Shield connection component

The shield connection component simplifies the grounding of multiple bus bars by using a conduction structure and cover to collectively ground shield layers, thereby improving workability and reducing operational complexity.

JP2025087281AActive Publication Date: 2025-06-10YAZAKI CORP
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Patent Information

Application Number
JP2023201828
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-11-29
Publication Date
2025-06-10
Estimated Expiration
2043-11-29

AI Technical Summary

Technical Problem

The complexity of grounding shield layers on multiple bus bars complicates the work process, leading to decreased workability.

Method used

A shield connection component is designed with a base, a conduction structure, and a cover, where the conduction structure includes conduction portions that contact the shield layers of the bus bars and a ground connection portion to electrically connect them to ground, improving workability by simplifying the grounding process.

Benefits of technology

The proposed solution enhances workability by allowing for collective grounding of shield layers, reducing operational complexity and improving efficiency compared to individual grounding of each bus bar.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a shield connection component capable of improving workability.SOLUTION: A shield connection component according to one embodiment has a first member, a conduction structure, and a second member. When a direction in which a first bus bar and a second bus bar are aligned is designated as a first direction, a direction in which an end of a conductor protrudes from a shield layer is designated as a second direction, and a direction intersecting the first direction and the second direction is designated as a third direction, then the first member faces the first bus bar and the second bus bar from the third direction. The conduction structure includes: a first conduction part which comes into contact with the shield layer of the first bus bar; a second conduction part which comes into contact with the shield layer of the second bus bar; and a ground connection part which electrically connects the first conduction part and the second conduction part to a ground. The second member is disposed opposite to the first member with respect to the first bus bar and the second bus bar. When assembled to the first member, the second member presses the first bus bar toward the first conduction part and presses the second bus bar toward the second conduction part.SELECTED DRAWING: Figure 2
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Description

Technical Field

[0001] Embodiments of the present invention relate to shield connection components.

Background Art

[0002] A conductive path including a plurality of bus bars has been proposed. This conductive path includes an insulating portion surrounding the outer peripheries of the plurality of bus bars and a shield member surrounding the plurality of bus bars and the insulating portion together.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, when a plurality of bus bars are arranged, if a configuration in which the plurality of bus bars each have a shield layer is assumed, the work for grounding the shield layers of the plurality of bus bars may become complicated.

[0005] One embodiment provides a shield connection component capable of improving workability.

Means for Solving the Problems

[0006] One embodiment is that the shield connection component is a component used in a layout unit including a first bus bar and a second bus bar. Each of the first bus bar and the second bus bar has a conductor, an insulating coating covering the outer periphery of the conductor, and a shield layer covering the outer periphery of the insulating coating. The shield connection component includes a first member, a conduction structure, and a second member. The first member faces the first bus bar and the second bus bar from a third direction when the direction in which the first bus bar and the second bus bar are arranged is defined as a first direction, the direction in which the end of the conductor protrudes from the shield layer is defined as a second direction, and the direction intersecting the first direction and the second direction is defined as a third direction. The conduction structure is disposed between the first bus bar and the first member in the third direction, and includes a first conduction portion that contacts the shield layer of the first bus bar, a second conduction portion that is disposed between the second bus bar and the first member in the third direction and contacts the shield layer of the second bus bar, and a ground connection portion that electrically connects the first conduction portion and the second conduction portion to the ground individually or together. The second member is disposed on the side opposite to the first member with respect to the first bus bar and the second bus bar, and when combined with the first member, presses the first bus bar toward the first conduction portion and presses the second bus bar toward the second conduction portion.

Effect of the Invention

[0007] According to one embodiment, it is possible to provide a shield connection component capable of improving workability.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Mode for Carrying Out the Invention

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the following description, components having the same or similar functions are denoted by the same reference numerals. And duplicate descriptions of those components may be omitted. In the present disclosure, terms are defined as follows. "Connection" is not limited to mechanical connection and may include electrical connection. That is, "connection" is not limited to the case where two elements to be connected are directly connected, and may include the case where two elements to be connected are connected with another element intervening therebetween.

[0010] In the present disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows. The +X direction is the direction in which the end portion 11e of the conductor 11 protrudes from the shield layer 13 described later (see FIG. 3). The -X direction is the direction opposite to the +X direction. When the +X direction and the -X direction are not distinguished, they are simply referred to as the "X direction". The +Y direction and the -Y direction are directions that intersect (e.g., are orthogonal to) the X direction. The +Y direction is the direction from the first shield bus bar 10A to the second shield bus bar 10B described later (see FIG. 2). The -Y direction is the direction opposite to the +Y direction. When the +Y direction and the -Y direction are not distinguished, they are simply referred to as the "Y direction". The +Z direction is a direction that intersects (e.g., is orthogonal to) the X direction and the Y direction. The +Z direction is the direction from the base 30 to the cover 60 described later (see FIG. 2). The -Z direction is the direction opposite to the +Z direction. When the +Z direction and the -Z direction are not distinguished, they are simply referred to as the "Z direction". The Y direction is an example of the "first direction". The X direction is an example of the "second direction". The Z direction is an example of the "third direction".

[0011] (Embodiment) <1. Configuration of the routing unit> FIG. 1 is a perspective view showing the routing unit 1 of the embodiment. The routing unit 1 is a component for electrically connecting a plurality of components (e.g., a plurality of in-vehicle components). The routing unit 1 includes, for example, a plurality of shield bus bars 10, shield connection components 20, and fixing members 71, 72.

