Liquid crystal display device

Abstract

To provide a highly-durable liquid crystal display device, to provide a liquid crystal display device that is highly durable even with a reduced frame width, to provide a liquid crystal display device which does not allow penetration of water, or to provide a liquid crystal display device with a reduced frame width.SOLUTION: An active matrix liquid crystal display device includes a liquid crystal layer between a counter substrate and an element substrate that are firmly attached to each other with a sealant. The counter substrate is provided with at least a resin layer. An end portion of the resin layer is not exposed to the outside atmosphere. The resin layer and the sealant at least partly overlap with each other in a cross-sectional view of the liquid crystal display device. A moisture impermeable layer is formed between the resin layer and the sealant.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an article, a method, or a manufacturing method. The present invention relates to a method, manufacture, or composition of matter. The present invention relates to, for example, a semiconductor device, a display device, a light emitting device, a driving method thereof, or In particular, the present invention relates to, for example, a liquid crystal display device and a manufacturing method thereof. This relates to electronic devices using the device. [Background technology]

[0002] Liquid crystal display devices for mobile applications such as smartphones and tablets are currently at their peak. Despite the slump in home televisions and other products, some products are selling so well that supply cannot keep up. Unlike home televisions, mobile devices are typically replaced every two to three years. There is always demand for replacement of displays, and they are a lifeline for the display industry in Japan, which is currently in a slump. It is as follows.

[0003] To generate replacement demand, it is essential to develop more sophisticated products. Accordingly, displays have always been required to have higher image quality and narrower bezels.

[0004] A liquid crystal display device is a device in which a liquid crystal material is sealed between a pair of substrates that are bonded together at the periphery with a sealant. In addition, one of the pair of substrates has a color filter and A black matrix is ​​provided, and an active matrix type liquid crystal display device is provided on the other substrate. In this case, a structure in which a driving element is provided is generally used.

[0005] In Patent Document 1, the flattening film on the element substrate side is exposed to the external atmosphere, In order to prevent moisture absorption and water penetration, the end of the flattening film is arranged at a position overlapping the sealing material. It has been disclosed.

[0006] In a liquid crystal display device, a non-display area located outside an effective display area, i.e., a frame area, The requirements for display are becoming ever narrower. Even large displays are only a few mm in size. Some 3D displays have even been announced that are less than 1mm thick.

[0007] The frame area is used for sealing and mounting the driver, but by narrowing the frame However, the amount of space available for these purposes has been greatly reduced.

[0008] The sealing material used for sealing is resin, so although it has low moisture permeability, it is unable to completely absorb water. However, it is not a complete blockage. However, it is possible to provide a certain width for the seal area as in the past. If this can be done, the effects of water from the external atmosphere can be suppressed for a period of time sufficient for use. He was there.

[0009] However, with the recent trend towards narrower picture frames, it is difficult to secure sufficient space for such displays. It is becoming. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] Patent No. 3531048 specification Summary of the Invention [Problem to be solved by the invention]

[0011] In view of the above, an object of one embodiment of the present invention is to provide a liquid crystal display device or the like with high durability. do.

[0012] In one embodiment of the present invention, the durability of a liquid crystal display device having a narrow frame can be improved. Another object of the present invention is to provide a liquid crystal display device or the like having high optical properties. It is an object of the present invention to provide a liquid crystal display device or the like in which the intrusion of light is reduced. In the present invention, it is an object of the present invention to provide a liquid crystal display device having a small frame. In the present embodiment, it is an object of the present invention to provide a novel liquid crystal display device. The description does not preclude the existence of other problems. Note that one embodiment of the present invention is to solve these problems. It is not necessary to solve all of the above problems. Problems other than these can be solved by the specification, drawings, and claims. The invention is self-evident from the description of the claims, etc., and is not limited to the description, drawings, claims, etc. From this, it is possible to extract other issues. [Means for solving the problem]

[0013] One embodiment of the present invention is a liquid crystal display device having a liquid crystal layer between an opposing substrate and an element substrate fixed with a sealant. In an active matrix type liquid crystal display device, at least a resin layer is formed on the opposing substrate. The end of the resin layer is not exposed to the outside atmosphere, and the resin layer and the shield are The adhesive material is a material that has at least a partial overlap when the cross section of the liquid crystal display device is viewed. and a moisture-impermeable layer is formed between the resin layer and the sealing material. It is. Effect of the Invention

[0014] The liquid crystal display device according to one embodiment of the present invention has high durability. [Brief description of the drawings]

[0015] [Figure 1] FIG. [Diagram 2] FIG. 2 is a diagram showing an electrode structure of a liquid crystal element. [Diagram 3] FIG. [Figure 4] FIG. [Diagram 5] FIG. 1 is a diagram showing a liquid crystal display panel (liquid crystal display module). [Figure 6] FIG. [Figure 7] FIG. [Figure 8] FIG. 13 shows the results of an ESD resistance test (voltage applied from the opposing substrate side). [Figure 9] FIG. 13 shows the results of an ESD resistance test (voltage applied from the element substrate side). [Figure 10] FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] An embodiment of the present invention will be described in detail below. However, the present invention is not limited to the following description. The present invention is not limited to the above, and its form may be modified in various ways without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the following description.

[0017] In this specification, a liquid crystal display device refers to a panel in which a display element is sealed. A module in which an IC (integrated circuit) including a controller is mounted on the panel. Furthermore, in the process of manufacturing the liquid crystal display device, a form before the display element is completed is also included. The element substrate corresponds to the above embodiment, and the element substrate has a plurality of means for supplying a current to the display element. Specifically, the element substrate is provided with only the pixel electrodes of the display element. Alternatively, after forming a conductive film to be a pixel electrode, the pixel electrode may be formed by etching. This may be in a state before the electrodes are formed, and any form may be used.

[0018] In addition, the liquid crystal display device in this specification refers to an image display device or a light source (illumination device It can also refer to connectors, such as FPC (Flexible Printed Circuit). connected circuit) or TCP (Tape Carrier Package) A module with a printed wiring board at the end of the TCP, or is a model in which an IC is directly mounted on the display element using the COG (Chip On Glass) method. The module may include or be contained within a liquid crystal display. do.

[0019] Resins used for flattening films in liquid crystal elements are popular due to their transparency and ease of handling. Kryl is often used. Polyimide, benzocyclobutene resin, polyamide, In addition to the organic materials, low-k materials can be used. materials), siloxane resin, PSG (phosphorus glass), BPSG (borophosphorus glass), etc. Such materials are generally known to have high moisture permeability. Therefore, as in the above-mentioned Patent Document 1, the end of the resin layer such as the flattening film is exposed to the outside atmosphere. The proposed configuration is to place the chip in an area surrounded by the sealant or inside the sealant. It has been done.

[0020] The sealing material is a material that has extremely low moisture permeability compared to the above-mentioned normal resins. In the case of a liquid crystal display device with a sufficient frame, by making the sealing material wide, It was possible to prevent the effects of water for a long period of time. However, the narrow frame of the LCD display In the case of equipment, the width of the sealant is not sufficient, making it susceptible to the effects of water. do.

[0021] Therefore, the sealing material is not applied to the planarizing film or black mask that is provided continuously in the effective pixel area. When viewed in cross section, the resin layer is at least partially overlapped with the resin layer such as trix. It is preferable that the width to be bonded by the adhesive material is large. In this case, the cross section is taken to be a cross section cut perpendicular to the display surface.

[0022] (Embodiment 1) Cross-sectional views of the sealing portion of the liquid crystal display device according to the present embodiment are shown in FIGS. In each of Fig. 1(A) to (F), the right side corresponds to the edge of the liquid crystal display device, and the left side corresponds to the edge of the liquid crystal display device. This is the direction toward the inside of the display device.

[0023] In FIG. 1, the opposing substrate 100 and the element substrate 101 are fixed with a sealant 107. A liquid crystal layer 102 is provided in the gap between the element substrate 101 and the counter substrate 100. 100 includes a color filter 103, a black matrix 104, and a planarization film 105 covering them. At least the planarization film 105 is made of resin, and the material is It is mainly made of acrylic and has a moisture permeability 10 times or more that of the seal material 107. Black The matrix 104 may be made of metal or resin. If it is made of resin, it is preferable that the matrix 104 is flat. The black matrix 104 has a water permeability similar to that of the oxide film 105. In the case of resin, as shown in FIG. 1(A), the black matrix 104 and the flattening film 105 are in contact with each other. When the two layers are formed as one resin layer, the two layers can be regarded as one resin layer. Although not shown, an alignment film may be formed in contact with the liquid crystal layer 102.

[0024] In addition, although not shown, the element substrate 101 includes a driving element for driving, a planarizing film, An alignment film or the like may be formed, and these are all referred to as the element substrate 101. The components of the element substrate 101 are not limited to those described above, and any of the above may be used. For example, in the case of a passive matrix liquid crystal display device, The driving element may not be formed, and the alignment film may be omitted, such as a display mode using a blue phase. If the display mode does not require alignment, the alignment film does not need to be formed.

[0025] FIG. 1(A) shows a structure in which the resin layer is partially exposed to the outside atmosphere. The planarization film 105 and the color filter 103 are the same as those in the black matrix 104. When the black matrix 104 is made of resin, the flattening film 105 and the color filter 106 are The filter 103 is combined to form a resin layer.

[0026] In the configuration of FIG. 1(A), the resin layer is partially exposed to the outside atmosphere, so there is comparatively little internal The water diffuses quickly and reaches the liquid crystal layer and the driving element. There is a concern that this may accelerate the deterioration of the display device.

[0027] Therefore, in the configuration of FIG. 1A, a non-transparent layer is used so that the liquid crystal layer 102 and the resin layer are not in contact with each other. The moisture-impermeable layer 106 is formed. The liquid crystal display can be prevented from being affected by water that has penetrated into the lipid layer and reaches the liquid crystal layer and the driving element. It is possible to suppress deterioration of the device. Here, the moisture-impermeable layer is a layer that is used as a sealing material. The layer is made of a material that is less moisture permeable than the material that is used. The higher the better.

[0028] The seal material 107 has a moisture permeability of about one tenth that of the resin layer, and is laminated with the resin layer. By folding the panel, a sufficient width can be ensured even in a liquid crystal display device with a narrow frame. It is possible to maintain the moisture impermeability of the material and to ensure sufficient moisture impermeability during normal use.

