Mounting board manufacturing system, mounting data creation device, and mounting data creation method

Abstract

To provide a mounting board manufacturing system capable of properly distributing components to multiple component mounting devices considering the operation mode of component mounting devices, a mounting data creation device, and a mounting data creation method.SOLUTION: An operation unit of each of multiple component mounting devices placed in a mounting line is capable of performing the mounting work of components to be mounted onto the board in one operation mode selected from multiple operation modes. The operation unit preferentially assigns components with high implementation difficulty to operation units that are scheduled to install components in high-precision mode (ST13) and creates mounting data (ST15).SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a mounting board manufacturing system including a mounting data creation device that creates mounting data, a mounting data creation device, and a mounting data creation method. [Background technology]

[0002] The component mounting device mounts components on the board according to the component mounting order and mounting work conditions defined in the mounting data. Since the efficiency of the mounting work of the component mounting device varies depending on the component mounting order, etc., a method for creating mounting data that allows efficient manufacturing of mounted boards has been proposed (for example, see Patent Document 1). Patent Document 1 discloses a method for improving production efficiency by optimizing the types of components allocated to the movable component supplying body and the immovable component supplying body in a component mounting device in which a movable component supplying body and a placement table on which components are transferred from an immovable component supplying body move alternately to a component supplying position accessible to a mounting head to supply components. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2000-36699 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, there are cases where an operation mode in which the moving speed of the mounting head differs depending on the type of component to be mounted, the distance between adjacent components, etc. is selected to have the component mounting device perform the mounting task. In this case, in a mounting line that includes multiple component mounting devices, it is necessary to allocate the type of components to each component mounting device while taking into account the operation mode of the component mounting device, and there is room for further improvement in order to create mounting data taking into account the quality of the mounted board and production efficiency.

[0005] Therefore, an object of the present invention is to provide a mounting board manufacturing system, a mounting data creation device, and a mounting data creation method that can appropriately allocate components to multiple component mounting devices while taking into account the operating mode of the component mounting devices. [Means for solving the problem]

[0006] The mounted board manufacturing system of the present invention is a mounted board manufacturing system including a mounting line including a plurality of component mounting devices having work units that mount components on a board, and a mounting data creation device that creates mounting data for operating the work units, wherein the work units are capable of performing component mounting work in one operating mode selected from a plurality of operating modes, and the data creation device creates mounting data by preferentially allocating components with high mounting difficulty to work units scheduled to perform component mounting work in a high precision mode.

[0007] The mounting data creation device of the present invention is a mounting data creation device that creates mounting data for operating an operation unit that mounts components onto a board from a plurality of component mounting devices arranged on a mounting line that manufactures mounted boards equipped with components, the operation unit being capable of performing component mounting work in one operation mode selected from a plurality of operation modes, and creating mounting data by preferentially allocating components with a high mounting difficulty to an operation unit scheduled to perform component mounting work in a high precision mode.

[0008] The mounting data creation method of the present invention is a method for creating mounting data for operating an operational unit that mounts components onto a board from a plurality of component mounting devices arranged on a mounting line that manufactures mounted boards equipped with components, the operational unit being capable of performing component mounting work in one operating mode selected from a plurality of operating modes, and creating mounting data by preferentially allocating components with a high mounting difficulty to an operational unit scheduled to perform component mounting work in a high precision mode. Effect of the Invention

[0009] According to the present invention, components can be appropriately allocated to a plurality of component mounting devices in consideration of the operation modes of the component mounting devices. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a configuration explanatory diagram of a mounting board manufacturing system according to an embodiment of the present invention; [Diagram 2] FIG. 1 is a plan view showing a schematic structure of a component mounting device provided in a mounting board manufacturing system according to an embodiment of the present invention; [Diagram 3] FIG. 1 is an explanatory diagram of the functions of the main parts of a component mounting device provided in a mounting board manufacturing system according to an embodiment of the present invention; [Figure 4] FIG. 1 is a flow diagram of a method for creating mounting data according to an embodiment of the present invention; [Diagram 5] FIG. 2 is a flow diagram of a process for creating mounting data according to an embodiment of the present invention; [Figure 6] 1A, 1B, and 1C are explanatory diagrams of steps in a process for creating mounting data according to an embodiment of the present invention; [Figure 7] FIG. 1 is a flow chart of another embodiment of a method for creating mounting data according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of the mounting board manufacturing system, the upper system, the mounting line, the component mounting device, etc. In the following, the same reference numerals are used for corresponding elements in all the drawings, and duplicated explanations are omitted. In FIG. 2 and in a part described later, the X-axis (left-right direction in FIG. 2) in the substrate transport direction and the Y-axis (up-down direction in FIG. 2) perpendicular to the substrate transport direction are shown as two axes perpendicular to each other in the horizontal plane. In FIG. 3 and in a part described later, the Z-axis (up-down direction in FIG. 3) is shown as the height direction perpendicular to the horizontal plane.

