Wiring circuit board

Abstract

To provide a wiring circuit board configured to reliably support an imaging element while correcting wobble of a mounting part with a small force.SOLUTION: A wiring circuit board 1 comprises a frame 2, a mounting part 3, and a joint 4. The mounting part 3 is surrounded by the frame 2 and is separated from the frame 2. The joint 4 connects the frame 2 and the mounting part 3. The mounting part 3 has a planned element mounting section 5 having a rectangular shape in plan view. The planned element mounting section 5 includes two first sides 51A, 51B and two second sides 52A, 52B respectively separated from each other and parallel to each other. The two second sides 52A, 52B connect one ends of the two first sides 51A, 51B and connect the other ends of the two first sides 51A, 51B. A first force per unit length required to move the mounting part 3 with respect to the frame 2 in a first direction along the first side 51A is 0.01-5.0 mN / mm inclusive.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a wired circuit board. [Background technology]

[0002] A wired circuit board for mounting an imaging element is known (see, for example, Patent Document 1 below). The wired circuit board described in Patent Document 1 includes a frame, a mounting portion surrounded by the frame, and a support member connecting them. The support member is made of a rigid material. The wired circuit board described in Patent Document 1 is provided in an imaging device with the imaging element mounted on the mounting portion. In the wired circuit board described in Patent Document 1, the frame elastically supports the mounting portion by means of the support member.

[0003] When the imaging device moves (vibrates), the frame also moves (vibrates). This causes the mounting part to shake (vibrate) in conjunction with the movement (vibration) of the frame. However, the support member corrects the above-mentioned shaking (vibration) of the mounting part. The above-mentioned correction is called vibration correction (shake correction). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 2020-30306 Summary of the Invention [Problem to be solved by the invention]

[0005] Depending on the application and purpose of the wired circuit board, there is a demand for correcting the vibration of the mounting portion with a small force. However, the wired circuit board described in Patent Document 1 has a drawback in that it cannot satisfy the above-mentioned demand.

[0006] On the other hand, the frame also needs to reliably support the imaging element via the mounting portion.

[0007] The present invention provides a wired circuit board capable of reliably supporting an imaging element while correcting the vibration of a mounting portion with a small force. [Means for solving the problem]

[0008] The present invention [1] includes a wired circuit board comprising: a frame; a mounting portion surrounded by the frame and spaced apart from the frame; and a joint connecting the frame and the mounting portion, wherein the mounting portion has a thickness, and the mounting portion has a rectangular element mounting portion for mounting an element when viewed in a direction perpendicular to the thickness direction, and the element mounting portion includes two first sides that are spaced apart and parallel to each other, and two second sides that connect one ends of the two first sides and connect the other ends of the two first sides, and a first force per unit length required to move the mounting portion relative to the frame in a first direction along the first sides is 0.01 mN / mm or more and 5.0 mN / mm or less.

[0009] In this wired circuit board, the first force is 5.0 mN / mm or less, so that the vibration of the mounting portion can be corrected with a small force.

[0010] In this wired circuit board, the first force is equal to or greater than 0.01 mN / mm, so that the frame can reliably support the imaging element via the mounting portion.

[0011] The present invention [2] includes the wired circuit board described in [1], wherein the second force per unit length required when moving the mounting portion relative to the frame in a second direction along the second side is 0.01 mN / mm or more and 5.0 mN / mm or less.

[0012] The present invention [3] includes the wired circuit board according to [1], wherein a third force per unit length required when moving the mounting portion relative to the frame in the thickness direction is 0.01 mN / mm or more and 5.0 mN / mm or less.

[0013] The present invention [4] includes the wired circuit board described in [1], wherein the frame, the mounting portion and the joint include a wiring layer, the wiring layer in the mounting portion includes a plurality of terminals spaced apart from each other and a plurality of wires spaced apart from each other and electrically connected to the plurality of terminals, the wiring layer in the joint includes a plurality of joint wires spaced apart from each other and electrically connected to the plurality of wires, the mounting portion has a first portion where the plurality of wires extend from the plurality of terminals and a second portion located between the first portion and an outer periphery of the mounting portion and where the plurality of wires converge, and the joint is connected to the second portion.

[0014] In this wired circuit board, the joint is connected to the second portion where the wires converge. Therefore, the joint can be prevented from expanding at the connection portion connected to the second portion. As a result, the rigidity of the joint can be reliably reduced.

[0015] The present invention [5] includes the wired circuit board according to [1], wherein the mounting portion has an edge that is positioned outside the intended element mounting portion, the joint includes a connection portion to which the joint connects at the edge, and the ratio of the length of the connection portion in a direction along the edge to the length of the edge (length of the connection portion / length of the edge) is 0.3 or less.

[0016] In this wired circuit board, the ratio of the length of the connection portion to the length of the side is 0.3 or less, so that the expansion of the connection portion is suppressed, and therefore the rigidity of the joint can be reliably reduced.

[0017] The present invention [6] includes the wired circuit board described in [1], wherein the mounting portion has a side that is positioned outside the intended element mounting portion, and the joint is a central region that includes a central portion of the side and is connected to the central region having a length that is 1 / 2 the length of the side.

[0018] In this wired circuit board, the joint is connected to the central region, so that the vibration of the mounting portion can be controlled with high precision.

[0019] The present invention [7] includes the wired circuit board described in [4] or [5], wherein each of the frame and the mounting portion includes a base insulating layer, the wiring layer arranged on one side of the base insulating layer in the thickness direction, and a cover insulating layer arranged on one side of the base insulating layer in the thickness direction, the cover insulating layer covering a part of the wiring layer, and may include a metal support layer arranged on the other side of the base insulating layer in the thickness direction, and the joint does not include the metal support layer, and includes the base insulating layer, the wiring layer, and the cover insulating layer.

[0020] In this printed circuit board, the joint does not include a metal support layer. Therefore, the rigidity of the joint is reduced. As a result, the vibration of the mounting portion can be corrected with a small force.

[0021] The present invention [8] includes the wired circuit board described in [7], wherein the wiring layer at the joint has a plurality of joint wirings spaced apart from each other, and the base insulating layer and the cover insulating layer at the joint have slits arranged between the plurality of joint wirings.

[0022] In this wired circuit board, the insulating base layer and the insulating cover layer at the joint have slits, so that the rigidity of the joint can be further reduced.

[0023] The present invention [9] includes the wired circuit board according to [8], wherein the slits extend along the plurality of joint wirings, and the joint has a sub-joint that divides the slits in the direction in which the slits extend and connects the plurality of joint wirings.

[0024] In this wired circuit board, the sub-joint can prevent the rigidity of the joint from being excessively reduced due to the slits, and therefore excessive deformation of the joint can be suppressed. Effect of the Invention

[0025] The wired circuit board of the present invention can reliably support the imaging element while correcting the vibration of the mounting portion with a small force. [Brief description of the drawings]

[0026] [Figure 1] 1 is a plan view of a first embodiment of a printed circuit board according to the present invention. [Diagram 2] FIG. 2 is an enlarged view of the printed circuit board shown in FIG. [Diagram 3] FIG. 3 is a cross-sectional view taken along the line AA in FIG. [Figure 4] 4 to 4E are manufacturing process diagrams of the wired circuit board shown in FIG. 3. FIG. 4A shows a process of forming a base insulating layer. FIG. 4B shows a process of forming a wiring layer. FIG. 4C shows a process of forming a cover insulating layer. FIG. 4D shows a process of forming a metal support layer. FIG. 4E shows a process of mounting an imaging element and an external board on the wired circuit board. [Diagram 5] FIG. 11 is a plan view of a first modified example. [Figure 6] FIG. 6 is a cross-sectional view taken along the line AA in FIG. [Figure 7] FIG. 11 is a cross-sectional view of a second modified example. [Figure 8] FIG. 13 is a plan view of a third modified example. [Figure 9] FIG. 9 is an enlarged view of the printed circuit board shown in FIG. [Figure 10] FIG. 10 is a cross-sectional view taken along the line AA in FIG. [Figure 11] FIG. 10 is a cross-sectional view taken along the line BB in FIG. [Figure 12] 12A and 12B are diagrams showing steps for preparing a kit. Fig. 12A shows a step for preparing a frame and a mounting part. Fig. 12B shows a step for attaching a connector to the frame and the mounting part. [Figure 13] FIG. 13 is a cross-sectional view of a fourth modified example. [Figure 14] FIG. 13 is a cross-sectional view of a fifth modified example. [Figure 15] FIG. 13 is a plan view of a sixth modified example. [Figure 16] FIG. 13 is a plan view of a seventh modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] 1. One embodiment of a printed circuit board An embodiment of the wired circuit board of the present invention will be described with reference to Figures 1 to 3. In Figure 1, the intended mounting area 5 is hatched to clearly show the arrangement and shape of the intended mounting area 5.

[0028] 1.1 Basic structure of the printed circuit board 1 As shown in Fig. 1, the wired circuit board 1 has a sheet shape. The wired circuit board 1 has a thickness. The wired circuit board 1 extends in a planar direction. The planar direction is perpendicular to the thickness direction. The wired circuit board 1 includes a frame 2, a mounting portion 3, and a joint 4.

[0029] 1.2 Frame 2 The frame 2 has a thickness and extends in the surface direction. The frame 2 has a substantially rectangular frame shape in a plan view. A plan view is the same as a view in a direction perpendicular to the thickness direction. The frame 2 has a thickness. The frame 2 has an outer peripheral edge 21 and an inner peripheral edge 22.

[0030] 1.3 Mounting section 3 The mounting portion 3 has a thickness and extends in the planar direction. The mounting portion 3 is surrounded by the frame 2. The mounting portion 3 is spaced apart from the frame 2. The mounting portion 3 has a substantially rectangular shape in a plan view. Preferably, the mounting portion 3 has a substantially rectangular outer shape in a plan view, and specifically, has a substantially rectangular frame shape in a plan view.

[0031] The mounting portion 3 includes an outer circumferential edge 31 and an inner circumferential edge 32. The outer circumferential edge 31 faces the inner circumferential edge 22 of the frame 2.

[0032] The mounting portion 3 includes a planned element mounting portion 5. The planned element mounting portion 5 is disposed on an inner portion of the mounting portion 3. An outer periphery (virtual line) of the imaging element 7 is mounted on the planned element mounting portion 5. The planned element mounting portion 5 has a rectangular shape in a plan view. The planned element mounting portion 5 includes two first sides 51A, 51B and two second sides 52A, 52B. The two first sides 51A, 51B and the two second sides 52A, 52B are disposed between the outer periphery 31 and the inner periphery 32.

