Substrate transfer device and substrate processing apparatus including the same

Abstract

To provide a substrate transfer device capable of preventing damage to a substrate and a substrate processing apparatus including the same.SOLUTION: A substrate transfer device 2 includes an indexer robot IR that enters a carrier C capable of accommodating a plurality of substrates W and transfers a substrates W accommodated in the carrier C, an imaging unit 21 and an image processing unit 53 that acquire shape information of the substrates W accommodated in the carrier C, and a control unit CU that controls the indexer robot IR based on the shape information. This shape information is shape information as seen in a direction in which the indexer robot IR enters the carrier C, and includes at least shape information at a center position in a depth direction of the substrate W accommodated in the carrier C, which is obtained using near-infrared rays. This shape information is less susceptible to the influence of reflected light from the surface of the substrate W, the influence of multiple reflections between substrates W, and the influence of objects reflected behind the substrate W. Therefore, damage to the substrate can be prevented.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a substrate transport device and a substrate processing apparatus including the same, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic electroluminescence (EL), a substrate for a flat panel display (FPD), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, a substrate for a photomask, or a substrate for a solar cell. [Background technology]

[0002] Conventionally, this type of apparatus has a cassette for storing substrates, a substrate transport mechanism for removing the substrates from the cassette and transporting them into a substrate processing apparatus, and an imaging means for imaging the substrates stored in the cassette, in which the substrates stored in the cassette are imaged and the shape of the substrate is determined based on the image of the substrate, and the substrate transport mechanism transports the substrate to a processing unit based on the determined shape of the substrate (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-69386 A (page 2, FIG. 2) Summary of the Invention [Problem to be solved by the invention]

[0004] However, the conventional example having such a configuration has the following problems. That is, in the conventional device, the captured image obtained by the imaging means capturing an image of the substrate held in the cassette is affected by light reflected from the substrate surface and multiple reflections between the substrates, the color of the cassette reflected behind the substrate, and objects installed behind the cassette reflected in the transparent part of the cassette, so that it is difficult to obtain an appropriate contrast at the boundary between the substrate shape and the background. Therefore, when the substrate transport device transports the substrate out of the cassette, there is a risk that the substrate transport device will interfere with the substrate and come into contact with the substrate surface, scratching or damaging the substrate.

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate transport device capable of preventing damage to a substrate, and a substrate processing apparatus including the same. [Means for solving the problem]

[0006] In order to achieve the above object, the present invention has the following configuration. In other words, the substrate transport device of the present invention is capable of storing multiple substrates stacked with gaps between them, and transports the substrates between a carrier having an loading / unloading opening on one side, and is equipped with a holding hand that holds the substrate, a transport unit that transports the substrate by moving the holding hand forward and backward from the loading / unloading opening of the carrier into the gap between the substrates, an acquisition unit that acquires shape information of the substrate when the substrate is stored in the carrier in the forward and backward direction of the holding hand and viewed from the loading / unloading opening side of the carrier, and a control unit that controls the transport unit based on the shape information, and is characterized in that the acquisition unit acquires the shape information of the substrate by irradiating light in a wavelength range longer than visible light from the forward and backward direction of the holding hand.

[0007] According to the substrate transport device of the present invention, the shape information of the substrate used to control the transport unit is shape information when the substrate is viewed from the carrier's loading / unloading port side in the direction of the holding hand's movement, and is obtained by irradiating the substrate with light in a wavelength range longer than visible light in the direction of the holding hand's movement, so that the substrate is less susceptible to the influence of reflected light from the substrate surface, the influence of multiple reflections between substrates, and the influence of objects reflected behind the substrate. Therefore, an appropriate contrast can be obtained at the boundary between the substrate shape and the background, and damage to the substrate can be prevented.

[0008] In the substrate transport device according to the present invention, it is preferable that the light in the wavelength region longer than visible light is light in a wavelength region that transmits through the inside of the substrate (claim 2). This makes it possible to eliminate the influence of light reflected from the substrate surface, the influence of multiple reflections between substrates, and the influence of objects reflected behind the substrate.

[0009] In the substrate transport device according to the present invention, the light in a wavelength region longer than visible light is preferably light in a near-infrared wavelength region (claim 3). This makes it possible to effectively eliminate the effects of light reflected from the substrate surface, the effects of multiple reflections between substrates, and the effects of objects reflected behind the substrate.

[0010] In the substrate transport device according to the present invention, it is preferable that the shape information is a cross-sectional shape of the substrate at a predetermined position in the advancing / retracting direction of the holding hand (claim 4). This makes it possible to grasp the three-dimensional shape of the substrate at the predetermined position in the advancing / retracting direction of the holding hand.

[0011] In the substrate transport device according to the present invention, the predetermined position in the depth direction of the substrate is preferably a center part of the substrate accommodated in the carrier (claim 5). This makes it possible to grasp the part of the substrate accommodated in the carrier that is likely to become warped or thick.

[0012] In the substrate transport device according to the present invention, it is preferable that the shape information includes the shape of the upper edge of the substrate accommodated in the carrier (claim 6). This makes it possible to grasp the shape of the substrate accommodated in the carrier three-dimensionally from the center and the upper edge.

[0013] In the substrate transport device according to the present invention, it is preferable that the acquisition unit includes an imaging unit that uses light in a wavelength region longer than the visible light to image the substrate accommodated in the carrier and acquires a substrate image, and acquires the shape information from the substrate image (claim 7). This makes it possible to acquire a substrate image that is less affected by light reflected from the substrate surface, by multiple reflections between substrates, or by objects reflected behind the substrate.

[0014] In the substrate transport device according to the present invention, it is preferable that the imaging unit is provided in the transport unit (claim 8). This makes it possible to freely adjust the imaging position of the imaging unit and the imaging sequence.

[0015] In addition, the substrate transport device according to the present invention preferably includes a platform for placing the carrier and an opening mechanism for opening a door of the carrier placed on the platform, and the imaging unit images the substrate when the opening mechanism has opened the door or while the opening mechanism is opening the door (claim 9). This makes it possible to accurately obtain shape information of the substrate immediately before it is transported to the transport unit.

[0016] In the substrate transport device according to the present invention, it is preferable that the image capturing unit is provided in the opening mechanism (claim 10). This allows the transport unit to have a simple configuration without including the image capturing unit.

[0017] In addition, it is preferable that the substrate transport device according to the present invention further comprises a gap information acquisition unit that acquires gap information between the substrates into which the transport unit enters based on the shape information of the substrates accommodated in the carrier, and the control unit controls the transport unit based on the gap information (claim 11). This makes it possible to acquire gap information that is less susceptible to the effects of reflected light from the substrate surfaces, multiple reflections between substrates, and objects reflected behind the substrates.

[0018] In the substrate transport device according to the present invention, it is preferable that the control unit adjusts the insertion height position of the holding hand based on the gap information (claim 12), thereby effectively preventing damage to the substrate.