[0012] First, the configuration of a mounted board manufacturing system 1 will be described with reference to Fig. 1. The mounted board manufacturing system is configured such that the work equipment constituting one mounting line L is connected via a communication network 2 and managed by a host system C. Note that the number of mounting lines L provided in the mounted board manufacturing system 1 does not need to be one, and two or more lines may be provided. In this case, the host system C manages the two or more mounting lines L.

[0013] The mounting line L is configured by connecting in series, from upstream (left side of the drawing) to downstream (right side of the drawing) in the board transport direction, work equipment that performs work on boards, such as a board supplying device M1, a screen printing device M2, a first inspection device M3, component mounting devices M4-M6, a second inspection device M7, a reflow device M8, a third inspection device M9, and a board removal device M10. The mounting line L has the function of mounting components on boards to produce mounted boards. Note that the mounting line L is a group of work equipment connected via a communication network 2, and the work equipment does not have to be physically connected to each other.

[0014] 1, board supplying device M1 has a storage unit such as a rack for storing multiple boards, and performs a board supplying operation to supply boards taken out of the storage unit to downstream equipment. Screen printing device M2 performs a solder printing operation to print solder paste on boards brought in by a board transport unit from the upstream side through a screen mask attached to the printing operation unit.

[0015] The first inspection device M3 performs a print inspection operation to inspect the state of the solder printed on the board using a print inspection operation unit including a solder inspection camera and various sensors. The inspection results including the surface state of the board on which the solder is deposited inspected by the first inspection device M3 are transmitted to the upper system C.

[0016] 1, component mounting devices M4-M6 have a work unit that performs mounting work by using a suction nozzle attached to a work head to pick up components supplied by a component supply unit such as a tape feeder or tray feeder and mount them on a board printed with solder. The mounting line L is not limited to a configuration of three component mounting devices M4-M6, and may have one, two, or four or more component mounting devices M4-M6.

[0017] The second inspection device M7 performs a mounting inspection operation in which a mounting inspection work section including a mounting inspection camera inspects the position and state of components mounted on the board. The inspection results, including mounting errors where components are not mounted in the specified positions on the board inspected by the second inspection device M7, are sent to the higher-level system C. The reflow device M8 performs a board heating operation in which the board carried into the device is heated by a board heating section, the solder on the board is melted and solidified, and the electrodes (lands) of the board are joined to the terminals (leads) of the components.

[0018] 1, the third inspection device M9 performs a reflow inspection operation in which a reflow inspection work unit including a reflow inspection camera inspects the position and state of the components mounted on the board after reflow. The inspection results including the state of the components after reflow inspected by the third inspection device M9 are transmitted to the higher-level system C. The board recovery device M10 has a storage unit such as a rack that stores multiple boards, and performs a board recovery operation in which it receives boards unloaded by an upstream device and recovers them in the storage unit.

[0019] Here, the detailed configuration of the component mounting devices M4 to M6 will be described with reference to Figs. 2 and 3. Fig. 3 is an explanatory diagram of the function of the main parts of the first working unit W1 on the front side. At the center of the upper part of the base 6, a first board transport lane L1 is arranged on the front side in the Y-axis direction, and a second board transport lane L2 is arranged on the rear side. The first board transport lane L1 is provided with a pair of first board transport conveyors K1 that transport the board 7 along the X-axis. The second board transport lane L2 is provided with a pair of second board transport conveyors K2 that transport the board 7 along the X-axis.

[0020] A first component supply section S1 is disposed in front of the first board transport lane L1. A second component supply section S2 is disposed in rear of the second board transport lane L2. A plurality of component supply units 8 (tape feeders) are attached to the upper portions of the first component supply section S1 and the second component supply section S2. The component supply units 8 feed the carrier tape holding the components by pitch feeding to supply them to the pickup position. In this manner, the first component supply section S1 and the second component supply section S2 are each provided with a plurality of component supply positions P (see FIG. 6(a)) where the component supply units 8 are attached.

