Display device manufacturing device, and display device manufacturing method

Abstract

To provide a display device manufacturing device, and a display device manufacturing method.SOLUTION: The present invention relates to a display device manufacturing device and a display device manufacturing method. The display device manufacturing device includes: a locating part, at which a substrate, on which a dummy layer is arranged, is located; plural support parts arranged at the locating part and supporting the substrate; and a measurement part opposed to the locating part and measuring thickness of the dummy layer. The locating part linearly moves to arrange the measurement part and the dummy layer at corresponding positions based on results measured at the measurement part.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an apparatus and method, and more particularly to an apparatus for manufacturing a display device and a method for manufacturing a display device. [Background technology]

[0002] Mobility-based electronic devices are widely used. In addition to small electronic devices such as mobile phones, tablet personal computers (PCs) have recently become popular as mobile electronic devices.

[0003] Such mobile electronic devices include a display device to provide a user with visual information such as an image or video to support various functions. Recently, as components other than those for driving the display device are becoming smaller, the proportion of the display device in the electronic device is gradually increasing, and structures that can be bent from a flat state to a predetermined angle are also being developed.

[0004] During the manufacture of such displays, various layers are formed, the thickness of at least one of which determines the performance of the display. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 7150776 [Patent Document 2] Patent No. 7348440 [Patent Document 3] JP 2023-079032 A Summary of the Invention [Problem to be solved by the invention]

[0006] In general, when forming at least one layer of a display device, it is necessary to form the thickness to be the same as or similar to a preset thickness. To achieve this, various methods are used, but the thickness of at least one layer may differ from the preset thickness. In such a case, the manufactured display device may not be able to emit light of a desired wavelength to the outside, or may have a deteriorated performance. In order to solve such a problem, the embodiment of the present invention provides a display device manufacturing apparatus and a display device manufacturing method capable of manufacturing a display device of uniform quality by measuring and compensating for the thickness of at least one layer. [Means for solving the problem]

[0007] One embodiment of the present invention discloses a display device manufacturing apparatus including a mounting section on which a substrate having a dummy layer is placed, a plurality of support sections arranged on the mounting section and supporting the substrate, and a measuring section arranged opposite the mounting section and measuring a thickness of the dummy layer, wherein the mounting section moves linearly so that the measuring section and the dummy layer are positioned in corresponding positions based on the results of measurement by the measuring section.

[0008] In this embodiment, the apparatus further includes a drive unit connected to the placement unit and configured to linearly move the placement unit.

[0009] In this embodiment, a sensing unit that measures the position of the placement unit and the position of the substrate is further included.

[0010] In this embodiment, the placement unit may linearly move the substrate so that the position of the substrate corresponds to a preset position based on the result of measurement by the sensing unit.

[0011] In the present embodiment, one of the plurality of support parts may be disposed at a different height than the other of the plurality of support parts.

[0012] In the present embodiment, at least one of the sensing unit and the measuring unit is disposed, and the device further includes a motion driver for moving at least one of the sensing unit and the measuring unit.

[0013] In this embodiment, the apparatus further includes a process section that forms at least one layer on the substrate, and a path unit that is connected to the process section and forms a movement path for the substrate, and the placement section, the support section, and the measurement section can be arranged in the process section or the path unit.

[0014] In this embodiment, the processing unit includes a first processing unit and a second processing unit which form different layers on the substrate, and the thickness of the layer formed on the substrate can be measured in the first processing unit, and the thickness of the layer formed on the substrate can be adjusted in at least one of the first processing unit and the second processing unit.

[0015] In this embodiment, the apparatus further includes a substrate pressing unit arranged to face at least one of the plurality of support units and at least one of the placement units, and configured to maintain at least a portion of the substrate flat.

[0016] In the present embodiment, the measurement unit may irradiate a signal in a direction perpendicular to one surface of the dummy layer.

[0017] Another embodiment of the present invention discloses a method for manufacturing a display device, including the steps of: moving a position of a substrate placed on a mounting portion so that it corresponds to a preset position; separating the substrate from a support portion and moving the support portion to an initial position, and then placing the substrate on the support portion; moving the substrate so that its position corresponds to the preset position; and moving the support portion so that a position of a dummy layer on the substrate corresponds to the preset dummy position.

[0018] In this embodiment, the method further includes the step of measuring the position of the substrate and the position of the placement part.

[0019] In this embodiment, the method further includes measuring the thickness of the dummy layer.

[0020] In this embodiment, the thickness of the dummy layer can be measured during the transfer of the substrate.

[0021] In this embodiment, the thickness of the dummy layer can be measured in a space where a layer identical to the dummy layer is formed on the substrate.

[0022] In this embodiment, the method further includes measuring the position of the dummy layer.

[0023] In this embodiment, the method further includes the step of comparing the position of the dummy layer with a preset dummy position.

[0024] In this embodiment, the method may further include supporting different portions of the substrate at different heights.

[0025] In this embodiment, the method further includes maintaining the substrate flat.

[0026] In this embodiment, the method may further include applying pressure to an edge of the substrate adjacent to the dummy layer to maintain the portion of the substrate on which the dummy layer is disposed flat.

[0027] Other aspects, features, and advantages in addition to those described above will become apparent from the following drawings, claims, and detailed description of the invention.

[0028] Such general and specific aspects may be implemented using a system, a method, a computer program, or a combination of a system, method, or computer program. Effect of the Invention

[0029] The display device manufacturing apparatus and the display device manufacturing method according to the embodiment of the present invention are capable of measuring the thickness of a layer and adjusting the thickness of the layer in real time.

[0030] The display device manufacturing apparatus and the display device manufacturing method according to the embodiment of the present invention manufacture a high-resolution display device.

[0031] The display device manufacturing apparatus and the display device manufacturing method according to the embodiment of the present invention are capable of measuring the thickness of a layer at an accurate position.

[0032] The display device manufacturing apparatus and the display device manufacturing method according to the embodiments of the present invention can reduce measurement errors caused by bending of the substrate. [Brief description of the drawings]

[0033] [Figure 1] 1 is a plan view illustrating a manufacturing apparatus for a display device according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a cross-sectional view showing a schematic diagram of the connecting portion shown in FIG. [Diagram 3] 3 is a perspective view showing a schematic view of a placement unit, a support unit, and a drive unit shown in FIG. 2. FIG. [Figure 4A] 2 is a partial perspective view illustrating a part of the display device manufacturing apparatus illustrated in FIG. 1 in an operating state. [Figure 4B] 2 is a partial perspective view illustrating a part of the display device manufacturing apparatus illustrated in FIG. 1 in an operating state. [Figure 4C] 2 is a partial perspective view illustrating a part of the display device manufacturing apparatus illustrated in FIG. 1 in an operating state. [Figure 4D] 2 is a partial perspective view illustrating a part of the display device manufacturing apparatus illustrated in FIG. 1 in an operating state. [Figure 4E] 2 is a partial perspective view illustrating a part of the display device manufacturing apparatus illustrated in FIG. 1 in an operating state. [Figure 4F] 2 is a partial perspective view illustrating a part of the display device manufacturing apparatus illustrated in FIG. 1 in an operating state. [Figure 4G] 2 is a partial perspective view illustrating a part of the display device manufacturing apparatus illustrated in FIG. 1 in an operating state. [Diagram 5] 4 is a front view showing a schematic view of a part of the support part shown in FIG. 3. [Figure 6A] 11 is a cross-sectional view illustrating a process of a display device manufacturing apparatus according to another embodiment of the present invention. [Figure 6B] FIG. 6B is a plan view illustrating the motion driver and substrate illustrated in FIG. 6A. [Figure 7] FIG. 11 is a front view illustrating a schematic view of a part of a display device manufacturing apparatus according to still another embodiment of the present invention. [Figure 8] FIG. 11 is a front view illustrating a schematic view of a part of a display device manufacturing apparatus according to still another embodiment of the present invention. [Figure 9] FIG. 13 is a front view showing a part of a display device manufacturing apparatus according to still another embodiment of the present invention. [Figure 10] 1 is a plan view illustrating a display device according to an embodiment of the present invention. [Figure 11] 11 is a cross-sectional view illustrating a cross section taken along line XI-XI' in FIG. 10. [Figure 12] 12 is a cross-sectional view showing a schematic view of an organic light-emitting diode of the display device of FIG. 11. [Figure 13] 12 is a cross-sectional view showing a schematic view of an organic light-emitting diode of the display device of FIG. 11. [Figure 14] 12 is a cross-sectional view showing a schematic view of an organic light-emitting diode of the display device of FIG. 11. [Figure 15] 12 is a cross-sectional view showing a schematic view of an organic light-emitting diode of the display device of FIG. 11. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0034] The present invention can be modified in various ways and can have various embodiments, but a specific embodiment is illustrated in the drawings and will be described in detail by the detailed description. The advantages, features, and methods of achieving the present invention will become clear with reference to the embodiments described in detail below together with the drawings. However, the present invention is not limited to the embodiments disclosed below, but can be embodied in various forms.

[0035] Hereinafter, an embodiment of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, the same or corresponding components are denoted by the same reference numerals, and duplicate descriptions thereof will be omitted.

[0036] In the following embodiments, terms such as first and second are not used in a limiting sense but are used for the purpose of distinguishing one component from another component.

[0037] In the following embodiments, singular expressions include plural expressions unless otherwise clearly and particularly meant in the context.

[0038] In the following embodiments, the terms "comprise" or "have" mean the presence of features or components described in the specification, without precluding the possibility that one or more other features or components may be added.

[0039] In the following embodiments, when a part such as a film, region, or component is said to be "on" or "above" another part, this does not only mean that it is directly on top of the other part, but also means that there is another film, region, component, etc. in between.

[0040] In the drawings, the size of components may be exaggerated or reduced for the convenience of explanation. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation, and the present invention is not necessarily limited to what is shown in the drawings.

[0041] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes on a Cartesian coordinate system, but may be interpreted in a broader sense including the three axes. For example, the x-axis, y-axis, and z-axis may be mutually orthogonal, but may not be mutually orthogonal and may indicate different directions.

[0042] It is understood that certain embodiments may be implemented differently, and certain steps may be performed out of the order described. For example, two steps described in succession may be performed substantially simultaneously or may be performed in the reverse order from that described.

[0043] Fig. 1 is a plan view illustrating a display device manufacturing apparatus according to an embodiment of the present invention, Fig. 2 is a cross-sectional view illustrating a connection unit illustrated in Fig. 1, Fig. 3 is a perspective view illustrating a placement unit, a support unit, and a driving unit illustrated in Fig. 2.

[0044] 1 to 3, the display device manufacturing apparatus 1 includes a loading unit 1000, a flip unit 2000, at least one cluster, an unloading unit 9100, and a connecting unit 9200.

[0045] A display substrate DP may be introduced into the loading unit 1000 from the outside. At this time, the display substrate DP may have at least one layer disposed on a substrate, which will be described later. Although not shown in the drawings, the loading unit 1000 may include a separate robot arm and move the display substrate DP to the flip unit 2000. Here, the layer may be at least one layer from a group including, for example, each layer constituting the display device 2 shown in FIG. 11 and a dummy layer that may be disposed only in a specific region of the display substrate DP. Each layer may be formed in each process unit, which will be described later.

[0046] The flip unit 2000 may invert the display substrate DP transferred from the loading unit 1000. Specifically, the flip unit 2000 may invert the display substrate DP such that a layer to be formed faces one side of the display substrate DP from the top to the bottom when a process is performed in at least one cluster.

[0047] At least one cluster may temporarily store the display substrate DP or form a layer on the display substrate DP. At this time, the at least one cluster may include a transfer chamber, which is a path unit connected to the connecting part 9200 as a path unit, for temporarily storing and transferring the display substrate DP, and a process part, which is connected to the transfer chamber and forms a layer on the display substrate DP. In another embodiment, the at least one cluster may further include a thickness measuring part for measuring a thickness of a layer formed in the process part. At this time, in one embodiment, the thickness measuring part may be provided in at least one of the plurality of clusters. The thickness measuring part may be disposed between the connecting part 9200 and the transfer chamber of each cluster, and may connect the connecting part 9200 and the transfer chamber. In the following, for convenience of explanation, a case where a plurality of at least one clusters are provided and the thickness measuring part is provided in the second cluster 4000 will be mainly described in detail.

[0048] The plurality of clusters also includes a first cluster 3000, a second cluster 4000, a third cluster 5000, a fourth cluster 6000, a fifth cluster 7000 and a sixth cluster 8000 which are connected to each other.

[0049] The first cluster 3000 includes a first transfer chamber 3100 connected to the flip unit 2000 and having a first robot arm 3200 disposed therein, and a first process unit 3300 connected to the first transfer chamber 3100 and forming a first layer on the display substrate DP. In this case, the first layer is also a first functional layer, which will be described later. In this case, the first functional layer may include a plurality of layers containing different materials.

[0050] The second cluster 4000 may be connected to the first cluster 3000 via a connection unit 9200. In this case, the second cluster 4000 may include a second transfer chamber 4100 connected to the connection unit 9200 and having a second robot arm 4200 disposed therein, and a second process unit 4300 connected to the second transfer chamber 4100 and forming a second layer on the display substrate DP. In this case, a plurality of second process units 4300 may be provided, and the plurality of second process units 4300 may form different layers from each other. In addition, the second cluster 4000 may include a second thickness measurement unit 4400 connected to the second transfer chamber 4100 and having a second thickness measurement unit, which will be described later, disposed therein.

[0051] The third cluster 5000 may be connected to the second cluster 4000 via a connection unit 9200. In this case, the third cluster 5000 may include a third transfer chamber 5100 connected to the connection unit 9200 and having a third robot arm 5200 disposed therein, and a third processing unit 5300 connected to the third transfer chamber 5100 and forming a third layer on the display substrate DP. In this case, a plurality of third processing units 5300 may be provided, and the plurality of third processing units 5300 may form different layers from each other.

