Light-emitting device, photoelectric conversion device, and electronic apparatus

Abstract

To provide a technique that is advantageous for drive in accordance with a specification of a display area.SOLUTION: A light-emitting device comprises: a first substrate provided with a data signal line and a plurality of pixels connected to the data signal line; and a second substrate provided with a signal processing circuit including a digital analog conversion circuit, in order to supply a data signal based on image data to be input, to the plurality of pixels. The first substrate further includes a drive circuit for supplying a signal voltage based on the data signal to be input from the signal processing circuit, to the data signal line. In a plan view, the drive circuit out of the first substrate and the signal processing circuit out of the second substrate are provided so as to be superposed at least in part.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a light-emitting device, a photoelectric conversion device, and an electronic device.

Background Art

[0002] Patent Document 1 shows a display device including a light-emitting element using an organic electroluminescence (EL) element. In the display device shown in Patent Document 1, video signals corresponding to image data are given to each pixel arranged in a display area from a driver IC via signal lines, whereby a screen display corresponding to the image data is performed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Since the load of the display area driven by the driver IC varies depending on the number of pixels arranged in the display area, the size of the pixels, etc., the driving force required for the driver IC changes according to the display area. On the other hand, general-purpose driver ICs often have a driving circuit with a large driving force in order to support driving of display areas with various specifications. However, when a driver IC having a driving circuit with a large driving force is used, depending on the specification of the display area, the driving force of the driving circuit may become excessive, and the size and power consumption of the driver IC may become excessive.

[0005] An object of the present invention is to provide a technique advantageous for driving according to the specification of a display area.

Means for Solving the Problems

[0006] In view of the above problems, a light-emitting device according to an embodiment of the present invention includes a first substrate on which a data signal line and a plurality of pixels connected to the data signal line are arranged, and a second substrate on which a signal processing circuit including a digital-to-analog conversion circuit is arranged in order to supply a data signal based on input image data to the plurality of pixels. The first substrate further includes a driving circuit that supplies a signal voltage based on the data signal input from the signal processing circuit to the data signal line. In a plan view, at least a part of the driving circuit on the first substrate and the signal processing circuit on the second substrate are arranged so as to overlap each other. 。

Effects of the Invention

[0007] According to the present invention, it is possible to provide a technology advantageous for driving according to the specifications of a display area.

Brief Description of the Drawings

[0008]

Figure 1

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Figure 10

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Figure 16

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.

[0010] With reference to FIGS. 1 to 7, a light-emitting device according to an embodiment of the present disclosure will be described. The following embodiments are all examples of the present disclosure and do not limit the invention according to the claims. FIG. 1 is a circuit diagram showing a configuration example of the light-emitting device 101 of the present disclosure. As shown in FIG. 1, the light-emitting device 101 may include a display substrate 102 and a display data control substrate 103. Each of the display substrate 102 and the display data control substrate 103 can be formed, for example, on a single semiconductor substrate or an insulating substrate such as glass or plastic. Depending on their size, the display substrate 102 and the display data control substrate 103 can also be referred to as display chips, display data control chips, etc.

[0011] The display substrate 102 is provided with a pixel array 105 including a plurality of pixels 104 two-dimensionally arranged in a matrix. The pixels 104 arranged on the display substrate 102 (pixel array 105) each have a light-emitting element. Further, a vertical scanning circuit 106 and a driving circuit 107 are arranged on the display substrate 102. In the pixel array 105, a plurality of scanning lines 108 respectively connected to the pixels 104 arranged row by row among the pixels 104 arranged on the pixel array 105 are arranged along the row direction (the horizontal direction in FIG. 1). Also, in the pixel array 105, a plurality of data signal lines 109 respectively connected to the pixels 104 arranged column by column among the pixels 104 arranged on the pixel array 105 are arranged along the column direction (the vertical direction in FIG. 1).

[0012] Each of the scanning lines 108 is connected to the output terminal of the corresponding row of the vertical scanning circuit 106. The vertical scanning circuit 106 supplies a write control signal to the scanning lines 108 when writing a luminance signal to each of the pixels 104 arranged on the pixel array 105. Each of the data signal lines 109 is connected to the output terminal of the corresponding column of the driving circuit 107. Also, a signal line 110 through which a data signal is supplied from the display data control substrate 103 to the driving circuit 107 is connected to the input terminal of the driving circuit 107.

[0013] The display data control substrate 103 is arranged to supply data signals based on image data input from the outside of the light-emitting device 101 to the plurality of pixels 104. The configuration arranged on the display data control substrate 103 will be described later.

[0014] The display data control substrate 103 outputs a data signal having a voltage corresponding to the luminance information of the light-emitting element arranged in each of the pixels 104 to the signal line 110. The driving circuit 107 arranged on the display substrate 102 supplies a luminance signal having a signal voltage corresponding to the data signal input from the display data control substrate 103 to the data signal lines 109.

[0015] FIG. 2 is a circuit diagram showing an example of the configuration of the driving circuit 107. As shown in FIG. 2, the driving circuit 107 may include, for example, a plurality of buffers 201. A signal line 110 is connected to the input terminal of each buffer 201, and a data signal supplied from the display data control board 103 is input. The buffer 201 outputs a luminance signal having a signal voltage based on the data signal to the data signal line 109.

[0016] Here, the driving circuit 107 is not limited to the configuration shown in FIG. 2. For example, the driving circuit 107 may have a demultiplexer separately from the buffer 201, and the demultiplexer may be configured to receive the luminance signal output from the buffer 201 and output it while switching it to a plurality of data signal lines 109. Also, the number of signal lines 110 connected to the driving circuit 107 and the number of data signal lines 109 connected to the driving circuit 107 may be the same or different. The number of the signal lines 110 and the data signal lines 109 may have an appropriate relationship according to the configuration of the driving circuit 107.

[0017] In order for the driving circuit 107 to cause the pixel 104 to emit light at a predetermined luminance, it is necessary to drive the data signal line 109 so that the voltage of the data signal line 109 settles to the voltage of a predetermined luminance signal within a predetermined period. Also, since the data signal line 109 is connected to a plurality of pixels 104 as shown in FIG. 1, the load capacitance of the data signal line 109 can change according to specifications such as the number of pixels 104 and the pixel size of the pixel array 105 provided on the display substrate 102. Therefore, an appropriate driving force is required for the driving circuit 107 so that the voltage of the data signal line 109 settles to the voltage of a predetermined luminance signal within a predetermined period according to the load capacitance of the data signal line 109.

[0018] In this embodiment, the driving circuit 107 is arranged on the display substrate 102. Therefore, according to the load capacitance of the data signal line 109 determined by specifications such as the number and size of the pixels 104 included in the pixel array 105 arranged on the display substrate 102, the driving force of the driving circuit 107 can be determined as an appropriate driving force. That is, the size and power consumption of the driving circuit 107 can be designed as appropriate values. Therefore, depending on the size of the driving circuit 107, the size of the light-emitting device 101 is not made larger than necessary.