[0021] 2 and 3, a Y-axis table 9 equipped with a linear drive mechanism is arranged along the Y-axis direction at both ends in the X-axis direction on the upper surface of the base 6. A first X-axis beam 10A equipped with a linear drive mechanism on the front side is connected to the Y-axis table 9 so as to be movable back and forth (arrow a) along the Y-axis direction. In addition, a second X-axis beam 10B equipped with a linear drive mechanism on the rear side is connected to the Y-axis table 9 so as to be movable back and forth along the Y-axis direction. The first X-axis beam 10A and the second X-axis beam 10B are arranged along the X-axis direction.

[0022] A first work head H1 that moves left and right (arrow b) along the X-axis direction is connected to the first X-axis beam B1. A second work head H2 that moves left and right along the X-axis direction is connected to the second X-axis beam B2.

[0023] 3, the first working head H1 and the second working head H2 are equipped with multiple suction nozzles 11 that hold components at their lower ends. The first working head H1 and the second working head H2 raise and lower the suction nozzles 11 along the Z axis (arrow c) and rotate the suction nozzles 11 around the Z axis.

[0024] 2 and 3, the first working head H1 moves horizontally (X-axis direction, Y-axis direction) by a linear drive mechanism, holds a component supplied to a pickup position by the component supply unit 8, and mounts it on the board 7 (arrow d). The Y-axis table 9 and the first X-axis table 6A constitute a first working head moving mechanism 12A that moves the first working head H1 at least from above the first component supply unit S1 within a first area A1 above the second board transport lane L2. The first working head H1 and the first working head moving mechanism 12A constitute a first working unit W1.

[0025] The second work head H2 moves horizontally (in the X-axis and Y-axis directions) by a linear drive mechanism, holds components supplied to the pickup position by component supply unit 8, and mounts them on board 7. The Y-axis table 9 and second X-axis table 6B constitute a second work head moving mechanism 12B that moves the second work head H2 at least from above the second component supply unit S2 within the second area A2 above the first board transport lane L1. The second work head H2 and the second work head moving mechanism 12B constitute a second work unit W2.

[0026] Hereinafter, unless there is a need to distinguish between them, the first working unit W1 and the second working unit W2 will be referred to simply as "working unit W." The working units W mount components on boards 7 held in the board transport sections (first board transport lane L1, second board transport lane L2). Note that the component mounting devices M4 to M6 are not limited to a configuration having two board transport sections (first board transport lane L1, second board transport lane L2) and two working units W, and may be configured to have one board transport section and one working unit W.

[0027] 2, a control unit 13 is disposed on the base 6. The control unit 13 controls the first board transport conveyor K1, the second board transport conveyor K2, the work unit W, and the component supply unit 8 to perform a component mounting operation for mounting components on the board 7 transported by the first board transport lane L1 or the second board transport lane L2.

[0028] The work unit W can perform component mounting work in multiple operation modes, including a standard operation mode (standard mode) that emphasizes productivity, and a high-precision operation mode (high-precision mode) in which the speed and acceleration of the suction nozzle 11 and work heads (first work head H1, second work head H2) are lower than in the standard mode to improve mounting accuracy. For example, in the high-precision mode, speed and acceleration are applied that are obtained by multiplying the operation parameters of the speed and acceleration of the suction nozzle 11 and work heads included in the mounting data by a predetermined coefficient. Note that mounting data with different operation parameters may be prepared for the standard mode and the high-precision mode.

[0029] The working unit W is capable of performing a component mounting operation in one operation mode selected from a plurality of operation modes. The control unit 13 causes the working unit W to perform a component mounting operation in one operation mode selected from a plurality of operation modes. If the component mounting devices M4-M6 have multiple operation units W, the multiple operation units W of the component mounting devices M4-M6 may be set to the same operation mode. This makes it possible to prevent a decrease in mounting accuracy due to the operation of the other working unit W, even if the first working unit W1 and the second working unit W2 are manufacturing different types of mounting boards.

[0030] 1, the host system C has a function of creating data and parameters necessary for the operation of the work equipment of the mounting line L and transmitting them to each piece of work equipment. The host system C is configured with an information processing device 3, a mounting data creation device 4, a storage device 5, etc.

