Processing system

Abstract

To provide a processing system capable of appropriately processing objects.MEANS: A processing system includes: a processing device capable of performing an additional process on a plurality of objects; and a control device that can control the processing device. On the basis of a result of a first measurement operation for measuring a shape of a first object of the plurality of objects, the control device generates first processing control information for controlling the processing device so as to perform an additional process on the first object. On the basis of the first processing control information, the processing device performs the additional process on the first object and an additional process on a second object of the plurality of objects, which is different from the first object.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to the technical field of, for example, a processing system for processing an object. [Background technology]

[0002] An example of a processing system for processing an object is described in Patent Document 1. In such a processing system, a technical challenge is to adopt a structure for efficiently processing the object. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Pat. No. 8,636,496 Summary of the Invention

[0004] According to a first aspect, a processing system is provided, comprising a processing device capable of performing additional processing on a plurality of objects, and a control device capable of controlling the processing device, wherein the control device generates first processing control information for controlling the processing device to perform additional processing on the first object based on results of a first measurement operation for measuring the shape of a first object among the plurality of objects, and the processing device performs additional processing on the first object and additional processing on a second object different from the first object among the plurality of objects based on the first processing control information.

[0005] According to a second aspect, a processing system is provided, comprising a processing device capable of repairing and processing a plurality of objects, and a control device capable of controlling the processing device, wherein the control device generates first processing control information for controlling the processing device to process the first object based on at least one of shape information regarding the post-repair shape of a first object among the plurality of objects and measurement results of the shape of the first object, and the processing device repairs and processes the first object and a second object different from the first object among the plurality of objects based on the first processing control information.

[0006] According to a third aspect, a processing system is provided, comprising a processing device capable of repairing multiple locations on an object, and a control device capable of controlling the processing device, wherein the control device generates first processing control information for controlling the processing device to process the first location based on at least one of shape information regarding the post-repair shape of a first location among the multiple locations and measurement results of the shape of the first location, and the processing device repairs the first location and a second location among the multiple locations, different from the first location, based on the first processing control information.

[0007] According to a fourth aspect, a processing system is provided, comprising a processing device capable of additional processing on a plurality of workpieces, and a control device capable of controlling the processing device, wherein the control device generates first processing control information for controlling the processing device to process the first workpiece based on at least one of shape information regarding the shape of a model of a first object formed on the plurality of workpieces and a measurement result of the shape of a first workpiece among the plurality of workpieces, and the processing device repairs and processes the first workpiece and a second workpiece different from the first workpiece among the plurality of objects based on the first processing control information.

[0008] According to a fifth aspect, there is provided a processing system comprising a processing device capable of processing a plurality of objects and a control device capable of controlling the processing device, wherein the control device generates first processing control information for controlling the processing device to perform processing on the first object based on a result of a first measurement operation for measuring a shape of a first object among the plurality of objects, and the processing device performs processing on the first object and processing on a second object different from the first object among the plurality of objects based on the first processing control information.

[0009] According to a sixth aspect, there is provided a processing system comprising a processing device capable of performing additional processing on a plurality of objects, and a control device capable of controlling the processing device, wherein the control device generates first processing control information for controlling the processing device to perform additional processing on the first object based on results of a first measurement operation for measuring a shape of a first object among the plurality of objects, and the processing device performs additional processing on the first object and additional processing on a second object different from the first object among the plurality of objects based on the first processing control information.

[0010] According to a seventh aspect, there is provided a processing system comprising a processing device capable of repairing and processing a plurality of objects, and a control device capable of controlling the processing device, wherein the control device generates first processing control information for controlling the processing device to process the first object based on at least one of shape information regarding the post-repair shape of a first object among the plurality of objects and measurement results of the shape of the first object, and the processing device repairs and processes the first object and a second object different from the first object among the plurality of objects based on the first processing control information.

[0011] According to an eighth aspect, there is provided a processing system comprising a processing device capable of repairing multiple locations on an object, and a control device capable of controlling the processing device, wherein the control device generates first processing control information for controlling the processing device to process the first location based on at least one of shape information regarding the post-repair shape of a first location among the multiple locations and measurement results of the shape of the first location, and the processing device repairs the first location and a second location among the multiple locations, different from the first location, based on the first processing control information.

[0012] According to a 9th aspect, there is provided a processing system comprising a processing device capable of additional processing on a plurality of workpieces, and a control device capable of controlling the processing device, wherein the control device generates first processing control information for controlling the processing device to process the first workpiece based on at least one of shape information regarding the shape of a model of a first object formed on the plurality of workpieces and a measurement result of the shape of a first workpiece among the plurality of workpieces, and the processing device repairs and processes the first workpiece and a second workpiece different from the first workpiece among the plurality of objects based on the first processing control information.

[0013] According to a tenth aspect, there is provided a processing system including a processing device capable of processing a plurality of objects, and a control device capable of controlling the processing device, wherein the control device generates first processing control information for controlling the processing device to perform processing on the first object based on a result of a first measurement operation for measuring a shape of a first object among the plurality of objects, and the processing device performs processing on the first object and processing on a second object different from the first object among the plurality of objects based on the first processing control information. is provided.

[0014] The functions and other advantages of the present invention will become apparent from the following detailed description of the preferred embodiments. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is a block diagram showing a system configuration of a machining system according to the present embodiment. [Diagram 2] FIG. 2 is a cross-sectional view showing the structure of the processing system of the present embodiment. [Diagram 3] FIG. 3 is a cross-sectional view showing the structure of the processing system of the present embodiment. [Figure 4] Each of Fig. 4(a) to Fig. 4(e) is a cross-sectional view showing a state in which a certain area on a workpiece is irradiated with processing light and a modeling material is supplied. [Diagram 5] Each of Figures 5(a) to 5(c) is a cross-sectional view showing a process for fabricating a three-dimensional structure. [Figure 6] FIG. 6 is a flowchart showing the flow of operations for performing additional machining on a plurality of workpieces. [Figure 7] FIG. 7 is a perspective view showing a plurality of workpieces placed on a stage. [Figure 8] FIG. 8 is a cross-sectional view showing a plurality of workpieces placed on a stage. [Figure 9] FIG. 9 is a cross-sectional view showing a plurality of workpieces placed on a stage. [Figure 10] FIG. 10 shows a schematic diagram of a three-dimensional model used in the process of generating the processing control information. [Figure 11] FIG. 11 is a cross-sectional view showing a plurality of workpieces on which additional machining has been performed. [Figure 12] FIG. 12 is a flowchart showing the flow of a first modified example of the operation for performing additional machining on a plurality of workpieces. [Figure 13] FIG. 13 is a flowchart showing the flow of a second modified example of the operation for performing additional machining on a plurality of workpieces. [Figure 14] FIG. 14 is a flowchart showing the flow of a third modified example of the operation for performing additional machining on a plurality of workpieces. [Figure 15] FIG. 15 is a flowchart showing the flow of a fourth modified example of the operation for performing additional machining on a plurality of workpieces. [Figure 16]FIG. 16 is a cross-sectional view showing the supply paths of the modeling material from multiple material nozzles. [Figure 17] FIG. 17 is a graph showing the relationship between the distance between the printing surface and the material nozzle and the printing volume. [Figure 18] FIG. 18 shows a number of workpieces before additive processing is performed, the distance between the number of workpieces and the material nozzle, the molding volume for the number of workpieces, and the number of workpieces after additive processing is performed. [Figure 19] FIG. 15 is a flowchart showing the flow of a sixth modified example of the operation for performing additional machining on a plurality of workpieces. [Figure 20] Figure 20(a) is a cross-sectional view showing the positional relationship between the machining head and multiple workpieces before the posture of the multiple workpieces is changed, and Figure 20(b) is a cross-sectional view showing the positional relationship between the machining head and multiple workpieces after the posture of the multiple workpieces is changed. [Figure 21] Figure 21(a) is a cross-sectional view showing the positional relationship between the machining head and multiple workpieces before the posture of the multiple workpieces is changed, and Figure 21(b) is a cross-sectional view showing the positional relationship between the machining head and multiple workpieces after the posture of the multiple workpieces is changed. [Figure 22] FIG. 22 is a cross-sectional view showing a plurality of workpieces placed on a stage. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Hereinafter, an embodiment of a processing method and a processing system will be described with reference to the drawings. Hereinafter, an embodiment of a processing method and a processing system will be described using a processing system SYS capable of processing a workpiece W, which is an example of an object. In particular, below, an embodiment of a processing method and a processing system will be described using a processing system SYS that performs additional processing based on a laser metal deposition (LMD). The additional processing based on the laser metal deposition is an additional processing that forms a shaped object that is integrated with the workpiece W or that can be separated from the workpiece W by melting a forming material M supplied to the workpiece W with processing light EL (i.e., an energy beam having the form of light). However, the processing system SYS may perform additional processing based on a method other than the laser metal deposition. Alternatively, the processing system SYS may perform any processing (e.g., removal processing) other than the additional processing.

[0017] Laser metal deposition (LMD) may also be called direct metal deposition, directed energy deposition, laser cladding, laser engineered net shaping, direct light fabrication, laser consolidation, shape deposition manufacturing, wire-feed laser deposition, gas through wire, laser powder fusion, laser metal forming, selective laser powder remelting, laser direct casting, laser powder deposition, laser additive manufacturing, and laser rapid forming.

[0018] In the following description, the positional relationship of various components constituting the machining system SYS will be described using an XYZ orthogonal coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis. For convenience of explanation, the X-axis direction and the Y-axis direction are each assumed to be horizontal (i.e., a predetermined direction in a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). The rotation directions (in other words, tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. The XY plane may be the horizontal direction.

[0019] (1) Structure of the machining system SYS First, the structure of the machining system SYS of the present embodiment will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is a system configuration diagram showing the system configuration of the machining system SYS of the present embodiment. Fig. 2 and Fig. 3 are each a cross-sectional view showing a schematic structure of the machining system SYS of the present embodiment.

[0020] The processing system SYS is capable of performing additional processing on the workpiece W. The processing system SYS is capable of forming a shaped object that is integrated with (or separable from) the workpiece W by performing additional processing on the workpiece W. In this case, the additional processing performed on the workpiece W corresponds to processing that adds a shaped object that is integrated with (or separable from) the workpiece W to the workpiece W. Note that the shaped object in this embodiment may mean any object formed by the processing system SYS. For example, the processing system SYS is capable of forming a three-dimensional structure ST (that is, a three-dimensional object that has a size in all three-dimensional directions, a solid object, in other words, an object that has a size in the X-axis direction, the Y-axis direction, and the Z-axis direction) as an example of a shaped object.

[0021] When the workpiece W is the stage 31 described below, the processing system SYS can perform additional processing on the stage 31. When the workpiece W is a placed object, which is an object placed on the stage 31, the processing system SYS can perform additional processing on the placed object. The placed object placed on the stage 31 may be another three-dimensional structure ST (i.e., an existing structure) formed by the processing system SYS. Note that FIG. 1 shows an example in which the workpiece W is an existing structure held by the stage 31. Also, the following description will be given using an example in which the workpiece W is an existing structure held by the stage 31.

[0022] The workpiece W may be an item that has a defect and needs to be repaired. In this case, the processing system SYS may perform repair processing to repair the item that needs to be repaired by performing additional processing to form a shaped object to compensate for the defect. In other words, the additional processing performed by the processing system SYS may include additional processing to add a shaped object to the workpiece W to compensate for the defect.

[0023] As described above, the processing system SYS is capable of performing additive processing based on the laser build-up welding method. In other words, the processing system SYS can be said to be a 3D printer that uses additive manufacturing technology to create objects. The additive manufacturing technology may also be called rapid prototyping, rapid manufacturing, or additive manufacturing.

[0024] The processing system SYS performs additional processing by processing the modeling material M using the processing light EL. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. However, other materials other than the metallic material and the resinous material may be used as the modeling material M. The modeling material M is a powder or granular material. In other words, the modeling material M is a powdered granular material. However, the modeling material M does not have to be a powdered granular material. For example, at least one of a wire-shaped modeling material and a gaseous modeling material may be used as the modeling material M.

[0025] 1 to 3 , in order to perform additive processing, the processing system SYS includes a material supply source 1, a processing unit 2, a stage unit 3, a measuring device 4, a light source 5, a gas supply source 6, and a control device 7. The processing unit 2 and the stage unit 3 may be housed in the internal space of a housing 8.

[0026] The material supply source 1 supplies the modeling material M to the processing unit 2. The material supply source 1 supplies a desired amount of modeling material M according to a required amount so that the amount of modeling material M required per unit time for performing additional processing is supplied to the processing unit 2.

[0027] The processing unit 2 processes the modeling material M supplied from the material supply source 1 to form a model. In order to form the model, the processing unit 2 includes a processing head 21 and a head drive system 22. Furthermore, the processing head 21 includes an irradiation optical system 211 and a material nozzle (i.e., a supply system that supplies the modeling material M) 212. In the example shown in FIG. 1, the processing head 21 includes multiple material nozzles 212 (two material nozzles 212 in FIG. 1), but the processing head 21 may also include a single material nozzle 212.

[0028] The irradiation optical system 211 is an optical system (for example, a focusing optical system) for emitting the processing light EL from the emission unit 213. Specifically, the irradiation optical system 211 is optically connected to the light source 5 that emits the processing light EL via an optical transmission member 51 such as an optical fiber or a light pipe. The irradiation optical system 211 emits the processing light EL propagated from the light source 5 via the optical transmission member 51. The irradiation optical system 211 irradiates the processing light EL downward (i.e., toward the -Z side) from the irradiation optical system 211. A stage 31 is disposed below the irradiation optical system 211. When a workpiece W is placed on the stage 31, the irradiation optical system 211 irradiates the processing light EL, which is an energy beam, toward the workpiece W. For this reason, the irradiation optical system 211 may be referred to as an energy beam irradiation unit. Specifically, the irradiation optical system 211 can irradiate the processing light EL to a target irradiation area EA that is set on or near the workpiece W as an area where the processing light EL is irradiated (typically, condensed). Furthermore, the state of the irradiation optical system 211 can be switched between a state in which the processing light EL is irradiated onto the target irradiation area EA and a state in which the processing light EL is not irradiated onto the target irradiation area EA under the control of the control device 7. Note that the direction of the processing light EL emitted from the irradiation optical system 211 is not limited to directly below (i.e., coinciding with the -Z axis direction), and may be, for example, a direction inclined by a predetermined angle with respect to the Z axis.

[0029] The material nozzle 212 is formed with a supply outlet 214. The material nozzle 212 supplies (e.g., ejects, jets, spouts, or sprays) the modeling material M from the supply outlet 214. For this reason, the material nozzle 212 may be referred to as a material supply unit. The material nozzle 212 is physically connected to the material supply source 1, which is a supply source of the modeling material M, via the supply pipe 11 and the mixer 12. The material nozzle 212 supplies the modeling material M supplied from the material supply source 1 via the supply pipe 11 and the mixer 12. The material nozzle 212 may pressure-feed the modeling material M supplied from the material supply source 1 via the supply pipe 11. That is, the modeling material M from the material supply source 1 and the conveying gas (i.e., a pressure-feed gas, for example, an inert gas such as nitrogen or argon) may be mixed in the mixer 12 and then pressure-feed to the material nozzle 212 via the supply pipe 11. As a result, the material nozzle 212 supplies the modeling material M together with the conveying gas. As the gas for conveyance, for example, a purge gas supplied from the gas supply source 6 is used. However, as the gas for conveyance, a gas supplied from a gas supply source other than the gas supply source 6 may be used. Although the material nozzle 212 is depicted in a tube shape in FIG. 1, the shape of the material nozzle 212 is not limited to this shape. The material nozzle 212 supplies the modeling material M from the material nozzle 212 downward (i.e., toward the -Z side). The stage 31 is disposed below the material nozzle 212. When the workpiece W is mounted on the stage 31, the material nozzle 212 supplies the modeling material M toward the workpiece W or the vicinity of the workpiece W. The traveling direction of the modeling material M supplied from the material nozzle 212 is a direction inclined at a predetermined angle (as an example, an acute angle) with respect to the Z-axis direction, but may be the -Z side (i.e., directly below).

