Assembled grid tray

Abstract

To provide an assembled grid tray comprising a frame for holding multiple substrate trays to form a larger tray for use in a semiconductor processing tool.SOLUTION: An assembled grid tray 100 comprises a frame for holding multiple substrate trays to form a larger tray for use in a semiconductor processing tool. The frame may be comprised of two outer frame members 105 that hold one or more of the trays, each with a magnet rail used with a magnetic levitation system. The frame may be further comprised of an inner frame member 120, 125 positioned between the outer frame members, which may also include a magnet rail, with the frame members being held in position by one or more outer beam members 130. The frame members may be fabricated of a material having a similar thermal expansion to trays 115 to be placed in the frame.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate generally to semiconductor substrate processing trays, and more particularly to assemblies including multiple trays. [Background technology]

[0002]

[0002] When processing semiconductor substrates for products such as solar cells in a solar array, a processing tool may process multiple substrates simultaneously. In many applications, substrate trays capable of holding multiple substrates are utilized to facilitate processing and transport of multiple substrates. The trays may include multiple pockets, each pocket configured to hold a substrate for processing.

[0003]

[0003] Previous generation solar cell processing tools, having process chamber dimensions up to approximately 1941 x 2305 mm, may use trays capable of holding, for example, up to approximately 99 substrates. However, larger tools, having process chamber dimensions of about 2800 x 3205 mm or more, can accommodate larger size trays, for example trays capable of holding 208 or more substrates, which may be larger than those used in previous generation tools.

[0004]

[0004] Larger trays can be substantially more expensive to manufacture than smaller trays, adding up to substantial costs for processing multiple substrates on a large scale. Furthermore, the increased size of the trays creates additional technical challenges, for example, in terms of tray flexing during processing under the extreme thermal conditions of semiconductor processing tools.

[0005] What is needed is a system and method for overcoming the deficiencies in manufacturing large trays. Summary of the Invention

[0006]

[0006] The methods and systems disclosed herein generally relate to a grid tray assembly including a frame for holding multiple substrate trays to form a large tray for use in a semiconductor processing tool. The frame may be comprised of two outer frame members for holding one or more trays, each having a magnetic rail for use in a magnetic levitation system. The frame may further comprise an inner frame member positioned between the outer frame members. The inner frame member may also include a magnetic rail, and the frame members are held in place by one or more outer beam members. The frame members may be made of a material having a similar thermal expansion as the trays disposed within the frame.

[0007]

[0007] According to certain embodiments, a grid tray assembly for semiconductor processing is disclosed, the grid tray assembly including a first frame component configured to hold one or more of a plurality of processing trays, each processing tray capable of holding a plurality of substrates for processing, the first frame component including a first frame component carrier configured to allow the first frame component to move within the semiconductor processing tool and extending along a length of the first frame component, a second frame component configured to hold one or more of the plurality of processing trays, the second frame component including a second frame component carrier configured to allow the second frame component to move within the semiconductor processing tool, and a coupling configured to movably couple the grid tray assembly to the semiconductor processing tool.

[0008]

[0008] In a further embodiment, a system for processing semiconductor substrates is disclosed, the system including a semiconductor processing tool with a robot and a grid tray assembly configured to hold a plurality of trays, each of the plurality of trays having a plurality of pockets, each pocket configured to hold a substrate, and the grid tray assembly configured to be coupled to a robot for moving the grid tray assembly within the semiconductor processing tool.

[0009]

[0009] In a further embodiment, a system for processing semiconductor substrates is disclosed, the system including a semiconductor processing tool; a grid tray assembly configured to hold a plurality of trays, each of the plurality of trays having a plurality of pockets for holding substrates; and a controller having a processor configured to execute a method for processing semiconductor substrates using the grid tray assembly, the method including moving a grid tray assembly including the plurality of trays within the semiconductor processing tool.

[0010]

[0010] So that the above-mentioned features of the present disclosure can be understood in detail, a more particular description of the present disclosure briefly summarized above can be had by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings show only exemplary embodiments, and therefore should not be considered as limiting the scope of the present disclosure, which may admit of other equally effective embodiments. [Brief description of the drawings]

[0011] [Figure 1] 1 illustrates a grid tray assembly according to a disclosed embodiment. [Figure 2A-2B] FIG. 1 illustrates a side view of an outer frame member according to a disclosed embodiment. [Figure 3A-3B]FIG. 1 illustrates a side view of an inner frame member according to a disclosed embodiment. [Figure 4A-4B] FIG. 1 illustrates a side view of an outer frame member according to a disclosed embodiment. [Figure 5A-D] 1 illustrates the operation of a magnetic levitation system according to a disclosed embodiment. [Figure 6] 1 illustrates a semiconductor processing system according to a disclosed embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012]