[0031] The storage device 5 stores line configuration information related to the configuration of the mounting line L, equipment information related to the component mounting devices M4 to M6 that constitute the mounting line L, which is necessary for creating mounting data, and production data of mounted boards scheduled to be produced on the mounting line L. The production data includes board data of the mounted boards and component data of the components to be mounted on the mounted boards. The board data includes information such as the board size, the type of component to be mounted (component name) and mounting position (XY coordinates), and reference mark position (XY coordinates) for each type of mounted board. The component data includes information such as component specification information (shape, dimensions, etc.) for each component name, and operation parameters (speed, acceleration, etc.) of the work unit W.

[0032] 1, the mounting data creation device 4 has a function of creating mounting data for operating the working units W of the component mounting devices M4-M6 equipped in the mounting line L to manufacture mounted boards. The mounting data includes the component mounting order, the component supply positions (set positions of the component supply units 8), the component mounting positions (XY coordinates), operation parameters, etc. Furthermore, the mounting data includes information regarding the operation mode of the operation units W (operation mode setting information). The information processing device 3 has a function of storing the mounting data created by the mounting data creation device 4 and transmitting the stored mounting data to the corresponding component mounting devices M4-M6.

[0033] Thus, the mounting board manufacturing system 1 includes a mounting line L including a plurality of component mounting devices M4-M6 each having a work unit W that mounts components on a board 7, and a mounting data creation device 4 that creates mounting data for operating the work unit W.

[0034] 1, a description will be given of the functions of the mounting data creation device 4 provided in the higher-level system C. The mounting data creation device 4 creates mounting data for operating the work units W of the multiple component mounting devices M4 to M6 arranged on the mounting line L, based on the production data, line configuration information, and equipment information stored in the storage device 5.

[0035] Specifically, the mounting data creation device 4 extracts the names of the components to be mounted on the mounting board from the production data, the types of component mounting devices M4-M6 that make up the mounting line L from the line configuration information, and the types and numbers of component supply units 8 that can be attached to the component mounting devices M4-M6 from the equipment information. Next, the mounting data creation device 4 assigns the components to be mounted on the mounting board to each of the component mounting devices M4-M6. Next, the mounting data creation device 4 determines the component placement (placement at the component supply position P of the component supply unit 8) that will increase the efficiency of component mounting work in each of the component mounting devices M4-M6, and creates mounting data for each work unit W of the component mounting devices M4-M6.

[0036] 1, mounting data creation device 4 allocates components to each of component mounting devices M4-M6 taking into consideration the mounting difficulty of the components to be mounted on the mounting board and the operation mode of operation unit W. For example, components with small component dimensions or components with a short distance (adjacent distance) from other adjacent components have a high mounting difficulty, and need to be mounted on board 7 by operation unit W in a high-precision operation mode with high mounting accuracy. Similarly, components with a small allowable misalignment dimension of the component terminals (leads) relative to the electrodes (lands) of board 7 also have a high mounting difficulty, and need to be mounted in a high-precision operation mode.

[0037] Mounting data creation device 4 determines the mounting difficulty of each component from at least one of the component names, component dimensions, component adjacent distances calculated from the component mounting coordinates and component dimensions, and allowable misalignment dimensions of the component terminals (leads) relative to the electrodes (lands) of substrate 7, contained in the production data of the mounted boards to be produced, and extracts components with high mounting difficulty. Then, mounting data creation device 4 creates mounting data by preferentially allocating components with high mounting difficulty to work units W that are scheduled to perform component mounting work in high precision mode.

[0038] 1, when the operation modes of the working units W of the component mounting devices M4-M6 equipped in the mounting line L are not determined, the mounting data creation device 4 assumes a plurality of operation mode setting patterns of the working units W which are combinations of the operation modes of each of the component mounting devices M4-M6. Then, the mounting data creation device 4 creates mounting data for each assumed operation mode setting pattern, evaluates the created mounting data by simulation, and registers the mounting data with favorable evaluation results as the official mounting data. For example, the mounting data creation device 4 evaluates by simulation the number of components mounted per hour (production capacity) when the mounting data is applied to the component mounting devices M4-M6.

[0039] Next, following the flows of Fig. 4 and Fig. 5, and with reference to Fig. 6, a mounting data creation method for creating mounting data for operating the work units W of the multiple component mounting devices M4-M6 arranged on the mounting line L will be described. In Fig. 4, first, the mounting data creation device 4 acquires production data of one mounting board to be produced from the storage device 5 (ST1: production data acquisition step). Note that in the production data acquisition step (ST1), the mounting data creation device 4 may acquire production data of multiple mounting boards. In this case, the created mounting data corresponds to the production of multiple mounting boards.