[0012] <2. Shield bus bar> First, the shield bus bar 10 will be described. The shield bus bar 10 is a bus bar having a shield structure. Note that the term "shield bus bar" in the present disclosure is for convenience of explanation and does not limit the scope of the invention to a specific structure.

[0013] FIG. 2 is a perspective view showing a part of the policy-making unit 1 disassembled. In the present embodiment, the plurality of shield busbars 10 includes a first shield busbar 10A and a second shield busbar 10B. The first shield busbar 10A is an example of the "first busbar". The second shield busbar 10B is an example of the "second busbar".

[0014] The first shield busbar 10A and the second shield busbar 10B, for example, have the same shape as each other. However, the first shield busbar 10A and the second shield busbar 10B may have different shapes from each other. Hereinafter, when the first shield busbar 10A and the second shield busbar 10B are not distinguished, they are simply referred to as "shield busbar 10".

[0015] FIG. 3 is a perspective view showing an end portion 10e of the shield busbar 10. FIG. 4 is a cross-sectional view taken along line F4-F4 of the shield busbar 10 shown in FIG. 3. The shield busbar 10 includes, for example, a conductor 11, an insulating coating 12, and a shield layer 13.

[0016] <2.1 Conductor> The conductor 11 forms a conductive path through which current or a signal flows in the shield busbar 10. The conductor 11 is, for example, made of metal. The conductor 11 is, for example, a prismatic member having a flat rectangular cross-sectional shape.

[0017] As shown in FIG. 4, the conductor 11 has a first main surface 11s1, a second main surface 11s2, a first side surface 11s3, and a second side surface 11s4. The first main surface 11s1 is located at the end portion of the conductor 11 on the -Z direction side. The first main surface 11s1 is a plane along the X direction and the Y direction. The second main surface 11s2 is located at the end portion of the conductor 11 on the +Z direction side. The second main surface 11s2 is a plane along the X direction and the Y direction. The first side surface 11s3 is located at the end portion of the conductor 11 on the -Y direction side. The first side surface 11s3 is a plane along the X direction and the Z direction. The second side surface 11s4 is located at the end portion of the conductor 11 on the +Y direction side. The second side surface 11s4 is a plane along the X direction and the Z direction. In the present embodiment, the first main surface 11s1 and the second main surface 11s2 are larger than the first side surface 11s3 and the second side surface 11s4.

[0018] As shown in FIG. 3, the conductor 11 has an end portion 11e as an end portion on the +X direction side. The end portion 11e of the conductor 11 protrudes in the +X direction from an end portion 12e of an insulating film 12 described later. The end portion 11e is not covered with the insulating film 12 and the shield layer 13, and is exposed outside the shield bus bar 10.

[0019] As shown in FIG. 1, the end portion 11e is connected to a terminal T of an external component MC. The external component MC is a component that is an electrical connection destination of the wiring unit 1. The end portion 11e has a through hole 11h. A fixing member 71 for fixing the end portion 11e to the terminal T is passed through the through hole 11h. The fixing member 71 is a fastening member such as a bolt, for example.

[0020] <2.2 Insulating Film> Returning to FIGS. 3 and 4, the insulating film 12 will be described. The insulating film 12 is an insulating member that covers the outer periphery of the conductor 11. The insulating film 12 is made of, for example, a synthetic resin. The insulating film 12 covers the outer periphery of the conductor 11 having a flat rectangular cross-sectional shape so as to surround the entire circumference of the cross-sectional shape. The insulating film 12 has an end portion 12e as an end portion on the +X direction side. The end portion 12e of the insulating film 12 is not covered with the shield layer 13, and is exposed outside the shield bus bar 10.

[0021] <2.3 Shield Layer> The shield layer 13 is a shield portion that covers the outer periphery of the insulating film 12. The shield layer 13 is, for example, a shield portion for noise reduction. The shield layer 13 is, for example, a braid, a mesh structure, or a metal foil, etc., but is not limited thereto. In the present embodiment, the shield layer 13 is integrated with the conductor 11 and the insulating film 12. The shield layer 13 covers the outer periphery of the insulating film 12 so as to surround the entire circumference of the cross-sectional shape with respect to the conductor 11 having a flat rectangular cross-sectional shape, for example.

[0022] As shown in FIG. 4, the shield layer 13 has a first main surface portion 13s1, a second main surface portion 13s2, a first side surface portion 13s3, and a second side surface portion 13s4.

[0023] The first main surface portion 13s1 is located at the end portion on the -Z direction side in the shield layer 13. The first main surface portion 13s1 is a flat portion along the X direction and the Y direction. The first main surface portion 13s1 is a flat portion along the first main surface 11s1 of the conductor 11.

[0024] The second main surface portion 13s2 is located at the end portion on the +Z direction side in the shield layer 13. The second main surface portion 13s2 is a flat portion along the X direction and the Y direction. The second main surface portion 13s2 is a flat portion along the second main surface 11s2 of the conductor 11.

[0025] The first side surface portion 13s3 is located at the end portion on the -Y direction side in the shield layer 13. The first side surface portion 13s3 is a flat portion along the X direction and the Z direction. The first side surface portion 13s3 is a flat portion along the first side surface 11s3 of the conductor 11.

[0026] The second side surface portion 13s4 is located at the end portion on the +Y direction side in the shield layer 13. The second side surface portion 13s4 is a flat portion along the X direction and the Z direction. The second side surface portion 13s4 is a flat portion along the second side surface 11s4 of the conductor 11.

