Method and apparatus for drying electronic device

Abstract

To provide a method and an apparatus for drying an electronic device.SOLUTION: A method and apparatus for heating an electronic device and reducing the pressure in the electronic device are disclosed. Heat is applied while increasing and decreasing the pressure. A desiccator is provided for removing moisture from air exhausted from an electronic device before the air reaches an exhaust pump. A further embodiment detects the humidity in a low pressure chamber to determine when to increase and / or decrease the pressure according to the humidity. Still further embodiments determine that the device is sufficiently dry to restore a proper function according to the detected humidity, which is determined according to changes in humidity while the pressure is increased or decreased. Still further alternative embodiments automatically control some or all aspects of drying the electronic device. Additional embodiments sterilize electronic devices.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] This application claims priority to U.S. Provisional Patent Application No. 61 / 593,617, filed Feb. 1, 2012, and U.S. Provisional Patent Application No. 61 / 638,599, filed Apr. 26, 2012, the entireties of which are hereby incorporated by reference.

[0002] Embodiments of the present invention generally relate to the repair and maintenance of electronic devices, and more particularly to the repair and maintenance of electronic devices that have become at least partially inoperable due to ingress of moisture.

Background Art

[0003] Electronic devices are often manufactured with ultra-precision components and tight fit-and-finish dimensions that are intended to keep moisture out of the interior of the device. Many electronic devices are also manufactured in such a way that it is difficult for the owner and / or user to even attempt to disassemble the device to dry it without rendering the device inoperable. With the ever-shrinking size of electronic devices and the increasing computerization of software applications, it is now common for people to own multiple electronic devices such as portable electronic devices. Cell phones are now more common than telephone land lines, and every day many people inadvertently come into contact with water or other fluids with their electronic devices all over the world. This occurs daily, for example, in bathrooms, kitchens, pools, ponds, washing machines, or any other area where there is a risk that various electronic devices (e.g., small portable electronic devices) may be submerged in water or exposed to high humidity conditions. These electronic devices often have miniaturized solid-state transistor memories that capture and store digitized media in the form of phone contact lists, email addresses, digital photos, digital music, etc.

Summary of the Invention

[0004] In the prior art, currently, it is difficult to remove moisture from within an electronic device. The electronic device can be heated, but it is wasteful. This is because in many cases, the moisture within the device cannot escape due to the tortuous movement path. It is difficult to properly dry a device that has once been exposed to water and / or other wetting agents or fluids without completely disassembling the electronic device and using a combination of heat drying and air drying. Furthermore, if the device is dried by heating it overall and the heat exceeds the recommended maximum value for the electronic equipment or other components, damage will occur, the device will become inoperable, and there is a risk that the owner's digitized data will be lost forever. It has been understood that a new type of drying system is necessary in order for individuals or repair shops to be able to dry electronic devices without disassembling them, while at the same time retaining digitized data and / or protecting the electronic device as a whole from corrosion.

[0005] Embodiments of the present invention relate to an apparatus and method for vacuum drying an object by reducing the vapor pressure and boiling point of a liquid. More specifically, certain embodiments of the present invention relate to a vacuum chamber having a heating platen, which may be automatically controlled to conductively heat an electronic device (such as a non-operational portable electronic device), thereby reducing the overall vapor pressure temperature in order to dry the device and make it operational again.

[0006] In one embodiment, a heated platen provides heat conduction to a portable electronic device exposed to water or other unintended wetting agents. This heating platen may form the base of a vacuum chamber from which air is selectively evacuated. The heat conduction platen can raise the overall temperature of the wet device by physical contact and the heat transfer coefficient of the material. The heat conduction platen is housed within a convection box, radiates heat, and may further heat other parts of the vacuum chamber (e.g., the outside of the vacuum chamber) for simultaneous convective heating. The pressure within the vacuum chamber housing containing the wet electronic device may be simultaneously reduced. The reduction in pressure creates an environment where the liquid vapor pressure is reduced, enabling the boiling point of any liquid or wetting agent within the chamber to be lowered. By combining the heating path (e.g., heat conduction path) to the wet electronic device with the reduced pressure, in the vapor pressure phase, the wetting agent and liquid are "boiled off" in gaseous form at a lower temperature, drying while preventing damage to the electronic device. This drying occurs because the evaporation of the liquid to gas can more easily flow out through the airtight housing of the electronic device and through the tortuous paths defined in the design and manufacture of the device. The water or wetting agent is essentially boiled off over time to become gas and is then exhausted from within the chamber housing.

[0007] Other embodiments include a heating platen and an automatically controlled vacuum chamber. The vacuum chamber is controlled by a microprocessor using various heat and vacuum pressure profiles for various electronic device devices. This exemplary heating vacuum system creates local conditions for the wet electronic device, lowering the overall vapor pressure point and enabling the wetting agent to boil off at a much lower temperature. This allows for complete drying of the electronic device without damage due to excessive (high) temperature to the device itself.

[0008] Some features of the present invention address these and other needs and provide other important advantages.

[0009] This summary is provided to introduce selected concepts that will be described more fully hereinafter in the detailed description and the drawings. This summary is not intended to identify key or essential features of the claimed subject matter. Some or all of the features described may be present in corresponding independent or dependent claims, but should not be construed as limitations unless explicitly recited in a particular claim. Each embodiment described herein is not necessarily intended to address all of the objects described herein, and each embodiment does not necessarily include all of the features described. Other forms, embodiments, objects, advantages, benefits, features, and aspects of the invention will be apparent to those skilled in the art from the detailed description and drawings included herein. Further, in addition to this summary section, the various apparatus and methods described elsewhere in this specification may be presented in numerous various combinations and sub-combinations. Since all such useful, novel, and progressive combinations and sub-combinations are contemplated herein, it is recognized that it is not necessary to expressly represent each of these combinations.

Brief Description of the Drawings

[0010] Some of the following figures may include dimensions or may be made from scaled drawings. However, such dimensions or relative scales in the figures are for illustrative purposes only and should not be construed as limiting the scope of the invention.

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Figure 1

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Mode for Carrying Out the Invention

[0029] For the purpose of facilitating the understanding of the principles of the present invention, reference will now be made to the selected embodiments shown in the drawings. Certain terms will be used to explain the same. However, it will be understood that no limitation of the scope of the present invention thereby is intended. Any modifications and further changes to the described or illustrated embodiments, as well as any further uses of the principles of the present invention shown herein, will be readily apparent to those skilled in the art to which the present invention pertains. Although at least one embodiment of the present invention is shown in considerable detail, it will be apparent to those skilled in the art that, for the sake of clarity, some features, or some combinations of features, may not be shown.

[0030] Any reference to the "invention" in this specification refers to embodiments that are a family of the present invention, and there is no single embodiment that necessarily includes features included in all embodiments unless otherwise specified. Further, there may be references to the "advantages" realized by some embodiments of the present invention, but other embodiments may not include the same advantages or may include different advantages. None of the advantages described herein should be construed as being limited to any of the claims.

[0031] Certain quantities (spatial dimensions, temperature, pressure, time, force, resistance, current, voltage, concentration, wavelength, frequency, heat transfer coefficient, dimensionless parameters, etc.) may be used explicitly or implicitly herein, and such specific quantities are shown only by way of example and are approximate values unless otherwise specified. Discussions related to specific compositions of substances, if any, are shown only by way of example and do not limit the application to other compositions of substances, especially those of substances with similar properties, unless otherwise specified.

