Method for installing electronic component on wire and wire having electronic component installed thereon

Abstract

To provide a method for installing an electronic component on a wire and a wire having an electronic component installed thereon.SOLUTION: A method for installing an electronic component E1 on a wire includes the steps of: providing a first line 11 and an insulating layer 12 covering the first line 11; cutting the first line 11 and the insulating layer 12 in the wire to form a first open hole, wherein the first line 11 after being cut forms a first line segment 11a and a second line segment 11b; removing part of the insulating layer 12 covering the first line 11 at a position of the first open hole to form a first opening 141 for partially exposing the first line segment 11a and a second opening 142 for partially exposing the second line segment 11b; and installing, in the first open hole, a first electronic component E1 having a first end E1a electrically connected to the first line segment 11a and a second end E1b electrically connected to the second line segment 11b.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a method for installing electronic components on a wiring and to a wiring, and in particular to a method for installing electronic components on a wiring and a wiring having electronic components installed thereon. [Background technology]

[0002] A circuit board contains various electronic components, and the electronic components, such as resistors, capacitors, transistors, etc., can be mounted on the surface of the circuit board using various connection technologies, such as surface mount technology (SMT). Regardless of the technology, each electronic component needs to be connected and installed on the circuit board based on the line layout of the circuit board.

[0003] In addition, due to the limited area of ​​the circuit board, not many electronic components can be mounted on the circuit board, which limits the functionality of the circuit board. For example, the flexible wiring structure and component module having the flexible wiring disclosed in Taiwan Patent No. TWM353516U disclose a flexible wiring structure, but due to the limited area of ​​the circuit board, not many electronic components can be mounted on the circuit board. Summary of the Invention [Problem to be solved by the invention]

[0004] Therefore, how to mount electronic components on wiring and how to provide wiring on which electronic components are mounted have already become urgent research topics. [Means for solving the problem]

[0005] In view of the above-mentioned problems, the present invention provides a method for installing an electronic component on a wiring, which includes the steps of: providing a wiring having a first line and an insulating layer covering the first line, forming a first opening by cutting the first line and the insulating layer in the wiring, and forming a first line segment and a second line segment in the first line after the cutting, forming a first opening that partially exposes the first line segment and a second opening that partially exposes the second line segment by partially removing the insulating layer covering the first line at the position of the first opening, and installing a first electronic component having a first terminal electrically connected to the first line segment exposed by the first opening and a second terminal electrically connected to the second line segment exposed by the second opening in the first opening.

[0006] The present invention includes another method for installing an electronic component on a wiring, the method further comprising the steps of: providing a wiring having a first line, a second line installed alongside the first line, and an insulating layer covering the first line and the second line, forming a slot at a predetermined component installation position by removing a part of the insulating layer covering the first line and a part of the insulating layer covering the second line to partially expose the first line and the second line, and installing in the slot a second electronic component having a third terminal electrically connected to the first line exposed by the slot and a fourth terminal electrically connected to the second line exposed by the slot.

[0007] The present invention includes a wiring on which an electronic component is installed. The wiring includes a first line, an insulating layer, a first hole, a first opening, and a second opening. The first line includes a first line segment and a second line segment. The insulating layer covers the first line. The first opening is located in the insulating layer and between the first line segment and the second line segment. The first opening is located in the first opening and partially exposes the first line. The second opening is located in the first opening and partially exposes the second line. A first electronic component is installed in the first opening, the first electronic component having a first terminal electrically connected to the first line segment exposed by the first opening, and a second terminal electrically connected to the second line segment exposed by the second opening.

[0008] The present invention further includes a wiring including a first line, a second line, an insulating layer, and a slot, and having an electronic component disposed thereon. The second line is disposed alongside the first line. The insulating layer covers the first line and the second line. The slot is located within the insulating layer and partially exposes the first line and the second line. A second electronic component is disposed within the slot, the second electronic component having a third terminal electrically connected to the first line exposed by the slot and a fourth terminal electrically connected to the second line exposed by the slot.

