Sealing resin for use in compression molding and forming method and forming apparatus thereof

Abstract

To provide a sealing resin capable of implementing a compression molding apparatus and a compression molding method that prevent occurrence of molding defects caused by uneven winding, residual gas, and dust generated during molding, and can prevent formation of thin burrs in a sealing resin at exposed parts of a molded product, and a forming method and a forming apparatus for the sealing resin capable of facilitating handling before resin sealing.SOLUTION: A forming apparatus 1 for forming sealing resin R is a forming apparatus for forming sealing resin R to be used in compression molding of a workpiece W, and is equipped with a tableting mold 102 having an upper mold 104 and a lower mold 106 to accommodate base resin Rm therein and tablets the base resin Rm into a lattice-shaped sealing resin R having through holes Rh.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a sealing resin used in compression molding, and a method and apparatus for forming the same. [Background technology]

[0002] 2. Description of the Related Art As an example of a resin sealing apparatus and a resin sealing method for sealing a workpiece having electronic components mounted on a substrate with a sealing resin and processing it into a molded product, a method using a compression molding method is known.

[0003] The compression molding method is a technique for resin sealing by supplying a predetermined amount of sealing resin to a sealing area (cavity) provided in a sealing mold comprising an upper mold and a lower mold, placing a workpiece in the sealing area, and clamping the upper mold and the lower mold. As an example, when a sealing mold having a cavity in the upper mold is used, a technique is known in which the sealing resin is supplied all at once to the center position on the workpiece to form the workpiece. On the other hand, when a sealing mold having a cavity in the lower mold is used, a technique is known in which a release film (hereinafter sometimes simply referred to as a "film") that covers the mold surface including the cavity and the sealing resin are supplied to form the workpiece (Patent Document 1: International Publication WO2015 / 159743). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. WO2015 / 159743 Summary of the Invention [Problem to be solved by the invention]

[0005] Traditionally, the compression molding method, in which the workpiece is held in the upper die, a cavity is created in the lower die, and sealing resin (granular resin, for example) is supplied into the cavity, has been widely adopted, as it was thought to have advantages in terms of preventing deformation of the workpiece due to the flow and contact of the sealing resin.

[0006] However, in a configuration in which a workpiece is held in the upper die and a cavity is provided in the lower die, there is a problem that if the workpiece is thin or large, it is difficult to hold it in the upper die and it is likely to fall. In addition, when granular resin is used as the sealing resin, there are problems such as dust generation during molding due to friction between resin particles, difficulty in handling, and difficulty in supplying (spreading) the sealing resin evenly over the entire area inside the cavity provided in the lower die, which tends to cause uneven spreading. In addition, there is a problem that air contained in the gaps between the particles when the sealing resin is spread and gas components caused by degassing from the sealing resin when melted do not escape and remain as voids in the molded product, which tends to cause molding defects.

[0007] On the other hand, regardless of the arrangement of the cavities, when forming a molded product in which electronic components such as a heat sink or a flip-chip connected chip are exposed, there was a problem that a thin burr of the sealing resin was likely to form on the exposed portion of the molded product (for a specific example, the top surface of the electronic component), resulting in incomplete exposure. [Means for solving the problem]

[0008] The present invention has been made in consideration of the above circumstances, and has an object to provide a compression molding device and compression molding method that can prevent molding defects caused by uneven scattering, residual gas, and dust generation during molding, and that can prevent the formation of thin burrs in the sealing resin at exposed parts of the molded product, and that can facilitate handling before resin sealing, as well as a sealing resin, and a forming method and forming device thereof.

[0009] The present invention solves the above problems by the solution means described below as one embodiment.

[0010] The molding device for sealing resin according to one embodiment is a molding device for forming sealing resin used in compression molding of a workpiece, and is required to include a tableting die having an upper die and a lower die, for accommodating a base resin, and for tableting the sealing resin into a lattice-like shape having through holes. The molding resin according to one embodiment formed by the device is required to have a lattice-like configuration having through holes.

[0011] By performing compression molding using the above-mentioned sealing resin, it is possible to prevent molding defects caused by uneven distribution, residual gas, and dust generation during molding. In addition, it is possible to facilitate handling of the sealing resin and prevent the formation of thin burrs in the sealing resin at exposed parts of the molded product. In addition, by applying this to a configuration in which a cavity is provided in the upper mold and a workpiece is held in the lower mold, it is possible to solve problems such as the workpiece falling.

[0012] Furthermore, it is preferable that the lower mold has a cavity piece that forms the bottom of the cavity, a clamper that is arranged to surround the cavity piece and form the inner wall of the cavity, and a plurality of movable pieces that protrude from the upper surface of the cavity piece, are arranged at predetermined positions, and are movable up and down, and that the tableting die is configured to accommodate the base resin around the movable pieces within the cavity and tablet the base resin, and that the area of ​​the movable pieces is formed as the through hole.

[0013] Moreover, it is preferable that the upper mold has a holding part for holding a heat sink on the lower surface of the upper plate, and the tableting die is configured to perform tableting in a state in which the heat sink is held by the holding part of the upper mold and the base resin is accommodated around the movable piece of the lower mold, and the sealing resin is formed in a state in which the heat sink is fixed. According to this, it is possible to form a sealing resin in a lattice shape having through holes and in which the heat sink is fixed to one side. The sealing resin according to one embodiment formed by the device is required to be in a lattice shape having through holes and in which the heat sink is fixed to one side.

[0014] In addition, it is preferable that the tableting mold has a leg forming groove formed on at least one of the upper surface of the cavity piece of the lower mold or the lower surface of the upper plate of the upper mold, for forming a leg to be erected in the sealing resin.

[0015] It is also preferable that a powder resin is used as the base resin.

[0016] In addition, a method for forming sealing resin in one embodiment is a method for forming sealing resin to be used in compression molding of a workpiece, and is required to include a forming step of forming the sealing resin in a lattice shape having through holes. Effect of the Invention

[0017] According to the molding apparatus and method of the present invention, it is possible to form an encapsulating resin that has the following effects. That is, by using the encapsulating resin of the present invention, it is possible to realize a compression molding apparatus and a compression molding method that can prevent molding defects caused by uneven distribution, residual gas, and dust generation during molding, and can prevent the formation of thin burrs in the encapsulating resin at exposed parts of the molded product. In addition, it is possible to facilitate handling before resin encapsulation. [Brief description of the drawings]