[0027] In the present disclosure, the "flat portion" is not limited to a flat portion in a strict sense, and may include a portion that can be regarded as flat when viewed macroscopically. For example, even a portion formed by a braided or mesh structure and having small steps, depressions, or voids may correspond to an example of the "flat portion" in the present disclosure.

[0028] The shield layer 13 has an end portion 13e as an end portion on the +X direction side. The end portion 13e of the shield layer 13 is located on the -X direction side compared to the end portion 12e of the insulating coating 12. The shield layer 13 is exposed outside the shield bus bar 10.

[0029] <2.4 Shape of Shield Bus Bar> In the present embodiment, the shield bus bar 10 has an end portion 10e as an end portion on the +X direction side. The end portion 10e of the shield bus bar 10 includes, for example, the end portion 11e of the conductor 11, the end portion 12e of the insulating coating 12, and the end portion 13e of the shield layer 13. In the present embodiment, the end portion 10e of the shield bus bar 10 extends linearly in the X direction.

[0030] <2.5 Arrangement Structure of Two Shield Bus Bars> As shown in FIG. 2, the first shield bus bar 10A and the second shield bus bar 10B are arranged side by side in the Y direction. The first shield bus bar 10A and the second shield bus bar 10B are arranged side by side in the Y direction with, for example, the short sides included in the flat rectangular cross-sectional shape of the conductor 11 facing each other.

[0031] In the present disclosure, the statement that "the first bus bar and the second bus bar are arranged in the first direction" is not limited to the case where the first bus bar and the second bus bar are arranged in the first direction over the entire lengths of the first bus bar and the second bus bar. The statement that "the first bus bar and the second bus bar are arranged in the first direction" may include a case where a part of the first bus bar (for example, the end portion 10e on the +X direction side) and a part of the second bus bar (for example, the end portion 10e on the +X direction side) are arranged in the first direction, but another part of the first bus bar and another part of the second bus bar are not arranged in the first direction.

[0032] <3. Shield connection component> Next, referring to FIG. 2, the shield connection component 20 will be described. The shield connection component 20 is a component for grounding the shield layers 13 of a plurality of shield busbars 10. The shield connection component 20 has, for example, a base 30, a conduction structure 40, and a cover 60.

[0033] <3.1 Base> The base 30 is a member facing the plurality of shield busbars 10 from the -Z direction. The base 30 is an example of the "first member". The base 30 is formed of an insulating material such as synthetic resin, for example. The base 30 includes, for example, a first main wall portion 31, a first side wall portion 32, a second side wall portion 33, and a standing wall portion 34. The base 30 is open on the +Z direction side.

[0034] (First main wall portion) The first main wall portion 31 is a wall portion facing the plurality of shield busbars 10 (the first shield busbar 10A and the second shield busbar 10B) from the -Z direction. The first main wall portion 31 is, for example, a wall portion along the X direction and the Y direction. The first main wall portion 31 includes a first region R1 and a second region R2.

[0035] The first region R1 is a portion facing the first shield busbar 10A from the -Z direction. The first region R1 defines the -Z direction side surface of the first accommodation portion S1 of the shield connection component 20. The first accommodation portion S1 is a space portion in the shield connection component 20 where the first shield busbar 10A is arranged.

[0036] The second region R2 is located on the +Y direction side of the first region R1. The second region R2 faces the second shield busbar 10B from the -Z direction. The second region R2 defines the -Z direction side surface of the second accommodation portion S2 of the shield connection component 20. The second accommodation portion S2 is a space portion in the shield connection component 20 where the second shield busbar 10B is arranged.

[0037] In this embodiment, the first region R1 has a first portion 31a and a second portion 31b. The first portion 31a faces the end portion 12e of the insulating coating 12 of the first shield bus bar 10A from the -Z direction. The second portion 31b faces the end portion 13e of the shield layer 13 of the first shield bus bar 10A from the -Z direction. The second portion 31b is provided offset in the -Z direction with respect to the first portion 31a such that the first accommodating portion S1 expands in the -Z direction side. A step portion ST1 in the Z direction is formed at the boundary between the first portion 31a and the second portion 31b. The step portion ST1 extends in the Y direction at a position corresponding to the end 13ea on the +X direction side of the shield layer 13 of the first shield bus bar 10A.

[0038] Similarly, the second region R2 has a third portion 31c and a fourth portion 31d. The third portion 31c faces the end portion 12e of the insulating coating 12 of the second shield bus bar 10B from the -Z direction. The fourth portion 31d faces the end portion 13e of the shield layer 13 of the second shield bus bar 10B from the -Z direction. The fourth portion 31d is provided offset in the -Z direction with respect to the third portion 31c such that the second accommodating portion S2 expands in the -Z direction side. A step portion ST2 in the Z direction is formed at the boundary between the third portion 31c and the fourth portion 31d. The step portion ST2 extends in the Y direction at a position corresponding to the end 13ea on the -X direction side of the shield layer 13 of the second shield bus bar 10B.

[0039] (First side wall portion) The first side wall portion 32 is a wall portion that protrudes in the +Z direction from the end portion on the -Y direction side of the first main wall portion 31. The first side wall portion 32 defines the end portion on the -Y direction side of the base 30. The first side wall portion 32 extends along the X direction and the Z direction. The first side wall portion 32 has, for example, a first engaging portion 35 that engages with the third side wall portion 62 of a cover 60 described later. The first engaging portion 35 is, for example, a claw portion that protrudes in the -Y direction.

