Heat conduction member and method for manufacturing heat conduction member

Abstract

To provide a heat conduction member with a high heat conductivity which can stably hold a heat discharger, and a method for manufacturing the heat conduction member.SOLUTION: A heat conduction member 100 includes: a first heat transfer plate 10 in the shape of a flat plate; a second heat transfer plate 20 in the shape of a flat plate, facing the first heat transfer plate 10; a high-temperature conduction fluid 30 arranged between the first heat transfer plate 10 and the second heat transfer plate 20; and an expansion sheet 40 for sealing the high-temperature conduction fluid 30. The configuration allows formation of a heat conduction member with a variable thickness, while the main surface of the first heat transfer plate 10 and the main surface of the second heat transfer plate 20 are kept to be substantially parallel to each other.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a thermally conductive member and a method for manufacturing the thermally conductive member. [Background technology]

[0002] In recent years, electronic components such as ICs (Integrated Circuits) have become increasingly highly integrated and faster. This has resulted in an increase in the amount of heat generated by electronic components such as ICs. This has created a demand for more efficient cooling technology for electronic components.

[0003] In cooling electronic components, the electronic components are generally thermally connected to a heat sink, heat pipe, or other heat sink. In this case, a thermally conductive material (thermal conductive member) called TIM (Thermal Interface Material) is placed between the electronic component and the heat sink. The TIM ensures thermal conduction between the electronic component and the heat sink. For this reason, TIMs with excellent thermal conductivity are being considered.

[0004] For example, Patent Document 1 discloses a technology of a thermally conductive gel pack used as a TIM. This thermally conductive gel pack includes a first layer, a second layer, and a thermally conductive polymer gel. The first layer includes a polymer film or a thermal tape. The second layer includes a polymer film. The thermally conductive polymer gel is encapsulated in a compliant package formed by the first layer and the second layer. In Patent Document 1, "compliant" means having a bending characteristic that conforms to the outer shape of the joining surface with a small force. It is said that excellent thermal conductivity is achieved by the thermally conductive gel pack conforming to the joining surface. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Utility Model Registration No. 3191158 Summary of the Invention [Problem to be solved by the invention]

[0006] In Patent Document 1, the thermally conductive gel pack is made of a material that bends with a small force, which causes a problem that the position of the heat sink attached to the thermally conductive gel pack cannot be stably maintained.

[0007] The present disclosure has been made in consideration of the above problems, and has an object to provide a heat conductive member etc. that has high thermal conductivity and can stably hold a heat sink. [Means for solving the problem]

[0008] In order to solve the above problems, the thermal conduction member of the present disclosure includes a flat first heat transfer plate, a flat second heat transfer plate arranged opposite the first heat transfer plate, a highly thermally conductive fluid arranged between the first heat transfer plate and the second heat transfer plate, and an elastic sheet that seals the highly thermally conductive fluid.

[0009] In addition, the manufacturing method of the thermal conduction member disclosed herein comprises arranging a first flat heat transfer plate and a second flat heat transfer plate opposite each other, disposing a highly thermally conductive fluid between the first heat transfer plate and the second heat transfer plate, and sealing the highly thermally conductive fluid with an elastic sheet. Effect of the Invention

[0010] The effect of the present invention is to provide a heat conductive member or the like that has high thermal conductivity and can stably hold a heat sink. [Brief description of the drawings]

