Curable composition, cured product and applications thereof

Abstract

To provide a curable composition that has appropriate flowability and is capable of forming a cured product with low hygroscopicity.SOLUTION: There is provided a curable composition, comprising: an epoxy monomer component selected from one of a first component and a second component; and an aniline-based curing agent, wherein the first component is formed from at least one of a first epoxy monomer represented by Formula I, and the second component includes the first epoxy monomer and a second epoxy monomer that is different from the first epoxy monomer.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a curable composition, a cured product, and applications thereof in the semiconductor field. [Background technology]

[0002] Patent Document 1 discloses a sealing resin composition containing 10 wt% to 50 wt% of an epoxy resin, 1 wt% to 50 wt% of a curing agent having an amino group, 3 wt% or less of a resin having a phenoxy group structure, and 40 wt% to 85 wt% of an inorganic filler material.

[0003] Examples of the epoxy resin include orthocresol novolac type epoxy resin, glycidyl ester type epoxy resin, and glycidyl amine type epoxy resin.

[0004] An example of the glycidyl amine type epoxy resin is triglycidyl p-aminophenol.

[0005] The sealing resin composition has a viscosity of 0.1 Pa·s to 100 Pa·s at temperatures below 25°C, and therefore has appropriate fluidity, allowing it to fill the gap between the carrier (e.g., a metal wire substrate) and the electronic device (e.g., a semiconductor chip) of an electronic device by the principle of capillary action, thereby sealing the electronic device. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] China Patent Publication No. 110036070 Summary of the Invention [Problem to be solved by the invention]

[0007] The encapsulating resin composition has a suitable fluidity and can be used as an underfill for flip chips. However, the cured product formed by curing the encapsulating resin composition has a tendency to absorb moisture. Therefore, when a reliability test is performed at high temperatures, moisture in the cured product is likely to form bubbles. The presence of bubbles makes the encapsulated electronic device prone to bursting, resulting in a problem of low yield of the encapsulated electronic device.

[0008] In view of the above problems, the development of a material capable of forming a cured product having suitable fluidity and low moisture absorption is an important issue for those in the electronic device encapsulation field.

[0009] Therefore, an object of the present invention is to provide a curable composition capable of forming a cured product having appropriate fluidity and low water absorption. [Means for solving the problem]

[0010] In order to achieve the above object, the present invention provides a composition comprising an epoxy monomer component selected from a first component or a second component, At least one aniline-based curing agent; The first component comprises at least one first epoxy monomer having the formula: the second component comprises at least one first epoxy monomer and at least one second epoxy monomer different from the first epoxy monomer represented by formula 1; When the epoxy monomer component is the second component, the total amount of the first epoxy monomer is 25 wt% or more and less than 100 wt%, and the total amount of the second epoxy monomer is more than 0 wt% and 75 wt% or less, based on 100 wt% of the total amount of the epoxy monomer components; TIFF2025041571000001.tif50170 in formula 1, R 1 is an alkylene group having 1 to 3 carbon atoms, R 21 is a single bond or oxygen, R 22is an alkylene group having 1 to 3 carbon atoms, R 3 is an alkylene group having 1 to 3 carbon atoms, R 4 is hydrogen or an alkyl group having 1 to 3 carbon atoms, R 5 is hydrogen or an alkyl group having 1 to 3 carbon atoms, R 6 is hydrogen or an alkyl group having 1 to 3 carbon atoms.

[0011] The present invention also provides a cured product, which is a cured product of the above-mentioned curable composition.

[0012] The present invention also provides an underfill comprising, as a main component, one of the above curable composition and the above cured product. Effect of the Invention

[0013] Due to the first epoxy monomer represented by formula 1, the curing composition of the present invention has a relatively low viscosity and appropriate fluidity, and the cured product of the curing composition has a relatively low water absorption rate. Therefore, when a high-temperature reliability test is performed, the encapsulated electronic device does not explode due to the presence of air bubbles, and therefore the yield of the encapsulated electronic device is good. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] First, it should be understood that the citation of any prior art document in this specification does not represent that the contents of the prior art document constitute general knowledge in the field to which the present invention pertains, in Taiwan or any other country.