[0019] In addition, it is preferable that the substrate processing apparatus according to the present invention includes the substrate transport device and a processing section for performing a predetermined process on the substrate transported by the substrate transport device (claim 13). This makes it possible to process the substrate without damaging it. Effect of the Invention

[0020] According to the substrate transport device of the present invention and the substrate processing apparatus equipped with the same, the shape information of the substrate used to control the transport section is less susceptible to the effects of reflected light from the substrate surface, multiple reflections between substrates, and objects reflected behind the substrate, thereby preventing damage to the substrate. [Brief description of the drawings]

[0021] [Figure 1] 1 is a plan view showing an overall configuration of a substrate processing apparatus according to a first embodiment. [Diagram 2] 1A to 1E are side views showing the configuration and operation of a carry-in / out block. [Diagram 3] FIG. 4A is a diagram for explaining an imaging unit, and FIG. 4B is a diagram for explaining a method for imaging a substrate accommodated in a carrier. [Figure 4] FIG. 2 is a plan view illustrating a substrate and an imaging unit. [Diagram 5]FIG. 1 shows an example of a substrate warped into a bowl shape, where (a) is a view seen from the front-rear direction X, and (b) is a view seen from the width direction Y. [Figure 6] 1(a) to 1(c) are diagrams showing the principle of acquiring a near-infrared image of a lower edge W of a substrate. [Figure 7] FIG. 2(a) is a front view showing a part of a substrate accommodated in a carrier, and FIG. 2(b) is a near-infrared image thereof. [Figure 8] FIG. 2 is a block diagram showing an example of a control system. [Figure 9] 13(a) to 13(c) are diagrams conceptually showing how to obtain information about the gap between boards using infrared images. [Figure 10] 13(a) and 13(b) are diagrams conceptually showing how to find the center position between substrates. [Figure 11] FIG. 1 shows an example of a substrate warped into an umbrella shape, where (a) is a view seen from the front-rear direction X, and (b) is a view seen from the width direction Y. [Figure 12] FIG. 1 shows an example of a substrate warped into a half-pipe shape, where (a) is a view seen from the front-rear direction X, and (b) is a view seen from the width direction Y. [Figure 13] 13(a) and (b) are diagrams showing the arrangement of an imaging unit according to a modified example. [Figure 14] 13(a) and (b) are diagrams showing a method of imaging a substrate according to a modified example. [Figure 15] 15(a) and (b) are diagrams showing a method of imaging a substrate according to a modified example different from that shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] The present invention will now be described with reference to various examples. EXAMPLES

[0023] A first embodiment of the present invention will be described below with reference to the drawings.

[0024] FIG. 1 is a plan view showing an overall configuration of a substrate transfer device 2 and a substrate processing apparatus 1 including the same according to a first embodiment.

[0025] <1. Overall composition>

[0026] The substrate processing apparatus 1 includes a carry-in / out block 3, an indexer block 5, and a processing block 7. The carry-in / out block 3 and the indexer block 5 constitute a substrate transport apparatus 2.

[0027] The substrate processing apparatus 1 processes a substrate W. The substrate W has, for example, a circular shape in a plan view. The substrate processing apparatus 1 performs, for example, a cleaning process on the substrate W. The substrate processing apparatus 1 processes the substrate W in a processing block 7 in a single-wafer manner. In the single-wafer manner, each substrate W is processed one by one in a horizontal position.

[0028] For convenience, in this specification, the direction in which the load / unload block 3, indexer block 5, and processing block 7 are lined up is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the processing block 7 toward the load / unload block 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." In each figure, for reference, front, back, right, left, top, and bottom are indicated as appropriate.

[0029] <2. Loading / unloading block>

[0030] The carry-in / out block 3 includes an input section 9 and an unloading section 11. The input section 9 and the unloading section 11 are arranged in the width direction Y. A plurality of substrates W (e.g., 25 substrates) are stored in a single carrier C in a horizontal orientation, stacked at regular intervals. The carrier C storing the unprocessed substrates W is placed in the input section 9. The input section 9 includes, for example, two mounting tables 13 on which the carriers C are placed. The carrier C stores the substrates W one by one with the surfaces of the substrates W spaced apart. The carrier C stores the substrates W, for example, with the front surfaces of the substrates W facing upward. An example of the carrier C is a front opening unify pod (FOUP). A FOUP is a sealed container. The carrier C may be an open container, and any type of carrier C may be used.

[0031] The unloading unit 11 is disposed on the opposite side of the input unit 9 across the center of the width direction Y of the substrate processing apparatus 1. The unloading unit 11 is disposed to the left Y of the input unit 9. The unloading unit 11 stores the processed substrates W in a carrier C and unloads the carrier C. The unloading unit 11 that functions in this manner includes, like the input unit 9, two mounting tables 13 for placing the carriers C, for example. The input unit 9 and the unloading unit 11 are also called load ports.

[0032] <3. Indexer block>

[0033] The indexer block 5 is disposed adjacent to the rear X of the carry-in / out block 3 in the substrate processing apparatus 1. The indexer block 5 includes an indexer robot IR and a transfer unit 15.

[0034] The indexer robot IR is configured to be rotatable around the vertical direction Z. The indexer robot IR is configured to be movable in the width direction Y. The indexer robot IR is equipped with a hand 19. The hand 19 holds one substrate W. The hand 19 is configured to be independently movable forward and backward in the forward and backward directions X. The indexer robot IR moves in the width direction Y and rotates around the vertical direction Z, and moves the hand 19 forward and backward to transfer the substrate W between the cassette C and the transfer section 15. The direction in which the hand 19 moves when transferring the substrate W between the carrier C is referred to as the forward and backward direction FD.

[0035] The advancing / retreating direction FD is indicated by one arrow indicating the front-rear direction X and two arrows indicating diagonal directions relative to the front-rear direction X. The arrows indicating the diagonal directions may deviate from the diagonal directions shown in the figure as long as they are diagonal directions relative to the front-rear direction X. Furthermore, the advancing / retreating direction FD may include components of the width direction Y and the vertical direction Z as long as they are components of the direction in which the hand 19 moves.

[0036] Furthermore, the substrate transport device 2 controls the indexer robot IR based on shape information of the substrate W including at least shape information of the substrate W accommodated in the carrier C at a predetermined position in the depth direction, which is obtained using near-infrared rays. The shape information of the substrate W is obtained, for example, in the indexer block 5. The indexer block 5 includes an imaging unit 21 that images the substrate W accommodated in the carrier C by irradiating near-infrared rays from the forward / backward direction FD of the carrier C, and obtains an image of the substrate W accommodated in the carrier C. The imaging unit 21 is provided, for example, in the indexer robot IR.

[0037] Here, the near-infrared rays are roughly infrared rays that are included in a wavelength range of infrared rays that is shorter than the wavelength range of far-infrared rays. That is, infrared rays are electromagnetic waves with a wavelength range of 0.76 to 0.8 μm, which is the upper limit of visible light, as a lower limit, and an upper limit of about 1 mm. Near-infrared rays are infrared rays that are 2.5 μm or less in the infrared wavelength range. The near-infrared rays in the present invention are preferably in a wavelength range that can acquire a near-infrared image that clearly distinguishes the shape of the substrate W from the carrier C behind the substrate W. The near-infrared rays are preferably reflected by the edge of the substrate W, transmitted through the inside of the substrate W, and have a lower near-infrared transmittance for the carrier C made of synthetic resin than the substrate W. In the present invention, the edge corresponds to the outermost periphery of the substrate W when the substrate W accommodated in the carrier C is viewed from the opening of the carrier C. In the case of a substrate W with a downward convex center, the upper edge W in FIG. 6 is the upper edge W. ue and the lower edge W Le corresponds to the edge. The edge is the interface between the substrate W and the atmosphere, and a refractive index difference occurs between the substrate W and the atmosphere. Therefore, when light is incident on the edge, the light is reflected. In the present invention, the inside corresponds to the part other than the edge when the substrate W accommodated in the carrier C is viewed from the opening of the carrier C.

[0038] The transfer section 15 is disposed on the boundary between the indexer block 5 and the processing block 7. The transfer section 15 is disposed, for example, at the center in the width direction Y. The transfer section 15 includes an inversion unit (not shown) that inverts the substrate W upside down.