[0018] [Figure 1] 1 is a plan view illustrating an example of an apparatus for forming a sealing resin according to an embodiment of the present invention. [Diagram 2] 2 is a side view showing an example of a first pressing device of the forming apparatus shown in FIG. 1. [Diagram 3] 2 is a front cross-sectional view showing an example of a first mold of the forming apparatus shown in FIG. 1. [Figure 4] 2 is an explanatory diagram illustrating an example of a method for forming a sealing resin using the forming apparatus shown in FIG. 1. [Diagram 5] FIG. 5 is an explanatory diagram following FIG. [Figure 6] FIG. 6 is an explanatory diagram following FIG. [Figure 7]1 is a perspective view showing an example of a workpiece to be compressed and molded using a sealing resin according to an embodiment of the present invention; [Figure 8] 2 is a perspective view showing an example of a sealing resin formed by the forming apparatus shown in FIG. 1. [Figure 9] 9 is a perspective view showing an example of a molded product obtained by compression molding using the sealing resin shown in FIG. 8. [Figure 10] 1. FIG. 4 is a perspective view showing another example of a sealing resin formed by the forming apparatus shown in FIG. [Figure 11] 1. FIG. 4 is a front cross-sectional view showing another example of the first mold of the forming apparatus shown in FIG. [Figure 12] 13 is a plan view showing another example of the sealing resin forming apparatus according to the embodiment of the present invention. FIG. [Figure 13] 13 is a front cross-sectional view showing an example of a first mold of the forming apparatus shown in FIG. 12. [Figure 14] 13 is an explanatory diagram illustrating an example of a method for forming a sealing resin using the forming device shown in FIG. 12. [Figure 15] FIG. 15 is an explanatory diagram following FIG. 14. [Figure 16] FIG. 16 is an explanatory diagram following FIG. [Figure 17] 13 is a perspective view showing an example of a sealing resin formed by the forming apparatus shown in FIG. 12. [Figure 18] 18 is a perspective view showing an example of a molded product obtained by compression molding using the sealing resin shown in FIG. 17. [Figure 19] 13 is a perspective view showing another example of the sealing resin formed by the forming apparatus shown in FIG. [Figure 20] 13 is a front cross-sectional view showing another example of the first mold of the forming apparatus shown in FIG. [Figure 21] FIG. 2 is a plan view showing an example of a compression molding device in which a sealing resin according to an embodiment of the present invention is used. [Figure 22] 22 is a side view showing an example of a second pressing device of the compression molding apparatus shown in FIG. 21. [Diagram 23] 22 is a front cross-sectional view showing an example of a second mold of the compression molding apparatus shown in FIG. 21. [Figure 24]24 is an explanatory view illustrating an example of a compression molding method using a compression molding apparatus equipped with the second press apparatus shown in FIG. 22 and the second mold shown in FIG. 23. FIG. [Diagram 25] FIG. 25 is an explanatory diagram following FIG. 24. [Figure 26] FIG. 27 is an explanatory diagram following FIG. 25. [Figure 27] This is an explanatory diagram following Figure 26. [Figure 28] FIG. 28 is an explanatory diagram following FIG. 27. [Figure 29] FIG. 29 is an explanatory diagram following FIG. 28. [Diagram 30] 22 is a front cross-sectional view showing another example of the second mold of the compression molding apparatus shown in FIG. [Diagram 31] 31 is an explanatory diagram illustrating an example of a compression molding apparatus including the second press apparatus shown in FIG. 22 and the second mold shown in FIG. 30. FIG. [Diagram 32] This is an explanatory diagram following Figure 31. [Diagram 33] This is an explanatory diagram following Figure 32. [Diagram 34] This is an explanatory diagram following Figure 33. [Diagram 35] 22 is a side view showing an example of a third press unit of the compression molding apparatus shown in FIG. 21. FIG. [Diagram 36] 22 is a front cross-sectional view showing an example of a third mold of the compression molding apparatus shown in FIG. 21. [Figure 37] 37 is an explanatory view illustrating an example of a compression molding method using a compression molding apparatus equipped with the third press apparatus shown in FIG. 35 and the third mold shown in FIG. 36. FIG. [Figure 38] This is an explanatory diagram following Figure 37. [Figure 39] This is an explanatory diagram following Figure 38. [Diagram 40] This is an explanatory diagram following Figure 39. [Diagram 41] This is an explanatory diagram following Figure 40. [Diagram 42] FIG. 42 is an explanatory diagram following FIG. 41. [Diagram 43] 22 is a front cross-sectional view showing another example of the third mold of the compression molding apparatus shown in FIG. [Diagram 44]44 is an explanatory diagram illustrating an example of a compression molding apparatus including the third press apparatus shown in FIG. 35 and the third mold shown in FIG. 43. FIG. [Diagram 45] This is an explanatory diagram following Figure 44. [Figure 46] This is an explanatory diagram following Figure 45. [Figure 47] This is an explanatory diagram following Figure 46. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] [First embodiment] (Sealing resin forming device) The sealing resin R according to the embodiment of the present invention is a resin used for compression molding of a workpiece (molding target) W. In the first embodiment, an example will be described in which the sealing resin R is formed as a lattice-shaped sealing resin R having through holes Rh (hereinafter, may be distinguished by being written as "R1").

[0020] First, a forming apparatus 1 for the sealing resin R (hereinafter, sometimes simply referred to as a "forming apparatus") will be described. The forming apparatus 1 may be provided either inside or outside the compression molding apparatus 2. Here, FIG. 1 is a plan view (schematic diagram) showing an example of the forming apparatus 1. For ease of explanation, arrows in the figure indicate the left-right direction (X direction), front-rear direction (Y direction), and up-down direction (Z direction) of the apparatus. In addition, in all the figures for explaining each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

[0021] The workpiece W to be molded has a configuration in which electronic components Wb are mounted on a substrate Wa (see FIG. 7). More specifically, examples of the substrate Wa include plate-shaped members such as a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, and a wafer. Examples of the electronic components Wb include a semiconductor chip, a MEMS chip, a passive element, a heat sink, a conductive member, a spacer, and a coil sheet (note that the workpiece W may be configured to include only electronic components Wb). The shape of the substrate Wa is generally a rectangular shape (striped shape), a square shape, a circular shape, and the like. The number of electronic components Wb mounted on one substrate Wa is set to one or more. In this embodiment, the workpiece W is described by taking as an example a configuration in which electronic components Wb are flip-chip connected to the substrate Wa via bumps Wc, but is not limited thereto.

[0022] In this embodiment, a thermosetting resin (for example, an epoxy resin containing a filler, but not limited thereto) is used as the base resin Rm and the sealing resin R formed from the base resin Rm. The sealing resin R is formed as a solid resin having a predetermined shape (details will be described later) whose overall shape corresponds to the shape of the workpiece W. Usually, one piece constitutes the "whole" of the required amount of sealing (one time per workpiece W), but it may be configured so that several pieces (for example, about two or three pieces) are divided to constitute the "whole" of the required amount of sealing. In addition, a powder resin (form) that is a thermosetting resin (property) is preferably used as the base resin Rm (details will be described later). However, it is not limited thereto, and a granular resin, a crushed resin, a solid resin, a liquid resin, or a resin that is a combination of a plurality of them, etc. may be used.

[0023] As shown in Fig. 1, the forming device 1 mainly comprises a base resin supplying unit 10D that performs the supply of base resin Rm and the like, and a resin forming unit 10E that performs the formation of sealing resin R using the base resin Rm. As an example, the base resin supplying unit 10D and the resin forming unit 10E are arranged in this order along the X direction in Fig. 1. However, the above configuration is not limited, and the equipment configuration within the unit, the number of units, the arrangement order of the units, etc. may be changed. In addition, a configuration including units other than those described above (not shown) may also be used.