[0052] The fourth cluster 6000 may be connected to the third cluster 5000 via a connecting unit 9200. In this case, the fourth cluster 6000 may include a fourth transfer chamber 6100 connected to the connecting unit 9200 and having a fourth robot arm 6200 disposed therein, and a fourth processing unit 6300 connected to the fourth transfer chamber 6100 and forming a fourth layer on the display substrate DP. In this case, a plurality of fourth processing units 6300 may be provided, and each fourth processing unit 6300 may form a different layer. For example, the fourth processing unit 6300 may form an organic light-emitting layer, and each fourth processing unit 6300 may form an organic light-emitting layer including a different material. For example, each fourth processing unit 6300 may form a green, red, or blue organic light-emitting layer on the third layer.

[0053] The fifth cluster 7000 may be connected to the fourth cluster 6000 via a connection unit 9200. In this case, the fifth cluster 7000 may include a fifth transfer chamber 7100 connected to the connection unit 9200 and having a fifth robot arm 7200 disposed therein, and a fifth process unit 7300 connected to the fifth transfer chamber 7100 and forming a fifth layer on the display substrate DP. In this case, a plurality of fifth process units 7300 may be provided, and the plurality of fifth process units 7300 may form different layers from each other.

[0054] The sixth cluster 8000 may be connected to the fifth cluster 7000 via a connection unit 9200. In this case, the sixth cluster 8000 may include a sixth transfer chamber 8100 connected to the connection unit 9200 and having a sixth robot arm 8200 disposed therein, and a sixth process unit 8300 connected to the sixth transfer chamber 8100 and forming a sixth layer on the display substrate DP. In this case, a plurality of sixth process units 8300 may be provided, and the plurality of sixth process units 8300 may form different layers. For example, one of the plurality of sixth process units 8300 may form the (6-1) layer, another of the plurality of sixth process units 8300 may form the (6-2) layer, yet another of the plurality of sixth process units 8300 may form the (6-3) layer, and yet another of the plurality of sixth process units 8300 may form the (6-4) layer. In this case, the (6-1) layer, the (6-2) layer, the (6-3) layer and the (6-4) layer may be stacked in sequence on the fifth layer. In another embodiment, a plurality of sixth clusters 8000 may be provided and connected to each other. In such a case, each sixth cluster 8000 may form the (6-1) layer, the (6-2) layer, the (6-3) layer and the (6-4) layer, respectively. In such a case, a plurality of sixth clusters 8000 may be arranged in a line.

[0055] The unloading unit 9100 may be connected to at least one cluster and may perform a function of unloading the processed display substrate DP to the outside or transferring it to another display device manufacturing device.

[0056] The connecting part 9200 is also a path unit, and is disposed between the flip part 2000 and the first cluster 3000, between adjacent clusters among the first cluster 3000 to the sixth cluster 8000, and between the sixth cluster 8000 and the unloading part 9100, and can not only connect adjacent components to each other but also transfer the display substrate DP between adjacent components. Specifically, the connecting part 9200 includes a first connecting part 9210, a second connecting part 9220, a third connecting part 9230, a fourth connecting part 9240, a fifth connecting part 9250, and a sixth connecting part 9260. In this case, the first connection unit 9210 may be disposed between the first cluster 3000 and the second cluster 4000, the second connection unit 9220 may be disposed between the second cluster 4000 and the third cluster 5000, and the third connection unit 9230 may connect the third cluster 5000 and the fourth cluster 6000. In addition, the fourth connection unit 9240 may be disposed between the fourth cluster 6000 and the fifth cluster 7000, the fifth connection unit 9250 may be disposed between the fifth cluster 7000 and the sixth cluster 8000, and the sixth connection unit 9260 may connect the sixth cluster 8000 and the unloading unit 9100. In another embodiment, the sixth connection unit 9260 may connect the sixth cluster 8000 and the flip unit 2000, and the flip unit 2000 may be connected to the unloading unit 9100.

[0057] The display device manufacturing apparatus 1 also includes a thickness measuring unit that measures the thickness of at least one of various layers laminated on the display substrate DP. In this case, the thickness measuring unit may be disposed on a path along which the display substrate DP on which each layer is formed moves. In addition, a plurality of thickness measuring units may be provided, and each thickness measuring unit may measure at least one of the thicknesses of each layer laminated on the display substrate DP and the thicknesses of each dummy layer formed simultaneously with each layer in the display device manufacturing apparatus 1. That is, the plurality of thickness measuring units may include a first thickness measuring unit that measures at least one of the thicknesses of the first layer and the first dummy layer, a second thickness measuring unit that measures at least one of the thicknesses of the second layer and the second dummy layer, a third thickness measuring unit that measures at least one of the thicknesses of the third layer and the third dummy layer, a fourth thickness measuring unit that measures at least one of the thicknesses of the fourth layer and the fourth dummy layer, a fifth thickness measuring unit that measures at least one of the thicknesses of the fifth layer and the fifth dummy layer, and a sixth thickness measuring unit that measures at least one of the thicknesses of the sixth layer and the sixth dummy layer. Here, the dummy layer is a layer that can be disposed only in one region of the display substrate DP, for example, a specific region of the display substrate DP. For example, the dummy layer (including the first to sixth dummy layers) is disposed in a frame portion of the display substrate DP. For example, the dummy layer can be disposed not in the display region DA (FIG. 10) where pixels that display images are disposed, but in the peripheral region PA (FIG. 10) excluding the display region DA. The peripheral region PA (non-display region) is disposed so as to surround the display region DA. The display region DA is, for example, a region including a pixel circuit layer PCL, a display element layer DEL, a sealing layer 300, and the like, as shown in FIG. 11. Also, for example, each layer (including the first to sixth layers) other than the dummy layer can be disposed in a region other than the frame portion of the display substrate DP. For example, each layer other than the dummy layer can be disposed in the display region DA where pixels that display images are disposed. And each layer other than the dummy layer can be each layer constituting the pixel circuit layer PCL, the display element layer DEL, the sealing layer 300, and the like. The dummy layer can be a layer different from each of the layers. The dummy layer may be a layer independent of the layers.Each dummy layer may be manufactured in the same process as each layer and may be made of the same material as the other layers. That is, the first dummy layer may be manufactured in the same process as the first layer and may be made of the same material as the other layers. The second dummy layer may be manufactured in the same process as the second layer and may be made of the same material as the other layers. The third dummy layer may be manufactured in the same process as the third layer and may be made of the same material as the other layers. The fourth dummy layer may be manufactured in the same process as the fourth layer and may be made of the same material as the other layers. The fifth dummy layer may be manufactured in the same process as the fifth layer and may be made of the same material as the other layers. The sixth dummy layer may be manufactured in the same process as the sixth layer and may be made of the same material as the other layers.

[0058] In this case, each thickness measuring unit measures at least one of the thickness of a layer formed in one cluster and the thickness of a dummy layer, and may be disposed in at least one of the transfer chamber, the processing unit, the thickness measuring unit, and the connecting unit 9200 connected to the cluster. Specifically, the first thickness measuring unit measuring at least one of the thickness of the first layer and the thickness of the first dummy layer may be disposed in at least one of the first transfer chamber 3100, the first processing unit 3300, and the first connecting unit 9210. The second thickness measuring unit measuring at least one of the thickness of the second layer and the thickness of the second dummy layer may be disposed in at least one of the second transfer chamber 4100, the second processing unit 4300, the second thickness measuring unit 4400, and the second connecting unit 9220. The third thickness measuring unit measuring at least one of the thickness of the third layer and the thickness of the third dummy layer may be disposed in at least one of the third transfer chamber 5100, the third processing unit 5300, and the third connecting unit 9230. The fourth thickness measuring unit for measuring at least one of the thickness of the fourth layer and the thickness of the fourth dummy layer may be disposed in at least one of the fourth transfer chamber 6100, the fourth processing unit 6300, and the fourth connecting unit 9240. The fifth thickness measuring unit for measuring at least one of the thickness of the fifth layer and the thickness of the fifth dummy layer may be disposed in at least one of the fifth transfer chamber 7100, the fifth processing unit 7300, and the fifth connecting unit 9250. The sixth thickness measuring unit for measuring at least one of the thickness of the sixth layer and the thickness of the sixth dummy layer may be disposed in at least one of the sixth transfer chamber 8100, the sixth processing unit 8300, and the sixth connecting unit 9260. In the above case, when a plurality of different layers are formed in one cluster, it is also possible to measure at least one of the thickness of a layer and the thickness of a dummy layer corresponding to the layer only in one of the transfer chamber and the processing unit of the cluster.For example, in the case of the third cluster 5000, the third thickness measuring unit may be disposed in at least one of the third transfer chamber 5100 and the third process unit 5300 to measure at least one of the thickness of the third layer and the thickness of the third dummy layer, and in the case of the sixth cluster 8000, the sixth thickness measuring unit may be disposed only in at least one of the sixth transfer chamber 8100 and the sixth process unit 8300 to measure at least one of the thickness of the sixth layer and the thickness of the sixth dummy layer. The first thickness measuring unit to the sixth thickness measuring unit may be formed in a similar shape and disposed in a similar position. Hereinafter, for convenience of explanation, the first thickness measuring unit will be described in detail.

[0059] In addition, in the above, the display device manufacturing apparatus 1 is illustrated as having only the second thickness measuring unit 4400, but the present invention is not limited thereto. That is, the display device manufacturing apparatus 1 may include at least one of the first thickness measuring unit connected to the first transfer chamber 3100, the second thickness measuring unit 4400 connected to the second transfer chamber 4100, the third thickness measuring unit connected to the third transfer chamber 5100, the fourth thickness measuring unit connected to the fourth transfer chamber 6100, the fifth thickness measuring unit connected to the fifth transfer chamber 7100, and the sixth thickness measuring unit connected to the sixth transfer chamber 8100. Also, each of the first thickness measuring unit, the second thickness measuring unit 4400, the third thickness measuring unit, the fourth thickness measuring unit, the fifth thickness measuring unit, and the sixth thickness measuring unit may have a similar form to the first connecting unit 9210 described below.

[0060] 2 and 3, the first cluster 3000 or the first connecting unit 9210 may include a first thickness measuring unit that senses (measures) at least one of the thicknesses of the first layer and the first dummy layer. That is, the first thickness measuring unit may be disposed in the first transfer chamber 3100, the first processing unit 3300, or the first connecting unit 9210. Hereinafter, for convenience of explanation, a detailed description will be given mainly on the case where the first thickness measuring unit is disposed in the first connecting unit 9210.

[0061] The first connecting part 9210 also includes a first connecting chamber 9211 and the first thickness measuring unit. At this time, the first thickness measuring unit also includes a first driving part 9212, a first linear motion part 9213, a first placement part 9214, a first support part 9215, a first sensing part 9216 and a first measuring part 9217.

[0062] The first connecting chamber 9211 may connect the first transfer chamber 3100 and the second transfer chamber 4100. At this time, a first pressure adjusting unit 9218 may be connected to the first connecting chamber 9211, which may adjust the pressure inside the first connecting chamber 9211. The first pressure adjusting unit 9218 may include a first pipe connected to the first connecting chamber 9211 and a first pump disposed on the first pipe. The first connecting chamber 9211 may have an open area, and a separate first opening / closing unit 9211a such as a gate valve for opening and closing the open area may be disposed in the opened area. In addition, a first transmission window 9211b may be provided on an outer surface of the first connecting chamber 9211, which allows light to pass through from the outside to the inside. At this time, the first transmission window 9211b may be made of a transparent material. In such a case, at least one of the first sensing unit 9216 and the first measurement unit 9217 may be disposed inside the first connecting chamber 9211 or outside the first connecting chamber 9211 .

[0063] The first actuator 9212 is disposed inside the first connection chamber 9211 and may linearly move the first support 9215 and the first placement 9214 in at least one of a first direction (e.g., the x direction in FIG. 2) and a second direction (e.g., the y direction in FIG. 2). In this case, the first actuator 9212 may include a (1-1) actuator 9212a and a (1-2) actuator 9212b connected to each other. One of the (1-1) actuator 9212a or the (1-2) actuator 9212b may be mounted on the other of the (1-1) actuator 9212a or the (1-2) actuator 9212b. In addition, the first linear motion unit 9213 may be mounted on the other of the (1-1) actuator 9212a or the (1-2) actuator 9212b. In the following, for ease of explanation, a detailed description will be given mainly of the case where the (1-2) driving unit 9212b is placed on the (1-1) driving unit 9212a, and the first linear motion unit 9213 is placed on the (1-2) driving unit 9212b.

[0064] The (1-2) driving unit 9212b is mounted on the (1-1) driving unit 9212a, and can be linearly moved on the (1-1) driving unit 9212a by the operation of the (1-1) driving unit 9212a. Also, the first linear motion unit 9213 is disposed on the (1-2) driving unit 9212b, and can be linearly moved on the (1-2) driving unit 9212b by the operation of the (1-2) driving unit 9212b.

[0065] The (1-1) driver 9212a and the (1-2) driver 9212b may be formed in various shapes. Since the (1-1) driver 9212a and the (1-2) driver 9212b have similar shapes, the following description will be focused on the (1-1) driver 9212a for ease of explanation.

[0066] The (1-1) driving unit 9212a may have various forms. For example, the (1-1) driving unit 9212a may include a cylinder, a motion block connected to the cylinder and moving by the operation of the cylinder, and a rail on which the motion block is arranged and guides the motion of the motion block. In another embodiment, the (1-1) driving unit 9212a may include a motor, a ball screw connected to the motor and operating, and a motion block that moves linearly by the rotation of the ball screw. In this case, the (1-1) driving unit 9212a may further include a separate rail that guides the motion of the motion block. In yet another embodiment, the (1-1) driving unit 9212a may include a linear motor. However, the (1-1) driving unit 9212a is not limited to the above, and may include all devices and structures that linearly move the (1-2) driving unit 9212b when the (1-2) driving unit 9212b is mounted.