[0030] In this embodiment, the material nozzle 212 supplies the modeling material M to a portion irradiated with the processing light EL from the irradiation optical system 211. That is, the material nozzle 212 supplies the modeling material M to a target irradiation area EA to which the irradiation optical system 211 irradiates the processing light EL. For this reason, the material nozzle 212 and the irradiation optical system 211 are aligned so that a target supply area MA, which is set on or near the workpiece W as an area to which the material nozzle 212 supplies the modeling material M, coincides with (or at least partially overlaps with) the target irradiation area EA. The material nozzle 212 may supply the modeling material M to a molten pool MP (see FIG. 4, etc., which will be described later) formed by the processing light EL emitted from the irradiation optical system 211. However, the material nozzle 212 may not supply the modeling material M to the molten pool MP. For example, the processing system SYS may melt the modeling material M from the material nozzle 212 by the irradiation optical system 211 before the modeling material M reaches the workpiece W, and attach the molten modeling material M to the workpiece W.

[0031] The head drive system 22 moves the processing head 21. The head drive system 22 moves the processing head 21, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. In the example shown in FIG. 2 to FIG. 3, the head drive system 22 moves the processing head 21 along each of the X-axis, Y-axis, and Z-axis. In this case, the head drive system 22 may include a head drive system 22X, a head drive system 22Y, and a head drive system 22Z. The head drive system 22X moves the processing head 21 along the X-axis. The head drive system 22Y moves the processing head 21 along the Y-axis. The head drive system 22Z moves the processing head 21 along the Z-axis.

[0032] Head driving system 22Y includes Y guide member 221Y connected to support frame 224 installed on the bottom surface of housing 8 (or a base placed on the bottom surface of housing 8) via an anti-vibration device such as an air spring and extending along the Y axis, Y slide member 222Y movable along Y guide member 221Y, and a motor (not shown) for moving Y slide member 222Y. Head driving system 22X includes X guide member 221X connected to Y slide member 222Y and extending along the X axis, X slide member 222X movable along X guide member 221X, and a motor (not shown) for moving X slide member 222X. Head driving system 22Z includes Z guide member 221Z connected to X slide member 222X and extending along the Z axis, Z slide member 222Z movable along Z guide member 221Z, and a motor (not shown) for moving Z slide member 222Z. The machining head 21 is connected to the Z slide member 222Z. When the Y slide member 222Y moves along the Y guide member 221Y, the machining head 21 connected to the Y slide member 222Y via the head drive systems 22X and 22Z moves along the Y axis. When the X slide member 222X moves along the X guide member 221X, the machining head 21 connected to the X slide member 222X via the head drive system 22Z moves along the X axis. When the Z slide member 222Z moves along the Z guide member 221Z, the machining head 21 connected to the Z slide member 222Z moves along the Z axis.

[0033] When the head drive system 22 moves the machining head 21, the relative positions of the machining head 21, the stage 31, and the workpiece W placed on the stage 31 change. Therefore, the head drive system 22 may function as a position changing device for changing the relative positional relationship between the machining head 21, the stage 31, and the workpiece W. Furthermore, when the relative positions of the machining head 21, the stage 31, and the workpiece W change, the target irradiation area EA and the target supply area MA (and further, the molten pool MP) move relative to the workpiece W.

[0034] The stage unit 3 includes a stage 31 and a stage drive system 32 .

[0035] A workpiece W, which is an object, is placed on the stage 31. Therefore, the stage 31 may be referred to as an object placement device. Specifically, the workpiece W is placed on a placement surface 311, which is at least a part of the upper surface of the stage 31. The stage 31 is capable of supporting the workpiece W placed on the stage 31. The stage 31 may be capable of holding the workpiece W placed on the stage 31. In this case, the stage 31 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, and the like, in order to hold the workpiece W. Alternatively, the stage 31 may not be capable of holding the workpiece W placed on the stage 31. In this case, the workpiece W may be placed on the stage 31 in a clampless manner. The above-mentioned irradiation optical system 211 emits the processing light EL during at least a part of the period during which the workpiece W is placed on the stage 31. Furthermore, the above-mentioned material nozzle 212 supplies the modeling material M during at least a part of the period during which the workpiece W is placed on the stage 31.

[0036] In this embodiment, the stage 31 includes a stage 31θX and a stage 31θZ. The reason why the stage 31 includes the stage 31θX and the stage 31θZ is to move the stage 31 along the θX direction and the θZ direction by a stage driving system 32 described later, as will be described in detail later. The workpiece W is placed on the stage 31θZ. For this reason, at least a part of the upper surface of the stage 31θZ is used as a mounting surface 311 on which the workpiece W is placed. The stage 31θX is movable along the θX direction by the stage driving system 32, as will be described later (i.e., rotatable around a rotation axis along the X-axis). The stage 31θZ is disposed in a recess formed in the stage 31θX so as to be rotatable around a rotation axis along the X-axis together with the stage 31θX in accordance with the rotation of the stage 31θX. As described below, stage 31θZ is disposed in a recess formed in stage 31θX so that it can be moved along the θZ direction by stage drive system 32 regardless of the rotation of stage 31θX (i.e., can rotate around a rotation axis along the Z axis). Note that the configuration of stage 31 is not limited to the configuration shown in Figures 2 and 3. As an example, stage 31θZ does not have to be disposed in a recess formed in stage 31θX.

[0037] The stage driving system 32 moves the stage 31. For example, the stage driving system 32 moves the stage 31 along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. The operation of moving the stage 31 along at least one of the θX direction, θY direction, and θZ direction is equivalent to the operation of changing the attitude of the stage 31 relative to the processing head 21 (and further the attitude of the workpiece W placed on the stage 31) by rotating the stage 31 around at least one of the rotation axis along the X-axis, the rotation axis along the Y-axis, and the rotation axis along the Z-axis. For this reason, the stage driving system 32 may be referred to as an attitude changing device. In the example shown in FIG. 2 to FIG. 3, the stage driving system 32 moves the stage 31 along each of the θX direction and the θZ direction. That is, the stage driving system 32 rotates the stage 31 around the rotation axis along the X-axis and rotates the stage 31 around the rotation axis along the Z-axis. In this case, the stage driving system 32 may include a stage driving system 32θX and a stage driving system 32θZ. The stage driving system 32θX rotates the stage 31 (particularly, the stage 31θX) around a rotation axis along the X-axis. The stage driving system 32θZ rotates the stage 31 (particularly, the stage 31θZ) around a rotation axis along the Z-axis. The stage driving system 32θX includes a pair of rotating shafts 321θX rotatably connected to a pair of support frames 323 installed on the bottom surface of the housing 8 (or a surface plate arranged on the bottom surface of the housing 8) via a vibration isolator such as an air spring, and a motor 322θX which is a driving device that rotates the pair of rotating shafts 321θX around a rotation axis along the X-axis. The pair of rotating shafts 321θX extend along the X-axis direction. The pair of rotating shafts 321θX are connected to the stage 31θX so as to sandwich the stage 31θX along the X-axis direction. The stage drive system 32θZ includes a rotating shaft 321θZ that extends along the Z-axis direction and is connected to the bottom surface of the stage 31θZ (specifically, the surface facing the stage 31θX), and a motor 322θZ that rotates the rotating shaft 321θZ about a rotation axis along the Z-axis. When the pair of rotating shafts 321θX rotate, the stage 31θX rotates about a rotation axis along the X-axis.As a result, the stage 31θZ supported by the stage 31θX (and further, the workpiece W supported by the stage 31θZ) also rotates about a rotation axis along the X-axis. When the rotating shaft 321θZ rotates, the stage 31θZ (and further, the workpiece W supported by the stage 31θZ) also rotates about a rotation axis along the Z-axis. Note that the stage 31 shown in FIGS. 2 and 3 has a double-supported structure in which the stage 31θX is supported from both sides by the support frame 323. However, the stage 31 may have a cantilevered structure in which the stage 31θX is supported from one side by the support frame 323.

[0038] When the stage drive system 32 moves the stage 31, the relative positions of the machining head 21 and the stage 31 and the workpiece W placed on the stage 31 change. For this reason, the stage drive system 32 may function as a position changing device for changing the relative positional relationship between the machining head 21 and the stage 31 and the workpiece W. Furthermore, when the relative positions of the machining head 21 and the stage 31 and the workpiece W change, the target irradiation area EA and the target supply area MA (and further, the molten pool MP) move relative to the workpiece W.

[0039] The operation of rotating the stage 31 around the rotation axis may be considered to be substantially equivalent to an operation of changing the attitude of the stage 31 (for example, changing the relative attitude of the stage 31 with respect to the machining head 21). Therefore, the stage drive system 32 may function as a position changing device for changing the relative positional relationship between the machining head 21 and each of the stage 31 and the workpiece W by changing the relative attitude of the stage 31 with respect to the machining head 21.

[0040] The measuring device 4 is a device capable of measuring at least a part of the measurement object. The measuring device 4 is a device capable of measuring at least a part of the characteristics of the measurement object. Specifically, the measuring device 4 is capable of measuring at least a part of the shape of the measurement object as at least a part of the characteristics of the measurement object. The measuring device 4 may be capable of measuring at least a part of the position of the measurement object in order to measure at least a part of the shape of the measurement object as at least a part of the characteristics of the measurement object. An example of such a measuring device is a three-dimensional measuring machine (in other words, a 3D scanner) that measures the measurement object in three dimensions. In this case, the measuring device 4 may measure the measurement object using a pattern projection method or a light cutting method that projects a light pattern onto the surface of the measurement object by irradiating the surface of the measurement object with measurement light ML and measures the shape of the projected pattern. Alternatively, the measuring device 4 may measure the measurement object using a time-of-flight method that projects measurement light ML onto the surface of the measurement object, measures the distance to the object from the time it takes for the projected measurement light ML to return, and performs this at multiple positions on the object. Alternatively, the measurement device 4 may measure the measurement object using at least one of a moire topography method (specifically, a grating projection method or a grating projection method), a holographic interferometry method, an autocollimation method, a stereo method, an astigmatism method, a critical angle method, and a knife edge method. Note that an example of the measurement object is at least one of the workpiece W, the molded object, and the stage 31.

[0041] The light source 5 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include a plurality of pulsed lights (i.e., a plurality of pulse beams). The processing light EL may be laser light. In this case, the light source 5 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD: Laser Diode). Examples of the laser light source include a fiber laser or a CO 2The processing light EL may be a laser, a YAG laser, an excimer laser, etc. However, the processing light EL does not have to be a laser light. The light source 5 may include any light source (for example, at least one of an LED (Light Emitting Diode), a discharge lamp, etc.).

[0042] The gas supply source 6 is a supply source of a purge gas for purging the internal space of the housing 8. The purge gas includes an inert gas. Examples of the inert gas include nitrogen gas and argon gas. The gas supply source 6 supplies the purge gas to the internal space of the housing 8 through a supply pipe 61 that connects the gas supply source 6 and the housing 8. As a result, the internal space of the housing 8 becomes a space purged by the purge gas. The gas supply source 6 may be a cylinder that stores an inert gas such as nitrogen gas or argon gas. When the inert gas is nitrogen gas, the gas supply source 6 may be a nitrogen gas generator that generates nitrogen gas using the air as a raw material.

[0043] As described above, when the material nozzle 212 supplies the modeling material M together with the purge gas, the gas supply source 6 may supply the purge gas to the mixer 12 to which the modeling material M from the material supply source 1 is supplied. Specifically, the gas supply source 6 may be connected to the mixer 12 via a supply pipe 62 that connects the gas supply source 6 and the mixer 12. As a result, the gas supply source 6 supplies the purge gas to the mixer 12 via the supply pipe 62. In this case, the modeling material M from the material supply source 1 may be supplied (specifically, pumped) through the supply pipe 11 toward the material nozzle 212 by the purge gas supplied from the gas supply source 6 via the supply pipe 62. In other words, the gas supply source 6 may be connected to the material nozzle 212 via the supply pipe 62, the mixer 12, and the supply pipe 11. In that case, the material nozzle 212 supplies the modeling material M from the supply outlet 214 together with the purge gas for pumping the modeling material M.

[0044] The control device 7 controls the operation of the processing system SYS. For example, the control device 7 may control the processing unit 2 (e.g., at least one of the processing head 21 and the head drive system 22) provided in the processing system SYS so as to perform additional processing on the workpiece W. For example, the control device 7 may control the stage unit 3 (e.g., the stage drive system 32) provided in the processing system SYS so as to perform additional processing on the workpiece W. In this manner, in this embodiment, additional processing is performed on the workpiece W mainly using the processing unit 2 and the stage unit 3. For this reason, an apparatus including the processing unit 2 and the stage unit 3 may be referred to as a processing apparatus.

[0045] The control device 7 may include, for example, a calculation device and a storage device. The calculation device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may include, for example, a memory. The control device 7 functions as a device that controls the operation of the machining system SYS by the calculation device executing a computer program. This computer program is a computer program for making the calculation device perform (i.e., execute) the operation to be performed by the control device 7, which will be described later. In other words, this computer program is a computer program for making the control device 7 function so as to make the machining system SYS perform the operation to be described later. The computer program executed by the calculation device may be recorded in a storage device (i.e., a recording medium) included in the control device 7, or may be recorded in any storage medium (e.g., a hard disk or a semiconductor memory) built into the control device 7 or externally attachable to the control device 7. Alternatively, the calculation device may download the computer program to be executed from a device external to the control device 7 via a network interface.

[0046] The control device 7 may control the emission mode of the processing light EL by the irradiation optical system 211. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. When the processing light EL includes a plurality of pulsed lights, the emission mode may include, for example, at least one of the emission time of the pulsed light, the emission cycle of the pulsed light, and the ratio between the length of the emission time of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control device 7 may control the movement mode of the processing head 21 by the head driving system 22. The control device 7 may control the movement mode of the stage 31 by the stage driving system 32. The movement mode may include, for example, at least one of the movement amount, the movement speed, the movement direction, and the movement timing (movement time). Furthermore, the control device 7 may control the supply mode of the modeling material M by the material nozzle 212. The supply mode may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing (supply time).

[0047] The control device 7 may not be provided inside the processing system SYS. For example, the control device 7 may be provided as a server or the like outside the processing system SYS. In this case, the control device 7 and the processing system SYS may be connected by a wired and / or wireless network (or a data bus and / or a communication line). As the wired network, a network using a serial bus type interface, for example, at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB, may be used. As the wired network, a network using a parallel bus type interface may be used. As the wired network, a network using an interface conforming to Ethernet (registered trademark), for example, at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T, may be used. As the wireless network, a network using radio waves may be used. As an example of a network using radio waves, a network conforming to IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)) may be mentioned. As the wireless network, a network using infrared rays may be used. A network using optical communication may be used as the wireless network. In this case, the control device 7 and the processing system SYS may be configured to be able to transmit and receive various information via the network. The control device 7 may also be able to transmit information such as commands and control parameters to the processing system SYS via the network. The processing system SYS may include a receiving device that receives information such as commands and control parameters from the control device 7 via the network. The processing system SYS may include a transmitting device that transmits information such as commands and control parameters to the control device 7 via the network (i.e., an output device that outputs information to the control device 7). Alternatively, a first control device that performs a part of the processing performed by the control device 7 may be provided inside the processing system SYS, while a second control device that performs another part of the processing performed by the control device 7 may be provided outside the processing system SYS.

[0048] As a recording medium for recording the computer program executed by the control device 7, at least one of CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, Blu-ray (registered trademark), and other optical disks, magnetic media such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program may be used. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in a state in which it can be executed in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized in the control device 7 by the control device 7 (i.e., a computer) executing the computer program, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) provided in the control device 7, or may be realized in a form in which a logical processing block and a partial hardware module that realizes some elements of the hardware are mixed.

[0049] (2) Operation of the machining system SYS Next, the operation of the machining system SYS will be described.

