Multi-node server

Abstract

To provide a multi-node server that can be rapidly replaced with another computing node.SOLUTION: A multi-node server includes a server case, a main circuit board, a power adaptor circuit board, and a signal adaptor module. The main circuit board has a first node area and a second node area. The power adaptor circuit board is disposed vertically on the main circuit board. The first side of the power adaptor circuit board has a first power input connector and a second power input connector. The second side of the power adaptor circuit board has a first power output connector facing the first node area and a second power input connector facing the second node area. The signal adaptor module has a signal adaptor circuit board, a first signal connector, and a second signal connector. The signal adaptor circuit board is parallel to the main circuit board. The signal adaptor circuit board electrically connects the first signal connector to the second signal connector.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to multi-node servers, and in particular to servers having two or more nodes. [Background technology]

[0002] Conventionally, common server types include a single-node server and a multi-node server. A "node" refers to a basic unit that stores and processes data within a data structure. Types of "nodes" include, for example, a "computation node" that handles computation, a "storage node" that stores data, a "network node" that connects different nodes to each other and connects the entire computing cluster to the outside, and a "control node" that allows a user to manage the entire computing cluster.

[0003] Multi-node servers have more replaceability and scalability in terms of function allocation than single-node servers.Currently, typical multi-node servers are based on a central processing unit (CPU) computing node, and each CPU computing node can be designed to meet various requirements by combining different access interfaces (I / O ports), data storage hardware (storage disks), and expansion cards (add-on cards).

[0004] When deep computation is required by artificial intelligence (AI), one of the nodes can be replaced with a computation node equipped with a graphic processing unit (GPU). When high-density data storage is required, one of the nodes can be replaced with a storage node equipped with storage slots for multiple storage disks. Although the existing single node can be quickly replaced, each node performs computation independently and does not have a signal connection function between nodes. In order to realize a node with the above two different functions, it is necessary to additionally connect a signal from one of the nodes to the CPU computation node. Generally, signals are connected using signal lines, but there are limitations on the length of the signal lines and cable management, and a single node cannot realize the quick replacement function.

[0005] Therefore, it has become a problem to be solved in the technical field to overcome the above-mentioned deficiencies through improving the structural design so that the multi-node server can be quickly replaced with other computing nodes. Summary of the Invention [Problem to be solved by the invention]

[0006] The technical problem that the present invention seeks to solve is to provide a multi-node server that can quickly replace nodes in response to the shortcomings of the prior art. [Means for solving the problem]

[0007] In order to solve the above technical problem, one technical means adopted by the present invention is to provide a multi-node server, which includes a server case, a main circuit board, a power adapter circuit board, and a signal adapter module. The main circuit board is installed in the server case, and the main circuit board has a first node area and a second node area. The power adapter circuit board is installed vertically on the main circuit board, and a first side of the power adapter circuit board has a first power input connector and a second power input connector. A second side of the power adapter circuit board has a first power output connector and a second power input connector, the second side faces the first side, the first power output connector faces the first node area, and the second power output connector faces the second node area. The signal adapter module includes a signal adapter circuit board, a first signal connector, and a second signal connector, and the signal adapter circuit board is installed along a direction parallel to the main circuit board. The signal adapter circuit board electrically communicates with the first signal connector and the second signal connector.

[0008] The advantage of the multi-node server of this embodiment is that the combination of a vertical power adapter circuit board and a horizontal high-speed transmission signal adapter circuit board allows the maximum density arrangement of the rack to be achieved with a 1U dual-node system configuration. Rapid replacement of a single node is possible without increasing the length of the server case.

[0009] In order to make the features and technical contents of the present invention more readily apparent, reference is made to the following detailed description of the present invention and the accompanying drawings, which are provided for reference and explanation only and are not intended to limit the scope of the present invention. [Brief description of the drawings]

[0010] [Figure 1]FIG. 1 is an exploded view of a multi-node server of the present invention. [Diagram 2] FIG. 2 is an exploded view of the vertical integrated circuit substrate module of the present invention. [Diagram 3] FIG. 2 is a three-dimensional combination diagram showing the vertical integrated circuit board module of the present invention; [Figure 4] FIG. 2 is another three-dimensional combination diagram showing the vertical integrated circuit board module of the present invention. [Diagram 5] FIG. 2 is a top view showing the multi-node server of the present invention. [Figure 6] FIG. 2 is a schematic diagram showing a heat dissipation airflow of the multi-node server of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] 1 to 5, an embodiment of the present invention provides a multi-node server 100, which includes a server case 10, a main circuit board 20, a power adapter circuit board 30, and a signal adapter module 40. The main circuit board 20 is installed in the server case 10, and the main circuit board 20 includes at least two node areas, namely a first node area A1 and a second node area A2, but the present invention is not limited thereto. For example, one of the node areas may accommodate a central processing unit (CPU) computing node, and the other of the node areas may be a graphics processing unit (GPU) computing node or a storage node. The power adapter circuit board 30 and the signal adapter module 40 can be referred to as a vertical integrated circuit board module.

