Antenna device and communication device

Abstract

To provide an antenna device capable of improving antenna gain without increasing the size of an antenna module.SOLUTION: An array antenna accommodated in a housing faces the inner surface of the housing and includes a plurality of antenna elements arranged at least one-dimensionally in a first direction. A plurality of waveguides are coupled to the plurality of antenna elements of the array antenna and extend from the plurality of antenna elements toward the inner surface of the housing, respectively. For two waveguides respectively coupled to two antenna elements adjacent to each other in the first direction, the distance in the first direction between the end faces on the inner surface side of the housing is wider than the distance in the first direction between the end faces on the array antenna side.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to an antenna device and a communication device. [Background technology]

[0002] Patent Document 1 below discloses an antenna device in which a dielectric spacer is disposed between a substrate on which an array antenna is provided and a dielectric cover. A conductive layer is disposed around the area of ​​the inner surface of the dielectric cover facing the dielectric spacer, and a vertical conductive layer is disposed on the side of the dielectric spacer. Radio waves radiated from the array antenna pass through the dielectric spacer and the dielectric cover and are radiated to the outside. The conductive film suppresses the generation of surface waves, resulting in a good radiation pattern. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2019 / 0312347 Summary of the Invention [Problem to be solved by the invention]

[0004] There is a demand for improving the gain of an array antenna. The gain can be improved by increasing the area of ​​the array antenna. On the other hand, there is a demand for miniaturization of an antenna module including an array antenna and a substrate. Increasing the area of ​​the array antenna to improve the gain runs counter to miniaturization of the antenna module.

[0005] An object of the present invention is to provide an antenna device capable of improving antenna gain without increasing the size of the antenna module. Another object of the present invention is to provide a communication device equipped with the antenna device. [Means for solving the problem]

[0006] According to one aspect of the present invention, A housing and an array antenna that is accommodated in the housing, faces an inner surface of the housing, and includes a plurality of antenna elements that are arranged at least one-dimensionally in a first direction; a plurality of waveguides coupled to the plurality of antenna elements of the array antenna, the plurality of waveguides extending from the plurality of antenna elements toward an inner surface of the housing; Equipped with An antenna device is provided in which, for two of the multiple waveguides respectively coupled to two antenna elements adjacent in the first direction, the spacing in the first direction between the end faces on the inner surface side of the housing is wider than the spacing in the first direction between the end faces on the array antenna side.

[0007] According to another aspect of the invention, The antenna device; a radio frequency integrated circuit that is accommodated in the housing of the antenna device and that supplies radio frequency signals to a plurality of antenna elements of the array antenna; A communication device is provided, comprising: Effect of the Invention

[0008] The end face of the waveguide on the inner side of the housing acts as a secondary wave source. The distance in the first direction between the end faces of the waveguide acting as the secondary wave source is wider than the distance in the first direction between the end faces on the array antenna side, so that the effective area of ​​the antenna elements is expanded and the gain can be improved without increasing the dimensions of the array antenna. [Brief description of the drawings]

[0009] [Figure 1] 1A and 1B are a see-through perspective view and a cross-sectional view, respectively, of a portion of an antenna device according to a first preferred embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view of an antenna device according to a modified example of the first preferred embodiment. [Diagram 3] 3A, 3B, and 3C are cross-sectional views showing more specific structures of the antenna device according to the first preferred embodiment or its modified examples. [Figure 4] 4A and 4B are cross-sectional views showing a more specific structure of the antenna device according to the first preferred embodiment or its modified example. [Diagram 5] 5A, 5B, and 5C are cross-sectional views showing more specific structures of the antenna device according to the first preferred embodiment or its modifications. [Figure 6] 6A, 6B, and 6C are cross-sectional views showing more specific structures of the antenna device according to the first preferred embodiment or its modified examples. [Figure 7] FIG. 7 is a cross-sectional view showing a more specific structure of the antenna device according to a modification of the first preferred embodiment. [Figure 8] 8A and 8B are cross-sectional views showing a more specific structure of the antenna device according to the first embodiment. [Figure 9] FIG. 9 is a cross-sectional view showing another more specific structure of the antenna device according to the first embodiment. [Figure 10] FIG. 10A is a cross-sectional view of the antenna device according to the second preferred embodiment, and FIG. 10B is a cross-sectional view showing a more specific configuration of the antenna device according to the second preferred embodiment. [Figure 11] FIG. 11 is a diagram showing the arrangement of each component in the xz plane of the antenna device according to a modified example of the second preferred embodiment. [Figure 12] FIG. 12 is a cross-sectional view of an antenna device according to the third preferred embodiment. [Figure 13] FIG. 13 is a cross-sectional view of an antenna device according to the fourth preferred embodiment. [Figure 14] FIG. 14 is a cross-sectional view of the antenna device according to the fifth preferred embodiment. [Figure 15] FIG. 15 is a cross-sectional view of an antenna device according to the sixth preferred embodiment. [Figure 16] FIG. 16 is a cross-sectional view of the antenna device according to the seventh preferred embodiment. [Figure 17] FIG. 17 is a cross-sectional view of an antenna device according to a modification of the seventh preferred embodiment. [Figure 18] FIG. 18 is a block diagram of a communication device according to the eighth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] [First Example] An antenna device according to a first embodiment will be described with reference to FIGS. 1A and 1B. 1A and 1B are respectively a see-through perspective view and a cross-sectional view of a portion of an antenna device according to a first embodiment. A substrate 10 is housed in a housing 50, and a plurality of antenna elements 11, for example, two antenna elements 11, are arranged on the substrate 10. The plurality of antenna elements 11 face a first region 55A on the inner surface of the housing 50, and are arranged lined up one-dimensionally to form an array antenna 12. An xyz Cartesian coordinate system is defined in which the direction in which the plurality of antenna elements 11 are arranged is the x direction, and the normal direction of the first region 55A is the y direction. The direction from the antenna element 11 to the first region 55A is defined as the positive direction of the y axis.