[0019] FIG. 3 is a circuit diagram showing an example of the configuration of the display data control substrate 103 included in the light-emitting device 101 according to this embodiment. As shown in FIG. 3, on the display data control substrate 103, a signal processing circuit 300 including a digital-to-analog conversion circuit (DA conversion circuit) 301 is arranged to supply data signals based on the input image data to a plurality of pixels 104. More specifically, the display data control substrate 103 may be configured to include a DA conversion circuit 301 and a display data control circuit 302.

[0020] The display data control circuit 302 outputs a gradation signal based on the luminance information of the light-emitting elements of the respective pixels 104 arranged in the pixel array 105 supplied as image data to the DA conversion circuit 301. The DA conversion circuit 301 may be configured by a plurality of Digital-Analog Converters (DACs) 303. The DAC 303 outputs a data signal to the signal line 110 according to the gradation signal output by the display data control circuit 302.

[0021] Here, the DA conversion circuit 301 is not limited to the configuration shown in FIG. 3. For example, the DA conversion circuit 301 may be configured to include a gradation voltage generation circuit separately from the plurality of DACs 303, and the DAC 303 may output a data signal based on the gradation voltage generated by the gradation voltage generation circuit.

[0022] FIG. 4 is a block diagram showing a plan view of an example of the configuration of the light-emitting device 101 in the present embodiment. The display data control board 103 is arranged on the display board 102. The display board 102 and the display data control board 103 may be interconnected, for example, by chip-on-chip mounting. That is, a structure is adopted in which a plurality of input terminals provided on the display board 102 and a plurality of output terminals provided on the display data control board 103 are electrically connected to each other. Further, the drive circuit 107 is arranged between the pixel array 105 and the display data control board 103. As described above, the drive circuit 107 receives the data signal output from the display data control board 103 and outputs a luminance signal having a signal voltage based on the data signal to the data signal line 109.

[0023] In this embodiment, the driving circuit 107 is arranged on the display substrate 102. The driving force of the driving circuit 107 can be determined according to the load capacitance of the data signal line 109 determined by specifications such as the number and size of the pixels 104 arranged in the pixel array 105 included in the display substrate 102. Therefore, in order to make the driving force of the driving circuit 107 larger than necessary, it is not necessary to increase the circuit area required for the driving circuit 107. Therefore, an increase in the size of the display substrate 102 can be suppressed, and the manufacturing cost can be kept low. Also, the driving circuit 107 does not require high-speed digital signal processing and requires an operating voltage equivalent to that of the pixel 104 to drive the pixel 104. Therefore, for example, the transistors included in the pixel 104 arranged in the pixel array 105, the transistors included in the vertical scanning circuit 106, and the transistors included in the driving circuit 107 may have the same gate insulating film thickness. In other words, the transistors included in the pixel 104 arranged in the pixel array 105, the transistors included in the vertical scanning circuit 106, and the transistors included in the driving circuit 107, which are formed on the display substrate 102, may be formed using the same process rules. From this perspective too, it can be said that the manufacturing cost can be kept low. On the other hand, the signal processing circuit 300 arranged on the display data control substrate 103 may include transistors that are more miniaturized than the transistors arranged in the pixel 104, the vertical scanning circuit 106, and the driving circuit 107 arranged in the pixel array 105. As described above, the display data control substrate 103 can be arranged on the display substrate 102 by chip-on-chip mounting. Therefore, it may be easy to adopt different process rules for the process rules for manufacturing the pixel array 105, the vertical scanning circuit 106, and the driving circuit 107 arranged on the display substrate 102 and the process rules for manufacturing the signal processing circuit 300 arranged on the display data control substrate 103, respectively.

[0024] In addition, the load capacitance of the signal line 110 connected to the display data control board 103 does not vary significantly depending on specifications such as the number and size of the pixels 104 arranged in the pixel array 105 provided on the display board 102. Therefore, it is possible to use a common display data control board 103 for a plurality of display boards 102 with various specifications. As a result, the design cost and manufacturing cost of the display data control board 103 can be kept low.

[0025] Next, with reference to FIG. 5, a modified example of the light-emitting device 101 shown in FIG. 4 will be described. In the configuration shown in FIG. 5, the display data control board 103 is arranged so as to overlap with the drive circuit 107. For example, in a plan view, at least a part of the drive circuit 107 in the display board 102 and the signal processing circuit 300 in the display data control board 103 are arranged so as to overlap. Here, the plan view may indicate an orthographic projection view with respect to the surface on which the pixel array 105, the vertical scanning circuit 106, and the drive circuit 107 of the display board 102 are arranged in the light-emitting device 101. Since the other configurations may be the same as those described above, the following description will focus on the differences.

[0026] In the configuration shown in FIG. 5, the display data control board 103 is arranged so as to overlap a part of the drive circuit 107 on the display board 102. The display data control board 103 is configured to be electrically interconnected with the display board 102 through a plurality of electrodes 501 including output terminals for outputting data signals, for example, by chip-on-chip mounting. In other words, one or more of the plurality of electrodes 501 are output terminals for outputting data signals that are connected via signal lines 110 to input terminals for receiving data signals provided on the display board 102. In the configuration shown in FIG. 5, the following description will be made assuming that the electrode 501a among the electrodes 501 arranged on the display data control board 103 is an output terminal for outputting data signals. Also, on the display board 102, a plurality of electrodes 511 are arranged at positions overlapping the plurality of electrodes 501 arranged on the display data control board 103, and the electrodes 501 and the electrodes 511 can be connected to each other. Here, the electrode 511a as an input terminal for receiving data signals among the plurality of electrodes 511 arranged on the display board 102 is arranged so as to overlap the electrode 501a.

[0027] In the configuration shown in FIG. 5, the drive circuit 107 is arranged in the lower region of the display data control board 103, which was a dead space in the configuration shown in FIG. 4. Thereby, it becomes possible to further reduce the substrate area of the display board 102. Also, compared with the configuration shown in FIG. 4, the display data control board 103 and the drive circuit 107 are arranged closer to each other, and the load capacitance of the signal lines 110 can be reduced. Therefore, it can be said that the configuration shown in FIG. 5 is a more advantageous configuration than the configuration shown in FIG. 4 in that the light-emitting device 101 can be driven even when the output driving force of the display data control board 103 is low.

[0028] Also, as shown in FIG. 5, in a plan view, an electrode 501a that functions as an output terminal for outputting a data signal arranged on the display data control substrate 103 may be arranged so as to overlap with the drive circuit 107. According to such an arrangement, the load capacitance of the signal line 110 connecting the electrode 501a and the drive circuit 107 can be further reduced. Therefore, the configuration shown in FIG. 5 can be said to be an advantageous configuration from the viewpoint of the driving force of the display data control substrate 103, similar to the above. At that time, an electrode 511a that functions as an input terminal for receiving the data signal arranged on the display substrate 102 may be arranged so as to overlap with the drive circuit 107. Thereby, the load capacitance of the signal line 110 connecting the output terminal (electrode 501a) of the signal processing circuit 300 and the input terminal (electrode 511a) of the drive circuit 107 can be made smaller.