[0039] <4. Processing block>

[0040] The processing block 7 performs, for example, a cleaning process on the substrate W. The cleaning process is, for example, a process using a brush in addition to a processing liquid. As shown in FIG. 1, the processing block 7 is, for example, divided into a first row R1, a second row R2, and a third row R3 in the width direction Y. In detail, the first row R1 is disposed on the left side Y. The second row R2 is disposed in the center of the width direction Y. In other words, the second row R2 is disposed on the right side Y of the first row R1. The third row R3 is disposed on the right side Y of the second row R2.

[0041] The processing block 7 is configured as described above. Here, an example of the operation of the center robot CR will be briefly described. The center robot CR receives the substrate W from the delivery section 15. The center robot CR transports the substrate W to a back surface cleaning unit SSR in either the first row R1 or the third row R3 to perform cleaning processing on the back surface of the substrate W. The center robot CR receives the substrate W that has been cleaned in the back surface cleaning unit SSR in either the first row R1 or the third row R. The center robot CR transports the substrate W to the delivery section 15.

[0042] <5. Mounting table>

[0043] The above-mentioned carry-in / out block 3 will now be described in detail with reference to Figures 1 and 2. Figures 2(a) to (e) are side views showing the configuration and operation of the carry-in / out block.

[0044] The loading / unloading block 3 includes a mounting table 13, an opening 39, and a lid opening / closing mechanism 41. The mounting table 13 has a carrier C mounted thereon. The mounting table 13 includes a mechanism (not shown) for moving the carrier C in the forward / backward direction X. The mounting table 13 can move the carrier C forward and backward relative to the opening 39. The carrier C has a loading / unloading opening CT. The loading / unloading opening CT is formed on one side of the carrier C. A plurality of substrates W stored in a stack in the carrier C are loaded and unloaded via the loading / unloading opening CT. The carrier C includes a lid CL. The lid CL is configured to be detachably attached to the loading / unloading opening CT of the carrier C. The lid CL seals the inside of the carrier C. When the lid CL is attached to the carrier C, the carrier C is isolated from the atmosphere outside the carrier C.

[0045] The lid opening / closing mechanism 41 is provided with an attachment / detachment unit 43 at the front X. The attachment / detachment unit 43 removes the lid CL from the carrier C and attaches the lid CL to the carrier C. The attachment / detachment unit 43 is movable in the vertical direction Z and the front-rear direction X while holding the lid CL. The lid opening / closing mechanism 41 is movable in the front-rear direction X in the opening 39 while holding the lid CL. The lid opening / closing mechanism 41 is capable of ascending and descending in the vertical direction Z while holding the lid CL. The lid opening / closing mechanism 41 is capable of moving downward in the vertical direction Z from the opening 39 while holding the lid CL. The lid opening / closing mechanism 41 can fully open the opening 39 by descending while holding the lid CL.

[0046] First, as shown in Fig. 2(a), the carrier C is placed on the mounting table 13. The carrier C accommodates a plurality of stacked substrates W and is closed with the lid CL. At this time, the lid opening / closing mechanism 41 positions the attachment / detachment unit 43 at the opening 39. This separates the inside of the indexer block 5 from the outside atmosphere.

[0047] As shown in FIG. 2(b), the mounting table 13 moves the carrier C to the rear X. The carrier C is positioned at the loading / unloading opening CT and the lid CL is positioned at the opening 39. At this time, the mounting / removal unit 43 releases the lock on the lid CL and holds the lid CL. The holding is performed, for example, by the mounting / removal unit 43 sucking the lid CL.

[0048] 2(c), the lid opening / closing mechanism 41 moves rearward X. As a result, the lid CL is moved rearward X from the opening 39. The lid CL is moved into the inside of the indexer block 5.

[0049] 2(d), the lid opening / closing mechanism 41 moves downward in the vertical direction Z. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 to the bottom of the loading / unloading opening CT. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 until an upper portion of the attachment / detachment unit 43 is positioned below the opening 39.

[0050] 2(e), the lid opening / closing mechanism 41 moves to the bottom. The lid opening / closing mechanism 41 descends to a position where the mounting / removal unit 43 does not overlap with the opening 39 in the front-rear direction X. This causes the opening 39 to be fully opened. The multiple substrates W in the carrier C can be seen from the indexer block 5 through the opening 39.

[0051] <6. Configuration of the imaging unit and carrier C>

[0052] Please refer to Fig. 3. Fig. 3(a) is a diagram for explaining the imaging unit 21, and Fig. 3(b) is a diagram for explaining a method for imaging the substrate W accommodated in the carrier C.

[0053] 3(a), the imaging unit 21 is provided in the indexer block 5. The imaging unit 21 is provided in, for example, the indexer robot IR.

[0054] The imaging unit 21 includes a near-infrared irradiation unit 23 that irradiates the substrate W with near-infrared light, and a near-infrared camera 25 that images the substrate W accommodated in the carrier C using near-infrared light reflected from the substrate W accommodated in the carrier C. The near-infrared camera 25 includes a lens 27 that transmits near-infrared light from incident light, and an imaging sensor 29 that converts the incident near-infrared light into an electrical signal. The lens 27 prevents visible light from entering the imaging sensor 29 during imaging.

[0055] The imaging unit 21 images the substrate W accommodated in the carrier C using near-infrared rays with the substrate W viewed from the indexer block 5 through the opening 39, and acquires an image of the substrate W accommodated in the carrier C. In the first embodiment, the imaging unit 21 images the substrate W accommodated in the carrier C with the opening 39 of the carrier C fully open, but the imaging unit 21 may also image the substrate W accommodated in the carrier C while the lid opening / closing mechanism 41 is moving downward in the vertical direction Z.

[0056] As shown in FIG. 3(b), the imaging unit 21 images, for example, three of the 25 substrates W accommodated in the carrier C. In this case, the imaging unit 21 divides the substrates W into three, for example, left, center, and right, according to the width of the field of view VA shown by the two-dot chain line in the figure, and images them. An image of one substrate W is completed by superimposing the three acquired images. The imaging unit 21 is moved by the indexer robot IR, for example, in the order of the upper left, lower left, lower center, upper center, upper right, and lower right of the opening 39, and images the substrates W accommodated in the carrier C at each position. Specifically, when the imaging unit images the substrates W in the first row to the third row in the field of view VA in the upper left, it images the substrates W in the third row to the fifth row in the next field of view VA. This is because the gap between the substrates W is calculated from the acquired images.

[0057] When the field of view range VA is large enough to include all three substrates W, images of the three substrates W can be captured in one imaging session. In this case, the imaging unit 21 can obtain near-infrared images of all of the substrates W accommodated in the carrier C simply by moving the indexer robot IR from top to bottom.

[0058] The carrier C is a box-shaped resin molded product surrounded by a bottom surface, both sides, a top surface, and a back surface. In the figure, the carrier C has an open loading / unloading port CT. The carrier C is molded, for example, from a synthetic resin. The synthetic resin is a transparent or semi-transparent resin. The transparent synthetic resin is, for example, a colored transparent resin such as orange, or a colorless transparent resin. For example, all surfaces of the carrier C may be molded from a transparent resin, or only the back surface may be molded from a transparent resin. The synthetic resin has a lower near-infrared transmittance than the substrate W. Therefore, in the near-infrared image of the substrate W accommodated in the carrier C, the difference between the substrate W and the back surface of the carrier C appears clearly. In other words, an appropriate contrast can be obtained at the boundary between the substrate W and the background.

[0059] <7. Imaging of the board W>

[0060] Here, reference is made to Fig. 4. Fig. 4 is a plan view showing a schematic view of the imaging section capturing an image of the substrate W. For ease of explanation, the upper parts of the carrier C and the indexer robot IR are shown in cross section.

