Component recognition device and component pick-up device

Abstract

To provide a component recognition device or a component pick-up device that can be simplified and miniaturized in structure.SOLUTION: A component recognition device 7 includes a component placement stage 72, an illumination unit 73, a component recognition camera 71, and an image processing unit 82 as a recognition processing unit. The component placement stage 72 is a stage on which chip components 6 are placed and has a mirror surface 72S. The illumination unit 73 irradiates the component placement stage 72 with coaxial illumination from above. The component recognition camera 71 is disposed above the component placement stage 72 and captures an image of the chip component 6 placed on the component placement stage 72. The image processing unit 82 recognizes the position of the chip component 6 on the component placement stage 72 based on the image captured by the component recognition camera 71.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a component recognition device that recognizes a component placed on a component suction stage, and a component removal device that removes the recognized component from the stage. [Background technology]

[0002] In component mounting devices that mount electronic components on printed circuit boards, components to be picked up by a head for mounting may be placed on a suction stage, such as the suction stage of a bulk feeder that supplies many components at once, or the suction stage on which components that require high-precision component mounting, such as wafer components, are temporarily placed before mounting.

[0003] Before the head picks up the component, the component on the suction stage is imaged by a camera, and the position of the component is recognized based on the acquired image. In general, the image is captured by a lighting device disposed below the suction stage, and the component on the suction stage is illuminated by transmitted light (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2020-120134 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in conventional devices using transmitted illumination, the illumination device and power supply device must be located below the suction stage, and space must be reserved for these devices, which complicates the structure of the component recognition device or component removal device and can be a factor in preventing compactness.

[0006] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a component recognition device or a component picking device that can be simplified in structure and made compact. [Means for solving the problem]

[0007] A component recognition device according to one aspect of the present invention includes a component placement stage on which components are placed, the stage having a mirror-finished surface, an illumination unit that irradiates the component placement stage with coaxial lighting from above, a camera that is positioned above the component placement stage and captures images of the components placed on the component placement stage, and a recognition processing unit that recognizes the positions of the components on the component placement stage based on the images captured by the camera.

[0008] According to this aspect, a component to be recognized in position is placed on a component placement stage having a mirror surface, and a coaxial light is irradiated from above the stage to capture an image including the component. The image captured by the camera is an image of the component with the mirror surface as the background. In the image, the mirror surface area has a high reflectance and therefore has a color reflecting the light source color, while the component area has a lower reflectance than the mirror surface and therefore is relatively dark. This provides a clear contrast between the component area and the background, allowing accurate recognition of the component position. In addition, there is no need to place a lighting device or power supply device below the component placement stage. This allows the structure of the area below the component placement stage to be simplified and made more compact.

[0009] In the above component recognition apparatus, it is preferable that the component placement stage includes a base material and a mirror layer laminated on the base material.

[0010] According to this aspect, a component mounting stage having a mirror-finished surface can be easily constructed by laminating a base material and a mirror layer.

[0011] A component picking device according to another aspect of the present invention includes the component recognition device described above, and a head that picks up a component on the component placement stage.

[0012] According to this aspect, it is possible to construct a device that uses a head to pick up a component placed on a component placement stage having a mirror-finished surface, and transfers the component to a specified location.

[0013] In the above component picking apparatus, the component placement stage may be a bulk feeder stage on which a plurality of components are placed in a scattered state.

[0014] According to this aspect, it is not necessary to provide a light source device for transmitted illumination on the part supplying device side that is equipped with the bulk feeder stage, and therefore the structure of the part picking device can be simplified.

[0015] The above-mentioned component removal device may further include a component storage section for storing a plurality of components, and the component placement stage may be a component temporary placement stage on which the components removed from the component storage section are temporarily placed prior to picking by the head.

[0016] According to this aspect, it is not necessary to dispose a light source device for transmitted illumination below the temporary component placement stage, and therefore the structure of the component removal device that employs the temporary component placement stage can be simplified.

[0017] In the above-mentioned part removal device, it is preferable that the head has a function of mounting the picked part onto a board, the part removal device has a board recognition camera that images a positioning mark affixed to the board from above, the board recognition camera also serving as a camera that images the parts, and a coaxial lighting device for the board recognition camera also serving as the lighting unit.