[0040] (Second side wall portion) The second side wall portion 33 is a wall portion that protrudes in the +Z direction from the end portion on the +Y direction side of the first main wall portion 31. The second side wall portion 33 defines the end portion on the +Y direction side of the base 30. The second side wall portion 33 extends along the X direction and the Z direction. The second side wall portion 33 has, for example, a second engaging portion 36 that engages with the fourth side wall portion 63 of the cover 60 described later. The second engaging portion 36 is, for example, a claw portion that protrudes in the +Y direction.

[0041] (Upright wall portion) The upright wall portion 34 is a wall portion that protrudes in the +Z direction from the central portion in the Y direction of the first main wall portion 31. The upright wall portion 34 is located between the first region R1 and the second region R2 of the first main wall portion 31. The upright wall portion 34 extends along the X direction and the Z direction. The upright wall portion 34 forms part or all of the insulating wall WI of the shield connection component 20. The insulating wall WI is a partition wall that partitions the inside of the shield connection component 20 into a first accommodation portion S1 and a second accommodation portion S2 so that the first shield bus bar 10A and the second shield bus bar 10B do not come into contact with each other.

[0042] <3.2 Conductive structure> The conductive structure 40 is a structure that electrically connects the shield layers 13 of the plurality of shield bus bars 10 to the ground. The conductive structure 40 includes, for example, a first conductive portion 41, a second conductive portion 42, and a ground connection portion 43.

[0043] (First conductive portion) The first conductive portion 41 is a conductive portion that contacts the end portion 13e of the shield layer 13 of the first shield bus bar 10A. The first conductive portion 41 is made of metal. The first conductive portion 41 is provided, for example, on the inner surface of the first main wall portion 31 of the base 30. For example, the first conductive portion 41 is provided in the first region R1 of the first main wall portion 31. For example, the first conductive portion 41 is disposed adjacent to the step portion ST1 of the first region R1 from the -X direction side. The first conductive portion 41 is disposed between the first main wall portion 31 of the base 30 and the shield layer 13 of the first shield bus bar 10A in the Z direction. The first conductive portion 41 contacts the end portion 13e of the shield layer 13 of the first shield bus bar 10A from the -Z direction.

[0044] The first conduction part 41 has a first leaf spring structure 51. The first leaf spring structure 51 is elastically deformable in the Z direction. The first leaf spring structure 51 contacts the first main surface part 13s1 of the shield layer 13 of the first shield bus bar 10A from the -Z direction.

[0045] In the present embodiment, the first leaf spring structure 51 includes a plurality of leaf spring parts 51a. Each of the plurality of leaf spring parts 51a includes an arc part curved so as to be convex on the +Z direction side and is elastically deformable in the Z direction. The plurality of leaf spring parts 51a are arranged side by side in the Y direction, for example. The plurality of leaf spring parts 51a respectively contact the first main surface part 13s1 of the shield layer 13 of the first shield bus bar 10A from the -Z direction.

[0046] (Second conduction part) The second conduction part 42 is a conduction part that contacts the end part 13e of the shield layer 13 of the second shield bus bar 10B. The second conduction part 42 is made of metal. The second conduction part 42 is provided on the inner surface of the first main wall part 31 of the base 30, for example. For example, the second conduction part 42 is provided in the second region R2 of the first main wall part 31. The second conduction part 42 is arranged adjacent to the step part ST2 of the second region R2 from the -X direction side, for example. The second conduction part 42 is arranged between the first main wall part 31 of the base 30 and the shield layer 13 of the second shield bus bar 10B in the Z direction. The second conduction part 42 contacts the end part 13e of the shield layer 13 of the second shield bus bar 10B from the -Z direction.

[0047] The second conduction part 42 has a second leaf spring structure 52. The second leaf spring structure 52 is elastically deformable in the Z direction. The second leaf spring structure 52 contacts the first main surface part 13s1 of the shield layer 13 of the second shield bus bar 10B from the -Z direction.

[0048] In this embodiment, the second leaf spring structure 52 includes a plurality of leaf spring portions 52a. Each of the plurality of leaf spring portions 52a includes an arc portion curved so as to be convex toward the +Z direction side and is elastically deformable in the Z direction. The plurality of leaf spring portions 52a are arranged side by side in the Y direction, for example. The plurality of leaf spring portions 52a are each in contact with the first main surface portion 13s1 of the shield layer 13 of the second shield bus bar 10B from the -Z direction.

[0049] (Ground connection portion) The ground connection portion 43 is an electrical connection portion that electrically connects the first conduction portion 41 and the second conduction portion 42 to the ground individually or together. In this embodiment, the ground connection portion 43 electrically connects the first conduction portion 41 and the second conduction portion 42 to the ground individually. The ground connection portion 43 has, for example, a first terminal 43a, a second terminal 43b, a first lead wire 43c, and a second lead wire 43d.

[0050] The first terminal 43a is physically and electrically connected to the attachment portion TP (see FIG. 1, for example, a boss of a vehicle body panel) of the external member MB having a ground potential. The first terminal 43a is, for example, a metal ring. The first terminal 43a has, for example, a through hole 43h. A fixing member 72 for fixing the first terminal 43a to the attachment portion TP is passed through the through hole 43h. The fixing member 72 is a fastening member such as a bolt, for example.

[0051] The second terminal 43b is physically and electrically connected to the attachment portion TP (see FIG. 1, for example, a boss of a vehicle body panel) of the external member MB having a ground potential. The second terminal 43b is, for example, a metal ring. The second terminal 43b has, for example, a through hole 43h. A fixing member 72 for fixing the second terminal 43b to the attachment portion TP is passed through the through hole 43h.