[0011] [Figure 1] FIG. 2 is a cross-sectional view illustrating an example of a heat conduction member according to the present disclosure. [Diagram 2] 1 is a cross-sectional view showing a first state of an example of a heat transfer member of the present disclosure. [Diagram 3] 1 is a cross-sectional view showing a first specific example of a heat conduction member according to the present disclosure. [Figure 4] 1 is a plan view showing a first specific example of a heat conduction member according to the present disclosure. [Diagram 5] FIG. 4 is a cross-sectional view showing a second specific example of an electronic device using a thermally conductive member according to the present disclosure. [Figure 6] 1 is a cross-sectional view showing a first state of a second specific example of an electronic device using a thermally conductive member according to the present disclosure. [Figure 7] 11 is a cross-sectional view showing a second state of a second specific example of an electronic device using a thermally conductive member of the present disclosure. [Figure 8] 11 is a cross-sectional view showing a first modified example of a second specific example of an electronic device according to the present disclosure. [Figure 9] FIG. 11 is a cross-sectional view showing a second modified example of the second specific example of the electronic device of the present disclosure. [Figure 10] FIG. 11 is a cross-sectional view showing a third modified example of the second specific example of the electronic device of the present disclosure. [Figure 11] FIG. 11 is a cross-sectional view showing a third specific example of an electronic device using a thermally conductive member according to the present disclosure. [Figure 12] FIG. 11 is a cross-sectional view showing a first state of a third specific example of an electronic device according to the present disclosure. [Figure 13] 1 is a cross-sectional view showing a first state of an example of a manufacturing method for a heat conduction member according to the present disclosure. [Figure 14] 4 is a cross-sectional view showing a second state of the example of the method for manufacturing a heat conduction member according to the present disclosure. FIG. [Figure 15] 11 is a cross-sectional view showing a third state of the exemplary method for manufacturing a heat conduction member according to the present disclosure. FIG. [Figure 16] 11 is a cross-sectional view showing a fourth state of the exemplary method for manufacturing a heat conduction member according to the present disclosure. FIG. [Figure 17] 10 is a cross-sectional view showing a first state of a modified example of the method for manufacturing a heat conduction member of the present disclosure. [Figure 18] 10 is a cross-sectional view showing a second state of a modified example of the method for manufacturing a heat conduction member according to the present disclosure. [Figure 19] 11 is a cross-sectional view showing a third state of the modified example of the method for manufacturing a heat conduction member according to the present disclosure. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the drawings. However, the embodiments described below are limited in a technically preferable manner for carrying out the present disclosure, but the scope of the invention is not limited to the following. Note that the same reference numbers are used for similar components in each drawing, and descriptions thereof may be omitted.

[0013] (First embodiment) 1 is a cross-sectional view showing an example of a heat transfer member 100 of the present disclosure. The heat transfer member 100 has a first heat transfer plate 10, a second heat transfer plate 20, a highly heat conductive fluid 30, and a stretchable sheet 40.

[0014] The first heat transfer plate 10 is flat. The second heat transfer plate 20 is flat. The second heat transfer plate 20 is disposed opposite the first heat transfer plate 10. The highly heat conductive fluid 30 is disposed between the first heat transfer plate 10 and the second heat transfer plate 20. The elastic sheet 40 seals the highly heat conductive fluid. In the following description, the direction perpendicular to the main surface of the first heat transfer plate 10 is referred to as the thickness direction. Also, the direction parallel to the main surface of the first heat transfer plate 10 is referred to as the width direction. In FIG. 1, the vertical direction of the figure is the thickness direction. Also, the horizontal direction of the figure is the width direction.

[0015] In the above configuration, one of the first heat transfer plate 10 and the second heat transfer plate 20 is attached to an electronic component such as an IC. The other is attached to a heat sink. In this case, the first heat transfer plate 10 and the second heat transfer plate 20 are flat. Therefore, the heat conductive member 100 and the electronic component, and the heat conductive member 100 and the heat sink are stably held.

[0016] 2 is a cross-sectional view showing a first state of a first example of the heat conduction member 100 of the present disclosure. In the first state, a force acts in a direction that brings the first heat transfer plate 10 and the second heat transfer plate 20 closer to each other. In other words, a force acts to compress the heat conduction member 100 in the thickness direction. At this time, the elastic sheet 40 is stretchable. As a result, a part of the high thermal conductivity fluid 30 moves in the outer periphery direction of the heat conduction member 100. Then, the thickness of the heat conduction member 100 decreases.