[0015] Unless otherwise defined, all technical and scientific terms used herein have the meaning commonly understood by one of ordinary skill in the art to which this invention belongs. Those skilled in the art will recognize and can utilize many methods and materials similar or equivalent to those described herein in the practice of the present invention. Indeed, the present invention is in no way limited to the methods and materials described.

[0016] <Curing composition> The curable composition of the present invention comprises an epoxy monomer component and at least one curing agent.

[0017] The epoxy monomer component is selected from the first component or the second component.

[0018] The first component comprises at least one first epoxy monomer having the formula: TIFF2025041571000002.tif50170

[0019] The second component includes at least one first epoxy monomer and at least one second epoxy monomer different from the first epoxy monomer shown in Formula 1.

[0020] When the epoxy monomer component is the second component, the total amount of the first epoxy monomer is 25 wt% or more and less than 100 wt%, and the total amount of the second epoxy monomer is more than 0 wt% and 75 wt% or less, where the total amount of the epoxy monomer components is 100 wt%.

[0021] In formula 1, R 1 is an alkylene group having 1 to 3 carbon atoms, R 21 is a single bond or oxygen, and R 22 is an alkylene group having 1 to 3 carbon atoms, R 3 is an alkylene group having 1 to 3 carbon atoms, R 4 is hydrogen or an alkyl group having 1 to 3 carbon atoms, and R 5 is hydrogen or an alkyl group having 1 to 3 carbon atoms, and R 6is hydrogen or an alkyl group having 1 to 3 carbon atoms.

[0022] In some embodiments, the total amount of the epoxy monomer components is 5 wt% to 65 wt%, based on 100 wt% of the total amount of the curing composition.

[0023] In some embodiments, the total amount of the epoxy monomer components is 20 wt% to 65 wt%, based on 100 wt% of the total amount of the curing composition.

[0024] In some embodiments, the epoxy monomer component is the first component.

[0025] In some embodiments, the first epoxy monomer according to Formula 1 is Selected from TIFF2025041571000003.tif120170.

[0026] In some embodiments, the epoxy monomer component is the second component, and the total amount of the first epoxy monomer is greater than or equal to 25 wt % and less than 100 wt % and the total amount of the second epoxy monomer is greater than 0 wt % and less than or equal to 75 wt % of the total amount of the epoxy monomer component, which is 100 wt %; in some embodiments, the total amount of the first epoxy monomer is greater than or equal to 60 wt % and less than 100 wt % of the total amount of the epoxy monomer component.

[0027] In order to provide the cured product formed by the curing composition with a relatively high glass transition temperature and relatively excellent adhesion strength, the second epoxy monomer may, for example, be, but is not limited to, an epoxy monomer having two epoxy groups and multiple aromatic rings.

[0028] Examples of epoxy monomers having two epoxy groups and a plurality of aromatic rings include: Examples include, but are not limited to, TIFF2025041571000004.tif62170.

[0029] In TIFF2025041571000005.tif22170, X 1 and X 2 is an alkylene group having 1 to 3 carbon atoms, and X 3 and X 4 is hydrogen or a methyl group.

[0030] TIFF2025041571000006.tif22170, for example, bisphenol F diglycidyl ether (CAS number: 2095-03-6), bisphenol A diglycidyl ether, or Examples include, but are not limited to, TIFF2025041571000007.tif13170.

[0031] In some embodiments, the second epoxy monomer is an epoxy monomer having two epoxy groups and multiple aromatic rings.

[0032] In some embodiments, the epoxy monomer having two epoxy groups and multiple aromatic rings is Selected from TIFF2025041571000008.tif62170.

[0033] The curing agent may be used alone or in combination of two or more kinds.

[0034] Examples of the hardener include, but are not limited to, aniline-based hardeners, acid anhydride-based hardeners, and phenolic-based hardeners.

[0035] Examples of aniline-based curing agents include, but are not limited to, aniline, bis(4-amino-3-ethylphenyl)methane [4,4'-methylenebis(2-ethylaniline)], 4,4'-methylenebis(2-methyl-6-ethylaniline) [4,4'-methylenebis(2-methyl-6-ethylaniline)], and 3,5-bis(methylthio)-2,4-toluenediamine [4-methyl-2,6-bis(methylsulfanyl)benzene-1,3-diamine].

