Bone conduction speaker

By integrating a resonance assembly with a mass element and a first elastic element into bone conduction speakers, the strong vibration feelings at low-frequency resonance peaks are reduced, thereby enhancing user experience and sound quality.

JP2025083383AActive Publication Date: 2025-05-30SHENZHEN SHOKZ CO LTD
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
JP2025034846
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-05
Publication Date
2025-05-30
Estimated Expiration
2041-01-14

AI Technical Summary

Technical Problem

Bone conduction speakers experience strong vibration feelings at low-frequency resonance peaks, which affect user experience and degrade sound quality.

Method used

Incorporating a resonance assembly with a mass element connected to the vibration assembly via a first elastic element, which reduces the amplitude of the vibration housing and mitigates the strong vibration feeling.

Benefits of technology

The solution effectively reduces the vibration intensity at low-frequency resonance peaks, improving user experience and enhancing sound quality by flattening the frequency response curve.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2025083383000001_ABST
    Figure 2025083383000001_ABST
Patent Text Reader

Abstract

To provide a bone conduction speaker which can clearly reduce the sense of vibrations when a bone conduction speaker is at the peak of a low-frequency resonance and also can improve the sound quality of a bone conduction speaker.SOLUTION: A bone conduction speaker according to an embodiment includes: a vibration assembly having a vibration element and a vibration housing, the vibration element converting an electric signal into a mechanical vibration and the vibration housing contacting the face of a user and transmitting mechanical vibrations to the user by a bone conduction system to generate sound; and a resonance assembly having a first elastic element and a mass element connected to the vibration assembly by the first elastic element. The vibration assembly vibrates the resonance assembly, and the vibrations of the resonance assembly reduce the amplitude of the vibration housing.SELECTED DRAWING: Figure 4
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of bone conduction speakers, and particularly to a bone conduction speaker capable of improving the vibration feeling at low frequencies.

Background Art

[0002] A bone conduction speaker can convert an audio signal into a mechanical vibration signal so as to let the wearer hear the voice, and can transmit the mechanical vibration signal to the auditory nerve of the human body through human tissues and bones. After expanding the frequency response range of the bone conduction speaker, especially the low-frequency response range, since the amplitude of the low-frequency resonance peak of the bone conduction speaker is large, the vibration feeling generated by the bone conduction speaker is strong, which affects the user experience, and the large peak value of the resonance peak also degrades the sound quality.

Summary of the Invention

Problems to be Solved by the Invention

[0003] This application provides a bone conduction speaker that can not only significantly reduce the vibration feeling at the low-frequency resonance peak of the bone conduction speaker, but also improve the sound quality of the bone conduction speaker.

Means for Solving the Problems

[0004] An object of the present invention is to provide a bone conduction speaker capable of reducing the amplitude at the low-frequency resonance peak of the bone conduction speaker, reducing the vibration feeling of the bone conduction speaker, and improving the sound quality.

[0005] In order to achieve the above object of the invention, the technical means according to the present invention are as follows.

[0006] The bone conduction speaker includes a vibration assembly including a vibration element that converts an electrical signal into mechanical vibration, and a vibration housing that contacts the user's face and transmits the mechanical vibration to the user by bone conduction to generate sound, a first elastic element, and a resonance assembly including a mass element connected to the vibration assembly by the first elastic element. The vibration assembly vibrates the resonance assembly, and the vibration of the resonance assembly reduces the amplitude of the vibration housing.

[0007] In some embodiments, the ratio of the mass of the mass element to the mass of the vibration housing is in the range of 0.04 to 1.25.

[0008] In some embodiments, the ratio of the mass of the mass element to the mass of the vibration housing is in the range of 0.1 to 0.6.

[0009] In some embodiments, the vibration assembly generates a first low-frequency resonance peak at a first frequency, the resonance assembly generates a second low-frequency resonance peak at a second frequency, and the ratio of the second frequency to the first frequency is in the range of 0.5 to 2.

[0010] In some embodiments, the vibration assembly generates a first low-frequency resonance peak at a first frequency, the resonance assembly generates a second low-frequency resonance peak at a second frequency, and the ratio of the second frequency to the first frequency is in the range of 0.9 to 1.1.

[0011] In some embodiments, both the first frequency and the second frequency are less than 500 Hz.

[0012] In some embodiments, within a frequency range lower than the first frequency, the amplitude of the resonance assembly is greater than the amplitude of the vibration housing.

[0013] In some embodiments, the vibration assembly further includes a second elastic element, the vibration housing houses the vibration element and the second elastic element, and the vibration element transmits the mechanical vibration to the vibration housing by means of the second elastic element.

[0014] In some embodiments, the second elastic element is a vibration transmission sheet fixedly connected to the vibration housing.

[0015] In some embodiments, the first elastic element is fixedly connected to the vibration housing, and the vibration housing transmits the mechanical vibration to the mass element by means of the first elastic element.

[0016] In some embodiments, the resonance assembly is housed within the vibration housing and is connected to the inner wall of the vibration housing by means of the first elastic element.

[0017] In some embodiments, the first elastic element includes a vibrating membrane, and the mass element includes a composite structure adhered to the surface of the vibrating membrane.

[0018] In some embodiments, the composite structure includes cone paper, an aluminum sheet, or a copper sheet.

[0019] In some embodiments, at least one sound-emitting hole is formed in the vibration housing, and the sound generated by the vibration of the resonance assembly is transmitted to the outside through the at least one sound-emitting hole.

[0020] In some embodiments, the at least one sound-emitting hole is formed on the side of the vibration housing facing away from the user's face.

[0021] In some embodiments, the bone conduction speaker further includes a fixing assembly that maintains stable contact between the bone conduction speaker and the user and is fixedly connected to the vibration housing.

[0022] In some embodiments, the resonance assembly is located outside the vibration housing and is connected to the outer wall of the vibration housing by the first elastic element.

[0023] In some embodiments, the mass element is a groove member, at least a part of the vibration housing is accommodated in the groove member, the first elastic element connects the outer wall of the vibration housing and the inner wall of the groove member, and a sound radiation passage is formed between the inner wall of the groove member and the outer wall of the vibration housing.

[0024] In some embodiments, the bone conduction speaker further includes a fixing assembly that maintains stable contact between the bone conduction speaker and the user's face and is fixedly connected to the resonance assembly.

[0025] The present application will be further described by way of exemplary embodiments, and these exemplary embodiments will be described in detail with reference to the drawings. These embodiments are not limiting, and in these embodiments, the same numbers indicate similar structures.

Brief Description of the Drawings

[0026]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Mode for Carrying Out the Invention

[0027] To more clearly explain the technical means of the embodiments of the present application, the drawings necessary for the description of the embodiments will be briefly described below. Obviously, the drawings described below are only a part of the examples or embodiments of the present application, and those skilled in the art can apply the present application to other similar scenarios based on these drawings without creative effort. It should be understood that these exemplary embodiments are only for enabling those skilled in the art to better understand and implement the present invention, and do not limit the scope of the present invention in any way. Unless it is clear from the language environment or otherwise stated, the same reference numerals in the figures indicate the same structure or operation.

[0028] As used in this application and the claims, unless the context clearly dictates otherwise, terms such as "one", "a", "an", and / or "the" are not specifically intended to refer to the singular, but may include the plural. Generally, the terms "comprising" and "including" merely present that they include the specifically identified steps and elements, and these steps and elements are not an exclusive listing, and the method or device may also include other steps or elements. The term "based on" means "at least partially based on". The term "one embodiment" indicates "at least one embodiment". The term "another embodiment" indicates "at least one another embodiment". Related definitions of other terms are given in the following description. Hereinafter, without loss of generality, when explaining the related technology of bone conduction in the present invention, it will be described using a "bone conduction speaker" or a "bone conduction earphone". This description is only one form of the application of bone conduction, and those skilled in the art may replace the "speaker" or "earphone" with other similar words such as "player", "hearing aid", etc. In fact, various embodiments in the present invention can be easily applied to other hearing devices other than speakers. For example, those skilled in the art can, on the basis of understanding the basic principle of the bone conduction speaker, make various modifications and changes to the form and details of the specific methods and steps for implementing the bone conduction speaker without departing from this principle. In particular, by adding an environmental sound pickup and processing function to the bone conduction speaker, the function of a hearing aid can be realized by the speaker. For example, an acoustic transducer such as a microphone can pick up the sound of the user / wearer's surrounding environment and transmit the processed sound (or generated electrical signal) to the bone conduction speaker by a specific algorithm. That is, by changing the bone conduction speaker to add an environmental sound pickup function and transmitting the sound to the user / wearer by the bone conduction speaker after performing specific signal processing, the function of a bone conduction hearing aid can be realized.As an example, the algorithms mentioned here may include one or a combination of more than one of noise removal, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environmental recognition, active noise cancellation, directivity processing, tinnitus prevention processing, multi-channel wide dynamic range compression, active howling suppression, volume control, etc.