[0017] Furthermore, even when the distance between the first heat transfer plate 10 and the second heat transfer plate 20 varies, the first heat transfer plate 10 and the second heat transfer plate 20 are maintained in a nearly parallel positional relationship. Therefore, by using the thermally conductive member 100, the heat sink is stably held on the electronic component.

[0018] As described above, according to the present disclosure, there is provided a heat conducting member 100 that has high thermal conductivity and can stably hold a heat sink.

[0019] Next, a specific example of the heat conductive member 100 will be described.

[0020] (Example 1) Fig. 3 is a cross-sectional view showing specific example 1 of the heat transfer member of the present disclosure. Fig. 4 is a plan view showing specific example 1 of the heat transfer member of the present disclosure. A stretchable sheet 40 is fixed to a first portion 11 of the surface of the first heat transfer plate 10 facing the second heat transfer plate 20. A stretchable sheet 40 is fixed to a second portion of the surface of the second heat transfer plate 20 facing the first heat transfer plate 10.

[0021] Here, the elastic sheet 40 is composed of a first sheet 41 and a second sheet 42. The first sheet 41 has a through hole therein. The periphery of this through hole is set so as to be a predetermined distance inward from the periphery of the first heat transfer plate 10. Similarly, the second sheet 42 has a through hole therein. And, the periphery of this through hole is set so as to be a predetermined distance inward from the periphery of the second heat transfer plate 20. In this example, the first heat transfer plate 10 and the second heat transfer plate 20 have the same outer shape.

[0022] The outer periphery of the through hole of the first sheet 41 is fixed to the first portion 11 of the periphery of the first heat transfer plate 10. The outer periphery of the through hole of the second sheet 42 is fixed to the second portion 21 of the periphery of the second heat transfer plate 20.

[0023] The first sheet 41 and the second sheet 42 are bonded to each other at their outer peripheries. This outer periphery is, for example, the outside of the first heat transfer plate 10 and the second heat transfer plate 20.

[0024] A highly heat conductive fluid 30 is enclosed in the area surrounded by the first heat transfer plate 10, the second heat transfer plate 20, and the elastic sheet 40. In this manner, specific example 1 of the heat transfer member 100 is configured.

[0025] For example, the first heat transfer plate 10 and the second heat transfer plate 20 are formed from a metal having high thermal conductivity, such as copper or a copper alloy, or from another material having high thermal conductivity.

[0026] Also, the stretchable sheet 40 is formed from, for example, rubber such as silicone or a stretchable resin.

[0027] Moreover, the highly thermally conductive fluid 30 is made of, for example, a liquid metal. The liquid metal is made of, for example, a combination of one or more of Ga, In, and Sn. Such liquid metal may be mixed with a metal filler having a higher thermal conductivity than the liquid metal. Alternatively, the highly thermally conductive fluid 30 may be made of a metal powder or a conductive paste.

[0028] (Example 2) Next, a specific example of an electronic device configured using the thermally conductive member 100 will be described. FIG. 5 is a cross-sectional view showing a specific example 2 of an electronic device 1000 using the thermally conductive member 100 of the present disclosure. A heat sink 200 is attached to the outer surface of the first thermally conductive plate 10 via a first TIM 50. The heat sink 200 is a heat dissipator. A heat-generating electronic component 300 is attached to the outer surface of the second thermally conductive plate 20 via a second TIM 51. In this manner, the heat sink 200 is attached to the electronic component 300 via the thermally conductive member 100. In the above configuration, the heat generated in the electronic component 300 is efficiently transferred to the heat sink 200 by the thermally conductive member 100. Therefore, the electronic component 300 is efficiently cooled. Note that TIM is an abbreviation for Thermal_Interface_Material. For example, thermally conductive grease or putty is used for the first TIM 50 and the second TIM 51. It is desirable that the first TIM 50 and the second TIM 51 are free of air.