[0036] An example of an acid anhydride curing agent is 4,5-dimethyl-7-(2-methyl-1-propen-1-yl)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione, but is not limited to this.

[0037] Examples of phenol-based curing agents include, but are not limited to, 4,4'-methylenebis(2-allylphenol).

[0038] In some embodiments, the curing agent is selected from an aniline-based curing agent, an anhydride-based curing agent, or a phenolic-based curing agent.

[0039] In some embodiments, the total amount of the curing agent is 11 wt% to 60 wt%, based on 100 wt% of the total amount of the curing composition.

[0040] In some embodiments, the total amount of the curing agent is 11 wt% to 45 wt%, based on 100 wt% of the total amount of the curing composition.

[0041] In some embodiments, the curable composition further comprises at least one filler.

[0042] Examples of fillers include, but are not limited to, aluminum oxide or spherical silicon dioxide.

[0043] In some embodiments, the filler is selected from aluminum oxide or spherical silicon dioxide.

[0044] In some embodiments, the total amount of filler is greater than 0 wt% and less than or equal to 70 wt%, based on 100 wt% of the total amount of the hardening composition.

[0045] In some embodiments, the total amount of the filler is 55 wt% to 70 wt%, based on 100 wt% of the total amount of the hardening composition.

[0046] <Cured product> The cured product of the present invention is a cured product of the above-mentioned curable composition of the present invention, that is, a cured product formed by subjecting the above-mentioned curable composition of the present invention to a curing reaction.

[0047] In some embodiments, the temperature range of the curing reaction is 100° C. to 200° C., and the time range of the curing reaction is 0.5 hours to 3 hours.

[0048] <Application> The underfill of the present invention has as its main component one of the above-mentioned curable composition of the present invention and the above-mentioned cured product of the present invention, i.e., the above-mentioned curable composition of the present invention and one of the above-mentioned cured product of the present invention can be used as an underfill.

[0049] An underfill is placed between a carrier and a semiconductor element of a semiconductor device to seal the semiconductor device. That is, one of the above-mentioned curing composition of the present invention and the above-mentioned cured product of the present invention can be used as an underfill that is placed between a carrier and a semiconductor element of a semiconductor device to seal the semiconductor device.

[0050] The carrier may be, for example, a printed circuit board, a ceramic substrate, or a metal wire substrate, but is not limited thereto.

[0051] The semiconductor element may be, for example, but is not limited to, a light emitting diode chip or an integrated circuit chip.

[0052] Examples of the present invention will now be described, with the understanding that these examples are illustrative and explanatory and should not be construed as limiting the present invention.

[0053] <Example 1> The total amount of the curing composition is 100 wt%, and the first epoxy monomer content is 22.5 wt% (the first epoxy monomer content is 14.42 wt% of the formula 1-1 TIFF2025041571000009.tif38170 and formula 1-3 with a content of 8.08 wt% TIFF2025041571000010.tif39170) and bisphenol F diglycidyl ether (as a second epoxy monomer) with a content of 8.1 wt% were mixed to obtain an epoxy monomer component as the second component. In the epoxy monomer component, the total amount of the epoxy monomer components is 100 wt%, and the total amount of the first epoxy monomer is 73.5 wt%.

[0054] Similarly, the total amount of the curing composition was 100 wt%, and a curing agent mixture [containing 9.36 wt% of bis(4-amino-3-ethylphenyl)methane and 5.04 wt% of 4,4'-methylenebis(2-methyl-6-ethylaniline)] with a content of 14.4 wt% and spherical silicon dioxide with a content of 55 wt% were mixed with the epoxy monomer component to obtain the curing composition of Example 1.

[0055] <Examples 2 and 3> The manufacturing methods of Examples 2 and 3 are similar to that of Example 1, except for the types and amounts of each component.

[0056] The amount of each component in Example 2 is shown in Table 1, where the total amount of the curing composition is 100 wt%, and the amount of each component in Example 2 is shown in Table 1. TIFF2025041571000011.tif38170 and formula 1-3 with a content of 4.96 wt% TIFF2025041571000012.tif39170, and the hardener mixture includes bis(4-amino-3-ethylphenyl)methane with a content of 8.06 wt% and 4,4'-methylenebis(2-methyl-6-ethylaniline) with a content of 4.34 wt%.