[0040] Next, the mounting data creation device 4 acquires line configuration information and equipment information from the storage device 5 (ST2: first information acquisition step). Next, the mounting data creation device 4 assumes a plurality of operation mode setting patterns that combine the operation modes of the work units W of the component mounting devices M4-M6 arranged on the mounting line L based on the line configuration information (ST3: operation mode setting pattern assumption step). For example, operation mode setting patterns are assumed in which the number of work units W set in high precision mode is varied between 0 and 6.

[0041] In FIG. 4, next, the mounting data creation device 4 selects one operation mode setting pattern from among a plurality of assumed operation mode setting patterns (ST4: operation mode setting pattern selection process). An example in which the operation mode setting pattern shown in FIG. 6 is selected will be described below. In the example shown in FIG. 6, the two work units W (the first work unit W1 and the second work unit W2) of the component mounting devices M4 to M6 are set to the same operation mode. That is, an operation mode setting pattern is selected in which the high-precision mode is set for the two work units W of the first component mounting device M4, the standard mode is set for the two work units W of the second component mounting device M5, and the standard mode is set for the two work units W of the third component mounting device M6.

[0042] Next, the mounting data creating device 4 executes a process of creating mounting data for the selected operation mode setting pattern (ST5: mounting data creating process).

[0043] 5, in the mounting data creation processing step (ST5), first, the mounting data creation device 4 determines whether or not there is an operation unit W in high precision mode on the component mounting devices M4 to M6 on the mounting line L (ST11: first high precision mode determination step). In the example of FIG 6, since the operation unit W of the component mounting device M4 is in high precision mode, it is determined in the first high precision mode determination step (ST11) that there is an operation unit W in high precision mode.

[0044] When it is determined that there is a work unit W in high-precision mode (ST11: Yes), the mounting data creation device 4 extracts components with high mounting difficulty from the production data (ST12: mounting difficulty extraction process). Next, the mounting data creation device 4 preferentially assigns components with high mounting difficulty to work units W that are scheduled to perform component mounting work in high-precision mode (ST13: priority assignment process).

[0045] In the example of Fig. 6(b), ten components are extracted as components (component names) with high mounting difficulty. Seven of these are assigned to component placement device M4, which has a high-precision mode operation unit W. The remaining three components cannot be assigned to component placement device M4, and two are assigned to component placement device M5, which has a standard mode operation unit W, and one is assigned to component placement device M6.

[0046] In FIG. 5, if it is determined in the first high-precision mode determination process (ST11) that there is no work unit W in high-precision mode ("NO" in ST11), or if there is a work unit W in high-precision mode ("YES" in ST11) and the priority allocation process (ST13) is completed, the mounting data creation device 4 allocates the remaining components with low mounting difficulty to component mounting devices M4 to M6 (ST14: standard allocation process).

[0047] In the example of FIG. 6(c), there are 30 remaining components that are not difficult to mount. Of these, 5 are allocated to component mounting device M4, 12 to component mounting device M5, and 13 to component mounting device M6. When allocating the remaining components that are not difficult to mount to component mounting devices M4 to M6, the mounting data creation device 4 preferentially allocates the components to component mounting devices M5 and M6 that have working units W in a standard mode that emphasizes productivity. This increases the manufacturing efficiency of mounted boards on the mounting line L. The remaining components may be allocated to component mounting devices M4 to M6 taking into consideration other factors such as line balance.

[0048] In FIG. 5, next, mounting data creation device 4 creates mounting data corresponding to the arrangement of the allocated components for each of operation units W of component mounting devices M4 to M6 (ST15: mounting data creation step).

[0049] 4, the mounting data creation device 4 then evaluates the production capacity of the mounting line L to which the created mounting data is applied by simulation (ST6: evaluation step). Next, if there is an unselected operation mode setting pattern ("Yes" in ST7), the mounting data creation device 4 selects one operation mode setting pattern from the unselected operation mode setting patterns (ST8: unselected operation mode setting pattern selection step). Next, the process returns to the mounting data creation process (ST5), and mounting data corresponding to the selected operation mode setting pattern is created.

