LED light source module for performance space such as theater, and LED lighting device for performance space such as theater

Abstract

To provide an LED light source module for performance spaces such as theaters, and an LED lighting device for performance spaces such as theaters, which reduce the number of layers in a multi-layer LED mounting board while reducing the spacing between LEDs and increasing the density of LED chips.SOLUTION: An LED light source module for performance space such as theaters includes an LED mounting board 40 with a multi-layer structure in which LEDs 30 of multiple colors are mounted in a two-dimensional array in the X and Y directions without LEDs 30 of the same color being adjacent to each other, and LEDs 30 of multiple colors, and has a laminated structure including two layers, a first layer 41 and a second layer 42 arranged below the first layer 41. In order to connect LEDs 30 of the same color, a wiring pattern 60 is formed for each color. The wiring pattern 60 includes a first wiring portion 64 formed on one of the first layer 41 and the second layer 42, a second wiring portion 66 formed on the other layer and extending in an oblique direction when viewed from above intersecting with the X or Y direction, and a via 62 that electrically connects the first wiring portion 64 and the second wiring portion 66.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an LED light source module for use in a performance space such as a theater, and an LED lighting device for use in a performance space such as a theater. [Background technology]

[0002] 2. Description of the Related Art Conventionally, there has been known an LED lighting device in which four LEDs (a blue LED, a red LED, a green LED, and a white LED) that emit light of different colors are mounted on the same plane of a substrate (see, for example, Patent Document 1). Furthermore, for such LED lighting devices, in applications such as stage lighting, there is a need for LED lighting devices that can emit light of four or more colors while remaining relatively small in size by narrowing the spacing between the LEDs and packing them closely together. Here, in an LED lighting device having multiple colored LEDs that each emit a different color, the current value of each colored LED can be controlled independently to enable tens of thousands of color variations, so that electrodes and wiring systems are usually arranged separately for each colored LED. However, when multiple colored LEDs are used as in Patent Document 1, the wiring pattern becomes more complicated as the number of colors of LEDs increases, and it may become necessary to cross the wiring for the different colored LEDs.

[0003] To address this problem, Patent Document 2 proposes arranging a first wiring, a second wiring, and a third wiring on a single-layer mounting board, and connecting the first wiring and the second wiring with a bonding wire so as to straddle the third wiring, thereby reducing the distance between the LEDs and increasing the density of the LEDs. Patent Document 3 also proposes using a multi-layer board as the LED mounting board, and wiring the wiring for LEDs of different colors on separate layers. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-102396 A [Patent Document 2] Patent Publication No. 2022-062564 [Patent Document 3] JP 2014-103261 A Summary of the Invention [Problem to be solved by the invention]

[0005] When an LED light source module is used as lighting for a performance space such as a theater, it is necessary to illuminate an object from a distance evenly compared to other applications. For this reason, in an LED light source module for a performance space such as a theater, which is equipped with multiple LEDs of multiple colors, it is required that the multiple LEDs mounted as a whole function as a point light source even when illuminating an object from a distance. However, in Patent Document 2, since the mounting board has a single-layer structure, it is necessary to lay wiring around the position where the LEDs are installed, and there is a problem that the pitch between the LEDs becomes large accordingly. In addition, in Patent Document 3, since the LEDs are connected by wire bonding and sealed with a resin containing a phosphor, there is a problem that the pitch between the LEDs becomes large. Furthermore, in Patent Document 3, since only wiring corresponding to one color of LED is formed on each layer of the LED mounting board, for example, when an LED lighting device is manufactured using four colors of LEDs, there is a problem that the mounting board has a multi-layer structure of four or more layers. In addition, in Patent Document 3, since the LEDs of the same color are arranged in a lower layer with a larger number of LEDs of the color and in an upper layer with a smaller number of LEDs of the color, there is a problem that the LEDs cannot be arranged densely when the number of LEDs of each color is about the same. LED light source modules using the aforementioned conventional technology do not provide sufficient performance for lighting in performance spaces such as theaters due to issues such as the large distance between the LEDs, even if this does not pose a problem for applications other than performance spaces such as theaters.

[0006] The objective of the present invention is to provide an LED light source module for use in performance spaces such as theaters, which can reduce the spacing between LEDs and increase the density of LEDs while keeping the number of board layers in a multi-layer LED mounting board small, and an LED lighting device for use in performance spaces such as theaters. [Means for solving the problem]

[0007] The LED light source module for a performance space such as a theater according to the present invention includes an LED mounting board with a multi-layer structure on which LEDs of multiple colors are mounted in a two-dimensional array in the X and Y directions without LEDs of the same color being adjacent to each other, and the multiple colors are mounted on the LED mounting board, wherein the LED mounting board has a stacked structure including two layers, a first layer and a second layer arranged below the first layer, and a wiring pattern is formed for each color to connect LEDs of the same color, and the wiring pattern includes a first wiring portion formed on one of the first and second layers, and a second wiring portion formed on the other layer and extending in an oblique direction in a top view intersecting with the X or Y direction, and a via electrically connecting the first wiring portion and the second wiring portion. In the above LED light source module for a performance space such as a theater, the second wiring portions corresponding to the respective colors may be formed in parallel in an X direction or a Y direction. In the above LED light source module for a performance space such as a theater, the LEDs of multiple colors can be arranged in a fixed color order in the Y direction, and between adjacent rows in the X direction, LEDs of the same color can be arranged with a shift in the Y direction. In the above-mentioned LED light source module for a performance space such as a theater, the first wiring section can be configured to connect LEDs of the same color in series and be composed of a plurality of first-color unit wiring patterns extending in a first direction on the same plane, and the second wiring section can be configured to connect LEDs of the same color in series and be composed of a plurality of second-color unit wiring patterns extending in a second direction intersecting the first direction on the same plane. In the above-mentioned LED light source module for a performance space such as a theater, the multi-colored LEDs can have a plurality of first LEDs and a plurality of second LEDs that emit light in a wavelength range different from that of the first LEDs, and the first wiring section connecting the plurality of first LEDs can be configured to intersect with the second wiring section connecting the plurality of second LEDs in a different layer. In the above LED light source module for a performance space such as a theater, the second wiring section can be configured to pass diagonally under the arrangement positions of the LEDs of other colors when viewed from above, electrically connecting the LEDs of the same color to each other. The LED lighting device for a performance space such as a theater according to the present invention comprises a lighting unit having the above-mentioned LED light source module for a performance space such as a theater, and a control unit that controls the lighting by the lighting unit. Effect of the Invention