[0029] FIG. 1 is a block diagram of a bone conduction speaker according to some embodiments of the present application. As shown in FIG. 1, the bone conduction speaker 100 may include a vibration assembly 110, a resonance assembly 120, and a fixing assembly 130.

[0030] The vibration assembly 110 can generate mechanical vibrations. The generation of mechanical vibrations involves energy conversion, and the bone conduction speaker 100 can realize the conversion of a signal including voice information into mechanical vibrations by the vibration assembly 110. In the process of conversion, the coexistence and conversion of multiple different types of energy may be involved. For example, an electrical signal can be directly converted into mechanical vibrations by the energy conversion device of the vibration assembly 110 to generate sound. Further, for example, voice information may be included in an optical signal, and a specific energy conversion device can realize the process of converting the optical signal into a vibration signal. Other types of energy that can coexist and be converted during the operation of the energy conversion device include thermal energy, magnetic field energy, etc. The energy conversion method of the energy conversion device may include a moving coil type, an electrostatic type, a piezoelectric type, a balanced armature type, a pneumatic type, an electromagnetic type, etc. In some embodiments, the vibration assembly 110 may include a vibration housing and a vibration element.

[0031] At least a part of the vibration housing may be in contact with the face of the human body so as to let the human body hear the voice, and transmit mechanical vibration to the bones of the face of the human body. The vibration housing may be configured as a sealed accommodation space or a non-sealed accommodation space, and the vibration element may be installed inside the vibration housing. In some embodiments, the vibration housing may not be configured as an accommodation space and may be directly connected to the vibration element. In some embodiments, the vibration housing may be directly or indirectly connected to the vibration element so as to let the human body hear the voice, and transmit the mechanical vibration of the vibration element to the auditory nerve through the bone.

[0032] In some embodiments, the vibration element (i.e., the energy conversion device) may include a magnetic circuit assembly. The magnetic circuit assembly can provide a magnetic field. The magnetic field can convert a signal containing voice information into a mechanical vibration signal. In some embodiments, the voice information may include a video file, an audio file having a specific data format, or data or a file that can be converted into voice in a specific manner. The signal containing voice information may be from the storage assembly of the bone conduction speaker 100 itself, or from an information generation, storage, or transmission system other than the bone conduction speaker 100. The signal containing voice information may include one or a combination of multiple types such as an electrical signal, an optical signal, a magnetic signal, a mechanical signal, etc. The signal containing voice information may be from one signal source or multiple signal sources. The multiple signal sources may or may not be related. In some embodiments, the bone conduction speaker 100 can acquire the signal containing voice information in multiple different ways, and the acquisition of the signal may be wired, wireless, real-time type, or delayed type. For example, the bone conduction speaker 100 may receive an electrical signal containing voice information in a wired or wireless manner, or directly acquire data from a storage medium to generate a voice signal. Also, for example, the bone conduction speaker 100 may include an assembly having a voice collection function, pick up the voice in the environment, convert the mechanical vibration of the voice into an electrical signal, and process it by an amplifier to obtain an electrical signal that meets specific requirements. In some embodiments, the wired connection may include a metal cable, an optical cable, or a combination thereof. For example, it may be a combination of one or more types such as a coaxial cable, a communication cable, a flexible cable, a spiral cable, a non-metallic sheath cable, a metal sheath cable, a multi-core cable, a twisted pair cable, a ribbon cable, a shielded cable, a telecommunication cable, a pair cable, a two-core parallel wiring, a twisted pair, etc. The above examples are only for ease of explanation, and the medium of the wired connection may be other types of media, such as other electrical signals or optical signals, etc., as transmission carriers.

[0033] Wireless connection may include wireless communication, free space optical communication, voice communication, electromagnetic induction, etc. Wireless communication may include IEEE 802.11 standard specifications, IEEE 802.15 standard specifications (such as Bluetooth (registered trademark) technology and cellular technology, etc.), first-generation mobile communication technology, second-generation mobile communication technology (such as FDMA, TDMA, SDMA, CDMA, and SSMA, etc.), general packet radio service technology, third-generation mobile communication technology (such as CDMA2000, WCDMA (registered trademark), TD-SCDMA, and WiMAX, etc.), fourth-generation mobile communication technology (such as TD-LTE and FDD-LTE, etc.), satellite communication (such as GPS technology, etc.), near-field communication (NFC) and other operations in other ISM bands (such as 2.4 GHz, etc.). Free space optical communication may include visible light signals, infrared signals, etc. Voice communication may include sound wave signals, ultrasonic signals, etc. Electromagnetic induction may include near-field communication technology, etc. The above examples are only for ease of explanation, and the medium of wireless connection may be other types, such as Z-wave technology, other paid radio frequency bands for civilian or military use. For example, in some application scenarios of the present technology, the bone conduction speaker 100 may obtain a signal including voice information from other devices by Bluetooth (registered trademark) technology.

[0034] The resonance assembly 120 is connected to the vibration assembly 110. When mechanical vibration occurs in the vibration assembly 110, at least a part of the mechanical vibration can be transmitted to the resonance assembly 120 to vibrate the resonance assembly 120, thereby reducing the amplitude of the vibration assembly 110. In some embodiments, the resonance assembly 120 may include a first elastic element and a mass element connected to the vibration assembly 110 by the first elastic element. The vibration assembly 110 can transmit mechanical vibration to the mass element through the first elastic element to vibrate the mass element.

[0035] The fixing assembly 130 can maintain a stable contact between the bone conduction speaker 100 and the user's face by acting as a fixed support for the vibration assembly 110 and the resonance assembly 120. The fixing assembly 130 may include one or more fixing connection members. The one or more fixing connection members can connect the vibration assembly 110 and / or the resonance assembly 120. In some embodiments, the fixing assembly 130 can achieve binaural wearing. For example, both ends of the fixing assembly 130 may be fixedly connected to two sets of vibration assemblies 110 (or resonance assemblies 120) respectively. When the user wears the bone conduction speaker 100, the fixing assembly 130 can fix the two sets of vibration assemblies 110 (or resonance assemblies 120) near the user's left ear and right ear respectively. In some embodiments, the fixing assembly 130 can achieve monaural wearing. For example, the fixing assembly 130 may be fixedly connected to only one set of vibration assemblies 110 (or resonance assemblies 120). When the user wears the bone conduction speaker 100, the fixing assembly 130 can fix the vibration assembly 110 (or resonance assembly 120) near one side of the user's ear. In some embodiments, the fixing assembly 130 may be one or any combination of glasses (such as sunglasses, augmented reality glasses, virtual reality glasses), helmets, and headbands, which is not limited here.

[0036] The above description of the structure of the bone conduction speaker is merely a specific example and should not be regarded as the only feasible implementation form. Obviously, those skilled in the art can make various modifications and changes to the form and details of the specific methods and steps for implementing the bone conduction speaker 100 without departing from the basic principle of the bone conduction speaker after understanding the basic principle. These modifications and changes are still within the scope described above. For example, the bone conduction speaker 100 may include one or more processors, and the processor can execute one or more audio signal processing algorithms. The audio signal processing algorithm can correct or enhance the audio signal. For example, noise cancellation, acoustic feedback suppression, wide dynamic range compression, automatic gain control, active environment recognition, active noise cancellation, directivity processing, tinnitus prevention processing, multi-channel wide dynamic range compression, active howling suppression, volume control, or other similar processing, or any combination of the above processing can be performed on the audio signal, and these modifications and changes are still within the scope of the claims of the present invention. Also, for example, the bone conduction speaker 100 may include one or more sensors, such as a temperature sensor, a humidity sensor, a speed sensor, a displacement sensor, etc. The sensor can collect user information or environmental information.

[0037] Figure 2 is a schematic longitudinal sectional view of a bone conduction speaker without an added resonance assembly according to some embodiments of the present application. As shown in Figure 2, in some embodiments, the bone conduction speaker 200 may include a vibration assembly 210 and a fixing assembly 230.

[0038] In some embodiments, the vibration assembly 210 may include a vibration element 211, a vibration housing 213, and a second elastic element 215 that elastically connects the vibration element 211 and the vibration housing 213. The vibration element 211 can generate mechanical vibrations by converting an audio signal into a mechanical vibration signal. When mechanical vibrations occur in the vibration element 211, the second elastic element 215 can drive the vibration housing 213 to vibrate. When the mechanical vibrations of the vibration element 211 are transmitted to the vibration housing 213 by the second elastic element 215, the vibration frequency of the vibration housing 213 is the same as that of the vibration element 211.

[0039] The vibration element 211 described in the present application may be an element that converts an audio signal into a mechanical vibration signal, for example, a transducer. In some embodiments, the vibration element 211 may include a magnetic circuit assembly and a coil. The magnetic circuit assembly can form a magnetic field, and the coil can generate mechanical vibrations in the magnetic field. Specifically, a signal current may be passed through the coil. The coil is located in the magnetic field formed by the magnetic circuit assembly, receives an Ampere force, and is driven to vibrate mechanically. At the same time, the magnetic circuit assembly receives a reaction force opposite to that of the coil. Due to the action of the Ampere force, the vibration element 211 can generate mechanical vibrations. Further, the mechanical rotation of the vibration element 211 may be transmitted to the vibration housing 213 such that the vibration housing 213 vibrates along with the vibration element 211.