[0018] According to this aspect, the board recognition camera and its coaxial lighting device installed in the component pick-up device can be used to capture images for recognizing the positions of the components on the component placement stage, eliminating the need to provide a new lighting device for recognizing the positions of the components, and further simplifying the structure of the component pick-up device. Effect of the Invention

[0019] According to the present invention, it is possible to provide a component recognition device or a component picking device that can be simplified in structure and made compact. [Brief description of the drawings]

[0020] [Figure 1] FIG. 1(A) is a plan view that shows a schematic configuration of a component mounting device according to an embodiment of a component removal device of the present invention, and FIG. 1(B) is a schematic view of a bulk feeder provided in the component mounting device. [Diagram 2] FIG. 2 is a plan view showing a schematic configuration of a wafer component mounting apparatus according to an embodiment of the component removal apparatus of the present invention. [Diagram 3] FIG. 3 is a side view showing a conventional component recognition device. [Figure 4] FIG. 4(A) is a side view showing a component recognition device according to an embodiment of the present invention, and FIG. 4(B) is a diagram showing a camera image acquired by the component recognition device. [Diagram 5] FIG. 5 is a side view showing an example in which the component recognition device of this embodiment is incorporated into the component mounting device of FIG. 1 or FIG. [Figure 6] FIG. 6 is a block diagram showing the electrical configuration of the component mounting apparatus. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The component recognition device or component removal device according to the present invention can be suitably applied to a component mounting device that mounts chip components or diced wafer components on a printed circuit board. In the following embodiment, a component mounting device to which the present invention is applied will be described. In addition to component mounting devices, the present invention can be applied to various devices that use a camera to capture images of components placed on a stage and recognize the positions of the components based on the images. For example, the present invention can also be applied to devices that sort and classify components based on camera images, inspection devices that determine the quality of components based on camera images, component transfer devices, and the like.

[0022] [Component mounting equipment configuration] Fig. 1(A) is a plan view showing a schematic configuration of a component mounting apparatus 1A according to an embodiment of a component removal apparatus of the present invention. The component mounting apparatus 1A is an apparatus of a type that bulk feeds electronic components, and produces a mounted board in which the electronic components are mounted on a board P. In Fig. 1, directional indications of XYZ are provided. The X direction is the movement direction of the board P. The board P is provided with a fiducial mark FM (positioning mark) for recognizing the position of the board P.

[0023] The component mounting apparatus 1A includes a base 10 and a mounting unit arranged on the base 10. The mounting unit includes a board transport unit 2, a component supply unit 3A, and a head unit 4, which are assembled to the base 10. The head unit 4 is equipped with a board recognition camera 5 (an example of a camera).

[0024] The board transport section 2 transports the board P on which electronic components are to be mounted. The board transport section 2 has a pair of conveyors 21, 22 that transport the board P in the left-right direction on the base 10. The conveyors 21, 22 transport the board P from the left side into the component mounting apparatus 1A, transport it to the right to a predetermined work position (the position of the board P shown in FIG. 1) and stop it once. At this work position, the electronic components are mounted on the board P. After the mounting work, the conveyors 21, 22 transport the board P to the right and take it out of the component mounting apparatus 1A.

[0025] The component supply unit 3A supplies electronic components to be mounted on the board P. The component supply unit 3A is equipped with a plurality of bulk feeders 31 arranged in the X direction. Unlike a tape feeder, which does not supply components in an individually contained manner, the bulk feeder 31 sends a large number of components in a random orientation to a component suction position. Although FIG. 1(A) shows an example in which the bulk feeder 31 is attached only to one side of the board transport unit 2, it may also be attached to the other side. Also, some of the bulk feeders 31 may be replaced with other feeders, such as a tape feeder or a component tray.

[0026] FIG. 1(B) is a diagram showing a schematic configuration of a bulk feeder 31. Here, a bulk feeder 31 that supplies a large number of chip components 6 in a bulk state is shown as an example. The bulk feeder 31 includes a component supply device 32 and a bulk feeder stage 33 (component placement stage). The component supply device 32 receives a large number of chip components 6 from a hopper or the like (not shown). The component placement surface of the component supply device 32 is a gently inclined surface, and sends the chip components 6 to the bulk feeder stage 33 by its own vibration. The bulk feeder stage 33 is a stage on which a plurality of chip components 6 are placed in a scattered state. The chip components 6 to be mounted on the substrate P are picked up from the bulk feeder stage 33.

