Ultrasonic device

Abstract

To provide an ultrasonic device that can suppress the effects of electromagnetic noise associated with wireless communication in a wireless communication portion.SOLUTION: An ultrasonic device 1 includes an ultrasonic sensor 20 that transmits and receives ultrasonic waves and outputs an ultrasonic signal corresponding to the received ultrasonic waves, a circuit board 40 connected to the ultrasonic sensor 20 and processes the ultrasonic signal input from the ultrasonic sensor 20 to generate a received signal, a wireless communication board (wireless communication unit) 50 connected to the circuit board and converts the received signal into an electromagnetic wave and transmits the electromagnetic wave to an external device, a housing 10 that houses the ultrasonic sensor 20, the circuit board, and the wireless communication board, and a support portion 13 that is disposed within the housing 10 between the ultrasonic sensor 20 and the wireless communication board and is a shielding portion that blocks the electromagnetic waves.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to ultrasound devices. [Background technology]

[0002] 2. Description of the Related Art Conventionally, as an ultrasonic device for transmitting and receiving ultrasonic waves, a wireless communication type ultrasonic measurement device for transmitting and receiving signals with an external device via wireless communication is known (see, for example, Patent Document 1). In the ultrasonic device described in Patent Document 1, a detection signal based on received ultrasonic waves output from an ultrasonic transducer array is modulated into a radio wave and transmitted from a wireless communication unit to an ultrasonic observation device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2011-072583 A Summary of the Invention [Problem to be solved by the invention]

[0004] In an ultrasonic device that communicates with an external device by wireless communication as in Patent Document 1, the operability is improved by eliminating the need for cables, and the influence of external noise caused by using long cables is reduced. However, there is a problem that electromagnetic noise is generated due to wireless communication in the wireless communication unit, which adversely affects the ultrasonic signal output from the ultrasonic transducer. [Means for solving the problem]

[0005] An ultrasonic device according to a first aspect of the present disclosure includes an ultrasonic sensor that transmits and receives ultrasonic waves and outputs an ultrasonic signal corresponding to the received ultrasonic waves; a circuit unit connected to the ultrasonic sensor and processes the ultrasonic signal input from the ultrasonic sensor to generate a received signal; a wireless communication unit connected to the circuit unit and converts the received signal into an electromagnetic wave and transmits it to an external device; a housing that accommodates the ultrasonic sensor, the circuit unit, and the wireless communication unit; and a shielding unit disposed within the housing between the ultrasonic sensor and the wireless communication unit and that blocks electromagnetic waves. [Brief description of the drawings]

[0006] [Figure 1] 1 is a cross-sectional view showing a schematic configuration of an ultrasonic device according to a first embodiment. [Diagram 2] FIG. 2 is a schematic plan view of the ultrasound device according to the first embodiment with an upper housing removed. [Diagram 3] FIG. 2 is a schematic plan view showing an example of the ultrasonic sensor according to the first embodiment. [Figure 4] FIG. 4 is a schematic cross-sectional view of the ultrasonic sensor taken along line BB in FIG. 3 . [Diagram 5] FIG. 1 is a block diagram of an ultrasound apparatus according to a first embodiment. [Figure 6] FIG. 1 is a block diagram of an ultrasound apparatus according to a first embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] [First embodiment] An ultrasound device according to a first embodiment of the present disclosure will be described below. Fig. 1 is a cross-sectional view showing a schematic configuration of an ultrasonic device 1 according to this embodiment. Fig. 2 is a plan view of the ultrasonic device 1 according to this embodiment with an upper housing 12 removed. 1, the ultrasonic device 1 of this embodiment includes a housing 10, an ultrasonic sensor 20, a relay board 30, a circuit board 40, a wireless communication board 50 (wireless communication unit), and a battery 60. The housing 10 includes a lower housing 11, an upper housing 12, a support unit 13 disposed between the lower housing 11 and the upper housing 12, and a sensor housing 15. In the following description, the thickness direction of the ultrasonic device 1 from the lower housing 11 toward the upper housing 12 is defined as the Z direction. The direction perpendicular to the Z direction and from the wireless communication board 50 toward the ultrasonic sensor 20 is defined as the X direction, and the direction perpendicular to the X and Z directions and from the bottom to the top of the paper in FIG. 2 is defined as the Y direction. Furthermore, the ultrasonic device 1 of this embodiment is capable of wireless communication with an external device 70 (see FIG. 5) via a wireless module 51 provided on the wireless communication board 50. Although a specific configuration of the external device 70 in this disclosure is omitted, a general computer such as a smartphone, a tablet terminal, or a personal computer can be used as the external device 70. The external device 70 receives reception signals and the like transmitted from the ultrasonic device 1 and performs various processes. For example, the external device 70 generates an internal tomographic image of the measurement target based on the reception signals, calculates the thickness of a predetermined part inside the measurement target, and checks the operating state of a predetermined part of the measurement target.