[0029] The configuration shown in FIG. 5 shows a configuration in which a part of the electrodes 501 arranged on the display data control substrate 103 overlaps with a part of the drive circuit 107. However, it is not limited to this. For example, a plurality of electrodes 501 may be arranged so as not to overlap with the drive circuit 107. Also, the configuration shown in FIG. 5 shows a configuration in which the display data control substrate 103 is arranged so as not to overlap with a part of the drive circuit 107. However, it is not limited to this. For example, the display data control substrate 103 may be arranged so as to cover the entire drive circuit 107.

[0030] Next, with reference to FIGS. 6 and 7, a further modification example of the light-emitting device 101 will be described. In the configuration shown in FIGS. 6 and 7, the display data control substrate 103 is arranged on the flexible substrate 601. The other configurations may be the same as those of the above-described embodiments, and hereinafter, the description will focus on the configurations different from the above-described embodiments.

[0031] FIG. 6 is a block diagram showing an example of the configuration of the light-emitting device 101 according to the present embodiment. The display data control board 103 is arranged on the flexible board 601, for example, by chip-on-film mounting. The flexible board 601 is electrically connected to the display board 102 via a plurality of electrodes 602. The electrode 602 is connected to a wiring pattern 603 on the flexible board 601. The signal processing circuit 300 arranged on the display data control board 103 outputs a data signal to the drive circuit 107 via the electrode 602 that functions as an output terminal for outputting a data signal among the plurality of electrodes 602 and the wiring pattern 603 connected to the electrode 602 that functions as an output terminal.

[0032] In the configuration shown in FIG. 6, in order to clearly show the display data control board 103 arranged on the flexible board 601, the flexible board 601 is shown as extending downward from the display board 102 in the drawing. However, it is not limited to this. For example, using the flexibility of the flexible board 601, in a plan view, at least a part of the drive circuit 107 and the signal processing circuit 300 of the display data control board 103 may be arranged so as to overlap. Also, for example, the display data control board 103 may be arranged so as to cover at least a part of the drive circuit 107. Thereby, miniaturization of the light-emitting device 101 can be achieved.

[0033] FIG. 7 is a circuit diagram showing a configuration example different from the configuration shown in FIG. 3 of the signal processing circuit 300 arranged on the display data control board 103. The signal processing circuit 300 shown in FIG. 7 includes a voltage buffer circuit 701 in addition to the DA conversion circuit 301 and the display data control circuit 302 arranged in the signal processing circuit 300 shown in FIG. 3. The voltage buffer circuit 701 can be constituted by, for example, a plurality of voltage buffers 702. The voltage buffer circuit 701 outputs a signal generated according to the output of the DA conversion circuit 301 to the drive circuit 107 as a data signal. More specifically, the voltage buffer 702 is configured to receive the output of the DAC 303 and output the buffered data signal to the signal line 110.

[0034] In the configuration shown in FIG. 6, there may be a case where the load capacitance caused by the wiring pattern 603 and the electrodes 602 on the flexible substrate 601 is large, and the driving force of the DAC 303 is insufficient, resulting in the inability to obtain a predetermined emission luminance in the pixel array 105. Even in such a case, by using a configuration including the voltage buffer circuit 701 shown in FIG. 7, it becomes possible to avoid the insufficient driving force of the DAC 303. Here, an example in which the display data control board 103 is arranged on the flexible substrate 601 has been given, and it has been described that the voltage buffer circuit 701 is arranged in the signal processing circuit 300 included in the display data control board 103. However, it is not limited thereto, and in the configurations shown in FIGS. 4 and 5, the voltage buffer circuit 701 may be arranged in the signal processing circuit 300 included in the display data control board 103. The voltage buffer circuit 701 may be appropriately arranged according to the driving force required by the display data control board 103 (signal processing circuit 300).

[0035] Even when the display data control board 103 is chip-on-film mounted as in the light-emitting device 101 shown in FIG. 6, the display board 102 can determine the driving force of the driving circuit 107 according to the load capacitance of the data signal line 109. Also, similar to the above-described configuration, the load capacitance of the signal line 110 connected to the display data control board 103 does not vary significantly depending on specifications such as the number and size of the pixels 104 arranged in the pixel array 105 provided in the display board 102. Therefore, for a plurality of display boards 102 with various specifications, it is possible to use a general-purpose and appropriate display data control board 103 according to the load capacitance caused by the electrodes 602 and the wiring pattern 603 arranged on the flexible substrate 601. As a result, in the configurations shown in FIGS. 6 and 7, the design cost and manufacturing cost of the display data control board 103 can be kept low.

[0036] Here, application examples of applying the light-emitting device 101 of the present embodiment to an image forming apparatus, a display device, a photoelectric conversion device, an electronic device, a lighting device, a moving body, and a wearable device will be described with reference to FIGS. 8(a), 8(b) to FIGS. 16(a), 16(b). It is assumed that an organic light-emitting element such as an organic EL element using an organic light-emitting material is disposed in the pixel 104 of the light-emitting device 101. First, after showing the details of each configuration disposed in the pixel 104 among the above-described light-emitting devices 101, application examples will be described.

[0037] Configuration of Organic Light-Emitting Element The organic light-emitting element is provided by forming an insulating layer, a first electrode, an organic compound layer, and a second electrode on a substrate. A protective layer, a color filter, a microlens, etc. may be provided on the cathode. When a color filter is provided, a planarization layer may be provided between the protective layer and the color filter. The planarization layer can be configured using an acrylic resin or the like. The same applies when a planarization layer is provided between the color filter and the microlens.

[0038] Substrate Examples of the substrate include quartz, glass, silicon wafer, resin, metal, etc. Also, a switching element such as a transistor and a wiring pattern are provided on the substrate, and an insulating layer may be provided thereon. The insulating layer may be made of any material as long as contact holes can be formed so that a wiring pattern can be formed between the first electrode and the substrate, and insulation from non-connected wiring patterns can be ensured. For example, resins such as polyimide, silicon oxide, silicon nitride, etc. may be used for the insulating layer.

[0039] Electrode As the electrodes, a pair of electrodes can be used. The pair of electrodes may be an anode and a cathode. When an electric field is applied in the direction in which the organic light-emitting element emits light, the electrode with a higher potential is the anode and the other is the cathode. Also, it can be said that the electrode that supplies holes to the light-emitting layer is the anode and the electrode that supplies electrons is the cathode.

[0040] As the constituent material of the anode, a material with a large work function may be selected. For example, simple metals such as gold, platinum, silver, copper, nickel, palladium, cobalt, selenium, vanadium, tungsten, mixtures containing these, alloys combining these, and metal oxides such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), indium zinc oxide can be used. Also, conductive polymers such as polyaniline, polypyrrole, and polythiophene can be used as the constituent material of the anode.

[0041] These electrode materials may be used alone or in combination of two or more. Also, the anode may be composed of one layer or multiple layers.

[0042] When using the electrode as a reflective electrode, for example, chromium, aluminum, silver, titanium, tungsten, molybdenum, or alloys thereof, laminates of these, etc. can be used. With the above materials, it is also possible to function as a reflective film without having the role of an electrode. Also, when using a transparent electrode as the electrode, oxide transparent conductive layers such as indium tin oxide (ITO), indium zinc oxide, etc. can be used, but it is not limited to these. Photolithography technology can be used for the formation of the electrode.