[0040] In some embodiments, the vibration housing 213 may include a housing panel 2131, a housing side plate 2132, and a housing back plate 2133. The housing panel 2131 may be a surface that contacts the user's face of the vibration housing 213 when the user wears the bone conduction speaker 200. The housing back plate 2133 is located on a surface opposite to the housing panel 2131. In some embodiments, the housing panel 2131 and the housing back plate 2133 are respectively installed at both end faces of the housing side plate 2132. The housing panel 2131, the housing side plate 2132, and the housing back plate 2133 can form a shell-like structure having a certain accommodation space. In some embodiments, the vibration element 211 may be installed inside the shell-like structure.

[0041] In some embodiments, the housing panel 2131, the housing side plate 2132, and the housing back plate 2133 may be made of the same material or different materials. For example, the housing panel 2131 and the housing side plate 2132 may be made of the same material, and the material for manufacturing the housing back plate 2133 may be different from the materials of the former two. In some embodiments, the housing panel 2131, the housing side plate 2132, and the housing back plate 2133 may be made of different materials respectively.

[0042] In some embodiments, the material for manufacturing the housing panel 2131 includes, but is not limited to, any of acrylonitrile butadiene styrene (ABS), polystyrene (PS), high impact polystyrene (HIPS), polypropylene (PP), polyethylene terephthalate (PET), polyester (PES), polycarbonate (PC), polyamides (PA), polyvinyl chloride (PVC), polyurethanes (PU), polyvinylidene chloride, polyethylene (PE), polymethyl methacrylate (PMMA), poly-ether-ether-ketone (PEEK), phenolics (PF), urea-formaldehyde (UF), melamine formaldehyde (MF), and some metals, alloys (such as aluminum alloys, chrome molybdenum steel, scandium alloys, magnesium alloys, titanium alloys, magnesium-lithium alloys, nickel alloys, etc.), glass fibers or carbon fibers, or any combination of the above-mentioned materials. In some embodiments, the material for manufacturing the housing panel 2131 is any combination of glass fibers and carbon fibers with materials such as polycarbonate (PC) and polyamides (PA). In some embodiments, the material for manufacturing the housing panel 2131 may be obtained by mixing carbon fibers and polycarbonate (PC) in a certain ratio.In some embodiments, the material for manufacturing the housing panel 2131 may be obtained by mixing carbon fiber, glass fiber, and polycarbonate (PC) in a certain ratio. In some embodiments, the material for manufacturing the housing panel 2131 may be obtained by mixing glass fiber and polycarbonate (PC) in a certain ratio, or may be obtained by mixing glass fiber and polyamide (PA) in a certain ratio.

[0043] In some embodiments, the housing panel 2131 needs to have a certain thickness to ensure its rigidity. In some embodiments, the thickness of the housing panel 2131 is 0.3 mm or more. Preferably, the thickness of the housing panel 2131 is 0.5 mm or more. More preferably, the thickness of the housing panel 2131 is 0.8 mm or more. Even more preferably, the thickness of the housing panel 2131 is 1 mm or more. As the thickness increases, the weight of the housing 700 also increases, so the self-weight of the bone conduction speaker 200 increases, which affects the sensitivity of the bone conduction speaker 200. Therefore, the thickness of the housing panel 2131 should not be too large. In some embodiments, the thickness of the housing panel 2131 is 2.0 mm or less. Preferably, the thickness of the housing panel 2131 is 1.5 mm or less.

[0044] In some embodiments, the housing panel 2131 may be configured in different shapes. For example, the housing panel 2131 may be configured in a square, rectangle, substantially rectangular (e.g., a structure in which the four corners of a rectangle are replaced by arcs), ellipse, circle, or any other arbitrary shape.

[0045] In some embodiments, the housing panel 2131 may be made of the same type of material. In some embodiments, the housing panel 2131 may be formed by laminating two or more materials. In some embodiments, the housing panel 2131 may be formed by combining one layer of a material with a high Young's modulus and one layer of a material with a low Young's modulus. In this way, while ensuring the rigidity requirements of the housing panel 2131, it is possible to improve the comfort when contacting the human face and improve the fit when the vibration panel 2131 contacts the human face. In some embodiments, the material with a high Young's modulus may be acrylonitrile-butadiene-styrene copolymer (ABS), polystyrene (PS), high impact polystyrene (HIPS), polypropylene (PP), polyethylene terephthalate (PET), polyester (PES), polycarbonate (PC), polyamides (PA), polyvinyl chloride (PVC), polyurethanes (PU), polyvinylidene chloride, polyethylene (PE), polymethyl methacrylate (PMMA), poly-ether-ether-ketone (PEEK), phenolics (PF), urea-formaldehyde (UF), melamine formaldehyde (MF) and some metals, alloys (such as aluminum alloy, chrome molybdenum steel, scandium alloy, magnesium alloy, titanium alloy, magnesium-lithium alloy, nickel alloy, etc.), glass fiber or carbon fiber, or any combination of the above-mentioned materials.

[0046] In some embodiments, the portion of the housing panel 2131 that contacts the human skin may be all or part of the area of the housing panel 2131. For example, when the housing panel 2131 has an arc-shaped structure, only a part of the area of the arc-shaped structure contacts the human skin. In some embodiments, the housing panel 2131 may be in surface contact with the human skin. In some embodiments, the surface of the housing panel 2131 that contacts the human body may be a flat surface. In some embodiments, there may be some protrusions or recesses on the outer surface of the housing panel 2131. In some embodiments, the outer surface of the housing panel 2131 may be a curved surface with any contour.

[0047] Note that the vibration element 211 includes a magnetic circuit assembly, and the vibration element 211 is housed within the vibration housing 213. Therefore, the larger the volume of the vibration housing 213 (i.e., the volume of the accommodation space), the larger the magnetic circuit assembly that can be accommodated inside the vibration housing 213, and thus the bone conduction speaker 200 has higher sensitivity. The sensitivity of the bone conduction speaker 200 can be reflected by the magnitude of the volume generated in the bone conduction speaker 200 after inputting a certain audio signal. When the same audio signal is input, the larger the volume generated in the bone conduction speaker 200, the higher the sensitivity of the bone conduction speaker 200. In some embodiments, the volume of the bone conduction speaker 200 increases as the volume of the accommodation space of the vibration housing 213 increases. Therefore, in the present application, there are also certain requirements for the volume of the vibration housing 213. In some embodiments, the volume of the vibration housing 213 may be 2000 mm3 to 6000 mm3 so that the bone conduction speaker 200 has high sensitivity (volume). Preferably, the volume of the vibration housing 213 may be 2000 mm3 to 5000 mm3. Preferably, the volume of the vibration housing 213 may be 2800 mm3 to 5000 mm3. Preferably, the volume of the vibration housing 213 may be 3500 mm3 to 5000 mm3. Preferably, the volume of the vibration housing 213 may be 1500 mm3 to 3500 mm3. Preferably, the volume of the vibration housing 213 may be 1500 mm3 to 2500 mm3.

[0048] The fixing assembly 230 is fixedly connected to the vibration housing 213 of the vibration assembly 210. The fixing assembly 230 maintains stable contact between the bone conduction speaker 200 and human tissue or bone, avoids the shaking of the bone conduction speaker 200, and ensures that the housing panel 2131 can stably transmit sound. In some embodiments, the fixing assembly 230 may be an arcuate elastic member, and a repulsive force can be generated at the middle part of the arc so as to be able to stably contact the human skull. Taking the earhook as an example of the fixing assembly, based on FIG. 2, since the tip p point of the earhook is in good contact with the human head, the tip p point can be regarded as a fixing point. The earhook is fixedly connected to the housing side plate 2132, and the earhook is fixed to the housing side plate 2132 or the housing back plate 2133 by an adhesive fixing method or a fixing connection method including locking, welding or screwing. The portion of the earhook connected to the vibration housing 213 may be made of the same material, a different material or a partially same material as the housing side plate 2132 or the housing back plate 2133. In some embodiments, the earhook may further include a plastic, silicone rubber and / or metal material so that the earhook has a small rigidity (i.e., a small spring constant). For example, the earhook may include an arcuate titanium wire. Preferably, the earhook may be integrally formed with the housing side plate 2132 or the housing back plate 2133. For more examples of the vibration assembly 210 and the vibration housing 213, reference can be made to the PCT applications with application numbers PCT / CN2019 / 070545 and PCT / CN2019 / 070548 filed on January 5, 2019, and the entire contents of which are incorporated herein by reference.

[0049] As described above, the vibration assembly 210 further includes a second elastic element 215. The second elastic element 215 can elastically connect the vibration element 211 and the vibration housing 213 so that the mechanical vibration of the vibration element 211 can be transmitted to the vibration housing 213 by the second elastic element 215. When mechanical vibration occurs in the vibration housing 213, it contacts the face of the wearer (or user) and transmits the mechanical vibration to the auditory nerve through the bone, thereby making a sound audible to the human body.

