Method for operating power storage device

Abstract

To reduce the power consumption of a power storage device, alternatively provide a highly safe power storage device, alternatively increase the safety of a battery monitored by a semiconductor device, alternatively reduce power consumption, e.g., reduce power in the dormant state, or reduce the time or energy required for the process of returning from a dormant state to a normal state.SOLUTION: A power storage device has a battery, a control circuit and a conversion circuit, the conversion circuit functions to provide voltage to the battery, and the control circuit has the function of measuring the data of the battery voltage and the function of maintaining the data of the battery voltage.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] One embodiment of the present invention relates to a power storage device or a semiconductor device included in a power storage device.

[0002] Note that one aspect of the present invention is not limited to the above technical field. The technical field of the invention disclosed in the present specification relates to an object, a method, or a manufacturing method. Alternatively, one aspect of the present invention relates to a process, a machine, a manufacture, or a composition of matter.

[0003] In this specification, the power storage device has, for example, a battery. In this specification, the power storage device has, for example, a device that stores power. In this specification, the semiconductor device refers to anything that can function by utilizing semiconductor characteristics. Therefore, semiconductor elements such as transistors and diodes, and circuits including semiconductor elements are semiconductor devices. In addition, display devices, light-emitting devices, lighting devices, electro-optical devices, communication devices, and electronic devices may include semiconductor elements and semiconductor circuits. Therefore, display devices, light-emitting devices, lighting devices, electro-optical devices, imaging devices, communication devices, and electronic devices may also be called semiconductor devices. [Background technology]

[0004] Recently, the spread of various electronic devices has led to an increase in power consumption. Patent Document 1 describes a control method for an uninterruptible power supply that predicts the battery life and safely shuts down the system.

[0005] In oxide semiconductors, c-axis aligned crystalline (CAAC) structures and nanocrystalline (nc) structures, which are neither single crystal nor amorphous, have been found (see Non-Patent Documents 1 and 2).

[0006] Non-Patent Documents 1 and 2 disclose techniques for manufacturing a transistor using an oxide semiconductor having a CAAC structure.

[0007] Also, known techniques for reducing power consumption of semiconductor devices include, for example, power gating (PG), clock gating (CG), voltage scaling, etc. For example, Patent Document 2 describes the implementation of a method that is advantageous for reducing power consumption out of the DVFS (Dynamic Voltage and Frequency Scaling) method and the PG method. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 9-44274 [Patent Document 2] International Publication No. 2009 / 078081 [Non-patent literature]

[0009] [Non-Patent Document 1] S. Yamazaki et al., “SID Symposium Digest of Technical Papers”, 2012, volume 43, issue 1, p.183-186 [Non-Patent Document 2] S. Yamazaki et al., “Japanese Journal of Applied Physics”, 2014, volume 53, Number 4S, p.04ED18-1-04ED18-10 Summary of the Invention [Problem to be solved by the invention]

[0010] An object of one embodiment of the present invention is to provide a novel semiconductor device or a method for operating the novel semiconductor device. Another object of one embodiment of the present invention is to reduce power consumption of a power storage device. Another object of one embodiment of the present invention is to provide a highly safe power storage device. Another object of one embodiment of the present invention is to improve the safety of a battery monitored by the semiconductor device. Another object of one embodiment of the present invention is to reduce power consumption, for example, to reduce power in a hibernation state. Another object of one embodiment of the present invention is to shorten the time required for a process of returning from a hibernation state to a normal state or to reduce the energy required for the process.

[0011] The description of multiple problems does not preclude the existence of each problem. Note that one embodiment of the present invention does not need to solve all of these problems. In addition, problems other than those listed will become apparent from the description of the specification, drawings, claims, etc., and these problems may also be problems of one embodiment of the present invention. [Means for solving the problem]

[0012] One embodiment of the present invention is a power storage device including a battery, a control circuit, and a conversion circuit, the conversion circuit having a function of applying a voltage to the battery, and the control circuit having a function of measuring data on the battery voltage and a function of holding the data on the battery voltage. Alternatively, one embodiment of the present invention is a power storage device including a battery, a control circuit, and a conversion circuit, the conversion circuit having a function of selecting and converting a first voltage or a second voltage and applying the voltage to the battery, the first voltage being an AC voltage and the second voltage being a DC voltage, the control circuit having a transistor including an oxide semiconductor in a channel formation region, and the control circuit having a function of measuring data on the battery voltage and a function of holding the data on the battery voltage.

[0013] In addition, in the above configuration, it is preferable that the control circuit has a transistor having an oxide semiconductor in a channel formation region, the control circuit has a processor core, the processor core has a function of applying a signal to a gate of the transistor, and the processor core is powered off during a period in which data of the first voltage is retained.

[0014] In the above configuration, the conversion circuit preferably has a function of converting at least one of the magnitude and frequency of the voltage.

[0015] In the above configuration, the second voltage is preferably a voltage generated by a solar cell.

[0016] Alternatively, one embodiment of the present invention is a power storage device including a battery, a control circuit, and a conversion circuit, the conversion circuit having a function of selecting and converting either a first voltage or a second voltage and providing the voltage to the battery, the first voltage being an AC voltage and the second voltage being a DC voltage, the control circuit having a first sample and hold circuit and a second sample and hold circuit, the first sample and hold circuit having a function of measuring and holding battery voltage data, the second sample and hold circuit having a function of converting battery current data into a voltage, measuring the battery current data, the first sample and hold circuit having a first transistor, and the second sample and hold circuit having a second transistor, the first sample and hold circuit having a function of measuring battery voltage data when the first transistor is in an on state and a function of holding battery voltage data when the first transistor is in an off state, and the second sample and hold circuit having a function of measuring battery current data when the second transistor is in an on state and a function of holding battery current data when the second transistor is in an off state.

[0017] In the above structure, each of the first transistor and the second transistor preferably includes an oxide semiconductor in a channel formation region.

[0018] In the above configuration, it is preferable to have a function of calculating the remaining battery capacity using the battery voltage data held in the first sample-and-hold circuit and the battery current data held in the second sample-and-hold circuit.

[0019] In the above configuration, the conversion circuit preferably has a function of converting at least one of the magnitude and frequency of the voltage.

[0020] In the above configuration, the second voltage is preferably a voltage generated by a solar cell.

[0021] Alternatively, one embodiment of the present invention is a method for operating a power storage device including a battery, a control circuit, and a conversion circuit, the control circuit including a processing device including a processor core, a first sample and hold circuit, and a second sample and hold circuit, the first sample and hold circuit having a first transistor, the second sample and hold circuit having a second transistor, the processing device being electrically connected to a gate of the first transistor and a gate of the second transistor, the processing device providing a signal to the gate of the first transistor and the gate of the second transistor to turn on the first transistor and the second transistor, providing a voltage from the conversion circuit to the battery, providing battery voltage data to one of a source and a drain of the first transistor, converting battery current data into a voltage and providing it to one of the source and drain of the second transistor, and providing a signal from the processing device to the gate of the first transistor and the gate of the second transistor to turn off the first transistor and the second transistor.

[0022] In addition, in the above configuration, it is preferable to have a second processing device, convert the battery voltage data and the battery current data into voltage data from analog values ​​to digital values ​​and provide them to the second processing device, cut off the power supply to the processor core, and have the second processing device calculate the remaining battery capacity.

[0023] Furthermore, in the above configuration, it is preferable that the conversion circuit has a function of converting one or more of the magnitude and frequency of the first voltage and the second voltage, the first voltage being an AC voltage and the second voltage being a DC voltage, and the conversion circuit selects and converts either the first voltage or the second voltage and supplies it to the battery.

[0024] In the above configuration, the second voltage is preferably a voltage generated by a solar cell. Effect of the Invention

[0025] According to one embodiment of the present invention, a novel semiconductor device or a method for operating the novel semiconductor device can be provided. According to one embodiment of the present invention, power consumption of a power storage device can be reduced. According to one embodiment of the present invention, a highly safe power storage device can be provided. According to one embodiment of the present invention, safety of a battery monitored by the semiconductor device can be improved. According to one embodiment of the present invention, power consumption can be reduced, for example, power in a hibernation state can be reduced. According to one embodiment of the present invention, the time required for a process of returning from a hibernation state to a normal state can be shortened, or the energy required for the process can be reduced.

[0026] Note that the description of these effects does not preclude the existence of other effects. Also, one embodiment of the present invention does not necessarily have all of the exemplified effects. Furthermore, for one embodiment of the present invention, problems, effects, and novel features other than those described above will become apparent from the description and drawings of this specification. [Brief description of the drawings]

[0027] [Figure 1] FIG. 1 is a block diagram illustrating an example of a power storage device. [Diagram 2] FIG. 2 is a circuit diagram illustrating a part of the configuration of the power storage device. [Diagram 3] FIG. 3 is a circuit diagram illustrating an example of the control circuit. [Figure 4] 4A and 4B are diagrams illustrating an example of a secondary battery. [Diagram 5] 5A and 5B are diagrams illustrating an example of a power storage device. [Figure 6] 6A and 6B are diagrams illustrating an example of a secondary battery. [Figure 7] 7A and 7B are block diagrams showing configuration examples of a semiconductor device. [Figure 8] 8A to 8D are timing charts showing an example of the power management operation of a semiconductor device. [Figure 9] FIG. 9 is a flowchart showing a configuration example of a semiconductor device. [Figure 10] 10A and 10B are block diagrams showing configuration examples of a semiconductor device. [Figure 11] FIG. 11 is a block diagram showing an example of the configuration of a processor core. [Figure 12] FIG. 12 is a circuit diagram showing a configuration example of the memory circuit. [Figure 13] FIG. 13 is a timing chart illustrating an example of the operation of the memory circuit. [Figure 14] FIG. 14 is a circuit diagram showing an example of the configuration of a memory cell of a cache. [Figure 15] FIG. 15 is a timing chart illustrating an example of the operation of the memory cell. [Figure 16] Fig. 16A is a functional block diagram showing a configuration example of a NOSRAM, and Fig. 16B is a circuit diagram showing a configuration example of a memory cell. [Figure 17] Fig. 17A is a circuit diagram showing an example of the configuration of a memory cell array, and Fig. 17B and Fig. 17C are circuit diagrams showing an example of the configuration of a memory cell. [Figure 18] Fig. 18A is a circuit diagram showing a configuration example of a memory cell of a DOSRAM, and Fig. 18B is a diagram showing an example of a stacked structure of the DOSRAM. [Figure 19] FIG. 19 is a diagram illustrating a configuration example of a semiconductor device. [Figure 20] FIG. 20 is a diagram illustrating a configuration example of a semiconductor device. [Figure 21]21A to 21C are diagrams showing configuration examples of transistors. [Figure 22] 22A to 22C are diagrams showing configuration examples of transistors. [Figure 23] 23A to 23C are diagrams showing configuration examples of transistors. [Figure 24] Fig. 24A is a diagram for explaining the classification of IGZO crystal structures, Fig. 24B is a diagram for explaining the XRD spectrum of a CAAC-IGZO film, and Fig. 24C is a diagram for explaining the ultrafine electron beam diffraction pattern of a CAAC-IGZO film. [Diagram 25] FIG. 25 is a diagram illustrating an example of an uninterruptible power supply. [Figure 26] FIG. 26 is a diagram illustrating an example of an electronic device. [Figure 27] 27A, 27B, and 27C are diagrams illustrating an example of a vehicle. [Figure 28] Fig. 28A is a diagram illustrating an example of a vehicle, and Fig. 28B is a diagram illustrating an example of a power storage device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be easily understood by those skilled in the art that the form and details of the present invention can be modified in various ways without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same parts or parts having similar functions are denoted by the same reference numerals in different drawings, and the repeated description will be omitted.

[0029] In addition, the position, size, range, etc. of each component shown in the drawings, etc. may not represent the actual position, size, range, etc. in order to facilitate understanding of the invention. Therefore, the disclosed invention is not necessarily limited to the position, size, range, etc. disclosed in the drawings, etc. For example, in an actual manufacturing process, a resist mask, etc. may be unintentionally eroded by a process such as etching, but this may not be reflected in the drawings in order to facilitate understanding.

[0030] In addition, in top views (also called "plan views"), perspective views, and the like, illustration of some components may be omitted in order to make the drawings easier to understand.

[0031] In addition, the terms "electrode" and "wiring" used in this specification and the like do not limit the functionality of these components. For example, an "electrode" may be used as part of a "wiring", and vice versa. Furthermore, the terms "electrode" and "wiring" include cases where multiple "electrodes" or "wirings" are formed integrally.

[0032] In addition, in this specification and the like, a "terminal" in an electric circuit refers to a portion where a current is input or output, a voltage is input or output, or a signal is received or transmitted. Therefore, a part of a wiring or an electrode may function as a terminal.

[0033] In this specification, the terms "above" and "below" do not limit the positional relationship of components to being directly above or below and in direct contact. For example, the expression "electrode B on insulating layer A" does not require that electrode B be formed in direct contact with insulating layer A, and does not exclude the inclusion of other components between insulating layer A and electrode B.

[0034] In addition, the functions of the source and drain are interchangeable depending on the operating conditions, such as when transistors of different polarities are used or when the direction of current changes during circuit operation, so it is difficult to determine which is the source and which is the drain. For this reason, in this specification, the terms source and drain can be used interchangeably.

[0035] In addition, in this specification, "electrically connected" includes a direct connection and a connection via "something having some electrical action." Here, the "something having some electrical action" is not particularly limited as long as it allows the transmission and reception of electrical signals between the connected objects. Therefore, even when it is expressed as "electrically connected," in the actual circuit, there may be no physical connection and only wiring extending therethrough.

[0036] In this specification and elsewhere, "parallel" refers to, for example, a state in which two straight lines are arranged at an angle of -10° or more and 10° or less. This therefore includes cases in which the angle is -5° or more and 5° or less. Furthermore, "perpendicular" and "orthogonal" refer to, for example, a state in which two straight lines are arranged at an angle of 80° or more and 100° or less. This therefore includes cases in which the angle is 85° or more and 95° or less.

[0037] In this specification and elsewhere, when referring to counting values ​​and measurement values, terms such as "same," "equal," "uniform," etc. are used, they are intended to include an error of plus or minus 20% unless otherwise expressly stated.

[0038] Furthermore, voltage often refers to the potential difference between a certain potential and a reference potential (for example, ground potential or source potential). Therefore, voltage and potential can often be interchanged. In this specification and the like, unless otherwise specified, voltage and potential can be interchanged.

[0039] Even when written as "semiconductor", for example, if the conductivity is sufficiently low, it has the characteristics of an "insulator". Therefore, it is also possible to use "semiconductor" instead of "insulator". In this case, the boundary between "semiconductor" and "insulator" is ambiguous, and it is difficult to strictly distinguish between the two. Therefore, "semiconductor" and "insulator" described in this specification may be read as interchangeable.

[0040] Furthermore, even when written as "semiconductor", if the conductivity is sufficiently high, it has the characteristics of a "conductor". Therefore, it is also possible to use "semiconductor" in place of "conductor". In this case, the boundary between "semiconductor" and "conductor" is ambiguous, and it is difficult to strictly distinguish between the two. Therefore, "semiconductor" and "conductor" described in this specification may be interchangeable.

[0041] In addition, ordinal numbers such as "first" and "second" in this specification are used to avoid confusion of components, and do not indicate any order or ranking, such as the order of processes or stacking. Even if a term does not have an ordinal number in this specification, an ordinal number may be added in the claims to avoid confusion of components. Even if a term has an ordinal number in this specification, a different ordinal number may be added in the claims. Even if a term has an ordinal number in this specification, the ordinal number may be omitted in the claims.

[0042] In this specification, the "on state" of a transistor refers to a state in which the source and drain of the transistor can be regarded as being electrically short-circuited (also referred to as a "conductive state"). The "off state" of a transistor refers to a state in which the source and drain of the transistor can be regarded as being electrically disconnected (also referred to as a "non-conductive state").

[0043] In this specification, the term "on-state current" may refer to a current that flows between a source and a drain when a transistor is on, and the term "off-state current" may refer to a current that flows between a source and a drain when a transistor is off.

[0044] In this specification and the like, high power supply potential VDD (hereinafter also simply referred to as "VDD", "H potential", or "H") refers to a power supply potential that is higher than the low power supply potential VSS (hereinafter also simply referred to as "VSS", "L potential", or "L"). Also, VSS refers to a power supply potential that is lower than VDD. Also, ground potential (hereinafter also simply referred to as "GND" or "GND potential") can be used as VDD or VSS. For example, when VDD is the ground potential, VSS is a potential lower than the ground potential, and when VSS is the ground potential, VDD is a potential higher than the ground potential.

[0045] In this specification and the like, a gate refers to a gate electrode and a part or the whole of a gate wiring. A gate wiring refers to a wiring for electrically connecting a gate electrode of at least one transistor to another electrode or another wiring.

[0046] In this specification and the like, the source refers to a source region, a source electrode, and a part or all of a source wiring. The source region refers to a region of a semiconductor layer having a resistivity equal to or lower than a certain value. The source electrode refers to a conductive layer connected to the source region. The source wiring refers to a wiring for electrically connecting the source electrode of at least one transistor to another electrode or another wiring.

[0047] In this specification and the like, the drain refers to a part or all of the drain region, the drain electrode, and the drain wiring. The drain region refers to a region of the semiconductor layer whose resistivity is equal to or lower than a certain value. The drain electrode refers to a conductive layer that is connected to the drain region. The drain wiring refers to a wiring for electrically connecting the drain electrode of at least one transistor to another electrode or another wiring.

[0048] In addition, in drawings, etc., to make the potential of wiring and electrodes easier to understand, "H" indicating H potential or "L" indicating L potential may be written next to the wiring and electrode. Wiring and electrodes where a potential change has occurred may be written with "H" or "L" enclosed in a box. When a transistor is in the off state, an "x" symbol may be written over the transistor.

[0049] A terminal may refer to a group of multiple terminals. For example, an independent signal is applied to each terminal of the group of multiple terminals, and one or more wires are electrically connected to each terminal.

[0050] A transistor has three terminals (nodes) called a gate, a source, and a drain. The gate is a terminal that functions as a control terminal that controls the conductive state of a transistor. A pair of input / output terminals (nodes) that function as a source or a drain becomes a source and the other a drain depending on the type of transistor and the level of the potential applied to each terminal (node). Generally, in an n-type transistor, the node to which a low potential is applied is called a source, and the node to which a high potential is applied is called a drain. Conversely, in a p-type transistor, the node to which a low potential is applied is called a drain, and the node to which a high potential is applied is called a source. In this specification, the two terminals (nodes) other than the gate may be called a first terminal (node) and a second terminal (node).

[0051] In this specification, in order to facilitate understanding of the circuit configuration and its operation, one of the two input / output terminals (nodes) of a transistor may be limited to a source and the other to a drain. Of course, depending on the driving method, the magnitude relationship of the potentials applied to the three terminals of the transistor may change, and the source and drain may be interchanged. Therefore, in one embodiment of the present invention, the distinction between the source and drain of a transistor is not limited to the description in the specification and drawings.

[0052] In this specification, etc., even if the connection destinations of all terminals of active elements (e.g., transistors, diodes, etc.), passive elements (e.g., capacitance elements, resistance elements, etc.), etc. are not specified, a person skilled in the art may be able to configure one aspect of the invention. In other words, it can be said that one aspect of the invention is clear even if the connection destinations are not specified. And, when an aspect in which the connection destinations are specified is described in this specification, etc., it may be possible to determine that an aspect of the invention in which the connection destinations are not specified is described in this specification, etc. In particular, when there are multiple possible cases in which the connection destinations of a terminal are to be multiple, it is not necessary to limit the connection destination of the terminal to a specific location. Therefore, it may be possible to configure one aspect of the invention by specifying the connection destinations of only some of the terminals of active elements (transistors, diodes, etc.), passive elements (capacitance elements, resistance elements, etc.).

[0053] In this specification, etc., if at least the connection destination of a certain circuit is specified, a person skilled in the art may be able to specify the invention. Alternatively, if at least the function of a certain circuit is specified, a person skilled in the art may be able to specify the invention. In other words, if the function can be specified, it can be said that the aspect of the invention is clear. Then, it may be possible to determine that one aspect of the invention in which the function is specified is described in this specification, etc. Therefore, if the connection destination of a certain circuit is specified even if the function is not specified, one aspect of the invention is disclosed and one aspect of the invention can be configured. Alternatively, if the connection destination of a certain circuit is specified even if the connection destination is not specified, one aspect of the invention is disclosed and one aspect of the invention can be configured.

[0054] (Embodiment 1) In this embodiment, a power storage device of one embodiment of the present invention will be described.

[0055] FIG. 1 illustrates a power storage device of one embodiment of the present invention.

[0056] 1 includes a semiconductor device 101, a battery pack 120, and a temperature sensor TS1. The battery pack 120 includes one or more battery cells.

[0057] The semiconductor device 101 includes a processing unit 51, a conversion circuit 52, a circuit 53, a control circuit 55, a relay circuit RL1, a relay circuit RL2, an inverter circuit IV1, an ammeter CR1, a terminal PS1, a terminal SC1, and a terminal OU2.

[0058] A signal such as a voltage, a current, etc. is applied to the terminal PS1 and the terminal SC1. As an example, an AC signal is applied to the terminal PS1, and a DC signal is applied to the terminal SC1.

[0059] The AC signal applied to the terminal PS1 is, for example, a commercial AC power source.

[0060] The DC signal applied to the terminal SC1 is, for example, a DC power source from a solar cell.

[0061] The conversion circuit 52 includes a conversion circuit AD1, a protection circuit PR1, a control circuit PR2, a control circuit SW1, and a terminal OU1.

[0062] The signal from the terminal PS1 is provided to the control circuit SW1 via the conversion circuit AD1 and the protection circuit PR1. The signal from the terminal SC1 is provided to the control circuit SW1 via the control circuit PR2. The control circuit SW1 has a function of selecting either the signal from the protection circuit PR1 or the signal from the control circuit PR2 and outputting it to the terminal OU1. Alternatively, the control circuit SW1 may mix and output the two signals. The signal output from the terminal OU1 is provided to the battery pack 120. The battery pack 120 can be charged using the signal output from the terminal OU1.

[0063] The conversion circuit AD1 has a function of converting an AC signal into a DC signal.

[0064] The protection circuit PR1 has a function of controlling a current (hereinafter, referred to as a current i(1)) flowing between the conversion circuit AD1 and the control circuit SW1. The protection circuit PR1 may also have a function of controlling a voltage applied from the terminal PS1 to the control circuit SW1 via the conversion circuit AD1.

[0065] The protection circuit PR1 also has a function of suppressing a reverse current from the control circuit SW1 to the conversion circuit AD1. For example, a diode is provided between the control circuit SW1 and the conversion circuit AD1 in the protection circuit PR1 to suppress a reverse current from the control circuit SW1 to the conversion circuit AD1.

[0066] The control circuit PR2 has a function of controlling the current (hereinafter, referred to as current i(2)) flowing between the terminal SC1 and the control circuit SW1. The control circuit PR2 may also have a function of controlling the voltage applied from the terminal SC1 to the control circuit SW1. The control circuit PR2 also has a function of suppressing the backflow current from the control circuit SW1 to the terminal SC1. For example, a diode is provided between the control circuit SW1 and the terminal SC1 in the control circuit PR2 to suppress the backflow current from the control circuit SW1 to the terminal SC1.

[0067] The protection circuit PR1 and the control circuit PR2 are electrically connected to a processing device 20b. The processing device 20b has, for example, a function of monitoring and storing the current i(1) and the current i(2). The processing device 20b may also provide a signal for controlling the current i(1) to the protection circuit PR1 and a signal for controlling the current i(2) to the control circuit PR2.