[0017] To facilitate understanding, wherever possible, the same reference numerals have been used to designate identical elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0013]

[0018] In the following, reference will be made to embodiments of the present disclosure. However, it should be understood that the present disclosure is not limited to the specifically described embodiments. Instead, any combination of the following features and elements, whether related to different embodiments or not, is envisioned to implement and practice the present disclosure. Furthermore, the embodiments of the present disclosure have advantages over other possible solutions and / or prior art, but whether or not a given embodiment achieves a particular advantage does not limit the present disclosure. Thus, the following aspects, features, embodiments, and advantages are merely exemplary and are not considered elements or limitations of the appended claims unless expressly recited in one or more claims. Similarly, reference to "the present disclosure" should not be construed as a generalization of any inventive subject matter disclosed herein, and should not be considered elements or limitations of the appended claims unless expressly recited in one or more claims.

[0014]

[0019] The present disclosure generally relates to methods and systems including a grid tray assembly with a frame for holding multiple substrate trays to form a large tray for use in a semiconductor processing tool. The frame may be comprised of two outer frame members that hold one or more trays, each having a magnetic rail for use in a magnetic levitation system. The frame may further comprise an inner frame member positioned between the outer frame members. The inner frame member may also include a magnetic rail, and the frame members are held in place by one or more outer beam members. The frame members may be made of a material that has a similar thermal expansion as the trays that are placed in the frame.

[0015]

[0020] In an approach utilizing a system with a small processing chamber, such as 1941×2305 mm (e.g., the Gen6 processing tool from Applied Materials, Santa Clara, Calif.), a tray is utilized to hold, for example, 99 substrates for processing. The use of trays in this context allows for efficiencies of scale for efficient use of processing tools, materials, labor, etc. The trays may be constructed of graphite, composite carbon fiber, or other materials suitable for carrying substrates during processing. For example, the trays may be constructed of a material having approximately the same coefficient of thermal expansion as the substrates that the trays may carry.

[0016]

[0021] As semiconductor processing tools of increased size become available (e.g., Gen8 solar cell processing tools from Applied Materials, Santa Clara, Calif.), with processing chamber dimensions of about 2800×3205 mm or more, larger trays capable of holding 208 or more substrates can be accommodated. As one skilled in the art can appreciate, processing more substrates in one processing cycle can increase efficiency and reduce the cost of the manufactured device. However, the manufacture of large trays is substantially more expensive than smaller trays, and can be up to four times (and in some cases even more) expensive than the manufacture of smaller trays. Furthermore, the increased tray size can introduce additional complications, such as tray sagging. Attempts have been made to use multiple small trays in close proximity to one another without a connecting base, but the gaps between the trays and the complexity of handling multiple separate trays pose substantial technical challenges.

[0017]

[0022] According to disclosed embodiments, a grid tray assembly including a frame with an outer frame member, one or more inner frame members, and one or more outer beams can be assembled to hold multiple trays. The grid tray assembly holding multiple small trays is provided in a semiconductor processing tool, such as a GEN8 (or higher) solar cell processing tool. The grid tray assembly eliminates the need to manufacture large trays and simplifies the handling of multiple small trays by allowing all small trays in the grid tray assembly to be handled as a unit, eliminating unnecessary gaps between trays. The use of multiple small trays in the grid tray assembly allows for efficiencies of scale without the cost and engineering complexity associated with developing large trays or attempting to use multiple individual trays individually in a processing line.

[0018]

[0023] FIG. 1 illustrates a grid tray assembly 100 according to a disclosed embodiment. The grid tray assembly includes an outer frame member 105, also referred to herein as a first frame component and a second frame component, respectively. The outer frame member 105 may be constructed of a material having a similar coefficient of thermal expansion as the trays 115 carried by the grid tray assembly 100. For example, the outer frame member 105 may be constructed of graphite, carbon fiber composite, aluminum, or other material having a similar coefficient of expansion as the tray or trays carried by the grid tray assembly 100. As illustrated, the outer frame member 105 is positioned such that its length dimension is parallel to the direction of movement of the grid tray assembly 100 for use in a semiconductor processing tool. However, one skilled in the art will appreciate that the outer frame member 105 may be replaced with one or more outer beam members, described below, such that its length dimension is parallel to the direction of movement of the grid tray assembly 100. In some embodiments, the outer frame members 105 may include magnets, allowing for transport of the grid tray assembly 100 within the semiconductor processing tool (or fab) via magnetic levitation. In other embodiments, wheels may be utilized, while in still other embodiments, a robotic assembly may carry the grid tray assembly. Additionally, one or both of the outer frame members 105 may further include outer wheels 113 to facilitate movement within the semiconductor processing tool or fab. Further details of the outer frame members 105 are described below in conjunction with FIG. 2.