[0050] In some embodiments, the vibration element 211 and the second elastic element 215 may be housed inside the vibration housing 213, and the second elastic element 215 can connect the vibration element 211 and the inner wall of the vibration housing 213. In some embodiments, the second elastic element 215 may include a first portion and a second portion. The first portion of the second elastic element 215 may be connected to the vibration element 211 (for example, the magnetic circuit assembly of the vibration element 211), and the second portion of the second elastic element 215 may be connected to the inner wall of the vibration housing 213.

[0051] In some embodiments, the second elastic element 215 may be a vibration transmission sheet. The first portion of the vibration transmission sheet may be connected to the vibration element 211, and the second portion of the vibration transmission sheet may be connected to the vibration housing 213. Specifically, the first portion of the vibration transmission sheet may be connected to the magnetic circuit assembly of the vibration element 211, and the second portion of the vibration transmission sheet may be connected to the inner wall of the vibration housing 213. Preferably, the vibration transmission sheet has an annular structure, and the first portion of the vibration transmission sheet is closer to the central region of the vibration transmission sheet than the second portion. For example, the first portion of the vibration transmission sheet may be located in the central region of the vibration transmission sheet, and the second portion may be located on the circumferential side of the vibration transmission sheet.

[0052] In some embodiments, the vibration transmission sheet may be an elastic member so as to be able to transmit the mechanical vibration of the vibration element 211 to the vibration housing 213. The elasticity of the vibration transmission sheet may be determined by many factors such as the material, thickness, and structure of the vibration transmission sheet.

[0053] In some embodiments, the material for manufacturing the vibration transmission sheet includes, but is not limited to, plastics (such as, but not limited to, polymer polyethylene, blown nylon, engineering plastics, etc.), steel materials (such as, but not limited to, stainless steel, carbon steel, etc.), lightweight alloys (such as, but not limited to, aluminum alloy, beryllium copper, magnesium alloy, titanium alloy, etc.), and may be other single materials or composite materials that can achieve similar performance. The composite material may include, but is not limited to, reinforcing materials such as glass fiber, carbon fiber, boron fiber, graphite fiber, graphene fiber, silicon carbide fiber or aramid fiber, or composites of various glass fiber reinforced plastics composed of a glass fiber reinforced unsaturated polyester, epoxy resin or phenolic resin matrix and / or other organic materials and / or inorganic materials.

[0054] In some embodiments, the vibration transmission sheet may have a certain thickness. In some embodiments, the thickness of the vibration transmission sheet is 0.005 mm or more. Preferably, in some embodiments, the thickness of the vibration transmission sheet is 0.005 mm to 3 mm. More preferably, the thickness of the vibration transmission sheet is 0.01 mm to 2 mm. More preferably, the thickness of the vibration transmission sheet is 0.01 mm to 1 mm. Even more preferably, the thickness of the vibration transmission sheet is 0.02 mm to 0.5 mm.

[0055] In some embodiments, the elasticity of the vibration transmission sheet may be provided by the structure of the vibration transmission sheet. For example, the vibration transmission sheet may be an elastic structure, and even if the rigidity of the material for manufacturing the vibration transmission sheet is high, the elasticity can be provided by the structure of the vibration transmission sheet. In some embodiments, the structure of the vibration transmission sheet may include, but is not limited to, a structure similar to a spring, an annular structure, or a substantially annular structure. In some embodiments, the structure of the vibration transmission sheet may be configured in a sheet shape. In some embodiments, the structure of the vibration transmission sheet may be configured in a stripe shape. Based on the materials, thicknesses, and structures in the above description, different vibration transmission sheets can be formed by combining the specific structures of the vibration transmission sheet. For example, the sheet-shaped vibration transmission sheet may have different thickness distributions, and the thickness of the first part of the vibration transmission sheet may be greater than the thickness of the second part of the vibration transmission sheet. In some embodiments, the number of vibration transmission sheets may be one or more. For example, the number of vibration transmission sheets may be two, and the second parts of the two vibration transmission sheets are respectively connected to the inner walls of the two housing side plates 2132 with opposite positions, and the first parts of the two vibration transmission sheets are both connected to the vibration element 211.

[0056] In some embodiments, the vibration transmission sheet may be directly connected to the vibration housing 213 and the vibration element 211. In some embodiments, the vibration transmission sheet may be connected to the vibration element 211 and the vibration housing 213 by an adhesive. In some embodiments, the vibration transmission sheet may be further fixed to the vibration element 211 and the vibration housing 213 by welding, locking, riveting, screwing (for example, connection by members such as screws, nuts, screws, bolts, etc.), clamp connection, pin connection, taper key connection, or integral molding. For more examples of the vibration transmission sheet, reference can be made to the PCT applications with application numbers PCT / CN2019 / 070545 and PCT / CN2019 / 070548 filed on January 5, 2019, and the entire contents of which are incorporated herein by reference.

[0057] In some embodiments, the vibration assembly 210 may further include a first connection member. The vibration transmission sheet may be connected to the vibration element 211 by the first connection member. In some embodiments, the first connection member may be fixedly connected to the vibration element 211 as shown in FIG. 2. For example, the first connection member may be fixed to the surface of the vibration element 211. In some embodiments, the first portion of the vibration element 211 may be fixedly connected to the first connection member. In some embodiments, the vibration transmission sheet may be further fixed to the first connection member by welding, locking, riveting, screwing (e.g., connected by members such as screws, nuts, screws, bolts, etc.), clamp connection, pin connection, taper key connection, integral molding. In some embodiments, the vibration assembly 210 may further include a second connection member (not shown), and the second connection member may be fixed to the inner wall of the vibration housing 213. For example, the second connection member may be fixed to the inner wall of the housing side plate 2132. The vibration transmission sheet may be connected to the vibration housing 213 by the second connection member. In some embodiments, the second portion of the vibration element 211 may be fixedly connected to the second connection member. The connection method between the second connection member and the vibration transmission sheet may be the same as or similar to the connection method between the first connection member and the vibration transmission sheet in the foregoing embodiments, and the description thereof is omitted herein.

[0058] FIG. 3 shows a part of the frequency response curve of a bone conduction speaker without an added resonance assembly according to some embodiments of the present application. The horizontal axis represents the frequency, and the vertical axis represents the vibration intensity (also called amplitude) of the bone conduction speaker 200. The vibration intensity referred to here may be understood as the vibration acceleration of the bone conduction speaker 200. The larger the numerical value on the vertical axis, the larger the amplitude of the bone conduction speaker 200, indicating a stronger vibration feeling of the bone conduction speaker 200. For ease of explanation, in some embodiments, the audio frequency range lower than 500 Hz may be referred to as the low frequency region, the audio frequency range of 500 Hz to 4000 Hz may be referred to as the intermediate frequency region, and the audio frequency range higher than 4000 Hz may be referred to as the high frequency region. In some embodiments, the audio in the low frequency region gives the user an obvious vibration feeling. If a sharp peak appears in the low frequency region (that is, the vibration acceleration at a certain frequency is much higher than the vibration acceleration at other frequencies in the vicinity), the audio heard by the user is harsh and shrill, while the strong vibration feeling also gives an uncomfortable feeling. Therefore, it is desirable that no sharp peak or dip appears within the range of the low frequency region, and the flatter the frequency response curve, the higher the acoustic effect of the bone conduction speaker 200.

[0059] As shown in FIG. 3, the bone conduction speaker 200 generates a low frequency resonance peak in the low frequency region (near 100 Hz). The low frequency resonance peak may be generated by the combined action of the vibration assembly 210 and the fixed assembly 230. Since the vibration acceleration of the low frequency resonance peak is large, the vibration feeling of the vibration panel 2131 is strong, and when the user wears the bone conduction speaker 200, there may be a feeling of pain in the face, which affects the comfort and experience of the user during use.

[0060] FIG. 4 is a schematic longitudinal sectional view of a bone conduction speaker with a resonance assembly added according to some embodiments of the present application. As shown in FIG. 4, in some embodiments, the bone conduction speaker 400 includes a vibration assembly 410 and a resonance assembly 420. The resonance assembly 420 is elastically connected to the vibration assembly 410 and can transmit mechanical vibrations to the resonance assembly 420 when mechanical vibrations occur in the vibration assembly 410. Since the resonance assembly 420 can absorb the mechanical energy of the vibration assembly 410 when it is forced to vibrate, the purpose of reducing the amplitude of the vibration assembly 410 is achieved.

[0061] In some embodiments, the vibration assembly 410 may include a vibration element 411, a vibration housing 413, and a second elastic element 415. The vibration housing 413 is elastically connected to the vibration element 411 by the second elastic element 415. When mechanical vibrations occur in the vibration element 411, the vibration housing 413 can be driven to vibrate mechanically. In some embodiments, the vibration element 411, the vibration housing 413, and the second elastic element 415 are the same as or similar to the vibration element 211, the vibration housing 213, and the second elastic element 215 of the bone conduction speaker 200, respectively, and the details of their structures are omitted here.