[0029] FIG. 6 is a cross-sectional view showing a first state of a specific example 2 of an electronic device 1000 using the thermally conductive member 100 of the present disclosure. In the first state, the heat sink 200 is pressed toward the electronic component 300. In this state, the elastic sheet 40 stretches, causing a part of the highly thermally conductive fluid 30 to move toward the outside of the first thermally conductive plate 10. The thickness of the thermally conductive member 100 then becomes thinner. At this time, the movement of the highly thermally conductive fluid 30 keeps the main surface of the first thermally conductive plate 10 and the main surface of the second thermally conductive plate 2 nearly parallel to each other. Therefore, the position of the heat sink 200 on the electronic component 300 is stably maintained.

[0030] FIG. 7 is a cross-sectional view showing a second state of a specific example 2 of an electronic device 1000 using the thermally conductive member 100 of the present disclosure. In the second state, the heat sink 200 is pressed toward the electronic component 300 more than in the first state. At this time, a larger amount of the high thermal conductivity fluid 30 moves to the outside of the first heat transfer plate 10 than in the first state. At this time, the elastic sheet 40 on the outside of the first heat transfer plate 10 expands in the vertical direction. This allows the moved high thermal conductivity fluid 30 to be held. This allows the main surface of the first heat transfer plate 10 and the main surface of the second heat transfer plate 2 to be kept nearly parallel. Therefore, the position of the heat sink 200 on the electronic component 300 is stably held.

[0031] When the pressing force is released from the first or second state, the restoring force of elastic sheet 40 causes heat conductive member 100 to return to its original thickness.

[0032] As described above, in the electronic device 1000 of the specific example 2, the heat generated in the electronic component 300 is efficiently transferred to the heat sink 200. Therefore, the electronic component 300 is efficiently cooled. In addition, the main surface of the first heat transfer plate 10 and the main surface of the second heat transfer plate 2 are kept nearly parallel. Therefore, the position of the heat sink 200 on the electronic component 300 is stably maintained.

[0033] Next, a modification of the electronic device 1000 will be described.

[0034] (Variation 1) FIG. 8 is a cross-sectional view showing a first modified example of a second specific example of the electronic device 1000 of the present disclosure. The thermally conductive member 100 used in the electronic device 1000 of the first modified example includes a spring 60. The spring 60 is provided between the first heat transfer plate 10 and the second heat transfer plate 20 in the region where the highly thermally conductive fluid 30 is sealed. For example, the spring 60 biases the first heat transfer plate 10 in a direction in which the first heat transfer plate 10 moves away from the second heat transfer plate 20. When the height of the object that holds down the heat sink 200 from above changes, the thickness of the thermally conductive member 100 is likely to follow this change due to the action of the spring 60. In FIG. 8, the spring 60 is exemplified as a conical spring, but the spring 60 may be a helical spring or a leaf spring.

[0035] (Variation 2) 9 is a cross-sectional view showing a second modified example of the second specific example of the electronic device of the present disclosure. In the second modified example, the outer shapes of the first heat transfer plate 10 and the second heat transfer plate 20 are expanded to the outside of the elastic sheet 40 of the heat conduction member 100. A spring 61 is provided on the outside of the elastic sheet 40. As the spring 61, for example, a leaf spring, a helical spring, a conical spring, or the like is used. The effect of the spring 61 is similar to that of the spring 60 of the first modified example.

[0036] (Variation 3) 10 is a cross-sectional view showing a modified example 3 of the specific example 2 of the electronic device 1000 of the present disclosure. In the modified example 3, the outer shapes of the first heat transfer plate 10 and the second heat transfer plate 20 are expanded to the outside of the elastic sheet 40 of the heat conduction member 100. The outer periphery of the first heat transfer plate 10 is bent toward the second heat transfer plate 20. The first heat transfer plate 10 is made of an elastic material. The outer periphery of the second heat transfer plate 20 is bent toward the first heat transfer plate 10. The second heat transfer plate 20 is made of an elastic material. The outer periphery of the first heat transfer plate 10 and the outer periphery of the second heat transfer plate 20 are bonded to each other.