[0011] The waveguide 20 is coupled to the array antenna 12 and extends from the array antenna 12 toward the first region 55A. Here, "coupling" means electromagnetic coupling, and refers to a state in which an electromagnetic field or electromagnetic wave flows from the array antenna 12 to the waveguide 20, or vice versa. More specifically, one waveguide 20 is coupled to a plurality of antenna elements 11. The cross section of the waveguide 20 perpendicular to the y axis spreads in the x direction from the array antenna 12 toward the first region 55A. In the z direction, the cross-sectional dimensions of the waveguide 20 are constant. The waveguide 20 may be shaped to spread in both the x direction and the z direction from the array antenna 12 toward the first region 55A.

[0012] When the array antenna 12 is viewed in a plan view from the y direction, the multiple antenna elements 11 are included in an end face 22 of the waveguide 20 on the array antenna 12 side (hereinafter, sometimes referred to as an end face on the antenna side). The dimensions in the x direction of the end face 21 of the waveguide 20 on the first region 55A side of the inner surface of the housing 50 (hereinafter, sometimes referred to as an end face on the housing side) and the end face 22 on the antenna side are denoted as Lx1 and Lx2, respectively. The dimension Lx1 can also be defined as the length from one end to the other end in the x direction of the end face 21 on the housing side of the waveguide 20. Similarly, the dimension Lx2 can also be defined as the length from one end to the other end in the x direction of the end face 22 on the antenna side of the waveguide 20.

[0013] In the first embodiment, Lx1>Lx2 holds. Therefore, the area of ​​the end face 21 of the waveguide 20 on the housing side is larger than the area of ​​the end face 22 on the antenna side. For example, a metal waveguide is used as the waveguide 20. The "end face" of the waveguide 20 means the opening at the end of the metal waveguide. The internal space defined by the metal waveguide is filled with air.

[0014] When the first region 55A is viewed from above, a transmission window 51 made of a dielectric material that encompasses the end face 21 of the waveguide 20 on the housing side is provided in the housing 50. The periphery of the transmission window 51 in the housing 50 is formed of a metal wall 52. The radio waves radiated from the array antenna 12 pass through the inside of the waveguide 20, pass through the transmission window 51, and are radiated to the outside of the housing 50.

[0015] Next, the excellent effects of the first embodiment will be described. In the antenna device according to the first embodiment, the antenna-side end face 22 of the waveguide 20 includes a plurality of antenna elements 11. That is, the area of ​​the antenna-side end face 22 is larger than the area of ​​the convex hull of the plurality of antenna elements 11 (hereinafter, sometimes simply referred to as the area of ​​the array antenna 12). Here, the convex hull means a polygon with the smallest area that includes the plurality of antenna elements 11. Furthermore, the area of ​​the housing-side end face 21 of the waveguide 20 is larger than the area of ​​the antenna-side end face 22. The antenna element 11 serves as a primary wave source, and the housing-side end face 21 of the waveguide 20 operates as a secondary wave source. That is, each point on the housing-side end face 21 of the waveguide 20 serves as a wave source of a secondary wave based on the Huygens-Fresnel principle. Since the area of ​​the end face 21 operating as a secondary wave source is larger than the area of ​​the array antenna 12, a higher gain can be obtained compared to the case where the array antenna 12 is used alone.

[0016] Furthermore, since the area of ​​the array antenna 12 is smaller than the end face 21 of the waveguide 20 on the housing side, the antenna module including the array antenna 12 and the substrate 10 can be made smaller.

[0017] Next, a modified example of the first embodiment will be described with reference to FIG. Fig. 2 is a cross-sectional view of an antenna device according to a modified example of the first embodiment. In the first embodiment (Figs. 1A and 1B), a metal waveguide is used as the waveguide 20. In contrast, in the modified example shown in Fig. 2, a dielectric waveguide is used as the waveguide 20. An end face 21 on the housing side and an end face 22 on the antenna side of the waveguide 20 correspond to the end face facing the first region 55A of the dielectric waveguide and the end face facing the array antenna 12, respectively.

[0018] The dielectric constant of the dielectric material constituting the waveguide 20 is higher than the dielectric constant of the space adjacent to the side surface of the waveguide 20. Even if a dielectric waveguide is used as the waveguide 20 as in the modified example shown in Fig. 2, the same effects as those of the first embodiment can be obtained.

[0019] In the first embodiment, the internal space of the waveguide 20, which is a metal waveguide, is filled with air, but the internal space may be filled with a dielectric material. The excellent effects of employing a configuration in which the internal space is filled with a dielectric material will be described below.

[0020] The dielectric constant of the dielectric material of the substrate 10 on which the array antenna 12 is provided is generally 2 or more and 8 or less. The dielectric constant of the dielectric material used for the transmission window 51 of the housing 50 is generally 3 or more and 10 or less. When the metal waveguide is filled with air, the dielectric constant of the internal space of the metal waveguide is 1. Therefore, impedance mismatch is large at the end face 22 on the antenna side of the waveguide 20 and the end face 21 on the housing side. If the internal space of the metal waveguide is filled with a dielectric material, the impedance mismatch is reduced. In particular, it is preferable to set the dielectric constant of the dielectric material filled in the metal waveguide to a value intermediate between the dielectric constant of the substrate 10 and the dielectric constant of the transmission window 51.

[0021] Furthermore, the dielectric material in the metal waveguide functions as a heat path from the substrate 10 to the housing 50. When a heat source such as a high-frequency integrated circuit is mounted on the substrate 10, the heat dissipation characteristics from the heat source to the housing 50 can be improved.

[0022] Next, another modification of the first embodiment will be described. In the antenna device according to the first embodiment, a one-dimensional array antenna in which a plurality of antenna elements 11 are arranged in the x direction is used as the array antenna 12, but a two-dimensional array antenna may be configured by arranging a plurality of antenna elements 11 two-dimensionally as the array antenna 12. For example, a plurality of antenna elements 11 may be arranged in a matrix in the xz plane direction. In this case, too, the antenna side end face 22 of the waveguide 20 is arranged so as to include the plurality of antenna elements 11. The waveguide 20 may be shaped so that the area of ​​the cross section perpendicular to the y axis gradually increases from the antenna side end face 22 toward the housing side end face 21. For example, the waveguide 20 may be shaped like a quadrangular pyramid.

[0023] In the antenna device according to the first embodiment, the transmitting window 51 made of a dielectric is disposed in a portion of the metal wall 52 of the housing 50, but the metal wall 52 may also be made of a dielectric. In this case, the degree of positioning flexibility between the waveguide 20 and the housing 50 is increased.