[0029] Also, what is represented by the reference numeral 108 in the figure is a liquid crystal display device formed of a transparent conductive film. The electrode 108 may not be formed depending on the driving mode of the liquid crystal. In such a case, the configuration of FIG. 1(A), which is one embodiment of the present invention, is more effective. As described above, the driving mode of a liquid crystal display device in which a common electrode is not formed on the counter substrate 100 is as follows: IPS (In Plane Switching) mode and FFS (Fringe Field Switching) mode, and the configuration shown in Figure 1(A) is suitable for this purpose. do.

[0030] Even when the electrode 108 is formed on the counter substrate 100, the MVA (Multi-domain Alignment) Like the main Vertical Alignment mode, the electrodes 108 are patterned. In the case of a fully-integrated TN (Twisted Nematic) mode, Even if an electrode is formed on the surface, it is necessary to use it for the purpose of degassing and for the purpose of controlling the orientation. If the electrode 108 has a cut or a hole, water may enter the liquid crystal layer 102 and the driving element from the resin layer. This is an environment where people can move around easily, making it suitable for application.

[0031] FIG. 1(B) also has a structure in which a part of the resin layer is exposed to the external atmosphere, similar to FIG. 1(A). FIG. 1B shows a configuration in which the black matrix 104 is made of resin.

[0032] In addition, the outer edge of the flattening film 105 of the resin layer is located inside the edge of the liquid crystal display device. The black matrix 104 is formed on the liquid crystal display device side and covered with a sealant 107. It is configured so that it is formed continuously to the mounting end.

[0033] In a liquid crystal display device having such a configuration, the black matrix exposed to the external atmosphere Water diffuses into the glass 104 and the color filter 103 in contact with it relatively quickly. The end of the flattening film 105 is covered with a sealant 107, so that water does not reach the flattening film 105. It is slower than the matrix 104 and the color filter 103. When the flattening film 105 is in contact with the black matrix 104 or the color filter 103, Water diffuses from there into the planarizing film 105, causing the end of the planarizing film 105 to recede inward. There would be no point in doing so.

[0034] Therefore, in the configuration of FIG. 1(B), the first resin layer (black matrix) exposed to the external atmosphere is The second resin layer (flattening layer 104 and color filter 103) is not exposed to the external atmosphere. A moisture-impermeable layer 106 was provided between the membrane 105 and the film 106 .

[0035] With this structure, water diffuses quickly only through the first resin layer, This leads to suppression of deterioration of the liquid crystal display device.

[0036] Here, the moisture permeability of the sealant 107 is the same as that of the planarizing film 105 and the black matrix 104. It has a moisture permeability of less than one-tenth of that of acrylic, which is used in other materials, but it does not allow water to pass through at all. Therefore, the end of the flattening film 105 is covered with the seal material 107. Even if the width of the seal material 107 is sufficiently set, the seal material 107 and the flattening film 105 do not come into contact with each other. If they overlap, there is a risk that water may penetrate into the planarizing film 105 from the contact portion. The water that penetrates the flattening film 105 is quickly diffused, so the seal of the sealant 107 There is a risk that the water intrusion prevention effect corresponding to the width of the filter will not be obtained.

[0037] For example, a sealant with a moisture permeability 1 / 10 that of the flattening film is placed at the midpoint of the seal width. When the end of the flattening film is located, all the water that reaches the flattening film at the midpoint is sealed. Compared to when it penetrates into the LCD display through the material, it penetrates into the LCD display in about half the time. The calculation results in reaching the

[0038] Therefore, a moisture-impermeable layer is formed in the area where the planarizing film 105 and the sealant 107 overlap. It is preferable that a moisture-impermeable layer is formed between the planarization film 105 and the sealant 107. By forming the above, the path of water intrusion from the seal material 107 to the planarizing film 105 is blocked. Therefore, the designed water suppression effect can be obtained by the width sealed by the seal material 107. You will be able to do this.

[0039] In FIG. 1B, the electrode 108 provided on the counter substrate 100 is replaced with a moisture-impermeable layer 109. In this case, the electrode 108 and the moisture impermeable layer 109 are formed in the same process. This is advantageous in terms of manufacturing costs. In this case, the electrode 108 is made of a transparent material such as an inorganic oxide having low moisture permeability, such as a transparent oxide conductor. It is preferable to use a conductor. Of course, a moisture-impermeable layer 109 may be provided separately from the electrode 108. The moisture impermeable layer 109 may be planarized at least with the seal material 107. It is sufficient that the film 105 is provided in the overlapping portion.

[0040] The configuration of FIG. 1C shows a case where the black matrix 104 is made of resin and a case where the black matrix 104 is made of metal. In the case where the black matrix 104 is made of resin, the water diffusion state is different. The resin layer (the color filter 103, the black matrix 104, and the planarization film 105) is partially This structure is exposed to the outside atmosphere. Therefore, there is no opaque space between the liquid crystal layer 102 and the resin layer. The formation of the moist layer 106 prevents water from entering the liquid crystal layer 102 and the driving elements. In addition, the end of the planarization film 105 is formed inside the end of the substrate. The surface of the planarizing film 105 is covered with a sealant 107. 07, but is not in direct contact with it, and a moisture-impermeable layer 106 is formed between them. Therefore, the intrusion of water from the seal material 107 into the planarizing film 105 is also suppressed. It is possible to obtain a water suppression effect corresponding to the formed width.

[0041] When the black matrix 104 is made of metal, the moisture impermeable layer 106 is not formed. However, the resin layer (the color filter 103 and the planarizing film 105) is isolated from the outside atmosphere. Therefore, it is less susceptible to the effects of external water and can more effectively prevent deterioration. In addition, the planarization film 105 overlaps the sealant 107 but is not in direct contact with it. First, since the moisture-impermeable layer 106 is formed between the sealing material 107 and the planarizing film 1, The intrusion of water into the sealing member 107 is also suppressed, and the water suppression effect is equivalent to the width of the sealing member 107. In this configuration, the moisture impermeable layer 106 is at least It is sufficient that the insulating film 104 is present between the insulating material 107 and the planarizing film 105 .

[0042] In either case, the black matrix 104 is made of metal or resin. If the electrode 108 is not formed, the resin layer may be infiltrated. Since the device is easily affected by water entering the device, this configuration can be more suitably applied. Even if the electrode 108 is formed, there may be holes, cuts, or slits, or the electrode 108 may not be completely flat. In the case where a turn is formed, the surface on which the electrode 108 is formed (in this figure, For the same reason, when the moisture-impermeable layer 106 is in contact with the liquid crystal layer 102, As a driving method for a liquid crystal display device in which the electrode 108 is not formed, the FFS method is preferably used. The driving method in which the electrode 108 is patterned is the MVA mode. In addition, holes, slits, or cuts are formed in the electrode 108 for the purpose of venting gas, etc. In some cases, this is also the case.

[0043] The liquid crystal display device having the configurations shown in FIGS. 1A to 1C has a black matrix. Since the insulating film 104 is formed up to the edge of the substrate of the liquid crystal display device, the backing 104 is formed around the substrate. It also suppresses light leakage from the screen and the intrusion of external light, making it ideal for LCD displays with narrow frames. This makes it possible to provide high-quality images that are less susceptible to light leakage and external light even in a large-area display.

[0044] FIG. 1D shows the outer periphery of the black matrix 104 and the flattening film 105, which are resin layers. The side ends are both positioned inside the ends of the substrate of the liquid crystal display device. The black matrix 104 and the flattening film 105 are arranged on the outer periphery side of the outer edge. Since the sealing material 107 is present between the substrate 101 and the outside atmosphere, the substrate 101 is isolated from the outside atmosphere.

[0045] In addition, between the black matrix 104, which is a resin layer, and the sealant 107, a moisture-impermeable The layer 106 prevents water from entering the substrate. By forming a moisture-impermeable layer 109 between the sealing material 10 and the This structure allows the suppression of the influence of water to be achieved corresponding to the width of the formed 7. In D), a moisture impermeable layer 109 is formed between the flattening film 105 and the sealant 107. In this example, the electrode 108 is made of the same material as that of the electrode 108. This makes it possible to form the moisture impermeable layer 109 simultaneously with the electrode 108. This reduces the number of manufacturing steps, which is advantageous in terms of costs.

[0046] In this way, when the moisture impermeable layer 109 is formed at the same time as the electrode 108, the electrode 108 It is preferable that the insulating layer is made of a transparent oxide conductor having low moisture permeability, such as ITO. Of course, the moisture impermeable layer 109 may be formed separately from the electrode 108. Regarding material 8, it is not necessary to use a material with low moisture permeability.

[0047] The electrode 108 may or may not be formed. If the resin layer is not provided with a resin layer, the resin layer is easily affected by water. Even if the electrode 108 is formed, there are no holes, cuts, or slips. The electrode 108 is formed, for example, a conductor is present, the electrode 108 is patterned, etc. In the case where the liquid crystal layer 102 is in contact with the surface (in this figure, the planarizing film 105), Since the resin layer is easily affected by water, the application of the above-mentioned method is suitable.

[0048] In addition, the end of the black matrix 104 is closer to the substrate than the end of the liquid crystal display device. The inside configuration is more susceptible to electrostatic discharge (ESD). This improves resistance to ischarge, resulting in more reliable and durable LCD displays. It becomes possible to do so.

[0049] The configuration of FIG. 1(E) is a planarization film formed on the outer edge of the black matrix 104, which is a resin layer. The outer ends of the electrodes 105 are both formed inside the ends of the substrate. In addition, the outer edge of the black matrix 104 is formed inside the outer edge of the flattening film 105. The outer edge of the seal material 107 is located on the outer periphery side of the substrate from the outer edge of the flattening film 105. The side end is located, and the inner end of the sealant 107 is located closer to the inside of the substrate than the outer end of the planarizing film 105. The planarizing film 105 and the sealant 107 are partially overlapped with each other. A moisture impermeable layer 109 is formed in the area where the sealing material 105 and the sealing material 107 overlap. This prevents water from penetrating from the molding material 107 into the resin layer.