[0037] In the above configuration, the first heat transfer plate 10 and the second heat transfer plate 20 act as springs that expand and contract in the thickness direction of the heat conduction member 100. Therefore, similar to the first and second modifications, when the height of something that holds down the heat sink 200 from above changes, the thickness of the heat conduction member 100 easily follows this change.

[0038] Next, another specific example of the electronic device 1000 having a different configuration of the thermally conductive member 100 will be described.

[0039] (Example 3) FIG. 11 is a cross-sectional view showing a specific example 3 of an electronic device 1000 using the thermal conduction member 100 of the present disclosure. In the specific example 3, the outer shape of the first heat transfer plate 10 is larger than the outer shape of the second heat transfer plate 20. A stretchable sheet 40 is attached to a fifth portion 12 of the surface of the first heat transfer plate 10 facing the second heat transfer plate 20. The fifth portion 12 is set on the outside of the second heat transfer plate 20. Also, a stretchable sheet 40 is attached to a sixth portion 22 of the surface of the second heat transfer plate 20 opposite to the first heat transfer plate 10. In this configuration, the stretchable sheet 40 does not exist between the first heat transfer plate 10 and the second heat transfer plate 20. A highly heat-conductive fluid 30 is enclosed in the area surrounded by the first heat transfer plate 10, the second heat transfer plate 20, and the stretchable sheet 40.

[0040] A heat sink 200 is attached to the outer surface of the first heat transfer plate 10 via a first TIM 50. An electronic component 300 is attached to the outer surface of the second heat transfer plate 20 via a second TIM 51. In this manner, the heat sink 200 is attached to the electronic component 300 via the thermally conductive member 100. In the above configuration, the heat generated in the electronic component 300 is efficiently transferred to the heat sink 200 by the thermally conductive member 100. Therefore, the electronic component 300 is efficiently cooled.

[0041] 12 is a cross-sectional view showing a first state of the specific example 3 of the electronic device 1000 of the present disclosure. In the first state, the heat sink 200 is pressed toward the electronic component 300. The first heat transfer plate 10 and the second heat transfer plate 20 are in contact with each other. In other words, there is no high thermal conductivity fluid 30 between the first heat transfer plate 10 and the second heat transfer plate 20. The high thermal conductivity fluid 30 is pushed outward from the second heat transfer plate 20. The pushed out high thermal conductivity fluid 30 is held outside the second heat transfer plate 20 by the stretched elastic sheet 40.

[0042] In the specific example configuration, the first heat transfer plate 10 and the second heat transfer plate 20 can come into contact with each other. This allows the thickness of the heat conduction member 100 to vary over a wider range than in a configuration in which the elastic sheet 40 is present between the first heat transfer plate 10 and the second heat transfer plate 20.

[0043] Next, a description will be given of a method for manufacturing the heat conductive member 100. In the following, the state changes in the order of a first state, a second state, a third state, and a fourth state.

[0044] 13 is a cross-sectional view showing a first state of an example of the manufacturing method of the thermal conduction member of the present disclosure. First, the first heat transfer plate 10 provided with the injection hole 13 is set in a mold 400. Then, resin as a raw material of the first sheet 41 is injected into a recess provided in the outer periphery of the first heat transfer plate 10 in the mold 400. The portion overlapping with the first sheet 41 becomes the third portion 14 of the first heat transfer plate 10. As the resin hardens, the first sheet 41 is insert-molded on the outer periphery of the first heat transfer plate 10.