[0032] As an embodiment of the present invention, devices and apparatuses commonly used to dry objects under reduced pressure are exemplified. Embodiments include methods and apparatuses for drying (e.g., automatically drying) an electronic device (e.g., a portable electronic device (such as a mobile phone, digital music player, wristwatch, pager, camera, tablet computer, etc.)) after being exposed to water, high humidity conditions, or other unintended harmful wetting agents that render these devices inoperable. At least one embodiment provides a platen (e.g., a user-controlled heating platen) that is heated under vacuum to heat the portable electronic device and / or reduces the pressure to evaporate undesired liquids at a point lower than their boiling point in the atmosphere. Heat may also be applied by other means such as other heating components of the vacuum chamber or a gas (e.g., air) within the vacuum chamber. Heat and vacuum may be utilized sequentially, simultaneously, or in various combinations of sequential and simultaneous operations.

[0033] The boiling point of the liquid present within the device is lowered based on the structural material of the device being heated such that the temperature deviation does not exceed the melting point and / or glass transition temperature of that material. Thus, a device exposed to a drying cycle under vacuum pressure can be safely dried and can operate again without damage to the device itself.

[0034] Referring first to FIG. 1, an isometric view of a drying device, for example, an automatic drying device 1 for a portable electronic device, according to an embodiment of the present invention is shown. The electronic device drying device 1 includes a housing 2, a vacuum chamber 3, a heater (for example, an electric heating conduction platen 16), an optional convection chamber 4 (convection chamber), and an optional modem Internet interface connector 12. For the electronic device drying device 1, an optional user interface may be used, and the interface may be optionally configured from one or more of an input device selection switch 11, a device selection display light 15, a timer display 14, a power switch 19, a start-stop switch 13, and an acoustic indicator 20. The vacuum chamber 3 may be made of, for example, polymer plastic, glass or metal, and has a thickness and geometric shape suitable for withstanding a vacuum (reduced pressure). The vacuum chamber 3 may be made of any material that is, for example, sufficiently nonporous, at least structurally sufficiently rigid, withstands the vacuum pressure, and can maintain the vacuum pressure within the structure.

[0035] The heating conduction platen 16 may be powered through a heater power supply wire 10, may be manufactured from a thermally conductive material, and may be made to a thickness suitable for supporting a high vacuum. In some embodiments, the electric heating conduction platen 16 is made of aluminum, but other embodiments include platens made of copper, steel, iron or other thermally conductive materials (including, but not limited to, other metallic, plastic or ceramic materials). The heating conduction platen 16 may be mounted inside the convection chamber 4 and may be coupled to the vacuum chamber 3, for example, optionally using a sealing O-ring 5. The air in the vacuum chamber 3 is exhausted through an exhaust port 7 and vented through a vent port 6. The convection chamber 4, if used, may include a fan 9 for circulating warm air within the convection chamber 4.

[0036] Figure 2 shows a heating conduction platen 16 that includes a heat generator (e.g., a thermofoil resistance heater 21). The heating conduction platen 16 may also include a temperature feedback sensor 8, a thermofoil resistance heater power supply connector 10, an exhaust port 7 and / or a vent port 6. In one embodiment of the present invention, the heating conduction platen 16 is a stand-alone separate heating platen on a vacuum chamber mounting plate.

[0037] Figure 3 shows the heating conduction platen 16 and the vacuum chamber 3 in an isometric view with the interior visible. The vacuum chamber 3 is coupled to the heating conduction platen 16 using a sealing O-ring 5. The platen 16 provides thermal energy to and from the vacuum chamber 3 using a thermofoil resistance heater 21 attached to the bottom of the platen 16, and is temperature controlled by a temperature feedback sensor 8. The temperature feedback sensor 8 may be a thermistor, a semiconductor temperature sensor, or one of a number of types of thermocouples. The exhaust port 7 and the vent port 6 are shown as through holes that facilitate a pneumatic connection to the interior of the vacuum chamber 3 using the bottom surface of the heating conduction platen 16.

[0038] Figures 4A and 4B show the vacuum chamber 3 in an open state 17 and a closed state 18. When transitioning from the open state 17 to the closed state 18, the sealing O-ring 5 engages the vacuum chamber sealing surface 31. While in the closed state 18, the exhaust port 7 and the atmosphere vent port 6 are positioned within the diameter of the sealing O-ring 5 so as to be sealed within the vacuum chamber 3.

[0039] Referring to FIG. 5, based on one embodiment of the present invention, the housing 1 of the electronic device drying apparatus is shown in an isometric view that illustrates the control in the form of a block diagram. A controller, for example, a microprocessor 44, is electrically connected to a user interface 47, a memory 45, a modem Internet interface circuit 46, and a relay 42 for an exhaust pump via a user interface bus 48, a memory interface bus 49, a modem Internet interface bus 51, and a relay control line 66 for the exhaust pump, respectively. A power supply 53 supplies power to the entire system, for example, through a positive power line 58 and a negative ground line 55. A thermofoil resistance heater power line 10 is directly connected to the positive power transmission line 58 and the negative power transmission line 55 via a heater platen control transistor 54. An exhaust manifold 6 is connected to an exhaust pump 41, and the exhaust pump 41 is electrically controlled via an exhaust pump control line 68. A vacuum pressure sensor 43 is connected to the exhaust manifold 62 and generates a vacuum pressure level signal via a vacuum pressure sensor signal wire 52. A relative humidity sensor 61 may be pneumatically connected to the exhaust manifold 62 to generate an analog voltage signal regarding the relative humidity of the exhaust manifold 62. The analog voltage signal is detected by a relative humidity signal wire 61 and sent to the control microprocessor 44. A convection chamber vent solenoid 57 is connected to a convection chamber vent manifold 64 and is controlled by the control microprocessor 44 via a convection chamber solenoid vent valve control signal 56. An atmosphere vent solenoid valve 67 is connected to an atmosphere vent manifold 75 and is controlled by the control microprocessor 44 via an atmosphere solenoid vent valve control signal wire 69.

[0040] Referring to FIGS. 6A through 6C, the graph of the vapor pressure curve 74 is derived from known vapor pressure conversions with respect to the temperature 72 of water and the vacuum pressure 70 of the air surrounding the water. In the example shown in FIG. 6B, water maintained at a temperature 81 (about 104°F) will begin to boil at a vacuum pressure 83 (about -27 Hg). Using the vapor pressure curve 74, a target or preferred heating and evacuation drying zone 76 for automatic drying of the portable electronic device was determined. The upper temperature limit of the evacuation drying zone 76 may be determined by the temperature at which the materials used to construct the electronic device being dried will begin to deform or melt. The lower temperature limit of the evacuation drying zone 76 may be determined by the ability of the evacuation pump 41 to generate a low pressure, or the time required for the evacuation pump 41 to achieve a low pressure.

[0041] Referring to FIG. 7, it is a graph of a heating conduction platen heating curve 80 according to an embodiment of the present invention, and is heated to the temperature value on the temperature axis 85 over the time shown on the time axis 87. The portable electronic device placed on the heating conduction platen 16 is heated generally according to the device heating curve 82 under the influence of the heating conduction platen heating curve 80. The device heating curve 82 is shown with a time delay due to variations in the heat conduction coefficient.