[0024] Furthermore, in the forming apparatus 1, a guide rail 20 is provided linearly across the units, and a conveying device (first loader) 21 for conveying the base resin Rm is provided so as to be movable between the units along the guide rail 20. However, the present invention is not limited to the above configuration, and the conveying device may be configured to include a robot hand or the like instead of a loader.

[0025] In addition, in the forming apparatus 1, a control unit 80 that controls the operation of each mechanism in each unit is disposed in the base resin supplying unit 10D (although it may be configured to be disposed in another unit).

[0026] Next, the base resin supply unit 10D provided in the forming apparatus 1 will be described in detail. The base resin supply unit 10D includes a base resin supply section 40 that supplies the base resin Rm. As an example, the base resin supply section 40 includes a dispenser that supplies the base resin Rm, a conveying device, and the like. When conveying the base resin Rm from the base resin supply unit 10D to the resin forming unit 10E, the first loader 21 may be used as the conveying device, or another conveying device (not shown) may be used (direct spraying from a dispenser may also be adopted for the base resin Rm).

[0027] Next, the resin forming unit 10E provided in the forming apparatus 1 will be described in detail. The resin forming unit 10E is provided with a resin forming section 50 as an apparatus for forming the sealing resin R using the base resin Rm. In this embodiment, two resin forming units 10E (may be three or more or one) are provided, and one resin forming section 50 (may be two or more) is provided per resin forming unit 10E (see FIG. 1). However, the present invention is not limited to this configuration.

[0028] The resin forming section 50 is equipped with a tableting die (first die) 102 having a pair of dies that are opened and closed (for example, a combination of a plurality of die blocks, die plates, die pillars, and other members made of alloy tool steel). It is also equipped with a press device (first press device) 150 that drives the first die 102 to open and close. A side view (schematic diagram) of the first press device 150 is shown in FIG. 2, and a front cross-sectional view (schematic diagram) of the first die 102 is shown in FIG. 3.

[0029] Here, as shown in FIG. 2, the first press apparatus 150 is configured to include a pair of platens 154, 156, a plurality of tie bars 152 on which the pair of platens 154, 156 are supported, and a drive device for moving (raising and lowering) the platen 156. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 160 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 162 (however, the present invention is not limited to this). In this embodiment, the platen 154 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 152), and the platen 156 on the lower side is set as a movable platen (a platen slidably held by the tie bars 152 and raised and lowered). However, the present invention is not limited to this, and the platens may be set upside down, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper side and the lower side may be set as movable platens (neither is shown).

[0030] On the other hand, the first mold 102, as shown in FIG. 3, includes a first upper mold 104 on the vertical side and a first lower mold 106 on the vertical side as a pair of molds disposed between the pair of platens 154, 156 in the first press device 150. The first upper mold 104 is assembled to the upper platen (in this embodiment, the fixed platen 154), and the first lower mold 106 is assembled to the lower platen (in this embodiment, the movable platen 156). The first upper mold 104 and the first lower mold 106 approach and move away from each other to close and open the mold (the vertical direction (up and down direction) is the mold opening and closing direction). In the first mold 102 according to this embodiment, the first upper mold 104 constitutes a so-called "pestle mold", and the first lower mold 106 constitutes a so-called "mortar mold".

[0031] Next, the first lower mold 106 of the first mold 102 will be described in detail. As shown in Fig. 3, the first lower mold 106 includes a first lower mold chase 110, a first cavity piece 126 held thereby, a first clamper 128, and the like. The first lower mold chase 110 is fixed to the upper surface of a first support plate 114 via a first support pillar 112. A first cavity 108 is provided on the upper surface of the first lower mold 106 (the surface on the first upper mold 104 side). A predetermined amount of base resin Rm is accommodated in this first cavity 108.

[0032] The first lower die 106 according to the present embodiment has the following configuration for pressing a predetermined amount of base resin Rm contained in the first cavity 108 to form (tablet) the sealing resin R having a predetermined shape corresponding to the shape of the workpiece W (details of the forming method will be described later). Specifically, in the first cavity piece 126 (within the area of ​​the first cavity piece 126 in plan view), a movable piece 136 that can abut against an upper plate 142 of the first upper die 104 described later and can move up and down is provided at a predetermined position (a position corresponding to an electronic component Wb set to be exposed during compression molding). The movable piece 136 is supported in a state in which it is biased toward the first upper die 104 by a movable piece spring 134 via a pressing pin 132. As an example, the movable piece 136 is set to have an outer shape that is a predetermined dimension larger than the outer shape of the corresponding electronic component Wb in plan view. In the first lower mold 106 having the above-mentioned configuration, a predetermined amount of base resin Rm is accommodated around the movable pieces 136 (specifically, in the concave portions 138 between the movable pieces 136) (note that the base resin Rm may first be sprayed over the entire first cavity 108 including the upper surface of the movable pieces 136, and then swept off with a squeegee or the like so that it is finally accommodated in the concave portions 138).

[0033] The first clamper 128 is annularly configured to surround the first cavity piece 126, and is assembled to be movable up and down while being spaced apart (floating) from the upper surface of the first support plate 114 via the first pressing pin 122 and the first clamper spring 124 (a biasing member exemplified by a coil spring, for example) (however, the assembly structure is not limited to this). The first cavity piece 126 constitutes the inner part (bottom part) of the first cavity 108, and the first clamper 128 constitutes the side part (inner wall part) of the first cavity 108. The shape and number of the first cavities 108 provided in one first lower mold 106 are set appropriately (one or multiple).

[0034] Here, the first press device 150 is provided with a first lower die film supply section 111 that supplies a film F for covering the die surface 106a (predetermined area) including the inner surface of the first cavity 108 in the first lower die 106. Note that, as an example, the film F is in a roll shape, but it may also be in a strip shape.

[0035] Furthermore, the first lower mold 106 is provided with suction paths (holes, grooves, etc.) (not shown) communicating with a suction device on the upper surface of the first clamper 128, on the boundary between the first clamper 128 and the first cavity piece 126, etc. This allows the film F supplied from the first lower mold film supply unit 111 to be adsorbed and held on the mold surface 106a including the inner surface of the first cavity 108.

[0036] In this embodiment, a first lower die heating mechanism (not shown) is provided for heating the first lower die 106 to a predetermined temperature. This first lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 80. As an example, the heater is built into the first lower die chase 110 and is configured to apply heat to the entire first lower die 106 and the base resin Rm contained in the first cavity 108. At this time, the first lower die 106 is heated to a predetermined temperature (e.g., 50°C to 80°C) at which the base resin Rm is not thermally cured (mainly cured).

[0037] Next, the first upper die 104 of the first mold 102 will be described in detail. As shown in FIG. 3, the first upper die 104 includes an upper plate (first plate) 142 that presses a predetermined amount of base resin Rm contained in the first cavity 108 of the first lower die 106 to form (compress) the sealing resin R having a predetermined shape corresponding to the shape of the workpiece W (the details of the forming method will be described later). The first plate 142 is held (fixed) by the first upper die chase 140. As an example, the first plate 142 has a flat lower surface (surface on the first lower die 106 side) and is configured to be able to abut against all the movable pieces 136 of the first lower die 106 described above.

