Electronic component package

Abstract

To provide an electronic component package that enables a user to check the printing of manufacturing information, etc. without removing the package from a mounting board.SOLUTION: An electronic component package (100) has a substrate (10), electronic components (20), and a sealing member (30). The electronic components are mounted on the substrate. The sealing member is positioned on the substrate to cover the electronic components. The surface of the sealing member is printed with a material that reacts to light of wavelengths in a first range.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to electronic component packages. [Background technology]

[0002] For example, JP 2023-076696 A (Patent Document 1) describes an LED (Light Emitting Diode) package. The LED package described in Patent Document 1 includes a substrate, an LED chip, and a sealing resin.

[0003] The substrate has a base material, a first conductor pattern, a second conductor pattern, a third conductor pattern, and a fourth conductor pattern. The base material has a first main surface and a second main surface. The first main surface and the second main surface are end surfaces in the thickness direction of the base material. The first conductor pattern and the second conductor pattern are arranged on the first main surface. The first conductor pattern and the second conductor pattern are electrically separated from each other. The third conductor pattern and the fourth conductor pattern are arranged on the second main surface. The third conductor pattern and the fourth conductor pattern are electrically separated from each other. The third conductor pattern and the fourth conductor pattern are electrically connected to the first conductor pattern and the second conductor pattern, respectively.

[0004] The LED chip is mounted on the substrate. More specifically, the LED chip is mounted on the first conductor pattern. The LED chip is electrically connected to the first conductor pattern and the second conductor pattern. The sealing resin is disposed on the substrate so as to cover the LED chip. The transparent resin is a transparent resin that transmits light generated by the LED chip. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2023-076696 A [Summary] In the LED package described in Patent Document 1, characters or the like indicating information about manufacturing are usually printed, for example, by scanning with a laser. If characters or the like are printed on the top surface of the sealing resin, they will prevent the transmission of light generated by the LED chip, so the characters or the like are printed on the second main surface. However, if characters or the like are printed on the second main surface, after the LED package described in Patent Document 1 is mounted on a mounting board, the characters or the like cannot be confirmed unless it is removed from the mounting board.

[0006] In the case of an electronic component package that does not emit light, there is no problem even if characters or the like indicating manufacturing information are printed on the top surface of the sealing member. However, in this case, a third party can easily read the manufacturing information of the electronic component package from the characters or the like.

[0007] The electronic component package of the present disclosure includes a substrate, an electronic component, and a sealing member. The electronic component is mounted on the substrate. The sealing member is disposed on the substrate so as to cover the electronic component. A surface of the sealing member is printed with a material that reacts to light having a wavelength in a first range. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view of an electronic component package 100. [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Diagram 3] FIG. 2 is a cross-sectional view showing the electronic component package 100 in a mounted state.

[0009] [Detailed Description] The details of the embodiment of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are given the same reference characters, and redundant description will not be repeated. An electronic component package according to the embodiment is referred to as an electronic component package 100.

[0010] (Configuration of electronic component package 100) The configuration of the electronic component package 100 will be described below.

[0011] Fig. 1 is a plan view of an electronic component package 100. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. As shown in Fig. 1 and Fig. 2, the electronic component package 100 includes a substrate 10, an electronic component 20, and a sealing member 30.

[0012] The substrate 10 has a base material 11, and a conductor pattern 12, a conductor pattern 13, a conductor pattern 14, a conductor pattern 15, a conductor pattern 16, and a conductor pattern 17.

[0013] The constituent material of the substrate 11 is an insulating material. A specific example of the constituent material of the substrate 11 is glass epoxy. The substrate 11 has a main surface 11a, a main surface 11b, a side surface 11c, and a side surface 11d. A case where the electronic component package 100 is viewed along the normal direction of the main surface 11a is referred to as a planar view. The substrate 11 is, for example, rectangular in plan view. The longitudinal direction of the substrate 11 in plan view is along a first direction DR1. The second direction DR2 is a direction perpendicular to the first direction DR1 in plan view. The direction perpendicular to the first direction DR1 and the second direction DR2 is referred to as a thickness direction.

[0014] The main surface 11a and the main surface 11b are both end surfaces in the thickness direction of the base material 11. The main surface 11b is the surface opposite to the main surface 11a. The side surface 11c and the side surface 11d are both end surfaces in the first direction DR1 of the base material 11. The side surface 11c is continuous with the main surface 11a at its upper end and with the main surface 11b at its lower end. The side surface 11d is continuous with the main surface 11a at its upper end and with the main surface 11b at its lower end.

