Substrate transport device and substrate processing device including the same

Abstract

To provide a substrate transport device capable of preventing interference during loading and unloading even for a three-dimensionally warped substrate, and a substrate processing device including the same.SOLUTION: A thickness shape information collecting unit collects thickness shape information based on the outer edge of a substrate W when the substrate W is viewed from a forward / backward direction FD toward the back side of a loading / unloading port CT in a state where the substrate W is accommodated in a carrier C. The thickness shape information includes the thickness of the substrate W not only on the front side of the loading / unloading port CT in the forward / backward direction FD but also on the back side. A calculation unit calculates height information on a gap between two vertically adjacent substrates W to / from which first hand 19, 21 are about to advance or retreat on the basis of the thickness shape information. The control unit controls the transport of an indexer robot on the basis of the calculated height information, taking into account the thickness of the three-dimensionally warped substrate W. Therefore, even when the substrate W is three-dimensionally warped, interference between the hands 19 and 21 during loading and unloading can be prevented.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present invention relates to a substrate transport device that transports substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks, and a substrate processing apparatus equipped with the same. [Background technology]

[0002] Conventionally, this type of device includes a storage unit, a robot arm, an imaging unit, and a control unit (see, for example, Patent Document 1).

[0003] The storage unit stores multiple substrates in a stacked state spaced apart in the vertical direction. The storage unit loads and unloads the substrates through an inlet / outlet opening on one side. The robot arm transports the substrates. The robot arm includes a substrate holding hand that holds the substrate. The robot arm moves the substrate holding hand forward and backward through the inlet / outlet of the storage unit to load and unload the substrate between the storage unit. The photographing unit is attached to the substrate holding hand. The photographing unit photographs the multiple substrates stored in the storage unit. The control unit acquires a transport gap, which is a gap through which the substrate holding hand moves forward and backward, based on an image captured by the photographing unit. The control unit transports the substrate by moving the substrate holding hand forward and backward through the storage unit based on the size of the acquired transport gap. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2023-30876 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the conventional example having such a configuration has the following problems. By the way, a substrate may be warped into a complex shape. This is because, in the semiconductor process, coatings with different thermal expansion coefficients are applied and various heat treatments are further performed. For example, some substrates are warped three-dimensionally. Representative warping shapes include a bowl shape, an umbrella shape, and a half-pipe shape. A substrate warped into a bowl shape has a concave center and a high outer periphery. A substrate warped into an umbrella shape has a shape that is like a substrate warped into a bowl shape turned upside down. In other words, a substrate warped into an umbrella shape has a low outer periphery and a high center. A substrate warped into a half-pipe shape has a circular arc shape when viewed from the central axis, with the substrate surface spaced apart around the central axis like a cylinder along the central axis.

[0006] In other words, when these warped substrates are stored in a storage unit, the height of the front side of the end face of the substrate located on the loading / unloading side of the storage unit differs from the height at which a part of the substrate is located on the rear side in the direction in which the substrate holding hand advances and retreats. The transport gap in the prior art reflects the height of the end face of the substrate located on the loading / unloading side of the storage unit. In other words, the height of the front side of the end face of the substrate is reflected.

[0007] However, the height in the depth direction in the direction in which the substrate holding hand advances and retreats is not reflected. Therefore, when transporting a three-dimensionally warped substrate, even if the advance / retract height of the substrate holding hand is adjusted according to the transport gap, there is a problem that the substrate and the substrate holding hand may interfere with each other.

[0008] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate transport device and a substrate processing apparatus equipped with the same that can prevent interference when loading and unloading even substrates that are three-dimensionally warped. [Means for solving the problem]

[0009] In order to achieve the above object, the present invention has the following configuration. That is, the invention described in claim 1 is a substrate transport device that can store multiple substrates stacked with gaps between them and transports the substrates between a container having an loading / unloading opening on one side, the substrate transport device comprising: a holding hand that holds the substrate, and a transport unit that transports the substrate by moving the holding hand forward and backward from the loading / unloading opening of the container into and from the gap between the substrates; a thickness shape information collection unit that collects thickness shape information for each substrate based on the outer edge of the substrate when the substrate is viewed along the forward and backward direction of the holding hand when the substrate is stored in the container; a calculation unit that calculates height information of the gap between two vertically adjacent substrates that the holding hand is about to move forward and backward between when the transport unit moves the substrate in and out of the container, based on the thickness shape information of the two vertically adjacent substrates; and a control unit that controls the transport of the transport unit based on the height information.

[0010] [Function and Effect] According to the invention described in claim 1, the thickness shape information collecting unit collects thickness shape information for each substrate based on the outer edge of the substrate when the substrate is viewed along the advancing and retreating direction of the holding hand while the substrate is accommodated in the container. The thickness shape information includes the thickness of the substrate not only on the front side of the loading / unloading opening in the advancing and retreating direction of the holding hand, but also on the back side. The thickness shape information includes the thickest dimension on the front side and the back side in the advancing and retreating direction of the holding hand. The calculation unit calculates height information of the gap between two vertically adjacent substrates that the holding hand is about to advance and retreat based on the thickness shape information. The control unit controls the transportation of the transport unit based on the calculated height information, taking into account the thickness of the three-dimensionally warped substrate. Therefore, interference of the holding hand can be prevented during loading and unloading even for a three-dimensionally warped substrate.

[0011] Furthermore, in the present invention, it is preferable that the thickness shape information includes an end face height position, which is the position in the height direction of the end face of the substrate accommodated in the container on the loading / unloading port side, and a rear side height position where a part of the substrate is located on the rear side of the end face, away in the height direction from the end face height position (Claim 2).

[0012] The thickness shape information includes not only the edge surface height position of the substrate but also the depth side height position located on the depth side of the edge surface. Therefore, the thickness shape information includes the thickness dimension at the front side and the depth side in the advancing and retreating direction of the holding hand.

[0013] In addition, in the present invention, it is preferable that the apparatus further includes a relative movement unit which moves the relative positions of the container and the thickness shape information collecting unit in the height direction, and a memory unit which stores the thickness shape information of each substrate obtained by moving the container and the thickness shape information collecting unit relatively by the relative movement unit, wherein the thickness shape information collecting unit collects the thickness shape information at multiple locations in a horizontal direction perpendicular to the advancing and retreating direction of the holding hand, and the calculation unit calculates the height information of the gap between adjacent substrates vertically based on the thickness shape information of each substrate stored in the memory unit (Claim 3).

[0014] The thickness shape information collecting unit collects thickness shape information at multiple locations in a horizontal direction perpendicular to the advancing / retracting direction of the holding hand. The calculating unit can calculate height information of the gap between vertically adjacent substrates based on the thickness shape information of each substrate stored in the storage unit. Therefore, interference with the holding hand that extends in the horizontal direction perpendicular to the advancing / retracting direction to hold the substrate can be prevented. In addition, the present invention can handle substrates whose thickness is greatest in the height direction at a position other than the center horizontally perpendicular to the advancing / retracting direction as viewed from the advancing / retracting direction of the holding hand.

[0015] Furthermore, in the present invention, it is preferable that the thickness shape information collecting unit includes a light projecting unit that irradiates light from a first direction toward the outer surface of the substrate, and a light receiving unit that receives light irradiated from the light projecting unit and reflected from a direction opposite to the first direction (Claim 4).

[0016] Based on the height at which the reflected light can be received by the light receiving section, thickness and shape information of the substrate as viewed from the direction in which the holding hand moves forward and backward can be collected without contacting the substrate.

[0017] In addition, in the present invention, it is preferable that the thickness shape information collection unit is arranged inside the container facing the light projecting unit across the substrate, and further includes a reflection unit that reflects light from the light projecting unit at the multiple locations (Claim 5).

[0018] Since the container is provided with a reflecting portion inside, the light receiving portion can reliably receive reflected light, and therefore thickness and shape information of the substrate can be reliably collected.

[0019] In the present invention, it is preferable that the light receiving section receives the reflected light from the substrate (claim 6).

[0020] Since the light reflected from the substrate is directly received by the light receiving section, there is no need to provide a reflecting section, and therefore a commercially available container can be used as is, simplifying the configuration.

[0021] In addition, in the present invention, it is preferable that the device for attaching and detaching a lid attached to the loading / unloading opening of the container further includes an opening / closing mechanism for lowering the lid downward along the loading / unloading opening when removing the lid, and that the light-projecting unit and the light-receiving unit are attached to the opening / closing mechanism (Claim 7).

[0022] Since the light projecting unit and the light receiving unit are attached to the opening / closing mechanism, there is no need to provide a separate relative moving unit, which can simplify the structure.

[0023] Furthermore, in the present invention, it is preferable that the container is made of a material that is optically transparent to the light irradiated from the light-projecting unit, and further includes a reflecting unit that reflects the light irradiated from the light-projecting unit, and that the reflecting unit is disposed outside the container (Claim 8).

[0024] The light-projecting unit, the light-receiving unit, and the reflecting unit can be provided outside the container, and therefore, as long as the container is made of an optically transparent material, there is no need to modify the container, such as by attaching a reflecting unit.

[0025] Furthermore, in the present invention, it is preferable that the thickness shape information collecting unit includes a light-projecting unit that irradiates light onto an outer surface of the substrate from a first direction toward the substrate, and a light-receiving unit that has a function of receiving the light irradiated from the light-projecting unit and is positioned outside the container in the opposite direction to the first direction across the substrate, and that the container is made of a material that is optically transparent to the light irradiated from the light-projecting unit (Claim 9).