[0050] If there are no unselected operation mode setting patterns ("None" in ST7), the mounting data creation device 4 registers the mounting data of the operation mode setting pattern with a good evaluation result in the evaluation process (ST6) in the information processing device 3 as the official mounting data (ST9: first mounting data registration process). When manufacturing mounted boards in the mounting line L, the information processing device 3 transmits the registered mounting data and operation mode to the corresponding component mounting devices M4 to M6.

[0051] In this manner, the mounting data creation method of this embodiment assumes multiple operation mode setting patterns for operation units W in mounting line L (ST3), extracts components with high mounting difficulty from production data for mounting boards scheduled for production (ST12), preferentially assigns components with high mounting difficulty to operation units W scheduled to perform component mounting work in high precision mode (ST13), creates mounting data for each assumed operation mode setting pattern (ST15), evaluates the created mounting data for each operation mode setting pattern (ST6), and registers the mounting data with favorable evaluation results as official mounting data (ST9). This allows components to be appropriately assigned to multiple component mounting devices M4-M6 in consideration of the operation modes of the component mounting devices M4-M6.

[0052] Next, another embodiment of the mounting data creation method will be described with reference to Fig. 6 along the flow of Fig. 7. The other embodiment of the mounting data creation method differs from the mounting data creation methods shown in Figs. 4 and 5 in that the operation modes of the operational units W of the multiple component mounting devices M4-M6 arranged on the mounting line L are determined in advance.

[0053] For example, this embodiment applies to a case where the operation mode of the work unit W of each component mounting device M4-M6 is specified in production data or the like, or a case where an on-site worker manually operates each component mounting device M4-M6 to set the specified operation mode. In this case, a process for determining the operation mode of the work unit W of each component mounting device M4-M6 is not required. Hereinafter, the same steps as those in the mounting data creation method shown in Figures 4 and 5 are denoted by the same reference numerals, and detailed explanations will be omitted.

[0054] 7, first, a production data acquisition process (ST1) is executed. Next, the mounting data creation device 4 acquires line configuration information and equipment information, as well as the operation mode of the work unit W of each component mounting device M4-M6 that has been determined in advance (ST21: second information acquisition process). Next, the mounting data creation device 4 determines whether or not the component mounting devices M4-M6 arranged on the mounting line L have a work unit W in high-precision mode (ST22: second high-precision mode determination process).

[0055] If there is an operation unit W in high-precision mode ("Yes" in ST22), the mounting difficulty extraction process (ST12) and the priority allocation process (ST13) are executed. As a result, components with high mounting difficulty are preferentially allocated to the operation unit W scheduled to perform component mounting work in high-precision mode (FIG. 6(b)). If there is no operation unit W in high-precision mode ("No" in ST22), or when the priority allocation process (ST13) is completed, the standard allocation process (ST14) is executed. As a result, components with low mounting difficulty are allocated to component mounting devices M4 to M6 (FIG. 6(c)).

[0056] 7, a mounting data creation step (ST15) is then executed, and the mounting data creation device 4 registers the created mounting data in the information processing device 3 (ST23: second mounting data registration step). This makes it possible to appropriately allocate components to the multiple component mounting devices M4 to M6 in consideration of the operation modes of the component mounting devices M4 to M6.

[0057] As described above, mounted board manufacturing system 1 of this embodiment includes a mounting line L including multiple component mounting devices M4-M6 each having an operation unit W that mounts components on a board 7, and a mounting data creation device 4 that creates mounting data for operating operation unit W. Operation unit W can perform component mounting work in one operation mode selected from multiple operation modes, and mounting data creation device 4 creates mounting data by preferentially allocating components with high mounting difficulty to operation units W scheduled to perform component mounting work in high precision mode. This makes it possible to appropriately allocate components to the multiple component mounting devices M4-M6 in consideration of the operation modes of the operation units W that component mounting devices M4-M6 have. [Industrial Applicability]

[0058] The mounting board manufacturing system, mounting data creation device, and mounting data creation method of the present invention have the effect of being able to appropriately allocate components to multiple component mounting devices by taking into account the operating mode of the component mounting devices, and are useful in fields where components are mounted on boards. [Explanation of symbols]

[0059] 1. Mounting board manufacturing system 4. Mounting data creation device 7 Substrate L Mounting Line M4~M6 parts mounting device W Work Unit

Claims

1. A mounting board manufacturing system including: a mounting line including a plurality of component mounting devices each having an operation unit that mounts components on a board; and a mounting data creation device that creates mounting data for operating the operation unit, the operational unit is capable of performing a component mounting operation in one operation mode selected from a plurality of operation modes, The data creation device creates mounting data by preferentially allocating components with high mounting difficulty to work units that are scheduled to perform component mounting work in a high precision mode.