[0062] In some embodiments, the resonance assembly 420 may include a mass element 421 and a first elastic element 423, and the first elastic element 423 is fixedly connected to the mass element 421. The mass element 421 may be connected to the vibration assembly 410 by the first elastic element 423. The vibration housing 413 can transmit mechanical vibrations to the mass element 421 by the first elastic element 423 and drive the mass element 421 to vibrate mechanically. When mechanical vibrations occur in the mass element 421, the vibration acceleration of the vibration housing 413, that is, the vibration intensity, can be reduced, so that the vibration feeling of the vibration housing 413 is reduced and the user experience is improved. In some embodiments, the first elastic element 423 may be connected to any position other than the housing panel that directly contacts the user of the vibration housing 413. For example, the first elastic element 423 may be connected to the housing side plate 4132 or the housing back plate 4133. In such a situation, since the resonance assembly 420 does not directly contact the human skin, the vibration of the resonance assembly 420 does not give the user an uncomfortable vibration feeling. In the example shown in FIG. 4, the first elastic element 423 may be connected to the outside of the side opposite to the housing panel 4131 of the vibration housing 413.

[0063] FIG. 5 is a partial frequency response graph of a bone conduction speaker with a resonance assembly added according to some embodiments of the present application. FIG. 5 further shows the frequency response curve of the resonance assembly. As can be seen from FIG. 5, due to the influence of the resonance assembly 420, the frequency response curve in the low frequency region of the bone conduction speaker 400 becomes flatter, thereby avoiding a strong vibration feeling caused by a sharp resonance peak and improving the user experience.

[0064] For ease of understanding, when the bone conduction speaker does not include a resonance assembly, the mechanical model of the bone conduction speaker can be equivalent to the model shown in FIG. 10. Specifically, the vibration panel and the vibration element can be simplified to a mass block m1 and a mass block m2 respectively, the earhook can be simplified to an elastic connection member k1, the second elastic element can be simplified to an elastic connection member k2, and the damping of the elastic connection member k1 and the elastic connection member k2 are set as R1 and R2 respectively. The vibration panel and the vibration element vibrate under the action of forces F and -F respectively. The composite vibration system composed of the vibration panel, the vibration element, the vibration transmission sheet, and the earhook is fixed at the p point at the tip of the earhook.

[0065] Similarly, for ease of understanding, when the bone conduction speaker includes a resonance assembly, the mechanical model of the bone conduction speaker can be equivalent to the model shown in FIG. 11.

[0066] Specifically, m1 and m2 represent the masses of the vibration housing and the vibration element respectively, m3 represents the mass of the mass element of the resonance assembly, k1 and R1 represent the elasticity and damping of the fixed assembly respectively, k2 and R2 represent the elasticity and damping of the second elastic element respectively, and k3 and R3 represent the elasticity and damping of the first elastic element. The entire composite vibration system is fixed at the p point at the tip of the earhook, and the vibration surface housing and the vibration element vibrate under the action of forces F and -F respectively. After the resonance assembly is added, it is equivalent to increasing the rigidity and damping of the vibration housing. At the same time, the Ampere force F does not change, the reaction force -F of the Ampere force does not change either, and since both the rigidity and damping of the vibration housing increase, the amplitude of the vibration housing can be reduced by adding the resonance assembly.

[0067] As can be understood, the vibration assembly 410 and the resonance assembly 420 can each generate one low-frequency resonance peak in the low-frequency region, and by using the resonance assembly 420 to absorb the mechanical vibration of the vibration housing 413, the amplitude of the mechanical vibration at the resonance peak of the vibration housing 413 can be reduced, thus achieving the purpose. Specifically, as shown in FIG. 5, the curve "without resonance assembly" shows the frequency response of the bone conduction speaker 400 when the resonance assembly 420 is not added. It can be seen that the vibration assembly 410 (combined with the fixed assembly 230) can generate a first low-frequency resonance peak 450 at the first frequency f. The curve "with resonance assembly - resonance assembly" shows the frequency response of the resonance assembly 420 itself, and it can be seen that the resonance assembly 420 can generate a second low-frequency resonance peak 460 at the second frequency f0. The curve "with resonance assembly - bone conduction speaker" shows the frequency response of the bone conduction speaker 400 generated by the interaction of the vibration assembly 410 and the resonance assembly 420. The frequency response in the low-frequency region of the bone conduction speaker 400 with the resonance assembly 420 added is flatter compared to the frequency response in the low-frequency region of the bone conduction speaker without the resonance assembly 420 added (for example, the bone conduction speaker 200 shown in FIG. 2), and it can be seen that the amplitude near the first frequency f is significantly lower than the amplitude when the resonance assembly 420 is not added. The first frequency f is the natural frequency of the vibration assembly 410 (combined with the fixed assembly 230), and the second frequency f0 is the natural frequency of the resonance assembly 420. In some embodiments, the natural frequency is related to the material, mass, elastic modulus, and shape of the structure itself.

[0068] When the vibration element 411 transmits mechanical vibration to the vibration housing 413 through the second elastic element 415, the vibration housing 413 is forced to vibrate, and the vibration frequency of the vibration housing 413 is the same as that of the vibration element 411. Similarly, when the vibration housing 413 transmits mechanical vibration to the mass element 421 of the resonance assembly 420 through the first elastic element 423, the mass element 421 is forced to move, and the vibration frequency of the mass element 421 is the same as that of the vibration housing 413. As can be seen from FIG. 5, in the frequency response of the resonance assembly 420 itself, within the range from 100 Hz to the second frequency f0, the vibration acceleration of the resonance assembly 420 increases as the frequency increases. When the frequency is the second frequency f0, the second low-frequency resonance peak 460 appears. When the frequency continues to increase, the vibration acceleration of the resonance assembly 420 decreases as the frequency increases. As is understood, the frequency response of the resonance assembly 420 can reflect the response of the resonance assembly 420 to external vibrations of different frequencies (i.e., the vibration of the vibration housing 413). For example, at and near the second frequency f0, the resonance assembly 420 absorbs the most mechanical energy from the vibration housing 413. In this way, the resonance assembly 420 mainly reduces the vibration near the low-frequency resonance peak of the vibration housing 413, and has little or little effect on the vibration of the vibration housing 413 that is not near the low-frequency resonance peak, so that finally the frequency response curve of the bone conduction speaker 400 is flatter and the sound quality is higher.

[0069] In some embodiments, in order to reduce the vibration intensity at the first low-frequency resonance peak 450 of the vibration housing 413, the frequency f0 corresponding to the second resonance peak 460 of the resonance assembly 420 can be set near the frequency f corresponding to the first resonance peak 450 of the vibration housing 413. As shown in FIG. 5, in some embodiments, the ratio of the second frequency f0 to the first frequency f is within the range of 0.5 to 2. Preferably, the ratio of the second frequency f0 to the first frequency f is within the range of 0.65 to 1.5. More preferably, the ratio of the second frequency f0 to the first frequency f is within the range of 0.75 to 1.25. Even more preferably, the ratio of the second frequency f0 to the first frequency f is within the range of 0.85 to 1.15. Even more preferably, the ratio of the second frequency f0 to the first frequency f is within the range of 0.9 to 1.1.

[0070] To broaden the frequency response range of the bone conduction speaker 400, by changing the structures and materials of the vibration assembly 410 and the resonance assembly 420, their low-frequency resonance peaks can be set at lower frequency positions. In some embodiments, both the first low-frequency resonance peak 450 and the second low-frequency resonance peak 460 may appear within the low-frequency region. Preferably, both the first frequency f and the second frequency f0 may be less than 800 Hz. More preferably, both the first frequency f and the second frequency f0 may be less than 700 Hz. Even more preferably, both the first frequency f and the second frequency f0 may be less than 600 Hz. Even more preferably, both the first frequency f and the second frequency f0 may be less than 500 Hz.

[0071] In some embodiments, by optimizing the structure and materials of the resonance assembly 420 (for example, optimizing the mass of the mass element 421, the elastic coefficient of the first elastic element 423, etc.), after the vibration housing 413 transmits vibrations to the resonance assembly 420, the resonance assembly 420 can vibrate significantly more than the vibration housing 413. For example, within at least a partial frequency range smaller (or larger) than the first frequency f, the amplitude of the resonance assembly 420 may be larger than the amplitude of the vibration housing 413. In this case, since the resonance assembly 420 does not come into direct contact with the user, the significant vibration of the resonance assembly 420 does not give the user an uncomfortable vibration feeling. Furthermore, because the amplitude of the resonance assembly 420 is large, the mass element 421 of the resonance assembly 420 can be designed with a large-area structure. As the resonance assembly 420 vibrates, the vibration of the large-area mass element 421 vibrates the air to generate low-frequency air-conducted sound, thereby improving the low-frequency response of the bone conduction speaker 400.