[0033] The two first sides 51A, 51B are parallel to each other. The two first sides 51A, 51B extend along a first direction. The two first sides 51A, 51B are spaced apart from each other.

[0034] The two second sides 52A, 52B connect one end of the first sides 51A, 51B in the first direction and connect the other end of the first sides 51A, 51B in the first direction. Specifically, the second side 52A connects one end of the first side 51A in the first direction to one end of the first side 51B in the first direction. The second side 52B connects the other end of the first side 51A in the first direction to the other end of the first side 51B in the first direction. The two second sides 52A, 52B are parallel to each other. The two second sides 52A, 52B are aligned along the second direction. The second direction is perpendicular to the first direction and the thickness direction. The two second sides 52A, 52B are spaced apart from each other in the first direction.

[0035] The outer periphery 31 of the mounting portion 3 includes two first outer sides 311A, 311B and two second outer sides 312A, 312B.

[0036] The two first outer sides 311A, 311B are parallel to each other. The two first outer sides 311A, 311B are aligned along a first direction. The two first outer sides 311A, 311B are spaced apart from each other. The first outer side 311A ​​faces the first side 51A. The first outer side 311A ​​faces the first side 51A. The first outer side 311B faces the first side 51B. The first outer side 311B faces the first side 51B.

[0037] The two second outer sides 312A, 312B are parallel to each other. The two second outer sides 312A, 312B are aligned along the second direction. The two second outer sides 312A, 312B are spaced apart from each other. The second outer side 312A connects one end of the first outer side 311A ​​in the first direction to one end of the first outer side 311B in the first direction. The second outer side 312A faces the second side 52A. The second outer side 312A faces the second side 52A. The second outer side 312B faces the second side 52B. The second outer side 312B faces the second side 52B.

[0038] The inner peripheral edge 22 of the frame 2 includes two first inner sides 221A, 221B and two second inner sides 222A, 222B.

[0039] The two first inner sides 221A, 221B are parallel to each other. The two first inner sides 221A, 221B are aligned along a first direction. The two first inner sides 221A, 221B are spaced apart from each other. The first inner side 221A faces the first outer side 311A. The first inner side 221A is aligned along the first outer side 311A. The first inner side 221B faces the first outer side 311B. The first inner side 221B is aligned along the first outer side 311B.

[0040] The two second inner sides 222A, 222B are parallel to each other. The two second inner sides 222A, 222B are aligned along the second direction. The second inner side 222A connects one end of the first inner side 221A in the first direction to one end of the first inner side 221B in the first direction. The second inner side 222A faces the second outer side 312A. The second inner side 222A is aligned along the second outer side 312A. The second inner side 222B connects the other end of the first inner side 221A in the first direction to the other end of the second inner side 222B in the first direction. The second inner side 222B faces the second outer side 312B. The second inner side 222B is aligned along the second outer side 312B.

[0041] 1.4 Joint 4 The joint 4 is disposed between the frame 2 and the mounting portion 3. The joint 4 connects the frame 2 and the mounting portion 3. The joint 4 bridges the inner peripheral edge 22 of the frame 2 and the outer peripheral edge 31 of the mounting portion 3. The joint 4 has a thickness and extends in the planar direction. The joint 4 includes two first joint portions 41A, 41B and two second joint portions 42A, 42B.

[0042] 1.4.1 Two first joint parts 41A, 41B and two second joint parts 42A, 42B The two first joint portions 41A, 41B and the two second joint portions 42A, 42B are spaced apart from each other between the inner circumferential edge 22 and the outer circumferential edge 31.

[0043] 1.4.1.1 First joint parts 41A and 41B The two first joint parts 41A and 41B are continuous with the two first inner sides 221A and 221B of the frame 2, respectively. The two first joint parts 41A and 41B are continuous with the two second outer sides 312A and 312B of the mounting part 3, respectively. The first joint part 41A connects the first inner side 221A and the second outer side 312A. The first joint part 41B connects the first inner side 221B and the second outer side 312B.

[0044] 1.4.1.2 Second joint parts 42A and 42B The two second joint parts 42A and 42B are continuous with the two second inner sides 222A and 222B of the frame 2, respectively. The two second joint parts 42A and 42B are continuous with the two first outer sides 311B and 311A ​​of the mounting part 3, respectively. The second joint part 42A connects the second inner side 222A and the first outer side 311B. The second joint part 42B connects the second inner side 222B and the first outer side 311A.

[0045] 1.5 Layer structure of frame 2 As shown in FIG. 3, the frame 2 includes a metal support layer 11, a base insulating layer 12, a wiring layer 13, and a cover insulating layer .

[0046] 1.5.1 Metal Support Layer 11 in Frame 2 The metal supporting layer 11 extends in the planar direction of the frame 2. The metal supporting layer 11 forms the other surface in the thickness direction of the frame 2. The metal supporting layer 11 has toughness.

[0047] The material of the metal support layer 11 in the frame 2 is, for example, a rigid material. Examples of the rigid material include stainless steel, 42 alloy, aluminum, copper-beryllium, phosphor bronze, copper, silver, nickel, chromium, titanium, tantalum, platinum, gold, and copper alloy.

[0048] As the rigid material, preferably, stainless steel and copper alloy are used from the viewpoint of ensuring the strength of the frame 2 and the mounting portion 3. The thickness of the metal support layer 11 in the frame 2 is in the range of, for example, 30 μm to 10,000 μm, or preferably 100 μm to 1,000 μm.

[0049] 1.5.2 Base insulating layer 12 in frame 2 In the frame 2, the insulating base layer 12 is disposed on one surface of the metal supporting layer 11 in the thickness direction. The insulating base layer 12 contacts one surface of the metal supporting layer 11.

[0050] The Young's modulus of the material of the base insulating layer 12 in the frame 2 at 25° C. is, for example, 2.0 GPa to 10.0 GPa, or preferably 2.0 GPa to 10.0 GPa. The material of the base insulating layer 12 in the frame 2 is, for example, a resin, or preferably a polyimide resin. The thickness of the base insulating layer 12 in the frame 2 is, for example, 1 μm to 20 μm, or preferably 5 μm to 15 μm.

[0051] 1.5.3 Wiring layer 13 in frame 2 In the frame 2, the wiring layer 13 is disposed on one surface of the base insulating layer 12 in the thickness direction. The wiring layer 13 contacts one surface of the base insulating layer 12. As shown in FIG. 2, the wiring layer 13 includes a plurality of frame terminals 131 and a plurality of frame wires 132.

[0052] 1.5.3.1 Frame terminal 131 The frame terminals 131 are provided corresponding to the first inner sides 221A and 221B and the second inner sides 222A and 222B, respectively. The frame terminals 131 corresponding to the first inner side 221A are spaced apart from one another along the first inner side 221A. Preferably, the frame terminals 131 are spaced apart from one another at equal intervals along the first inner side 221A. The frame terminals 131 corresponding to the first inner side 221A include a plurality of frame ground terminals 131G and a plurality of frame differential terminals 131D. Although not shown, the frame terminals 131 corresponding to the first inner side 221B (see FIG. 1), the second inner side 222A (see FIG. 1), and the second inner side 222B (see FIG. 1) have the same configuration as the frame terminals 131 corresponding to the first inner side 221A.

[0053] 1.5.3.2 Frame Wiring 132 The frame wirings 132 are electrically connected to the frame terminals 131, respectively. The frame wirings 132 corresponding to the first inner side 221A extend from the frame terminals 131 corresponding to the first inner side 221A, bend, converge to each other, and then reach the first inner side 221A. Specifically, each of the frame wirings 132 includes a frame extension line 132A and a frame convergence line 132B.

[0054] The frame extension lines 132A corresponding to the first inner side 221A extend from each of the plurality of frame terminals 131 corresponding to the first inner side 221A toward the first inner side 221A. A plurality of frame extension lines 132A corresponding to the first inner side 221A are provided corresponding to the plurality of frame terminals 131 corresponding to the first inner side 221A.

[0055] The multiple frame extension lines 132A are spaced apart from one another in a direction along the first inner side 221A. Each of the multiple frame extension lines 132A extends in a direction intersecting with the first inner side 221A.

[0056] The frame extension line 132A includes a plurality of frame ground extension lines 132AG and a plurality of frame differential extension lines 132AD. Each of the frame ground extension lines 132AG extends from each of the frame ground terminals 131G. Each of the frame differential extension lines 132AD extends from each of the frame differential terminals 131D.

[0057] In the frame 2, an area in which the multiple frame extension lines 132A are provided is defined as a third portion 25.

[0058] The frame extension lines 132A corresponding to the first inner side 221B (see FIG. 1), the second inner side 222A (see FIG. 1), and the second inner side 222B (see FIG. 1) respectively have the same configuration as the frame extension line 132A corresponding to the first inner side 221A described above.

[0059] The frame converging lines 132B corresponding to the first inner side 221A are provided in a plurality of positions corresponding to the plurality of frame extending lines 132A corresponding to the first inner side 221A. The plurality of frame converging lines 132B converge to each other and head toward the vicinity of the second connecting portion 46 (described later) of the joint portion 4A of the frame 3. Each of the plurality of frame converging lines 132B starts from one end edge of the plurality of frame extending lines 132A and ends at a point where the frame extending lines 132A overlaps with the first inner side 221A in the thickness direction. The one end edge is an end edge of the frame extending line 132A on the opposite side of the frame terminal 131. The starting point of the frame converging line 132B is a first bending point in the frame wiring 132. The frame converging line 132B is bent in a region facing the second connecting portion 46 of the joint portion 4A. The above-mentioned bending of the frame converging line 132B is a second bending point in the frame wiring 132. The second bend point of the frame wiring 132 is spaced apart from the first bend point of the frame wiring 132 in the direction along the first inner side 221A. The second bend point faces the joint portion 4A in the direction perpendicular to the first inner side 221A, but may not face the corresponding frame terminal 131. The wiring density of the frame converging lines 132B is higher than the wiring density of the frame extending line 132A. The frame converging lines 132B may have equally spaced portions that are spaced apart from each other by equal intervals. In this embodiment, each of the frame converging lines 132B has a substantially L-shape.

[0060] In the frame 2, an area where the frame converging line 132B is provided is defined as the fourth portion 26. The fourth portion 26 is disposed between the first inner side 221A and the third portion 25. The first inner side 221A, the fourth portion 26, and the third portion 25 are arranged in order. The wiring density of the frame converging line 132B in the fourth portion 26 is higher than the wiring density of the frame extending line 132A in the third portion 25.