[0068] Furthermore, when the protection circuit PR1 has a diode, the processing device 20b preferably has a function of measuring a temperature T(1). The temperature T(1) is the temperature of the diode or the temperature around the area in which the diode is disposed. The processing device 20b preferably has a function of making a judgment based on the temperature T(1), controlling the current i(1) based on the judgment result, and managing the temperature T(1) at or below a predetermined temperature. By managing the temperature T(1) at or below the predetermined temperature, it is possible to suppress breakdown and degradation of the diode.

[0069] The processing device 20b can be in a standby state during a period when no signal is input to the terminal PS1 and the terminal SC1. The processing device 20b has a transistor (also called an "OS transistor" or "OS-FET") that includes an oxide semiconductor (OS), which is a type of metal oxide, in a semiconductor layer in which a channel is formed. The processing device 20b has a feature that its standby power consumption is extremely low by being configured to include an OS transistor. The processing device 20b can have the configuration of the processing device 20 or the processing device 21 described later. When the processing device 20b is in a standby state, a circuit block of the processing device 20b, such as a processor core, can be shifted to a sleep state to reduce power consumption.

[0070] The control circuit 55 is electrically connected to the battery pack 120 and the temperature sensor TS1.

[0071] The ammeter CR1 has a function of measuring a charging current (hereinafter, current i(3)) provided to the battery pack 120 and a current (hereinafter, current i(4)) provided from the battery pack 120 to a terminal OU2 via a relay circuit RL1, an inverter circuit IV1, and a relay circuit RL2. Data measured by the ammeter CR1 is provided to the processing device 51. In addition, the data measured by the ammeter CR1 may be provided to a control circuit 55.

[0072] The relay circuit RL1 has a function of providing a signal from the battery pack 120 to the inverter circuit IV1 when a desired signal is provided from the processing device 51. The relay circuit RL2 has a function of providing a signal from the inverter circuit IV1 to the terminal OU2 when a desired signal is provided from the processing device 51. The inverter circuit IV1 has a function of converting a DC signal provided from the battery pack 120 into an AC signal.

[0073] 2 shows an example of electrical connections between the control circuit 55, the battery pack 120, the ammeter CR1, and the temperature sensor TS1. The battery pack 120 has a terminal VC1 and a terminal VSSS.

[0074] The temperature sensor TS1 has a sensor element, and the sensor element has a function of measuring temperature. The sensor element is disposed in the vicinity of the battery pack 120. The temperature sensor TS1 has a function of providing the control circuit 55 with temperature data measured by the sensor element.

[0075] The control circuit 55 includes a processor 20a.

[0076] The ammeter CR1 is electrically connected to the terminal VC1 of the battery pack 120. Alternatively, the ammeter CR1 may be connected to the terminal VSSS side of the battery pack 120.

[0077] 2 shows an example in which n battery packs 122(k) (k=an integer between 1 and n) are connected in parallel, each battery pack having m battery cells 121 connected in series. Battery pack 122(k) is disposed between terminal VC1 and terminal VSSS. In battery pack 122(k), the first battery cell through the mth battery cell are connected in series in that order.

[0078] Terminal VC1 has a function of being electrically connected to the positive electrode of battery cell 121 via switch SE7(k), and the electrical connection between the positive electrode of battery cell 121 and terminal VC1 is controlled by opening and closing switch SW7(k). The opening and closing of switch SW7(k) is controlled by control circuit 55, more specifically, by processing device 20a included in control circuit 55, for example.

[0079] The negative electrode of the mth battery cell of the battery pack 122(k) is electrically connected to the terminal VSSS.

[0080] The control circuit 55 has a function of measuring the voltage across the battery pack 120 .

[0081] Moreover, it is preferable that the control circuit 55 has a function of measuring the voltage across both ends of each battery cell 121 (voltage between the positive and negative electrodes) of the assembled battery 120. The control circuit 55 can use the measured voltage to determine the charging conditions for the assembled battery 120. For example, the control circuit 55 controls the charging of the assembled battery 122(k) by opening and closing the switch SW7(k) based on the determined charging conditions.

[0082] When determining the charging conditions in the control circuit 55, the charging conditions of the battery pack 120 may be controlled using temperature data provided by the temperature sensor TS1 in addition to the voltage across the battery pack 120 and the voltage across each battery cell 121 of the battery pack 120.

[0083] In addition, the voltage across the battery pack 120 measured by the control circuit 55, the voltage across each battery cell 121 of the battery pack 120, temperature data measured by the temperature sensor TS1, etc. may be provided to the processing device 51, and the processing device 51 may determine the charging conditions for the battery pack 120.

[0084] It is also preferable to measure the remaining capacity of the battery pack 120 in addition to voltage values ​​such as the voltage of the battery pack 120 and the voltage across each battery cell 121 of the battery pack 120. The measurement of the remaining capacity of the battery pack 120 will be described later.

[0085] The processor 51 has a function of controlling the charging conditions of the battery pack 120 .

[0086] The processing device 51 is preferably provided with the current measured by the ammeter CR1, the current between the inverter circuit IV1 and the relay circuit RL2, the current between the terminal PS1 and the conversion circuit AD1, and the current between the terminal SC1 and the control circuit PR2.

[0087] The processor 51 has a function of controlling signals such as the current i(3) and the voltage applied to the battery pack 120 by providing signals to the protection circuit PR1, the control circuit PR2, the control circuit SW1, and the like to control them.

[0088] The protection circuit PR1 may be controlled by providing a signal from the processing device 51 to the processing device 20b, and then providing a signal from the processing device 20b to the protection circuit PR1. Data such as current stored in the protection circuit PR1 is preferably provided to the processing device 51. The data can be used, for example, in the processing device 51 to determine the charging conditions of the battery pack 120 and to control the charging conditions.

[0089] The processor 51 also has the function of applying signals to the relay circuit RL1, the inverter circuit IV1, and the relay circuit RL2 to control the current i(4) and the voltage applied to the terminal OU2.

[0090] Data measured by the processing device 20b, such as the current i(1), the current i(2) and the temperature T(1), may be provided to the processing device 51. The processing device 51 can also provide the processing device 20b with a determination result based on the measured temperature T(1).

[0091] The processing device 51, for example, compares data on voltage and current values ​​stored in memories ME1, ME2, etc., described below, with the voltage and current related to the battery pack 120, and makes a judgment. For example, if the voltage related to the battery pack 120 exceeds a predetermined value, it is judged to be overcharged. Also, for example, if the voltage related to the battery pack 120 falls below a predetermined value, it is judged to be overdischarged. Also, for example, if the current related to the battery pack 120 exceeds a predetermined value, it is judged to be overcharged. The processing device 51 has a function of protecting the battery pack 120 by controlling the charging conditions, stopping charging, controlling the discharging conditions, or stopping discharging, based on the judgment result.

[0092] The processing device 51 can be supplied with power from the battery pack 120 or power from the terminal OU1 of the conversion circuit 52. The processing device 51 can distribute the supplied power to other circuits, such as the conversion circuit 52, the circuit 53, the control circuit 55, the relay circuit RL1, the inverter circuit IV1, and the relay circuit RL2.

[0093] The power storage device 100 has a function of measuring the remaining capacity of the battery pack 120 using the current i(3) and the current i(4). When measuring the remaining capacity, the accuracy of the measurement can be improved by also measuring the voltage of the battery pack 120. When measuring the remaining capacity of the battery pack 120, the amount of charge provided to the battery pack 120 and the amount of charge discharged from the battery pack 120 are calculated using the current and the voltage.

[0094] The change in capacity of the battery pack 120 can be obtained by calculating the amount of charge consumed by charging or discharging using the charging current or discharging current of the battery pack 120 and the time the current flows. However, repeated measurements may result in accumulated errors.

[0095] By evaluating the relationship between the voltage and capacity of the battery pack 120 in advance and storing it in memory ME1, memory ME2, etc., which will be described later, it is possible to obtain the remaining capacity of the battery pack 120 using the voltage of the battery pack 120. However, in a region where the voltage change is small on the capacity-voltage curve of the battery pack 120, a measurement error may occur.

[0096] The accuracy of measuring the remaining capacity can be improved by calculating the charge amount based on the current and the capacity based on the voltage together to obtain the remaining capacity of the battery pack 120. For example, in a region of the capacity-voltage curve where the voltage changes significantly, the remaining capacity can be measured using the voltage, and in a region where the change is small, the remaining capacity can be measured using the current value and the time the current flows.

[0097] In the power storage device 100, the processing device 51 can perform calculations for measuring the remaining capacity of the battery pack 120. For example, the processing device 51 can perform calculations for measuring the remaining capacity of the battery pack 120 using the current i(3) and the current i(4) measured by the ammeter CR1 and the voltage value measured by the control circuit 55.

[0098] Alternatively, by providing a sample-and-hold circuit using an OS transistor in the control circuit 55, the accuracy of measuring the remaining capacity can be improved.

[0099] The control circuit 55 shown in FIG. 3 includes a processing device 20a, a sample-and-hold circuit SH1, a sample-and-hold circuit SH2, and an analog-to-digital conversion circuit AD2.

[0100] The sample-and-hold circuit SH1 has an amplifier circuit 121a, a transistor 122a, and a capacitance element 123a. A voltage Vc is applied to the sample-and-hold circuit SH1. The voltage Vc is, for example, the voltage of the assembled battery 120. Alternatively, the voltage Vc is, for example, the voltage of each battery cell 121 of the assembled battery 120. The voltage Vc is applied to the amplifier circuit 121a of the sample-and-hold circuit SH1. The amplifier circuit 121a has a function of amplifying and outputting analog data such as the voltage Vc input to the sample-and-hold circuit SH1. The amplifier circuit 121a may be configured to be provided on the gate side of the transistor 122a.

[0101] An OS transistor is preferably used as the transistor 122a. The OS transistor has an extremely low off-state current, and the capacitor 123a has a function of holding charge according to the voltage Vc by turning off the transistor 122a.

[0102] The sample and hold circuit SH2 has a resistive element 126, an amplifier circuit 121b, a transistor 122b, and a capacitive element 123b. A current i(3) or a current i(4) is applied to the sample and hold circuit SH2. The current i(3) or the current i(4) flows through the resistive element 126. The voltage across the resistive element 126 is applied to the amplifier circuit 121b of the sample and hold circuit SH2. The amplifier circuit 121b has a function of amplifying and outputting the difference between the voltages across the resistive element 126.

[0103] An OS transistor is preferably used as the transistor 122b. An OS transistor has an extremely low off-state current, and the capacitor 123b has a function of holding charge corresponding to a difference in voltage between both ends of the resistor 126 by turning off the transistor 122b.

[0104] The values ​​held in the sample-and-hold circuits SH1 and SH2 are converted by an analog-to-digital conversion circuit AD2 and then provided to the processing device 51. Alternatively, a memory may be provided in the control circuit 55, and each of the held values ​​may be stored in the memory.

[0105] The on and off timing of the transistors 122a and 122b is controlled by a potential applied to a terminal electrically connected to the gate of each transistor. A signal is applied to the gate of each transistor from the processing device 20a. By synchronizing the on and off times of the transistors 122a and 122b, it is possible to obtain voltage and current values ​​related to the battery pack 120 at approximately the same time.

[0106] Due to the impedance characteristics of the battery pack 120, the voltage changes depending on the magnitude of the current flowing through the battery pack 120. Therefore, when the remaining capacity is calculated using the voltage of the battery pack 120, it is preferable to also measure the magnitude of the current flowing through the battery pack 120 and correct the effect of the voltage change due to the impedance. By acquiring the voltage and current at approximately the same time, the effect of the voltage change due to the impedance can be corrected more accurately, improving the accuracy of the calculation of the remaining capacity.

[0107] The voltage and current measurements for calculating the remaining capacity do not need to be performed constantly, but can be performed at certain intervals. Furthermore, if the rate of change of the voltage or current is high, the intervals should be narrowed, and if the rate of change is low, the intervals should be widened.

[0108] In the control circuit 55, during the period when the voltage, current, and temperature are not being measured, for example, the processing device 20a included in the control circuit 55 can be placed in a standby state, thereby reducing power consumption.

[0109] Rather than directly providing the data for calculating the remaining capacity of the battery pack 120 to the processing device 51 for calculation, the tasks of the processing device 51 can be reduced by measuring and storing the data for calculating the remaining capacity of the battery pack 120 in the control circuit 55. Furthermore, since the control circuit 55 can store the data, data can be transmitted at a desired timing. Therefore, the calculation in the processing device 51 can be performed efficiently.

[0110] 1 includes a circuit 53. The circuit 53 includes a circuit WR1, a memory ME1, a memory ME2, and a display device DP1.

[0111] The circuit WR1 has a group of circuits for wireless communication, such as a modulation circuit, a demodulation circuit, a rectifier circuit, an antenna, etc. The power storage device 100 can transmit and receive data through wireless communication.

[0112] The memory ME1 and the memory ME2 are memories for storing data. For example, a volatile memory such as a DRAM (dynamic random access memory) or an SRAM (static random access memory) can be used as the memory ME1. Alternatively, a DOSRAM, a NOSRAM, or the like described below can be used as the memory ME1. For example, data used for the calculation of the processing device 51 is stored in the memory ME1. For example, a non-volatile memory such as a flash memory can be used as the memory ME2. Alternatively, a DOSRAM, a NOSRAM, or the like described below can be used as the memory ME2. For example, data on voltage-capacity characteristics used when determining the remaining capacity of the battery pack 120, data on the upper and lower limits of the voltage and current of the battery pack 120, and time-series voltage and current data as a record of the usage history of the battery pack 120 are stored in the memory ME2. When the data stored in the memory ME2 is used for calculation, for example, the data is read out to the memory ME1 and then the calculation is performed.

[0113] Furthermore, data received by the circuit WR1 via wireless communication may be stored in the memory ME1 and the memory ME2.

[0114] The memory ME1 and the memory ME2 store, for example, data used to determine the charging conditions of the power storage device 100. These data can be rewritten at any time with data received by wireless communication.

[0115] The display device DP1 has a display section and a drive circuit. The display section can display, for example, the remaining charge of the battery pack 120 and the status of the power storage device 100 (charging, discharging, standby, charging mode, etc.). During charging, it is preferable that the status indicates whether charging is being performed from the terminal PS1 or the terminal SC1, or from both.

[0116] This embodiment mode can be implemented in appropriate combination with other embodiment modes.

[0117] (Embodiment 2) In this embodiment, an example of a battery cell included in a power storage device of one embodiment of the present invention will be described.

[0118] It is preferable to use a secondary battery as the battery cell, for example. Examples of the secondary battery include secondary batteries that use electrochemical reactions, such as lithium ion batteries, electrochemical capacitors, such as electric double layer capacitors and redox capacitors, air batteries, and fuel cells.

[0119] [Cathode active material] For example, a material having element A, element X, and oxygen can be used as a positive electrode material for a secondary battery. Element A is preferably one or more selected from Group 1 elements and Group 2 elements. For example, alkali metals such as lithium, sodium, and potassium can be used as Group 1 elements. For example, calcium, beryllium, and magnesium can be used as Group 2 elements. For example, element X can be one or more selected from metal elements, silicon, and phosphorus. For example, element X is preferably one or more selected from cobalt, nickel, manganese, iron, and vanadium.

[0120] Examples of the positive electrode active material include lithium-containing composite oxides having an olivine type crystal structure, a layered rock salt type crystal structure, or a spinel type crystal structure.

[0121] Examples of the olivine-type lithium-containing composite oxide include composite oxides represented by the general formula LiMPO4 (M is one or more of Fe(II), Mn(II), Co(II), and Ni(II)). Representative examples of the general formula LiMPO4 include LiFePO4, LiNiPO4, LiCoPO4, LiMnPO4, LiFe a Ni b PO4, LiFe a Co b PO4, LiFe a Mn b PO4, LiNi a Co b PO4, LiNi a Mn b PO4 (a + b is 1 or less, 0 < a < 1, 0 < b < 1), LiFe c Ni d Co e PO4, LiFe c Ni d Mn e PO4, LiNi c Co d Mn e PO4 (c + d + e is 1 or less, 0 < c < 1, 0 < d < 1, 0 < e < 1), LiFe f Ni g Co h Mn i PO4 (f + g + h + i is 1 or less, 0 < f < 1, 0 < g < 1, 0 < h < 1, 0 < i < 1), etc.

[0122] Examples of the lithium-containing composite oxide having a layered rock salt-type crystal structure include lithium cobalt oxide (LiCoO2), LiNiO2, LiMnO2, Li2MnO3, LiNi 0.8 Co 0.2 O2 and other NiCo-based (general formula: LiNi x Co 1-x O2 (0 < x < 1)), LiNi 0.5 Mn 0.5 O2 and other NiMn-based (general formula: LiNi x Mn 1-x O2 (0 < x < 1)), LiNi 1 / 3 Mn 1 / 3 Co 1 / 3O2, etc. NiMnCo system (also called NMC. The general formula is LiNi x Mn y Co 1-x-y O2(x>0, y>0, x+y<1)). 0.8 Co 0.15 Al 0.05 )O2, Li2MnO3-LiMO2 (M=Co, Ni, Mn), etc.

[0123] Examples of lithium-containing composite oxides having a spinel-type crystal structure include LiMn2O4, Li 1+x Mn 2-x O4, LiMn 2-x Al x O4, LiMn 1.5 Ni 0.5 Examples include O4.

[0124] [Electrolyte] The electrolytic solution has a solvent and an electrolyte. The solvent of the electrolytic solution is preferably an aprotic organic solvent, and for example, one of ethylene carbonate (EC), propylene carbonate (PC), butylene carbonate, chloroethylene carbonate, vinylene carbonate, γ-butyrolactone, γ-valerolactone, dimethyl carbonate (DMC), diethyl carbonate (DEC), ethyl methyl carbonate (EMC), methyl formate, methyl acetate, ethyl acetate, methyl propionate, ethyl propionate, propyl propionate, methyl butyrate, 1,3-dioxane, 1,4-dioxane, dimethoxyethane (DME), dimethyl sulfoxide, diethyl ether, methyl diglyme, acetonitrile, benzonitrile, tetrahydrofuran, sulfolane, sultone, etc., or two or more of these can be used in any combination and ratio.

[0125] In addition, by using one or more ionic liquids (room-temperature molten salts) that are flame-retardant and non-volatile as a solvent for the electrolyte, even if the internal temperature of the secondary battery rises due to an internal short circuit or overcharging, the secondary battery can be prevented from bursting or catching fire. The ionic liquid is composed of a cation and an anion, and includes an organic cation and an anion. Examples of the organic cation used in the electrolyte include aliphatic onium cations such as quaternary ammonium cations, tertiary sulfonium cations, and quaternary phosphonium cations, and aromatic cations such as imidazolium cations and pyridinium cations. Examples of the anion used in the electrolyte include monovalent amide anions, monovalent methide anions, fluorosulfonic acid anions, perfluoroalkylsulfonic acid anions, tetrafluoroborate anions, perfluoroalkylborate anions, hexafluorophosphate anions, and perfluoroalkylphosphate anions.

[0126] As the electrolyte to be dissolved in the above-mentioned solvent, for example, a salt containing element A can be used.

[0127] Alternatively, a polymer gel electrolyte may be used in which a polymer is swollen with an electrolytic solution. By using a polymer gel electrolyte, safety against leakage and the like is improved. In addition, the secondary battery can be made thinner and lighter.

[0128] In addition, instead of the electrolyte, a solid electrolyte containing inorganic materials such as sulfides or oxides, or a solid electrolyte containing polymeric materials such as PEO (polyethylene oxide) can be used. When using a solid electrolyte, the installation of a separator or spacer becomes unnecessary. In addition, since the entire battery can be solidified, there is no risk of leakage, and safety is dramatically improved.

[0129] An example of a sulfide-based solid electrolyte is the thiosilicon-based (Li 10 GeP2S 12 , Li 3.25 Ge 0.25 P 0.75S4, etc.), sulfide glasses (70Li2S·30P2S5, 30Li2S·26B2S3·44LiI, 63Li2S·38SiS2·1Li3PO4, 57Li2S·38SiS2·5Li4SiO4, 50Li2S·50GeS2, etc.), sulfide crystallized glasses (Li7P3S 11 、Li 3.25 P 0.95 S4, etc.). As an example of an oxide-based solid electrolyte, a material having a perovskite-type crystal structure (La 2 / 3-x Li 3x TiO3, etc.), a material having a NASICON-type crystal structure (Li 1-X Al X Ti 2-X (PO4)3, etc.), a material having a garnet-type crystal structure (Li7La3Zr2O 12 ,etc.), a material having a LISICON-type crystal structure (Li 14 ZnGe4O 16 ,etc.), LLZO (Li7La3Zr2O 12 ), oxide glasses (Li3PO4-Li4SiO4, 50Li4SiO4·50Li3BO3, etc.), oxide crystallized glasses (Li 1.07 Al 0.69 Ti 1.46 (PO4)3, Li 1.5 Al 0.5 Ge 1.5 (PO4)3, etc.). As an example of a halide-based solid electrolyte, LiAlCl4, Li3InBr6, LiF, LiCl, LiBr, LiI, etc. are mentioned. Also, Li 1+x Al x Ti 2-x (PO4)3 (0 < x < 1) (hereinafter, LATP) contains aluminum and titanium, which are elements that the positive electrode active material used in the secondary battery of one aspect of the present invention may have. Therefore, a synergistic effect can be expected for improving the cycle characteristics, which is preferable. Also, an improvement in productivity due to the reduction of processes can be expected. In this specification, etc., the NASICON-type crystal structure refers to a compound represented by M2(XO4)3 (M: transition metal, X: S, P, As, Mo, W, etc.), which has a structure in which MO6 octahedra and XO4 tetrahedra share vertices and are three-dimensionally arranged.

[0130] [Separator] The secondary battery preferably has a separator, which may be made of, for example, paper, nonwoven fabric, glass fiber, ceramics, or synthetic fibers such as nylon (polyamide), vinylon (polyvinyl alcohol fiber), polyester, acrylic, polyolefin, or polyurethane.

[0131] [Negative electrode active material] When a material containing element A, element X, and oxygen is used as the positive electrode active material, a material capable of performing a charge / discharge reaction by insertion / desorption of ions of element A, a material capable of performing a charge / discharge reaction by alloying / dealloying reaction with element A, etc. can be used as the negative electrode active material of the secondary battery.

[0132] As the negative electrode active material, carbon-based materials such as graphite, easily graphitizable carbon (soft carbon), non-graphitizable carbon (hard carbon), carbon nanotubes, graphene, and carbon black can be used.

[0133] Examples of the negative electrode active material include materials containing at least one of Al, Si, Ge, Sn, Pb, Sb, Bi, Ag, Zn, Cd, In, Ga, etc. Such elements have a large capacity compared to carbon, and silicon in particular has a theoretical capacity of 4200mAh / g, which is dramatically high. For this reason, it is preferable to use silicon as the negative electrode active material. Examples of alloy-based materials using such elements include alloy-based materials such as Mg2Si, Mg2Ge, Mg2Sn, SnS2, V2Sn3, FeSn2, CoSn2, Ni3Sn2, Cu6Sn5, Ag3Sn, Ag3Sb, Ni2MnSb, CeSb3, LaSn3, La3Co2Sn7, CoSb3, InSb, and SbSn.

[0134] This embodiment mode can be implemented in appropriate combination with other embodiment modes.

[0135] (Embodiment 3) In this embodiment, an example of a power storage device of one embodiment of the present invention and an example of a battery cell and a battery pack included in the power storage device will be described.