[0050] (2-1) Basic operations of additional processing First, the basic operation of the additive processing performed by the processing system SYS on the workpiece W will be described. The additive processing performed on the workpiece W corresponds to an operation of forming a shaped object by adding a shaped object integrated with (or separable from) the workpiece W to the workpiece W. For convenience of explanation, the additive processing of forming a three-dimensional structure ST, which is a shaped object having a desired shape, will be described below. As described above, the processing system SYS forms the three-dimensional structure ST by performing additive processing based on the laser build-up welding method. For this reason, the processing system SYS may form the three-dimensional structure ST by performing existing additive processing in accordance with the laser build-up welding method. An example of the operation of forming the three-dimensional structure ST using the laser build-up welding method will be briefly described below.

[0051] The processing system SYS forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (e.g., CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed. Measurement data of a solid object measured by at least one of a measuring device (not shown) provided in the processing system SYS and a three-dimensional shape measuring device provided separately from the processing system SYS may be used as the three-dimensional model data. In order to form the three-dimensional structure ST, the processing system SYS sequentially forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") SL arranged along the Z-axis direction. For example, the processing system SYS sequentially forms a plurality of structural layers SL one by one based on data of a plurality of layers obtained by slicing a model of the three-dimensional structure ST along the Z-axis direction. As a result, a three-dimensional structure ST, which is a laminated structure in which a plurality of structural layers SL are stacked, is formed. Hereinafter, a flow of operations for forming the three-dimensional structure ST by sequentially forming a plurality of structural layers SL one by one will be described.

[0052] First, the operation of forming each structure layer SL will be described with reference to FIG. 4(a) to FIG. 4(e). Under the control of the control device 7, the processing system SYS moves at least one of the processing head 21 and the stage 31 so that the target irradiation area EA is set in a desired area on the printing surface MS corresponding to the surface of the workpiece W or the surface of the already-formed structure layer SL. After that, the processing system SYS irradiates the processing light EL from the irradiation optical system 211 to the target irradiation area EA. At this time, the condensing surface on which the processing light EL is condensed in the Z-axis direction may coincide with the printing surface MS. Alternatively, the condensing surface may deviate from the printing surface MS in the Z-axis direction. As a result, as shown in FIG. 4(a), a molten pool (i.e., a pool of metal or the like melted by the processing light EL) MP is formed on the printing surface MS irradiated with the processing light EL. Furthermore, under the control of the control device 7, the processing system SYS supplies the printing material M from the material nozzle 212. As a result, the printing material M is supplied to the molten pool MP. The modeling material M supplied to the molten pool MP is melted by the processing light EL irradiated onto the molten pool MP. Alternatively, the modeling material M supplied from the material nozzle 212 may be melted by the processing light EL before reaching the molten pool MP, and the molten modeling material M may be supplied to the molten pool MP. Thereafter, when the processing light EL is no longer irradiated onto the molten pool MP as at least one of the processing head 21 and the stage 31 moves, the molten modeling material M in the molten pool MP is cooled and solidified (i.e., solidified). As a result, as shown in FIG. 4(c), a model made of the solidified modeling material M is deposited on the modeling surface MS.

[0053] The processing system SYS repeats a series of printing processes, including forming a molten pool MP by irradiating the processing light EL, supplying the printing material M to the molten pool MP, melting the supplied printing material M, and solidifying the molten printing material M, while moving the processing head 21 along at least one of the X-axis direction and the Y-axis direction relative to the printing surface MS, as shown in Fig. 4(d). At this time, the processing system SYS irradiates the processing light EL to the area on the printing surface MS where a model is to be printed, while not irradiating the processing light EL to the area on the printing surface MS where a model is not to be printed. In other words, the processing system SYS irradiates the processing light EL to the printing surface MS at a timing according to the distribution of the area where a model is to be printed, while moving the target irradiation area EA along a predetermined movement trajectory on the printing surface MS. As a result, the molten pool MP also moves on the printing surface MS along a movement trajectory according to the movement trajectory of the target irradiation area EA. Specifically, the molten pool MP is formed on the printing surface MS in a sequential manner in the area irradiated with the processing light EL among the areas along the movement trajectory of the target irradiation area EA. As a result, as shown in FIG. 4(e), a structure layer SL corresponding to a model, which is an aggregate of the melted and then solidified modeling material M, is formed on the printing surface MS. That is, a structure layer SL corresponding to an aggregate of the models formed on the printing surface MS in a pattern according to the movement trajectory of the molten pool MP (that is, a structure layer SL having a shape according to the movement trajectory of the molten pool MP in a plan view) is formed. When the target irradiation area EA is set in an area where a model is not desired to be formed, the processing system SYS may irradiate the target irradiation area EA with the processing light EL and stop the supply of the modeling material M. When the target irradiation area EA is set in an area where a model is not desired to be formed, the processing system SYS may supply the modeling material M to the target irradiation area EA and irradiate the target irradiation area EA with the processing light EL of an intensity that does not allow the formation of a molten pool MP.

[0054] The processing system SYS repeatedly performs an operation for forming such a structure layer SL based on the three-dimensional model data under the control of the control device 7. Specifically, first, the control device 7 slices the three-dimensional model data at a layer pitch to create slice data before performing an operation for forming the structure layer SL. The processing system SYS performs an operation for forming the first structure layer SL#1 on the printing surface MS corresponding to the surface of the workpiece W based on the slice data corresponding to the structure layer SL#1. Specifically, the control device 7 generates processing control information for controlling the processing unit 2 and the stage unit 3 to print the first structure layer SL#1 based on the slice data corresponding to the structure layer SL#1. The processing control information may include, for example, processing path information indicating a relative movement trajectory of the target irradiation area EA of the processing light EL on the printing surface MS with respect to the printing surface MS. After that, the control device 7 controls the processing unit 2 and the stage unit 3 to print the first structure layer SL#1 based on the processing path information. As a result, as shown in FIG. 5(a), a structural layer SL#1 is formed on the printing surface MS. Note that the processing control information may be generated in advance before the processing system SYS starts additional processing. In this case, instead of generating the processing control information, the control device 7 may acquire the processing control information generated in advance and control the processing unit 2 and the stage unit 3 to print the structural layer SL based on the acquired processing control information. After that, the processing system SYS sets the surface (i.e., the upper surface) of the structural layer SL#1 as a new printing surface MS, and then prints the second structural layer SL#2 on the new printing surface MS. In order to print the structural layer SL#2, the control device 7 first controls at least one of the head driving system 22 and the stage driving system 32 so that the processing head 21 moves along the Z axis relative to the stage 31. Specifically, the control device 7 controls at least one of the head drive system 22 and the stage drive system 32 to move the processing head 21 toward the +Z side and / or move the stage 31 toward the -Z side so that the target irradiation area EA is set on the surface of the structural layer SL#1 (i.e., the new printing surface MS).Thereafter, under the control of the control device 7, the processing system SYS forms the structural layer SL#2 on the structural layer SL#1 based on the slice data corresponding to the structural layer SL#2 in the same manner as the operation for forming the structural layer SL#1. As a result, the structural layer SL#2 is formed as shown in FIG. 5(b). Thereafter, the same operation is repeated until all the structural layers SL constituting the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, the three-dimensional structure ST is formed by a laminated structure in which a plurality of structural layers SL are stacked, as shown in FIG. 5(c).

[0055] (2-2) Additional processing on multiple workpieces W In this embodiment, a plurality of workpieces W may be placed on the stage 31. In this case, the processing system SYS may perform additional processing on the plurality of workpieces W. Hereinafter, an operation of performing additional processing on the plurality of workpieces W will be described with reference to Fig. 6. Fig. 6 is a flowchart showing the flow of the operation of performing additional processing on the plurality of workpieces W.

[0056] 6, first, a plurality of workpieces W are placed on the stage 31 (step S11). In the following description, a set of a plurality of workpieces W placed on the stage 31 is referred to as a "workpiece set WS."

[0057] FIG. 7 shows an example of a plurality of workpieces W placed on the stage 31. FIG. 7 shows an example in which each of the plurality of workpieces W is a turbine blade. However, each of the plurality of workpieces W is not limited to being a turbine blade. As shown in FIG. 7, the plurality of workpieces W may be placed on the placement surface 311 of the stage 31 via a jig 33. Specifically, the plurality of workpieces W are placed on the jig 33. At this time, the placement positions on the jig 33 where the plurality of workpieces W are placed may be determined in advance. That is, the plurality of workpieces W may be placed at a determined position on the jig 33. When the placement positions on the jig 33 where the plurality of workpieces W are placed are determined in advance, placement position information regarding the placement positions of the plurality of workpieces W on the jig 33 may be information known to the control device 7. However, the plurality of workpieces W may be placed at any position on the jig 33. The jig 33 on which the plurality of workpieces W are placed may be placed on the placement surface 311 of the stage 31. However, the multiple workpieces W may be placed on the placement surface 311 of the stage 31 without using the jig 33 .

[0058] The jig 33 may hold multiple workpieces W placed on the jig 33. For example, the jig 33 may hold multiple workpieces W by clamping each workpiece W using the fixed claws 331. In this case, the placement positions on the jig 33 where the multiple workpieces W are placed (i.e., the holding positions where the jig 33 holds the multiple workpieces W) are determined by the positions where the fixed claws 331 are arranged. However, the jig 33 does not have to hold multiple workpieces W. The multiple workpieces W may be placed on the jig 33 in a clampless manner.

[0059] The jig 33 may be placed at a predetermined position on the mounting surface 311 of the stage 31. However, the jig 33 may be placed at any position on the mounting surface 311 of the stage 31. In order to place the jig 33 at a predetermined position on the mounting surface 311, a mark for alignment may be formed on at least one of the jig 33 and the mounting surface 311. In the example shown in Fig. 7, a mark for alignment is formed on both the jig 33 and the mounting surface 311.

[0060] For example, as shown in FIG. 7, a plurality of pins 312 may be formed on the mounting surface 311 as a mark for alignment. In the example shown in FIG. 7, two pins 312 are formed on the mounting surface 311, but three or more pins 312 may be formed. The pins 312 are members that protrude from the mounting surface 311 along the Z-axis direction. Note that information regarding the positions of the pins 312 on the stage 31 may be information known to the control device 7. Furthermore, as shown in FIG. 7, a plurality of through holes 332 may be formed on the jig 33 as a mark for alignment. In the example shown in FIG. 7, two through holes 332 are formed on the jig 33, but three or more through holes 332 may be formed. The through holes 332 penetrate the jig 33 along the Z-axis direction. In this case, as shown in FIG. 7, the jig 33 may be placed on the mounting surface 311 so that the pins 312 are inserted into the through holes 332. The jig 33 may be placed on the mounting surface 311 with the pins 312 inserted in the through holes 332. Therefore, the arrangement of the through holes 332 is the same as the arrangement of the pins 312. Furthermore, the number of the through holes 332 is the same as the number of the pins 312 (or may be greater). As a result, the jig 33 is placed on the mounting surface 311 at a position determined by the pins 312 and the through holes 332. Therefore, in this case, the placement position information regarding the placement position of the jig 33 on the stage 31 becomes known information to the control device 7.

[0061] In this embodiment, the multiple workpieces W placed on the stage 31 have the same characteristics. The characteristics of the workpieces W may include the type of material constituting the workpieces W and the shape of the workpieces W. For example, a turbine is equipped with a large number of turbine blades having the same characteristics described above. In this case, some of the large number of turbine blades may be placed on the stage 31 as the multiple workpieces W.

[0062] The state where "multiple workpieces W have the same characteristics" may include not only the state where "multiple workpieces W have completely the same characteristics" but also the state where "multiple workpieces W have roughly the same characteristics". The state where "multiple workpieces W have roughly the same characteristics" may include the state where "at least two of the multiple workpieces W have different characteristics, but the difference in the characteristics of the at least two workpieces W is within the characteristic tolerance value". Specifically, for example, the state where "multiple workpieces W have roughly the same shape" may include the state where "at least two of the multiple workpieces W have different shapes, but the difference in the shapes of the at least two workpieces W is within the shape tolerance value". In addition, the state where "multiple workpieces W have the same characteristics" may include the state where "at least some of the multiple workpieces W have the same characteristics". For example, the state where "multiple workpieces W have the same shape" may include the state where "at least some of the multiple workpieces W have the same shape".

[0063] The state in which the shapes of at least two workpieces W are different may include a state in which the shapes themselves of at least two workpieces W are different, as shown in FIG. 8 showing a plurality of workpieces placed on a stage. The state in which the shapes of at least two workpieces W are different may include a state in which the shapes of at least two workpieces W are different due to the difference in the sizes of at least two workpieces W, as shown in FIG. 9 showing a plurality of workpieces placed on a stage. For this reason, the "shape of the workpiece W" in this embodiment may mean the shape of the workpiece W taking into consideration the size of the workpiece W. The state in which the shapes of at least two workpieces W are different may include a state in which parts of the plurality of workpieces W have the same shape. The state in which the shapes of at least two workpieces W are different may include a state in which parts of the plurality of workpieces W have different shapes, while other ...

[0064] As described above, a turbine blade constituting a turbine may be used as an example of the workpiece W. The turbine blade is typically attached to a rotor that constitutes a turbine and is rotatable around a rotation axis. A plurality of turbine blades having the same characteristics are usually attached to the rotor. However, when the turbine is used, the turbine blades are worn due to friction between the fluid and the turbine blades. As a result, at least two characteristics (particularly, shapes) of the plurality of turbine blades that had the same characteristics before the start of use of the turbine may become different due to the use of the turbine. However, even in this case, the wear amount of the plurality of turbine blades is likely to be approximately the same. As a result, at least two characteristics of the plurality of turbine blades that had the same characteristics before the start of use of the turbine may be considered to be approximately the same, although strictly speaking different, even after the use of the turbine. In this embodiment, a plurality of turbine blades including at least two turbine blades having approximately the same characteristics may be placed on the stage 31 as a plurality of workpieces W.

[0065] In addition, when a plurality of worn turbine blades are placed on the stage 31 as a plurality of workpieces W, the plurality of workpieces W (i.e., a plurality of worn turbine blades) may be regarded as items having missing parts and needing repair. The missing parts correspond to the worn parts. In this case, the processing system SYS may perform additional processing on the workpiece W to form a structure that compensates for the missing parts (the worn parts of the turbine blades) of the workpiece W, which is an item needing repair. In other words, the processing system SYS may perform repair processing to repair the workpiece W so as to compensate for the missing parts of the workpiece W with a structure. For example, the processing system SYS may process (i.e., repair) the workpiece W to compensate for the missing parts of the workpiece W by performing additional processing to add a structure having the same characteristics (e.g., material type and shape) as the characteristics of the missing parts of the workpiece W to the missing parts of the workpiece W.

[0066] At least one of the multiple workpieces W placed on the stage 31 may be subjected to pre-processing. For example, before the multiple workpieces W are placed on the stage 31, at least one of the multiple workpieces W may be subjected to pre-processing. In other words, at least one of the multiple workpieces W that are not placed on the stage 31 may be subjected to pre-processing. For example, after the multiple workpieces W are placed on the stage 31, at least one of the multiple workpieces W may be subjected to pre-processing. In other words, at least one of the multiple workpieces W that are placed on the stage 31 may be subjected to pre-processing.

[0067] The pre-processing may include a first pre-processing process for processing at least one of the multiple workpieces W so that the characteristics of the multiple workpieces W are approximately the same. For example, when the multiple workpieces W include at least two workpieces W whose difference in shape is not within the shape tolerance, the first pre-processing may include a process for processing at least one workpiece W so that the difference in shape of at least two workpieces W whose difference in shape is not within the shape tolerance is within the shape tolerance. The first pre-processing typically includes a removal process for removing a part of at least one workpiece W so that the characteristics of the multiple workpieces W are approximately the same. The removal process may include a process for removing a part of at least one workpiece W using a tool such as a grinder. The removal process may include a process for removing a part of at least one workpiece W by irradiating at least one workpiece W with an energy beam. However, the first pre-processing may include an addition process for adding a shaped object to at least one workpiece W so that the characteristics of the multiple workpieces W are approximately the same.

