Machining method, machining device, and machining program

Abstract

To provide a technique for simultaneously executing supplemental machining and lathe turning.SOLUTION: A machining method includes the steps of: rotating a workpiece around a workpiece spindle; and executing simultaneous machining in which supplemental machining using a laser head and lathe turning using a tool are simultaneously executed on the rotating workpiece. The simultaneous machining is executed in a state where the laser head and the tool are fed-driven toward one side in a rotational axis direction of the workpiece spindle, and a supplemental machining point of the workpiece by the laser head and a lathe turning point of the workpiece by the tool are separated by a predetermined distance or more in the rotational axis direction.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a workpiece machining method, a workpiece machining device, and a workpiece machining program. [Background technology]

[0002] Japanese Patent Application Laid-Open No. 2022-041603 (Patent Document 1) discloses a processing machine equipped with an additional processing head and a tool rest for performing turning. The processing machine can perform additional processing of a workpiece and turning processing of the workpiece with a single machine. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-041603 Summary of the Invention [Problem to be solved by the invention]

[0004] In order to improve the efficiency of machining a workpiece, a technique for simultaneously performing additional machining and turning is desired. Patent Document 1 does not disclose the simultaneous performance of additional machining and turning.

[0005] The present invention has been made in view of the above-mentioned problems, and an object of one aspect of the present invention is to provide a technique for simultaneously performing additional machining and turning. [Means for solving the problem]

[0006] In one example of the present disclosure, a method for machining a workpiece by a machining device is provided. The machining device includes a workpiece spindle for rotating the workpiece, a laser head capable of supplying powder material to the workpiece and performing additional machining by irradiating the workpiece with a laser beam, and a tool rest for holding a tool. The machining method includes a step of rotating the workpiece by the workpiece spindle, and a step of performing simultaneous machining in which additional machining by the laser head and turning by the tool are performed simultaneously on the rotating workpiece. The simultaneous machining is performed while the laser head and the tool are driven to feed to one side in the rotation axis direction of the workpiece spindle, and while the additional machining point of the workpiece by the laser head and the turning machining point of the workpiece by the tool are separated by a predetermined distance or more in the rotation axis direction.

[0007] In one example of the present disclosure, the simultaneous machining is performed with the additional machining point preceding the turning machining point on the one side.

[0008] In one example of the present disclosure, the simultaneous machining is performed with the turning point preceding the additional machining point on the one side.

[0009] In one example of the present disclosure, the additional machining point, the rotation center of the workpiece, and the turning machining point are arranged in the following order when viewed from the rotation axis direction: the additional machining point, the rotation center of the workpiece, and the turning machining point.

[0010] In one example of the present disclosure, the machining apparatus further includes a discharge mechanism for discharging a fluid onto the workpiece. The simultaneous machining is performed while discharging the fluid onto the workpiece.

[0011] In one example of the present disclosure, the fluid is air or a coolant.

[0012] In one example of the present disclosure, the simultaneous machining is performed in a state where, on the one side, the additional machining point precedes the discharge point of the fluid onto the workpiece, and, on the one side, the discharge point precedes the turning machining point.

[0013] In another example of the present disclosure, a workpiece machining device is provided. The machining device includes a workpiece spindle for rotating the workpiece, a laser head capable of supplying powder material to the workpiece and performing additional machining by irradiating the workpiece with a laser beam, a tool rest for holding a tool, and a control unit for controlling the machining device. The control unit executes a process of rotating the workpiece with the workpiece spindle, and a process of executing simultaneous machining for simultaneously performing additional machining by the laser head and turning by the tool on the rotating workpiece. The simultaneous machining is executed while the laser head and the tool are driven to be fed to one side in the rotation axis direction of the workpiece spindle, and while the additional machining point of the workpiece by the laser head and the turning point of the workpiece by the tool are separated by a predetermined distance or more in the rotation axis direction.

[0014] In another example of the present disclosure, a machining program for a workpiece executed by a machining device is provided. The machining device includes a workpiece spindle for rotating the workpiece, a laser head capable of supplying powder material to the workpiece and performing additional machining by irradiating the workpiece with a laser beam, and a tool rest for holding a tool. The machining program causes the machining device to execute a step of rotating the workpiece with the workpiece spindle, and a step of executing simultaneous machining for simultaneously performing additional machining by the laser head and turning by the tool on the rotating workpiece. The simultaneous machining is executed while the laser head and the tool are driven to feed to one side in the rotation axis direction of the workpiece spindle, and while the additional machining point of the workpiece by the laser head and the turning point of the workpiece by the tool are separated by a predetermined distance or more in the rotation axis direction.

[0015] The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the invention, which is to be understood in conjunction with the accompanying drawings.

