Electronic device

Abstract

To provide an electronic device in which cracks are difficult to generate in a laminate.SOLUTION: An electronic device includes: a frame 10 with at least one opening part 11; a laminate 20 having an electrode film 21 and at least one functional film laminated on the electrode film 21; and a resin film 30. The laminate body 20 is arranged in a position overlapping with the opening part 11 when viewed from the lamination direction of the laminate body 20, without overlapping with the frame 10 in the lamination direction of the laminate 20. The resin film 30 bridges the frame 10 and the laminate 20.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to an electronic device that can be used as an antenna or the like.

Background Art

[0002] As a functional material having a function of mutually converting mechanical energy and electrical (magnetic) energy, for example, a piezoelectric material or a magnetostrictive material is known. A piezoelectric material is a material that exhibits a piezoelectric effect of converting an external force into electric power in response to the application of an external force. A magnetostrictive material is a material that exhibits a magnetostrictive effect of converting an external magnetic field into strain in response to the application of an external magnetic field. Such a functional material is thinned and incorporated into an electronic device such as a pressure sensor, a magnetic sensor, an antenna, or an energy conversion device.

[0003] For example, in the electronic device of Patent Document 1, a thin film made of a functional material (hereinafter, a functional film) is laminated on an electrode film having conductivity, and together with the electrode film, a laminate is formed. The laminate is disposed in a frame having an opening and constitutes a vibrating body that can vibrate based on the piezoelectric effect and the magnetostrictive effect.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, when a tensile stress is generated in the laminate due to strain or residual stress, there is a risk that cracks will occur in the laminate, and a technique for preventing this is required.

[0006] The present disclosure provides an electronic device in which cracks are less likely to occur in the laminate.

Means for Solving the Problems

[0007] An electronic device according to an embodiment of the present disclosure includes a frame having at least one opening, a laminate having an electrode film and at least one functional film laminated on the electrode film, and a resin film. The laminate is disposed at a position overlapping the opening when viewed from the lamination direction of the laminate without overlapping the frame in the lamination direction of the laminate. The resin film bridges between the frame and the laminate.

[0008] The laminate may have at least one of a piezoelectric film and a magnetostrictive film as at least one of the functional films.

[0009] The laminate has the piezoelectric film and the magnetostrictive film as at least one of the functional films, and the electrode film, the piezoelectric film, and the magnetostrictive film may be laminated in this order.

[0010] In a first direction perpendicular to the lamination direction, the resin film bridges between the frame and the laminate, and in a second direction perpendicular to the lamination direction and the first direction, a gap may be formed between the laminate and the frame.

[0011] The electronic device further includes a first conductive pattern extending between the laminate and the frame, the first conductive pattern being electrically connected to the laminate and may be bent along the in-plane direction of the resin film.

[0012] The electronic device further includes a second conductive pattern extending between the laminate and the frame at a position different from the first conductive pattern, the second conductive pattern being electrically connected to the laminate and may be bent along the in-plane direction of the resin film.

[0013] The resin film has a bridging portion that bridges between the frame and the laminate in a first direction perpendicular to the lamination direction, and the width of the bridging portion in a second direction perpendicular to the lamination direction and the first direction may be wider than the interval between the laminate and the frame in the first direction.

[0014] In the lamination direction, at least the whole of one end or the other end of the laminate in the first direction may overlap with the resin film.

[0015] In the lamination direction, the whole of the laminate may overlap with the resin film.

[0016] The resin film may cover at least a part of the laminate from one side where at least one of the functional films is located in the lamination direction of the laminate.

Brief Description of Drawings

[0017]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7A

Figure 7B

Figure 8

Figure 9

Figure 10A

Figure 10B

Embodiments for Carrying Out the Invention

[0018] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that the illustrated content is only schematically and exemplarily shown for the purpose of understanding the present disclosure, and the appearance, dimensional ratios, etc. may be different from the actual ones. Also, the present disclosure is not limited to the following embodiments.

[0019] First Embodiment The element 1 of the first embodiment shown in FIG. 1 has a function of mutually converting mechanical energy and electrical (magnetic) energy, and is incorporated into electronic devices such as pressure sensors, magnetic sensors, antennas, and energy conversion devices. Further, these electronic devices are incorporated into electronic devices such as wearable terminals, hearable terminals, and cardiac pacemakers. The element 1 has at least a frame 10, at least one laminate 20 (a plurality of laminates 20 in this embodiment), and a resin film 30.

[0020] The frame 10 is a flat plate-like structure and is made of, for example, an insulating member. The material constituting the frame 10 is not particularly limited, but for example, silicon (Si), glass, magnesium oxide (MgO), strontium titanate (SrTiO 3 ) or lithium niobate (LiNbO 3 ).

[0021] Frame 10 has a first surface 10a, a second surface 10b, a third surface 10c, a fourth surface 10d, a fifth surface 10e, and a sixth surface 10f. The first surface 10a and the second surface 10b are opposed to each other, the third surface 10c and the fourth surface 10d are opposed to each other, and the fifth surface 10e and the sixth surface 10f are opposed to each other.

[0022] In FIG. 1 and the like, an axis along the direction in which the third surface 10c and the fourth surface 10d face each other is defined as the X-axis, an axis along the direction in which the third surface 10c and the fourth surface 10d face each other is defined as the Y-axis, and an axis along the direction in which the first surface 10a and the second surface 10b face each other is defined as the Z-axis. The X-axis, Y-axis, and Z-axis are perpendicular to each other. Hereinafter, the positive direction side of the Z-axis is defined as the upper side, and the negative direction side of the Z-axis is defined as the lower side. However, the upper side in the Z-axis direction does not necessarily coincide with the upper side in the vertical direction. Also, the lower side in the Z-axis direction does not necessarily coincide with the lower side in the vertical direction. Further, with respect to the X-axis and Y-axis, the direction approaching the center of the laminate 20 is defined as the inner side, and the direction away from the center of the laminate 20 is defined as the outer side.

[0023] Frame 10 has at least one opening 11. In the present embodiment, the number of openings 11 is plural, but it may be singular. The plurality of openings 11 are arranged at regular intervals along the X-axis and Y-axis. In the example shown in FIG. 1, the opening 11 is constituted by a through-hole extending from the first surface 10a to the second surface 10b of the frame 10. However, the configuration of the opening 11 is not limited to a through-hole, and the opening 11 may be, for example, a bottomed recess that is recessed downward from the first surface 10a. The plurality of openings 11 are two-dimensionally arranged in the frame 10, but may be arranged one-dimensionally or three-dimensionally.