[0019]

[0024] Although the trays 115 are designated by a single reference number, one skilled in the art will appreciate that the trays need not be identical in either material composition or size. Trays of different sizes may be combined such that all trays will fit into the assembled grid frame.

[0020]

[0025] The grid tray assembly 100 further comprises one or more inner frame members 120 and 125, either of which may be referred to herein as a third frame component. Although two inner frame members 120 and 125 are shown here, in some embodiments there may be one or none, and in other embodiments there may be more than two inner frame members. As with at least one of the outer frame members 105, the inner frame members 120 and / or 125 may be constructed of a material having a substantially similar coefficient of thermal expansion as one or more of the trays 115 carried by the grid tray assembly 100. In some embodiments, one or more of the inner frame members 120 and 125 may include multiple magnets. This allows the grid tray assembly to move within the semiconductor processing tool via magnetic levitation. In other embodiments, wheels may be utilized, while in yet other embodiments the grid tray assembly may be carried by one or more robotic assemblies. One or more trays 115 may be disposed between the inner frame members 120 or 125 and the outer frame member 105. The inner frame members 120 and 125 are described in more detail below in connection with FIG.

[0021]

[0026] The grid tray assembly 100 further comprises one or more outer beam members 130. As shown, one or more of the outer beam members 130 are coupled to the outer frame member 105 and one or more of the inner frame members 120 and / or 125 to form a rigid frame structure for carrying one or more of the trays 115. The outer beam members 130 may be coupled to one or more of the outer frame members 105 and / or the inner frame members 120 and 125 by screws or rivets, welding, adhesives, or any other technique that rigidly connects these elements to form a rigid frame capable of holding one or more trays 115. The one or more outer beam members 130 may further include one or more connection points 135 for coupling the grid tray assembly 100 to a robot (e.g., the robot shown below in FIG. 2) or other carrier to enable movement of the grid tray assembly within a semiconductor processing tool and / or factory.

[0022]

[0027] 2A illustrates a side view 200 of an outer frame member 205, which may be similar to one or both of the outer frame members 105, according to a disclosed embodiment. The outer frame member 205 includes a magnet channel 210 that extends through the length of the outer frame member 205. In an embodiment, a magnet tray 215 is disposed within the magnet channel 210 and holds a number of magnets 220 that extend through the length of the outer frame member 205 and covers the magnets 220 that may otherwise be exposed on the underside of the outer frame member 205. In an embodiment, the magnets 220 may be natural magnets, and in other embodiments, may be electromagnets. The outer frame member 205 has a lower ledge 225 on which a tray 230 or trays may be held, with a top surface 235 of the tray 230 meeting an upper lip 240 of the outer frame member 205.

[0023]

[0028] 2B shows an alternative embodiment of the outer frame member 205. Instead of an upper lip 240, a clip 250 is movably and / or removably coupled to the top surface of the outer frame member 205, with a portion of the clip 250 extending into contact with the top surface 235 of the tray 230 to hold the tray in place against the lower ledge 225 of the outer frame member 205.

[0024]

[0029] 3A illustrates a side view 300 of an inner frame member 305, which may be similar to one or more of the inner frame members 120 and 125, according to a disclosed embodiment. The inner frame member 305 includes a magnet channel 310 that extends through the length of the inner frame member 305. In an embodiment, a magnet tray 315 is disposed within the magnet channel 310 and holds a plurality of magnets 320 that extend through the length of the inner frame member 305 and covers the magnets 320 that would otherwise be exposed on the underside of the inner frame member 305. In an embodiment, the magnets 320 may be natural magnets, and in other embodiments, may be electromagnets. On either side of the inner frame member 305 is a lower ledge 325 on which a tray 330 and / or 331, or multiple trays, may rest, with a top surface 335 of the tray 330 and a top surface 336 of the tray 331 abutting an upper lip 340 extending from either side of the inner frame member 305.