[0061] In FIG. 4, the substrate W is viewed from the indexer block 5 through the opening 39. The location of the substrate W to be imaged is the center of the substrate W. The center of the substrate W is within the field of view of the near-infrared camera 25. The near-infrared irradiation unit 23 irradiates a range wider than the field of view of the near-infrared camera 25 with near-infrared rays. The near-infrared camera 25 is provided in the vicinity of the hand 19, in other words, around the hand 19. In this embodiment, the center of the near-infrared camera 25 in the width direction Y is aligned with the center of the hand 19 in the width direction Y. The near-infrared irradiation unit 23 is provided in the vicinity of the near-infrared camera 25, in other words, around the near-infrared camera 25. The irradiation direction of the main ray of near-infrared rays is the advancing / retreating direction FD, which is oblique to the forward / rearward direction X, among the advancing / retreating directions FD indicated by the three arrows.

[0062] The image of the substrate W accommodated in the carrier C is captured by adjusting the focus of the near-infrared camera 25 to the center position Wc in the depth direction of the substrate W so as to include shape information at the center position Wc in the depth direction (front-rear direction X) of the substrate W accommodated in the carrier C. The center position Wc is also the center position in the width direction Y of the substrate W. In the figure, a dashed line is shown that passes through the center position Wc and is drawn along the width direction Y. This dashed line is called the substrate center line Wcl. The near-infrared image of the substrate W accommodated in the carrier C is a tomographic image at this substrate center line Wcl. In this case, the central portion indicates an area that includes at least the center (center position Wc) of the substrate W when viewed in a plan view. The central portion may be determined based on the diameter of the substrate W. In the case of a substrate W with a diameter of 300 mm, for example, a range of 150 mm in diameter centered on the center position Wc, which is an area half the diameter, may be the central portion. It is considered that in a curved substrate W, the most convex or concave portion on the substrate is often near the center position Wc of the substrate W. Therefore, by acquiring a tomographic image at the center, it is possible to measure the most convex or concave portion on the substrate W. Moreover, the most convex or concave portion on the substrate W does not necessarily have to coincide with the center position Wc, and even if it does not coincide, it is possible to suitably acquire a tomographic image of the substrate W by measuring the center of the substrate W.

[0063] <8. Warpage of the substrate W>

[0064] Here, reference is made to Fig. 5. Fig. 5 shows an example of a substrate warped into a bowl shape, where (a) is a view seen from the front-rear direction X, and (b) is a view seen from the width direction Y.

[0065] The substrate W is subjected to various processes, in which films having different thermal expansion coefficients are attached, and further subjected to various heat treatments, so that the substrate W may be warped into a complex shape.

[0066] FIG. 5 shows a substrate W warped in a bowl shape. That is, the substrate W is concave at the center and has a high outer periphery. The substrate W warped in a bowl shape narrows the gap in the vertical direction Z below the substrate W stored below it in the carrier C. FIG. 5(a) is a view from the front-rear direction X, and thus shows the substrate W as seen from the indexer block 5 through the loading / unloading port CT. In other words, FIG. 5(a) is a view from the forward / backward direction FD of the hand 19 of the indexer robot CR toward the back side of the carrier C. FIG. 5(b) is a view from the width direction Y, and thus shows the forward / backward direction FD of the hand 19 from the side. The substrate W shown in FIGS. 5(a) and (b) is curved downwardly convexly.

[0067] Here, the lowest point on the bottom surface of the substrate W is the lowest point W L1 In the substrate W shown in FIG. L1 is located directly below the substrate center position Wc. L1 A cross section of the substrate W extending in the width direction Y along the warp of the substrate W is taken at the lower edge W Le The solid line of the warp of the substrate W shown in FIG. Le The dotted line on the inside of the warp indicates the lower edge W Le The lower edge W Le When the substrate is stored in the carrier C, it is located at the same depth as the substrate center line Wcl shown in FIG. 4. Also, in FIG. 5, the solid line extending horizontally indicates the upper edge W ue It is called the upper edge W ue are the upper and lower sides of the periphery of the substrate W when viewed from the front-rear direction X. Since the near-infrared camera 25 focuses on the substrate center line Wcl in the near-infrared image of the substrate W accommodated in the carrier C, the bottom edge W Le is obtained.

[0068] <9. Principle of Acquiring Near-Infrared Images of the Lower Edge of a Substrate>

[0069] FIG. 6 shows the lower edge W of a substrate W accommodated in a carrier C. Le1A and 1B are front views of a substrate W accommodated in a carrier C, and FIG. 1C is an acquired near-infrared image. The portion of the substrate W indicated by a solid line is the outer periphery of the substrate W that is visible with visible light when the substrate W is viewed from the front-rear direction X, and the portion indicated by a dashed line is the upper side of the substrate W in a virtual cross section at the center position Wc when the substrate W is viewed from the front-rear direction X.

[0070] FIG. 6(a) shows a state in which near-infrared rays are irradiated from the near-infrared irradiating unit 23. For convenience of explanation, the viewing range VA is assumed to be the entire substrate W. For convenience of illustration, the near-infrared rays are shown as being irradiated from the front of the substrate W. That is, the direction in which the near-infrared rays are irradiated is the front in the front-rear direction X, and a representative portion of the substrate W irradiated with the near-infrared rays is indicated by an X mark in a circle. In contrast, the direction in which the near-infrared rays are reflected from a representative portion of the substrate W irradiated with the near-infrared rays is the rear in the front-rear direction X, and is indicated by a black circle mark in a circle. Symbols Ir1 to Ir6 represent near-infrared rays irradiated from the near-infrared irradiating unit 23. Ir1 is the light reflected from the upper edge portion W of the substrate W. ue Ir2 is the near infrared ray irradiated to the upper edge W ue Ir3 is the near infrared ray irradiated to the inside of the upper edge of the substrate W. L1 The lower edge W along the width direction Y passing through Le Ir4 is the near infrared ray irradiated to the lower edge W Le Ir5 is near-infrared light irradiated to other portions of the substrate W. Ir6 is near-infrared light irradiated to the cassette C located behind the substrate W.

[0071] FIG. 6(b) shows how the near-infrared rays irradiated from the near-infrared irradiating unit 23 are reflected from the substrate W and the carrier C. Specifically, the upper edge portion W ue and the lower edge W Le Near infrared rays Ir1 and Ir3 irradiated to the upper edge W ue and the lower edge W LeThe near-infrared rays Ir2, Ir4, and Ir5 irradiated to the inside of the upper edge, the inside of the lower edge, and other locations of the substrate W are transmitted through the inside of the substrate W. Of the near-infrared rays Ir6 irradiated to a cassette C located behind the substrate W, some wavelength regions of the near-infrared rays are transmitted through or absorbed by the cassette C due to the material of the carrier C, while other wavelength regions are reflected by the cassette C.

[0072] FIG. 6(c) is an image of the substrate W accommodated in the carrier C captured by the near-infrared camera 25. In this image, the bottom edge W Le and the lower edge W Le The background is uniform BK except for the bottom edge. The inside of the bottom edge is background BK. Le The image shows the lower edge W of the substrate W. Le This image shows the cross-sectional contour of the upper edge W ue When taking the image, the near-infrared camera was focused on the upper edge W ue In this embodiment, the focus is not set on the center position Wc in the depth direction of the substrate W, but on the center position Wc of the substrate W. ue Therefore, the lower edge W of the substrate W does not exist. Le Except for the bottom edge W, the carrier C located in the background of the substrate W is shown as a uniform background BK. Le The image of the background BK is displayed in a uniform gray color that is lighter than black. Le can be clearly distinguished from the background BK by the computer in image processing.