[0024] The shape of the opening 11 is rectangular in plan view, but it may be square, other polygons, or other shapes (such as circular and elliptical). When the shape of the opening 11 is an n-sided polygon (n is 3 or more) in plan view, at least one of the n corners of the opening 11 may be rounded in plan view.

[0025] The widths of the frame 10 in the X-axis direction and the Y-axis direction are not particularly limited, but are, for example, 1 to 10 mm. The width of the frame 10 in the Z-axis direction is not particularly limited, but is, for example, 0.1 to 1 mm. The Young's modulus of the frame 10 is not particularly limited, but is, for example, 50 to 500 GPa.

[0026] The plurality of laminates 20 are two-dimensionally arranged at positions overlapping the plurality of openings 11 when viewed from the stacking direction of the laminates 20. However, when the plurality of openings 11 are arranged one-dimensionally in the frame 10, the plurality of laminates 20 are arranged one-dimensionally at positions overlapping the plurality of openings 11 when viewed from the stacking direction of the laminates 20.

[0027] As shown in FIG. 2, the laminate 20 has an electrode film 21 and at least one functional film laminated on the electrode film 21. In the present disclosure, the functional film refers to a film composed of a material (hereinafter, a functional material) having at least one of a function of converting electrical energy into mechanical energy, a function of converting magnetic energy into mechanical energy, a function of converting mechanical energy into electrical energy, and a function of converting mechanical energy into magnetic energy. Examples of the functional film include a piezoelectric film composed of a piezoelectric material, a magnetostrictive film composed of a magnetostrictive material, and a film constituting an electrostatically driven oscillator such as a silicon oscillator.

[0028] The laminate 20 has a piezoelectric film 22 and a magnetostrictive film 23 as at least one functional film. The piezoelectric film 22 exhibits a piezoelectric effect of converting an external force into electric power in response to the application of the external force. Further, the piezoelectric film 22 exhibits an inverse piezoelectric effect of converting electric power into strain in response to the application of electric power. The magnetostrictive film 23 exhibits a magnetostrictive effect of converting an external magnetic field into strain in response to the application of the external magnetic field. Further, the magnetostrictive film 23 exhibits an inverse magnetostrictive effect of converting an external force into a magnetic field in response to the application of the external force. The laminate 20 having both the piezoelectric film 22 and the magnetostrictive film 23 exhibits a magnetoelectric effect of converting an external magnetic field into electric power due to the interaction between the magnetostrictive film 23 and the piezoelectric film 22, and constitutes a vibrator capable of vibrating.

[0029] More specifically, when an external magnetic field is applied to the laminate 20, the magnetostrictive film 23 converts the external magnetic field into strain due to the magnetostrictive effect. The strain of the magnetostrictive film 23 propagates to the piezoelectric film 22, and when an external force is applied to the piezoelectric film 22, the piezoelectric film 22 converts the external force into electric power due to the piezoelectric effect. When the external magnetic field applied to the laminate 20 is an alternating magnetic field, the magnetostrictive film 23 vibrates together with the piezoelectric film 22 and the electrode film 21, and the piezoelectric film 22 outputs alternating current power.

[0030] In addition, the laminate 20 having both the piezoelectric film 22 and the magnetostrictive film 23 can also convert electric power into a magnetic field and radiate the magnetic field and electromagnetic waves to the outside due to the interaction between the magnetostrictive film 23 and the piezoelectric film 22. Also in this case, the laminate 20 constitutes a vibratable vibrating body. More specifically, when electric power (electric field) is applied to the piezoelectric film 22 of the laminate 20, the piezoelectric film 22 converts the electric power into strain due to the inverse piezoelectric effect. The strain of the piezoelectric film 22 propagates to the magnetostrictive film 23, and when an external force is applied to the magnetostrictive film 23, the magnetostrictive film 23 converts the external force into a magnetic field due to the inverse magnetostrictive effect. When the electric power (electric field) applied to the piezoelectric film 22 is alternating current power (alternating current field), the piezoelectric film 22 vibrates together with the magnetostrictive film 23 and the electrode film 21, and the magnetostrictive film 23 radiates an alternating magnetic field (electromagnetic wave). In this case, an electronic device having the laminate 20 can be used as, for example, a transmission antenna.

[0031] In the present disclosure, the laminate does not refer only to a portion where all the functional films overlap the electrode film in the Z-axis direction, but also includes a portion where at least one functional film does not overlap the electrode film in the Z-axis direction. Therefore, in FIG. 2, the laminate 20 is composed of the following parts (1) to (3). (1) A portion where the piezoelectric film 22 and the magnetostrictive film 23 overlap the electrode film 21 in the Z-axis direction. (2) A portion where the piezoelectric film 22 overlaps the electrode film 21 while the magnetostrictive film 23 does not overlap in the Z-axis direction. (3) A portion where neither the piezoelectric film 22 nor the magnetostrictive film 23 overlaps the electrode film 21 in the Z-axis direction. Although detailed illustration is omitted, in other embodiments, in the (4) Z-axis direction, when there is a portion where the magnetostrictive film 23 overlaps the electrode film 21 while the piezoelectric film 22 does not overlap, the portion constitutes a part of the laminate 20.

[0032] The width of the laminate 20 in the X-axis direction is not particularly limited, but is, for example, 100 μm to 1000 μm. The width of the laminate 20 in the Y-axis direction is not particularly limited, but is, for example, 50 μm to 1000 μm.

[0033] The outer edge of the laminate 20 and the opening edge of the opening 11 of the frame 10 are not in contact, and a gap is formed between the outer edge of the laminate 20 and the opening edge of the opening 11 of the frame 10. That is, the laminate 20 is arranged at a position overlapping the opening 11 when viewed from the stacking direction of the laminate 20 without overlapping the first surface 10a of the frame 10 in the stacking direction of the laminate 20. More specifically, the main surface of the electrode film 21 constituting the laminate 20 has an area smaller than the opening area of the opening 11, and the electrode film 21 is arranged at a position overlapping the opening 11 when viewed from the stacking direction of the laminate 20 without overlapping the first surface 10a in the stacking direction of the laminate 20. Further, the main surfaces of at least one functional film (the piezoelectric film 22 and the magnetostrictive film 23 in this embodiment) constituting the laminate 20 all have an area smaller than the opening area of the opening 11, and at least one functional film is all arranged at a position overlapping the opening 11 when viewed from the stacking direction of the laminate 20 without overlapping the first surface 10a in the stacking direction of the laminate 20.