[0027] The head unit 4 is a unit for transferring electronic components including chip components 6 onto the substrate P brought into the working position from the component supply unit 3. The head unit 4 has a plurality of heads 41 having a function of picking up, i.e., sucking and removing, the chip components 6 from the bulk feeder stage 33 and mounting them onto the substrate P.

[0028] A component recognition camera 11 is built into the base 10. The component recognition camera 11 is a camera whose imaging field of view is above the base 10. The component recognition camera 11 images the electronic component held by the head 41 from the bottom side in order to image-recognize the suction state of the electronic component suctioned by the head 41.

[0029] The board recognition camera 5 is mounted on the head unit 4. The board recognition camera 5 captures images of various marks, including the fiducial marks FM, attached to the board P carried to the work position by the conveyors 21 and 22 from above. The positions of the fiducial marks FM are identified on the image data obtained by the image capture by the board recognition camera 5, and the amount of positional deviation from the origin coordinates is calculated. This amount of positional deviation is referred to when mounting components, and electronic components are mounted on the board P so that no positional deviation occurs. In this embodiment, the board recognition camera 5 also serves as a camera that captures images for positional recognition of the chip components 6 on the bulk feeder stage 33. This point will be described later with reference to FIG. 5.

[0030] 2 is a plan view showing a schematic configuration of a wafer component mounting apparatus 1B according to another embodiment of the component removal apparatus of the present invention. The wafer component mounting apparatus 1B is an apparatus for producing a mounted board by mounting diced wafer components Wa on a board P. The wafer component mounting apparatus 1B includes a base 10, a board transport section 2, a component supply section 3B and a head unit 4 which are mounted on the base 10, and a board recognition camera 5 mounted on the head unit 4. The configuration except for the component supply section 3B is the same as that of the component mounting apparatus 1A in FIG. 1(A).

[0031] The component supply section 3B includes a wafer supply device 34 (component storage section) and a wafer stage 35 (temporary placement stage / component placement stage). The wafer supply device 34 has a wafer storage section that stores multiple wafer parts Wa arranged in multiple tiers in the vertical direction. The wafer supply device 34 includes a wafer removal device that removes one wafer part Wa from the wafer storage section and places it on the wafer stage 35.

[0032] The wafer stage 35 is a picking stage accessible to the head unit 4. The wafer part Wa taken out from the wafer supply device 34 is temporarily placed on the wafer stage 35 before being picked up by the head 41. In this embodiment, the board recognition camera 5 captures an image of the die of the wafer part Wa temporarily placed on the wafer stage 35 for recognizing the position of the die.

[0033] [Comparative example of component recognition device] Fig. 3 is a side view showing a conventional component recognition device 700. Conventionally, the bulk feeder stage 33 of the above-mentioned component mounting apparatus 1A and the wafer stage 35 of the wafer component mounting apparatus 1B are equipped with a component recognition device 700 as shown in Fig. 3. The component recognition device 700 includes a component recognition camera 701, a component suction stage 702, and a transmitted illumination unit 703.

[0034] The component suction stage 702 is a diffusion plate made of a light-transmitting material such as an acrylic plate. A chip component 6 (or a wafer component Wa) to be picked is placed on the component suction stage 702. The transillumination unit 703 includes a light source in which a large number of LEDs are arranged in a matrix on a board. The transillumination unit 703 is disposed below the component suction stage 702 so as to face the component recognition camera 701. When an image of the chip component 6 is captured, the transillumination unit 703 is turned on, and the component suction stage 702 is placed in a backlit state. A transillumination image of the chip component 6 blocking the backlight is incident on the component recognition camera 701, and an image of the chip component 6 on the component suction stage 702 is acquired.

[0035] When the component recognition device 700 is used, a transmission illumination unit 703 and a power supply unit for the transmission illumination unit 703 must be disposed below the component suction stage 702. For this reason, it is necessary to secure space for disposing a device for transmission illumination below the bulk feeder stage 33 and the wafer stage 35. This, including the necessity to dispose a transmission illumination device dedicated to component recognition, complicates the structure of the component mounting devices 1A, 1B and is a factor preventing compactness.