[0026] Since the detection method is a transmission type, it is not easily affected by the reflectance of the detection target or the reflectance of the surrounding structure. Therefore, the detection accuracy of the thickness shape information can be improved. In addition, the light projecting unit and the light receiving unit can be provided outside the container. Therefore, if the container is made of an optically transparent material, there is no need to modify the container, such as by attaching a reflecting unit.

[0027] In the present invention, it is preferable that the thickness shape information collecting unit is disposed on the loading / unloading side of the container and includes an image capturing unit that captures a projected image as the thickness shape information (claim 10).

[0028] By capturing the projected image with the imaging unit, thickness shape information can be collected. Therefore, it is necessary to provide an imaging unit only on the loading / unloading side of the container. As a result, the configuration of the thickness shape information collection unit can be simplified. In addition, by expanding the field of view in the direction in which multiple substrates are stacked, multiple pieces of thickness shape information can be collected simultaneously.

[0029] Furthermore, in the present invention, it is preferable that the photographing unit is configured to be able to adjust the focus position, and the control unit operates the focus position of the photographing unit to focus on at least two positions, i.e., a first focus position focused on a portion of the substrate on the loading / unloading port side, and a second focus position focused on a portion of the substrate further back than the first focus position (Claim 11).

[0030] Considering the diameter of the substrate, for example, a projected image focused on the edge of the substrate will be blurred on the center side of the substrate in the direction of movement of the holding hand. Conversely, for example, a projected image focused on the center side of the substrate in the direction of movement of the holding hand will be blurred on the edge of the substrate. Therefore, thickness shape information is collected from projected images focused on at least two points, a projected image at a first focusing position and a projected image at a second focusing position. This allows thickness shape information to be collected accurately based on the projected images.

[0031] In addition, in the present invention, it is preferable that the present invention further includes an image memory unit which stores the projection image captured by the photographing unit, and the control unit causes the photographing unit to photograph a plurality of substrates having a first thickness and no warping in the container, and stores the projection image collected at this time in the image memory unit as a first reference image, and causes the photographing unit to photograph a plurality of substrates having a second thickness different from the first thickness in the container, and stores the projection image collected at this time in the image memory unit as a second reference image, and the thickness shape information collecting unit, when processing the substrate, which is a product, calculates dimensions in the projection image based on known dimensions in the first reference image and the second reference image stored in the image memory unit to collect the thickness shape information (Claim 12).

[0032] The first and second reference images are stored in advance in a storage unit. When processing a substrate, which is a product, the thickness shape information collecting unit calculates dimensions in the projected image based on known dimensions in the first and second reference images to collect thickness shape information. Since calibration is performed using the first and second reference images, it is possible to collect accurate thickness shape information based on the dimensions of the projected image when processing a substrate, which is a product.

[0033] Furthermore, in the present invention, the thickness shape information collecting unit includes a light-projecting unit that irradiates light onto the outer surface of the substrate from a first direction toward the substrate, and a line sensor that has a function of receiving the light irradiated from the light-projecting unit, is positioned outside the container in the opposite direction to the first direction across the substrate, and has a detection area that is long in the stacking direction of the multiple substrates contained inside the container, and it is preferable that the container is made of a material that is optically transparent to the light irradiated from the light-projecting unit (Claim 13).

[0034] The thickness shape information collecting unit is composed of a light projecting unit and a line sensor. By using the line sensor, it is possible to reduce the number of movements or to eliminate the need to move in the direction in which the multiple substrates are stacked. Therefore, it is possible to efficiently collect thickness shape information of the multiple substrates.

[0035] In addition, in the present invention, it is preferable that the calculation unit calculates the height information based on the shape of the outer edges of the target substrate to be transported by the transport unit and a substrate adjacent to the target substrate, among the thickness shape information (Claim 14).

[0036] The height information is calculated based on thickness and shape information of the target substrate transported from the container and the substrates adjacent to the target substrate. Therefore, the control unit can control the transport so that the target substrate does not interfere with the adjacent substrates even when the holding hand moves up and down to carry the target substrate out of the container.

[0037] In addition, in the present invention, it is preferable that a substrate processing apparatus includes any one of the substrate transport devices described above, and a processing section that performs a predetermined process on a substrate transported by the substrate transport device (claim 15).

[0038] The substrate processing apparatus includes a processing section that performs a predetermined process on the substrate transported by the substrate transport device. Therefore, even if a substrate that is three-dimensionally warped is contained in the container, it can be transported without interfering with the holding hand. Therefore, the substrate that is three-dimensionally warped can be appropriately processed in the processing section. Effect of the Invention

[0039] According to the substrate transport device of the present invention, the thickness shape information collecting unit collects thickness shape information for each substrate based on the outer edge of the substrate when the substrate is viewed along the advancing / retracting direction of the holding hand while the substrate is accommodated in the container. The thickness shape information includes the thickness of the substrate not only on the front side of the loading / unloading opening in the advancing / retracting direction of the holding hand, but also on the back side. The thickness shape information includes the thickest dimension on the front side and the back side in the advancing / retracting direction of the holding hand. The calculating unit calculates height information of the gap between two vertically adjacent substrates that the holding hand is about to advance / retract based on the thickness shape information. The control unit controls the transport of the transport unit based on the calculated height information, taking into account the thickness of the three-dimensionally warped substrate. Therefore, interference of the holding hand can be prevented during loading / unloading even for a three-dimensionally warped substrate. [Brief description of the drawings]

[0040] [Figure 1] 1 is a plan view showing an overall configuration of a substrate processing apparatus according to a first embodiment. [Diagram 2] 2 is a view of the substrate processing apparatus of FIG. 1 as seen from the rear X. [Diagram 3] 1A to 1E are side views showing the configuration and operation of a carry-in / out block. [Figure 4] FIG. 1 shows an example of a substrate warped into a bowl shape, where (a) is a view seen from the front-rear direction X, and (b) is a view seen from the width direction Y. [Diagram 5] FIG. 1 shows an example of a substrate warped into an umbrella shape, where (a) is a view seen from the front-rear direction X, and (b) is a view seen from the width direction Y. [Figure 6] FIG. 1 shows an example of a substrate warped into a half-pipe shape, where (a) is a view seen from the front-rear direction X, and (b) is a view seen from the width direction Y. [Figure 7] FIG. 2 is a block diagram showing an example of a control system. [Figure 8] 4 is a front view showing a configuration of a thickness shape information collecting unit according to the first embodiment. FIG. [Figure 9] 4 is a plan view illustrating a configuration of a thickness shape information collecting unit according to the first embodiment. FIG. [Figure 10] 11 is a schematic diagram illustrating thickness shape information. FIG. [Figure 11] FIG. 11 is a front view showing a configuration of a thickness shape information collecting unit according to the second embodiment. [Figure 12] FIG. 11 is a plan view illustrating a configuration of a thickness shape information collecting unit according to the second embodiment. [Figure 13] FIG. 11 is a plan view illustrating a configuration of a thickness shape information collecting unit according to a third embodiment. [Figure 14] 13 is a plan view illustrating a configuration of a thickness shape information collecting unit according to a fourth embodiment. FIG. [Figure 15] 13 is a plan view illustrating a configuration of a thickness shape information collecting unit according to a fifth embodiment. FIG. [Figure 16] FIG. 13 is a block diagram showing an example of a thickness shape information collecting unit according to the fifth embodiment. [Figure 17] 1A to 1C are schematic diagrams illustrating a focus position and a composite image. [Figure 18] 13(a) to 13(c) are schematic diagrams illustrating an example of calibration in image processing. [Figure 19] 13 is a side view showing an example of a thickness shape information collecting unit according to the sixth embodiment. FIG. [Figure 20] 13 is a plan view illustrating an example of a thickness shape information collecting unit according to the sixth embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0041] The present invention will now be described with reference to various examples. EXAMPLES

[0042] A first embodiment of the present invention will be described below with reference to the drawings.

[0043] Fig. 1 is a plan view showing an overall configuration of a substrate processing apparatus according to Example 1. Fig. 2 is a view of the substrate processing apparatus of Fig. 1 as seen from the rear X.

[0044] <1. Overall composition>

[0045] The substrate processing apparatus 1 includes a load / unload block 3, an indexer block 5, and a processing block .

[0046] The substrate processing apparatus 1 processes a substrate W. The substrate W has, for example, a circular shape in a plan view. The substrate processing apparatus 1 performs, for example, a cleaning process on the substrate W. The substrate processing apparatus 1 processes the substrate W in a processing block 7 in a single-wafer manner. In the single-wafer manner, each substrate W is processed one by one in a horizontal position.

[0047] For convenience, in this specification, the direction in which the load / unload block 3, indexer block 5, and processing block 7 are lined up is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the processing block 7 toward the load / unload block 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." In each figure, for reference, front, back, right, left, top, and bottom are indicated as appropriate.

[0048] <2. Loading / unloading block>

[0049] The carry-in / out block 3 includes an input section 9 and an unloading section 11. The input section 9 and the unloading section 11 are arranged in the width direction Y. A plurality of substrates W (e.g., 25 substrates) are stored in a single carrier C in a horizontal orientation, stacked at regular intervals. The carrier C storing the unprocessed substrates W is placed in the input section 9. The input section 9 includes, for example, two mounting tables 13 on which the carriers C are placed. The carrier C stores the substrates W one by one with the surfaces of the substrates W spaced apart. The carrier C stores the substrates W, for example, with the front surfaces of the substrates W facing upward. An example of the carrier C is a front opening unify pod (FOUP). A FOUP is a sealed container. The carrier C may be an open container, and any type of carrier C may be used.