[0045] 14 is a cross-sectional view showing a second state of an example of the manufacturing method of the thermal conduction member of the present disclosure. The second heat transfer plate 20 is set in a mold 400. Then, resin as a raw material of the second sheet 42 is injected into a recess provided in the outer periphery of the second heat transfer plate 20 in the mold 400. The portion overlapping with the second sheet 42 becomes the fourth portion 23 of the second heat transfer plate 20. As the resin hardens, the second sheet 42 is insert-molded on the outer periphery of the second heat transfer plate 20.

[0046] Fig. 15 is a cross-sectional view showing a third state of an example of a manufacturing method of the thermal conduction member 100 of the present disclosure. In the third state, the part formed in Fig. 13 and the part formed in Fig. 14 are arranged so that the main surface of the first heat transfer plate 10 and the main surface of the second heat transfer plate 20 are in contact with each other. The outer periphery of the first sheet 41 and the outer periphery of the second sheet 42 are adhered or joined to each other.

[0047] 16 is a cross-sectional view showing a fourth state of an example of the manufacturing method of the heat transfer member of the present disclosure. Here, a highly heat conductive fluid 30 is injected between the first heat transfer plate 10 and the second heat transfer plate 20. Then, after the injection, the injection hole 13 is blocked by a sealant 15. In this way, the heat transfer member 100 is completed. In the above manufacturing method, a stretchable sheet 40 is fixed to a third portion 14 on the surface of the first heat transfer plate 10 opposite to the second heat transfer plate 20. In addition, a stretchable sheet 40 is fixed to a fourth portion 23 on the surface of the second heat transfer plate 20 opposite to the first heat transfer plate 10.

[0048] (Modification) 17 is a cross-sectional view showing a first state of a modified example of the method of manufacturing heat conduction member 100 of the present disclosure. In this modified example, a mold 400 is formed so that the thickness of the outer periphery of first sheet 41 is the same as the thickness of first heat transfer plate 10.

[0049] First, the first heat transfer plate 10 provided with the injection hole 13 is set in the mold 400. Then, resin as a raw material of the first sheet 41 is injected into a recess provided in the outer periphery of the first heat transfer plate 10 in the mold 400. The portion overlapping with the first sheet 41 becomes the third portion 14 of the first heat transfer plate 10. As the resin hardens, the first sheet 41 is insert molded on the outer periphery of the first heat transfer plate 10. Although a repeated explanation is omitted, a second sheet 42 is also insert molded on the outer periphery of the second heat transfer plate 20.

[0050] 18 is a cross-sectional view showing a second state of a modified example of the manufacturing method of the heat transfer member of the present disclosure. In the second state, a part composed of the first heat transfer plate 10 and the first sheet 41 and a part composed of the second heat transfer plate 20 and the second sheet 42 are used. Then, the two parts are arranged so that the main surface of the first heat transfer plate 10 and the main surface of the second heat transfer plate 20 are in contact with each other. Next, the outer periphery of the first sheet 41 and the outer periphery of the second sheet 42 are adhered or joined to each other.

[0051] 19 is a cross-sectional view showing a third state of a modified example of the manufacturing method of the heat conduction member 100 of the present disclosure. Here, a highly heat conductive fluid 30 is injected between the first heat transfer plate 10 and the second heat transfer plate 20. After the injection, the injection hole 13 is blocked by a sealant 15. In this manner, the heat conduction member 100 is completed. In the above manufacturing method, the elastic sheet 40 is fixed to the third portion 14 on the surface of the first heat transfer plate 10 opposite to the second heat transfer plate 20. In the manufacturing method of this modified example, the heat conduction member 100 is formed in which the outer periphery of the elastic sheet 40 is thinner than in the manufacturing method of FIGS. 13 to 15.

[0052] The heat transfer member 100 etc. of the present disclosure have been described above.

[0053] The heat transfer member 100 of the present disclosure includes a first heat transfer plate 10, a second heat transfer plate 20, a highly heat conductive fluid 30, and an elastic sheet 40. The first heat transfer plate 10 is flat. The second heat transfer plate 20 is flat. The second heat transfer plate 20 is disposed opposite the first heat transfer plate 10. The highly heat conductive fluid 30 is disposed between the first heat transfer plate 10 and the second heat transfer plate 20. The elastic sheet 40 seals the highly heat conductive fluid 30.