[0052] The first lead wire 43c extends between the first terminal 43a and the first conduction portion 41. The first lead wire 43c electrically connects the first terminal 43a and the first conduction portion 41. The first conduction portion 41 is electrically connected to the attachment portion TP of the external member MB via the first lead wire 43c and the first terminal 43a.

[0053] The second lead wire 43d extends between the second terminal 43b and the second conduction part 42. The second lead wire 43d electrically connects the second terminal 43b and the second conduction part 42. The second conduction part 42 is electrically connected to the attachment part TP of the external member MB via the second lead wire 43d and the second terminal 43b.

[0054] <3.3 Cover> The cover 60 is a member disposed on the side opposite to the base 30 with respect to the plurality of shield busbars 10. The cover 60 faces the plurality of shield busbars 10 in the +Z direction. The cover 60 is an example of the "second member". The cover 60 is formed of an insulating material such as synthetic resin, for example. When the cover 60 is combined with the base 30 (for example, when engaged with the base 30), the end portion 13e of the shield layer 13 of the first shield busbar 10A is pressed toward the first conduction part 41, and the end portion 13e of the shield layer 13 of the second shield busbar 10B is pressed toward the second conduction part 42. The cover 60 includes, for example, a second main wall portion 61, a third side wall portion 62, a fourth side wall portion 63, and a standing wall portion 64. The cover 60 is open on the -Z direction side.

[0055] (Second main wall portion) The second main wall portion 61 is a wall portion that faces the plurality of shield busbars 10 (the first shield busbar 10A and the second shield busbar 10B) in the +Z direction. The second main wall portion 61 is, for example, a wall portion along the X direction and the Y direction. The second main wall portion 61 includes a third region R3 and a fourth region R4. The third region R3 is a portion that faces the first shield busbar 10A in the +Z direction. The third region R3 defines the +Z direction side surface of the first accommodation portion S1. The fourth region R4 is located on the +Y direction side of the third region R3. The fourth region R4 faces the second shield busbar 10B in the +Z direction. The fourth region R4 defines the +Z direction side surface of the second accommodation portion S2.

[0056] In this embodiment, the third region R3 has a first portion 61a and a second portion 61b. Further, the fourth region R4 has a third portion 61c and a fourth portion 61d. Note that for the details of the first portion 61a, the second portion 61b, the third portion 61c, and the fourth portion 61d, in the descriptions of the first portion 31a, the second portion 31b, the third portion 31c, and the fourth portion 31d described above, “-Z direction” may be read as “+Z direction”.

[0057] As shown in FIG. 5, in this embodiment, the second portion 61b is provided offset in the +Z direction with respect to the first portion 61a such that the first accommodating portion S1 expands toward the +Z direction side. A step portion ST1 in the Z direction is formed at the boundary between the first portion 61a and the second portion 61b. The step portion ST1 extends in the Y direction at a position corresponding to the +X direction side end 13ea of the shield layer 13 of the first shield bus bar 10A. The positioning of the first shield bus bar 10A can be performed, for example, by arranging the end 13ea of the shield layer 13 of the first shield bus bar 10A along the step portion ST1.

[0058] Similarly, the fourth portion 61d is provided offset in the +Z direction with respect to the third portion 61c such that the second accommodating portion S2 expands toward the +Z direction side. A step portion ST2 in the Z direction is formed at the boundary between the third portion 61c and the fourth portion 61d. The step portion ST2 extends in the Y direction at a position corresponding to the +X direction side end 13ea of the shield layer 13 of the second shield bus bar 10B. The positioning of the second shield bus bar 10B can be performed, for example, by arranging the end 13ea of the shield layer 13 of the second shield bus bar 10B along the step portion ST2.

[0059] (Third side wall portion) Returning to FIG. 2, the third side wall portion 62 will be described. The third side wall portion 62 is a wall portion protruding in the -Z direction from the end portion on the -Y direction side of the second main wall portion 61. The third side wall portion 62 extends along the X direction and the Z direction. The third side wall portion 62 is adjacent to, for example, the first side wall portion 32 from the -Y direction side. The third side wall portion 62 has an engaging portion 65 that engages with the first side wall portion 32. The engaging portion 65 is, for example, an engaging hole with which the engaging portion 35 of the base 30 that is a claw portion engages. When the engaging portion 65 of the cover 60 and the engaging portion 35 of the base 30 engage with each other, the base 30 and the cover 60 are combined such that the second main wall portion 61 presses the plurality of shield busbars 10 toward the conduction structure 40.

[0060] (Fourth side wall portion) The fourth side wall portion 63 is a wall portion protruding in the -Z direction from the end portion on the +Y direction side of the second main wall portion 61. The fourth side wall portion 63 extends along the X direction and the Z direction. The fourth side wall portion 63 is adjacent to, for example, the second side wall portion 33 from the +Y direction side. The fourth side wall portion 63 has an engaging portion 66 that engages with the second side wall portion 33. The engaging portion 66 is, for example, an engaging hole with which the engaging portion 36 of the base 30 that is a claw portion engages. When the engaging portion 66 of the cover 60 and the engaging portion 36 of the base 30 engage with each other, the base 30 and the cover 60 are combined such that the second main wall portion 61 presses the plurality of shield busbars 10 toward the conduction structure 40.

[0061] (Upright wall portion) The upright wall portion 64 is a wall portion that stands up in the -Z direction from the central portion in the Y direction of the second main wall portion 61. The upright wall portion 64 is located between the third region R3 and the fourth region R4 of the second main wall portion 61. The upright wall portion 64 extends along the X direction and the Z direction. The upright wall portion 64 forms part or all of the insulating wall WI. In the present embodiment, the insulating wall WI is formed by combining the upright wall portion 64 of the cover 60 and the upright wall portion 34 of the base 30. Instead of the above example, the insulating wall WI may be formed only by the upright wall portion 34 of the base 30, or may be formed only by the upright wall portion 64 of the cover 60.