[0038] Here, the first press device 150 is provided with a first upper die film supply section 113 that supplies a film F for covering the die surface 104a (predetermined area) of the first upper die 104. Note that, as an example, the film F is in a roll shape, but it may also be in a rectangular shape.

[0039] Furthermore, the first upper mold 104 has suction paths (holes, grooves, etc.) (not shown) communicating with a suction device provided in the first plate 142, etc. This allows the film F supplied from the first upper mold film supply unit 113 to be adsorbed and held on the mold surface 104a.

[0040] In this embodiment, a first upper die heating mechanism (not shown) is provided for heating the first upper die 104 to a predetermined temperature. This first upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 80. As an example, the heater is built into the first upper die chase 140 and is configured to apply heat to the entire first upper die 104. At this time, the first upper die 104 is heated to a predetermined temperature (e.g., 50°C to 80°C) at which the base resin Rm held (contained) in the first lower die 106 is not thermally cured (mainly cured).

[0041] (Method of forming sealing resin) Next, a method for forming the sealing resin R (R1) according to the first embodiment (hereinafter, may be simply referred to as a "forming method") will be described. As an example, the forming method can be carried out using the forming apparatus 1 according to the first embodiment. Here, Figs. 4 to 6 are explanatory diagrams of main steps.

[0042] First, a preparation step is performed. Specifically, a heating step (first lower die heating step) is performed in which the first lower die 106 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully cure, for example, 50°C to 80°C) and heated by the first lower die heating mechanism. In addition, a heating step (first upper die heating step) is performed in which the first upper die 104 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully cure, for example, 50°C to 80°C) and heated by the first upper die heating mechanism. In addition, a lower die film supply step (first lower die film supply step) is performed in which the first lower die film supply unit 111 is operated to supply a new film F and adsorb it so as to cover a predetermined area of ​​the mold surface 106a including the inner surface of the first cavity 108 in the first lower die 106. In addition, an upper mold film supplying process (first upper mold film supplying process) is performed in which the first upper mold film supplying section 113 is operated to supply new film F and adsorb it so as to cover a predetermined area of ​​the mold surface 104a of the first upper mold 104.

[0043] After the preparation step, a forming step is performed in which a sealing resin R (R1) having a predetermined shape corresponding to the shape of the workpiece W is formed.

[0044] The forming process according to the present embodiment includes a tableting process in which the base resin Rm is tableted to form a solid resin having a predetermined shape corresponding to the shape of the workpiece W as the sealing resin R (R1). Note that, as another example of the forming process, a forming method other than tableting may be adopted.

[0045] Specifically, in the above tableting process, a predetermined amount of base resin Rm supplied from the base resin supply unit 40 is conveyed by a conveying device (for example, the first loader 21, etc.) or directly sprayed from a dispenser or the like, and accommodated in the first cavity 108 of the first lower mold 106 (see FIG. 4). As described above, the base resin Rm is accommodated in the recessed portion 138 between the movable pieces 136 while not being placed on the upper surface of the movable pieces 136 (note that the base resin Rm may be first sprayed over the entire inside of the first cavity 108 including the upper surface of the movable pieces 136, and then swept down by a squeegee or the like, and finally accommodated in the recessed portion 138). Next, the first pressing device 150 is operated to close the first mold 102 heated to the above predetermined temperature (see FIG. 5).

[0046] When the mold is closed, first, the upper surface of the first clamper 128 and the lower surface of the first plate 142 come into contact with each other. Next (or simultaneously), the upper surface of the movable piece 136 and the lower surface of the first plate 142 come into contact with each other, so that the entire upper surface of the movable piece 136 is covered. Next, the base resin Rm is compressed (sandwiched and pressed) between the upper surface (region of the concave portion 138) of the first cavity piece 126 and the lower surface (region facing the concave portion 138) of the first plate 142. This forms a solid sealing resin R (R1) that has a "predetermined shape" (details will be described later) and is not fully cured. Note that "solid" includes a state in which the resin has melted to the so-called B stage or is in a state immediately before melting, since the resin is compressed while being heated to a temperature at which the resin will not fully cure.

[0047] It is important that the above tableting step is carried out at a temperature at which the main curing of the base resin Rm does not proceed easily (the first lower die 106 and the first upper die 104 are heated to a temperature at which the main curing does not proceed easily) so that the formed sealing resin R can be main cured in the subsequent resin sealing (compression molding) step. As described above, the "temperature at which the main curing does not proceed easily" depends on the material of the base resin Rm, but is specifically about 50°C to 80°C (about 70°C in this embodiment).

[0048] In addition, it is preferable to use a powder resin as the base resin Rm. This allows the amount of resin to be adjusted and supplied with greater precision than when granular or crushed resin is used. However, the base resin Rm is not limited to a powder resin.

[0049] After the tableting step, the first mold 102 is opened and the sealing resin R and the used film F are separated to enable removal of the sealing resin R (see FIG. 6). In this embodiment, by providing the lower mold film supplying step and the upper mold film supplying step described above, the film F is disposed on both the mold surface 106a of the first lower mold 106 and the mold surface 104a of the first upper mold 104, so that the sealing resin R formed by tableting can be easily released and damage due to the resin adhering to the mold can be prevented.

[0050] In addition, after the mold opening process, the first lower mold film supply unit 111 and the first upper mold film supply unit 113 are operated to send out the used film F from within the first mold 102 and to send and set a new film F into the first mold 102, thereby carrying out a film supply process (first lower mold film supply process, first upper mold film supply process).

[0051] The above are the main steps of the method for forming the sealing resin R according to this embodiment. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as there is no problem.

[0052] (Sealing resin) An example of the configuration (shape) of the sealing resin R (R1) formed by the above-mentioned forming device 1 and forming method is shown in FIG. 8 (however, the present invention is not limited to this configuration). Specifically, the sealing resin R (R1) has a lattice shape in which a plurality of through holes Rh are arranged in parallel on a plate-shaped main body Ra. Here, the "lattice shape" in this application is exemplified as a matrix shape including a single row shape, but is not limited to this, and may be a matrix shape of multiple rows and columns, a random shape, etc. Note that the sealing resin R (R1) may be configured so that one piece of the sealing resin R (R1) constitutes the "whole" of the required amount of sealing (one time per work W), or may be configured so that a plurality of pieces (e.g., about two or three pieces) are assembled (connected) to constitute the "whole" of the required amount of sealing.

[0053] By performing resin sealing (compression molding) using the above-mentioned sealing resin R (R1), it is possible to prevent the formation of thin burrs on the upper surface Wbf of the electronic component Wb, and to form a molded product Wp (see FIG. 9) in which the upper surface Wbf is reliably exposed (details will be described later). Therefore, in the above-mentioned forming process, it is important to set the position and shape of the through hole Rh of the sealing resin R so that the electronic component Wb of the work W to be sealed is accommodated in the through hole Rh and the upper surface Wbf of the electronic component Wb is exposed. The through hole Rh needs to be a little larger in size than each electronic component Wb and have the same shape as the electronic component Wb. In addition, the resin amount (height) of the sealing resin R (R1) needs to be an amount that allows the resin to penetrate under the electronic component Wb and seal it without excess or deficiency.