[0073] <10. Near-infrared image>

[0074] FIG. 7(a) is a diagram showing a substrate W accommodated in a carrier C included in the viewing range VA of the near-infrared camera 25, and (b) is a diagram showing a near-infrared image acquired from (a).

[0075] FIG. 7(a) shows a state in which the substrate W is accommodated in the carrier C. The substrate W is accommodated in a state in which the left and right ends of the peripheral portion are placed on the locking portions 57 attached to the left and right sides of the carrier C. FIG. 7(a) shows three substrates W from the top of the carrier C. The field of view VA of the near-infrared camera 25 includes the three substrates W accommodated in the carrier C. The substrates W in the upper and lower tiers are warped. Hereinafter, they will be referred to as the warped substrate W1. The substrate W in the middle tier is a substrate W in which two substrates W are bonded together. Hereinafter, they will be referred to as the bonded substrate W2. The bonded substrate W2 is also warped. The magnitude of the warping varies depending on the substrate W. If the warped substrate W1 and the bonded substrate W2 are photographed with visible light, the visible light image will be affected by the reflection of the upper and lower substrates W and the background BK reflected behind the carrier C. Therefore, it is difficult for a computer to accurately measure the shapes of the warped substrate W1 and the bonded substrate stack W2 through image processing and to accurately obtain information about the gaps between the substrates W.

[0076] As shown in FIG. 7(b), in the near-infrared image, the reflected light (visible light) from the upper and lower substrates W is cut by the lens 27 and is not reflected. Also, in the near-infrared image, a uniformly opaque gray background BK is displayed behind the warped substrate W1 and the bonded substrate W2, so objects located behind the carrier C are not reflected. Also, in the bonded substrate W2, the lower edge portions W of the respective bonded substrates W2a and W2b are not reflected. Le Therefore, the computer can accurately measure the shapes of the warped substrate W1 and the bonded substrate W2 by image processing, and can accurately obtain information about the gaps between the substrates W. <11. Control System>

[0077] FIG. 8 is a block diagram showing an example of a control system of the substrate processing apparatus 1 shown in FIG.

[0078] The substrate processing apparatus 1 is controlled by a control unit CU. The control unit CU includes a CPU, a memory, and the like. The control unit CU operates according to a program stored in advance in a storage unit 51. The control unit CU controls a mechanism (not shown) that moves the carrier C on the mounting table 10 in the forward and backward directions X. The control unit CU controls the attachment and detachment operation of the lid CL by the attachment and detachment unit 43 of the lid opening and closing mechanism 41, and the lifting and lowering operation of the lid opening and closing mechanism 41. When the control unit CU causes the lid opening and closing mechanism 41 to perform the lifting and lowering operation, the control unit CU causes the lid opening and closing mechanism 41 to perform the lifting and lowering operation while referring to the height position in the vertical direction Z output from the lid opening and closing mechanism 41. The control unit CU controls the indexer robot IR. Specifically, the control unit CU controls the movement of the hand 19 of the indexer robot IR in the forward and backward directions FD, the movement of the hand 19 in the vertical direction Z, and the rotation of the indexer robot IR about the vertical direction Z. The control unit CU controls the processing of the substrate W in the processing unit 31. The control unit CU controls the center robot CR. The control unit CU controls the forward and backward movement of the hand 33 of the center robot CR, the movement of the hand 33 in the vertical direction Z, and the rotation of the center robot CR about the vertical direction Z.

[0079] The control unit CU will be described in more detail. The control unit CU grasps the current position of the indexer robot IR based on signals output from sensors provided in each drive unit of the indexer robot IR. The control unit CU controls the indexer robot IR to position the imaging unit 21 at the imaging start position at the timing when the lid opening / closing mechanism 41 finishes descending in the vertical direction Z. The control unit CU controls the imaging unit 21 and the indexer robot IR so that the imaging unit 21 moves to multiple imaging positions in the order of upper left, lower left, lower center, upper center, upper right, and lower right, as shown in FIG. 3(b).

[0080] The imaging unit 21 and the indexer robot IR each have a control unit. The control unit in the indexer robot drives each drive unit of the indexer robot IR based on instructions from the control unit CU. The control unit in the imaging unit 21 controls the near-infrared irradiation unit 23 and the near-infrared camera 25 based on instructions from the control unit CU.

[0081] <12. Image processing section>

[0082] When the imaging unit 21 acquires a near-infrared image of the substrate W accommodated in the carrier C, the imaging unit 21 transmits the acquired near-infrared image data to the image processing unit 53. The image processing unit 53 is a computer different from the control unit CU. The image processing unit 53 may be the same computer as the control unit CU. The image processing unit 53 calculates the shape of the substrate W using the near-infrared image data, and calculates the substrate gap information GPw, the standard substrate center position CP0, the individual substrate center position CP1, the gap GP1, the gap GP2, and the like, which will be described later, from the calculated shape of the substrate W. The image processing unit 53 transmits the calculated information to the control unit CU. The control unit CU controls the indexer robot IR based on the information received from the image processing unit 53. Specifically, the control unit CU adjusts the insertion height position of the hand 19 based on the substrate gap information GPw, and determines whether or not the hand 19 can be inserted. The processing performed by the image processing unit 53 will be described below.

[0083] <13. How to obtain board gap information using near-infrared images> 9(a) to (c) are diagrams for explaining how to obtain the board-to-board gap information GPw using a near-infrared image.

[0084] FIG. 9(a) is a diagram showing a formal inter-substrate gap region GS1. The inter-substrate gap region GS1 is formed by dividing the upper edge W Ue The formal gap area GS1 between the substrates is calculated from a tomographic image (near-infrared image) at the substrate center line Wcl. When capturing the tomographic image, the focal position is set at the substrate center line Wcl, so that the upper edge portion W of the substrate W located in front of the focal position is calculated from the tomographic image (near-infrared image) at the substrate center line Wcl. Uedoes not form an image. The formal inter-substrate gap area GS1 calculated from the tomographic image is the area sandwiched between the upper and lower substrates W, excluding the area overlapping with the locking portion 57 in the vertical direction Z. The formal inter-substrate gap area GS1 is obtained, for example, from position information of the substrate W in the vertical direction Z, thickness information of the substrate W, and warpage shape information of the substrate W. These pieces of information are associated with the pixels of the imaging sensor 29. The correspondence between the pixels of the near-infrared image and the actual length is known.

[0085] FIG. 9(b) shows a warped substrate W1, a superposed substrate W2, and a virtually set upper edge portion W of the superposed substrate W2 in a formal substrate gap region GS1. Ue The upper edge W Ue is a dashed line, and the lower edge W Le The line connecting the upper ends of both the left and right sides of the lower edge W Le The line connecting the upper ends of both the left and right sides is the imaginary upper edge W Ue The imaginarily set upper edge W Ue corresponds to the top edge of the actual substrate W2.

[0086] 9(c) is a diagram showing a substantial gap region GS2 between the substrates. The substantial gap region GS2 between the substrates is a region between the substrates that is substantially spaced apart from the imaginarily set upper edge portion W Ue Therefore, this is an area where the hand 19 cannot enter, taking into consideration the upper edge of the actual substrate W2. Ue From the line indicating the lower edge W Le The area up to is an access-prohibited area GS3 into which the hand 19 cannot enter due to the presence of the overlapped substrate W2. The access-prohibited area GS3 is shown in the figure with a darker shaded area. The area obtained by excluding the access-prohibited area GS3 from the formal substrate gap area GS1 becomes the substantial substrate gap area GS2. This makes it possible to obtain the length of the substantial substrate gap area GS2 in the vertical direction Z as substrate gap information GPw at any position in the width direction Y of the substantial substrate gap area GS2.