[0050] The unloading unit 11 is disposed on the opposite side of the input unit 9 across the center of the width direction Y of the substrate processing apparatus 1. The unloading unit 11 is disposed to the left Y of the input unit 9. The unloading unit 11 stores the processed substrates W in a carrier C and unloads the carrier C. The unloading unit 11 that functions in this manner includes, like the input unit 9, two mounting tables 13 for placing the carriers C, for example. The input unit 9 and the unloading unit 11 are also called load ports.

[0051] <3. Indexer block>

[0052] The indexer block 5 is disposed adjacent to the rear X of the carry-in / out block 3 in the substrate processing apparatus 1. The indexer block 5 includes an indexer robot IR and a transfer unit 15.

[0053] The indexer robot IR is configured to be rotatable around the vertical direction Z. The indexer robot IR is configured to be movable in the width direction Y. The indexer robot IR includes a first hand 19 and a second hand 21. In FIG. 1, only one hand is shown for the sake of illustration. The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are configured to be independently movable forward and backward in the forward and backward direction X. The indexer robot IR moves in the width direction Y and rotates around the vertical direction Z, and moves the first hand 19 and the second hand 21 forward and backward to transfer the substrate W between each cassette C. In the same manner, the indexer robot IR transfers the substrate W between the transfer section 15. The direction in which the first hand 19 and the second hand 21 move when transferring the substrate W between the carrier C and the carrier C is defined as the forward and backward direction FD.

[0054] The transfer section 15 is disposed on the boundary between the indexer block 5 and the processing block 7. The transfer section 15 is disposed, for example, at the center in the width direction Y. As shown in FIG. 2, the transfer section 15 is formed long in the vertical direction Z.

[0055] The delivery section 15 includes, from bottom to top in the vertical direction Z, a first reversing unit 23, a path section 25, a path section 27, and a second reversing unit 29.

[0056] The first inversion unit 23 inverts the top and bottom of the substrate W received from the indexer block 5. The first inversion unit 23 inverts the horizontal orientation of the substrate W. Specifically, the first inversion unit 23 converts the orientation of the substrate W, which has its front surface facing up, to one in which its front surface faces down. In other words, the orientation of the substrate W is converted so that its back surface faces up.

[0057] The second inversion unit 29 performs the reverse operation. That is, the second inversion unit 29 inverts the top and bottom of the substrate W received from the processing block 7. The second inversion unit 29 converts the substrate W with its front surface facing down into a position in which its front surface faces up. In other words, the second inversion unit 29 converts the position of the substrate W so that its back surface faces down.

[0058] The inversion directions of the first inversion unit 23 and the second inversion unit 29 may be opposite to each other. That is, the first inversion unit 23 changes the orientation of the substrate W so that the front surface faces upward. The second inversion unit 29 changes the orientation of the substrate W so that the back surface faces upward.

[0059] The path sections 25 and 27 are used for transferring the substrate W between the indexer block 5 and the processing block 7. The path section 25 is used, for example, for transporting the substrate W from the processing block 7 to the indexer block 5. The path section 27 is used, for example, for transporting the substrate W from the indexer block 5 to the processing block 7. Note that the transport directions of the substrate W in the path sections 25 and 27 may be opposite to each other.

[0060] <4. Processing block>

[0061] The processing block 7 performs, for example, a cleaning process on the substrate W. The cleaning process is, for example, a process using a brush in addition to a processing liquid. As shown in FIG. 1, the processing block 7 is, for example, divided into a first row R1, a second row R2, and a third row R3 in the width direction Y. In detail, the first row R1 is disposed on the left side Y. The second row R2 is disposed in the center of the width direction Y. In other words, the second row R2 is disposed on the right side Y of the first row R1. The third row R3 is disposed on the right side Y of the second row R2.

[0062] <4-1. 1st column>

[0063] The first row R1 of the processing block 7 includes a plurality of processing units 31. The first row R1 includes, for example, four processing units 31. The first row R1 has the four processing units 31 stacked in the vertical direction Z. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit cleans the substrate W. The cleaning units include a front surface cleaning unit that cleans the front surface of the substrate W, and a back surface cleaning unit that cleans the back surface of the substrate W. In this embodiment, the back surface cleaning unit SSR will be used as an example of the processing unit 31.

[0064] <4-2. 2nd column>

[0065] The second row R2 of the processing block 7 is equipped with a center robot CR. The center robot CR is configured to be rotatable around the vertical direction Z. The center robot CR is configured to be able to move up and down in the vertical direction Z. The center robot CR is equipped with, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are configured to be able to move forward and backward in the front-rear direction X and the width direction Y independently.

[0066] <4-3. 3rd column>

[0067] The third row R3 of the processing block 7 has the same configuration as the first row R1. That is, the third row R3 includes a plurality of processing units 31. The third row R3 includes, for example, four processing units 31. The third row R3 has four processing units 31 stacked in the vertical direction Z. Each processing unit 31 in the first row R1 and each processing unit 31 in the third row R3 are arranged opposite each other in the width direction Y. This allows the center robot CR to access each of the opposing processing units 31 in the first row R1 and the third row R3 at the same height in the vertical direction Z.

[0068] The processing block 7 is configured as described above. Here, an example of the operation of the center robot CR will be briefly described. The center robot CR receives the substrate W, for example, from the first reversal unit 23. The center robot CR transports the substrate W to any of the back surface cleaning units SSR in the first row R1 or the third row R3 to perform cleaning processing on the back surface of the substrate W. The center robot CR receives the substrate W that has been cleaned in any of the back surface cleaning units SSR in the first row R1 or the third row R3. The center robot CR transports the substrate W to the second reversal unit 29.

[0069] <5. Mounting table>

[0070] The above-mentioned carry-in / out block 3 will now be described in detail with reference to Figures 1 and 3. Figures 3(a) to (e) are side views showing the configuration and operation of the carry-in / out block.

[0071] The loading / unloading block 3 includes a mounting table 13, an opening 39, and a lid opening / closing mechanism 41. The mounting table 13 has a carrier C mounted thereon. The mounting table 13 includes a mechanism (not shown) for moving the carrier C in the forward / backward direction X. The mounting table 13 can move the carrier C forward and backward relative to the opening 39. The carrier C has a loading / unloading opening CT. The loading / unloading opening CT is formed on one side of the carrier C. A plurality of substrates W stored in a stack in the carrier C are loaded and unloaded via the loading / unloading opening CT. The carrier C includes a lid CL. The lid CL is configured to be detachably attached to the loading / unloading opening CT of the carrier C. The lid CL seals the inside of the carrier C. When the lid CL is attached to the carrier C, the carrier C is isolated from the atmosphere outside the carrier C.

[0072] The lid opening / closing mechanism 41 is provided with an attachment / detachment unit 43 at the front X. The attachment / detachment unit 43 removes the lid CL from the carrier C and attaches the lid CL to the carrier C. The attachment / detachment unit 43 is movable in the vertical direction Z and the front-rear direction X while holding the lid CL. The lid opening / closing mechanism 41 is movable in the front-rear direction X in the opening 39 while holding the lid CL. The lid opening / closing mechanism 41 is capable of ascending and descending in the vertical direction Z while holding the lid CL. The lid opening / closing mechanism 41 is capable of moving downward in the vertical direction Z from the opening 39 while holding the lid CL. The lid opening / closing mechanism 41 can fully open the opening 39 by descending while holding the lid CL.

[0073] First, as shown in Fig. 3(a), the carrier C is placed on the mounting table 13. The carrier C accommodates a plurality of stacked substrates W and is closed by the lid CL. At this time, the lid opening / closing mechanism 41 positions the attachment / detachment unit 43 at the opening 39. This separates the inside of the indexer block 5 from the outside atmosphere.

[0074] As shown in Fig. 3(b), the mounting table 13 moves the carrier C to the rear X. The carrier C is positioned at the loading / unloading port CT and the lid CL is positioned at the opening 39. At this time, the mounting / removal unit 43 releases the lock on the lid CL and holds the lid CL. The holding is performed, for example, by the mounting / removal unit 43 sucking the lid CL.

[0075] 3(c), the lid opening / closing mechanism 41 moves rearward X. As a result, the lid CL is moved rearward X from the opening 39. The lid CL is moved into the inside of the indexer block 5.

[0076] 3(d), the lid opening / closing mechanism 41 moves downward in the vertical direction Z. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 to the bottom of the loading / unloading opening CT. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 until an upper portion of the attachment / detachment unit 43 is positioned below the opening 39.

[0077] 3(e), the lid opening / closing mechanism 41 moves downward in the vertical direction Z to the lowest position to which the lid opening / closing mechanism 41 can move. The lid opening / closing mechanism 41 descends to a position where the attachment / detachment unit 43 does not overlap with the opening 39 in the front-rear direction X. This causes the opening 39 to be fully opened. The multiple substrates W in the carrier C can be seen from the indexer block 5 through the opening 39.

[0078] The above-mentioned lid opening / closing mechanism 41 includes, for example, a reflective sensor 45 in the mounting / removal unit 43. The reflective sensor 45 is used to collect thickness shape information based on the outer edge of the substrate W. The reflective sensor 45 will be described in detail later.