[0067] The first linear motion unit 9213 may protrude from the first mounting unit 9214 toward the first driving unit 9212 and connect the first mounting unit 9214 and the first driving unit 9212 to each other. For example, the first linear motion unit 9213 is controlled in a linear motion in a first direction (e.g., the x direction in FIG. 2) and a second direction (e.g., the y direction in FIG. 2) by the (1-1) driving unit 9212a and the (1-2) driving unit 9212b. In the example of FIG. 3, the first linear motion unit 9213 may be connected to a linearly moving part of the (1-1) driving unit 9212a through the (1-2) driving unit 9212b. In the example of FIG. 3, etc., the first linear motion unit 9213 has a rod-like shape and is connected to the (1-1) driving unit 9212a in a state of penetrating an opening of the (1-2) driving unit 9212b. The linear motion of the first linear motion unit 9213 in the second direction (e.g., y direction in FIG. 2) is restricted by the opening of the (1-2) driving unit 9212b, and the linear motion in the first direction (e.g., x direction in FIG. 2) is restricted based on the movement of the (1-1) driving unit 9212a. In addition, the linear motion of the first placement unit 9214 to which the first linear motion unit 9213 is connected is controlled in the first direction (e.g., x direction in FIG. 2) and the second direction (e.g., y direction in FIG. 2). At this time, a pair of sets of the first linear motion unit 9213 and the first driving unit 9212 may be provided and may be arranged symmetrically with respect to the first placement unit 9214. In the example of FIG. 3, the set of the first linear motion unit 9213 and the first driving unit 9212 is arranged on the first placement unit 9214 so as to be symmetrical in the second direction (e.g., y direction in FIG. 2).

[0068] The first placement portion 9214 may be connected to the first linear motion portion 9213. The first placement portion 9214 may have an opening region at a central portion thereof. A portion of the display substrate DP on the first placement portion 9214 may be exposed to the outside through the opening region.

[0069] The first support portion 9215 may be disposed on the first placement portion 9214 and support the edge of the display substrate DP. A plurality of first support portions 9215 may be provided, and the plurality of first support portions 9215 may be disposed to be spaced apart from each other on the first placement portion 9214. Also, the plurality of first support portions 9215 may support at least two of the edges of the display substrate DP. Also, each of the first support portions 9215 may support a portion of the display substrate DP on which a layer to be formed on the display substrate DP is not formed.

[0070] The first support parts 9215 may be disposed at different heights on the first placement part 9214, or may be arranged to be movable up and down from the first placement part 9214. Through this, the first support parts 9215 may adjust the frame shape of the display substrate DP.

[0071] At least one of the first measuring unit 9217 and the first sensing unit 9216 may be disposed outside or inside the first connecting chamber 9211. For example, the first measuring unit 9217 and the first sensing unit 9216 may be disposed outside or inside the first connecting chamber 9211. Also, one of the first measuring unit 9217 and the first sensing unit 9216 may be disposed outside or inside the first connecting chamber 9211, and the other of the first measuring unit 9217 and the first sensing unit 9216 may be disposed outside or inside the first connecting chamber 9211.

[0072] The first sensing unit 9216 may include a charge couple device (CCD) camera. In this case, the first sensing unit 9216 may capture an image of the display substrate DP and the first placement unit 9214.

[0073] The first measuring unit 9217 may sense the thickness of at least one of the first layer and the first dummy layer of the display substrate DP. For example, the first measuring unit 9217 may sense the thickness of the first layer disposed in the display area DA of the display substrate DP. As another embodiment, the first measuring unit 9217 may sense the thickness of a first dummy layer of the display substrate DP disposed on the display substrate DP in the same process as the first layer disposed in the display area DA of the display substrate DP. In the following, for convenience of explanation, a detailed explanation will be given mainly on a case where the first measuring unit 9217 senses the thickness of the first dummy layer of the display substrate DP in the same process as the first layer.

[0074] The first measuring unit 9217 may include at least one of an ellipsometer and a reflectometer. For example, the first measuring unit 9217 may include at least one of a Nanospec, a spectroscopic reflectometer, a Metapulse, an X-ray reflection, and a fluorescence analyzer. The first measuring unit 9217 may irradiate light or laser from the outside and receive the reflected light or laser.

[0075] The same or similar structures as the first placement part 9214, the first support part 9215, the first driving part 9212, and the first measurement part 9217, which are part of the configuration of the first thickness measurement unit, may be provided separately, for example, in the first transfer chamber 3100 and the first connection part 9210, in addition to the first connection part 9210, in order to align the display substrate DP. In such a case, the same or similar structures as the first placement part 9214, the first support part 9215, the first driving part 9212, and the first measurement part 9217 may align the position of the display substrate DP.

[0076] When a structure identical to or similar to the first thickness measuring unit is disposed in the first transfer chamber 3100, the first thickness measuring unit may be disposed in a space of the first transfer chamber 3100, which corresponds to a space 4500 of the second transfer chamber 4100 that does not overlap with the second robot arm 4200 shown in FIG. 1. The first thickness measuring unit may be disposed in a separate space connected to the first transfer chamber 3100. For example, the first thickness measuring unit may be disposed in a first thickness measuring unit connected to the first transfer chamber 3100, which corresponds to the second thickness measuring unit 4400 connected to the second transfer chamber 4100, although not shown in the drawings.

[0077] The display device manufacturing apparatus 1 as described above may sequentially stack various layers on the display substrate DP. Specifically, the display substrate DP may enter the loading unit 1000 and then move to the flip unit 2000. The flip unit 2000 may invert the display substrate DP. That is, the display substrate DP may be externally supplied to the loading unit 1000 so that the layers stacked on the substrate face upward. Thereafter, the flip unit 2000 may invert the display substrate DP so that the layers stacked on the substrate face downward.

[0078] Thereafter, the display substrate DP may be introduced into the first transfer chamber 3100. At this time, the first robot arm 3200 may supply the display substrate DP from the flip unit 2000 to the first transfer chamber 3100. At this time, the internal pressure of the flip unit 2000 and the internal pressure of the first transfer chamber 3100 may be maintained to be the same or similar to each other.

[0079] The first robot arm 3200 may transfer the display substrate DP from the first transfer chamber 3100 to the first processing unit 3300. At this time, the internal pressure of the first processing unit 3300 and the internal pressure of the first transfer chamber 3100 may be maintained to be the same or similar to each other.

[0080] When the display substrate DP is introduced into the first processing unit 3300, a first layer and a first dummy layer may be formed on the display substrate DP in the first processing unit 3300. At this time, materials forming the first layer and the first dummy layer may be supplied to the display substrate DP along a third direction (e.g., the z direction in FIG. 1). That is, materials forming the first layer and the first dummy layer may be supplied from the lower side of the display substrate DP to the display substrate DP side. The first layer and the first dummy layer are formed simultaneously in this process.

[0081] After the first layer and the first dummy layer are disposed on the display substrate DP, the first robot arm 3200 may move the display substrate DP from the first processing unit 3300 to the first transfer chamber 3100. At this time, the internal pressure of the first processing unit 3300 and the internal pressure of the first transfer chamber 3100 may be maintained to be the same or similar to each other.

[0082] The first robot arm 3200 may move the display substrate DP from the first transfer chamber 3100 to the first connection part 9210. At this time, the internal pressure of the first transfer chamber 3100 and the internal pressure of the first connection part 9210 may be the same or similar to each other.

[0083] The first connection unit 9210 may arrange the display substrate DP such that the surface on which the first layer and the first dummy layer are arranged faces downward. At this time, the first thickness measurement unit may measure the thickness of at least one of the first layer and the first dummy layer. A separately provided control unit may control the first process unit 3300 based on the measured thickness of at least one of the first layer and the first dummy layer. The display device manufacturing apparatus 1 as described above may include a separate control unit (not shown in the drawings) and control each component of the display device manufacturing apparatus based on the measured result. At this time, the control unit may include various devices and structures such as a computer, a portable terminal, and a circuit board.

[0084] Specifically, the control unit may compare whether the measured thickness of the first layer is different from a preset first set thickness, and if different, may control the first process unit 3300 to make the thickness of the first layer the same as or similar to the preset thickness. For example, in one embodiment, the control unit may send the display substrate DP on which the first layer and the first dummy layer are arranged to the first process unit 3300 again, and execute the first process unit 3300 to further proceed with the process so that the thicknesses of the first layer and the first dummy layer are the same as or similar to the first set thickness. At this time, the control unit may control the first process unit 3300 to further form the first layer and the first dummy layer on the display substrate DP on which the first layer and the first dummy layer are already formed, so that the difference between the measured thicknesses of the first layer and the first dummy layer and the first set thickness is reduced. As another embodiment, when a new display substrate DP is placed in the first process unit 3300 while performing subsequent operations on the display substrate DP on which the first layer and the first dummy layer have already been placed, the control unit may control the first process unit 3300 so that the thickness of the first layer and the first dummy layer placed on the new display substrate DP corresponds to the previously set first thickness. As yet another embodiment, when a first layer and a first dummy layer are further formed on the display substrate DP on which the first layer and the first dummy layer have already been formed, in addition to the first layer and the first dummy layer formed as described above, the control unit may control the first process unit 3300 so that the thickness of the first layer and the first dummy layer to be further formed is adjusted based on the thickness measured as described above. That is, the control unit may control the first process unit 3300 so that the thickness of the first layer and the first dummy layer to be further formed is adjusted so that the sum of the thickness of the first layer and the first dummy layer to be further formed and the thickness of the first layer and the first dummy layer already formed is a constant thickness on the display substrate DP. The thickness of the first layer may be calculated based on the thickness of the first dummy layer.

[0085] The method of forming the first layer and the first dummy layer to have a thickness corresponding to the first set thickness may include a method of increasing or decreasing the temperature of a crucible containing the material for forming the first layer and the first dummy layer, or a method of increasing or decreasing the internal pressure of the first process section 3300.

[0086] In addition to the above-mentioned case, the control unit can also control the display device manufacturing apparatus 1 to adjust the thickness of at least one of the second layer, the third layer, the fourth layer, the fifth layer, and the sixth layer excluding the first layer based on the thickness of the first layer. In such a case, the control unit can control the display device manufacturing apparatus 1 to adjust the thickness of at least one layer so that the layers are formed complementarily to each other based on the change in optical characteristics due to the thickness of each layer. For example, a layer different from one of the first layer, the second layer, the third layer, the fourth layer, the fifth layer, and the sixth layer may have a tendency that the optical characteristics are reduced by becoming thinner and the optical characteristics are increased by becoming thicker. In this case, if the thickness of one of the first layer, the second layer, the third layer, the fourth layer, the fifth layer, and the sixth layer is thinner than the preset thickness, the thickness of the other one of the first layer, the second layer, the third layer, the fourth layer, the fifth layer, and the sixth layer is formed thicker than the preset thickness. This allows the optical properties of the entire structure of the stacked layers to correspond to the designed optical properties after at least two of the first, second, third, fourth, fifth and sixth layers are stacked.

[0087] The second robot arm 4200 may move the display substrate DP on which the first layer and the first dummy layer are disposed from the first connecting part 9210 to the second transfer chamber 4100. At this time, the internal pressure of the first connecting part 9210 and the internal pressure of the second transfer chamber 4100 are set to be the same or similar to each other.

[0088] The second robot arm 4200 may move the display substrate DP from the second transfer chamber 4100 to the second processing unit 4300. At this time, the internal pressure of the second transfer chamber 4100 and the internal pressure of the second processing unit 4300 may be the same or similar to each other. The second processing unit 4300 may form a second layer and a second dummy layer on the first layer and the first dummy layer. At this time, the second processing unit 4300 may supply materials forming the second layer and the second dummy layer from the lower side of the display substrate DP to the display substrate DP side. The second layer and the second dummy layer are formed simultaneously in this process.

[0089] The second robot arm 4200 may move the display substrate DP on which the second layer and the second dummy layer are formed from the second processing unit 4300 to the second transfer chamber 4100, and may move the display substrate DP from the second transfer chamber 4100 to the second thickness measuring unit 4400. At this time, the internal pressure of the second processing unit 4300 and the internal pressure of the second transfer chamber 4100 may be the same or similar to each other, and the internal pressure of the second transfer chamber 4100 and the second thickness measuring unit 4400 may be the same or similar to each other.

[0090] The second thickness measuring unit 4400 may measure the thickness of at least one of the second layer or the second dummy layer formed by the same process as the second layer. At this time, the second dummy layer may be disposed on a display substrate DP different from the display substrate DP portion on which the first dummy layer is formed. In the following, for convenience of explanation, a detailed explanation will be given mainly on a case where the second thickness measuring unit 4400 measures the thickness of the second dummy layer formed by the same process as the second layer and calculates the thickness of the second layer. Note that the second thickness measuring unit 4400 may measure only the thickness of the second layer instead of measuring the thickness of the second dummy layer, or may measure the thickness of both the second layer and the second dummy layer. In addition, instead of measuring the thickness of the second dummy layer, calculating the thickness of the second layer, and controlling the second process unit 4300 to correct the thickness of the second layer, the second process unit 4300 may be controlled to correct the thickness of the second dummy layer based on the results of measuring the thickness of the second dummy layer, or the second process unit 4300 may be controlled to correct the thickness of the second layer based on the results of measuring the thickness of the second layer, or the second process unit 4300 may be controlled to correct the thicknesses of the second layer and the second dummy layer based on the results of measuring the thickness of both the second layer and the second dummy layer.

