Server cooling device

Abstract

To provide a server cooling device which offers improved cooling efficiency while minimizing the amount of coolant used.SOLUTION: A server cooling device of the present invention comprises a case for accommodating a server comprising electronic parts mounted on an electronic circuit board, and a supply nozzle for dripping an insulating coolant to supply the coolant toward the server accommodated in the case. A rear face of the case in a front-rear direction is provided with a discharge port for discharging the coolant form inside the case, and a bottom end height of the discharge port is adjusted to control the liquid level of the coolant inside the case.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a server cooling device. [Background technology]

[0002] Patent Document 1 discloses a server cooling device that sprays a cooling liquid from above the server, thereby increasing the cooling efficiency of the server with a small amount of cooling liquid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-153240 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the server cooling device disclosed in Patent Document 1, the sprayed cooling liquid flows over the server surface and is then discharged as is, so the time that the cooling liquid remains on the server surface is short and the cooling efficiency is low.

[0005] The present invention has been made in consideration of the above problems, and an object of the present invention is to provide a server cooling device that can increase cooling efficiency while reducing the amount of coolant used. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the server cooling device of the present invention is a server cooling device comprising a case for housing a server having electronic components mounted on an electronic board, and a supply nozzle for dripping and supplying an insulating cooling liquid toward the server housed in the case, wherein an outlet for discharging the cooling liquid from within the case is provided on the rear surface in the fore-and-aft direction of the case, and the liquid level of the cooling liquid within the case is controlled by adjusting the height of the bottom end of the outlet. Effect of the Invention

[0007] The server cooling device according to the present invention has an advantageous effect of increasing the amount of coolant that comes into contact with electronic components, which are heat-generating devices, while reducing the amount of coolant used, thereby improving cooling efficiency. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view that illustrates a schematic configuration of a server cooling device according to an embodiment. [Diagram 2] FIG. 2 is a side view that illustrates a schematic configuration of the server cooling device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a server cooling device according to the present invention will be described, however, the present invention is not limited to the embodiment.

[0010] Fig. 1 is a perspective view showing a schematic configuration of a server cooling device 100 according to an embodiment. Fig. 2 is a side view showing a schematic configuration of the server cooling device 100 according to an embodiment.

[0011] As shown in Figures 1 and 2, the server cooling device 100 of the embodiment is composed of cases 2A, 2B, 2C for housing servers 1A, 1B, 1C respectively, supply nozzles 5A, 5B, 5C, liquid delivery piping 6, cooling liquid 10, supply piping 61A, 61B, 61C, rack 101, oil pan 102, pump 103, and heat exchange device 104.

[0012] A plurality of servers 1A, 1B, 1C to be cooled by the server cooling device 100 according to the embodiment are housed in cases 2A, 2B, 2C, stacked and arranged in the height direction (vertical direction) of a rack 101. Note that support members such as stays that support the cases 2A, 2B, 2C on the rack 101 are not shown in Figures 1 and 2.

[0013] The servers 1A, 1B, and 1C are configured by providing electronic boards 3A, 3B, and 3C in server housings 11A, 11B, and 11C, respectively. The server housings 11A, 11B, and 11C are box-shaped with an open top and rear (back) surface. Electronic components 31A, 31B, and 31C are provided on the electronic boards 3A, 3B, and 3C. In this embodiment, the electronic components 31A, 31B, and 31C are heat-generating devices that generate heat when powered on.

[0014] The servers 1A, 1B, and 1C are housed in box-shaped cases 2A, 2B, and 2C, respectively. The tops of the cases 2A, 2B, and 2C are open, and insulating coolant 10 is dripped and supplied from supply nozzles 5A, 5B, and 5C toward the servers 1A, 1B, and 1C housed in the cases 2A, 2B, and 2C from above the cases 2A, 2B, and 2C. The supply nozzles 5A, 5B, and 5C are provided corresponding to the servers 1A, 1B, and 1C, respectively. The number of supply nozzles 5A, 5B, and 5C is not limited to one each corresponding to the servers 1A, 1B, and 1C, and a plurality of supply nozzles may be provided corresponding to each of the servers.

[0015] The rear surfaces (rear surfaces) 22A, 22b, 22C in the front-rear direction of the cases 2A, 2B, 2C are provided with outlets 220A, 220B, 220C for discharging the cooling liquid 10. As a result, the cooling liquid 10 does not accumulate in the cases 2A, 2B, 2C, but is discharged from the outlets 220A, 220B, 220C and falls into the oil pan 102 installed at the bottom of the rack 101. The oil pan 102 also functions as a reservoir tank for temporarily storing the cooling liquid 10. The cooling liquid 10 stored in the oil pan 102 passes through the liquid supply pipe 6, is sucked up by the pump 103, and is cooled by dissipating heat in the heat exchanger 104. After that, the cooling liquid 10 stored in the oil pan 102 is sent again to the supply nozzles 5A, 5B, 5C through the supply pipes 61A, 61B, 61C branched from the liquid supply pipe 6, and is recycled.