[0024] Next, specific examples of fixing the waveguide 20 and the substrate 10 in the antenna device according to the first embodiment and its modified examples will be described with reference to Figures 3A to 8B. Figures 3A to 8B are cross-sectional views showing more specific structures of the antenna device according to the first embodiment or its modified examples.

[0025] In the specific example shown in FIG. 3A, the waveguide 20 is defined by a cavity penetrating the conductive member 23. The surface of the conductive member 23 facing the first region 55A is fixed to the inner surface of the housing 50 via the adhesive layer 24. The substrate 10 on which the multiple antenna elements 11 are arranged is fixed to the conductive member 23 via the adhesive layer 24. The adhesive layer 24 may be an adhesive, a double-sided tape, or the like. In a configuration in which the outer periphery of the end face 21 on the housing side of the waveguide 20 is approximately aligned with the outer periphery of the transmission window 51 made of a dielectric, the metal wall 52 of the housing 50 functions as a waveguide connected to the waveguide 20.

[0026] In the specific example shown in Fig. 3B, the adhesive layer 24 is also disposed on the end face 21 on the housing side and the end face 22 on the antenna side of the waveguide 20, i.e., on the region corresponding to the opening. In the example shown in Fig. 3B, for example, when adhesive is applied to the inner surface of the housing 50 or the substrate 10 and the conductive member 23 is bonded, it is not necessary to precisely adjust the adhesive application range, and therefore the manufacturing process can be simplified. In addition, when double-sided tape is used for the adhesive layer 24, it is not necessary to cut off the double-sided tape in the region corresponding to the end face 21 on the housing side and the end face 22 on the antenna side of the waveguide 20, and therefore the manufacturing process can be simplified.

[0027] 3C, a dielectric waveguide is used as the waveguide 20. One end face 21 of the dielectric waveguide is fixed to a first region 55A of the inner surface of the housing 50 via an adhesive layer 24. The substrate 10 is fixed to the other end face 22 of the dielectric waveguide via the adhesive layer 24.

[0028] In the specific example shown in Fig. 4A, the conductive member 23 that defines the waveguide 20 is fixed to the metal wall 52 of the housing 50 by the screw 25. The substrate 10 is fixed to the conductive member 23 by the screw 26. The metal wall 52 of the housing 50 and the conductive member 23 may be made of the same metal material or different metal materials. The metal wall 52 of the housing 50 and the conductive member 23 may be processed integrally. In this case, the screw 25 is not necessary.

[0029] In the specific example shown in FIG. 4B, a dielectric waveguide is used as the waveguide 20. A dielectric waveguide support member 27 is in contact with the side surface of the waveguide 20. The dielectric constant of the dielectric waveguide support member 27 is lower than the dielectric constant of the dielectric material constituting the waveguide 20. The dielectric waveguide support member 27 surrounds the waveguide 20 from the side surface. The dielectric waveguide support member 27 is fixed to a metal wall 52 of the housing 50 by a screw 25. The substrate 10 is fixed to the dielectric waveguide support member 27 by a screw 26.

[0030] In the specific example shown in FIG. 5A, the conductive member 23, the substrate 10, and the heat dissipation member 16 that define the waveguide 20 are fixed to the housing 50 by a fixing member 28. The fixing member 28 includes a bottom 28A, a side wall 28B, and a mounting portion 28C. The fixing member 28 is formed of, for example, a metal. The conductive member 23, the substrate 10, the heat dissipation member 16, and the bottom 28A are stacked in order from a first region 55A on the inner surface of the housing 50. The side wall 28B extends from the edge of the bottom 28A toward the first region 55A. The end of the side wall 28B is provided with a mounting portion 28C that is bent outward in an L-shape. The mounting portion 28C is fixed to the metal wall 52 of the housing 50 by a screw 29.

[0031] The conductive member 23, the substrate 10, and the heat dissipation member 16 are pressed against the first region 55A by the fixing member 28, and are fixed to the housing 50 by frictional force. The fixing member 28 and the screw 29 form a support portion for supporting the waveguide 20, the substrate 10, and the heat dissipation member 16 to the housing 50. Other fasteners for mechanically fixing the fixing member 28 to the housing 50 may be used instead of the screw 29. Heat is dissipated from the substrate 10 to the metal wall 52 of the housing 50 via the heat dissipation member 16 and the fixing member 28. If the outer peripheral side surface of the conductive member 23 is brought into contact with the side wall portion 28B of the fixing member 28, the heat dissipation can be further improved.

[0032] In the specific example shown in Fig. 5B, a dielectric waveguide is used instead of the waveguide 20 defined by the conductive member 23 in the specific example shown in Fig. 5A. The other configurations are the same as those of the specific example shown in Fig. 5A.

[0033] In the specific example shown in Fig. 5C, a high-frequency integrated circuit 60 is mounted on the surface of the substrate 10 of the specific example shown in Fig. 5A opposite to the surface on the waveguide 20 side. A heat dissipation member 16 is disposed between the high-frequency integrated circuit 60 and the bottom 28A of the fixing member 28. The dielectric waveguide shown in Fig. 5B may be used as the waveguide 20. In the configuration shown in Fig. 5C, heat generated in the high-frequency integrated circuit 60 is dissipated to the housing 50 via the heat dissipation member 16 and the fixing member 28. Instead of the high-frequency integrated circuit 60, a system-in-package (SiP) having a high-frequency integrated circuit or the like built in may be mounted.

[0034] In the specific example shown in Fig. 6A, a support portion 56 is used that is molded integrally with the metal wall 52 of the housing 50, instead of the fixing member 28 of the specific example shown in Fig. 5A. The support portion 56 includes a bottom portion 56A that faces the first region 55A at a distance, and a side wall portion 56B that extends from the peripheral portion of the bottom portion 56A to the metal wall 52. The conductive member 23 that defines the waveguide 20 and the substrate 10 are inserted between the first region 55A and the bottom portion 56A. A heat dissipation member may be inserted between the substrate 10 and the bottom portion 56A.

[0035] In the example shown in Fig. 6B, a dielectric waveguide is used instead of the waveguide 20 defined by the conductive member 23 in the example shown in Fig. 6A. The dielectric waveguide support member 27 shown in the example shown in Fig. 4B is disposed on the side of the waveguide 20. In the example shown in Fig. 6B, a heat dissipation member may also be inserted between the substrate 10 and the bottom portion 56A.