[0043] On one hand, as a constituent material of the cathode, a material with a small work function may be selected. For example, it includes alkali metals such as lithium, alkaline earth metals such as calcium, simple metals such as aluminum, titanium, manganese, silver, lead, chromium, and mixtures containing these. Alternatively, alloys combining these simple metals can also be used. For example, magnesium-silver, aluminum-lithium, aluminum-magnesium, silver-copper, zinc-silver, etc. can be used. The use of metal oxides such as indium tin oxide (ITO) is also possible. These electrode materials may be used alone or in combination of two or more. Also, the cathode may have a single-layer structure or a multi-layer structure. As the cathode, silver may be used, and to reduce the aggregation of silver, it may be a silver alloy. As long as the aggregation of silver can be reduced, the ratio of the alloy does not matter. For example, silver: other metals may be 1:1, 3:1, etc.

[0044] The cathode may be a top emission element using an oxide conductive layer such as ITO, or a bottom emission element using a reflective electrode such as aluminum (Al), and is not particularly limited. As a method for forming the cathode, although not particularly limited, when using a direct current or alternating current sputtering method, etc., the coverage of the formed film is good and the resistance of the cathode can be reduced.

[0045] Pixel isolation layer The pixel isolation layer may be formed of so-called silicon oxides such as silicon nitride (SiN), silicon oxynitride (SiON), and silicon oxide (SiO) formed using a chemical vapor deposition (CVD) method. To increase the in-plane resistance of the organic compound layer, the film thickness of the organic compound layer, especially the hole transport layer, may be formed thinner on the sidewalls of the pixel isolation layer. Specifically, by increasing the taper angle of the sidewalls of the pixel isolation layer and the film thickness of the pixel isolation layer, and increasing the peeling during evaporation, the film thickness of the organic processed layer on the sidewalls can be made thinner.

[0046] On the other hand, the pixel isolation layer can have its sidewall taper angle and film thickness adjusted such that voids are not formed in the protective layer formed thereon. By preventing voids from being formed in the protective layer, the occurrence of defects in the protective layer can be reduced. Since the occurrence of defects in the protective layer is reduced, the occurrence of reliability degradation such as the generation of dark spots and conduction failures in the second electrode can be reduced.

[0047] According to the present embodiment, even if the taper angle of the sidewall of the pixel isolation layer is not steep, it is possible to effectively suppress charge leakage to adjacent pixels. As a result of this study, it was found that sufficient reduction can be achieved if the taper angle is in the range of 60 degrees or more and 90 degrees or less. The film thickness of the pixel isolation layer may be 10 nm or more and 150 nm or less. Further, the same effect can be obtained even when the pixel electrode is composed only of a pixel electrode without a pixel isolation layer. However, in this case, the film thickness of the pixel electrode should be set to be half or less of the organic layer, or the end of the pixel electrode should be formed into a forward taper with an angle of less than 60° to reduce the short circuit of the organic light-emitting device.

[0048] Also, when the first electrode is a cathode and the second electrode is an anode, a high color gamut and low voltage driving can be achieved by forming an electron transport material and a charge transport layer, and a light-emitting layer on the charge transport layer.

[0049] Organic compound layer The organic compound layer may be formed as a single layer or as a plurality of layers. When there are a plurality of layers, depending on their functions, they may be referred to as a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, an electron injection layer, and the like. The organic compound layer is mainly composed of organic compounds, but may contain inorganic atoms or inorganic compounds. The organic compound layer may have, for example, copper, lithium, magnesium, aluminum, iridium, platinum, molybdenum, zinc, etc. The organic compound layer may be disposed between the first electrode and the second electrode, or may be disposed in contact with the first electrode and the second electrode.

[0050] Protective layer A protective layer may be provided on the cathode. For example, by adhering a glass provided with a moisture absorbent on the cathode, the intrusion of moisture and the like into the organic compound layer can be reduced, and the occurrence of display defects can be reduced. Further, as another embodiment, a passivation layer such as silicon nitride may be provided on the cathode to reduce the intrusion of moisture and the like into the organic compound layer. For example, after forming the cathode, it is transported to another chamber without breaking the vacuum, and silicon nitride with a thickness of 2 μm is formed by CVD method, which may also serve as a protective layer. After forming the protective layer by CVD method, a protective layer using atomic layer deposition (ALD) method may be provided. The material of the protective layer by ALD method is not limited, but may be silicon nitride, silicon oxide, aluminum oxide, etc. Silicon nitride may be further formed by CVD method on the protective layer formed by ALD method. The protective layer formed by ALD method may have a smaller film thickness than the protective layer formed by CVD method. Specifically, the film thickness of the protective layer formed by ALD method may be 50% or less, and further 10% or less of the film thickness of the protective layer formed by CVD method.

[0051] Color filter A color filter may be provided on the protective layer. For example, a color filter considering the size of the organic light-emitting element may be provided on another substrate, and the substrate on which the color filter is formed and the substrate on which the organic light-emitting element is provided may be bonded together. Also, for example, a color filter may be patterned on the above-described protective layer using photolithography technology. The color filter may be composed of a polymer.

[0052] Planarization layer A planarization layer may be disposed between the color filter and the protective layer. The planarization layer is provided for the purpose of reducing the unevenness of the layer below the planarization layer. Without limiting the purpose, it may sometimes be called a material resin layer. The planarization layer may be composed of an organic compound, and may be a low molecule or a high molecule. Considering the reduction of unevenness, a high-molecular organic compound may be used for the planarization layer.

[0053] The planarization layer may be provided above and below the color filter. In that case, the constituent materials of the respective planarization layers may be the same or different. Specifically, polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicon resin, urea resin, etc. can be mentioned as materials for the planarization layer.

[0054] Micro lens The organic light-emitting device may have an optical member such as a micro lens on its light-emitting side. The micro lens can be composed of an acrylic resin, an epoxy resin, etc. The micro lens may be for the purpose of increasing the amount of light extracted from the organic light-emitting device and controlling the direction of the extracted light. The micro lens may have a hemispherical shape. When having a hemispherical shape, among the tangents in contact with the hemisphere, there is a tangent parallel to the insulating layer, and the contact point between the tangent and the hemisphere is the vertex of the micro lens. The vertex of the micro lens can be determined similarly in any cross-sectional view. That is, among the tangents in contact with the semi-circle of the micro lens in the cross-sectional view, there is a tangent parallel to the insulating layer, and the contact point between the tangent and the semi-circle is the vertex of the micro lens.

[0055] Also, the midpoint of the micro lens can be defined. In the cross-section of the micro lens, a line segment from the point where the arc shape ends to the point where another arc shape ends is imagined, and the midpoint of the line segment can be called the midpoint of the micro lens. The cross-section for discriminating the vertex and the midpoint may be a cross-section perpendicular to the insulating layer.

[0056] The microlens has a first surface with a convex portion and a second surface opposite to the first surface. The second surface can be disposed closer to the functional layer (light-emitting layer) side than the first surface. To adopt such a configuration, it is necessary to form a microlens on the light-emitting device. When the functional layer is an organic layer, a process that becomes high temperature in the manufacturing process of the microlens may be avoided. Further, when the configuration is such that the second surface is disposed closer to the functional layer side than the first surface, the glass transition temperatures of all the organic compounds constituting the organic layer may be 100 °C or higher, and for example, it is suitable that they are 130 °C or higher.