[0050] In the liquid crystal display device having the above-mentioned configuration, a relatively high moisture permeability resin layer is provided on the outside of the resin layer. Since the seal material 107 having a relatively low moisture permeability is located, it is possible to prevent water from entering. In addition, the moisture-impermeable layer 109 is located between the seal material 107 and the resin layer. The intrusion of water from the sealing material 107 into the resin layer is suppressed, and the width of the sealing material 107 is equivalent to the width of the resin layer. This configuration makes it easy to obtain the effect of suppressing the intrusion of water.

[0051] In addition, the end of the black matrix 104 is closer to the substrate than the end of the liquid crystal display device. The internal configuration provides better immunity to electrostatic discharge (ESD) and therefore more reliable. This makes it possible to provide a highly reliable and durable liquid crystal display device.

[0052] In FIG. 1E, the moisture impermeable layer 109 is disposed between the electrode 108 formed on the counter substrate 100. In this way, the electrode 108 and the moisture impermeable layer are formed in the same process as in FIG. By forming the 109 in the same process, costs can be reduced, and it is possible to form each separately. In this case, the material of the electrode 108 is a water-permeable material having a low moisture permeability. It is preferable to use a transparent oxide conductor.

[0053] The electrode 108 and the moisture impermeable layer 109 may be formed in different steps. The moisture-impermeable layer 109 may be made of any material as long as it has low moisture permeability. It does not matter if the electrode 108 is a transparent conductive film, and there is no need to use a material with low moisture permeability. do not have.

[0054] The electrode 108 may or may not be formed. If the resin layer is not provided with a resin layer, the resin layer is easily affected by water. Even if the electrode 108 is formed, there are no holes, cuts, or slips. The electrode 108 is formed, such as a metal layer is present, the electrode 108 is patterned, etc. In the case where the liquid crystal layer 102 is in contact with the flattened surface (in this figure, the flattened film 105), However, since the resin layer is easily affected by water infiltration, the application of the resin layer is suitable.

[0055] In addition, the end of the black matrix 104 is closer to the substrate than the end of the liquid crystal display device. The internal configuration provides better immunity to electrostatic discharge (ESD) and therefore more reliable. This makes it possible to provide a highly reliable and durable liquid crystal display device.

[0056] The contribution to improved ESD resistance is that the edge of the black matrix is The structure is as shown in Fig. 10(A) and (B). This improves ESD resistance even when

[0057] FIG. 1(F) shows a structure almost identical to that of FIG. 1(E), but the outer end of the moisture-impermeable layer 109 is The sealing material 107 is formed on the inner side of the edge of the substrate, and the sealing material 107 is also in contact with the counter substrate 100. The sealing material 107 is also in contact with the counter substrate 100, which provides a better This is a preferable configuration since it is possible to obtain a sealing effect.

[0058] In the liquid crystal display device having the configurations shown in FIG. 1(D) to FIG. 1(F), Since the substrate 104 is not formed to the edge of the substrate, light leakage from the backlight and external light Therefore, liquid crystal display devices having these configurations may cause inconvenience. The seal material 107 in the above position is preferably colored in a dark color. This can be achieved by mixing or dispersing the powder in the sealing material 107 .

[0059] FIG. 2 shows a schematic diagram of the electrode arrangement for each display method of the liquid crystal display device. , an element substrate 151, a liquid crystal layer 152, an electrode 158 on the opposing substrate side, an electrode 160 on the element substrate side, etc. In FIG. 1, the element substrate 101 includes the element substrate including the electrodes on the element substrate side. 2, the electrode 160 on the element substrate side is the element substrate 101. Although not shown, the electrodes 158 and 160 and the liquid crystal An alignment film may be formed between the layer 152 and the counter substrate 100. In the previous example, the substrate itself was shown, on which layers such as a resin layer and a moisture-impermeable layer were formed. 1. The opposing substrate 150 is shown for the purposes of illustration only.

[0060] Figure 2(A) shows the TN (Twisted Nematic) and VA (Vertical Arrow) modes. FIG. 1 is a schematic diagram of the electrode arrangement in a liquid crystal alignment mode (vertical alignment mode). The electrode 158 on the opposing substrate side is not patterned, but in this case too, it is used for the purpose of degassing, etc. In such a case, holes, cuts, slits, etc. may be formed. The configuration described above can be suitably applied. Of course, even if holes or the like are intentionally formed, Even without such a configuration, a highly durable liquid crystal display device can be obtained by applying the configuration described in this embodiment. can be obtained.

[0061] Figure 2(B) shows the MVA mode (Multi-domain Vertical Alignment). FIG. 1 is a schematic diagram of the electrode arrangement in a multi-domain vertical alignment mode. The electrode 158 on the plate side is patterned, and the liquid crystal layer 152 is in contact with the surface on which the electrode 158 is formed. The liquid crystal display device of this embodiment having such a configuration includes: The configuration described in the above embodiment can be suitably applied.

[0062] Figure 2(C) shows the IPS mode (In-Plane Switching mode, Impression This is a schematic diagram of the electrode arrangement in the in-scan switching mode. The electrode 158 on the substrate side is not formed, and the electrode 160 on the element substrate 151 side and the electrode 160 on the element substrate 1 The liquid crystal is driven by a horizontal electric field generated between the electrodes 161 on the side of the liquid crystal display panel 51. In the liquid crystal display device of this display mode, water is blocked by the electrode 158 on the counter substrate 150 side. Therefore, the configurations described in this embodiment are very preferably applied. can.

[0063] Figure 2(D) shows the FFS mode (fringe field switching mode, This is a schematic diagram of the electrode arrangement in the fringe field switching mode. In this example, the electrode 158 on the opposing substrate side is not formed, and the electrode 160 on the element substrate 151 side is Similarly, an electrode 160 is formed on the element substrate 151 side with an insulating film 162 interposed therebetween. The liquid crystal is driven by the fringe electric field produced by shortening the electrode width. In the liquid crystal display device of this display mode having such a configuration, the electrode 158 on the counter substrate 150 side Since the water blocking effect cannot be expected, the configurations described in this embodiment are very suitable. It can be used.

[0064] Figure 2(E) shows the ASV mode (Advanced Super View mode, ADV mode). This is a schematic diagram of the electrode arrangement in the Inst Super View mode. Since the electrode 158 on the plate 150 side is patterned, the configuration described in this embodiment It can be suitably applied.

[0065] In FIG. 3, an electrode 158 is formed on the counter substrate 150 side as in FIG. 2(C) and FIG. 2(D). Some of the aspects of the present invention in the IPS mode and FFS mode, which are not included in the present invention, are shown in FIG. In the element substrate 101, the driving elements and the electrodes on the element substrate side (electrodes 160 and 16 1) and an alignment film. Each element substrate 101 has a display mode corresponding to the display mode. It is assumed that an electrode 160 and an electrode 161 are formed.

[0066] Fig. 3(A) corresponds to Fig. 1(A). In this way, the resin layer exposed to the external atmosphere (color filter 103, black matrix 104 and flattening film 105) and liquid crystal layer 10 2, a moisture-impermeable layer 106 is formed between the resin layer and the liquid crystal layer 10. It is possible to suppress the intrusion of water into the sealing material 2 and to suppress the adverse effects of water. Since the moisture-impermeable layer 106 is formed between the sealing material 107 and the resin layer, Therefore, it is possible to reliably obtain the sealing performance expected from the performance of the sealing material and the width of the sealing material formed.

[0067] Fig. 3(B) corresponds to Fig. 1(B). In Fig. 3(B), the resin layer is exposed to the external atmosphere. (color filter 103 and black matrix 104) and the liquid crystal layer 1 The outer end portion provided on the 02 side is formed inside the substrate end portion and is exposed to the external atmosphere. In the figure, a moisture-impermeable layer 106 is formed between the resin layer (flattening film 105) and the non-permeable resin layer. With this structure, water is absorbed relatively quickly into the resin layer exposed to the external atmosphere. However, the water can be prevented from penetrating into the flattening film 105 which is closer to the liquid crystal layer. This makes it possible to prevent water from adversely affecting the liquid crystal layer 102 and the driving elements.

[0068] The outer end of the flattening film 105 is covered with a seal material 107. In the area where the planarizing film 105 and the sealant 107 overlap, a moisture-impermeable layer 109 is provided between them. With this configuration, the sealing material 107 and the planarizing film 105 are Therefore, it is possible to suppress the intrusion of water into the sealing material 107 from the moisture permeability and the seal width. It is possible to obtain the expected sealing performance without impairing it. The sealing material 107 and the planarizing film 105 are provided only in the overlapping portion of the sealing material 107. The moisture-permeable layer 109 may be formed on the entire surface. If the semiconductor device is made of a thin film, the manufacturing process is simplified since processes such as patterning and etching are not required. On the other hand, as shown in FIG. 3B, the moisture impermeable layer 109 in the effective display area is removed. This suppresses the deterioration of display quality due to the refractive index or coloring of the moisture-impermeable layer 109. can be done.

[0069] FIG. 3C corresponds to FIG. 1C. In FIG. 3C, the resin layer (color filter 103 , black matrix 104, and flattening film 105) (only black matrix 104) The outer end of the flattening film 105 is exposed to the outside atmosphere. The resin layer is formed on the inner side of the liquid crystal layer 102 and between the resin layer and the seal material 107. A moisture impermeable layer 106 is formed between the resin layer and the outside atmosphere. Since only the black matrix 104 is used, the intrusion of water from the outside atmosphere is minimized. In addition, the black matrix 104 is formed up to the edge of the substrate. This prevents backlight leakage and deterioration of display quality caused by external light intrusion. It is possible.

[0070] FIG. 3(D) corresponds to FIG. 1(D). In FIG. 3(D), the resin layer (color filter 103, The ends of the black matrix 104 and the flattening film 105 are formed inside the outer periphery of the substrate. Since the sealing material 107 is present on the outside, the sealing material 107 is not exposed to the outside atmosphere. The structure is resistant to the effects of water. A moisture-impermeable layer 106 is formed in the overlapping portion, and moisture-impermeable water is prevented from penetrating from the seal material 107 into the resin layer. The moisture impermeable layer 106 is composed almost entirely of the seal material 107 and the resin layer. The moisture impermeable layer 106 is provided only in the overlapping portion, but it may be formed on the entire surface. When the moisture-impermeable layer 106 is formed on the entire surface, it is possible to perform patterning, etching, etc. Since the above steps are not required, the manufacturing process can be simplified. By removing the moisture impermeable layer 106 in the display area, the difference in refractive index of the moisture impermeable layer 106 and the It is possible to suppress deterioration of display quality due to color, etc.