[0036] In the specific example shown in Fig. 6C, a high-frequency integrated circuit 60 is mounted on the surface of the substrate 10 of the specific example shown in Fig. 6A opposite to the surface on the waveguide 20 side. The dielectric waveguide shown in Fig. 6B may be used as the waveguide 20. In the configuration shown in Fig. 6C, heat generated in the high-frequency integrated circuit 60 is dissipated to the housing 50 via the support part 56. Instead of the high-frequency integrated circuit 60, a system-in-package (SiP) with a built-in high-frequency integrated circuit or the like may be mounted. A heat dissipation member may be inserted between the high-frequency integrated circuit 60 and the bottom part 56A.

[0037] 7, a dielectric waveguide is used as the waveguide 20, and a transmission window 51 of a housing 50 and the waveguide 20 are integrally formed. For example, the waveguide 20 and the transmission window 51 are made of the same dielectric material. Alternatively, they may be made of different dielectric materials. A substrate 10 is fixed to an end face 22 of the waveguide 20 on the antenna side via an adhesive layer 24.

[0038] 8A, conductive member 23 defining waveguide 20 is fixed to the inner surface of housing 50 via adhesive layer 24. Substrate 10 is mounted on motherboard 57 via solder 58. By fixing motherboard 57 to a predetermined position within housing 50, the relative positions of antenna-side end face 22 of waveguide 20 and substrate 10 are fixed.

[0039] 8B, the substrate 10 and the conductive member 23 are mounted on a motherboard 57 via solder 58. The conductive member 23 is provided with a recess 23A that is continuous with the waveguide 20 via an end face 22 (opening) on ​​the antenna side of the waveguide 20. The substrate 10 is disposed in the recess 23A. By accommodating the motherboard 57 at a predetermined position within the housing 50, the relative positions of the end face 21 of the waveguide 20 on the housing side and the transmission window 51 are fixed.

[0040] In the specific example shown in FIG. 9, an antenna module 45 is mounted on a motherboard 57. The antenna module 45 includes a substrate 10, an antenna element 11, a high-frequency integrated circuit 60, a sealing resin layer 43, a plurality of conductor columns 41, and a conductor film 42. The high-frequency integrated circuit 60 is mounted on the surface of the substrate 10 opposite to the waveguide 20 side. The sealing resin layer 43 seals the high-frequency integrated circuit 60. The plurality of conductor columns 41 penetrate the sealing resin layer 43 in the thickness direction. The conductor film 42 is disposed on the surface of the sealing resin layer 43 facing the motherboard 57, and is connected to some of the plurality of conductor columns 41. The conductor film 42 and the conductor columns 41 not connected to the conductor film 42 are fixed to the motherboard 57 via solder 58.

[0041] The multiple conductor columns 41 and the conductor film 42 function as heat transfer paths, and heat generated in the high frequency integrated circuit 60 is dissipated to the motherboard 57 via these heat transfer paths. The conductor film 42 may be in contact with the top surface (the surface opposite to the substrate 10) of the high frequency integrated circuit 60. By adopting this configuration, it is possible to improve the heat dissipation characteristics. Instead of the high frequency integrated circuit 60, a system in package (SiP) with a built-in high frequency integrated circuit etc. may be mounted.

[0042] [Second Example] Next, an antenna device according to a second embodiment will be described with reference to Figures 10A and 10B. Below, a description of the configuration common to the antenna device according to the first embodiment (Figures 1A and 1B) will be omitted.

[0043] Fig. 10A is a cross-sectional view of an antenna device according to a second embodiment. In the first embodiment (Fig. 1B), one waveguide 20 is coupled to a plurality of antenna elements 11. In contrast, in the antenna device according to the second embodiment, one waveguide 20 is coupled to each of the plurality of antenna elements 11. For example, the antenna device according to the second embodiment includes two antenna elements 11 and two waveguides 20, and the antenna elements 11 and the waveguides 20 correspond one-to-one. A metal waveguide is used as the waveguide 20. A transmission window 51 of the housing 50 is also provided for each of the plurality of waveguides 20.

[0044] The area of ​​each of the waveguides 20 in a cross section parallel to the y direction is constant from the antenna-side end face 22 to the housing-side end face 21. The two waveguides 20 are inclined so that the distance between them becomes wider from the antenna-side end face 22 toward the housing-side end face 21. For this reason, the distance G1 in the x direction between the housing-side end faces 21 of the two waveguides 20 coupled to the two antenna elements 11 adjacent in the x direction is wider than the distance G2 in the x direction between the antenna-side end faces 22. Here, the "distance" means the distance between the geometric centers of the two. In this case, as in the first embodiment (FIG. 1A), the length Lx1 from one end to the other end in the x direction of the housing-side end face 21 among the end faces of the multiple waveguides 20 is longer than the length Lx2 from one end to the other end in the x direction of the antenna-side end face 22.

[0045] 10B is a cross-sectional view showing a more specific configuration of the antenna device according to the second embodiment. A waveguide 20 is defined by two cavities penetrating the conductive member 23. The conductive member 23 is fixed to the inner surface of the housing 50 via an adhesive layer 24. The substrate 10 is fixed to the conductive member 23 via the adhesive layer 24.

[0046] Next, the excellent effects of the second embodiment will be described. In the second embodiment, each of the end faces 21 of the two waveguides 20 on the housing side operates as a secondary wave source. The area of ​​the convex hull that includes the multiple secondary wave sources is larger than the area of ​​the array antenna 12 consisting of the multiple antenna elements 11. Therefore, like the first embodiment, the gain of the array antenna 12 can be improved.

[0047] In the first embodiment (FIG. 1B), radio waves radiated from multiple antenna elements 11 overlap within one waveguide 20. This can make it difficult to control the directivity. In contrast, in the antenna device according to the second embodiment, multiple secondary wave sources and multiple antenna elements 11 correspond one-to-one, so the phases of the secondary wave sources can be controlled independently. This makes it easier to control the directivity compared to the first embodiment.