[0087] <14. How to determine the center position between boards using near-infrared images> FIG. 10 is a diagram for explaining a method for determining the center position between substrates using a near-infrared image.

[0088] The left diagram of FIG. 10(a) is a diagram showing the standard inter-substrate center position CP0. The standard inter-substrate center position CP0, which indicates the height in the vertical direction Z, is found by determining the distance between the locking parts 57 of the carrier C and the thickness of the standard substrate Wt. The standard inter-substrate center position CP0 is located in the middle of the length obtained by subtracting the thickness of the standard substrate Wt from the distance between the locking parts 57. If the substrate W accommodated in the carrier C is the same as the standard substrate Wt, the insertion height of the hand 19 is the standard inter-substrate center position CP0. The standard substrate Wt is a test substrate W that is not warped, or virtual data for such a substrate W.

[0089] The right diagram of FIG. 10(a) shows the individual inter-substrate center position CP1. The individual inter-substrate center position CP1 is an inter-substrate center position that is optimized from the standard inter-substrate center position CP0 in accordance with the shape of the substrate W. In the near-infrared image shown in the right diagram of FIG. 10(a), the warped substrates W1 are accommodated in the upper, middle, and lower stages. First, when removing the warped substrate W1 in the upper stage, it is determined whether or not the insertion height of the hand 19 is set to the standard inter-substrate center position CP0. This determination is made based on whether or not the inter-substrate gap information GPw contacts either the upper or lower substrate W1, W1 when the hand 19 is advanced or retreated at the standard inter-substrate center position CP0. For this determination, the inter-substrate gap information GPw1 at the insertion position of the hand 19 in the width direction Y is used. If the inter-substrate gap information GPw1 is a value that will not cause the hand 19 to come into contact with the substrates W1, W1 when the hand 19 is advanced or retreated from the standard inter-substrate center position CP0, the insertion height of the hand 19 remains at the standard inter-substrate center position CP0 (not shown). If the inter-substrate gap information GPw1 is a value that will cause the hand 19 to come into contact with the substrates W1, W1 when the hand 19 is advanced or retreated from the standard inter-substrate center position CP0, a determination is made as to whether or not to change the insertion height of the hand 19 to the individual inter-substrate center position CP1.

[0090] Specifically, when the hand 19 is inserted at the standard inter-substrate center position CP0, if the length between the lower end of the hand 19 and the lower end of the inter-substrate gap information GPw1 exceeds a contact threshold value that is a predetermined contact judgment criterion, it is determined that the hand 19 will not contact the lower substrate W. Also, if the length between the upper end of the hand 19 and the upper end of the inter-substrate gap information GPw1 exceeds the contact threshold value, it is determined that the hand 19 will not contact the upper substrate W either. This determines that the hand 19 can be inserted. On the other hand, if the length between the lower end of the hand 19 and the lower end of the inter-substrate gap information GPw1 is less than the contact threshold value, it is determined that the hand 19 will contact the lower substrate W. Also, if the length between the upper end of the hand 19 and the upper end of the inter-substrate gap information GPw1 is less than the contact threshold value, it is determined that the hand 19 will contact the upper substrate W. If either of the above is true, it is determined that the hand 19 cannot be inserted.

[0091] The individual substrate center position CP1 is the intermediate position of the values ​​of the substrate gap information GPw1. If the hand 19 does not come into contact with the substrates W1, W1 when entering and retracting at the individual substrate center position CP1, the insertion height of the hand 19 is changed to the individual substrate center position CP1. In this case, it is determined in which direction in the vertical direction Z the individual substrate center position CP1 is located relative to the standard substrate center position CP0. Also, the length of the gap GP1 between the standard substrate center position CP0 and the individual substrate center position CP1 is measured. Then, the hand 19 is moved in the determined direction by the length of the gap GP1. If the hand 19 comes into contact with the substrates W1, W1 when entering and retracting at the individual substrate center position CP1, the entry and retraction of the hand 19 is prohibited.

[0092] When the warped substrate W1 in the middle is removed, the inter-substrate gap information is obtained in the same manner as when the warped substrate W1 in the upper layer is removed. When the warped substrate W1 in the middle is removed, it may be determined whether the shape of the warped substrate W1 in the lower layer is the same as the shape of the warped substrate W1 in the middle layer. In this case, if the two shapes are the same, the same inter-substrate gap information GPw1 as when the warped substrate 1 in the upper layer is removed may be used, and if the two shapes are different, the inter-substrate gap information may be obtained in the same manner as described above. The above-mentioned determination may be made by the control unit CU based on information acquired by the image processing unit 53, or the image processing unit 53 may make the determination and transmit the result to the control unit CU.

[0093] When the indexer robot IR sequentially takes out the substrates W accommodated in the carrier C from top to bottom, if the hand 19 can enter between the substrates W, the hand 19 that lifts the substrate W can be retreated without coming into contact with the upper substrate W1. Therefore, it is important whether the hand 19 can enter without coming into contact with either the upper or lower substrate W. When the indexer robot IR sequentially takes out the substrates W accommodated in the carrier C from bottom to top, even if the hand 19 can enter between the substrates W, the hand 19 that lifts the substrate W may come into contact with the upper substrate when retreating the hand 19. In this case, it is also important whether the hand 19 that lifts the substrate W can be retreated without coming into contact with the upper substrate W. In addition, whether the hand 19 that lifts the substrate W comes into contact with the upper substrate W when retreating the substrate may be determined using the substrate gap information GPw1.

[0094] The left diagram of FIG. 10(b) is the same as the left diagram of FIG. 10(a). The right diagram of FIG. 10(b) is a diagram showing the center position CP2 between the individual substrates. In the near-infrared image shown in the right diagram of FIG. 10(b), the warped substrate W1 is accommodated in the upper stage, the bonded substrate W2 in the middle stage, and the warped substrate W1 in the lower stage. The case of removing the upper stage warped substrate W1 will be described. The substrate gap information GPw2 is calculated in the same manner as the substrate gap information GPw1. When removing the upper stage warped substrate W1, the substrate gap information GPw2 is a value such that even if the hand 19 is inserted at the standard substrate center position CP0, there is no contact with either the upper or lower substrates W1, W2, so the hand 19 is inserted at the standard substrate center position CP0. When removing the middle bonded substrate W2, the middle bonded substrate W2 is curved more downwardly than the upper warped substrate W1, so the substrate gap information GPw3 is a value that will cause the hand 19 to come into contact with either the upper or lower substrate W1, W2, when it is advanced at the standard substrate center position CP0. Therefore, the hand 19 is advanced to the lower side in the vertical direction Z at the individual substrate center position CP2, which is the length of the gap GP2, which is the difference between the substrates W1 and W2. In this way, by accurately measuring the shape of the substrate W, damage to the substrate W when the hand 19 advances and retreats can be reduced.

[0095] The correspondence between the above-mentioned first embodiment and the present invention is as follows.

[0096] The "carrier C" corresponds to the "carrier" in the present invention. The "hand 19" corresponds to the "holding hand" in the present invention. The "indexer robot IR" corresponds to the "transport section" in the present invention. The "near infrared ray" corresponds to the "light in a wavelength region longer than visible light" in the present invention. The "imaging section 21" and the "image processing section 53" correspond to the "acquisition section" in the present invention. The "control section CU" corresponds to the "control section" in the present invention. The "loading / unloading block 3" and the "indexer block 5" correspond to the "substrate transport device" in the present invention. Furthermore, the "imaging section 21" corresponds to the "imaging section" in the present invention. Furthermore, the "center position Wc in the depth direction of the substrate W" corresponds to the "predetermined position in the depth direction of the substrate". Furthermore, the "lid opening / closing mechanism 41" corresponds to the "opening mechanism" in the present invention. Furthermore, the "image processing section 53" corresponds to the "gap information acquisition section". Furthermore, the "upper edge portion W Ue " corresponds to the "upper edge" of the present invention.