[0057] The amount of each component in Example 3 is shown in Table 1, where the total amount of the curing composition is 100 wt%, and the amount of each component in Example 3 is shown in Table 1. TIFF2025041571000013.tif38170 and formula 1-3 with a content of 14.11 wt% TIFF2025041571000014.tif39170, and the hardener mixture includes bis(4-amino-3-ethylphenyl)methane with a content of 23.2 wt% and 4,4'-methylenebis(2-methyl-6-ethylaniline) with a content of 12.50 wt%.

[0058] <Example 4> The total amount of the curing composition is 100 wt%, and the content of the compound of formula 1-1 is 36.47 wt%. TIFF2025041571000015.tif38170 and formula 1-3 with a content of 20.43 wt% TIFF2025041571000016.tif39170 were mixed to obtain the first component, the epoxy monomer component.

[0059] Then, the total amount of the curing composition was 100 wt%, and a curing agent mixture having a content of 43.1 wt% [containing bis(4-amino-3-ethylphenyl)methane having a content of 28.015 wt% and 4,4'-methylenebis(2-methyl-6-ethylaniline) having a content of 15.085 wt%] was mixed with the epoxy monomer component to obtain the curing composition of Example 4.

[0060] <Example 5> The total amount of the curing composition is 100 wt%, and the content of the compound of formula 1-1 is 18.91 wt%. TIFF2025041571000017.tif38170 and formula 1-3 with a content of 10.59 wt% TIFF2025041571000018.tif39170 were mixed to obtain the first component, the epoxy monomer component.

[0061] Then, the total amount of the curing composition was 100 wt%, and a curing agent mixture [containing bis(4-amino-3-ethylphenyl)methane with a content of 10.075 wt% and 4,4'-methylenebis(2-methyl-6-ethylaniline) with a content of 5.425 wt%] with a content of 15.5 wt% and spherical silicon dioxide with a content of 55 wt% were mixed with the epoxy monomer component to obtain a curing composition of Example 5.

[0062] <Examples 6 to 8> The manufacturing methods of Examples 6 to 8 are similar to that of Example 1, except for the types and amounts of each component.

[0063] The amount of each component in Example 6 is shown in Table 2, where the total amount of the curing composition is 100 wt%, and the first epoxy monomer is a compound represented by the formula 1-1 with a content of 3.91 wt%. TIFF2025041571000019.tif38170 and formula 1-3 with a content of 2.19 wt% TIFF2025041571000020.tif39170, and the hardener mixture includes bis(4-amino-3-ethylphenyl)methane with a content of 7.77 wt% and 4,4'-methylenebis(2-methyl-6-ethylaniline) with a content of 4.18 wt%.

[0064] The amount of each component in Example 7 is shown in Table 2, where the total amount of the curing composition is 100 wt%, and the amount of each component in Example 7 is shown in Table 2. TIFF2025041571000021.tif38170 and formula 1-3 with a content of 2.18 wt% TIFF2025041571000022.tif39170, and the hardener mixture includes bis(4-amino-3-ethylphenyl)methane with a content of 7.42 wt % and 4,4'-methylenebis(2-methyl-6-ethylaniline) with a content of 4.00 wt %.

[0065] The amount of each component in Example 8 is shown in Table 2, where the total amount of the curing composition is 100 wt%, and the first epoxy monomer is a compound represented by the formula 1-1 with a content of 3.78 wt%. TIFF2025041571000023.tif38170 and formula 1-3 with a content of 2.12 wt% TIFF2025041571000024.tif39170, and the hardener mixture includes bis(4-amino-3-ethylphenyl)methane with a content of 8.00 wt % and 4,4'-methylenebis(2-methyl-6-ethylaniline) with a content of 4.30 wt %.