[0136] As the battery cell of one embodiment of the present invention, battery cells of various shapes such as a rectangular type, a cylindrical type, a coin type, a flexible laminate type, and the like can be used.

[0137] [Cylindrical secondary battery] An example of using a cylindrical secondary battery as a battery cell of one embodiment of the present invention will be described below with reference to Fig. 4A. As shown in Fig. 4A, a cylindrical secondary battery 400 has a positive electrode cap (battery lid) 401 on its top surface and a battery can (external can) 402 on its side and bottom surfaces. The positive electrode cap 401 and the battery can (external can) 402 are insulated from each other by a gasket (insulating packing) 410.

[0138] Fig. 4B is a schematic diagram showing a cross section of a cylindrical secondary battery. The cylindrical secondary battery shown in Fig. 4B has a positive electrode cap (battery lid) 601 on the top surface, and a battery can (external can) 602 on the side and bottom surfaces. The positive electrode cap and the battery can (external can) 602 are insulated by a gasket (insulating packing) 610.

[0139] A battery element is provided inside a hollow cylindrical battery can 602, in which a strip-shaped positive electrode 604 and a negative electrode 606 are wound with a separator 605 sandwiched between them. The positive electrode 604 has a layer containing a positive electrode active material (hereinafter referred to as a positive electrode active material layer) formed on both sides or one side of a current collector. The negative electrode 606 has a layer containing a negative electrode active material (hereinafter referred to as a negative electrode active material layer) formed on both sides or one side of a current collector.

[0140] The active material layer preferably has a conductor in addition to the active material. As the conductor, a sheet-like compound, a fibrous compound, etc. may be used. For example, the sheet-like compound and the fibrous compound can form a three-dimensional conductive path. The sheet-like compound can be arranged so as to contact a plurality of active materials, thereby imparting conductivity across the plurality of active materials. In addition, the sheet-like compound can be arranged so as to wrap the surface of the active material, thereby enabling surface contact with the active material and increasing the conductivity of the active material layer. For example, a plurality of fibrous compounds can contact each other in the thickness direction of the active material layer to form a conductive path. Thus, the conductivity of the active material layer can be increased. For example, graphene can be used as the sheet-like conductor. The graphene may be rolled up like carbon nanofibers. In addition, the conductor may form an aggregate. The conductivity of the active material layer may be increased by the conductor forming an aggregate.

[0141] By using a sheet-like carbon-containing compound or a fibrous carbon-containing compound as the conductor, the conductivity of the active material layer can be increased, and a secondary battery suitable for rapid charging, rapid discharging, etc. can be provided.

[0142] Although not shown, the battery element is wound around a center pin. One end of the battery can 602 is closed and the other end is open. For the battery can 602, metals such as nickel, aluminum, titanium, etc., which are resistant to corrosion by the electrolyte, or alloys of these metals or alloys of these metals with other metals (e.g., stainless steel, etc.) can be used. In addition, in order to prevent corrosion by the electrolyte, it is preferable to coat the battery can 602 with nickel, aluminum, etc. Inside the battery can 602, the battery element in which the positive electrode, negative electrode, and separator are wound is sandwiched between a pair of opposing insulating plates 608, 609. In addition, a nonaqueous electrolyte (not shown) is injected into the inside of the battery can 602 in which the battery element is provided.

[0143] Since the positive and negative electrodes used in a cylindrical storage battery are wound, it is preferable that the active material is formed on both sides of the current collector. A positive electrode terminal (positive electrode current collector lead) 603 is connected to the positive electrode 604, and a negative electrode terminal (negative electrode current collector lead) 607 is connected to the negative electrode 606. Both the positive electrode terminal 603 and the negative electrode terminal 607 can be made of a metal material such as aluminum. The positive electrode terminal 603 is resistance-welded to a safety valve mechanism 613, and the negative electrode terminal 607 is resistance-welded to the bottom of the battery can 602. The safety valve mechanism 613 is electrically connected to the positive electrode cap 601 via a PTC element (Positive Temperature Coefficient) 611. The safety valve mechanism 613 cuts off the electrical connection between the positive electrode cap 601 and the positive electrode 604 when the rise in the internal pressure of the battery exceeds a predetermined threshold value. The PTC element 611 is a thermosensitive resistor whose resistance increases when the temperature rises, and the increase in resistance limits the amount of current to prevent abnormal heat generation. Barium titanate (BaTiO3)-based semiconductor ceramics can be used for the PTC element.

[0144] 5A illustrates an example of a power storage device 415. The power storage device 415 includes a battery pack 408, a temperature sensor 427, and a semiconductor device 420.

[0145] The description of the battery pack 120 described in the above embodiment can be applied to the battery pack 408. The description of the temperature sensor TS1 described in the above embodiment can be applied to the temperature sensor 427. The description of the semiconductor device 101 described in the above embodiment can be applied to the semiconductor device 420.

[0146] The battery pack 408 has a plurality of secondary batteries 400. A positive electrode of each secondary battery is in contact with and electrically connected to a conductor 424 separated by an insulator 425. The conductor 424 is electrically connected to the semiconductor device 420 via a wiring 423. In addition, a negative electrode of each secondary battery is electrically connected to the semiconductor device 420 via a wiring 426.

[0147] 5B illustrates an example of a power storage device 415. The power storage device 415 includes a battery pack 408, a temperature sensor 427, and a semiconductor device 420.

[0148] The description of the battery pack 120 described in the above embodiment can be applied to the battery pack 408. The description of the temperature sensor TS1 described in the above embodiment can be applied to the temperature sensor 427. The description of the semiconductor device 101 described in the above embodiment can be applied to the semiconductor device 420.

[0149] The battery pack 408 has a plurality of secondary batteries 400, which are sandwiched between a conductive plate 413 and a conductive plate 414. The plurality of secondary batteries 400 are electrically connected to the conductive plate 413 and the conductive plate 414 by wiring 416. The plurality of secondary batteries 400 may be connected in parallel or in series, or the secondary batteries connected in parallel may be further connected in series after being connected in parallel. By configuring a power storage device 415 having a plurality of secondary batteries 400, a large amount of power can be extracted.

[0150] A plurality of secondary batteries 400 may be connected in parallel and then further connected in series.

[0151] A temperature control device may be provided between the multiple secondary batteries 400. When the secondary batteries 400 are overheated, they can be cooled by the temperature control device, and when the secondary batteries 400 are too cold, they can be heated by the temperature control device. Therefore, the performance of the power storage device 415 is less susceptible to the effect of the outside air temperature.

[0152] 5B, the power storage device 415 is electrically connected to the semiconductor device 420 via wiring 421 and wiring 422. The wiring 421 is electrically connected to the positive electrodes of the multiple secondary batteries 400 via a conductive plate 413, and the wiring 422 is electrically connected to the negative electrodes of the multiple secondary batteries 400 via a conductive plate 414.

[0153] [Plaid secondary battery] FIG. 6 illustrates an example of a secondary battery that can be used as a battery cell in a power storage device of one embodiment of the present invention.

[0154] The wound body 950 shown in FIG. 6A has a negative electrode 931, a positive electrode 932, and a separator 933. The wound body 950 is a wound body in which the negative electrode 931 and the positive electrode 932 are stacked with the separator 933 sandwiched therebetween, and the laminated sheet is wound. Note that the negative electrode 931, the positive electrode 932, and the separator 933 may be stacked a plurality of times. The number of layers of the stack of the negative electrode 931, the positive electrode 932, and the separator 933 may be appropriately designed according to the required capacity and element volume. The terminal 951 and the terminal 952 are a positive electrode lead electrode and a negative electrode lead electrode.

[0155] As shown in Fig. 6B, a prismatic case can be used as the housing 930. The inside of the housing 930 is impregnated with an electrolyte. For convenience, the housing 930 is shown separately in Fig. 6B, but in reality, the wound body 950 is covered by the housing 930, and the terminals 951 and 952 extend outside the housing 930. The housing 930 can be made of a metal material (such as aluminum) or a resin material.

[0156] This embodiment mode can be implemented in appropriate combination with other embodiment modes.

[0157] (Embodiment 4) In this embodiment, an example of a processing apparatus or the like that can be used in one embodiment of the present invention will be described.

[0158] <Processing device configuration example 1> A processing device capable of power gating and its power management mechanism will be described below.

[0159] The semiconductor device and its power management will be described with reference to FIG. 7. The semiconductor device shown in FIG. 7A has a power circuit 10 and a processing unit (PU) 20. The PU 20 is a circuit having a function of executing instructions. The PU 20 has a plurality of functional circuits integrated on one chip. The PU 20 has a processor core 30, a power management unit (PMU) 60, a clock control circuit 65, a power switch (PSW) 70, and terminals 80 to 83. FIG. 7A shows an example in which the power circuit 10 is provided on a chip different from the PU 20. The terminal 80 is a terminal to which a power supply potential MVDD is input from the power circuit 10. The terminal 81 is a terminal to which a reference clock signal CLKM is input from the outside. The terminal 82 is a terminal to which a signal INT is input from the outside. The signal INT is an interrupt signal that requests interrupt processing. The signal INT is input to the PU 20 and the PMU 60. The terminal 83 is a terminal to which a control signal generated by the PMU 60 is output, and is electrically connected to the power circuit 10.

[0160] In a semiconductor device according to one embodiment of the present invention, the number of bits that a processing device can handle in an arithmetic circuit or the like can be, for example, 8 bits, 16 bits, 32 bits, or 64 bits.

[0161] <Processor core 30, memory circuit 31> The processor core 30 is a circuit capable of processing instructions, and can be called an arithmetic processing circuit. It has a memory circuit 31 and a number of combinational circuits 32, which constitute various functional circuits. For example, the memory circuit 31 is included in a register.

[0162] As shown in FIG. 7B, the memory circuit 31 has a circuit MemC1 and a circuit BKC1. The circuit MemC1 has a function of holding data generated by the processor core 30, and can be configured with, for example, a flip-flop circuit (FF), a latch circuit, etc. The circuit BKC1 can function as a backup circuit for the circuit MemC1, and is a circuit capable of holding data for a long period of time even if the power supply is cut off or the clock signal is cut off. By having such a memory circuit 31, it becomes possible to perform power gating of the processor core 30. This is because, by saving the data of the circuit MemC1 to the circuit BKC1 in the memory circuit 31 before cutting off the power supply, the state of the processor core 30 at the time of power cut off can be held. When the power supply is resumed, the data held in the circuit BKC1 is written to the circuit MemC1, so that the processor core 30 can be restored to the state at the time of power cut off. Therefore, after the power supply is resumed, the PU 20 can immediately perform normal processing operations.

[0163] The circuit BKC1 has at least a retention circuit having one transistor (MW1) and one capacitance element (CB1). The retention circuit shown in FIG. 7B has a circuit configuration similar to that of a 1T1C (one transistor, one capacitance element) type memory cell of a standard DRAM (dynamic random access memory), and can perform write and read operations in the same way. The charge and discharge of the capacitance element CB1 are controlled by controlling the conductive state of the transistor MW1. By turning off the transistor MW1, the node FN1 is electrically floating. By making the drain current (off current) of the transistor MW1 in the off state extremely small, the fluctuation of the potential of the node FN1 can be suppressed, and therefore the data retention time of the circuit BKC1 can be extended. The data retention time of the circuit BKC1 is determined by the leakage current of the transistor MW1, the capacitance of the capacitance element CB1, and the like. By making the transistor MW1 a transistor with an extremely small off current, it is not necessary to refresh the circuit BKC1 while the PU20 is operating. Therefore, the circuit BKC1 can be used as a non-volatile memory circuit.

[0164] It is preferable to use an OS transistor as the transistor MW1. Since an oxide semiconductor has a band gap of 2 eV or more, the off-state current is extremely small. In an OS transistor, the normalized off-state current per 1 μm of channel width when the source-drain voltage is 10 V is 10×10 -21 A (10 zeptoA) or less can be set. By using an OS transistor as the transistor MW1, the circuit BKC1 can function substantially as a nonvolatile memory circuit while the PU 20 is in operation. In the second embodiment, an OS transistor will be described.

[0165] The oxide semiconductor film used in the semiconductor layer in which the channel is formed may be formed of a single-layer oxide semiconductor film or a laminated oxide semiconductor film. The oxide semiconductor constituting the semiconductor layer in which the channel is formed is preferably an oxide containing at least one element selected from In, Ga, Sn, and Zn. Examples of such oxides include In-Sn-Ga-Zn oxide, In-Ga-Zn oxide, In-Sn-Zn oxide, In-Al-Zn oxide, Sn-Ga-Zn oxide, Al-Ga-Zn oxide, Sn-Al-Zn oxide, In-Zn oxide, Sn-Zn oxide, Al-Zn oxide, Zn-Mg oxide, Sn-Mg oxide, In-Mg oxide, In-Ga oxide, In oxide, Sn oxide, and Zn oxide.

[0166] The circuit BKC1 writes data using voltage, so it can reduce the write power compared to MRAM (Magnetoresistive RAM), which writes data using current. Also, because data is held by the load capacitance of node FN1, there is no limit to the number of times data can be rewritten, as there is with flash memory.

[0167] In the circuit BKC1, the energy required to write data corresponds to the energy associated with charging and discharging electric charge to the capacitive element CB1. On the other hand, in a storage circuit using a two-terminal storage element such as an MRAM, the energy required to write data corresponds to the energy consumed when a current flows through the storage element. In the MRAM, a current continues to flow during the data writing period, so the energy required to write data is high. Compared to such an MRAM, the circuit BKC1 can reduce the energy consumed in writing data. Therefore, compared to a storage circuit in which the backup circuit is configured with an MRAM, the storage circuit 31 has more opportunities to perform voltage scaling and power gating that can reduce the energy consumed, and therefore can reduce the power consumption of the PU 20.

[0168] <Power management> The PMU 60 has a function of controlling a power gating operation, a clock gating operation, a voltage scaling operation, and the like. More specifically, the PMU 60 has a function of controlling the power supply circuit 10, a function of controlling the memory circuit 31, a function of controlling the clock control circuit 65, and a function of controlling the PSW 70. Therefore, the PMU 60 has a function of generating control signals for controlling these circuits (the power supply circuit 10, the memory circuit 31, the clock control circuit 65, and the PSW 70). The PMU 60 has a circuit 61. The circuit 61 has a function of measuring time. The PMU 60 has a function of managing the power supply based on data related to time obtained by the circuit 61.

[0169] The PSW70 has a function of controlling the supply of a power supply potential MVDD to the PU20 in accordance with a control signal from the PMU60. Here, the power supply potential supplied to the PU20 via the PSW70 is referred to as the power supply potential VDD. The processor core 30 may have a plurality of power supply domains. In this case, it is sufficient if the PSW70 can independently control the power supply to the plurality of power supply domains. The processor core 30 may also have a power supply domain for which power gating is not required. In this case, the power supply potential may be supplied to this power supply domain without going through the PSW70.

[0170] The clock control circuit 65 has a function of receiving the reference clock signal CLKM, generating and outputting a gated clock signal. The clock control circuit 65 has a function of being able to cut off the clock signal to the processor core 30 in accordance with a control signal from the PMU 60. The power supply circuit 10 has a function of being able to change the magnitude of the power supply potential VDD in accordance with a control signal from the PMU 60.

[0171] The signal SLP output from the processor core 30 to the PMU 60 is a signal that triggers the transition of the processor core 30 to a sleep state. When the signal SLP is input, the PMU 60 generates a control signal for transitioning to a sleep state and outputs it to the functional circuit to be controlled. The power supply circuit 10 lowers the power supply potential MVDD to a level lower than that during normal operation based on the control signal from the PMU 60. When a certain period of time has elapsed in the sleep state, the PMU 60 controls the PSW 70 to cut off the power supply to the processor core 30. When the processor core 30 transitions from the normal state to the sleep state, the PMU 60 performs a voltage scaling operation to lower the power supply potential VDD of the processor core 30. When the period of the sleep state exceeds a set time, the PMU 60 performs a power gating operation to stop the supply of the power supply potential VDD to the processor core 30 in order to further reduce the power consumption of the processor core 30. Hereinafter, the power supply management of the semiconductor device shown in FIG. 7 will be described with reference to FIGS. 8 and 9.

[0172] FIG. 8 shows a schematic diagram of a change in potential of the power line 35. The power line 35 is a wiring to which a power supply potential VDD is supplied via a PSW 70. The horizontal axis of the figure shows the elapsed time (time) from the normal state to the hibernation state, and t0, t1, etc. show time. FIG. 8A shows an example in which only power gating is performed in the hibernation state, and FIG. 8B shows an example in which only voltage scaling is performed in the hibernation state. FIGS. 8C and 8D show examples in which voltage scaling and power gating are performed. In the normal state, the magnitude of the power supply potential MVDD supplied from the power supply circuit 10 is VH1.

[0173] In the following, the power modes of the PU 20 are classified into three modes: a power on mode, a power off mode, and a low power mode. The power on mode is a mode in which a power supply potential VDD that enables normal processing is supplied to the PU 20. The power off mode is a mode in which the supply of the power supply potential VDD is stopped by the PSW 70. The low power mode is a mode in which a power supply potential VDD lower than that of the power on mode is supplied.

[0174] An example of FIG. 8A will be described. At time t0, the processor core 30 starts a process of transitioning to a hibernation state. For example, the memory circuit 31 is backed up. The PMU 60 controls the PSW 70 to cut off the power supply to the processor core 30 at time t1. The power line 35 naturally discharges, and its potential drops to 0V. This allows the leakage current of the processor core 30 in the hibernation state to be significantly reduced, and the power consumption in the hibernation state (hereinafter, sometimes referred to as standby power) can be reduced. When returning to the normal state due to an external interrupt request or the like, the PMU 60 controls the PSW 70 to resume the supply of VDD. Here, the supply of VDD is resumed at time t4. The potential of the power line 35 rises and becomes VH1 at time t6.

[0175] In the example of Figure 8B, in order to perform voltage scaling, at time t1, PMU 60 controls power supply circuit 10 to lower power supply potential MVDD to VH2. The potential of power supply line 35 eventually becomes VH2. At time t4, when power supply potential MVDD returns from VH2 to VH1, the potential of power supply line 35 rises and becomes VH1 at time t5.

[0176] In the example of Fig. 8A, the time required to return from the hibernation state to the normal state (overhead time) is the time required for the potential of the power line 35 to rise from 0V to VH1, and the energy overhead required for return is the energy required to charge the load capacitance of the power line 35 from 0V to VH1. If the period (t1-t4) of the power-off mode is sufficiently long, power gating is effective in reducing the standby power of the PU 20. On the other hand, if the period (t1-t4) is short, the power required to return to the normal state becomes greater than the power that can be reduced by cutting off the power supply, and the effect of power gating cannot be obtained.

[0177] In the voltage scaling example shown in FIG. 8B, the potential of the power line 35 is VH2 in the hibernation state, so the reduction in standby power is smaller than that of the power gating example shown in FIG. 8A. On the other hand, in the example shown in FIG. 8B, the fluctuation in the potential of the power line 35 is small, so the time required to return to the normal state is shorter than that of the example shown in FIG. 8A, and the energy required for the return is smaller. Therefore, in the semiconductor device shown in FIG. 7, in order to reduce the standby power of the PU 20 more efficiently, power management that combines power gating and voltage scaling is possible. Examples of power management are shown in FIG. 8C and FIG. 8D.

[0178] As shown in FIG. 8C, first, in the hibernation state, a voltage scaling operation is performed, and the mode transitions from the power-on mode to the low power mode. As in FIG. 8B, at time t1, the PMU 60 controls the power supply circuit 10 to lower the potential of the power supply potential MVDD to VH2, so that the potential of the power line 35 eventually becomes VH2. After a certain period (t1-t3) has elapsed since the transition to the low power mode, the PMU 60 controls the PSW 70 to switch to the power-off mode. The period (t3-t4) is a period during which it is possible to reduce power by cutting off the power supply to the PU 20 by power gating, even if it includes the power consumed to return to the normal state, rather than supplying VH2 to the PU 20.

[0179] For example, the potential VH2 is a power supply potential having a magnitude capable of holding data in the circuit MemC1 of the memory circuit 31, and the potential VH3 is a potential at which the data in the circuit MemC1 is lost. In the PU20 of FIG. 7A, the circuit BKC1 is a circuit capable of holding data even during a period when the supply of power is stopped. By saving the data in the memory circuit 31 to the circuit BKC1 during the period (t0-t1), it is possible to lower the VDD to the potential VH3 at which the data in the circuit MemC1 is lost in the low power mode. This allows the standby power of the PU20 to be further reduced.

[0180] The PMU 60 has a function that can return the PU 20 to the normal state based on an interrupt request or the like. The PMU 60 controls the power supply circuit 10 to boost the magnitude of MVDD to VH1, and also controls the PSW 70 to resume the supply of VDD to the PU 20. The power-on mode is in effect from time t4 onwards. At time t6, the potential of the power supply line 35 becomes stable, and the PU 20 becomes able to operate normally from time t6 onwards.

[0181] 8D shows an example in which an interrupt request to return to normal operation occurs before time t3. From time t2 onwards, the power-on mode is in effect. At time t2, the PMU 60 controls the power supply circuit 10 to change the magnitude of MVDD to the potential VH1 of the power-on mode. At time t3, the potential of the power line 35 rises to VH1.

[0182] 8C and 8D, in the hibernation state, the time required to return the potential of the power line 35 to VH1 is longer when returning from the power off mode to the power on mode than when returning from the low power mode to the power on mode. Therefore, the PMU 60 has a function that can adjust the timing of the operation of returning the processor core 30 from the hibernation state to the normal state according to the power mode. This makes it possible to return the processor core 30 from the hibernation state to the normal state in the shortest time.

[0183] In addition, in the hibernation state, the transition from the low power mode to the power off mode can be made by measuring time with a circuit 61 provided in the PMU 60. When a signal SLP is input from the PU 20, the PMU 60 starts measuring time with the circuit 61. When a predetermined time has elapsed since the low power mode was entered, the PMU 60 transitions to the power off mode. The PSW 70 is turned off by a control signal from the PMU 60, and the supply of VDD is cut off. In this way, it is possible to transition from the low power mode to the power off mode by an interrupt request based on the measurement data of the circuit 61. An example of the power management operation of the PMU 60 will be described below with reference to FIG. 9.

[0184] The PU 20 is performing a normal operation. The power supply mode is the power-on mode, and the PMU 60 is in an idle state (step S10). The PMU 60 is in the idle state until the signal SLP is input, and executes a save sequence using the input of the signal SLP as a trigger (step S11). In the example of the save sequence in FIG. 9, first, the PMU 60 outputs a control signal to the clock control circuit 65 to stop outputting the clock signal (step S12). Next, it outputs a control signal for saving data to the memory circuit 31 (step S13). In the memory circuit 31, the data held in the circuit MemC1 is saved to the circuit BKC1 according to the control signal of the PMU 60. Finally, the PMU 60 controls the power supply circuit 10 to reduce MVDD. These operations cause the power supply mode to transition to a low power supply mode (step S14). When the signal SLP is input, the PMU 60 controls the built-in circuit 61 to measure the time Ta of the low power supply mode (step S15). The timing for operating the circuit 61 can be any timing while the save sequence is being executed, such as when the signal SLP is input, when a control signal is output to the clock control circuit 65, when data save is started, when data save is completed, when a control signal is output to the power supply circuit 10, etc.