[0048] Furthermore, in the first embodiment (FIG. 1B), since the cross-sectional area of ​​the waveguide 20 is large, higher modes are likely to occur within the waveguide 20. In contrast, in the antenna device according to the second embodiment, since the cross-sectional area of ​​each of the multiple waveguides 20 is narrower than that of the antenna device according to the first embodiment, it is possible to suppress the occurrence of higher modes.

[0049] Next, an antenna device according to a modification of the second embodiment will be described with reference to FIG. Fig. 11 is a diagram showing the arrangement of each component in the xz plane of an antenna device according to a modified example of the second embodiment. In the second embodiment (Fig. 10A), a plurality of antenna elements 11 are arranged one-dimensionally in the x direction. In contrast, in the modified example shown in Fig. 11, a plurality of antenna elements 11 are arranged in a matrix. For example, they are arranged in a 2-row by 2-column matrix with the x direction as the row direction.

[0050] A waveguide 20 is coupled to each of the multiple antenna elements 11. A metal waveguide is used as the waveguide 20. The antenna element 11 is included in an end face 22 on the antenna side of the waveguide 20. The multiple waveguides 20 are inclined so as to move away from each other from the end face 22 on the antenna side toward the end face 21 on the housing side. The geometric center of the multiple end faces 22 is marked as C0. When the multiple waveguides 20 are viewed in a plan view from the y direction, the end face 21 on the housing side is disposed at a position obtained by translating the end face 22 on the antenna side in a direction moving it away from the geometric center C0.

[0051] 11, the area of ​​the convex hull that includes the housing-side end faces 21 of the multiple waveguides 20 is also larger than the area of ​​the convex hull that includes the multiple antenna elements 11. This makes it possible to improve the gain of the array antenna while preventing the antenna module from becoming too large.

[0052] [Third Example] Next, an antenna device according to a third embodiment will be described with reference to Fig. 12. Below, a description of the configuration common to the antenna device according to the first embodiment (Figs. 1A and 1B) will be omitted.

[0053] FIG. 12 is a cross-sectional view of an antenna device according to a third embodiment. A second region 55B is connected to a first region 55A on the inner surface of a housing 50 through a linear corner 53 extending in the z direction. The corner 53 does not necessarily have to be a sharp corner formed by the intersection of two planes. For example, the first region 55A and the second region 55B may be connected through a curved surface having a certain curvature, or may be connected through a plane oblique to both the first region 55A and the second region 55B. The antenna device according to the third embodiment includes a plurality of antenna elements facing the first region 55A as well as a plurality of antenna elements facing the second region 55B. The plurality of antenna elements facing the first region 55A are referred to as first antenna elements 11A, and the plurality of antenna elements facing the second region 55B are referred to as second antenna elements 11B.

[0054] For example, an L-shaped bent substrate is used as the substrate 10. The second region 55B is perpendicular to the x-direction, for example. The direction from the second antenna element 11B to the second region 55B is defined as the positive direction of the x-axis.

[0055] The multiple second antenna elements 11B are arranged side by side in a direction (y direction) that is parallel to the x direction and parallel to a virtual plane (xy plane) perpendicular to the first region 55A, and parallel to the second region 55B. The multiple first antenna elements 11A form a first array antenna 12A, and the multiple second antenna elements 11B form a second array antenna 12B. The multiple first antenna elements 11A and the multiple second antenna elements 11B are arranged one-dimensionally along bent straight lines parallel to the x direction and y direction, and can also be considered to form a single array antenna.

[0056] Similar to the array antenna 12, the waveguide 20, and the transmission window 51 in the first embodiment (FIG. 1B), a first waveguide 20A and a first transmission window 51A are arranged for the first array antenna 12A, and a second waveguide 20B and a second transmission window 51B are arranged for the second array antenna 12B. A metal waveguide or a dielectric waveguide is used as the first waveguide 20A and the second waveguide 20B.

[0057] The length Ly1 from one end to the other end in the y direction of the end face 21B on the housing side of the second waveguide 20B is longer than the length Ly2 from one end to the other end in the y direction of the end face 22B on the antenna side.

[0058] Next, the excellent effects of the third embodiment will be described. In the third embodiment, it is possible to improve the gain of each of the first array antenna 12A and the second array antenna 12B without increasing the size of the antenna module. Furthermore, by simultaneously operating the first array antenna 12A and the second array antenna 12B as beamforming antennas, it is possible to widen the coverage range of beamforming.

[0059] Next, a modification of the third embodiment will be described. In the antenna device according to the third embodiment, the corner 53 connecting the first region 55A and the second region 55B is a right angle, but the angle between the first region 55A and the second region 55B is not limited to a right angle. For example, the angle of the corner 53 may be an obtuse angle. In addition, the corner 53 may be rounded, or a slope inclined with respect to the first region 55A and the second region 55B may be provided, and the first region 55A and the second region 55B may be connected via the slope. In addition, in the antenna device according to the third embodiment, an L-shaped substrate is used as the substrate 10, but two different flat substrates may be used.

[0060] [Fourth Example] Next, an antenna device according to a fourth embodiment will be described with reference to Fig. 13. Below, a description of the configuration common to the antenna device according to the third embodiment (Fig. 12) will be omitted.

[0061] Fig. 13 is a cross-sectional view of an antenna device according to a fourth embodiment. In the antenna device according to the third embodiment (Fig. 12), one first waveguide 20A is coupled to a plurality of first antenna elements 11A of the first array antenna 12A, and one second waveguide 20B is coupled to a plurality of second antenna elements 11B of the second array antenna 12B. In contrast, in the antenna device according to the fourth embodiment, one first waveguide 20A is coupled to each of the plurality of first antenna elements 11A of the first array antenna 12A. Similarly, one second waveguide 20B is coupled to each of the plurality of second antenna elements 11B of the second array antenna 12B. A plurality of first transmission windows 51A and a plurality of second transmission windows 51B are arranged for each of the plurality of first waveguides 20A and the plurality of second waveguides 20B.

[0062] The relative positional relationship and shape of the first array antenna 12A, the first waveguide 20A, and the first transparent window 51A are similar to the relative positional relationship and shape of the array antenna 12, the waveguide 20, and the transparent window 51 of the antenna device according to the second embodiment (FIG. 10A). The relative positional relationship and shape of the second array antenna 12B, the second waveguide 20B, and the second transparent window 51B are also similar to the relative positional relationship and shape of the array antenna 12, the waveguide 20, and the transparent window 51 of the antenna device according to the second embodiment (FIG. 10A).