[0091] The control unit may measure the thickness of the second dummy layer on the display substrate DP, calculate the thickness of the second layer, and compare the measured thickness of the second layer with the preset second set thickness. The thickness of the second layer may be calculated based on the measured thickness of the second dummy layer. For example, the thickness of the second layer may be approximately the same as the thickness of the second dummy layer. In addition, if a relational expression and a table or the like showing the relationship between the thickness of the second layer and the thickness of the second dummy layer exist in advance, the thickness of the second layer may be calculated from the thickness of the second dummy layer based on the relational expression or the like. The actual thickness of the second layer may be measured by the second thickness measuring unit 4400. At this time, the control unit may control the second process unit 4300 to correct the thickness of the second layer based on the measured thickness of the second layer, correct the thickness of a layer different from the second layer, or correct the thickness of the second layer that is further formed when a second layer is further formed on the display substrate DP formed on the second layer.

[0092] The second robot arm 4200 may pull out the display substrate DP from the second thickness measuring unit 4400 and move it to the second processing unit 4300 or the second connecting unit 9220 via the second transfer chamber 4100. At this time, the internal pressures of the second thickness measuring unit 4400 and the second transfer chamber 4100, the internal pressures of the second transfer chamber 4100 and the second processing unit 4300, or the internal pressures of the second transfer chamber 4100 and the second connecting unit 9220 may be maintained to be the same or similar to each other.

[0093] The display substrate DP disposed in the second connection unit 9220 may be moved from the second connection unit 9220 to the third transfer chamber 5100 via the third robot arm 5200. The third robot arm 5200 may transfer the display substrate DP to the third processing unit 5300 and then form at least one third layer and at least one third dummy layer on the display substrate DP. In this case, when the third layer and the third dummy layer are formed in a plurality of layers, in one embodiment, the plurality of third layers and the third dummy layer may be formed sequentially in one third processing unit 5300. In another embodiment, the display substrate DP may move sequentially through a plurality of third processing units 5300, and each of the third processing units 5300 may have a plurality of different third layers disposed on the display substrate DP. In such a case, the plurality of different third layers may be organic light-emitting layers that emit different colors. In the above case, the third layers and the third dummy layers disposed on the display substrate DP through each of the third process units 5300 may be disposed in different regions of the display substrate DP so as not to overlap each other. In still another embodiment, the third layers may be sequentially stacked on the entire surface or a certain region of the display substrate DP. At this time, at least one of the first layer, the second layer, the fourth layer, and the fifth layer may be disposed between adjacent third layers. In the above case, the third dummy layers may be disposed on the display substrate DP so as to be spaced apart from each other. Also, each of the third dummy layers may be disposed on the display substrate DP so as not to overlap the first dummy layer and the second dummy layer.

[0094] However, the present invention is not limited thereto, and the third layers and the third dummy layers of the different layers may be formed of a plurality of different third clusters 5000. In such a case, although not shown in the drawings, the plurality of third clusters 5000 may be arranged in a line between the second cluster 4000 and the fourth cluster 6000 and connected via at least one third connection part 9230. However, for convenience of explanation, the following will mainly describe in detail the case where the different third layers and the third dummy layers are formed in the plurality of third process parts 5300 of one third cluster 5000.

[0095] The third robot arm 5200 can move the display substrate DP, on which at least one third layer and a third dummy layer are formed, from the third processing unit 5300 to the third transfer chamber 5100, and then transfer it from the third transfer chamber 5100 to the third connection unit 9230.

[0096] The third thickness measuring unit disposed in the third connection portion 9230 may measure at least one of the thickness of the third layer and the thickness of the third dummy layer. In this case, the third thickness measuring unit may sequentially measure at least one of the thickness of the third layer of the plurality of layers and the thickness of the third dummy layer of the plurality of layers. In this case, the thickness of each third layer may be measured individually after forming each third layer and each third dummy layer corresponding to each third layer, or at least one of the thickness of each third layer and each third dummy layer may be measured after forming both the plurality of third layers and each third dummy layer corresponding to each third layer. In the following, for convenience of explanation, a detailed explanation will be given mainly on the case where the thickness of each third dummy layer corresponding to each third layer is measured and the thickness of each third layer is calculated.

[0097] The control unit calculates the thickness of the third layer based on the thickness of the third dummy layer measured by the third thickness measurement unit, similarly to the first thickness measurement unit and the second thickness measurement unit 4400. The control unit compares the thickness of the third layer calculated as described above with a preset third set thickness, and controls the third process unit 5300 to adjust the thickness of the third layer, or controls at least one of the first process unit 3300, the second process unit 4300, the fourth process unit 6300, the fifth process unit 7300, and the sixth process unit 8300 to adjust the thickness of at least one layer of the first layer, the second layer, the fourth layer, the fifth layer, and the sixth layer excluding the third layer.

[0098] As described above, when the third layer is formed on the display substrate DP, the third transfer chamber 5100 and each of the third processing units 5300, or the third transfer chamber 5100 and the third connecting unit 9230 may be selectively connected to each other along the moving path of the display substrate DP. In this case, when the display substrate DP moves, the internal pressure of the third transfer chamber 5100 and each of the third processing units 5300, or the internal pressure of the third transfer chamber 5100 and the third connecting unit 9230 may be formed to be the same or similar to each other.

[0099] The fourth robot arm 6200 may move the display substrate DP from the third connection part 9230 to the fourth transfer chamber 6100, and then transfer the display substrate DP from the fourth transfer chamber 6100 to the fourth process part 6300. At this time, along the movement path of the display substrate DP, the internal pressure of the third connection part 9230 and the internal pressure of the fourth transfer chamber 6100, or the internal pressure of the fourth transfer chamber 6100 and the internal pressure of the fourth process part 6300 may be the same or similar to each other.

[0100] In the fourth processing unit 6300, a fourth layer and a fourth dummy layer may be formed on the display substrate DP. The display substrate DP on which the fourth layer and the fourth dummy layer are formed may be moved from the fourth processing unit 6300 to the fourth transfer chamber 6100 and from the fourth transfer chamber 6100 to the fourth connecting unit 9240 by the fourth robot arm 6200. In this case, the internal pressure of the fourth processing unit 6300 and the internal pressure of the fourth transfer chamber 6100, or the internal pressure of the fourth transfer chamber 6100 and the internal pressure of the fourth connecting unit 9240 may be the same or similar to each other.

[0101] In the above case, at least one of the thickness of the fourth layer and the thickness of the fourth dummy layer may be measured through the fourth thickness measuring unit disposed in the fourth connection part 9240. For convenience of explanation, the following detailed description will be focused on a case where the fourth thickness measuring unit measures the thickness of the fourth dummy layer and the control part calculates the thickness of the fourth layer based on the measured thickness of the fourth dummy layer.

[0102] The fourth dummy layer as described above can also be disposed on the display substrate DP so as not to overlap with the first dummy layer, the second dummy layer, and the third dummy layer.

[0103] The control unit, like the first thickness measuring unit and the second thickness measuring unit 4400, etc., may compare the thickness of the fourth layer calculated based on the thickness of the fourth dummy layer with a previously set fourth thickness, and control the fourth process unit 6300 to adjust the thickness of the fourth layer, or may control at least one of the first process unit 3300, the second process unit 4300, the third process unit 5300, the fifth process unit 7300, and the sixth process unit 8300 to adjust the thickness of at least one of the first layer, the second layer, the third layer, the fifth layer, and the sixth layer excluding the fourth layer.

[0104] The fifth robot arm 7200 may move the display substrate DP arranged in the fourth connection unit 9240 from the fourth connection unit 9240 to the fifth transfer chamber 7100, and then move the display substrate DP from the fifth transfer chamber 7100 to the fifth process unit 7300. After that, a fifth layer and a fifth dummy layer are formed on the display substrate DP, and the fifth robot arm 7200 may move the display substrate DP from the fifth process unit 7300 to the fifth transfer chamber 7100. At this time, along the movement path of the display substrate DP, the internal pressure of the fourth connection unit 9240 and the internal pressure of the fifth transfer chamber 7100, or the internal pressure of the fifth transfer chamber 7100 and the internal pressure of the fifth process unit 7300 may be the same or similar to each other.

[0105] The fifth robot arm 7200 may move the display substrate DP on which the fifth layer and the fifth dummy layer are formed from the fifth transfer chamber 7100 to the fifth connection unit 9250. At this time, the fifth thickness measuring unit of the fifth connection unit 9250 may measure at least one of the thickness of the fifth layer and the thickness of the fifth dummy layer. At this time, the fifth dummy layer may be disposed on the display substrate DP so as not to overlap with the first dummy layer, the second dummy layer, the third dummy layer, and the fourth dummy layer. In the following, for convenience of explanation, a detailed explanation will be given mainly on a case where the fifth thickness measuring unit measures the thickness of the fifth dummy layer and the control unit calculates the thickness of the fifth layer based on the thickness of the fifth dummy layer.

[0106] The control unit, like the first thickness measuring unit and the second thickness measuring unit 4400, etc., may compare the thickness of the fifth layer calculated based on the thickness of the fifth dummy layer with a previously set fifth thickness, and control the fifth process unit 7300 to adjust the thickness of the fifth layer, or may control at least one of the first process unit 3300, the second process unit 4300, the third process unit 5300, the fourth process unit 6300, and the sixth process unit 8300 to adjust the thickness of at least one of the first layer, the second layer, the third layer, the fourth layer, and the sixth layer excluding the fifth layer.

[0107] The sixth robot arm 8200 may move the display substrate DP from the fifth connecting part 9250 to the sixth transfer chamber 8100, and from the sixth transfer chamber 8100 to the sixth process part 8300. At this time, along the movement path of the display substrate DP, the internal pressure of the fifth connecting part 9250 and the internal pressure of the sixth transfer chamber 8100, or the internal pressure of the sixth transfer chamber 8100 and the internal pressure of the sixth process part 8300 are the same or similar to each other.

[0108] The sixth process unit 8300 may form a sixth layer and a sixth dummy layer on the display substrate DP. In this case, each of the sixth process units 8300 may form a sixth layer including different materials. For example, the sixth layer may include a (6-1) layer, a (6-2) layer, a (6-3) layer, a (6-4) layer, and a (6-5) layer. The (6-1) layer may be a common electrode, the (6-2) layer may be a protective layer (or a capping layer), and the (6-3) layer may be a first inorganic sealing layer, which will be described later. The (6-4) layer may include an organic sealing layer, which will be described later, and the (6-5) layer may include a second inorganic sealing layer, which will be described later. When each of the sixth layers is formed on the display substrate DP, the sixth robot arm 8200 may move the display substrate DP from one of the plurality of sixth process units 8300 to the sixth transfer chamber 8100 and to another of the plurality of sixth process units 8300. When forming a plurality of sixth layers as described above, a plurality of sixth dummy layers may also be formed to correspond to the respective sixth layers. In addition, the plurality of sixth dummy layers may be disposed in different regions of the display substrate DP so as not to overlap each other.

[0109] After the sixth layer is formed on the display substrate DP, the sixth robot arm 8200 may move the display substrate DP from the sixth process unit 8300 to the sixth transfer chamber 8100, and then move the display substrate DP from the sixth transfer chamber 8100 to the sixth connection unit 9260. The sixth thickness measurement unit disposed in the sixth connection unit 9260 may measure the thickness of the sixth layer. In this case, the sixth thickness measurement unit may measure at least one of the thicknesses of each of the sixth layers and each of the sixth dummy layers. In another embodiment, the sixth thickness measurement unit may measure only one of the thicknesses of one of the sixth layers and the thickness of one of the sixth dummy layers. In the following, for convenience of explanation, a detailed explanation will be given mainly on a case where the sixth thickness measurement unit measures only the thickness of the sixth dummy layer corresponding to the (6-3)th layer, which is an organic sealing layer, among the sixth layers.

[0110] In the above case, the sixth thickness measuring unit measures the thickness of the sixth dummy layer corresponding to the measured (6-3) layer. The control unit may calculate the thickness of the (6-3) layer similarly to the first thickness measuring unit and the second thickness measuring unit 4400 based on the thickness of the sixth dummy layer measured by the sixth thickness measuring unit. The control unit may compare the calculated thickness of the (6-3) layer with the previously set (6-3) thickness (or the sixth set thickness). Through this, the control unit may control the corresponding sixth process unit 8300 to adjust the thickness of the (6-3) layer or adjust the thickness of at least one of the remaining sixth layers excluding the (6-3) layer. In another embodiment, it is also possible to control at least one of the first process section 3300, the second process section 4300, the third process section 5300, the fourth process section 6300 and the fifth process section 7300 so as to adjust the thickness of at least one of the remaining first layer, second layer, third layer, fourth layer and fifth layer excluding the sixth layer.

[0111] The display substrate DP on which the sixth layer is formed may be moved to the unloading unit 9100. Although not shown in the drawings, the unloading unit 9100 may include a separate robot arm. Also, a separate flip unit 2000 may be provided between the unloading unit 9100 and the sixth process unit 8300 to invert the display substrate DP and thereby change the posture of the display substrate DP.

[0112] Therefore, the display device manufacturing apparatus 1 and the display device manufacturing method are capable of manufacturing a display device whose optical characteristics (e.g., light wavelength, energy, intensity, etc.) are similar to preset optical characteristics.

[0113] The display device manufacturing apparatus 1 and the display device manufacturing method may precisely measure the thickness of at least one of a plurality of layers formed on the display substrate DP during the manufacturing process. In this case, the first thickness measuring unit, the second thickness measuring unit, the third thickness measuring unit, the fourth thickness measuring unit, the fifth thickness measuring unit, and the sixth thickness measuring unit may operate similarly to each other. Hereinafter, for convenience of explanation, a method of measuring the thickness of the first layer via the first thickness measuring unit will be described in detail.

[0114] 4A to 4G are partial perspective views each showing a schematic part of an operating state of the display device manufacturing apparatus shown in FIG.