[0012] 1 to 3, the power adapter circuit board 30 is vertically installed on the main circuit board 20. The power adapter circuit board 30 has a first side and a second side opposite to each other, the first side refers to the side facing the power supplies (P1, P2), and the second side refers to the side opposite to the power supplies (P1, P2), i.e., the side facing the node areas (A1, A2). The first side of the power adapter circuit board 30 is provided with a first power input connector 31A and a second power input connector 31B.

[0013] A first power output connector 32A and a second power output connector 32B are provided on a second side of the power adapter circuit board 30. The first power output connector 32A faces the first node area A1, and the second power output connector 32B faces the second node area A2.

[0014] The power input connector 31A faces the first node area A1 and is arranged to be connected to the first power supply P1 to receive power. The first power input connector 31A is connected to the first power output connector 32A and the second power output connector 32B through the plate body 32 of the power adapter circuit board 30 to supply power to the first node device N1 and the second node device N2 (see FIG. 6). The second power input connector 31B faces the second node area A2 and is arranged to be connected to the second power supply P2 to receive power. Similarly, the second power input connector 31B is connected to the first power output connector 32A and the second power output connector 32B through the plate body 32 of the power adapter circuit board 30 to supply power to the first node device N1 and the second node device N2 (see FIG. 6). In an embodiment of the present invention, a single power supply (the first power supply P1 or the second power supply P2) can supply power to the first node device N1 and the second node device N2 simultaneously.

[0015] 2 and 3, the structure of this embodiment has the advantage of promoting the circulation of heat dissipation airflow, specifically, a middle fixing part 320, a first side fixing part 321, and a second side fixing part 322 are formed on the upper edge of the power adapter circuit board 30. The middle fixing part 320 is located between the first side fixing part 321 and the second side fixing part 322, and as a result, ventilation grooves 323 are formed on both sides of the middle fixing part 320, which allows the heat dissipation airflow to circulate horizontally.

[0016] As shown in Fig. 1, the method for fixing the power adapter circuit board 30 in this embodiment is to provide a fixing frame 50. The fixing frame 50 is horizontally installed on the server case 10 to provide a suspension fixing function. The fixing frame 50 includes a horizontal frame 51, a pair of side frames 52, and a vertical frame 53. The pair of side frames 52 are connected to both ends of the horizontal frame 51 and fixed to both side walls 12 of the server case 10. The vertical frame 53 is located between the both side walls 12 and can be fixed in contact with the main circuit board 20.

[0017] 2 to 4, the first side fixing part 321 and the second side fixing part 322 of the power adapter circuit board 30 each have an assembly fixing hole 3220, so that the power adapter circuit board 30 can be fixed to the horizontal frame 51 (see FIG. 1). In addition, the middle fixing part 320 of the power adapter circuit board 30 can be fixed to the vertical frame 53.

[0018] The signal adapter module 40 includes a signal adapter circuit board 41, at least one first signal connector 42A, and at least one second signal connector 42B. The signal adapter circuit board 41 is arranged in a direction parallel to the main circuit board 20. The signal adapter circuit board 41 electrically communicates with the first signal connector 42A and the second signal connector 42B. The advantage of this arrangement in the present embodiment is that no wiring is required to connect the two nodes, so there is no restriction on the length of the wiring and no cable management is required. The first signal connector 42A and the second signal connector 42B of the signal adapter circuit board 41 allow the first node device N1 and the second node device N2 to be quickly attached and detached, thereby enabling quick replacement.

[0019] As shown in FIG. 2 to FIG. 4, specifically, the signal adapter circuit board 41 has an intermediate segment 411, a first adapter segment 412A, and a second adapter segment 412B. The intermediate segment 411 is connected between the first adapter segment 412A and the second adapter segment 412B. The width of the intermediate segment 411 is smaller than the width of the first adapter segment 412A and the second adapter segment 412B. The signal adapter circuit board 41 further includes a ventilation recess 413, which is formed in a concave shape between the first adapter segment 412A and the second adapter segment 412B. Thus, the signal adapter circuit board 41 has a substantially U-shape. The width and position of the ventilation recess 413 correspond to the first power input connector 31A and the second power input connector 31B, which helps the heat dissipation airflow to flow vertically.