[0008] [Configuration of ultrasonic sensor 20] The ultrasonic sensor 20 is a sensor that transmits and receives ultrasonic waves, and is disposed at one end (+X side) of the ultrasonic device 1. The ultrasonic sensor 20 transmits ultrasonic waves to a measurement object and receives ultrasonic waves reflected by the measurement object. The ultrasonic sensor 20 is not particularly limited as long as it is configured to transmit and receive ultrasonic waves. For example, a bulk ultrasonic element may be used that applies a voltage to a piezoelectric body to vibrate the piezoelectric body itself to transmit ultrasonic waves and detects the reflected waves by an ultrasonic signal output by the distortion of the piezoelectric body itself due to the reflected waves. Alternatively, a thin-film ultrasonic element may be used in which a plurality of ultrasonic transducers, each having a piezoelectric element arranged on a thin-film vibration part, are arranged in an array, and each vibration part is vibrated by applying a voltage to the piezoelectric element to transmit ultrasonic waves.

[0009] In this embodiment, a thin-film ultrasonic element is used as the ultrasonic sensor 20. Fig. 3 is a schematic plan view showing an example of the ultrasonic sensor 20 of this embodiment. Fig. 4 is a schematic cross-sectional view of the ultrasonic sensor 20 taken along line BB in Fig. 3. In the ultrasonic sensor 20, a plurality of ultrasonic transducers Tr are arranged in a two-dimensional array along the Y direction and the Z direction. In addition, for convenience of explanation, the number of ultrasonic transducers Tr arranged is reduced in FIG. 3, but in reality, more ultrasonic transducers Tr may be arranged.

[0010] As shown in FIG. 4, the ultrasonic sensor 20 includes an element substrate 21, a diaphragm 22 provided on the element substrate 21, and a piezoelectric element 23 provided on the diaphragm 22. The element substrate 21 is made of a semiconductor substrate such as Si. The element substrate 21 has a first surface 211 on the -X side and a second surface 212 on the +X side that is the opposite surface to the first surface 211. The element substrate 21 is provided with substrate openings 21A that open from the first surface 211 to the second surface 212 in correspondence with each ultrasonic transducer Tr. In this embodiment, each substrate opening 21A is a through hole that penetrates the element substrate 21 in the substrate thickness direction (X direction), and the vibration plate 22 is provided on the -X side of the through hole.

[0011] Furthermore, the side (+X side) of the substrate opening 21A where the diaphragm 22 is not provided may be filled with an acoustic matching material having an acoustic impedance close to that of the measurement target (e.g., a living body), and as the acoustic matching material, for example, a resin material such as silicone may be used. Furthermore, an acoustic lens may be provided on the side (+X side) of the substrate opening 21A where the diaphragm 22 is not provided. In this case, an acoustic matching material having an acoustic impedance close to that of the acoustic lens is filled between the acoustic lens and the diaphragm 22.

[0012] The diaphragm 22 is made of, for example, a laminate of SiO2 and ZrO2, and is provided to cover the entire -X side of the element substrate 21. That is, the diaphragm 22 is supported by the partition wall 21B that constitutes the substrate opening 21A, and closes the -X side of the substrate opening 21A. The thickness dimension of this diaphragm 22 is sufficiently smaller than that of the element substrate 21.

[0013] The piezoelectric elements 23 are provided on the vibration plate 22 that closes each of the substrate openings 21A. The piezoelectric elements 23 are formed, for example, of a laminate in which a first electrode 23A, a piezoelectric layer 23B, and a second electrode 23C are laminated from the vibration plate 22 toward the -X side. Here, the portion of the diaphragm 22 that closes the substrate opening 21A constitutes a vibration section 22A, and this vibration section 22A and the piezoelectric element 23 constitute one ultrasonic transducer Tr. In such an ultrasonic transducer Tr, when a rectangular wave voltage (drive signal) of a predetermined frequency is applied between the first electrode 23A and the second electrode 23C, the piezoelectric layer 23B is deflected, the vibration part 22A is vibrated, and an ultrasonic wave is sent to the +X side. When the vibration part 22A is vibrated by the ultrasonic wave (reflected wave) reflected by the measurement object, a potential difference is generated above and below the piezoelectric layer 23B. This makes it possible to detect the received ultrasonic wave by detecting the potential difference generated between the first electrode 23A and the second electrode 23C.