[0008] According to the present invention, in an LED light source module for use in a performance space such as a theater, which has an LED mounting board on which multiple types of LEDs are arranged two-dimensionally without LEDs of the same type being adjacent to each other, it is possible to form wiring patterns of LEDs of multiple colors at high density on the same layer, thereby making it possible to reduce the arrangement pitch between LEDs and increase the density of the LEDs while reducing the number of board layers in a multi-layered LED mounting board. [Brief description of the drawings]

[0009] [Figure 1] 1 is a configuration diagram of an LED lighting device according to an embodiment of the present invention. [Diagram 2] 1 is a plan view of an LED light source module according to an embodiment of the present invention. [Diagram 3] FIG. 3 is a side cross-sectional view taken along line III in FIG. 2. [Figure 4] FIG. 3 is a side cross-sectional view taken along line IV in FIG. 2. [Diagram 5] 4A to 4C are diagrams for explaining a method of arranging LEDs in the present embodiment. [Figure 6] FIG. 1 is a diagram for explaining a conventional wiring method. [Figure 7]FIG. 13 is a diagram for explaining another wiring method. [Figure 8] 10 is a diagram for explaining the relationship between the arrangement pitch of LEDs and the number of wiring patterns. FIG. [Figure 9] 1A to 1C are diagrams for explaining a wiring method according to an embodiment of the present invention. [Figure 10] FIG. 3 is an enlarged view of a portion B in FIG. 2, illustrating a wiring method for wiring patterns according to the present embodiment. [Figure 11] FIG. 2 is a diagram showing an example of a wiring pattern formed on a first layer. [Figure 12] FIG. 2 is a plan view of the first layer before LEDs are mounted. [Figure 13] FIG. 11 is a diagram showing an example of a wiring pattern formed on a second layer. [Figure 14] FIG. 2 is a diagram showing wiring patterns formed on a first layer and a second layer superimposed on each other. [Figure 15] FIG. 13 is a diagram for explaining a wiring method of the wiring pattern over the entire light-emitting surface. [Figure 16] FIG. 13 is a plan view of an LED mounting board according to another embodiment. [Figure 17] FIG. 11 is a diagram showing an example of a wiring pattern of a first layer according to another embodiment. [Figure 18] FIG. 13 is a diagram showing first and second layer wiring patterns superimposed on each other according to another embodiment. [Figure 19] FIG. 4 is a side cross-sectional view of an LED light source module according to a comparative example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a configuration diagram showing an LED lighting device 1 according to this embodiment. As shown in Fig. 1, the LED lighting device 1 according to this embodiment is mainly composed of a control unit 100 and a lighting unit 200. In the following, the lighting unit 200 has multiple types of LEDs 30 that each emit light of different wavelengths, and the control unit 100 performs dimming control to dim the emitted light by separately controlling the color emission of these multiple types of LEDs 30.

[0011] 1, the control unit 100 has a color rendering controller 110 and a plurality of LED dimming control units 120. The color rendering controller 110 comprehensively controls the color rendering of the light irradiated by the lighting unit 200, and for example, transmits a control signal according to the light emission intensity of the LEDs 30 of each color to the lighting unit 200 in order to adjust the irradiated light to a predetermined color based on a pre-stored program.

[0012] The LED dimming control unit 120 performs dimming control of the LEDs 30 of the lighting unit 200 based on a control signal output from the control unit 100. Specifically, the LED dimming control unit 120 controls the power supplied to the LEDs 30 by digital control or analog control based on an instruction from the color rendering controller 110, and causes the LEDs 30 of each color to emit light at their respective intensities according to the program of the color rendering controller 110, thereby emitting light of a color according to the program of the color rendering controller 110. As shown in FIG. 1, the LED dimming control unit 120 is provided for each type of LED 30, and since six types of LEDs 30 are used in this embodiment, the configuration includes six LED dimming control units.

[0013] Next, the lighting unit 200 will be described. The lighting unit 200 has a large number of LEDs 30, and emits light by supplying power to these LEDs 30 from the control unit 100. As shown in Fig. 1, the lighting unit 200 mainly has an LED light source module 10 and a heat sink 20. Also, a lens may be arranged in the direction of light emission by the lighting unit 200, or a reflector may be arranged to determine the irradiation direction.

[0014] Here, Fig. 2 is a plan view of the LED light source module 10 according to this embodiment. Fig. 3 and Fig. 4 are side cross-sectional views of the LED light source module 10 according to this embodiment, Fig. 3 is a cross-sectional view along line III in Fig. 2 (cross-sectional view of a cross-section along the X-axis direction), and Fig. 4 is a cross-sectional view along line IV in Fig. 2 (cross-sectional view of a cross-section along the extension direction of a diagonal wiring portion 66 described later). As shown in Figs. 2 to 4, the LED light source module 10 has an LED 30, an LED mounting substrate 40, and an external electrode 50.