Brief Description of the Drawings

[0016] [Figure 1] It is a figure which shows an example of the external appearance of a processing apparatus. [Diagram 2] It is a figure which shows an example of the apparatus configuration of a processing apparatus. [Diagram 3] It is a figure which shows the cross section of a laser head during additional processing. [Figure 4] It is a figure which schematically shows the mode of simultaneous processing from the X-axis direction. [Diagram 5] It is a figure which schematically shows the mode of simultaneous processing from the Z-axis direction. [Figure 6] It is a figure which shows an example of the drive mechanism of a processing apparatus. [Figure 7] It is a figure which shows an example of the hardware configuration of a control unit. [Figure 8] It is a flowchart which shows the flow of the process which concerns on the simultaneous processing shown in FIG. 4. [Figure 9] It is a figure which schematically shows the mode of simultaneous processing according to Modification 1. [Figure 10] It is a flowchart which shows the flow of the process which concerns on the simultaneous processing according to Modification 1. [Figure 11] It is a figure which schematically shows the mode of simultaneous processing according to Modification 3.

Modes for Carrying Out the Invention

[0017] Hereinafter, each embodiment according to the present invention will be described with reference to the drawings. In the following description, the same parts and components are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed descriptions thereof will not be repeated. Note that each embodiment and each modification described below may be selectively combined as appropriate.

[0018] <A. Appearance of Processing Apparatus 100> First, referring to FIG. 1, the processing apparatus 100 according to the embodiment will be described. FIG. 1 is a diagram showing an example of the appearance of the processing apparatus 100.

[0019] The processing apparatus 100 is an AM / SM hybrid processing machine capable of performing additive processing (AM (Additive manufacturing) processing) and subtractive processing (SM (Subtractive manufacturing)) on a workpiece. Examples of the functions of the subtractive processing include a milling function and a turning function.

[0020] The processing apparatus 100 includes, for example, a cover body 130 and an operation panel 200.

[0021] The cover body 130 is a mechanism for protecting the components provided inside the processing apparatus 100. A door DR is provided on the cover body 130. The door DR is, for example, a slide-type door. The door DR may be configured to be openable and closable by a drive source such as a motor, or may be configured to be openable and closable manually.

[0022] The operation panel 200 is a general-purpose computer and has a display for displaying various information related to processing. The display is, for example, a liquid crystal display, an organic EL (Electro Luminescence) display, or other display devices. Further, the display is provided with a touch panel and accepts various operations on the processing apparatus 100 by touch operation.

[0023] <B. Device Configuration of Processing Apparatus 100> Next, referring to FIG. 2, the device configuration of the processing apparatus 100 will be described. FIG. 2 is a diagram showing an example of the device configuration of the processing apparatus 100.

[0024] As described above, the processing apparatus 100 includes a cover body 130. The cover body 130 forms the appearance of the processing apparatus 100 and partitions and forms a processing area AR for performing additive processing on the workpiece W.

[0025] The machining apparatus 100 also includes a bed 11 , a tool rest 16 , a workpiece spindle 22 , a tailstock 25 , a tool spindle 30 , and a laser head 140 .

[0026] For ease of explanation, the direction of the rotation axis of the work spindle 22 will also be referred to as the "Z-axis direction" below. The Z-axis direction is parallel to the axes AX1 to AX3 shown in FIG. 2. A direction on a horizontal plane perpendicular to the Z-axis direction will also be referred to as the "X-axis direction." A direction perpendicular to both the X-axis and Z-axis directions will be referred to as the "Y-axis direction." In the example of FIG. 2, the Y-axis direction corresponds to the direction of gravity.

[0027] The bed 11 is a base member for supporting various devices provided in the processing device 100. In the example of Fig. 2, the bed 11 supports the tool rest 16, the work spindle 22, the tailstock 25, the tool spindle 30, and the laser head 140. The bed 11 is installed on the floor of a factory or the like. The bed 11 is made of metal such as cast iron.

[0028] The tool rest 16 has a turret 18. The turret 18 is configured to be rotatable about an axis AX1. The turret 18 holds a plurality of tools at intervals in the circumferential direction about the axis AX1. The tool rest 16 is also configured to be movable in the X-axis direction and the Y-axis direction by various driving mechanisms such as a motor. The tool rest 16 performs turning by bringing a fixed tool held by the turret 18 into contact with a workpiece W that is rotationally driven by a workpiece spindle 22.

[0029] The work spindle 22 is configured to be rotatable while holding the workpiece W. More specifically, the work spindle 22 is provided with a chuck mechanism 23. The chuck mechanism 23 is a mechanism for fixing the workpiece W to the work spindle 22. The work spindle 22 is also configured to be rotatable about an axis AX2 that is aligned with the axial direction of the work spindle 22.