[0034] Hereinafter, one end on the X-axis direction side of the laminate 20 is referred to as the first end 20a, the other end on the X-axis direction side of the laminate 20 is referred to as the second end 20b, one end on the Y-axis direction side of the laminate 20 is referred to as the third end 20c, and the other end on the Y-axis direction side of the laminate 20 is referred to as the fourth end 20d. The first end 20a and the second end 20b are parallel to the Y-axis and face each other in the X-axis direction. The third end 20c and the fourth end 20d are parallel to the X-axis and face each other in the Y-axis direction.

[0035] As shown in FIG. 3, the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23 are laminated in this order. In this embodiment, the number of functional films is plural, but the number of functional films may also be singular. For example, the functional film may be either the piezoelectric film 22 or the magnetostrictive film 23. The laminate 20 composed of the electrode film 21 and the piezoelectric film 22 is incorporated into an electronic device such as a pressure sensor. Further, the laminate 20 composed of the electrode film 21 and the magnetostrictive film 23 is incorporated into an electronic device such as a magnetic sensor.

[0036] The electrode film 21 is located at the lowermost layer of the laminate 20, and the main surface (hereinafter, the bottom surface) below the electrode film 21 is exposed to the outside. The position of the electrode film 21 in the height direction is not particularly limited, but in the example shown in FIG. 3, it is substantially equal to the position in the height direction of the first surface 10a of the frame 10. However, the term "substantially equal" includes not only the case where these positions in the height direction are exactly the same, but also the case where a deviation of within ± 5% occurs in these positions in the height direction. As shown in FIG. 2, the shape of the electrode film 21 is rectangular in plan view, but it may be square, other polygons, or other shapes.

[0037] The electrode film 21 is a conductive film (metal film) made of a metal such as Pt, Ir, Ag, Cu, Au, or Al. The electrode film 21 is SrRuO 3 (SRO) or LaNiO 3 It may also be an oxide conductor film having a perovskite-type structure such as etc. The thickness (average thickness) of the electrode film 21 is not particularly limited, but is, for example, 10 to 300 nm.

[0038] Note that other films such as a SiO 2 film may be formed below the electrode film 21. In this case, in the manufacturing process of the element 1, when the opening 11 (FIG. 1) is formed in the film-forming substrate serving as the base of the frame 10, the film below the electrode film 21 functions as an etching stopper. The thickness (average thickness) of the etching stopper layer is thinner than the thickness (average thickness) of the resin film 30 and is not particularly limited, but is, for example, 5 to 100 nm.

[0039] As shown in FIG. 3, the piezoelectric film 22 is laminated on the electrode film 21. The piezoelectric film 22 is sandwiched between the electrode film 21 and the magnetostrictive film 23. The piezoelectric film 22 is directly disposed on the electrode film 21 so as to be in contact with the electrode film 21, but another film may be disposed between the electrode film 21 and the piezoelectric film 22. The thickness (average thickness) of the piezoelectric film 22 is not particularly limited, but is, for example, 0.1 to 10 μm.

[0040] As shown in FIG. 2, the shape of the piezoelectric film 22 is rectangular in plan view, but may be square, other polygons, or other shapes. The area of the main surface of the piezoelectric film 22 is smaller than the area of the main surface of the electrode film 21, but may be equal to the area of the main surface of the electrode film 21 or larger than the area of the main surface of the electrode film 21. The center position of the piezoelectric film 22 is offset to one side in the X-axis direction with respect to the center position of the electrode film 21. This is to secure a space for forming a through layer 40e (FIG. 3) described later on the other side of the electrode film 21 in the X-axis direction.

[0041] The piezoelectric material constituting the piezoelectric film 22 is not particularly limited, and examples thereof include quartz, lithium niobate, aluminum nitride (AlN), zinc oxide (ZnO), lead zirconate titanate (PZT: Pb(Zr,Ti)O 3 )), potassium sodium niobate (KNN: (K,Na)NbO 3 )) or barium calcium zirconate titanate (BCZT: (Ba,Ca)(Zr,Ti)O 3 ). From the viewpoint of ensuring excellent piezoelectric characteristics and high reliability, a piezoelectric material having a perovskite structure such as PZT, KNN, BCZT, etc. may be used, and other elements may be added to the above piezoelectric materials.

[0042] As shown in FIG. 3, the magnetostrictive film 23 is laminated on the piezoelectric film 22. The magnetostrictive film 23 is directly disposed on the piezoelectric film 22 so as to be in contact with the piezoelectric film 22, but another film (for example, an electrode film) may be disposed between the piezoelectric film 22 and the magnetostrictive film 23. The thickness (average thickness) of the magnetostrictive film 23 is not particularly limited, but is, for example, 0.1 to 10 μm. In FIG. 3, the thickness of the magnetostrictive film 23 is shown to be equal to the thickness of the piezoelectric film 22, but it may be thinner or thicker than this.

[0043] As shown in FIG. 2, the shape of the magnetostrictive film 23 is rectangular in plan view, but it may be square, other polygons, or other shapes. The area of the main surface of the magnetostrictive film 23 is smaller than the area of the main surface of the piezoelectric film 22, but it may be equal to the area of the main surface of the piezoelectric film 22 or larger than the area of the main surface of the piezoelectric film 22.

[0044] The magnetostrictive material constituting the magnetostrictive film 23 is not particularly limited, but is, for example, an iron (Fe)-cobalt (Co)-silicon (Si)-boron (B) alloy, an Fe-Si-B alloy, an Fe-Co-B alloy, an Fe-chromium (Cr)-Si-B alloy, an Fe-nickel (Ni)-molybdenum (Mo)-B alloy, an Fe-Si-B-copper (Cu)-niobium (Nb) alloy, or a Co-Fe-Ni-Si-B-Mo alloy.

[0045] The resin film 30 (the portion indicated by dots in FIG. 2) is composed of an insulating film and covers at least a part (in this embodiment, all when viewed from the stacking direction of the laminate 20) of the laminate 20. Further, the resin film 30 bridges between the first surface 10a of the frame 10 and the laminate 20 in the X-axis direction. On the other hand, the resin film 30 does not bridge between the first surface 10a and the laminate 20 in the Y-axis direction. Therefore, a gap 50 is formed between the third end 20c of the laminate 20 and the first surface 10a. Also, a gap 50 is formed between the fourth end 20d of the laminate 20 and the first surface 10a. Further, gaps 50 are formed between both ends of the resin film 30 in the Y-axis direction and the first surface 10a.

