass substrate 10 is in close contact with the support glass plate part 50 (base substrate) that serves as the supporting substrate directly below. For this reason, it is difficult for a chemical solution to penetrate into the gaps between the contact parts, and it is difficult to remove the protective metal film 23, so the protective metal film 23 remains.

[0042] As shown in Fig. 4(B), another glass substrate 10 (second glass substrate) is placed on top of the completed glass substrate 10 (first glass substrate). The other glass substrate 10 (second glass substrate) is placed on the first glass substrate instead of the support glass plate after going through the first concave hole forming step, the protective metal film applying step, and the first metal film applying step described in detail in Figs. 1 and 2 above. Then, the second concave hole forming step and the second metal film applying step described in detail in Figs. 3 and 4(A) above are performed on the other glass substrate 10 (second glass substrate) on top of the previously completed glass substrate 10 (first glass substrate) in Fig. 4(B).

[0043] 1 to 4, perforated portions 15 are formed in the thickness direction of each glass substrate 10, and the first metal film portion 26 and the second metal film portion 27 are joined at the perforated portions 15 of the glass substrate 10. For convenience, the drawings show only one perforated portion 15. In an actual glass substrate 10, perforated portions 15 are formed in multiple locations.

[0044] In the embodiment, a metal foil such as copper, silver, gold, platinum, nickel, or lead is provided around the hole 51 of the support glass plate 50 to become the base electrode 52. A conductive material 31 is interposed to make the first metal film 26 and the base electrode 52 conductive. A suitable conductive material is filled in the hole 51 of the support glass plate 50. As a result, conductivity is ensured from the hole 51 to the base electrode 52 and the conductive material 31, and the conductive material 31 of the glass substrate 10 (first glass substrate) and the base electrode 52 can be electrically connected. A circuit board (not shown) is provided below the support glass plate 50.

[0045] The conductive material 31 is preferably a conductive resin paste (conductive resin member) containing fine particles of metal such as copper, silver, gold, platinum, nickel, and lead. The conductive resin paste uses epoxy resin, acrylic resin, urethane resin, and the like, and fine metal particles are dispersed in the resin at a ratio of 60 to 90% by weight. The conductive resin paste contains a conductive resin ink. Therefore, when the glass substrate 10 (first glass substrate) is placed on the support glass plate portion 50 (base substrate), the conductive material 31 is injected onto the base electrode 52, and the first recessed portion 13 is filled with the conductive material 31.

[0046] In principle, it is possible to directly bond them without using the conductive material 31. However, if they were to come into direct contact with each other, the first metal film portion 26 and the base electrode 52 would be affected by deformation and bending due to thermal expansion of the glass substrate 10 and the support glass plate portion 50. This could result in a gap being generated depending on the amount of deformation of the glass substrates, resulting in a loss of conductivity, or excessive pressure being applied to each other, resulting in cracks. The conductive material 31 acts as a buffer material to accommodate deformation of the glass substrate 10.

[0047] The conductive material 31 has a relatively good conductivity. However, the conductive material 31 may have an uneven conductivity due to the influence of the uneven distribution of metal particles contained in the resin component due to the specific gravity, etc. Therefore, in order to ensure stable conductivity, the conductive material 31 includes a metal member 32. The metal member 32 disclosed in FIG. 2 and subsequent figures is a metal ball that is interposed in the conductive material 31 between the first metal film portion 26 and the base electrode 52 and contacts both metal films. As shown in FIG. 5, the metal member 32 is interposed in the conductive material 31 between the first metal film portion 26 and the second metal film portion 27. Therefore, the first metal film portion 26 and the base electrode 52 can be directly electrically connected through the metal member 32 (the metal ball shown in the figure). The metal member 32 may be a ring-shaped metal thin film (not shown) that imitates a washer or the like, instead of the metal ball shown in the figure. In addition, in order to make the conductive material 31 and the metal member 32 have the same conductivity, the metal member 32 made of the same material as the fine metal particles contained in the conductive material 31 is used.