[0030] The tailstock 25 is configured to be movable along the axis AX3 by various driving mechanisms such as a motor. As a result, the tailstock 25 supports the long workpiece W from the side opposite to the workpiece spindle 22. Typically, the axis AX3 is coaxial with the axis AX2. The tailstock 25 is also configured to be rotatable about the axis AX3.

[0031] The tool spindle 30 is provided, for example, at a position higher than the work spindle 22 and the tailstock 25. The tool spindle 30 is configured to allow a tool and a laser head 140 to be detachably attached thereto. Fig. 2 shows an example in which the laser head 140 is attached to the tool spindle 30.

[0032] The attachment and detachment of the laser head 140 to the tool spindle 30 is realized by, for example, an automatic tool changer (ATC). The machining device 100 attaches the laser head 140 to the tool spindle 30 when performing additional machining of the workpiece W. On the other hand, the machining device 100 attaches a tool to the tool spindle 30 when performing removal machining of the workpiece W.

[0033] One example of the removal process is milling, in which a rotating tool is brought into contact with the workpiece W fixed to the workpiece spindle 22. Another example of the removal process is turning, in which a tool is pressed against the workpiece W rotating about the axis AX2.

[0034] The laser head 140 performs additional machining by a direct energy deposition (DED) method while being attached to the tool spindle 30. The laser head 140 has a head body 142 and a laser nozzle 146 as a mechanism for realizing the additional machining.

[0035] A powder material is supplied via a cable (not shown) to the head body 142. The supplied powder material may be a metal powder, a resin powder, or any other type of powder that melts when irradiated with a laser beam.

[0036] The laser nozzle 146 irradiates the workpiece W with laser light and defines the irradiation area of the laser light on the workpiece W. The powder material supplied to the laser head 140 is discharged toward the workpiece W through the laser nozzle 146.

[0037] <C. Additive Processing> Next, with reference to FIG. 3, the additive processing by the laser head 140 will be described in more detail. FIG. 3 is a diagram showing a cross section of the laser head 140 during additive processing.

[0038] The processing apparatus 100 can realize various additive processes by controlling the laser head 140. Examples of the types of additive processing include lamination processing and coating processing. Lamination processing is a process of stacking layers SL on the workpiece W. Coating processing is a process of covering the surface of the workpiece W with a layer SL.

[0039] The processing apparatus 100 according to the embodiment is configured to enable high-speed additive processing. Examples of high-speed additive processing techniques include, for example, EHLA (Extreme High-speed Laser Application).

[0040] More specifically, while the laser head 140 moves in the axial direction of the workpiece spindle 22 (i.e., the Z-axis direction), the rotating workpiece W is irradiated with the laser light LS. As a result, the irradiated portion of the laser light LS melts, and a molten pool MP is formed on the workpiece W.

[0041] Also, in parallel with the irradiation of the laser light LS, the laser head 140 supplies the powder material PM to the workpiece W. The supplied powder material PM melts before reaching the surface of the workpiece W by the laser light LS. As a result, the molten powder material PM is introduced into the molten pool MP. When the molten pool MP hardens on the workpiece W, it becomes the layer SL.

[0042] <D. Simultaneous Processing> The processing device 100 rotates the workpiece W at high speed during high-speed additional machining. Therefore, the processing device 100 can perform turning of the workpiece W in parallel with the additional machining of the workpiece W. Hereinafter, the processing in which the additional machining of the workpiece W and the turning of the workpiece W are performed simultaneously will also be referred to as "simultaneous machining."

[0043] Simultaneous machining by the machining apparatus 100 will be described with reference to Fig. 4 and Fig. 5. Fig. 4 is a diagram showing the simultaneous machining from the X-axis direction. Fig. 5 is a diagram showing the simultaneous machining from the Z-axis direction.

[0044] 4 shows a laser head 140 performing additional machining on a workpiece W, and a tool T performing turning on the workpiece W. The tool T is fixed to the tool rest 16 (see FIG. 2) via the turret 18 described above.

[0045] The machining device 100 simultaneously performs additional machining by the laser head 140 and turning by the tool T on a rotating workpiece W. At this time, the machining device 100 performs simultaneous machining while driving the laser head 140 and the tool T to one side in the Z-axis direction and while keeping the additional machining point LP of the workpiece W by the laser head 140 and the turning machining point TP of the workpiece W by the tool T apart from each other by a predetermined distance ΔD1 or more in the Z-axis direction.

[0046] The additional machining point LP corresponds to a point where the laser head 140 irradiates the workpiece W with laser light. The turning machining point TP corresponds to a point where the tool T turns the workpiece W. In other words, the turning machining point TP corresponds to a contact point between the tool T and the workpiece W.