[0046] The material constituting the resin film 30 is not particularly limited, but is an organic material such as polyimide, polyethylene terephthalate, polyethylene, polypropylene, polyester, polyamideimide, epoxy resin, etc. The thickness (average thickness) of the resin film 30 is not particularly limited, but is 0.1 to 10 μm. In FIG. 3, the thickness of the resin film 30 is shown to be thicker than the thickness of the piezoelectric film 22 or the magnetostrictive film 23, but it may be equivalent thereto, or may be thinner than this.

[0047] As shown in FIG. 2, the resin film 30 has a bridging portion 31, a covering portion 32, an intermediate portion 33, and an outer edge portion 34 (FIG. 1). The width of the covering portion 32 in the X-axis direction is equal to the width of the laminate 20 in the X-axis direction, and the covering portion 32 extends from one end to the other end of the laminate 20 in the X-axis direction. The shape of the covering portion 32 is rectangular in plan view, but may be square, other polygons, or other shapes. As shown in FIG. 3, the covering portion 32 is laminated on the laminate 20 and covers the laminate 20.

[0048] Both end portions of the covering portion 32 in the X-axis direction are formed in a stepped shape along the step between the electrode film 21 and the piezoelectric film 22 and the step between the piezoelectric film 22 and the magnetostrictive film 23. Although detailed illustration is omitted, both end portions of the covering portion 32 in the Y-axis direction are formed in a stepped shape along the step between the electrode film 21 and the piezoelectric film 22 and the step between the piezoelectric film 22 and the magnetostrictive film 23. The covering portion 32 is directly disposed on the magnetostrictive film 23 so as to be in contact with the magnetostrictive film 23, but another film may be disposed between the covering portion 32 and the magnetostrictive film 23.

[0049] As shown in FIG. 2, in the stacking direction of the laminate 20, the entire laminate 20 overlaps with the covering portion 32 of the resin film 30. Further, the covering portion 32 of the resin film 30 covers at least a part (in this embodiment, all when viewed from the stacking direction of the laminate 20) of the laminate 20 from one side where the functional films (in this embodiment, the piezoelectric film 22 and the magnetostrictive film 23) are located in the stacking direction of the laminate 20. More specifically, the covering portion 32 entirely covers the upper main surface (hereinafter, the top surface) of the magnetostrictive film 23 from above. Further, the covering portion 32 covers from above the portion (outer edge portion of the piezoelectric film 22) of the top surface of the piezoelectric film 22 that is located outside the outer edge of the magnetostrictive film 23. Further, the covering portion 32 covers from above the portion (outer edge portion of the electrode film 21) of the top surface of the electrode film 21 that is located outside the outer edge of the piezoelectric film 22.

[0050] In the stacking direction of the laminate 20, at least one (in this embodiment, both) of the first end portion 20a and the second end portion 20b of the laminate 20 overlaps with the covering portion 32. Further, in the stacking direction of the laminate 20, at least one (in this embodiment, both) of the third end portion 20c and the fourth end portion 20d of the laminate 20 overlaps with the covering portion 32.

[0051] The width of the covering portion 32 in the Y-axis direction is wider than the width of the laminate 20 in the Y-axis direction, and both end portions of the covering portion 32 in the Y-axis direction are located outside both end portions of the laminate 20 in the Y-axis direction. However, the width of the covering portion 32 in the Y-axis direction may be equal to the width of the laminate 20 in the Y-axis direction, and both end portions of the covering portion 32 in the Y-axis direction may be laminated on both end portions of the laminate 20 in the Y-axis direction.

[0052] The intermediate portion 33 is disposed on the first surface 10a of the frame 10. As shown in FIG. 3, the intermediate portion 33 is disposed directly on the first surface 10a so as to be in contact with the first surface 10a, but another film (for example, an etching stopper layer) may be disposed between the intermediate portion 33 and the first surface 10a. As shown in FIG. 1, the intermediate portion 33 is located between one opening 11 and the other opening 11 adjacent in the X-axis direction when viewed from the lamination direction of the laminate 20. The intermediate portion 33 insulates the fourth conductive pattern 40d located between one opening 11 and the other opening 11 adjacent in the X-axis direction when viewed from the lamination direction of the laminate 20 from the first surface 10a.

[0053] The outer edge portion 34 is disposed at the outer edge of the first surface 10a. The outer edge portion 34 is disposed directly on the first surface 10a so as to be in contact with the first surface 10a, but another film (for example, an etching stopper layer) may be disposed between the outer edge portion 34 and the first surface 10a. The outer edge portion 34 insulates the third conductive pattern 40c located at the outer edge of the first surface 10a from the first surface 10a.

[0054] As shown in FIG. 2, the bridging portion 31 is located between the covering portion 32 and the intermediate portion 33. The bridging portion 31 bridges (connects) between the first surface 10a of the frame 10 and the laminate 20 in the X-axis direction. The bridging portion 31 supports the laminate 20 so as to be vibratable at a position overlapping the opening 11 when viewed from the lamination direction of the laminate 20. FIG. 2 shows two bridging portions 31. One bridging portion 31 bridges between the laminate 20 and the first surface 10a on the side of the first end portion 20a of the laminate 20. The other bridging portion 31 bridges between the laminate 20 and the first surface 10a on the side of the second end portion 20b of the laminate 20. As shown in FIG. 3, the laminate 20 is disposed at a position overlapping the opening 11 when viewed from the lamination direction of the laminate 20 in a state of being suspended (hanging in the air) by these bridging portions 31.

[0055] In the example shown in FIG. 3, the bridging portion 31 extends parallel to the intermediate portion 33. The position of the bottom surface of the bridging portion 31 in the height direction is not particularly limited, but is substantially equal to the position of the first surface 10a of the frame 10 in the height direction and is substantially equal to the position of the bottom surface of the electrode film 21 in the height direction. However, the term "substantially equal" is a concept that includes not only the case where these positions in the height direction are exactly the same, but also the case where there is a deviation of within ±5% in these positions in the height direction. The bridging portion 31 supports the laminate 20 parallel to the first surface 10a, but may support the laminate 20 non-parallel to the first surface 10a.

[0056] As shown in FIG. 2, at the central portion of the bridging portion 31 in the Y-axis direction, a first conductive pattern 40a or 40b is provided on the top surface of the bridging portion 31. On the other hand, on both sides of the first conductive pattern 40a or 40b in the Y-axis direction, the top surface of the bridging portion 31 is exposed to the outside. Also, the bottom surface of the bridging portion 31 is exposed to the outside (see FIG. 3). That is, the electrode film 21 constituting the laminate 20 is not disposed on the bottom surface and the top surface of the bridging portion 31. Also, none of the at least one functional film (piezoelectric film 22 and magnetostrictive film 23) constituting the laminate 20 is disposed on the bottom surface and the top surface of the bridging portion 31.

