Electronic appliance

Abstract

To provide an electronic appliance in which the increase in thickness is suppressed even when a display panel is included.SOLUTION: An electronic appliance in the present disclosure includes first and second circuit boards (main circuit board 40 and sub-circuit board 70) disposed in a stacking direction, and a display panel 11 disposed between the first circuit board and the second circuit board. Out of the first and second circuit boards, the circuit board (sub-circuit board 70) that is disposed on a display surface side of the display panel 11 includes a notch (opening 72) to which the display panel 11 can be fitted. The display panel 11 is disposed in the notch and at a position at least partially overlapping with the circuit board (sub-circuit board 70) where the notch is formed in the thickness direction.SELECTED DRAWING: Figure 15

Description

[Technical field]

[0001] The present disclosure relates to an electronic device having a display panel. [Background technology]

[0002] Conventionally, medical telemeters have been widely used to measure biological information such as an electrocardiogram or heart rate of a patient and transmit the measurement results wirelessly to a central monitor, etc. An example of a medical telemeter is described in Patent Document 1. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-081139 A Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, medical telemeters equipped with more functions have been developed. For example, medical telemeters have been developed that have a display panel such as an LCD (Liquid Crystal Display) panel and can display an electrocardiogram on the display panel. Medical telemeters with such a display panel are convenient because the electrocardiogram can be viewed on the telemeter side.

[0005] Incidentally, the display panel is fixed onto the circuit board, for example, by double-sided tape, etc. As a result, the thickness of the telemeter increases by the thickness of the display panel.

[0006] However, since a medical telemeter is carried by a patient, it is preferable that the medical telemeter be as thin as possible. This is not limited to medical telemeters, but applies to various electronic devices that are required to be thin.

[0007] The present disclosure has been made in consideration of the above points, and provides an electronic device in which an increase in the thickness of the device is suppressed even when the electronic device has a display panel. [Means for solving the problem]

[0008] One aspect of the electronic device of the present disclosure is to An electronic device having a display panel, a first circuit board and a second circuit board arranged in a stacking direction; a display panel disposed between the first circuit board and the second circuit board; having a cutout portion into which the display panel can be fitted is formed in the circuit board disposed on the display surface side of the display panel, of the first and second circuit boards; The display panel is disposed in the cutout portion and at a position where at least a portion of the display panel overlaps in a thickness direction with the circuit board in which the cutout portion is formed. Effect of the Invention

[0009] According to the present invention, it is possible to realize an electronic device in which an increase in the thickness of the device is suppressed even when the electronic device has a display panel. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a front view of a telemeter according to an embodiment of the present invention; [Diagram 2] Top view of the telemeter [Diagram 3] Telemeter bottom view [Figure 4] Telemeter left side view [Diagram 5] Telemeter right side view [Figure 6] Perspective view of the charging station [Figure 7] A perspective view showing the main circuit board and ECG processing unit built into the telemeter. [Figure 8] An exploded view for explaining the circuit board structure of the ECG processing unit [Figure 9]A plan view for explaining the assembly procedure of the ECG processing unit [Figure 10] FIG. 1 is a perspective view for explaining an assembly procedure of an ECG processing unit. [Figure 11] FIG. 1 is a perspective view for explaining an assembly procedure of an ECG processing unit. [Figure 12] FIG. 1 is an exploded perspective view of a display panel before it is fitted into a holding member; [Figure 13] FIG. 13 is a perspective view showing a state after the display panel is fitted into the holding member; [Figure 14] FIG. 2 is an exploded perspective view of a display panel, a main circuit board, and a sub-circuit board before they are combined together; [Figure 15] FIG. 2 is a perspective view showing a state after the display panel, the main circuit board, and the sub-circuit board are coupled together; [Figure 16] A perspective view showing the installation state of the SpO2 processing board [Figure 17] A perspective view showing the installation state of the SpO2 processing board DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings.

[0012] <1> External appearance of medical telemeter Fig. 1 is a front view of a medical telemeter (hereinafter simply referred to as "telemeter") 10 according to this embodiment. In this embodiment, the up-down direction in Fig. 1 may be referred to as the up-down direction (±Y direction) of telemeter 10, the left-right direction in Fig. 1 as the left-right direction (±X direction) of telemeter 10, and the depth direction (±Z direction) of the paper surface in Fig. 1 as the front-back direction of telemeter 10.

[0013] As can be seen from FIG. 1, the front side of the telemeter 10 is provided with an LCD (Liquid Crystal Display) panel 11, an indicator 12, an operation unit 13, and the like.