[0048] In the embodiment, metal foil (copper foil) is used for the first metal film portion 26 and the base electrode 52. The first metal film portion 26 is easily pushed toward the back of the recessed portion by the pressure of the filled conductive material 31. However, due to the influence of the fluidity of the filled conductive material 31, there is a risk of misalignment and deformation. Therefore, a reinforcing agent 33 is used to maintain the shape of the first recessed portion 13. Prior to injecting the conductive material 31 into the first recessed portion 13, the reinforcing agent 33 is injected into the recessed portion of the first metal film portion 26. The injected reinforcing agent 33 hardens in each recessed portion. Then, the hardened reinforcing agent 33 maintains the shape of the first metal film portion 26. Thereafter, the conductive material 31 is injected into the periphery between the second metal film portion 27 of one glass substrate 10 and the first metal film portion 26 of the other glass substrate 10 while leaving the reinforcing agent 33, and is filled so as to fill the first recessed portion 13 and the second recessed portion 14. The reinforcing agent 33 is a thermosetting resin such as an acrylic resin, a urethane resin, etc. The reinforcing agent 33 may have a composition having electrical conductivity similar to the above-mentioned conductive material 31.

[0049] First, the first glass substrate 10 (first glass substrate) to be placed on the support glass plate 50 (base substrate) is completed through the steps detailed in FIG. 1 to FIG. 4. Then, the second glass substrate 10 (second glass substrate) is subjected to the first concave portion forming step, the first metal film portion applying step, the protective metal film applying step, the first placing step, the second concave portion forming step, and the second metal film portion applying step, as in the above description of the first glass substrate, and is then subjected to the formation of perforations and thinning by etching. Thus, in the second glass substrate 10 (second glass substrate), as in the first glass substrate 10, perforations are formed and the perforations are made conductive. The same processing and processing are repeated for the third and subsequent glass substrates 10 in the stack. Five to ten glass substrates 10 are stacked to form an interposer 1i. In this way, as shown in the schematic cross-sectional view of FIG. 5, a first form of conductive laminated glass composite 1A is produced. In the interposer 1i, the perforated portions of the glass substrate 10 are arranged to face each other.

[0050] To summarize the structure of the conductive laminated glass composite 1A, each glass substrate 10 is provided with a perforation 15 in the thickness direction and is electrically connected. A first concave portion 13 is formed in the first surface portion 11 of the glass substrate 10. A second concave portion that communicates with the first concave portion 13 and forms the perforation 15 is formed in the second surface portion 12, which is the opposite surface of the first surface portion 11 of the glass substrate 10. In the first and second glass substrates 10 after lamination, a first metal film portion 26 that is applied along the first concave portion 13 and a second metal film portion 27 that is applied along the second concave portion 14 and is in contact with the first metal film portion 26 and electrically connected thereto are provided. The second metal film portion 27 of the first glass substrate 10 and the first metal film portion 26 of the second glass substrate 10 are electrically connected via a conductive material 31 and a metal member 32 (conductivity is ensured). The second and third glass substrates in FIG. 4 are similarly stacked and electrically connected to each other, and the subsequent glass substrates are similarly stacked and electrically connected to each other.

[0051] As can be understood from the series of explanations, as the glass substrate 10 is etched, the glass substrate 10 itself becomes thinner (slimming: reduction in plate thickness through etching), and the glass substrate 10 becomes thinner from its initial thickness to a final thickness of about 10 to 20 μm. When the glass substrate 10 has a thickness in this range, it is extremely thin and it is almost difficult to move the glass substrate 10 during processing. For this reason, in consideration of convenience in moving and handling, a support glass plate portion 50 (base substrate) is attached to the first surface portion 11 of the glass substrate 10 from an early stage. As a result, resistance to bending deformation of the glass substrate 10 and ease of transportation are ensured.