[0015] The external electrodes 50 are connected to an external power source and are connected to the LEDs 30 via a wiring pattern 60 (details of which will be described later) formed on the LED mounting substrate 40. In this embodiment, as shown in FIG. 2, the LEDs 30 of each color have external electrodes 51 to 54, but hereinafter, these external electrodes 51 to 54 are simply referred to as external electrodes 50. In this embodiment, six types of LEDs 30 are provided, each of which emits light of a different wavelength, and each type emits light of a unique wavelength. Heat generated by the LEDs 30 is transferred to the heat sink 20 shown in FIG. 1 via the LED mounting substrate 40, and is dissipated from the heat sink 20.

[0016] In this embodiment, as shown in FIG. 2 and FIG. 3, six color LEDs (blue LED 30B, yellow LED 30Y, light blue LED 30S, purple LED 30V, green LED 30G, and red LED 30R) are mounted by SMT (Surface Mount) or COB (Chip On Board). Specifically, the LED 30 has a pair of electrodes 31 on the lower surface, and the pair of electrodes 31 are electrically connected to a wiring pattern 60 formed on the LED mounting board 40, and the LED 30 is turned on by applying a current or voltage between the electrodes 31 of the LED 30. For example, in the example shown in FIG. 3, the green LED 30G has a pair of electrodes 31G1, 31G2 on the lower surface, and the pair of electrodes 31G1, 31G2 are connected to a wiring pattern 60 (such as an electrode pad wiring portion 61 and a diagonal wiring portion 66 described later) formed on the first layer 41, and the green LED 30G can be turned on by applying a current or voltage between the pair of electrodes 31G1, 31G2 via the wiring pattern 60.

[0017] In the following description, the blue LED 30B, the yellow LED 30Y, the light blue LED 30S, the purple LED 30V, the green LED 30G, and the red LED 30R are collectively referred to simply as LED 30. In this embodiment, LEDs 30 are packaged in a chip scale package (CSP) or the like, but LED bare chips may be used as they are. In this embodiment, as shown in FIG. 2, 120 LEDs 30 are arranged, and all the LEDs 30 of the same color have the same specifications, and all the LEDs have approximately the same shape when viewed from above.

[0018] In this embodiment, as shown in FIG. 2, six color LEDs 30 that emit light in different wavelength ranges are two-dimensionally arranged in a lattice shape when viewed from above. Furthermore, in this embodiment, the LEDs 30 of multiple colors are two-dimensionally arranged so that LEDs 30 of the same color are not adjacent to each other. The multiple LEDs 30 are arranged taking into consideration the dimensional variations of the LED outer shapes and the variations in the LED mounting positions. In the following, for convenience of explanation, among the multiple LEDs 30 arranged in the two-dimensional direction, the arrangement of the LEDs 30 in the X-axis direction is referred to as a "column", and the arrangement of the LEDs 30 in the Y-axis direction is referred to as a "row".

[0019] In this embodiment, as shown by SA in FIG. 2, six color LEDs 30 are arranged in a color basic array SA, and this color basic array SA is repeated in the Y-axis direction, and the color basic array SA is arranged in the X-axis direction while being shifted in the Y-axis direction. Here, FIG. 5 is a diagram for explaining a method of arranging the LEDs 30 in this embodiment, and the LEDs 30 shown in FIG. 2 are replaced with the color basic array SA. As shown in FIG. 5, the color basic array SA2 in the second column from the left is arranged at a position shifted from the color basic array SA1 in the Y-axis forward direction by two LEDs (shown by D1 in FIG. 5) with respect to the color basic array SA1 in the first column from the left. Similarly, the color basic array SA3 adjacent to the color basic array SA2 is arranged at a position shifted from the color basic array SA2 in the Y-axis forward direction by two LEDs (shown by D2 in FIG. 5) with respect to the color basic array SA2. As a result, as shown in FIG. 5, LEDs 30 of the same color are no longer adjacent to each other (because LEDs 30 of the same color in adjacent rows are shifted by two in the forward direction along the Y axis), and as shown in FIG. 2, color bias on the light-emitting surface of the LED light source module 10, which is a multi-color light source, can be suppressed.

[0020] In the present application, the LED mounting board 40 is a board on which the LEDs 30 are mounted, and as shown in FIG. 3, is configured with a two-layer structure including two layers, a first layer 41 and a second layer 42. In this embodiment, a plurality of LEDs 30 are mounted on the upper surface of the first layer 41. Also, as shown in FIG. 2, an external electrode 50 is provided on the upper surface of the first layer 41. Furthermore, a wiring pattern 60 is formed on the first layer 41 and the second layer 42. Specifically, as the wiring pattern 60, an electrode pad wiring portion 61 and a horizontal wiring portion 64 are formed on the upper surface of the first layer 41, and an oblique wiring portion 66 and a vertical wiring portion 67 are formed on the upper surface of the second layer 42. Also, the wiring patterns 60 (electrode pad wiring portion 61, horizontal wiring portion 64, oblique wiring portion 66, and vertical wiring portion 67) formed on each layer are electrically connected by a via 62 that connects the first layer 41 and the second layer 42. Details of a method for forming the wiring pattern 60 will be described later. The LED mounting board 40 may have a two-layer structure including the first layer 41 and the second layer 42, or may have a three or more layer structure including other layers.

[0021] The first layer 41 and the second layer 42 can each be made of a thermally conductive insulating substrate. The insulating substrate can be made of, for example, an organic material such as glass epoxy, or a ceramic material such as Al2O3, AlN, GaN, or SiC. In this embodiment, the first layer 41 and the second layer 42 are made of a ceramic material.