[0061] The frame convergence lines 132B corresponding to the first inner side 221B (see FIG. 1), the second inner side 222A (see FIG. 1), and the second inner side 222B (see FIG. 1) respectively have the same configuration as the frame convergence line 132B corresponding to the first inner side 221A described above.

[0062] Examples of the material of the wiring layer 13 in the frame 2 include conductors. The conductor is preferably copper. The thickness of the wiring layer 13 in the frame 2 is, for example, 1 μm to 50 μm, or 5 μm to 35 μm.

[0063] 1.5.4 Cover insulating layer 14 in frame 2 3, in the frame 2, the cover insulating layer 14 is disposed on one surface of the base insulating layer 12 in the thickness direction. The cover insulating layer 14 covers the frame wiring 132 (frame extension line 132A and frame convergence line 132B, see FIG. 2) which is a part of the wiring layer 13. The cover insulating layer 14 exposes the frame terminals 131 (frame ground terminal 131G and frame differential terminal 131D, see FIG. 2) which are the remaining parts of the wiring layer 13.

[0064] The material of the cover insulating layer 14 may be, for example, a resin, and preferably a polyimide resin. The cover insulating layer 14 in the frame 2 has a thickness of, for example, 5 μm to 100 μm, or preferably 5 μm to 50 μm.

[0065] 1.5.5 Frame 2 dimensions As shown in FIG. 1, the distance between the first inner sides 221A and 221B and the distance between the second inner sides 222A and 222B are, for example, 5 mm to 50 mm, preferably 8 mm to 30 mm. The lengths of the first inner sides 221A and 221B and the second inner sides 222A and 222B are, for example, 5 mm to 50 mm, preferably 8 mm to 30 mm. The width of the frame 2 is, for example, 0.1 mm to 50 mm, preferably 0.3 mm to 30 mm. The width of the frame 2 is the length between the outer peripheral edge 21 and the inner peripheral edge 22. The lengths of the first inner sides 221A and 221B and the second inner sides 222A and 222B are, for example, 15 mm to 60 mm.

[0066] As shown in FIG. 2, the width of each of the plurality of frame terminals 131 is, for example, 10 μm to 3,000 μm, or preferably 30 μm to 1,000 μm.

[0067] The pitch of the multiple frame terminals 131 is, for example, 30 μm to 2,000 μm, or preferably 50 μm to 1,000 μm. The pitch is the distance between the edges of adjacent frame terminals 131. Each of the two edges is one edge in the direction along the first inner side 221A. The definition of the pitch is the same below.

[0068] For example, the pitch of the evenly spaced portions of the frame convergent lines 132B is smaller than the pitch of the frame extension lines 132A. The pitch of the evenly spaced portions of the frame convergent lines 132B is, for example, 1,500 μm or less, preferably 1,000 μm or less, more preferably 800 μm or less, and for example, 10 μm or more. The ratio of the pitch of the evenly spaced portions of the frame convergent lines 132B to the pitch of the frame extension lines 132A is, for example, less than 1, preferably 0.8 or less, more preferably 0.5 or less, and for example, 0.01 or more.

[0069] The width of the frame wiring 132 is, for example, 1 μm to 3,000 μm, or preferably 5 μm to 1,000 μm.

[0070] 1.6 Layer structure of mounting part 3 As shown in FIG. 3, the mounting portion 3 includes a metal support layer 11, a base insulating layer 12, a wiring layer 13, and a cover insulating layer .

[0071] 1.6.1 Metal Support Layer 11 in Mounting Section 3 In the mounting portion 3, the metal support layer 11 extends in the planar direction. The metal support layer 11 forms the other surface of the mounting portion 3 in the thickness direction. The material and thickness of the metal support layer 11 in the mounting portion 3 are the same as those of the metal support layer 11 in the frame 2.

[0072] 1.6.2 Base insulating layer 12 in mounting portion 3 In the mounting portion 3, the base insulating layer 12 is disposed on one surface of the metal supporting layer 11 in the thickness direction. The base insulating layer 12 contacts one surface of the metal supporting layer 11. The material and thickness of the base insulating layer 12 in the mounting portion 3 are the same as those of the base insulating layer 12 in the frame 2.

[0073] 1.6.3 Wiring layer 13 in mounting portion 3 In the mounting portion 3, the wiring layer 13 is disposed on one surface of the base insulating layer 12 in the thickness direction. The wiring layer 13 contacts one surface of the base insulating layer 12. As shown in FIG. 2, the wiring layer 13 in the mounting portion 3 includes a plurality of terminals 133 and a plurality of wires 134.

[0074] 1.6.3.1 Terminal 133 The multiple terminals 133 are provided corresponding to the first outer sides 311A, 311B and the second outer sides 312A, 312B (see FIG. 1). Specifically, the multiple terminals 133 corresponding to the second outer side 312A are spaced apart from one another in a direction along the second outer side 312A. Preferably, the multiple terminals 133 are spaced apart from one another at equal intervals in a direction along the second outer side 312A. The second side 52A is partitioned (formed) on a straight line along the outer end faces (or the vicinity thereof) of the multiple terminals 133 in the first direction. The multiple terminals 133 corresponding to the second outer side 312A include multiple ground terminals 133G and multiple differential terminals 133D. Although not shown, the multiple terminals 133 corresponding to the second outer side 312B (see Figure 1), the first outer side 311A ​​(see Figure 1), and the first outer side 311B (see Figure 1) have the same configuration as the terminal 133 corresponding to the second outer side 312A.

[0075] The second side 52B of the intended element mounting portion 5 is defined (formed) on a straight line along the outer end faces (or nearby areas) of the multiple terminals 133 in the first direction. Each of the first sides 51A and 51B is defined (formed) on a straight line along the outer end faces (or nearby areas) of the multiple terminals 133 in the second direction.

[0076] 1.6.3.2 Wiring 134 The multiple wirings 134 are electrically connected to the multiple terminals 133, respectively. The multiple wirings 134 are spaced apart from one another. The multiple wirings 134 corresponding to the second outer side 312A extend from the multiple terminals 133 corresponding to the second outer side 312A, then converge to one another, and then reach the second outer side 312A. Specifically, each of the multiple wirings 134 includes an extending line 134A and a converging line 134B.

[0077] The extension lines 134A corresponding to the second outer side 312A extend from each of the multiple terminals 133 corresponding to the second outer side 312A toward the second outer side 312A. A plurality of extension lines 134A corresponding to the second outer side 312A are provided corresponding to the multiple terminals 133 corresponding to the second outer side 312A.

[0078] The extension lines 134A are spaced apart from one another in a direction along the second outer side 312A. Each of the extension lines 134A extends in a direction intersecting the second outer side 312A. The extension lines 134A include a plurality of ground extension lines 134AG and a plurality of differential extension lines 134AD. Each of the ground extension lines 134AG extends from a respective one of the ground terminals 133G. Each of the differential extension lines 134AD extends from a respective one of the differential terminals 133D.

[0079] In the mounting portion 3, an area in which the multiple extension wires 134A are provided is defined as a first portion 36. In other words, the mounting portion 3 includes the first portion 36. In other words, in the first portion 36, the multiple wirings 134 extend from the multiple terminals 133.

[0080] The extension lines 134A corresponding to the second outer side 312B (see FIG. 1), the first outer side 311A, and the first outer side 311B respectively have the same configuration as the extension line 134A corresponding to the second outer side 312A described above.

[0081] The converging lines 134B corresponding to the second outer side 312A are provided in a plurality of positions corresponding to the extending lines 134A corresponding to the second outer side 312A. The converging lines 134B converge to each other and head toward the vicinity of the connection portion 45 (described later) of the joint portion 4A in the mounting portion 3. Each of the converging lines 134B starts from one end edge of the extending lines 134A and ends at a point where the extending lines 134A overlap with the second outer side 312A in the thickness direction. The one end edge is an end edge of the extending line 134A on the opposite side to the terminal 133. The starting point of the converging line 134B is a first bending point in the wiring 134. The converging line 134B is bent in a region facing the connection portion 45 of the joint portion 4A. The above-mentioned bending of the converging line 134B is a second bending point in the wiring 134. The second bend point of the wiring 134 is spaced apart from the first bend point of the wiring 134 in the direction along the second outer side 312A. The second bend point faces the joint portion 4A in the direction perpendicular to the second outer side 312A, but may not face the corresponding terminal 133. The wiring density of the multiple converging lines 134B is higher than the wiring density of the above-mentioned extension line 134A. The multiple converging lines 134B may have equally spaced portions that are spaced apart at equal intervals from each other. Each of the multiple converging lines 134B has a substantially L-shape.

[0082] In the mounting portion 3, the region where the converging line 134B is provided is defined as the second portion 37. In other words, the mounting portion 3 has the second portion 37. The second portion 37 is disposed between the second outer side 312A and the above-mentioned first portion 36. The second outer side 312A, the second portion 37, and the first portion 36 are aligned in order toward the inner periphery 32. In the second portion 37, the multiple wirings 134 converge. The wiring density of the converging line 134B in the second portion 37 is higher than the wiring density of the extending line 134A in the first portion 36.

[0083] 1.6.4 Cover insulating layer 14 in mounting portion 3 3, in the mounting portion 3, the cover insulating layer 14 is disposed on one surface of the base insulating layer 12 in the thickness direction. The cover insulating layer 14 covers the wiring 134 (extension line 134A and convergence line 134B, see FIG. 2) which is a part of the wiring layer 13. The cover insulating layer 14 exposes the terminal 133 (see FIG. 2) which is the remaining part of the wiring layer 13.

[0084] 1.6.5 Dimensions of mounting part 3 1, the distance between the second outer sides 312A and 312B and the distance between the first outer sides 311A ​​and 311B are each, for example, 3 mm to 50 mm, or preferably 5 mm to 30 mm. The length of each of the second outer sides 312A, 312B and the first outer sides 311A, 311B is, for example, 3 mm to 50 mm, or preferably 5 mm to 30 mm.

[0085] The width of the mounting portion 3 is in the range of, for example, 0.3 mm to 30 mm, or preferably 0.5 mm to 20 mm. The width of the mounting portion 3 is the length between the outer circumferential edge 31 and the inner circumferential edge 32.

[0086] As shown in FIG. 2, the width of each of the plurality of terminals 133 is the same as the width of each of the plurality of frame terminals 131 described above.

[0087] The pitch of the multiple terminals 133 is, for example, 30 μm to 2,000 μm, or preferably 50 μm to 1,000 μm. The interval between adjacent terminals 133 is, for example, 10 μm to 1,500 μm, or preferably 30 μm to 800 μm.