[0071] After the planarization film 105 is formed, the moisture impermeable layer 106 is formed on the end of the planarization film 105. The black matrix 104 is formed so as to cover the end of the black matrix 104 at the same time. The moisture-impermeable layer covering the end of the substrate 104 and the moisture-impermeable layer covering the planarizing film 105 are formed separately. Of course, it is okay to form it.

[0072] In the configuration shown in FIG. 3(D), the black matrix 104 is formed up to the edge of the substrate. Therefore, in LCD displays with narrow frames, there are problems such as light leakage from the backlight and There is a risk that the display quality may be deteriorated due to the intrusion of external light. By mixing dyes and pigments, the material can be colored in dark colors to reduce light leakage and the effects of external light. , it becomes possible to maintain the display quality.

[0073] FIG. 3(E) corresponds to FIG. 1(E). In FIG. 3(E), the resin layer (color filter 103 The ends of the black matrix 104 and the flattening film 105 are formed inside the outer periphery of the substrate. Since the sealing material 107 is present on the outside, the heat exchanger 104 is not exposed to the outside atmosphere. The structure is resistant to the influence of water. A moisture-impermeable layer 106 is formed in the overlapping portion, and the moisture-impermeable layer 106 prevents the moisture from penetrating from the seal material 107 into the resin layer. In the configuration of FIG. 3(E), the outside of the black matrix 104 is covered with a thin film. The side edge is located inside the outer edge of the flattening film 105, and the black matrix 1 The substrate 04 is covered with a planarizing film 105. The moisture impermeable layer 106 is The moisture impermeable layer 106 is provided only in the area where the seal material 107 and the resin layer overlap. In the case where the moisture impermeable layer 106 is formed on the entire surface, Since processes such as turning and etching are not required, the manufacturing process can be simplified. As shown in FIG. 3E, the moisture-impermeable layer 106 in the effective display area is removed to form a moisture-impermeable This makes it possible to suppress deterioration of display quality due to the refractive index or coloring of the layer 106, and the like.

[0074] In the configuration shown in FIG. 3(E), the black matrix 104 is formed up to the edge of the substrate. Therefore, in LCD displays with narrow frames, there are problems such as light leakage from the backlight and There is a risk that the display quality may be deteriorated due to the intrusion of external light. By mixing dyes and pigments, the material can be colored in dark colors to reduce light leakage and the effects of external light. , it becomes possible to maintain the display quality.

[0075] In addition, in FIG. 3(D) to (E), the end portion of the black matrix 104 is The structure is located inside the edge of the board, which improves resistance to electrostatic discharge (ESD). This makes it possible to provide a liquid crystal display device with even higher reliability and durability.

[0076] The thickness of the sealing material 107 is 0.2 mm or more and 1.5 mm or less, preferably 0.4 mm or more and 1.5 mm or less. By having a width of less than 1 mm, the liquid crystal display device having the configuration described in this embodiment has a narrow frame. It is possible to maintain sufficient sealing performance for a required period while maintaining the sealing performance.

[0077] In the present embodiment, the moisture-impermeable layer is at least more moisture-impermeable than the sealing material used. This refers to a material with low moisture permeability, and may be formed as a single layer or may have a laminated structure. Preferred materials include silicon nitride, silicon oxynitride, aluminum nitride, and silicon oxide. Transparent oxide conductors can also be used. When a transparent oxide conductor is used, the moisture impermeable layer and the electrode on the opposing substrate side are formed simultaneously. As the transparent oxide conductor, indium tin oxide (IT O), a conductive material made by mixing indium oxide with zinc oxide (ZnO), Conductive materials mixed with silicon (SiO2), organic indium, organic tin, and tungsten oxide Indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, titanium oxide Examples include indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, and graphene. The sheet resistance is 10,000 Ω / □ or less, and the light transmittance at a wavelength of 550 nm is 70% or more. It is preferable that

[0078] The electrodes 108, 160, and 161 correspond to pixel electrodes and common electrodes. In the case of a liquid crystal display device, the pixel electrode layer, the common electrode layer, and the element substrate, which are present in the pixel region through which light passes, The substrate, opposing substrate, other insulating films, conductive films, etc. are transparent to light in the visible light wavelength range. Liquid crystal display devices with a structure in which an electric field is applied in the lateral direction, such as IPS mode and FFS mode, In the above, it is preferable that the pixel electrode layer and the common electrode layer are transparent, but the opening pattern is relatively large. In the case of a liquid crystal display device having a structure having a metal film or other non-transparent material, depending on the shape, In this specification, the term "translucent" refers to the property of transmitting light at least in the visible light wavelength range. say.

[0079] On the other hand, in the case of a reflective liquid crystal display device, the liquid crystal composition is disposed on the opposite side to the viewing side. A reflective member (such as a reflective film or substrate) that reflects light that has passed through the light source may be provided. Therefore, the light-transmitting substrate, insulating film, and conductive film provided from the viewing side to the reflective member are The liquid crystal display device is transparent to light in the visible wavelength range. In the present embodiment, the pixel electrode layer or the common electrode layer on the opposite side to the viewing side is made reflective, and the reflective member It can be used as such.

[0080] The pixel electrode layer and the common electrode layer are made of indium tin oxide (ITO), indium oxide plus zinc oxide. Conductive material mixed with lead (ZnO), indium oxide mixed with silicon oxide (SiO2) Conductive materials, organoindium, organotin, indium oxides including tungsten oxide, acid Indium zinc oxide with tungsten oxide, indium oxide with titanium oxide, Indium tin oxide containing titanium, graphene, or tungsten (W), molybdenum ( Mo), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb ), Tantalum (Ta), Chromium (Cr), Cobalt (Co), Nickel (Ni), Titanium (Ti), platinum (Pt), aluminum (Al), copper (Cu), silver (Ag) and other metals, can be formed by using one or more of the alloys or metal nitrides. In addition, it can be formed using a conductive composition containing a conductive macromolecule (also called a conductive polymer). As the conductive polymer, a so-called π-electron conjugated conductive polymer is used. For example, polyaniline or its derivatives, polypyrrole or its derivatives, , polythiophene or a derivative thereof, or a copolymer of two or more of these. The sheet resistance is 10,000 Ω / □ or less, and the light transmittance at a wavelength of 550 nm is 70% or more. It is preferable that the resistivity of the conductive polymer contained in the conductive composition is 0.1 Ω·c As described above, in selecting the electrode material, the liquid crystal Depending on the display format of the display device, materials and configurations with translucency and materials and configurations with reflectivity are selected. Choose appropriately.

[0081] The element substrates 101 and 151 and the opposing substrates 100 and 150 are made of barium borosilicate glass or aluminum. Glass substrates such as lumino borosilicate glass, quartz substrates, plastic substrates, etc. can be used. In the case of a reflective liquid crystal display device, the substrate on the opposite side to the viewing side is made of aluminum. Alternatively, a metal substrate such as a rubber substrate or a stainless steel substrate may be used.

[0082] In addition, optical films such as a polarizing plate, a retardation plate, and an anti-reflection film may be provided as appropriate. In addition, a backlight or the like can be used as the light source.

[0083] The configurations, methods, etc. described in this embodiment may be the same as those described in other embodiments. can be used in appropriate combination.

[0084] (Embodiment 2) As a liquid crystal display device according to one embodiment of the present invention, a passive matrix type liquid crystal display device, In this embodiment, the present invention provides an active matrix type liquid crystal display device. An example of an active matrix liquid crystal display device according to one embodiment will be described with reference to FIG.

[0085] FIG. 4(A) is a plan view of a liquid crystal display device, showing two pixels. FIG. 4(B) shows 4(A) is a cross-sectional view taken along line X1-X2 of FIG.

[0086] In FIG. 4A, the multiple wirings 405a are parallel to each other (extending in the vertical direction in the figure) and The wiring 405a functions as a source wiring. The wiring layer 405b is provided by the same conductive layer as the wiring 405a. They extend in a direction (left and right direction in the drawing) roughly perpendicular to the line 405a and are arranged apart from each other. The wiring 401 functions as a gate wiring. The first electrode layer 447 is disposed in a substantially rectangular area. The transistor 420 that drives the pixel electrode is connected to the wiring 40 in the figure. The pixel 5a is disposed in the upper right corner of a roughly rectangular area surrounded by the wiring 401. A plurality of electrodes and transistors are arranged in a matrix.

[0087] In the liquid crystal display device of FIG. 4, a transistor 420 is connected through a contact hole 421. The first electrode layer 447 electrically connected to the first electrode layer 447 functions as a pixel electrode. The second electrode layer 446 overlapping the insulating film 408 functions as a common electrode. A common potential is applied.

[0088] The arrangement of the electrodes is not particularly limited, but a fringe potential such as that in the FFS mode shown in FIG. A method can be used to generate a field to move the liquid crystal molecules and control the gradation. A driving method using the electrode structure as shown in FIG. 2 can be appropriately applied.

[0089] The liquid crystal composition used in the liquid crystal layer is appropriately selected according to the driving method. This can be done.

[0090] Since the second electrode layer 446 has an opening pattern, In the cross-sectional view, the electrode layers are shown as being separated. The same is true for surfaces.

[0091] The structure of a transistor applicable to the liquid crystal display device disclosed in the present specification is not particularly limited, and For example, a staggered type or planar type with a top gate structure or a bottom gate structure is used. In addition, the transistor can be a single gate transistor in which one channel forming region is formed. The structure is either a double gate structure with two gates or a triple gate structure with three gates. Alternatively, a multi-gate structure may be used, such as a gate insulating layer above and below the channel region. It may be of a dual gate type having two gate electrode layers arranged side by side.