[0022] Here, a conventional wiring method of the wiring pattern will be described. Conventionally, wiring between a plurality of LEDs 30 was performed using only a wiring pattern extending in the X-axis direction and a wiring pattern extending in the Y-axis direction. Here, FIG. 6 is a diagram for explaining the conventional wiring method, and shows the left half of the LEDs 30 arranged on the LED mounting board 40 shown in FIG. 2. In addition, in the example shown in FIG. 6, only the wiring pattern 60 of the green LED 30G among the six color LEDs 30 is shown. For example, in the conventional wiring method, even in a scene where six color LEDs 30 are arranged, the LEDs 30 of each color are connected by column as shown in FIG. 6. That is, in the conventional wiring method, as shown in FIG. 6, the wiring pattern 60 derived from the external electrode 51 is first connected to the green LED 30G3 in the first column from the left. Then, the wiring pattern 60 is extended in the forward direction along the Y axis from the green LED 30G3 to a position where no LED 30 exists, the wiring is turned back at that position, and the wiring is extended in the reverse direction along the Y axis toward the green LED 30G4 in the second row from the left, and the wiring pattern 60 is connected to the green LED 30G4. 10 In the conventional configuration, the green LEDs 30G are linked in the order of 30G9, 30G6, 30G5, and 30G8, and connected to the external electrodes 52 by wiring patterns 60, thereby linking together green LEDs of the same color.

[0023] However, in such a configuration, the total length of the wiring pattern becomes long, and the wiring resistance increases, which causes a problem of increased loss. Therefore, the inventor created a method of connecting LEDs 30 of the same color arranged in close positions by treating a predetermined number of rows of LEDs 30 as one block and moving a wiring pattern 60 back and forth within the block as shown in FIG. 7. Here, FIG. 7 is a diagram for explaining another wiring method, and shows the left half of the LEDs 30 arranged on the LED mounting board 40 shown in FIG. 1, as in FIG. 6. Also, in the example shown in FIG. 7, as in FIG. 6, only the wiring pattern 60 of the green LED 30G is shown among the six colors of LEDs 30. Specifically, in the example shown in FIG. 7, three rows of LEDs 30 are treated as one block, and within the range of these three rows, LEDs 30 of the same color are connected to each other in order from top to bottom. 7, the first to third rows from the left are designated as a first block B1, and the fourth to sixth rows from the left are designated as a second block B2. First, in the first block B1, the green LEDs 30G1 to 30G4 are connected in order from the top to the bottom, and then the wiring pattern 60 is folded back below the first block B1 and connected to the second block B2. Then, in the second block B2, the green LEDs 30G5 to 30G6 are connected in order from the bottom to the top. 10 This will connect the same color green LEDs 30G1 to 30G 10 can be concatenated in order.

[0024] In this way, in the wiring method shown in Fig. 7, LEDs 30 of the same color arranged in close positions in block units from top to bottom are connected to each other, so that the overall length of the wiring pattern 60 can be shortened and loss can be reduced compared to the wiring method shown in Fig. 6. However, in the wiring method shown in Fig. 7, when there are many colors of LEDs 30, the wiring patterns formed for each color (each type of LED 30) cannot be accommodated within the arrangement pitch of the LEDs 30, and the arrangement pitch of the LEDs 30 needs to be increased. Here, Fig. 8 is a diagram for explaining the relationship between the arrangement pitch of the LEDs 30 and the number of wiring patterns. In Fig. 8(A), the arrangement pitch of the LEDs 30 is indicated by P1, and when the LEDs 30 are six colors, it is necessary to fit six wiring patterns 60 (wiring pattern 60B connected to blue LEDs 30B, wiring pattern 60Y connected to yellow LEDs 30Y, wiring pattern 60S connected to light blue LEDs 30S, wiring pattern 60V connected to purple LEDs 30V, wiring pattern 60G connected to green LEDs 30G, and wiring pattern 60R connected to red LEDs 30R) within the arrangement pitch P1 of the LEDs 30. However, since there is a limit to how small the width P2 of the wiring patterns 60 and the interval P3 between the wiring patterns 60 can be, the more the number of wiring patterns 60 increases (for example, four or more colors, or six or more colors), the wiring patterns 60 reach P4, which exceeds the range of the arrangement pitch P1 of the LEDs 30, as shown in Fig. 8(B), and it is necessary to increase the arrangement pitch P1 of the LEDs 30.

[0025] In contrast, in this embodiment, the wiring pattern 60 is formed to extend in an oblique direction, so that the wiring pattern 60 of the LEDs 30 of multiple colors can be formed while keeping the arrangement pitch P1 of the LEDs 30 small. Here, FIG. 9 is a diagram for explaining the wiring method according to this embodiment, and shows the left half of the LEDs 30 arranged on the LED mounting board 40 shown in FIG. 2, as in FIG. 6 and FIG. 7. Also, in the example shown in FIG. 9, as in FIG. 6 and FIG. 7, only the wiring pattern 60 of the green LED 30G is shown among the six-color LEDs 30. In this embodiment, as shown in FIG. 9, the wiring pattern 60 has a wiring portion (a diagonal wiring portion 66 described later) that extends in an oblique direction (a direction intersecting the X-axis direction and the Y-axis direction).

[0026] 9, similarly to the example shown in FIG. 7, the first to third columns from the left are designated as a first block B1, and the fourth to sixth columns from the left are designated as a second block B2. First, in the first block B1, the green LEDs 30G1 to 30G4 are connected in order from the top to the bottom, and then the wiring pattern 60 is folded back below the first block B1 and connected to the second block B2. Then, in the second block B2, the green LEDs 30G5 to 30G6 are connected in order from the bottom to the top. 10 7, the overall length of the wiring pattern 60 can be made shorter than in the example shown in Fig. 6 (and furthermore than in the example shown in Fig. 7).

[0027] 9, the green LEDs 30G1 and 30G2 are connected by a diagonal wiring pattern 60. Similarly, the green LEDs 30G3 and 30G4, the green LEDs 30G5 and 30G6, the green LEDs 30G6 and 30G7, the green LEDs 30G8 and 30G9, the green LEDs 30G9 and 30G 10and are also connected by wiring patterns 60 in a diagonal direction when viewed from above. In this way, in the LED mounting board 40 according to this embodiment, the LEDs 30 of the same color are connected to each other by the diagonal wiring patterns 60, and the other colors are also connected by similarly diagonal wiring patterns 60, so that it is not necessary to form vertical wiring for the number of colors as in the conventional example shown in Fig. 6 or the example shown in Fig. 7, and as a result, the arrangement pitch P1 between the LEDs 30 can be reduced.