[0016] The servers 1A, 1B, 1C and the cases 2A, 2B, 2C are arranged separate from the supply pipes 61A, 61B, 61C, and the servers 1A, 1B, 1C and the cases 2A, 2B, 2C are structured so that they can be easily removed from the rack 101.

[0017] In the server cooling device 100 according to the embodiment, the supply nozzles 5A, 5B, 5C are arranged to drip the coolant 10 near the front faces 21A, 21B, 21C in the front-rear direction of the cases 2A, 2B, 2C. This makes it easier for the coolant 10 to flow over a wide range on the electronic boards 3A, 3B, 3C of the servers 1A, 1B, 1C from the front faces 21A, 21B, 21C toward the rear faces (rear faces) 22A, 22B, 22C in the front-rear direction of the cases 2A, 2B, 2C toward the outlets 220A, 220B, 220C. In the server cooling device 100 according to the embodiment, by creating a flow of coolant 10 over the electronic boards 3A, 3B, 3C of the servers 1A, 1B, 1C, the cooling effect of the electronic components 31A, 31B, 31C provided on the electronic boards 3A, 3B, 3C is improved, and the electronic components 31A, 31B, 31C can be cooled with a small amount of coolant 10.

[0018] In the server cooling device 100 according to the embodiment, the liquid level of the cooling liquid 10 in the cases 2A, 2B, 2C is controlled by adjusting the lower end heights hA, hB, hC of the exhaust ports 220A, 220B, 220C in the rear faces (back faces) 22A, 22B, 22C of the cases 2A, 2B, 2C (the distance from the bottom face of the cases 2A, 2B, C to the lower end of the opening in the exhaust port 220A, 220B, 220C in the height direction of the rack 101). Specifically, the lower end heights hA, hB, hC of the exhaust ports 220A, 220B, 220C are adjusted so that at least a part of the electronic components 31A, 31B, 31C on the electronic boards 3A, 3B, 3C is immersed in the cooling liquid 10, thereby controlling the liquid level of the cooling liquid 10 in the cases 2A, 2B, 2C. As a result, in the server cooling device 100 of the embodiment, the servers 1A, 1B, 1C are cooled by supplying the smallest possible amount of cooling liquid 10 to the servers 1A, 1B, 1C without submerging the entire servers 1A, 1B, 1C in an immersion tank, thereby significantly reducing the amount of cooling liquid 10 used.

[0019] Furthermore, in the server cooling device 100 according to the embodiment, the liquid level of the coolant 10 in the cases 2A, 2B, 2C is set to the required level, thereby minimizing the amount of the coolant 10 used while increasing the amount of the coolant 10 that comes into contact with the electronic components 31A, 31B, 31C, which are heat-generating devices, thereby suppressing the temperature rise of the electronic components 31A, 31B, 31C.

[0020] Furthermore, in the server cooling device 100 of the embodiment, even if the servers 1A, 1B, 1C are different sizes, appropriate cooling can be achieved by adjusting the lower end heights hA, hB, hC of the exhaust outlets 220A, 220B, 220C according to the dimensions of the servers 1A, 1B, 1C (electronic components 31A, 31B, 31C).

[0021] Furthermore, the server cooling device 100 according to the embodiment is not limited to a configuration in which the cases 2A, 2B, and 2C that respectively house the servers 1A, 1B, and 1C are stacked in the height direction (vertical direction) of the rack 101. That is, the server cooling device 100 according to the embodiment can also be applied to a configuration in which the cases 2A, 2B, and 2C that respectively house the servers 1A, 1B, and 1C are arranged side by side in the width direction or front-rear direction perpendicular to the height direction (vertical direction) of the rack 101.

[0022] 1A, 1B, 1C Server 2A, 2B, 2C Case 3A,3B,3C Electronic board 5A, 5B, 5C Supply nozzle 31A, 31B, 31C Electronic Components 220A,220B,220C outlet

Claims

[Claim 1] a case for housing a server having electronic components mounted on an electronic board; a supply nozzle that supplies a cooling liquid having insulating properties by dripping it toward the server housed in the case; A server cooling device comprising: a drain port for draining the cooling liquid from inside the case is provided on a rear surface of the case in the front-rear direction, A server cooling device, characterized in that the liquid level of the cooling liquid in the case is controlled by adjusting the height of the bottom end of the outlet.

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