[0042] Next, referring to FIG. 8, it is a graph of a heating conduction platen heating curve 80 according to another embodiment of the present invention, and is shown by the temperature axis 85 and the vacuum pressure axis 92 over the time on the time axis 87. As a result of changing the vacuum pressure curve 98, and due to the dissipation of the latent heat by the evaporation of the vapor of the wet portable electronic device, a device heating curve 96 is generated.

[0043] When the moisture inside the device evaporates, the device will typically cool due to the latent heat of evaporation. Heating in the process helps to minimize the cooling of the device and increase the rate at which moisture is removed from the device.

[0044] Referring to FIG. 9, it is a graph of the relative humidity sensor 61 according to an embodiment of the present invention, in which the relative humidity axis 102 is plotted against the cycle time axis 87. As moisture evaporates in the portable electronic device, the relative humidity curve 100 caused by evaporation gradually becomes smaller and follows the decreasing line 106. The relative humidity peak 104 gradually drops and finally becomes as small as the indoor humidity 108.

[0045] In one embodiment, the electronic device drying apparatus 1 operates as follows: Open the door 22 and place the wet or moisture-exposed portable electronic device under the vacuum chamber 3 lifted from the heating conduction platen 16, so that the device is placed in the convection chamber 4. The lifting of the vacuum chamber 3 may be performed manually or by a lifting mechanism. The door 22 may be hinged to the top of the convection chamber 4. (Neither method impairs nor enhances the spirit or purpose of the present invention.)

[0046] To start the drying cycle operation, the user presses or moves the on-off switch 19 to turn on the power of the drying apparatus 1. When the apparatus 1 is powered on, the user selects the electronic device to be dried using the input device selection switch (see FIGS. 1 and 5). The control microprocessor 44 polls the input device selection switch 11 to detect the user's switch selection via the user interface bus 48, and then acknowledges the user's selection by lighting the corresponding input device selection display light 15 (FIG. 1) for the corresponding selection. The microprocessor 44 stores software in the non-volatile memory 45 and communicates with its software code through the memory interface bus 49.

[0047] In one embodiment of the present invention, the memory 45 includes algorithms for various portable electronic devices that can be dried by the present invention (each algorithm includes a specific temperature setting of the heating conduction platen 16), and the correct algorithm is automatically selected for the type of electronic device placed in the apparatus 1.

[0048] In one embodiment, the microprocessor 44 activates or powers the heating conduction platen 16 via the control transistor 54. The control transistor 54 switches the positive supply line 58 and the negative supply line 55 of the power supply 53 to the heater power supply wire 10, respectively. By this power switching, the thermofoil resistance heater 21 generates heat by resistive heating. The thermofoil resistance heater 21 is in thermal contact with the heating conduction platen 16 (it may be superimposed on the heating conduction platen 16), begins to heat up to the target temperature, and then transfers heat to and into the device by heat conduction, for example, through physical contact with the target device. In certain embodiments, the target temperature of the heating platen is at least 70°F and at most 150°F. In further embodiments, the target temperature of the heating platen is at least about 110°F and at most about 120°F.

[0049] In an alternative embodiment, the heating of the heating conduction platen 16 is achieved by another method, for example, hot water heating, infrared lamp, incandescent lamp, gas or combustible fuel, Fresnel lens, steam, human body heat, hair dryer, fissionable material, or frictional heat. Any of these heating methods will provide the heat necessary for the heating conduction platen 16 to transfer heat to the portable electronic device.

[0050] During operation, the microprocessor 44 polls the heating platen temperature sensor 8 (via the heating platen temperature sensor signal line 26) and supplies power to the platen 16 until the platen 16 reaches the target temperature. When the target temperature is reached, the microprocessor 44 starts a timer based on a variable in the memory 45 via the memory interface bus 49. The timer gives the heating conduction plate 16 sufficient time to transfer heat into the portable electronic device. In some embodiments, the platen 16 has a heating conduction platen heating profile 80 and requires a finite time to reach the target temperature. The heating profile 80 (FIG. 7) is just one such algorithm, and the target temperature can be at any point on the temperature axis 85. As a result of the heating conduction plate 16 transferring heat to the device under target, a device temperature profile 82 occurs. Generally, the portable electronic device temperature profile 82 follows the heating conduction platen heating profile 80 and can typically settle anywhere on the temperature axis 85. Without further action, the heating conduction platen heating profile 80 and the portable electronic device heating profile 82 will reach a stationary point and maintain this temperature for a finite time along the time axis 87. When power is interrupted to the device 1, the heating conduction platen heating profile 80 and the portable electronic device heating profile 85 will cool as per the profile 84.

[0051] During the thermal cycle, the vacuum chamber 3 can be in the open position 17 or the closed position 18 as shown in FIGS. 4A and 4B. In either position, there is little effect on the conductive heat transfer from the heating conduction plate 16 to the portable electronic device.

[0052] The convection chamber fan 9 may be powered (via the fan control signal line 24 electrically connected to the microprocessor 44) to circulate air inside the convection chamber 4 and outside the vacuum chamber 3. The air in the convection chamber 4 is heated, at least in part, by radiant heat coming from the heating conduction platen 16. The convection chamber fan 9 provides a means for circulating the air in the convection chamber 4 and helps to maintain the heated air temperature relatively uniformly inside the convection chamber 4 and around the vacuum chamber 3. The microprocessor 44 can close the atmosphere vent solenoid valve 67 by sending an electrical signal via the atmosphere vent solenoid valve control signal line 69.

[0053] In one embodiment of the present invention, there are separate heating elements for controlling the heat in the convection chamber 4. These heating elements may be general electrical resistance heaters. In certain embodiments, the platen 16 may be used to heat the convection chamber 4 without the need for a separate convection chamber heater.

[0054] During operation, the microprocessor 44 signals to the user, via the acoustic indicator 20 (Figs. 1 and 5) etc., that the heating conduction platen 4 has reached the target temperature, and may give an audible signal with the acoustic indicator 20 for the user to move the vacuum chamber 3 from the open position 17 to the closed position 18 (see Figs. 4A and 4B) to start the drying cycle. Subsequently, the start-stop switch 13 may be pushed or actuated by the user, after which the microprocessor 44 detects this action through polling of the user interface bus 48. Then the microprocessor 44 sends a signal to the convection vent solenoid valve 57 (via the convection chamber vent solenoid control signal wire 56), after which the atmosphere vent 6 is closed through the pneumatically connected atmosphere vent manifold 64. When the convection chamber vent solenoid valve 57 closes, it is ensured that the vacuum chamber 3 is sealed when the exhaust of its internal air starts.

[0055] After the electronic device has been heated to the target temperature (in an alternative embodiment, when the heating platen reaches the target temperature), and after an optional time delay, the pressure within the vacuum chamber is reduced. In at least one embodiment, the microprocessor 44 sends a control signal to the motor relay 42 (via the motor relay control signal line 66) to activate the exhaust pump 41. The motor relay 42 powers the exhaust pump 41 via the exhaust pump power line 68. When activated, the exhaust pump 41 begins to exhaust air from within the vacuum chamber 3 through the exhaust port 7. The exhaust port 7 is pneumatically connected to the exhaust manifold 62. The microprocessor 44 can display the elapsed time on the display timer 14 (FIG. 1). As the air is exhausted within the vacuum chamber 3, the vacuum chamber sealing surface 31 presses the vacuum chamber sealing O-ring 5 against the surface of the heating conduction platen 16, thereby achieving a vacuum-tight seal. The exhaust manifold 62 is pneumatically connected to the vacuum pressure sensor 43. The vacuum pressure sensor 43 conducts a vacuum pressure analog signal to the microprocessor 44 via the vacuum pressure signal line 52 for monitoring and control based on an algorithm corresponding to the particular electronic device being processed.