[0009] As described above, the method of installing electronic components on wiring and the wiring having electronic components installed thereon according to the present invention allows for the installation and connection of electronic components connected in series and parallel in a flexible, economical and optimal manner by installing electronic components on the wiring using readily available wiring. [Brief description of the drawings]

[0010] [Figure 1A-1D] 4 is a cross-sectional step flow chart of a first method for placing an electronic component on a wiring according to the present invention. [Figures 2A-2D] FIG. 2 is a top view corresponding to FIGS. 1A to 1D. [Diagram 3] FIG. 11 is a cross-sectional view showing an electronic component placed on a first line. [Figure 4A-4C]4 is a cross-sectional step flow chart of a second method for placing an electronic component on a wiring according to the present invention. [Figure 5A-5B] 1A and 1B are a perspective view and a partially enlarged view of a method for placing an electronic component on a wiring by combining a first method and a second method according to the present invention; [Figures 6A-6E] 4 is a flow chart showing steps for bending a wiring line according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] 1A-1D, and correspondingly, FIG. 2A-2D and FIG. 3, FIG. 1A-1D are a step flow chart of a cross section of a first method of installing an electronic component on a wiring according to the present invention, FIG. 2A-2D are top views corresponding to FIG. 1A-1D, and FIG. 3 is a cross-sectional view of an electronic component installed on a first line. The method of installing an electronic component on a wiring includes the following steps. As shown in FIG. 1A and FIG. 2A, first, a wiring 10 is provided, the wiring 10 includes a first line 11 and an insulating layer 12, the insulating layer 12 includes a two-layer structure of upper and lower layers, covers the first line 11, and for simplification, only the upper insulating layer 12 is labeled in the figure. As shown in FIG. 1B and FIG. 2B, the first line 11 and the insulating layer 12 on the wiring 10 are cut to form a first opening 13, and the first line 11 after the cutting forms a first line segment 11a and a second line segment 11b. In the embodiment of the present invention, the method of cutting the insulating layer 12 and the first line 11 includes using various tools such as a cutting tool, a punching machine, etc. Also, the lower insulating layer 12 may or may not be cut, and is not limited in the present invention. As shown in FIG. 1C and FIG. 2C, the insulating layer 12 covering the first line 11 is partially removed at the position of the first opening 13 to form a first opening 141 and a second opening 142, where the first opening 141 partially exposes the first line segment 11a of the first line 11, and the second opening 142 partially exposes the second line segment 11b of the first line 11. In the embodiment of the present invention, the method of removing a part of the insulating layer 12 includes melting or cutting. As shown in Figures 1D, 2D and 3, a first electronic component E1 is installed in the first opening 13, and the first electronic component E1 has a first terminal (pin) E1a and a second terminal (pin) E1b, with the first terminal E1a electrically connected to the first line segment 11a exposed by the first opening 141, and the second terminal E1b electrically connected to the second line segment 11b exposed by the second opening 142.In an embodiment of the present invention, a method for installing the first electronic component E1 on the first line segment 11a and the second line segment 11b includes surface mount technology (SMT), or using an adhesive to adhere the first terminal E1a and the second terminal E1b of the first electronic component E1 onto the first line segment 11a and the second line segment 11b.

[0012] 4A-4C, which are cross-sectional step flow charts of a second method for installing an electronic component on a wiring according to the present invention. In the above-mentioned method steps, the first electronic component E1 is installed on both ends of the broken first line 11, not only to connect the terminals of the electronic component to the same line, but also to connect the terminals of the electronic component to the same line by each of the parallel lines in the wiring 10, since the wiring 10 actually includes a plurality of parallel lines. More specifically, the wiring 10 has a second line 15, the first line 11 is installed next to the second line 15, and the insulating layer 12 covers the second line 15. The method for installing an electronic component on a wiring includes the following steps. As shown in FIG. 4A, FIG. 4A shows a cross-sectional view of the first line 10 and the second line 15 that are parallel in the wiring 10. As shown in Fig. 4B, a slot 16 is formed by removing a part of the insulating layer 12 covering the first line 11 and a part of the insulating layer 12 covering the second line 15 at a predetermined component installation position. As shown in Fig. 4C, a second electronic component E2 is installed in the slot 16. The second electronic component E2 has a third terminal E2a electrically connected to the first line 11 exposed by the slot 16 and a fourth terminal E2b electrically connected to the second line 15 exposed by the slot 16.