[0014] In this embodiment, the first electrodes 23A of the ultrasonic transducers Tr arranged in the Y direction are connected to each other as shown in Fig. 3. These first electrodes 23A are connected to a driving terminal 23D, and are electrically connected from the driving terminal 23D to a control board (not shown) via, for example, a flexible printed circuit board or the like. In addition, the second electrodes 23C of the ultrasonic transducers Tr arranged in the Z direction are connected to each other. These second electrodes 23C are connected to a common terminal 23E, and this common terminal 23E is electrically connected to a control board via, for example, a flexible printed circuit board or the like. Here, in this embodiment, ultrasonic transducers Tr arranged in the Y direction are regarded as one transmitting / receiving pair, and multiple transmitting / receiving pairs are arranged in the Z direction. In this embodiment, each transmitting / receiving pair is configured to be driven simultaneously, but an independent driving terminal 23D may be connected to each transmitting / receiving pair, in which case each transmitting / receiving pair can be driven individually. In this case, by shifting the driving timing of each transmitting / receiving pair, it is possible to swing the transmission direction of the ultrasonic wave in a predetermined direction, or transmit the ultrasonic wave so that the ultrasonic wave converges at the measurement depth. On the other hand, when each ultrasonic transducer Tr is connected to one driving terminal 23D and driven simultaneously as shown in FIG. 3, it is possible to converge the ultrasonic wave at a predetermined depth by providing a separate acoustic lens.

[0015] [Configuration of relay board 30] 1 and 2, the relay board 30 connects the ultrasonic sensor 20 and the circuit board 40. Although not shown, the relay board 30 includes a terminal portion that is electrically connected to the drive terminal 23D and the common terminal 23E provided on the ultrasonic sensor 20, and a wiring circuit for connecting the terminal portion to the circuit board 40. The connection between the relay board 30 and the ultrasonic sensor 20 and the connection between the relay board 30 and the circuit board 40 can be made using a flexible board or lead wires (not shown), respectively. In addition, a support portion 13 is disposed between the relay board 30 and the circuit board 40, and the relay board 30 may be fixed to the support portion 13 by a conductive screw, and the conductive screw may be brought into contact with or screwed into a terminal portion provided on the circuit board 40, thereby connecting the relay board 30 and the circuit board 40. Further, in the present embodiment, a configuration in which the relay board 30 is provided is illustrated, but a configuration in which the relay board 30 is not provided and the ultrasonic sensor 20 and the circuit board 40 are directly connected by an FPC, lead wires, or the like may also be used.

[0016] [Configuration of circuit board 40] The circuit board 40 is connected to the ultrasonic sensor 20 via the relay board 30. The circuit board 40 outputs a drive voltage for transmitting ultrasonic waves to the ultrasonic sensor 20. The circuit board 40 also processes the ultrasonic signal input from the ultrasonic sensor 20 to generate a received signal, and transmits the generated received signal to an external device via the wireless communication board 50.

[0017] FIG. 5 is a block diagram showing a schematic configuration of the ultrasound device 1 of this embodiment. More specifically, the circuit board 40 of this embodiment includes a transmission circuit 41, a reception circuit 42 (signal generating unit), a switching circuit 43, a control circuit 44, and a circuit board side power supply IC 45, as shown in Fig. 5. Although details will be described later, the circuit board 40 is disposed between the lower housing 11 and the support part 13 in the housing 10. Here, the ultrasonic sensor 20, the relay board 30, the transmission circuit 41, the reception circuit 42, and the switching circuit 43 in the circuit board 40, which are included in the range A1 in Fig. 5, are configured to transmit signals by analog signals, and noise countermeasures are required. The transmission circuit 41, the reception circuit 42, and the switching circuit 43 included in the range A1 correspond to the circuit part of the present disclosure.

[0018] The transmission circuit 41 generates a drive signal for outputting ultrasonic waves from the ultrasonic sensor 20 and outputs the drive signal to the ultrasonic sensor 20 .

[0019] The receiving circuit 42 is configured to include, for example, a noise removal circuit, a signal amplification circuit, an ADC (analog / digital converter), etc., and generates a received signal by processing the ultrasonic signal input from the ultrasonic sensor 20. In other words, the receiving circuit 42 is a signal generation unit of the present disclosure, which removes noise from the ultrasonic signal, amplifies the signal value of the ultrasonic signal by a predetermined amplification factor, samples the signal value of the ultrasonic signal, which is an analog signal, at a predetermined sampling frequency, and converts it into a received signal, which is a digital signal.

[0020] The switching circuit 43 can switch between a transmission connection that connects the transmission circuit 41 and the ultrasonic sensor 20, and a reception connection that connects the reception circuit 42 and the ultrasonic sensor 20, and switches the connection state based on the control of the control circuit 44. When the ultrasonic sensor 20 has a plurality of independent transmission / reception pairs, a MUX (multiplexer) that can switch the connection state for each transmission / reception pair may be employed.