[0057] The shape of the bridging portion 31 is a rectangle having a long side in the Y-axis direction in plan view. In the example shown in FIG. 2, the width of the bridging portion 31 in the Y-axis direction is equal to the width of the covering portion 32 in the Y-axis direction and is also equal to the width of the intermediate portion 33 in the Y-axis direction. Also, the width W1 of the bridging portion 31 in the Y-axis direction is wider than the interval W2 in the X-axis direction between the laminate 20 and the first surface 10a of the frame 10. By setting W1>W2, the strength of the bridging portion 31 is improved, and the laminate 20 can be stably fixed to the frame 10 via the bridging portion 31. The ratio W1 / W2 of W1 to W2 may be 1 <W1 / W2 <10, or may be 5 ≦ W1 / W2 <10. The width of the bridging portion 31 in the X-axis direction is equal to the interval in the X-axis direction between the laminate 20 and the first surface 10a of the frame 10.

[0058] The laminate 20 is indirectly fixed to the first surface 10a of the frame 10 via the bridging portion 31. On the other hand, the electrode film 21 constituting the laminate 20 is not directly fixed to the first surface 10a. Also, none of the at least one functional film (in this embodiment, the piezoelectric film 22 and the magnetostrictive film 23) constituting the laminate 20 is directly fixed to the first surface 10a.

[0059] The elastic modulus (Young's modulus) or rigidity of the bridging portion 31 is smaller than that of the laminate 20. Also, the elastic modulus (Young's modulus) or rigidity of the bridging portion 31 is smaller than that of the frame 10. The Young's modulus of the bridging portion 31 (resin film 30) is not particularly limited, but is, for example, less than 100 GPa. The Young's modulus of the laminate 20 is not particularly limited, but is, for example, 100 to 500 GPa. However, the Young's modulus of the laminate 20 is the average value of the Young's moduli of the electrode film 21 and the at least one functional film (in this embodiment, the piezoelectric film 22 and the magnetostrictive film 23) constituting the laminate 20. The elastic modulus (Young's modulus) of the bridging portion 31 may be smaller than the elastic modulus of the electrode film 21, may be smaller than the elastic modulus of the piezoelectric film 22, or may be smaller than the elastic modulus of the magnetostrictive film 23.

[0060] Here, let the Young's modulus of the bridging portion 31 (resin film 30) be Yo [N / m], the film thickness of the bridging portion 31 be dо [μm], the Young's modulus of the laminate 20 be Yr [N / m], and the total film thickness of the laminate 20 be dr [μm]. In this embodiment, dо·Yo < dr·Yr. The ratio dо·Yo / dr·Yr of dо·Yo to dr·Yr is not particularly limited, but may be 1 / 1000 or more and 1 / 10 or less, or may be 1 / 500 or more and 1 / 50 or less.

[0061] Also, let the Young's modulus of the frame 10 be Yr' [N / m], and the thickness of the frame 10 (the width of the frame 10 in the Z-axis direction) be dr' [μm]. In this embodiment, do·Yo < dr'·Yr'. The ratio do·Yo / dr'·Yr' of do·Yo to dr'·Yr' is not particularly limited, but may be 1 / 100000 or more and 1 / 1000 or less, or may be 1 / 50000 or more and 1 / 5000 or less. Also, in this embodiment, dr·Yr < dr'·Yr'.

[0062] As shown in FIG. 3, the first conductive pattern 40a and the second conductive pattern 40b are formed of a conductive film and laminated on the resin film 30. The first conductive pattern 40a and the second conductive pattern 40b are conductive patterns for supplying input power to the laminate 20 or obtaining output power from the laminate 20.

[0063] The first conductive pattern 40a and the second conductive pattern 40b are directly disposed on the resin film 30 so as to be in contact with the resin film 30. However, another film may be disposed between the first conductive pattern 40a and the resin film 30, and another film may be disposed between the second conductive pattern 40b and the resin film 30. The thickness (average thickness) of the first conductive pattern 40a is not particularly limited, but is, for example, 3 to 500 nm.

[0064] The material constituting the first conductive pattern 40a is not particularly limited, but is, for example, Au, Pt, Ag, Cu, or Al. The same applies to the material constituting the second conductive pattern 40b.

[0065] As shown in FIG. 2, the first conductive pattern 40a extends along the resin film 30 between the laminate 20 and the first surface 10a of the frame 10 on the first end portion 20a side of the laminate 20. The second conductive pattern 40b extends along the resin film 30 between the laminate 20 and the first surface 10a of the frame 10 on the second end portion 20b side of the laminate 20. The first conductive pattern 40a and the second conductive pattern 40b are disposed at the central portion in the Y-axis direction of the resin film 30, but the positions of the first conductive pattern 40a and the second conductive pattern 40b in the Y-axis direction are not particularly limited.

[0066] The width (lateral width) in the direction perpendicular to the extending direction of the first conductive pattern 40a in the plane of the resin film 30 is smaller than the width in the Y-axis direction of the bridging portion 31. The lateral width of the first conductive pattern 40a is not particularly limited, but is, for example, 10 to 50 μm. The lateral width of the first conductive pattern 40a is not particularly limited, but may be 20% or less, or 10% or less, of the width in the Y-axis direction of the resin film 30 (for example, the bridging portion 31). The same applies to the lateral width of the second conductive pattern 40b.

[0067] The length of the first conductive pattern 40a along the X-axis is not particularly limited, but is, for example, 50 to 300 μm. The length of the second conductive pattern 40b along the X-axis is longer than the length of the first conductive pattern 40a along the X-axis, but may be equal to or shorter than this.

[0068] As shown in FIG. 3, the first conductive pattern 40a is electrically connected to the electrode film 21 through the through layer 40e. The through layer 40e is located on the first end portion 20a side of the laminate 20 (see FIG. 2), but the position of the through layer 40e is not particularly limited. The through layer 40e is disposed inside the opening formed in the resin film 30 so as to penetrate the resin film 30. The through layer 40e connects the end portion in the extending direction of the first conductive pattern 40a and the electrode film 21.