[0013] 5A and 5B, which are perspective and partially enlarged views of the first and second methods of the present invention for mounting an electronic component on a wiring. In this embodiment, the first and second methods are simultaneously combined to mount both a first electronic component E1 and a second electronic component E2 on a wiring 10. The wiring has a second line, the first line is mounted side by side with the second line, and an insulating layer covers the first line and the second line. In this embodiment, the method for mounting an electronic component on a wiring includes the following steps. In step S10, a wiring 10 is provided, the wiring 10 includes a first line 11 and an insulating layer 12, and the insulating layer 12 includes a two-layer structure, upper and lower, and covers the first line 11. In step S11, the first line 11 and the insulating layer 12 on the wiring 10 are cut to form a first opening 13, and the first line 11 after being cut forms a first line segment 11a and a second line segment 11b. In step S12, the insulating layer 12 covering the first line 11 is removed at the position of the first opening 13 to form a first opening 141 and a second opening 142, where the first opening 141 partially exposes the first line segment 11a of the first line 11, and the second opening 142 partially exposes the second line segment 11b of the first line 11. In step S13, a first electronic component E1 is placed in the first opening 13. The first electronic component E1 has a first terminal E1a and a second terminal E1b. The first terminal E1a is electrically connected to the first line segment 11a exposed through the first opening 141, and the second terminal E1b is electrically connected to the second line segment 11b exposed through the second opening 142. In step S14, a slot 16 is formed by removing a part of the insulating layer 12 covering the first line 11 and a part of the insulating layer 12 covering the second line 15 at a predetermined component placement position. In step S15, a second electronic component E2 is placed in the slot 16. The second electronic component E2 has a third terminal E2a and a fourth terminal E2b. The third terminal E2a is electrically connected to the first line 11 exposed in the slot 16, and the fourth terminal E2b is electrically connected to the second line 15 exposed in the slot 16.

[0014] Referring again to FIG. 1D, in the embodiment of FIG. 1D, the wiring on which the electronic components are installed includes a wiring 10, which has a first line 11, an insulating layer 12, a first opening 13, a first opening 141, and a second opening 142. The first line 11 includes a first line segment 11a and a second line segment 11b. The insulating layer 12 covers the first line 11. The first opening 13 is located in the insulating layer 12 and between the first line segment 11a and the second line segment 11b. The first opening 141 is located in the first opening 13 and partially exposes the first line segment 11a. The second opening 142 is located in the first opening 13 and partially exposes the second line segment 11b. A first electronic component E1 is installed in the first opening 13, and the first electronic component E1 has a first terminal E1a and a second terminal E1b, the first terminal E1a being electrically connected to the first line segment 11a exposed by the first opening 141, and the second terminal E1b being electrically connected to the second line segment 11b exposed by the second opening 142.

[0015] Referring again to Fig. 3, in the embodiment of Fig. 3, the wiring on which the electronic components are installed includes a first line 11, a second line 15, an insulating layer 12, and a slot 16. The second line 15 is installed alongside the first line 11. The insulating layer 12 covers the first line 11 and the second line 15. The slot 16 is located in the insulating layer 12 and partially exposes the first line 11 and the second line 15. A second electronic component E2 is installed in the slot 16, and the second electronic component E2 has a third terminal E2a and a fourth terminal E2b, where the third terminal E2a is electrically connected to the first line 11 exposed in the slot 16, and the fourth terminal E2b is electrically connected to the second line 15 exposed in the slot 16.