[0052] 5, the multiple laminated glass substrates 10 are a so-called glass interposer 1i. A circuit board (not shown) is provided below the support glass plate portion 50 (base substrate), and semiconductor elements such as a CPU, GPU, etc. are mounted above the multiple laminated glass substrates 10.

[0053] In the conductive laminated glass composite manufactured by the manufacturing method of the second embodiment, in the first drilling step in the first glass substrate, the perforated portion of the first glass substrate is formed by irradiating a laser. In the processes of the first drilling step, the first thin-etching step, and the first conductive step, the first glass substrate is placed on a support glass plate portion ("placing step"). A mask member is provided on the first glass substrate ("mask member installation step"). The first glass substrate is irradiated with a laser to form a perforated portion ("laser irradiation step"). The mask member is removed, and the first glass substrate with the perforated portion formed is etched ("thinning step"). A conductive portion is formed in the perforated portion of the first glass substrate ("conductive portion formation step").

[0054] 6(A), a bottom glass substrate 10 (first glass substrate) to be first placed on a support glass plate part 50 (base substrate) is prepared, and the glass substrate 10 (first glass substrate) is placed on the support glass plate part 50 ("placement step"). The support glass plate part 50 is provided with a base electrode 52, and a conductive material 31 is interposed around a hole part 51.

[0055] For the glass substrate 10 (first glass substrate), non-alkali glass, borosilicate glass, etc. are used from the viewpoints of modification of laser irradiation, influence of etching corrosion, and high reliability of the substrate having a semiconductor. In consideration of the influence of corrosion due to the subsequent etching process, the final thickness of the glass substrate 10 is 10 to 100 μm, preferably 10 to 50 μm, and more preferably 10 to 30 μm. At the start of processing in FIG. 5(A), the thickness is set to about 50 μm in consideration of the influence of etching. For convenience in the drawing, the lower side of the glass substrate 10 is referred to as the first surface portion 11, and the opposite side is referred to as the second surface portion 12.

[0056] As shown in Fig. 6(B), a mask member 41 is provided on the second surface 12 of the glass substrate 10 (first glass substrate) ("mask member installation process"). The mask member 41 is not particularly limited as long as it can block the transmission of the laser, and may be any appropriate material such as metal foil or a resin material containing a light-shielding component. The mask member is open at an opening 42 only in the region where the perforation is to be formed.

[0057] As shown in FIG. 7(A), a laser is irradiated onto a glass substrate 10 (first glass substrate) to form a perforated portion 15 ("laser irradiation step"). The type of laser used for irradiation is not particularly limited as long as it is a type suitable for glass processing, and an ultrashort pulse laser (picosecond laser, femtosecond laser) or the like is used. In order to concentrate energy on the irradiated portion and modify the glass substrate, a laser with non-diffraction characteristics, such as a Bessel beam formed by an axicon lens, is used as the laser light characteristic. In the perforation by laser, the modification of the irradiated portion of the glass progresses. Therefore, removal of the modified portion from the surrounding area, etching for perforation, and etching for thinning, which will be described below, are performed.

[0058] As shown in FIG. 7(B), after the predetermined perforated portions 15 are formed by the laser irradiation, the mask member 41 is removed to expose the second surface 12 of the glass substrate 10. The glass substrate 10 (first glass substrate) is then etched with an etching solution such as hydrofluoric acid or caustic soda ("thinning process"). The etching thins the glass substrate 10 (first glass substrate) itself, and also corrodes the inner wall surface of the perforated portions 15 formed by the laser irradiation, enlarging the opening diameter. Therefore, the thickness of the glass substrate 10 and the size (opening diameter) of the perforated portions 15 are controlled by the etching conditions (time, number of times).