[0115] Referring to FIG. 4A, the display substrate DP on which the first layer and the first dummy layer TEG are formed may be disposed in a first connection portion (not shown). At this time, the first dummy layer TEG may be disposed on the display substrate DP by the same process as the first layer and disposed on the frame portion of the display substrate DP. The frame portion of the display substrate DP may be, for example, a peripheral area PA (non-display area). In this case, the first dummy layer TEG may be in direct contact with the display substrate DP in the display substrate DP, or may be disposed on an electrode layer in a state in which layers such as a buffer layer, a gate insulating layer, and an electrode layer (source electrode or drain electrode) are stacked on a substrate (not shown) to be described later. Also, the dummy layer TEG may be disposed only in a specific region of the display substrate DP. In this case, the first dummy layer TEG may be in an island form on a plane, or may be completely disconnected from the first layer.

[0116] At least one dummy layer including the first dummy layer TEG may be provided on the display substrate DP. For example, the dummy layer may be provided in a plurality of layers corresponding to the first, second, third, fourth, fifth and sixth layers, respectively. In this case, each dummy layer is not in a form in which at least two layers among the first, second, third, fourth, fifth and sixth layers are sequentially stacked, and one dummy layer may correspond to one of the first, second, third, fourth, fifth and sixth layers. Therefore, the plurality of dummy layers are arranged in different parts of the display substrate DP on a plane, and do not overlap each other.

[0117] The first robot arm 3200 may move the display substrate DP from a first transfer chamber (not shown) to a first connecting chamber (not shown). The first robot arm 3200 may move the display substrate DP to a preset position inside the first connecting chamber. Also, the first placement unit 9214 may be disposed at a preset initial position. The attitude of the first placement unit 9214 may maintain a preset initial position. For example, the first placement unit 9214 may be disposed inside the first connecting chamber such that one point of the first placement unit 9214 (e.g., the center of the opening area of ​​the first placement unit 9214) corresponds to a preset first center setting position. In such a case, the first center setting position is also the center of the first connecting chamber.

[0118] 4B, the first robot arm 3200 may descend and place the display substrate DP on the first support part 9215. In this case, the display substrate DP may be twisted on the first robot arm 3200 or a point of the display substrate DP (e.g., the center of the display substrate DP) may not be positioned at an accurate position due to various reasons such as a design error of the first robot arm 3200, the operation of the first robot arm 3200, and the movement speed of the first robot arm 3200. That is, when the first robot arm 3200 moves the display substrate DP into the first connection chamber and places it on the first placement part 9214 so as to be spaced apart, the point of the display substrate DP should be placed at the first center setting position. However, when the display substrate DP is placed on the first placement part 9214 due to the above-mentioned reasons, the point of the display substrate DP may be misaligned with the first center setting position. Furthermore, the display substrate DP may also be twisted in a manner that differs from the preset attitude.

[0119] 4C, after the display substrate DP is placed on the first support part 9215, the first support part 9215 may be moved so that a position of the display substrate DP corresponds to a first center setting position. Also, the first support part 9215 may be moved so that the attitude of the display substrate DP corresponds to a preset attitude. For example, as shown in FIG. 4C, the first driver 9212 may linearly move the first support part 9215 in a third direction (e.g., z direction in FIGS. 4A to 4G, etc.). In addition, the first driver 9212 may move the first support part 9215 in at least one of the first direction (e.g., x direction in FIGS. 4A to 4G, etc.) and the second direction (e.g., y direction in FIGS. 4A to 4G, etc.). At this time, the first placement part 9214 may be twisted from an initial state or disposed at a position different from the initial position.

[0120] Specifically, the first sensing unit 9216 may photograph an edge of the display substrate DP or an alignment mark ARM arranged on the substrate of the display substrate DP. Based on the photographed edge of the display substrate DP or the alignment mark ARM arranged on the substrate of the display substrate DP, the position and the attitude of the display substrate DP may be calculated. The first sensing unit 9216 may also photograph the first placement unit 9214. Based on the photographed display substrate DP and first placement unit 9214, the relative positions of the display substrate DP and the first placement unit 9214 may be grasped. After that, after placing the display substrate DP on the first placement unit 9214, the first robot arm 3200 may lower the display substrate DP and place the display substrate DP on the first support unit 9215. The display substrate DP may be linearly moved in at least one of a first direction (e.g., x direction in FIGS. 4A to 4G, etc.), a second direction (e.g., y direction in FIGS. 4A to 4G, etc.), and a third direction (e.g., z direction in FIGS. 4A to 4G, etc.) by linearly moving the first placement unit 9214 so that an edge of the display substrate DP or an alignment mark ARM of the display substrate DP corresponds to a preset alignment position, so that a point of the display substrate DP corresponds to a first center preset position. In addition, the display substrate DP may be rotated by linearly moving the first support unit 9215 in, for example, a third direction (e.g., z direction in FIGS. 4A to 4G, etc.) so that the attitude of the display substrate DP corresponds to a preset attitude. In addition, the first support unit 9215 may be moved in at least one of a first direction (e.g., x direction in FIGS. 4A to 4G, etc.) and a second direction (e.g., y direction in FIGS. 4A to 4G, etc.).

[0121] Referring to FIG. 4D, after moving the position of the first placement part 9214, the first robot arm 3200 may support the display substrate DP and further move up and down. In the state shown in FIG. 4D, the display substrate DP is raised. In such a case, the display substrate DP may be separated from the first support part 9215. In addition, the first driving part 9212 may move the first support part 9215 in at least one of a first direction (e.g., x direction in FIGS. 4A to 4G, etc.), a second direction (e.g., y direction in FIGS. 4A to 4G, etc.), and a third direction (e.g., z direction in FIGS. 4A to 4G, etc.) so that the first placement part 9214 corresponds to an initial position and an initial setting posture. Thereafter, the first robot arm 3200 may place the display substrate DP on the first support part 9215, separate it from the display substrate DP, and return it to a first transfer chamber (not shown).

[0122] Referring to FIG. 4E, as described above, while the display substrate DP is raised and lowered by the first robot arm 3200, the attitude of the display substrate DP may be twisted or the position of the display substrate DP may be changed.

[0123] Referring to FIG. 4F, the position of the display substrate DP may be further aligned. Specifically, the first sensing unit 9216 may photograph an edge of the display substrate DP or an alignment mark ARM. Based on the photographed edge of the display substrate DP or the alignment mark ARM, the position and orientation of the display substrate DP may be calculated by comparing the edge or the alignment mark ARM with the alignment position. For example, the first placement unit 9214 may be linearly moved in at least one of a first direction (e.g., x direction in FIGS. 4A to 4G, etc.), a second direction (e.g., y direction in FIGS. 4A to 4G, etc.), and a third direction (e.g., z direction in FIGS. 4A to 4G, etc.) so that the edge of the display substrate DP or the alignment mark corresponds to the alignment position.

[0124] Referring to FIG. 4G, when the above-mentioned operation is performed, the positions of the first dummy layer TEG and the first measuring unit 9217 are aligned to some extent. However, the center of the first dummy layer TEG and the center of the first measuring unit 9217 may not coincide with each other. In such a case, it may be difficult to accurately measure the thickness of the first dummy layer TEG. To avoid such a problem, the first measuring unit 9217 may sense the position and posture of the first dummy layer TEG and change the position and posture of the display substrate DP based on the result. For example, a point (e.g., the center) of the first dummy layer TEG measured by the first measuring unit 9217 may be compared with the position (dummy position) of the first dummy layer that has been set. Based on the comparison result, the position and posture of the first dummy layer TEG may be calculated. At this time, the first driving unit 9212 may linearly move the first mounting unit 9214 in at least one of a first direction (e.g., the x direction in Figures 4A to 4G, etc.), a second direction (e.g., the y direction in Figures 4A to 4G, etc.), and a third direction (e.g., the z direction in Figures 4A to 4G, etc.) based on the detected position and posture of the first dummy layer TEG.

[0125] After the above-mentioned process is completed, the first measuring unit 9217 may measure the thickness of the first dummy layer TEG. At this time, the first measuring unit 9217 may irradiate the first dummy layer TEG with a laser or light, and then analyze the wavelength of the reflected laser or light to precisely measure the thickness of the first dummy layer TEG.

[0126] As described above, the method of measuring the thickness of the first dummy layer TEG can be similarly applied to the case of measuring the thickness of the second and second dummy layers, the thickness of the third and third dummy layers, the thickness of the fourth and fourth dummy layers, the thickness of the fifth and fifth dummy layers, and the thickness of the sixth and sixth dummy layers. That is, the thickness of the dummy layer formed on the display substrate DP in the same process as each layer formed in the display device manufacturing equipment can be measured through a process similar to that described above.

[0127] Therefore, the display device manufacturing apparatus 1 and the display device manufacturing method can precisely control the thickness of each layer by precisely measuring the thickness of the dummy layer. Also, the display device manufacturing apparatus 1 and the display device manufacturing method can precisely control the positions of the dummy layer and the measurement unit, thereby reducing measurement errors due to errors in the positions of the measurement unit and the dummy layer.

[0128] FIG. 5 is a front view that diagrammatically illustrates a portion of the support portion illustrated in FIG.

[0129] 5, when the thickness of each layer is measured by measuring the thickness of a dummy layer (not shown), it may be affected by the curvature of the curved surface of the display substrate DP (or substrate). That is, when a plurality of first supporting parts 9215 support the display substrate DP, the display substrate DP may bend depending on the size, area, weight, etc. of the display substrate DP. At this time, the part of the display substrate DP where the dummy layer is disposed may have a curved surface of different shapes in different display substrates DP. In such a case, even if the same dummy layer is formed in the same region of different display substrates DP, the values ​​measured by the first measuring part 9217 may be different from each other. In this case, when the above-mentioned process is performed based on the value measured by the first measuring part 9217, it may be difficult to manufacture a display device of consistent quality.

[0130] Therefore, in order to manufacture display devices with uniform quality, the first supporting portions 9215 may be arranged at different heights to support the display substrate DP in a uniform shape.

[0131] Specifically, one of the plurality of first support portions 9215, another of the plurality of first support portions 9215, and yet another of the plurality of first support portions 9215 may be disposed at different heights on one surface of a first placement portion (not shown). For example, the plurality of first support portions 9215 may include a (1-1) support portion 9215a, a (1-2) support portion 9215b, and a (1-3) support portion 9215c, as shown in FIG. 5 and the like. The (1-1) support portion 9215a, the (1-2) support portion 9215b, and the (1-3) support portion 9215c may be disposed at different heights. In this case, but not limited thereto, for example, the (1-1) support portion 9215a may be disposed at a higher position than the (1-2) support portion 9215b, the (1-2) support portion 9215b may be disposed at a lower position than the (1-3) support portion 9215c, and the (1-3) support portion 9215c may be disposed at a lower position than the (1-1) support portion 9215a. Also, the (1-2) support portion 9215b and the (1-3) support portion 9215c may be disposed symmetrically with respect to the (1-1) support portion 9215a. In this case, the plurality of first support portions 9215 may support one of the frames of the display substrate DP in a "W" shape. That is, by supporting the display substrate DP on the plurality of first support portions 9215 having different height positions in the z direction, bending, curvature, etc. of the display substrate DP can be suppressed and corrected. In this case, the portion where the first dummy layer TEG is arranged always has a constant shape in the plurality of display substrates DP, so that it is possible to reduce measurement errors due to the shape of the display substrate DP. The shape of the display substrate DP is not limited to the above, and includes all structures that support the display substrate DP while maintaining the shape of the display substrate DP constant. The configuration for arranging the plurality of first support parts 9215 at different height positions is not limited, but examples of the configuration include a mode in which the plurality of first support parts 9215 are formed by piezoelectric elements that can deform in the height direction, and a mode in which a height moving part that moves the plurality of first support parts 9215 in the height direction is provided for each of the plurality of first support parts 9215.For example, when the first support portion 9215 made of a piezoelectric element is provided on the first mounting portion 9214, the first support portion 9215 expands and contracts under the control of the drive portion, thereby making it possible to vary the height position of the upper surface of the first support portion 9215 supporting the display substrate DP. Also, when a height moving portion is provided on each of the first support portions 9215, the height moving portion moves in the height direction from the first mounting portion 9214 under the control of the drive portion, thereby causing the first support portion 9215 to also move in the height direction, thereby making it possible to vary the height position of the upper surface of the first support portion 9215 supporting the display substrate DP.

[0132] The above-mentioned structure is not only applicable to the first thickness measuring unit. For example, at least one of the second support of the second thickness measuring unit, the third support of the third thickness measuring unit, the fourth support of the fourth thickness measuring unit, the fifth support of the fifth thickness measuring unit, and the sixth support of the sixth thickness measuring unit may be the same as or similar to the first support 9215.

[0133] Therefore, the display device manufacturing apparatus 1 and the display device manufacturing method can reduce measurement errors caused by bending of the substrate.

[0134] Fig. 6A is a cross-sectional view illustrating a process unit of an apparatus for manufacturing a display device according to another embodiment of the present invention, and Fig. 6B is a plan view illustrating a motion driver and a substrate illustrated in Fig. 6A.

[0135] 6A, the third process part 5300 includes a third process chamber 5310, a third thickness measuring unit (not shown), a third mask support part 5390, a third deposition source 3320, and a third process pressure control part 5391.

[0136] The third process chamber 5310 has a space formed therein, and may accommodate the display substrate DP and the mask assembly MS. In this case, the third process chamber 5310 has an opening through which the display substrate DP and the mask assembly MS can be moved, and also includes an opening / closing unit such as a gate valve that can open and close the opening.