[0185] After the save sequence is executed, the PMU 60 goes into an idle state (step S16) and monitors the input of the signal INT and the measurement time Ta of the clock control circuit 65. When the signal INT is input, the PMU 60 goes into a restore sequence (step S17). vs The PMU 60 determines whether the time Ta exceeds the time T vs If the time T exceeds the time T, the power supply mode is switched to the power off mode (step S19), and if the time T does not exceed the time T, the idle state is maintained (step S16). vs The time may be set so that the standby power consumption of the processor core 30 can be reduced more by putting the processor core 30 in the power off mode than by putting the processor core 30 in the low power mode.

[0186] In step S19, the PMU 60 outputs a control signal to the PSW 70 to cut off the power supply to the processor core 30. After entering the power-off mode, the PMU 60 again enters the idle state (step S20) and monitors the input of the signal INT (step S21). When the signal INT is input, the PMU 60 executes a recovery sequence.

[0187] In the recovery sequence, first, the PMU 60 transitions from the power off mode to the power on mode (step S22). The PMU 60 controls the power supply circuit 10 to output a power supply potential for normal operation. The PMU 60 also controls the PSW 70 to resume the supply of VDD to the processor core 30. Next, a control signal is output to the memory circuit 31 to restore the data in the memory circuit 31 (step S23). In response to the control signal from the PMU 60, the memory circuit 31 writes back the data held in the circuit BKC1 to the circuit MemC1. The PMU 60 outputs a control signal to the clock control circuit 65 to output a clock signal (step S24). In response to the control signal from the PMU 60, the clock control circuit 65 resumes outputting the clock signal.

[0188] When the return sequence is executed from the determination process of step S17, the mode is returned from the low power mode to the power on mode, and the potential of the power line 35 can be stabilized more quickly than when the return sequence is executed from the determination process of step S21. Therefore, in the PMU 60, when transitioning from step S17 to the return sequence, the timing of executing step S23 is made earlier than when transitioning from step S21 to the return sequence. This makes it possible to shorten the time required for the processor core 30 to return from the sleep state to the normal state.

[0189] 7, when the PU 20 enters a sleep state, first, a voltage scaling operation is performed to lower the power supply potential supplied to the processor core 30, thereby reducing leakage current and suppressing the time and energy overhead of the process of returning from the sleep state to the normal state. If the sleep state continues for a certain period of time, a power gating operation is performed to suppress the leakage current of the processor core 30 as much as possible. This makes it possible to reduce the power consumption of the PU 20 in the sleep state without reducing the processing capacity of the PU 20.

[0190] <<Processing device configuration example 2>> FIG. 10A shows a modified example of the processing device in FIG. 7A. The processing device (PU) 21 shown in FIG. 10A is obtained by adding a cache 40 and a power switch (PSW) 71 to the PU 20. The cache 40 is capable of power gating and voltage scaling, similar to the PU 20, and the power mode of the cache 40 changes in conjunction with the power mode of the PU 21. The PSW 71 is a circuit that controls the supply of a power supply potential MVDD to the cache 40, and is controlled by the PMU 60. Here, the power supply potential input to the cache 40 via the PSW 71 is set to VDD_MEM. The cache 40 receives a control signal from the PMU 60 and a gated clock signal from the clock control circuit 65, similar to the processor core 30.

[0191] <Cache 40> The cache 40 is a storage device having a function of temporarily storing frequently used data. The cache 40 has a memory array 41, a peripheral circuit 42, and a control circuit 43. The memory array 41 has a plurality of memory cells 45. The control circuit 43 controls the operation of the cache 40 in accordance with a request from the processor core 30. For example, it controls the write operation and read operation of the memory array 41. The peripheral circuit 42 has a function of generating a signal to drive the memory array 41 in accordance with a control signal from the control circuit 43. The memory array 41 has memory cells 45 that hold data.

[0192] As shown in FIG. 10B, the memory cell 45 has a circuit MemC2 and a circuit BKC2. The circuit MemC2 is a memory cell that is accessed in normal operation. For example, a memory cell of an SRAM (static random access memory) may be applied. The circuit BKC2 can function as a backup circuit for the circuit MemC2, and is a circuit that can hold data for a long period of time even if the power supply is cut off or the clock signal is cut off. By providing such a memory cell 45, it is possible to perform power gating of the cache 40. Before cutting off the power supply, the memory cell 45 saves data of the circuit MemC2 to BKC2. After the power supply is resumed, the data held in the circuit BKC2 is written back to the circuit MemC2, so that the PU21 can be quickly restored to the state before the power supply was cut off.

[0193] The circuit BKC2 of the memory cell 45 has at least a retention circuit having one transistor (MW2) and one capacitance element (CB2) like the circuit BKC1 of FIG. 7B. That is, the circuit BKC2 has a retention circuit with a configuration similar to that of a 1T1C memory cell of a standard DRAM. The transistor MW2 has an extremely low off-state current. An OS transistor may be used for the transistor MW2 like the transistor MW1. With this configuration, the circuit BKC2 can also suppress the fluctuation of the potential of the node FN2, which is in an electrically floating state, so that the circuit BKC2 can retain data for a long period of time. The data retention time of the circuit BKC2 is determined by the leakage current of the transistor MW2, the capacitance of the capacitance element CB2, and the like. By making the transistor MW2 a transistor with an extremely low off-state current, the circuit BKC2 can be used as a nonvolatile memory circuit that does not require a refresh operation.

[0194] In the PU 21 shown in FIG. 10A, the PMU 60 performs power management in the same manner as in the PU 20 (see FIG. 9). In step S13 shown in FIG. 9, a data save operation is performed for the memory circuit 31 and the cache 40. In step S19, the PSW 70 and PSW 71 are controlled to stop the power supply to the processor core 30 and the cache 40. In step S22, the PSW 70 and PSW 71 are controlled to resume the power supply to the processor core 30 and the cache 40. In step S23, a data restore operation is performed for the memory circuit 31 and the cache 40.

[0195] Therefore, like the semiconductor device shown in FIG. 7, the semiconductor device shown in FIG. 10 also performs power management that combines voltage scaling and power gating, making it possible to reduce the power consumed by PU21 when it is in a dormant state without reducing the processing capability of PU21.

[0196] <<Processor core configuration example>> An example of the configuration of a processor core is shown in Fig. 11. The processor core 130 shown in Fig. 11 has a control device 131, a program counter 132, a pipeline register 133, a pipeline register 134, a register file 135, an arithmetic logic unit (ALU) 136, and a data bus 137. Data is exchanged between the processor core 130 and peripheral circuits such as a PMU and a cache via the data bus 137.

[0197] The control device 131 has a function of decoding and executing instructions included in a program such as an input application by comprehensively controlling the operations of the program counter 132, pipeline register 133, pipeline register 134, register file 135, ALU 136, and data bus 137. The ALU 136 has a function of performing various arithmetic processing such as arithmetic operations and logical operations. The program counter 132 is a register that has a function of storing the address of the next instruction to be executed.

[0198] The pipeline register 133 is a register having a function of temporarily storing instruction data. The register file 135 has a plurality of registers including general-purpose registers, and can store data read from the main memory, data obtained as a result of the arithmetic processing of the ALU 136, etc. The pipeline register 134 is a register having a function of temporarily storing data used in the arithmetic processing of the ALU 136, data obtained by the arithmetic processing of the ALU 136, etc.

[0199] The storage circuit 31 in FIG. 7B is used for a register included in the processor core 130.

[0200] <Example of memory circuit configuration> A more specific example of the configuration of the memory circuit 31 shown in Fig. 7B will be described below. Fig. 12 is a circuit diagram showing an example of the configuration of the memory circuit. The memory circuit 200 shown in Fig. 12 functions as a flip-flop circuit.

[0201] A standard flip-flop circuit (FF) can be applied to the circuit MemC1, for example, a master-slave type FF can be applied. An example of such a configuration is shown in FIG. 12. The FF 110 has transmission gates (TG1, TG2, TG3, TG4, TG5), inverter circuits (INV1, INV2), and NAND circuits (NAND1, NAND2). The signal RESET and the signal OSR are control signals output from the PMU 60. The signal OSR and its inverted signal are input to TG5. The clock signal CLK and its inverted signal are input to TG1-TG4. A clocked inverter circuit may be provided instead of TG1 and INV1. A clocked NAND circuit may be provided instead of TG2 and NAND2. A clocked inverter circuit may be provided instead of TG3 and INV3. TG5 functions as a switch that controls the conduction state between the output node of NAND1 and the node NR1. The node NB1 is electrically connected to an input node of the circuit BKC10, and the node NR1 is electrically connected to an output node of the circuit BKC10.

[0202] 12 functions as a backup circuit for FF110. The circuit BKC10 includes a circuit RTC10 and a circuit PCC10. Signals (OSG, OSC, OSR) input to the circuit BKC10 are control signals output from the PMU60. The power supply potential VSS is a low power supply potential, and may be, for example, a ground potential (GND) or 0V. The power supply potential VSS and the power supply potential VDD are input to the FF110 as in the case of BKC1. In the memory circuit 200, the supply of VDD is managed by the PMU60.

[0203] The circuit RTC10 has transistors MW1, MA1, and MR1, a node FN1, and a node NK1. The circuit RTC10 has a function of retaining data, and is configured here as a memory circuit with a 3T-type gain cell structure. The transistor MW1 is a write transistor and an OS transistor. The transistor MR1 is a read transistor, and the transistor MA1 is an amplifying transistor and a read transistor. The data is retained at the node FN1. The node NK1 is a data input node. The node NR1 is a data output node of the circuit RTC10.

[0204] 12 shows an example of a configuration in which the circuit BKC10 reads data from the slave latch circuit of FF110 in a save operation, and writes the held data back to the master latch circuit in a restore operation. The data to be saved may be data from the master latch circuit. The data may also be restored to the slave latch circuit. In this case, TG5 may be provided in the slave latch circuit.

[0205] In addition, the transistors MR1 ​​and MA1 of the circuit RTC10 may be either n-type or p-type, and the potential of the signal OSR and the level of the power supply potential supplied to the transistor MA1 may be changed depending on the conductivity type of the transistors MR1 ​​and MA1. In addition, the logic circuit of the FF110 may be set appropriately. For example, if the transistors MR1 ​​and MA1 are p-type transistors, NAND1 and INV3 may be swapped in the master latch circuit, and INV2 and NAND2 may be swapped in the slave latch circuit. In addition, VDD may be input to the transistor MA1 instead of VSS.

[0206] The circuit BKC10 writes data using voltage, so it can reduce the write power compared to MRAM, which writes data using current. Also, since data is held by the load capacitance of the node FN1, there is no limit to the number of times data can be rewritten, as there is in flash memory.

[0207] In the circuit RTC10, the energy required to write data corresponds to the energy associated with charging and discharging electric charge to the capacitive element CB1. On the other hand, in a memory circuit using a two-terminal memory element such as MRAM, the energy required to write data corresponds to the energy consumed when a current flows through the memory element. Therefore, the circuit BKC10 can reduce the energy consumed by saving data compared to the case of using MRAM or the like in which a current continues to flow during the data writing period. Therefore, by providing the circuit BKC10 in the backup circuit, it is possible to shorten the BET (Break Even Time) compared to the case of providing MRAM. As a result, the opportunities for power gating that can reduce the consumed energy increase, and the power consumption of the semiconductor device can be reduced.

[0208] The circuit PCC10 includes a transistor MC1 and a transistor MC2. The circuit PCC10 has a function of precharging the node FN1. The circuit PCC10 does not necessarily have to be provided. As will be described later, by providing the circuit PCC10, the data save time of the circuit BKC10 can be shortened.

[0209] <Memory circuit operation example> FIG. 13 is a timing chart showing an example of the operation of the memory circuit 200, and shows waveforms of control signals (signal SLP, signal RESET, clock signal CLK, signal OSG, signal OSR) and changes in the power supply potential VDD and the potentials of node FN1 and node NR1.

[0210] [Normal operation] The "normal operation" period will be described. A power supply potential VDD and a clock signal CLK are supplied to the memory circuit 200. FF110 functions as a sequential circuit. Since the signal RESET is maintained at a high level, NAND1 and NAND2 function as inverter circuits. In the circuit BKC1, the transistor MC1 is in an off state, and the transistors MC2 and MW1 are in an on state, so that the potential of the node FN1 is precharged to a high level.

[0211] [Data evacuation] Next, the "back up" period will be described. First, the clock signal CLK is stopped. This stops rewriting the data of the node NB1. In the example of FIG. 13, the potential level of the node NB1 is low ("0") when the potential of the node NR1 is high ("1"), and is high ("1") when the potential is low ("0"). During the period when the signal OSC is high, the data of the node NB1 is saved to the node FN1. Specifically, since the transistors MC1 and MW1 are in the on state, the node FN1 and the node NB1 are electrically connected. By setting the signal OSG to low and turning the transistor MW1 off, the node FN1 is in an electrically floating state, and the circuit BKC10 is in a data holding state. The potential of the node FN1 is high when the node NR1 is low ("0"), and is low when the potential is high ("1").

[0212] The data evacuation ends when the signal OSG is set to low level, so the voltage scaling operation of the PU20 can be performed immediately after the signal OSG is set to low level. Also, because the node FN1 is precharged to high level by the transistor MC2 during normal operation, the data evacuation operation that sets the node FN1 to high level does not involve the movement of charge at the node FN1. This allows the circuit BKC10 to complete the evacuation operation in a short time.

[0213] In the data save operation, it is sufficient that the clock signal CLK is inactive. In the example of FIG. 13, the potential of the clock signal CLK is set to a low level, but it may be set to a high level.

[0214] [Voltage scaling, low power mode] Next, the "low power" period will be described. In conjunction with the falling edge of the signal OSC, the PMU 60 performs a voltage scaling operation. This causes the storage circuit 200 to transition to a low power mode.

[0215] [Power gating, power off mode] Next, the "power off" period will be described. When a certain period of time has elapsed since the transition to the low power mode, the PMU 60 performs a power gating operation to put the storage circuit 200 into the power off mode.

[0216] [Power on mode] Next, the "power on" period will be described. In response to an interrupt request, the PMU 60 returns the memory circuit 200 to the power on mode. In the example of FIG. 13, when the potential of the power line supplying VDD becomes stable, the clock signal CLK becomes high level. In FIG. 13, the four periods of backup, low power, power off, and power on are collectively represented as a "sleep" period.

[0217] [Data recovery] A data recovery operation is performed while the signal OSR is at a high level. By setting the signal RESET to a high level, the potential of the node NR1 is precharged to a high level ("1"). By setting the signal OSR to a high level, TG5 is set to a high impedance state and the transistor MR1 is set to a conductive state. The conductive state of the transistor MA1 is determined by the potential of the node FN1. If the node FN1 is at a high level, the transistor MA1 is in a conductive state, so that the potential of the node NR1 drops to a low level ("0"). If the node FN1 is at a low level, the potential of the node NR1 is maintained at a high level. In other words, the state of FF110 is restored to the state before the transition to the hibernation state.

[0218] As described above, the rising edges of the signals RESET and OSR allow high-level data to be written back (Restored) to the node NR1, thereby enabling the storage circuit 200 to shorten the restoration operation period.

[0219] 13 shows an example of returning from the power-off mode to the power-on mode. When returning from the low power mode to the power-on mode, a period T onIn this case, it is better to make the signal OSR rise earlier than when returning from the power off mode.

[0220] [Normal operation] Next, the "normal operation" period will be described. By resuming the supply of the clock signal CLK, the state where normal operation is possible is restored. By setting the signal OSG to high level, the node FN1 is precharged by the circuit PCC10 and becomes high level.

[0221] <<Cache>> An example in which the cache 40 is configured using an SRAM will be described below.

[0222] <Memory cell configuration example> An example of the configuration of a cache memory cell is shown in FIG. 14. The memory cell 220 shown in FIG. 14 has a circuit SMC20 and a circuit BKC20. The circuit SMC20 may have a circuit configuration similar to that of a standard SRAM memory cell. The circuit SMC20 shown in FIG. 14 has an inverter circuit INV11, an inverter circuit INV12, a transistor M11, and a transistor M12.

[0223] The circuit BKC20 functions as a backup circuit for the circuit SMC20. The circuit BKC20 has a transistor MW11, a transistor MW12, and a capacitance element CB11 and a capacitance element CB12. The transistors MW11 and MW12 are OS transistors. The circuit SMC20 has two 1T1C type holding circuits, and data is held at nodes SN1 and SN2, respectively. The holding circuit made up of the transistor MW11 and the capacitance element CB11 has a function of backing up data at node NET1. The holding circuit made up of the transistor MW12 and the capacitance element CB12 has a function of backing up data at node NET2.

[0224] The memory cell 220 is supplied with power supply potentials VDDMC and VSS. The memory cell 220 is electrically connected to wirings (WL, BL, BLB, BRL). A signal SLC is input to the wiring WL. When writing data, a data signal D and a data signal DB are input to the wirings BL and BLB. Data is read by detecting the potentials of the wirings BL and BLB. A signal OSS is input to the wiring BRL. The signal OSS is a signal input from the PMU 60.

[0225] <Memory cell operation example> A description will now be given of an example of the operation of the memory cell 220. FIG.

[0226] [Normal operation] An access request is made to the circuit SMC20, and data is written or read. In the circuit BKC20, the signal OSS is at a low level, so that the nodes SN1 and SN2 are in an electrically floating state and are in a data holding state. In the example of Fig. 15, the potential of the node SN1 is at a low level ("0"), and the potential of the other node, the node SN2, is at a high level ("1").

[0227] [Data evacuation] When the signal OSS goes high, the transistors MW11 and MW12 are turned on, and the nodes SN1 and SN2 are at the same potential levels as the nodes NET1 and NET2, respectively. In the example of Fig. 15, the potentials of the nodes SN1 and SN2 are at high and low levels, respectively. The signal OSS goes low, the circuit BKC20 goes into a data holding state, and the data save operation ends.

[0228] [Voltage scaling, low power mode] In conjunction with the falling edge of the signal OSS, the PMU 60 performs a voltage scaling operation, which causes the cache 40 to transition to a low power mode.

[0229] [Power gating, power off mode] When a certain period of time has elapsed since the transition to the low power mode, the PMU 60 performs a power gating operation and puts the cache 40 into the power off mode.

[0230] [Data recovery, power on mode] In response to the interrupt request, the PMU 60 restores the cache 40 to the normal state. The signal OSS is set to high level, and the data held in the circuit BKC 20 is written back to the circuit SMC 20. During the period when the signal OSS is at high level, the PMU 60 performs a voltage scaling operation and a power gating operation, and restores the memory circuit 200 to the power-on mode. In the example of FIG. 13, when the potential of the power line supplying VDD becomes stable, the clock signal CLK becomes high level. When the potential of the power line supplying VDDMC becomes stable, the signal OSS is returned to low level, and the data restoration operation is terminated. The states of the nodes SN1 and SN2 are restored to the states they were in immediately before entering the hibernation state.

[0231] [Normal operation] When the supply of VDDMC is resumed, the circuit SMC20 returns to the normal mode in which normal operation is possible.

[0232] As described above, by using OS transistors, a backup circuit capable of retaining data for a long period of time even when the power supply is cut off can be configured. Providing this backup circuit enables power gating of the processor core and cache. In addition, by performing power management in hibernation that combines voltage scaling and power gating, it is possible to reduce the energy and time overhead required for the process of returning from the hibernation state to the normal state. Therefore, it is possible to efficiently reduce power without reducing the processing capacity of the processing device.

[0233] <Example of memory> Below, a memory including an OS transistor of one embodiment of the present invention will be described.

[0234] The power storage device of one embodiment of the present invention preferably includes a memory. A memory device including an OS transistor can be used as the memory. For example, NOSRAM (registered trademark), DOSRAM (registered trademark), or the like described below can be used.

[0235] NOSRAM is a gain cell type DRAM in which the write transistor of the memory cell is composed of an OS transistor. NOSRAM is an abbreviation for Nonvolatile Oxide Semiconductor RAM. An example of the configuration of NOSRAM is shown below.

[0236] 16A is a block diagram showing an example of the configuration of a NOSRAM. The NOSRAM 240 is provided with power domains 242 and 243, and power switches 245 to 247. The power domain 242 is provided with a memory cell array 250, and the power domain 243 is provided with peripheral circuits for the NOSRAM 240. The peripheral circuits include a control circuit 251, a row circuit 252, and a column circuit 253.

[0237] A voltage VDDD, a voltage VSSS, a voltage VDHW, a voltage VDHR, a voltage VBG2, a clock signal GCLK2, an address signal, a signal CE, a signal WE, and a signal PSE5 are input to the NOSRAM 240 from outside. The signals CE and WE are a chip enable signal and a write enable signal. The signal PSE5 controls the on / off of the power switches 245 to 247. The power switches 245 to 247 control the input of the voltages VDDD, VDHW, and VDHR to the power domain 243, respectively.

[0238] The voltages, signals, and the like input to the NOSRAM 240 are appropriately selected according to the circuit configuration and operation method of the NOSRAM 240. For example, a power domain that is not power-gated may be provided in the NOSRAM 240, and a power gating control circuit that generates the signal PSE5 may be provided.

[0239] The memory cell array 250 includes memory cells 11, a write word line WWL, a read word line RWL, a write bit line WBL, a read bit line RBL, and a source line SL.

[0240] As shown in FIG. 16B, the memory cell 11 is a 2T1C (two transistors, one capacitor) type gain cell, and includes a node SN1, transistors M1 and M2, and a capacitor C1. The transistor M1 is a write transistor and is an OS transistor having a backgate. The backgate of the transistor M1 is electrically connected to a wiring BGL2 that supplies a voltage VBG2. The transistor M2 is a read transistor and is a p-channel type Si transistor. The capacitor C1 is a storage capacitor that holds the voltage of the node SN1.

[0241] The voltages VDDD and VSSS represent data "1" and "0." The high-level voltages of the write word line WWL and the read word line RWL are the voltages VDHW and VHDR, respectively.

[0242] Fig. 17A shows a configuration example of a memory cell array 250. In the memory cell array 250 shown in Fig. 17, one source line is supplied to two adjacent rows.

[0243] In principle, the memory cell 11 has no limit to the number of times it can be rewritten, data can be rewritten with low energy, and no power is consumed to retain data. Because the transistor M1 is an OS transistor with extremely low off-current, the memory cell 11 can retain data for a long time. Therefore, by configuring a cache with NOSRAM 240, it is possible to create a non-volatile, low-power cache.

[0244] The circuit configuration of the memory cell 11 is not limited to the circuit configuration of FIG. 16B. For example, the read transistor M2 may be an OS transistor having a back gate or an n-channel type Si transistor. Alternatively, the memory cell 11 may be a 3T type gain cell. For example, an example of a 3T type gain cell is shown in FIG. 17B and FIG. 17C. The memory cell 15 shown in FIG. 17B has transistors M3 to M5, a capacitance element C3, and a node SN3. The transistors M3 to M5 are a write transistor, a read transistor, and a selection transistor. The transistor M3 is an OS transistor having a back gate, and the transistors M4 and M5 are p-channel type Si transistors. The transistors M4 and M5 may be configured as n-channel type Si transistors or OS transistors having a back gate. In the memory cell 16 shown in FIG. 17C, the three transistors are configured as OS transistors having a back gate.

[0245] The node SN3 is a holding node. The capacitive element C3 is a holding capacitance for holding the voltage of the node SN3. The capacitive element C3 may not be intentionally provided, and the holding capacitance may be formed by the gate capacitance of the transistor M4 or the like. A fixed voltage (e.g., VDDD) is input to the wiring PDL. The wiring PDL is a wiring in place of the source line SL, and for example, a voltage VDDD is input to the wiring PDL.