[0097] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0098] (1) In the present embodiment 1, the substrate processing apparatus 1 having the configuration shown in Fig. 1 has been described as an example. However, the present invention is not limited to this configuration. In other words, the configurations of the indexer block 5 and the processing block 7 are not important.

[0099] (2) In the first embodiment, the substrate W having a circular shape in a plan view is processed. However, the present invention is not limited to this. In other words, the shape of the substrate W may be a square shape, etc.

[0100] (3) In the first embodiment, the inter-board gap information GPw is described taking as an example the inter-board gap information GPw1, GPw2, and GPw3 at the insertion height position of the hand 19 in the width direction Y. However, the inter-board gap information GPw is not limited to the insertion height position of the hand 19 in the width direction Y. The inter-board gap information GPw may be, for example, the lowest point W L1 and the upper edge W of the lower substrate W UeBased on such gap information, the control unit CU can determine whether or not to insert at least the hand 19.

[0101] (4) In the present embodiment 1, the warped substrate W1 along the bowl shape and the bonded substrate W2 are described, but the substrate W may be warped in a different shape.

[0102] FIG. 11 shows a substrate W warped in an umbrella shape. The substrate W shown in FIG. 11 has a shape that is obtained by turning upside down the substrate W warped in a bowl shape shown in FIG. 5. The substrate W in an umbrella shape is Le ) is located at a low position and the center is raised. In other words, the umbrella-shaped substrate W has a raised center and a low outer periphery. The substrate W warped in this manner has a narrower upper gap in the vertical direction Z with the substrate W accommodated above it in the carrier C. As can be seen from FIGS. 11(a) and (b), the substrate W has a top surface W U The lower edge W Le is higher than the vertical Z height of the end face.

[0103] Here, the top surface W U The highest point of U1 Call. Top point W U1 is the upper edge W Ue In the case of measuring the substrate W in FIG. 11, the highest point W U1 In such a case, the measurement of the substrate W is performed at the central portion including at least the lower edge portion W Le is virtually set, and a non-entry area GS3 into which the hand 19 cannot enter is determined. Le " corresponds to the "upper edge" of the present invention.

[0104] FIG. 12 shows a substrate W warped in a half-pipe shape. The substrate W shown in FIG. 12 is warped in an arc shape when viewed from the direction of the central axis CP, with the surfaces of the substrate W spaced apart around the central axis CP, as if a cylinder were cut along the central axis CP. The outer periphery of the substrate W in the half-pipe shape is located at a low position, and the central portion is raised. However, unlike the bowl-like and umbrella-like shapes described above, the shape of the outer edge of the substrate W is different when viewed from the front-rear direction X and when viewed from the width direction Y. In other words, the shape of the outer edge of the substrate W is different when viewed from the front-rear direction X and when viewed from the width direction Y. The substrate W warped in this way in a half-pipe shape has a narrower upper gap in the vertical direction Z with respect to the substrate W accommodated above this substrate W in the carrier C. As can be seen from FIGS. 12(a) and (b), the substrate W has a top surface W U The lower edge W Le 12, the axis CP on the center side is in the front-rear direction X, but the axis CP on the center side may be in the width direction Y. Note that a warped substrate with a half-pipe shape like that of FIG. 12, which is upside down, may be housed in carrier C.

[0105] Here, the top surface W U The highest point of U1 Call. Top point W U1 is the upper edge W Ue In the case of measuring the substrate W in FIG. 12, the highest point W U1 In such a case, the measurement of the substrate W is performed at the central portion including at least the lower edge portion W Le is virtually set, and a non-entry area GS3 into which the hand 19 cannot enter is determined. Le " corresponds to the "upper edge" of the present invention.

[0106] (5) In the first embodiment, the imaging unit 21 is provided in the indexer block 5. However, the imaging unit 21 may be disposed in a location other than the indexer block 5.

[0107] 13(a) and (b) are diagrams showing the arrangement of the imaging unit 21 according to a modified example.

[0108] In FIG. 13(a), the near-infrared irradiation unit 23 of the imaging unit 21 is provided on the outside of the indexer block 5, for example, on a wall located in front of the mounting table 13. The near-infrared camera 25 of the imaging unit 21 is provided on the indexer robot IR. The near-infrared irradiation unit 23 on the wall is disposed at a height that allows near-infrared light to be irradiated onto the substrate W accommodated in the carrier C. The near-infrared light irradiated from the wall does not penetrate the edge of the substrate W, but penetrates the other parts. The near-infrared camera 25 measures the light by a system that transmits the center and reflects the edge. Therefore, a near-infrared image with the shades reversed from those in Example 1 can be obtained. The near-infrared irradiation unit 23 and the near-infrared camera 25 may be disposed inversely.

[0109] In FIG. 13(b), the near-infrared irradiation unit 23 of the imaging unit 21 is provided on the outside of the indexer block 5, for example, on a wall located forward of the mounting table 13. The near-infrared camera 25 of the imaging unit 21 is provided on the upper end of the lid opening and closing mechanism 41. This allows the near-infrared camera 25 to image the substrate W accommodated in the carrier C in accordance with the downward movement of the lid opening and closing mechanism 41 in the vertical direction Z while holding the lid CL. At this time, the indexer robot IR does not need to move in accordance with the near-infrared camera 25. Therefore, after the end of imaging by the near-infrared camera 25, if the insertion of the hand 19 is permitted, the substrate W can be quickly removed. The near-infrared irradiation unit 23 may be attached to the upper end of the lid opening and closing mechanism 41 together with the near-infrared camera 25.

[0110] (6) In the present embodiment 1, the imaging unit 21 moves among a plurality of imaging positions in the order of upper left, lower left, lower center, upper center, upper right, and lower right, imaging the substrates W accommodated in the carrier C in sequence, and after imaging of all the substrates W is completed, the substrates W are unloaded. However, the method of imaging and unloading the substrates W is not limited to this.

[0111] 14(a) and (b) are diagrams showing a method of imaging the substrate W according to a modified example.

[0112] In FIG. 14(a), the indexer robot IR alternately captures images of the substrates W accommodated in the carrier C by the imaging unit 21 and unloads the substrates W. Specifically, the indexer robot IR moves from left to right so that the imaging unit 21 captures images in the field of view VA in the order of left, center, and right, with the substrates W in the first to third rows as the imaging targets. The imaging unit 21 acquires near-infrared images of the substrates W in the first to third rows. If it is determined that the hand 19 can be inserted, the indexer robot IR moves to the center again and inserts the hand 19 between the substrates W in the first and second rows, and unloads the substrates W in the first and second rows. After unloading the substrates W, the indexer robot IR moves the imaging unit 21 to the left so that the imaging unit 21 acquires near-infrared images of the substrates W in the third to fifth rows.

[0113] By imaging and removing the substrate W in this manner, the amount of movement of the indexer robot IR per one trip can be reduced, thereby reducing the burden on the drive mechanism of the indexer robot IR.