[0057] Counter substrate The counter substrate may be disposed on the planarization layer. Since the counter substrate is provided at a position corresponding to the aforementioned substrate, it is called a counter substrate. The constituent material of the counter substrate may be the same as that of the aforementioned substrate. The counter substrate may be a second substrate when the aforementioned substrate is taken as the first substrate.

[0058] Organic layer The organic compound layers (hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc.) constituting the organic light-emitting element according to the embodiment of the present disclosure may be formed by the following method.

[0059] For the organic compound layers constituting the organic light-emitting element according to the embodiment of the present disclosure, dry processes such as vacuum evaporation, ionization evaporation, sputtering, and plasma can be used. Further, instead of the dry process, a wet process of dissolving in an appropriate solvent and forming a layer by a known coating method (for example, spin coating, dipping, casting method, LB method, inkjet method, etc.) can also be used.

[0060] Here, when a layer is formed by a method such as vacuum evaporation or solution coating method, crystallization and the like hardly occur, and the stability over time is excellent. Further, when forming a film by a coating method, a film can also be formed in combination with an appropriate binder resin.

[0061] Examples of the binder resin include, but are not limited to, polyvinyl carbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, urea resin, etc.

[0062] These binder resins may be used alone as one type of homopolymer or copolymer, or two or more types may be mixed and used. Furthermore, additives such as known plasticizers, antioxidants, and ultraviolet absorbers may be used in combination as necessary.

[0063] Pixel circuit The light-emitting device may have a pixel circuit connected to the light-emitting element. The pixel circuit may be an active matrix type that independently controls the light emission of the first light-emitting element and the second light-emitting element. The active matrix type circuit may be voltage programming or current programming. The driving circuit has a pixel circuit for each pixel. The pixel circuit may have a light-emitting element, a transistor for controlling the light emission luminance of the light-emitting element, a transistor for controlling the light emission timing, a capacitor for holding the gate voltage of the transistor for controlling the light emission luminance, and a transistor for connecting to GND without passing through the light-emitting element.

[0064] The light-emitting device has a display area and a peripheral area arranged around the display area. The display area has a pixel circuit, and the peripheral area has a display control circuit. The mobility of the transistors constituting the pixel circuit may be smaller than the mobility of the transistors constituting the display control circuit.

[0065] The slope of the current-voltage characteristics of the transistors constituting the pixel circuit may be smaller than the slope of the current-voltage characteristics of the transistors constituting the display control circuit. The slope of the current-voltage characteristics can be measured by the so-called Vg-Ig characteristics.

[0066] The transistors constituting the pixel circuit are transistors connected to a light-emitting element such as the first light-emitting element.

[0067] Pixel The organic light-emitting device has a plurality of pixels. Each pixel has sub-pixels that emit different colors from each other. The sub-pixels may have emission colors of RGB, for example.

[0068] The pixel emits light from a region also called a pixel aperture. The pixel aperture may be 15 μm or less and may be 5 μm or more. More specifically, it may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc.

[0069] The interval between sub-pixels may be 10 μm or less. Specifically, it may be 8 μm, 7.4 μm, 6.4 μm.

[0070] In a plan view, the pixel can take a known arrangement form. For example, it may be a stripe arrangement, a delta arrangement, a pentile arrangement, or a Bayer arrangement. The shape of the sub-pixel in the plan view may take any known shape. For example, it may be a rectangle, a quadrilateral such as a rhombus, a hexagon, etc. Of course, if it is not an exact figure but a shape close to a rectangle, it is included in the rectangle. The shape of the sub-pixel and the pixel arrangement can be used in combination.

[0071] Use of the organic light-emitting element according to the embodiment of the present disclosure The organic light-emitting element according to the embodiment of the present disclosure can be used as a component of a display device or a lighting device. In addition, there are applications such as an exposure light source of an electrophotographic image forming device, a backlight of a liquid crystal display device, and a light-emitting device having a color filter for a white light source.

[0072] The display device may be an image information processing device that has an image input unit for inputting image information from an area CCD, a linear CCD, a memory card, etc., has an information processing unit for processing the input information, and displays the input image on a display unit.

[0073] In addition, the display unit of an imaging device or an inkjet printer may have a touch panel function. The driving method of this touch panel function may be an infrared method, a capacitance method, a resistive film method, or an electromagnetic induction method, and is not particularly limited. Further, the display device may be used for the display unit of a multifunction printer.

[0074] Next, further description will be made with reference to the drawings. FIG. 8(a) is an example of a pixel 104 arranged in a light-emitting device 101. The pixel has a sub-pixel 810 (pixel 104). The sub-pixel is divided into 810R, 810G, and 810B according to its light emission. The emission color may be distinguished by the wavelength emitted from the light-emitting layer, or the light emitted from the sub-pixel may be selectively transmitted or color-converted by a color filter or the like. Each sub-pixel has a reflective electrode 802 which is a first electrode on an interlayer insulating layer 801, an insulating layer 803 covering the edge of the reflective electrode 802, an organic compound layer 804 covering the first electrode and the insulating layer, a transparent electrode 805 which is a second electrode, a protective layer 806, and a color filter 807.

[0075] A transistor or a capacitor element may be arranged in or under the interlayer insulating layer 801. The transistor and the first electrode may be electrically connected via a contact hole or the like (not shown).

[0076] The insulating layer 803 may also be called a bank or a pixel isolation film. The insulating layer 803 covers the edge of the first electrode and is arranged surrounding the first electrode. The portion of the first electrode where the insulating layer 803 is not arranged is in contact with the organic compound layer 804 and becomes a light-emitting region.

[0077] The organic compound layer 804 has a hole injection layer 841, a hole transport layer 842, a first light-emitting layer 843, a second light-emitting layer 844, and an electron transport layer 845.

[0078] The second electrode may be a transparent electrode, a reflective electrode, or a semi-transmissive electrode.

[0079] The protective layer 806 reduces the penetration of moisture into the organic compound layer. Although the protective layer is illustrated as a single layer, it may be a plurality of layers. Each layer may be an inorganic compound layer or an organic compound layer.

[0080] The color filter 807 is divided into 807R, 807G, and 807B according to its color. The color filter may be formed on a planarization film (not shown). Also, a resin protective layer (not shown) may be disposed on the color filter. Further, the color filter may be formed on the protective layer 806. Also, the color filter may be bonded after being provided on a counter substrate such as a glass substrate.

[0081] The display device 800 in FIG. 8(b) (corresponding to the above-described light-emitting device 101) describes an organic light-emitting element 826 and a TFT 818 as an example of a transistor. A substrate 811 such as glass or silicon and an insulating layer 812 are provided on the substrate. Active elements such as the TFT 818 are arranged on the insulating layer, and a gate electrode 813, a gate insulating film 814, and a semiconductor layer 815 of the active element are arranged. The TFT 818 is also composed of a semiconductor layer 815, a drain electrode 816, and a source electrode 817. An insulating film 819 is provided on the TFT 818. The anode 821 constituting the organic light-emitting element 826 and the source electrode 817 are connected through a contact hole 820 provided in the insulating film.