[0069] Further, the second conductive pattern 40b is electrically connected to the magnetostrictive film 23 via the through layer 40f. The through layer 40f is located on the second end portion 20b side of the laminate 20 (see FIG. 2), but the position of the through layer 40f is not particularly limited. The through layer 40f is disposed inside an opening formed in the resin film 30 so as to penetrate the resin film 30. The through layer 40f connects the end portion in the extending direction of the second conductive pattern 40b to the magnetostrictive film 23.

[0070] As shown in FIG. 2, the first conductive pattern 40a and the second conductive pattern 40b are bent in an S shape (crank shape or meander shape) along the in-plane direction of the resin film 30. The first conductive pattern 40a and the second conductive pattern 40b are bent at least on the bridging portion 31. The bending swing width W3 (FIG. 4) of the first conductive pattern 40a is not particularly limited, but is, for example, 1.5 times or more the lateral width of the first conductive pattern 40a. The same applies to the second conductive pattern 40b. The bending shapes of the first conductive pattern 40a and the second conductive pattern 40b are not limited to an S shape, and may be a C shape or other shapes.

[0071] As shown in FIG. 1, the third conductive pattern 40c is located at the outer edge portion of the first surface 10a of the frame 10. The third conductive pattern 40c is composed of a conductive film and is laminated on the resin film 30. The material constituting the third conductive pattern 40c may be the same as or different from the material constituting the first conductive pattern 40a. The thickness (average thickness) of the third conductive pattern 40c may be the same as or different from the thickness (average thickness) of the first conductive pattern 40a. The third conductive pattern 40c is electrically connected to a plurality of first conductive patterns 40a and a plurality of second conductive patterns 40b that are scattered at both end portions of the frame 10 in the X-axis direction.

[0072] The fourth conductive pattern 40d is disposed between the first conductive pattern 40a and the second conductive pattern 40b adjacent in the X-axis direction on the first surface 10a of the frame 10. The fourth conductive pattern 40d electrically connects the first conductive pattern 40a and the second conductive pattern 40b adjacent in the X-axis direction. The fourth conductive pattern 40d is composed of a conductive film and is laminated on the resin film 30. The material constituting the fourth conductive pattern 40d may be the same as or different from the material constituting the first conductive pattern 40a. The thickness (average thickness) of the fourth conductive pattern 40d may be the same as or different from the thickness (average thickness) of the first conductive pattern 40a.

[0073] As shown in FIG. 5, for example, in a non-contact power supply system 3, the element 1 is incorporated into the electronic device 2 and used as an antenna. In the non-contact power supply system 3, the transmitting antenna 7 is a dipole antenna, a monopole antenna, a loop antenna, etc., and transmits an alternating magnetic field to the electronic device 2. The electronic device 2 has, in addition to the element 1, a power management IC 4, a capacitor 5, and a plurality of power consumption units 6.

[0074] When the element 1 receives the alternating magnetic field transmitted from the transmitting antenna 7, the laminate 20 (FIG. 3) vibrates due to the magnetoelectric effect and outputs power. The output power of the laminate 20 is supplied from the laminate 20 to the power management IC 4 via the first conductive pattern 40a and the second conductive pattern 40b (FIG. 2), etc. The power management IC 4 stores the power supplied from the laminate 20 in the capacitor 5 and supplies the power stored in the capacitor 5 to the power consumption unit 6 as necessary. The power consumption unit 6 operates based on the power supplied from the power management IC 4. When the electronic device 2 is, for example, an ear-mounted canal-type earphone, the power consumption unit 6 is a piezoelectric speaker, a piezoelectric microphone, a pressure sensor, an acoustic IC, a storage device, etc.

[0075] Next, a method for manufacturing the element 1 shown in FIG. 1 will be described. First, a film-forming substrate such as a silicon substrate serving as a base for the frame 10 is prepared. Next, an electrode film, a piezoelectric film, and a magnetostrictive film are formed on the film-forming substrate in this order to form a laminate of these films. Examples of the film-forming method include vapor deposition, sputtering, sol-gel, CVD, and PLD methods.

[0076] Next, patterning is performed on the electrode film, the piezoelectric film, and the magnetostrictive film to form the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23 shown in FIGS. 1 and 2. The patterning is performed, for example, by an etching method (such as photoetching or laser dry etching) or a lift-off method. As a result, a plurality of laminates 20 having the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23 are formed on the film-forming substrate.

[0077] Next, a solution of polyamic acid, which is a precursor of polyimide, is applied to the film-forming substrate on which the laminate 20 is formed by spin coating, the solution is dried, and further heated to dehydrate and cyclize (imidize) the polyamic acid. As a result, a resin film made of a polyimide film is formed on the film-forming substrate so as to cover the plurality of laminates 20. Note that the film constituting the resin film is not limited to a polyimide film, and may be a film made of another organic material such as polyethylene terephthalate. Next, patterning is performed on the resin film to form the resin film 30 shown in FIGS. 1 and 2.

[0078] Next, a conductive film is formed on the resin film 30 by a vapor deposition method, a sputtering method, or the like. The conductive film is a film serving as a base for the first conductive pattern 40a, the second conductive pattern 40b, the third conductive pattern 40c, and the fourth conductive pattern 40d. Next, patterning such as lift-off is performed on the conductive film to form the first conductive pattern 40a, the second conductive pattern 40b, the third conductive pattern 40c, and the fourth conductive pattern 40d shown in FIGS. 1 and 2.

[0079] Next, a part of the substrate for film formation is removed by, for example, dry etching (Deep-RIE method, etc.) or anisotropic wet etching to form a frame 10 having an opening 11. In this way, the element 1 shown in FIG. 1 can be manufactured.

[0080] As shown in FIG. 2, in the element 1 of the present embodiment, the laminate 20 is arranged at a position overlapping the opening 11 when viewed from the stacking direction of the laminate 20 without overlapping the frame 10 in the stacking direction of the laminate 20. And the resin film bridges between such a laminate 20 and the frame 10. Therefore, the laminate 20 is arranged so as to overlap the opening 11 in a state of being suspended by the resin film 30, and is indirectly fixed to the frame 10 via the resin film 30. When the laminate 20 vibrates in this state, the resin film 30 expands and contracts according to the vibration of the laminate 20, and the tensile stress of the laminate 20 caused by strain or residual stress is weakened. Thereby, it is possible to prevent the problem that cracks occur in the laminate 20.