[0062] <3.4 Additional waterproof treatment> In addition to the above-described configuration, the shield connection component 20 may have a waterproof treatment portion WP (see FIG. 5). The waterproof treatment portion WP is a portion where waterproof treatment for suppressing corrosion of the conduction structure 40 is performed. The waterproof treatment portion WP is formed between the base 30 and the cover 60 by injecting a potting material therebetween. For example, the waterproof treatment portion WP is formed by injecting a potting material between the base 30 and the cover 60 through an injection hole 85 provided in the base 30 or the cover 60.

[0063] <4. Assembly Method of Shield Connection Component> Next, an assembly method of the shield connection component 20 will be described. First, with the base 30 and the cover 60 separated, the first shield bus bar 10A and the second shield bus bar 10B are placed inside the base 30.

[0064] Next, the cover 60 is combined with the base 30. For example, the plurality of shield bus bars 10 are pressed toward the conduction structure 40 by the second main wall portion 61 of the cover 60, and with the first leaf spring structure 51 and the second leaf spring structure 52 elastically deformed, the engaging portions 35, 36 of the base 30 and the engaging portions 65, 66 of the cover 60 are engaged. By this operation, the shield connection component 20 is assembled in a state where the contact pressure between the first shield bus bar 10A and the first conduction portion 41 is ensured and the contact pressure between the second shield bus bar 10B and the second conduction portion 42 is ensured.

[0065] <5. Advantages> As a comparative example, consider a configuration in which a plurality of bus bars each have an individual shield layer and grounding components are individually attached to the shield layers of the plurality of bus bars. In the configuration of this comparative example, the operation of individually attaching grounding components to the shield layers of the plurality of bus bars becomes complicated, and there is a possibility that workability decreases.

[0066] On the one hand, in the present embodiment, the shield connection component 20 includes a base 30, a conduction structure 40, and a cover 60. The base 30 faces the first shield bus bar 10A and the second shield bus bar 10B from the Z direction. The conduction structure 40 has a first conduction part 41, a second conduction part 42, and a ground connection part 43. The first conduction part 41 is disposed between the first shield bus bar 10A and the base 30 in the Z direction and contacts the shield layer 13 of the first shield bus bar 10A. The second conduction part 42 is disposed between the second shield bus bar 10B and the base 30 in the Z direction and contacts the shield layer 13 of the second shield bus bar 10B. The ground connection part 43 electrically connects the first conduction part 41 and the second conduction part 42 to the ground individually or together. The cover 60 is disposed on the side opposite to the base 30 with respect to the first shield bus bar 10A and the second shield bus bar 10B. When combined with the base 30, the cover 60 presses the first shield bus bar 10A toward the first conduction part 41 and presses the second shield bus bar 10B toward the second conduction part 42.

[0067] According to such a configuration, even when the plurality of shield bus bars 10 each have a shield layer 13 individually, the operation of grounding those shield layers 13 can be performed collectively. When such an operation can be performed, compared with the case of attaching grounding components individually, the operation of grounding the shield layers 13 of the plurality of shield bus bars 10 can be easily performed. When the operation of grounding the shield layers 13 of the plurality of shield bus bars 10 can be easily performed, the workability can be improved.

[0068] In the present embodiment, the first conduction part 41 has a first leaf spring structure 51 that is elastically deformable in the Z direction. The second conduction part 42 has a second leaf spring structure 52 that is elastically deformable in the Z direction. According to such a configuration, it becomes easy to appropriately ensure the contact pressure between the shield layer 13 of the first shield bus bar 10A and the first conduction part 41 and to appropriately ensure the contact pressure between the shield layer 13 of the second shield bus bar 10B and the second conduction part 42.

[0069] In this embodiment, the shield layer 13 of the first shield bus bar 10A has a first main surface portion 13s1 (first flat portion) along the X direction and the Y direction. The shield layer 13 of the second shield bus bar 10B has a first main surface portion 13s1 (second flat portion) along the X direction and the Y direction. The first leaf spring structure 51 includes a plurality of leaf spring portions 51a that are each elastically deformable in the Z direction and contact the first main surface portion 13s1 of the first shield bus bar 10A. Further, the second leaf spring structure 52 includes a plurality of leaf spring portions 52a that are each elastically deformable in the Z direction and contact the first main surface portion 13s1 of the second shield bus bar 10B. According to such a configuration, by utilizing the configuration of the shield bus bar 10 having a flat portion, it becomes easy to ensure contact between the shield layer 13 of the first shield bus bar 10A and the first conduction portion 41, and it becomes easy to ensure contact between the shield layer 13 of the second shield bus bar 10B and the second conduction portion 42.

[0070] In this embodiment, at least one of the base 30 and the cover 60 has an insulating wall WI that partitions the inside of the shield connection component 20 into a first accommodation portion S1 in which the first shield bus bar 10A is arranged and a second accommodation portion S2 in which the second shield bus bar 10B is arranged. According to such a configuration, it is possible to more reliably avoid contact between the first shield bus bar 10A and the second shield bus bar 10B. Further, when the insulating wall WI is provided, the arrangement interval between the first shield bus bar 10A and the second shield bus bar 10B can be appropriately maintained. When the arrangement interval can be appropriately maintained, the heat dissipation performance of the first shield bus bar 10A and the second shield bus bar 10B can be improved.