[0137] The mask assembly MS as described above also includes a mask frame M-1 and a mask sheet M-2. The mask frame M-1 has an opening area in the center and is in the form of a picture frame. The mask sheet M-2 may be arranged in a tensioned state relative to the mask frame M-1 to cover the opening area of ​​the mask frame M-1. For example, as shown in FIG. 6A, the mask sheet M-2 is located above the mask frame M-1 and arranged to cover the opening area of ​​the mask frame M-1 in a tensioned state. In this case, the mask sheet M-2 also includes at least one opening M-2a. One or more such openings M-2a may be provided along the layer to be formed. For example, when the opening M-2a is a layer to be disposed in front of the display substrate DP, one opening may be provided, and may be formed to be the same as or similar to the opening area of ​​the mask frame M-1. In another embodiment, when the opening M-2a is arranged in a pattern shape in a specific portion of the display substrate DP together with the organic light emitting layer, a plurality of openings M-2a may be provided so as to be spaced apart from each other. In the following description, since the third layer corresponds to the organic light emitting layer, for convenience of explanation, a detailed description will be given mainly on the case where a plurality of third layers are provided.

[0138] In addition to the above, the mask assembly MS may further include a support stick M-3. The support stick M-3 may be disposed on the mask frame M-1 to divide the opening region into a plurality of parts and support the mask sheet M-2. In one embodiment, a plurality of support sticks M-3 may be provided, and the plurality of support sticks M-3 may be disposed spaced apart from each other in the same direction. In another embodiment, some of the plurality of support sticks M-3 may be disposed spaced apart from each other in a first direction, and other parts of the plurality of support sticks M-3 may be disposed spaced apart from each other in a second direction. In such a case, one of the plurality of support sticks M-3 and another of the plurality of support sticks M-3 may cross each other.

[0139] The third thickness measuring unit also includes a third placing part 5340, a third supporting part 5350, a third sensing part 5360, a third measuring part 5370, and a rotating part 5380. Here, the third placing part 5340, the third supporting part 5350, the third sensing part 5360, and the third measuring part 5370 are the same as or similar to the first placing part 9214, the first supporting part 9215, the first sensing part 9216, and the first sensing part 9216 described in FIG. 3, and therefore detailed description thereof will be omitted.

[0140] At least one of the third sensing unit 5360 and the third measuring unit 5370 is disposed in the rotating unit 5380, and the rotating unit 5380 may rotate at least one of the third sensing unit 5360 and the third measuring unit 5370. In this case, the rotating unit 5380 may rotate during the process of forming the third layer. In this case, the rotating unit 5380 may include a rotating plate 5381 on which at least one of the third sensing unit 5360 and the third measuring unit 5370 is disposed, and a rotation driving unit 5382 having a motor connected to the rotating plate 5381. In the following, for convenience of explanation, a detailed explanation will be given mainly on the case where only the third measuring unit 5370 is disposed on the rotating plate 5381.

[0141] The mask assembly MS may be placed on the third mask support portion 5390. The mask assembly MS is placed on the third mask support portion 5390, and may adjust the position of the mask assembly MS.

[0142] The third deposition source 3320 may be disposed in the third process chamber 5310 and may supply a deposition material to the display substrate DP. In this case, the third deposition source 3320 may store a deposition material therein and apply heat to the deposition material to vaporize or sublimate the deposition material.

[0143] The third process pressure adjusting unit 5391 is connected to the third process chamber 5310 and may adjust the internal pressure of the third process chamber 5310. For example, the third process pressure adjusting unit 5391 may include a pipe connected to the third process chamber 5310 and a pump disposed on the pipe. In this case, the pump may be operated to supply outside air to the third process chamber 5310 or to exhaust the internal air of the third process chamber 5310 to the outside.

[0144] In addition, the position of the display substrate DP may be aligned by operating the third process unit 5300. In this case, the display substrate DP may be placed on the third support unit 5350 with its position adjusted, as described above with reference to FIGS. 4A to 4E.

[0145] After the above process is completed, the mask assembly MS is placed on the third mask supporting part 5390, and the positions of the mask assembly MS and the display substrate DP are photographed by the third sensing part 5360. Based on the photograph, the relative positions of the mask assembly MS and the display substrate DP are calculated so that the mask assembly MS and the display substrate DP are aligned with each other. At this time, the third sensing part 5360 is disposed outside the third process chamber 5310 and can photograph the inside of the third process chamber 5310 through a transmission window of the third process chamber 5310.

[0146] As described above, when the alignment of the mask assembly MS and the display substrate DP is completed, the third process pressure adjusting unit 5391 can change the pressure inside the third process chamber 5310 from a state similar to atmospheric pressure to a state similar to vacuum. Then, a deposition material is supplied through the third deposition source 3320 to form a third layer on the display substrate DP. At this time, the third layer is also an organic light emitting layer as described above.

[0147] The organic light emitting layer as described above may form a dummy layer TEG, which is the same layer as the third layer, in one region of the display substrate DP. When the formation of the third layer on the display substrate DP is completed as described above, the mask assembly MS may be drawn out of the third process chamber 5310. Thereafter, the rotating unit 5380 may be operated to rotate the third measuring unit 5370 so that the third measuring unit 5370 corresponds to the dummy layer TEG. At this time, in order to correspond to the third measuring unit 5370 and the dummy layer TEG, operations similar to those of FIGS. 4F and 4G may be performed.

[0148] After measuring the thickness of the dummy layer TEG by the third measuring unit 5370, the thickness of the third layer or the thicknesses of the other layers excluding the third layer can be adjusted based on the thickness of the dummy layer TEG. In particular, since the third measuring unit 5370 is disposed inside the third process chamber 5310 and can calculate the thickness of the third layer without carrying the display substrate DP out of the third process chamber 5310, it is possible to adjust the thickness of the third layer to correspond to the preset third set thickness. For example, it is possible to suppress a calculation error of the thickness of the third layer due to a positional error when carrying the display substrate DP out of the third process chamber 5310.

[0149] In another embodiment, the rotating plate 5381 of the rotating unit 5380 may be disposed between the display substrate DP and the mask assembly MS. In such a case, the third sensing unit 5360 may be disposed outside or inside the third process chamber 5310 as described above. In such a case, the rotating plate of the rotating unit 5380 rotates and is disposed between the display substrate DP and the mask assembly MS, so that it is not necessary to carry the mask assembly MS out of the third process chamber 5310 to measure the thickness of the third dummy layer. For example, it is possible to suppress a deviation in the calculation of the thickness of the third layer due to a positional deviation when the mask assembly MS is carried out of the third process chamber 5310.

[0150] In still another embodiment, the third processing unit 5300 may support the display substrate DP and the mask assembly MS via one structure (e.g., a shuttle). In this case, the third placement unit 5340 and the third mask support unit 5390 may be integrally formed. Also, the rotation unit 5380 may be connected to at least one of the third placement unit 5340 and the third mask support unit 5390.

[0151] In the above case, the rotating plate of the rotating unit 5380 may be disposed so as not to obstruct the path of the deposition material when the deposition process is performed. After the deposition process is completed, in order to measure the thickness of the third dummy layer, the rotating plate of the rotating unit 5380 may rotate, and the rotating plate may overlap the display substrate DP when viewed in a plan view.

[0152] The first, second, fourth and fifth process units may be the same as or similar to the above-described third process unit 5300. In this case, when the layers formed in the first, second, fourth and fifth process units are formed on the entire surface of the display substrate DP, the mask sheet used for deposition may have one opening.

[0153] Therefore, the display device manufacturing apparatus 1 can measure the thickness of a layer inside a process section where one layer is formed.

[0154] Although not shown in the drawings, the above-mentioned structure may also be applied to at least one of the first thickness measurement unit, the second thickness measurement unit, the fourth thickness measurement unit, the fifth thickness measurement unit, and the sixth thickness measurement unit.

[0155] FIG. 7 is a front view that illustrates a part of a display device manufacturing apparatus according to still another embodiment of the present invention.

[0156] 7, the manufacturing apparatus for the display device is the same as or similar to that described with reference to FIGS. 1 to 3, and therefore, for the sake of convenience, only the differences will be described in detail below.

[0157] The first thickness measuring unit (not shown) also includes a first placing part 9214, a first supporting part 9215, a first sensing part 9216, a first measuring part 9217, and a motion driving part 9219. Here, the first placing part 9214 and the first supporting part 9215 are the same as or similar to those described in FIG. 1, and therefore detailed description thereof will be omitted.

[0158] The motion driver 9219 includes a driving force generator 9219a on which the motion block 9219c is placed and which moves the motion block 9219c, a guide unit 9219b connected to the driving force generator 9219a and guiding the motion of the motion block 9219c, and the motion block 9219c on which at least one of the first sensor 9216 and the first measuring unit 9217 is disposed. In this case, the motion block 9219c may move along a curve by the operation of the driving force generator 9219a. Specifically, when the display substrate DP is disposed on the first support unit 9215, the display substrate DP may sag due to the load. In such a case, a part of the display substrate DP that the first measuring unit 9217 must measure may have a chamfered shape (circular, round, rounded, curved, etc.). The moving path of the motion block 9219c may correspond to the circular part of the display substrate DP.

[0159] In the above case, the first sensing unit 9216 and the first measuring unit 9217 may be arranged such that signals from the first sensing unit 9216 and the first measuring unit 9217 are incident on one surface of the display substrate DP in a direction perpendicular to the surface. That is, the first sensing unit 9216 and the first measuring unit 9217 may be arranged on the movement block 9219c such that their longitudinal directions are not in the load direction but are tilted from the load direction. This can reduce problems such as the signal path being distorted or the signal not being received due to sagging of the display substrate DP.

[0160] Although not shown in the drawings, the above-mentioned structure can also be applied to at least one of the second thickness measurement unit, the third thickness measurement unit, the fourth thickness measurement unit, the fifth thickness measurement unit and the sixth thickness measurement unit.

[0161] FIG. 8 is a front view that illustrates a part of a display device manufacturing apparatus according to still another embodiment of the present invention.

[0162] Referring to FIG. 8, the display device manufacturing apparatus is generally the same as or similar to that described with reference to FIGS. 1 to 3, and therefore, for the sake of convenience, differences will be described in detail below.

[0163] The first thickness measuring unit (not shown) also includes a first placement part 9214, a first support part 9215, a first sensing part (not shown), and a first measuring part (not shown). At this time, the first placement part 9214, the first support part 9215, the first sensing part, and the first measuring part are the same as or similar to those described in FIG. 1, and therefore detailed description thereof will be omitted.

[0164] The first thickness measurement unit further includes a substrate fixing part SUT, which is a substrate pressing part arranged to face the first placement part 9214. The substrate fixing part SUT may be in the form of an electrostatic chuck (fixed state by electrostatic force) or an adhesive chuck (fixed state by adhesive force) and may keep the display substrate DP flat. In this case, since the display substrate DP may form a flat plane, the first support parts 9215 may be arranged at the same height as each other.

[0165] In addition, in the case described above, when measuring the thickness of the dummy layer via the first measuring unit 9217, since one surface of the display substrate DP is flat, it is possible to reduce measurement errors caused by bending of the display substrate DP due to the load of the display substrate DP.

[0166] Although not shown in the drawings, the above-mentioned structure can also be applied to at least one of the second thickness measurement unit, the third thickness measurement unit, the fourth thickness measurement unit, the fifth thickness measurement unit and the sixth thickness measurement unit.

[0167] FIG. 9 is a front view showing a part of a display device manufacturing apparatus according to still another embodiment of the present invention.

[0168] Referring to FIG. 9, the display device manufacturing apparatus is generally the same as or similar to that described with reference to FIGS. 1 to 3, and therefore, for the sake of convenience, differences will be described in detail below.

[0169] The first thickness measuring unit (not shown) also includes a first placing part 9214 (see FIG. 2, etc.), a first supporting part 9215, a first sensing part 9216, and a first measuring part 9217. At this time, the first placing part 9214, the first supporting part 9215, the first sensing part 9216, and the first measuring part 9217 are the same as or similar to those described in FIG. 1, and therefore detailed description thereof will be omitted.

[0170] The first thickness measurement unit further includes a substrate clamp CLP, which is a substrate pressing part arranged to face a part of the first support part 9215. The substrate clamp CLP may maintain a specific part of the display substrate DP flat by using an electrostatic chuck or an adhesive chuck. For example, the substrate clamp CLP may fix an edge part of the display substrate DP such that the edge part of the display substrate DP on which the dummy layer is arranged forms a flat plane. In the example of FIG. 9, the substrate clamp CLP clamps the edge part of the display substrate DP together with the first support part 9215.

[0171] In such a case, when measuring the thickness of the dummy layer via the first measuring unit 9217, since one surface of the display substrate DP is flat, it is possible to reduce measurement errors caused by bending of the display substrate DP due to the load of the display substrate DP.

[0172] Although not shown in the drawings, the above-mentioned structure can also be applied to at least one of the second thickness measurement unit, the third thickness measurement unit, the fourth thickness measurement unit, the fifth thickness measurement unit and the sixth thickness measurement unit.

[0173] FIG. 10 is a plan view that illustrates a schematic configuration of a display device according to an embodiment of the present invention.

[0174] 10, the display device 2 also includes a display area DA and a peripheral area PA located outside the display area DA. The display device 2 can provide an image in the display area DA through an array of a plurality of pixels PX arranged two-dimensionally.

[0175] The peripheral area PA is an area that does not provide an image and may completely or partially surround the display area DA. Drivers for providing electrical signals and power to pixel circuits corresponding to the pixels PX may be arranged in the peripheral area PA. Pads to which electronic elements, printed circuit boards, etc. may be electrically connected may be arranged in the peripheral area PA.