[0081] Further, the laminate 20 has a piezoelectric film 22 and a magnetostrictive film 23 as at least one functional film, and the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23 are laminated in this order. Therefore, due to the interaction between the magnetostrictive film 21 and the piezoelectric film 22, a magnetoelectric effect of converting an external magnetic field into electric power can be obtained. By incorporating such a laminate 20 of the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23 into an electronic device such as an antenna, miniaturization of the electronic device can be achieved.

[0082] Further, the resin film 30 has a bridging portion 31 that bridges between the frame 10 and the laminate 20, and the elastic modulus of the bridging portion 31 is smaller than the elastic modulus of the laminate 20. Therefore, the stretchability of the bridging portion 31 becomes higher than the stretchability of the laminate 20, and the bridging portion 31 easily expands and contracts according to the vibration of the laminate 20. Thereby, the tensile stress of the laminate 20 caused by strain or residual stress can be weakened, and the problem that cracks occur in the laminate 20 can be prevented.

[0083] Also, in the X-axis direction, the resin film 30 bridges between the frame 10 and the laminate 20. In the Y-axis direction, a gap 50 is formed between the laminate 20 and the frame 10. Therefore, in the X-axis direction, the laminate 20 is constrained by the resin film 30 and becomes less likely to expand and contract. On the other hand, in the Y-axis direction, the laminate 20 can expand and contract freely without being constrained by the resin film 30. By restricting the expansion and contraction direction of the laminate 20 to a certain direction in this way, the power output from the laminate 20 can be increased, and the high output of the electronic device can be achieved.

[0084] Also, the element 1 is provided with a first conductive pattern 40a extending between the laminate 20 and the frame 10. The first conductive pattern 40a is electrically connected to the laminate 20 (the electrode film 21 in this embodiment) and is bent along the in-plane direction of the resin film 30. Since the first conductive pattern 40a is bent along the in-plane direction of the resin film 30, it has stretchability that can expand and contract in response to the vibration of the laminate 20. By the first conductive pattern 40a and the resin film 30 expanding and contracting together in response to the vibration of the laminate 20, the tensile stress of the laminate 20 caused by strain or residual stress can be weakened, and the defect that cracks occur in the laminate 20 can be effectively prevented.

[0085] Also, the element 1 is provided with a second conductive pattern 40b extending between the laminate 20 and the frame 10 at a position different from the first conductive pattern 40a. The second conductive pattern 40b is electrically connected to the laminate 20 (the magnetostrictive film 23 in this embodiment) and is bent along the in-plane direction of the resin film 30. Therefore, the second conductive pattern 40b has stretchability that can expand and contract in response to the vibration of the laminate 20. By the first conductive pattern 40a, the second conductive pattern 40b, and the resin film 30 expanding and contracting together in response to the vibration of the laminate 20, the tensile stress of the laminate 20 caused by strain or residual stress can be weakened, and the defect that cracks occur in the laminate 20 can be effectively prevented.

[0086] In addition, the width in the direction orthogonal to the extending direction of the first conductive pattern 40a in the plane of the resin film 30 is narrower than the width of the resin film 30 in the Y-axis direction, and the width in the direction orthogonal to the extending direction of the second conductive pattern 40b in the plane of the resin film 30 is narrower than the width of the resin film 30 in the Y-axis direction. Therefore, the expansion and contraction of the resin film 30 in response to the vibration of the laminate 20 are less likely to be hindered by the first conductive pattern 40a and the second conductive pattern 40b.

[0087] In addition, in the stacking direction of the laminate 20, the entire at least one (both in this embodiment) of the first end 20a and the second end 20b of the laminate 20 overlaps with the resin film 30. Therefore, due to the function of the resin film 30 as a protective film, damage to the laminate 20 is suppressed at the first end 20a and the second end 20b, and the reliability or durability of the laminate 20 can be enhanced.

[0088] In addition, in the stacking direction of the laminate 20, the entire laminate 20 overlaps with the resin film 30. Further, the resin film 30 covers at least a part (all in this embodiment) of the laminate 20 from the one side where at least one functional film (the piezoelectric film 22 and the magnetostrictive film 23 in this embodiment) is located in the stacking direction of the laminate 20. Therefore, in the laminate 20, the surface (top surface) on the side of the functional film (the magnetostrictive film 23 in this embodiment) is entirely covered by the resin film 30. Therefore, exposure of the top surface of the laminate 20 to the outside can be prevented. Thereby, due to the function of the resin film 30 as a protective film, damage or corrosion from the top surface of the laminate 20 can be prevented throughout the entire area of the laminate 20, and the reliability or durability of the laminate 20 can be enhanced.

[0089] Second Embodiment The element 101 of the second embodiment shown in FIG. 6 has the same configuration as the element 1 of the first embodiment, except for the points shown below. The same reference numerals are given to the portions overlapping with the element 1 of the first embodiment, and the detailed description thereof is omitted.

[0090] Element 101 has a resin film 130. The resin film 130 has a covering portion 132, and the covering portion 132 is different from the covering portion 32 of the first embodiment in that it has an opening 35. The covering portion 132 partially covers the top surface of the laminate 20 outside the opening 35. On the other hand, as shown in FIGS. 7A and 7B, inside the opening 35, at least a part of the top surface of the magnetostrictive film 23 constituting the laminate 20 is exposed to the outside without being covered by the covering portion 132. In the present embodiment, more than 50% of the top surface of the laminate 20 is exposed to the outside, but the exposure ratio of the top surface of the laminate 20 is not particularly limited and may be less than 50% of the top surface of the laminate 20.

[0091] Also in the present embodiment, the same effects as those of the first embodiment can be obtained. In addition, in the present embodiment, since at least a part of the top surface of the laminate 20 is not covered by the covering portion 132, the laminate 20 is likely to vibrate. As a result, the power output from the laminate 20 increases, and the high output of the electronic device can be achieved.

[0092] Third Embodiment Element 201 of the third embodiment shown in FIG. 8 has the same configuration as element 1 of the first embodiment, except for the following points. The same reference numerals are given to the portions overlapping with element 1 of the first embodiment, and the detailed description thereof is omitted.

[0093] Element 201 has a resin film 230. The resin film 230 has a bridging portion 231 and an intermediate portion 233. The width of the bridging portion 231 in the Y-axis direction is narrower than the width of the covering portion 32 of the first embodiment in the Y-axis direction. The width of the bridging portion 231 in the Y-axis direction is not particularly limited, but may be 1 / 2 or more and less than 1 of the width of the covering portion 32 in the Y-axis direction. Also, the width of the intermediate portion 233 in the Y-axis direction is narrower than the width of the covering portion 32 of the first embodiment in the Y-axis direction. Also in the present embodiment, the same effects as those of the first embodiment can be obtained.