[0054] In the above configuration, when the heat conducting member 100 is compressed in the thickness direction, the highly heat conducting fluid 30 can move in the width direction. Here, the elastic sheet 40 stretches, and the highly heat conducting fluid 30 is held on the outside of the first heat transfer plate 10 or the second heat transfer plate 20. With this configuration, even if the thickness varies, the first heat transfer plate 10 and the second heat transfer plate 20 are kept nearly parallel. This provides a heat conducting member or the like that has high thermal conductivity and can stably hold a heat sink.

[0055] Moreover, according to one embodiment, in the heat conduction member 100, a stretchable sheet 40 is fixed to a first portion 11 of the surface of the first heat transfer plate 10 facing the second heat transfer plate 20. Also, a stretchable sheet 40 is fixed to a second portion 21 of the surface of the second heat transfer plate 20 facing the first heat transfer plate 10.

[0056] In the above configuration, a highly heat conductive fluid 30 can be enclosed between the first heat transfer plate 10 and the second heat transfer plate 20.

[0057] According to one embodiment, the first portion 11 is an outer periphery of the first heat transfer plate in the heat conduction member 100, and the second portion 21 is an outer periphery of the second heat transfer plate 20.

[0058] In the above configuration, the highly thermally conductive fluid 30 is sealed in the center of the thermally conductive member 100. This ensures high thermal conductivity in the thickness direction.

[0059] Moreover, according to one embodiment, in the heat conduction member 100, a stretchable sheet 40 is fixed to a third portion 14 on the surface of the first heat transfer plate 10 opposite the second heat transfer plate 20. Also, a stretchable sheet 40 is fixed to a fourth portion 23 on the surface of the second heat transfer plate 20 opposite the first heat transfer plate 10.

[0060] In the above configuration, the first heat transfer plate 10 and the second heat transfer plate 20 can approach each other until they come into contact with each other. This makes it possible to increase the range of variation in the thickness of the heat conducting member 100.

[0061] According to one embodiment, in the heat conducting member 100, the third portion 14 is the outer periphery of the first heat transfer plate 10. The fourth portion 23 is the outer periphery of the second heat transfer plate 20.

[0062] In the above configuration, the highly thermally conductive fluid 30 is sealed in the center of the thermally conductive member 100. This ensures high thermal conductivity in the thickness direction.

[0063] According to one embodiment, in the heat conduction member 100, a stretchable sheet 40 is fixed to a fifth portion 12 of a surface of one of the first heat transfer plate 10 and the second heat transfer plate 20 that faces the other. Also, a stretchable sheet 40 is fixed to a sixth portion 22 of a surface of the other of the first heat transfer plate 10 and the second heat transfer plate 20 that is opposite to the surface facing the one.

[0064] In the above configuration, the first heat transfer plate 10 and the second heat transfer plate 20 can approach each other until they come into contact with each other. This makes it possible to increase the range of variation in the thickness of the heat conducting member 100.

[0065] In the heat conductive member 100, the elastic sheet 40 is made of rubber.

[0066] By using rubber, a stretchable sheet 40 with good stretchability can be obtained.

[0067] According to one embodiment, in the heat transfer member 100, the highly heat conductive fluid 30 is a liquid metal.

[0068] Liquid metal has a high thermal conductivity. Moreover, at room temperature, liquid metal is liquid. This allows the highly thermally conductive fluid 30 to move easily in the width direction. Furthermore, good thermal conductivity is ensured even if the thickness varies.

[0069] According to one embodiment, the heat transfer member 100 includes a spring. The spring biases the first heat transfer plate 10 in a direction away from the second heat transfer plate 20.