[0036] [Component recognition device according to the embodiment] 4(A) is a side view showing a component recognition device 7 according to an embodiment of the present invention. The component recognition device 7 includes a component recognition camera 71, a component placement stage 72, an illumination unit 73, and a half mirror 74. The component recognition camera 71, the illumination unit 73, and the half mirror 74 are disposed above the component placement stage 72, and no optical system for capturing images of the chip components 6 is disposed below the component placement stage 72. The component placement stage 72 corresponds to the bulk feeder stage 33 when the component recognition device 7 is applied to the component mounting apparatus 1A, and corresponds to the wafer stage 35 when the component recognition device 7 is applied to the wafer component mounting apparatus 1B.

[0037] The component recognition camera 71 captures an image of the chip component 6 (component) placed on the component placement stage 72 from above. The illumination unit 73 irradiates the component placement stage 72 with coaxial illumination from above. The illumination unit 73 includes a light source in which a number of LEDs 732 are arranged in a matrix on the surface of a substrate 731. The illumination unit 73 is disposed so that the irradiation optical axis of the coaxial illumination light is perpendicular to the imaging optical axis of the component recognition camera 71. The half mirror 74 is disposed so as to face the illumination unit 73. The illumination light emitted from the illumination unit 73 is reflected downward by the half mirror 74 and irradiated onto the component placement stage 72. The reflected light from the surface 72S of the component placement stage 72 passes through the half mirror 74 along the imaging optical axis, enters the objective lens of the component recognition camera 71, and is received by an imaging sensor provided in the component recognition camera 71.

[0038] The component mounting stage 72 is a stage on which the chip components 6 are mounted, and its surface 72S is a mirror surface. The component mounting stage 72 includes a base material 721 and a mirror layer 722 laminated on the base material 721. The base material 721 is a flat plate made of metal, resin, ceramic, or the like having a predetermined strength. The mirror layer 722 can be formed by attaching a mirror made of a light-transmitting inorganic material such as a glass mirror, or a mirror made of a light-transmitting organic resin material such as an acrylic mirror, to one side of the base material 721. Alternatively, the mirror layer 722 may be formed of a mirror layer formed by mirror-finishing one side of the metal flat plate as the base material 721, or a highly reflective coating film or vapor deposition film.

[0039] Fig. 4(B) is a diagram showing a camera image CI acquired by the component recognition device 7. Fig. 4(B) also shows a partial image CIA, which is an enlarged view of one chip component 6 and its surroundings in the camera image CI. Brightness and darkness appear in the camera image CI due to the difference in reflectance of the coaxial illumination light between the surface 72S of the component mounting stage 72 and the chip component 6.

[0040] The chip component 6 generally comprises a chip body 61 and electrodes 62 on both ends of the chip body 61. The chip body 61 is often formed of a dark-colored mold layer, and therefore has a low reflectance. The electrodes 62 are metal pieces, and therefore have a higher reflectance than the chip body 61. However, since the electrodes 62 are not mirror-finished, the electrodes 62 appear darker in the partial image CIA than the background 63, which reflects the mirror surface 72S. This makes it possible to clearly express the contrast between the area of ​​the chip component 6 and the area of ​​the background 63. Therefore, by performing image processing on the camera image CI, the outline of the chip component 6 can be clearly captured, and the position of the chip component 6 can be accurately recognized.

[0041] The degree of specularity of the surface 72S may be determined based on the reflectance of the illumination light of the component to be placed. For example, the reflectance of the illumination light of the electrode 62 is about 70%. The reflectance of the chip body 61 is even lower. A highly polished specular surface has a reflectance of ≈100%, and sufficient contrast can be obtained between the two. The same is true for the body and lead parts of a SOP (Small Outline Package) or a QFP (Quad Flat Package). As long as the component area and the background area can be sufficiently captured on the camera image CI, it is not necessary to make the specularity of the surface 72S excessively high. For example, a specular surface having a reflectance 20% or more higher than the reflectance of the illumination light of the component to be picked may be used.

[0042] As described above, according to this embodiment, the chip component 6 to be recognized is placed on the component placement stage 72 having a mirror surface on the surface 72A, and a coaxial illumination is applied from above the stage to capture an image including the chip component 6. The camera image CI captured by the component recognition camera 71 is an image of the chip component 6 with the mirror surface as the background. In the camera image CI, the background 63 has a high reflectance and therefore has a color reflecting the light source color, while the area of ​​the chip component 6 has a lower reflectance than the mirror surface and therefore has a relatively dark color. This results in a clear contrast between the component area and the background, and the position of the chip component 6 can be accurately recognized. In addition, there is no need to place an illumination device or a power supply device for component position recognition below the component placement stage 72. This makes it possible to simplify and compact the structure of the area below the component placement stage 72.