[0082] The method of electrical connection between the electrodes (anode, cathode) included in the organic light-emitting element 826 and the electrodes (source electrode, drain electrode) included in the TFT is not limited to the mode shown in FIG. 8(b). That is, it is sufficient that either one of the anode or the cathode is electrically connected to either one of the TFT source electrode or the drain electrode. The TFT refers to a thin-film transistor.

[0083] In the display device 800 of FIG. 8(b), the organic compound layer is illustrated as a single layer, but the organic compound layer 822 may be a plurality of layers. A first protective layer 824 and a second protective layer 825 for reducing the deterioration of the organic light-emitting element are provided on the cathode 823.

[0084] In the display device 800 of FIG. 8(b), a transistor is used as the switching element, but other switching elements may be used instead.

[0085] Also, the transistor used in the display device 800 of FIG. 8(b) is not limited to a transistor using a single crystal silicon wafer, and may be a thin film transistor having an active layer on an insulating surface of a substrate. Examples of the active layer include non-single crystal silicon such as single crystal silicon, amorphous silicon, and microcrystalline silicon, and non-single crystal oxide semiconductors such as indium zinc oxide and indium gallium zinc oxide. Note that a thin film transistor is also called a TFT element.

[0086] The transistor included in the display device 800 of FIG. 8(b) may be formed in a substrate such as a silicon substrate. Here, forming in the substrate means manufacturing a transistor by processing the substrate itself such as a silicon substrate. That is, having a transistor in the substrate can also be regarded as the substrate and the transistor being integrally formed.

[0087] The organic light-emitting element according to the present embodiment has its emission luminance controlled by a TFT which is an example of a switching element, and an image can be displayed according to the emission luminance of each organic light-emitting element by providing a plurality of organic light-emitting elements in a plane. Here, the switching element according to the present embodiment is not limited to a TFT, and may be a transistor formed of low-temperature polysilicon or an active matrix driver formed on a substrate such as a silicon substrate. "On the substrate" can also mean "in the substrate". Whether to provide a transistor in the substrate or use a TFT is selected according to the size of the display portion. For example, if the size is about 0.5 inches, an organic light-emitting element may be provided on a silicon substrate.

[0088] Figs. 9(a) to 9(c) are schematic diagrams showing an example of an image forming apparatus using the light emitting device 101 of the present embodiment. The image forming apparatus 926 shown in Fig. 9(a) includes a photoreceptor 927, an exposure light source 928, a developing unit 931, a charging unit 930, a transferrer 932, a conveying unit 933 (a conveying roller in the configuration of Fig. 9(a)), and a fixing unit 935.

[0089] Light 929 is irradiated from the exposure light source 928, and an electrostatic latent image is formed on the surface of the photoreceptor 927. The light emitting device 101 can be applied to this exposure light source 928. The developing unit 931 can function as a developer that contains toner or the like as a developer and applies the developer to the exposed photoreceptor 927. The charging unit 930 charges the photoreceptor 927. The transferrer 932 transfers the developed image onto the recording medium 934. The conveying unit 933 conveys the recording medium 934. The recording medium 934 can be, for example, paper or film. The fixing unit 935 fixes the image formed on the recording medium.

[0090] Figs. 9(b) and 9(c) are schematic diagrams showing a state in which a plurality of light emitting portions 936 are arranged along the longitudinal direction on a long substrate in the exposure light source 928. The light emitting device 101 can be applied to this light emitting portion 936. That is, a plurality of pixels 104 are arranged along the longitudinal direction of the substrate. The direction 937 is a direction parallel to the axis of the photoreceptor 927. This column direction is the same as the direction of the axis when the photoreceptor 927 rotates. This direction 937 can also be called the major axis direction of the photoreceptor 927.

[0091] FIG. 9(b) shows a form in which the light-emitting part 936 is arranged along the major axis direction of the photoreceptor 927. FIG. 9(c) is a modification of the arrangement of the light-emitting part 936 shown in FIG. 9(b), and is a form in which the light-emitting parts 936 are alternately arranged in the column direction in each of the first column and the second column. In the first column and the second column, the light-emitting parts 936 are arranged at different positions in the row direction. In the first column, a plurality of light-emitting parts 936 are arranged at intervals, and in the second column, the light-emitting parts 936 are arranged at positions corresponding to the gaps between the light-emitting parts 936 in the first column. Also, in the row direction, a plurality of light-emitting parts 936 are arranged at intervals. The arrangement of the light-emitting parts 936 shown in FIG. 9(c) can also be described as, for example, a state of being arranged in a grid pattern, a state of being arranged in a staggered grid, or a checkered pattern.

[0092] FIG. 10 is a schematic diagram showing an example of a display device using the light-emitting device 101 of the present embodiment. The display device 1000 may have a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. The touch panel 1003 and the display panel 1005 are connected to flexible printed circuits FPC1002 and 1004. Active elements such as transistors are arranged on the circuit board 1007. The battery 1008 may not be provided if the display device 1000 is not a portable device, or even if it is a portable device, it does not need to be provided at this position. The light-emitting device 101 can be applied to the display panel 1005. The pixel 104 arranged in the light-emitting device 101 functioning as the display panel 1005 is connected to and operates with active elements such as transistors arranged on the circuit board 1007.

[0093] The display device 1000 shown in FIG. 10 may be used in a display unit of a photoelectric conversion device (which may also be called an imaging device) having an optical unit with a plurality of lenses and an imaging element that receives the light passing through the optical unit and performs photoelectric conversion into an electrical signal. The photoelectric conversion device may have a display unit that displays the information acquired by the imaging element. Further, the display unit may be a display unit exposed to the outside of the photoelectric conversion device or a display unit disposed in a viewfinder. The photoelectric conversion device may be a digital camera or a digital video camera.

[0094] FIG. 11 is a schematic diagram showing an example of a photoelectric conversion device using the light-emitting device 101 of the present embodiment. The photoelectric conversion device 1100 may have a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The photoelectric conversion device 1100 may also be called an imaging device. The light-emitting device 101 of the present embodiment can be applied to the viewfinder 1101 and the rear display 1102 which are display units. In this case, the light-emitting device 101 may display not only the image to be captured but also environmental information, imaging instructions, and the like. The environmental information may include the intensity of external light, the direction of external light, the moving speed of the subject, the possibility that the subject is shielded by an obstacle, and the like.

[0095] Since the timing suitable for imaging is often a very short time, it is better to display information as soon as possible. Therefore, the light-emitting device 101 in which pixels 104 including a light-emitting element using an organic light-emitting material such as an organic EL element are arranged may be used for the viewfinder 1101 and the rear display 1102. This is because the organic light-emitting material has a high response speed. The light-emitting device 101 using an organic light-emitting material is more suitable for these devices that require a display speed than a liquid crystal display device.

[0096] The photoelectric conversion device 1100 has an optical unit (not shown). The optical unit has a plurality of lenses and forms an image on a photoelectric conversion element (not shown) housed in the housing 1104 that receives the light passing through the optical unit. The plurality of lenses can adjust the focus by adjusting their relative positions. This operation can also be performed automatically.