[0246] The control circuit 251 has a function of controlling the overall operation of the NOSRAM 240. For example, the control circuit 251 performs a logical operation on the signals CE and WE to determine whether an external access is a write access or a read access.

[0247] The row circuit 252 has a function of selecting a write word line WWL and a read word line of a selected row specified by an address signal, and the column circuit 253 has a function of writing data to a write bit line of a column specified by an address signal, and a function of reading data from the write bit line WBL of the column.

[0248] DOSRAM is a RAM having 1T1C type memory cells, and is an abbreviation for Dynamic Oxide Semiconductor RAM. DOSRAM will be described below with reference to FIG.

[0249] As shown in FIG. 18A, the memory cell 16 of the DOSRAM 351 is electrically connected to a bit line BL1 (or BLB1), a word line WL1, a wiring BGL6, and a wiring PL. The bit line BLB1 is an inverted bit line. For example, a voltage VBG6 and a voltage VSSS are input to the wiring BGL6 and the wiring PL, respectively. The memory cell 16 includes a transistor M6 and a capacitance element C6. The transistor M6 is an OS transistor having a back gate.

[0250] Since data is rewritten by charging and discharging the capacitive element C6, the DOSRAM 351 has no restriction on the number of rewrites in principle, and data can be written and read with low energy. In addition, since the circuit configuration of the memory cell 16 is simple, it is easy to increase the capacity. Since the write transistor of the memory cell 16 is an OS transistor, the retention time of the DOSRAM 351 is much longer than that of DRAM. Therefore, the frequency of refresh can be reduced, or the refresh operation can be made unnecessary, thereby reducing the power required for the refresh operation.

[0251] 18B, in the DOSRAM 351, the memory cell array 361 can be stacked on the peripheral circuit 365. This is because the transistor M6 of the memory cell 16 is an OS transistor.

[0252] In the memory cell array 361, a plurality of memory cells 16 are arranged in a matrix, and bit lines BL1, BLB1, word line WL1, wirings BGL6, and PL are provided according to the arrangement of the memory cells 16. In the peripheral circuit 365, a control circuit, a row circuit, and a column circuit are provided. The row circuit selects the word line WL1 to be accessed, and the column circuit writes and reads data to and from the bit line pair consisting of BL1 and BLB1.

[0253] Power switches 371 and 373 are provided to power gate the peripheral circuit 365. The power switches 371 and 373 respectively control the input of voltages VDDD and VDHW6 to the peripheral circuit 365. The voltage VDHW6 is a high-level voltage of the word line WL1. The on / off of the power switches 371 and 373 is controlled by a signal PSE6.

[0254] This embodiment mode can be implemented in appropriate combination with other embodiment modes.

[0255] (Embodiment 5) In this embodiment, a structure example of a semiconductor device of one embodiment of the present invention will be described.

[0256] A portion of the cross-sectional structure of the semiconductor device is shown in Fig. 19. The semiconductor device shown in Fig. 19 has a transistor 550, a transistor 500, and a capacitor 600. Fig. 21A is a cross-sectional view of the transistor 500 in the channel length direction, Fig. 21B is a cross-sectional view of the transistor 500 in the channel width direction, and Fig. 21C is a cross-sectional view of the transistor 550 in the channel width direction.

[0257] The transistor 500 is an OS transistor. The off-state current of the transistor 500 is extremely small. Therefore, a data voltage or charge written to a storage node through the transistor 500 can be held for a long period of time. That is, the frequency of a refresh operation of the storage node can be reduced or the refresh operation is not required, so that the power consumption of a semiconductor device can be reduced.

[0258] In FIG. 19, a transistor 500 is provided above a transistor 550 , and a capacitor 600 is provided above the transistors 550 and 500 .

[0259] The transistor 550 is provided over a substrate 311 and includes a conductor 316, an insulator 315, a semiconductor region 313 made of a part of the substrate 311, a low resistance region 314a functioning as a source region or drain region, and a low resistance region 314b.

[0260] 21C , in the transistor 550, the upper surface and the side surface in the channel width direction of the semiconductor region 313 are covered with the conductor 316 via the insulator 315. By forming the transistor 550 as a fin type in this manner, the effective channel width is increased, thereby improving the on-characteristics of the transistor 550. In addition, the contribution of the electric field of the gate electrode can be increased, thereby improving the off-characteristics of the transistor 550.

[0261] Note that the transistor 550 may be either a p-channel transistor or an n-channel transistor.

[0262] The region where the channel of the semiconductor region 313 is formed, the region nearby, the low resistance region 314a which becomes the source region or the drain region, and the low resistance region 314b preferably contain a semiconductor such as a silicon-based semiconductor, and preferably contain single crystal silicon. Alternatively, they may be formed of a material containing Ge (germanium), SiGe (silicon germanium), GaAs (gallium arsenide), GaAlAs (gallium aluminum arsenide), or the like. A configuration using silicon in which the effective mass is controlled by applying stress to the crystal lattice and changing the lattice spacing may be used. Alternatively, the transistor 550 may be a HEMT by using GaAs and GaAlAs, or the like.

[0263] Low resistance region 314a and low resistance region 314b contain, in addition to the semiconductor material applied to semiconductor region 313, an element that imparts n-type conductivity, such as arsenic or phosphorus, or an element that imparts p-type conductivity, such as boron.

[0264] The conductor 316 functioning as the gate electrode can be made of a conductive material such as a semiconductor material, such as silicon, containing an element that imparts n-type conductivity, such as arsenic or phosphorus, or an element that imparts p-type conductivity, such as boron, a metal material, an alloy material, or a metal oxide material.

[0265] Since the work function is determined by the material of the conductor, the threshold voltage of the transistor can be adjusted by selecting the material of the conductor. Specifically, it is preferable to use a material such as titanium nitride or tantalum nitride for the conductor. Furthermore, in order to achieve both electrical conductivity and embeddability, it is preferable to use a metal material such as tungsten or aluminum as the conductor in a laminated state, and in particular, it is preferable to use tungsten in terms of heat resistance.

[0266] The transistor 550 may be formed using a silicon on insulator (SOI) substrate or the like.

[0267] The SOI substrate may be a SIMOX (Separation by Implanted Oxygen) substrate formed by implanting oxygen ions into a mirror-polished wafer and then heating at high temperature to form an oxide layer at a certain depth from the surface and eliminate defects in the surface layer, or an SOI substrate formed using the Smart Cut method, which cleaves a semiconductor substrate by utilizing the growth of microvoids formed by hydrogen ion implantation through heat treatment, or the ELTRAN method (registered trademark: Epitaxial Layer Transfer). A transistor formed using a single crystal substrate has a single crystal semiconductor in the channel formation region.

[0268] 19 is just an example and is not limited to the structure, and an appropriate transistor may be used depending on the circuit structure and driving method. For example, when the semiconductor device is a unipolar circuit including only OS transistors (meaning transistors having the same polarity, such as only n-channel transistors), the structure of the transistor 550 may be the same as that of the transistor 500, as shown in FIG. 20. Details of the transistor 500 will be described later.

[0269] An insulator 320, an insulator 322, an insulator 324, and an insulator 326 are stacked in this order over the transistor 550.

[0270] As the insulators 320, 322, 324, and 326, for example, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, aluminum oxide, aluminum oxynitride, aluminum nitride oxide, aluminum nitride, or the like can be used.

[0271] In this specification, silicon oxynitride refers to a material having a higher oxygen content than nitrogen, silicon nitride oxide refers to a material having a higher nitrogen content than oxygen, aluminum oxynitride refers to a material having a higher oxygen content than nitrogen, and aluminum nitride oxide refers to a material having a higher nitrogen content than oxygen.

[0272] The insulator 322 may function as a planarizing film that planarizes steps caused by the transistor 550 or the like provided thereunder. For example, the top surface of the insulator 322 may be planarized by planarization treatment using a chemical mechanical polishing (CMP) method or the like to improve the planarity.

[0273] The insulator 324 is preferably a film having a barrier property that prevents hydrogen or impurities from diffusing from the substrate 311, the transistor 550, or the like to a region where the transistor 500 is provided.

[0274] As an example of a film having a barrier property against hydrogen, for example, silicon nitride formed by a CVD method can be used. Here, when hydrogen diffuses into a semiconductor element having an oxide semiconductor such as the transistor 500, the characteristics of the semiconductor element may deteriorate. Therefore, it is preferable to use a film that suppresses the diffusion of hydrogen between the transistor 500 and the transistor 550. Specifically, the film that suppresses the diffusion of hydrogen is a film that releases a small amount of hydrogen.

[0275] The amount of desorption of hydrogen can be analyzed, for example, by using thermal desorption spectrometry (TDS). For example, the amount of desorption of hydrogen from the insulator 324 is calculated as 10×10 per area of ​​the insulator 324 when the surface temperature of the film is in the range of 50° C. to 500° C. in the TDS analysis. 15 atoms / cm 2 Less than or equal to 5×10 15 atoms / cm 2 The following is acceptable.

[0276] The insulator 326 preferably has a lower dielectric constant than the insulator 324. For example, the relative dielectric constant of the insulator 326 is preferably less than 4, and more preferably less than 3. For example, the relative dielectric constant of the insulator 326 is preferably 0.7 times or less, and more preferably 0.6 times or less, the relative dielectric constant of the insulator 324. By using a material with a low dielectric constant as the interlayer film, the parasitic capacitance generated between wirings can be reduced.

[0277] Moreover, the insulator 320, the insulator 322, the insulator 324, and the insulator 326 are embedded with the capacitor 600 or the conductor 328 and the conductor 330 connected to the transistor 500. The conductor 328 and the conductor 330 function as a plug or wiring. In addition, a plurality of conductors having the function of a plug or wiring may be collectively given the same reference numeral. In addition, in this specification and the like, the wiring and the plug connected to the wiring may be integral. That is, there are cases where a part of the conductor functions as the wiring, and cases where a part of the conductor functions as the plug.

[0278] As the material for each plug and wiring (conductor 328, conductor 330, etc.), a conductive material such as a metal material, an alloy material, a metal nitride material, or a metal oxide material can be used in a single layer or a laminated layer. It is preferable to use a high melting point material such as tungsten or molybdenum that has both heat resistance and conductivity, and tungsten is preferably used. Alternatively, it is preferable to form the plug and wiring from a low resistance conductive material such as aluminum or copper. By using a low resistance conductive material, the wiring resistance can be reduced.

[0279] A wiring layer may be provided over the insulator 326 and the conductor 330. For example, in FIG. 19, an insulator 350, an insulator 352, and an insulator 354 are stacked in this order. A conductor 356 is formed in the insulator 350, the insulator 352, and the insulator 354. The conductor 356 functions as a plug or wiring connected to the transistor 550. Note that the conductor 356 can be provided using a material similar to that of the conductor 328 and the conductor 330.

[0280] Note that, for example, the insulator 350 is preferably an insulator having a barrier property against hydrogen, similar to the insulator 324. The conductor 356 preferably includes a conductor having a barrier property against hydrogen. In particular, a conductor having a barrier property against hydrogen is formed in an opening of the insulator 350 having a barrier property against hydrogen. With this structure, the transistor 550 and the transistor 500 can be separated by a barrier layer, and diffusion of hydrogen from the transistor 550 to the transistor 500 can be suppressed.

[0281] Note that, for example, tantalum nitride or the like may be used as a conductor having a barrier property against hydrogen. By stacking tantalum nitride and tungsten having high conductivity, diffusion of hydrogen from the transistor 550 can be suppressed while maintaining the conductivity of the wiring. In this case, it is preferable that the tantalum nitride layer having a barrier property against hydrogen be in contact with the insulator 350 having a barrier property against hydrogen.

[0282] A wiring layer may be provided on the insulator 354 and the conductor 356. For example, in FIG. 19, an insulator 360, an insulator 362, and an insulator 364 are stacked in this order. A conductor 366 is formed in the insulator 360, the insulator 362, and the insulator 364. The conductor 366 functions as a plug or a wiring. The conductor 366 can be provided using a material similar to that of the conductor 328 and the conductor 330.

[0283] Note that, for example, the insulator 360 is preferably an insulator having a barrier property against hydrogen, similar to the insulator 324. The conductor 366 preferably includes a conductor having a barrier property against hydrogen. In particular, a conductor having a barrier property against hydrogen is formed in an opening of the insulator 360 having a barrier property against hydrogen. With this structure, the transistor 550 and the transistor 500 can be separated by a barrier layer, and diffusion of hydrogen from the transistor 550 to the transistor 500 can be suppressed.

[0284] A wiring layer may be provided over the insulator 364 and the conductor 366. For example, in FIG. 19, an insulator 370, an insulator 372, and an insulator 374 are stacked in this order. A conductor 376 is formed in the insulator 370, the insulator 372, and the insulator 374. The conductor 376 functions as a plug or a wiring. The conductor 376 can be provided using a material similar to that of the conductor 328 and the conductor 330.

[0285] Note that, for example, the insulator 370 is preferably an insulator having a barrier property against hydrogen, similar to the insulator 324. The conductor 376 preferably includes a conductor having a barrier property against hydrogen. In particular, a conductor having a barrier property against hydrogen is formed in an opening of the insulator 370 having a barrier property against hydrogen. With this structure, the transistor 550 and the transistor 500 can be separated by a barrier layer, and diffusion of hydrogen from the transistor 550 to the transistor 500 can be suppressed.

[0286] A wiring layer may be provided over the insulator 374 and the conductor 376. For example, in FIG. 19, an insulator 380, an insulator 382, ​​and an insulator 384 are stacked in this order. A conductor 386 is formed in the insulator 380, the insulator 382, ​​and the insulator 384. The conductor 386 functions as a plug or a wiring. The conductor 386 can be provided using a material similar to that of the conductor 328 and the conductor 330.

[0287] Note that, for example, the insulator 380 is preferably an insulator having a barrier property against hydrogen, similar to the insulator 324. The conductor 386 preferably includes a conductor having a barrier property against hydrogen. In particular, a conductor having a barrier property against hydrogen is formed in an opening of the insulator 380 having a barrier property against hydrogen. With this structure, the transistor 550 and the transistor 500 can be separated by a barrier layer, and diffusion of hydrogen from the transistor 550 to the transistor 500 can be suppressed.

[0288] In the above, a wiring layer including the conductor 356, a wiring layer including the conductor 366, a wiring layer including the conductor 376, and a wiring layer including the conductor 386 have been described, but the semiconductor device of this embodiment is not limited to this. There may be three or fewer wiring layers similar to the wiring layer including the conductor 356, or there may be five or more wiring layers similar to the wiring layer including the conductor 356.

[0289] An insulator 510, an insulator 512, an insulator 514, and an insulator 516 are stacked in this order on the insulator 384. Any of the insulator 510, the insulator 512, the insulator 514, and the insulator 516 is preferably made of a substance that has a barrier property against oxygen or hydrogen.

[0290] For example, the insulator 510 and the insulator 514 are preferably formed using a film having a barrier property against hydrogen and impurities in a region where the transistor 500 is provided, such as the substrate 311 or a region where the transistor 550 is provided. Therefore, a material similar to that of the insulator 324 can be used.

[0291] As an example of a film having a barrier property against hydrogen, silicon nitride formed by a CVD method can be used. Here, when hydrogen diffuses into a semiconductor element having an oxide semiconductor such as the transistor 500, the characteristics of the semiconductor element may deteriorate. Therefore, a film that suppresses the diffusion of hydrogen is preferably used between the transistor 500 and the transistor 550.

[0292] As a film having a barrier property against hydrogen, for example, the insulator 510 and the insulator 514 are preferably made of a metal oxide such as aluminum oxide, hafnium oxide, or tantalum oxide.

[0293] In particular, aluminum oxide has a high blocking effect of preventing the film from permeating both oxygen and impurities such as hydrogen and moisture, which are factors that cause fluctuations in the electrical characteristics of a transistor. Therefore, aluminum oxide can prevent impurities such as hydrogen and moisture from entering the transistor 500 during and after the transistor manufacturing process. In addition, aluminum oxide can suppress the release of oxygen from the oxide that constitutes the transistor 500. Therefore, aluminum oxide is suitable for use as a protective film for the transistor 500.

[0294] For example, the insulator 512 and the insulator 516 can be made of a material similar to that of the insulator 320. By using a material with a relatively low dielectric constant for these insulators, the parasitic capacitance generated between wirings can be reduced. For example, the insulator 512 and the insulator 516 can be made of a silicon oxide film, a silicon oxynitride film, or the like.

[0295] A conductor 518, a conductor constituting the transistor 500 (for example, the conductor 503), and the like are embedded in the insulator 510, the insulator 512, the insulator 514, and the insulator 516. Note that the conductor 518 functions as a plug or wiring connected to the capacitor 600 or the transistor 550. The conductor 518 can be provided using a material similar to that of the conductor 328 and the conductor 330.

[0296] In particular, the insulator 510 and the conductor 518 in the region in contact with the insulator 514 are preferably conductors having barrier properties against oxygen, hydrogen, and water. With this structure, the transistor 550 and the transistor 500 can be separated by a layer having barrier properties against oxygen, hydrogen, and water, and diffusion of hydrogen from the transistor 550 to the transistor 500 can be suppressed.

[0297] Above the insulator 516 is a transistor 500 .

[0298] As shown in Figures 21A and 21B, transistor 500 has a conductor 503 arranged so as to be embedded in insulator 514 and insulator 516, an insulator 520 arranged on insulator 516 and conductor 503, an insulator 522 arranged on insulator 520, an insulator 524 arranged on insulator 522, an oxide 530a arranged on insulator 524, an oxide 530b arranged on oxide 530a, conductors 542a and 542b arranged apart from each other on oxide 530b, an insulator 580 arranged on conductor 542a and conductor 542b and having an opening formed therebetween overlapping with conductor 542a and conductor 542b, an insulator 545 arranged on the bottom and side surfaces of the opening, and a conductor 560 arranged on the formation surface of insulator 545.

[0299] 21A and 21B, it is preferable that an insulator 544 is disposed between the oxide 530a, the oxide 530b, the conductor 542a, and the conductor 542b and the insulator 580. It is preferable that the conductor 560 has a conductor 560a provided inside the insulator 545 and a conductor 560b provided so as to be embedded inside the conductor 560a, as shown in FIG. 21A and 21B. It is preferable that an insulator 574 is disposed on the insulator 580, the conductor 560, and the insulator 545, as shown in FIG. 21A and 21B.

[0300] In this specification and other documents, oxide 530a and oxide 530b may be collectively referred to as oxide 530.

[0301] Note that, in the transistor 500, a two-layer structure of the oxide 530a and the oxide 530b is shown in the region where the channel is formed and in the vicinity thereof, but the present invention is not limited to this structure. For example, a single layer of the oxide 530b or a stacked structure of three or more layers may be used.

[0302] In addition, although the transistor 500 has a two-layer structure, the conductor 560 is not limited to this. For example, the conductor 560 may have a single-layer structure or a three- or more-layer structure. The transistor 500 shown in FIGS. 19, 20, and 21A is merely an example, and the present invention is not limited to this structure. An appropriate transistor may be used depending on the circuit configuration, driving method, and the like.

[0303] Here, the conductor 560 functions as a gate electrode of the transistor, and the conductors 542a and 542b function as a source electrode and a drain electrode, respectively. As described above, the conductor 560 is formed so as to be embedded in the opening of the insulator 580 and in the region sandwiched between the conductors 542a and 542b. The arrangement of the conductors 560, 542a, and 542b is selected in a self-aligned manner with respect to the opening of the insulator 580. That is, in the transistor 500, the gate electrode can be arranged in a self-aligned manner between the source electrode and the drain electrode. Therefore, the conductor 560 can be formed without providing a margin for alignment, so that the area occupied by the transistor 500 can be reduced. This allows the semiconductor device to be miniaturized and highly integrated.

[0304] Furthermore, since the conductor 560 is formed in a self-aligned manner in the region between the conductor 542a and the conductor 542b, the conductor 560 does not have a region that overlaps with the conductor 542a or the conductor 542b. This makes it possible to reduce the parasitic capacitance formed between the conductor 560 and the conductor 542a and between the conductor 560 and the conductor 542b. This makes it possible to improve the switching speed of the transistor 500 and provide high frequency characteristics.

[0305] The conductor 560 may function as a first gate (also referred to as a top gate) electrode. The conductor 503 may function as a second gate (also referred to as a bottom gate) electrode. In this case, the threshold voltage of the transistor 500 can be controlled by changing the potential applied to the conductor 503 independently of the potential applied to the conductor 560. In particular, by applying a negative potential to the conductor 503, the threshold voltage of the transistor 500 can be increased and the off-current can be reduced. Therefore, the drain current when the potential applied to the conductor 560 is 0 V can be reduced by applying a negative potential to the conductor 503 compared to the case where a negative potential is not applied.

[0306] The conductor 503 is disposed so as to overlap the oxide 530 and the conductor 560. In this manner, when a potential is applied to the conductor 560 and the conductor 503, the electric field generated from the conductor 560 and the electric field generated from the conductor 503 are connected, and a channel formation region formed in the oxide 530 can be covered.

[0307] In this specification and the like, a transistor configuration in which a channel formation region is electrically surrounded by the electric field of a pair of gate electrodes (a first gate electrode and a second gate electrode) is called a surrounded channel (S-channel) configuration. The S-channel configuration disclosed in this specification and the like is different from a fin type configuration and a planar type configuration. By adopting the S-channel configuration, it is possible to obtain a transistor that is more resistant to the short channel effect, in other words, in which the short channel effect is less likely to occur.

[0308] The conductor 503 has a structure similar to that of the conductor 518, and the conductor 503a is formed in contact with the inner walls of the openings of the insulator 514 and the insulator 516, and the conductor 503b is formed further inside. Note that, although the transistor 500 shows a structure in which the conductor 503a and the conductor 503b are stacked, the present invention is not limited to this. For example, the conductor 503 may have a single layer structure or a stacked structure of three or more layers.

[0309] Here, the conductor 503a is preferably made of a conductive material having a function of suppressing the diffusion of impurities such as hydrogen atoms, hydrogen molecules, water molecules, and copper atoms (the impurities are less likely to permeate through). Alternatively, it is preferable to use a conductive material having a function of suppressing the diffusion of oxygen (e.g., at least one of oxygen atoms, oxygen molecules, etc.) (the oxygen is less likely to permeate through). Note that in this specification, the function of suppressing the diffusion of impurities or oxygen refers to the function of suppressing the diffusion of any one or all of the impurities and oxygen.

[0310] For example, the conductor 503a has a function of suppressing the diffusion of oxygen, so that the conductor 503b can be prevented from being oxidized and causing a decrease in conductivity.

[0311] In addition, when the conductor 503 also functions as a wiring, it is preferable that the conductor 503b is made of a highly conductive material containing tungsten, copper, or aluminum as a main component. Note that, although the conductor 503 is illustrated in this embodiment as a stack of the conductors 503a and 503b, the conductor 503 may have a single layer structure.

[0312] The insulators 520, 522, and 524 function as a second gate insulating film.