[0068] The pre-processing may include a second pre-processing process in which at least one of the workpieces W is processed so that the surface of at least one of the workpieces W (particularly, a surface portion set as a printing surface MS on which a model is formed by the additive processing) is flatter than before the pre-processing process. In this case, when the additional processing is performed on the workpiece W on which the second pre-processing process has been performed, a model that is more firmly bonded to the workpiece W can be formed, compared to when the additional processing is performed on the workpiece W on which the second pre-processing process has not been performed. The second pre-processing typically includes a removal processing process in which a part of at least one workpiece W is removed so that the surface of at least one workpiece W becomes relatively flat. Note that the removal processing itself has already been described when describing the first pre-processing process, so its description will be omitted. However, the second pre-processing may include an additional processing process in which a model is added to at least one workpiece W so that the surface of at least one workpiece W becomes relatively flat.

[0069] The processing system SYS may include a device for performing pre-processing. For example, the processing system SYS may include a device capable of removing a part of at least one workpiece W using a tool such as a grinder as a device for performing pre-processing. For example, the processing system SYS may include a device capable of removing a part of at least one workpiece W by irradiating an energy beam onto at least one workpiece W as a device for performing pre-processing. The processing light EL may be used as an energy beam for performing the removal processing. In this case, the processing system SYS may use the processing unit 2 as a device for performing pre-processing. Alternatively, a device external to the processing system SYS may perform pre-processing on at least one workpiece W.

[0070] 6 again, under the control of the control device 7, the measurement device 4 performs a measurement operation to measure the shape of one of the workpieces W placed on the stage 31 (step S12). In the following description, the workpiece W measured in step S12 is referred to as the "measurement target workpiece W."

[0071] Thereafter, the control device 7 generates processing control information for performing additional processing on the measurement target workpiece W based on the result of the measurement operation in step S12 (i.e., the measurement result of the shape of the measurement target workpiece W) (step S13). That is, the control device 7 generates processing control information for controlling the processing unit 2 and the stage unit 3 to form a model on the measurement target workpiece W based on the result of the measurement operation in step S12 (step S13).

[0072] The control device 7 may generate processing control information based on the result of the measurement operation in step S12 and shape information on the shape that the measurement target work W should have after the additional processing is performed (i.e., the shape that the measurement target work W to which the molded object is added should have, and the shape that an object composed of the molded object and the measurement target work W should have). Specifically, the control device 7 may generate a three-dimensional model (hereinafter referred to as a "measurement model") showing the actual shape of the measurement target work W based on the result of the measurement operation in step S12. Furthermore, the control device 7 may acquire a three-dimensional model (hereinafter referred to as a "target model") showing the shape that the measurement target work W should have after the additional processing is performed, as shape information on the shape that the measurement target work W should have after the additional processing is performed. The control device 7 may acquire a target model stored in a storage device of the control device 7, or may acquire a target model stored in a device external to the processing system SYS. The difference between the target model and the measurement model corresponds to a three-dimensional model (hereinafter referred to as a "printing model") that indicates the shape of the object to be formed by the processing system SYS performing additional processing. Therefore, the control device 7 may generate processing control information based on the difference between the target model and the measurement model. In other words, the control device 7 may generate processing control information based on the comparison result between the target model and the measurement model.

[0073] As an example, when a product having a defect and requiring repair is used as the workpiece W as described above, the control device 7 may generate processing control information for controlling the processing unit 2 and the stage unit 3 to perform additional processing for adding a shaped object to the measurement target workpiece W to compensate for the defect of the measurement target workpiece W. In this case, the control device 7 may generate a measurement model based on the result of the measurement operation in step S12. Furthermore, the control device 7 may acquire a target model (i.e., a three-dimensional model showing the shape that the measurement target workpiece W should have after the repair processing is performed (i.e., the shape of the measurement target workpiece W after repair)). As the target model, a three-dimensional model showing the design shape of the measurement target workpiece W (typically, the shape of the measurement target workpiece W without the defect) may be used. Alternatively, as the target model, a three-dimensional model showing the shape obtained by correcting the design shape of the measurement target workpiece W (for example, a shape modified to improve the functionality of the measurement target workpiece W compared with the design shape of the measurement target workpiece W) may be used. Note that examples of the measurement model and the target model are each shown in FIG. 10. 10, the control device 7 may generate a three-dimensional model (i.e., a molding model) indicating the shape of the missing part of the measurement target workpiece W by comparing the target model with the measurement model (typically, calculating the difference between the target model and the measurement model). Then, the control device 7 may generate processing control information for molding a molded object indicated by the molding model.

[0074] However, in addition to or instead of acquiring the target model and generating the measurement model, the control device 7 may acquire shape information (e.g., the above-mentioned modeling model) regarding the shape of the object to be formed by the processing system SYS performing additional processing, and generate processing control information based on the acquired shape information. In this case, the control device 7 does not need to acquire the target model or generate the measurement model.

[0075] In addition to or instead of the measuring device 4 included in the machining system SYS, a measuring device external to the machining system SYS may perform a measuring operation to measure the shape of the measurement target workpiece W. In this case, the control device 7 may obtain information on the result of the measuring operation performed by the external measuring device from the external measuring device, and generate machining control information based on the obtained information.

[0076] In this embodiment, the processing control information for performing additional processing on the measurement target workpiece W is used as processing control information for performing additional processing on the remaining workpieces W other than the measurement target workpiece W among the multiple workpieces W. In other words, the processing control information for performing additional processing on the measurement target workpiece W is used as common processing control information for performing additional processing on each of the multiple workpieces W. This is because, as described above, the multiple workpieces W placed on the stage 31 have the same characteristics (even if the characteristics of at least two workpieces W are different, the difference in the characteristics of the at least two workpieces W is within the characteristic tolerance value), and therefore the processing control information for performing additional processing on one workpiece W can be used as processing control information for performing additional processing on other workpieces W different from the one workpiece W. For this reason, in this embodiment, the processing control information generated based on the result of the measurement operation for measuring the shape of the measurement target workpiece W is referred to as "common processing control information".

[0077] Thereafter, the processing system SYS performs an alignment operation to calculate the placement positions on the stage 31 where the multiple workpieces W are placed (step S14). For example, as described above, when placement position information regarding the placement positions of the multiple workpieces W on the jig 33 and placement position information regarding the placement position of the jig 33 on the stage 31 are known to the control device 7, the control device 7 may calculate the placement positions of the multiple workpieces W on the stage 31 based on the placement position information.

[0078] Alternatively, when the placement position information is not known to the control device 7, the measurement device 4 may measure the positions of the multiple workpieces W, and the control device 7 may calculate the placement positions of the multiple workpieces W on the stage 31 based on the measurement results of the positions of the multiple workpieces W by the measurement device 4. Specifically, the measurement device 4 may measure the shapes of the multiple workpieces W together with a reference member whose information on its position relative to the stage 31 is known to the control device 7. As the reference member whose position relative to the stage 31 is known, for example, the pin 312 shown in FIG. 7 may be used, or any other member formed on the stage 31 may be used. Thereafter, the control device 7 may calculate the placement positions of the multiple workpieces W on the stage 31 based on the measurement results of the multiple workpieces W and the reference member by the measurement device 4. Specifically, the control device 7 may specify the positional relationship between the reference member and the multiple workpieces W based on the measurement results of the multiple workpieces W and the reference member by the measurement device 4, and calculate the placement positions of the multiple workpieces W on the stage 31 based on the specified positional relationship and information on the position of the reference member relative to the stage 31. In addition, since the measuring device 4 measures the shapes of multiple workpieces W to perform an alignment operation while the measuring device 4 measures the shape of a single workpiece W to be measured to generate common processing control information, the measurement characteristics of the measuring device 4 performing the measurement operation to perform the alignment operation may be different from the measurement characteristics of the measuring device 4 performing the measurement operation to generate common processing control information. The measurement characteristics may include the size of the measurement field of view of the measuring device 4 (i.e., the area that the measuring device 4 can measure). For example, the measurement field of view of the measuring device 4 performing the measurement operation to perform an alignment operation may be larger than the measurement field of view of the measuring device 4 performing the measurement operation to generate common processing control information. The measurement characteristics may include the measurement resolution of the measuring device 4 (i.e., the measurement accuracy, which is the limit value of the fineness of an object that the measuring device 4 can measure). For example, the measurement resolution of the measuring device 4 performing the measurement operation to perform an alignment operation may be coarser (i.e., larger) than the measurement resolution of the measuring device 4 performing the measurement operation to generate common processing control information.In other words, the measurement accuracy of the measuring device 4 performing the measurement operation for performing the alignment operation may be lower than the measurement accuracy of the measuring device 4 performing the measurement operation for generating the common processing control information. Thereafter, the control device 7 controls the processing unit 2 and the stage unit 3 to perform additional processing on the multiple workpieces W based on the common processing control information generated in step S13 (step S15). That is, the processing system SYS performs additional processing on the multiple workpieces W based on the common processing control information generated in step S13 (step S15). Specifically, the control device 7 may control the processing unit 2 and the stage unit 3 to perform additional processing on the measurement target workpiece W based on the common processing control information. Furthermore, the control device 7 may control the processing unit 2 and the stage unit 3 to perform additional processing on the remaining workpieces W other than the measurement target workpiece W among the multiple workpieces W based on the common processing control information. In the following description, the workpiece W different from the measurement target workpiece W is referred to as a "non-measurement target workpiece W". At this time, the control device 7 may calculate the positional relationship between the measurement target workpiece W and the non-measurement target workpiece W based on the placement positions of the multiple workpieces W calculated in step S14, and control the processing unit 2 and the stage unit 3 to perform additional processing on the non-measurement target workpiece W based on the calculated positional relationship and the common processing control information. As an example, as described above, the processing control information may include processing path information indicating the relative movement trajectory of the target irradiation area EA of the processing light EL on the printing surface MS. As described above, since the characteristics (particularly, the shapes) of the multiple workpieces W are the same (particularly, even if the characteristics of the multiple workpieces W are different, the difference is within the characteristic tolerance), the movement trajectory of the target irradiation area EA for performing additional processing on the non-measurement target workpieces W and the movement trajectory of the target irradiation area EA for performing additional processing on the measurement target workpieces W should be separated along the printing surface MS by an amount corresponding to the difference between the placement position of the non-measurement target workpieces W and the placement position of the measurement target workpieces W. For this reason, the control device 7 may correct the common processing control information based on the difference between the placement position of the measurement target workpieces W and the placement position of the non-measurement target workpieces W, and control the processing unit 2 and the stage unit 3 to perform additional processing on the non-measurement target workpieces W based on the corrected common processing control information.Alternatively, the control device 7 may correct the control amount of the processing unit 2 and the stage unit 3 based on the common processing control information based on the difference between the placement position of the workpiece W to be measured and the placement position of the workpiece W not to be measured.

[0079] In this way, when the processing system SYS performs additional processing on the multiple workpieces W using the common processing control information, the processing system SYS processes the multiple workpieces W in the same way. Even in this case, as described above, the characteristics (particularly, the shapes) of the multiple workpieces W are the same (particularly, even if the characteristics of the multiple workpieces W are different, the difference falls within the characteristic tolerance value), so the processing system SYS can appropriately perform additional processing on the multiple workpieces W using the common processing control information. As a result, as shown in FIG. 11 showing the multiple workpieces W on which additional processing has been performed (for example, multiple workpieces W that have been repaired), the characteristics of the multiple workpieces W on which additional processing has been performed are also the same (particularly, even if the characteristics of the multiple workpieces W are different, the difference falls within the characteristic tolerance value). For example, as shown in FIG. 11, the shapes of the multiple workpieces W on which additional processing has been performed may be the same. For example, as shown in FIG. 11, the sizes of the multiple workpieces W on which additional processing has been performed may be the same. As an example, when a number of worn turbine blades are placed on the stage 31 as a number of workpieces W, the processing system SYS can perform additional processing on the number of workpieces W (i.e., the number of worn turbine blades) as shown in FIG. 11, thereby repairing the number of workpieces W so that missing areas (worn areas of the turbine blades) are filled with a molded object (i.e., generating a number of unworn turbine blades).

[0080] Thereafter, after the additional machining of the work set WS including the multiple workpieces W placed on the stage 31 is completed, the control device 7 judges whether or not there is a new work set WS including the multiple workpieces W on which the machining system SYS is to newly perform additional machining (i.e., the next work set WS) (step S16). In other words, the control device 7 judges whether or not there is a new work set WS including the multiple workpieces W on which the machining system SYS has not yet performed additional machining (step S16).

[0081] In this embodiment, the characteristics of each of the multiple workpieces W included in the new work set WS may be the same as the characteristics of each of the multiple workpieces W included in the machined work set WS. Note that the state in which "the characteristics of one workpiece W become the same as the characteristics of another workpiece W (i.e., one workpiece W and another workpiece W have the same characteristics)" has already been explained, so the explanation will be omitted here.

[0082] As a result of the determination in step S16, when it is determined that there is a new work set WS on which the machining system SYS should perform additional machining (step S16: Yes), the multiple workpieces W included in the new work set WS are placed on the stage 31 (step S17). Thereafter, the machining system SYS performs the operations from step S14 to step S15 on the multiple workpieces W placed on the stage 31 in step S17. That is, the machining system SYS performs an alignment operation for calculating the placement positions of the multiple workpieces W placed on the stage 31 in step S17 (step S14), and performs additional machining on the multiple workpieces W placed on the stage 31 in step S17 based on the common machining control information generated in step S13 (step S15). At this time, as long as the characteristics of each of the multiple workpieces W included in the new work set WS are the same as the characteristics of each of the multiple workpieces W included in the machined work set WS, the control device 7 does not need to newly generate machining control information for performing additional machining on the multiple workpieces W included in the new work set WS. In other words, the control device 7 may control the machining unit 2 and the stage unit 3 to perform additional machining on an unmachined workpiece W based on the common machining control information used to perform additional machining on a machined workpiece W.

[0083] On the other hand, if it is determined in step S16 that there is no new work set WS on which the machining system SYS should perform additional machining (step S16: No), the machining system SYS ends the operation shown in FIG.

[0084] (3) Technical effect In this manner, in the present embodiment, the machining system SYS can perform additional machining not only on the measurement target workpiece W but also on the non-measurement target workpiece W using the machining control information for performing additional machining on the measurement target workpiece W. Therefore, the machining system SYS does not need to measure the shape of the measurement target workpiece W and generate machining control information for performing additional machining on the measurement target workpiece W based on the measurement results of the measurement target workpiece W. In other words, the machining system SYS does not need to measure all of the multiple workpieces W individually and generate multiple pieces of machining control information for performing additional machining on each of the multiple workpieces W based on the measurement results of the multiple workpieces W. Therefore, the machining system SYS can reduce the time required for additional machining on multiple workpieces W compared to the comparative example machining system that needs to measure all of the multiple workpieces W individually and generate multiple pieces of machining control information for performing additional machining on each of the multiple workpieces W based on the measurement results of the multiple workpieces W.

[0085] (4) Variations Next, a modified example of the operation for performing additional machining on a plurality of workpieces W will be described.

[0086] (4-1) First Modification First, a first modified example of the operation for performing additional machining on a plurality of workpieces W will be described with reference to Fig. 12. Fig. 12 is a flowchart showing the flow of the first modified example of the operation for performing additional machining on a plurality of workpieces W. Note that operations that have already been described will be assigned the same step numbers and detailed descriptions thereof will be omitted.