[0079] <6. Warpage of the substrate W>

[0080] Here, reference is made to Figures 4 to 6. Figure 4 shows an example of a substrate warped into a bowl shape, where (a) is a view from the front-rear direction X and (b) is a view from the width direction Y. Figure 5 shows an example of a substrate warped into an umbrella shape, where (a) is a view from the front-rear direction X and (b) is a view from the width direction Y. Figure 6 shows an example of a substrate warped into a half-pipe shape, where (a) is a view from the front-rear direction X and (b) is a view from the width direction Y.

[0081] The substrate W is subjected to various processes, and is coated with films having different thermal expansion coefficients, and is further subjected to various heat treatments. Therefore, the substrate W may be warped into a complex shape. Representative warping of the substrate W includes, for example, the following:

[0082] FIG. 4 shows a substrate W warped in a bowl shape. That is, the substrate W is concave at the center and has a high outer periphery. The substrate W warped in a bowl shape narrows the gap in the vertical direction Z below another substrate W accommodated below this substrate W in the carrier C. FIG. 4(a) is a view from the front-rear direction X, and thus shows the substrate W as seen from the indexer block 5 through the loading / unloading port CT. In other words, FIG. 4(a) is a view from the forward / backward direction FD of the first hand 19 and the second hand 21 of the indexer robot CR toward the back side of the carrier C. FIG. 4(b) is a view from the width direction Y, and thus shows the forward / backward direction FD of the first hands 19 and 21 from the side. As can be seen from FIGS. 4(a) and 4(b), the bottom surface of the substrate W is lower than the height of the end surface in the vertical direction Z.

[0083] FIG. 5 shows a substrate W warped into an umbrella shape. The substrate W shown in FIG. 5 has a shape that is the same as the substrate W warped into a bowl shape shown in FIG. 4, but turned upside down. The umbrella-shaped substrate W has a low outer periphery and a raised center. In other words, the umbrella-shaped substrate W has a raised center and a low outer periphery. The substrate W warped into a bowl shape has a narrower upper gap in the vertical direction Z between it and another substrate W accommodated above it in the carrier C. As can be seen from FIGS. 5(a) and (b), the top surface of the substrate W is higher than the height of the end surface in the vertical direction Z.

[0084] The above-mentioned bowl-shaped and umbrella-shaped warped substrate W has substantially the same shape of the outer edge when viewed from the front-rear direction X and when viewed from the width direction Y.

[0085] FIG. 6 shows a substrate W warped in a half-pipe shape. The substrate W shown in FIG. 6 is warped in an arc shape when viewed from the center axis CP direction, with the surfaces of the substrate W spaced apart around the center axis CP, as if a cylinder was cut along the center axis CP. The half-pipe substrate W has a low outer periphery and a raised central portion. However, unlike the bowl-shaped and umbrella-shaped substrates described above, the shape of the outer edge of the substrate W is different when viewed from the front-rear direction X and when viewed from the width direction Y. In other words, the shape of the outer edge of the substrate W is different when viewed from the front-rear direction X and when viewed from the width direction Y. The substrate W warped in a half-pipe shape like this has a narrower upper gap in the vertical direction Z with another substrate W accommodated above this substrate W in the carrier C. As can be seen from FIGS. 6(a) and 6(b), the top surface of the substrate W is higher than the height of the end surface in the vertical direction Z. In FIG. 6, the center axis CP is in the front-rear direction X, but the center axis CP may also be in the width direction Y. There is also a half-pipe-like warp, like that shown in Figure 6, upside down.

[0086] <7. Control System>

[0087] Here, a control system of the substrate processing apparatus 1 will be described with reference to Fig. 7. Fig. 7 is a block diagram showing an example of the control system.

[0088] The substrate processing apparatus 1 is controlled by the control unit CU. The control unit CU includes a control unit CU, a CPU, a memory, and the like. The control unit CU operates according to a program stored in advance. The control unit CU controls the movement of the carrier C in the mounting table 10 in the forward and backward directions X. The control unit CU controls the attachment and detachment operation of the lid CL by the attachment and detachment unit 43 of the lid opening and closing mechanism 41, and the lifting and lowering operation of the lid opening and closing mechanism 41. When the control unit CU causes the lid opening and closing mechanism 41 to perform the lifting and lowering operation, the control unit CU causes the lid opening and closing mechanism 41 to perform the lifting and lowering operation while referring to the height position in the vertical direction Z output from the lid opening and closing mechanism 41. The control unit CU controls the indexer robot IR. Specifically, the control unit CU controls the movement of the first hand 19 and the second hand 21 of the indexer robot IR in the forward and backward directions FD, the movement of the first hand 19 and the second hand 21 in the vertical direction Z, and the rotation of the indexer robot IR about the vertical direction Z. The control unit CU controls the processing of the substrate W in the processing unit 31. The control unit CU controls the center robot CR. The control unit CU controls the forward and backward movement of the first hand 33 and the second hand 35 of the center robot CR, the movement of the first hand 33 and the second hand 35 in the vertical direction Z, and the rotation of the center robot CR about the vertical direction Z.

[0089] When the lid opening / closing mechanism 41 descends in the vertical direction Z, if the reflective sensor 45 detects the presence of the substrate W, the control unit CU stores the height position of the lid opening / closing mechanism 41 in the vertical direction Z in the memory unit 51.

[0090] The control unit CU controls the thickness shape information collecting unit 53. The control unit CU can read a signal from the thickness shape information collecting unit 53. The thickness shape information collecting unit 53 provides a signal to the calculation unit 55. The thickness shape information collecting unit 53 collects thickness shape information as described below. The calculation unit 55 calculates height information based on the thickness shape information from the thickness shape information collecting unit 53, the height position in the vertical direction Z from the memory unit 51, and information on the cassette C (the distance between the locking parts indicating the storage distance). The height information is the gap (height in the vertical direction Z) between two vertically adjacent substrates W that the first hand 19 and second hand 21 of the indexer robot IR are to advance or retreat.

[0091] <8. Thickness and shape information collection unit>

[0092] Here, the thickness shape information collecting unit 53 will be described with reference to Fig. 8 and Fig. 9. Fig. 8 is a front view showing the configuration of the thickness shape information collecting unit according to the first embodiment. Fig. 9 is a plan view showing the configuration of the thickness shape information collecting unit according to the first embodiment.

[0093] The carrier C has a plurality of locking portions 57. The locking portions 57 are provided on the inner wall of the carrier C, spaced apart in the vertical direction Z. The locking portions 57 abut against and support the lower surface of the peripheral portion of the substrate W. For convenience of explanation, only the locking portions 57 provided on the inner wall in the width direction Y are shown in Figures 8 and 9. In reality, the locking portions 57 are formed on four surfaces of the side wall of the carrier C. In the case where the carrier C can accommodate 25 substrates W stacked together, 25 locking portions 57 are formed in the vertical direction Z. The dimensions of the locking portions 57 themselves and the dimensions of the intervals between the locking portions 57 are known.

[0094] The carrier C is provided with a reflecting portion 59 on the side wall on the far side in the front-rear direction X. The reflecting portion 59 is, for example, a mirror or a retroreflective tape. The reflecting portions 59 are arranged at a plurality of locations in the width direction Y. In this example, the reflecting portions 59 are attached at three locations. The reflecting portions 59 are arranged at three locations in a direction horizontally perpendicular to the forward-retract direction FD. The three reflecting portions 59 are arranged at intervals in the width direction Y. Each reflecting portion 59 extends in the vertical direction Z. The positions of each reflecting portion 59 in the width direction Y are preferably positions corresponding to the first hand 19 and the second hand 21 as shown in FIG. 9. Specifically, the first hand 19 and the second hand 21 are provided with support pieces 61 at two locations on the tip side and one location on the base end side. The support piece 61 abuts against the lower surface and the end surface of the substrate W to support it. Each reflecting portion 59 is preferably arranged in the width direction Y to correspond to the position where each support piece 61 is present. The support pieces 61 are parts that protrude upward from the first hand 19 and the second hand 21. For this reason, they are locations of the first hand 19 and the second hand 21 that are likely to interfere with the substrate W when the substrate W is loaded or unloaded.

[0095] The reflective sensor 45 of the lid opening / closing mechanism 41 described above is provided at a position corresponding to each reflecting portion 59. That is, the mounting / removal unit 43 is provided with each reflective sensor 45 at a position facing each reflecting portion 59 in the width direction Y. Each reflective sensor 45 is provided with a light-emitting portion 45a and a light-receiving portion 45b. The light-emitting portion 45a of the reflective sensor 45 irradiates light in the direction from the mounting / removal unit 43 side toward the loading / unloading port CT. The light-emitting portion 45a of the reflective sensor 45 irradiates light in the direction in which the outer surface of the substrate W is located at the loading / unloading port CT. The direction from the mounting / removal unit 43 side toward the loading / unloading port CT is the same as the forward / backward direction FD of the indexer robot IR. The reflective sensor 45 cannot detect reflected light from the edge surface or curved top and bottom surfaces of the substrate W. The reflective sensor 45 can only detect strong reflected light from the reflecting portion 59.

[0096] As shown in FIG. 9, each of the reflecting parts 59 is provided inside the carrier C facing each of the reflective sensors 45 with the substrate W interposed therebetween. Each of the reflecting parts 59 reflects light from the light projecting part 45a of the reflective sensor 45 toward the reflective sensor 45. The light receiving part 45b of the reflective sensor 45 is irradiated with light from the light projecting part 45a of the reflective sensor 45 and detects the reflected light from the reflecting part 59. Therefore, when the reflective sensor 45 reaches the height of the outer edge of the substrate W as seen from the forward / backward direction FD, the irradiated light is scattered and the reflected light is not received. On the other hand, when the height of the reflective sensor 45 deviates from the outer edge of the substrate W, the reflected light reflected by the reflecting part 59 is received. The control unit CU stores the height positions of the mounting / removal unit 43 at these times in the memory unit 51.