[0313] Here, it is preferable that the insulator 524 in contact with the oxide 530 is an insulator containing more oxygen than the oxygen that satisfies the stoichiometric composition. The oxygen is easily released from the film by heating. In this specification and the like, oxygen released by heating may be called "excess oxygen." In other words, it is preferable that the insulator 524 has a region containing excess oxygen (also called "excess oxygen region"). By providing such an insulator containing excess oxygen in contact with the oxide 530, oxygen vacancies (V O In addition, when hydrogen enters an oxygen vacancy in the oxide 530, the defect (hereinafter, V OH.) may function as a donor and generate electrons as carriers. Some of the hydrogen may bond with oxygen that is bonded to a metal atom to generate electrons as carriers. Therefore, a transistor using an oxide semiconductor containing a large amount of hydrogen is likely to have normally-on characteristics. Furthermore, hydrogen in an oxide semiconductor is easily moved by stress such as heat or an electric field. Therefore, if an oxide semiconductor contains a large amount of hydrogen, the reliability of the transistor may be deteriorated. In one embodiment of the present invention, V in the oxide 530 O It is preferable to reduce H as much as possible and make it high-purity intrinsic or substantially high-purity intrinsic. O In order to obtain an oxide semiconductor in which H is sufficiently reduced, it is important to remove impurities such as moisture and hydrogen from the oxide semiconductor (also called "dehydration" or "dehydrogenation treatment") and to supply oxygen to the oxide semiconductor to compensate for oxygen vacancies (also called "oxygenation treatment"). O By using an oxide semiconductor in which impurities such as H are sufficiently reduced for a channel formation region of a transistor, stable electrical characteristics can be obtained.

[0314] Specifically, it is preferable to use an oxide material from which some oxygen is released by heating as an insulator having an excess oxygen region. An oxide material from which oxygen is released by heating is an oxide material from which the amount of released oxygen converted into oxygen atoms is 1.0×10 18 atoms / cm 3 More than 1.0×10 19 atoms / cm 3 More preferably, 2.0×10 19 atoms / cm 3 or more than 3.0×10 20 atoms / cm 3 The oxide film is one having the above-mentioned properties. The surface temperature of the film during the TDS analysis is preferably in the range of 100° C. or more and 700° C. or less, or 100° C. or more and 400° C. or less.

[0315] In addition, the oxide 530 may be brought into contact with the insulator having the excess oxygen region and subjected to one or more of heat treatment, microwave treatment, and RF treatment. By carrying out such treatment, water or hydrogen in the oxide 530 can be removed. For example, a reaction occurs in the oxide 530 that breaks the bond of VoH, in other words, "V O The reaction "H → Vo + H" occurs, and the hydrogen can be dehydrogenated. Some of the hydrogen generated at this time may combine with oxygen to become H2O and be removed from the oxide 530 or the insulator near the oxide 530. Some of the hydrogen may also be gettered to the conductor 542.

[0316] In addition, the microwave treatment is preferably performed using, for example, a device having a power source that generates high-density plasma or a device having a power source that applies RF to the substrate side. For example, high-density oxygen radicals can be generated by using a gas containing oxygen and high-density plasma, and the oxygen radicals generated by the high-density plasma can be efficiently introduced into the oxide 530 or an insulator near the oxide 530 by applying RF to the substrate side. In addition, the pressure of the microwave treatment may be set to 133 Pa or more, preferably 200 Pa or more, and more preferably 400 Pa or more. In addition, for example, oxygen and argon are used as gases to be introduced into the microwave treatment device, and the oxygen flow rate ratio (O2 / (O2+Ar)) is 50% or less, preferably 10% or more and 30% or less.

[0317] In addition, in a manufacturing process of the transistor 500, it is preferable to perform heat treatment while the surface of the oxide 530 is exposed. The heat treatment may be performed, for example, at a temperature of 100° C. or higher and 450° C. or lower, more preferably 350° C. or higher and 400° C. or lower. Note that the heat treatment is performed in an atmosphere of nitrogen gas or an inert gas, or an atmosphere containing an oxidizing gas at 10 ppm or higher, 1% or higher, or 10% or higher. For example, the heat treatment is preferably performed in an oxygen atmosphere. In this way, oxygen is supplied to the oxide 530 to reduce oxygen deficiencies (V O) can be reduced. The heat treatment may be performed under reduced pressure. Alternatively, the heat treatment may be performed in an atmosphere containing 10 ppm or more, 1% or more, or 10% or more of an oxidizing gas in order to compensate for the desorbed oxygen after the heat treatment in a nitrogen gas or inert gas atmosphere. Alternatively, the heat treatment may be performed in an atmosphere containing 10 ppm or more, 1% or more, or 10% or more of an oxidizing gas in order to compensate for the desorbed oxygen. Alternatively, the heat treatment may be performed in an atmosphere containing 10 ppm or more, 1% or more, or 10% or more of an oxidizing gas in succession to a heat treatment in a nitrogen gas or inert gas atmosphere.

[0318] By subjecting the oxide 530 to oxygen addition treatment, the oxygen vacancies in the oxide 530 can be repaired by the supplied oxygen, in other words, the reaction of "Vo+O→null" can be promoted. Furthermore, the supplied oxygen reacts with the hydrogen remaining in the oxide 530, and the hydrogen can be removed as H2O (dehydrated). As a result, the hydrogen remaining in the oxide 530 recombines with the oxygen vacancies to form V O The formation of H can be suppressed.

[0319] When the insulator 524 has an excess oxygen region, it is preferable that the insulator 522 has a function of suppressing the diffusion of oxygen (eg, oxygen atoms, oxygen molecules, etc.) (the oxygen is less likely to permeate).

[0320] The insulator 522 preferably has a function of suppressing diffusion of oxygen and impurities, so that oxygen contained in the oxide 530 does not diffuse toward the insulator 520. Furthermore, reaction of the conductor 503 with the insulator 524 or oxygen contained in the oxide 530 can be suppressed.

[0321] The insulator 522 is preferably a single layer or a multilayer insulator containing a so-called high-k material, such as aluminum oxide, hafnium oxide, oxide containing aluminum and hafnium (hafnium aluminate), tantalum oxide, zirconium oxide, lead zirconate titanate (PZT), strontium titanate (SrTiO3), or (Ba,Sr)TiO3 (BST). As transistors become smaller and more highly integrated, problems such as leakage current may occur due to the thinning of the gate insulating film. By using a high-k material for the insulator that functions as the gate insulating film, it is possible to reduce the gate potential during transistor operation while maintaining the physical film thickness.

[0322] In particular, it is preferable to use an insulator containing an oxide of one or both of aluminum and hafnium, which are insulating materials having a function of suppressing the diffusion of impurities and oxygen (the oxygen is unlikely to permeate through them). As an insulator containing an oxide of one or both of aluminum and hafnium, it is preferable to use aluminum oxide, hafnium oxide, an oxide containing aluminum and hafnium (hafnium aluminate), or the like. When the insulator 522 is formed using such a material, the insulator 522 functions as a layer that suppresses the release of oxygen from the oxide 530 and the intrusion of impurities such as hydrogen into the oxide 530 from the periphery of the transistor 500.

[0323] Alternatively, for example, aluminum oxide, bismuth oxide, germanium oxide, niobium oxide, silicon oxide, titanium oxide, tungsten oxide, yttrium oxide, or zirconium oxide may be added to these insulators. Alternatively, these insulators may be nitrided. Silicon oxide, silicon oxynitride, or silicon nitride may be stacked on the above insulators.

[0324] In addition, the insulator 520 is preferably thermally stable. For example, silicon oxide and silicon oxynitride are preferable because they are thermally stable. In addition, by combining a high-k material insulator with silicon oxide or silicon oxynitride, it is possible to obtain the insulator 520 having a thermally stable and high dielectric constant laminate structure.

[0325] 21A and 21B, the second gate insulating film has a three-layer stack structure, and includes insulators 520, 522, and 524. However, the second gate insulating film may have a single layer, two layers, or four or more layers. In this case, the second gate insulating film is not limited to a stack structure made of the same material, and may have a stack structure made of different materials.

[0326] In the transistor 500, a metal oxide functioning as an oxide semiconductor is used for the oxide 530 including the channel formation region. For example, a metal oxide such as In-M-Zn oxide (wherein the element M is one or more elements selected from aluminum, gallium, yttrium, copper, vanadium, beryllium, boron, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, or the like) may be used for the oxide 530.

[0327] The metal oxide functioning as an oxide semiconductor may be formed by a sputtering method or an ALD (Atomic Layer Deposition) method. Note that the metal oxide functioning as an oxide semiconductor will be described in detail in another embodiment.

[0328] The metal oxide that functions as a channel formation region in the oxide 530 preferably has a band gap of 2 eV or more, preferably 2.5 eV or more. In this manner, by using a metal oxide with a wide band gap, the off-state current of the transistor can be reduced.

[0329] The oxide 530 has the oxide 530a below the oxide 530b, and thus can suppress the diffusion of impurities from components formed below the oxide 530a to the oxide 530b.

[0330] The oxide 530 preferably has a laminated structure of a plurality of oxide layers having different atomic ratios of metal atoms. Specifically, the atomic ratio of element M among the constituent elements in the metal oxide used for the oxide 530a is preferably larger than the atomic ratio of element M among the constituent elements in the metal oxide used for the oxide 530b. In addition, the atomic ratio of element M to In in the metal oxide used for the oxide 530a is preferably larger than the atomic ratio of element M to In in the metal oxide used for the oxide 530b. In addition, the atomic ratio of In to element M in the metal oxide used for the oxide 530b is preferably larger than the atomic ratio of In to element M in the metal oxide used for the oxide 530a.

[0331] In addition, it is preferable that the energy of the conduction band minimum of the oxide 530a is higher than that of the oxide 530b, or, in other words, it is preferable that the electron affinity of the oxide 530a is smaller than that of the oxide 530b.

[0332] Here, at the junction between the oxide 530a and the oxide 530b, the energy level of the conduction band minimum changes gradually. In other words, it can be said that the energy level of the conduction band minimum at the junction between the oxide 530a and the oxide 530b changes continuously or is a continuous junction. To achieve this, it is preferable to reduce the defect level density of the mixed layer formed at the interface between the oxide 530a and the oxide 530b.

[0333] Specifically, the oxide 530a and the oxide 530b have a common element other than oxygen (as a main component), so that a mixed layer with a low density of defect states can be formed. For example, when the oxide 530b is an In-Ga-Zn oxide, the oxide 530a may be an In-Ga-Zn oxide, a Ga-Zn oxide, or a gallium oxide.

[0334] At this time, the main carrier path is the oxide 530b. By configuring the oxide 530a as described above, the defect state density at the interface between the oxide 530a and the oxide 530b can be reduced. Therefore, the effect of interface scattering on carrier conduction is reduced, and the transistor 500 can obtain a high on-state current.

[0335] Conductors 542a and 542b functioning as a source electrode and a drain electrode are provided on the oxide 530b. As the conductors 542a and 542b, it is preferable to use a metal element selected from aluminum, chromium, copper, silver, gold, platinum, tantalum, nickel, titanium, molybdenum, tungsten, hafnium, vanadium, niobium, manganese, magnesium, zirconium, beryllium, indium, ruthenium, iridium, strontium, and lanthanum, an alloy containing the above-mentioned metal elements as a component, or an alloy combining the above-mentioned metal elements. For example, it is preferable to use tantalum nitride, titanium nitride, tungsten, a nitride containing titanium and aluminum, a nitride containing tantalum and aluminum, ruthenium oxide, ruthenium nitride, an oxide containing strontium and ruthenium, an oxide containing lanthanum and nickel, or the like. In addition, tantalum nitride, titanium nitride, nitrides containing titanium and aluminum, nitrides containing tantalum and aluminum, ruthenium oxide, ruthenium nitride, oxides containing strontium and ruthenium, and oxides containing lanthanum and nickel are conductive materials that are difficult to oxidize, or materials that maintain conductivity even when oxygen is absorbed, and are therefore preferable.Furthermore, metal nitride films such as tantalum nitride are preferable because they have barrier properties against hydrogen or oxygen.

[0336] 21A, the conductor 542a and the conductor 542b are shown as a single layer, but may be a laminated structure of two or more layers. For example, a tantalum nitride film and a tungsten film may be laminated. A titanium film and an aluminum film may be laminated. A two-layer structure in which an aluminum film is laminated on a tungsten film, a two-layer structure in which a copper film is laminated on a copper-magnesium-aluminum alloy film, a two-layer structure in which a copper film is laminated on a titanium film, or a two-layer structure in which a copper film is laminated on a tungsten film may be used.

[0337] In addition, there are three-layer structures in which a titanium film or titanium nitride film is laminated with an aluminum film or copper film on the titanium film or titanium nitride film, and a titanium film or titanium nitride film is further formed thereon, and a three-layer structure in which a molybdenum film or molybdenum nitride film is laminated with an aluminum film or copper film on the molybdenum film or molybdenum nitride film, and a molybdenum film or molybdenum nitride film is further formed thereon, etc. Note that a transparent conductive material containing indium oxide, tin oxide, or zinc oxide may be used.

[0338] 21A, regions 543a and 543b may be formed as low-resistance regions at and near the interface of the oxide 530 with the conductor 542a (conductor 542b). In this case, the region 543a functions as one of the source region and the drain region, and the region 543b functions as the other of the source region and the drain region. A channel formation region is formed in a region sandwiched between the regions 543a and 543b.

[0339] By providing the conductor 542a (conductor 542b) so as to be in contact with the oxide 530, the oxygen concentration in the region 543a (region 543b) may be reduced. Also, a metal compound layer containing a metal contained in the conductor 542a (conductor 542b) and a component of the oxide 530 may be formed in the region 543a (region 543b). In such a case, the carrier density in the region 543a (region 543b) increases, and the region 543a (region 543b) becomes a low-resistance region.

[0340] The insulator 544 is provided to cover the conductor 542a and the conductor 542b and suppresses oxidation of the conductor 542a and the conductor 542b. In this case, the insulator 544 may be provided to cover the side surface of the oxide 530 and to be in contact with the insulator 524.

[0341] The insulator 544 can be a metal oxide containing one or more elements selected from hafnium, aluminum, gallium, yttrium, zirconium, tungsten, titanium, tantalum, nickel, germanium, neodymium, lanthanum, magnesium, etc. Alternatively, the insulator 544 can be silicon nitride oxide, silicon nitride, or the like.

[0342] In particular, it is preferable to use, as the insulator 544, an insulator containing an oxide of either or both of aluminum and hafnium, such as aluminum oxide, hafnium oxide, or an oxide containing aluminum and hafnium (hafnium aluminate). In particular, hafnium aluminate has higher heat resistance than a hafnium oxide film. Therefore, it is preferable because it is less likely to crystallize in a heat treatment in a later process. Note that the insulator 544 is not an essential component when the conductors 542a and 542b are made of a material having oxidation resistance or when the conductivity does not decrease significantly even when oxygen is absorbed. It may be designed appropriately depending on the desired transistor characteristics.

[0343] The insulator 544 can prevent impurities such as water and hydrogen contained in the insulator 580 from diffusing to the oxide 530b through the insulator 545. The insulator 580 can also prevent the conductor 560 from being oxidized by excess oxygen contained in the insulator 580.

[0344] The insulator 545 functions as a first gate insulating film. Like the insulator 524 described above, the insulator 545 is preferably formed using an insulator that contains excess oxygen and releases oxygen by heating.

[0345] Specifically, silicon oxide having excess oxygen, silicon oxynitride, silicon nitride oxide, silicon nitride, silicon oxide to which fluorine is added, silicon oxide to which carbon is added, silicon oxide to which carbon and nitrogen are added, and silicon oxide having vacancies can be used. In particular, silicon oxide and silicon oxynitride are preferable because they are stable against heat.

[0346] By providing an insulator containing excess oxygen as the insulator 545, oxygen can be effectively supplied from the insulator 545 to a channel formation region of the oxide 530b. Similarly to the insulator 524, the concentration of impurities such as water or hydrogen in the insulator 545 is preferably reduced. The thickness of the insulator 545 is preferably 1 nm or more and 20 nm or less.

[0347] Furthermore, in order to efficiently supply excess oxygen contained in the insulator 545 to the oxide 530, a metal oxide may be provided between the insulator 545 and the conductor 560. The metal oxide preferably suppresses oxygen diffusion from the insulator 545 to the conductor 560. By providing a metal oxide that suppresses oxygen diffusion, the diffusion of excess oxygen from the insulator 545 to the conductor 560 can be suppressed. That is, a decrease in the amount of excess oxygen supplied to the oxide 530 can be suppressed. Furthermore, oxidation of the conductor 560 due to the excess oxygen can be suppressed. As the metal oxide, a material that can be used for the insulator 544 can be used.

[0348] The insulator 545 may have a layered structure, similar to the second gate insulating film. As transistors become smaller and more highly integrated, problems such as leakage current may occur due to the thinning of the gate insulating film. Therefore, by making the insulator that functions as the gate insulating film have a layered structure of a high-k material and a thermally stable material, it is possible to reduce the gate potential during transistor operation while maintaining the physical film thickness. In addition, a layered structure that is thermally stable and has a high relative dielectric constant can be obtained.

[0349] Although the conductor 560 functioning as the first gate electrode is shown as having a two-layer structure in FIGS. 21A and 21B, it may have a single-layer structure or a laminated structure of three or more layers.

[0350] The conductor 560a is preferably made of a conductive material having a function of suppressing the diffusion of impurities such as hydrogen atoms, hydrogen molecules, water molecules, nitrogen atoms, nitrogen molecules, nitrogen oxide molecules (N2O, NO, NO2, etc.), and copper atoms. Alternatively, it is preferably made of a conductive material having a function of suppressing the diffusion of oxygen (for example, at least one of oxygen atoms, oxygen molecules, etc.). The conductor 560a has a function of suppressing the diffusion of oxygen, so that it is possible to suppress the conductor 560b from being oxidized by the oxygen contained in the insulator 545 and its conductivity from decreasing. As a conductive material having a function of suppressing the diffusion of oxygen, for example, tantalum, tantalum nitride, ruthenium, or ruthenium oxide is preferably used. In addition, an oxide semiconductor applicable to the oxide 530 can be used as the conductor 560a. In that case, the conductor 560b can be formed by a sputtering method to reduce the electrical resistance value of the conductor 560a and make it a conductor. This can be called an OC (Oxide Conductor) electrode.

[0351] The conductor 560b is preferably made of a conductive material containing tungsten, copper, or aluminum as a main component. The conductor 560b also functions as wiring, so it is preferable to use a conductor with high conductivity. For example, a conductive material containing tungsten, copper, or aluminum as a main component can be used. The conductor 560b may have a layered structure, for example, a layered structure of titanium or titanium nitride and the above conductive material.

[0352] The insulator 580 is provided on the conductor 542a and the conductor 542b via the insulator 544. The insulator 580 preferably has an excess oxygen region. For example, the insulator 580 preferably has silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, silicon oxide to which fluorine has been added, silicon oxide to which carbon has been added, silicon oxide to which carbon and nitrogen have been added, silicon oxide having voids, or a resin. In particular, silicon oxide and silicon oxynitride are preferable because they are thermally stable. In particular, silicon oxide and silicon oxide having voids are preferable because they can easily form an excess oxygen region in a later step.

[0353] The insulator 580 preferably has an excess oxygen region. By providing the insulator 580 from which oxygen is released by heating, oxygen in the insulator 580 can be efficiently supplied to the oxide 530. Note that the concentration of impurities such as water or hydrogen in the insulator 580 is preferably reduced.

[0354] The opening of insulator 580 is formed to overlap the region between conductor 542a and conductor 542b, so that conductor 560 is formed so as to be embedded in the opening of insulator 580 and the region sandwiched between conductor 542a and conductor 542b.

[0355] In miniaturizing a semiconductor device, it is necessary to shorten the gate length, but it is also necessary to prevent the conductivity of the conductor 560 from decreasing. If the film thickness of the conductor 560 is increased for that purpose, the conductor 560 may have a shape with a high aspect ratio. In this embodiment, the conductor 560 is provided so as to be embedded in the opening of the insulator 580, so that even if the conductor 560 has a shape with a high aspect ratio, the conductor 560 can be formed without collapsing during the process.

[0356] The insulator 574 is preferably provided in contact with a top surface of the insulator 580, a top surface of the conductor 560, and a top surface of the insulator 545. By forming the insulator 574 by a sputtering method, an excess oxygen region can be provided in the insulator 545 and the insulator 580. This allows oxygen to be supplied from the excess oxygen region into the oxide 530.

[0357] For example, the insulator 574 can be a metal oxide containing one or more elements selected from hafnium, aluminum, gallium, yttrium, zirconium, tungsten, titanium, tantalum, nickel, germanium, magnesium, and the like.

[0358] In particular, aluminum oxide has high barrier properties and can suppress the diffusion of hydrogen and nitrogen even in a thin film with a thickness of 0.5 nm to 3.0 nm. Therefore, aluminum oxide formed by sputtering can function as a barrier film against impurities such as hydrogen as well as an oxygen source.

[0359] An insulator 581 functioning as an interlayer film is preferably provided over the insulator 574. Like the insulator 524, the insulator 581 preferably has a reduced concentration of impurities such as water or hydrogen.

[0360] Conductor 540a and conductor 540b are arranged in openings formed in insulator 581, insulator 574, insulator 580, and insulator 544. Conductor 540a and conductor 540b are provided facing each other with conductor 560 interposed therebetween. Conductor 540a and conductor 540b have the same configuration as conductor 546 and conductor 548, which will be described later.

[0361] An insulator 582 is provided over the insulator 581. The insulator 582 is preferably made of a substance that has a barrier property against oxygen and hydrogen. Therefore, the insulator 582 can be made of a material similar to that of the insulator 514. For example, the insulator 582 is preferably made of a metal oxide such as aluminum oxide, hafnium oxide, or tantalum oxide.

[0362] In particular, aluminum oxide has a high blocking effect of preventing the film from permeating both oxygen and impurities such as hydrogen and moisture, which are factors that cause fluctuations in the electrical characteristics of a transistor. Therefore, aluminum oxide can prevent impurities such as hydrogen and moisture from entering the transistor 500 during and after the transistor manufacturing process. In addition, aluminum oxide can suppress the release of oxygen from the oxide that constitutes the transistor 500. Therefore, aluminum oxide is suitable for use as a protective film for the transistor 500.

[0363] An insulator 586 is provided over the insulator 582. The insulator 586 can be formed using a material similar to that of the insulator 320. By using a material with a relatively low dielectric constant for these insulators, parasitic capacitance between wirings can be reduced. For example, a silicon oxide film, a silicon oxynitride film, or the like can be used as the insulator 586.

[0364] In addition, conductors 546, 548, etc. are embedded in insulators 520, 522, 524, 544, 580, 574, 581, 582, and 586.

[0365] The conductor 546 and the conductor 548 function as a plug or wiring that connects to the capacitor 600, the transistor 500, or the transistor 550. The conductor 546 and the conductor 548 can be formed using a material similar to that of the conductor 328 and the conductor 330.

[0366] After the transistor 500 is formed, an opening may be formed to surround the transistor 500, and an insulator having a high barrier property against hydrogen or water may be formed to cover the opening. By surrounding the transistor 500 with the insulator having a high barrier property, it is possible to prevent moisture and hydrogen from entering from the outside. Alternatively, a plurality of transistors 500 may be collectively surrounded by an insulator having a high barrier property against hydrogen or water. When an opening is formed to surround the transistor 500, for example, an opening reaching the insulator 522 or the insulator 514 is formed, and the insulator having a high barrier property is formed in contact with the insulator 522 or the insulator 514, which is preferable because it serves as part of the manufacturing process of the transistor 500. Note that the insulator having a high barrier property against hydrogen or water may be made of a material similar to that of the insulator 522 or the insulator 514, for example.

[0367] Subsequently, a capacitor 600 is provided above the transistor 500. The capacitor 600 has a conductor 610, a conductor 620, and an insulator 630.

[0368] A conductor 612 may be provided over the conductor 546 and the conductor 548. The conductor 612 functions as a plug or a wiring connected to the transistor 500. The conductor 610 functions as an electrode of the capacitor 600. Note that the conductor 612 and the conductor 610 can be formed at the same time.