[0066] <Example 9> The total amount of the curing composition is 100 wt%, and the first epoxy monomer having a content of 5.90 wt% (the first epoxy monomer having a content of 3.78 wt% of Formula 1-1 TIFF2025041571000025.tif38170 and formula 1-3 with a content of 2.12 wt% TIFF2025041571000026.tif39170) and a content of 0.58 wt% TIFF2025041571000027.tif36170 (as the second epoxy monomer) and TIFF2025041571000028.tif31170 (as the second epoxy monomer) and TIFF2025041571000029.tif12170 (as a second epoxy monomer) was mixed to obtain an epoxy monomer component as the second component. In the epoxy monomer component, the total amount of the epoxy monomer components is 100 wt%, and the total amount of the first epoxy monomer is 25.3 wt%.

[0067] Then, the total amount of the curing composition was 100 wt%, and a curing agent mixture with a content of 11.65 wt% [containing bis(4-amino-3-ethylphenyl)methane with a content of 7.57 wt% and 4,4'-methylenebis(2-methyl-6-ethylaniline) with a content of 4.08 wt%] and spherical silicon dioxide with a content of 65 wt% were mixed with the epoxy monomer component to obtain a curing composition of Example 9.

[0068] <Comparative Example 1> The total amount of the curing composition was 100 wt %, and bisphenol F diglycidyl ether with a content of 8.1 wt % and triglycidyl p-aminophenol with a content of 22.5 wt % were mixed to obtain an epoxy monomer component.

[0069] Then, the total amount of the curing composition was taken as 100 wt%, and a curing agent mixture [containing bis(4-amino-3-ethylphenyl)methane with a content of 9.36 wt% and 4,4'-methylenebis(2-methyl-6-ethylaniline) with a content of 5.04 wt%] with a content of 14.4 wt% and spherical silicon dioxide with a content of 55 wt% were mixed with the epoxy monomer component to obtain a curing composition of Comparative Example 1.

[0070] <Comparative Examples 2 to 6> The manufacturing methods of Comparative Examples 2 to 6 are similar to that of Comparative Example 1, except for the types and amounts of each component.

[0071] The total amount of the curing composition is taken as 100 wt%, and the amount of each component used in Comparative Example 2 is shown in Table 3, in which the curing agent mixture contains 7.865 wt% bis(4-amino-3-ethylphenyl)methane and 4.235 wt% 4,4'-methylenebis(2-methyl-6-ethylaniline).

[0072] The total amount of the curing composition is taken as 100 wt%, and the amount of each component used in Comparative Example 3 is shown in Table 3, in which the curing agent mixture contains bis(4-amino-3-ethylphenyl)methane with a content of 22.62 wt% and 4,4'-methylenebis(2-methyl-6-ethylaniline) with a content of 12.18 wt%.

[0073] The total amount of the curing composition is taken as 100 wt%, and the amount of each component used in Comparative Example 4 is shown in Table 3, in which the curing agent mixture contains bis(4-amino-3-ethylphenyl)methane with a content of 27.365 wt% and 4,4'-methylenebis(2-methyl-6-ethylaniline) with a content of 14.735 wt%.

[0074] The total amount of the curing composition is taken as 100 wt%, and the amount of each component used in Comparative Example 5 is shown in Table 3, in which the curing agent mixture contains 5.785 wt% bis(4-amino-3-ethylphenyl)methane and 3.115 wt% 4,4'-methylenebis(2-methyl-6-ethylaniline).

[0075] The total amount of the curing composition is taken as 100 wt%, and the amount of each component used in Comparative Example 6 is shown in Table 3, in which the curing agent mixture contains bis(4-amino-3-ethylphenyl)methane with a content of 10.075 wt% and 4,4'-methylenebis(2-methyl-6-ethylaniline) with a content of 5.425 wt%.

[0076] <Evaluation items> Viscosity (unit: Pa s) measurement: 0.55 mL of the curable composition of each Example and Comparative Example was placed in a rheometer (manufacturer: TA, model number: AR2000ex) and heated at 25°C and 100°C for 1 s.-1 The shear rate was measured.

[0077] Measurement of water absorption rate (unit: %): The curing compositions of each Example and Comparative Example were subjected to a curing reaction at 150°C for 2 hours, and the dimensions were measured. 2 The cured lumps were placed in an oven set at 150° C. for 1 hour to obtain a plurality of dried products. The weight of each dried product was measured and recorded as W0.