[0020] 1 and 6, the signal adapter circuit board 41 is installed in an elevated state above the main circuit board 20. As shown in FIG. 2 and FIG. 3, the first signal connector 42A is installed on the bottom surface of the first adapter segment 412A, and the second signal connector 42B is installed on the bottom surface of the second adapter segment 412B. In this embodiment, the signal adapter circuit board 41 is elevated using the first signal connector 42A and the second signal connector 42B, and this structure also has the effect of promoting the flow of heat dissipation airflow. Furthermore, the first signal connector 42A has an engagement end surface 422, and the second signal connector 42B also has an engagement end surface 422. The engagement end surface 422 of the first signal connector 42A faces the first node area A1, and the engagement end surface 422 of the second signal connector 42B faces the second node area A2. Specifically, the signal connector has a substantially L-shaped signal terminal 421, one end of which is connected upward to the signal adapter circuit board 41 and the other end of which is bent and faces the node area.

[0021] As shown in FIG. 2, FIG. 3 and FIG. 5, in this embodiment, the length of the power adapter circuit board 30 is shorter than the length of the signal adapter circuit board 41. Specifically, the power adapter circuit board 30 is located between the first signal connector 42A and the second signal connector 42B. In this embodiment, the second side of the power adapter circuit board 30 is further provided with a first identification connector 33A and a second identification connector 33B. Also referring to FIG. 5 (fixing frame 50 is omitted), the first identification connector 33A is connected to the first identification plug N13 of the first node device N1, and the second identification connector 33B is connected to the second identification plug N23 of the second node device N2. The identification connector can identify which device the connected node is, for example, whether it is a CPU computing node, a GPU computing node, or a storage node.

[0022] 2 and 3, the second side of the power adaptor circuit board 30 is further provided with a first alignment device 34A and a second alignment device 34B. The first alignment device 34A and the second alignment device 34B in this embodiment are cylindrical, so that the first node device N1 and the second node device N2 can be accurately engaged into the power adaptor circuit board 30. Also referring to FIG. 5, the first alignment device 34A is connected to the first alignment plug N14 of the first node device N1, and the second alignment device 34B is connected to the second alignment plug N24 of the second node device N2.

[0023] As shown in FIG. 3, the first identification connector 33A is located between the first alignment device 34A and the first power input connector 31A, and the second identification connector 33B is located between the second alignment device 34B and the second power input connector 31B.

[0024] As shown in Fig. 1 and Fig. 6, the multi-node server of this embodiment further includes an air guide cover (air baffle) 60, which is installed outside the first power input connector 31A and the second power input connector 31B. The air guide cover 60 includes an arc-shaped portion 61, a pair of side shrouds 62, and a top shroud 63. The pair of side shrouds 62 are connected to both sides of the arc-shaped portion 61, respectively, and are arranged outside the heat dissipation inlet of the power supply (P1, P2). The top shroud 63 is arranged on the top surface of the arc-shaped portion 61, and both ends of the top shroud 63 are fixed to the pair of side shrouds 62.

[0025] As shown in Fig. 1, in this embodiment, the top shell 14 of the server case 10 can be formed with vents 142 and 143, which correspond approximately to the positions of the external airflows W21 and W31 shown in Fig. 6. The external airflow W31 is bent by the air guide cover 60 to form an independent central cooling airflow W32, which directly cools the power supplies (P1 and P2), and improves the cooling efficiency of the system. Meanwhile, the external airflows W21 on both sides directly cool the first node area A1 and the second node area A2, and are guided by the air guide cover 60 and the side wall 12 to form independent side cooling airflows W22.

[0026] [Beneficial Effects of the Embodiments] The advantage of the multi-node server according to this embodiment is that it can realize the maximum density arrangement of the rack with a 1U dual node system configuration by combining a vertical power adapter circuit board (Power deliver board) and a horizontal signal adapter circuit board (Signal transfer board) capable of high-speed transmission. It is possible to quickly replace a single node without increasing the length dimension of the server case.

[0027] In this embodiment, the power adapter circuit board and the signal adapter circuit board are divided into two boards, and the vertical power adapter circuit board reduces the occupied area and ensures the space for heat dissipation. Meanwhile, the horizontal signal adapter circuit board has less impact on the heat dissipation airflow and has better overall heat dissipation performance. In addition, the high-speed signal part is not interfered with by the power supply, and the system performance is more stable.