[0056] As air is being exhausted, the microprocessor 44 polls the temperature of the heating conduction platen 16, the vacuum chamber exhaust pressure sensor 43, and the relative humidity sensor 61 via the temperature signal line 26, the vacuum pressure signal line 52, and the relative humidity signal line 65, respectively. During this exhaust process, for example, the vapor pressure point of water present on the surface of components within a portable electronic device follows a known vapor pressure curve 74 as shown in FIGS. 6A through 6C. In some embodiments, the target temperature and vacuum pressure variables of the microprocessor 44's algorithm fall within a preferred vacuum drying target zone 76, for example. The vacuum drying target zone 76 evaporates water at a lower temperature based on the reduced pressure within the chamber 4. The microprocessor 44 can monitor the pressure (via the vacuum pressure sensor 43) and the relative humidity (via the relative humidity sensor 61) and control the drying process accordingly.

[0057] Even though the heating platen (or any type of component used to apply heat) is maintained at a constant temperature, as the pressure within the chamber decreases, the temperature of the electronic device will typically decrease. This is due, at least in part, to the dissipation of the latent heat of vaporization and the removal of vapor through the exhaust manifold 62. The pressure drop will also increase the relative humidity, which will be detected by the relative humidity sensor 61 pneumatically connected to the exhaust manifold 62.

[0058] The pressure within the chamber is decreased and then increased again. This may occur after a predetermined time or after a specific condition (such as the relative humidity reaching or approaching a steady state value) is detected. The microprocessor 44 may send signals to the convection chamber vent solenoid valve 57 and the atmosphere vent solenoid valve 67 (via the convection chamber vent solenoid valve control signal 56 and the atmosphere solenoid valve control signal 69), and the pressure increase may be achieved by these valves opening. Thereby, air, which may be ambient air, enters through the atmosphere control solenoid valve 67 and thereby into the vent convection chamber 4. Simultaneously with the opening of the convection chamber vent solenoid valve 57 and / or the atmosphere vent solenoid valve 67, the convection vent solenoid valve 57 may open, and when the convection vent solenoid valve 57 opens, the heated air within the convection chamber 4 is drawn into the vacuum chamber 3 by the vacuum pump 41. With the exhaust pump 41 remaining on and drawing in air into the vacuum chamber 3 through the atmosphere vent manifold 64 and the exhaust manifold 62, air (e.g., indoor air) is drawn in.

[0059] After the relative humidity is decreased (as detected through the relative humidity sensor 61 and the relative humidity sensor feedback signal sent to the microprocessor 44 via the relative humidity sensor feedback line 65), the convection chamber vent solenoid valve 57 and the atmosphere solenoid valve 67 may be closed through the convection chamber vent solenoid valve control signal 56, the atmosphere solenoid valve control signal 69, etc., and the pressure within the vacuum chamber is decreased again.

[0060] This sequence results in the exhaust chamber profile curve 98 (Figs. 8B and 8C), is repeated based on a selected algorithm, and may be controlled under the software control of the microprocessor 44. By the repeated vacuum cycles (which may be performed under constant heating), the wetting agent is forced to evaporate and change from the liquid state to the gaseous state. By thus converting water to the gaseous state, the resulting water vapor can escape from the tortuous path of the electronic device. Otherwise, liquid water would not be able to escape through this path.

[0061] In at least one embodiment, the microprocessor 44 detects the relative humidity peak 104 (represented in Fig. 9), for example, by using a software algorithm, and the algorithm determines the peak by detecting a decrease or lack of the rate at which the relative humidity changes. When the relative humidity peak 104 is detected, the pressure in the vacuum chamber is increased (such as by venting the vacuum chamber), and the relative humidity decreases. When the relative humidity reaches the minimum relative humidity 108 (which may be detected by a software algorithm similar to the above-described algorithm), another cycle may be started by decreasing the pressure in the vacuum chamber.

[0062] Referring now to Figs. 8A and 8C, the arrow 96A plotting the direction of the reaction curve is typically due to heat acquisition when the system is in the purge air recovery mode where the electronic device obtains heat. The arrow 96B plotting the direction of the reaction curve is typically due to the latent heat of evaporation when the system is in the vacuum drying mode. As the cycles are continuously performed, the temperature 96 of the electronic device tends to gradually increase, and the temperature change between successive cycles tends to decrease.

[0063] In some embodiments, the microprocessor 44 continues this repetitive or periodic heating and evacuation of the vacuum chamber 3 to yield a relative humidity response curve 100 (FIG. 9). This relative humidity response curve 100 may be monitored by a software algorithm, and the relative humidity cycle maxima 104 and cycle minima 108 are stored in registers of the microprocessor 44. In alternative embodiments, the relative humidity maxima 104 and minima 108 typically asymptote to minima 109 and 110 over time according to relative humidity drying profiles 106A and 106B. Through one or more successive heating cycles 96 and evacuation cycles 98 shown in FIG. 8, the portable electronic device disposed within the vacuum chamber 3 is dried. The control algorithm of the microprocessor 44 can identify the point in time when the difference between the relative humidity maximum 104 and the relative humidity minimum 108 is within a particular tolerance that would cause the vacuum pump 41 not to operate or to be stopped.

[0064] The system can automatically stop continuous drying cycles when one or more criteria are reached. For example, the system may stop the execution of continuous drying cycles when a parameter that changes as the device dries approaches or reaches a steady state value or an end value. In one exemplary embodiment, when the relative humidity falls below a certain level or approaches (or reaches) a steady state value, the system automatically stops the execution of continuous drying cycles. In another exemplary embodiment, when the difference between the maximum relative humidity and the minimum relative humidity of a cycle falls below a certain level, the system automatically stops the execution of continuous drying cycles. In yet another exemplary embodiment, when the temperature 96 of the electronic device approaches or reaches a steady state value, the system automatically stops the execution of continuous drying cycles.

[0065] Referring back to FIGS. 1 and 5, the microprocessor 44 may be remotely connected to the Internet via, for example, an RJ11 modem Internet connector 12 integrated with a modem interface 46. Thus, the microprocessor 44 may send Internet or telephone signals via the modem Internet interface 46 and the RJ11 Internet connector 12 to complete a processing cycle and inform the user that the electronic device is sufficiently dry.

[0066] Accordingly, conductive heating and vacuum drying are simultaneously achieved and adjusted for specific electronic devices based on the materials of the portable electronic structure to dry various types of electronic devices available in the market today without damage.

[0067] In an alternative embodiment, an optional desiccator 63 (FIG. 5) may be connected to the exhaust manifold 62 upstream of the exhaust pump 41. One example of the location of the desiccator 63 is downstream of the relative humidity sensor 61 and upstream of the exhaust pump 41. When the desiccator 63 is included, moisture in the air reaching from the vacuum chamber 3 can be absorbed before the moisture reaches the exhaust pump 41. In some embodiments, the desiccator 63 may be a replaceable cartridge or a regenerative desiccator.