[0092] In FIG. 4, the transistor 420 is an inverted staggered thin film transistor. 420 is formed on a first substrate 441 having an insulating surface, and a gate electrode 401 a, a gate insulating layer 402, a semiconductor layer 403, which functions as a source electrode or a drain electrode The wiring layer 405b is also included. An insulating film 407 is laminated to cover the transistor 420. The insulating film 407 may be a laminated layer or a single layer.

[0093] A first substrate 441 and a second substrate (not shown) serving as an opposing substrate are sandwiched with a liquid crystal layer therebetween. The structure around the sealing material is the same as that described in the first embodiment. The liquid crystal layer is formed by a dispenser method (dropping method) or a first After bonding the substrate 441 and the second substrate together, a liquid crystal composition is injected using capillary action or the like. Injection techniques such as

[0094] As the sealing material, typically, a visible light curing, ultraviolet light curing or heat curing resin is used. Typically, acrylic resin, epoxy resin, amine resin, etc. are used. In addition, photopolymerization initiators (typically ultraviolet rays), heat curing agents, fillers, coupling agents, etc. If the black matrix is ​​not formed to the edge of the substrate, It is preferable to mix a dye or pigment into the sealing material to color it a deep color.

[0095] When a photocurable resin such as ultraviolet light is used as a sealant and a liquid crystal composition is formed by a dropping method, The sealing material may also be cured by the light irradiation step of the polymer stabilization treatment.

[0096] In this embodiment, a polarizing plate is provided on the outer side of the first substrate 441, and a polarizing plate is provided on the outer side of the second substrate (opposite substrate). A polarizing plate may be provided on the side of the polarizing plate. In addition to the polarizing plate, optical filters such as a retardation plate and an anti-reflection film may also be used. For example, circular polarization using a polarizing plate and a retardation plate may be used. Through these steps, a liquid crystal display device can be completed.

[0097] In addition, when multiple liquid crystal display devices are manufactured using a large substrate (so-called multiple panel manufacturing), The dividing step can be carried out before the polymer stabilization treatment or before the provision of the polarizing plate. Consider the effect of the process on the liquid crystal composition (such as alignment disturbance caused by the force applied during the cutting process) Then, after bonding the first substrate and the second substrate and before the polymer stabilization treatment, preferable.

[0098] Although not shown, a backlight, a sidelight, or the like may be used as the light source. Illumination is transmitted from the first substrate 441 side, which is the element substrate, to the second substrate, which is the viewing side. Be shot.

[0099] The first electrode layer 447 and the second electrode layer 446 are the same as those of the electrode 108 in the first embodiment. The same materials as those listed above can be used. In selecting the materials, As mentioned above, the material has a light-transmitting property according to the display format of the liquid crystal display device or liquid crystal display module. The material and structure, and the material and structure having reflectivity are appropriately selected.

[0100] An insulating film serving as a base film may be provided between the first substrate 441 and the wiring 401. It has a function of preventing diffusion of impurity elements from the first substrate 441. One or more films selected from a silicon film, a silicon nitride oxide film, and a silicon oxynitride film The wiring 401 can be formed of a single layer or a multilayer structure. Titanium, Chromium, Tantalum, Tungsten, Aluminum, Copper, Neodymium, Scandium It is formed in a single layer or multilayer using metal materials such as aluminum or alloy materials that contain these as the main components. In addition, the wiring 401 can be formed by doping a polycrystalline silicon film with an impurity element such as phosphorus. A semiconductor film such as a silicon film, or a silicide film such as nickel silicide may be used. When a conductive film having a light-shielding property is used for the wiring 401, the light from the backlight (the first substrate It is possible to prevent light (light incident from 441 ) from entering the semiconductor layer 403 .

[0101] The gate insulating layer 402 is formed by depositing silicon oxide using a plasma CVD method, a sputtering method, or the like. Kon film, gallium oxide film, aluminum oxide film, silicon nitride film, silicon oxynitride film, The insulating film can be formed using an aluminum oxynitride film, a silicon nitride oxide film, or the like. The material of the gate insulating layer 402 is hafnium oxide, yttrium oxide, lanthanum oxide, Hafnium silicate, hafnium aluminate, nitrogen doped hafnium silicate Alternatively, high-k materials such as hafnium aluminate doped with nitrogen may be used. The use of these high-k materials can reduce gate leakage current.

[0102] The material used for the semiconductor layer 403 is not particularly limited, and may be any material having the characteristics required for the transistor 420. Examples of materials that can be used for the semiconductor layer 403 will be described below. .

[0103] The semiconductor layer 403 is formed of a semiconductor material such as silane or germanium. Amorphous semiconductors are produced by vapor phase growth using a quartz crystal or by sputtering. ) Semiconductors, polycrystals obtained by crystallizing the amorphous semiconductors using light energy or thermal energy A crystalline semiconductor, a microcrystalline semiconductor, or the like can be used for the semiconductor layer. The film can be formed by a method such as LPCVD or plasma CVD.

[0104] Representative examples of amorphous semiconductors include hydrogenated amorphous silicon and crystalline semiconductors. A typical example is polysilicon. Polysilicon (polycrystalline silicon) The so-called high-temperature polysilicon formed through a process temperature of 800°C or higher, and the Low-temperature polysilicon, which is formed at a lower process temperature, and elements that promote crystallization, It includes polysilicon, which is made by crystallizing amorphous silicon using a As described above, a microcrystalline semiconductor or a semiconductor having a crystalline phase in a part of the semiconductor layer can also be used. do.

[0105] Alternatively, an oxide semiconductor may be used. Examples of the oxide semiconductor include indium oxide and sulphur oxide. Zinc oxide, and binary metal oxides such as In-Zn oxide, Sn-Zn oxide, Al-Zn oxide, Zn-Mg oxide, Sn-Mg oxide, In-Mg oxide, In-Ga-based oxides, In-Ga-Zn-based oxides (IGZO and (also written as In-Al-Zn oxide, In-Sn-Zn oxide, Sn-Ga-Z n-based oxides, Al-Ga-Zn-based oxides, Sn-Al-Zn-based oxides, In-Hf-Zn In-La-Zn oxide, In-Ce-Zn oxide, In-Pr-Zn oxide Oxide, In-Nd-Zn oxide, In-Sm-Zn oxide, In-Eu-Zn oxide oxides, In-Gd-Zn oxides, In-Tb-Zn oxides, In-Dy-Zn oxides In-Ho-Zn oxides, In-Er-Zn oxides, In-Tm-Zn oxides , In-Yb-Zn oxides, In-Lu-Zn ​​oxides, and oxides of quaternary metals. n-Sn-Ga-Zn oxide, In-Hf-Ga-Zn oxide, In-Al-Ga- Zn-based oxide, In-Sn-Al-Zn-based oxide, In-Sn-Hf-Zn-based oxide, I The n-Hf-Al-Zn oxide can be used. Elements other than Ga, Sn and Zn, for example SiO2, may be included.

[0106] Here, for example, the In-Ga-Zn-O-based oxide semiconductor is a semiconductor containing indium (In), gallium (Ga), and zinc (Zn) in a Zn-O-based oxide semiconductor. It means an oxide semiconductor containing Ga and Zn, and the composition is not important. I don't.

[0107] The oxide semiconductor film may be, for example, non-single-crystal. C Axis Aligned Crystal), polycrystalline, microcrystalline, and amorphous parts The amorphous part has a higher defect level density than the microcrystals and CAAC. The density of defect states is higher than that of the oxide semiconductor having CAAC. C Axis Aligned Crystalline Oxide Semicon The ductor is called a

[0108] The oxide semiconductor film may include, for example, a CAAC-OS. , the c-axis is oriented, and the a-axis and / or b-axis are not macroscopically aligned.

[0109] The oxide semiconductor film may include, for example, microcrystals. The microcrystalline oxide semiconductor film has a thickness of, for example, 1 nm to 10 nm. The film contains microcrystals (also called nanocrystals) smaller than 1 nm in size.

[0110] The oxide semiconductor film may have, for example, an amorphous portion. A conductor such as an amorphous oxide semiconductor is called an amorphous oxide semiconductor. Alternatively, the amorphous oxide semiconductor film is, for example, completely amorphous. It is a solid substance and does not have crystalline parts.

[0111] Note that the oxide semiconductor film may be a CAAC-OS film, a microcrystalline oxide semiconductor film, or an amorphous oxide semiconductor film. The mixed film may be, for example, a region of an amorphous oxide semiconductor and a region of a microcrystalline oxide semiconductor. The mixed film has a region of a crystalline semiconductor and a region of a CAAC-OS. The product of the crystallographic oxide semiconductor region, the microcrystalline oxide semiconductor region, and the CAAC-OS region is It may have a layered structure.

[0112] Note that the oxide semiconductor film may be, for example, single crystal.

[0113] The oxide semiconductor film has a plurality of crystal parts, and the c-axes of the crystal parts are aligned along a normal vector Alternatively, it is preferable that the directions are aligned parallel to the normal vector of the surface. The directions of the a-axis and the b-axis may be different between the portions. An example of a membrane is a CAAC-OS membrane.

[0114] The crystals in the CAAC-OS film are small enough to fit inside a cube with one side less than 100 nm. In addition, the transmission electron microscope (TEM) The CAAC-OS film was observed under a CT microscope. The boundaries between the crystalline regions are not clear. No clear grain boundaries can be identified. The OS film suppresses the decrease in electron mobility caused by grain boundaries.

[0115] The crystal parts included in the CAAC-OS film have, for example, a c-axis that is aligned with the surface on which the CAAC-OS film is formed. The direction is parallel to the normal vector or the surface normal vector, and perpendicular to the ab plane. When viewed from a direction perpendicular to the c-axis, the metal atoms are arranged in a triangular or hexagonal shape. In the crystal structure, metal atoms are arranged in layers, or metal atoms and oxygen atoms are arranged in layers. The directions of the a-axis and the b-axis may be different between the portions. When describing it as vertical, it is in the range of 80° to 100°, preferably 85° to 95°. In addition, when simply describing it as parallel, it means -10° or more and 10° or less, and preferably Or the range from -5° to 5° is also included.

[0116] In the CAAC-OS film, the distribution of the crystal parts may not be uniform. In the process of forming the AC-OS film, when crystal growth is performed from the surface side of the oxide semiconductor film, The proportion of crystalline parts may be higher near the surface than near the formation surface. By adding impurities to the AAC-OS film, the crystallization of the crystals in the impurity-added region is suppressed. The crystallinity may also decrease.