[0094] Fourth Embodiment The element 301 of the fourth embodiment shown in FIG. 9 has the same configuration as the element 1 of the first embodiment, except for the points described below. The same reference numerals are given to the parts overlapping with the element 1 of the first embodiment, and the detailed description thereof will be omitted.

[0095] The element 301 has a resin film 330. The resin film 330 is different from the resin film 30 of the first embodiment in that two covering portions 332 are arranged on the top surface of the laminate 20. One of the covering portions 332 is arranged on the side of the first end portion 20a of the laminate 20 and extends in the Y-axis direction along the first end portion 20a. The other covering portion 332 is arranged on the side of the second end portion 20b of the laminate 20 and extends in the Y-axis direction along the second end portion 20b. The shape of the covering portion 332 is a rectangle elongated in the Y-axis direction in plan view. However, the shape of the covering portion 332 may be a rectangle elongated in the X-axis direction, a square, or other shapes in plan view.

[0096] As shown in FIG. 10A, one covering portion 332 and the other covering portion 332 are discontinuous in the X-axis direction. Also, as shown in FIG. 10B, at least in the central portion of the laminate 20 in the X-axis direction, the covering portion 332 is not arranged. Also in this embodiment, the same effects as those of the first embodiment can be obtained. In addition, in this embodiment, since at least a part of the top surface of the laminate 20 is not covered by the covering portion 332, the laminate 20 is likely to vibrate. Thereby, the power output from the laminate 20 increases, and the high output of the electronic device can be achieved.

[0097] Note that the present invention is not limited to the above-described embodiments and can be variously modified within the scope of the present invention. For example, although the element 1 shown in FIG. 1 has a plurality of laminates 20, the number of laminates 20 may be singular. Further, although the laminate 20 shown in FIG. 2 has two functional films (piezoelectric film 22 and magnetostrictive film 23) as at least one functional film, it may have one or three or more functional films. For example, the laminate 20 may have a piezoelectric film 22 or a magnetostrictive film 23 as one functional film. The laminate 20 composed of the electrode film 21 and the piezoelectric film 22 constitutes a vibrator that can vibrate due to the inverse piezoelectric effect of the piezoelectric film 22. Further, the laminate 20 composed of the electrode film 21 and the magnetostrictive film 23 constitutes a vibrator that can vibrate due to the magnetostrictive effect of the magnetostrictive film 23.

[0098] As shown in FIG. 3, although the resin film 30 is composed of one layer, it may be composed of two or more layers.

[0099] In FIG. 2, only the whole of either one of the first end portion 20a and the second end portion 20b of the laminate 20 may overlap with the resin film 30 in the lamination direction of the laminate 20. Further, a part of at least one of the first end portion 20a and the second end portion 20b of the laminate 20 may overlap with the resin film 30 in the lamination direction of the laminate 20.

[0100] As shown in FIG. 2, although the shape of the laminate 20 is rectangular in plan view, it may be square, circular, elliptical, or other shapes.

[0101] The first conductive pattern 40a and the second conductive pattern 40b shown in FIG. 2 may extend linearly.

[0102] As shown in FIG. 1, although the plurality of laminates 20 are arranged in a matrix, they may be arranged, for example, concentrically or radially.

[0103] The positional relationship between the piezoelectric film 22 and the magnetostrictive film 23 shown in FIG. 3 may be upside down, and in the laminate 20, the electrode film 21, the magnetostrictive film 23, and the piezoelectric film 22 may be laminated in this order.

[0104] As shown in FIG. 2, a gap 50 was formed between the laminate 20 and the frame 10 in the Y-axis direction. However, in the Y-axis direction, the resin film 30 may bridge between the laminate 20 and the frame 10 so that the gap 50 may not be formed between the laminate 20 and the frame 10.

Explanation of Reference Numerals

[0105] 1,101,201,301… elements 2… electronic device 3… non-contact power supply system 4… power management IC 5… capacitor 6… power consumption part 7… transmission antenna 10… frame 10a~10f… first surface ~ sixth surface 11… opening 20… laminate 20a~20d… first end ~ fourth end 21… electrode film 22… piezoelectric film 23… magnetostrictive film 30,130,230,330… resin film 31,231… bridging part 32,132,332… covering part 33,233… intermediate part 34… outer edge part 35… opening 40a… first conductive pattern 40b… second conductive pattern 40c… third conductive pattern 40d… fourth conductive pattern 40e,40f… through layer 50… gap

Claims

1. a frame having at least one opening; a laminate having an electrode film and at least one functional film laminated on the electrode film; a resin film, and the laminate is disposed at a position overlapping the opening when viewed from the lamination direction of the laminate without overlapping the frame in the lamination direction of the laminate, the resin film is an electronic device bridging between the frame and the laminate.

2. The electronic device according to claim 1, wherein the laminate has at least one of a piezoelectric film and a magnetostrictive film as at least one of the functional films.

3. the laminate has the piezoelectric film and the magnetostrictive film as at least one of the functional films, The electronic device according to claim 2, wherein the electrode film, the piezoelectric film, and the magnetostrictive film are laminated in this order.

4. In a first direction perpendicular to the lamination direction, the resin film bridges between the frame and the laminate, The electronic device according to claim 1 or 2, wherein a gap is formed between the laminate and the frame in a second direction perpendicular to the lamination direction and the first direction.

5. further having a first conductive pattern extending between the laminate and the frame, The electronic device according to claim 1 or 2, wherein the first conductive pattern is electrically connected to the laminate and is bent along the in-plane direction of the resin film.

6. further having a second conductive pattern extending between the laminate and the frame at a position different from the first conductive pattern, The electronic device according to claim 5, wherein the second conductive pattern is electrically connected to the laminate and is bent along the in-plane direction of the resin film.

7. The resin film has a bridging portion bridging between the frame and the laminate in a first direction perpendicular to the lamination direction, The electronic device according to claim 1 or 2, wherein the width of the bridging portion in a second direction perpendicular to the lamination direction and the first direction is wider than the distance between the laminate and the frame in the first direction.

8. In the lamination direction, at least the whole of one end and the other end of the laminate in the first direction overlap the resin film. The electronic device according to claim 1 or 2.

9. The electronic device according to claim 1 or 2, wherein, in the stacking direction, the entire laminate overlaps with the resin film.

10. The electronic device according to claim 1 or 2, wherein the resin film covers at least a part of the laminate from one side on which at least one of the functional films is located in the stacking direction of the laminate.

Images