[0015] The conductor pattern 12 and the conductor pattern 13 are disposed on the main surface 11a. The conductor pattern 12 has a die pad 12a. The die pad 12a is, for example, in the center of the main surface 11a in the first direction DR1. The die pad 12a is at one end of the conductor pattern 12 in the first direction DR1 (the right end in Figs. 1 and 2). The conductor pattern 12 extends such that the other end of the conductor pattern 12 in the first direction DR1 reaches the side surface 11c. The other end of the conductor pattern 13 in the first direction DR1 (the left end in Figs. 1 and 2) is spaced apart from one end of the conductor pattern 12 in the first direction DR1 (the die pad 12a). The conductor pattern 13 extends such that the other end of the conductor pattern 13 in the first direction DR1 reaches the side surface 11d.

[0016] The conductor pattern 14 and the conductor pattern 15 are disposed on the main surface 11b. One end of the conductor pattern 14 in the first direction DR1 (the right end in Figs. 1 and 2) is spaced apart from one end of the conductor pattern 15 in the first direction DR1 (the left end in Figs. 1 and 2). The conductor pattern 14 extends such that the other end of the conductor pattern 14 in the first direction DR1 reaches the side surface 11c. The conductor pattern 15 extends such that the other end of the conductor pattern 15 in the first direction DR1 reaches the side surface 11d.

[0017] Conductive pattern 16 is disposed on side surface 11c. This electrically connects conductor pattern 12 to conductor pattern 14. Conductive pattern 17 is disposed on side surface 11d. This electrically connects conductor pattern 13 to conductor pattern 15. Specific examples of materials for conductor patterns 12, 13, 14, 15, 16, and 17 include copper and copper alloys.

[0018] The electronic component 20 is, for example, an LED. However, the electronic component 20 is not limited to an LED. The electronic component 20 has a first surface 20a and a second surface 20b. The first surface 20a and the second surface 20b are both end surfaces of the electronic component 20 in the thickness direction. The second surface 20b is the surface opposite to the first surface 20a. The electronic component 20 has an electrode 21 and an electrode 22. The electrode 21 is on the first surface 20a. The electrode 22 is on the second surface 20b.

[0019] The electronic component 20 is mounted on the substrate 10. More specifically, the electronic component 20 is disposed on the die pad 12a such that the first surface 20a (electrode 21) faces the die pad 12a. A connection layer 23 is interposed between the electronic component 20 and the die pad 12a. The connection layer 23 is made of, for example, a conductive adhesive. This electrically connects the electronic component 20 to the conductor pattern 12. The electronic component 20 is electrically connected to the conductor pattern 13 by, for example, a bonding wire 24. The bonding wire 24 is connected to the electrode 22 at one end and to the conductor pattern 13 at the other end. The bonding wire 24 is made of, for example, gold or a gold alloy.

[0020] The sealing member 30 is disposed on the substrate 10 so as to cover the electronic component 20. More specifically, the sealing member 30 encapsulates a portion of the conductive pattern 12 including the die pad 12a, a portion of the conductive pattern 13 including a portion to which the other end of the bonding wire 24 is connected, the bonding wire 24, and the electronic component 20. The sealing member 30 has a top surface 30a.

[0021] On the top surface 30a, printing is performed using a material that reacts to light of a wavelength in the first range (in the example shown in FIG. 1, letters and numbers such as "ABCD123" are printed). For example, on the top surface 30a, letters and numbers indicating the product number of the electronic component package 100, the lot number at the time of manufacture, the manufacturing date, etc. may be printed. On the top surface 30a, a dot pattern or a barcode may be drawn using a material that reacts to light of a wavelength in the first range, instead of letters. In other words, "printing" includes cases other than drawing letters and numbers. An example of the material that reacts to light of a wavelength in the first range is a fluorescent material. A material that reacts to light of a wavelength in the first range does not react to light of a wavelength outside the first range and is transparent. In other words, the printing performed on the top surface 30a cannot be seen with the naked eye unless light of a wavelength in the first range is irradiated. It is preferable that the printing performed on the top surface 30a generates visible light by reacting to light of the first range.

[0022] The wavelength of light generated by the LED, which is the electronic component 20, is in a second range. The second range is different from the first range and does not overlap with the first range. Therefore, even if the LED, which is the electronic component 20, generates light, the printing made on the top surface 30a cannot be seen by the naked eye. When the electronic component 20 is an LED, the constituent material of the sealing member 30 is a transparent resin that transmits light in the second range. Note that the first range and the second range are not particularly limited as long as they are different from each other. The first range is preferably not the wavelength range of visible light, and may be the wavelength range of infrared light or the wavelength range of ultraviolet light.

[0023] Although an example has been described above in which the printing using the material that reacts to light with wavelengths in the first range is performed on the top surface 30a, the printing may be performed on the side surface of the sealing member 30. In other words, the printing using the material that reacts to light with wavelengths in the first range may be performed on the surface of the sealing member 30.