[0021] The control circuit 44 is configured by a semiconductor device such as an FPGA (Field Programmable Gate Array), etc. The control circuit 44 functions as a transmission control unit 441 and a reception control unit 442, for example.

[0022] The transmission control unit 441 switches the switching circuit 43 to the transmission connection based on the command to start ultrasonic measurement, and causes the transmission circuit 41 to generate a drive signal of a predetermined drive voltage and transmit it to the ultrasonic sensor 20. The start command may be input from the external device 70 to the ultrasonic device 1 by a user operating the external device 70, for example, or may be input by an operation button provided on the ultrasonic device 1 and operated by the user.

[0023] After a predetermined time has elapsed since the timing of transmitting the ultrasonic waves, the reception control unit 442 switches the switching circuit 43 to a reception connection, and causes the reception circuit 42 to process the ultrasonic signal output from the ultrasonic sensor 20. As a result, the reception signal is input to the control circuit 44 as a digital signal. Then, the reception control unit 442 transmits the reception signal input from the reception circuit 42 to the external device 70 via the wireless communication board 50.

[0024] The circuit board side power supply IC 45 modulates the power provided from the battery 60 via the communication board side power supply IC 52 to a voltage and power supply frequency suitable for the circuit board 40 and the ultrasonic sensor 20, and supplies it to each component of the circuit board 40. The circuit board side power supply IC45 is connected to a communication board side power supply IC52 provided on the wireless communication board 50. In this embodiment, power supplied from the battery 60 is modulated by the communication board side power supply IC52, and the power is supplied from the communication board side power supply IC52 to the circuit board side power supply IC45.

[0025] [Configuration of wireless communication board 50] The wireless communication board 50 is connected to the circuit board 40 and the battery 60 . Although details will be described later, the wireless communication board 50 is disposed in the housing 10 between the upper housing 12 and the support portion 13 and on the -X side of the battery 60 in the housing 10.

[0026] The wireless communication board 50 includes a wireless module 51 , a communication board side power supply IC 52 , and a battery charger 53 . The wireless module 51 transmits the reception signal input from the circuit board 40 to the external device 70. In addition, the wireless module 51 receives information, such as a command to start ultrasonic measurement, transmitted from the external device 70, and outputs the information to the control circuit 44 of the circuit board 40.

[0027] The communication board side power supply IC52 modulates the power supplied from the battery 60 to a voltage and power supply frequency usable for communication processing in the wireless module 51, and supplies the modulated power to the wireless module 51. In addition, the communication board side power supply IC52 provides a portion of the power supplied from the battery 60 to the circuit board side power supply IC45. Here, the power supply adjustment by the communication board-side power supply IC 52 is performed based on the communication frequency of the electromagnetic waves when wireless communication is performed by the wireless module 51. As a result, each component of the wireless communication board 50 surrounded by the area A2 in Fig. 5, particularly the communication board-side power supply IC 52 that adjusts the power supply, becomes an electromagnetic wave source (noise source).

[0028] Battery charger 53 is a charging circuit that charges battery 60. Battery charger 53 is connected to, for example, a connector 55 exposed from the outer surface of housing 10, and supplies power supplied from a charging cable connected to connector 55 to battery 60 to charge it.

[0029] [Battery 60 Configuration] The battery 60 is a secondary battery that supplies power to each component of the ultrasound device 1, and various types of secondary batteries such as a lithium ion battery can be used. Note that, although an example of a secondary battery is shown in this embodiment, the battery 60 may be a primary battery. The battery 60 is supported by the support portion 13 in the housing 10, and is disposed between the upper housing 12 and the support portion 13, and between the ultrasonic sensor 20 (relay board 30) and the wireless communication board 50. Such a battery 60 typically has an exterior covered with a conductive cover 61, which functions as an electromagnetic shield (i.e., the shielding portion of the present disclosure).

[0030] [Configuration of Chassis 10] As described above, housing 10 includes lower housing 11, upper housing 12, support part 13, and sensor housing 15. Lower housing 11, which is disposed on the -Z side of ultrasonic device 1, engages with upper housing 12, which is disposed on the +Z side, to form an exterior part of ultrasonic device 1. With lower housing 11 and upper housing 12 engaged, a housing opening 14 is formed at the +X side end of housing 10, and sensor housing 15 is fixed so as to close housing opening 14.

[0031] The lower housing 11, the upper housing 12, the support portion 13, and the sensor housing 15 are preferably made of a conductive material. The conductive material may be, for example, a metal such as aluminum, or a conductive resin. As a result, the lower housing 11, the upper housing 12, and the sensor housing 15 are made of a conductive material, and thus the ultrasonic sensor 20, the relay board 30, the circuit board 40, and the wireless communication board 50 arranged inside the housing 10 are shielded from external electromagnetic waves.