[0088] The pitch of the multiple extension lines 134A is, for example, the same as the pitch of the multiple terminals 133. The pitch of the equally spaced portions of the convergent lines 134B is smaller than the pitch of the multiple extension lines 134A. The pitch of the equally spaced portions of the convergent lines 134B is, for example, 1,500 μm or less, preferably 1,000 μm or less, more preferably 800 μm or less, and for example, 10 μm or more. The ratio of the pitch of the equally spaced portions of the convergent lines 134B to the pitch of the multiple extension lines 134A is, for example, less than 1, preferably 0.8 or less, more preferably 0.5 or less, and for example, 0.01 or more.

[0089] The width of the wiring 134 is the same as the width of the frame wiring 132 described above.

[0090] When the wired circuit board 1 is viewed in plan from its thickness direction, the area ratio of the joint 4 to the area defined between the frame 2 and the mounting portion 3 is, for example, 50% or less, preferably 40% or less, more preferably 35% or less, and even more preferably 30% or less. Moreover, the ratio is, for example, 1% or more, preferably 10% or more, more preferably 20% or more, and even more preferably 25% or more. When the ratio is within the range, the length, width, and / or thickness of the joint 4 can be set within an appropriate range, so that the mounting portion 3 can be corrected for shaking with a small force while the imaging element 7 can be reliably supported.

[0091] 1.7.1 Shape of the joint part 4A, etc. As shown in Fig. 2, the joint part 4A has a curved shape in a plan view. Preferably, the joint part 4A does not have a straight shape and / or a bent shape, but only has a curved shape. Specifically, the joint part 4A has an S-shape or a hook shape. If the joint part 4A has a curved shape, the stress can be alleviated evenly without being locally concentrated, and therefore the accuracy of the shake correction of the mounting part 3 can be improved.

[0092] The width of the joint portion 4A (the length in the direction perpendicular to the extension direction of the joint portion 4A and the direction perpendicular to the thickness direction) is in the range of, for example, 0.1 mm to 10 mm, or preferably 0.5 mm to 5 mm.

[0093] 1.7.2 Connection of the joint 4 to the mounting part 3 The joint part 4A is connected to the second portion 37 of the mounting part 3. In other words, the joint part 4A is not connected to the first portion 36 of the mounting part 3 where the multiple extending wires 134A having the same pitch as the multiple terminals 133 (relatively large pitch) are arranged, but is connected to the second portion 37 where the multiple converging wires 134B having a smaller pitch than the multiple terminals 133 are arranged.

[0094] The joint portion 4A includes a connection portion 45 that connects to the above-described second portion 37. For example, the connection portion 45 connects to the central region 34 of the second outer side 312A of the mounting portion 3, as shown in FIG.

[0095] The central region 34 is a region of the second outer side 312A that includes a central portion 35. The central portion 35 is the center point of the second outer side 312A and the area nearby. The central region 34 has a length that is 1 / 2 the length of the second outer side 312A. The central region 34 preferably has a length that is 1 / 3 the length of the second outer side 312A, and more preferably has a length that is 1 / 4 the length of the second outer side 312A.

[0096] Preferably, the joint portion 4A is connected to the central portion 35 of the second outer side 312A.

[0097] The ratio of the length of the connection portion 45 in the direction along the second outer side 312A to the length of the second outer side 312A (length of the connection portion 45 / length of the second outer side 312A) is, for example, 0.3 or less, preferably 0.25 or less, more preferably 0.2 or less, and is, for example, 0.01 or more.

[0098] If the ratio of the length of the connecting portion 45 in the direction along the second outer side 312A to the length of the second outer side 312A is equal to or less than the above-mentioned upper limit, the connecting portion 45 is prevented from expanding in the direction in which the second outer side 312A extends. Therefore, the rigidity of the joint portion 4A can be reliably reduced.

[0099] 1.7.3 Connection of Joint 4 to Frame 2 2, the joint portion 4A is connected to a fourth portion 26 of the frame 2. In other words, the joint portion 4A is not connected to a third portion 25 of the frame 2 in which a plurality of frame extension wires 132A having the same pitch as the plurality of frame terminals 131 (a relatively large pitch) are arranged, but is connected to a fourth portion 26 in which a plurality of converging wires 134B having a smaller pitch than the plurality of frame terminals 131 are arranged.

[0100] 1, the joint portion 4A includes a second connection portion 46 that connects to the fourth portion 26. For example, the second connection portion 46 connects to the second central region 29 of the first inner side 221A of the frame 2.

[0101] The second central region 29 is a region of the first inner side 221A that includes the second central portion 28. The second central portion 28 is the center point of the first inner side 221A and its vicinity. The second central region 29 has a length that is 1 / 2 the length of the first inner side 221A. Preferably, the second central region 29 has a length that is 1 / 3 the length of the first inner side 221A. More preferably, the second central region 29 has a length that is 1 / 4 the length of the first inner side 221A.

[0102] Preferably, the joint portion 4A is connected to the second central portion 28 of the first inner side 221A.

[0103] The ratio of the length of the second connection portion 46 in the direction along the first inner side 221A to the length of the first inner side 221A (length of the second connection portion 46 / length of the first inner side 221A) is, for example, 0.3 or less, preferably 0.25 or less, and more preferably 0.2 or less. If the ratio of the length of the second connection portion 46 in the direction along the first inner side 221A to the length of the first inner side 221A is equal to or less than the above-mentioned upper limit, the second connection portion 46 is prevented from expanding in the direction in which the first inner side 221A extends. Therefore, the rigidity of the joint portion 4A can be reliably reduced.

[0104] The lower limit of the ratio of the length of the second connection portion 46 in the direction along the first inner side 221A to the length of the first inner side 221A is, for example, equal to or greater than 0.01.

[0105] As shown in FIG. 2, the joint portion 4A includes a plurality of slits 421, 422, and 423, a plurality of wiring body portions 431 and 432, and ground wiring body portions 433 and 434.

[0106] 1.7.4 Slits 421, 422, 423 Each of the multiple slits 421, 422, 423 is disposed in a middle portion of the joint 4 in a direction intersecting (intersecting direction, preferably a perpendicular direction) the extension direction of the joint 4. The multiple slits 421, 422, 423 are spaced apart from one another in the intersecting direction.

[0107] Each of the multiple slits 421, 422, 423 is disposed over the entire joint 4 in the direction in which the joint 4 extends. The multiple slits 421, 422, 423 are lined up in order in the intersecting direction. The multiple slits 421, 422, 423 separate the wiring body 431, the wiring body 432, the ground wiring body 433, and the ground wiring body 434. As shown in Fig. 3, each of the multiple slits 421, 422, 423 penetrates the base insulating layer 12 and the cover insulating layer 14 in the thickness direction.

[0108] 1.7.5 Wiring body parts 431, 432 The wiring body portion 431 and the wiring body portion 432 are partitioned by slits 421, 422, and 423. The wiring body portion 431 and the wiring body portion 432 are spaced apart from each other in the intersecting direction. The multiple slits 421, 422, and 423 extend along the wiring body portions 431 and 432. Each of the wiring body portion 431 and the wiring body portion 432 includes four joint wires 1341, 1342, 1343, and 1344, a base insulating layer 12, and a cover insulating layer 14.

[0109] The joint wirings 1341, 1342, 1343, and 1344 are spaced apart from each other in the crossing direction. The joint wirings 1341, 1342, 1343, and 1344 are arranged in sequence in the crossing direction. The slits 421, 422, and 423 extend along the joint wirings 1341, 1342, 1343, and 1344. The joint wirings 1341, 1342, 1343, and 1344 can function as differential wirings. For example, the joint wirings 1341 and 1342 operate as a differential pair. The joint wirings 1343 and 1344 operate as a differential pair.

[0110] One base insulating layer 12 contacts the other surfaces of the joint wirings 1341, 1342, 1343, and 1344 in the thickness direction in each of the wiring body portions 431 and 432.

[0111] One cover insulating layer 14 collectively covers the joint wirings 1341, 1342, 1343, and 1344 in each of the wiring body portions 431 and 432. The cover insulating layer 14 contacts one surface and an outer surface of each of the joint wirings 1341, 1342, 1343, and 1344.

[0112] 1.7.6 Ground wiring body 433, 434 The ground wiring body 433 is disposed across the wiring body 431 from the slit 421. The ground wiring body 434 is disposed across the wiring body 432 from the slit 423. Each of the ground wiring bodies 433 and 434 includes a ground wiring 1345, a base insulating layer 12, and a cover insulating layer 14.

[0113] One base insulating layer 12 is in contact with the lower surface of the ground wire 1345 in the thickness direction in each of the ground wire bodies 433 and 434. The ground wire 1345 is thicker than the joint wires 1341, 1342, 1343, and 1344.

[0114] One cover insulating layer 14 covers the ground wire 1345 in each of the ground wire bodies 433, 434. The cover insulating layer 14 contacts one surface and an outer surface of the ground wire 1345 in the thickness direction.

[0115] 2, the ground wiring 1345 is electrically connected to a frame ground terminal 131G of the frame 2. Specifically, the ground wiring 1345 is electrically connected to the metal support layer 11 of the frame 2 via the converging line 134B corresponding to the ground extension line 134AG, the ground extension line 134AG, and the frame ground terminal 131G. In this way, the ground wiring 1345 is grounded to the frame ground terminal 131G.

[0116] 3, the joint portion 4A does not include a metal supporting layer 11. The metal supporting layer 11 is a layer disposed on the other side in the thickness direction of the insulating base layer 12. The material of the metal supporting layer 11 is, for example, the above-mentioned rigid material.

[0117] The joint portion 4A includes a base insulating layer 12, a wiring layer 13, and a cover insulating layer 14. Preferably, the joint portion 4A includes only the base insulating layer 12, the wiring layer 13, and the cover insulating layer 14.

[0118] 1.7.7 Base insulating layer 12 in joint portion 4A In the joint portion 4A, the base insulating layer 12 forms the other surface of the joint portion 4A in the thickness direction. The base insulating layer 12 is exposed toward the other side in the thickness direction. The material and thickness of the base insulating layer 12 in the joint 4 are the same as those of the base insulating layer 12 in the joint 4 of the frame 2.

[0119] The base insulating layer 12 has the above-mentioned multiple slits 421, 422, 423. They are arranged between the wiring body parts 431 and 432, between the wiring body part 431 and the ground wiring body part 433, and between the wiring body part 432 and the ground wiring body part 434.