[0043] [Application example to component mounting equipment] Fig. 5 is a side view showing a preferred example in which the component recognition device 7 of this embodiment is incorporated into the component mounting apparatus 1A of Fig. 1(A) or the wafer component mounting apparatus 1B of Fig. 2. Here, an example in which a part of the component recognition device 7 is incorporated into the head unit 4 is shown.

[0044] The head unit 4 includes a plurality of heads 41 that can advance and retreat in the Z direction relative to the unit body 40, and a suction nozzle 42 attached to the lower end of each head 41. Each head 41 has the function of mounting a picked-up component onto a substrate P. Negative and positive pressures are supplied to the suction nozzle 42 through a flow path in the head 41, enabling electronic components such as chip components 6 to be picked up and released by the negative pressure. A lifting mechanism and a rotation mechanism for the heads 41 are built into the unit body 40.

[0045] The board recognition camera 5 is mounted on a side wall of the unit body 40. As described above, the board recognition camera 5 is a camera that captures images of the fiducial marks FM and the like attached to the board P from above. In this embodiment, the board recognition camera 5 also serves as the component recognition camera 71 of the component recognition device 7 described above. The illumination section 73 and the half mirror 74 also serve as the coaxial illumination device for the board recognition camera 5 that are originally equipped in the head unit 4. The component placement stage 72 is incorporated into the bulk feeder stage 33 or the wafer stage 35.

[0046] At a timing when the image of the fiducial mark FM is not being captured, the head unit 4 is moved so that the board recognition camera 5 faces the sky above the bulk feeder stage 33 or the wafer stage 35. After the movement, the chip component 6 on the bulk feeder stage 33 or the wafer component Wa on the wafer stage 35 is captured by the board recognition camera 5 while being irradiated with coaxial illumination light from the illumination unit 73. Based on the image acquired by the above-mentioned imaging, the position of the chip component 6 or the wafer component Wa is recognized.

[0047] Next, the control configuration of the component mounting apparatuses 1A and 1B will be described. Fig. 6 is a block diagram showing the electrical configuration of the component mounting apparatuses 1A and 1B. In addition to the configuration shown in Figs. 1 and 2, the component mounting apparatuses 1A and 1B include a control device 8 that performs various processes including position recognition processing of components placed on the component placement stage 72, and an X-axis servo motor 12 and a Y-axis servo motor 13 as drive sources for the head unit 4. The control device 8 controls the operations of the head unit 4, the board recognition camera 5, the component recognition camera 11, and the like, by executing a predetermined program.

[0048] The X-axis servo motor 12 and the Y-axis servo motor 13 are motors that move the head unit 4 in the X and Y directions, respectively, and are mounted on the base 10. The head unit 4 has a Z-axis servo motor 43 and an R-axis servo motor 44 built in. The Z-axis servo motor 43 raises and lowers the head 41 along the Z axis when picking up or mounting an electronic component. The R-axis servo motor 44 rotates the head 41 around the R axis. The head unit 4 is further equipped with a board recognition camera 5 that also functions as the component recognition camera 71 of the component recognition device 7, and an illumination unit 51 that also functions as the illumination unit 73.

[0049] The control device 8 functionally comprises an axis control unit 81, an image processing unit 82 (recognition processing unit), an imaging control unit 83, a main control unit 84, and a storage unit 85. The axis control unit 81 controls the X-axis servo motor 12 and the Y-axis servo motor 13 to control the movement operation of the head unit 4 in the X and Y directions. In addition, the axis control unit 81 controls the Z-axis servo motor 43 and the R-axis servo motor 44 to control the lifting and rotation operation of the head 41.

[0050] The image processing unit 82 applies image processing techniques such as edge detection processing and pattern recognition processing involving feature extraction to the image data acquired by the board recognition camera 5 and the component recognition camera 11 to extract various information from the images. Specifically, the image processing unit 82 performs processing to identify the position of the fiducial mark FM based on the image data acquired by the board recognition camera 5. In addition, the image processing unit 82 performs processing to recognize the position of the component on the component placement stage 72 based on an image of the component placement stage 72 (bulk feeder stage 33 or wafer stage 35) captured by the board recognition camera 5. Furthermore, the image processing unit 82 performs processing to identify the shape, position, etc. of the component held by the suction nozzle 42 based on the image data acquired by the component recognition camera 11.