[0063] The first waveguide 20A closest to the corner 53 and the second waveguide 20B closest to the corner 53 extend approximately parallel to each other. The geometric centers of the housing-side end face 21A of the first waveguide 20A closest to the corner 53, the antenna-side end face 22A, the housing-side end face 21B of the second waveguide 20B closest to the corner 53, and the antenna-side end face 22B are marked as CA1, CA2, CB1, and CB2, respectively. A distance G1 between the geometric centers CA1 and CB1 is approximately equal to a distance G2 between the geometric centers CA2 and CB2.

[0064] Next, the excellent effects of the fourth embodiment will be described. In the antenna device according to the fourth embodiment, similarly to the antenna device according to the second embodiment (FIG. 10A), it is possible to improve the gain of each of the first array antenna 12A and the second array antenna 12B, facilitate directivity control, and suppress the occurrence of higher modes. Furthermore, similarly to the antenna device according to the third embodiment (FIG. 12), it is possible to widen the coverage range of beamforming by simultaneously operating the first array antenna 12A and the second array antenna 12B as beamforming antennas.

[0065] [Fifth Example] Next, an antenna device according to a fifth embodiment will be described with reference to Fig. 14. Below, a description of the configuration common to the antenna device according to the fourth embodiment (Fig. 13) will be omitted.

[0066] Fig. 14 is a cross-sectional view of an antenna device according to the fifth embodiment. In the antenna device according to the fourth embodiment (Fig. 13), the first waveguide 20A closest to the corner 53 and the second waveguide 20B closest to the corner 53 extend substantially parallel to each other. In contrast, in the antenna device according to the fifth embodiment, the first waveguide 20A closest to the corner 53 and the second waveguide 20B closest to the corner 53 extend from the substrate 10 toward the inner surface of the housing 50 so as to move away from each other. For this reason, the distance G1 between the geometric centers CA1 and CB1 is wider than the distance G2 between the geometric centers CA2 and CB2.

[0067] Next, the excellent effects of the fifth embodiment will be described. In the antenna device according to the fifth embodiment, the gap G1 is wider than that in the antenna device according to the fourth embodiment. Therefore, when the housing-side end faces 21A and 21B of the first waveguide 20A and the second waveguide 20B, which are closest to the corner 53, are operated as secondary wave sources, it is possible to improve the gain.

[0068] [Sixth Example] Next, an antenna device according to a sixth embodiment will be described with reference to Fig. 15. Below, a description of the configuration common to the antenna device according to the second embodiment (Fig. 10A) will be omitted.

[0069] Fig. 15 is a cross-sectional view of an antenna device according to a sixth embodiment. In the antenna device according to the second embodiment (Fig. 10A), a patch antenna is used as the antenna element 11. In contrast, in the antenna device according to the sixth embodiment, a microstrip line-waveguide converter 31 functions as the antenna element. An example of the configuration of the microstrip line-waveguide converter 31 will be described below.

[0070] When the substrate 10 is viewed in plan, an end 35 of a microstrip line provided in the substrate 10 is disposed in the end face 22 on the antenna side of each of the waveguides 20. The microstrip line is coupled to the waveguide 20 at its end 35, and the coupling portion forms a microstrip line-waveguide converter 31. Ground planes 32 and 33 are disposed on the surface of the substrate 10 on the waveguide 20 side and in the same layer as the microstrip line, respectively. A back-shorting portion 34 is disposed in a layer deeper than the end 35 of the microstrip line. By coupling the microstrip line to the waveguide 20 at the microstrip line-waveguide converter 31, a high-frequency signal transmitted through the microstrip line is transmitted through the waveguide 20 and radiated to the outside of the housing 50.

[0071] Next, the excellent effects of the sixth embodiment will be described. In the sixth embodiment, the arrangement and shape of the multiple waveguides 20 are similar to those of the antenna device according to the second embodiment (FIG. 10A). Compared with a configuration in which each of the multiple waveguides 20 extends perpendicularly to the first region 55A of the inner surface of the housing 50, the area of ​​the convex hull of the secondary wave source is larger. Therefore, it is possible to improve the gain of the antenna device. Furthermore, when the antenna element 11 is realized by a resonant antenna such as a patch antenna or a dipole antenna, the size of the antenna element is about 1 / 2 the wavelength of the radio wave in the operating frequency band. Therefore, for each antenna element, an area larger than the area of ​​about 1 / 2 the wavelength must be secured. In contrast, the antenna device according to the sixth embodiment does not have such a restriction, and therefore the antenna module can be made smaller.

[0072] [Seventh Example] Next, an antenna device according to a seventh embodiment will be described with reference to Fig. 16. Below, a description of the configuration common to the antenna device according to the third embodiment (Fig. 12) will be omitted.

[0073] Fig. 16 is a cross-sectional view of an antenna device according to the seventh embodiment. In the antenna device according to the third embodiment (Fig. 12), the first region 55A and the second region 55B intersect at a substantially right angle at the corner 53 of the housing 50. In contrast, in the antenna device according to the seventh embodiment, the inner surface corresponding to the corner 53 includes a curved surface. The curved surface is referred to as a third region 55C. The outer surface of the housing 50 is also curved, reflecting the shape of the curved surface.

[0074] In the antenna device according to the third embodiment (FIG. 12), an L-shaped substrate bent at a substantially right angle is used as the substrate 10. In contrast, in the antenna device according to the seventh embodiment, a substrate having a curved surface in an area facing the curved third area 55C on the inner surface of the housing 50 is used as the substrate 10. Also, a third antenna element 11C facing the third area 55C is disposed in the curved area of ​​the substrate 10.

[0075] The third waveguide 20C is coupled to the third antenna element 11C and extends from the third antenna element 11C toward the third region 55C. In the antenna device according to the third embodiment (FIG. 12), the first waveguide 20A and the second waveguide 20B expand from the antenna-side end faces 22A, 22B toward the housing-side end faces 21A, 21B. In contrast, in the antenna device according to the seventh embodiment, the cross-sectional areas of the first waveguide 20A, the second waveguide 20B, and the third waveguide 20C are constant from the antenna-side end faces 22A, 22B, 22C to the housing-side end faces 21A, 21B, 21C. A third transmission window 51C that transmits radio waves is provided in a region of the third waveguide 20C corresponding to the housing-side end face 21C.