[0047] In the example of Fig. 4, the machining device 100 performs simultaneous machining in a state where the additional machining point LP precedes the turning machining point TP in the feed direction of the laser head 140 and the tool T. As a result, each location on the workpiece W is machined in the order of "additional machining -> turning machining". Typically, the feed speed of the laser head 140 is the same as the feed speed of the tool T.

[0048] The additional processing point LP becomes hot. Therefore, if turning is immediately performed on the additional processed portion, the tool T will be consumed by heat. Also, the workpiece W expands at high temperatures. If turning is performed while the workpiece W is expanded, dimensional control becomes difficult and the desired machining accuracy may not be obtained.

[0049] In contrast, the processing apparatus 100 according to the present embodiment executes simultaneous machining with the additional processing point LP separated from the turning point TP by a distance ΔD1 or more. Therefore, the processing apparatus 100 can execute turning after the temperature of the workpiece W has dropped. As a result, the processing apparatus 100 can suppress the consumption of the tool T due to heat. Also, the processing apparatus 100 can execute turning while the workpiece W is not expanded, and can avoid a decrease in machining accuracy.

[0050] Preferably, the additional processing point LP, the rotation center CP of the workpiece W, and the turning point TP are arranged in the order of the additional processing point LP, the rotation center CP of the workpiece W, and the turning point TP when viewed from the Z-axis direction. In other words, the rotation center CP of the workpiece W is located between the additional processing point LP and the turning point TP in the direction orthogonal to the Z-axis direction. In the example of FIG. 5, the additional processing point LP, the rotation center CP of the workpiece W, and the turning point TP are located on a straight line when viewed from the Z-axis direction. That is, the additional processing during simultaneous machining is performed from one side in the Y-axis direction, and the turning during simultaneous machining is performed from the other side in the Y-axis direction.

[0051] Typically, the additional processing point LP is located at the uppermost part of the workpiece W when viewed from the Z-axis direction. On the other hand, the turning point TP is located at the lowermost part of the workpiece W when viewed from the Z-axis direction. By performing the additional processing and the turning on opposite sides sandwiching the workpiece W, the processing apparatus 100 can prevent one of the additional processing and the turning from affecting the machining accuracy of the other.

[0052] <E. Drive mechanism of the processing apparatus 100> Next, a drive mechanism in the processing apparatus 100 will be described with reference to Fig. 6. Fig. 6 is a diagram showing an example of a drive mechanism of the processing apparatus 100.

[0053] As shown in FIG. 6, the processing apparatus 100 includes a control unit 50 and drive units 210, 220, 230A, 230B, and 240.

[0054] The control unit 50 controls various devices in the processing apparatus 100. The control unit 50 may have any configuration. The control unit 50 may be configured with a single control unit or may be configured with multiple control units. As an example, the control unit 50 includes at least one of a CNC (Computer Numerical Control) and a PLC (Programmable Logic Controller).

[0055] The driving unit 210 is a driving mechanism for rotating the work spindle 22. The driving unit 210 may be composed of a single driving unit, or may be composed of multiple driving units. In the example of Fig. 6, the driving unit 210 is composed of a motor driver 211C and a motor 212C.

[0056] The motor driver 211C sequentially receives input of the target rotation angle or the target rotation speed of the work spindle 22 from the control unit 50, and outputs a current according to the target rotation angle or the target rotation speed to the motor 212C. As a result, the work held by the work spindle 22 rotates about the Z-axis direction as the center of rotation. The motor 212C may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0057] The driving unit 220 is a driving mechanism for driving the tailstock 25. The driving unit 220 may be composed of a single driving unit, or may be composed of multiple driving units. In the example of Fig. 6, the driving unit 220 is composed of a motor driver 221Z and a motor 222Z.

[0058] The motor driver 221Z sequentially receives input of target positions for the work spindle 22 from the control unit 50, and outputs a current corresponding to the target positions to the motor 222Z. This causes the motor 222Z to move the tailstock 25 to an arbitrary position in the Z-axis direction. The motor 222Z may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0059] The driving unit 230A is a driving mechanism for moving the position of the tool spindle 30. The above-mentioned laser head 140 is driven by being attached to the tool spindle 30. The driving unit 230A may be composed of a single driving unit, or may be composed of a plurality of driving units. In the example of Fig. 6, the driving unit 230A is composed of motor drivers 231X to 231Z and motors 232X to 232Z.