[0014] 2 is a top side view of the telemeter 10. On the top side, a lead cord connector section 14 and an SpO2 input connector section 15 are provided. A lead cord extending from an electrode attached to the patient's chest is connected to the lead cord connector section 14. A cable of an SpO2 probe is connected to the SpO2 input connector section 15, and an SpO2 detection signal from the SpO2 probe is input.

[0015] 3 is a bottom side view of the telemeter 10. Power input connectors 16 and 17 are provided on the bottom side. A DC power output cable of an AC / DC adapter, for example, is connected to the power input connector 16. The power input connector 17 is a pogo pin connector, and is connected to a pogo pin 31 of a charging stand 30 in FIG. 6, which will be described later. Power input from the power input connectors 16 and 17 is supplied to a battery (not shown) built into the telemeter 10. This charges the battery.

[0016] A lock lever 18 is also provided on the lower side. The lock lever 18 locks a battery lid 19 provided on the back side of the telemeter 10. The lock lever 18 can be switched between a locked state and an unlocked state by a user's operation. Specifically, in the locked state, the lock lever 18 engages with one end of the battery lid 19 to lock the battery lid 19 to the case body of the telemeter 10. In contrast, when the lock lever 18 is set to the unlocked state by the user, the lock lever 18 is disengaged from the battery lid 19. By setting the lock lever 18 to the unlocked state, the user can remove the battery lid 19 and replace the battery.

[0017] Fig. 4 is a left side view of the telemeter 10. A power switch 20 is provided on the left side. Fig. 5 is a right side view of the telemeter 10.

[0018] FIG. 6 is a perspective view of the charging stand 30 of the telemeter 10, seen from obliquely above. The charging stand 30 has pogo pins 31. When the telemeter 10 is placed against the charging stand 30, the pogo pins 31 are electrically connected to the power input connector section 16, which is a pogo pin connector. The charging stand 30 is also provided with a power input connector section (not shown) to which, for example, a DC power output cable of an AC / DC adapter is connected, and a data input / output connector section (not shown). This allows the telemeter 10 to charge the battery and communicate data with an external device via the charging stand 30. The telemeter 10 is not only capable of receiving power via the power input connector section 17, but also capable of inputting and outputting signals. This allows the telemeter 10 to transmit and receive signals to and from the external device via the charging stand 30, thereby enabling operation diagnosis using the external device.

[0019] The charging stand 30 is formed with an insertion portion 32 into which the lower portion of the telemeter 10 is inserted, and also with a protrusion 33 that engages with a recess (not shown) on the back surface of the telemeter 10. As a result, when the telemeter 10 is inserted, the charging stand 30 holds the telemeter 10 with the insertion portion 32 and the protrusion 33, thereby preventing the telemeter 10 from tilting or shifting upward (in the +Y direction). As a result, the reliability of the electrical connection between the pogo pin 31 and the power input connector portion 16 can be improved.

[0020] <2> circuit board structure Here, particularly characteristic parts of the circuit board structure of the telemeter 10 of this embodiment will be described.

[0021] 7 is a perspective view showing the main circuit board 40 and ECG processing unit 50 built into the telemeter 10. The main circuit board 40 is connected to the power input connector units 16, 17. Electronic components 42 (FIG. 14) such as an amplifier and a filter for power processing, a wireless module 41, etc. are mounted on the main circuit board 40.

[0022] The ECG processing unit 50 is connected to the connection pin 14a of the lead cord connector unit 14. The ECG processing unit 50 is also connected to the main circuit board 40. The ECG processing unit 50 performs measurement processing of an electrocardiogram (ECG) based on the potential input from the connection pin 14a of the lead cord connector unit 14. Specifically, the ECG processing unit 50 performs analog-to-digital conversion, ECG waveform formation processing, etc. The signal obtained by the ECG processing unit 50 is wirelessly transmitted to a central monitor or the like by the wireless module 41 of the main circuit board 40.

[0023] FIG. 8 is a development view for explaining the circuit board structure of the ECG processor 50. As shown in FIG.

[0024] The ECG processing unit 50 has a signal input board 51 on which a signal input unit is formed, and a plurality of circuit boards 52, 53, 54, 55 extending in all directions from the signal input board 51. The processing of the ECG processing unit 50 is distributed among the plurality of circuit boards 52 to 55.

[0025] The signal input board 51 is connected to the connection pin 14a of the induction cord connector portion 14. The connection pin 14a and the signal input board 51 are electrically connected by, for example, soldering.