[0068] In embodiments where the exhaust pump is of the type that uses oil, the oil in the exhaust pump tends to remove (or absorb) water from the air, which may lead to the draw-in of water into the exhaust pump, premature degradation of the oil in the exhaust pump, and / or premature failure of the exhaust pump itself. In embodiments where the exhaust pump is of the oil-free type, a high humidity condition may also lead to premature failure of the pump. Thus, the advantage of removing water (or other air components may also be possible) from the air by the desiccator 63 before the air reaches the exhaust pump 41 will be understood.

[0069] While many of the above embodiments describe an automatically controlled drying apparatus and method, other embodiments include a manually controlled drying apparatus and method. For example, in one embodiment, the user controls the application of heat to the wet device, the application of vacuum to the wet device, and the release of vacuum to the wet device.

[0070] FIG. 10 shows a drying apparatus according to another embodiment of the present invention, for example, a portable electronic device automatic drying apparatus 200. Many features and components of the drying apparatus 200 are similar to those of the drying apparatus 1, and the same reference numerals are used to indicate similar features and components between the two embodiments. The drying apparatus 200 includes a sterilization unit, which is, for example, an ultraviolet (UV) sterilization light 202 that can kill germs. The light 202 may be mounted inside the convection chamber 4 and controlled by a UV sterilization light control signal 204. In one embodiment, the UV sterilization light 202 is mounted inside the convection chamber 4 and outside the vacuum chamber 3, and UV radiation is emitted by the sterilization light 202 and passes through the vacuum chamber 3. The vacuum chamber 3 may be made of a UV light transmissive material (such as acrylic plastic as an example). In an alternative embodiment, the UV sterilization light 202 is mounted inside the vacuum chamber 3, which may be advantageous in embodiments where the vacuum chamber 3 is made of a non-UV light transmissive material.

[0071] In one embodiment, the operation of the drying apparatus 200 is similar to that of the drying apparatus 1 described above, but there are the following changes and purification. The microprocessor 44 sends a control signal through the UV sterilization lamp control line 204 to turn on the power of the UV sterilization lamp 202. This may occur when or around the time of operation of the heat conduction platen 16 by the microprocessor 44. In one embodiment, the UV sterilization lamp 202 subsequently emits UV waves with a wavelength of about 254 nm. This can pass through the vacuum chamber 3, especially in embodiments where the vacuum chamber 3 is made of transparent plastic.

[0072] In yet a further embodiment, one or more desiccators 218 can be isolated from the exhaust manifold 62. This is advantageous when performing regular maintenance of the drying device or when performing an automated maintenance cycle. As an example, the embodiment shown in FIGS. 11 through 13 includes valves (e.g., three-way air purge solenoid valves 210 and 212) that can selectively connect and isolate the desiccator 218 to the exhaust manifold 62. Solenoid valve 210 is disposed between the relative humidity sensor 61 and the desiccator 218, and solenoid valve 212 is disposed between the desiccator 218 and the vacuum sensor 43. In the illustrated embodiment, the three-way air purge valves 210 and 212 have a common distribution port that is pneumatically connected to the desiccator 218. This common port connection simultaneously enables isolation of the desiccator 218 from the exhaust manifold 62 and disconnection of the exhaust manifold 62 from the vacuum pump 41. This disconnection prevents moisture from reaching the vacuum pump 41 from the vacuum chamber 3 while the desiccator 63 is being regenerated. The operation of this embodiment is similar to the embodiment described with respect to FIG. 5, but with the following modifications and purifications.

[0073] An optional desiccator heater 220 and an optional desiccator air purge pump 224 may be included. While the desiccator 218 is isolated from the exhaust manifold 62 and the vacuum pump 41, the desiccator 218 may be heated by the desiccator heater 220 without affecting the vacuum manifold 62 and the associated air-vacuum circuit. The desiccant inside the desiccator 218 is heated to, for example, a target temperature to bake off the absorbed moisture, and the purge pump 224 is regulated (e.g., according to a maintenance control algorithm such that a specified time and / or temperature profile is commanded by the microprocessor 44) to assist in removing moisture from the desiccant 218. In certain embodiments, the target temperature of the desiccator heater is at least 200°F and at most 300°F. In a further embodiment, the target temperature of the desiccator heater is about 250°F.

[0074] When the purge pump 224 is adjusted, air is pushed along the air path 235 over the entire desiccant housed inside the desiccator 218, and the moist air is blown out through the atmosphere port 238. An optional desiccator cooling fan 222 may be included (and optionally adjusted by the microprocessor 44) to lower the temperature of the desiccant inside the desiccator 218 to a temperature suitable for the desiccant to absorb rather than degas moisture.

[0075] When a drying cycle is started according to an embodiment, the atmosphere vent 6 is closed, and the microprocessor 44 sends control signals to the three-way air purge solenoid valves 210 and 212 via the three-way air purge solenoid control line 214. By this operation, the three-way air purge solenoid valves 210 and 212 are closed, and the vacuum pump 41 pneumatically connects to the exhaust manifold 62. By this pneumatic connection, the exhaust air flows along the path 215 of the air flow, through the exhaust manifold 62 and the desiccator 218, to the vacuum pump 41. One advantage that can be achieved by removing moisture from the exhaust air before it reaches the vacuum pump 41 is a dramatic reduction in the failure rate of the vacuum pump 41.

[0076] After the algorithm of the microprocessor 44 detects that the portable electronic device has dried, the microprocessor 44 may signal the system to enter a maintenance mode. The UV sterilization light 202 may be powered off from the microprocessor 44 via the UV sterilization light control line 204. The microprocessor 44 powers the desiccator heater 220 via the desiccator heater power relay control signal 166 and the desiccator heater power relay 228. The control signal 226 is the control signal for the relay 228. The temperature of the desiccator 218 may be sampled by the microprocessor 44 via the desiccator temperature probe 230, and the heating of the desiccator 218 may be controlled to a specific temperature at which the moisture in the desiccant contained in the desiccator 218 begins to bake out. The three-way air purge solenoid valves 210 and 212 may be electrically switched via the three-way air purge solenoid control line 202 when it is determined that sufficient drying has occurred, which may occur within a finite time specified by the maintenance algorithm of the microprocessor 44. Subsequently, the air purge pump 224 may be powered on by the microprocessor 44 via the air purge pump control signal 232, and moist air may be flowed through the desiccator 218 to the atmosphere vent port 238. The microprocessor 44 may use a timer in the maintenance algorithm to heat and purge the moist air for a finite time. When the optional maintenance cycle is complete, the microprocessor 44 may turn on the desiccator cooling fan 222 to cool the desiccator 218. Subsequently, the microprocessor 44 may turn off the air purge pump 224 and allow the system to dry another electronic device and optionally prepare for sterilization.

[0077] Next, referring to FIG. 12, desiccator 218 is shown together with desiccator heater 220, desiccator temperature sensor 230, desiccator cooling fan 222, and desiccator air purge solenoid valves 210 and 212. Vacuum pump 41 is connected to exhaust manifold 62, and air purge pump 224 is pneumatically connected to air purge solenoid valve 212 via air purge manifold 240. Three-way air purge solenoid valves 210 and 212 are shown in a state that enables vacuum through desiccator 218 as illustrated in the air flow path.