[0051] The imaging control unit 83 controls the imaging operations of the various cameras and lighting devices equipped in the component mounting apparatuses 1A and 1B, as well as the board recognition camera 5 and the component recognition camera 11. For example, the imaging control unit 83 provides control signals that designate the timing at which these cameras perform imaging operations. Furthermore, the imaging control unit 83 provides control signals that cause the lighting devices, including the lighting unit 51, to irradiate illumination light at the imaging timing.

[0052] The main control unit 84 comprehensively controls various operations of the component mounting apparatuses 1A and 1B. For example, the main control unit 84 provides control signals to the axis control unit 81, the image processing unit 82, the imaging control unit 83, and the like, and causes them to execute operations of driving the head unit 4 and the head 4H, operations of performing image processing on image data, and operations of capturing images. The main control unit 84 also functionally includes a picking control unit 841. The picking control unit 841 derives the XY movement amount of the head unit 4 and the R-axis rotation amount of the head 41 for picking up the component, based on the position information of the component on the component placement stage 72 specified by the image processing unit 82.

[0053] The storage unit 85 stores various information related to the substrate P and electronic components, various setting values ​​and parameters related to the component mounting apparatuses 1A and 1B, control data, operation programs, etc. For example, the illumination light reflectance of the surface 72S of the component mounting stage 72 and the illumination light reflectance of each component are stored in the storage unit 85. The imaging control unit 83 may control the adjustment of light source parameters such as light intensity when the illumination unit 51 is used as a coaxial illumination light source in accordance with the illumination light reflectance.

[0054] According to the present embodiment described above, the board recognition camera 5 for recognizing the position of the board P and its coaxial illumination device, which are provided in the component mounting apparatuses 1A and 1B, can be used to capture images for recognizing the positions of the components on the component placement stage 72. Therefore, it is not necessary to separately provide at least an illumination device for recognizing the positions of the components in the component mounting apparatuses 1A and 1B. This makes it possible to simplify the structure of the component mounting apparatuses 1A and 1B, make them more compact, and reduce costs. [Explanation of symbols]

[0055] 1A Component mounting device (component removal device) 1B Wafer component mounting device (component removal device) 31 Bulk feeder 33 Bulk feeder stage (parts placement stage) 34 Wafer supply device (parts storage section) 35 Wafer stage (temporary placement stage / component placement stage) 4 Head Unit 41 Head 5. Board Recognition Camera (Camera) 51 Lighting Department 6 Chip parts (components) 7 Parts Recognition Device 71 Parts Recognition Camera 72 Parts placement stage 72S surface 721 Base material 722 Mirror Layer 73 Lighting Department 8. Control Unit 82 Image processing section (recognition processing section) Wa Wafer parts (parts) FM fiducial mark (positioning mark)

Claims

1. a component placement stage on which a component is placed, the surface of the stage being a mirror surface; an illumination unit that irradiates the component mounting stage with coaxial illumination from above; a camera disposed above the component placement stage for capturing an image of a component placed on the component placement stage; a recognition processing unit that recognizes the position of a component on the component placement stage based on an image acquired by the camera; A part recognition device comprising:

2. 2. The component recognition device according to claim 1, The component placement stage includes a substrate and a mirror layer laminated on the substrate.

3. The part recognition device according to claim 1 or 2; a head for picking up a component on the component placement stage; A part removal device comprising:

4. 4. The component picking device according to claim 3, The component placement stage is a bulk feeder stage on which a plurality of components are placed in a scattered state.

5. 4. The component picking device according to claim 3, Further comprising a component housing portion for housing a plurality of components; The component placement stage is a component temporary placement stage on which components taken out of the component storage unit are temporarily placed before being picked up by the head.

6. 4. The component picking device according to claim 3, The head has a function of mounting the picked component on a substrate, the component removal device includes a board recognition camera that captures an image of a positioning mark affixed to the board from above, The board recognition camera also serves as a camera for capturing an image of the component, A component removal device, wherein a coaxial lighting device for the board recognition camera also serves as the lighting unit.

Images