[0369] A metal film containing an element selected from molybdenum, titanium, tantalum, tungsten, aluminum, copper, chromium, neodymium, and scandium, or a metal nitride film containing the above-mentioned element (tantalum nitride film, titanium nitride film, molybdenum nitride film, tungsten nitride film), etc. can be used for the conductor 612 and the conductor 610. Alternatively, a conductive material such as indium tin oxide, indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, indium zinc oxide, or indium tin oxide with added silicon oxide can also be used.

[0370] In this embodiment, the conductor 612 and the conductor 610 have a single-layer structure, but the present invention is not limited to this structure and may have a stacked structure of two or more layers. For example, a conductor having a barrier property and a conductor having high adhesion to the conductor having high conductivity may be formed between a conductor having a barrier property and a conductor having high conductivity.

[0371] The conductor 620 is provided so as to overlap with the conductor 610 with the insulator 630 interposed therebetween. Note that the conductor 620 can be made of a conductive material such as a metal material, an alloy material, or a metal oxide material. It is preferable to use a high melting point material such as tungsten or molybdenum that has both heat resistance and conductivity, and it is particularly preferable to use tungsten. When the conductor 620 is formed simultaneously with other components such as a conductor, a low resistance metal material such as Cu (copper) or Al (aluminum) may be used.

[0372] An insulator 640 is provided over the conductor 620 and the insulator 630. The insulator 640 can be provided using a material similar to that of the insulator 320. The insulator 640 may also function as a planarizing film that covers the uneven shape underneath.

[0373] With this structure, miniaturization or high integration can be achieved in a semiconductor device including a transistor including an oxide semiconductor.

[0374] Examples of the substrate that can be used in the semiconductor device according to one embodiment of the present invention include a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate (e.g., a stainless steel substrate, a substrate having stainless steel foil, a tungsten substrate, a substrate having tungsten foil, etc.), a semiconductor substrate (e.g., a single crystal semiconductor substrate, a polycrystalline semiconductor substrate, a compound semiconductor substrate, etc.), and an SOI (Silicon on Insulator) substrate. A plastic substrate having heat resistance that can withstand the processing temperature of this embodiment may also be used. Examples of the glass substrate include barium borosilicate glass, aluminosilicate glass, aluminoborosilicate glass, and soda-lime glass. In addition, crystallized glass and the like can be used.

[0375] Alternatively, a flexible substrate, a laminated film, a paper containing a fibrous material, or a base film can be used as the substrate. Examples of flexible substrates, laminated films, base films, etc. include the following. For example, there are plastics such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), and polytetrafluoroethylene (PTFE). Alternatively, there are synthetic resins such as acrylic. Alternatively, there are polypropylene, polyester, polyvinyl fluoride, and polyvinyl chloride. Alternatively, there are polyamide, polyimide, aramid resin, epoxy resin, inorganic deposition film, and paper. In particular, by manufacturing transistors using a semiconductor substrate, a single crystal substrate, or an SOI substrate, etc., it is possible to manufacture transistors with small variations in characteristics, size, or shape, high current capacity, and small size. When a circuit is constructed using such transistors, it is possible to reduce the power consumption of the circuit or to increase the integration of the circuit.

[0376] Alternatively, a flexible substrate may be used as the substrate, and transistors, resistors, and / or capacitors may be formed directly on the flexible substrate. Alternatively, a peeling layer may be provided between the substrate and the transistors, resistors, and / or capacitors. The peeling layer can be used to separate a semiconductor device from the substrate after a part or whole of the semiconductor device is completed thereon, and transfer the semiconductor device to another substrate. In this case, the transistors, resistors, and / or capacitors can be transferred to a substrate having poor heat resistance or a flexible substrate. For the peeling layer, for example, a laminated structure of inorganic films of a tungsten film and a silicon oxide film, a structure in which an organic resin film such as polyimide is formed on a substrate, a silicon film containing hydrogen, or the like can be used.

[0377] That is, the semiconductor device may be formed on a certain substrate, and then the semiconductor device may be transferred to another substrate. Examples of substrates onto which the semiconductor device may be transferred include substrates on which the above-mentioned transistors can be formed, as well as paper substrates, cellophane substrates, aramid film substrates, polyimide film substrates, stone substrates, wood substrates, cloth substrates (including natural fibers (silk, cotton, hemp), synthetic fibers (nylon, polyurethane, polyester), or regenerated fibers (acetate, cupra, rayon, regenerated polyester), etc.), leather substrates, or rubber substrates. By using these substrates, it is possible to manufacture semiconductor devices that are flexible, that are not easily broken, that have heat resistance, and that are lightweight or thin.

[0378] By providing a semiconductor device over a flexible substrate, an increase in weight can be suppressed and a semiconductor device that is less likely to be damaged can be provided.

[0379] <Transistor modification 1> A transistor 500A shown in FIGS. 22A, 22B, and 22C is a modified example of the transistor 500 having the structure shown in FIGS. 21A and 21B. FIG. 22A is a top view of the transistor 500A, FIG. 22B is a cross-sectional view of the transistor 500A in the channel length direction, and FIG. 22C is a cross-sectional view of the transistor 500A in the channel width direction. Note that some elements are omitted in the top view of FIG. 22A for clarity. The structures shown in FIGS. 22A, 22B, and 22C can also be applied to other transistors included in the semiconductor device of one embodiment of the present invention, such as the transistor 550.

[0380] 22A, 22B, and 22C differs from transistor 500 shown in FIGS. 21A and 21B in that transistor 500A includes insulator 552, insulator 513, and insulator 404. Transistor 500A also differs from transistor 500 shown in FIGS. 21A and 21B in that insulator 552 is provided in contact with a side surface of conductor 540a and insulator 552 is provided in contact with a side surface of conductor 540b. Transistor 500A also differs from transistor 500 shown in FIGS. 21A and 21B in that insulator 520 is not provided.

[0381] 22A, 22B, and 22C, an insulator 513 is provided over an insulator 512. Furthermore, an insulator 404 is provided over the insulator 574 and the insulator 513.

[0382] 22A, 22B, and 22C, the insulator 514, the insulator 516, the insulator 522, the insulator 524, the insulator 544, the insulator 580, and the insulator 574 are patterned, and the insulator 404 covers them. That is, the insulator 404 contacts the top surface of the insulator 574, the side surface of the insulator 574, the side surface of the insulator 580, the side surface of the insulator 544, the side surface of the insulator 524, the side surface of the insulator 522, the side surface of the insulator 516, the side surface of the insulator 514, and the top surface of the insulator 513. As a result, the oxide 530 and the like are isolated from the outside by the insulator 404 and the insulator 513.

[0383] The insulator 513 and the insulator 404 preferably have a high function of suppressing diffusion of hydrogen (for example, at least one of hydrogen atoms, hydrogen molecules, and the like) or water molecules. For example, the insulator 513 and the insulator 404 are preferably made of silicon nitride or silicon nitride oxide, which are materials with high hydrogen barrier properties. This can suppress diffusion of hydrogen and the like into the oxide 530, thereby suppressing deterioration in the characteristics of the transistor 500A. Therefore, the reliability of the semiconductor device of one embodiment of the present invention can be improved.

[0384] The insulator 552 is provided in contact with the insulator 581, the insulator 404, the insulator 574, the insulator 580, and the insulator 544. The insulator 552 preferably has a function of suppressing diffusion of hydrogen or water molecules. For example, the insulator 552 is preferably made of an insulator having a high hydrogen barrier property, such as silicon nitride, aluminum oxide, or silicon nitride oxide. In particular, silicon nitride is preferably used as the insulator 552 because it has a high hydrogen barrier property. By using a material having a high hydrogen barrier property as the insulator 552, impurities such as water or hydrogen can be suppressed from diffusing from the insulator 580 or the like to the oxide 530 through the conductor 540a and the conductor 540b. Furthermore, oxygen contained in the insulator 580 can be suppressed from being absorbed by the conductor 540a and the conductor 540b. As described above, the reliability of the semiconductor device of one embodiment of the present invention can be improved.

[0385] <Transistor modification 2> A configuration example of a transistor 500B will be described with reference to Figures 23A, 23B, and 23C. Figure 23A is a top view of the transistor 500B. Figure 23B is a cross-sectional view of the L1-L2 portion shown by the dashed line in Figure 23A. Figure 23C is a cross-sectional view of the W1-W2 portion shown by the dashed line in Figure 23A. Note that in the top view of Figure 23A, some elements are omitted for clarity.

[0386] The transistor 500B is a modified example of the transistor 500 and can be substituted for the transistor 500. Therefore, in order to avoid repetition of the description, the following description will mainly focus on the differences between the transistor 500B and the transistor 500.

[0387] The conductor 560 functioning as the first gate electrode has a conductor 560a and a conductor 560b on the conductor 560a. The conductor 560a is preferably made of a conductive material having a function of suppressing the diffusion of impurities such as hydrogen atoms, hydrogen molecules, water molecules, and copper atoms. Alternatively, it is preferably made of a conductive material having a function of suppressing the diffusion of oxygen (e.g., at least one of oxygen atoms, oxygen molecules, and the like).

[0388] The conductor 560a has a function of suppressing oxygen diffusion, which improves the material selectivity of the conductor 560b. In other words, the presence of the conductor 560a suppresses oxidation of the conductor 560b, thereby preventing a decrease in electrical conductivity.

[0389] It is preferable to provide an insulator 544 so as to cover the top surface and side surfaces of the conductor 560 and the side surfaces of the insulator 545. Note that the insulator 544 may be made of an insulating material having a function of suppressing the diffusion of impurities such as water or hydrogen, and oxygen. For example, it is preferable to use aluminum oxide or hafnium oxide. In addition, for example, metal oxides such as magnesium oxide, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, or tantalum oxide, silicon nitride oxide, or silicon nitride may also be used.

[0390] Providing the insulator 544 can suppress oxidation of the conductor 560. Furthermore, providing the insulator 544 can suppress diffusion of impurities such as water and hydrogen contained in the insulator 580 to the transistor 500B.

[0391] In the transistor 500B, the conductor 560 overlaps with part of the conductor 542a and part of the conductor 542b, and thus the parasitic capacitance of the transistor 500B is likely to be larger than that of the transistor 500. Thus, the operating frequency of the transistor 500B tends to be lower than that of the transistor 500. However, the productivity of the transistor 500B is higher than that of the transistor 500 because a step of forming an opening in the insulator 580 or the like and filling the conductor 560 and the insulator 545 is not required.

[0392] The configurations, structures, methods, and the like described in this embodiment can be used in appropriate combination with the configurations, structures, methods, and the like described in other embodiment modes and examples.

[0393] (Embodiment 6) In this embodiment, an oxide semiconductor, which is a type of metal oxide, will be described.

[0394] The metal oxide preferably contains at least indium or zinc. In particular, it is preferable that the metal oxide contains indium and zinc. In addition to these, it is preferable that the metal oxide contains aluminum, gallium, yttrium, tin, etc. In addition, it may contain one or more elements selected from boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, cobalt, etc.

[0395] <Classification of crystal structures> First, classification of crystal structures in oxide semiconductors will be described with reference to Fig. 24A. Fig. 24A is a diagram for explaining classification of crystal structures of oxide semiconductors, typically IGZO (metal oxide containing In, Ga, and Zn).

[0396] As shown in FIG. 24A, oxide semiconductors are broadly classified into "Amorphous", "Crystalline", and "Crystal". "Amorphous" includes completely amorphous. "Crystalline" includes c-axis-aligned crystalline (CAAC), nanocrystalline (nc), and cloud-aligned composite (CAC). "Crystalline" excludes single crystal, poly crystal, and completely amorphous. "Crystalline" includes single crystal and poly crystal.

[0397] The structure in the bold frame shown in Fig. 24A is an intermediate state between "Amorphous" and "Crystal" and belongs to a new boundary region (New crystalline phase). In other words, this structure is completely different from the energetically unstable "Amorphous" and "Crystal".

[0398] The crystal structure of the film or substrate can be evaluated using an X-ray diffraction (XRD) spectrum. FIG. 24B shows an XRD spectrum obtained by GIXD (Grazing-Incidence XRD) measurement of the CAAC-IGZO film classified as "Crystalline". The GIXD method is also called the thin film method or the Seemann-Bohlin method. Hereinafter, the XRD spectrum obtained by the GIXD measurement shown in FIG. 24B will be simply referred to as the XRD spectrum. The composition of the CAAC-IGZO film shown in FIG. 24B is in the vicinity of In:Ga:Zn=4:2:3 [atomic ratio]. The thickness of the CAAC-IGZO film shown in FIG. 24B is 500 nm.

[0399] As shown in Figure 24B, a clear peak indicating crystallinity is detected in the XRD spectrum of the CAAC-IGZO film. Specifically, a peak indicating c-axis orientation is detected near 2θ=31° in the XRD spectrum of the CAAC-IGZO film. Note that, as shown in Figure 24B, the peak near 2θ=31° is asymmetric with respect to the angle at which the peak intensity is detected.

[0400] The crystal structure of the film or substrate can be evaluated by a diffraction pattern (also called a nanobeam electron diffraction pattern) observed by nanobeam electron diffraction (NBED). The diffraction pattern of the CAAC-IGZO film is shown in FIG. 24C. FIG. 24C is a diffraction pattern observed by NBED, which causes an electron beam to be incident parallel to the substrate. The composition of the CAAC-IGZO film shown in FIG. 24C is approximately In:Ga:Zn=4:2:3 [atomic ratio]. In the nanobeam electron diffraction method, electron diffraction is performed with a probe diameter of 1 nm.

[0401] As shown in FIG. 24C, multiple spots indicating c-axis orientation are observed in the diffraction pattern of the CAAC-IGZO film.

[0402] <<Structure of oxide semiconductor>> In addition, when focusing on the crystal structure, oxide semiconductors may be classified differently from that shown in FIG. 24A. For example, oxide semiconductors are divided into single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors. Examples of non-single-crystal oxide semiconductors include the above-mentioned CAAC-OS and nc-OS. In addition, non-single-crystal oxide semiconductors include polycrystalline oxide semiconductors, amorphous-like oxide semiconductors (a-like OS), amorphous oxide semiconductors, and the like.

[0403] Here, the above-mentioned CAAC-OS, nc-OS, and a-like OS will be described in detail.

[0404] [CAAC-OS] CAAC-OS is an oxide semiconductor having a plurality of crystalline regions, each of which has a c-axis aligned in a specific direction. The specific direction is the thickness direction of the CAAC-OS film, the normal direction of the surface on which the CAAC-OS film is formed, or the normal direction of the surface of the CAAC-OS film. The crystalline region is a region having periodic atomic arrangement. If the atomic arrangement is considered as a lattice arrangement, the crystalline region is also a region with a uniform lattice arrangement. CAAC-OS has a region in which a plurality of crystalline regions are connected in the ab-plane direction, and the region may have distortion. The distortion refers to a portion in which the direction of the lattice arrangement changes between a region with a uniform lattice arrangement and another region with a uniform lattice arrangement in the region in which the plurality of crystalline regions are connected. In other words, CAAC-OS is an oxide semiconductor having a c-axis aligned and no clear orientation in the ab-plane direction.

[0405] Each of the multiple crystalline regions is composed of one or more minute crystals (crystals with a maximum diameter of less than 10 nm). When a crystalline region is composed of one minute crystal, the maximum diameter of the crystalline region is less than 10 nm. When a crystalline region is composed of many minute crystals, the size of the crystalline region may be about several tens of nm.

[0406] In addition, in an In-M-Zn oxide (wherein element M is one or more elements selected from aluminum, gallium, yttrium, tin, titanium, etc.), the CAAC-OS tends to have a layered crystal structure (also referred to as a layered structure) in which a layer containing indium (In) and oxygen (hereinafter, In layer) and a layer containing element M, zinc (Zn), and oxygen (hereinafter, (M, Zn) layer) are stacked. Note that indium and element M are mutually substituted. Thus, the (M, Zn) layer may contain indium. Also, the In layer may contain element M. Note that the In layer may contain Zn. The layered structure is observed as a lattice image in a high-resolution TEM image, for example.

[0407] When the CAAC-OS film is subjected to structural analysis using, for example, an XRD device, a peak indicating c-axis orientation is detected at or near 2θ=31° in out-of-plane XRD measurement using θ / 2θ scan. Note that the position of the peak indicating c-axis orientation (2θ value) may vary depending on the type and composition of the metal elements constituting the CAAC-OS.

[0408] For example, a plurality of bright points (spots) are observed in the electron diffraction pattern of the CAAC-OS film, and the two spots are observed at positions symmetrical to each other with respect to the spot of the incident electron beam that has passed through the sample (also called the direct spot).

[0409] When the crystal region is observed from the specific direction, the lattice arrangement in the crystal region is based on a hexagonal lattice, but the unit cell is not necessarily a regular hexagon and may be a non-regular hexagon. The above distortion may have a pentagonal or heptagonal lattice arrangement. In addition, no clear grain boundary can be confirmed in the CAAC-OS even in the vicinity of the distortion. That is, it is found that the formation of grain boundaries is suppressed by the distortion of the lattice arrangement. This is considered to be because the CAAC-OS can tolerate distortion due to the fact that the arrangement of oxygen atoms is not dense in the ab-plane direction and the bond distance between atoms changes due to the substitution of metal atoms.

[0410] A crystal structure in which clear grain boundaries are observed is called a polycrystal. The grain boundaries are likely to become recombination centers and capture carriers, causing a decrease in the on-current of a transistor and a decrease in field effect mobility. Therefore, CAAC-OS in which clear grain boundaries are not observed is one of the crystalline oxides having a crystal structure suitable for a semiconductor layer of a transistor. In order to form a CAAC-OS, a structure containing Zn is preferable. For example, In-Zn oxide and In-Ga-Zn oxide are suitable because they can suppress the occurrence of grain boundaries more than In oxide.

[0411] The CAAC-OS is an oxide semiconductor with high crystallinity and no clear crystal grain boundaries. Therefore, it can be said that the CAAC-OS is less susceptible to a decrease in electron mobility due to crystal grain boundaries. In addition, since the crystallinity of an oxide semiconductor can be decreased by the inclusion of impurities or the generation of defects, the CAAC-OS can be said to be an oxide semiconductor with few impurities and defects (such as oxygen vacancies). Therefore, the physical properties of an oxide semiconductor having the CAAC-OS are stable. Therefore, an oxide semiconductor having the CAAC-OS is resistant to heat and has high reliability. In addition, the CAAC-OS is stable against high temperatures (so-called thermal budget) in the manufacturing process. Therefore, the use of the CAAC-OS in an OS transistor can increase the degree of freedom in the manufacturing process.

[0412] [nc-OS] The nc-OS has periodic atomic arrangement in a minute region (for example, a region of 1 nm to 10 nm, particularly a region of 1 nm to 3 nm). In other words, the nc-OS has minute crystals. Note that the size of the minute crystals is, for example, 1 nm to 10 nm, particularly 1 nm to 3 nm, and therefore the minute crystals are also called nanocrystals. In addition, the nc-OS does not show regularity in the crystal orientation between different nanocrystals. Therefore, no orientation is seen in the entire film. Therefore, depending on the analysis method, the nc-OS may be indistinguishable from an a-like OS or an amorphous oxide semiconductor. For example, when a structure analysis is performed on an nc-OS film using an XRD device, no peak indicating crystallinity is detected in out-of-plane XRD measurement using θ / 2θ scan. In addition, when an nc-OS film is subjected to electron diffraction (also called selected area electron diffraction) using an electron beam with a probe diameter larger than that of nanocrystals (for example, 50 nm or more), a diffraction pattern like a halo pattern is observed. On the other hand, when electron diffraction (also called nanobeam electron diffraction) is performed on an nc-OS film using an electron beam with a probe diameter (e.g., 1 nm to 30 nm) that is close to the size of a nanocrystal or smaller than the nanocrystal, an electron diffraction pattern in which multiple spots are observed within a ring-shaped region centered on the direct spot may be obtained.

[0413] [a-like OS] The a-like OS is an oxide semiconductor having a structure between the nc-OS and an amorphous oxide semiconductor. The a-like OS has a void or low-density region. That is, the a-like OS has lower crystallinity than the nc-OS and CAAC-OS. Moreover, the a-like OS has a higher hydrogen concentration in the film than the nc-OS and CAAC-OS.

[0414] <<Oxide semiconductor structure>> Next, the above-mentioned CAC-OS will be described in detail, with reference to its material composition.

[0415] [CAC-OS] CAC-OS is, for example, a material configuration in which elements constituting a metal oxide are unevenly distributed in a size range of 0.5 nm to 10 nm, preferably 1 nm to 3 nm, or in the vicinity thereof. In the following, a state in which one or more metal elements are unevenly distributed in a metal oxide and the regions having the metal elements are mixed in a size range of 0.5 nm to 10 nm, preferably 1 nm to 3 nm, or in the vicinity thereof, is also referred to as a mosaic or patch state.

[0416] Furthermore, CAC-OS is a composite metal oxide in which the material is separated into a first region and a second region, forming a mosaic structure, and the first region is distributed throughout the film (hereinafter, also referred to as a cloud structure). In other words, CAC-OS is a composite metal oxide in which the first region and the second region are mixed together.

[0417] Here, the atomic ratios of In, Ga, and Zn to the metal elements constituting the CAC-OS in the In-Ga-Zn oxide are represented as [In], [Ga], and [Zn], respectively. For example, in the CAC-OS in the In-Ga-Zn oxide, the first region is a region where [In] is larger than [In] in the composition of the CAC-OS film. Also, the second region is a region where [Ga] is larger than [Ga] in the composition of the CAC-OS film. Alternatively, for example, the first region is a region where [In] is larger than [In] in the second region and [Ga] is smaller than [Ga] in the second region. Also, the second region is a region where [Ga] is larger than [Ga] in the first region and [In] is smaller than [In] in the first region.

[0418] Specifically, the first region is a region mainly composed of indium oxide, indium zinc oxide, etc., and the second region is a region mainly composed of gallium oxide, gallium zinc oxide, etc. In other words, the first region can be rephrased as a region mainly composed of In, and the second region can be rephrased as a region mainly composed of Ga.

[0419] In addition, there are cases where a clear boundary between the first region and the second region cannot be observed.

[0420] For example, in the case of a CAC-OS of an In-Ga-Zn oxide, EDX mapping obtained using EDX (Energy Dispersive X-ray spectroscopy) has confirmed that the CAC-OS has a structure in which a region mainly composed of In (first region) and a region mainly composed of Ga (second region) are unevenly distributed and mixed.

[0421] When CAC-OS is used in a transistor, the conductivity due to the first region and the insulating property due to the second region act in a complementary manner, giving the CAC-OS a switching function (On / Off function). In other words, CAC-OS has a conductive function in part of the material and an insulating function in other parts of the material, and the material as a whole functions as a semiconductor. By separating the conductive function from the insulating function, it is possible to maximize both functions. Therefore, by using CAC-OS in a transistor, it is possible to achieve a high on-current (I on ), high field effect mobility (μ), and good switching behavior can be achieved.

[0422] Oxide semiconductors have a variety of structures and have different characteristics. The oxide semiconductor of one embodiment of the present invention may include two or more of an amorphous oxide semiconductor, a polycrystalline oxide semiconductor, an a-like OS, a CAC-OS, an nc-OS, and a CAAC-OS.

[0423] <Transistor Having Oxide Semiconductor> Next, the case where the oxide semiconductor is used for a transistor will be described.

[0424] By using the oxide semiconductor for a transistor, a transistor with high field-effect mobility and high reliability can be realized.