[0026] Each of the circuit boards 52, 53, 54, and 55 has a flexible board 52a, 53a, 54a, and 55a, and is connected to the signal input board 51 via the flexible board 52a, 53a, 54a, and 55a. Also, connection parts 52b, 53b, 54b, and 55b are provided on the end side of each of the circuit boards 52, 53, 54, and 55. Furthermore, the ECG processing unit 50 has a connection connector part 57 connected to the main circuit board 40.

[0027] 9, 10 and 11 are diagrams for explaining the assembly procedure of the ECG processor 50. FIG.

[0028] As shown in the plan view of Fig. 9 and the perspective view of Fig. 10, first, a support member 56 is provided upright on a signal input board 51. The support member 56 is made of a non-conductive material. In the embodiment, the support member 56 is made of resin. The support member 56 has a box-like shape having a bottom surface, a top surface and four side surfaces as main surfaces.

[0029] 11, circuit boards 52, 53, 54, and 55 are arranged along the four side surfaces of support member 56. At this time, flexible boards 52a, 53a, 54a, and 55a are bent, so that circuit boards 52, 53, 54, and 55 can be easily arranged at predetermined positions on support member 56.

[0030] Furthermore, a plurality of engaging protrusions 56a are formed on the support member 56, and the engaging protrusions 56a engage with engaging holes in the circuit boards 52, 53, 54, and 55, thereby positioning and fixing the circuit boards 52, 53, 54, and 55 at predetermined positions on the support member 56. In other words, locking portions (engaging protrusions 56a) are formed on the plurality of main surfaces of the support member 56, and the plurality of circuit boards 52, 53, 54, and 55 constituting the circuit board group are each positioned and fixed at a predetermined position on the plurality of main surfaces of the support member 56 by the locking portions (engaging protrusions 56a).

[0031] As shown in Fig. 11, when the circuit boards 52, 53, 54, and 55 are arranged along the support member 56, the connection pins constituting the connection parts 52b and 53b of the circuit boards 52 and 53 stand in a direction parallel to the Y direction. As shown in Fig. 11, the connection pins are fitted into the connection holes that are the connection parts 54b and 55b of the circuit boards 54 and 55. Next, the connection pins and the connection holes are soldered. This electrically and mechanically integrates the circuit boards 52, 53, 54, and 55.

[0032] Next, the main circuit board 40 is connected to the connector unit 57. As a result, the ECG processing unit 50 inputs the cardiac potential from the signal input board 51, performs measurement processing of an electrocardiogram (ECG) using circuit boards 52, 53, 54, and 55, and outputs the processing results to the main circuit board 40.

[0033] As described above, the electronic device (telemeter 10) of this embodiment has a first circuit board (signal input board 51) on which a signal input section is formed, a support member 56 standing on the first circuit board, and a circuit board group consisting of multiple circuit boards 52, 53, 54, 55 each extending so as to expand from the first circuit board and arranged to cover support member 56.

[0034] In addition, in the electronic device of this embodiment, the multiple circuit boards 52, 53, 54, and 55 that constitute the circuit board group each have terminals (connection portions 52b, 53b, 54b, 55b) on their end sides, and the terminals of the multiple circuit boards 52, 53, 54, and 55 are connected to each other while being arranged to cover the support member 56.

[0035] In addition, in the electronic device of this embodiment, the circuit board group (circuit boards 52, 53, 54, 55) is connected to the first circuit board (signal input board 51) via flexible boards 52a, 53a, 54a, 55a, and the circuit board group (circuit boards 52, 53, 54, 55) is positioned so as to cover support member 56 by bending flexible boards 52a, 53a, 54a, 55a.

[0036] In the electronic device of the present embodiment, the support member 56 has a plurality of main surfaces, and the plurality of circuit boards 52, 53, 54, 55 constituting the circuit board group are arranged along the plurality of main surfaces of the support member 56, respectively.

[0037] In addition, in the electronic device of this embodiment, locking portions (engagement protrusions 56a) are formed on multiple main surfaces of support member 56, and multiple circuit boards 52, 53, 54, 55 that constitute the circuit board group are each positioned and fixed at predetermined positions on the multiple main surfaces of support member 56 by the locking portions.

[0038] In the electronic device of this embodiment, a lead cord for a cardiac potential is connected to the signal input section of the first circuit board (signal input board 51), and the group of circuit boards (circuit boards 52, 53, 54, 55) performs measurement processing of an electrocardiogram.