[0059] After the perforated portion 15 is thus formed in the glass substrate 10 (first glass substrate), a conductive material 31 is injected into the perforated portion 15 to form a conductive portion, as shown in Fig. 8(A) ("conductive portion forming step"). Prior to the injection of the conductive material 31, the inner wall surface of the perforated portion 15 may be plated (not shown) to adhere a metal foil thereto.

[0060] 8(B), another glass substrate 10 (second glass substrate) is placed on top of the glass substrate 10 (first glass substrate). In the drawing, an intermediate metal film portion 43 is interposed when placing the other glass substrate 10 (second glass substrate). First, the first glass substrate 10 (first glass substrate) to be placed on the support glass plate portion 50 (base substrate) is completed through the steps detailed in FIG. 6 to FIG. 8.

[0061] The intermediate metal film portion 43 is composed of a metal foil plated with copper, silver, gold, platinum, nickel, lead, or the like. A known pattern formation method is used to form the intermediate metal film portion 43. For example, processes such as resist coating, heating (pre-baking), exposure, development, and heating (post-baking) are performed. As shown in the figure, a pattern (groove-shaped notches in the figure) is formed in the intermediate metal film portion 43.

[0062] Next, the second glass substrate 10 (second glass substrate) of the stack is subjected to the same steps as the first glass substrate described above, including the placement step, mask member installation step, laser irradiation step, thinning step, and conductive portion formation step, followed by the formation of perforations by laser irradiation and thinning by etching. Then, in the second perforation step of the second glass substrate 10 (second glass substrate), similar to the first glass substrate 10, the formation of perforations in the second glass substrate is performed by laser irradiation, and the formation of perforations and the perforations are made conductive. The same processing and machining are repeated for the third and subsequent glass substrates 10 of the stack. Five to ten glass substrates 10 are stacked to form an interposer 1ii. Thus, as shown in the schematic cross-sectional view of FIG. 9, a second form of conductive laminated glass composite 1B is produced. In the interposer 1ii, the perforations of the glass substrates 10 are also arranged to face each other.

[0063] To summarize the structure of the conductive laminated glass composite 1B, each glass substrate 10 is provided with perforations 15 in the thickness direction, and the upper and lower glass substrates 10 are electrically connected to each other by conductive material 31 or metal foil. The second and third glass substrates 10 in Fig. 9 and the subsequent substrates are connected in a similar manner.

[0064] As can be understood from the series of explanations, the etching process is performed on the glass substrate 10, so that the glass substrate 10 itself becomes thinner (slimming: reduction in plate thickness through etching), and the glass substrate 10 becomes thinner from its initial thickness to a final thickness of about 10 to 100 μm. When the glass substrate 10 has a thickness in this range, it is extremely thin, so that it is almost difficult to move the glass substrate 10 during processing. Therefore, even in the manufacturing method for forming a perforated portion by laser irradiation, the support glass plate portion 50 (base substrate) is attached to the first surface portion 11 of the glass substrate 10 from the initial stage, taking into consideration the convenience of movement and handling. As a result, the resistance of the glass substrate 10 to bending deformation and the ease of transportation are guaranteed.

[0065] Regarding the conductive laminated glass composite 1A of the first embodiment in which holes are drilled by etching and the conductive laminated glass composite 1B of the second embodiment in which holes are drilled by laser, the use of either one depends on the manufacturing equipment and is largely influenced by the thickness of the glass substrate itself. In general, when the perforation is formed by etching with hydrofluoric acid or the like, the thinner the glass substrate, the more efficiently the holes can be drilled. However, the thinner the glass substrate, the more difficult it is to handle. In contrast, when the perforation is formed by laser irradiation, the glass substrate can be made relatively thick. This improves the convenience of handling in the intermediate process. However, the manufacturing time increases because the number of laser irradiations increases. [Explanation of symbols]