[0425] For the transistor, an oxide semiconductor having a low carrier concentration is preferably used. For example, the carrier concentration of the oxide semiconductor is 1×10 17 cm -3 Less than or equal to 1×10 15 cm -3 Less than 1×10, more preferably 13 cm -3 Less than or equal to 1×10 11 cm -3 Less than 1×10, more preferably 10 cm -3 Less than 1 x 10 -9 cm-3 The above is the case. Note that in order to reduce the carrier concentration of an oxide semiconductor film, the impurity concentration in the oxide semiconductor film may be reduced to reduce the density of defect states. In this specification and the like, an oxide semiconductor having a low impurity concentration and a low density of defect states is referred to as a high-purity intrinsic or substantially high-purity intrinsic oxide semiconductor. Note that an oxide semiconductor having a low carrier concentration may be referred to as a high-purity intrinsic or substantially high-purity intrinsic oxide semiconductor.

[0426] Furthermore, a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has a low density of defect states, and therefore the density of trap states might also be low.

[0427] In addition, charges trapped in the trap states of an oxide semiconductor take a long time to disappear and may behave as if they are fixed charges. Therefore, a transistor in which a channel formation region is formed in an oxide semiconductor with a high density of trap states may have unstable electrical characteristics.

[0428] Therefore, in order to stabilize the electrical characteristics of a transistor, it is effective to reduce the impurity concentration in the oxide semiconductor. In order to reduce the impurity concentration in the oxide semiconductor, it is preferable to also reduce the impurity concentration in a nearby film. Examples of impurities include hydrogen, nitrogen, alkali metals, alkaline earth metals, iron, nickel, silicon, and the like.

[0429] <Impurities> Here, the influence of each impurity in an oxide semiconductor will be described.

[0430] When an oxide semiconductor contains silicon or carbon, which is one of the group 14 elements, defect levels are formed in the oxide semiconductor. For this reason, the concentrations of silicon or carbon in the oxide semiconductor and those near the interface with the oxide semiconductor (concentrations obtained by secondary ion mass spectrometry (SIMS)) are calculated as 2×10 18 atoms / cm 3 Less than or equal to 2 x 10 17atoms / cm 3 The following applies.

[0431] In addition, when an oxide semiconductor contains an alkali metal or an alkaline earth metal, defect states may be formed and carriers may be generated. Therefore, a transistor using an oxide semiconductor containing an alkali metal or an alkaline earth metal is likely to have normally-on characteristics. For this reason, when the concentration of an alkali metal or an alkaline earth metal in an oxide semiconductor obtained by SIMS is 1×10 18 atoms / cm 3 Less than or equal to 2 x 10 16 atoms / cm 3 To the following:

[0432] Furthermore, when nitrogen is contained in an oxide semiconductor, electrons serving as carriers are generated, the carrier concentration increases, and the semiconductor is likely to become n-type. As a result, a transistor using an oxide semiconductor containing nitrogen as a semiconductor is likely to have normally-on characteristics. Alternatively, when nitrogen is contained in an oxide semiconductor, trap states may be formed. As a result, the electrical characteristics of the transistor may become unstable. For this reason, the nitrogen concentration in an oxide semiconductor obtained by SIMS is set to 5×10 19 atoms / cm 3 Less than 5 x 10 18 atoms / cm 3 Less than or equal to 1×10 18 atoms / cm 3 Less than 5×10, more preferably 17 atoms / cm 3 To the following:

[0433] Furthermore, hydrogen contained in an oxide semiconductor reacts with oxygen bonded to a metal atom to form water, which may form an oxygen vacancy. When hydrogen enters the oxygen vacancy, electrons serving as carriers may be generated. In addition, some of the hydrogen may bond with oxygen bonded to a metal atom to generate electrons serving as carriers. Therefore, a transistor using an oxide semiconductor containing hydrogen is likely to have normally-on characteristics. For this reason, it is preferable to reduce hydrogen in the oxide semiconductor as much as possible. Specifically, when the hydrogen concentration in an oxide semiconductor measured by SIMS is 1×10 20 atoms / cm 3 Less than 1 x 10 19 atoms / cm 3 less than 5×10 18 atoms / cm 3 less than 1×10 18 atoms / cm 3 Make it less than.

[0434] When an oxide semiconductor in which impurities are sufficiently reduced is used for a channel formation region of a transistor, stable electrical characteristics can be obtained.

[0435] The configurations, structures, methods, and the like described in this embodiment can be used in appropriate combination with the configurations, structures, methods, and the like described in other embodiment modes and examples.

[0436] (Embodiment 7) In this embodiment, an example of an uninterruptible power supply is described. An uninterruptible power supply 8700 shown in FIG. 25 includes a semiconductor device 8706, a battery pack 8707, a temperature sensor 8710, and a display device 8702. The temperature sensor 8710 is preferably provided near or in contact with the battery pack 8707. The temperature sensor 8710 may include a plurality of sensor elements. The semiconductor device 101 included in the power storage device described in the above embodiment can be used as the semiconductor device 8706. The battery pack 120 included in the power storage device described in the above embodiment can be used as the battery pack 8707. The display device DP1 included in the power storage device described in the above embodiment can be used as the display device 8702. The temperature sensor TS1 included in the power storage device described in the above embodiment can be used as the temperature sensor 8710.

[0437] A power cord 8701 of the uninterruptible power supply 8700 is electrically connected to a system power supply 8703. The system power supply 8703 is provided with power from, for example, a commercial power supply. Furthermore, a power cord 8708 of the uninterruptible power supply 8700 is electrically connected to a power supply 8709. The power supply 8709 is provided with power from, for example, a solar cell. The solar cell is installed outdoors, for example, on the roof of a house. The uninterruptible power supply 8700 is electrically connected to a precision device 8704. The precision device 8704 refers to, for example, a server device that should not be subject to power outages. The assembled battery 8707 of the uninterruptible power supply 8700 has multiple secondary batteries connected in series or in parallel to provide a desired voltage (for example, 80V or more, 100V or 200V, etc.).

[0438] By applying the power storage device of one embodiment of the present invention to an uninterruptible power supply, the measurement of the remaining amount of the battery pack can be improved, and the duration of the uninterruptible power supply can be extended. In addition, the reliability of the uninterruptible power supply can be improved. In addition, the life of the uninterruptible power supply can be extended. In addition, the power consumption of a semiconductor device included in the uninterruptible power supply can be reduced, and therefore the duration of the uninterruptible power supply can be extended. In addition, the semiconductor device 8706 detects phenomena such as overcharge, overdischarge, and overcurrent of the battery pack and controls charging, so that a highly safe uninterruptible power supply can be provided.

[0439] The uninterruptible power supply 8700 can be installed, for example, under the floor of a house. In such a case, only the display device 8702 may be installed on the floor, for example, on the wall of a room. The uninterruptible power supply 8700 is highly safe and is therefore suitable for installation under the floor.

[0440] The uninterruptible power supply according to one embodiment of the present invention can supply power to various devices shown in FIG.

[0441] 26 includes a housing 8101 and a light source 8102. When the supply of power from a commercial power source is stopped, the lighting device 8100 can use power stored in an uninterruptible power supply. Alternatively, the uninterruptible power supply may be used as an auxiliary power source in combination with the supply of power from a small amount of power source.

[0442] An artificial light source that artificially obtains light using electric power can be used as the light source 8102. Specifically, examples of the artificial light source include discharge lamps such as incandescent lamps and fluorescent lamps, and light-emitting elements such as LEDs and organic EL elements.

[0443] The air conditioner illustrated in FIG. 26 includes an indoor unit 8200 and an outdoor unit 8204. The indoor unit 8200 includes a housing 8201 and an air outlet 8202. When the supply of power from a commercial power source is stopped, the air conditioner can use power stored in an uninterruptible power supply. Alternatively, the uninterruptible power supply may be used as an auxiliary power source in combination with the supply of power from a small amount of power source.

[0444] 26 includes a housing 8301, a refrigerator door 8302, and a freezer door 8303. When the supply of power from the commercial power source is stopped, the electric refrigerator-freezer 8300 can use power stored in an uninterruptible power supply. Alternatively, the uninterruptible power supply may be used as an auxiliary power source in combination with the supply of power from a small amount of power source.

[0445] Also, by storing power in the uninterruptible power supply during time periods when electronic devices are not in use, particularly during time periods when the ratio of the amount of power actually used to the total amount of power that can be supplied by the commercial power source (called the power usage rate) is low, it is possible to prevent the power usage rate from increasing outside of the above time periods. For example, in the case of an electric refrigerator-freezer 8300, power is stored in the uninterruptible power supply during the night when the temperature is low and the refrigerator door 8302 and the freezer door 8303 are not opened or closed. Then, by using the uninterruptible power supply as an auxiliary power supply during the daytime when the temperature is high and the refrigerator door 8302 and the freezer door 8303 are opened and closed, it is possible to keep the daytime power usage rate low.

[0446] This embodiment mode can be appropriately combined with the descriptions of other embodiment modes.

[0447] (Embodiment 8) In this embodiment, an example in which a power storage device of one embodiment of the present invention is mounted on a vehicle will be described. Examples of vehicles include automobiles, motorcycles, and bicycles.

[0448] The power storage device of one embodiment of the present invention has a long lifetime and excellent reliability. Furthermore, the use of the power storage device of one embodiment of the present invention can improve the safety of electronic devices, vehicles, and the like.

[0449] An example in which a power storage device of one embodiment of the present invention is installed in a vehicle will be described below.

[0450] By installing an electricity storage device in a vehicle, next-generation clean energy vehicles such as hybrid electric vehicles (HEVs), electric vehicles (EVs), and plug-in hybrid electric vehicles (PHEVs) can be realized.

[0451] 27A, 27B, and 27C illustrate an example of a vehicle using a power storage device according to one embodiment of the present invention. An automobile 8400 illustrated in FIG. 27A is an electric automobile using an electric motor as a power source for running. Alternatively, the automobile 8400 is a hybrid automobile in which an electric motor and an engine can be appropriately selected and used as a power source for running. By using one embodiment of the present invention, a vehicle with a long cruising distance can be realized. The automobile 8400 includes a power storage device. The power storage device can not only drive the electric motor 8406 but also supply power to a light-emitting device such as a headlight 8401 or a room light (not shown).

[0452] The power storage device can supply power to display devices such as a speedometer and a tachometer included in the automobile 8400. The power storage device can also supply power to a navigation system included in the automobile 8400.

[0453] The automobile 8500 shown in FIG. 27B can be charged by receiving power supply from an external charging facility to the power storage device 8024 of the automobile 8500 by a plug-in method, a non-contact power supply method, or the like. FIG. 27B shows a state in which charging is being performed from a ground-mounted charging device 8021 to the power storage device 8024 mounted on the automobile 8500 via a cable 8022. When charging, the charging method and connector standards may be appropriately performed by a predetermined method such as CHAdeMO (registered trademark) or Combo. The charging device 8021 may be a charging station installed in a commercial facility, or may be a home power source. For example, the power storage device 8024 mounted on the automobile 8500 can be charged by an external power supply by plug-in technology. Charging can be performed by converting AC power to DC power via a conversion device such as an ACDC converter.

[0454] Although not shown, a power receiving device may be mounted on a vehicle, and power may be supplied contactlessly from a ground power transmitting device to charge the vehicle. In the case of this contactless power supply method, by incorporating a power transmitting device in a road or an exterior wall, charging may be performed not only while the vehicle is stopped but also while the vehicle is moving. This contactless power supply method may also be used to transmit and receive power between vehicles. Furthermore, a solar cell may be provided on the exterior of the vehicle, and the power storage device may be charged while the vehicle is stopped or moving. An electromagnetic induction method or a magnetic field resonance method may be used for such contactless power supply.

[0455] 27C is an example of a two-wheeled vehicle using a power storage device of one embodiment of the present invention. A scooter 8600 shown in FIG 27C includes a power storage device 8602, a side mirror 8601, and a turn signal light 8603. The power storage device 8602 can supply electricity to the turn signal light 8603.

[0456] 27C, the power storage device 8602 can be stored in the under-seat storage 8604. The power storage device 8602 can be stored in the under-seat storage 8604 even if the under-seat storage 8604 is small in size.

[0457] 28A is an example of an electric bicycle using the power storage device of one embodiment of the present invention. The power storage device of one embodiment of the present invention can be applied to an electric bicycle 8900 shown in FIG.

[0458] The electric bicycle 8900 includes a power storage device 8902. The power storage device 8902 can supply electricity to a motor that assists a rider. The power storage device 8902 is portable and is shown in a state removed from the bicycle in FIG. 28B. The power storage device 8902 includes a plurality of built-in battery packs 8901 of the power storage device of one embodiment of the present invention, and the remaining battery charge and the like can be displayed on a display unit 8903. The power storage device 8902 also includes a semiconductor device 8904 of one embodiment of the present invention. The semiconductor device 8904 is electrically connected to the positive and negative electrodes of the battery packs 8901. The semiconductor device 101 described in the above embodiment can be used as the semiconductor device 8904.

[0459] This embodiment mode can be appropriately combined with the descriptions of other embodiment modes.

[0460] (Additional notes regarding the present specification, etc.) The above embodiment and each configuration in the embodiment will be described below with additional notes.

[0461] The configurations shown in each embodiment can be combined with the configurations shown in other embodiments as appropriate to form one aspect of the present invention. In addition, when multiple configuration examples are shown in one embodiment, the configuration examples can be combined as appropriate.

[0462] In addition, the content (or a part of the content) described in one embodiment can be applied to, combined with, or replaced by another content (or a part of the content) described in that embodiment, and / or the content (or a part of the content) described in one or more other embodiments.

[0463] The contents described in the embodiments refer to contents described in each embodiment using various figures or contents described using text in the specification.

[0464] In addition, a figure (or a part thereof) described in one embodiment can be combined with another part of that figure, with another figure (or a part thereof) described in that embodiment, and / or with a figure (or a part thereof) described in one or more other embodiments to form even more figures.

[0465] In addition, in the present specification and the like, in the block diagrams, the components are classified by function and shown as mutually independent blocks. However, in actual circuits and the like, it is difficult to separate the components by function, and there may be cases where one circuit is involved in multiple functions, or where one function is involved across multiple circuits. Therefore, the blocks in the block diagrams are not limited to the components described in the specification, and may be rephrased appropriately according to the situation.

[0466] In addition, in the drawings, the size, layer thickness, or region are shown at an arbitrary size for convenience of explanation. Therefore, they are not necessarily limited to the scale. Note that the drawings are shown diagrammatically for clarity, and are not limited to the shapes or values ​​shown in the drawings. For example, it is possible to include variations in signals, voltages, or currents due to noise, or variations in signals, voltages, or currents due to timing deviations.

[0467] In this specification and the like, when describing the connection relationship of a transistor, the term "one of the source or drain" (or first electrode or first terminal) is used, and the other of the source and drain is used as "the other of the source or drain" (or second electrode or second terminal). This is because the source and drain of a transistor vary depending on the structure or operating conditions of the transistor. Note that the source and drain of a transistor can be appropriately referred to as source (drain) terminal, source (drain) electrode, etc. depending on the situation.

[0468] In addition, the terms "electrode" and "wiring" used in this specification and the like do not limit the functionality of these components. For example, an "electrode" may be used as part of a "wiring", and vice versa. Furthermore, the terms "electrode" and "wiring" include cases where multiple "electrodes" or "wirings" are formed integrally.

[0469] In addition, in this specification and the like, the terms voltage and potential can be interchanged as appropriate. Voltage is a potential difference from a reference potential, and if the reference potential is a ground voltage, for example, voltage can be interchanged as potential. Ground potential does not necessarily mean 0V. Note that potential is relative, and the potential applied to wiring, etc. may be changed depending on the reference potential.

[0470] In this specification and the like, the terms "film" and "layer" can be interchanged depending on the circumstances. For example, the term "conductive layer" can be changed to the term "conductive film". Or, for example, the term "insulating film" can be changed to the term "insulating layer".

[0471] In this specification, a switch refers to a device that has a function of controlling whether a current flows or not by being in a conductive state (on state) or a non-conductive state (off state), or a device that has a function of selecting and switching a path for a current to flow.

[0472] In this specification, the channel length refers to, for example, in a top view of a transistor, a region where a semiconductor (or a portion in the semiconductor through which current flows when the transistor is on) and a gate overlap, or a distance between the source and drain in a region where a channel is formed.

[0473] In this specification, the channel width refers to, for example, the length of the region where a semiconductor (or the portion in the semiconductor through which current flows when the transistor is on) and a gate electrode overlap, or the length of the portion where a source and a drain face each other in a region in which a channel is formed.

[0474] In this specification, "A and B are connected" includes not only a direct connection between A and B, but also an electrical connection between A and B. Here, "A and B are electrically connected" means that an object having some electrical effect exists between A and B, allowing transmission and reception of electrical signals between A and B. [Explanation of symbols]

[0475] AD1: conversion circuit, AD2: analog-to-digital conversion circuit, BGL2: wiring, BGL6: wiring, BKC1: circuit, BKC2: circuit, BKC10: circuit, BKC20: circuit, C1: capacitance element, C3: capacitance element, C6: capacitance element, CB1: capacitance element, CB2: capacitance element, CB11: capacitance element, CB12: capacitance element, CR1: ammeter, DP1: display device, FN1: node, FN2: node, GCLK2: clock signal, INV11: inverter circuit, INV12: inverter circuit, IV1: inverter circuit, M1: transistor, M2: transistor, M3: trans transistor, M4: transistor, M5: transistor, M6: transistor, M11: transistor, M12: transistor, MA1: transistor, MC1: transistor, MC2: transistor, ME1: memory, ME2: memory, MemC1: circuit, MemC2: circuit, MR1: transistor, MW1: transistor, MW2: transistor, MW11: transistor, MW12: transistor, NB1: node, NET1: node, NET2: node, NK1: node, NR1: node, OU1: terminal, OU2: terminal, PCC10: circuit, PR1: reserve protection circuit, PR2: control circuit, PS1: terminal, PSE5: signal, PSE6: signal, RL1: relay circuit, RL2: relay circuit, RTC10: circuit, S1: terminal, SC1: terminal, SE7: switch, SH1: sample and hold circuit, SH2: sample and hold circuit, SMC20: circuit, SN1: node, SN2: node, SN3: node, SW1: control circuit, SW7: switch, TS1: temperature sensor, VC1: terminal, VH1: potential, VH2: potential, VH3: potential, WR1: circuit, 10: power supply circuit, 11: memory cell, 12: MW, 15: memory cell, 16: memory recell, 20: processing device, 20a: processing device, 20b: processing device, 21: processing device, 30: processor core, 31: memory circuit, 32: circuit, 35: power line, 40: cache, 41: memory array, 42: peripheral circuit, 43: control circuit, 45: memory cell, 51: processing device, 52: conversion circuit, 53: circuit, 55: control circuit, 60: PMU, 61: circuit, 65: clock control circuit, 70: PSW, 71: PSW, 80: terminal, 81: terminal, 82: terminal, 83: terminal, 100: power storage device, 101: semiconductor device, 110: FF, 120: battery pack, 121: battery cell,121a: amplifier circuit, 121b: amplifier circuit, 122: battery pack, 122a: transistor, 122b: transistor, 123a: capacitive element, 123b: capacitive element, 126: resistive element, 130: processor core, 131: control device, 132: program counter, 133: pipeline register, 134: pipeline register, 135: register file, 136: ALU, 137: data bus, 200: memory circuit, 202: cache memory device, 203: cache memory device, 220: memory cell, 240: NOSRAM, 242: power domain , 243: power domain, 245: power switch, 247: power switch, 250: memory cell array, 251: control circuit, 252: row circuit, 253: column circuit, 311: substrate, 313: semiconductor region, 314a: low resistance region, 314b: low resistance region, 315: insulator, 316: conductor, 320: insulator, 322: insulator, 324: insulator, 326: insulator, 328: conductor, 330: conductor, 350: insulator, 351: DOSRAM, 352: insulator, 354: insulator, 356: conductor, 360: insulator, 361: memory cell array, 362: insulator , 364: insulator, 365: peripheral circuit, 366: conductor, 370: insulator, 371: power switch, 372: insulator, 373: power switch, 374: insulator, 376: conductor, 380: insulator, 382: insulator, 384: insulator, 386: conductor, 400: secondary battery, 401: positive electrode cap, 402: battery can, 404: insulator, 408: battery pack, 413: conductive plate, 414: conductive plate, 415: power storage device, 416: wiring, 420: semiconductor device, 421: wiring, 422: wiring, 423: wiring, 424: conductor, 425: insulator, 426: wiring, 427: Temperature sensor, 500: transistor, 500A: transistor, 500B: transistor, 503: conductor, 503a: conductor, 503b: conductor, 510: insulator, 512: insulator, 513: insulator, 514: insulator, 516: insulator, 518: conductor, 520: insulator, 522: insulator, 524: insulator, 530: oxide, 530a: oxide, 530b: oxide, 540a: conductor, 540b: conductor, 542: conductor, 542a: conductor, 542b: conductor, 543a: region, 543b: region, 544: insulator, 545: insulator, 546: conductor,548: conductor, 550: transistor, 552: insulator, 560: conductor, 560a: conductor, 560b: conductor, 574: insulator, 580: insulator, 581: insulator, 582: insulator, 586: insulator, 600: capacitor, 601: positive electrode cap, 602: battery can, 603: positive electrode terminal, 604: positive electrode, 605: separator, 606: negative electrode, 607: negative electrode terminal, 608: insulating plate , 609: insulating plate, 610: conductor, 611: PTC element, 612: conductor, 613: safety valve mechanism, 620: conductor, 630: insulator, 640: insulator, 930: housing, 931: negative electrode, 932: positive electrode, 933: separator, 950: winding body, 951: terminal, 952: terminal, 8021: charging device, 8022: cable, 8024: power storage device, 8100: lighting device, 8101: housing , 8102: light source, 8200: indoor unit, 8201: housing, 8202: air outlet, 8204: outdoor unit, 8300: electric refrigerator-freezer, 8301: housing, 8302: refrigerator compartment door, 8303: freezer compartment door, 8400: automobile, 8401: headlight, 8406: electric motor, 8500: automobile, 8600: scooter, 8601: side mirror, 8602: power storage device, 8603: direction Indicator light, 8604: Under-seat storage, 8700: Uninterruptible power supply, 8701: Power cord, 8702: Display device, 8703: System power supply, 8704: Precision equipment, 8706: Semiconductor device, 8707: Assembled battery, 8708: Power cord, 8709: Power supply, 8710: Temperature sensor, 8900: Electric bicycle, 8901: Assembled battery, 8902: Power storage device, 8903: Display unit, 8904: Semiconductor device,

Claims

[Claim 1] A battery, a control circuit, and a conversion circuit, the control circuit includes a processing unit including a processor core, a first sample-and-hold circuit, and a second sample-and-hold circuit; the first sample-and-hold circuit includes a first transistor having an oxide semiconductor in a channel formation region; the second sample-and-hold circuit includes a second transistor having an oxide semiconductor in a channel formation region; the processing device is electrically connected to the gate of the first transistor and the gate of the second transistor; a signal is applied from the processing device to a gate of the first transistor and a gate of the second transistor, thereby turning on the first transistor and the second transistor; A voltage is applied from the conversion circuit to the battery. providing data on the voltage of the battery to one of the source and drain of the first transistor, converting data on the current of the battery into a voltage and providing the same to one of the source and drain of the second transistor; A method for operating an electricity storage device, comprising: applying a signal from the processing device to a gate of the first transistor and a gate of the second transistor, thereby turning off the first transistor and the second transistor.

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