[0028] Here, Fig. 10 is a diagram for explaining a wiring method of the wiring pattern 60 according to this embodiment, and is an enlarged view of the portion B shown in Fig. 2 of the wiring pattern 60. Fig. 10 is also a diagram illustrating the wiring pattern 60 formed on the second layer 42 of the wiring pattern 60 electrically connected to each LED 30, and for convenience of explanation, each LED 30 is shown superimposed.

[0029] As shown in FIG. 10, in this embodiment, the LEDs 30 of the same color are connected to each other using the diagonal wiring portion 66, which is the wiring pattern 60 extending in a diagonal direction when viewed from above. Even if the number of colors of the LEDs 30 is large and the number of wiring patterns 60 is large, the wiring pattern 60 can be formed without widening the arrangement pitch P1 between the LEDs 30. This is because, in this embodiment, the LEDs 30 of the same color are not adjacent to each other in the X-axis direction, but are arranged shifted in the Y-axis direction (in this embodiment, the LEDs 30 are arranged shifted in the Y-axis direction by two LEDs 30), and as shown in FIG. 10, the diagonal wiring portion 66 corresponding to each color can be arranged shifted in the Y-axis direction and connected to each other for each color. Note that, in the example shown in FIG. 10, a configuration using six colors of LEDs 30 is illustrated, but even if there are eight colors, the number of LEDs 30 included in the color basic array SA arranged in the Y-axis direction will be eight, and there is no change in the fact that the diagonal wiring portion 66 corresponding to each color can be arranged in the Y-axis direction (there is no change in the wiring density), so it is possible to form wiring patterns for eight colors. The wiring method for the wiring pattern 60 according to this embodiment will be described in detail below.

[0030] In this embodiment, the wiring pattern 60 is composed of an electrode pad wiring portion 61 and a horizontal wiring portion 64 formed on the first layer 41, a via 62 connecting the first layer 41 and the second layer 42, and a diagonal wiring portion 66 and a vertical wiring portion 67 formed on the second layer 42. Here, Figs. 11 to 14 are diagrams showing the wiring pattern 60 in part B shown in Fig. 2. Specifically, Fig. 11 is a diagram showing the wiring pattern 60 formed on the first layer 41. Fig. 12 is a plan view showing a state in which a cover ceramic 80 described below is laminated on the first layer 41 of Fig. 11 in order to mount the LED 30. Furthermore, Fig. 13 shows the wiring pattern 60 formed on the second layer 42, and Fig. 14 is a diagram showing all the wiring patterns 60 formed on the first layer 41 and the second layer 42 superimposed. 11 and 12 are views seen from the first layer 41 side toward the second layer 42 side, and for ease of explanation, the LEDs 30 arranged on the first layer 41 are illustrated superimposed on the lower side of the wiring pattern 60. In addition, in Fig. 13, for ease of explanation, the electrode pad wiring portion 61 formed on the first layer 41 is illustrated by a dashed line, and the LEDs 30 arranged on the first layer 41 are illustrated superimposed on the lower side of the wiring pattern 60. Furthermore, Fig. 14 is a view of the wiring pattern 60 seen from the second layer 42 side toward the first layer 41 side.

[0031] As shown in FIG. 11 and FIG. 2, the electrode pad wiring portion 61 and the lateral wiring portion 64 are formed on the surface of the first layer 41 as the configuration of the wiring pattern 60. In addition, in this embodiment, as shown in FIG. 12, the surface of the first layer 41 including the electrode pad wiring portion 61 and the lateral wiring portion 64, except for the opening 81, is covered with the cover ceramic 80. Specifically, the first layer 41 has an opening 81 of the cover ceramic 80 formed at a position where the first layer 41 contacts the electrode 31 of the LED 30, and the electrode pad wiring portion 61 and the lateral wiring portion 64 are partially exposed. As a result, the LED 30 is connected to the electrode pad wiring portion 61 and the lateral wiring portion 64 through the solder 70 in the opening 81, thereby SMT surface mounting the LED 30. In addition, the first layer 41 has a via 62 formed therein for connecting the wiring pattern 60 formed on the first layer 41 and the second layer 42. In this embodiment, the cover ceramic 80 covers the surface of the first layer 41, but when the mounting substrate is an organic substrate, the surface of the first layer 41 can be covered with a solder resist. In this embodiment, the wiring pattern 60 is made of a material such as copper, aluminum, or tungsten. In addition, in order to increase the adhesion between the electrode pad wiring portion 61 and the solder 70, the surface of the electrode pad wiring portion 61 can be plated (for example, electroless Ni / Pd / Au plating). In this application, the cover ceramic 80 is a member made of a material different from the two layers of the first layer 41 and the second layer 42, covers the upper surface of the first layer 41, and has a plurality of openings 81 for exposing parts of each of the wiring patterns 60. The openings 81 are structures for exposing electrodes for solder connection. The different material may be, for example, a material different from the ceramic sheet used for the first layer 41. More specifically, even if alumina ceramic is used for both the first layer 41 and the cover ceramic 80, if a ceramic sheet is not used for the cover ceramic 80, it may be interpreted that different materials are used.

[0032] For example, in the example shown in FIG. 11 and FIG. 12, a pair of electrodes 31G of a green LED 30G8 is connected to an electrode pad wiring portion 61G formed on the first layer 41 through the opening 81 of the cover ceramic 80 via the solder 70. 82 and horizontal wiring section 64G 78 By connecting the electrode pad wiring portion 61G to the green LED 30G8, the green LED 30G8 is surface mounted by SMT. 82 and horizontal wiring section 64G 78 Via 62G 82 and via 62G 78 , and through these vias, a diagonal wiring portion 66G formed in the second layer 42 described later 89 and vertical wiring section 67G 78 and will be connected to each other.