[0066] 1A,1B Conductive laminated glass composite 1i,1ii Interposer 10 First glass substrate, second glass substrate 11 First side 12 Second side part 13 First concave hole part 14 Second recessed hole part 15 Perforation 16 Inner surface 21 Surface protective film 23 Protective metal film 24 Opening 26 First metal film part 27 Second metal film part 31 Conductive resin agent 32 Metallic parts 33 Reinforcement 41 Mask material 43 Intermediate metal film section 50 Support glass plate portion (base substrate) 51 Hole 52 Base electrode

Claims

1. a first drilling step of forming a drilled portion in a first glass substrate placed on a support glass plate portion having a through hole in a thickness direction at a predetermined position; a first thinning etching process for thinning the first glass substrate by etching the first glass substrate having the perforated portion formed therein; a first conductive process for forming a conductive portion in the perforated portion of the first glass substrate; an additional mounting step of newly mounting a second glass substrate on the first glass substrate; a second drilling step of forming a drilled portion in the second glass substrate; a second thinning etching process for thinning the second glass substrate by etching the second glass substrate having the perforated portion formed therein; and a second conductive process for forming a conductive portion in the perforated portion of the second glass substrate. A method for producing a conductive laminated glass composite comprising the steps of:

2. 2. The method for producing a conductive laminated glass composite according to claim 1, wherein another glass substrate is placed on the second glass substrate having a conductive portion formed in the perforation, and the glass substrates are laminated after forming a perforation in the new glass substrate, thinning the glass substrate by etching, and forming a conductive portion in the perforation, and the laminated glass substrates are electrically connected through the conductive portion formed in the perforation.

3. In the first perforation step in the first glass substrate, the formation of the perforated portion in the first glass substrate is an etching process; The first drilling step, the first thin-wall etching step, and the first conductive step include the following processes: a first recess portion forming step of forming a first recess portion by etching a first surface portion of the first glass substrate which faces the support glass plate portion; a protective metal film coating step of coating the first recessed hole portion with a protective metal film; a first metal film portion depositing step of depositing a first metal film portion by covering the protective metal film along the first recess portion; a first placing step of placing the first glass substrate on the support glass plate portion; a second recessed hole forming step of forming a second recessed hole by etching a second surface portion of the first surface portion of the first glass substrate opposite the first recessed hole portion, and connecting the first recessed hole portion and the second recessed hole portion to form a perforated hole portion; The method for manufacturing the conductive laminated glass composite according to claim 1 , further comprising: a second metal film portion applying step of applying a second metal film portion along the second recess portion and connecting the second metal film portion to the first metal film portion.

4. The method for manufacturing a conductive laminated glass composite according to claim 3 , wherein in the second drilling step, the formation of the drilled portion in the second glass substrate is performed by etching.

5. In the first perforation step in the first glass substrate, the perforation portion of the first glass substrate is formed by irradiating a laser, The first drilling step, the first thin-wall etching step, and the first conductive step include the following processes: a placing step of placing the first glass substrate on the support glass plate portion; a mask member setting step of setting a mask member on the first glass substrate; a laser irradiation step of irradiating the first glass substrate with a laser to form a perforated portion; a thinning step of etching the first glass substrate after removing the mask member and forming the perforated portion; The method for manufacturing the conductive laminated glass composite according to claim 1 , further comprising: a conductive portion forming step of forming a conductive portion in the perforated portion of the first glass substrate.

6. The method for manufacturing a conductive laminated glass composite according to claim 5 , wherein in the second drilling step, the perforations in the second glass substrate are formed by irradiating the second glass substrate with a laser.

7. The method for producing a conductive laminated glass composite according to claim 1 , wherein the conductive portion is a conductive resin member.

8. The method for producing a conductive laminated glass composite according to claim 1 , wherein the conductive portion is a plated metal foil.

9. 2. The method for manufacturing a conductive laminated glass composite according to claim 1, wherein a conductive resin member is interposed between the through hole of the support glass plate portion and the perforated portion of the first glass substrate, and between the perforated portion of the first glass substrate and the perforated portion of the second glass substrate.

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