[0176] In the following description, the display device 2 is a light emitting element and includes an organic light emitting diode (OLED), but the display device 2 of the present invention is not limited thereto. In another embodiment, the display device 2 is a light emitting display device including an inorganic light emitting diode, that is, an inorganic light emitting display. The inorganic light emitting diode also includes a PN diode including an inorganic semiconductor-based material. When a voltage is applied to the PN junction diode in the forward direction, holes and electrons are injected, and the energy generated by the recombination of the holes and the electrons is converted into light energy, and light of a predetermined color can be emitted. The inorganic light emitting diode has a width of several to several hundred μm, and in some embodiments, the inorganic light emitting diode may also be referred to as a micro LED (light-emitting diode). In yet another embodiment, the display device 2 is a quantum dot light emitting display.

[0177] The display device 2 may be used as a display screen for various products such as a television, a notebook computer, a monitor, a billboard, an Internet of Things (IoT) device, as well as a portable electronic device such as a mobile phone, a smart phone, a tablet personal computer (PC), a mobile communication terminal, an electronic organizer, an electronic book, a portable multimedia player (PMP), a navigation system, and an ultra mobile personal computer (UMPC). The display device 2 according to an embodiment may be used in a wearable device such as a smart watch, a watch phone, a glasses-type display, and a head mounted display (HMD). The display device 2 according to an embodiment may be used as a display screen for an automobile instrument panel, a center information display (CID) disposed in a center fascia or dashboard of an automobile, a room mirror display replacing a side mirror of an automobile, or a display screen disposed on the back of a front seat as entertainment for a rear seat of an automobile.

[0178] FIG. 11 is a cross-sectional view that diagrammatically illustrates a cross section taken along line XI-XI' in FIG.

[0179] 11, the display device 2 also includes a laminated structure of a substrate 100, a pixel circuit layer PCL, a display element layer DEL, and a sealing layer 300. The above-mentioned display substrate DP (FIG. 2) is processed during the manufacturing process of the display device 2. For example, the display substrate includes the substrate 100, and at least one of at least one of the pixel circuit layer PCL, at least one of the display element layer DEL, and at least one of the sealing layer 300 is laminated on the substrate 100 during the manufacturing process.

[0180] The substrate 100 is also a multi-layer structure including a base layer containing a polymer resin and an inorganic layer. For example, the substrate 100 includes a base layer containing a polymer resin and a barrier layer of an inorganic insulating layer. For example, the substrate 100 includes a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104, which are stacked in sequence. The first base layer 101 and the second base layer 103 may include polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene napthalate (PEN), polyethylene terepthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (TAC) and / or cellulose acetate propionate (CAP), etc. The first barrier layer 102 and the second barrier layer 104 may include inorganic insulators such as silicon oxide, silicon oxynitride and / or silicon nitride. The substrate 100 may have a flexible property.

[0181] A pixel circuit layer PCL is disposed on the substrate 100. Fig. 11 illustrates that the pixel circuit layer PCL includes a thin film transistor TFT, and a buffer layer 111, a first gate insulating layer 112, a second gate insulating layer 113, an interlayer insulating layer 114, a first planarization insulating layer 115, and a second planarization insulating layer 116 disposed under and / or over components of the thin film transistor TFT.

[0182] The buffer layer 111 may reduce or block the penetration of foreign matter, moisture, or outside air from the bottom of the substrate 100, and may provide a flat surface on the substrate 100. The buffer layer 111 may include an inorganic insulator such as silicon oxide, silicon oxynitride, or silicon nitride, and may have a single-layer structure or a multi-layer structure including the above-mentioned materials.

[0183] The thin film transistor TFT on the buffer layer 111 includes a semiconductor layer Act, which may include polysilicon. Alternatively, the semiconductor layer Act may include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The semiconductor layer Act may include a channel region C, and a drain region D and a source region S disposed on both sides of the channel region C. The gate electrode GE may overlap the channel region C.

[0184] The gate electrode GE may also include a low resistance metal material. The gate electrode GE may also include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed in a multi-layer or single layer including the aforementioned materials.

[0185] The first gate insulating layer 112 between the semiconductor layer Act and the gate electrode GE is made of silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), tantalum oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x It also contains inorganic insulators such as zinc oxide (ZnO x ) is a compound made of zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ) as well.

[0186] A second gate insulating layer 113 may be provided to cover the gate electrode GE. The second gate insulating layer 113 is similar to the first gate insulating layer 112 and may be formed of silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), tantalum oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x It also contains inorganic insulators such as zinc oxide (ZnO x ) is a compound made of zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ) as well.

[0187] An upper electrode Cst2 of the storage capacitor Cst may be disposed on the second gate insulating layer 113. The upper electrode Cst2 may overlap the gate electrode GE therebelow. In this case, the gate electrode GE and the upper electrode Cst2 overlapping with the second gate insulating layer 113 sandwiched therebetween may form the storage capacitor Cst. That is, the gate electrode GE may function as a lower electrode Cst1 of the storage capacitor Cst.

[0188] In this manner, the storage capacitor Cst and the thin film transistor TFT may be formed to overlap each other, or in some embodiments, the storage capacitor Cst may be formed not to overlap with the thin film transistor TFT.

[0189] The top electrode Cst2 may comprise aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may be a single layer or multiple layers of the aforementioned materials.

[0190] The interlayer insulating layer 114 can cover the upper electrode Cst2. The interlayer insulating layer 114 can be made of silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), tantalum oxide (Ta 2 O5), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x ) and zinc oxide (ZnO x ) is a compound made of zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 The interlayer insulating layer 114 may be a single layer or multiple layers including the inorganic insulators mentioned above.

[0191] The drain electrode DE and the source electrode SE may be located on the interlayer insulating layer 114. The drain electrode DE and the source electrode SE may be connected to the drain region D and the source region S through contact holes formed in the insulating layer therebelow. The drain electrode DE and the source electrode SE may include a material having good conductivity. The drain electrode DE and the source electrode SE may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer including the above materials. In one embodiment, the drain electrode DE and the source electrode SE may have a multilayer structure of Ti / Al / Ti.

[0192] The first planarization insulating layer 115 may cover the drain electrode DE and the source electrode SE. The first planarization insulating layer 115 may include an organic insulator such as a general-purpose polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, or a blend thereof.

[0193] The second planarization insulating layer 116 may be disposed on the first planarization insulating layer 115. The second planarization insulating layer 116 may include the same material as the first planarization insulating layer 115, or may include an organic insulator such as a general-purpose polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, or a blend thereof.

[0194] A display element layer DEL may be disposed on the pixel circuit layer PCL of the above structure. The display element layer DEL includes an organic light emitting diode OLED as a display element (i.e., a light emitting element), and the organic light emitting diode OLED also includes a stacked structure of a pixel electrode 210, an intermediate layer 220, and a common electrode 230. The organic light emitting diode OLED may emit, for example, red light, green light, or blue light, or may emit red light, green light, blue light, or white light. The organic light emitting diode OLED emits light through a light emitting region, and the light emitting region may be defined as a pixel PX.

[0195] The pixel electrode 210 of the organic light emitting diode OLED may be electrically connected to the thin film transistor TFT through a contact hole formed in the second planarization insulating layer 116 and the first planarization insulating layer 115 and a contact metal CM disposed on the first planarization insulating layer 115.

[0196] The pixel electrode 210 may be made of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium oxide (In 2 O 3In some embodiments, the pixel electrode 210 includes a conductive oxide such as indium oxide (ITO), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). In other embodiments, the pixel electrode 210 includes a reflective layer including silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a combination thereof. In other embodiments, the pixel electrode 210 includes a conductive layer above / below the reflective layer including ITO, IZO, ZnO, or In. 2 O 3 The present invention further includes a film formed by

[0197] A pixel defining film 117 having an opening 117OP exposing a central portion of the pixel electrode 210 is disposed on the pixel electrode 210. The pixel defining film 117 may include an organic insulator and / or an inorganic insulator. The opening 117OP may define a light emitting area of ​​light emitted from the organic light emitting diode OLED. For example, the size / width of the opening 117OP may correspond to the size / width of the light emitting area. Therefore, the size and / or width of the pixel PX may depend on the size and / or width of the opening 117OP of the corresponding pixel defining film 117.

[0198] The intermediate layer 220 may also include a light-emitting layer 222 formed to correspond to the pixel electrode 210. The light-emitting layer 222 may also include a polymer organic material or a small molecular organic material that emits light of a predetermined color, or the light-emitting layer 222 may also include an inorganic light-emitting material or a quantum dot.

[0199] In one embodiment, the intermediate layer 220 includes a first functional layer 221 and a second functional layer 223, which are disposed below and above the light-emitting layer 222, respectively. The first functional layer 221 may include, for example, a hole transport layer (HTL), or may include a hole transport layer and a hole injection layer (HIL). The second functional layer 223 is a component disposed on the light-emitting layer 222, and may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The first functional layer 221 and / or the second functional layer 223 may be a common layer formed to entirely cover the substrate 100, similar to the common electrode 230 described below. In the above case, the first layer described in FIG. 1 to FIG. 3 is a hole transport layer, the second layer is a hole injection layer, and the third layer is the light-emitting layer 222. In addition, the fourth layer is also an electron transport layer, the fifth layer is also an electron injection layer, and the (6-1)th layer is also a common electrode. In the above case, if the thickness of one of the intermediate layers 220 is different from the preset thickness, the thickness of the corresponding layer may be adjusted, or the thickness of the other layers of the intermediate layer 220 may be adjusted. For example, if the thickness of the hole transport layer is thinner than the preset thickness, the thickness of the hole transport layer may be adjusted, or the thickness of the other layers excluding the hole transport layer may be adjusted. For example, the corresponding display substrate is sent to the first process unit again to deposit a hole transport layer on the display substrate, or when a hole transport layer is formed on a new display substrate, a hole transport layer is deposited on the display substrate. Alternatively, when the thickness of the other layers is adjusted, the thickness of the other layers similar to the hole transport layer may be adjusted, as described above with reference to FIGS. 1 to 3. In such a case, the thickness of the other layers may be adjusted so that the final optical properties of intermediate layer 220 correspond to the preset optical properties depending on the sum of the thickness of the hole transport layer and the thickness of the other layers.

[0200] In another embodiment, when the thickness of the hole transport layer is thicker than the preset thickness, the thickness of the hole transport layer or the thickness of the other layer different from the hole transport layer may be adjusted. When the thickness of the hole transport layer is adjusted, the thickness of the hole transport layer formed on the new display substrate may be adjusted. When the thickness of the layer different from the hole transport layer is adjusted, the thickness of the other layer similar to the hole transport layer may be adjusted so that the optical properties that vary with the thickness are adjusted as described above with reference to FIGS. 1 to 3. In such a case, the thickness of the other layer may be adjusted so that the final optical properties of the intermediate layer 220 correspond to the preset optical properties according to the sum of the thickness of the hole transport layer and the thickness of the other layer.

[0201] The common electrode 230 is disposed on the pixel electrode 210 and may overlap the pixel electrode 210. The common electrode 230 may be made of a conductive material having a small work function. For example, the common electrode 230 may include a (semi-)transparent layer containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or an alloy thereof. Alternatively, the common electrode 230 may include a (semi-)transparent layer containing the aforementioned material and a conductive material such as ITO, IZO, ZnO, or In. 2 O 3 The common electrode 230 may be integrally formed so as to entirely cover the substrate 100.

[0202] The sealing layer 300 may be disposed on the display element layer DEL and cover the display element layer DEL. The sealing layer 300 includes at least one inorganic sealing layer and at least one organic sealing layer. In one embodiment, FIG. 11 illustrates the sealing layer 300 including a first inorganic sealing layer 310, an organic sealing layer 320, and a second inorganic sealing layer 330 that are sequentially stacked.

[0203] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include one or more inorganic materials selected from the group consisting of aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 320 may include a polymer-based material. The polymer-based material may include an acrylic resin, an epoxy resin, polyimide, and polyethylene. In one embodiment, the organic encapsulation layer 320 may include an acrylate. The organic encapsulation layer 320 may be formed by curing a monomer or applying a polymer. The organic encapsulation layer 320 may be transparent.

[0204] Although not shown, a touch sensor layer may be disposed on the encapsulation layer 300, and an optical function layer may be disposed on the touch sensor layer. The touch sensor layer may acquire coordinate information based on an external input, for example, a touch event. The optical function layer may reduce the reflectance of light (external light) incident from the outside toward the display device, and / or improve the color purity of light emitted from the display device. In one embodiment, the optical function layer may include a phase retarder and / or a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. The phase retarder and the polarizer may further include a protective film.

[0205] An adhesive member may be disposed between the touch electrode layer and the optical function layer. The adhesive member may be a common adhesive member known in the art without limitation. The adhesive member may be a pressure sensitive adhesive (PSA).

[0206] Fig. 12 is a cross-sectional view showing an organic light-emitting diode of the display device of Fig. 11. Fig. 13 is a cross-sectional view showing an organic light-emitting diode of the display device of Fig. 11. Fig. 14 is a cross-sectional view showing an organic light-emitting diode of the display device of Fig. 11. Fig. 15 is a cross-sectional view showing an organic light-emitting diode of the display device of Fig. 11.

[0207] 12 to 15, the organic light emitting diode may be configured to include one light emitting layer. However, the present invention is not limited thereto. As shown in Figs. 12 to 15, the organic light emitting diode may be configured to have a tandem structure in which a plurality of light emitting layers are stacked.

[0208] 12, the organic light emitting diode OLED includes a pixel electrode 210 as an anode electrode, a common electrode 230 as a cathode electrode, and a first light emitting unit 220-1 and a second light emitting unit 220-3 stacked as intermediate layers between the pixel electrode 210 and the common electrode 230. A charge generation layer (CGL) may be disposed between the first light emitting unit 220-1 and the second light emitting unit 220-3 of the organic light emitting diode OLED.

[0209] The first light emitting unit 220-1 also includes a blue light emitting layer (B). A hole injection layer and / or a hole transport layer may be disposed between the pixel electrode 210 and the blue light emitting layer (B). An electron injection layer and / or an electron transport layer may be disposed between the blue light emitting layer and the common electrode 230.