[0097] The light-emitting device 101 may be applied to the display unit of an electronic device. In that case, it may have both a display function and an operation function. Examples of the portable terminal include a mobile phone such as a smartphone, a tablet, and a head-mounted display.

[0098] FIG. 12 is a schematic diagram showing an example of an electronic device using the light-emitting device 101 of the present embodiment. The electronic device 1200 includes a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may include a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a reaction unit of a touch panel method. The operation unit 1202 may be a biometric recognition unit that recognizes a fingerprint and performs operations such as unlocking. A portable device having a communication unit can also be called a communication device. The light-emitting device 101 of the present embodiment can be applied to the display unit 1201.

[0099] FIGS. 13(a) and 13(b) are schematic diagrams showing an example of a display device using the light-emitting device 101 of the present embodiment. FIG. 13(a) is a display device such as a TV monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The light-emitting device 101 of the present embodiment can be applied to the display unit 1302. The display device 1300 may have a base 1303 that supports the frame 1301 and the display unit 1302. The base 1303 is not limited to the form of FIG. 13(a). For example, the lower side of the frame 1301 may also serve as the base 1303. Further, the frame 1301 and the display unit 1302 may be bent. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0100] FIG. 13(b) is a schematic diagram showing another example of a display device using the light-emitting device 101 of the present embodiment. The display device 1310 in FIG. 13(b) is configured to be foldable and is a so-called foldable display device. The display device 1310 includes a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The light-emitting device 101 of the present embodiment can be applied to the first display unit 1311 and the second display unit 1312. The first display unit 1311 and the second display unit 1312 may be a single seamless display device. The first display unit 1311 and the second display unit 1312 can be separated at the bending point. The first display unit 1311 and the second display unit 1312 may display different images, or may display a single image with the first display unit and the second display unit.

[0101] FIG. 14 is a schematic diagram showing an example of an illumination device using the light-emitting device 101 of the present embodiment. The illumination device 1400 may include a housing 1401, a light source 1402, a circuit board 1403, an optical film 1404, and a light diffusing portion 1405. The light-emitting device 101 of the present embodiment can be applied to the light source 1402. The optical film 1404 may be a filter that improves the color rendering property of the light source. The light diffusing portion 1405 can effectively diffuse the light of the light source, such as lighting up, and deliver the light to a wide range. If necessary, a cover may be provided on the outermost side. The illumination device 1400 may have both the optical film 1404 and the light diffusing portion 1405, or may have only one of them.

[0102] The lighting device 1400 is a device for lighting, for example, an indoor space. The lighting device 1400 may emit light of any color from white, warm white, to other colors from blue to red. It may have a dimming circuit for dimming them. The lighting device 1400 may have a power supply circuit connected to the light-emitting device 101 that functions as a light source 1402. The power supply circuit is a circuit that converts an AC voltage into a DC voltage. Also, white has a color temperature of 4200K and warm white has a color temperature of 5000K. Further, the lighting device 1400 may have a color filter. Additionally, the lighting device 1400 may have a heat dissipation part. The heat dissipation part releases the heat inside the device to the outside of the device, and examples include metals with a high specific heat and liquid silicon.

[0103] FIG. 15 is a schematic diagram of an automobile having a tail lamp, which is an example of a vehicle lamp using the light-emitting device 101 of the present embodiment. The automobile 1500 has a tail lamp 1501, and when a brake operation or the like is performed, the tail lamp 1501 may be lit. The light-emitting device 101 of the present embodiment may be used as a head lamp as a vehicle lamp. An automobile is an example of a moving body, and the moving body may be a ship, a drone, an aircraft, a railway vehicle, an industrial robot, or the like. The moving body may have a body and a lamp provided thereon. The lamp may notify the current position of the body.

[0104] The light-emitting device 101 of the present embodiment can be applied to the tail lamp 1501. The tail lamp 1501 may have a protection member that protects the light-emitting device 101 that functions as the tail lamp 1501. The protection member has a certain degree of strength, and the material may be any as long as it is transparent, and it may be made of polycarbonate or the like. Also, the protection member may be mixed with a phthalic acid derivative, an acrylonitrile derivative, or the like in polycarbonate.

[0105] Automobile 1500 may have a vehicle body 1503 and a window 1502 attached thereto. The window may be a window for checking the front and rear of the automobile, or may be a transparent display such as a head-up display. The light-emitting device 101 of the present embodiment may be used for the transparent display. In this case, constituent materials such as electrodes included in the light-emitting device 101 are formed of transparent members.

[0106] With reference to FIGS. 16(a) and 16(b), a further application example of the light-emitting device 101 of the present embodiment will be described. The light-emitting device 101 can be applied to a system that can be worn as a wearable device such as smart glasses, a head-mounted display (HMD), or smart contact. The imaging display device used in such an application example has an imaging device capable of photoelectrically converting visible light and a light-emitting device capable of emitting visible light.

[0107] FIG. 16(a) illustrates glasses 1600 (smart glasses) according to one application example. An imaging device 1602 such as a CMOS sensor or a SPAD is provided on the front surface side of the lens 1601 of the glasses 1600. Further, the light-emitting device 101 of the present embodiment is provided on the back surface side of the lens 1601.

[0108] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power supply that supplies power to the imaging device 1602 and the light-emitting device 101 according to each embodiment. Further, the control device 1603 controls the operations of the imaging device 1602 and the light-emitting device 101. An optical system for condensing light onto the imaging device 1602 is formed in the lens 1601.

[0109] FIG. 16(b) illustrates glasses 1610 (smart glasses) according to one application example. The glasses 1610 have a control device 1612, and an imaging device corresponding to the imaging device 1602 and a light emitting device 101 are mounted on the control device 1612. An optical system for projecting light emitted from the imaging device and the light emitting device 101 is formed in the lens 1611, and an image is projected onto the lens 1611. The control device 1612 functions as a power supply for supplying power to the imaging device and the light emitting device 101, and controls the operations of the imaging device and the light emitting device 101. The control device 1612 may have a gaze detection unit that detects the wearer's gaze. Infrared rays may be used for gaze detection. The infrared light emitting unit emits infrared light to the eyeball of the user who is gazing at the display image. An imaging image of the eyeball is obtained by detecting the reflected light of the emitted infrared light from the eyeball by an imaging unit having a light receiving element. By having a reducing means for reducing the light from the infrared light emitting unit to the display unit in a plan view, a decrease in image quality is reduced.

[0110] The user's gaze with respect to the display image is detected from the imaging image of the eyeball obtained by imaging infrared light. Any known method can be applied to gaze detection using the imaging image of the eyeball. As an example, a gaze detection method based on the Purkinje image by reflection of irradiation light on the cornea can be used.

[0111] More specifically, a gaze detection process based on the pupil corneal reflection method is performed. Using the pupil corneal reflection method, a gaze vector representing the orientation (rotation angle) of the eyeball is calculated based on the image of the pupil and the Purkinje image included in the imaging image of the eyeball, whereby the user's gaze is detected.

[0112] The light emitting device 101 according to the embodiment of the present disclosure may have an imaging device having a light receiving element, and may control a display image based on the user's gaze information from the imaging device.