[0097] The control unit CU collects thickness shape information by the thickness shape information collecting unit 53 when the lid CL is lowered by the lid opening / closing mechanism 41. The thickness shape information is information on the thickness shape based on the outer edge of the substrate W when the substrate W is accommodated in the carrier C and viewed from the rear side (front X) of the loading / unloading port CT in the advancing / retracting direction FD of the first hand 19 and the second hand 21. The thickness shape information includes the end face height position in the vertical direction Z of the end face on the loading / unloading port CT side among the end faces on the outer periphery of the substrate W viewed from the advancing / retracting direction FD. The thickness shape information includes the rear side height position at which a part of the substrate W is located in the vertical direction Z away from the end face height position of the substrate W in the front X of the end face on the loading / unloading port CT side among the end faces on the outer periphery of the substrate W viewed from the advancing / retracting direction FD. In other words, the thickness shape information is information on the shape obtained from the outermost peripheral edge (outer shape) of the substrate W when the substrate W is viewed horizontally in the forward direction X from the loading / unloading port CT in the advancing / retracting direction FD. The maximum and minimum heights in the vertical direction Z in the depth direction of the substrate W in the forward / backward direction FD can be determined based on the thickness shape information and the height position of the lid opening / closing mechanism 41 (i.e., the reflective sensor 45 attached to the lid opening / closing mechanism 41) when the thickness shape information is being collected (i.e., when the presence of the substrate W is being detected).

[0098] In the following example, when the lid opening / closing mechanism 41 lowers the mounting / removal unit 43, the height position at which the outer edge of the substrate W is detected by the reflective sensor 45 is stored in the storage unit 51.

[0099] <9. Calculation section>

[0100] Please refer to Fig. 10. Fig. 10 is a schematic diagram for explaining thickness shape information.

[0101] Based on the thickness shape information collected by the thickness shape information collecting unit 53, the calculating unit 55 calculates height information of the gap between two vertically adjacent substrates W that the first hand 19 and the second hand 21 are to advance or retreat from the carrier C in the advance / retract direction FD. In this case, in order to facilitate understanding of the invention, as shown in FIG. 10, it is described that three substrates W are accommodated: a substrate W with no warping, a substrate W with an umbrella-shaped warping (FIG. 5), and a substrate W with a half-pipe-shaped warping (FIG. 6). The substrate W with the half-pipe-shaped warping is placed on the carrier C such that the advance / retract direction FD of the first hand 19 and the second hand 21 and the front-rear direction X in FIG. 6(a) are oriented in the same direction.

[0102] Here, when the lid opening / closing mechanism 41 lowers the lid CL, specifically during the operations shown in Figures 3(c) to 3(d), the height position (i.e., the range in the height direction) from when the outer edge of the substrate W is detected by the reflective sensor 45 to when the outer edge is no longer detected is shown by hatching as shown in Figure 10. In Figure 10, of the reflective sensors 45, the ones on the left side Y are in row A, the ones in the center are in row B, and the ones on the right side Y are in row C.

[0103] In a substrate W without warping, for example, the height positions in rows A, B, and C are height positions TH1a, TH1b, and TH1c, respectively. For convenience of explanation, the height positions TH1a, TH1b, and TH1c illustrated as thicknesses are obtained from the height positions in the memory unit 51, and are therefore referred to as height positions here. These height positions TH1a, TH1b, and TH1c all have the same thickness. Therefore, the highest position on this substrate W is the upper position UP1, and the lowest position is the lower position DP1. The upper position UP1 is the highest height position on this substrate W. The lower position DP1 is the lowest height position on this substrate W. From the relationship between these height positions, the control unit CU and the calculation unit 55 can recognize that the substrate W is without warping.

[0104] In the substrate W having an umbrella-shaped warp, for example, row A is at height position TH2a, row B is at height position TH2b, and row C is at height position TH2c. The height position TH2b of row B is higher than the height position TH2a of row A and the height position TH2c of row C. In this example, these height positions TH2a, TH2b, and TH2c have different thicknesses. The height position TH2a and the height position TH2c may be the same. From the relationship of these height positions, the control unit CU and the calculation unit 55 can recognize that the substrate W has an umbrella-shaped warp. In this case, the upper position UP2 is obtained from the height position TH2b of row B. The lower position DP2 is obtained from the height position TH2a of row A or the height position TH2c of row C. In this example, the lower height position TH2b of row B is higher than the lower position DP2. In other words, the umbrella-shaped warp in this example indicates that the central part of the lower surface of the edge surface of the outer periphery of the substrate W is also lifted up by the warp.

[0105] Furthermore, when the height position TH2b of row B is lower than the height position TH2a of row A and the height position TH2c of row C, the control unit CU and the calculation unit 55 can recognize that the substrate W has a bowl-shaped warp.

[0106] In the substrate W having a half-pipe-like warp, for example, row A is at height position TH3a, row B is at height position TH3b, and row C is at height position TH3c. These height positions TH3a, TH3b, and TH3c have the same thickness, for example. However, the height position TH3b of row B is different from the height position TH3a of row A and the height position TH3c of row C. In addition, the center position in the vertical direction Z of the height position TH3b of row B is different from the center positions in the vertical direction Z of the height position TH3a of row A and the height position TH3c of row C. Therefore, the control unit CU and the calculation unit 55 can recognize that the substrate W has a half-pipe-like warp and the axis CP on the center side faces the front-rear direction X. In this case, the upper position UP3 is obtained from the height position TH3b of row B. The lower position DP3 is obtained from the height position TH3a of row A or the height position TH3c of row C.

[0107] In a state in which three substrates W are accommodated in the carrier C as described above, the thickness shape information of the substrate W in the first slot is the height positions TH1a, TH1b, and TH1c, the upper position UP1, and the lower position DP1. The thickness shape information of the substrate W in the second slot is the height positions TH2a, TH2b, and TH2c, the upper position UP2, and the lower position DP2. The thickness shape information of the substrate W in the third slot is the height positions TH3a, TH3b, and TH3c, the upper position UP3, and the lower position DP3. Based on these thickness shape information, the calculation unit 55 obtains height information HG1_2 of the gap between the substrates W between the first slot and the second slot, and height information HG2_3 of the gap between the substrates W between the second slot and the third slot. For example, when a substrate W in the first slot is to be removed, the substrate W in the first slot becomes the "target substrate," and height information HG1_2 of the gap between the substrate W in the first slot and the substrate W in the second slot below is calculated based on the thickness shape information of the substrate W in the first slot and the thickness shape information of the substrate W in the adjacent second slot below.

[0108] The control unit CU operates the indexer robot IR based on the height information HG1_2, HG2_3 of the gap between the vertically adjacent substrates W obtained by the calculation unit 55. Specifically, when the first hand 19 and the second hand 21 are advanced and retreated from the advance / retract direction FD relative to the carrier C to unload the substrate W, the height positions of the first hand 19 and the second hand 21 are adjusted. For example, when unloading the upper substrate W between substrates W that are not warped, the first hand 19 and the second hand 21 are advanced and retreated at a preset height position that is determined in advance according to the height dimension between the slots. Alternatively, the first hand 19 and the second hand 21 are advanced and retreated at a preset height position that is determined by a teaching process. The control unit CU advances and retreats the first hand 19 and the second hand 21 by offsetting from the preset height position according to the height information.

[0109] 10, since it is known from the thickness shape information that the substrate W in the second slot is warped upward, the first hand 19 or the second hand 21 is offset to a position higher than the predetermined height position and then inserted. This makes it possible to prevent interference with the substrate W in the second slot that is warped upward.

[0110] According to the present embodiment 1, the thickness shape information collecting unit 53 collects thickness shape information based on the outer edge of the substrate W when the substrate W is viewed from the forward / backward direction FD toward the back side of the loading / unloading port CT in a state where the substrate W is accommodated in the carrier C. The thickness shape information includes the thickness of the substrate W not only on the front side of the loading / unloading port CT in the forward / backward direction FD but also on the back side. The thickness shape information includes the thickest dimension on the front side and the back side in the forward / backward direction FD. The calculating unit 55 calculates height information of the gap between two vertically adjacent substrates W that the first hand 19 and the second hand 21 are going to advance / retract based on the thickness shape information. The control unit CU controls the transportation of the indexer robot IR in consideration of the thickness of the three-dimensionally warped substrate W based on the calculated height information. Therefore, even if the substrate W is three-dimensionally warped, interference between the first hand 19 and the second hand 21 during loading / unloading can be prevented.

[0111] The correspondence between the above-mentioned first embodiment and the present invention is as follows.

[0112] The carrier C corresponds to the "container" in this invention. The indexer robot IR corresponds to the "transport section" in this invention. The first hand 19 and the second hand 21 correspond to the "holding hand" in this invention. The reflective sensor 45, the reflecting section 59, and the lid opening and closing mechanism 41 correspond to the "thickness shape information collecting section" in this invention. The lid opening and closing mechanism 41 corresponds to the "relative moving section" in this invention. The rear X of the forward and backward direction FD corresponds to the "first direction" in this invention. The lid opening and closing mechanism 41 corresponds to the "opening and closing mechanism" in this invention. The processing unit corresponds to the "processing section" in this invention. The load / unload block 3 and the indexer block 5 correspond to the "substrate transport device" in this invention.