[0028] When integrating the power supply and signal connection functions onto the same board, supplying both the power supply and the high-speed signal source on the same board increases the board area and hinders the heat dissipation airflow. The structure and layout of the present invention can solve these problems.

[0029] The above disclosure is merely a preferred embodiment of the present invention, and does not limit the scope of the claims of the present invention. Therefore, all equivalent technical modifications made based on the contents of the specification and accompanying drawings of the present invention shall be included in the scope of the claims of the present invention. [Explanation of symbols]

[0030] 100: Multi-node server 10: Server case 12: Side wall 14: Top shell 142, 143: Ventilation holes 20: Main circuit board 30: Power adapter circuit board 32: Plate body 320: Intermediate fixed part 321: First side fixing part 322: Second side fixing part 323: Ventilation groove 31A: First power input connector 31B: Second power input connector 32A: First power output connector 32B: Second power output connector 33A: First identification connector 33B: Second identification connector 34A: First alignment device 34B: Second alignment device 40: Signal adapter module 41: Signal adapter circuit board 411: Mid segment 412A: First adapter segment 412B: Second adapter segment 413: Ventilation recess 42A: First signal connector 421: Signal terminal 422: Engagement end face 42B: Second signal connector 50: Fixed frame 51: Horizontal frame 52: Side frame 53: Vertical frame 60: Air guide cover 61:Arc-shaped part 62: Side shroud 63: Top Shroud A1: First node area A2: Second node area N1: First node device N13: First identification plug N14: First alignment plug N2: Second node device N23: Second identification plug N24: Second alignment plug P1: First power supply P2: Second power supply

Claims

1. Server case, a main circuit board installed in the server case and having a first node area and a second node area; a power adapter circuit board that is vertically installed on the main circuit board, the power adapter circuit board having a first power input connector and a second power input connector on a first side thereof, and a first power output connector facing the first node area and a second power output connector facing the second node area on a second side thereof opposite to the first side thereof; a signal adapter module including a first signal connector, a second signal connector, and a signal adapter circuit board that is disposed in a direction parallel to the main circuit board and electrically connects the first signal connector and the second signal connector; A multi-node server comprising:

2. 2. The multi-node server of claim 1, wherein the signal adapter circuit board has an intermediate segment, a first adapter segment and a second adapter segment, the intermediate segment connects the first adapter segment and the second adapter segment, the width of the intermediate segment is narrower than the widths of the first adapter segment and the second adapter segment, and forms an air ventilation recess, the width of the air ventilation recess corresponds to the first power input connector and the second power input connector.

3. 3. The multi-node server of claim 2, wherein the signal adapter circuit board is installed in an elevated position above the main circuit board, the first signal connector is installed on a bottom surface of the first adapter segment, and the second signal connector is installed on a bottom surface of the second adapter segment.

4. 4. The multi-node server of claim 3, wherein the first signal connector has a first mating end face and the second signal connector has a second mating end face, the first mating end face facing the first node area and the second mating end face facing the second node area.

5. 2. The multi-node server of claim 1, wherein the power adapter circuit board is located between the first signal connector and the second signal connector.

6. 2. The multi-node server of claim 1, wherein the first power input connector faces toward the first node area and is arranged to be connected to a first power supply, and the second power input connector faces toward the second node area and is arranged to be connected to a second power supply.

7. 2. The multi-node server of claim 1, wherein the second side of the power adapter circuit board further comprises a first identification connector and a second identification connector.

8. 8. The multi-node server of claim 7, wherein the second side of the power adapter circuit board further comprises a first alignment device and a second alignment device.

9. 9. The multi-node server of claim 8, wherein the first identification connector is located between the first alignment device and the first power input connector, and the second identification connector is located between the second alignment device and the second power input connector.

10. 2. The multi-node server of claim 1, wherein an upper edge of the power adapter circuit board is formed with an intermediate fixing part, a first side fixing part, and a second side fixing part, the intermediate fixing part is located between the first side fixing part and the second side fixing part, and a ventilation groove is formed on both sides of the intermediate fixing part.

11. 2. The multi-node server of claim 1, further comprising an air guide cover, the air guide cover being installed outside the first power input connector and the second power input connector, the air guide cover including an arc-shaped portion and a pair of side shrouds, the pair of side shrouds being respectively connected to both sides of the arc-shaped portion.

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