[0060] The motor driver 231X sequentially receives input of target positions of the tool spindle 30 in the X-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 232X. As a result, the motor 232X drives the tool spindle 30 to an arbitrary position in the X-axis direction. The motor 232X may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0061] The motor driver 231Y sequentially receives input of target positions of the tool spindle 30 in the Y-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 232Y. As a result, the motor 232Y drives the tool spindle 30 to an arbitrary position in the Y-axis direction. The motor 232Y may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0062] The motor driver 231Z sequentially receives input of target positions of the tool spindle 30 in the Z-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 232Z. As a result, the motor 232Z moves the tool spindle 30 to an arbitrary position in the Z-axis direction. The motor 232Z may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0063] The driving unit 230B is a driving mechanism for rotationally driving the tool spindle 30. The driving unit 230B may be composed of a single driving unit, or may be composed of a plurality of driving units. In the example of Fig. 6, the driving unit 230B is composed of motor drivers 231A, 231B and motors 232A, 232B.

[0064] The motor driver 231A sequentially receives input of a target rotation angle or a target rotation speed of the tool spindle 30 centered on the X-axis direction from the control unit 50, and outputs a current according to the target rotation angle or the target rotation speed to the motor 232A. The motor 232A drives the tool spindle 30 to rotate around the X-axis direction. The motor 232A may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0065] The motor driver 231B sequentially receives an input of a target rotation angle or a target rotation speed of the tool spindle 30 about the axial direction of the tool spindle 30 as a rotation center from the control unit 50, and outputs a current according to the target rotation angle or the target rotation speed to the motor 232B. The motor 232B drives and rotates the tool spindle 30 about the axial direction of the tool spindle 30 as a rotation center. The motor 232B may be an AC motor, a stepping motor, a servo motor, or another type of motor.

[0066] The drive unit 240 is a drive mechanism for driving the tool rest 16 and the turret 18. The drive unit 240 may be composed of a single drive unit or a plurality of drive units. In the example of FIG. 6, the drive unit 240 is composed of motor drivers 241C, 241Y, 241Z and motors 242C, 242Y, 242Z.

[0067] The motor driver 241C receives an input of a target value regarding the turning angle of the turret 18 centered on the Z-axis direction, and outputs a current corresponding to the target value to the motor 242C. Thereby, the motor driver 241C controls the turning angle of the turret 18 with the Z-axis direction as the rotation center. The motor 242C may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0068] The motor driver 241Y sequentially receives from the control unit 50 an input of the target position of the tool rest 16 in the Y-axis direction, and outputs a current corresponding to the target position to the motor 242Y. Thereby, the motor 242Y moves the tool rest 16 to an arbitrary position in the Y-axis direction. The motor 242Y may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0069] The motor driver 241Z sequentially receives from the control unit 50 an input of the target position of the tool rest 16 in the Z-axis direction, and outputs a current corresponding to the target position to the motor 242Z. Thereby, the motor 242Z moves the tool rest 16 to an arbitrary position in the Z-axis direction. The motor 242Z may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0070] <F. Hardware Configuration of Control Unit 50> Next, with reference to FIG. 7, the hardware configuration of the control unit 50 shown in FIG. 6 will be described. FIG. 7 is a diagram showing an example of the hardware configuration of the control unit 50.

[0071] As described above, the control unit 50 may be a CNC or a PLC. Fig. 7 shows a hardware configuration of the control unit 50 as a CNC.

[0072] The control unit 50 includes, for example, a control circuit 101, a read only memory (ROM) 102, a random access memory (RAM) 103, a communication interface 104, and an auxiliary storage device 120. These components are connected to an internal bus 109.

[0073] The control circuit 101 is configured, for example, by at least one integrated circuit. The integrated circuit may be configured, for example, by at least one central processing unit (CPU), at least one graphics processing unit (GPU), at least one application specific integrated circuit (ASIC), at least one field programmable gate array (FPGA), or a combination thereof.

[0074] The control circuit 101 controls the operation of the control unit 50 by executing various programs such as a machining program 122. The machining program 122 is a program for realizing various processes described in this specification. Based on receiving an execution command for the machining program 122, the control circuit 101 reads the machining program 122 from the ROM 102 to the RAM 103. The RAM 103 functions as a working memory and temporarily stores various data required for executing the machining program 122.

[0075] The communication interface 104 is an interface for realizing communication with various devices. The processing device 100 communicates with various drive units (e.g., the above-mentioned drive units 210, 220, 230A, 230B, 240, etc.) for realizing additional processing of the workpiece, for example, via the communication interface 104.

[0076] The auxiliary storage device 120 is a storage medium such as a hard disk or a flash memory, for example. The auxiliary storage device 120 stores a processing program 122 and the like. The storage location of the processing program 122 is not limited to the auxiliary storage device 120, and may be stored in the storage area of the control circuit 101 (for example, cache memory), ROM 102, RAM 103, an external device (for example, a server), or the like.