[0078] Then, each dried product was placed in a high pressure aging accelerator (pressure cooker tester, manufacturer: Kson, model number: HAST-A PLUS), and left to stand for 20 hours at a temperature of 120°C and a relative humidity of 100%. The weight of the product that had been left to stand was then measured and recorded as W1.

[0079] The water absorption rate was calculated according to the following formula 1. Formula 1: Water absorption rate = {[(W1-W0) / W0] / (amount of epoxy monomer component + amount of hardener)} x 100%

[0080] Adhesion strength (unit: kgf / mm 2 ) Measurement: The curing composition of each Example and Comparative Example was applied to a silicon carrier so as to form multiple cylindrical protrusions, and each protrusion was subjected to a curing reaction at 150°C for 2 hours to form multiple cylindrical cured products with a diameter of 0.4 mm and a height of 0.1 mm.

[0081] Then, several cylindrical cured products were placed in a bond tester (manufacturer: Nordson, model number: DAGE 4000PXY), and different lateral forces were applied to each cylindrical cured product at 22°C, starting from smallest to largest, and the lateral forces at which they broke were recorded. The room temperature adhesion strength was then calculated using the following formula 2. Formula 2: Room temperature adhesion (kgf / mm 2 ) = lateral force at rupture at 22°C / cross-sectional area of ​​cylindrical hardened material

[0082] In addition, several other cylindrical cured products were placed in the bond tester and allowed to stand at 110°C for 2 minutes. After that, different lateral forces were applied to each cylindrical cured product in order from small to large, and the lateral forces at which they broke were recorded. The high temperature adhesion strength was then calculated using the following formula 3. Formula 3: High temperature adhesion (kgf / mm 2 ) = Lateral force at rupture at 110°C / Cross-sectional area of ​​cylindrical hardened material

[0083] Table 1 JPEG2025041571000030.jpg67165

[0084] Table 2 JPEG2025041571000031.jpg163165

[0085] Table 3 JPEG2025041571000032.jpg48164

[0086] Table 4 JPEG2025041571000033.jpg97162

[0087] As shown in Table 4, according to the experimental results of Examples 1 to 4 and Comparative Examples 1 to 4, the viscosity at 25°C of the curing compositions of Examples 1 to 4 is lower than that of the curing compositions of Comparative Examples 1 to 4, respectively, and according to the experimental results of Example 5 and Comparative Example 6, the viscosity at 25°C of the curing composition of Example 5 is lower than that of the curing composition of Comparative Example 6. Therefore, the curing composition of the present invention containing the first epoxy monomer represented by Formula 1 has better fluidity.

[0088] Moreover, the water absorption rates of the cured products formed by the curing compositions of Examples 1 to 4 are lower than the water absorption rates of the cured products formed by the curing compositions of Comparative Examples 1 to 4, respectively. Example 1 is 4.5 wt% {[(4.00-3.82) / 4.00]×100 wt%} lower than Comparative Example 1, Example 2 is 4.28 wt% {[(2.57-2.46) / 2.57]×100 wt%} lower than Comparative Example 2, Example 3 is 4.40 wt% {[(2.73-2.61) / 2.73]×100 wt%} lower than Comparative Example 3, and Example 4 is 16.05 wt% {[(2.43-2.04) / 2.43]×100 wt%} lower than Comparative Example 4. Therefore, the curing composition of the present invention containing the first epoxy monomer represented by formula 1 does not cause the encapsulated electronic device to explode due to the presence of air bubbles during high temperature reliability testing, and therefore the yield of the encapsulated electronic device is good.

[0089] In addition, as shown in Table 4, according to the experimental results of Example 6 to Example 9 and Comparative Example 5, the viscosities of the curing compositions of Example 6 to Example 9 at 25°C are all lower than the viscosity of the curing composition of Comparative Example 5 at 25°C, and the water absorption of the cured products formed by the curing compositions of Example 6 to Example 9 is all lower than the water absorption of the cured product formed by the curing composition of Comparative Example 5. Therefore, the curing composition of the present invention, which contains a first epoxy monomer represented by Formula 1 and a second epoxy monomer different from the first epoxy monomer represented by Formula 1, can satisfy the demand for appropriate fluidity, and the cured product formed by the curing composition of the present invention can also satisfy the demand for low water absorption.