[0114] In FIG. 14(b), the indexer robot IR includes three imaging units 21A, 21B, and 21C. That is, the imaging units 21A, 21B, and 21C can acquire near-infrared images of three rows of substrates W in one imaging in the left viewing range VA1, the central viewing range VA2, and the right viewing range VA3. The indexer robot IR may unload the substrates W after the imaging units 21A, 21B, and 21C have finished imaging the substrates W accommodated in the carrier C, or may alternately image the substrates W accommodated in the carrier C using the imaging units 21A, 21B, and 21C and unload the substrates W. In either case, the imaging time and unloading time can be shortened. The three imaging units 21A, 21B, and 21C are preferably disposed at the left and right ends and the center of the substrate when viewed from the front-rear direction X, respectively. This arrangement allows the tomographic image of the substrates W to be suitably measured.

[0115] 15(a) and (b) are diagrams showing a method of imaging the substrate W according to different modified examples.

[0116] In FIG. 15(a), a near-infrared camera 21W with a wide viewing range WVA wider than the viewing range VA is used. Although the near-infrared image acquired by the wide viewing range WVA lacks both the left and right ends of the substrate W, it includes a thick portion required for measuring the shape of the substrate W and for determining whether the hand 19 can be inserted. Therefore, it is possible to determine with sufficient accuracy whether the hand 19 can be inserted. In this case, the indexer robot IR may take out the substrate W after the imaging unit 21W has taken an image of the substrate W accommodated in the carrier C, or may alternately take an image of the substrate W accommodated in the carrier C by the imaging unit 21W and take out the substrate W. If necessary, the image processing unit 53 may calculate the complete shape of the substrate W from the shape of the acquired portion of the substrate W.

[0117] In FIG. 15(b), a near-infrared camera 21F with a full field of view range FVA that can accommodate three rows of substrates W to both the left and right ends is used. The near-infrared image acquired by the full field of view range FVA includes both the left and right ends of the three rows of substrates W. Therefore, it is possible to determine with high accuracy whether or not the hand 19 can be inserted. Furthermore, because the imaging unit 21F is compact, the weight of the indexer robot IR can be reduced. Furthermore, the power consumption related to driving the indexer robot IR can be reduced.

[0118] (7) In the first embodiment, the case where the substrate W is unloaded has been described as an example, but the present invention can also be applied to the case where the substrate W is loaded into the carrier C. In other words, when a substrate W has already been loaded into the carrier C and the next substrate W is loaded into the carrier C, if the substrate W is loaded into the carrier C at the standard inter-substrate center position CP0, the individual inter-substrate center position is calculated when the hand 19 comes into contact with the previously loaded substrate W. This makes it possible to prevent damage to the substrate W when the substrate W is loaded into the carrier C.

[0119] (8) In this embodiment 1, an example has been described in which the indexer robot IR removes the substrate W based on an image of the substrate W contained in the carrier C. However, this may also be applied to a case in which the indexer robot IR receives the substrate W from the transfer section 15, or a case in which the center robot CR receives the substrate W from the transfer section 15.

[0120] (9) In the first embodiment, the near-infrared irradiating unit 23 and the near-infrared camera 25 are used as the imaging unit 21. However, the imaging unit 21 may be infrared light other than near-infrared light, such as short-wave infrared light.

[0121] (10) In the first embodiment, an example has been described in which the processing unit 31, which is a processing section, is provided with a back surface cleaning unit SSR. However, the processing section of the present invention is not limited to a cleaning processing section. The present invention may also include a processing section that performs a predetermined process on the substrate W, for example, resist coating, developing processing, etc.

[0122] (11) In this Example 1, a virtual upper edge is set for a tomographic image of the substrate W measured at the center of the substrate W, and an inaccessible area GS3 into which the hand 19 cannot enter is determined. However, the present invention is not limited to this. The upper edge may not be set virtually, but may be actually measured using the near-infrared camera 25. In this case, after measuring the center of the substrate W with the near-infrared camera 25, the position of the lens 27 may be changed with respect to the imaging plane of the near-infrared camera 25, and the upper edge of the substrate W may be measured as the focal position. Even in the case of this modified example, the same effect as in Example 1 can be obtained. [Explanation of symbols]

[0123] 1 ... Substrate processing equipment 3 ... Loading / unloading block 5 … Indexer block 7 … Processing block W: Substrate X…Anteroposterior direction Y: Width direction Z: Vertical direction 9 … Input section 11 ... Payment section C...Career 13 ... Placement table IR... Indexer robot 19... Hand FD… Advance / retreat direction 21 … Imaging section 23 … Near-infrared irradiation section 25 … Near infrared camera 27 ... Lens 29 … Image sensor 31 … Processing unit 37 … Front panel 39…Aperture 41 ... Lid opening and closing mechanism CT… Loading / unloading exit CL... Lid 43 ... Detachable unit CU: Control unit 53 ... Image processing section 57 ... Locking part GS1 … Formal board gap area GS2: Substantial gap area between boards GS3… No entry area CP0…Standard center position between boards CP1,CP2,CP3 … Center position between individual boards GP1, GP2... Gap

Claims

1. A substrate transport device capable of accommodating a plurality of substrates stacked with gaps therebetween and transporting the substrates between a carrier having an inlet / outlet on one side thereof, comprising: a transport unit including a holding hand for holding the substrate, the holding hand being moved forward and backward from the loading / unloading opening of the carrier to the gap between the substrates to transport the substrate; an acquisition unit that acquires shape information of the substrate when the substrate is accommodated in the carrier and the substrate is viewed from a loading / unloading port side of the carrier in a moving direction of the holding hand; a control unit that controls the conveying unit based on the shape information, The acquisition unit is Shape information of the substrate is obtained by irradiating the substrate with light having a wavelength longer than that of visible light from the direction in which the holding hand advances and retreats. A substrate transport device comprising:

2. 2. The substrate transport apparatus according to claim 1, The light in the wavelength region longer than visible light is light in the wavelength region that transmits through the inside of the substrate. A substrate transport device comprising:

3. 2. The substrate transport apparatus according to claim 1, The light in the wavelength region longer than visible light is light in the near-infrared wavelength region. A substrate transport device comprising:

4. 2. The substrate transport apparatus according to claim 1, The shape information is a cross-sectional shape of the substrate at a predetermined position in the advancing / retracting direction of the holding hand. A substrate transport device comprising:

5. 5. The substrate transport device according to claim 4, The predetermined position is the center of the substrate accommodated in the carrier. A substrate transport device comprising:

6. 2. The substrate transport apparatus according to claim 1, The shape information includes a shape of an upper edge of the substrate accommodated in the carrier. A substrate transport device comprising:

7. 2. The substrate transport apparatus according to claim 1, The acquisition unit is an imaging unit that images the substrate accommodated in the carrier using light in a wavelength region longer than the visible light, and acquires a substrate image; The shape information is obtained from the substrate image. A substrate transport device comprising:

8. 8. The substrate transport apparatus according to claim 7, The imaging unit is provided on the transport unit. A substrate transport device comprising:

9. 8. The substrate transport apparatus according to claim 7, a placement portion on which the carrier is placed; an opening mechanism for opening a door of the carrier placed on the placement section, The imaging unit captures an image of the board in a state where the opening mechanism has opened the door or during the process of the opening mechanism opening the door. A substrate transport device comprising:

10. 10. The substrate transport apparatus according to claim 9, The imaging unit is provided in the opening mechanism. A substrate transport device comprising:

11. 2. The substrate transport apparatus according to claim 1, a gap information acquisition unit that acquires gap information between the substrates into which the transport unit enters based on the shape information of the substrates accommodated in the carrier; The control unit controls the transport unit based on the gap information. A substrate transport device comprising:

12. 12. The substrate transport apparatus according to claim 11, The control unit adjusts the insertion height position of the holding hand based on the gap information. A substrate transport device comprising:

13. A substrate transport device according to any one of claims 1 to 12, A processing unit that performs a predetermined process on the substrate transported by the substrate transport device; A substrate processing apparatus comprising:

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