[0054] Furthermore, since the sealing resin R (R1) is formed as a solid resin, it is possible to realize a compression molding device 2 and a compression molding method that can prevent molding defects caused by uneven spreading, residual gas, and dust generation during molding compared to conventional granular resins. Also, handling before resin sealing can be facilitated.

[0055] As a modified example of the sealing resin R (R1), a configuration having legs Rb on either one of the surfaces may be used (see FIG. 10). In order to form the legs Rb, a configuration may be used in which a leg forming groove (recess) 143 is provided on at least one of the upper surface of the first cavity piece 126 of the first lower die 106 in the first die 102 or the lower surface of the first plate 142 of the first upper die 104 (see FIG. 11). With this sealing resin R (R1), by appropriately setting the position and length of the legs Rb, it is possible to easily adjust the lower surface (surface facing the workpiece W) of the sealing resin R (R1) so that it does not come into contact with the electronic component Wb of the workpiece W.

[0056] [Second embodiment] (Sealing resin forming device) In the second embodiment, an example will be described in which the sealing resin R is formed in a lattice shape having through holes Rh, and a heat sink H is fixed to one side to block the through holes Rh (all or part), thereby forming a sealing resin R (hereinafter, may be distinguished as "R2"). Here, a plan view of the forming device 1 according to the second embodiment is shown in FIG. 12, and a front cross-sectional view (schematic diagram) of the first mold 102 is shown in FIG. 13. Note that the heat sink H is, as an example, a plate-like member formed of a metal material (e.g., copper alloy, aluminum alloy, etc.) with a thickness of about 0.1 mm to several mm, but is not limited thereto.

[0057] The forming apparatus 1 according to the second embodiment has a basic configuration similar to that of the first embodiment described above, so the following description will focus on the differences.

[0058] The base resin supply unit 10D according to this embodiment includes a heat sink supply section 30 that supplies a heat sink H, in addition to the base resin supply section 40 similar to that of the first embodiment. As an example, the heat sink supply section 30 is configured to include a storage section (e.g., a stocker, etc.) in which a plurality of heat sink plates H are stored (a pickup, a stage, etc. may be provided as appropriate). When the heat sink plate H is transported from the base resin supply unit 10D to the resin forming unit 10E, the first loader 21 may be used as a transport device, or another transport device (not shown) may be used.

[0059] Next, the resin forming unit 10E of this embodiment is equipped with a press device (first press device) 150 similar to that of the first embodiment, but has a difference in the first upper mold 104 of the first mold 102 that is opened and closed by the first press device 150.

[0060] 13, the first upper die 104 according to this embodiment has a holding section 146 that holds a heat sink H (which may be another electronic component Wb) on the lower surface of the upper plate (first plate) 142. As an example, the holding section 146 is configured such that a plurality of fine through holes are provided in the film F that is adsorbed to the mold surface 104a of the first upper die 104, and the suction force of a suction device is generated in the through holes via suction paths (holes, grooves, etc.) in the first plate 142, thereby adsorbing and holding the heat sink H to the holding section 146. Note that the configuration of the holding section 146 is not limited to this.

[0061] According to the above-mentioned forming apparatus 1, it is possible to form the sealing resin R (R2) in a lattice shape having through holes Rh, with the heat sink H fixed to one side thereof to block the through holes Rh. The details of the forming method are described below.

[0062] (Method of forming sealing resin) Next, a method for forming the sealing resin R (R2) according to the second embodiment (hereinafter, may be simply referred to as a "forming method") will be described. As an example, the forming method can be carried out using the forming apparatus 1 according to the second embodiment. Here, Figs. 14 to 16 are explanatory diagrams of main steps.

[0063] The formation method according to the second embodiment has a basic configuration similar to that of the above-described first embodiment, so the following description will focus on the differences.

[0064] First, a preparation step is carried out similarly to that of the first embodiment. After the preparation step, a forming step is carried out to form a sealing resin R (R2) having a predetermined shape corresponding to the shape of the work W.

[0065] The forming process according to the present embodiment includes a tableting process in which the base resin Rm is tableted together with the heat sink H in the resin forming section 50 to form the solid sealing resin R (R2) formed in a predetermined shape to which the heat sink H is fixed. Note that, as another example of the forming process, a forming method other than tableting may be adopted.

[0066] Specifically, in the above-mentioned tableting process, the heat sink H supplied from the heat sink supply unit 30 is transported by a transport device (e.g., the first loader 21, etc.) and held at a predetermined position on the lower surface of the first plate 142 of the first upper mold 104 (see FIG. 14). Before or after this, or in parallel, a predetermined amount of base resin Rm supplied from the base resin supply unit 40 is transported by a transport device (e.g., the first loader 21, etc.) or directly sprayed from a dispenser or the like, and is contained in the first cavity 108 of the first lower mold 106 (see FIG. 14). As described above, the base resin Rm is accommodated in the recessed portion 138 between the movable pieces 136 while not resting on the upper surface of the movable pieces 136 (Note that the base resin Rm may be first sprayed over the entire first cavity 108 including the upper surface of the movable pieces 136, and then the upper surface of the movable pieces 136 may be swept off with a squeegee or the like, and finally accommodated in the recessed portion 138. After that, the heat sink H may be placed on the upper surface of the movable pieces 136 in the first cavity 108. In this case, the heat sink H is of a size that can be accommodated in the first cavity 108, and does not need to be held at a predetermined position on the lower surface of the first plate 142 of the first upper mold 104). Next, the first pressing device 150 is operated to close the first mold 102 heated to the above-mentioned predetermined temperature (see FIG. 15).

[0067] When the mold is closed, first, the upper surface of the first clamper 128 and the lower surface of the first plate 142 (at a position where the heat sink H is not held) come into contact with each other. Next (or at the same time), the upper surface of the movable piece 136 comes into contact with the lower surface of the heat sink H held by the first plate 142, so that the entire upper surface of the movable piece 136 is covered. Next, the base resin Rm is compressed (sandwiched and pressed) between the upper surface (region of the concave portion 138) of the first cavity piece 126 and the lower surface (region facing the concave portion 138) of the heat sink H held by the first plate 142. This forms a solid sealing resin R (R2) that has a "predetermined shape" (details will be described later) and is not fully cured. The term "solid" includes a state in which the resin has melted to the so-called B stage or a state immediately before melting, since the resin is compressed while being heated to a temperature at which the resin is not fully cured.

[0068] It is important that the above tableting step is carried out at a temperature at which the main curing of the base resin Rm does not proceed easily (the first lower die 106 and the first upper die 104 are heated to a temperature at which the main curing does not proceed easily) so that the formed sealing resin R can be main cured in the subsequent resin sealing (compression molding) step. As described above, the "temperature at which the main curing does not proceed easily" depends on the material of the base resin Rm, but is specifically about 50°C to 80°C (about 70°C in this embodiment).