[0117] The c-axis of the crystal part in the CAAC-OS film is the normal vector of the surface on which the CAAC-OS film is formed. The CAAC-OS film is aligned parallel to the torus or surface normal vector. Depending on the shape (cross-sectional shape of the surface to be formed or cross-sectional shape of the surface), the directions may differ from each other. In addition, the crystallization process such as heat treatment is performed when or after the film is formed. Therefore, the c-axis of the crystal part is The vectors are aligned so that they are parallel to the normal vector of the surface on which the light is formed or the normal vector of the surface.

[0118] The electrical characteristics of transistors using CAAC-OS films change when irradiated with visible or ultraviolet light. Therefore, the transistor has high reliability.

[0119] The oxide semiconductor layer may be made up of multiple layers. In the following, an oxide semiconductor layer having a three-layer structure will be described. The laminated structure does not have to be three layers.

[0120] The first oxide semiconductor layer and the third oxide semiconductor layer are the same as the second oxide semiconductor layer. The second layer is an oxide semiconductor layer containing one or more elements. This can make it difficult for DOS to be formed at the interface with the body layer.

[0121] The second oxide semiconductor layer is preferably made of an oxide having high carrier mobility. The oxides containing Zn-Sn oxide and Ga-Sn oxide are preferred. The conductor layer preferably contains an element having a high bond energy with oxygen. Examples of the metals that can be used include aluminum, gallium, and yttrium. This makes it possible to increase the energy gap of the oxide. The oxide layer preferably contains zinc. By containing zinc, the oxide is easily crystallized. .

[0122] In addition, when the element with the high bond energy with oxygen is defined as M, the first layer of the oxide semiconductor When the layer is an In-M-Zn oxide, the atomic ratio of In to M is preferably 50 atom mic%, M is 50 atomic % or more, and more preferably In is 25 atomic % or more. %, and M is 75 atomic % or more. In addition, the second oxide semiconductor layer is In-M In the case of Zn oxide, the atomic ratio of In to M is preferably 25 atomic % or more. , M is less than 75 atomic %, more preferably In is 34 atomic % or more, and M is The third oxide semiconductor layer is an In-M-Zn oxide. In this case, the atomic ratio of In to M is preferably less than 50 atomic % and less than 50 atomic %. % or more, more preferably In is less than 25 atomic %, and M is 75 atomic % or more. The atomic ratio of In and M above is 100 atm. The oxide semiconductor layer in the first layer is a 0.05% oxide semiconductor layer. An oxide having the same composition as the conductor layer may be used.

[0123] When the first oxide semiconductor layer is formed by sputtering, the atomic ratio of the target is , In:M:Zn is 1:1:0.5, 1:1:1, 1:1:2, 1:3:1, 1:3:2 , 1:3:4, 1:3:6, 1:6:2, 1:6:4, 1:6:6, 1:6:8, 1:6 :10, 1:9:2, 1:9:4, 1:9:6, 1:9:8, 1:9:10, etc. good.

[0124] When the second oxide semiconductor layer is formed by sputtering, the atomic ratio of the target is , In:M:Zn is 3:1:1, 3:1:2, 3:1:4, 1:1:0.5, 1:1:1 , 1:1:2, etc.

[0125] When the third oxide semiconductor layer is formed by sputtering, the atomic ratio of the target is , In:M:Zn is 1:1:0.5, 1:1:1, 1:1:2, 1:3:1, 1:3:2 , 1:3:4, 1:3:6, 1:6:2, 1:6:4, 1:6:6, 1:6:8, 1:6 :10, 1:9:2, 1:9:4, 1:9:6, 1:9:8, 1:9:10, etc. good.

[0126] When these semiconductor layers are formed by sputtering, the atomic ratio of the target deviates from the normal ratio. In particular, zinc may form a film with a higher atomic ratio than the target. The atomic ratio may become smaller. Specifically, the atomic ratio of zinc contained in the target may become smaller. It may be between 40 atomic% and 90 atomic%.

[0127] In the process of manufacturing semiconductor layers and wiring layers, etching is used to process thin films into the desired shape. The etching process may be dry etching or wet etching. can be done.

[0128] In order to etch the desired shape, the etching conditions are adjusted according to the material. Adjust the etching conditions (etching solution, etching time, temperature, etc.) as appropriate.

[0129] The material of the wiring layer 405b functioning as a source electrode layer or a drain electrode layer is Al. , Cr, Ta, Ti, Mo, W, or an alloy containing the above elements. Examples of the film include an alloy film made up of the above-mentioned elements. It is preferable to give the conductive film heat resistance that can withstand the heat treatment. However, since it has problems such as poor durability and susceptibility to corrosion, it is formed in combination with heat-resistant conductive materials. Heat-resistant conductive materials that can be combined with Al include titanium (Ti) and tantalum (Ta ), tungsten (W), molybdenum (Mo), chromium (Cr), neodymium (Nd), An element selected from the group consisting of candium (Sc), or a nitride of the above elements, or It is formed by laminating the above-mentioned elements.

[0130] An insulating film may be provided between the wiring layer 405b and the semiconductor layer 403. The film can function as a channel protection film. The channel protection film is a film that is formed on the channel region. Alternatively, the wiring layer 405b may be provided only on the portion where the wiring layer 405b and the semiconductor layer 403 are in contact with each other. may be opened and placed in an area other than the opening.

[0131] The insulating film 407 covering the transistor 420 is an inorganic insulating film formed by a dry method or a wet method. An organic insulating film can be used. For example, it can be obtained by using a CVD method or a sputtering method. Silicon nitride film, silicon oxide film, silicon oxynitride film, aluminum oxide film, oxide Tantalum chloride films and the like can also be used. Organic materials such as tungsten-based resins, polyamides, and epoxies can be used. In addition to the above materials, low-k materials, siloxane resins, and PSG (phosphor glass) are also available. For example, boron phosphorus sulfate glass (BPSG) can be used. A gallium nitride film may also be used.

[0132] In addition, the insulating film 407 is formed by stacking a plurality of insulating films made of these materials. For example, a structure in which an organic resin film is laminated on an inorganic insulating film may be used.

[0133] The liquid crystal display device and the liquid crystal display module having the above-mentioned configuration may be By applying the sealing structure having the above structure, a highly reliable liquid crystal display module or liquid crystal display device can be obtained. It may be a display device.

[0134] The configurations, methods, etc. described in this embodiment may be the same as those described in other embodiments. can be used in appropriate combination.

[0135] (Embodiment 3) In this embodiment, a liquid crystal display panel having the sealing structure described in the first embodiment, In this embodiment, a transistor is used in a driver circuit. A liquid crystal display panel or liquid crystal display module in which a part or the whole of the liquid crystal display is integrally formed on the same substrate as the pixel unit. However, the present invention is not limited to this, and all the driving circuits may be external. Although not shown, sensors and timers may be formed on the same substrate. For example, a second electrode layer 446 may be provided to function as a common electrode. By using these materials as electrodes for the touch sensor, an in-cell type touch sensor can be realized. It may be stored.

[0136] Appearance and cross-section of a liquid crystal display panel (liquid crystal display module), which corresponds to one form of liquid crystal display device The surface will be described with reference to FIG. 5. FIG. 5(A) shows a surface formed on a first substrate 4001. The transistors 4010 and 4011 and the liquid crystal element 4013 are disposed between the second substrate 4006 and the 5(A) is a top view of the panel sealed with a sealant 4005. ) corresponds to a cross-sectional view at MN.

[0137] A pixel portion 4002 and a scanning line driver circuit 4004 are provided on a first substrate 4001. A sealant 4005 is provided so as to cover the pixel portion 4002 and the scanning line driver circuit. A second substrate 4006 is provided on the substrate 4004. The path 4004 is formed by a first substrate 4001, a sealant 4005, and a second substrate 4006. The black matrix 4041 and the color filter 4042 are sealed together with the liquid crystal layer 4008. The outer ends of the pad 4040, the planarization film 4042, etc. are connected to the first substrate 4001 and the second substrate 4002. 4006, and a seal material 4005 is formed on the outside of the end of the The structure is designed to prevent water from penetrating through the resin layer. Also, a sufficient seal width is ensured. In order to secure the sealing material 4005, a part of the sealing material 4005 is formed so as to overlap with the resin layer. Therefore, to prevent water from penetrating from the sealant 4005 into the resin layer and causing a deterioration in sealing performance, A moisture impermeable layer 4043 is formed between the resin layer and the sealant 4005. This is just one example. By using the other seal structures described in the first embodiment, Furthermore, it is possible to provide a highly reliable liquid crystal display panel and liquid crystal display module that are suppressed from being affected by water. This can be done.

[0138] In addition, the interlayer film 4021 of the first substrate 4001 is also made of a resin material. In this case, the same configuration as that on the second substrate 4006 side can be applied to the first substrate 4001 side. As a result, it is possible to obtain a liquid crystal display module and a liquid crystal display panel having good durability.

[0139] FIG. 5A shows an area surrounded by a sealant 4005 on a first substrate 4001. A signal line circuit formed of a single crystal semiconductor or a polycrystalline semiconductor is mounted in a region different from the semiconductor region. The liquid crystal display module and the liquid crystal display panel are shown. In this example, a part of an operating circuit is formed by a transistor provided on a first substrate 4001. A signal line driver circuit 4003b is formed on a substrate 4001 of one of the substrates, and a single crystal semiconductor or a multi-layered film is formed on the substrate 4001 of the other of the substrates. A signal line driver circuit 4003a formed of a crystalline semiconductor is mounted.

[0140] The method of connecting the separately formed drive circuit is not particularly limited, and may be a COG method. For example, a wire bonding method or a TAB method can be used. 4, which is an example in which a signal line driver circuit 4003a is mounted by the TAB method.

[0141] A pixel portion 4002 and a scanning line driver circuit 4004 are provided on a first substrate 4001. In FIG. 5B, the transistor included in the pixel portion 4002 is 4004 and a transistor 4011 included in the scanning line driver circuit 4004. An insulating layer 4020 and an interlayer film 4021 are provided over the transistors 4010 and 4011. It is being done.