[0087] As shown in FIG. 12, in the first modified example, a plurality of workpieces W are placed on the stage 31 (step S11). Thereafter, in the first modified example, the measuring device 4 performs a measuring operation to measure the shapes of the plurality of workpieces W (step S21a). Thereafter, the control device 7 identifies at least one workpiece W whose shape does not satisfy a predetermined shape criterion from among the plurality of workpieces W based on the result of the measuring operation in step S21a (i.e., the measurement results of the plurality of workpieces W) (step S22a). The predetermined shape criterion may include a criterion that the difference between the shape of the one workpiece W and the shape of the other workpieces W is within a shape tolerance value. In other words, the predetermined shape criterion may include a criterion that the shape of the one workpiece W is the same as the shape of the other workpieces W. In this case, the control device 7 may identify a workpiece W whose shape is different from the shape of the other workpieces W by more than the shape tolerance value as a workpiece W whose shape does not satisfy the predetermined shape criterion. The control device 7 may identify a workpiece W whose shape is not the same as the shape of the other workpieces W as a workpiece W whose shape does not satisfy the predetermined shape criterion. In the following description, a workpiece W whose shape does not meet the specified shape criteria will be referred to as an “abnormal workpiece W,” while a workpiece W whose shape meets the specified shape criteria will be referred to as a “normal workpiece W,” thereby distinguishing between the two.

[0088] As described above, the "shape of the workpiece W" in this embodiment may mean the shape of the workpiece W taking into consideration the size of the workpiece W. In this case, the predetermined shape criterion may include a criterion that the difference between the size of one workpiece W and the size of another workpiece W is within the size tolerance. In other words, the predetermined shape criterion may include a criterion that the size of one workpiece W is the same as the size of another workpiece W. In this case, the control device 7 may identify a workpiece W having a size that exceeds the size tolerance as a workpiece W whose shape does not satisfy the predetermined shape criterion. The control device 7 may identify a workpiece W having a size that is not the same as the size of another workpiece W as a workpiece W whose shape does not satisfy the predetermined shape criterion.

[0089] Because the measuring device 4 measures the shapes of multiple workpieces W to identify an abnormal workpiece W, while the measuring device 4 measures the shape of a single workpiece W to generate common processing control information, the measurement characteristics of the measuring device 4 performing the measurement operation to identify the abnormal workpiece W may be different from the measurement characteristics of the measuring device 4 performing the measurement operation to generate the common processing control information. As described above, the measurement characteristics may include at least one of the measurement field of view and the measurement resolution of the measuring device 4. In this case, the measurement field of view of the measuring device 4 performing the measurement operation to identify the abnormal workpiece W may be wider than the measurement field of view of the measuring device 4 performing the measurement operation to generate the common processing control information. The measurement resolution of the measuring device 4 performing the measurement operation to identify the abnormal workpiece W may be coarser than the measurement resolution of the measuring device 4 performing the measurement operation to generate the common processing control information. In other words, the measurement accuracy of the measuring device 4 performing the measurement operation to identify the abnormal workpiece W may be lower than the measurement accuracy of the measuring device 4 performing the measurement operation to generate the common processing control information. In the following description, for convenience of explanation, an example will be described in which the measuring device 4 measures the shape of the measurement target workpiece W in a fine state having a relatively narrow measurement field of view and a relatively fine measurement resolution (i.e., relatively high measurement accuracy) in order to generate common processing control information, and the measuring device 4 measures the shape of the measurement target workpiece W in a rough state having a relatively wide measurement field of view and a relatively coarse measurement resolution (i.e., relatively low measurement accuracy) compared to the fine state in order to identify the abnormal workpiece W. In this case, the measurement operation for generating the common processing control information is called a fine measurement operation, while the measurement operation for identifying the abnormal workpiece W is called a rough measurement operation to distinguish between the two. Note that the measurement operation for performing the alignment operation described with reference to FIG. 6 may also be performed by the measuring device 4 in the rough state.

[0090] Thereafter, the control device 7 determines whether or not common machining control information that can be used to perform additional machining on the multiple workpieces W placed on the stage 31 has been generated (step S23a).

[0091] When it is determined that the common processing control information has not been generated (step S23a: No) as a result of the determination in step S23a, the control device 7 generates the common processing control information. Specifically, under the control of the control device 7, the measurement device 4 performs a measurement operation to measure the shape of the measurement target workpiece W, which is one of the workpieces W placed on the stage 31 (step S12a). However, step S12a of the first modified example is different from step S12 in FIG. 6 described above in that the measurement device 4 does not measure the shape of the abnormal workpiece W identified in step S22a as the shape of the measurement target workpiece W. In other words, step S12a of the first modified example is different from step S12 in FIG. 6 described above in that the measurement device 4 measures the shape of the normal workpiece W not identified as the abnormal workpiece W in step S22a as the shape of the measurement target workpiece W. Other features of step S12a of the first modified example may be the same as other features of step S12 in FIG. 6 described above. Thereafter, the control device 7 generates processing control information (that is, common processing control information) for performing additional processing on the measurement target workpiece W based on the result of the measurement operation in step S12a (step S13).

[0092] Thereafter, the processing system SYS performs an alignment operation to calculate the placement positions on the stage 31 where the multiple workpieces W are placed (step S14). Thereafter, the processing system SYS performs additional processing on the multiple workpieces W based on the common processing control information generated in step S13 (step S15a). However, step S15a of the first modified example differs from step S15 of FIG. 6 described above in that the processing system SYS does not need to perform additional processing on the abnormal workpiece W identified in step S22a. In other words, step S15a of the first modified example differs from step S15 of FIG. 6 described above in that the processing system SYS only needs to perform additional processing on normal workpieces W that are not identified as abnormal workpieces W in step S22a. Other features of step S15a of the first modified example may be the same as other features of step S15 of FIG. 6 described above.

[0093] Thereafter, after additional processing is completed on the work set WS including multiple work pieces W placed on the stage 31, the control device 7 determines whether there is a new work set WS (i.e., the next work set WS) including multiple work pieces W on which the processing system SYS should newly perform additional processing (step S16).

[0094] As a result of the judgment in step S16, when it is judged that there is a new work set WS on which the machining system SYS should perform additional machining (step S16: Yes), a plurality of workpieces W included in the new work set WS are placed on the stage 31 (step S17). After that, the machining system SYS performs the operations from step S21a to step S15a on the plurality of workpieces W placed on the stage 31 in step S17. That is, the machining system SYS measures the shapes of the plurality of workpieces W placed on the stage 31 in step S17 (step S21a), identifies the abnormal workpieces W (step S22a), performs an alignment operation to calculate the placement positions of the plurality of workpieces W (step S14), and performs additional machining on the normal workpieces W placed on the stage 31 in step S17 based on the common machining control information already generated (step S15a). At this stage, since it is judged that the common machining control information has been generated in step S23a, the machining system SYS does not need to generate the common machining control information again.

[0095] On the other hand, if it is determined in step S16 that there is no new work set WS on which the machining system SYS should perform additional machining (step S16: No), the machining system SYS ends the operation shown in FIG.

[0096] In the above description, the measuring device 4 provided in the processing system SYS performs a measuring operation to measure the shapes of multiple workpieces W in order to identify an abnormal workpiece W. However, a measuring device external to the processing system SYS may perform a measuring operation to measure the shapes of multiple workpieces W in order to identify an abnormal workpiece W. In this case, the control device 7 may obtain information on the results of the measuring operation performed by the external measuring device from the external measuring device, and identify the abnormal workpiece W based on the obtained information. The same applies to the second and third modified examples described below in which an abnormal workpiece W is identified.

[0097] When pre-processing is performed on at least one of the multiple workpieces W placed on the stage 31, the measuring device 4 may measure the shapes of the multiple workpieces W after the pre-processing in order to identify the abnormal workpieces W. Alternatively, the measuring device 4 may measure the shapes of the multiple workpieces W before the pre-processing in order to identify the abnormal workpieces W. When the multiple workpieces W before the pre-processing are measured by the measuring device 4, the control device 7 may estimate the shapes of the multiple workpieces W after the pre-processing based on the amount of processing by the pre-processing (for example, the amount of removal by the removal processing) and the measurement results of the multiple workpieces W by the measuring device 4, and may identify the workpieces W whose estimated shape does not satisfy the shape criterion as the abnormal workpieces W. The same applies to the second and third modified examples described below in which the abnormal workpieces W are identified.

[0098] In the case where the plurality of workpieces W before the pre-processing are measured by the measuring device 4, the control device 7 may determine the amount of processing by the pre-processing based on the measurement results by the measuring device 4. For example, in the case where a plurality of worn turbine blades are used as the plurality of workpieces W, the control device 7 may calculate the amount of wear of each of the plurality of workpieces W based on the measurement results by the measuring device 4, and may determine the amount of processing by the pre-processing for making the shapes of the plurality of workpieces W the same based on the calculated amount of wear. Note that the measuring device 4 may measure the shapes of the plurality of workpieces W before the pre-processing for the purpose of determining the amount of processing by the pre-processing in addition to or instead of identifying the abnormal workpiece W. The same applies to the second and third modified examples described below.

[0099] (4-2) Second Modification Next, a second modified example of the operation for performing additional machining on a plurality of workpieces W will be described with reference to Fig. 13. Fig. 13 is a flowchart showing the flow of the second modified example of the operation for performing additional machining on a plurality of workpieces W.

[0100] 13, in the second modified example, the operations from step S11 to step S13 are performed in the same manner as in the first modified example. That is, a plurality of workpieces W are placed on the stage 31 (step S11), the measuring device 4 performs a measuring operation to measure the shapes of the plurality of workpieces W (step S21a), and the control device 7 identifies an abnormal workpiece W (step S22a). Furthermore, if the common processing control information has not been generated (step S23a: No), the measuring device 4 performs a measuring operation to measure the shape of the workpiece W to be measured (step S12a), and the control device 7 generates the common processing control information (step S13).

[0101] Thereafter, the control device 7 corrects the common processing control information generated in step S13 based on the results of the measurement operation in step S21a (particularly, the measurement results of the abnormal workpiece W) (step S31b). In step S31b, the control device 7 may correct the common processing control information so that the corrected common processing control information becomes processing control information for performing additional processing on the abnormal workpiece W. In other words, the control device 7 corrects the common processing control information so that the corrected common processing control information becomes processing control information for performing additional processing on the abnormal workpiece W having the characteristics (particularly, the shape) measured in step S21a.

[0102] Thereafter, the processing system SYS performs an alignment operation to calculate the placement positions on the stage 31 where the multiple workpieces W are placed (step S14). Thereafter, the processing system SYS performs additional processing on the normal workpieces W other than the abnormal workpieces W among the multiple workpieces W based on the common processing control information generated in step S13 (particularly, the common processing control information not corrected in step S31b) (step S15a). Furthermore, the processing system SYS performs additional processing on the abnormal workpieces W among the multiple workpieces W based on the common processing control information generated in step S13 (particularly, the common processing control information corrected in step S31b) (step S32b).

[0103] Thereafter, after the additional processing of the work set WS including the multiple workpieces W placed on the stage 31 is completed, the control device 7 judges whether or not there is a new work set WS (i.e., the next work set WS) including the multiple workpieces W on which the processing system SYS is to newly perform additional processing (step S16). If it is judged that there is a new work set WS on which the processing system SYS is to perform additional processing (step S16: Yes), the multiple workpieces W included in the new work set WS are placed on the stage 31 (step S17). Thereafter, the processing system SYS performs the operations from step S21a to step S32b on the multiple workpieces W placed on the stage 31 in step S17. On the other hand, if it is judged that there is no new work set WS on which the processing system SYS is to perform additional processing (step S16: No) as a result of the judgment in step S16, the processing system SYS ends the operation shown in FIG. 13.

[0104] In this way, in the second modified example, the machining system SYS can perform additional machining not only on normal workpieces W whose shapes meet the predetermined shape criteria, but also on abnormal workpieces W whose shapes do not meet the predetermined shape criteria. At this time, the machining system SYS corrects the common machining control information generated based on the measurement results of the measurement target workpiece W, which is the normal workpiece W, based on the measurement results of the abnormal workpiece W, and performs additional machining on the abnormal workpiece W using the corrected common machining control information. Therefore, the machining system SYS can appropriately perform additional machining on the abnormal workpiece W as well. Specifically, the machining system SYS can perform additional machining on the abnormal workpiece W such that the shape of the abnormal workpiece W after the additional machining is performed is the same as the shape of the normal workpiece W after the additional machining is performed.

[0105] (4-3) Third Modification Next, a third modified example of the operation for performing additional machining on a plurality of workpieces W will be described with reference to Fig. 14. Fig. 14 is a flowchart showing the flow of the third modified example of the operation for performing additional machining on a plurality of workpieces W.

[0106] 14, in the third modified example, the operations from step S11 to step S13 are performed in the same manner as in the second modified example. That is, a plurality of workpieces W are placed on the stage 31 (step S11), the measuring device 4 performs a measuring operation to measure the shapes of the plurality of workpieces W (step S21a), and the control device 7 identifies an abnormal workpiece W (step S22a). Furthermore, if the common processing control information has not been generated (step S23a: No), the measuring device 4 performs a measuring operation to measure the shape of the workpiece W to be measured (step S12a), and the control device 7 generates the common processing control information (step S13).

[0107] Thereafter, the measuring device 4 performs a measurement operation to measure the shape of the abnormal workpiece W identified in step S22a (step S41c). Thereafter, the control device 7 generates processing control information for performing additional processing on the abnormal workpiece W based on the result of the measurement operation in step S41c (i.e., the measurement result of the abnormal workpiece W) (step S42c). That is, in the third modified example, the control device 7 generates dedicated processing control information for performing additional processing on the abnormal workpiece W, separately from the common processing control information for performing additional processing on normal workpieces W. In the following description, the dedicated processing control information for performing additional processing on the abnormal workpiece W is referred to as "dedicated processing control information."

[0108] The measurement field of view of the measuring device 4 performing the measurement operation in step S41c (i.e., the measurement operation for identifying the dedicated processing control information) may be narrower than the measurement field of view of the measuring device 4 performing the measurement operation in step S21a (i.e., the measurement operation for identifying the abnormal workpiece W). The measurement field of view of the measuring device 4 performing the measurement operation in step S41c may be the same as the measurement field of view of the measuring device 4 performing the measurement operation in step S12a (i.e., the measurement operation for generating the common processing control information). The measurement resolution of the measuring device 4 performing the measurement operation in step S41c may be finer than the measurement resolution of the measuring device 4 performing the measurement operation in step S21a. In other words, the measurement accuracy of the measuring device 4 performing the measurement operation in step S41c may be higher than the measurement accuracy of the measuring device 4 performing the measurement operation in step S21a. The measurement resolution of the measuring device 4 performing the measurement operation in step S41c may be the same as the measurement resolution of the measuring device 4 performing the measurement operation in step S12a. That is, the measurement accuracy of the measuring device 4 performing the measurement operation in step S41c may be the same as the measurement accuracy of the measuring device 4 performing the measurement operation in step S12a. In order to generate the dedicated processing control information, the measuring device 4 may measure the shape of the abnormal workpiece W in a fine state having a relatively narrow measurement field of view and a relatively fine measurement resolution (i.e., relatively high measurement accuracy). As a result, processing control information is generated that can process the abnormal workpiece W with higher accuracy compared to the case where the measuring device 4 measures the shape of the abnormal workpiece W in a rough state having a relatively wide measurement field of view and a relatively coarse measurement resolution (i.e., relatively low measurement accuracy) in order to generate the dedicated processing control information in step S41c.

[0109] Thereafter, the processing system SYS performs an alignment operation to calculate the placement positions on the stage 31 where the multiple workpieces W are placed (step S14). Thereafter, the processing system SYS performs additional processing on the normal workpieces W other than the abnormal workpiece W among the multiple workpieces W based on the common processing control information generated in step S13 (step S15a). Furthermore, the processing system SYS performs additional processing on the abnormal workpiece W among the multiple workpieces W based on the dedicated processing control information generated in step S42c (step S43c).