[0072] Furthermore, as can be seen from FIG. 5, due to the interaction between the vibration housing 413 and the resonance assembly 420, the bone conduction speaker 400 can generate two low-frequency resonance peaks within the low-frequency region range, namely the third low-frequency resonance peak 471 and the fourth low-frequency resonance peak 473. The vibration acceleration of the third low-frequency resonance peak 471 and the fourth low-frequency resonance peak 473 is smaller than that of the first low-frequency resonance peak 450. That is, compared with the bone conduction speaker without the resonance assembly 420 (for example, the bone conduction speaker 200 shown in FIG. 2), the bone conduction speaker 400 with the resonance assembly 420 has a smaller amplitude of the low-frequency resonance peak, which means that the user experience when wearing the bone conduction speaker 400 is further improved. In some embodiments, the bone conduction speaker may generate two low-frequency resonance peaks within a frequency range smaller than 450 Hz. Preferably, the bone conduction speaker 400 may generate two low-frequency resonance peaks within a frequency range smaller than 400 Hz. More preferably, the bone conduction speaker 400 may generate two low-frequency resonance peaks within a frequency range smaller than 350 Hz. Even more preferably, the bone conduction speaker 400 may generate two low-frequency resonance peaks within a frequency range smaller than 300 Hz. Even more preferably, the bone conduction speaker 400 may generate two low-frequency resonance peaks within a frequency range smaller than 200 Hz.

[0073] When the mass m3 of the mass element 421 of the resonance assembly 420 is very small, the influence on the mechanical vibration of the vibration housing 413 of the resonance assembly 420 is small, and the mechanical vibration near the first low-frequency resonance peak 450 of the vibration housing 413 cannot be effectively reduced. For example, when the mass m3 of the mass element 421 of the resonance assembly 420 is too small, even if the resonance assembly 420 is added, the vibration acceleration of the first low-frequency resonance peak 450 of the vibration housing 413 is still large, and the vibration feeling of the bone conduction speaker 400 cannot be effectively reduced. When the mass m3 of the mass element 421 of the resonance assembly 420 is very large, the influence on the amplitude of the mechanical vibration of the bone conduction speaker 400 of the resonance assembly 420 is too large, and the frequency response of the bone conduction speaker 400 is clearly changed. Therefore, it is necessary to control the mass m3 of the mass element 421 of the resonance assembly 420 within a certain range.

[0074] In some embodiments, the ratio of the mass m3 of the mass element 421 of the resonance assembly 420 to the mass m1 of the vibration housing 413 is in the range of 0.04 to 1.25. Preferably, the ratio of the mass m3 of the mass element 421 of the resonance assembly 420 to the mass m1 of the vibration housing 413 is in the range of 0.05 to 1.2. Preferably, the ratio of the mass m3 of the mass element 421 of the resonance assembly 420 to the mass m1 of the vibration housing 413 is in the range of 0.06 to 1.1. More preferably, the ratio of the mass m3 of the mass element 421 of the resonance assembly 420 to the mass m1 of the vibration housing 413 is in the range of 0.07 to 1.05. More preferably, the ratio of the mass m3 of the mass element 421 of the resonance assembly 420 to the mass m1 of the vibration housing 413 is in the range of 0.08 to 0.9. More preferably, the ratio of the mass m3 of the mass element 421 of the resonance assembly 420 to the mass m1 of the vibration housing 413 is in the range of 0.09 to 0.75. More preferably, the ratio of the mass m3 of the mass element 421 of the resonance assembly 420 to the mass m1 of the vibration housing 413 is in the range of 0.1 to 0.6.

[0075] FIG. 6 is a schematic longitudinal sectional view of another bone conduction speaker according to some embodiments of the present application. As shown in FIG. 6, the bone conduction speaker 600 may include a vibration assembly 610 and a resonance assembly 620. The vibration assembly 610 can generate mechanical vibrations. The resonance assembly 620 can receive the mechanical vibrations from the vibration assembly 610 and reduce the amplitude of the mechanical vibrations of the vibration assembly 610.

[0076] In some embodiments, the vibration assembly 620 may include a vibration element 611, a vibration housing 613, and a second elastic element 615. The vibration element 611 may be elastically connected to the vibration housing 613 by the second elastic element 615. When mechanical vibrations are generated in the vibration element 611, the vibration housing 613 can be driven to vibrate mechanically, and further transmit the vibrations to the user's facial tissues and bones, and then transmit them to the auditory nerve through the tissues and bones to let the user hear the sound. In some embodiments, the vibration element 611, the vibration housing 613, and the second elastic element 615 are the same as or similar to the vibration element 211, the vibration housing 213, and the second elastic element 215 of the bone conduction speaker 200 respectively, and the details of their structures are omitted here.

[0077] In some embodiments, the resonance assembly 620 may include a first elastic element 623 and a mass element 621. The mass element 621 may be elastically connected to the vibration housing 613 by the first elastic element 623. The vibration housing 613 transmits the vibration to the mass element 621 by the first elastic element 623, so that the mechanical vibration of the vibration housing 613 is partially absorbed by the mass element 621, thereby reducing the amplitude of the vibration housing 613.

[0078] As shown in FIG. 6, the resonance assembly 620 may be housed within the vibration housing 613, and the resonance assembly 620 may be connected to the inner wall of the vibration housing 621 by the first elastic element 623.

[0079] In some embodiments, the first elastic element 623 may include a diaphragm. The peripheral side of the diaphragm may be connected to the inside of the housing side plate 6132 of the vibration housing 613 by a support structure or directly connected thereto. The housing side plate 6132 is a side wall installed to surround the housing panel 6131. When vibration occurs in the vibration housing 613, the housing side plate 6132 can vibrate the diaphragm. Here, the diaphragm is connected to the vibration housing 613 and vibrates driven by the vibration housing 613, and thus may be called a passive diaphragm. In some embodiments, the diaphragm may include, but is not limited to, a plastic diaphragm, a metal diaphragm, a paper diaphragm, a biological diaphragm, etc.

[0080] In some embodiments, the mass element 621 may include a composite structure. The composite structure can be adhered to the surface of the diaphragm to form a composite diaphragm (i.e., the resonance assembly 620). The composite structure adhered to the surface of the diaphragm mainly performs the following functions. (1) The composite structure 621 can act as a counterweight element to adjust the mass of the composite diaphragm so that the entire composite diaphragm is within a certain mass range, so that the amplitude within the low-frequency region range of the bone conduction speaker 600 can be effectively reduced due to the large amplitude of the passive diaphragm itself. (2) The composite diaphragm structure formed by combining the composite structure 621 and the diaphragm has higher rigidity, and it is difficult for higher-order modes to occur on the surface of the composite diaphragm, avoiding the appearance of many peaks in the frequency response of the passive diaphragm. The mass of the mass element 621 and the frequency response of the composite diaphragm formed by the mass element 621 and the diaphragm may be the same as or similar to the mass element (for example, the mass element 421) and the resonance assembly (for example, the resonance assembly 420) in other embodiments of the present application, and the description thereof is omitted here.

[0081] In some embodiments, the composite structure may include, but is not limited to, one or a combination of cone paper, aluminum sheet, or copper sheet. In some embodiments, the composite structure may be made of the same type of material. For example, the composite structure may be cone paper or an aluminum sheet. In some embodiments, the composite structure may be made of different materials. For example, the composite structure may be a structure formed by combining cone paper and a copper sheet. Also for example, the composite structure may be a structure formed by mixing aluminum and copper in a certain ratio.

[0082] In some embodiments, the connection method between the composite structure and the diaphragm may include, but is not limited to, adhesive bonding and fixing, welding, locking, riveting, screwing (such as screws, nuts, screws, bolts, etc.), interference fit connection, clamp connection, pin connection, taper key connection, and forming connection methods.

[0083] As can be understood, when the diaphragm vibrates, it may vibrate the air in the vibration housing 613, thereby generating sound. Therefore, in some embodiments, at least one sound-emitting hole 640 may be formed in the vibration housing 613 to release the sound generated by the vibration of the diaphragm outside the vibration housing 613, and at least a part of the released sound is perceived by a person's ear. This part of the sound can improve the response of the bone conduction speaker 600 in the low-frequency region so that the bone conduction speaker 600 can still maintain a certain volume when the vibration sense at low frequencies is reduced.