[0071] <6. Modification Example> Next, some modification examples of the embodiment will be described. Note that the configurations other than those described below in each modification example are the same as the configurations of the above-described embodiment.

[0072] <6.1 First Modification Example> FIG. 6 is a perspective view showing a part of the shield connection component 20A of the first modified example. In this modified example, the first conduction part 41 and the second conduction part 42 are connected. The first conduction part 41 and the second conduction part 42 are connected via a connection part 44, for example. The connection part 44 extends between the first conduction part 41 and the second conduction part 42 through the standing wall part 34 of the base 30 in the Y direction, for example. The first conduction part 41, the second conduction part 42, and the connection part 44 are formed of one metal member M. The metal member M and the base 30 are integrally formed by insert molding, for example. Note that, instead of passing through the standing wall part 34, the connection part 44 may be provided so as to bypass the standing wall part 34, similar to the second modified example described later.

[0073] In this modified example, the ground connection part 43 has one terminal 43b and one lead wire 43d. In this modified example, the ground connection part 43 electrically connects the first conduction part 41 and the second conduction part 42 to the ground together by electrically connecting the second conduction part 42 to the ground.

[0074] According to such a configuration, the work becomes easier compared with the case where the ground connection part 43 has a plurality of terminals 43a, 43b.

[0075] <6.2 Second Modified Example> FIG. 7 is a perspective view showing a part of the shield connection component 20B of the second modified example. In this modified example, the first conduction part 41 and the second conduction part 42 are connected via a connection part 44. The connection part 44 is provided so as to bypass the standing wall part 34. Note that, instead of bypassing the standing wall part 34, the connection part 44 may connect the first conduction part 41 and the second conduction part 42 by passing through the standing wall part 34 in the Y direction, similar to the first modified example described above.

[0076] In this modification example, at least one of the base 30 or the cover 60 has a fixing portion 81 for fixing the shield connection component 20 to the external member MB. FIG. 7 shows an example in which the fixing portion 81 is provided on the base 30. The fixing portion 81, for example, protrudes in the +Y direction from the second side wall portion 33. The fixing portion 81 has a mounting surface 81a that contacts the external member MB. The fixing portion 81 has a through hole 81h. The through hole 81h penetrates the fixing portion 81 in the Z direction. A fixing member 91 for fixing the fixing portion 81 to the external member MB is passed through the through hole 81h. The fixing member 91 is, for example, a fastening member such as a bolt.

[0077] FIG. 8 is a perspective view showing the back surface of the base 30 of the second modification example. In this modification example, the ground connection portion 43 is provided on the mounting surface 81a. For example, the ground connection portion 43 is formed by one metal member M (see FIG. 7) together with the first conduction portion 41, the second conduction portion 42, and the connecting portion 44. The ground connection portion 43 is provided on the mounting surface 81a and is exposed in the -Z direction. The ground connection portion 43 is electrically connected to the external member MB in contact with the external member MB when the fixing portion 81 is fixed to the external member MB by the fixing member 91. The ground connection portion 43 is electrically connected to the ground via the external member MB.

[0078] According to such a configuration, by performing the operation of fixing the shield connection component 20B to the external member MB, the ground connection portion 43 can be electrically connected to the ground.

[0079] <6.3 Third Modification Example> FIG. 9 is a diagram showing a cross section of the shield connection component 20C of the third modification example. In this modification example, the shield layer 13 of the shield bus bar 10 is a braided or mesh structure or the like and has a plurality of depressions or voids or the like.

[0080] In this modification example, at least one of the base 30 and the cover 60 includes a plurality of first protrusions 101 and a plurality of second protrusions 102. In the example shown in FIG. 9, each of the base 30 and the cover 60 includes a plurality of first protrusions 101 and a plurality of second protrusions 102.

[0081] The plurality of first protrusions 101 protrude from the first main wall portion 31 or the second main wall portion 61 toward the inside of the shield connection component 20C. The plurality of first protrusions 101 are arranged at equal intervals, for example, in the X direction and the Y direction. The plurality of first protrusions 101 bite into the end portion 13e of the shield layer 13 of the first shield bus bar 10A from the Z direction.

[0082] The plurality of first protrusions 101 include, for example, two or more first protrusions 101 arranged at different positions with respect to the Y direction. In the present disclosure, "arranged at different positions with respect to the Y direction" is not limited to the case of being arranged in the Y direction, and may also include the case of being arranged at positions obliquely shifted with respect to the Y direction. These two or more first protrusions 101 bite into the first main surface portion 13s1 or the second main surface portion 13s2 of the shield layer 13 of the first shield bus bar 10A.

[0083] Similarly, the plurality of second protrusions 102 protrude from the first main wall portion 31 or the second main wall portion 61 toward the inside of the shield connection component 20C. The plurality of second protrusions 101 are arranged at equal intervals, for example, in the X direction and the Y direction. The plurality of second protrusions 102 bite into the end portion 13e of the shield layer 13 of the second shield bus bar 10B from the Z direction.

[0084] In this modification, the plurality of second protrusions 102 include two or more second protrusions 102 arranged at different positions with respect to the Y direction. These two or more second protrusions 102 bite into the first main surface portion 13s1 or the second main surface portion 13s2 of the shield layer 13 of the second shield bus bar 10B.