[0110] Thereafter, after the additional processing of the work set WS including the multiple workpieces W placed on the stage 31 is completed, the control device 7 judges whether or not there is a new work set WS (i.e., the next work set WS) including the multiple workpieces W on which the processing system SYS is to newly perform additional processing (step S16). If it is judged that there is a new work set WS on which the processing system SYS is to perform additional processing (step S16: Yes), the multiple workpieces W included in the new work set WS are placed on the stage 31 (step S17). Thereafter, the processing system SYS performs the operations from step S21a to step S43c on the multiple workpieces W placed on the stage 31 in step S17. On the other hand, if it is judged that there is no new work set WS on which the processing system SYS is to perform additional processing (step S16: No) as a result of the judgment in step S16, the processing system SYS ends the operation shown in FIG. 14.

[0111] In this way, in the third modified example, the machining system SYS can perform additional machining not only on normal workpieces W whose shapes meet the predetermined shape criteria, but also on abnormal workpieces W whose shapes do not meet the predetermined shape criteria. At this time, the machining system SYS generates dedicated machining control information for performing additional machining on the abnormal workpieces W based on the measurement results of the abnormal workpieces W (particularly, the measurement results of the abnormal workpieces W by the measuring device 4 in the fine state), and performs additional machining on the abnormal workpieces W using the dedicated machining control information. Therefore, the machining system SYS can appropriately perform additional machining on the abnormal workpieces W. Specifically, the machining system SYS can perform additional machining on the abnormal workpieces W so that the shape of the abnormal workpieces W after the additional machining is performed is the same as the shape of the normal workpieces W after the additional machining is performed.

[0112] (4-4) Fourth Modification Next, a fourth modified example of the operation for performing additional machining on a plurality of workpieces W will be described with reference to Fig. 15. Fig. 15 is a flowchart showing the flow of the fourth modified example of the operation for performing additional machining on a plurality of workpieces W.

[0113] As shown in Fig. 15, in the fourth modified example, operations from step S11 to step S15 are performed similarly to the operations shown in Fig. 6. That is, a plurality of workpieces W are placed on the stage 31 (step S11), the measuring device 4 performs a measuring operation for measuring the shape of the workpieces W to be measured (step S12), the control device 7 generates common processing control information (step S13), the processing system SYS performs an alignment operation (step S14), and the processing system SYS performs additional processing on the plurality of workpieces W based on the common processing control information (step S15).

[0114] Then, in the fourth modified example, after the machining system SYS performs additional machining on the multiple workpieces W, the measuring device 4 performs a measurement operation to measure the shape of at least one of the multiple workpieces W that have been subjected to additional machining in step S15 (step S51d). For example, the measuring device 4 may perform a measurement operation to measure the shape of the measurement target workpiece W that has been machined in step S15. For example, the measuring device 4 may perform a measurement operation to measure the shape of a workpiece W other than the measurement target workpiece W among the multiple workpieces W that have been machined in step S15.

[0115] As described in detail later, the result of the measurement operation in step S51d is used to determine whether the additional processing performed on the workpiece W was appropriate. In this case, the measurement field of view of the measuring device 4 performing the measurement operation in step S51d (i.e., the measurement operation for determining whether the additional processing performed on the workpiece W was appropriate) may be the same as the measurement field of view of the measuring device 4 performing the measurement operation in step S12 (i.e., the measurement operation for generating the common processing control information), or may be wider or narrower. The measurement resolution of the measuring device 4 performing the measurement operation in step S51d may be the same as the measurement resolution of the measuring device 4 performing the measurement operation in step S12, or may be coarser or finer. In other words, the measurement accuracy of the measuring device 4 performing the measurement operation in step S51d may be the same as the measurement accuracy of the measuring device 4 performing the measurement operation in step S12, or may be lower or higher. In order to determine whether the additional processing performed on the workpiece W was appropriate, the measuring device 4 may measure the shape of the workpiece W in a fine state having a relatively narrow measurement field of view and a relatively fine measurement resolution (i.e., a relatively high measurement accuracy). In order to determine whether the additional processing performed on the workpiece W was appropriate, the measuring device 4 may measure the workpiece W in a rough state having a relatively wide measurement field of view and a relatively coarse measurement resolution (i.e., relatively low measurement accuracy).

[0116] Thereafter, the control device 7 judges whether the additional processing performed on at least one of the multiple workpieces W in step S15 was appropriate based on the result of the measurement operation in step S51d (i.e., the measurement result of the workpiece W after the additional processing) (step S52d). For example, the control device 7 may determine whether the additional processing was appropriate by identifying the shape of the workpiece W after the additional processing (i.e., the shape of the workpiece W to which the shaped object is added, and the shape of the object including the shaped object and the workpiece W) based on the result of the measurement operation in step S51d and judging whether the shape of the workpiece W after the additional processing is a desired shape. For example, the shape that the workpiece W should have after the additional processing (i.e., the shape of the target model described above) may be used as the desired shape. In this case, for example, the control device 7 may judge that the additional processing was appropriate when the shape of the workpiece W after the additional processing is a desired shape.

[0117] If the result of the judgment in step S52d is that the additional processing was inappropriate (step S52d: No), the processing system SYS may perform additional processing (in other words, secondary processing) on ​​the workpiece W on which the inappropriate additional processing was performed.

[0118] For example, if the shape of the workpiece W after the additional processing is smaller than the desired shape, it is presumed that the additional processing is determined to be inappropriate due to a shortage in the amount of processing by the additional processing (i.e., the size of the added object). In this case, the processing system SYS may perform additional processing (i.e., additional processing) to add an object to the workpiece W to compensate for the shortage in the amount of processing by the additional processing. At this time, the control device 7 may generate processing control information for forming an object to compensate for the shortage in the amount of processing by the additional processing based on the result of the measurement operation in step S51d, and the processing system SYS may perform the additional processing based on the generated processing control information. In other words, the processing system SYS may perform the additional processing based on the result of the measurement operation in step S51d. As a result, the processing system SYS can perform the additional processing on the workpiece W so that the shape of the workpiece W after the additional processing becomes the desired shape.

[0119] Alternatively, for example, when the shape of the workpiece W after the additional processing is larger than the desired shape, it is estimated that the additional processing is determined to be inappropriate due to the excessive amount of processing by the additional processing (i.e., the size of the added object). In this case, the processing system SYS may perform additional processing (i.e., removal processing) to remove the excessive object added by the additional processing. For example, the processing system SYS may perform removal processing using the processing light EL. For example, the processing system SYS may perform removal processing using a tool (e.g., a cutting tool). At this time, the control device 7 may generate processing control information for controlling the processing unit 2 and the stage unit 3 so as to remove the excessive object added by the additional processing based on the result of the measurement operation in step S51d, and the processing system SYS may perform the additional processing based on the generated processing control information. In other words, the processing system SYS may perform the additional processing based on the result of the measurement operation in step S51d. As a result, the processing system SYS can perform additional processing on the workpiece W so that the shape of the workpiece W after the additional processing becomes the desired shape.

[0120] After the additional machining is performed, the machining system SYS continues additional machining on the multiple workpieces W included in the new work set WS until it is determined that there is no new work set WS (i.e., the next work set WS) including multiple workpieces W on which the machining system SYS should perform additional machining (steps S16 to S17 and steps S14 to S53d).

[0121] In the above description, the machining system SYS performs additional machining on the workpiece W. However, an external device to the machining system SYS may perform additional machining on the workpiece W. In this case, the control device 7 may transmit (i.e., output) information on the result of the measurement operation in step S51d of Fig. 15 to the external device that performs the additional machining.

[0122] Also, in the above description, the machining system SYS performs additional machining to machine the workpiece W so that the shape of the workpiece W after the additional machining becomes the desired shape that the workpiece W should have after additional machining (e.g., repair machining). However, the machining system SYS may perform any additional machining. For example, the machining system SYS may perform additional machining to form holes in the workpiece W, may perform additional machining to form grooves in the workpiece W, or may perform additional machining to form a desired structure in the workpiece W (e.g., a riblet structure to reduce the resistance of the surface of the workpiece W to a fluid).

[0123] In addition to the above-described embodiment, an operation specific to the fourth modified example may be performed in at least one of the first to third modified examples. The operation specific to the fourth modified example may include an operation of measuring the shape of at least one of the multiple workpieces W after additional machining is performed on the multiple workpieces W, and performing additional machining on at least one of the multiple workpieces W as necessary.

[0124] (4-5) Fifth Modification Next, a description will be given of a fifth modified example of the operation of performing additional processing on a plurality of workpieces W. In the fifth modified example, the processing system SYS may perform additional processing on a plurality of workpieces W such that the difference in size (i.e., the difference in shape) between at least two of the plurality of workpieces W after the additional processing is performed is smaller than the difference in size between at least two of the plurality of workpieces W before the additional processing is performed.

[0125] In order to perform additional processing on a plurality of workpieces W in this manner, the processing system SYS may have a function (hereinafter, this function will be referred to as a "self-alignment function") that, for example, "varies the amount of processing by the additional processing (i.e., the size of the object added to the printing surface MS by the additional processing, for example, the height of the above-mentioned structural layer SL) depending on the distance D1 between the printing surface MS and the processing head 21 (particularly, the distance D1 between the printing surface MS and the material nozzle 212 (particularly, the supply outlet 214))." The self-alignment function will be described below with reference to Figs. 16 and 17.

[0126] FIG. 16 shows the supply paths of the modeling material M from the multiple material nozzles 212. As shown in FIG. 16, in order to realize the self-alignment function, the supply outlets 214 of the multiple material nozzles 212 may face in different directions. For example, the supply outlet 214 of the first material nozzle 212 may face in a first direction, and the supply outlet 214 of the second material nozzle 212 may face in a second direction. Furthermore, in order to realize the self-alignment function, the multiple material nozzles 212 may be aligned so that the supply paths of the modeling material M from the multiple supply outlets 214 facing in different directions intersect in the concentration region CP. In other words, the multiple material nozzles 212 may be aligned so that the modeling material M supplied from the multiple supply outlets 214 facing in different directions is supplied toward the concentration region CP.

[0127] In the example shown in FIG. 16, the concentration region CP is located below the printing surface MS (i.e., at a position away from the printing surface MS on the -Z side). In this case, the processing system SYS performs additional processing on the workpiece W in a state in which the printing material M supplied from the material nozzle 212 reaches the printing surface MS before actually reaching the concentration region CP. However, the concentration region CP may be located on the printing surface MS. In other words, the processing system SYS may process the workpiece W in a state in which the printing material M supplied from the material nozzle 212 reaches the printing surface MS at the same time as it reaches the concentration region CP. Alternatively, the concentration region CP may be located above the printing surface MS (i.e., at a position away from the printing surface MS on the +Z side). In other words, the processing system SYS may process the workpiece W in a state in which the printing material M supplied from the material nozzle 212 reaches the printing surface MS after actually reaching the concentration region CP.

[0128] In this case, the size of the object added to the printing surface MS by additional processing (in the example shown in Figure 16, this is the size in the Z-axis direction, hereinafter referred to as the "printing amount") varies depending on the distance D1 between the printing surface MS and the processing head 21.

[0129] Specifically, as shown in FIG. 16, the longer the distance D1, the shorter the distance D2 between the concentration region CP and the printing surface MS. As a result, the amount of the printing material M supplied from the material nozzle 212 to the molten pool MP increases. This is because the shorter the distance D2, the closer the concentration region CP where the printing material M is concentrated is to the printing surface MS. The greater the amount of the printing material M supplied to the molten pool MP, the greater the amount of the printing material M melted in the molten pool MP. The greater the amount of the printing material M melted in the molten pool MP, the greater the amount of the printing material M solidified on the printing surface MS. As a result, the height of the object made of the solidified printing material M becomes higher. For this reason, as shown in FIG. 17, there is a relationship between the distance D2 and the printing amount such that the shorter the distance D2, the greater the printing amount. In other words, there is a relationship between the distance D2 and the printing amount such that the longer the distance D2, the smaller the printing amount. 17, there is a relationship between the distance D1 and the printing amount such that the longer the distance D1, the greater the printing amount. In other words, there is a relationship between the distance D1 and the printing amount such that the shorter the distance D1, the smaller the printing amount.

[0130] 17 shows a graph in which the distance D2 is a positive distance when the concentration area CP is located above the printing surface MS, and is a negative distance when the concentration area CP is located below the printing surface MS. As described above, the processing system SYS performs additional processing on the workpiece W in a state in which the concentration area CP is located below the printing surface MS (i.e., the printing surface MS is located between the concentration area CP and the material nozzle 212). For this reason, the distance D2 has a value within a range of an area (called a usage area) smaller than zero. In this case, the relationship that the shorter the distance D2 is, the greater the printing amount means that the smaller the absolute value of the distance D2 is, the greater the printing amount is. Similarly, the relationship that the longer the distance D2 is, the smaller the printing amount is, means that the larger the absolute value of the distance D2 is, the smaller the printing amount is. For this reason, in the following description, unless otherwise specified, the distance D2 means the absolute value of the distance D2.

[0131] The machining system SYS may use such a self-alignment function to perform additional machining on a plurality of workpieces W such that the difference in size (i.e., the difference in shape) between at least two of the plurality of workpieces W after the additional machining is performed is smaller than the difference in size between at least two of the plurality of workpieces W before the additional machining is performed. Hereinafter, the additional machining using the self-alignment function will be described with reference to FIG.

[0132] The top row of Fig. 18 shows a plurality of workpieces W including at least two workpieces W of different sizes (size in the Z-axis direction, height, in the example shown in Fig. 18). In the example shown in Fig. 18, the heights of workpieces W#1, W#3, and W#5 are each greater than the heights of workpieces W#2 and W#4. When additional processing is performed on multiple workpieces W including such workpieces W#1 to W#5, as shown in Figure 18, the distance D1#1 between the printing surface MS (i.e., the surface of workpiece W#1) and the material nozzle 212 when processing workpiece W#1, the distance D1#3 between the printing surface MS (i.e., the surface of workpiece W#3) and the material nozzle 212 when processing workpiece W#3, and the distance D1#5 between the printing surface MS (i.e., the surface of workpiece W#5) and the material nozzle 212 when processing workpiece W#5 are each shorter than the distance D1#2 between the printing surface MS (i.e., the surface of workpiece W#2) and the material nozzle 212 when processing workpiece W#2, and the distance D1#4 between the printing surface MS (i.e., the surface of workpiece W#4) and the material nozzle 212 when processing workpiece W#4. As a result, the manufacturing volume for the workpiece W#1, the manufacturing volume for the workpiece W#3, and the manufacturing volume for the workpiece W#5 are each smaller than the manufacturing volume for the workpiece W#2 and the manufacturing volume for the workpiece W#4, as shown in Fig. 18. Therefore, as shown in Fig. 18, the difference in size between each of the workpieces W#1, W#3, and W#5 and each of the workpieces W#2 and W#4 after the additional machining is performed is smaller than the difference in size between each of the workpieces W#1, W#3, and W#5 and each of the workpieces W#2 and W#4 before the additional machining is performed.

[0133] In this way, in the fifth modified example, the machining system SYS can perform additional machining on the multiple workpieces W such that the difference in size between the multiple workpieces W after the additional machining is performed is smaller than that before the additional machining is performed. Typically, the machining system SYS may perform additional machining on the multiple workpieces W such that the sizes of the multiple workpieces W after the additional machining are uniform.

[0134] In addition to the above-described embodiment, an operation specific to the fifth modified example may be performed in at least one of the first modified example to the fourth modified example. The operation specific to the fifth modified example may include an operation using a self-alignment function.

[0135] (4-6) Sixth Modification Next, a seventh modified example of the operation for performing additional machining on a plurality of workpieces W will be described with reference to Fig. 19. Fig. 19 is a flowchart showing the flow of the seventh modified example of the operation for performing additional machining on a plurality of workpieces W.

[0136] As shown in Fig. 16, in the sixth modified example, operations from step S11 to step S14 are performed similarly to the operations shown in Fig. 6. That is, a plurality of workpieces W are placed on the stage 31 (step S11), the measuring device 4 performs a measuring operation for measuring the shape of the workpieces W to be measured (step S12), the control device 7 generates common processing control information (step S13), and the processing system SYS performs an alignment operation (step S14).