[0142] The transistors 4010 and 4011 are the transistors described in Embodiment 2. can be done.

[0143] In addition, the transistor 4 for the driver circuit is formed over the interlayer film 4021 or the insulating layer 4020. A conductive layer may be provided in a position overlapping with a channel formation region of the semiconductor layer of 011. The potential of the gate electrode layer of the transistor 4011 may be the same as or different from that of the gate electrode layer of the transistor 4011. The conductive layer can also function as a gate electrode layer of the second gate electrode. Alternatively, the conductive layer may be in a floating state.

[0144] In addition, a pixel electrode layer 4030 and a common electrode layer 4031 are formed on the interlayer film 4021. The electrode layer 4030 is electrically connected to the transistor 4010. The first pixel includes a pixel electrode layer 4030, a common electrode layer 4031, and a liquid crystal layer 4008. The outer surfaces of the substrate 4001 and the second substrate 4006 are provided with polarizing plates 4032a and 4032b, respectively. It is provided.

[0145] The liquid crystal layer 4008 uses a liquid crystal composition suited to the display mode.

[0146] In the liquid crystal display panel (liquid crystal display module) shown in FIG. A configuration in which the liquid crystal of the liquid crystal layer 4008 is controlled by forming an electric field between the electrode layer 4031 ( The figure shows a liquid crystal display panel (liquid crystal display module) with an IPS mode. In this case, a horizontal electric field is generated in the liquid crystal, and this electric field can be used to control the liquid crystal molecules. .

[0147] The first substrate 4001 and the second substrate 4006 are made of a transparent glass or a transparent plastic. As for plastic, FRP (Fiber Reinforced Plastic) can be used. reinforced plastics) plate, PVF (polyvinyl fluoride) film Films made of aluminum, polyester or acrylic resin can be used. A sheet with a structure in which minium foil is sandwiched between PVF film or polyester film is used. It is also possible.

[0148] Although FIG. 5 shows an example of a transmissive liquid crystal display device, one embodiment of the present invention is a semi-transmissive liquid crystal display device. However, it can also be applied to a reflective liquid crystal display device.

[0149] In addition, in the liquid crystal display device of FIG. 5, an example is shown in which a polarizing plate is provided on the outer side (viewing side) of the substrate. The polarizing plate may be provided on the inside of the substrate. This can be appropriately set according to the material of the polarizing plate and the manufacturing process conditions. Also, a light-shielding layer that functions as a black matrix may be provided. Although it is not shown, it may be a module integrated with the touch panel, or it may be an in-cell The touch panel may further include a touch panel configuration.

[0150] A color filter layer or a light-shielding layer may be formed as part of the interlayer film 4021. In this case, a light-shielding layer 4034 is provided on the second substrate 4 so as to cover the transistors 4010 and 4011. By providing the light-shielding layer 4034, the contrast is further improved. This can improve the lasting effect and stabilize the transistors.

[0151] The transistor may be covered with an insulating layer 4020 that functions as a protective film for the transistor. Not limited.

[0152] The protective film prevents the intrusion of polluting impurities such as organic matter, metals, and water vapor suspended in the air. The protective film is formed by sputtering with an acid. silicon oxide film, silicon nitride film, silicon oxynitride film, silicon nitride oxide film, aluminum oxide aluminum film, aluminum nitride film, aluminum oxynitride film, or aluminum nitride oxide film The insulating film 10 may be formed as a single layer or a laminated layer.

[0153] In addition, when a light-transmitting insulating layer is further formed as a planarizing insulating film, polyimide, acrylic Heat-resistant organic materials such as benzocyclobutene resin, polyamide, and epoxy are used. In addition to the above organic materials, low-k materials, white materials, etc. Xanthane resin, PSG (phosphorus glass), BPSG (borophosphorus glass), etc. can be used. In addition, an insulating layer can be formed by stacking multiple insulating films made of these materials. You may do so.

[0154] The pixel electrode layer 4030 and the common electrode layer 4031 are the same as those in the second embodiment. The same materials as those listed as the materials for the common electrode layer can be used. As described above, the material and the configuration having light-transmitting properties are selected according to the display format of the liquid crystal display device. A reflective material and structure are appropriately selected.

[0155] In addition, a signal line driver circuit and a scanning line driver circuit 4004 or a pixel portion 4002 are formed separately. The various signals and potentials are supplied from the FPC4018.

[0156] In addition, since transistors are easily damaged by static electricity, etc., On the other hand, it is preferable to provide a protection circuit for protecting the drive circuit on the same substrate. It is preferable to use a nonlinear element.

[0157] In FIG. 5, the connection terminal electrode 4015 is formed from the same conductive film as the pixel electrode layer 4030. The terminal electrode 4016 is a source electrode layer and a drain electrode layer of the transistors 4010 and 4011. The conductive film is formed of the same material as the layer.

[0158] The connection terminal electrode 4015 is connected to a terminal of the FPC 4018 via an anisotropic conductive film 4019. The electrodes are electrically connected to each other.

[0159] In FIG. 5, a signal line driver circuit is formed separately and mounted on the first substrate 4001. However, the present invention is not limited to this configuration. Alternatively, only a part of the signal line driver circuit or a part of the scanning line driver circuit may be separately formed and mounted. is also good.

[0160] The liquid crystal display panel (liquid crystal display module) having the above-mentioned configuration is protected from the external atmosphere. This suppresses the effects of water, resulting in highly reliable LCD panels (LCD modules) and In addition, it is possible to provide a highly durable liquid crystal display panel (liquid crystal display module). This can be done.

[0161] The configurations, methods, etc. described in this embodiment may be the same as those described in other embodiments. can be used in appropriate combination.

[0162] (Embodiment 4) As an example of an electronic device to which the above liquid crystal display device is applied, a television set (television, (also called television receivers), computer monitors, digital cameras, digital Digital video cameras, digital photo frames, mobile phones (mobile phones, mobile phone devices, etc.) (also called "game consoles"), portable game machines, personal digital assistants, audio playback devices, pachinko machines and other large game machines Specific examples of these electronic devices are shown below.

[0163] 6A shows an example of a television device. The television device has a housing 71. A display unit 7103 is built into the display unit 7101. The display unit 7103 can display images. The seal structure of the display portion 7103 may have the seal structure described in Embodiment 1. Therefore, a television device having the display portion 7103 is required to have high durability. can be done.

[0164] The television device can be operated using an operation switch provided on the housing 7101 or a separate remote control. The remote control 7110 includes an operation pad 71 09 allows the channel and volume to be controlled, and the image displayed on the display unit 7103 can be The image can be operated by the remote control 7110. A display portion 7107 for displaying information output from the image forming apparatus 10 may be provided.

[0165] The television device is assumed to be equipped with a receiver, a modem, etc. It can receive general television broadcasts and can also transmit wired or wirelessly via a modem. By connecting to a communications network, it can be one-way (sender to receiver) or two-way (transmit It is also possible to communicate information between a sender and a recipient, or between recipients themselves.

[0166] FIG. 6B shows a computer, which includes a main body 7201, a housing 7202, a display unit 7203, and a keyboard. keyboard 7204, external connection port 7205, pointing device 7206, etc. In addition, in this computer, the seal structure of the display portion 7203 is the same as that described in the embodiment 1. It has a ring structure.

[0167] FIG. 6C shows a portable game machine that is composed of two housings, a housing 7301 and a housing 7302. The housing 7301 is connected to the display unit 7302 by a connecting portion 7303 so as to be openable and closable. The seal structure of the display unit 7304 is the seal structure described in the first embodiment. A display portion 7305 is incorporated in the housing 7302. The portable gaming machine shown in the figure also has a speaker unit 7306, a recording medium insertion unit 7307, an LED light A pump 7308, an input means (operation keys 7309, a connection terminal 7310, a sensor 7311 (force, Displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substances, sound voice, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor, The 7312 includes a function to measure infrared rays, and a microphone. Of course, the configuration of the portable game machine is not limited to the above, and at least the display unit 7304 and The liquid crystal display device described in Embodiment 1 is used for either or both of the display portions 7305. It is sufficient to use the above-mentioned parts, and other auxiliary equipment may be provided as appropriate. The portable gaming machine shown in (C) reads out the program or data recorded on the recording medium. and a function to share information with other portable gaming machines via wireless communication. The functions of the portable gaming machine shown in FIG. 6C are not limited to these, and may include various functions. The portable game machine having the display portion 7304 as described above can have various functions. The seal structure of the display unit 7304 has the seal structure described in the first embodiment. This results in a highly durable portable gaming machine.

[0168] FIG. 6D shows an example of a mobile phone. The mobile phone is built in a housing 7401. In addition to the display unit 7402, the operation buttons 7403, the external connection port 7404, the speaker 7 The mobile phone includes a microphone 7406 and a terminal 405. The display portion 7402 has a seal structure. A mobile phone having the display portion 7402 can be a highly durable mobile phone.

[0169] In the mobile phone shown in FIG. 6D, information can be input by touching the display portion 7402 with a finger or the like. In this case, the user can make a call or write an email. Operations such as creating a new screen can also be performed by touching the display portion 7402 with a finger or the like. .

[0170] The screen of the display unit 7402 has three main modes. The first is a mode that mainly displays images. The first mode is a display mode, the second is an input mode for inputting information such as characters, and the third mode is a display mode. This is a display + input mode that combines the display mode and the input mode.

[0171] For example, when making a call or composing an e-mail, the display unit 7402 is used for inputting characters. The main input mode is the character input mode, and the input operation of the characters displayed on the screen can be performed. In this case, a keyboard or number buttons can be displayed on most of the screen of the display unit 7402. preferable.

[0172] The mobile phone also includes a sensor for detecting tilt, such as a gyro or acceleration sensor. By providing a detection device, the orientation of the mobile phone (vertical or horizontal) can be determined and the display portion 7402 can be displayed. The screen display can be switched automatically.

[0173] The screen mode can be changed by touching the display portion 7402 or by operating the housing 7401. The type of image displayed on the display unit 7402 can be selected by operating the operation button 7403. For example, the image signal to be displayed on the display unit may be changed by If the data is text data, the mode switches to input mode.