[0084] In some embodiments, at least one sound-emitting hole 640 may be formed at any position of the vibration housing 613. In some embodiments, at least one sound-emitting hole 640 may be formed on the side of the vibration housing 613 facing away from the user's face, that is, on the housing back plate 6133. In some embodiments, at least one sound-emitting hole 640 may be formed on the housing side plate 6132, for example, at a position on the housing side plate 6132 facing the user's ear canal. In some other embodiments, at least one sound-emitting hole 640 may further be formed at a corner of the vibration housing 613, for example, at the connection portion between the housing side plate 6132 and the housing back plate 6133. In some embodiments, the number of the sound-emitting holes 640 may be plural. The plurality of sound-emitting holes 640 may be formed at different positions. For example, a part of the plurality of sound-emitting holes 640 may be formed on the housing back plate 6133, and another part may be formed on the housing side plate 6132. In some embodiments, at least part of the sound emitted through at least one sound-emitting hole 640 can be conducted to the user's ear, thereby improving the low-frequency response of the bone conduction speaker 600. In some embodiments, the above-described object can be achieved by installing at least one sound-emitting hole 640 at a position facing the user's ear. For example, when the user wears the bone conduction speaker 600, since the housing side plate 6132 faces the human ear, at least one sound-emitting hole 640 can be installed on the housing side plate 6132 to emit sound through the sound-emitting hole 640 and conduct at least part of the sound to the human ear. In some embodiments, the above-described object can be achieved by providing an additional sound conduction structure. For example, a sound conduction tube can be installed at the outlet of at least one sound-emitting hole 640 to conduct sound in the direction of the human ear through the sound conduction tube.

[0085] In some embodiments, the cross-sectional shape of the sound-emitting hole 640 may include, but is not limited to, a circle, a square, a triangle, a polygon, etc.

[0086] In some embodiments, the bone conduction speaker 600 may include a fixing assembly 630, and the fixing assembly 630 may be fixedly connected to the vibration housing 613. The fixing assembly 630 can maintain stable contact between the bone conduction speaker 600 and the face of the user (e.g., the wearer), avoid shaking of the bone conduction speaker 600, and ensure stable sound transmission of the bone conduction speaker 600.

[0087] In some embodiments, the smaller the rigidity of the fixing assembly 630 (i.e., the smaller the spring constant), the more obvious the low-frequency response at the first resonance peak 450 of the bone conduction speaker 600 (i.e., the larger the vibration acceleration and the higher the sensitivity), which is helpful for improving the sound quality of the bone conduction speaker 600. On the other hand, when the rigidity of the fixing assembly 630 is small (i.e., the spring constant is small), it is helpful for the vibration of the vibration housing 613.

[0088] In some embodiments, the fixing assembly 630 may be directly and fixedly connected to the vibration housing 613. In some embodiments, a connecting member may be used to connect the fixing assembly 630 and the vibration housing 613. In some embodiments, the fixing assembly 630 may include a fixed connecting member. The fixed member connecting member can connect the fixing assembly 630 and the vibration housing 613. In some embodiments, the fixed connecting member may be one or a combination of silicone rubber, sponge, plastic, spring, and carbon sheet.

[0089] In some embodiments, the fixing assembly 630 may be in the form of an earhook. One vibration housing 613 may be connected to each end of the fixing assembly 630, and the two vibration housings 613 may be fixed to both sides of the human skull in an earhook manner. In some embodiments, the fixing assembly 630 may be a single-ear ear clip. The fixing assembly 630 may be individually connected to one vibration housing 613 and can fix the vibration housing 613 to one side of the human skull. The structure of the fixing assembly 630 may be the same as or similar to the fixing assembly (for example, the fixing assembly 230) in other embodiments of the present application, and the description thereof is omitted here.

[0090] FIG. 7 is a schematic longitudinal sectional view of another bone conduction speaker according to some embodiments of the present application. As shown in FIG. 7, the bone conduction speaker 700 may include a vibration assembly 710 and a resonance assembly 720. The vibration assembly 710 may include a vibration element 711, a vibration housing 713, and a second elastic element 715. The second elastic element 715 elastically connects the vibration element 711 and the vibration housing 713 and transmits the mechanical vibration of the vibration element 711 to the vibration housing 713. In some embodiments, the vibration element 711, the vibration housing 713, and the second elastic element 715 may be the same as or similar to the vibration element 211, the vibration housing 213, and the second elastic element 215 of the bone conduction speaker 200, respectively, and the details of their structures are omitted here.

[0091] The resonance assembly 720 may include a mass element 721 and a first elastic element 723. The mass element 721 may be elastically connected to the vibration housing 713 by the first elastic element 723. As shown in FIG. 7, the resonance assembly 720 may be installed outside the vibration housing 713. The resonance assembly 720 may be connected to the outer wall of the vibration housing 713 by the first elastic element 723. When mechanical vibration occurs in the vibration housing 713, the resonance assembly 720 can reduce the amplitude of the vibration housing 713 by absorbing some of the mechanical energy of the vibration housing 713.

[0092] In some embodiments, the mass element 721 may be configured in different shapes. For example, it may be a cube, a substantially cube (e.g., with the eight corners of the cube being arc-shaped), or an ellipsoid, etc.

[0093] In some embodiments, the mass element 721 may be a groove member. At least a part of the vibration housing 713 may be received in the groove member. In some embodiments, the groove cross-sectional shape of the groove member may be a shape such as circular, square, polygonal, etc. In some embodiments, the groove cross-sectional shape of the groove member may be adapted to the outer contour of the vibration housing 713. For example, if the outer contour of the vibration housing 713 is a rectangular parallelepiped, the groove cross-sectional shape of the groove member may be a corresponding square. In some embodiments, the vibration housing 713 may be completely received in the groove of the groove member. In some embodiments, a part of the vibration housing 713 may be received in the groove of the groove member. For example, so that the housing panel 7131 of the vibration housing 713 is in contact with the human skull and is likely to transmit vibration, the housing panel 7131 and at least a part of the housing side plate 7132 of the vibration housing 713 may be located outside the groove. In some embodiments, the first elastic element 723 may connect the housing back plate 7133 and the inner wall of the groove member. For example, the first part of the first elastic element 723 is connected to the housing back plate 7133, and the second part of the first elastic element 723 is connected to the inner side wall of the groove member. Assuming that the first elastic element 723 has an annular structure, the first part of the first elastic element 723 may be located in the central region of the annular structure, and the second part may be located on the circumferential side of the annular structure. In some embodiments, the first part of the first elastic element 723 may be connected to the housing back plate 7133, and the second part of the first elastic element 723 may be connected to the bottom plate of the groove member. In some embodiments, the first part of the first elastic element 723 may be connected to the housing side plate 7132, and the second part of the first elastic element 723 may be connected to the side plate of the groove member. In some embodiments, the vibration housing may not include the housing back plate 7133 and may include only the housing panel 7121 and the housing side plate 7132. In such a case, the resonance assembly 720 may be connected to the housing side plate 7132 or the inner wall of the vibration housing 713 by the first elastic element 723.

[0094] In some embodiments, the first elastic element 723 may be directly connected to the housing back plate 7133 and the groove member. In some embodiments, the first elastic element 723 may be connected to the housing back plate 7133 and the groove member by a connecting member. For example, a third connecting member may be fixedly installed on the housing back plate 7133, and a first portion of the first elastic element 723 may be fixedly connected to the third connecting member. A fourth connecting member may be fixedly installed on the groove member, and a second portion of the first elastic element 723 may be fixedly connected to the fourth connecting member. In some embodiments, the mass of the mass element 721 and the frequency response of the resonance assembly 720 formed by the mass element 721 and the first elastic element 723 may be the same as or similar to the mass element (e.g., the mass element 421) and the resonance assembly (e.g., the resonance assembly 420) in other embodiments of the present application, and the description thereof is omitted herein.

[0095] In some embodiments, the internal size of the groove member may be larger than the external size of the vibration housing 713. In this case, a cavity can be formed between the vibration housing 713 and the groove member. The vibration housing 713 and the groove member can vibrate the air in the cavity during vibration to generate sound. Further, a sound emission passage 740 may be formed between the groove member and the outer wall of the vibration housing 713. For example, in the embodiment shown in FIG. 7, there is a gap between the side wall of the groove member and the housing side plate 7132, and this gap can be used as the sound emission passage 740. The sound generated by the air vibration between the vibration housing 713 and the groove member can be transmitted to the outside through the sound emission passage 740. A person's ear can receive a part of the sound, achieving the effect of increasing the low frequency to a certain extent and increasing the volume.

[0096] In some embodiments, the bone conduction speaker 700 may further include a fixing assembly 730. The fixing assembly 730 can maintain the contact between the bone conduction speaker 700 and the user's cranial bone of the face. In some embodiments, the fixing assembly 730 may be fixedly connected to the resonance assembly 720. For example, the fixing assembly 730 may be fixedly connected to or integrally formed with the mass element 721 (e.g., the groove member). In some embodiments, the fixing assembly 730 may be directly fixedly connected to the groove member. In some embodiments, the fixing assembly 730 may be connected to the groove member by a fixing connection member.

[0097] In some embodiments, the fixing assembly 730 may be in the form of earhooks. Both ends of the fixing assembly 730 are respectively connected to a groove member and a vibration housing 713 housed in the groove member, and the two groove members are fixed to both sides of the cranial bone in an earhook manner. In some embodiments, the fixing assembly 730 may be a single-ear ear clip. The fixing assembly 730 is individually connected to one groove member and the vibration housing 713 housed in the groove member, and can fix the groove member to one side of the human cranial bone. The structure of the fixing assembly 730 may be the same as or similar to the fixing assembly (e.g., the fixing assembly 230) in other embodiments of the present application, and the description thereof is omitted here.