[0137] Thereafter, the machining system SYS performs additional machining on the multiple workpieces W based on the common machining control information (step S61f). In particular, in step S61f, the machining system SYS sets a printing surface MS on the first surface (e.g., the surface facing the machining head 21) of each of the multiple workpieces W based on the common machining control information, and performs additional machining on the first surface.

[0138] Thereafter, the processing system SYS changes the orientation of the multiple workpieces W relative to the processing head 21 (i.e., the orientation of the stage 31 on which the multiple workpieces W are placed) (step S62f). At this time, the processing system SYS changes the orientation of the multiple workpieces W so that the printing surface MS can be set on the second surface of each of the multiple workpieces W (specifically, a surface different from the first surface on which the additional processing was performed in step S61f). For example, the processing system SYS may change the orientation of the multiple workpieces W so that the second surface of each of the multiple workpieces W faces the processing head 21.

[0139] Thereafter, the machining system SYS performs additional machining on the plurality of workpieces W based on the common machining control information (step S63f). In particular, in step S63f, the machining system SYS sets a printing surface MS on the second surface (e.g., the surface facing the machining head 21) of each of the plurality of workpieces W based on the common machining control information, and performs additional machining on the second surface.

[0140] The processing system SYS may change the postures of the multiple workpieces W by moving the stage 31 using the stage drive system 32 (i.e., changing the posture of the stage 31). For example, FIG. 20(a) is a cross-sectional view showing the positional relationship between the processing head 21 and the multiple workpieces W before moving the stage 31 to change the postures of the multiple workpieces W. In the state shown in FIG. 20(a), the processing system SYS can perform additional processing on the first surface W1 (e.g., the upper surface) of each of the multiple workpieces W by irradiating the processing light EL onto the first surface W1. On the other hand, FIG. 20(b) is a cross-sectional view showing the positional relationship between the processing head 21 and the multiple workpieces W after moving the stage 31 to change the postures of the multiple workpieces W. In the state shown in FIG. 20(a), the processing system SYS can perform additional processing on the second surface W2 (e.g., the side surface) of each of the multiple workpieces W by irradiating the processing light EL onto the second surface W2.

[0141] The processing system SYS may change the posture of the multiple workpieces W using the jig 33. In this case, the jig 33 may be configured to be able to change the posture of the multiple workpieces W. For example, the jig 33 may change the posture of the workpieces W held by the fixed claws 331 by moving the fixed claws 331 that hold the workpieces W. For example, FIG. 21(a) is a cross-sectional view showing the positional relationship between the processing head 21 and the multiple workpieces W before the jig 33 changes the posture of the multiple workpieces W. In the state shown in FIG. 21(a), the processing system SYS can perform additional processing on the first surface W1 by irradiating the first surface W1 (e.g., the upper surface) of each of the multiple workpieces W with the processing light EL. On the other hand, FIG. 21(b) is a cross-sectional view showing the positional relationship between the processing head 21 and the multiple workpieces W after the jig 33 changes the posture of the multiple workpieces W. In the state shown in Figure 21(a), the processing system SYS is capable of performing additional processing on the second surfaces W2 (e.g., side surfaces) of each of the multiple workpieces W by irradiating the processing light EL onto the second surfaces W2.

[0142] The machining system SYS may change the postures of the multiple workpieces W so that the modeling surface MS can be set on still other surfaces (specifically, surfaces other than the two surfaces on which additional machining was performed in steps S61f and 63f) of each of the multiple workpieces W. After that, the machining system SYS may perform additional machining on still other surfaces of each of the multiple workpieces W based on the common machining control information.

[0143] Thereafter, the processing system SYS continues additional processing on the multiple workpieces W included in the new work set WS until it is determined that there is no new work set WS (i.e., the next work set WS) including multiple workpieces W on which the processing system SYS should perform additional processing (steps S16 to S17 and steps S14 to S63f).

[0144] In this way, in the sixth modified example, the machining system SYS can perform additional machining on a plurality of locations (eg, a plurality of surfaces) of each workpiece W.

[0145] In addition, when additional processing is performed on multiple locations of the workpiece W by changing the posture of the workpiece W, in step S12 of FIG. 19, the measurement device 4 measures the shape of a first location among multiple locations of the workpiece W to be measured, and in step S13 of FIG. 19, the control device 7 may generate common processing control information based on the measurement result of the shape of the first location. Furthermore, in step S61f of FIG. 19, the processing system SYS may perform additional processing on each of the first locations of the multiple workpieces W based on the common processing control information generated from the measurement result of the shape of the first location. Furthermore, in step S63f of FIG. 19, the processing system SYS may perform additional processing on each of the second locations of the multiple workpieces W based on the common processing control information generated from the measurement result of the shape of the first location. Alternatively, the processing system SYS may perform additional processing on multiple locations of the workpiece W without changing the posture of the workpiece W. Even in this case, the machining system SYS may perform additional machining on the second locations of each of the multiple workpieces W based on common machining control information generated from the measurement results of the shape of the first locations.

[0146] In addition to the above-described embodiment, an operation specific to the sixth modified example may be performed in at least one of the first modified example to the fifth modified example. The operation specific to the sixth modified example may include an operation of performing additional machining on multiple locations (e.g., multiple surfaces) of the workpiece W.

[0147] (4-7) Seventh Modification Next, a description will be given of a seventh modified example of the operation of performing additional machining on a plurality of workpieces W. In the seventh modified example, the machining system SYS may perform additional machining on a plurality of workpieces W having a rotationally symmetric shape.

[0148] An example of the workpiece W having a rotationally symmetric shape is a shaft member extending along the longitudinal direction. An example of the shaft member is a turbine shaft that constitutes a turbine.

[0149] When additional machining is performed on a workpiece W having such a rotationally symmetric shape, as shown in Fig. 22, the multiple workpieces W may be placed on the stage 31 so that an axis extending along the center of rotation of the workpiece W having a rotationally symmetric shape (hereinafter referred to as the "central axis", for example, the central axis of a shaft member or the rotation axis of a turbine shaft) coincides with the rotation axis of the stage 31. In the example shown in Fig. 22, the multiple workpieces W are placed on the stage 31 so that the central axis of the workpieces W coincides with the rotation axis of the stage 31θX (i.e., the rotation axis extending along the rotating shaft 321θX).

[0150] 22, the processing system SYS may irradiate the workpiece W with the processing light EL from a direction intersecting the central axis of the workpiece W. In this case, if the processing system SYS has the above-mentioned self-alignment function, the processing system SYS may perform additional processing on the multiple workpieces W such that the difference in radius size between at least two of the multiple workpieces W after the additional processing is performed is smaller than the difference in radius size between at least two of the multiple workpieces W before the additional processing is performed. Typically, the processing system SYS may perform additional processing on the multiple workpieces W such that the radius sizes of the multiple workpieces W after the additional processing are uniform.

[0151] (4-8) Other variations In the above description, the machining system SYS performs a measurement operation to measure one of the multiple workpieces W using the measuring device 4 in order to generate the common machining control information. That is, the machining system SYS performs a measurement operation to measure a single measurement target workpiece W using the measuring device 4 in order to generate the common machining control information. However, the machining system SYS may perform a measurement operation to measure multiple measurement target workpieces W using the measuring device 4 in order to generate the common machining control information. In this case, the control device 7 may generate the common machining control information based on the measurement results of the measurement operation to measure the multiple measurement target workpieces W. For example, when the common machining control information is generated using a measurement model and a target model as shown in FIG. 10, the control device 7 may generate a measurement model equivalent to a three-dimensional model showing the actual average size and average shape of the multiple measurement target workpieces W based on the measurement results of the measurement operation to measure the multiple measurement target workpieces W.

[0152] In the above description, the processing system SYS is provided with a stage drive system 32. That is, in the above description, the stage 31 is movable. The processing system SYS does not have to be provided with a stage drive system 32. That is, the stage 31 does not have to be movable. In the above description, the processing system SYS is provided with a head drive system 22. That is, in the above description, the processing head 21 is movable. The processing system SYS does not have to be provided with a head drive system 22. That is, the processing head 21 does not have to be movable.

[0153] In the above description, the processing system SYS processes the workpiece W by irradiating the workpiece W with the processing light EL. However, the processing system SYS may process the workpiece W by irradiating the workpiece W with an arbitrary energy beam. In this case, the processing system SYS may include a beam irradiation device capable of irradiating an arbitrary energy beam in addition to or instead of the light source 5 and the irradiation optical system 211. An example of the arbitrary energy beam is at least one of a charged particle beam and an electromagnetic wave. An example of the charged particle beam is at least one of an electron beam and an ion beam.

[0154] (5) Additional Notes The following supplementary notes are further disclosed regarding the above-described embodiment. [Appendix 1] A processing device capable of performing additive processing on a plurality of objects; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to perform additional processing on a first object based on a result of a first measurement operation for measuring a shape of the first object among the plurality of objects; The processing device performs additional processing on the first object and additional processing on a second object different from the first object among the plurality of objects based on the first processing control information. Processing system. [Appendix 2] The apparatus further includes an object placement device on which the plurality of objects are placed, After the processing device performs additional processing on a plurality of third objects including the first and second objects, a plurality of fourth objects different from the plurality of third objects are placed on the object placement device, The processing device performs additional processing on the plurality of fourth objects based on the first processing control information. 2. The processing system of claim 1. [Appendix 3] The processing device includes: an energy beam irradiation unit that emits an energy beam to each of the plurality of objects; a material supply unit that supplies a modeling material to the portion irradiated with the energy beam; Equipped 3. The processing system according to claim 1 or 2. [Appendix 4] At least two of the plurality of objects differ in size. 4. The processing system of any one of claims 1 to 3. [Appendix 5] The difference in size of the at least two objects after the processing device performs additional processing is smaller than the difference in size of the at least two objects before the processing device performs additional processing. 5. The processing system of claim 4. [Appendix 6] The measuring device further includes a measuring device that performs the first measuring operation. 6. The processing system of any one of claims 1 to 5. [Appendix 7] a second measurement operation is performed to measure a shape of each of the plurality of objects before the processing device performs additional processing on the plurality of objects; The processing device does not perform additional processing on a fifth object, of the plurality of objects, whose shape measured by the second measurement operation does not satisfy a predetermined shape criterion. 7. The processing system of any one of claims 1 to 6. [Appendix 8] a second measurement operation is performed to measure a shape of each of the plurality of objects before the processing device performs additional processing on the plurality of objects; the control device corrects the first processing control information based on a measurement result, by the second measurement operation, of a shape of a fifth object among the plurality of objects, the shape of which does not satisfy a predetermined shape criterion; The processing device performs additional processing on the fifth object based on the corrected first processing control information. 8. The processing system of any one of claims 1 to 7. [Appendix 9] a second measurement operation is performed to measure the shape of each of the plurality of objects with a first measurement accuracy before the processing device performs additional processing on the plurality of objects; a third measurement operation is performed to measure a shape of a fifth object, the shape of which does not satisfy a predetermined shape criterion and is measured by the second measurement operation, with a second measurement accuracy higher than the first measurement accuracy; the control device generates second processing control information for controlling the processing device to perform additional processing on the fifth object based on a result of the third measurement operation; The processing device performs additional processing on the fifth object based on the second processing control information. 9. The processing system of any one of claims 1 to 8. [Appendix 10] The measuring device further includes a measuring device that performs the third measuring operation. 10. The processing system of claim 9. [Appendix 11] The measuring device further includes a measuring device that performs the second measuring operation. 11. The processing system of any one of claims 7 to 10. [Appendix 12] the second measurement operation is an operation of measuring a shape of each of the plurality of objects with a first measurement accuracy; The first measurement operation is an operation for measuring a shape of the first object with a second measurement accuracy higher than the first measurement accuracy. 12. The processing system of any one of claims 7 to 11. [Appendix 13] The second measurement operation is performed after a pre-processing process is performed on at least one of the plurality of objects. 13. The processing system of claim 7 to 12. [Appendix 14] The second measurement operation is performed before a pre-processing process is performed on at least one of the plurality of objects. 14. The processing system of claim 7 to 13. [Appendix 15] The pre-processing process includes a removal process for removing a part of at least one of the plurality of objects. 15. The processing system according to claim 13 or 14. [Appendix 16] After the processing device performs additional processing on at least one of the first and second objects, a fourth measurement operation is performed to measure a shape of at least one of the first and second objects. 16. The processing system of claim 1. [Appendix 17] The processing device processes at least one of the first and second objects based on a result of the fourth measurement operation. 17. The processing system of claim 16. [Appendix 18] The processing device processes at least one of the first and second objects so that a shape of at least one of the first and second objects becomes a desired shape based on a result of the fourth measurement operation. 18. The processing system according to claim 16 or 17. [Appendix 19] The measuring device further includes a measuring device for performing the fourth measuring operation. 19. The processing system of any one of claims 16 to 18. [Appendix 20] The measuring device outputs information regarding a result of the fourth measuring operation to a device external to the processing system. 20. The processing system of claim 19. [Appendix 21] an object placement device on which the plurality of objects are placed; a posture changing device capable of changing the posture of the object placement device; Further comprising: The processing device performs additional processing on a first surface of each of the first and second objects, and after the orientation change device changes the orientation of the object placement device, performs additional processing on a second surface of each of the first and second objects that is different from the first surface. 21. The processing system of any one of claims 1 to 20. [Appendix 22] the processing device performs additional processing on the plurality of objects placed on a jig; The posture of the plurality of objects placed on the jig is changeable, The processing device performs additional processing on a first surface of each of the first and second objects, and after the jig changes the posture of the plurality of objects, performs additional processing on a second surface of each of the first and second objects that is different from the first surface. 22. The processing system of any one of claims 1 to 21. [Appendix 23] At least one of the plurality of objects includes a turbine blade and a turbine shaft. 23. The processing system of any one of claims 1 to 22. [Appendix 24] A processing device capable of repairing a plurality of objects; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to process the first object based on at least one of shape information on a post-repair shape of a first object among the plurality of objects and a measurement result of the shape of the first object; The processing device repairs the first object and a second object different from the first object among the plurality of objects based on the first processing control information. Processing system. [Appendix 25] The control device generates the first processing control information based on a comparison result between the shape information on the shape of the first object after repair and a measurement result of the shape of the first object. 25. The processing system of claim 24. [Appendix 26] A processing device capable of repairing a plurality of portions of an object; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to process the first location based on at least one of shape information regarding a shape of a first location among the plurality of locations after repair and a measurement result of the shape of the first location; The processing device repairs the first location and a second location different from the first location among the plurality of locations based on the first processing control information. Processing system. [Appendix 27] A processing device capable of additional processing on multiple workpieces; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to process the first workpiece based on at least one of shape information regarding a shape of a model of a first object formed on the plurality of workpieces and a measurement result of a shape of a first workpiece among the plurality of workpieces; The processing device performs repair processing on the first workpiece and a second workpiece different from the first workpiece among the plurality of objects based on the first processing control information. Processing system. [Appendix 28] A processing device capable of processing a plurality of objects; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to perform processing on a first object based on a result of a first measurement operation for measuring a shape of the first object among the plurality of objects; The processing device performs processing on the first object and processing on a second object different from the first object among the plurality of objects based on the first processing control information. Processing system. [Appendix 29] performing a first measurement operation to measure a shape of a first object of the plurality of objects; generating first processing control information for performing additional processing on the first object based on a result of the first measurement operation; performing additional processing on the first object and additional processing on a second object different from the first object among the plurality of objects based on the first processing control information; A processing method comprising the steps of: [Appendix 30] placing a plurality of third objects including the first and second objects on an object placement device; After additional processing is performed on the third objects placed on the object placement device, placing a fourth object different from the third objects on the object placement device; performing additional processing on the plurality of fourth objects based on the first processing control information; The processing method according to claim 29, comprising: [Appendix 31] At least two of the plurality of objects differ in size. Attachment 29 or 30. The processing method according to claim 29 or 30. [Appendix 32] The difference in size of the at least two objects after additional processing is performed is less than the difference in size of the at least two objects before additional processing is performed. 32. The processing method according to claim 31. [Appendix 33] performing a second measurement operation to measure a shape of each of the plurality of objects before additional processing is performed on the plurality of objects; No additional processing is performed on a fifth object among the plurality of objects, the shape of which measured by the second measuring operation does not satisfy a predetermined shape criterion. 33. The processing method according to any one of appendix 29 to 32. [Appendix 34] performing a second measurement operation to measure a shape of each of the plurality of objects before additional processing is performed on the plurality of objects; correcting the first processing control information based on a measurement result, by the second measurement operation, of a shape of a fifth object among the plurality of objects, the shape of which does not satisfy a predetermined shape criterion; performing additional processing on the fifth object based on the corrected first processing control information; The processing method according to any one of appendices 29 to 33, comprising: [Appendix 35] performing a second measurement operation to measure a shape of each of the plurality of objects before additional processing is performed on the plurality of objects; performing a third measurement operation to measure a shape of a fifth object, the shape of which does not satisfy a predetermined shape criterion, among the plurality of objects, with a second measurement accuracy higher than the first measurement accuracy; generating second processing control information for performing additional processing on the fifth object based on a result of the third measurement operation; performing additional processing on the fifth object based on the second processing control information; The method of any one of appendices 29 to 34, comprising: [Appendix 36] the second measurement operation is an operation of measuring a shape of each of the plurality of objects with a first measurement accuracy; The first measurement operation is an operation for measuring a shape of the first object with a second measurement accuracy higher than the first measurement accuracy. 36. The processing method according to any one of appendix 33 to 35. [Appendix 37] Performing the second measurement operation includes performing the second measurement operation after a pre-processing process is performed on at least one of the plurality of objects. 37. The processing method according to claims 33 to 36. [Appendix 38] Performing the second measurement operation includes performing the second measurement operation before a pre-processing process is performed on at least one of the plurality of objects. 38. The processing method according to claims 33 to 37. [Appendix 39] The pre-processing process includes a removal process for removing a part of at least one of the plurality of objects. 39. The processing method according to claim 37 or 38. [Appendix 40] and performing a fourth measurement operation of measuring a shape of at least one of the first and second objects after additional processing is performed on at least one of the first and second objects. 40. The processing method according to claims 29 to 39. [Appendix 41] and processing at least one of the first and second objects based on results of the fourth measurement operation. 41. The processing method according to claim 40. [Appendix 42] and processing at least one of the first and second objects so that the shape of at least one of the first and second objects is a desired shape based on a result of the fourth measurement operation. 42. The processing method according to claim 40 or 41. [Appendix 43] and outputting information about a result of the fourth measurement operation to a processing device that processes at least one of the first and second objects based on the result of the fourth measurement operation. 43. The method of any one of claims 40 to 42. [Appendix 44] Performing additional processing on the first and second objects includes: performing additional processing on a first surface of each of the first and second objects; changing a posture of the object placement device on which the first and second objects are placed; performing additional processing on second surfaces of the first and second objects, the second surfaces being different from the first surfaces; The method of any one of claims 29 to 43, comprising: [Appendix 45] Performing additional processing on the first and second objects includes: performing additional processing on a first surface of each of the first and second objects; Changing the orientation of the plurality of objects placed on a jig; performing additional processing on second surfaces of the first and second objects, the second surfaces being different from the first surfaces; The method of any one of claims 29 to 44, comprising: [Note 46] At least one of the plurality of objects includes a turbine blade and a turbine shaft. 46. ​​The method of any one of claims 29 to 45. [Appendix 47] The additional processing includes repair processing, Generating the first processing control information includes generating the first processing control information based on at least one of shape information regarding a shape of the first object after repair and a result of the first measurement operation. 47. The method according to any one of claims 29 to 46. [Appendix 48] Generating the first processing control information based on at least one of the shape information and the first measurement result includes generating the first processing control information based on a comparison result between the shape information and a result of the first measurement operation. 48. The processing method described in Appendix 47. [Appendix 49] the plurality of objects are a plurality of workpieces including first and second workpieces corresponding to the first and second objects, respectively; generating the first processing control information includes generating, as the first processing control information, processing control information for processing the first workpiece based on at least one of shape information relating to a shape of a model of a sixth object formed on a plurality of workpieces and a result of the first measurement operation; The additional processing includes repair processing. 49. The processing method according to any one of appendix 29 to 48. [Appendix 50] generating first processing control information for processing a first object based on at least one of shape information relating to a shape after repair of the first object among a plurality of objects and a measurement result of the shape of the first object; repairing the first object and a second object different from the first object among the plurality of objects based on the first processing control information; A processing method comprising the steps of: [Appendix 51] Generating the first processing control information based on at least one of the shape information and the measurement result includes generating the first processing control information based on a comparison result between the shape information and the measurement result. 51. The processing method according to claim 50. [Appendix 52] generating first processing control information for processing a first portion based on at least one of shape information relating to a shape of the first portion after repair among a plurality of portions of an object and a measurement result of the shape of the first portion; repairing the first location and a second location, which is different from the first location, among the plurality of locations based on the first processing control information; A processing method comprising the steps of: [Appendix 53] generating first processing control information for processing the first workpiece based on at least one of shape information relating to a shape of a model of a first object formed on a plurality of workpieces and a measurement result of a shape of a first workpiece among the plurality of workpieces; repairing the first workpiece and a second workpiece different from the first workpiece among the plurality of workpieces based on the first processing control information; A processing method comprising the steps of: [Appendix 54] performing a first measurement operation to measure a shape of a first object of the plurality of objects; generating first processing control information for processing the first object based on a result of the first measurement operation; performing a process on the first object and a process on a second object different from the first object among the plurality of objects based on the first process control information; A processing method comprising the steps of: [Appendix 55] A processing device capable of performing additive processing on a plurality of objects; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to perform additional processing on a first object based on a result of a first measurement operation for measuring a shape of the first object among the plurality of objects; The processing device performs additional processing on the first object and additional processing on a second object different from the first object among the plurality of objects based on the first processing control information. Processing system. [Appendix 56] A processing device capable of repairing a plurality of objects; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to process the first object based on at least one of shape information on a post-repair shape of a first object among the plurality of objects and a measurement result of the shape of the first object; The processing device repairs the first object and a second object different from the first object among the plurality of objects based on the first processing control information. Processing system. [Appendix 57] A processing device capable of repairing a plurality of portions of an object; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to process the first location based on at least one of shape information regarding a shape of a first location among the plurality of locations after repair and a measurement result of the shape of the first location; The processing device repairs the first location and a second location different from the first location among the plurality of locations based on the first processing control information. Processing system. [Appendix 58] A processing device capable of additional processing on multiple workpieces; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to process the first workpiece based on at least one of shape information regarding a shape of a model of a first object formed on the plurality of workpieces and a measurement result of a shape of a first workpiece among the plurality of workpieces; The processing device performs repair processing on the first workpiece and a second workpiece different from the first workpiece among the plurality of objects based on the first processing control information. Processing system. [Appendix 59] A processing device capable of processing a plurality of objects; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to perform processing on a first object based on a result of a first measurement operation for measuring a shape of the first object among the plurality of objects; The processing device performs processing on the first object and processing on a second object different from the first object among the plurality of objects based on the first processing control information. Processing system. [Appendix 60] A processing device capable of processing an object; a jig having a structure capable of holding the object and having a through hole formed therein; and a stage device having a pin structure insertable into the through hole formed therein, the stage device having the jig placed thereon with the pin structure inserted into the through hole; A processing system comprising:

[0155] At least a part of the components of each of the above-mentioned embodiments can be appropriately combined with at least a part of other components of each of the above-mentioned embodiments. Some of the components of each of the above-mentioned embodiments may not be used. In addition, to the extent permitted by law, the disclosures of all publications and U.S. patents cited in each of the above-mentioned embodiments are incorporated by reference into the present description.

[0156] The present invention is not limited to the above-described embodiments, but may be modified as appropriate within the scope of the claims and the gist or concept of the invention as can be read from the entire specification, and processing systems involving such modifications are also included in the technical scope of the present invention. [Explanation of symbols]

[0157] 2 Modeling equipment 21 Sculpted head 22 Head drive system 3. Stage Equipment 31, 31θX, 31θZ stage 32 Stage drive system 7 Control device Double work EL processing light ST 3D structure

Claims

1. A processing device capable of performing additive processing on a plurality of objects; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to perform additional processing on a first object based on a result of a first measurement operation for measuring a shape of the first object among the plurality of objects; The processing device performs additional processing on the first object and additional processing on a second object different from the first object among the plurality of objects based on the first processing control information. Processing system.

2. The apparatus further includes an object placement device on which the plurality of objects are placed, After the processing device performs additional processing on a plurality of third objects including the first and second objects, a plurality of fourth objects different from the plurality of third objects are placed on the object placement device, The processing device performs additional processing on the plurality of fourth objects based on the first processing control information. The processing system of claim 1 .

3. The processing device includes: an energy beam irradiation unit that emits an energy beam to each of the plurality of objects; a material supply unit that supplies a modeling material to the portion irradiated with the energy beam; Equipped The processing system according to claim 1 or 2.

4. At least two of the plurality of objects differ in size. The processing system according to any one of claims 1 to 3.

5. The difference in size of the at least two objects after the processing device performs additional processing is smaller than the difference in size of the at least two objects before the processing device performs additional processing. The processing system according to claim 4 .

6. The measuring device further includes a measuring device that performs the first measuring operation. The processing system according to any one of claims 1 to 5.

7. a second measurement operation is performed to measure shapes of the plurality of objects before the processing device performs additional processing on the plurality of objects; The processing device does not perform additional processing on a fifth object, of the plurality of objects, whose shape measured by the second measurement operation does not satisfy a predetermined shape criterion. The processing system according to any one of claims 1 to 6.

8. a second measurement operation is performed to measure shapes of the plurality of objects before the processing device performs additional processing on the plurality of objects; the control device corrects the first processing control information based on a measurement result, by the second measurement operation, of a shape of a fifth object among the plurality of objects, the shape of which does not satisfy a predetermined shape criterion; The processing device performs additional processing on the fifth object based on the corrected first processing control information. The processing system according to any one of claims 1 to 7.

9. a second measurement operation is performed to measure the shapes of the plurality of objects with a first measurement accuracy before the processing device performs additional processing on the plurality of objects; a third measurement operation is performed to measure a shape of a fifth object, the shape of which does not satisfy a predetermined shape criterion and is measured by the second measurement operation, with a second measurement accuracy higher than the first measurement accuracy; the control device generates second processing control information for controlling the processing device to perform additional processing on the fifth object based on a result of the third measurement operation; The processing device performs additional processing on the fifth object based on the second processing control information. The processing system according to any one of claims 1 to 8.

10. The measuring device further includes a measuring device that performs the third measuring operation. The processing system of claim 9.

11. The measuring device further includes a measuring device that performs the second measuring operation. The processing system according to any one of claims 7 to 10.

12. the second measurement operation is an operation of measuring a shape of each of the plurality of objects with a first measurement accuracy; The first measurement operation is an operation for measuring a shape of the first object with a second measurement accuracy higher than the first measurement accuracy. The processing system according to any one of claims 7 to 11.

13. The second measurement operation is performed after pre-processing is performed on at least one of the plurality of objects. A processing system according to any one of claims 7 to 12.

14. The second measurement operation is performed before a pre-processing process is performed on at least one of the plurality of objects. A processing system according to any one of claims 7 to 13.

15. The pre-processing process includes a removal process for removing a part of at least one of the plurality of objects.

15. The processing system according to claim 13 or 14.

16. After the processing device performs additional processing on at least one of the first and second objects, a fourth measurement operation is performed to measure a shape of at least one of the first and second objects. A processing system according to any one of claims 1 to 15.

17. The processing device processes at least one of the first and second objects based on a result of the fourth measurement operation.

17. The processing system of claim 16.

18. The processing device processes at least one of the first and second objects so that a shape of at least one of the first and second objects becomes a desired shape based on a result of the fourth measurement operation.

18. A processing system according to claim 16 or 17.

19. The measuring device further includes a measuring device that performs the fourth measuring operation.

19. The processing system according to any one of claims 16 to 18.

20. The measuring device outputs information regarding a result of the fourth measuring operation to a device external to the processing system.

20. The processing system of claim 19.

21. an object placement device on which the plurality of objects are placed; a posture changing device capable of changing the posture of the object placement device; Further comprising: The processing device performs additional processing on a first surface of each of the first and second objects, and after the orientation change device changes the orientation of the object placement device, performs additional processing on a second surface of each of the first and second objects, the second surface being different from the first surface.

21. The processing system according to any one of claims 1 to 20.

22. the processing device performs additional processing on the plurality of objects placed on a jig; The posture of the plurality of objects placed on the jig is changeable, The processing device performs additional processing on a first surface of each of the first and second objects, and after the jig changes the posture of the plurality of objects, performs additional processing on a second surface of each of the first and second objects that is different from the first surface.

22. The processing system of any one of claims 1 to 21.

23. At least one of the plurality of objects includes a turbine blade and a turbine shaft.

23. The processing system of any one of claims 1 to 22.

24. A processing device capable of repairing a plurality of objects; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to process the first object based on at least one of shape information relating to a post-repair shape of a first object among the plurality of objects and a measurement result of the shape of the first object; The processing device repairs the first object and a second object different from the first object among the plurality of objects based on the first processing control information. Processing system.

25. The control device generates the first processing control information based on a comparison result between the shape information on the shape of the first object after repair and a measurement result of the shape of the first object.

25. The processing system of claim 24.

26. A processing device capable of repairing a plurality of portions of an object; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to process the first location based on at least one of shape information regarding a shape of a first location after repair among the plurality of locations and a measurement result of the shape of the first location; The processing device repairs the first location and a second location different from the first location among the plurality of locations based on the first processing control information. Processing system.

27. A processing device capable of additional processing on multiple workpieces; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to process the first workpiece based on at least one of shape information relating to a shape of a model of a first object formed on the plurality of workpieces and a measurement result of a shape of a first workpiece among the plurality of workpieces; The processing device performs repair processing on the first workpiece and a second workpiece different from the first workpiece among the plurality of objects based on the first processing control information. Processing system.

28. A processing device capable of processing a plurality of objects; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to perform processing on a first object based on a result of a first measurement operation for measuring a shape of the first object among the plurality of objects; The processing device performs processing on the first object and processing on a second object different from the first object among the plurality of objects based on the first processing control information. Processing system.

29. A processing device capable of performing additive processing on a plurality of objects; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to perform additional processing on a first object based on a result of a first measurement operation for measuring a shape of the first object among the plurality of objects; The processing device performs additional processing on the first object and additional processing on a second object different from the first object among the plurality of objects based on the first processing control information. Processing system.

30. A processing device capable of repairing a plurality of objects; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to process the first object based on at least one of shape information relating to a post-repair shape of a first object among the plurality of objects and a measurement result of the shape of the first object; The processing device repairs the first object and a second object different from the first object among the plurality of objects based on the first processing control information. Processing system.

31. A processing device capable of repairing a plurality of portions of an object; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to process the first location based on at least one of shape information regarding a shape of a first location after repair among the plurality of locations and a measurement result of the shape of the first location; The processing device repairs the first location and a second location different from the first location among the plurality of locations based on the first processing control information. Processing system.

32. A processing device capable of additional processing on multiple workpieces; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to process the first workpiece based on at least one of shape information relating to a shape of a model of a first object formed on the plurality of workpieces and a measurement result of a shape of a first workpiece among the plurality of workpieces; The processing device performs repair processing on the first workpiece and a second workpiece different from the first workpiece among the plurality of objects based on the first processing control information. Processing system.

33. A processing device capable of processing a plurality of objects; A control device capable of controlling the processing device; Equipped with the control device generates first processing control information for controlling the processing device to perform processing on a first object based on a result of a first measurement operation for measuring a shape of the first object among the plurality of objects; The processing device performs processing on the first object and processing on a second object different from the first object among the plurality of objects based on the first processing control information. Processing system.

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