[0113] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0114] (1) In this embodiment 1, the substrate processing apparatus 1 having the configuration shown in Figures 1 and 2 has been described as an example. However, the present invention is not limited to this configuration. In other words, the configuration of the indexer block 5 and the processing block 7 does not matter. For example, the indexer block 5 does not need to have the first hand 19 and the second hand 21, and it is sufficient if it has at least one hand.

[0115] (2) In the above-described first embodiment, the substrate W having a circular shape in a plan view is processed. However, the present invention is not limited to this embodiment. In other words, the shape of the substrate W may be a square shape, etc.

[0116] (3) In the present embodiment 1, the case where the substrate W is unloaded has been described as an example, but the present embodiment can also be applied to the case where the substrate W is loaded into the carrier C. In other words, since the thickness shape information corresponds to each substrate W, interference can be prevented when the substrate W is loaded into the carrier C by referring to the thickness shape information.

[0117] (4) In the present embodiment 1, the reflective sensor 45 is provided in the lid opening / closing mechanism 41 and is raised and lowered. However, the reflective sensor 45 may be raised and lowered by a lifting mechanism separate from the lid opening / closing mechanism 41. Alternatively, the reflective sensor 45 may be attached to the first hand 19 and the second hand 21, and the thickness shape information of each substrate W may be collected by raising and lowering the first hand 19 or the second hand 21. Furthermore, although the thickness shape information is collected while lowering the reflective sensor 45, the thickness shape information may be collected while raising the reflective sensor 45. Such modifications may also be made in other embodiments described later.

[0118] (5) In the first embodiment, an example has been described in which the processing unit 31, which is a processing section, is provided with a back surface cleaning unit SSR. However, the processing section of the present invention is not limited to a cleaning processing section. The present invention may also include a processing section that performs a predetermined process on the substrate W, for example, resist coating, developing processing, etc. EXAMPLES

[0119] Next, a second embodiment of the present invention will be described with reference to the drawings.

[0120] Fig. 11 is a front view illustrating a configuration of a thickness shape information collecting unit according to the second embodiment. Fig. 12 is a plan view illustrating a configuration of a thickness shape information collecting unit according to the second embodiment.

[0121] In this embodiment 2, the overall configuration of the substrate processing apparatus 1 is almost the same as that of the above-mentioned embodiment 1. Therefore, detailed description of the substrate processing apparatus 1 will be omitted. Note that the same components as those in embodiment 1 will be denoted by the same reference numerals and detailed description will be omitted. The configuration of this embodiment 2 is different in that the carrier C does not include the reflecting portion 59 in the above-mentioned embodiment 1.

[0122] In the second embodiment, the attachment / detachment unit 43 is provided with a reflective sensor 45s. The reflective sensor 45s has basically the same configuration as the reflective sensor 45 in the first embodiment described above. However, it is preferable that the irradiated light of the light-projecting unit 45a of the reflective sensor 45s is stronger than that of the reflective sensor 45, and the light-receiving sensitivity of the light-receiving unit 45b of the reflective sensor 45s is higher than that of the reflective sensor 45. This is because in the second embodiment, it is necessary to directly receive light reflected from the edge face of the outer periphery of the substrate W or from a warped surface of the substrate W to collect thickness shape information of the substrate W.

[0123] In the above-described first embodiment, the reflective sensor 45 does not receive reflected light in a location where the substrate W is present, but receives reflected light in a location where the substrate W is not present. On the other hand, the second embodiment is operationally different from the first embodiment in that the reflective sensor 45s receives reflected light in a location where the substrate W is present, but does not receive reflected light in a location where the substrate W is not present.

[0124] The present embodiment 2 has the same effects as the above-mentioned embodiment 1. Furthermore, in the present embodiment 2, since the carrier C in the above-mentioned embodiment 1 does not include the reflecting portion 59, a normal commercially available carrier C can be used as it is. Therefore, the configuration can be simplified.

[0125] The above-mentioned reflective sensor 45s and the lid opening / closing mechanism 41 correspond to the "thickness / shape information collecting unit" in the present invention. EXAMPLES

[0126] Next, a third embodiment of the present invention will be described with reference to the drawings.

[0127] FIG. 13 is a plan view of a configuration of a thickness shape information collecting unit according to the third embodiment.

[0128] In this embodiment 3, the overall configuration of the substrate processing apparatus 1 is almost the same as that of the above-mentioned embodiment 1. Therefore, a detailed description of the substrate processing apparatus 1 will be omitted. Note that the same components as those in embodiment 1 are denoted by the same reference numerals and a detailed description thereof will be omitted.

[0129] In this embodiment 3, the reflecting portion 59s is disposed outside the carrier C. The carrier C is made of a material that is optically transparent to the light irradiated from the reflective sensor 45s provided in the mounting unit 43. An attachment member 71 is provided on the mounting table 13 at the front X of the carrier C. The attachment member 71 extends in the vertical direction Z. The attachment member 71 has the same reflecting portion 59s as in the embodiment 1 attached thereto. That is, the attachment member 71 has the reflecting portions 59s extending in the vertical direction Z attached at intervals in the width direction Y. The attachment member 71 has three reflecting portions 59s.

[0130] The present embodiment 3 has the same effects as those of the above-mentioned embodiment 1. Furthermore, in the present embodiment 3, the reflective sensor 45s and the reflector 59s can be provided outside the carrier C. Therefore, if the carrier C is made of an optically transparent material, there is no need to modify the carrier C, such as by attaching the reflector 59.

[0131] The reflective sensor 45s, the reflector 59s, and the lid opening / closing mechanism 41 correspond to the "thickness / shape information collecting unit" of the present invention. EXAMPLES

[0132] Next, a fourth embodiment of the present invention will be described with reference to the drawings.

[0133] FIG. 14 is a plan view of a configuration of a thickness shape information collecting unit according to the fourth embodiment.

[0134] In this embodiment 4, the overall configuration of the substrate processing apparatus 1 is almost the same as that of the above-mentioned embodiment 1. Therefore, a detailed description of the substrate processing apparatus 1 will be omitted. Note that the same components as those in embodiment 1 are denoted by the same reference numerals and a detailed description thereof will be omitted.

[0135] The fourth embodiment is different in that it includes a transmission type sensor 81. Three transmission type sensors 81 are arranged at intervals in the width direction Y. The transmission type sensor 81 includes a light-projecting unit 83 and a light-receiving unit 85. The light-projecting unit 83 is provided in the mounting unit 43. The light-projecting unit 83 emits light from the rear X to the front X of the carrier C, which is the "first direction". The light-receiving unit 85 is arranged in the mounting member 71. The light-receiving unit 85 is arranged in the front X, sandwiching the substrate W and the carrier C. The light-receiving unit 85 is arranged to face the light-projecting unit 83 in the front-rear direction X, sandwiching the carrier C. The light-receiving unit 85 is arranged in the opposite direction to the "first direction". The light-receiving unit 85 is configured to be able to move up and down in the vertical direction Z along the surface of the mounting member 71 on the carrier C side. The light-receiving unit 85 moves up and down in the vertical direction Z in conjunction with the mounting unit 43.

[0136] In the fourth embodiment, the light receiving section 85 does not receive the irradiated light in a portion where the substrate W is present, and receives the irradiated light in a portion where the substrate W is not present. In this way, thickness shape information of the substrate W is collected.

[0137] This embodiment 4 has the same effects as the embodiment 1 described above. Furthermore, since the detection method in this embodiment 4 is a transmission type, it is not easily adversely affected by the reflectance of the substrate W to be detected and the reflectance of the surrounding structure. Therefore, it is possible to improve the detection accuracy of the thickness shape information. In addition, the light projecting unit 83 and the light receiving unit 85 can be provided outside the carrier C. Therefore, if the carrier C is made of an optically transparent material, it is not necessary to modify the carrier C, such as by attaching a reflecting unit 59 as in the embodiment 1 described above.

[0138] The above-mentioned transmission sensor 81 (light projecting section 83 and light receiving section 85) and the lid opening and closing mechanism 41 correspond to the "thickness / shape information collecting section" in the present invention.

[0139] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0140] (1) In the fourth embodiment, the light-projecting unit 83 is provided at the rear X, and the light-receiving unit 85 is provided at the front X across the carrier C. The present invention is not limited to this configuration. In other words, the positions of the light-projecting unit 83 and the light-receiving unit 85 may be interchanged.

[0141] (2) In this fourth embodiment, the light receiving unit 85 moves up and down in conjunction with the light projecting unit 83. However, the present invention is not limited to this configuration. For example, the light receiving unit 85 may be fixed in position without being moved up and down. In this case, the light receiving units 85 may be densely arranged in the vertical direction Z, or a line sensor may be arranged as the light receiving unit 85. The line sensor has a detection area in the vertical direction Z that is large enough to include all of the multiple substrates W. EXAMPLES

[0142] Next, a fifth embodiment of the present invention will be described with reference to the drawings.

[0143] FIG. 15 is a plan view of a configuration of a thickness shape information collecting unit according to the fifth embodiment.

[0144] The overall configuration of the substrate processing apparatus 1 is almost the same as that of the above-described embodiment 1. Therefore, a detailed description of the substrate processing apparatus 1 will be omitted. Note that the same components as those in embodiment 1 are denoted by the same reference numerals and detailed descriptions thereof will be omitted.