[0174] In the input mode, the optical sensor of the display unit 7402 detects a signal and displays the If there is no input by touch operation on the display unit 7402 for a certain period of time, the screen mode is changed to the input mode. Alternatively, the display mode may be switched from the display mode to the display mode.

[0175] FIG. 7(A) and FIG. 7(B) show an example of a tablet terminal that can be folded in half. 9631a, the tablet terminal is in an open state. 9631b, a display mode changeover switch 9034, a power switch 9035, a power saving mode The device has a mode changeover switch 9036, a fastener 9033, and an operation switch 9038. The tablet terminal displays a liquid crystal display device having the seal structure described in the first embodiment. The display portion 9631a and / or the display portion 9631b are formed using the same.

[0176] A part of the display unit 9631a can be used as a touch panel area 9632a. By touching the operation keys 9637, data can be input. In 1a, as an example, half of the area has a display function only, and the other half The display unit 963 has a touch panel function, but is not limited to this. The entire area of ​​the display unit 96 may have a touch panel function. The entire surface of 31a is made to display keyboard buttons to make it a touch panel, and the display part 9631b is displayed It can be used as a screen.

[0177] In addition, in the display unit 9631b, as in the display unit 9631a, The portion of the keyboard 9632 can be used as a touch panel area 9632b. By touching the area where the display switch button 9639 is displayed with your finger or a stylus, Keyboard buttons can be displayed on the display portion 9631b.

[0178] In addition, when touching the touch panel area 9632a and the touch panel area 9632b at the same time, You can also input the

[0179] A display mode changeover switch 9034 is used to change the display orientation, such as portrait or landscape. You can switch between black and white and color display. The switch 9036 is a switch that turns on and off when the tablet terminal is in use and is detected by a light sensor built into the tablet terminal. The brightness of the display can be optimized according to the amount of light. In addition to sensors, other detection devices such as gyros, acceleration sensors, etc. that detect tilt may be incorporated.

[0180] FIG. 7A shows an example in which the display area of ​​the display portion 9631b is the same as that of the display portion 9631a. However, there is no particular limitation, and one size may be different from the other size. For example, one display panel may have a higher resolution than the other. It is also possible to use the following.

[0181] FIG. 7B shows the tablet terminal in the closed state. 9630, solar cell 9633, charge / discharge control circuit 9634, battery 9635, DCDC An example in which a converter 9636 is provided is shown. Note that in FIG. 7B, a charge / discharge control circuit 9634 As an example, a configuration having a battery 9635 and a DC-DC converter 9636 is shown. is doing.

[0182] In addition, since the tablet device can be folded in half, the case 9630 can be folded when not in use. Therefore, the display portions 9631a and 9631b can be protected. This makes it possible to provide a tablet device that is highly durable and reliable even when used for a long period of time.

[0183] In addition, the tablet terminals shown in Figs. 7(A) and 7(B) can display various information. Functions that display (still images, videos, text images, etc.), calendars, dates, or times, etc. A function to display information on the display unit, and a touch input function to operate or edit information displayed on the display unit Functions such as the ability to control processing using various software (programs) can be done.

[0184] The solar cell 9633 attached to the surface of the tablet device supplies power to the touch panel. The solar cell 9633 can supply the light to a display unit, a video signal processor, or the like. When the battery is charged on one or both sides of the housing 9630, the battery 9635 can be charged efficiently. This is preferable because it is possible to configure the above.

[0185] The configuration and operation of the charge / discharge control circuit 9634 shown in FIG. A block diagram is shown and explained in FIG. 7(C). , DC-DC converter 9636, converter 9638, switches SW1 to SW3, display The figure shows the part 9631, the battery 9635, the DCDC converter 9636, The inverter 9638 and the switches SW1 to SW3 are connected to the charge / discharge control circuit 96 shown in FIG. This corresponds to 34.

[0186] First, an example of operation in which power is generated by the solar cell 9633 using external light will be described. The power generated by the solar cell is converted to DC voltage to charge the Battery 9635. The voltage is increased or decreased by the DC converter 9636. When the power charged by the solar cell 9633 is used, switch SW1 is turned on and the The inverter 9638 raises or lowers the voltage to the voltage required for the display unit 9631. When the display unit 9631 is not to be displayed, turn SW1 off and SW2 on to The configuration may be such that the battery 9635 is charged.

[0187] Although the solar cell 9633 is shown as an example of a power generating means, the power generating means is not particularly Other power generating devices such as, but not limited to, piezoelectric elements (piezo elements) and thermoelectric conversion elements (Peltier elements) may also be used. The battery 9635 may be charged by a wireless (non-contact) means. It can be combined with a non-contact power transmission module that transmits and receives power to charge, or other charging methods. The power generating means may be omitted.

[0188] In addition, as long as the display unit 9631 is provided, the electronic device is not particularly limited to the shape shown in FIG. Needless to say, this will not happen. EXAMPLES

[0189] In this embodiment, the edge of the black matrix is ​​located inside the edge of the substrate. This paper presents the results of a study on improving resistance to ESD (electrostatic discharge).

[0190] In this embodiment, an ESD test is performed on a liquid crystal display device in which a driving circuit is integrally formed, and the scanning line driving We confirmed the change in the operating margin in the circuit. The operating margin is as follows: This is the margin of voltage relative to the design specification voltage. If it is within the margin, the power supply voltage will drop and the system will remain normal. Normal operation is possible.

[0191] The measured sample was a so-called This is an active matrix type liquid crystal display device with an integrated driving circuit. The semiconductor element is a bottom-gate top contact, and an oxide semiconductor is used for the active layer. The body element was covered with an acrylic resin layer to make it flat, and a common electrode was formed on the acrylic resin layer. The pixel electrodes are formed on an insulating film (silicon nitride film) that covers the common electrode, and are then covered with an alignment film. The liquid crystal display device was an FFS mode liquid crystal display device.

[0192] A black matrix and a color filter are formed on the second substrate (opposite substrate), and the acrylic A flattening film / overcoat layer of a resin and an alignment film are provided, and a seal is formed at the peripheral edge of the substrate. It was sealed with material.

[0193] The ESD test uses a gun-type tester that complies with the IEC 61000-4-2 test standard. With a discharge resistance of 330 Ω and a discharge capacity of 150 pF, apply a specified voltage to both + and - ten times in succession. The ESD was applied to two electrodes facing each other across the pixel area. The three pixel regions are located near the center of the two scanning line driving circuits and near the input terminal. The results are shown in Figures 8 and 9. Note that in Figure 8, ESD was applied from the opposing substrate side. Figure 9 shows the results when the voltage was applied from the element substrate side. The graph shown is the result of a display device in which the black matrix is ​​formed up to the edge of the substrate. The graph shown in (B) shows that the edge of the black matrix is ​​180 to 290 μm from the edge of the substrate. The results are for a display device located approximately 50mm inside.

[0194] Both Figures 8 and 9 show the results for a liquid crystal display device in which the black matrix is ​​formed up to the edge of the substrate. In the graph (A), the operation of the driving element starts to decrease when the ESD stress voltage exceeds 6 kV. The margin began to decrease, and at 10 kV the margin became zero, rendering the device inoperable. On the other hand, the edge of the black matrix was located about 180 to 290 μm inward from the edge of the substrate. In graph (B), which shows the results for a liquid crystal display device installed in the same place, even with an ESD voltage of 12 kV, There is no reduction in the operating margin, and the LCD device having this structure has high ESD resistance. It is clear that the improvement is being achieved. [Explanation of symbols]

[0195] 100 Opposing substrate 101 Element substrate 102 Liquid crystal layer 103 Color Filter 104 Black Matrix 105 Planarization film 106 Breathable Layer 107 Sealing material 108 electrode 109 Breathable Layer 150 Opposing substrate 151 Element substrate 152 Liquid crystal layer 158 Electrode 160 electrodes 161 Electrode 162 Insulating film 401 Wiring 401a Gate electrode 402 Gate insulating layer 403 Semiconductor Layer 405a Wiring 405b wiring layer 407 Insulating Film 408 Insulating film 420 Transistor 421 Contact Hole 441 First Board 446 Second electrode layer 447 First electrode layer 4001 First substrate 4002 Pixel section 4003a Signal line driver circuit 4003b Signal line driver circuit 4004 Scanning line driver circuit 4005 Sealing material 4006 Second Board 4008 Liquid crystal layer 4010 Transistor 4011 Transistor 4013 Liquid crystal element 4015 Connection terminal electrode 4016 Terminal electrode 4018 FPC 4019 Anisotropic conductive film 4020 Insulation layer 4021 Interlayer film 4030 Pixel electrode layer 4031 Common electrode layer 4032a Polarizing plate 4032b Polarizing plate 4034 Light blocking layer 4040 Color Filter 4041 Black Matrix 4042 Planarization film 4043 Non-breathable layer 7101 Case 7103 Display section 7105 Stand 7107 Display section 7109 Operation Pad 7110 Remote control device 7201 Main unit 7202 Case 7203 Display section 7204 Keyboard 7205 External connection port 7206 Pointing Device 7301 Case 7302 Case 7303 Connection section 7304 Display section 7305 Display section 7306 Speaker section 7307 Recording medium insertion section 7308 LED Lamp 7309 Operation key 7310 Connection terminal 7311 Sensor 7401 Case 7402 Display section 7403 Operation button 7404 External connection port 7405 Speaker 7406 Mike 9033 Fastener 9034 Display mode change switch 9035 Power Switch 9036 Power saving mode switch 9038 Operation switch 9630 Case 9631 Display section 9631a Display section 9631b Display section 9632a Touch Panel Area 9632b Touch panel area 9633 Solar Cells 9634 Charge / discharge control circuit 9635 Battery 9636 DC-DC Converter 9637 Operation key 9638 Converter 9639 Keyboard display switch button

Claims

[Claim 1] In an active matrix type liquid crystal display device having a liquid crystal layer between an opposing substrate and an element substrate fixed with a sealant, At least a resin layer is formed on the opposing substrate, The end of the resin layer is not exposed to the outside atmosphere, the resin layer and the sealant overlap at least partially when a cross section of the liquid crystal display device is viewed, A liquid crystal display device, further comprising a moisture impermeable layer formed between the resin layer and the sealing material.

Images