[0085] As described above, in this modification, the shield connection component 20C includes the first protrusions 101 that bite into the shield layer 13 of the first shield bus bar 10A and the second protrusions 102 that bite into the shield layer 13 of the second shield bus bar 10B. According to such a configuration, the positioning and / or suppression of displacement of the shield bus bar 10 can be performed by the first protrusions 101 and the second protrusions 101.

[0086] In this modified example, two or more first protrusions 101 arranged at different positions in the Y direction bite into the first main surface portion 13s1 or the second main surface portion 13s2 of the shield layer 13 of the first shield bus bar 10A. Further, two or more second protrusions 102 arranged at different positions in the Y direction bite into the first main surface portion 13s1 or the second main surface portion 13s2 of the shield layer 13 of the second shield bus bar 10B. According to such a configuration, by utilizing the configuration of the shield bus bar 10 having a flat surface portion, the positioning of the first shield bus bar 10A and the second shield bus bar 10B and / or the suppression of displacement can be performed more firmly.

[0087] Here, when attempting to provide two or more such protrusions in a base or cover corresponding to a cylindrical shield cable, all the protrusions will be provided toward the center of the conductor. In this case, since an undercut problem occurs in the molding of the base or cover, it becomes difficult to provide the protrusions as described above. On the other hand, in the present embodiment, since the protrusions 101 and 102 are provided on the base 30 or the cover 60 corresponding to the shield bus bar 10 including the rectangular conductor 11, it becomes easier to form the protrusions 101 and 102.

[0088] The embodiments and a plurality of modified examples have been described above. However, the embodiments and modified examples are not limited to the examples described above. For example, a plurality of modified examples may be combined with each other for implementation. Further, in the above-described embodiment, the engaging portions 35 and 36 of the base 30 are claw portions, and the engaging portions 65 and 66 of the cover 60 are engaging holes. Instead of this, the engaging portions 65 and 66 of the cover 60 may be claw portions, and the engaging portions 35 and 36 of the base 30 may be engaging holes.

Description of Reference Numerals

[0089] 1... Wiring unit 10... Shield bus bar 10A... First shield bus bar (first bus bar) 10B... Second shield bus bar (second bus bar) 11... Conductor 12... Insulating coating 13… Shield layer 20, 20A, 20B, 20C… Shield connection parts 30… Base (first member) 40… Conductive structure 41… First conductive part 42… Second conductive part 43… Ground connection part 44… Connecting part 51… First leaf spring structure 51a… Leaf spring part 52… Second leaf spring structure 52a… Leaf spring part 60… Cover (second member) 81… Fixing part 81a… Mounting surface S1… First accommodating part S2… Second accommodating part WI… Insulating wall

Claims

1. A shield connection component used in a wiring unit including a first bus bar and a second bus bar, wherein each of the first bus bar and the second bus bar has a conductor, an insulating coating covering the outer periphery of the conductor, and a shield layer covering the outer periphery of the insulating coating, the shield connection component includes when the direction in which the first bus bar and the second bus bar are arranged is defined as a first direction, the direction in which the end portion of the conductor protrudes from the shield layer is defined as a second direction, and the direction intersecting the first direction and the second direction is defined as a third direction, a first member facing the first bus bar and the second bus bar from the third direction, a first conduction part arranged between the first bus bar and the first member in the third direction and contacting the shield layer of the first bus bar, a second conduction part arranged between the second bus bar and the first member in the third direction and contacting the shield layer of the second bus bar, and a ground connection part for electrically connecting the first conduction part and the second conduction part to the ground individually or together, a second member arranged on the side opposite to the first member with respect to the first bus bar and the second bus bar, and when combined with the first member, pressing the first bus bar toward the first conduction part and pressing the second bus bar toward the second conduction part, a shield connection component provided with the above.

2. The first conduction part has a first leaf spring structure that can be elastically deformed in the third direction, The second conduction part has a second leaf spring structure that can be elastically deformed in the third direction, The shield connection component according to Claim 1.

3. The shield layer of the first bus bar has a first flat part along the first direction and the second direction, The shield layer of the second bus bar has a second flat part along the first direction and the second direction, The first leaf spring structure includes a plurality of leaf spring parts that can be elastically deformed in the third direction and contact the first flat part, The second leaf spring structure includes a plurality of leaf spring parts that can be elastically deformed in the third direction and contact the second flat part, The shield connection component according to Claim 2.

4. At least one of the first member and the second member has an insulating wall that partitions the inside of the shield connection component into a first accommodation part where the first bus bar is arranged and a second accommodation part where the second bus bar is arranged, The shield connection component according to Claim 1 or Claim 2.

5. The first conduction part and the second conduction part are connected. The ground connection part electrically connects the second conduction part to the ground, thereby electrically connecting the first conduction part and the second conduction part together to the ground. The shield connection component according to claim 1 or claim 2.

6. At least one of the first member and the second member has a fixing part for fixing the shield connection component to an external member. The fixing part has a mounting surface that contacts the external member. The ground connection part is provided on the mounting surface. The shield connection component according to claim 1 or claim 2.

7. At least one of the first member and the second member includes a plurality of first protrusions that bite into the shield layer of the first bus bar and a plurality of second protrusions that bite into the shield layer of the second bus bar. The shield connection component according to claim 1 or claim 2.

8. The shield layer of the first bus bar has a first flat part along the first direction and the second direction. The shield layer of the second bus bar has a second flat part along the first direction and the second direction. The plurality of first protrusions include two or more first protrusions that are arranged at different positions with respect to the first direction and bite into the first flat part. The plurality of second protrusions include two or more second protrusions that are arranged at different positions with respect to the first direction and bite into the second flat part. The shield connection component according to claim 7.

Citation Information

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