[0145] In the fifth embodiment, the indexer robot IR includes a photographing unit 91. The photographing unit 91 includes a main body 93 and a lens 95. The photographing unit 91 photographs a projected image of the substrate W as thickness shape information. The main body 93 includes an image sensor and an image processing circuit. The lens 95 forms an image on the image sensor of the main body 93. The lens 95 can move the focal position in the forward and backward directions X in response to an external signal. That is, the lens 95 can adjust the focal position in response to an external signal. The photographing unit 81 is attached to the indexer robot IR, for example. The photographing unit 81 can move in the vertical direction Z, the forward and backward directions X, and the width direction Y together with the indexer robot IR. The photographing unit 91 is disposed on the base end side of the first hand 19 and the second hand 21.

[0146] The photographing unit 91 is capable of capturing all of the substrates W within its field of view. However, due to optical performance such as aberration of the lens 95, it may not be practical to capture all of the substrates W within its field of view. In that case, the photographing unit 91 may be configured to simultaneously capture a predetermined number of substrates W (e.g., five substrates) that is less than the total number of substrates W, rather than all of the substrates W. In this case, the photographing unit 91 is moved stepwise in the vertical direction Z by the indexer robot IR to capture images of all of the substrates W in the carrier C. After that, a single image showing all of the substrates W may be generated by image processing, and used for the calculation process of thickness and shape information.

[0147] The photographing unit 91 is controlled by a thickness shape information collecting unit 53 as shown in Fig. 16. Fig. 16 is a block diagram showing an example of a thickness shape information collecting unit according to Example 5. The thickness shape information collecting unit 53 includes a focus control unit 97, a photographing control unit 99, an image storage unit 101, an image synthesis unit 103, and a thickness shape information calculation unit 105.

[0148] The focus control unit 97 adjusts the focal position of the lens 95 in response to an instruction from the control unit CU. The shooting control unit 99 sets shooting conditions in response to an instruction from the control unit CU, and shoots an image by the main body 93 through the lens 95. The projected image shot by the main body 93 is stored in the image storage unit 101. The image storage unit 101 stores images focused on at least a plurality of points.

[0149] Here, reference is made to Fig. 17. Fig. 17(a) to (c) are schematic diagrams for explaining the focus position and the composite image. Fig. 17(a) to (c) are schematic diagrams viewed from the width direction Y.

[0150] The image storage unit 101 stores at least two projection images focused on a first focusing position IF1 as shown in FIG. 17(a) and a second focusing position IF2 as shown in FIG. 17(b). The first focusing position IF1 is, for example, a part of the substrate W on the loading / unloading exit CT side. The second focusing position IF2 is, for example, a part of the substrate W on the back side in the forward / backward direction X from the first focusing position IF2. Due to general optical characteristics, when the lens 95 is located at a position close to the substrate W as the subject, the distance in the forward / backward direction X at which the lens 95 can be considered to be in focus is short. Therefore, even if the substrate W is photographed from the indexer robot IR, it is not realistic to focus from the end face of the substrate W on the loading / unloading exit CT side to the back side of the substrate W in the forward / backward direction X. Therefore, the focusing position is moved to at least two positions in front and back of the substrate W to photograph two projection images. The rear side of the substrate W where the second focusing position IF2 is located is preferably the portion of the substrate W where the thickness is greatest.

[0151] The image synthesis unit 103 reads out two projection images having different focus positions stored in the image storage unit 101 and synthesizes them (FIG. 17(c)). The thickness shape information calculation unit 105 calculates thickness shape information based on the synthesized image. The thickness shape information calculation unit 105 extracts the outer edge of the substrate W in the synthesized image by image processing such as edge emphasis, and calculates thickness shape information based on the outer edge of the substrate W from the extracted outer edge. The thickness shape information is referenced by the calculation unit 55. In this way, by setting focus positions in at least two locations, thickness shape information can be accurately collected.

[0152] Here, reference is made to Fig. 18. Figs. 18(a) to (c) are schematic diagrams for explaining an example of calibration in image processing. Figs. 18(a) to (c) are diagrams of the rear side of the carrier C as viewed from the front-rear direction X.

[0153] <1. Proofreading process>

[0154] It is preferable that the thickness shape information collecting unit 53 performs a calibration process as follows.

[0155] As shown in Figs. 18(a) and (b), a substrate W having no warpage and known dimensions is photographed. For example, as shown in Fig. 18(a), a photographing unit 91 photographs a state in which a plurality of substrates W having no warpage and a first thickness d1 are housed in a carrier C. Furthermore, as shown in Fig. 18(b), a photographing unit 91 photographs a state in which a plurality of substrates W having no warpage and a second thickness d2 are housed in a carrier C. The first thickness d1 and the second thickness d2 are different. In addition, since the dimensions of the substrate W are known and the interval in the vertical direction Z of the locking portion 57 of the carrier C is known, the distance between the upper and lower surfaces of the plurality of substrates W housed in a stack is also known. In other words, the distance SP1 between the substrates W having the first thickness d1 in the projected image and the distance SP2 between the substrates W having the second thickness d2 are known.

[0156] Of these, a first reference image RF1 which is a projected image of a plurality of substrates W having a first thickness d1, and a second reference image RF2 which is a projected image of a plurality of substrates W having a second thickness d2 are stored in advance in the image storage unit 101. The thickness shape information calculation unit 105 sets a standard for determining the dimensions of the projected image photographed by the photographing unit 91, based on the first reference image RF1 and the second reference image RF2 in the image storage unit 101.

[0157] <2. Calculation process>

[0158] After completing the calibration process as described above, when processing the substrate W as a product, thickness shape information of the substrate W is obtained. Specifically, the dimension in the vertical direction Z of the composite image synthesized by the image synthesis unit 103 is determined. That is, the thickness shape information calculation unit 105 knows the dimension in the projected image, that is, the correspondence relationship between the distance between pixels at a portion of the substrate W in the projected image and the actual dimension, from the first reference image RF1 and the second reference image RF2 including known dimensions. Therefore, the thickness shape information calculation unit 105 obtains the dimension based on the outer edge of the substrate W shown in the composite image. That is, the thickness shape information calculation unit 105 calculates the thickness shape information of the substrate W. In this way, the thickness shape information collection unit 53 collects the thickness shape information of the substrate W by the photographing unit 91.

[0159] According to this embodiment 5, the same effects as those of the above-mentioned embodiment 1 can be achieved. Furthermore, thickness shape information can be collected by capturing a projected image with the photographing unit 91. Therefore, it is necessary to provide the photographing unit 91 only on the loading / unloading port CT side of the carrier C. As a result, the configuration of the thickness shape information collecting unit 53 can be simplified. Furthermore, by expanding the field of view in the direction in which multiple substrates W are stacked, multiple pieces of thickness shape information can be collected simultaneously.

[0160] In addition, the first reference image RF1 and the second reference image RF2 are stored in advance in the image storage unit 101, and the dimensions in the projected images are calculated based on the known dimensions to collect thickness shape information. In other words, since calibration is performed, the thickness shape information can be collected accurately based on the dimensions of the projected images.

[0161] The above-mentioned photographing unit 91, focus control unit 97, photographing control unit 99, image storage unit 101, image synthesis unit 103, and thickness shape information calculation unit 105 correspond to the "thickness shape information collection unit" in the present invention.

[0162] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0163] (1) In the fifth embodiment, the number of focusing positions is two. However, the present invention is not limited to this. In other words, the number of focusing positions may be three or more.

[0164] (2) In this embodiment 5, the photographing unit 91 is provided on the indexer robot IR. However, the present invention is not limited to such an arrangement. In other words, the arrangement position of the photographing unit 91 is not limited as long as it can photograph the multiple substrates W accommodated in the carrier C from the load / unload port CT.

[0165] (3) In this embodiment 5, one photographing unit 91 corresponds to all the carriers C. However, the present invention is not limited to one photographing unit 91. In other words, one photographing unit 91 may be arranged facing each carrier C, and a total of four photographing units 91 may be provided. In addition, there may be provided a photographing unit 91 in which the focal position of the lens 95 is fixed and set at the first focusing position IF1, and two photographing units 91 in which the focal position of the lens 95 is fixed and set at the second focusing position IF2. This eliminates the need for control to switch the focal position. EXAMPLES

[0166] Next, a sixth embodiment of the present invention will be described with reference to the drawings.

[0167] 19 is a side view illustrating an example of a thickness shape information collecting unit according to the sixth embodiment. FIG 20 is a plan view illustrating an example of a thickness shape information collecting unit according to the sixth embodiment.

[0168] In this embodiment 6, the overall configuration of the substrate processing apparatus 1 is almost the same as that of the above-mentioned embodiment 1. Therefore, a detailed description of the substrate processing apparatus 1 will be omitted. Note that the same components as those in embodiment 1 are denoted by the same reference numerals and a detailed description thereof will be omitted.

[0169] In this embodiment 6, the thickness shape information collecting unit 53 includes a light projecting unit 111 and a line sensor 113. The light projecting unit 111 and the line sensor 113 are disposed on the mounting table 13. In other words, they are disposed outside the carrier C. The light projecting unit 111 is disposed on the carrier C on the side of the loading / unloading opening CT. The light projecting unit 111 is disposed on the mounting table 13. The light projecting unit 111 irradiates light from the loading / unloading opening CT side, which is the "first direction", toward the back side of the carrier C. The carrier C is made of a material that is optically transparent to the light irradiated by the light projecting unit 111. The light projecting unit 111 is moved in the width direction Y by the horizontal driving unit 115. The light projecting unit 111 has a light emitting surface that is sufficient to irradiate the entire line sensor 113 with light.