[0025]

[0030] 3B illustrates an alternative embodiment of the inner frame member 305. Instead of an upper lip 340, a clip 350 is movably and / or removably coupled to the top surface of the inner frame member 305, with a portion of the clip 350 extending into contact with the top surface 335 of the tray 330 to hold the tray 330 in place against the lower ledge 325 of the inner frame member 305.

[0026]

[0031] 4A shows a side view 400 of an outer beam member 405, which may be identical to the outer beam member 130, according to a disclosed embodiment. The outer beam member 405 includes a lower ledge 410 extending along the length of the outer beam member 405, upon which a tray 415, or multiple such trays, may be positioned. A top surface 420 of the tray 415 may be bordered by an upper lip 425 extending from the outer beam member 405 and extending along its length.

[0027]

[0032] 4B shows an alternative embodiment of the outer beam member 405. Instead of an upper lip 425, a clip 450 is movably and / or removably coupled to the upper surface of the outer beam member 405, with a portion of the clip 450 extending into contact with the upper surface 420 of the tray to hold the tray in place against the lower ledge 410 of the outer beam member 405.

[0028]

[0033] 5A-5D illustrate the operation of a magnetic levitation system according to a disclosed embodiment.

[0029]

[0034] 5A illustrates a first operational state 500 of a magnetic levitation system 505 for transporting a grid tray assembly 510 (which may be like grid tray assembly 100 of FIG. 1) along an outer frame member 515 of the grid tray assembly 510 (which may be like outer frame member 205 of FIG. 2) to a susceptor 520 in a semiconductor processing system. The magnetic levitation system 505 includes a lift arm 506 configured to move up and down, and a plurality of magnets 507.

[0030]

[0035] In a first operational state 500, the lift arm 506 is in a raised position with its multiple magnets 507 exerting an upward force on the magnets of the outer frame member 515 to raise the grid tray assembly 510. A robot (not shown) of the semiconductor processing system can be coupled to one or more connection points (e.g., connection points 135 in FIG. 1 ) of the grid tray assembly 510 to position the grid tray assembly 510 above the susceptor 520.

[0031]

[0036] 5B illustrates a second operational state 501 in which the lift arm 506 of the magnetic levitation system 505 is configured to lower to position the grid tray assembly 510 on the susceptor for further processing. Although this operational state illustrates positioning the grid tray assembly for processing, one skilled in the art will appreciate that the magnetic levitation system and associated components of the grid tray assembly 510 can be used to transport the grid tray assembly to any type of processing, testing, cleaning, or other station within a fab.

[0032]

[0037] 5C illustrates a first operational state 550 which, in an embodiment, is identical to a first operational state 500 of a magnetic levitation system 505 for transporting a grid tray assembly 510 (which may be like grid tray assembly 100 of FIG. 1) along an inner frame member 555 (which may be like inner frame member 305 of FIG. 3) of the grid tray assembly 510 to a susceptor 520 in a semiconductor processing system. The magnetic levitation system 560 includes a lift arm 561 configured to move up and down, and a plurality of magnets 562.

[0033]

[0038] In a first operational state 550, the magnetic lift arm 561 is in a raised position with its multiple magnets 562 exerting an upward force on the magnets of the inner frame member 555 to raise the grid tray assembly 510. A robot (not shown) of the semiconductor processing system can be coupled to one or more connection points (e.g., connection points 135 in FIG. 1 ) of the grid tray assembly 510 to position the grid tray assembly 510 above the susceptor 520.

[0034]

[0039] 5D illustrates a second operational state 551, which in an embodiment is identical to second operational state 501 in which lift arm 561 of magnetic levitation system 560 is configured to lower to position grid tray assembly 510 on a susceptor for further processing. Although this operational state illustrates positioning the grid tray assembly for processing, one skilled in the art will appreciate that the magnetic levitation system and associated components of grid tray assembly 510 may be used to transport the grid tray assembly to any type of processing, testing, cleaning, or other station within a fab.

[0035]

[0040] FIG. 6 illustrates a semiconductor processing system 600 according to a disclosed embodiment.

[0036]

[0041] Semiconductor processing system 600 includes a grid tray assembly 605 (which may be like grid tray assembly 100 of FIG. 1), a magnetic levitation system 610 including magnetic levitation systems 505 and 560 of FIGS. 5A and 5B, a robot 615 configured to move grid tray assembly 605, a controller 620 for controlling semiconductor processing system 600, and a susceptor 625 (which may be like susceptor 520 of FIGS. 5A and 5B).

[0037]

[0042] While the above description is directed to embodiments of the present disclosure, other and additional embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the claims that follow.