[0032] The support portion 13 is disposed between the lower housing 11 and the upper housing 12 . The support section 13 faces the upper housing 12 and includes a battery engagement section 131 that corresponds to the outer shape of the battery 60. The battery 60 is fitted into the battery engagement section 131, whereby the support section 13 supports the battery 60. As described above, the support portion 13 is made of a conductive material, and also functions as an electromagnetic shield that blocks electromagnetic waves between the +Z side (upper housing 12 side) and the -Z side (lower housing 11 side) of the support portion 13. In this embodiment, the circuit board 40 and the wireless communication board 50 are arranged with the support portion 13 in between. This provides an electromagnetic shield between the circuit board 40 and the wireless communication board 50, suppressing the influence of electromagnetic waves generated by the wireless communication board 50 on the circuit board 40.

[0033] 2 shows a configuration in which the relay board 30, the circuit board 40, and the wireless communication board 50 are fixed to the support portion 13 by screws, but the method of fixing them to the housing 10 is not particularly limited. For example, they may be fixed using an adhesive or the like, or a protruding claw provided on the support portion 13 may be engaged with a hole provided in each of the boards 30, 40, and 50 to fix them. In addition, in this embodiment, the relay board 30 may be fixed to the upper housing 12, the circuit board 40 may be fixed to the lower housing 11, or the wireless communication board 50 may be fixed to the upper housing 12, etc.

[0034] [Arrangement of components in ultrasound device 1] Next, the arrangement of the ultrasonic sensor 20, relay board 30, circuit board 40, wireless communication board 50, and battery 60 in the ultrasonic device 1 will be described. As described above, the ultrasonic sensor 20 is fixed to the sensor housing 15 that closes the housing opening 14 at the +X side end of the housing 10. In addition, the relay board 30 that relays the ultrasonic signal from the ultrasonic sensor 20 to the circuit board 40 is also provided on the +X side of the housing 10. Furthermore, the circuit board 40 is disposed on the lower housing 11 side with respect to the relay board 30, with the support portion 13 sandwiched therebetween. In the circuit board 40, the transmitting circuit 41, the receiving circuit 42, and the switching circuit 43, through which the analog signal propagates, are disposed on the +X side of the circuit board 40. In other words, the transmitting circuit 41, the receiving circuit 42, and the switching circuit 43 are disposed on the -Z side of the relay board 30.

[0035] In the ultrasonic device 1, the wireless communication board 50 is disposed on the -X side opposite the ultrasonic sensor 20, on the upper housing 12 side (+Z side) of the support part 13. In addition, between the wireless communication board 50 and the ultrasonic sensor 20 and the relay board 30, a battery 60 having a conductive cover 61, and a conductive support part 13 including a battery engagement part 131 that supports the battery 60 are disposed.

[0036] 5, the ultrasonic sensor 20 (ultrasonic sensor 20, transmitting circuit 41, receiving circuit 42, and switching circuit 43) enclosed by area A1 is configured to transmit analog signals as described above, and is susceptible to electromagnetic waves and requires noise countermeasures. On the other hand, the wireless communication board 50 enclosed by area A2 is a noise source centered around the communication board side power supply IC 52. In this embodiment, as described above, the configuration included in range A1 is disposed on the +X side of the ultrasonic device 1, and the configuration included in range A2 is disposed on the -X side of the ultrasonic device 1. This allows the configuration included in range A1 to be disposed away from the configuration included in range A2 of the noise generation source, thereby suppressing the inconvenience that noise generated from the configuration included in range A2 of the noise generation source affects the configuration included in range A1.

[0037] Furthermore, in this embodiment, the battery 60 and the support 13 function as a shielding section of the present disclosure, shielding electromagnetic waves generated in the configurations included in range A2. This further suppresses the inconvenience of the electromagnetic waves generated in the wireless communication board 50 affecting analog signals of the configurations included in range A1 (for example, ultrasonic signals output from the ultrasonic sensor 20). In addition, since the received signal after being converted into a digital signal by the receiving circuit is not affected by noise, the control circuit 44 on the circuit board 40 and the circuit board side power supply IC 45 may be arranged on the -X side close to the wireless communication board 50.