[0170] The line sensor 113 is disposed on the opposite side of the "first direction" across the substrate W in a plan view. The line sensor 113 has a detection section that is long in the vertical direction Z. The line sensor 113 has a detection section that is long in the direction in which the multiple substrates W are stacked and accommodated, for example. The line sensor 113 has a detection section length that is sufficient to collect thickness shape information of all substrates W accommodated in the carrier C. The line sensor 113 has a resolution sufficient to collect thickness shape information of the substrates W. The line sensor 113 is moved in the width direction Y by the horizontal drive unit 117. The movement by the horizontal drive unit 115 is linked to the movement of the horizontal drive unit 117. That is, the light projecting unit 111 and the line sensor 113 move in an opposing state. The light projecting unit 111 and the line sensor 113 move in the same direction and at the same speed.

[0171] With the lid CL of the carrier C open, the light projector 111 and the line sensor 113 are moved in conjunction with each other in the width direction Y. This makes it possible to collect thickness shape information of the multiple substrates W accommodated in the carrier C.

[0172] According to the present embodiment 6, the same effects as those of the above-mentioned embodiment 1 can be obtained. Furthermore, in the present embodiment 6, since the line sensor 113 is used, it is not necessary to move in the direction in which the multiple substrates W are stacked. Therefore, thickness shape information of the multiple substrates W can be efficiently collected.

[0173] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0174] (1) In this embodiment 6, the line sensor 113 has a detection length sufficient to collect thickness shape information of all of the substrates W accommodated in the carrier C. However, the present invention is not limited to this form. In other words, the line sensor 113 may have a detection length sufficient to collect thickness shape information of a portion of a smaller number of substrates W at one time than the total number of substrates W. In this case, it is sufficient to move the line sensor 113 in the direction in which the substrates W are stacked and in the width direction Y. Furthermore, such a line sensor 113 may be disposed at three locations along the width direction Y. In this case, it is sufficient to move the line sensor 113 up and down in the direction in which the substrates W are stacked.

[0175] (2) In the sixth embodiment, one line sensor 113 is provided and moved in the width direction Y. However, the present invention is not limited to this configuration. For example, three line sensors 113 may be arranged spaced apart in the width direction Y. Also, one light projector 111 may be arranged opposite each line sensor 113. This eliminates the need to move the three line sensors 113 and the three light projectors 111 in the width direction Y.

[0176] In the embodiment of the present invention, height information of the gap between two vertically adjacent substrates is calculated. However, the present invention is not limited to this embodiment. That is, for the substrate W arranged at the bottom of the carrier C, height information of the gap between the carrier C and the substrate W may be calculated. Even in this case, the substrate W is subjected to the same processing as in the above embodiment to calculate the height information. [Explanation of symbols]

[0177] 1 ... Substrate processing equipment 3 … Loading / unloading block 5 … Indexer block 7 … Processing block W … Substrate X…Anteroposterior direction Y: Width direction Z: Vertical direction 9 … Input section 11 ... Payment section C...Career 13 ... Placement table IR... Indexer robot 19 … First Hand 21 … Second hand FD… Advance / retreat direction 31 … Processing unit 37 … Front panel 39…Aperture 41 ... Lid opening and closing mechanism CT… Loading / unloading exit CL... Lid 43 ... Detachable unit 45 ... Reflective sensor 45a … Light projecting section 45b... Light receiving section CU: Control unit 51 … Storage section 53 ... Thickness and shape information collection section 55 ... Calculation section 57 ... Locking part 59…Reflector 61 … Support piece UP1,UP2,UP3…Upper position DP1,DP2,DP3…lower position

Claims

1. A substrate transport device capable of storing a plurality of substrates stacked with gaps therebetween and transporting the substrates between a container having an inlet / outlet on one side, comprising: a transport unit including a holding hand for holding the substrate, the holding hand being moved forward and backward from the loading / unloading opening of the container to a gap between the substrates to transport the substrate; a thickness shape information collecting unit that collects thickness shape information for each substrate based on an outer edge of the substrate when the substrate is viewed along a direction in which the holding hand moves forward and backward while the substrate is accommodated in the container; a calculation unit that calculates height information of a gap between two vertically adjacent substrates that the holding hand is about to advance or retreat between when the transport unit loads or unloads the substrates between the storage unit and the substrate storage unit, based on the thickness shape information of the two vertically adjacent substrates; A control unit that controls the conveyance of the conveying unit based on the height information; A substrate transport device comprising:

2. 2. The substrate transport apparatus according to claim 1, A substrate transport device characterized in that the thickness shape information includes an end face height position, which is the height position of the end face of the substrate stored in the container on the loading / unloading port side, and a rear height position at which a portion of the substrate is located further back than the end face and away in the height direction from the end face height position.

3. 2. The substrate transport apparatus according to claim 1, a relative moving unit that moves a relative position between the container and the thickness shape information collecting unit in a height direction; a storage unit configured to store the thickness shape information of each substrate obtained by relatively moving the container and the thickness shape information collecting unit by the relative moving unit; Further equipped with the thickness shape information collecting unit collects the thickness shape information at a plurality of locations in a horizontal direction perpendicular to a moving direction of the holding hand; The substrate transport device according to claim 1, wherein the calculation unit calculates the height information of the gap between vertically adjacent substrates based on the thickness shape information of each substrate stored in the memory unit.

4. 4. The substrate transport device according to claim 3, The thickness shape information collecting unit is a light projecting unit that projects light from a first direction toward an outer surface of the substrate; a light receiving unit that receives light irradiated from the light projecting unit and reflected from a direction opposite to the first direction; A substrate transport device comprising:

5. 5. The substrate transport device according to claim 4, The substrate transport device is characterized in that the thickness shape information collection unit is arranged inside the container opposite the light-projecting unit across the substrate, and further includes a reflection unit that reflects light from the light-projecting unit at the multiple locations.

6. 5. The substrate transport device according to claim 4, The substrate transport device, wherein the light receiving section receives the reflected light from the substrate.

7. 6. The substrate transport apparatus according to claim 5, The container further includes an opening / closing mechanism for attaching and detaching a lid attached to the loading / unloading opening of the container, the opening / closing mechanism lowering the lid downward along the loading / unloading opening when removing the lid, The substrate transport device, wherein the light projecting unit and the light receiving unit are attached to the opening and closing mechanism.

8. 5. The substrate transport device according to claim 4, the container is made of a material that is optically transparent to the light emitted from the light projecting unit, A reflecting section that reflects the light emitted from the light projecting section is further provided. The substrate transport device, wherein the reflecting portion is disposed outside the container.

9. 4. The substrate transport device according to claim 3, The thickness shape information collecting unit is a light projecting unit that projects light onto an outer surface of the substrate from a first direction toward the substrate; a light receiving unit that has a function of receiving the irradiated light from the light projecting unit and is disposed outside the container in a direction opposite to the first direction with the substrate therebetween; Equipped with The substrate transport device according to claim 1, wherein the container is made of a material that is optically transparent to the light emitted from the light projector.

10. 2. The substrate transport apparatus according to claim 1, The substrate transport device, wherein the thickness shape information collecting unit is disposed on the loading / unloading side of the container and includes an image capturing unit that captures a projected image as the thickness shape information.

11. 11. The substrate transport apparatus according to claim 10, The photographing unit is configured to be able to adjust a focus position, The control unit controls the focus position of the photographing unit to focus on at least two positions on the substrate, a first focus position focused on a portion of the substrate on the loading / unloading port side, and a second focus position focused on a portion of the substrate further back than the first focus position.

12. 12. The substrate transport apparatus according to claim 11, An image storage unit that stores the projection image captured by the imaging unit, the control unit causes the photographing unit to photograph a plurality of substrates having a first thickness and no warping contained in the container, and causes the projection image collected at this time to be stored in the image storage unit as a first reference image; and causes the photographing unit to photograph a plurality of substrates having a second thickness and no warping different from the first thickness contained in the container, and causes the projection image collected at this time to be stored in the image storage unit as a second reference image; The substrate transport device is characterized in that, when processing a substrate which is a product, the thickness shape information collection unit calculates dimensions in the projected image based on known dimensions in a first reference image and a second reference image stored in the image memory unit, and collects the thickness shape information.

13. 4. The substrate transport device according to claim 3, The thickness shape information collecting unit is a light projecting unit that projects light onto an outer surface of the substrate from a first direction toward the substrate; a line sensor having a function of receiving the irradiated light from the light projecting unit, the line sensor being disposed outside the container in a direction opposite to a first direction with the substrate sandwiched therebetween, the line sensor having a detection area that is long in a stacking direction of the plurality of substrates contained inside the container; Equipped with The substrate transport device according to claim 1, wherein the container is made of a material that is optically transparent to the light emitted from the light projector.

14. 2. The substrate transport apparatus according to claim 1, The substrate transport device is characterized in that the calculation unit calculates the height information based on the shape of the outer edges of a target substrate transported by the transport unit and a substrate adjacent to the target substrate, among the thickness shape information.

15. A substrate transport device according to any one of claims 1 to 4, A processing unit that performs a predetermined process on the substrate transported by the substrate transport device; A substrate processing apparatus comprising:

Images