[0078] Referring to FIG. 13, three-way air purge solenoid valves 210 and 212 of the desiccator in the maintenance state are shown, and the air flow from air purge pump 224 passes through the desiccator along direction 235 and flows "backward" through purge air port 238. Air purge pump 224 can flow pressurized air along air flow path 235. This preferred air flow path enables the desiccant to be delivered with the moisture removed from the air and prevents moisture from entering air purge pump 224. This would occur if the air purge pump were to draw air through desiccator 218. Purge pump 224 can continue to blow air along air flow path 235 for a time defined by the maintenance control algorithm of microprocessor 44. In one embodiment, an in-line relative humidity sensor similar to relative humidity sensor 61 is incorporated to detect when desiccator 218 is sufficiently dry.

[0079] As described above for at least one embodiment, when the desiccator 218 is isolated from the exhaust manifold 62, the exhaust manifold 62 is isolated from the vacuum pump 41. Nevertheless, in an alternative embodiment, an exhaust manifold 62 that remains pneumatically connected to the vacuum pump 41 is included even when the desiccator 218 is isolated from the exhaust manifold 62. Such a configuration is useful in situations where the desiccator 218 blocks the air flow, as when the desiccator 218 malfunctions, but the operation of the drying device 200 is still desired.

[0080] In some embodiments, all of the above-described operations are performed automatically, so that the user simply places the electronic device in the appropriate position and activates the drying device so that the drying device removes moisture from the electronic device.

[0081] The microprocessor 44 may be a microcontroller, a general-purpose microprocessor, or generally any type of controller capable of performing the required control functions. The microprocessor 44 can read its program from the memory 45 and may consist of one or more components configured as a single unit. Alternatively, in a multi-component form, the processor 44 may have one or more components remotely located relative to others. The one or more components of the processor 44 may consist of a variety of combinations of digital circuits, analog circuits, or electronic circuits including both. In certain embodiments, the processor 44 is a conventional integrated circuit microprocessor device, for example, one or more of the CORE i7 HEXA processors of INTEL Corporation (450 Mission College Boulevard, Santa Clara, California 95052, USA), the ATHLON or PHENOM processors of Advanced Micro Devices (One AMD Place, Sunnyvale, California 94088, USA), the POWER8 processor of IBM Corporation (1 New Orchard Road, Armonk, New York 10504, USA), or the PIC Microcontrollers of Microchip Technologies (2355 West Chandler Boulevard, Chandler, Arizona 85224, USA), etc. In alternative embodiments, one or more application-specific integrated circuits (ASICs), reduced instruction set computing (RISC) processors, general-purpose microprocessors, programmable logic arrays, or other devices may be used alone or in combinations that would be apparent to those skilled in the art.

[0082] Furthermore, as the memory 45 in various embodiments, to name just a few examples, there are one or more types of solid-state electronic memory, magnetic memory, optical memory, and the like. As non-limiting examples, the memory 45 may be a solid-state electronic random access memory (RAM), a sequentially accessible memory (SAM) (such as a First-In, First-Out (FIFO) type or a Last-In First-Out (LIFO) type), a programmable read-only memory (PROM), an electrically programmable read-only memory (EPROM), or an electrically erasable programmable read-only memory (EEPROM), an optical disk memory (recordable, rewritable, or read-only DVD or CD-ROM, etc.), a magnetic-encoded hard drive, a floppy (registered trademark) disk, a tape or cartridge medium, or a plurality and / or combination of these memory types. Also, the memory 45 may be volatile, non-volatile, or a hybrid combination of volatile and non-volatile. The memory 45 in various embodiments is encoded with program instructions executable by the processor 44 to perform the automated methods disclosed herein.

[0083] Various aspects of various embodiments of the present invention are described in paragraphs X1, X2, X3, X4, X5, X6, and X7 as follows:

[0084] X1. One embodiment of the present invention includes an electronic device drying apparatus for drying an electronic device damaged by water or other wetting agents, the apparatus including a heat conduction platen means, a vacuum chamber means, an exhaust pump means, a convection oven means, a solenoid valve control means, a microprocessor control system for automatically controlling heating and exhaust, a vacuum detection device, a humidity detection device, and a switch array for algorithm selection.

[0085] X2. Another embodiment of the present invention includes the steps of placing a portable electronic device that has become at least partially inoperable due to water intrusion into a low-pressure chamber, heating the electronic device, reducing the pressure inside the low-pressure chamber, removing water from inside the portable electronic device to the outside of the portable electronic device, increasing the pressure inside the low-pressure chamber after the step of reducing the pressure, equalizing the pressure inside the low-pressure chamber with the pressure outside the low-pressure chamber, and removing the portable electronic device from the low-pressure chamber.

[0086] X3. Another embodiment of the present invention includes a low-pressure chamber that defines an interior, the interior being sized to accommodate an electronic device therein and configured to allow removal of the electronic device therefrom, an exhaust pump connected to the chamber, a heater connected to the chamber, and a controller connected to the exhaust pump and the heater, the controller controlling the exhaust pump to reduce the pressure inside the low-pressure chamber and controlling the operation of the heater to apply heat to the electronic device to control the removal of water from the electronic device.

[0087] X4. Another embodiment of the present invention includes a device for removing water from an electronic device substantially as described herein with reference to the accompanying drawings.

[0088] X5. Another embodiment of the present invention includes a method for removing water from an electronic device substantially as described herein with reference to the accompanying drawings.

[0089] X6. Another embodiment of the present invention includes a method for manufacturing a device substantially as described herein with reference to the accompanying drawings.

[0090] X7. Another embodiment of the present invention includes a device comprising means for heating an electronic device, means for reducing the pressure inside the electronic device, and means for detecting when a sufficient amount of water has been removed from the electronic device.

[0091] Still other embodiments include the features described in any of the previous descriptions X1, X2, X3, X4, X5, X6, and X7, combined with one or more of the following aspects:

[0092] Regenerative desiccator means for automatically drying a desiccant.

[0093] UV sterilization lamp means for sterilizing a portable electronic device.

[0094] The heat conduction platen consists of a thermo foil heater superimposed on a metallic conduction platen.

[0095] The thermo foil heater of the heat conduction platen is between 25 watts and 1000 watts.

[0096] The heat conduction platen utilizes a temperature feedback sensor.

[0097] The surface area of the heat conduction platen is between 4 square inches and 1500 square inches.

[0098] The heat conduction platen is also used as a convection oven heater for heating the outside of the vacuum chamber.

[0099] The convection oven is used to heat the outside of the vacuum chamber and, when evaporation occurs, minimizes the compression of the internal vacuum chamber.

[0100] The vacuum chamber is made of a vacuum-rated material such as plastic, metal, or glass.

[0101] The vacuum chamber is constructed to withstand a vacuum pressure of up to 30 inches of mercury below atmospheric pressure.

[0102] The capacity of the vacuum chamber is between 0.25 liters and 12 liters.

[0103] The exhaust pump achieves a minimum vacuum pressure of 19 inches of mercury below atmospheric pressure.

[0104] The orifice diameter of the solenoid valve is between 0.025 inches and 1.000 inches.