[0038] [Effects of this embodiment] The ultrasonic device 1 of this embodiment includes an ultrasonic sensor 20, a transmission circuit 41, a reception circuit 42, and a switching circuit 43 constituting a circuit unit, a wireless communication board 50 constituting a wireless communication unit, and a housing 10. The ultrasonic sensor 20 transmits and receives ultrasonic waves, and outputs an ultrasonic signal corresponding to the received ultrasonic waves. The transmission circuit 41, the reception circuit 42, and the switching circuit 43 are connected to the ultrasonic sensor 20, and process the ultrasonic signal input from the ultrasonic sensor 20 by ultrasonic measurement to generate a received signal. The wireless communication board 50 is connected to a circuit board 40 including a circuit unit, converts the received signal into an electromagnetic wave, and transmits it to an external device 70. The housing 10 accommodates the ultrasonic sensor 20, the circuit board 40, and the wireless communication board 50. In addition, a shielding unit (a battery 60 and a support unit 13) that is disposed between the ultrasonic sensor 20 and the wireless communication board 50 and blocks the electromagnetic waves is disposed in the housing 10.

[0039] This provides an electromagnetic shield between the wireless communication board 50, which is the noise source, and the ultrasonic sensor 20, transmitting circuit 41, receiving circuit 42, and switching circuit 43, where analog signal propagation takes place, thereby suppressing the increase in noise caused by the ultrasonic signal being affected by electromagnetic waves.

[0040] In this embodiment, the battery 60 is disposed between the components of an area A1 including the ultrasonic sensor 20, the transmitting circuit 41, the receiving circuit 42, the switching circuit 43, and the relay board 30, and the components of an area A2 including the wireless communication board 50. The battery 60 is covered with a conductive cover 61. As a result, the battery 60 functions as a shielding section of the present disclosure, and can suppress the inconvenience of electromagnetic waves generated in the wireless communication board 50 affecting the components of the range A1, and can suppress noise. In addition, in an ultrasonic device 1 that communicates with an external device 70 by wireless communication, it is difficult to supply power from the external device 70 because the external device 70 is not connected to the ultrasonic device 1 by wire. Therefore, such an ultrasonic device 1 usually includes a battery 60 for driving the ultrasonic sensor 20. In this embodiment, the battery 60 functions as a shielding section (electromagnetic shield), so there is no need to provide other members that constitute an electromagnetic shield in the housing 10, and the configuration of the ultrasonic device 1 can be simplified compared to a configuration in which a separate shielding section is provided.

[0041] In this embodiment, the housing 10 includes a supporting portion 13 that supports the battery 60 and has electrical conductivity, and the supporting portion 13 functions as a shielding portion. This allows the support 13 to function as a shielding part in addition to the battery 60, and further suppresses the inconvenience of electromagnetic waves generated in the wireless communication board 50 affecting the components of the range A1. Furthermore, in an ultrasonic device 1 equipped with the battery 60, a support 13 for placing the battery 60 is usually provided. In this embodiment, by having such a support 13 function as a shielding part, it is not necessary to provide other components that constitute an electromagnetic shield inside the housing 10, and the configuration of the ultrasonic device 1 can be simplified compared to a configuration in which a separate shielding part is provided.

[0042] In this embodiment, the lower housing 11, the upper housing 12, and the sensor housing 15 that constitute the housing 10 are also conductive. This allows the ultrasonic sensor 20, transmitting circuit 41, receiving circuit 42, switching circuit 43, and relay board 30 inside the housing 10 to be shielded from external electromagnetic waves, thereby suppressing the effects of noise caused by external electromagnetic waves.

[0043] In this embodiment, the receiving circuit 42 that generates a receiving signal from an ultrasonic signal is disposed closer to the ultrasonic sensor 20 than the battery 60 that constitutes the shielding part. This makes it possible to suppress the inconvenience of noise being carried over to the ultrasonic signal, and to generate an appropriate receiving signal.

[0044] In this embodiment, the ultrasonic sensor 20 comprises an element substrate 21 having a first surface 211 and a second surface 212, and including a substrate opening 21A extending from the first surface 211 to the second surface 212, a vibration plate 22 arranged to cover the first surface 211 of the element substrate 21, and a piezoelectric element 23 arranged on the side of the vibration plate 22 opposite the element substrate 21, in a position overlapping with the substrate opening 21A when viewed in the substrate thickness direction (X direction) from the first surface 211 toward the second surface 212, and the piezoelectric element 23 is formed by stacking a first electrode 23A, a piezoelectric layer 23B, and a second electrode 23C along the X direction. Use of such a thin-film ultrasonic element can facilitate miniaturization of the ultrasonic device 1. Furthermore, in a miniaturized ultrasonic device 1, the distance between the wireless communication board 50 and the ultrasonic sensor 20 and each member constituting the circuit unit is particularly short, but the influence of noise can be suppressed by providing a shielding portion for the battery 60 and the support portion 13 between the wireless communication board 50 and each member constituting the circuit unit.

[0045] [Second embodiment] Next, a second embodiment will be described. In the above-described first embodiment, a configuration has been exemplified in which the wireless communication board 50, which is the wireless communication unit of the present disclosure, is provided separately from the circuit board 40 including the transmitting circuit 41, the receiving circuit 42, and the switching circuit 43 that constitute the circuit unit of the present disclosure. However, a configuration in which the wireless communication unit and the circuit unit are disposed on a single board may also be used.