[0024] The electronic component package 100 is mounted on a substrate 200. FIG. 3 is a cross-sectional view showing the electronic component package 100 in a mounted state. As shown in FIG. 3, the substrate 200 has a base material 201, and lands 202 and 203. The lands 202 and 203 are arranged on the main surface of the base material 201 so as to be spaced apart from each other. The electronic component package 100 is mounted on the substrate 200 so that the conductor patterns 14 and 15 face the lands 202 and 203, respectively. The connection between the conductor patterns 14 and 202 and the connection between the conductor patterns 15 and 203 are made by a connection layer 204. The material of the connection layer 204 is, for example, a solder alloy.

[0025] (Effects of 100 Electronic Component Packages) The effects of the electronic component package 100 will be described below.

[0026] On the electronic component package, letters, numbers, and the like indicating manufacturing information may be printed, for example, by irradiating the package with a laser. If such printing by laser irradiation is performed on the top surface 30a, the printing will obstruct the transmission of light generated by the LED, which is the electronic component 20, and deteriorate the light-emitting characteristics.

[0027] Therefore, in the electronic component package, printing by laser irradiation is usually performed on main surface 11b between conductor patterns 14 and 15. When printing by laser irradiation is performed on main surface 11b between conductor patterns 14 and 15, the printing does not impede the transmission of light generated by the LED, which is electronic component 20, and does not deteriorate the light emission characteristics. However, in this case, the printing cannot be confirmed unless the electronic component package is removed from the mounting board.

[0028] In this regard, the electronic component package 100 has letters, numbers, and the like that indicate manufacturing information printed on the top surface 30a. However, the printing reacts to light in a first range and does not react to light in a second range, and therefore does not impede the transmission of light generated by the LED, which is the electronic component 20, and does not deteriorate the light-emitting characteristics. In addition, since the printing is printed on the top surface 30a, in order to check the manufacturing information, etc. of the electronic component package 100, it is sufficient to read the printing by irradiating the top surface 30a with light in the second range, and there is no need to remove the electronic component package 100 from the mounting substrate (substrate 200) in order to check the manufacturing information, etc.

[0029] Even when the electronic component 20 is not an LED and the sealing member 30 is not a transparent resin, it is effective to print on the top surface 30a using a material that reacts to light with a wavelength in the first range. In other words, since the printing reacts to light with a wavelength in the first range, it is difficult for a person looking at the electronic component package 100 to recognize the presence of the printing unless light with a wavelength in the first range is irradiated. Therefore, when the electronic component 20 is not an LED and the sealing member 30 is not a transparent resin, it is easy to conceal manufacturing information, etc. by printing on the top surface 30a using a material that reacts to light with a wavelength in the first range.

[0030] (Additional Note) The embodiments of the present disclosure include the following features.

[0031] <Appendix 1> A substrate; Electronic components, a sealing member; The electronic component is mounted on the substrate, the sealing member is disposed on the substrate so as to cover the electronic components; An electronic component package, wherein a surface of the sealing member is printed using a material that reacts to light having a wavelength in a first range.

[0032] <Appendix 2> the electronic component is an LED that generates light at a wavelength in a second range; the sealing member is a transparent resin that transmits light having a wavelength in the second range, 2. The electronic component package of claim 1, wherein the second range is different from the first range.

[0033] <Appendix 3> 3. The electronic component package of claim 1, wherein the material is a fluorescent material that responds to light with wavelengths in the first range.

[0034] Although the embodiment of the present disclosure has been described above, the above-mentioned embodiment can be modified in various ways. The scope of the present invention is not limited to the above-mentioned embodiment. The scope of the present invention is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims. [Explanation of symbols]

[0035] 100 electronic component package, 10 substrate, 11 base material, 11a, 11b main surfaces, 11c, 11d side surfaces, 12, 13, 14, 15, 16, 17 conductor pattern, 12a die pad, 20 electronic component, 20a first surface, 20b second surface, 21, 22 electrode, 23 connection layer, 24 bonding wire, 30 sealing member, 30a top surface, 200 substrate, 201 base material, 202, 203 lands, 204 connection layer, DR1 first direction, DR2 second direction.

Claims

1. A substrate; Electronic components, a sealing member; The electronic component is mounted on the substrate, the sealing member is disposed on the substrate so as to cover the electronic components; An electronic component package, wherein a surface of the sealing member is printed with a material that reacts to light having a wavelength in a first range.

2. the electronic component is an LED that generates light at a wavelength in a second range; the sealing member is a transparent resin that transmits light having a wavelength in the second range, The electronic component package of claim 1 , wherein the second range is different from the first range.

3. 3. The electronic component package according to claim 1, wherein the material is a fluorescent material that responds to light having a wavelength in the first range.

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