[0105] The solenoid valve is used to provide an atmospheric path for exchanging air heated in a convection oven.

[0106] The microprocessor controller utilizes an algorithm stored in memory for controlled vacuum drying.

[0107] The relative humidity sensor is pneumatically connected to the vacuum chamber and is used to sample the real-time relative humidity.

[0108] The microprocessor controller utilizes the maximum and minimum values of relative humidity for controlled vacuum drying.

[0109] The microprocessor controller automatically controls the heating conduction temperature, vacuum pressure, and cycle time.

[0110] The microprocessor controller utilizes pressure sensors, temperature sensors, and relative humidity sensors as feedback for heated vacuum drying.

[0111] The microprocessor controller can record performance data and transmit it via a modem Internet interface.

[0112] The switch array for algorithm selection realizes a simple control method.

[0113] The regenerative desiccator is heated by an external thermal foil heater between 25W and 1000W.

[0114] The regenerative desiccator can bake the desiccant through accurate closed-loop temperature control by using a fan and a temperature signal.

[0115] The regenerative desiccator uses a three-way pneumatic valve to pneumatically isolate and switch the direction and path of the air flow to purge the desiccator.

[0116] The UV germicidal light emits UV radiation in the wavelength range of 254 nm and the output range between 1 W and 250 W to achieve sufficient UV radiation for sterilizing portable electronic devices.

[0117] The UV germicidal light sterilizes the portable electronic device for a period between 1 minute and 480 minutes.

[0118] The regenerative desiccator is heated from 120°F to 500°F to provide a dried medium.

[0119] The regenerative desiccator is heated for a period between 5 minutes and 600 minutes to provide sufficient drying time.

[0120] The heating conduction platen is heated between 70°F and 200°F to reintroduce heat as compensation for losses due to the latent heat of evaporation.

[0121] The microprocessor controller can record performance data and wirelessly transmit and receive performance data and software updates via a cellular wireless network.

[0122] The microprocessor controller can record performance data and print the results with an Internet Protocol wireless printer or a locally installed printer.

[0123] The step of placing includes placing the portable electronic device on the platen, and the step of heating includes heating the platen to at least about 110°F and at most about 120°F.

[0124] The step of reducing the pressure includes reducing the pressure to at least about 28 Hg inches, which is less than the pressure outside the chamber.

[0125] The step of reducing the pressure includes reducing the pressure to at least about 30 Hg inches, which is less than the pressure outside the chamber.

[0126] The step of arranging includes arranging the portable electronic device on the platen, the step of heating includes heating the platen to at least about 110°F and at most about 120°F, and the step of reducing the pressure includes reducing the pressure to at least about 28 Hg inches, which is less than the pressure outside the chamber.

[0127] The step of reducing the pressure and the step of increasing the pressure are sequentially repeated before the step of taking out the portable electronic device.

[0128] The step of automatically controlling the repetition of the step of reducing the pressure and the step of increasing the pressure according to at least one predetermined criterion.

[0129] The step of detecting when a sufficient amount of moisture has been removed from the electronic device.

[0130] The step of stopping the repetition of the step of reducing the pressure and the step of increasing the pressure after the step of detecting.

[0131] The step of measuring the relative humidity inside the chamber.

[0132] The step of increasing the pressure inside the chamber after the relative humidity has decreased and the rate of decrease in relative humidity has slowed down.

[0133] The step of reducing the pressure and the step of increasing the pressure are sequentially repeated before the step of taking out the portable electronic device.

[0134] The step of reducing the pressure starts when the relative humidity increases and the rate of increase in relative humidity slows down.

[0135] The repetition of the step of reducing the pressure and the step of increasing the pressure is stopped when the difference between the successive relative humidity maximum values and the relative humidity minimum values falls within a predetermined allowable range.

[0136] The repetition of the step of reducing the pressure and the step of increasing the pressure is stopped when the relative humidity in the chamber reaches a predetermined value.

[0137] A step of reducing the pressure in the low-pressure chamber using a pump.

[0138] A step of removing moisture from the gas being pumped out of the chamber before the gas reaches the pump.

[0139] The step of removing the moisture includes a step of removing the moisture using a desiccator containing a desiccant.

[0140] A step of removing moisture from the desiccant.

[0141] Before the step of removing moisture from the desiccant, a step of isolating the desiccant from the pump.

[0142] A step of reversing the air flow through the desiccator while removing moisture from the desiccant.

[0143] A step of heating the desiccant while removing moisture from the desiccant.

[0144] The step of heating includes a step of heating the desiccant to at least 200°F and at most 300°F.

[0145] The step of heating includes a step of heating the desiccant to about 250°F.

[0146] The controller controls the exhaust pump to reduce the pressure in the low-pressure chamber multiple times, and the pressure in the low-pressure chamber increases during successive pressure drops.

[0147] A humidity sensor is connected to a low-pressure chamber and a controller, and the controller controls an exhaust pump based at least in part on a signal received from the humidity sensor to at least temporarily stop reducing the pressure in the low-pressure chamber.

[0148] When the rate of change of relative humidity decreases or is approximately zero, the controller controls the exhaust pump to at least temporarily stop reducing the pressure in the low-pressure chamber.

[0149] When the rate of change of relative humidity decreases or is approximately zero, the controller controls the exhaust pump to begin reducing the pressure in the low-pressure chamber.

[0150] When the exhaust pump reduces the pressure in the low-pressure chamber multiple times, the humidity sensor detects the maximum and minimum values of the relative humidity, and when the difference between consecutive maximum relative humidity values and minimum relative humidity values is equal to or less than a predetermined value, the controller determines that the device is dry.

[0151] A valve is connected to the low-pressure chamber and the controller, and due at least in part to the controller controlling the valve to increase the pressure, the pressure in the low-pressure chamber increases during successive decreases in pressure.

[0152] The controller controls the valve to increase the pressure in the low-pressure chamber, and at approximately the same time, the controller controls the exhaust pump to stop reducing the pressure in the low-pressure chamber.

[0153] The controller controls the valve to equalize the pressure between the inside and the outside of the low-pressure chamber.

[0154] A temperature sensor is connected to a heater and a controller, and the controller controls the heater to maintain a predetermined temperature based at least in part on a signal received from the pressure sensor.

[0155] A pressure sensor is connected to a low-pressure chamber and a controller, and the controller controls an exhaust pump to at least temporarily stop reducing the pressure in the low-pressure chamber, at least partially based on a signal received from the pressure sensor.

[0156] The heater includes a platen that the electronic device directly contacts while removing moisture from the electronic device.

[0157] A step of sterilizing an electronic device.

[0158] A UV lamp for sterilizing an electronic device.

[0159] The illustrated examples, representative embodiments, and specific forms of the present invention have been described and set forth in detail in the drawings and the foregoing description, but these are for illustrative purposes and should be considered neither restrictive nor limiting. The description of a particular feature in one embodiment does not mean that the particular feature is necessarily limited to that embodiment. The features of one embodiment may be utilized in combination with the features of other embodiments, whether or not explicitly described as such, as will be understood by those skilled in the art. Exemplary embodiments are shown and described, and it is desired that all changes and modifications falling within the spirit of the present invention be protected.