[0033] As shown in FIG. 13, the wiring pattern 60 is formed on the upper surface of the second layer 42 with a diagonal wiring portion 66 extending in a diagonal direction (a second direction intersecting with the X-axis direction and the Y-axis direction, which are the arrangement directions of the LEDs 30) and a vertical wiring portion 67 extending in the Y-axis direction. In this embodiment, the LEDs 30 of the same color are arranged in adjacent rows without being adjacent to each other and shifted by a predetermined number of LEDs 30 (two in this embodiment). In this manner, in this embodiment, the wiring pattern 60 (diagonal wiring portion 66) extends in a diagonal direction, so that the LEDs 30 of the same color in adjacent rows can be connected to each other in a straight line distance by passing under the LEDs 30 of other colors. In this embodiment, the wiring patterns 60 (diagonal wiring portion 66) corresponding to each color can be formed in a line in the Y-axis direction, so that even if the number of colors increases and the number of wiring patterns 60 increases, the wiring patterns 60 can be appropriately arranged.

[0034] For example, in the example shown in FIG. 13, the green LED 30G8 and the green LED 30G9 are arranged in a diagonal wiring portion 66G 89The red LEDs 30R1 and 30R2, which are disposed one LED below the green LEDs 30G8 and 30G9 (i.e., shifted in the Y-axis forward direction by one LED 30), are also connected in a straight line by the diagonal wiring portion 66G. 89 The diagonal wiring portion 66R is formed at a position one LED lower than the position (a position shifted in the Y-axis forward direction by one LED 30). 12 In the same manner, the diagonal wiring portions 66 corresponding to the other colors are also formed to be aligned substantially parallel to the Y-axis direction, so that even if the number of colors and the number of wiring patterns increase, the wiring patterns can be arranged at equal intervals.

[0035] In this manner, the LEDs 30 of the same color are connected to each other by the wiring patterns 60 formed on each layer. For example, in the example shown in FIG. 14, the green LEDs 30G7 to 30G9 of the same color are connected by the wiring patterns 60 as follows. That is, in the range shown in FIG. 14, the power supplied from the external electrode 51 is first transmitted to the diagonal wiring portion 66G formed on the second layer 42. 67 , via 62G formed in the first layer 41 71 and electrode pad wiring portion 61G 71 One electrode 31G of the green LED 30G7 71 The green LED 30G7 is connected to the other electrode 31G 72 The electrode pad wiring portion 61G of the first layer 41 is 72 and the electrode pad wiring portion 61G 72 Via 62G 72 , the vertical wiring portion 67G of the second layer 42 78 Vertical wiring section 67G 78 extends in the Y-axis direction in the second layer 42, and the via 62G 78 through the horizontal wiring portion 64G of the first layer 41. 78 Also, the horizontal wiring section 64G 78 One electrode 31G of the green LED 30G8 81 By connecting it to the green LED30G8, it is connected to the green LED30G8.

[0036] Similarly, the green LED 30G8 has the other electrode 31G 82 Electrode pad wiring portion 61G of the first layer 41 82 and the electrode pad wiring portion 61G 82 Via 62G 82 , and the diagonal wiring portion 66G of the second layer 42. 89 Diagonal wiring part 66G 89 extends in an oblique direction in a top view in the second layer 42, and the via 62G 91 Electrode pad wiring portion 61G of the first layer 41 91 and connect one electrode 31G of the green LED 30G9 to 91 The green LED 30G9 is connected to the other electrode 31G. 92 Electrode pad wiring portion 61G of the first layer 41 92 and the electrode pad wiring portion 61G 92 Via 62G 92 , and the diagonal wiring portion 66G of the second layer 42. 910 By connecting with, green LED 30G 10 will be connected to.

[0037] In this manner, in this embodiment, by forming the horizontal wiring section 64 extending in the X-axis direction and the diagonal wiring section 66 and vertical wiring section 67 extending in a diagonal direction in separate layers, it is possible to form the wiring patterns 60 while keeping the arrangement pitch P1 of the LEDs 30 small, even when forming wiring patterns 60 corresponding to each of the six colors of LEDs 30.

[0038] In the present embodiment, the LED light source module 10 is formed with separate external electrodes 50 and wiring patterns 60 for each color of the LEDs 30, so that the current values ​​of the multiple types of LEDs 30 that emit different colors can be individually controlled to change the color variations to tens of thousands of ways. For example, as shown in FIG. 15, for the green LEDs 30G, the wiring pattern 60G for connecting the green LEDs 30G is wired so as to connect the external electrodes 51G to 54G for the green LEDs 30G and the green LEDs 30G in series, and between the green LEDs 30G, so that the green LED group consisting of the multiple green LEDs 30G is configured with a wiring pattern independent from the LEDs 30 of other colors. Similarly, the blue LEDs 30B, light blue LEDs 30S, purple LEDs 30V, green LEDs 30G, and red LEDs 30R are also connected with independent wiring patterns for the LED groups consisting of LEDs of the same color. Note that FIG. 15 is a diagram for explaining a wiring method of the wiring pattern on the entire light-emitting surface.

[0039] In this embodiment, the wiring pattern 60 for the LED groups of the same color is formed in two parts, the left half and the right half of the light-emitting surface. For example, in this embodiment, as shown in FIG. 15, the LED groups of each color arranged in the left half (the LEDs 30 in the first to sixth rows from the left) form a first line L1 connected in series between the external electrodes 51 and 52. Also, the LED groups of each color arranged in the right half (the LEDs 30 in the first to sixth rows from the right) form a second line L2 connected in series between the external electrodes 53 and 54 for each color. Specifically, in the example shown in FIG. 15, the green LED group is connected to the external electrode 51 at one end, and the green LEDs 30G1 to 30G 10 are connected in series, and then the green LED group of the first line L1 connected at one end to the external electrode 52 and the green LED 30G 11 ~30G 20 are sequentially connected in series, and then the other end of the green LEDs of the second line L2 are connected to the external electrode 54.