[0070] In the method for producing the heat transfer member 100 of the present disclosure, a flat first heat transfer plate 10 and a flat second heat transfer plate 20 are disposed opposite each other. A highly heat conductive fluid 30 is disposed between the first heat transfer plate 10 and the second heat transfer plate 20. The highly heat conductive fluid 30 is sealed by the elastic sheet 40.

[0071] According to the above manufacturing method, the heat conduction member 100 is easily manufactured. In the heat conduction member 100 manufactured here, when the heat conduction member 100 is compressed in the thickness direction, the highly heat conductive fluid 30 can move in the width direction. This is because the elastic sheet 40 stretches and the highly heat conductive fluid 30 is held on the outside of the first heat transfer plate 10 or the second heat transfer plate 20. Due to this configuration, in the heat conduction member 100 manufactured, even if the thickness varies, the first heat transfer plate 10 and the second heat transfer plate 20 are kept in a state close to parallel. This provides a heat conduction member or the like that has high thermal conductivity and can stably hold a heat sink.

[0072] The present invention has been described above by taking the above-mentioned embodiment as an exemplary example. However, the present invention is not limited to the above-mentioned embodiment. That is, the present invention can be applied in various aspects that can be understood by a person skilled in the art within the scope of the present invention. [Explanation of symbols]

[0073] 10 First heat transfer plate 11 First Part 12 Fifth Part 13 Injection hole 14 Third Part 15 Encapsulating materials 20 Second heat transfer plate 21 Second Part 22 Sixth Part 23 Fourth Part 30 High thermal conductivity fluid 40 Elastic Sheet 41 Sheet 1 42 2nd Sheet 50 First TIM 51 The Second TIM 60, 61 Spring 100 Thermal conductive material 200 Heatsink 300 Electronic Components 1000 electronic devices

Claims

1. A flat first heat transfer plate; A flat second heat transfer plate arranged opposite to the first heat transfer plate; a high thermal conductivity fluid disposed between the first heat transfer plate and the second heat transfer plate; An elastic sheet that seals the highly thermally conductive fluid; A thermal conductive member comprising:

2. The elastic sheet is fixed to a first portion of a surface of the first heat transfer plate facing the second heat transfer plate, The elastic sheet is fixed to a second portion of a surface of the second heat transfer plate facing the first heat transfer plate. The heat conductive member according to claim 1 .

3. The first portion is an outer periphery of the first heat transfer plate, The second portion is an outer periphery of the second heat transfer plate. The heat conductive member according to claim 2 .

4. The stretchable sheet is fixed to a third portion of a surface of the first heat transfer plate opposite to the second heat transfer plate, The elastic sheet is fixed to a fourth portion of a surface of the second heat transfer plate opposite to the first heat transfer plate. The heat conductive member according to claim 1 .

5. The third portion is an outer periphery of the first heat transfer plate, The fourth portion is an outer periphery of the second heat transfer plate. The heat conductive member according to claim 4 .

6. The stretchable sheet is fixed to a fifth portion of a surface of one of the first heat transfer plate and the second heat transfer plate facing the other, The stretchable sheet is fixed to a sixth portion of a surface of the other of the two opposite to the surface facing the one of the two. The heat conductive member according to claim 1 .

7. The elastic sheet is made of rubber.

7. The heat conducting member according to claim 1, wherein the heat conducting member is a conductor.

8. The high heat transfer fluid is a liquid metal.

7. The heat conducting member according to claim 1, wherein the heat conducting member is a conductor.

9. A spring is provided to bias the first heat transfer plate in a direction away from the second heat transfer plate.

7. The heat conducting member according to claim 1, wherein the heat conducting member is a conductor.

10. A first flat heat transfer plate and a second flat heat transfer plate are disposed opposite each other, A high thermal conductivity fluid is disposed between the first heat transfer plate and the second heat transfer plate; The highly thermally conductive fluid is sealed with an elastic sheet. A method for producing a thermally conductive member comprising the steps of:

Images