[0046] 6 is a block diagram showing a schematic configuration of an ultrasonic device 1A according to a second embodiment. In the following description, the same reference numerals are used for the configurations that have already been described, and the description thereof will be omitted or simplified. The ultrasonic device 1A of this embodiment includes a housing 10, an ultrasonic sensor 20, a relay board 30, a circuit board 40A, and a battery 60. The circuit board 40A includes a transmission circuit 41, a reception circuit 42, a switching circuit 43, a control circuit 44, and a circuit board side power supply IC 45, as well as a wireless module 51, a battery charger 53, a power supply IC 46, and the like. That is, in this embodiment, the circuit board 40 and the wireless communication board 50 of the first embodiment are integrated into one board, and the respective circuit configurations are integrated onto one board. In this embodiment, the transmitting circuit 41, the receiving circuit 42, and the switching circuit 43 constituting the circuit unit are arranged on the +X side of the circuit board 40A close to the ultrasonic sensor 20, and the wireless module 51 and the power supply IC 46 constituting the wireless communication unit, which is a noise source, are arranged on the -X side of the circuit board 40A opposite the ultrasonic sensor 20.

[0047] In this embodiment, the components in range A1 where analog signals are propagated (ultrasonic sensor 20, relay board 30, transmitting circuit 41, receiving circuit 42, and switching circuit 43) are disposed apart from the components in range A2 that are noise sources (wireless module 51 and power supply IC 46). As in the first embodiment, a battery 60 is disposed between the components in range A1 and the components in range A2 as a shielding unit. This makes it possible to obtain the same effect as in the first embodiment, suppress the inconvenience of analog signals such as ultrasonic signals being affected by electromagnetic waves and increasing noise, and enable proper ultrasonic measurement to be performed in the ultrasonic device 1A.

[0048] [Variations] The present invention is not limited to the above-described embodiments, and the present invention includes configurations obtained by modifying, improving, and appropriately combining the embodiments within the scope that can achieve the object of the present invention.

[0049] (Variation 1) In the above embodiment, a configuration in which a relay board 30 is provided is exemplified, but as described above, the relay board 30 does not have to be provided, in which case the ultrasonic sensor 20 only needs to be directly connected to the circuit board 40.

[0050] (Variation 2) In the above embodiment, an example has been shown in which the transmitting circuit 41, the receiving circuit 42, and the switching circuit 43 constituting the circuit section of the present disclosure are provided on the circuit board 40. However, for example, the transmitting circuit 41, the receiving circuit 42, and the switching circuit 43 may all or at least a part of them be provided on the relay board 30.

[0051] (Variation 3) In the above embodiment, the battery 60 and the support portion 13 are exemplified as the shielding portion, but a configuration in which another electromagnetic shield is provided may also be used. Also, either the battery 60 or the support part 13 may not function as a shielding part. For example, even if the support part 13 is made of a resin material that has no conductivity, the provision of the battery 60 can provide the shielding effect of an electromagnetic shield.

[0052] [Summary of this disclosure] An ultrasonic device according to a first aspect of the present disclosure includes an ultrasonic sensor that transmits and receives ultrasonic waves and outputs an ultrasonic signal corresponding to the received ultrasonic waves; a circuit unit connected to the ultrasonic sensor and processes the ultrasonic signal input from the ultrasonic sensor to generate a received signal; a wireless communication unit connected to the circuit unit and converts the received signal into an electromagnetic wave and transmits it to an external device; a housing that accommodates the ultrasonic sensor, the circuit unit, and the wireless communication unit; and a shielding unit disposed within the housing between the ultrasonic sensor and the wireless communication unit and that blocks electromagnetic waves.

[0053] This provides an electromagnetic shield between the wireless communication unit, which is the noise source, and the ultrasonic sensor and circuit unit where analog signal propagation takes place, thereby suppressing the increase in noise caused by the ultrasonic signal being affected by electromagnetic waves.

[0054] In the ultrasonic device of this aspect, it is preferable that the shielding unit is a battery that supplies power to the ultrasonic sensor, the circuit unit, and the wireless communication unit. This allows the battery that supplies power to each component of the ultrasound device to be used as the shielding section, thereby simplifying the configuration of the ultrasound device.

[0055] In the ultrasonic device of this aspect, the battery is preferably covered with a conductive cover. This allows the battery's conductive cover to act as an electromagnetic shield, reducing the effect of electromagnetic waves generated by the wireless communication unit on the circuit section and ultrasonic sensor.