2. 2. The mounted board manufacturing system according to claim 1, wherein said data creation device assumes a plurality of operation mode setting patterns for operation units in said mounting line, and creates mounting data for each assumed operation mode setting pattern.

3. 3. The mounting board manufacturing system according to claim 2, wherein said data creation device evaluates the mounting data created for each operation mode setting pattern, and registers mounting data having a good evaluation result as official mounting data.

4. 2. The mounting board manufacturing system according to claim 1, wherein said data generating device extracts components with high mounting difficulty from production data of mounting boards to be produced.

5. 5. The mounting board manufacturing system according to claim 4, wherein the data creation device determines the mounting difficulty from at least one of the component names included in the production data, the component dimensions, the component adjacent distances calculated from the component mounting coordinates and the component dimensions, and the allowable positional misalignment dimensions of the component terminals relative to the electrodes of the board.

6. The mounting board manufacturing system according to claim 1 , wherein the component mounting device has a plurality of the operation units.

7. 7. The system for manufacturing mounted substrates according to claim 6, wherein the plurality of operational units of the component mounting device are set to the same operation mode.

8. A mounting data creation device that creates mounting data for operating an operation unit that mounts components on a board, the operation unit having a plurality of component mounting devices arranged in a mounting line that manufactures mounted boards having components mounted thereon, the operation unit comprising: the operational unit is capable of performing a component mounting operation in one operation mode selected from a plurality of operation modes, A mounting data creation device that creates mounting data by preferentially allocating components with high mounting difficulty to a work unit that is scheduled to perform component mounting work in a high precision mode.

9. 9. The mounting data creation device according to claim 8, wherein a plurality of operation mode setting patterns of operation units in the mounting line are assumed, and mounting data is created for each assumed operation mode setting pattern.

10. 10. The mounting data creating device according to claim 9, wherein the mounting data created for each operation mode setting pattern is evaluated, and mounting data having a good evaluation result is registered as official mounting data.

11. 9. The mounting data creating device according to claim 8, further comprising: extracting components with high mounting difficulty from production data of mounting boards to be produced.

12. 12. The mounting data creation device according to claim 11, wherein the mounting difficulty is determined from at least one of the component names included in the production data, the dimensions of the components, the adjacent distance between components calculated from the mounting coordinates and the dimensions of the components, and the allowable misalignment dimensions of the terminals of the components relative to the electrodes of the board.

13. 9. The mounting data creating device according to claim 8, wherein the component mounting device has a plurality of the operation units.

14. 14. The mounting data creating device according to claim 13, wherein the plurality of operation units of the component mounting device are set to the same operation mode.

15. 1. A mounting data creation method for creating mounting data for operating an operation unit that mounts components onto a board, the operation unit having a plurality of component mounting devices arranged in a mounting line that manufactures mounted boards having components mounted thereon, comprising: the operational unit is capable of performing a component mounting operation in one operation mode selected from a plurality of operation modes, A mounting data creation method for creating mounting data by preferentially allocating components with high mounting difficulty to a work unit that is scheduled to perform component mounting work in high precision mode.

16. 16. The mounting data creating method according to claim 15, further comprising: assuming a plurality of operation mode setting patterns of operation units in the mounting line; and creating mounting data for each of the assumed operation mode setting patterns.

17. 17. The mounting data creating method according to claim 16, further comprising the steps of: evaluating the mounting data created for each operation mode setting pattern; and registering the mounting data having a good evaluation result as the official mounting data.

18. 12. The mounting data creating method according to claim 11, further comprising the step of extracting components having a high mounting difficulty from production data of mounting boards to be produced.

19. 20. The mounting data creation method according to claim 18, further comprising the step of judging the degree of difficulty of mounting from at least one of the component names included in the production data, the dimensions of the components, the distance between adjacent components calculated from the mounting coordinates and the dimensions of the components, and the allowable misalignment dimensions of the terminals of the components relative to the electrodes of the board.

20. 16. The mounting data generating method according to claim 15, wherein the component mounting device has a plurality of the operation units.

21. 21. The mounting data creating method according to claim 20, wherein the plurality of operational units of the component mounting device are set to the same operation mode.

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