[0120] 1.7.8 Wiring layer 13 in joint portion 4A In the joint portion 4A, the wiring layer 13 includes the joint wirings 1341, 1342, 1343, and 1344 described above, and the two ground wirings 1345 described above.

[0121] In the joint portion 4A, the wiring layer 13 is disposed on one surface of the base insulating layer 12 in the thickness direction. The wiring layer 13 contacts one surface of the base insulating layer 12. The joint wirings 1341, 1342, 1343, 1344 are spaced apart from each other in the intersecting direction (preferably, the perpendicular direction) in the joint portion 4A. As shown in FIG. 2, the joint wirings 1341, 1342, 1343, 1344 are electrically connected to the multiple wirings 134, respectively. In addition, the joint wirings 1341, 1342, 1343, 1344 are electrically connected to the multiple frame wirings 132, respectively. That is, the multiple joint wirings 1341, 1342, 1343, 1344 electrically connect the multiple frame wirings 132 in the frame 2 and the multiple wirings 134 in the mounting portion 3. The material and thickness of the wiring layer 13 in the joint 4 are the same as those of the wiring layer 13 in the frame 2. The Young's modulus at 25° C. of the material of the wiring layer 13 in the joint portion 4A is, for example, 20 GPa to 150 GPa.

[0122] 1.7.9 Cover insulating layer 14 in joint portion 4A 3, in the joint portion 4A, the cover insulating layer 14 forms one surface of the joint portion 4A in the thickness direction. The cover insulating layer 14 is exposed toward one side in the thickness direction. The cover insulating layer 14 is disposed on one surface of the base insulating layer 12 in the thickness direction. The cover insulating layer 14 covers a plurality of joint wirings 1341, 1342, 1343, and 1344 and a ground wiring 1345.

[0123] The cover insulating layer 14 has the above-mentioned multiple slits 421, 422, 423 together with the base insulating layer 12. Each of the multiple slits 421, 422, 423 penetrates the cover insulating layer 14 in the thickness direction. The inner surfaces partitioning each of the multiple slits 421, 422, 423 in the cover insulating layer 14 are flush with the inner surfaces partitioning each of the multiple slits 421, 422, 423 in the base insulating layer 12. The material and thickness of the base insulating layer 12 in the cover insulating layer 14 may be the same as the material and thickness of the base insulating layer 12 in the frame 2.

[0124] 1.7.10 Dimensions of joint part 4A The ratio of the thickness of the ground wiring 1345 to the thickness of the joint wirings 1341, 1342, 1343, and 1344 is, for example, 0.5 or more, preferably 0.8 or more, more preferably 1 or more, and for example, not more than 10. The thickness of the joint wirings 1341, 1342, 1343, and 1344 is the same as the thickness of the frame wiring 132. The thickness of the ground wiring 1345 is, for example, 3 μm to 100 μm, or preferably 6 μm to 50 μm.

[0125] The wiring bodies 431 and 432 each have a thickness of, for example, 3 μm to 100 μm, or preferably 5 μm to 50 μm.The wiring bodies 431 and 432 each have a width of, for example, 5 μm to 500 μm, or preferably 10 μm to 300 μm.

[0126] The ground wiring bodies 433 and 434 each have a thickness of, for example, 3 μm to 100 μm, or preferably 5 μm to 50 μm.The ground wiring bodies 433 and 434 each have a width of, for example, 5 μm to 500 μm, or preferably 10 μm to 300 μm.

[0127] The width of each of the slits 421, 422, and 423 is in the range of, for example, 5 μm to 500 μm, or preferably 10 μm to 300 μm.

[0128] 1.8 First force, second force, third force 1.8.1 First force The first force per unit length required when moving the mounting portion 3 relative to the frame 2 in the first direction is 0.01 mN / mm or more, preferably 0.05 mN / mm or more, more preferably 0.1 mN / mm or more, even more preferably 0.3 mN / mm or more, and particularly preferably 0.5 mN / mm or more. If the first force is equal to or greater than the above-mentioned lower limit, the frame 2 can reliably support the imaging element 7 via the mounting portion 3.

[0129] The first force is 5 mN / mm or less, preferably 4 mN / mm or less, more preferably 3 mN / mm or less, even more preferably 2 mN / mm or less, and particularly preferably 1 mN / mm or less. If the first force is equal to or less than the above upper limit, the vibration of the mounting part can be corrected with a small force.

[0130] The first force is 0.01 mN / mm to 5 mN / mm, preferably 0.05 mN / mm to 4 mN / mm, more preferably 0.1 mN / mm to 3 mN / mm, even more preferably 0.3 mN / mm to 2 mN / mm, and particularly preferably 0.5 mN / mm to 1 mN / mm. If the first force is within the above range, the imaging element 7 can be reliably supported while the shaking of the mounting portion 3 can be corrected with a small force.

[0131] The first force per unit length required when moving the mounting portion 3 relative to the frame 2 to one side in the first direction is the same as the first force per unit length required when moving the mounting portion 3 relative to the frame 2 to the other side in the first direction.

[0132] When the mounting unit 3 is moved to one side or the other side in the first direction relative to the frame 2, the orientation of the mounting unit 3 relative to the frame 2 is maintained. The state in which the orientation of the mounting unit 3 relative to the frame 2 is maintained means a state in which the first outer side 311A ​​and the first inner side 221A are kept parallel to each other, and the second outer side 312A and the second inner side 222A are kept parallel to each other.

[0133] By adjusting the shape, arrangement and material of the joint 4, the first force is designed (adjusted).

[0134] The first force is calculated by a simulation that performs linear static analysis on the shape, arrangement, and material of the joint 4. The first force can also be determined by actual measurement. When actually measuring the first force, for example, the frame 2 is fixed to a fixed portion of a measuring device, a stress measurement portion of the measuring device is fixed to the element mounting portion 5 of the mounting portion 3, and then the stress measurement portion is moved in a first direction relative to the fixed portion to measure the stress that the stress measurement portion receives in the first direction.

[0135] 1.8.2 Second force The second force per unit length required to move the mounting portion 3 relative to the frame 2 in the second direction is, for example, equal to or less than the first force. In other words, the first force is, for example, equal to or greater than the second force. That is, for example, the second force is the same as the first force or less than the first force.

[0136] The second force is, for example, 0.01 mN / mm or more, preferably 0.05 mN / mm or more, more preferably 0.1 mN / mm or more, more preferably 0.3 mN / mm or more, and particularly preferably 0.5 mN / mm or more. If the second force is equal to or greater than the above-mentioned lower limit, the frame 2 can reliably support the imaging element 7 via the mounting portion 3.

[0137] The second force is, for example, 5 mN / mm or less, preferably less than 5 mN / mm, more preferably 4 mN / mm or less, even more preferably 3 mN / mm or less, particularly preferably 2 mN / mm or less, and most preferably 1 mN / mm or less. If the second force is equal to or less than the above-mentioned upper limit, the vibration of the mounting part can be corrected with a small force.

[0138] The second force is, for example, 0.01 mN / mm to 5 mN / mm, preferably 0.05 mN / mm to 4 mN / mm, more preferably 0.1 mN / mm to 3 mN / mm, more preferably 0.3 mN / mm to 2 mN / mm, and particularly preferably 0.5 mN / mm to 1 mN / mm. If the second force is within the above range, the imaging element 7 can be reliably supported while the vibration of the mounting portion 3 can be corrected with a small force.

[0139] The second force per unit length required when moving the mounting portion 3 relative to the frame 2 to one side in the second direction is the same as the second force per unit length required when moving the mounting portion 3 relative to the frame 2 to the other side in the second direction.

[0140] The ratio of the first force to the second force is, for example, 0.50 to 1.50.

[0141] When the mounting portion 3 is moved relative to the frame 2 to one side or the other side in the second direction, the attitude of the mounting portion 3 relative to the frame 2 is maintained.

[0142] By adjusting the shape, arrangement and material of the joint 4, the second force is designed (adjusted).

[0143] The second force is calculated by a simulation that performs linear static analysis on the shape, arrangement, and material of the joint 4. The second force can also be determined by actual measurement. When actually measuring the second force, for example, the frame 2 is fixed to a fixed portion of a measuring device, and a stress measurement portion of the measuring device is fixed to the element mounting portion 5 of the mounting portion 3, and then the stress measurement portion is moved in a second direction relative to the fixed portion to measure the stress that the stress measurement portion receives in the second direction.

[0144] 1.8.3 Third force A third force per unit length required when moving the mounting portion 3 relative to the frame 2 in the thickness direction is, for example, less than the first force per unit length required when moving the mounting portion 3 relative to the frame 2 in the first direction.

[0145] The third force is, for example, 0.01 mN / mm or more, preferably 0.05 mN / mm or more, more preferably 0.1 mN / mm or more, more preferably 0.3 mN / mm or more, and particularly preferably 0.5 mN / mm or more. If the third force is equal to or greater than the above-mentioned lower limit, the frame 2 can reliably support the imaging element 7 via the mounting portion 3.

[0146] The third force is, for example, 5 mN / mm or less, preferably less than 5 mN / mm, more preferably 4 mN / mm or less, even more preferably 3 mN / mm or less, particularly preferably 2 mN / mm or less, and most preferably 1 mN / mm or less. If the third force is equal to or less than the above upper limit, the vibration of the mounting part can be corrected with a small force.

[0147] The third force is, for example, 0.01 mN / mm to 5 mN / mm, preferably 0.05 mN / mm to 4 mN / mm, more preferably 0.1 mN / mm to 3 mN / mm, more preferably 0.3 mN / mm to 2 mN / mm, and particularly preferably 0.5 mN / mm to 1 mN / mm. If the third force is within the above range, the imaging element 7 can be reliably supported while the vibration of the mounting portion 3 can be corrected with a small force.

[0148] The third force per unit length required when moving the mounting portion 3 relative to the frame 2 to one side in the third direction is the same as the third force per unit length required when moving the mounting portion 3 relative to the frame 2 to the other side in the third direction.

[0149] When the mounting portion 3 is moved relative to the frame 2 to one side or the other side in the third direction, the attitude of the mounting portion 3 relative to the frame 2 is maintained.

[0150] By adjusting the shape, arrangement and material of the joint 4, the third force is designed (adjusted).

[0151] The third force is calculated by a simulation that performs linear static analysis on the shape, arrangement, and material of the joint 4. The third force can also be determined by actual measurement. When actually measuring the third force, for example, the frame 2 is fixed to a fixing part of a measuring device, and a stress measuring part of the measuring device is fixed to the element mounting part 5 of the mounting part 3, and then the stress measuring part is moved in the third direction relative to the fixing part, and the stress that the stress measuring part receives in the third direction is measured.