[0090] According to the above, due to the first epoxy monomer represented by formula 1, the curing composition of the present invention has a relatively low viscosity and appropriate fluidity, and the cured product formed by the curing composition has a relatively low water absorption rate, so that the encapsulated electronic device does not explode due to the presence of air bubbles during high-temperature reliability testing, and therefore the yield of the encapsulated electronic device is good.

[0091] In the above, for the purpose of explanation, many specific details are provided to facilitate a thorough understanding of the embodiments. However, it will be apparent to one skilled in the art that one or more other embodiments may be implemented without providing the specific details. In addition, in the description of "one embodiment" or "one embodiment" in this specification, it should be understood that all descriptions accompanied by ordinal numbers or other indications may be included in the specific implementation of the present invention having specific aspects, structures, and features. Furthermore, in this description, multiple variations are sometimes incorporated into one embodiment, drawing, or description thereof, but this is for the purpose of streamlining the description and for the purpose of understanding the multiple aspects of the present invention, and one or more features or specific embodiments in one embodiment may be implemented together with one or more features or specific embodiments in other embodiments, where appropriate, in the implementation of the present invention.

[0092] Although the preferred embodiments and modified examples of the present invention have been described above, the present invention is not limited to these, and is intended to encompass all modifications and equivalent configurations as various configurations falling within the spirit and scope of the broadest interpretation. [Industrial Applicability]

[0093] According to the present invention, it is possible to provide a curable composition for use in electronic devices.

Claims

1. an epoxy monomer component selected from the first component or the second component; At least one aniline-based curing agent; The first component comprises at least one first epoxy monomer having the formula: the second component comprises at least one first epoxy monomer and at least one second epoxy monomer different from the first epoxy monomer represented by formula 1; When the epoxy monomer component is the second component, the total amount of the first epoxy monomer is 25 wt % or more and less than 100 wt %, and the total amount of the second epoxy monomer is more than 0 wt % and 75 wt % or less, where the total amount of the epoxy monomer components is 100 wt %; In formula 1, R １ is an alkylene group having 1 to 3 carbon atoms, R ２１ is a single bond or oxygen, R ２２ is an alkylene group having 1 to 3 carbon atoms, R ３ is an alkylene group having 1 to 3 carbon atoms, R ４ is hydrogen or an alkyl group having 1 to 3 carbon atoms, R ５ is hydrogen or an alkyl group having 1 to 3 carbon atoms, R ６ is hydrogen or an alkyl group having 1 to 3 carbon atoms.

2. The first epoxy monomer represented by the formula 1 is The curing composition according to claim 1, characterized in that it is selected from the group consisting of

3. The curing composition according to claim 1 , wherein the epoxy monomer component is the first component.

4. The curing composition according to claim 1 , wherein the epoxy monomer component is the second component.

5. The curing composition according to claim 4, wherein the total amount of the first epoxy monomer is 60 wt% or more and less than 100 wt%, with the total amount of the epoxy monomer components being 100 wt%.

6. The curing composition according to any one of claims 1 to 5, characterized in that a total amount of the epoxy monomer components is 5 wt % to 65 wt % with respect to a total amount of the curing composition being 100 wt %.

7. The curing composition according to claim 1 , wherein the second epoxy monomer is an epoxy monomer having two epoxy groups and a plurality of aromatic rings.

8. The epoxy monomer having two epoxy groups and a plurality of aromatic rings is It is selected from In the formula, X １ and X ２ is an alkylene group having 1 to 3 carbon atoms, X ３ and X ４ The curable composition according to claim 7 , wherein is hydrogen or a methyl group.

9. The curable composition of claim 1 further comprising at least one filler.

10. The hardening composition according to claim 9, wherein a total amount of the filler is more than 0 wt % and 70 wt % or less, based on a total amount of the hardening composition being 100 wt %.

11. 10. The hardening composition according to claim 9, wherein the filler is selected from aluminum oxide and spherical silicon dioxide.

12. A cured product, which is a cured product of the curable composition according to claim 1.

13. An underfill comprising, as a main component, either the curable composition according to claim 1 or the cured product according to claim 12.

14. 14. The underfill of claim 13, disposed in a gap between a carrier and a semiconductor element of a semiconductor device to encapsulate the semiconductor device.

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