Claims

1. placing a portable electronic device that has become at least partially inoperable due to moisture ingress into a low pressure chamber; heating the electronic device; reducing the pressure in the low pressure chamber; removing moisture from an interior of the portable electronic device to an exterior of the portable electronic device; increasing the pressure in the low pressure chamber after the step of reducing the pressure; Equalizing the pressure in the low pressure chamber to a pressure outside the low pressure chamber; removing the portable electronic device from the low pressure chamber; The method includes:

2. 10. The method of claim 1, wherein the placing step includes placing the portable electronic device on a platen, and the heating step includes heating the platen to a temperature of at least about 110 degrees Fahrenheit and at most about 120 degrees Fahrenheit.

3. The method of claim 1 , wherein the step of reducing the pressure comprises reducing the pressure to at least about 28 inches of Hg, which is less than the pressure outside the chamber.

4. 10. The method of claim 1, wherein the step of reducing the pressure comprises reducing the pressure to at least about 30 inches of Hg below the pressure outside the low pressure chamber.

5. 10. The method of claim 1, wherein the placing step includes placing the portable electronic device on a platen, the heating step includes heating the platen to at least about 110° F. and at most about 120° F., and the reducing pressure step includes reducing the pressure to at least about 28 inches of Hg, which is less than the pressure outside the chamber.

6. The method of claim 1 , wherein the steps of decreasing pressure and increasing pressure are repeated sequentially before the step of removing the portable electronic device.

7. 7. The method of claim 6, further comprising automatically controlling the repetition of the steps of decreasing pressure and increasing pressure according to at least one predetermined criterion.

8. detecting when a sufficient amount of moisture has been removed from the electronic device; ceasing the repetition of the steps of decreasing pressure and increasing pressure after the step of detecting; The method of claim 6, comprising:

9. measuring the relative humidity in a low pressure chamber; increasing the pressure after the relative humidity has decreased and the rate of decrease in relative humidity has slowed; The method of any of claims 1 to 8, comprising:

10. measuring the relative humidity in a low pressure chamber; the steps of reducing pressure and increasing pressure are repeated sequentially prior to the step of removing the portable electronic device; 9. The method of claim 1, wherein the step of reducing the pressure begins when the relative humidity increases and the rate of increase of the relative humidity slows.

11. measuring the relative humidity in a low pressure chamber; the steps of reducing pressure and increasing pressure are repeated sequentially prior to the step of removing the portable electronic device; 9. A method according to claim 1, wherein the repeated steps of decreasing and increasing the pressure are stopped when a difference between successive relative humidity maxima and minima is within a predetermined tolerance.

12. measuring the relative humidity in a low pressure chamber; the steps of reducing pressure and increasing pressure are repeated sequentially prior to the step of removing the portable electronic device; 9. The method of claim 1, wherein the repeated steps of decreasing pressure and increasing pressure are stopped when the relative humidity within the chamber reaches a predetermined value.

13. reducing the pressure in the low pressure chamber using a pump; removing moisture from the gas being pumped from the chamber by the pump before the gas reaches the pump; The method of any of claims 1 to 8, comprising:

14. 14. The method of claim 13, wherein removing the moisture comprises removing the moisture using a desiccator containing a desiccant.

15. The method of claim 14 including removing moisture from the desiccant.

16. 16. The method of claim 15, further comprising isolating the desiccant from the pump prior to removing moisture from the desiccant.

17. 16. The method of claim 15, including the step of reversing the flow of air through the desiccator during the step of removing moisture from the desiccant.

18. 16. The method of claim 15, further comprising the step of heating the desiccant during the step of removing moisture from the desiccant.

19. 16. The method of claim 15, wherein the heating step comprises heating the desiccant to at least 200°F and at most 300°F.

20. 16. The method of claim 15, wherein the heating step includes heating the desiccant to about 250°F.

21. 9. The method of any one of claims 1 to 8, further comprising the step of sterilizing the electronic device.

22. 22. The method of claim 21, wherein the sterilizing step comprises exposing the electronic device to UV light.

23. 8. A method according to any preceding claim, comprising detecting when a sufficient amount of moisture has been removed from the electronic device.

24. a low pressure chamber defining an interior, the interior being sized and configured to accommodate placement of an electronic device within the low pressure chamber and removal of the electronic device from the interior; an exhaust pump connected to the chamber; a heater connected to the chamber; a controller connected to the exhaust pump and the heater, the controller controlling the exhaust pump to reduce pressure in the low pressure chamber and controlling operation of the heater to apply heat to the electronic device, thereby controlling removal of moisture from the electronic device; An apparatus comprising:

25. 25. The apparatus of claim 24, wherein the controller controls the exhaust pump to reduce pressure in the low pressure chamber multiple times, the pressure in the low pressure chamber increasing between successive reductions in pressure.

26. 26. The apparatus of claim 24 or claim 25, further comprising a humidity sensor connected to the low pressure chamber and to a controller, the controller controlling the exhaust pump to at least temporarily stop reducing pressure in the low pressure chamber based at least in part on a signal received from the humidity sensor.

27. 27. The apparatus of claim 26, wherein when the rate of change of the relative humidity decreases or is about zero, the controller controls the exhaust pump to at least temporarily stop reducing the pressure in the low pressure chamber.

28. 27. The apparatus of claim 26, wherein as the exhaust pump reduces the pressure in the low pressure chamber multiple times, the humidity sensor detects local maximum and minimum relative humidity values, and the controller determines that the device is dry when a difference between successive maximum and minimum relative humidity values ​​is equal to or less than a predetermined value.

29. 26. An apparatus as claimed in claim 24 or claim 25, comprising a humidity sensor connected to the low pressure chamber and a controller, the controller controlling the exhaust pump to begin reducing the pressure in the low pressure chamber when the rate of change of relative humidity decreases or is about zero.

30. 30. The apparatus of any of claims 25 to 29, comprising a valve connected to a low pressure chamber and a controller, wherein the pressure in the low pressure chamber increases during successive reductions in pressure due at least in part to the controller controlling the valve to increase the pressure.

31. 31. The apparatus of claim 30, wherein the controller controls the valve to increase pressure in the low pressure chamber and, at about the same time, the controller controls the exhaust pump to stop decreasing pressure in the low pressure chamber.

32. 30. The apparatus of claim 29, wherein the controller controls the valve to equalize pressure between the interior of the low pressure chamber and the exterior of the low pressure chamber.

33. 26. An apparatus as claimed in claim 24 or claim 25, comprising a temperature sensor connected to a heater and a controller, the controller controlling the heater to maintain a predetermined temperature based at least in part on a signal received from the pressure sensor.

34. 26. The apparatus of claim 24 or claim 25, further comprising a pressure sensor connected to the low pressure chamber and a controller, the controller controlling the exhaust pump to at least temporarily stop reducing pressure in the low pressure chamber based at least in part on a signal received from the pressure sensor.

35. 25. The apparatus of claim 24, wherein the heater includes a platen that the electronic device directly contacts while removing moisture from the electronic device.

36. 25. The apparatus of claim 24, comprising a sterilization portion connected to the chamber and designed and configured to kill germs on an electronic device disposed within the chamber.

37. 25. The apparatus of claim 24, wherein the sterilizing portion is an ultraviolet lamp.

38. a means for heating the electronic device; a means for reducing pressure within the electronic device; means for detecting when a sufficient amount of moisture has been removed from the electronic device; An apparatus comprising:

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