Claims

1. 1. A grid tray assembly for semiconductor processing, comprising: a first frame component configured to hold one or more of a plurality of processing trays, each processing tray capable of holding a plurality of substrates for processing, the first frame component configured to allow movement of the first frame component within a semiconductor processing tool, the first frame component including a first frame component transport extending along a length of the first frame component; a second frame component configured to hold one or more of the plurality of processing trays, the second frame component including a second frame component transport configured to enable movement of the second frame component within the semiconductor processing tool; and a coupling configured to movably couple the grid tray assembly to the semiconductor processing tool; A grid tray assembly comprising:

2. 2. The grid tray assembly of claim 1, further comprising a third frame component positioned between the first frame component and the second frame component and configured to hold two or more of the plurality of processing trays, the third frame component including a third frame component transport configured to enable movement of the third frame component within the semiconductor processing tool.

3. 3. The grid tray assembly of claim 2, wherein one or more of the first frame component transport, the second frame component transport, and the third frame component transport include magnetic rails with one or more magnets.

4. 4. The grid tray assembly of claim 3, further comprising an outer beam connected to said first frame component, said second frame component, and said third frame component, said connectors being attached to said outer beams.

5. 2. The grid tray assembly of claim 1, wherein one of the first frame component and the second frame component is constructed of a material with a substantially similar coefficient of thermal expansion as one or more of the plurality of processing trays.

6. 6. The grid tray assembly of claim 5, wherein one of the first frame component and the second frame component is constructed from one of graphite and carbon fiber composite (CFC).

7. 2. The grid tray assembly of claim 1, wherein one of the first frame component and the second frame component comprises a ledge configured to receive a bottom side of one or more trays of the plurality of processing trays and a lip configured to receive a top side of one or more trays of the plurality of processing trays.

8. 1. A system for processing a semiconductor substrate, comprising: A semiconductor processing tool equipped with a robot; and 1. A grid tray assembly configured to hold a plurality of trays, each of the plurality of trays comprising a plurality of pockets, each pocket configured to hold a substrate, the grid tray assembly configured to be coupled to the robot for moving the grid tray assembly within the semiconductor processing tool. A system comprising:

9. The grid tray assembly includes: a first frame component including a first frame component carrier configured to enable movement of the first frame component within the semiconductor processing tool, the first frame component being configured to hold one or more of the plurality of trays; a second frame component including a second frame component carrier, the second frame component configured to hold one or more of the plurality of trays; and A coupling part configured to be coupled to the robot The system of claim 8 , comprising:

10. 10. The system of claim 9, further comprising a third frame component positioned between the first frame component and the second frame component, the third frame component configured to hold one or more of the plurality of trays.

11. The system of claim 9 , wherein one or more of the first frame component and the second frame component comprise one or more magnets.

12. The system of claim 11 , wherein the grid tray assembly further comprises an outer beam connected to the first frame component and the second frame component.

13. 11. The system of claim 10, wherein one of the first frame component, the second frame component, and the third frame component is constructed from a material having a coefficient of thermal expansion similar to a coefficient of thermal expansion of one of the plurality of trays.

14. 14. The system of claim 13, wherein one of the first frame component, the second frame component, and the third frame component is constructed from one of graphite and carbon fiber composite (CFC).

15. 1. A system for processing a semiconductor substrate, comprising: Semiconductor processing tools, a grid tray assembly configured to hold a plurality of trays, each of the plurality of trays including a plurality of pockets for holding substrates; and a controller having a processor configured to execute a method for processing semiconductor substrates with the grid tray assembly, the method including moving the grid tray assembly including the plurality of trays within the semiconductor processing tool; A system comprising:

16. The grid tray assembly includes: a first frame component configured to hold one or more of the plurality of trays; and a second frame component configured to hold one or more of the plurality of trays; The system of claim 15, comprising:

17. 17. The system of claim 16, wherein the grid tray assembly further comprises a third frame component positioned between the first frame component and the second frame component, the third frame component configured to hold one or more of the plurality of trays.

18. 20. The system of claim 17, wherein one of the first frame component, the second frame component, and the third frame component comprises a plurality of magnets positioned along a length of a corresponding one of the first frame component, the second frame component, and the third frame component.

19. 17. The system of claim 16, wherein one of the first frame component and the second frame component is constructed from a material having a substantially similar coefficient of thermal expansion as one of the plurality of trays.

20. 20. The system of claim 17, wherein the grid tray assembly further comprises an outer beam connected to one of the first frame component, the second frame component, and the third frame component.

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