[0152] 1.9 Manufacturing method of the wired circuit board 1 A method for manufacturing the wired circuit board 1 and mounting the imaging element 7 will be described with reference to FIGS. 4A to 4E.

[0153] 4A, in this method, first, a base insulating layer 12 is formed on one surface in the thickness direction of a metal support plate 110. The metal support plate 110 is a metal plate for forming the metal support layer 11. The metal support plate 110 is made of the same material as the metal support layer 11 and has the same thickness as the metal support layer 11.

[0154] For example, a resin is applied to one surface of the metal support plate 110, and the base insulating layer 12 having a pattern corresponding to the frame 2, the mounting portion 3, and the joint 4 is formed by photolithography. In this process, the base insulating layer 12 of the frame 2, the base insulating layer 12 of the mounting portion 3, and the base insulating layer 12 of the joint 4 are formed simultaneously.

[0155] As shown in FIG. 4B, the wiring layer 13 is then formed on one surface of the base insulating layer 12 in the thickness direction. For example, the wiring layer 13 is formed by a conductor pattern forming method. Examples of the conductor pattern forming method include an additive method and a subtractive method, and preferably, an additive method. To form the wiring layer 13 by the additive method, first, the wiring layer 13 of the frame 2, a part of the wiring layer 13 of the mounting portion 3 (see imaginary lines), and the wiring layer 13 of the joint 4 are simultaneously formed. The part of the wiring layer 13 of the mounting portion 3 (see imaginary lines) is the joint wirings 1341, 1342, 1343, and 1344, and the other side part of the ground wiring 1345 in the thickness direction. Then, the one side part of the ground wiring 1345 in the thickness direction is laminated on the other side part of the ground wiring 1345.

[0156] As shown in FIG. 4C, next, the cover insulating layer 14 is formed on one surface of the base insulating layer 12 in the thickness direction so as to cover the frame wiring 132, the wiring 134, and the joint wirings 1341, 1342, 1343, and 1344.

[0157] For example, resin is applied to one side of the metal support plate 110, the base insulating layer 12, and the wiring layer 13, and a cover insulating layer 14 having a pattern corresponding to the frame 2, the mounting portion 3, and the joint 4 is formed by photolithography. In this process, the cover insulating layer 14 of the frame 2, the cover insulating layer 14 of the mounting portion 3, and the cover insulating layer 14 of the joint 4 are formed simultaneously.

[0158] As shown in FIG. 4D, the metal support plate 110 is then contour-processed to form the metal support layer 11. Examples of contour processing include etching, punching, and laser. From the viewpoint of productivity, etching is preferably used as the contour processing. By contour processing of the metal support plate 110, the metal support plate 110 between the frame 2 and the mounting portion 3 is removed. As a result, the joint 4 does not include the metal support layer 11.

[0159] 4E, thereafter, the imaging element 7 is mounted on the intended element mounting portion 5 of the mounting portion 3. The electrodes 71 of the imaging element 7 are electrically connected to a plurality of terminals 133 on the mounting portion 3. The imaging element 7 is mounted on the mounting portion 3 via a mounting board (not shown).

[0160] Additionally, the external substrate 6 is mounted on the frame 2. The electrodes 61 of the external substrate 6 are electrically connected to the multiple frame terminals 131 of the frame 2. The outer periphery 21 (see FIG. 1) of the frame 2 may be supported by an external member (not shown).

[0161] 2. Effects of one embodiment

[0162] In this wired circuit board 1, the first force is 5.0 mN / mm or less, so that the vibration of the mounting portion 3 can be corrected with a small force.

[0163] In this wired circuit board 1, the first force is equal to or greater than 0.01 mN / mm, so that the frame 2 can reliably support the imaging element 7 via the mounting portion 3.

[0164] In this wired circuit board 1, the joint 4 is connected to the second portion 37 where the multiple wires 134 converge. Therefore, in the joint 4, the connection portion 45 connected to the second portion 37 can be prevented from expanding. As a result, the rigidity of the joint 4 can be reliably reduced.

[0165] In this wired circuit board 1, the ratio of the length of connection portion 45 in the direction along second outer side 312A to the length of second outer side 312A (length of connection portion 45 / length of second outer side 312A) is 0.3 or less, which prevents expansion of connection portion 45. Therefore, the rigidity of joint 4 can be reliably reduced.

[0166] Furthermore, when the mounting part 3 moves and the joint 4 bends, if the connection part 45 widens, the difference between the force applied to the center part of the joint 4 in the width direction and the force applied to one end part of the joint 4 in the width direction increases, and as a result, it may not be possible to accurately control the vibration of the mounting part 3.

[0167] However, in this wired circuit board 1, when the frame 2 moves and the joint 4 bends, the connection portion 45 is prevented from widening, and the difference between the force applied to the center portion in the width direction of the joint 4 and the force applied to one end portion in the width direction is reduced, thereby enabling the vibration of the mounting portion 3 to be controlled with precision.

[0168] In this wired circuit board 1, the joint 4 is connected to the central region 34, so that the vibration of the mounting portion 3 can be controlled with high precision.

[0169] In this wired circuit board 1, the joint 4 does not include the metal support layer 11. This reduces the rigidity of the joint 4. As a result, the vibration of the mounting portion 3 can be corrected with a small force.

[0170] In this wired circuit board 1, the base insulating layer 12 and the cover insulating layer 14 in the joint 4 have slits 421, 422, and 423, so that the rigidity of the joint 4 can be further reduced.

[0171] 3. Variations In the following modifications, the same components and steps as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. In addition, each modification can achieve the same effects as those in the above-described embodiment, unless otherwise specified. Furthermore, the embodiment and its modifications can be appropriately combined.

[0172] 3.1 First modified example In the first modified example, as shown in FIG. 5, the joint 4 includes sub-joints 4511, 4512, 4521, 4522, 4531, and 4532.

[0173] The sub-joints 4511, 4512 divide the slit 421 in the direction that the slit 421 extends. The sub-joints 4511, 4512 are spaced apart in the direction that the slit 421 extends.

[0174] Sub-joints 4521 and 4522 divide slit 422 in the direction in which slit 422 extends. Sub-joints 4521 and 4522 are spaced apart in the direction in which slit 422 extends. As shown in Fig. 6, each of sub-joints 4521 and 4522 connects wiring body portion 431 and wiring body portion 432. Also, each of sub-joints 4521 and 4522 connects joint wiring 1344 of wiring body portion 431 and joint wiring 1341 of wiring body portion 432.

[0175] The sub-joints 4531, 4532 divide the slit 423 in the direction that the slit 421 extends. The sub-joints 4531, 4532 are spaced apart in the direction that the slit 423 extends.

[0176] 5, the sub-joints 4511, 4521, and 4531 are lined up in a direction intersecting (intersecting, preferably perpendicular) the extension direction of the joint 4. The sub-joints 4512, 4522, and 4532 are lined up in a direction intersecting (intersecting, preferably perpendicular) the extension direction of the joint 4.

[0177] 6, the sub-joints 4511, 4512, 4521, 4522, 4531, and 4532 do not include the cover insulating layer 14, but include the base insulating layer 12. In this modification, the sub-joints 4511, 4512, 4521, 4522, 4531, and 4532 include only the base insulating layer 12.

[0178] According to the first modified example, the sub-joints 4521 and 4522 can prevent the rigidity of the joint 4 from being excessively reduced due to the slit 422. Therefore, excessive deformation of the joint 4 can be suppressed.

[0179] 3.2 Further modification of the first modification Although not shown, the sub-joints 4511 , 4512 , 4521 , 4522 , 4531 , 4532 may include a base insulating layer 12 and a cover insulating layer 14 .

[0180] Although not shown, the sub-joints 4511 , 4512 , 4521 , 4522 , 4531 , and 4532 may include only the cover insulating layer 14 .

[0181] 3.3 Second variant As shown in FIG. 7, each of the frame 2, the mounting portion 3, and the joint 4 does not necessarily have to include the metal supporting layer 11.

[0182] In the second modified example, the frame 2 is supported by the external substrate 6 and an external member (not shown), and the mounting portion 3 is supported by the imaging element 7, so the rigidity of the joint 4 is low compared to the rigidity of each of the frame 2 and the mounting portion 3. Therefore, the shaking of the mounting portion 3 can be corrected with a small force.

[0183] 3.4 Other Variations Although not shown, the mounting portion 3 does not have to have the second portion 37. In this case, the joint portion 4A is connected to the first portion 36 of the mounting portion 3.

[0184] Preferably, as in one embodiment, the mounting portion 3 has a second portion 37, and the joint portion 4A is connected to the second portion 37 of the mounting portion 3. In one embodiment, the connection portion 45 connected to the second portion 37 in the joint 4 can be prevented from expanding in the intersecting direction (width direction). As a result, the rigidity of the joint 4 can be reliably reduced.

[0185] In one embodiment, the inner periphery 22 of the frame 2 includes two first inner sides 221A, 221B and two second inner sides 222A, 222B, but in a variant, the inner periphery 22 may include a curved line. Specifically, the inner periphery 22 may have no inner side and may be circular.

[0186] In one embodiment, the outer peripheral edge 31 of the mounting portion 3 includes two first outer sides 311A, 311B and two second outer sides 312A, 312B, but in a modified example, the outer peripheral edge 31 may include a curved line. Specifically, the outer peripheral edge 31 may have no outer sides and may be circular.

[0187] In one embodiment, the mounting portion 3 has an inner peripheral edge 32 , but in alternative embodiments, the mounting portion 3 does not have an inner peripheral edge 32 .

[0188] The joint portion 4A may have a substantially wave shape. The number of the joints 4 may be two. The joints 4 may have a straight shape and / or a bent shape.

[0189] 3.5 Third variant As shown in FIG. 8, the wired circuit board 1 of the third modified example further includes connectors 8 and 9 in addition to the frame 2, mounting portion 3, and joint 4 described above.

[0190] 3.5.1 Frame 2 The frame terminal 131 of the frame 2 faces the first inner side 221A. The frame terminal 131 of the frame 2 is disposed between the first inner side 221A and the outer side disposed on the outer side thereof.

[0191] 3.5.2 Joint 4 The joint 4 is separate from the frame 2 and the mounting portion 3. As shown in Fig. 10, the joint 4 includes a joint base layer 41, a joint wiring layer 42, and a joint cover layer 43. The joint 4 does not include a metal support layer 11. The joint 4 also does not include an adhesive layer.