[0069] In addition, it is preferable to use a powder resin as the base resin Rm. This allows the amount of resin to be adjusted and supplied with greater precision than when granular or crushed resin is used. However, the base resin Rm is not limited to a powder resin.

[0070] After the tableting process, the first mold 102 is opened and a mold opening process is performed in which the sealing resin R (with the heat sink H fixed to the upper surface) is separated from the used film F so that the sealing resin R can be removed (see Figure 16).

[0071] The steps subsequent to the above mold opening step are the same as those in the first embodiment, and therefore a repeated explanation will be omitted.

[0072] (Sealing resin) An example of the configuration (shape) of the sealing resin R (R2) formed by the above-mentioned forming device 1 and forming method is shown in Fig. 17 (however, the present invention is not limited to this configuration). Specifically, the sealing resin R (R2) has a lattice shape in which a plurality of through holes Rh are arranged in parallel on a plate-shaped main body portion Ra, and a heat sink H is fixed to one side to block the through holes Rh (all or part). The sealing resin R (R2) may be configured so that one piece constitutes the "whole" of the required amount of sealing (one application per workpiece W), or may be configured so that a collection (connection) of multiple pieces (e.g., about two or three pieces) constitutes the "whole" of the required amount of sealing.

[0073] By performing resin sealing (compression molding) using the above-mentioned sealing resin R (R2), a molded product Wp (see FIG. 18) having a configuration in which the heat sink H is exposed on the upper surface can be easily formed (details will be described later). At that time, it is possible to prevent thin burrs from being formed on the upper surface of the heat sink H, and the upper surface can be reliably exposed. Furthermore, since it is not necessary to carry the sealing resin R and the heat sink H separately into the sealing mold when performing compression molding (i.e., they can be carried in as a single component in a single process), it is possible to simplify the process and shorten the time.

[0074] As a modified example of the sealing resin R (R2), the surface to which the heat sink H is not fixed may have legs Rb (see FIG. 19). In order to form the legs Rb, a leg forming groove (recess) 143 may be provided on the upper surface of the first cavity piece 126 of the first lower die 106 in the first die 102 (see FIG. 20). With this sealing resin R (R2), by appropriately setting the position and length of the legs Rb, it is possible to easily adjust the lower surface (surface facing the workpiece W) of the sealing resin R (R2) so that it does not come into contact with the electronic component Wb of the workpiece W.

[0075] (Compression molding device and compression molding method) Next, an outline of a compression molding apparatus 2 and a compression molding method for performing resin sealing (compression molding) of a workpiece W using the sealing resin R according to the first and second embodiments will be described. Here, Fig. 21 is a plan view (schematic view) showing an example of the compression molding apparatus 2.

[0076] As shown in FIG. 21, the compression molding device 2 mainly includes a supply unit 10A that supplies the workpiece W, a press unit 10B that seals the workpiece W with resin and processes it into a molded product Wp, and a storage unit 10C that stores the molded product Wp. As an example, the supply unit 10A, the press unit 10B, and the storage unit 10C are arranged in this order along the X direction in FIG. 9. However, the above configuration is not limited to this, and the equipment configuration within the unit, the number of units, the arrangement order of the units, etc. may be changed. For example, the supply unit 10A and the storage unit 10C may be arranged in reverse to each other in the X direction, or may be arranged to be concentrated in one position (not shown). In addition, the configuration may include units other than those described above (not shown).

[0077] In addition, the compression molding device 2 has a guide rail 22 linearly provided between each unit, and a conveying device (second loader) 23 for conveying the work W and the sealing resin R (may be used for conveying other than the work W and the sealing resin R) and a conveying device (third loader) 24 for conveying the molded product Wp (may be used for conveying other than the molded product Wp) are provided so as to be movable between predetermined units along the guide rail 22. However, the above configuration is not limited, and a configuration may be provided with a common (single) conveying device (loader) for conveying the work W, the sealing resin R, the molded product Wp, etc. (not shown). Also, the conveying device may be configured to include a robot hand or the like instead of a loader.

[0078] In addition, in the compression molding apparatus 2, a control unit 90 that controls the operation of each mechanism in each unit is disposed in the supply unit 10A (it may be disposed in another unit).

[0079] The press unit 10B is provided with a resin sealing section 70 that resin-seals the workpiece W and processes it into a molded product Wp. In this embodiment, two press units 10B (three or more, or one) each equipped with the resin sealing section 70 are provided, and one press unit 10B is provided with one resin sealing section 70 (two or more) (see FIG. 21). However, this configuration is not limited to this. The resin sealing section 70 is provided with a pair of sealing dies (for example, a pair assembled with a plurality of die blocks, die plates, die pillars, etc., made of alloy tool steel, and other members) that are opened and closed by a press device.

[0080] Here, as an example, steps of a compression molding method performed using a compression molding apparatus 2 including a second press device 250 (see FIG. 22) and a second mold 202 (see FIG. 23) will be described with reference to FIGS. 24 to 34.

[0081] First, a sealing preparation step is performed. Specifically, a heating step (second upper die heating step) is performed in which the second upper die 204 is adjusted to a predetermined temperature (for example, 100°C to 300°C) and heated by the second upper die heating mechanism. In addition, a heating step (second lower die heating step) is performed in which the second lower die 206 is adjusted to a predetermined temperature (for example, 100°C to 300°C) and heated by the second lower die heating mechanism. In addition, an upper die film supply step (second upper die film supply step) is performed in which the second upper die film supply unit 213 is operated to supply new film F and adsorb it so as to cover a predetermined area of ​​the die surface 204a including the inner surface of the second cavity 208 in the second upper die 204.

[0082] After the sealing preparation step, a workpiece holding step is performed in which the workpiece W is held by the workpiece holding portion 205 of the second lower die 206 (see FIG. 24). Specifically, the workpiece W supplied from the supply magazine 12 is held by a conveying device (such as the second loader 23) and carried into the second die 202, and is held by the workpiece holding portion 205 of the lower plate (second plate) 242 (die surface 206a).

[0083] After the work holding step, a resin placing step is performed in which the sealing resin R is placed on the work W held by the work holding part 205 (see FIG. 25). Specifically, the sealing resin R formed in the above-mentioned forming device 1 is held by a conveying device (second loader 23, etc.), carried into the second mold 202, and placed on the work W held by the work holding part 205. When forming a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed, the work W and the sealing resin R are aligned with each other and placed so that the electronic component Wb is accommodated in the through hole Rh of the sealing resin R.

[0084] Alternatively, as another example of the resin placing step, the sealing resin R formed in the forming device 1 may be placed on the workpiece W before the above-mentioned workpiece holding step. In this case, the workpiece holding step is a step of holding the workpiece W with the sealing resin R placed thereon in the workpiece holding section 205. That is, the transport device (second loader 23, etc.) holds the workpiece W with the sealing resin R placed thereon, carries it into the second mold 202, and holds it in the workpiece holding section 205. This has the advantage of carrying out the workpiece W and the sealing resin R in the second mold 202 at one time, rather than separately.