[0076] The distance between the first waveguide 20A and the third waveguide 20C becomes wider from the antenna-side end faces 22A, 22C toward the housing-side end faces 21A, 21C. That is, the distance G1 between the geometric center CA1 of the housing-side end face 21A of the first waveguide 20A and the geometric center CC1 of the housing-side end face 21C of the third waveguide 20C is wider than the distance G2 between the geometric center CA2 of the antenna-side end face 22A of the first waveguide 20A and the geometric center CC2 of the antenna-side end face 22C of the third waveguide 20C. The positional relationship between the second waveguide 20B and the third waveguide 20C is similar.

[0077] The first antenna element 11A, the third antenna element 11C, and the second antenna element 11B are arranged one-dimensionally along a curved line along the surface of the curved substrate 10, and form a single array antenna. The direction of the curve along which the first antenna element 11A, the third antenna element 11C, and the second antenna element 11B are arranged is referred to as a first direction D1. The length L1 from one end to the other end in the first direction D1 of the end faces 21A, 21C, and 21B on the housing side is longer than the length L2 from one end to the other end in the first direction D1 of the antenna side end faces 22A, 22C, and 22B of the multiple waveguides consisting of the first waveguide 20A, the third waveguide 20C, and the second waveguide 20B.

[0078] Next, the excellent effects of the seventh embodiment will be described. In the seventh embodiment, the range in the first direction D1 in which the secondary wave source generated by the first waveguide 20A, the third waveguide 20C, and the second waveguide 20B is arranged is larger than the range in the first direction D1 in which the first antenna element 11A, the third antenna element 11C, and the second antenna element 11B are arranged, thereby improving the gain of the antenna device.

[0079] Next, an antenna device according to a modification of the seventh embodiment will be described with reference to FIG. FIG. 17 is a cross-sectional view of an antenna device according to a modification of the seventh embodiment. In the antenna device according to the seventh embodiment, a substrate having a substantially uniform thickness is used as the substrate 10. In contrast, in the modification shown in FIG. 17, the thickness of the curved portion is thinner than the thickness of the portions facing the first region 55A and the second region 55B. Such a substrate 10 can be produced, for example, by thinning a portion of a flat substrate having a uniform thickness and curving the thinned portion. Alternatively, two flat substrates may be connected by a flexible substrate, and the flexible substrate may be curved.

[0080] In the antenna device according to the seventh embodiment (FIG. 16), the inner surface (third region 55C) of the corner portion 53 of the housing 50 is a curved surface. In contrast to this, in the modified example shown in FIG. 17, the third region 55C is configured as a flat surface inclined with respect to both the first region 55A and the second region 55B. The first region 55A and the second region 55B are connected via the inclined third region 55C.

[0081] Two first antenna elements 11A facing the first region 55A are arranged side by side in the first direction D1. The third antenna element 11C is, for example, a dipole antenna. A radio frequency integrated circuit (RFIC) 60 is mounted on the surface of the portion facing the first region 55A opposite to the surface facing the first region 55A. The radio frequency integrated circuit 60 is connected to the first antenna element 11A, the second antenna element 11B, and the third antenna element 11C via a plurality of power feed lines 15 arranged on the substrate 10.

[0082] Next, an antenna device according to another modification of the seventh embodiment will be described. In the antenna device according to the seventh embodiment, the first antenna element 11A, the second antenna element 11B, and the third antenna element 11C are arranged one-dimensionally in the first direction D1, but they may also be arranged two-dimensionally.

[0083] [Eighth Example] Next, a communication device according to an eighth embodiment will be described with reference to Fig. 18. The communication device according to the eighth embodiment includes an antenna device according to any one of the first to seventh embodiments or a modified example thereof.

[0084] FIG. 18 is a block diagram of a communication device according to the eighth embodiment. The communication device according to the eighth embodiment includes a baseband integrated circuit (BBIC) 80, a radio frequency integrated circuit (RFIC) 60, and an antenna device 40. As the antenna device 40, an antenna device according to any one of the first embodiment to the seventh embodiment or a modified example thereof is used. The antenna device 40 includes a plurality of antenna elements 11. The plurality of antenna elements 11 include, for example, the antenna element 11 of the first embodiment (FIGS. 1A and 1B), the first antenna element 11A and the second antenna element 11B of the third embodiment (FIG. 12), the first antenna element 11A, the second antenna element 11B, and the third antenna element 11C of the seventh embodiment (FIG. 16), and the like.

[0085] The baseband integrated circuit 80 and the radio frequency integrated circuit 60 are housed in a common housing 50 (FIG. 1A, etc.) with the antenna device 40. For example, the radio frequency integrated circuit 60 is mounted on the substrate 10 of the antenna device according to the modified example of the seventh embodiment shown in FIG.

[0086] The high frequency integrated circuit 60 includes an intermediate frequency amplifier 61, an up / down conversion mixer 62, a transmit / receive switch 63, a power divider 64, a plurality of phase shifters 65, a plurality of attenuators 66, a plurality of transmit / receive switches 67, a plurality of power amplifiers 68, a plurality of low noise amplifiers 69, and a plurality of transmit / receive switches 70.

[0087] First, the transmission function will be described. An intermediate frequency signal is input from a baseband integrated circuit 80 to an up / down conversion mixer 62 via an intermediate frequency amplifier 61. The up / down conversion mixer 62 up-converts the intermediate frequency signal to generate a high frequency signal. The generated high frequency signal is input to a power divider 64 via a transmit / receive switch 63. Each of the high frequency signals divided by the power divider 64 is input to an antenna element 11 via a phase shifter 65, an attenuator 66, a transmit / receive switch 67, a power amplifier 68, and a transmit / receive switch 70.

[0088] Next, the receiving function will be described. High frequency signals received by each of the multiple antenna elements 11 are input to the power divider 64 via the transmit / receive switch 70, the low noise amplifier 69, the transmit / receive switch 67, the attenuator 66, and the phase shifter 65. The high frequency signal combined by the power divider 64 is input to the up / down conversion mixer 62 via the transmit / receive switch 63. The up / down conversion mixer 62 down-converts the high frequency signal to generate an intermediate frequency signal. The generated intermediate frequency signal is input to the baseband integrated circuit 80 via the intermediate frequency amplifier 61. Note that the up / down conversion mixer 62 may employ a direct conversion method in which the high frequency signal is directly down-converted to a baseband signal.