[0039] Here, in conventional medical telemeters that wirelessly transmit a patient's ECG, in general, many devices do not include an ECG processor in order to reduce the size of the device. In such medical telemeters, instead of including an ECG processor in the device body, an ECG processor is installed on the lead cord side, and the medical telemeter wirelessly transmits the signal processed by the ECG processor.

[0040] However, when such a configuration is adopted, it is necessary to use a lead cord dedicated to the telemeter. On the other hand, a vital sign monitor or the like has a built-in ECG processor, so a lead cord without an ECG processor can be used.

[0041] In this embodiment, the telemeter 10 is equipped with an ECG processor 50, so that a common lead code can be used with a vital sign monitor or the like.

[0042] However, simply providing an ECG processing unit would result in another problem of the telemeter becoming larger. In a vital sign monitor or the like, which is larger in device size than a telemeter, the ECG processing unit is often formed on a single circuit board. However, in a telemeter that is required to be compact, it is not preferable to adopt such a configuration. In this embodiment, by adopting the circuit board structure described above, it is possible to prevent the telemeter from becoming larger when an ECG processing unit is provided.

[0043] In the electronic device of this embodiment, the group of circuit boards (circuit boards 52, 53, 54, 55) extending out from the first circuit board (signal input board 51) are arranged in a box-like three-dimensional manner to cover the support member 56, thereby preventing the size of the entire device (the size of the telemeter 10) from increasing even if the area of ​​the circuit boards increases (i.e., even if ECG processing unit 50 is added).

[0044] Furthermore, when the multiple circuit boards 52, 53, 54, 55 are arranged three-dimensionally, the distance between the circuit boards 52, 53, 54, 55 is set to a predetermined distance or more by the support member 56, thereby ensuring the insulation distance. For example, the support member 56 can increase the creepage distance between resistors formed on the circuit boards 52, 53, 54, 55, thereby ensuring the insulation distance. In other words, the support member 56 has a function of arranging the multiple circuit boards 52, 53, 54, 55 three-dimensionally in a predetermined shape, and a function as a spacer.

[0045] <3> Mounting structure for display panel 11 12, 13, 14 and 15 are perspective views illustrating the mounting structure of the display panel 11. FIG.

[0046] 12 and 13, the display panel 11 is fitted into a holding member 60 made of resin. Fig. 12 is an exploded perspective view of the display panel 11 before it is fitted into the holding member 60, and Fig. 13 is a perspective view of the display panel 11 after it has been fitted into the holding member 60.

[0047] The display panel 11 fitted into the holding member 60 is disposed between the main circuit board 40 and the sub-circuit board 70, as shown in Figures 14 and 15. Figure 14 is an exploded perspective view of the display panel 11, the main circuit board 40, and the sub-circuit board 70 before they are joined together, and Figure 15 is a perspective view showing the state after the display panel 11, the main circuit board 40, and the sub-circuit board 70 are joined together.

[0048] When they are joined, the connector portion 43 provided on the main circuit board 40 and the connector portion (not shown) provided on the sub-circuit board 70 are connected. When they are joined, the holding member 60 is sandwiched between the main circuit board 40 and the sub-circuit board 70. The connector portion 43 is disposed on the periphery of the main circuit board 40, which allows the user to visually check whether the main circuit board 40 and the sub-circuit board 70 are securely connected. In order to prevent poor connection due to separation between the main circuit board 40 and the sub-circuit board 70, the two circuit boards 40, 70 are held down by the corners of the case, locking claws, or the like.

[0049] As described above, electronic components 42 such as an amplifier for power processing, a filter, an image processing module, and a wireless module 41 are mounted on the main circuit board 40. The sub-circuit board 70 is provided with a switch 71 and the like that is provided at a position corresponding to the operation unit 13 (FIG. 1) and is turned on and off in response to the operation of the operation unit 13. The flexible board 11a extending from the display panel 11 is connected to the main circuit board 40.

[0050] Furthermore, the sub-circuit board 70 has an opening 72 formed therein that is slightly larger than the outer size of the display panel 11. In other words, the sub-circuit board 70 has an opening 72 into which the display panel 11 can be fitted.

[0051] The position of the display surface of the display panel 11 protrudes slightly in the +Z direction from the sub-circuit board 70 through the opening 72. The position of the display surface of the display panel 11 may be the same position as the +Z direction surface of the sub-circuit board 70, or may be slightly recessed in the -Z direction from the +Z direction surface of the sub-circuit board 70. In short, the display panel 11 is disposed at a position where the display panel 11 and the sub-circuit board 70 at least partially overlap in the thickness direction (±Z direction).