[0210] The second light emitting unit 220-3 also includes a yellow light emitting layer Y. A hole injection layer and / or a hole transport layer may be disposed between the charge generation layer CGL and the yellow light emitting layer Y. An electron injection layer and / or an electron transport layer may be disposed between the yellow light emitting layer Y and the common electrode 230.

[0211] The charge generation layer CGL is disposed between the first light emitting unit 220-1 and the second light emitting unit 220-3, and adjusts the charges between the first light emitting unit 220-1 and the second light emitting unit 220-3 to achieve charge balance.

[0212] The charge generation layer CGL may be formed by stacking an n-type layer adjacent to the first light emitting unit 220-1 and supplying electrons to the first light emitting unit 220-1, and a p-type layer adjacent to the second light emitting unit 220-3 and supplying holes to the second light emitting unit 220-3.

[0213] 13, the organic light emitting diode OLED includes a pixel electrode 210 serving as an anode electrode, a common electrode 230 serving as a cathode electrode, and a first light emitting unit 220-1, a second light emitting unit 220-3, and a third light emitting unit 220-5 stacked between the pixel electrode 210 and the common electrode 230. A charge generation layer CGL may be disposed between the first light emitting unit 220-1 and the second light emitting unit 220-3, and between the second light emitting unit 220-3 and the third light emitting unit 220-5 of the organic light emitting diode OLED.

[0214] The first light-emitting unit 220-1 also includes a blue light-emitting layer B. A hole injection layer and / or a hole transport layer may be disposed under the blue light-emitting layer B, and an electron injection layer and / or an electron transport layer may be disposed over the blue light-emitting layer B.

[0215] The second light-emitting unit 220-3 also includes a yellow light-emitting layer Y. A hole injection layer and / or a hole transport layer may be disposed below the yellow light-emitting layer Y, and an electron injection layer and / or an electron transport layer may be disposed above the yellow light-emitting layer Y.

[0216] The third light-emitting unit 220-5 also includes a blue light-emitting layer B. A hole injection layer and / or a hole transport layer may be disposed below the blue light-emitting layer B, and an electron injection layer and / or an electron transport layer may be disposed above the blue light-emitting layer B.

[0217] The charge generation layer CGL is disposed between the first light emitting unit 220-1, the second light emitting unit 220-3, and the third light emitting unit 220-5, and may be formed by stacking an n-type layer that supplies electrons and a p-type layer that supplies holes.

[0218] 14, the organic light emitting diode OLED includes a pixel electrode 210 serving as an anode electrode, a common electrode 230 serving as a cathode electrode, and a first light emitting unit 220-1, a second light emitting unit 220-3', and a third light emitting unit 220-5 stacked between the pixel electrode 210 and the common electrode 230. A charge generation layer CGL may be disposed between the first light emitting unit 220-1 and the second light emitting unit 220-3' and between the second light emitting unit 220-3' and the third light emitting unit 220-5 of the organic light emitting diode OLED.

[0219] The embodiment of Fig. 14 illustrates an example in which the second light-emitting unit 220-3 in the embodiment of Fig. 13 is modified to a second light-emitting unit 220-3'. Unlike the second light-emitting unit 220-3, the second light-emitting unit 220-3' further includes a red light-emitting layer R and / or a green light-emitting layer G in addition to the yellow light-emitting layer Y.

[0220] In the drawing, the red light emitting layer R is disposed below the yellow light emitting layer Y, and the green light emitting layer G is disposed above the yellow light emitting layer Y, but the present invention is not limited thereto.

[0221] For example, a red light emitting layer R may be disposed above and below the yellow light emitting layer Y, or a green light emitting layer G may be disposed above and below the yellow light emitting layer Y. Alternatively, a red light emitting layer R or a green light emitting layer G may be disposed only above or only below the yellow light emitting layer Y. Various modifications are possible.

[0222] The organic light emitting diode OLED of Fig. 12 to Fig. 14 may be integrally formed with respect to a plurality of pixels arranged in the display area DA. In this case, the organic light emitting diode OLED may emit white light or blue light. A color filter may be arranged on the organic light emitting diode OLED to realize a color according to each pixel.

[0223] Referring to FIG. 15, the organic light emitting diode OLED includes a red organic light emitting diode OLEDr, a green organic light emitting diode OLEDg, and a blue organic light emitting diode OLEDb that emit different colors.

[0224] In this embodiment, the red organic light emitting diode OLEDr, the green organic light emitting diode OLEDg, and the blue organic light emitting diode OLEDb may be provided in a tandem structure.

[0225] The red organic light emitting diode OLEDr may include a first pixel electrode 210r, a first light emitting unit 220-1 including an additional red light emitting layer R', a charge generation layer CGL, a second light emitting unit 220-3 including a red light emitting layer R and an additional red light emitting layer R', and a common electrode 230, which are sequentially stacked. The first light emitting unit 220-1 further includes a hole injection layer HTL disposed under the additional red light emitting layer R' and an electron injection layer ETL disposed over the additional red light emitting layer R'. The light emitting unit 220-3 further includes a hole injection layer HTL disposed under the additional red light emitting layer R' and an electron injection layer ETL disposed over the red light emitting layer R. The charge generation layer CGL is located between the electron injection layer ETL of the first light emitting unit 220-1 and the hole injection layer HTL of the light emitting unit 220-3.

[0226] The green organic light emitting diode OLEDg may include a second pixel electrode 210g, a first light emitting unit 220-1 including a green light emitting layer G, a charge generation layer CGL, a second light emitting unit 220-3 including a green light emitting layer G, and a common electrode 230, which are sequentially stacked. The first light emitting unit 220-1 may further include a hole injection layer HTL disposed under the green light emitting layer G. The second light emitting unit 220-3 may further include an electron injection layer ETL disposed over the green light emitting layer G.

[0227] The blue organic light emitting diode OLEDb may include a third pixel electrode 210b, a first light emitting unit 220-1 including a blue light emitting layer B, a charge generation layer CGL, a second light emitting unit 220-3 including a blue light emitting layer B, and a common electrode 230, which are sequentially stacked. Each of the first light emitting unit 220-1 and the second light emitting unit 220-3 may further include a hole injection layer HTL disposed under the blue light emitting layer B and an electron injection layer ETL disposed over the blue light emitting layer B.

[0228] The hole injection layer HTL, the electron injection layer ETL, and the charge generation layer CGL may be integrally formed over the red organic light emitting diode OLEDr, the green organic light emitting diode OLEDg, and the blue organic light emitting diode OLEDb. In some embodiments, a separator may be disposed between each of the organic light emitting diodes OLED to improve leakage current due to the charge generation layer CGL.

[0229] In the present embodiment, the red light emitting layer R, the green light emitting layer G, and the blue light emitting layer B included in the red organic light emitting diode OLEDr, the green organic light emitting diode OLEDg, and the blue organic light emitting diode OLEDb may have different thicknesses. This may be set in consideration of the thickness at which light resonates depending on the wavelength emitted from the light emitting layer. For example, the red light emitting layer R may be thicker than the green light emitting layer G. The green light emitting layer G may be thicker than the blue light emitting layer B.

[0230] By providing the organic light emitting diode OLED in a tandem structure, the organic light emitting diode OLED can have high brightness, a long life, and the like.

[0231] As described above, when the organic light emitting diode OLED has a tandem structure, at least two layers having the same material may be provided. In this case, the at least two layers having the same material may be performed in the same process unit. In such a case, the display substrate may move in one direction according to the formation of each layer, and then return in the opposite direction to perform each process. In another embodiment, different clusters may be provided according to the number of layers of the organic light emitting diode OLED, and each layer may be formed in each cluster.

[0232] In the above-mentioned case, if the thickness of one of the at least two layers is different from the preset thickness, the thickness of the other of the at least two layers may be adjusted. For example, if the thickness of one of the at least two layers is thinner than the preset thickness, the thickness of the other of the at least two layers may be adjusted to be thicker than the preset thickness. Also, if the thickness of one of the at least two layers is thicker than the preset thickness, the thickness of the other of the at least two layers may be adjusted to be thinner than the preset thickness.

[0233] In addition to the above, when the thickness of one layer of the organic light emitting diode OLED is different from the preset thickness, the thickness of another layer of the organic light emitting diode OLED may be adjusted so that the optical characteristics of the organic light emitting diode OLED correspond to the preset optical characteristics.

[0234] Therefore, the display device manufacturing apparatus and the display device manufacturing method are capable of manufacturing a display device that displays a clear image.

[0235] In the above, instead of measuring only the thickness of the dummy layer, only the thickness of the layers other than the dummy layer may be measured. For example, only the thickness of the first layer out of the first layer and the first dummy layer may be measured. In this case, the first dummy layer (dummy layer) may not be formed on the display substrate DP, and only the first layer (layer) may be formed.

[0236] As described above, the present invention has been described with reference to the embodiment shown in the drawings, but these are merely illustrative, and those skilled in the art will understand that various modifications and variations of the embodiment are possible therefrom. Therefore, the true technical scope of the present invention is defined by the technical ideas of the claims. [Explanation of symbols]

[0237] 1. Display device manufacturing equipment 2 Display device 1000 Loading section 2000 Flip Section 3000 1st Cluster 3100 First Transfer Chamber 3200 First Robot Arm 3300 1st process department 4000 Second Cluster 4100 Second Transfer Chamber 4200 Second Robot Arm 4300 2nd process department 4400 Second thickness measurement unit 5000 3rd Cluster 5100 3rd Transfer Chamber 5200 3rd Robot Arm 5300 3rd process department 5310 3rd process chamber 5340 Third loading section 5350 Third support part 5360 3rd sensing section 5370 Third measurement section 5380 Rotating part 5390 3rd mask support part 5391 3rd process pressure adjustment section 6000 4th Cluster 6100 Transfer Chamber No. 4 6200 4th Robot Arm 6300 4th process department 7000 5th Cluster 7100 5th Transfer Chamber 7200 5th Robot Arm 7300 5th process department 8000 6th Cluster 8100 Transfer Chamber No. 6 8200 6th Robot Arm 8300 6th Process Department 9100 Unloading Department 9200 Connection section 9210 1st connection part 9211 1st connecting chamber 9212 First Drive Unit 9213 1st linear motion section 9214 First Placement Section 9215 1st support part 9216 1st sensing section 9217 1st measurement section 9218 First pressure adjustment section 9219 Motion drive unit 9220 2nd connection part 9230 3rd connection section 9240 4th connection section 9250 5th connection section 9260 6th connection section

Claims

1. a placement portion on which a substrate having a dummy layer is placed; a plurality of support portions disposed on the placement portion and supporting the substrate; a measuring unit arranged to face the placement unit and configured to measure a thickness of the dummy layer, The display device manufacturing apparatus, wherein the placement unit performs linear movement so that the measurement unit and the dummy layer are disposed in corresponding positions based on the result of measurement by the measurement unit.

2. The display device manufacturing apparatus of claim 1 , further comprising a driving unit connected to the placement unit and adapted to perform a linear movement of the placement unit.

3. The display device manufacturing apparatus according to claim 1 , further comprising a sensing unit for measuring a position of the mounting unit and a position of the substrate.

4. The apparatus of claim 3 , wherein the placement unit linearly moves the substrate so that the position of the substrate corresponds to a preset position based on the result of measurement by the sensing unit.

5. The apparatus of claim 1 , wherein one of the plurality of supporting portions is disposed at a different height than the other of the plurality of supporting portions.

6. The apparatus of claim 1 , further comprising: a motion driver, in which at least one of a sensing unit and the measuring unit is disposed, and which moves at least one of the sensing unit and the measuring unit.

7. A process for forming at least one layer on the substrate; a path unit connected to the processing unit and forming a moving path for the substrate, The display device manufacturing apparatus according to claim 1 , wherein the placement section, the support section and the measurement section are arranged in the process section or the path unit.

8. The process unit includes a first process unit and a second process unit for forming different layers on the substrate, 8. The display device manufacturing apparatus of claim 7, wherein the thickness of a layer formed on the substrate is measured in the first process section, and the thickness of a layer formed on the substrate is adjusted in at least one of the first process section and the second process fixing section.

9. 2. The display device manufacturing apparatus according to claim 1, further comprising a substrate pressing unit arranged to face at least one of the plurality of support units and at least one of the placement units, and to maintain at least a portion of the substrate flat.

10. The display device manufacturing apparatus according to claim 1 , wherein the measurement unit irradiates the one surface of the dummy layer with a signal in a direction perpendicular to the one surface.

11. moving the position of the substrate placed on the placement part so that the position corresponds to a preset position; separating the substrate from a support and moving the support to an initial position, and then placing the substrate on the support; moving the substrate so that the position of the substrate corresponds to the preset position; and moving the support portion so that a position of a dummy layer on the substrate corresponds to a preset dummy position.

12. The method of claim 11, further comprising the step of measuring a position of the substrate and a position of the placement part.

13. The method of claim 11, further comprising measuring a thickness of the dummy layer.

14. The method for manufacturing a display device according to claim 13 , wherein the thickness of the dummy layer is measured while the substrate is being transferred.

15. The method for manufacturing a display device according to claim 13 , wherein the thickness of the dummy layer is measured in a space where a layer identical to the dummy layer is formed on the substrate.

16. The method of claim 11, further comprising measuring a position of the dummy layer.

17. The method of claim 16, further comprising: comparing the position of the dummy layer with a preset dummy position.

18. The method of claim 11, further comprising supporting different portions of the substrate at different heights.

19. The method of claim 11, further comprising maintaining the substrate flat.

20. The method of claim 11, further comprising applying pressure to an end of the substrate adjacent to the dummy layer to maintain the portion of the substrate on which the dummy layer is disposed flat.

Images