[0056] In the ultrasonic measurement device of this aspect, it is preferable that the device is provided with a battery that supplies power to the ultrasonic sensor, the circuit unit, and the wireless communication unit, the housing is provided with a support portion that supports the battery and is conductive, and the shielding portion is the support portion. Thus, in an ultrasonic device equipped with a battery, a support part for supporting the battery is usually provided. In this aspect, by using a conductive support part, the support part can function as a shielding part, and the configuration of the ultrasonic device can be simplified.

[0057] In the ultrasonic device of this aspect, the housing is preferably conductive. This makes it possible to shield the ultrasonic sensor and the circuit section from external electromagnetic waves.

[0058] In the ultrasonic device of this aspect, it is preferable that the circuit section includes a signal generating section that generates the received signal from the ultrasonic signal, and that the signal generating section is arranged closer to the ultrasonic sensor than the shielding section. As a result, the signal generating unit, which generates a received signal from the ultrasonic signal output from the ultrasonic sensor, is positioned closer to the ultrasonic sensor than the shielding unit, thereby suppressing the inconvenience of noise being introduced into the ultrasonic signal and enabling an appropriate received signal to be generated.

[0059] In the ultrasonic device of this embodiment, the ultrasonic sensor comprises a substrate having a first surface and a second surface and an opening extending from the first surface to the second surface, a vibration plate arranged to cover the first surface of the substrate, and a piezoelectric element arranged on the surface of the vibration plate opposite the substrate in a position overlapping with the opening when viewed in a substrate thickness direction from the first surface to the second surface, and the piezoelectric element is configured by stacking a first electrode, a piezoelectric layer, and a second electrode along the substrate thickness direction. This allows the ultrasonic sensor to be made thinner, and the ultrasonic device to be made smaller. In such a small ultrasonic device, the distance between the wireless communication unit and the circuit unit is particularly short, but the influence of noise can be suppressed by providing a shielding unit between the wireless communication unit and the circuit unit. [Explanation of symbols]

[0060] 1,1A...ultrasonic device, 10...housing, 11...lower housing, 12...upper housing, 13...support part (shielding part), 14...housing opening, 15...sensor housing, 20...ultrasonic sensor, 21...element substrate (substrate), 21A...substrate opening (opening), 22...diaphragm, 23...piezoelectric element, 23A...first electrode, 23B...piezoelectric layer, 23C...second electrode, 30...relay substrate, 40,40A...circuit substrate, 41...transmitting circuit, 42...receiving circuit, 43...switching circuit, 44...control circuit, 45...circuit substrate side power supply IC, 46...power supply IC, 50...wireless communication substrate (wireless communication part), 51...wireless module, 52...communication substrate side power supply IC, 53...battery charger, 60...battery (shielding part), 61...conductive cover, 70...external device, 211...first surface, 212...second surface.

Claims

1. an ultrasonic sensor that transmits and receives ultrasonic waves and outputs an ultrasonic signal corresponding to the received ultrasonic waves; a circuit section connected to the ultrasonic sensor, the circuit section processing the ultrasonic signal input from the ultrasonic sensor to generate a reception signal; a wireless communication unit connected to the circuit unit, which converts the received signal into an electromagnetic wave and transmits the electromagnetic wave to an external device; a housing that houses the ultrasonic sensor, the circuit unit, and the wireless communication unit; a shielding unit disposed in the housing between the ultrasonic sensor and the wireless communication unit and configured to block electromagnetic waves; An ultrasound device comprising:

2. The shielding unit is a battery that supplies power to the ultrasonic sensor, the circuit unit, and the wireless communication unit.

10. The ultrasound device of claim 1.

3. The battery is covered with a conductive cover.

3. The ultrasound device of claim 2.

4. a battery for supplying power to the ultrasonic sensor, the circuit unit, and the wireless communication unit; the housing includes a supporting portion that supports the battery and has electrical conductivity; The shielding portion is the support portion.

10. The ultrasound device of claim 1.

5. The support portion is disposed between the circuit portion and the wireless communication portion.

5. The ultrasound device of claim 4.

6. The housing is conductive.

10. The ultrasound device of claim 1.

7. the circuit unit includes a signal generating unit that generates the reception signal from the ultrasonic signal, The signal generating unit is disposed closer to the ultrasonic sensor than the shielding unit.

10. The ultrasound device of claim 1.

8. The ultrasonic sensor includes: a substrate having a first surface and a second surface and including an opening extending from the first surface to the second surface; a diaphragm disposed over the first surface of the substrate; a piezoelectric element disposed on a surface of the vibration plate opposite to the substrate at a position overlapping with the opening when viewed in a substrate thickness direction from the first surface toward the second surface, The piezoelectric element is configured by laminating a first electrode, a piezoelectric layer, and a second electrode along the thickness direction of the substrate.

10. The ultrasound device of claim 1.

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