[0052] This makes it possible to suppress the increase in thickness caused by providing the display panel 11 compared to a case in which the display panel 11 is attached to the +Z direction surface of the sub-circuit board 70 with double-sided tape or the like without forming the opening 72.

[0053] Furthermore, in the present embodiment, by disposing display panel 11 in the gap between main circuit board 40 and sub-circuit board 70, an increase in thickness due to display panel 11 is suppressed.

[0054] Here, electronic components 42 are mounted on the main circuit board 40, and a gap (e.g., about 4 to 5 mm) is generated between the main circuit board 40 and the sub-circuit board 70 according to the height of the electronic components 42. In the present embodiment, the display panel 11 is disposed in this gap to effectively utilize the gap and to prevent an increase in thickness due to the display panel 11.

[0055] In this embodiment, one reason for dividing the circuit board into the main circuit board 40 and the sub-circuit board 70 and arranging them in the stacking direction is that the size of the telemeter can be made smaller than that of a single circuit board. Another reason is that the main circuit board 40 and the sub-circuit board 70 can be used to realize an antenna for a wireless LAN (Local Area Network). Specifically, one of the main circuit board 40 and the sub-circuit board 70 functions as the antenna ground, and the other has a copper foil pattern formed thereon to obtain a desired resonance frequency. In other words, the telemeter 10 has a communication function and an antenna used therefor, and at least one of the first and second circuit boards functions as the antenna ground.

[0056] As described above, according to this embodiment, there are first and second circuit boards (main circuit board 40 and sub-circuit board 70) arranged in a stacking direction, and a display panel 11 arranged between the first and second circuit boards. Of the first and second circuit boards, the circuit board (sub-circuit board 70) arranged on the display surface side of the display panel 11 has a cutout portion (opening 72) formed therein into which the display panel 11 can be fitted, and the display panel 11 is arranged at a position where at least a portion of the display panel 11 overlaps in the thickness direction with the circuit board (sub-circuit board 70) in which the cutout portion (opening 72) is formed.

[0057] This makes it possible to realize a telemeter 10 in which an increase in the thickness of the device is suppressed even when the display panel 11 is included. In particular, when the display panel 11 is an LCD panel, the thickness of the display panel 11 including the backlight is about 2.5 mm. Therefore, for example, when the display panel 11 is attached to the sub-circuit board 70, the thickness of the device increases by about 2.5 mm compared to when the display panel 11 is not provided. In contrast, according to the configuration of this embodiment, the increase in the thickness of the device caused by the thickness of the display panel 11 can be suppressed, and when the above-mentioned LCD panel is adopted, for example, the thickness of the device can be practically reduced by about 1.8 mm.

[0058] In addition, compared to, for example, a case where the display panel 11 is attached onto the sub-circuit board 70, this is advantageous in terms of heat dissipation efficiency.

[0059] Furthermore, since the display panel 11 fits into the cutout portion (opening 72), it is supported by the circuit board (sub-circuit board 70), and misalignment in the XY directions is suppressed. Note that, in the embodiment, the cutout portion (opening 72) has a shape with four closed sides, but the cutout portion may have, for example, three of the four sides closed and one side open. For example, of the four sides of the opening 72 in FIG. 14, one side in the -X direction may be cut out so as to be open.

[0060] Further, an electronic component 42 is mounted on the opposing surface of at least one of the first and second circuit boards (main circuit board 40 and sub-circuit board 70). There is a gap between the first circuit board and the second circuit board corresponding to at least the thickness of the electronic component 42, and the display panel 11 is disposed across at least both this gap and the opening 72.

[0061] Thereby, the gap between the first and second circuit boards (main circuit board 40 and sub-circuit board 70) can be effectively utilized, and an increase in the thickness due to the display panel 11 can be suppressed.

[0062] Furthermore, as can be seen from FIG. 14, the holding member 60 has an arm 61. As shown in FIGS. 16 and 17, SpO2 processing substrates 81 and 82 are attached to this arm 61. FIG. 16 is an example in which a small-sized SpO2 processing substrate 81 is attached, and FIG. 17 is an example in which a large-sized SpO2 processing substrate 82 is attached.