[0089] Next, the excellent effects of the eighth embodiment will be described. Since an antenna device according to any one of the first to seventh embodiments or a modified example thereof is used as the antenna device 40 included in the communication device according to the eighth embodiment, it is possible to improve the gain of the antenna device.

[0090] The above-mentioned embodiments are merely examples, and it goes without saying that partial replacement or combination of the configurations shown in different embodiments is possible. Similar effects due to similar configurations of multiple embodiments are not mentioned in each embodiment. Furthermore, the present invention is not limited to the above-mentioned embodiments. For example, it will be obvious to those skilled in the art that various modifications, improvements, combinations, etc. are possible. [Explanation of symbols]

[0091] 10 Substrate 11 Antenna elements 11A First Antenna Element 11B Second antenna element 11C Third antenna element 12 Array Antenna 12A First array antenna 12B Second array antenna 15 Power line 16 Heat dissipation material 20 Waveguide 20A 1st Waveguide 20B 2nd waveguide 20C 3rd waveguide 21 End face of the waveguide on the housing side 21A: End face of first waveguide on the housing side 21B: End face of second waveguide on the housing side 21C: End face of the third waveguide on the housing side 22 Antenna-side end face of the waveguide 22A Antenna-side end face of the first waveguide 22B: Antenna-side end face of second waveguide 22C Antenna-side end face of the third waveguide 23 Conductive materials 23A Recessed portion provided in conductive member 24 Adhesive layer 25, 26 Screws 27 Dielectric waveguide support member 28 Fixing member 28A Bottom of fixing member 28B Side wall of fixing member 28C Mounting part of fixing member 29 Screws 31 Microstrip line-waveguide transition 32, 33 Ground Plane 34 Back Short Section 35 End of microstrip line 40 Antenna equipment 41 Conductor Pillar 42 Conductor Film 43 Sealing resin layer 45 Antenna Module 50 Case 51 Transparent window 51A First transparent window 51B Second transparent window 51C 3rd transparent window 52 metal wall 53 Corner 55A First area of ​​the inner surface of the housing 55B Second area of ​​the inner surface of the housing 55C Third area of ​​the inner surface of the housing 56 Support part 56A bottom 56B Side wall part 57 Motherboard 58 Solder 60 Radio Frequency Integrated Circuits (RFICs) 61 Intermediate Frequency Amplifier 62 Up / down conversion mixer 63 Transmit / receive switch 64 Power Divider 65 Phase shifter 66 Attenuator 67 Transmit / receive switch 68 Power Amplifier 69 Low Noise Amplifier 70 Transmit / receive switch 80 Baseband Integrated Circuits

Claims

1. A housing and an array antenna that is accommodated in the housing, faces an inner surface of the housing, and includes a plurality of antenna elements that are arranged at least one-dimensionally in a first direction; a plurality of waveguides coupled to the plurality of antenna elements of the array antenna, the plurality of waveguides extending from the plurality of antenna elements toward an inner surface of the housing; Equipped with An antenna device in which, for two of the multiple waveguides, each coupled to two antenna elements adjacent in the first direction, the spacing in the first direction between the end faces on the inner surface side of the housing is wider than the spacing in the first direction between the end faces on the array antenna side.

2. 2. The antenna device according to claim 1, wherein each of the plurality of antenna elements of the array antenna is a patch antenna.

3. each of the plurality of antenna elements of the array antenna includes an end portion of a microstrip line; 2. The antenna device according to claim 1, wherein coupling points between each of the plurality of antenna elements of the array antenna and each of the plurality of waveguides form microstrip line-waveguide converters.

4. The antenna device according to claim 1 , wherein each of the plurality of waveguides is a metallic waveguide.

5. 5. The antenna device according to claim 4, wherein the interior of a metal waveguide constituting each of the plurality of waveguides is filled with a dielectric material.

6. The antenna device according to claim 1 , wherein each of the plurality of waveguides is a dielectric waveguide.

7. the inner surface of the housing includes a first region and a second region that are continuous with each other via a corner portion, A part of the antenna elements of the array antenna faces the first area, and the remaining antenna elements face the second area, 2. The antenna device according to claim 1, wherein the plurality of waveguides include a plurality of first waveguides and a plurality of second waveguides, the plurality of first waveguides being coupled to a plurality of antenna elements facing the first region, respectively, and the plurality of second waveguides being coupled to a plurality of antenna elements facing the second region.

8. A substrate on which the array antenna is disposed; a support portion that fixes the substrate and the plurality of waveguides to the housing; It also has the support portion includes a bottom portion disposed at a distance from a first region of an inner surface of the housing, the first region facing the array antenna, and a sidewall portion extending from the bottom portion to the inner surface of the housing and fixed to the housing; The antenna device according to claim 1 , wherein the plurality of waveguides and the substrate are disposed between the first region and the bottom.

9. The antenna device according to claim 8 , wherein the support portion is fixed to the housing by a fastener or is molded integrally with the housing.

10. a high-frequency integrated circuit mounted on a surface of the substrate opposite to the surface on which the plurality of waveguides are formed, 9. The antenna device of claim 8, wherein the high frequency integrated circuit is thermally coupled to the base.

11. The antenna device according to claim 10 , further comprising a heat dissipation member disposed between the high frequency integrated circuit and the bottom portion.

12. A substrate on which the array antenna is disposed; a motherboard on which the substrate is mounted; an adhesive layer that fixes the plurality of waveguides to the housing; It also has 2. The antenna device according to claim 1, wherein the motherboard is fixed to the housing so that the array antenna is disposed at a position where it is coupled to the plurality of waveguides.

13. A substrate on which the array antenna is disposed; a motherboard on which the substrate and the plurality of waveguides are mounted in a positional relationship in which the array antenna is coupled to the plurality of waveguides; It also has The antenna device according to claim 1 , wherein the motherboard is fixed to the housing.

14. An antenna device according to any one of claims 1 to 13, a radio frequency integrated circuit that is accommodated in the housing of the antenna device and that supplies radio frequency signals to a plurality of antenna elements of the array antenna; A communication device comprising:

Images