[0085] Next, a resin sealing process is performed in which the work W is sealed with sealing resin R and processed into a molded product Wp. Specifically, the second mold 202 is closed, and the second cavity piece 226 is lowered relatively in the second cavity 208 surrounded by the second clamper 228 to perform a mold closing process in which the sealing resin R is heated and pressurized against the work W. As shown in FIG. 23, the second upper mold 204 (204A) of the second mold 202 is provided with a movable piece 236 that abuts against the entire upper surface Wbf of the electronic component Wb set to be exposed in the second cavity piece 226 and is movable up and down. The movable piece 236 is supported in a state in which it is urged toward the second lower mold 206 by a movable piece spring 234 via a push pin 232.

[0086] Here, when forming a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed using the sealing resin R (R1), the mold closing process is as follows. Specifically, the second upper die 204 (204A) and the second lower die 206 are moved closer to each other. At this time, the movable piece 236 comes into contact with the upper surface Wbf of the electronic component Wb of the work W, covering the entire upper surface Wbf (see FIG. 26). Next, the second clamper 228 comes into contact with the base material Wa of the work W via the film F, and clamps the work W (see FIG. 27). These steps may be set in the reverse order or simultaneously. Next, the lower surface of the second cavity piece 226 (the area where the movable piece 236 is not provided) comes into contact with the sealing resin R (R1) placed on the base material Wa of the work W, and further pressurized. This causes the sealing resin R (R1) to thermally harden, completing the resin sealing (compression molding) (see FIG. 28). In this way, it is possible to prevent the formation of thin burrs on the upper surface Wbf of the electronic component Wb. Next, the second mold 202 is opened, and a mold opening process is performed in which the molded product Wp is separated from the used film F so that the molded product Wp can be removed (see FIG. 29).

[0087] On the other hand, when forming a molded product Wp in which the heat sink H is exposed using the sealing resin R (R2), a second upper die 204B (see FIG. 30) having a general configuration without a movable piece may be used as the second upper die 204 instead of the second upper die 204A (see FIG. 23) having the above-mentioned movable piece. In this case, the mold closing process is as follows. Specifically, the second upper die 204 (204B) and the second lower die 206 are moved closer to each other. At this time, the clamper 228 abuts against the base material Wa of the work W via the film F, and the work W is clamped (see FIG. 31). Next, the second cavity piece 226 abuts against the upper surface of the heat sink H of the sealing resin R (R2), and covers the upper surface of the heat sink H (see FIG. 32). These may be set to occur simultaneously. Next, the lower surface of the heat sink H, which is in contact with the second cavity piece 226, presses the sealing resin R (R2) placed on the base material Wa of the work W. This causes the sealing resin R (R2) to thermally harden, completing the resin sealing (compression molding) (see FIG. 33). In this way, it is possible to prevent a thin burr from being formed on the upper surface of the heat sink H. Note that, although the sealing resin R2 with the heat sink H in the shape of FIG. 17 is used in this example, it is not necessary to have the heat sink H. After the sealing resin R1 without the heat sink is placed on the base material Wa, only the heat sink H may be placed on the sealing resin R1 and molded. Next, the second mold 202 is opened, and a mold opening process is performed in which the molded product Wp and the used film F are separated so that the molded product Wp can be taken out (see FIG. 34). In this case, an elastic thermally conductive resin sheet or the like (not shown) is placed between the surface of the electronic component Wb mounted on the work W that faces the heat sink H and the surface of the heat sink H of the sealing resin R (R2) placed on the work W that faces the electronic component Wb, thereby preventing any gaps from occurring and preventing the upper surface of the electronic component Wb from being sealed with resin.

[0088] Next, a molded product carrying-out process is carried out in which the molded product Wp is carried out from the second mold 202 by a carrying device (third loader 24, etc.) and carried out to the storage unit 10C. As an example, the carried molded product Wp is stored in the storage magazine 14. In addition, after or in parallel with the molded product carrying-out process, a process is carried out in which the second upper mold film supply unit 213 is operated to send out the used film F from the second mold 202 and send a new film F into the second mold 202 and set it therein.

[0089] The above are the main steps of the compression molding method performed using the compression molding apparatus 2 including the second press device 250 and the second mold 202. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as there is no problem.

[0090] As another example, steps of a compression molding method performed using a compression molding apparatus 2 including a third press device 350 (see FIG. 35) and a third mold 302 (see FIG. 36) will be described with reference to FIGS. 37 to 47.

[0091] First, a sealing preparation step is performed. Specifically, a heating step (third upper die heating step) is performed in which the third upper die 304 is adjusted to a predetermined temperature (for example, 100°C to 300°C) and heated by the third upper die heating mechanism (third upper die heating step). In addition, a heating step (third lower die heating step) is performed in which the third lower die 306 is adjusted to a predetermined temperature (for example, 100°C to 300°C) and heated by the third lower die heating mechanism (third lower die heating step). In addition, a lower die film supply step (third lower die film supply step) is performed in which the third lower die film supply unit 311 is operated to supply new film F and adsorb it so as to cover a predetermined area of ​​the die surface 306a of the third lower die 306.

[0092] After the sealing preparation step, a workpiece holding step is performed in which the workpiece W is held by the workpiece holding portion 305 of the third upper die 304 (see FIG. 37). Specifically, the workpiece W supplied from the supply magazine 12 is held by a transport device (such as the second loader 23) and carried into the third die 302, and is held by the workpiece holding portion 305 of the upper plate (third plate) 342 (die surface 304a). As an example of holding the workpiece W, a suction hole (not shown) may be opened in the workpiece holding portion 305 to suck the workpiece W, but the holding method is not limited to suction.

[0093] After or in parallel with the workpiece holding step, a resin holding step is performed in which the sealing resin R is held in the third cavity 308 of the third lower die 306 (see FIG. 38). Specifically, the sealing resin R formed in the above-mentioned forming device 1 is held by a conveying device (such as the second loader 23) and carried into the third die 302, and accommodated in the third cavity 308 (specifically, placed on the upper surface of the third cavity piece 326). When forming a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed, the workpiece W and the sealing resin R are aligned with each other and held so that the electronic component Wb is accommodated in the through hole Rh of the sealing resin R.

[0094] Next, a resin sealing process is performed in which the work W is sealed with sealing resin R and processed into a molded product Wp. Specifically, the third mold 302 is closed, and the third cavity piece 326 is relatively raised in the third cavity 308 surrounded by the third clamper 328 to perform a mold closing process in which the sealing resin R is heated and pressurized against the work W. As shown in FIG. 36, the third lower mold 306 (306A) of the third mold 302 is provided with a movable piece 336 that abuts against the entire upper surface Wbf of the electronic component Wb set to be exposed in the third cavity piece 326 and is movable up and down. The movable piece 336 is supported in a state in which it is urged toward the third upper mold 304 by a movable piece spring 334 via a push pin 332.