[0113] Specifically, the light-emitting device 101 determines a first viewing area that the user gazes at and a second viewing area outside the first viewing area based on the line-of-sight information. The first viewing area and the second viewing area may be determined by the control device of the light-emitting device 101, or may be received from an external control device. In the display area of the light-emitting device 101, the display resolution of the first viewing area may be controlled to be higher than that of the second viewing area. That is, the resolution of the second viewing area may be made lower than that of the first viewing area.

[0114] Further, the display area has a first display area and a second display area different from the first display area, and an area with a higher priority is determined from the first display area and the second display area based on the line-of-sight information. The first display area and the second display area may be determined by the control device of the light-emitting device 101, or may be received from an external control device. The resolution of the area with a higher priority may be controlled to be higher than that of the area other than the area with a higher priority. That is, the resolution of the area with a relatively lower priority may be made lower.

[0115] Note that AI may be used to determine the first viewing area or the area with a higher priority. AI may be a model configured to estimate the angle of the line of sight and the distance to the object at the tip of the line of sight from the eye image using the eye image and the direction in which the eye in the image is actually looking as teacher data. The AI program may be possessed by the light-emitting device 101, the imaging device, or an external device. When possessed by an external device, it is transmitted to the light-emitting device 101 via communication.

[0116] When performing display control based on visual recognition detection, it can be applied to smart glasses further having an imaging device for imaging the outside. The smart glasses can display the imaged external information in real time.

[0117] The disclosure of this specification includes the following light-emitting devices, photoelectric conversion devices, and electronic devices.

[0118] (Item 1) A first substrate on which a data signal line and a plurality of pixels connected to the data signal line are arranged, A second substrate provided with a signal processing circuit including a digital-to-analog conversion circuit for supplying a data signal based on the input image data to the plurality of pixels, A light-emitting device comprising: The first substrate further includes a driving circuit that supplies a signal voltage based on the data signal input from the signal processing circuit to the data signal line, A light-emitting device, wherein in a plan view, at least a part of the driving circuit on the first substrate and the signal processing circuit on the second substrate are arranged so as to overlap each other.

[0119] (Item 2) The light-emitting device according to Item 1, wherein the second substrate is arranged so as to cover at least a part of the driving circuit.

[0120] (Item 3) The second substrate includes an output terminal for outputting the data signal, The light-emitting device according to Item 1 or 2, wherein in a plan view, the output terminal is arranged so as to overlap the driving circuit.

[0121] (Item 4) The first substrate includes an input terminal for receiving the data signal, The light-emitting device according to Item 3, wherein in a plan view, the input terminal is arranged so as to overlap the driving circuit.

[0122] (Item 5) The signal processing circuit further includes a voltage buffer circuit, The light-emitting device according to any one of Items 1 to 4, wherein the voltage buffer circuit outputs a generated signal corresponding to the output of the digital-to-analog conversion circuit as the data signal to the driving circuit.

[0123] (Item 6) The light-emitting device according to any one of Items 1 to 5, wherein the first substrate and the second substrate are chip-on-chip mounted.

[0124] (Item 7) The light-emitting device according to any one of Items 1 to 5, wherein the second substrate is disposed on the flexible substrate by chip-on-film mounting.

[0125] (Item 8) The plurality of pixels include pixels each including a first transistor. The driving circuit includes a second transistor. The light-emitting device according to any one of Items 1 to 7, wherein gate insulating film thicknesses of the first transistor and the second transistor are the same as each other.

[0126] (Item 9) The light-emitting device according to any one of Items 1 to 8, wherein gate insulating film thicknesses of transistors respectively disposed in each of the plurality of pixels and transistors disposed in the driving circuit are the same as each other.

[0127] (Item 10) The signal processing circuit includes transistors that are more miniaturized than transistors disposed in the plurality of pixels and the driving circuit, the light-emitting device according to any one of Items 1 to 9.

[0128] (Item 11) An optical unit having a plurality of lenses, an image sensor that receives light that has passed through the optical unit, and a display unit that displays an image. The display unit displays an image captured by the image sensor and has a light-emitting device according to any one of Items 1 to 10, the photoelectric conversion device.

[0129] (Item 12) A housing provided with a display unit, and a communication unit provided in the housing and communicating with the outside. The display unit has a light-emitting device according to any one of Items 1 to 10, the electronic device.

[0130] The invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the claims are appended to disclose the scope of the invention.

Explanation of Signs

[0131] 100: Light-emitting device, 101: Substrate, 110: Reflective electrode, 111: Insulating layer, 111c: Electrode separation part, 112: Contact electrode, 112a, 112b: Parts, 113, 116: Electrodes, 115: Organic functional layer, 151: Main surface, 201: Pixel

Claims

1. A first substrate on which a data signal line and a plurality of pixels connected to the data signal line are arranged; A second substrate on which a signal processing circuit including a digital-to-analog conversion circuit is arranged to supply a data signal based on input image data to the plurality of pixels; A light-emitting device comprising: The first substrate further includes a driving circuit that supplies a signal voltage based on the data signal input from the signal processing circuit to the data signal line; A light-emitting device, wherein in a plan view, at least a part of the driving circuit on the first substrate and the signal processing circuit on the second substrate are arranged so as to overlap each other.

2. The light-emitting device according to claim 1, wherein the second substrate is arranged so as to cover at least a part of the driving circuit.

3. The second substrate includes an output terminal for outputting the data signal, A light-emitting device according to claim 1, wherein in a plan view, the output terminal is arranged so as to overlap the driving circuit.

4. The first substrate includes an input terminal for receiving the data signal, A light-emitting device according to claim 3, wherein in a plan view, the input terminal is arranged so as to overlap the driving circuit.

5. The signal processing circuit further includes a voltage buffer circuit, The light-emitting device according to claim 1, wherein the voltage buffer circuit outputs a generated signal corresponding to the output of the digital-to-analog conversion circuit as the data signal to the driving circuit.

6. The light-emitting device according to claim 1, wherein the first substrate and the second substrate are chip-on-chip mounted.

7. The light-emitting device according to claim 1, wherein the second substrate is disposed on the flexible substrate by chip-on-film mounting.

8. The plurality of pixels include pixels each including a first transistor, The driving circuit includes a second transistor, The light-emitting device according to claim 1, wherein gate insulating film thicknesses of the first transistor and the second transistor are the same as each other.

9. The light-emitting device according to claim 1, wherein gate insulating film thicknesses of transistors disposed in each of the plurality of pixels and transistors disposed in the driving circuit are the same as each other.

10. The light-emitting device according to claim 1, wherein the signal processing circuit includes transistors that are more miniaturized than transistors disposed in the plurality of pixels and the driving circuit.

11. An optical unit having a plurality of lenses, an imaging device that receives light that has passed through the optical unit, and a display unit that displays an image, The display unit displays an image captured by the imaging device and has the light-emitting device according to any one of claims 1 to 10. A photoelectric conversion device characterized by that.

12. A housing provided with a display unit, and a communication unit provided in the housing and communicating with the outside, The display unit has the light-emitting device according to any one of claims 1 to 10. An electronic device characterized by that.

Images