[0040] In this embodiment, as shown in FIG. 14, the LEDs 30 of the same color in the first block B1 and the second block B2 are divided into a first line L1 in which the LEDs 30 are connected in series between the external electrodes 51 and 52, and the LEDs 30 of the same color in the third block B3 and the fourth block B4 are divided into a second line L2 in which the LEDs 30 are connected in series between the external electrodes 53 and 54, and the LEDs 30 are connected in two parallel lines as the LED light source module 10. However, the present invention is not limited to this configuration. The LEDs 30 of the same color may be connected in series between the external electrodes 51 and 52 without being divided (by connecting the LEDs 30 in the second block B2 and the LEDs 30 in the third block B3 shown in FIG. 14). The LED light source module 10 may be configured to have one group of LEDs 30 connected in parallel, or may be configured to have four groups of LEDs 30 connected in parallel, divided into a first line L1 in which the LEDs 30 of the same color in the first block B1 are connected in series between the external electrodes 51 and 53, a second line L2 in which the LEDs 30 of the same color in the second block B2 are connected in series between the external electrodes 51 and 53, a third line L3 in which the LEDs 30 of the same color in the third block B3 are connected in series between the external electrodes 52 and 54, and a fourth line L4 in which the LEDs 30 of the same color in the fourth block B4 are connected in series between the external electrodes 52 and 54. In the present embodiment, the number of LEDs 30 per line is 10, but is not limited to this configuration, and may be less than 9 or 11 or more, for example.

[0041] As described above, the LED light source module 10 according to this embodiment has the LEDs 30 of multiple colors and the LED mounting substrate 40 of a multi-layer structure, the LEDs 30 of multiple colors are two-dimensionally arranged in a lattice shape without being adjacent to the LEDs 30 of the same color, and the LEDs 30 of the same color are connected to each other by a wiring pattern 60 having a horizontal wiring portion 64 formed on the first layer 41 and a diagonal wiring portion 66 formed on the second layer 42. Moreover, the diagonal wiring portion 66 and the vertical wiring portion 67 extend in a direction (second direction) intersecting the X-axis direction (first direction) in which the LEDs 30 of multiple colors are arranged, thereby passing under the LEDs 30 of other colors and connecting the LEDs 30 of the same color by a straight-line distance. As a result, in the LED mounting board 40 according to this embodiment, even when LEDs 30 of four or more colors are mounted, a plurality of diagonal wiring sections 66 corresponding to the LEDs 30 of the plurality of colors can be formed in a small area in the same layer, so that the arrangement pitch P1 between the LEDs 30 can be made smaller while suppressing the number of layers of the LED mounting board 40, and the density of the LEDs 30 can be increased. As a result, the size of the LED light source module 10 can be reduced, and the size of the entire LED lighting device 1 can be reduced.

[0042] In the LED light source module 10 according to this embodiment, the diagonal wiring section 66 extends in a diagonal direction (second direction) in top view with respect to the arrangement direction of the LEDs 30 for each block, so that the LEDs 30 arranged in the rightmost row and the LEDs 30 arranged in the leftmost row in each block must be separately connected. Therefore, in this embodiment, by extending the horizontal wiring section 64 in the X-axis direction which is the arrangement direction of the LEDs 30 of multiple colors, the LEDs 30 of the same color can be connected to each other via the horizontal wiring section 64, and even when there are four or more colors of LEDs 30, the LEDs 30 of the same color can be connected to each other via the horizontal wiring section 64 and the diagonal wiring section 66.

[0043] Although the preferred embodiment of the present invention has been described above, the technical scope of the present invention is not limited to the description of the above embodiment. Various modifications and improvements can be made to the above embodiment, and such modifications and improvements are also included in the technical scope of the present invention.

[0044] For example, in the above-mentioned embodiment, a configuration having six colors of LEDs 30 is illustrated, but the present invention is not limited to this configuration, and a configuration having less than six colors of LEDs 30, such as four colors, or a configuration having six or more colors of LEDs 30, such as eight colors, may be used. Here, FIG. 16 is a plan view showing an example of an LED light source module 10a using eight colors of LEDs 30. In the example shown in FIG. 16, the LEDs 30 of multiple colors are also two-dimensionally arranged so that they are not adjacent to the LEDs 30 of the same color. Also, in the example shown in FIG. 16, the eight colors of LEDs 30 are arranged as a color basic array SA, and in adjacent rows, the LEDs 30 of the same color are arranged so as to be shifted by three LEDs in the Y-axis forward direction. For example, in the example shown in FIG. 16, the color basic array SA4 and the color basic array SA5 of the row adjacent thereto are arranged so as to be shifted by three LEDs in the Y-axis forward direction, as shown by D3, and similarly in other rows, the LEDs 30 of the same color are arranged so as to be shifted by three LEDs in the Y-axis forward direction. In this case, the LEDs 30 of the same color can be connected to each other by the diagonal wiring portion 66, and the diagonal wiring portion 66 corresponding to each color can be arranged in the Y-axis direction, so that even when the wiring patterns 60 for eight colors are used, the wiring patterns 60 can be formed without widening the arrangement pitch P1 between the LEDs 30. Furthermore, in the above-mentioned embodiment, as shown in FIG. 5, a configuration in which adjacent color basic arrays SA are arranged with a shift in the Y-axis direction is illustrated, but the amount of shift in the Y-axis direction is not limited to the distance D1, D2 equivalent to two LEDs 30, and the LEDs 30 can be arranged with a shift of one, four, or five LEDs 30. Similarly, in the example shown in FIG. 16, a configuration in which adjacent color basic arrays SA are arranged with a shift in the Y-axis direction by a distance D3 equivalent to three LEDs 30, but the configuration is not limited to this, and the LEDs 30 can be arranged with a shift of one, two, or any of four to seven LEDs 30.