[0016] 1D, 3 and 5A, the wiring on which the electronic components are installed includes a first line 11, an insulating layer 12, a first opening 13, a first opening 141, a second opening 142 and a slot 16. The first line 11 includes a first line segment 11a and a second line segment 11b. The insulating layer 12 covers the first line 11 and the second line 15. The second line 15 is installed side by side with the first line 11. The first opening 13 is located in the insulating layer 12 and between the first line segment 11a and the second line segment 11b. The first opening 141 is located in the first opening 13 and partially exposes the first line segment 11a. The second opening 142 is located in the first opening 13 and partially exposes the second line segment 11b. A first electronic component E1 is disposed in the first opening 13, and the first electronic component E1 has a first terminal E1a and a second terminal E1b, the first terminal E1a being electrically connected to the first line segment 11a exposed in the first opening 141, and the second terminal E1b being electrically connected to the second line segment 11b exposed in the second opening 142. A slot 16 is located in the insulating layer 12 and partially exposes the first line 11 and the second line 15. A second electronic component E2 is disposed in the slot 16, and the second electronic component E2 has a third terminal E2a and a fourth terminal E2b, the third terminal E2a being electrically connected to the first line 11 exposed in the slot 16, and the fourth terminal E2b being electrically connected to the second line 15 exposed in the slot 16.

[0017] In the embodiment of the present invention, the first electronic component E1 and the second electronic component E2 include surface mount technology components, terminal type components (e.g. resistors, capacitors, transistors, light emitting diodes, etc.), fuses, etc., and different installation methods are used according to different first electronic components E1 and second electronic components E2 to install the first electronic component E1 and the second electronic component E2 on the first line 11 and the second line 15. The wiring 10 includes a transmission wiring made of a flexible flat wiring (Flexible Flat Cable, FFC) material, such as an IDE (Integrated Device Electronics) wiring or a SATA (Serial Advanced Technology Attachment) wiring. Therefore, the method of installing electronic components on wiring according to the present invention can widely and flexibly install various electronic components on the wiring 10.

[0018] 6A to 6E, which are step flow charts of bending the lines of the wiring according to the present invention. Since the wiring 10 and the lines are made of flexible materials, in the present invention, when the wiring is not limited to being installed on a flat surface, the lines in the wiring 10 can be bent by a bending method to be connected to the required positions as needed. As shown in FIG. 6A, first, the installation position of the bending line 17 is drawn on the insulating layer 12 on the wiring 10. As shown in FIG. 6B, based on the position of the bending line 17, the extra first line 11, the second line 15, and the insulating layer 12 covering the outside of the first line 11 and the second line 15 are removed. As shown in FIG. 6C, the first line 11 and the second line 15 at one end of the wiring 10 are connected to the circuit board B. As shown in FIG. 6D, on a plane, the first line 11 and the second line 15 are bent in various predetermined directions and angles based on the installation position of the line. In the embodiment of the present invention, the bending angle is 90 degrees as an example, but is not limited to 90 degrees. As shown in FIG. 6E, in space, the first line 11 and the second line 15 are bent in various predetermined directions and angles based on the installation position of the line, thereby forming a three-dimensional line structure of the wiring 10. Note that the step flow chart of bending the wiring line in FIG. 6A to FIG. 6E has been described using the first method of installing electronic components on the wiring in FIG. 1A to FIG. 1D as an example, but it should be noted that in practice, the step flow chart of bending the wiring line in FIG. 6A to FIG. 6E can also be applied to the second method of installing electronic components on the wiring in FIG. 4A to FIG. 4C, and a combination of the first method and the second method in FIG. 5A and FIG. 5B.

[0019] As described above, the method of installing electronic components on wiring according to the present invention can install and connect electronic components connected in series and parallel in a flexible, economical and optimal manner by installing electronic components on wiring using readily available wiring. In addition, compared with the conventional technology using flexible printed circuit materials, the conventional technology requires processing on a flexible circuit board in the manufacturing process, for example, completing the installation of lines by drilling, developing, exposing, and etching the circuit board, so that more steps and materials are required in the overall manufacturing process. In comparison, the method of installing electronic components on wiring according to the present application only requires attaching a molded electronic component to a single copper wire line in the wiring, so that material loss is relatively small. In addition, compared with conventional products that originally use flexible wiring materials, the product completed by combining surface mount technology (SMT) with flexible wiring (FFC) materials according to the present application can withstand high temperatures during SMT manufacturing at 260 degrees, so that the high temperature resistance of the product can be greatly improved, and it can be more widely applied to various electronic components such as resistors, capacitors, and light-emitting diodes, so that the diversity of products can be achieved due to their complexity. In addition, compared to conventional flexible flat wiring, in which fuses can only be installed at the input / output positions of a circuit board, the present invention combines surface mount technology (SMT) with flexible wiring (FFC) materials to install the fuse as an electronic component on the wiring, allowing the completed product to be installed close to the battery module. Therefore, in the event of a current overload, the fuse can provide a quick response and instant meltdown, further improving the safety of the product. [Explanation of symbols]