[0095] Here, when forming a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed using the sealing resin R (R1), the mold closing process is as follows. Specifically, the third upper die 304 and the third lower die 306 are moved closer to each other. At this time, the movable piece 336 comes into contact with the upper surface Wbf (facing downward) of the electronic component Wb of the work W, covering the entire upper surface Wbf (see FIG. 39). Next, the third clamper 328 comes into contact with the base material Wa of the work W via the film F, and clamps the work W (see FIG. 40). These steps may be set in the reverse order or simultaneously. Next, the sealing resin R (R1) is pressed by the upper surface (area where the movable piece 336 is not provided) of the third cavity piece 326 and the base material Wa of the work W. This causes the sealing resin R (R1) to thermally harden, completing the resin sealing (compression molding) (see FIG. 41). In this way, it is possible to prevent the formation of a thin burr on the upper surface Wbf of the electronic component Wb. Next, the third mold 302 is opened, and a mold opening process is performed in which the molded product Wp is separated from the used film F so that the molded product Wp can be removed (see FIG. 42).

[0096] On the other hand, when forming a molded product Wp with an exposed heat sink H using the sealing resin R (R2), a third lower die 306B (see FIG. 43) having a general configuration without a movable piece may be used as the third lower die 306 instead of the third lower die 306A (see FIG. 36) having the above-mentioned movable piece. In this case, the mold closing process is as follows. Specifically, the sealing resin R (R2) is placed on the upper surface of the third cavity piece 326 so that the heat sink H of the sealing resin R (R2) abuts against the upper surface of the third cavity piece 326. Next, the third upper die 304 and the third lower die 306 are moved closer to each other. At this time, the third clamper 328 abuts against the base material Wa of the work W via the film F, and the work W is sandwiched (see FIG. 44). Next, the base material Wa of the work W comes into contact with the upper surface (the surface to which the heat sink H is not fixed) of the sealing resin R (R2) (see FIG. 45). These may be set to occur simultaneously. Next, the sealing resin R (R2) is pressed by the heat sink H that is in contact with the third cavity piece 326 and the base material Wa of the work W. This causes the sealing resin R (R2) to thermally harden, completing the resin sealing (compression molding) (see FIG. 46). Note that in this example, the sealing resin R2 with the heat sink H in the shape of FIG. 17 is used, but it is not necessary to have the heat sink H. After placing only the heat sink H on the upper surface of the third cavity piece 326, the sealing resin R1 without the heat sink may be placed on the heat sink H and molded. In this way, it is possible to prevent a thin burr from being formed on the upper surface of the heat sink H. Next, the third mold 302 is opened, and a mold opening process is performed in which the molded product Wp and the used film F are separated to enable the molded product Wp to be removed (see FIG. 47). In this case, an elastic heat conductive resin sheet or the like (not shown) is placed between the surface of the electronic component Wb mounted on the work W that faces the heat sink H and the surface of the heat sink H of the sealing resin R (R2) placed on the third cavity piece 326 that faces the electronic component Wb to prevent a gap from being generated, thereby preventing the upper surface of the electronic component Wb from being sealed with resin.

[0097] Next, a molded product carrying-out process is carried out in which a conveying device (third loader 24, etc.) carries out the molded product Wp from inside the third mold 302 and carries it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 14. In addition, after or in parallel with the molded product carrying-out process, a process is carried out in which the third lower mold film supply unit 311 is operated to send out the used film F from inside the third mold 302 and send a new film F into the third mold 302 and set it therein.

[0098] The above are the main steps of the compression molding method performed using the compression molding apparatus 2 including the third press device 350 and the third mold 302. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as there is no problem.

[0099] As described above, the molding apparatus and method according to the present invention can form a sealing resin that provides the following effects. That is, by using the lattice-shaped solid sealing resin according to the present invention, it is possible to realize a compression molding apparatus and a compression molding method that can prevent molding defects caused by uneven distribution, residual gas, and dust generation during molding, and prevent the formation of thin burrs in the sealing resin at exposed parts of the molded product. In addition, handling before resin sealing can be facilitated.

[0100] Furthermore, by using a lattice-shaped solid sealing resin to which the heat sink is fixed, a molded product in which the heat sink is exposed on the upper surface can be easily formed, and the forming process can be simplified and time-saving.

[0101] The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. [Explanation of symbols]

[0102] 1. Sealing resin forming device 2. Compression molding equipment 102 Tablet pressing mold 136 Movable piece 202, 302 Sealing mold 236, 336 Movable piece H Heat sink Rm Base Resin R Sealing resin Rh through hole Double work Wa base material Wb electronic components

Claims

1. A forming apparatus for forming a sealing resin used in compression molding of a workpiece, The tableting mold has an upper mold and a lower mold, contains a base resin, and tablets the base resin into a lattice-shaped sealing resin having through holes. The sealing resin forming apparatus is characterized by the above.

2. the lower die has a cavity piece which becomes a bottom of a cavity, a clamper which is disposed to surround the cavity piece and which becomes an inner wall of the cavity, and a plurality of movable pieces which protrude from an upper surface of the cavity piece, are disposed at predetermined positions, and are movable up and down; The tableting die is configured to accommodate the base resin around the movable piece in the cavity and to tablet the base resin, and the area of ​​the movable piece is configured to be formed as the through hole.

2. The sealing resin forming apparatus according to claim 1,

3. the upper die has a holding portion for holding a heat sink on a lower surface of the upper plate, The tableting die is configured to perform tableting in a state where the heat sink plate is held by the holding portion of the upper die and the base resin is accommodated around the movable piece of the lower die, and the sealing resin is formed with the heat sink plate fixed thereto.

3. The sealing resin forming apparatus according to claim 2, further comprising:

4. The tableting die has a leg forming groove formed on at least one of the upper surface of the cavity piece of the lower die and the lower surface of the upper plate of the upper die, which forms a leg to be erected in the sealing resin.

3. The sealing resin forming apparatus according to claim 2, further comprising:

5. A powder resin is used as the base resin.

5. The sealing resin forming apparatus according to claim 1, wherein

6. A method for forming a sealing resin used in compression molding of a workpiece, comprising the steps of: The method further comprises the step of forming the sealing resin in a lattice shape having through holes. A method for forming a sealing resin comprising the steps of:

7. The forming step includes a step of tableting a base resin to form the sealing resin.

7. The method for forming a sealing resin according to claim 6,

8. The forming step includes a step of filling the base resin around a movable piece provided in a cavity and tableting the base resin to form the sealing resin so that the area of ​​the movable piece becomes the through hole.

8. The method for forming a sealing resin according to claim 7,

9. the forming step includes a step of holding a heat sink in a holding part of an upper die, and placing the base resin around the movable piece of a lower die and tableting the base resin to form the sealing resin with the heat sink fixed thereto.

9. The method for forming a sealing resin according to claim 8,

10. A powder resin is used as the base resin. The method for forming a sealing resin according to any one of claims 7 to 9,

11. A sealing resin used in compression molding of a workpiece, Formed in a lattice shape with through holes The sealing resin is characterized by:

12. A heat sink is fixed to one side of the plate, and the through hole is blocked. The sealing resin according to claim 11 .

Images