[0077] Also, the processing program 122 may be provided incorporated into a part of an arbitrary program instead of as a single program. In this case, various processes according to the present embodiment are realized in cooperation with an arbitrary program. Even a program that does not include such a part of the module does not deviate from the gist of the processing program 122 according to the present embodiment. Further, part or all of the functions provided by the processing program 122 may be realized by dedicated hardware. Further, the control unit 50 may be configured in a form such as a so-called cloud service in which at least one server executes a part of the processing of the processing program 122.

[0078] <G. Control Flow of Simultaneous Processing> Next, with reference to FIG. 8, the control flow of simultaneous processing will be described. FIG. 8 is a flowchart showing the flow of the process related to the simultaneous processing shown in FIG. 4.

[0079] The process shown in FIG. 8 is realized, for example, when the control unit 50 of the processing device 100 executes the above-described processing program 122. In other aspects, part or all of the process may be executed by circuit elements or other hardware.

[0080] In step S112, the control unit 50 controls the above-described drive unit 210 (see FIG. 6) to start the rotation of the workpiece W.

[0081] In step S114, the control unit 50 starts simultaneous processing of the additional machining and the turning. At this time, the control unit 50 drives and feeds the laser head 140 and the tool rest 31 in the Z-axis direction at the same speed so that the additional machining point LP precedes the turning machining point TP. The control unit 50 also maintains the distance between the additional machining point LP and the turning machining point TP at a predetermined distance ΔD1 (see FIG. 4). The distance ΔD1 may be set in advance or may be arbitrarily set by the user.

[0082] In step S120, the control unit 50 determines whether or not the laser head 140 has reached a processing end position. The processing end position of the laser head 140 is described in the processing program 122, for example.

[0083] If the control unit 50 determines that the laser head 140 has reached the processing end position (YES in step S120), the control unit 50 switches the control to step S122. If not (NO in step S120), the control unit 50 executes the process of step S120 again.

[0084] In step S122, the control unit 50 stops the additional processing by the laser head 140. More specifically, the control unit 50 causes the laser head 140 to stop supplying the powder material and emitting the laser light.

[0085] In step S130, the control unit 50 determines whether or not the tool rest 31 has reached the machining end position. The machining end position of the tool rest 31 is described in the machining program 122, for example.

[0086] If the control unit 50 determines that the tool rest 31 has reached the machining end position (YES in step S130), the control proceeds to step S132. If not (NO in step S130), the control unit 50 executes the process of step S130 again.

[0087] In step S132, the control unit 50 stops the turning operation by the tool T. More specifically, the control unit 50 stops the rotation of the workpiece W on the workpiece spindle 22 and controls the drive of the tool rest 31 so as to separate the tool T from the workpiece W.

[0088] <H. Modification Example 1> Next, with reference to FIG. 9, a modification example of the simultaneous machining shown in FIG. 4 will be described.

[0089] In the example of FIG. 4 described above, the simultaneous machining was performed with the additional machining point LP ahead of the turning machining point TP. However, the simultaneous machining may be performed with the turning machining point TP ahead of the additional machining point LP.

[0090] FIG. 9 is a diagram schematically showing a mode of simultaneous machining according to Modification Example 1. In the example of FIG. 9, the machining apparatus 100 executes simultaneous machining with the turning machining point TP ahead of the additional machining point LP in the feed direction of the laser head 140 and the tool T. Also, in the example of FIG. 9, the turning machining point TP is ahead of the additional machining point LP by a distance ΔD2.

[0091] The distance ΔD2 is determined to be equal to or greater than the distance that the tool T or the laser head 140 moves in the Z-axis direction while the workpiece W makes a half rotation. As an example, when the tool T or the laser head 140 moves 0.2 mm in the feed direction while the workpiece W makes one rotation, the distance ΔD2 is determined to be 0.1 mm or more.

[0092] As a result, each location on the workpiece W is machined in the order of "turning machining → additional machining". By performing the turning machining first, the surface of the workpiece becomes a state suitable for the additional machining. As a result, the accuracy of the additional machining of the workpiece is improved.

[0093] <I. Control Flow of Simultaneous Machining According to Modification Example 1> Next, with reference to FIG. 10, the control flow of the simultaneous machining according to Modification Example 1 will be described. FIG. 10 is a flowchart showing the flow of processing related to the simultaneous machining shown in FIG. 9.

[0094] 10 is realized, for example, by the control unit 50 of the processing device 100 executing the above-mentioned processing program 122. In another aspect, a part or all of the processing may be executed by circuit elements or other hardware.

[0095] In step S212, the control unit 50 controls the above-mentioned drive unit 210 (see FIG. 6) to start rotating the workpiece W.