[0192] The joint base layer 41 forms the other surface of the joint 4A in the thickness direction. The joint base layer 41 is exposed toward the other side in the thickness direction. The material of the joint base layer 41 may be the same as or different from the material of the base insulating layer 12 in the frame 2. The thickness of the joint base layer 41 is, for example, 1 μm to 20 μm, preferably 5 μm to 15 μm.

[0193] The joint wiring layer 42 is disposed on one surface of the joint base layer 41 in the thickness direction. The joint wiring layer 42 is in contact with the one surface of the joint base layer 41. As shown in FIG.

[0194] A plurality of joint wires 421 are arranged at intervals in a direction intersecting (intersecting direction, preferably a direction perpendicular to) the extension direction of the joint 4. The joint wire 421 is arranged in the middle of the joint 4 in the extension direction of the joint 4.

[0195] The joint terminal 422 includes a first terminal 4221 and a second terminal 4222. The first terminal 4221 is disposed at one end of the joint 4 in the extension direction of the joint 4. The first terminal 4221 extends to one side from one end edge of the joint wire 421 in the extension direction of the joint 4. As shown in FIG. 9 , a plurality of first terminals 4221 are provided corresponding to the plurality of joint wires 421.

[0196] The second terminal 4222 is disposed at the other end of the joint 4 in the extension direction of the joint 4. The second terminal 4222 extends from the other end edge of the joint wire 421 to the other side in the extension direction of the joint 4. A plurality of second terminals 4222 are provided corresponding to the plurality of joint wires 421.

[0197] The joint 4 further includes slits 441 , 442 , 443 , and 444 .

[0198] 3.5.3 Connector 8 8, the connector 8 is disposed on the frame 2. A plurality of connectors 8 are provided corresponding to the two first inner sides 221A, 221B and the two second inner sides 222A, 222B. The plurality of connectors 8 include two first connector portions 81A, 81B and two second connector portions 82A, 82B.

[0199] The first connector portion 81A corresponds to the first inner side 221A. The first connector portion 81B corresponds to the first inner side 221B. The second connector portion 82A corresponds to the second inner side 222A. The second connector portion 82B corresponds to the second inner side 222B. The first connector portion 81A will be described in detail below. The first connector portion 81B and the second connector portions 82A and 82B have the same configuration as the first connector portion 81A, and their description will be omitted.

[0200] 11, the first connector portion 81A is disposed on one side of the metal supporting layer 11 in the thickness direction. Specifically, the first connector portion 81A is disposed on one surface of the base insulating layer 12 in the thickness direction. The other surface of the first connector portion 81A in the thickness direction is fixed to one surface of the frame 2 in the thickness direction.

[0201] The first connector portion 81A has a recess 83A. The recess 83A includes a connector terminal. The connector terminal is electrically connected to the wiring layer 13 in the frame 2. Specifically, the connector terminal is electrically connected to the frame wiring 132 (see FIG. 9). When a first terminal 4221 (described later) of the joint 4 contacts the connector terminal, a joint wiring layer 142 (see FIG. 9) of the joint 4 and a wiring layer 13 (see FIG. 9) of the frame 2 are electrically connected via the connector terminal. The recess 83A is configured so that one end of the joint portion 4A can be inserted and fixed. In this embodiment, the first connector portion 81A is a ZIF connector. The recess 83A faces the mounting portion 3. Specifically, as shown in FIG. 8, the recess 83A faces the first outer side 311A ​​of the mounting portion 3.

[0202] 3.5.4 Connector 9 The connector 9 is disposed on the mounting portion 3. A plurality of connectors 9 are provided corresponding to the two first outer sides 311A, 311B and the two second outer sides 312A, 312B. The plurality of connectors 9 include two third connector portions 91A, 91B and two fourth connector portions 92A, 92B.

[0203] The third connector portion 91A corresponds to the first outer side 311A. The third connector portion 91B corresponds to the first outer side 311B. The fourth connector portion 92A corresponds to the second outer side 312A. The fourth connector portion 92B corresponds to the second outer side 312B. The fourth connector portion 92A will be described in detail below. The third connector portions 91A, 91B and the fourth connector portion 92B have the same configuration as the fourth connector portion 92A, and therefore descriptions thereof will be omitted.

[0204] 11, the fourth connector portion 92A is disposed on one side of the metal supporting layer 11 in the thickness direction. Specifically, the fourth connector portion 92A is disposed on one surface of the base insulating layer 12 in the thickness direction. The other surface of the fourth connector portion 92A in the thickness direction is fixed to one surface of the mounting portion 3 in the thickness direction.

[0205] The fourth connector portion 92A has a recess 94A. The recess 94A includes a connector terminal. The connector terminal is electrically connected to the wiring layer 13 in the mounting portion 3. Specifically, the connector terminal is electrically connected to the wiring 134 (see FIG. 9). When a second terminal 4222 (described later, see FIG. 11) of the joint 4 contacts the connector terminal, the joint wiring layer 1421 of the joint 4 and the wiring layer 13 (see FIG. 3) of the mounting portion 3 are electrically connected via the connector terminal. The recess 94A is configured so that the other end of the joint portion 4A can be inserted into the recess 94A to fix the other end of the joint portion 4A. In this embodiment, the fourth connector portion 92A is a ZIF connector. The recess 94A faces the frame 2. Specifically, as shown in FIG. 1, the recess 94A faces the second inner side 222A of the frame 2.

[0206] 3.5.5 Manufacturing method of the wired circuit board 1 A method for manufacturing the wired circuit board 1 and mounting the imaging element 7 will be described with reference to FIGS. 10, 12A, and 12B.

[0207] The method for producing the wired circuit board 1 includes steps (1) and (2). Steps (1) and (2) are carried out in this order.

[0208] 3.5.6 Process (1) As shown in FIG. 12B, in step (1), a kit 10 is prepared.

[0209] The kit 10 includes the frame 2, the mounting portion 3, and the joint 4 described above. Specifically, the kit 10 includes the frame 2, the mounting portion 3, and the joint 4, which are separated from each other. In the kit 10, when the joint 4 connects the frame 2 and the mounting portion 3, the joint 4 becomes a separate body from the frame 2 and the mounting portion 3. In other words, in step (1), the joint 4 has not yet connected the frame 2 and the mounting portion 3 to the joint 4. Specifically, one end of the joint 4 has not yet been inserted into and fixed to the connector 8 of the frame 2. The other end of the joint 4 has not yet been inserted into and fixed to the connector 9 of the mounting portion 3.

[0210] 3.5.7 Preparation of Frame 2 and Mounting Part 3 12A, for example, a base insulating layer 12, a wiring layer 13, and a cover insulating layer 14 are sequentially formed on one surface of a metal plate in the thickness direction. The base insulating layer 12 and the cover insulating layer 14 are formed by photoprocessing a photosensitive resin. The wiring layer 13 is formed by, for example, an additive method or a subtractive method.

[0211] Thereafter, the metal plate is processed to form the metal support layer 11. The processing is performed by, for example, etching.

[0212] In the manner described above, the frame 2 and the mounting portion 3 are prepared. In this embodiment, the frame 2 and the mounting portion 3 are prepared in a separated state.

[0213] 3.5.8 Preparation of Joint 4 For example, a joint wiring layer 142 and a joint cover layer 143 are formed in this order on one surface of a joint base layer 141. For example, an additive method or a subtractive method is used to form the joint wiring layer 142. For example, a photoprocessing method for a photosensitive resin is used to form the joint cover layer 143.

[0214] Thereafter, the slits 441, 442, 443, and 444 are formed in the joint base layer 141 and the joint cover layer 143. The slits 441, 442, 443, and 444 are formed, for example, by laser processing. In this way, the joint 4 is prepared.

[0215] 12B, the connector 8 is attached to the frame 2. The connector 9 is attached to the mounting portion 3. In this way, the kit 10 is prepared.

[0216] 3.5.9 Process (2) As indicated by the arrows in FIGS. 11 and 12B, in step (2), the frame 2 and the mounting portion 3 are connected by the joint 4.

[0217] Specifically, one end of the joint 4 is inserted into the recess 53A of the connector 8 (first connector portion 81A). The other end of the joint 4 is inserted into the recess 93A of the connector 9 (fourth connector portion 92A).

[0218] Then, the first terminal 4221 comes into contact with the connector terminal of the connector 8. The second terminal 4222 comes into contact with the connector terminal of the connector 9.

[0219] One end of the joint 4 is fixed to a connector 8. The other end of the joint 4 is fixed to a connector 9.

[0220] As a result, the joint 4 connects the frame 2 and the mounting portion 3 such that the joint 4 is separate from the frame 2 and the mounting portion 3 .

[0221] In this way, the wired circuit board 1 is manufactured.

[0222] 3.6 Fourth Variation As shown in FIG. 13, in this modification, the metal support layer 11 may be a rigid substrate 112. The rigid substrate 112 is bonded to the lower surface of the insulating base layer 12 in the thickness direction via an adhesive layer 113. The rigid substrate 112 includes a second insulating base layer 114 and a second wiring layer 115 in this order toward the other side in the thickness direction. The second insulating base layer 114 is rigid. Examples of materials for the second insulating base layer 114 include glass-epoxy resin. The rigid substrate 112 may further include a second insulating cover layer.

[0223] 3.7 Fifth Variation 14, each of the frame 2 and the mounting portion 3 includes a third base insulating layer 15, a third wiring layer 16, a third cover insulating layer 17, a fourth wiring layer 18, a fourth cover insulating layer 19, and a metal support layer 11. The joint 4 does not include the metal support layer 11, but includes the third base insulating layer 15, the third wiring layer 16, the third cover insulating layer 17, the fourth wiring layer 18, and the fourth cover insulating layer 19.

[0224] The third insulating base layer 15 extends in the planar direction. The shape, material and thickness of the third insulating base layer 15 may be the same as those of the base insulating layer 12 of the embodiment. The third insulating base layer 15 in the frame 2 and the mounting portion 3 has a through hole 151.

[0225] The third wiring layer 16 is disposed on one surface of the third insulating base layer 15 in the thickness direction. The third wiring layer 16 includes a third wire 161. The third wiring layer 16 in the frame 2 and the mounting portion 3 includes a third terminal 162. The third terminal 162 includes a protective layer 163 on one surface in the thickness direction.

[0226] The third cover insulating layer 17 is disposed on one surface in the thickness direction of the third insulating base layer 15. The third cover insulating layer 17 covers the third wiring 161 which is a part of the third wiring layer 16. The third cover insulating layer 17 may include an adhesive layer 171 on the other surface in the thickness direction.