[0020] 10 Wiring 11 The First Track 11a First line segment 11b Second line segment 12 Insulating layer 13 First Aperture 141 First Opening 142 Second Opening 15 The Second Track 16 Slots 17 Folding lines E1 First Electronic Component E1a First Terminal E1b Second Terminal E2 Second Electronic Component E2a Third Terminal E2b 4th terminal B Circuit board

Claims

1. providing a wiring having a first line and an insulating layer covering the first line; forming a first opening by cutting the first line and the insulating layer in the wiring, and forming a first line segment and a second line segment from the first line after the cutting; forming a first opening that partially exposes the first line segment of the first line and a second opening that partially exposes the second line segment of the first line by removing a portion of the insulating layer covering the first line at a position of the first opening; and installing in the first opening a first electronic component having a first terminal electrically connected to the first line segment exposed by the first opening and a second terminal electrically connected to the second line segment exposed by the second opening.

2. the wiring further includes a second line, the first line is disposed in parallel with the second line, and the insulating layer further covers the second line; The method comprises: forming a slot by removing a portion of the insulating layer covering the first line and a portion of the insulating layer covering the second line at a predetermined component installation position; 2. The method of installing an electronic component on a wiring as described in claim 1, further comprising the step of installing a second electronic component in the slot, the second electronic component having a third terminal electrically connected to the first line exposed by the slot and a fourth terminal electrically connected to the second line exposed by the slot.

3. providing at least one fold line on the insulating layer of the wiring; removing the insulating layer covering a part of the first line, a part of the second line, and an outside of the first line and the second line based on an installation position of the at least one folding line; connecting one end of the first line and one end of the second line of the wiring to a circuit board; Bending the first line and the second line at a first predetermined angle and a first predetermined direction on a plane based on the installation position of the at least one bending line; 3. The method for installing an electronic component on a wiring according to claim 2, further comprising the step of bending the first line and the second line at a second predetermined angle and in a second predetermined direction in space based on the installation position of the at least one bending line.

4. providing a wiring having a first line, a second line installed alongside the first line, and an insulating layer covering the first line and the second line; forming a slot that partially exposes the first line and the second line by removing a portion of the insulating layer covering the first line and a portion of the insulating layer covering the second line at a predetermined component installation position; and placing in the slot a second electronic component having a third terminal electrically connected to the first line exposed by the slot and a fourth terminal electrically connected to the second line exposed by the slot.

5. a first line including a first line segment and a second line segment; an insulating layer covering the first line; a first aperture located in the insulating layer and between the first line segment and the second line segment; a first opening located within the first aperture and partially exposing the first line; a second opening located within the first opening and partially exposing the second line; A wiring having an electronic component installed thereon, characterized in that a first electronic component is installed within the first opening, the first electronic component having a first terminal electrically connected to the first line segment exposed by the first opening, and a second terminal electrically connected to the second line segment exposed by the second opening.

6. a second line disposed alongside the first line and covered with the insulating layer; a slot located in the insulating layer to partially expose the first line and the second line; The wiring having an electronic component installed thereon, as described in claim 5, characterized in that a second electronic component is installed in the slot, the second electronic component having a third terminal electrically connected to the first line exposed by the slot, and a fourth terminal electrically connected to the second line exposed by the slot.

7. 7. The wiring according to claim 6, wherein the first electronic component and the second electronic component are fuses.

8. The first line, a second line installed alongside the first line; an insulating layer covering the first line and the second line; a wiring located within the insulating layer and including a slot partially exposing the first line and the second line; A wiring having an electronic component installed therein, characterized in that a second electronic component is installed within the slot, the second electronic component having a third terminal electrically connected to the first line exposed by the slot, and a fourth terminal electrically connected to the second line exposed by the slot.

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