[0096] In step S214, the control unit 50 starts simultaneous processing of the additional machining and the turning. At this time, the control unit 50 drives and feeds the laser head 140 and the tool rest 31 in the Z-axis direction at the same speed so that the turning point TP precedes the additional machining point LP. The control unit 50 also maintains the distance between the turning point TP and the additional machining point LP at a predetermined distance ΔD2 (see FIG. 9). The distance ΔD2 may be set in advance or may be set arbitrarily by the user.

[0097] In step S220, the control unit 50 determines whether or not the tool rest 31 has reached the machining end position. The machining end position of the tool rest 31 is described in the machining program 122, for example.

[0098] If the control unit 50 determines that the tool rest 31 has reached the machining end position (YES in step S220), it switches control to step S222. If not (NO in step S220), the control unit 50 executes the process of step S220 again.

[0099] In step S222, the control unit 50 stops the turning process by the tool T. More specifically, the control unit 50 controls the driving of the tool rest 31 so as to move the tool T away from the workpiece W.

[0100] In step S230, the control unit 50 determines whether the laser head 140 has reached the machining end position. The machining end position related to the laser head 140 is described in the machining program 122, for example.

[0101] When the control unit 50 determines that the laser head 140 has reached the machining end position (YES in step S230), the control is switched to step S232. Otherwise (NO in step S230), the control unit 50 executes the process of step S230 again.

[0102] In step S232, the control unit 50 stops the additional machining by the laser head 140. More specifically, the control unit 50 stops the supply of the powder material and the irradiation of the laser beam to the laser head 140. Further, the control unit 50 stops the rotation of the workpiece W on the workpiece spindle 22.

[0103] <J. Modification Example 2> Next, the simultaneous machining according to Modification Example 2 will be described.

[0104] In the example of FIG. 4 described above, the simultaneous machining was performed with the additional machining point LP ahead of the turning machining point TP. Also, in the example of FIG. 9 described above, the simultaneous machining was performed with the turning machining point TP ahead of the additional machining point LP. In contrast, in this modification example, the machining apparatus 100 executes a combination of simultaneous machining with the additional machining point LP ahead of the turning machining point TP and simultaneous machining with the turning machining point TP ahead of the additional machining point LP.

[0105] More specifically, first, the control unit 50 executes the simultaneous machining with the turning machining point TP ahead of the additional machining point LP. Next, based on the turning machining point TP reaching the machining end position, the control unit 50 returns the tool rest 31 to the machining start position. Thereafter, the control unit 50 executes the simultaneous machining with the additional machining point LP ahead of the turning machining point TP.

[0106] Next, based on the fact that the additional machining point LP has reached the machining end position, the control unit 50 returns the laser head 140 to the machining start position. Then, the control unit 50 executes simultaneous machining with the turning machining point TP ahead of the additional machining point LP.

[0107] As described above, in this modified example, the machining apparatus 100 alternately repeats the simultaneous machining in which the turning machining point TP is ahead of the additional machining point LP and the simultaneous machining in which the additional machining point LP is ahead of the turning machining point TP.

[0108] <K. Modified Example 3> Next, with reference to FIG. 11, the simultaneous machining according to Modified Example 3 will be described. FIG. 11 is a diagram schematically showing the mode of the simultaneous machining according to Modified Example 3.

[0109] In this modified example, the machining apparatus 100 further includes a discharge mechanism 60 for discharging a fluid onto the workpiece W. Then, the machining apparatus 100 executes simultaneous machining while discharging the fluid onto the workpiece W. Thereby, the machining apparatus 100 can cool the workpiece W that has been heated by the additional machining.

[0110] Note that the fluid discharged by the discharge mechanism 60 may be air, may be a coolant, or may be other types of gases or liquids. When the coolant is used for cooling the workpiece W, the machining apparatus 100 can more efficiently lower the temperature of the workpiece W and suppress a decrease in machining accuracy due to temperature changes. On the other hand, when air is used for cooling the workpiece W, a decrease in machining accuracy due to liquid adhering to the workpiece surface can be suppressed.

[0111] The discharge mechanism 60 is configured to be drivable in the Z-axis direction. As an example, the discharge mechanism 60 is provided on the tool post 31 and is fed and driven integrally with the tool post 31. As another example, the drive unit (not shown) of the discharge mechanism 60 is provided in the machining apparatus 100 separately from the drive unit 240 (see FIG. 6) of the tool post 31. The drive unit of the discharge mechanism 60 is configured to be able to drive the discharge mechanism 60 at least in the Z-axis direction.

[0112] The machining device 100 performs simultaneous machining while driving the discharge mechanism 60, the laser head 140, and the tool T to one side in the Z-axis direction at the same speed. At this time, the simultaneous machining is performed in a state where the additional machining point LP precedes the fluid discharge point AP for the workpiece W, and the discharge point AP precedes the turning machining point TP. As a result, each point on the workpiece W is machined in the order of "additional machining → fluid discharge → turning machining."