[0227] The fourth wiring layer 18 is disposed on the other surface of the third insulating base layer 15 in the thickness direction. The fourth wiring layer 18 includes a fourth wiring 181. The fourth wiring layer 18 in the frame 2 and the mounting portion 3 includes a fourth terminal 182. The fourth terminal 182 is electrically connected to the third terminal 162 via a conductive connection portion 164. The conductive connection portion 164 is filled in the through hole 151.

[0228] The fourth cover insulating layer 19 is disposed on the other surface of the third base insulating layer 15 in the thickness direction. The fourth cover insulating layer 19 covers the fourth wiring layer 18. The fourth cover insulating layer 19 may include an adhesive layer 191 on one surface in the thickness direction. The fourth cover insulating layer 19 has a through hole 192.

[0229] The metal support layer 11 in the frame 2 and the mounting portion 3 is disposed on the other side of the fourth cover insulating layer 19 in the thickness direction. The metal support layer 11 is adhered to the other side of the fourth cover insulating layer 19 via an adhesive layer 111. The adhesive layer 111 has, for example, electrical conductivity. The adhesive layer 111 is disposed on the other side of the fourth cover insulating layer 19 in the thickness direction. A portion of the adhesive layer 111 fills the through hole 192. The joint 4 does not include an adhesive layer 111.

[0230] 3.8 Sixth Variation 15, the mounting portion 3 is integral with the joint 4. The mounting portion 3 and the joint 4 are provided in a mounting-part-attached joint 100. That is, the mounting portion-attached joint 100 integrally includes the mounting portion 3 and the joint 4. The wired circuit board 1 of the sixth modified example includes a frame 2, a connector 8, and the mounting portion-attached joint 100.

[0231] The frame terminal 131 of the frame 2 faces the second outer piece 312A of the mounting portion 3. The frame terminal 131 of the frame 2 is disposed between the second inner side 222A and the outer side disposed on the outer side thereof.

[0232] The connector 8 is disposed on the frame 2. Two connectors 8 (81A, 81B) are provided corresponding to the two first inner sides 221A, 221B. Both the recess 83A of the connector 81A and the recess 83B of the connector 81B open toward the other side in the first direction.

[0233] The joint part 100 with a mount portion includes a metal support layer 11, a base insulating layer 12, a wiring layer 13, and a cover insulating layer 14. The joint 4 in the joint part 100 with a mount portion includes a first joint part 41A and a second joint part 42A.

[0234] The first joint part 41A has a curved shape. At least a middle part in the extending direction of the first joint part 41A is curved. The first joint part 41A extends from the second outer side 312B of the mounting part 3 to the other side in the first direction and returns to one side in the first direction while curving. The tip part 411A of the first joint part 41A is inserted into the recessed part 83A of the connector 81A.

[0235] The second joint portion 42A is symmetrical with the first joint portion 41A with respect to the line L. The line L passes through the center of the mounting portion 3 along the first direction. The second joint portion 42A is spaced apart from the first joint portion 41. The second joint portion 42A has a curved shape. At least a middle portion of the second joint portion 42A in the extending direction is curved. The second joint portion 42A extends from the second outer side 312B of the mounting portion 3 to one side in the first direction and returns to the other side in the first direction while curving. The tip portion 421A of the second joint portion 42A is inserted into the recessed portion 83B of the connector 81B. The shapes of the first joint portion 41A and the second joint portion 42A are not particularly limited as long as the first force and the second force are both 0.01 mN / mm or more and 5.0 mN / mm or less. For example, at least one of the first joint part 41A and the second joint part 42A may have a shape in which a part of the joint part is bent, instead of the entire joint part being curved.

[0236] In the sixth modified example, the direction in which the two joints 41A, 41B are arranged side by side (or the direction in which they face each other) is the second direction. In the sixth modified example, the direction perpendicular to the two bent portions 4111 is the first direction.

[0237] In the sixth modified example, when the mounting portion 3 is moved relative to the frame 2 in the first direction, the degree of curvature of the two joints 41A, 41B varies (bends), and has the first force in the above-mentioned range.

[0238] 3.9 Seventh Variation 16, in the seventh modified example, the two joints 4 in the sixth modified example are arranged point-symmetrically with respect to the center of the mounting part 3. That is, the second joint part 42A is point-symmetrical with the first joint part 41A with respect to the center of the mounting part 3.

[0239] A recess 83B of the connector 81B opens toward one side in the first direction, that is, the recess 83B opens in the opposite direction to the recess 83A.

[0240] The second joint portion 42A extends from the second outer side 312A of the mounting portion 3 to one side in the first direction and returns to the other side in the first direction while curving. EXAMPLES

[0241] Example 1 A wired circuit board 1 shown in Figures 1 to 3 was manufactured. The wiring layer 13 was formed by an additive method.

[0242] The dimensions and materials were as follows: Joint 4 width: 850μm Width of slits 421, 422, 423: 40μm Width of wiring body parts 431, 432: 150 μm Thickness of wiring body parts 431, 432: 45 μm Width of ground wiring body 433, 434: 120 μm Thickness of ground wiring body 433, 434: 45 μm Thickness of base insulating layer 12: 12 μm Thickness of ground wiring 1345 at joint 4: 24 μm Width of ground wiring 1345 at joint 4: 50 μm Thickness of joint wiring 1341, 1342, 1343, 1344: 12 μm Width of joint wiring 1341, 1342, 1343, 1344: 20μm Thickness of cover insulating layer 14: 6 μm Thickness of metal support layer 11: 120 μm Materials of the base insulating layer 12 and the cover insulating layer 14: Polyimide Material of wiring layer 13 and Young's modulus at 25°C: copper, 45GPa

[0243] Example 2 A wired circuit board 1 was manufactured in the same manner as in Example 1. However, the wiring layer 13 was formed by a subtractive method. The size was changed as follows. Back: Thickness of ground wiring 1345 at joint 4: 24 μm Back: Width of ground wiring 1345 at joint 4: 50 μm Table: Thickness of joint wiring 1341, 1342, 1343, 1344: 9μm Front: Width of joint wiring 1341, 1342, 1343, 1344: 20μm Thickness of the cover insulating layer 14 on the joint wiring: 24 μm Thickness of the cover insulating layer 14 on the ground wiring: 40 μm

[0244] Comparative Example 1 A wired circuit board 1 was produced in the same manner as in Example 1, except that a metal supporting layer 11 was provided at the joint 4.

[0245] (evaluation) The first force, the second force, and the third force were calculated for the wired circuit boards 1 of Examples 1 and 2 and Comparative Example 1. Ansys Mechanical (simulation software) was used for the linear static analysis. The results are shown in Table 1.

[0246] [Table 1] [Explanation of symbols]

[0247] 1 Wiring circuit board 11 Metal support layer 12 Base insulation layer 13 Wiring layer 131 Frame terminal 132 Frame wiring 133 Terminal 134 Wiring 14 Cover insulation layer 15 Third base insulating layer 16 3rd wiring layer 17 Third cover insulating layer 18 4th wiring layer 19 Fourth cover insulating layer 2 Frames 21 Outer rim 25 Part 3 26 Part 4 28 Second central section 29 Second central area 3 Mounting section 31 Outer rim 311A, 311B First outer side (an example of an outer side) 312A, 312B Second outer edge (an example of an outer edge) 34 Central area 35 Central part 36 Part 1 37 Part 2 4. Joint 421,422,423,441,442,443,444 Slit 4511,4512,4521,4522,4531,4532 Sub-joints 45 Connection 46 Second connection part 5. Element mounting area 51A, 51B Side 1 52A, 52B Side 2 7. Image sensor 8,9 Connector

Claims

1. A frame, a mounting portion surrounded by the frame and spaced apart from the frame; a joint connecting the frame and the mounting portion, The mounting portion has a thickness, the mounting portion has a rectangular element mounting portion when viewed in a direction perpendicular to the thickness direction, and has an element mounting portion for mounting an element; the element mounting portion includes two first sides that are spaced apart from each other and parallel to each other, and two second sides that connect one end of the two first sides and connect the other end of the two first sides, A wired circuit board, wherein a first force per unit length required when moving the mounting portion relative to the frame in a first direction along the first side is 0.01 mN / mm or more and 5.0 mN / mm or less.

2. 2. The printed circuit board according to claim 1, wherein a second force per unit length required when moving the mounting portion relative to the frame in a second direction along the second side is 0.01 mN / mm or more and 5.0 mN / mm or less.

3. 2. The wired circuit board according to claim 1, wherein a third force per unit length required when moving said mounting portion relative to said frame in the thickness direction is 0.01 mN / mm or more and 5.0 mN / mm or less.

4. the frame, the mounting portion and the joint each include a wiring layer; the wiring layer in the mounting portion includes a plurality of terminals spaced apart from one another, and a plurality of wires spaced apart from one another, the plurality of wires being electrically connected to the plurality of terminals, respectively; the wiring layer at the joint includes a plurality of joint wirings spaced apart from one another and electrically connected to the plurality of wirings, respectively; the mounting portion has a first portion where the plurality of wirings extend from the plurality of terminals, and a second portion disposed between the first portion and an outer periphery of the mounting portion, the second portion where the plurality of wirings converge; The printed circuit board of claim 1 , wherein the joint connects to the second portion.

5. the mounting portion has an outer side that is disposed outside the element mounting portion, The joint includes a connection portion where the joint connects at the outer side, 2. The wired circuit board according to claim 1, wherein a ratio of a length of said connection portion in a direction along said outer side to a length of said outer side (length of said connection portion / length of said outer side) is 0.3 or less.

6. the mounting portion has an outer side that is disposed outside the element mounting portion, The printed circuit board according to claim 1 , wherein the joint is connected to a central region including a central portion of the outer side, the central region having a length that is half the length of the outer side.

7. Each of the frame and the mounting portion includes a base insulating layer, the wiring layer disposed on one side of the base insulating layer in the thickness direction, and a cover insulating layer disposed on one side of the base insulating layer in the thickness direction, the cover insulating layer covering a part of the wiring layer, and may include a metal support layer disposed on the other side of the base insulating layer in the thickness direction, 6. The wired circuit board according to claim 4, wherein the joint does not include the metal supporting layer, but includes the base insulating layer, the wiring layer, and the cover insulating layer.

8. the wiring layer at the joint has a plurality of joint wires spaced apart from one another; The wired circuit board according to claim 7 , wherein the base insulating layer and the cover insulating layer in the joint have slits disposed between the plurality of joint wirings.

9. The slits extend along the plurality of joint wirings, The wired circuit board according to claim 8 , wherein the joint includes a sub-joint that divides the slit in an extending direction of the slit and connects the plurality of joint wires.

Images