[0045] Furthermore, in the above-described embodiment, a configuration in which the wiring pattern 60 is formed with three rows of LEDs 30 as one block has been exemplified, but the number of rows per block is not limited, and for example, the LEDs 30 can be configured as one block for four rows.

[0046] In addition, in the above-mentioned embodiment, the configuration in which the horizontal wiring portion 64 extending in the X-axis direction is formed is exemplified, but the present invention is not limited to this configuration. For example, as shown in FIG. 17 and FIG. 18, a configuration in which the diagonal wiring portion 68 is formed instead of the horizontal wiring portion 64 can be used. FIG. 17 is a diagram showing an example of the wiring pattern 60 of the first layer 41 according to another embodiment. FIG. 18 is a diagram showing the wiring patterns 60 of the first layer 41 and the second layer 42 according to another embodiment superimposed, and is a diagram showing the wiring pattern 60 from the second layer 42 side toward the first layer 41 side. As shown in FIG. 17 and FIG. 18, even when the diagonal wiring portion 68 extending in a diagonal direction in a top view crossing the extending direction of the diagonal wiring portion 66 is formed in the first layer 41, the same effect as the above-mentioned embodiment having the horizontal wiring portion 64 can be achieved. 17 and 18, by forming the diagonal wiring portion 68, the vertical wiring portion 67 is not required in the second layer 42, and therefore the vias 62 for connecting the horizontal wiring portion 64 and the vertical wiring portion 67 are also not required. In addition, by shortening the length of the electrode pad wiring portion 61 in the X-axis direction, the diagonal wiring portion 68 can be formed more easily and over a shorter distance.

[0047] FIG. 19 is a side cross-sectional view of an LED light source module 10C according to a comparative example. In the following, the same structures as those in the above-mentioned embodiment are denoted by the same reference numerals, and detailed description is omitted. As shown in FIG. 19, the LED light source module 10C is different from the LED light source module 10 according to the first embodiment in that it has a cover layer 80C as a structure corresponding to the cover ceramic 80. Furthermore, the LED light source module 10C is different from the LED light source module 10 according to the first embodiment in that a via 65 is provided as a conductor penetrating the cover layer 80C instead of the solder 70. The cover layer 80C is a layer formed by firing a ceramic sheet, similar to the first layer 41 and the second layer 42.

[0048] The LED light source module 10C according to the comparative example has a structure similar to that of the LED light source module 10 of the present application and can provide similar effects, but has a disadvantage in that the laminated structure is thick, making the structure inferior to the LED light source module 10 of the present application. In addition, the LED light source module 10C according to the comparative example has a via 65 penetrating the cover layer 80C instead of the solder 70, and therefore has a structure inferior to the LED light source module 10 of the present application in which the solder 70 is provided at the same time as the mounting operation of attaching the LED 30 to the LED mounting board 40. [Explanation of symbols]

[0049] 1...LED lighting device 100...Control unit 110…Color rendering controller 120…LED dimming control unit 200…Lighting section 10, 10a, 10b, 10C...LED light source module 20…Heat sink 30…LED 31...LED electrode 40, 40C…LED mounting board 41…1st layer 42…Second layer 50,51~54...External electrode 60...Wiring pattern 61...Electrode pad wiring section 62,65…Beer 64...Horizontal wiring section 66...Diagonal wiring section 67…Vertical wiring section 68...Diagonal wiring section 70…Solder 80,80C…Cover ceramic 81...Opening

Claims

1. An LED light source module comprising: an LED mounting substrate having a multi-layer structure in which LEDs of a plurality of colors are mounted in a two-dimensional array in an X direction and a Y direction without being adjacent to LEDs of the same color; and the LEDs of the plurality of colors mounted on the LED mounting substrate, The LED mounting substrate is A laminate structure including two layers, a first layer and a second layer disposed below the first layer, In order to connect LEDs of the same color, wiring patterns are formed for each color. the wiring pattern has a first wiring portion formed on one of the first layer and the second layer, a second wiring portion formed on the other layer and extending in a diagonal direction when viewed from above intersecting with the X-direction or the Y-direction, and a via electrically connecting the first wiring portion and the second wiring portion.

2. 2. The LED light source module for a presentation space such as a theater according to claim 1, wherein the second wiring portions corresponding to the respective colors are formed in parallel in an X direction or a Y direction.

3. 2. The LED light source module for a performance space such as a theater as described in claim 1, wherein the LEDs of the multiple colors are arranged in a fixed color order in the Y direction, and between adjacent rows in the X direction, LEDs of the same color are arranged with a shift in the Y direction.

4. the first wiring section is configured with a plurality of first-color unit wiring patterns that connect LEDs of the same color in series and extend in a first direction on the same plane, 2. The LED light source module for a performance space such as a theater as described in claim 1, wherein the second wiring section is composed of a plurality of second-color unit wiring patterns in which LEDs of the same color are connected in series and which extend in a second direction intersecting with the first direction on the same plane.

5. The LEDs of the multiple colors include a plurality of first LEDs and a plurality of second LEDs that emit light of a wavelength range different from that of the first LEDs, 2. The LED light source module for a performance space such as a theater according to claim 1, wherein the first wiring portion connecting the plurality of first LEDs intersects with the second wiring portion connecting the plurality of second LEDs in a different layer.

6. 2. The LED light source module for a performance space such as a theater according to claim 1, wherein the second wiring portion passes under the arrangement positions of the LEDs of the other colors in a diagonal direction when viewed from above, electrically connecting the LEDs of the same color to each other.

7. A lighting unit having an LED light source module for a performance space such as a theater according to any one of claims 1 to 6; A control unit that controls the lighting by the lighting unit.

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