[0113] This allows the processing device 100 to perform turning after more reliably lowering the temperature of the workpiece W. As a result, the processing device 100 can suppress wear of the tool T due to heat. In addition, the processing device 100 can perform turning in a state in which the workpiece W is not expanded, and can avoid a decrease in processing accuracy.

[0114] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0115] 11 bed, 16 tool rest, 18 turret, 22 work spindle, 23 chuck mechanism, 25 tailstock, 30 tool spindle, 31 tool rest, 50 control unit, 60 discharge mechanism, 100 machining device, 101 control circuit, 102 ROM, 103 RAM, 104 communication interface, 109 internal bus, 120 auxiliary storage device, 122 machining program, 130 cover body, 140 laser head, 142 head body, 146 laser nozzle, 200 operation panel, 210 drive unit, 211C motor driver, 212C motor, 220 drive unit, 221Z motor driver, 222Z motor, 230A drive unit, 230B drive unit, 231A motor driver, 231B motor driver, 231X motor driver, 231Y Motor driver, 231Z motor driver, 232A motor, 232B motor, 232X motor, 232Y motor, 232Z motor, 240 drive unit, 241C motor driver, 241Y motor driver, 241Z motor driver, 242C motor, 242Y motor, 242Z motor, AP discharge point, AR processing area, AX1 axis, AX2 axis, AX3 axis, CP rotation center, DR door, LP additional processing point, LS laser light, MP molten pool, PM powder material, SL layer, T tool, TP turning processing point, W workpiece.

Claims

1. A method for machining a workpiece by a machining device, comprising: The processing device includes: A work spindle for rotating the work; A laser head capable of supplying powder material to the workpiece and performing additional processing by irradiating the workpiece with laser light; a tool rest for holding a tool, The processing method includes: Rotating the workpiece on the workpiece spindle; A step of performing simultaneous machining in which an additional machining process using the laser head and a turning process using the tool are performed simultaneously on the rotating workpiece, The simultaneous machining is performed in a state in which the laser head and the tool are driven to feed to one side in the rotational axis direction of the work spindle, and the additional machining point of the workpiece by the laser head and the turning machining point of the workpiece by the tool are separated by a predetermined distance or more in the rotational axis direction.

2. The machining method according to claim 1 , wherein the simultaneous machining is performed in a state where the additional machining point precedes the turning machining point on the one side.

3. The machining method according to claim 1 , wherein the simultaneous machining is performed in a state where the turning point precedes the additional machining point on the one side.

4. The processing method according to any one of claims 1 to 3, wherein the additional processing point, the rotation center of the workpiece, and the turning processing point are arranged in the order of the additional processing point, the rotation center of the workpiece, and the turning processing point when viewed from the rotation axis direction.

5. The processing apparatus further includes a discharge mechanism for discharging a fluid onto the workpiece, The machining method according to claim 1 , wherein the simultaneous machining is performed while the fluid is being discharged onto the workpiece.

6. The method of claim 5 , wherein the fluid is air or a coolant.

7. The machining method according to claim 5, wherein the simultaneous machining is performed in a state in which the additional machining point on the one side precedes the discharge point of the fluid onto the workpiece, and the discharge point on the one side precedes the turning machining point.

8. A workpiece processing device, A work spindle for rotating the work; A laser head capable of supplying powder material to the workpiece and performing additional processing by irradiating the workpiece with laser light; a tool rest for holding a tool; A control unit for controlling the processing device, The control unit is A process of rotating the workpiece on the workpiece spindle; a process of performing simultaneous machining in which the additional machining by the laser head and the turning by the tool are performed simultaneously on the rotating workpiece; The simultaneous machining is performed by a machining apparatus in which the laser head and the tool are driven to feed to one side in the rotational axis direction of the work spindle, and the additional machining point of the workpiece by the laser head and the turning machining point of the workpiece by the tool are separated by a predetermined distance or more in the rotational axis direction.

9. A machining program executed by a workpiece machining device, The processing device includes: A work spindle for rotating the work; A laser head capable of supplying powder material to the workpiece and performing additional processing by irradiating the workpiece with laser light; a tool rest for holding a tool, The processing program is for the processing device. Rotating the workpiece on the workpiece spindle; a step of performing simultaneous machining in which the additional machining by the laser head and the turning by the tool are performed simultaneously on the rotating workpiece; The simultaneous machining is performed in a machining program in which the laser head and the tool are driven to feed to one side in the rotational axis direction of the work spindle, and the additional machining point of the workpiece by the laser head and the turning machining point of the workpiece by the tool are separated by a predetermined distance or more in the rotational axis direction.

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