[0098] FIG. 8 and FIG. 9 are schematic longitudinal sectional views of another bone conduction speaker according to some embodiments of the present application. As shown in FIGS. 8 and 9, the bone conduction speaker 800 may include a vibration assembly 810 and a resonance assembly 820. The vibration assembly 810 may include a vibration element 811, a vibration housing 813, and a second elastic element 815 (shown in FIG. 9). The second elastic element 815 elastically connects the vibration element 811 and the vibration housing 813.

[0099] The vibration housing 813 may have an individual plate-like or substantially plate-like structure. Compared with the embodiment shown in FIG. 7, the vibration housing 813 is different in that no accommodation space is defined, and the vibration element and the second elastic element 815 are connected to the vibration housing 813. The mass element 821 may be a groove member, the mass element 821 can define an accommodation space, and at least a part of the vibration assembly 810 may be accommodated in the space formed by the mass element 821. The first elastic element 823 can connect the mass element 821 and the vibration housing 813.

[0100] The vibration element 811 may include a magnetic circuit assembly. A coil is installed in the vibration housing 813, and a magnetic circuit assembly is provided around the coil. The second elastic element 815 connects the magnetic circuit assembly and the vibration housing 813.

[0101] The second elastic element 815 may be a vibration transmission sheet. In some embodiments, the vibration transmission sheet may have an annular structure. As shown in FIG. 9, the annular vibration transmission sheet is provided around the outside of the vibration housing 813. The peripheral side of the annular vibration transmission sheet is connected to the magnetic circuit assembly, and the middle part of the annular vibration transmission sheet is connected to the vibration housing 813. When mechanical vibration is generated under the action of Ampere force, the vibration housing 813 can transmit the vibration to the mass element 821 through the first elastic element 823 to vibrate the mass element 821, and finally achieve the effect of reducing the amplitude of the vibration assembly 810.

[0102] In some embodiments, the vibration element 811, the vibration housing 813, and the second elastic element 815 are the same as or similar to the vibration element 211, the vibration housing 213, and the second elastic element 215 of the bone conduction speaker 200 respectively, and the details of their structures are omitted here.

[0103] Although the basic concept has been described above, it is clear to those skilled in the art that the disclosure of the above invention is merely presented as an example and does not limit the present application. Although not explicitly described in this specification, those skilled in the art can make various changes, improvements, and modifications to the present application. These changes, improvements, and modifications are intended to be suggested by the present application and are within the spirit and scope of the exemplary embodiments of the present application.

[0104] Furthermore, to explain the embodiments of the present application, specific terms are used in the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" mean specific features, structures, or characteristics related to at least one embodiment of the present application. Therefore, it should be emphasized and understood that two or more references to "an embodiment" or "one embodiment" or "one alternative embodiment" in various parts of this specification do not necessarily all refer to the same embodiment. Also, specific features, structures, or characteristics in one or more embodiments of the present application may be appropriately combined.

[0105] Also, as will be understood by those skilled in the art, each aspect of the present application can be exemplified and described in several patentable classes or contexts, including any novel and useful process, machine, product, or combination of substances, or any novel and useful improvement thereto. Thus, each aspect of the present application may be implemented entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. Any of the above hardware or software may also be referred to as a "data block", "module", "engine", "unit", "assembly", or "system". Furthermore, each aspect of the present application can take the form of a computer program product embodied in one or more computer-readable media containing computer-readable program code.

[0106] Furthermore, unless expressly recited in the claims, the recited order of process elements or sequences, use of alphanumerics, or use of other names in this application do not limit the order of the procedures and methods of this application. In the above disclosure, various examples that are currently considered to be useful embodiments of the invention are described through various examples, but such details are merely for the purpose of explanation, and the appended claims are not limited to the disclosed embodiments. On the contrary, it should be understood that the claims are intended to cover all modifications and equivalent combinations within the spirit and scope of the embodiments of this application. For example, the above-described system assembly may be implemented by a hardware device, but may also be implemented by a software-only solution, for example, by installing the system described in an existing server or mobile device.

[0107] Similarly, in the foregoing description of the embodiments of this application, it should be understood that for the purpose of simplifying this application and assisting in the understanding of one or more embodiments of the invention, various features may be grouped in one embodiment, drawing, or description thereof. However, such a disclosure method should not be construed as reflecting an intention that the claimed subject matter requires more features than those recited in each claim. In fact, the features of an embodiment may be less than all the features of the single embodiment disclosed above.

[0108] In some embodiments, numbers are used to describe the number of components and attributes, and it should be understood that the numbers for describing such embodiments are modified by the modifier "about", "substantially" or "generally" in some examples. Unless otherwise specified, "about", "substantially" or "generally" indicates that the above numbers are allowed a variation of ±20%. Therefore, in some embodiments, the numerical parameters used in the specification and claims are all approximate values that can vary according to the characteristics required for individual embodiments. In some embodiments, for numerical data, the specified number of significant digits should be considered and the normal rounding method should be applied. In some embodiments of the present application, the numerical ranges and data for determining the range are approximate values, but in specific embodiments, such numbers are set as accurately as possible.

[0109] Finally, it should be understood that the embodiments according to the present application are merely for explaining the principles of the embodiments of the present application. Other variations may also be within the scope of the present application. Therefore, without limitation, by way of example, alternative configurations of the embodiments of the present application may be considered to be in accordance with the teachings of the present application. Thus, the embodiments of the present application are not limited to the embodiments clearly introduced and described in the present application.

Description of Reference Numerals

[0110] 100 Bone conduction speaker 110 Vibration assembly 120 Resonance assembly 130 Fixing assembly 200 Bone conduction speaker 210 Vibration assembly 230 Fixing assembly 211 Vibration element 213 Vibration housing 215 Second elastic element 400 Bone conduction speaker 410 Vibration assembly 411 Vibration element 413 Vibration housing 415 Second elastic element 421 mass element 423 first elastic element

Claims

1. a vibration assembly including a vibration element for converting an electrical signal into mechanical vibration, and a vibration housing for contacting a user's face and transmitting the mechanical vibration to the user in a bone conduction manner to generate sound, the vibration housing including a housing panel, a housing side plate, and a housing back plate, the housing panel being configured to contact the user's face, the housing back plate being disposed opposite the housing panel, and the housing panel and the housing back plate being disposed on both end surfaces of the housing side plate, respectively; a resonator assembly including a first elastic element and a mass element connected to the vibrating assembly by the first elastic element; Including, the first elastic element is fixedly connected to the vibration housing, the vibration housing transmitting the mechanical vibration to the mass element by the first elastic element; the resonator assembly is disposed outside the vibration housing; the resonator assembly is connected to an outer wall of the vibration housing by the first elastic element; A bone conduction speaker, wherein the vibration assembly vibrates the resonator assembly, and the vibration of the resonator assembly reduces the amplitude of the vibration housing.

2. The bone conduction speaker of claim 1 , wherein the ratio of the mass of the mass element to the mass of the vibration housing is in the range of 0.04 to 1.

25.

3. 3. A bone conduction speaker as described in claim 1 or 2, wherein the vibration assembly has a first low frequency resonant peak at a first frequency, the resonant assembly has a second low frequency resonant peak at a second frequency, and the ratio of the second frequency to the first frequency is in the range of 0.5 to 2.

4. The bone conduction speaker of claim 3 , wherein the ratio of the second frequency to the first frequency is in the range of 0.9 to 1.

1.

5. The bone conduction speaker according to claim 4 , wherein the first frequency and the second frequency are both less than 500 Hz.

6. The bone conduction speaker of claim 5 , wherein the amplitude of the resonating assembly is greater than the amplitude of the vibrating housing in a frequency range less than the first frequency.

7. 4. The bone conduction speaker of claim 3, wherein the vibration assembly further includes a second elastic element, the vibration housing accommodates the vibration element and the second elastic element, and the vibration element transmits the mechanical vibration to the vibration housing via the second elastic element.

8. The bone conduction speaker of claim 1 , wherein the mass element is a channel member and the vibration housing is at least partially housed within the channel member.

9. The bone conduction speaker according to claim 8 , wherein the first elastic element connects the outer wall of the vibration housing and the inner wall of the groove member, and a sound emitting passage is formed between the inner wall of the groove member and the outer wall of the vibration housing.

10. Further comprising a fastening assembly; The bone conduction speaker of claim 1 , wherein the fixing assembly is configured to maintain stable contact of the bone conduction speaker with the user, and the fixing assembly is fixedly connected to the vibration housing.

Citation Information

Patent Citations

  • Bone conduction speaker and earphone

    CA3103583A1

  • Method for suppressing sound leakage from bone conduction speakers and bone conduction speakers

    JP2017502615A

  • Bone conduction speaker of double frame and double magnet structures

    KR1020090082999A

  • Bone conduction speaker unit

    WO2019003465A1

  • Bone conduction speaker and testing method therefor

    WO2019237726A1