[0063] The SpO2 processing substrates 81 and 82 are removably attached to the arm 61 using screws or the like. The SpO2 processing substrates 81 and 82 are electrically connected to the main circuit board 40 or the sub-circuit board 70 by connectors. In the present embodiment, by holding the SpO2 processing substrates 81 and 82 by the arm 61 of the holding member 60, the fixing strength can be increased as compared with the case where the SpO2 processing substrates 81 and 82 are fixed only by connectors.

[0064] Here, when the SpO2 processing boards 81, 82 are directly attached to circuit boards such as the main circuit board 40 and the sub-circuit board 70, and the size of the SpO2 processing boards 81, 82 is changed, connection holes and the like must be formed in the circuit boards such as the main circuit board 40 and the sub-circuit board 70 in order to ensure the fixing strength, and this requires processing the circuit boards. In contrast, if an attachment section (arm 61) that allows the third circuit board (SpO2 processing boards 81, 82) to be detachably attached is provided in the holding member 60 as in this embodiment, the fixing strength of the third circuit board (SpO2 processing boards 81, 82) can be increased without processing the circuit board.

[0065] In addition, the main circuit board 40 is formed with a notch 44 for avoiding interference with the SpO2 processing boards 81 and 82.

[0066] <4> Other embodiments The above-described embodiment is merely an example of the embodiment of the present invention, and the technical scope of the present invention should not be interpreted as being limited by the embodiment. In other words, the present invention can be embodied in various forms without departing from the gist or main characteristics of the present invention.

[0067] Items in the above embodiment <2> In the above description, the multiple circuit boards extending so as to spread out from the first circuit board (signal input board 51) are four circuit boards 52, 53, 54, 55, and all of these four circuit boards 52, 53, 54, 55 cover the support member 56 and are mechanically and electrically integrated by the terminals on the end side (connecting portions 52b, 53b, 54b, 55b), but this is not limiting. For example, the multiple circuit boards extending so as to spread out from the first circuit board (signal input board 51) may be five, four of which cover the support member 56 and are mechanically and electrically integrated by the terminals on the end side, and the remaining one may be directly connected to the main circuit board 40 without being integrated.

[0068] In the above embodiment, the circuit board structure and the display panel mounting structure of the present disclosure are described as being applied to a telemeter, but the present disclosure is not limited thereto and can be widely applied to various electronic devices. For example, <2> Although the circuit board structure of the present disclosure has been described above as being applied to the ECG processing unit 50, it can also be applied to circuits that perform processing other than ECG processing. The configuration of the present disclosure is useful for electronic devices that require miniaturization. [Industrial Applicability]

[0069] The present disclosure is suitable for electronic devices having a display panel. [Explanation of symbols]

[0070] 10 Medical Catheters 11 Display Panel 11a Flexible substrate 12. Indicators 13 Control section 14 Induction cord connector 14a Connection pin 15 SpO2 input connector 16, 17 Power input connector 18 Lock lever 19 Battery cover 20 Power Switch 30 Charging Station 40 Main circuit board 41 Wireless Module 42 Electronic Components 43 Connector part 44 Notch 50 ECG Processing Unit 51 Signal input board 52~55 Circuit board 52a, 53a, 54a, 55a Flexible substrate 52b, 53b, 54b, 55b Connections 56 Support member 56a Engaging protrusion 57 Connector part 60 Retaining member 61 61 70 Sub-circuit board 71 Switch 72 Aperture 81, 82 SpO2 treatment substrate

Claims

1. An electronic device having a display panel, A first circuit board and a second circuit board arranged in a stacking direction; a display panel disposed between the first circuit board and the second circuit board; having a cutout portion into which the display panel can be fitted is formed in the circuit board disposed on the display surface side of the display panel, of the first and second circuit boards; the display panel is disposed in the cutout portion and at a position where at least a portion of the display panel overlaps in a thickness direction with the circuit board in which the cutout portion is formed. electronic equipment.

2. an electronic component is mounted on an opposing surface of at least one of the first and second circuit boards; a gap corresponding to at least a thickness of the electronic component is present between the first circuit board and the second circuit board; The display panel is disposed across at least both the gap and the opening.

2. The electronic device according to claim 1.

3. the electronic device has a communication function and an antenna used therefor; At least one of the first and second circuit boards functions as a ground for the antenna.

2. The electronic device according to claim 1.

4. The display device further includes a holding member for holding the display panel. the holding member has an attachment portion to which a third circuit board can be removably attached; 2. The electronic device according to claim 1.

5. The display panel is a Liquid Crystal Display (LCD) panel.

2. The electronic device according to claim 1.

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