Curing board
The curing board addresses the issue of slipping on wet surfaces by incorporating an embossed linear low-density polyethylene anti-slip layer, ensuring effective slip resistance and safety in both dry and wet conditions.
Patent Information
- Application Number
- JP2023207240
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-12-07
- Publication Date
- 2025-06-19
AI Technical Summary
Existing curing boards with embossed polyethylene films or release film layers are effective in dry conditions but become slippery when wet, compromising construction or moving work efficiency.
A curing board with a board body comprising a cushion layer, a board material layer, and an anti-slip layer made of a linear low-density polyethylene film, which is embossed to enhance slip resistance, ensuring effective anti-slip performance in both dry and wet conditions.
The curing board maintains excellent anti-slip properties in both dry and wet states, preventing slips and ensuring safer working conditions, while also providing impact resistance and waterproofing.
Smart Images

Figure 2025091785000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a curing board for covering and protecting a surface to be cured such as a floor surface.
Background Art
[0002] During construction work or moving work, a curing board is used to protect the floor surface from scratches, dirt, etc. by covering the floor surface. For example, Patent Document 1 discloses a curing board in which an embossed sheet, a paper material, and a cushion material are laminated in this order from the front surface side to the back surface side. Patent Document 2 discloses a curing board in which a release film layer, a moisture-proof layer, a board material layer, and a cushion layer are laminated in this order from the front surface side to the back surface side.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Patent Document 2
Summary of the Invention
Problems to be Solved by the Invention
[0004] The embossed sheet on the surface of the curing board disclosed in Patent Document 1 is composed of a polyethylene film subjected to embossing. The release film layer on the surface of the curing board disclosed in Patent Document 2 is composed of a polyethylene film. Although the surfaces of these curing boards are excellent in anti-slip properties in a dry state, they tend to be slippery when the surface is wet due to the influence of rain or the like. Therefore, in a state where the surface is wet, the efficiency of construction work or moving work may deteriorate.
[0005] The present invention has been made in view of the above circumstances, and an object thereof is to provide a curing board that is excellent in anti-slip performance not only in a dry state but also in a state where the surface is wet.
Means for Solving the Problems
[0006] The curing board of the present invention is a curing board for covering and protecting the surface to be cured, and includes a board body that covers the surface to be cured, and an anti-slip layer provided on the surface of the board body opposite to the surface to be cured and made of a linear low-density polyethylene film.
[0007] According to the present invention, compared with a curing board provided with other types of polyethylene films on the surface, it is excellent in anti-slip performance not only in a dry state but also in a state where the surface is wet. Further, in the present invention, since the anti-slip layer is composed of a linear low-density polyethylene film, a curing board excellent in waterproof performance can be provided.
[0008] In the above invention, it is preferable that the slip resistance value of the surface of the anti-slip layer is 0.60 or more and 0.70 or less in both the dry state and the water spraying state.
[0009] According to the above configuration, even when a person operates on the curing board in a state where the surface of the curing board is wet, it is possible to surely prevent the person from slipping at that time.
[0010] In the above invention, it is preferable that the anti-slip layer is embossed.
[0011] According to the above configuration, unevenness is formed on the surface of the anti-slip layer, so the anti-slip performance of the curing board is further improved.
[0012] In the above invention, the board body includes a cushion layer and a board material layer. The cushion layer includes a cushioning material, and the board material layer is preferably provided between the cushion layer and the anti-slip layer and includes cardboard.
[0013] According to the above configuration, the curing board is resistant to impact, excellent in shock buffering property, and can maintain its strength.
Effect of the Invention
[0014] According to the present invention, it is possible to provide a curing board that is excellent in anti-slip property not only in a dry state but also in a state where the surface is wet.
Brief Description of the Drawings
[0015]
Figure 1
Figure 2
Figure 3
Mode for Carrying Out the Invention
[0016] Hereinafter, the curing board 1 according to an embodiment of the present invention will be described with reference to the above-described drawings. Note that the curing board 1 is only one embodiment of the present invention. Therefore, the present invention is not limited to the following embodiments, and addition, deletion, and modification are possible without departing from the gist of the invention.
[0017] The curing board 1 shown in FIG. 1 is a board for covering and protecting the surface to be cured. The curing board 1 is, for example, a rectangular sheet. In the present embodiment, the size of the curing board 1 is 180 cm in length, 90 cm in width, and 3 mm in thickness. Note that the size of the curing board 1 is not particularly limited as long as it is a size according to the purpose of use. The shape of the curing board 1 is also not limited to a rectangular shape, and may be a polygon.
[0018] The curing board 1 is formed with at least one fold line 1a extending in the short side direction. In the present embodiment, one fold line 1a is formed at the longitudinal center of the curing board 1. Therefore, the curing board 1 can be folded into two along the fold line 1a. Accordingly, it is easy to carry and store the curing board 1. The method of forming the fold line 1a is not particularly limited as long as it is a general method. For example, there is a grooving process method. Note that the fold line 1a may be formed by making a cut on one surface of the curing board 1.
[0019] As shown in FIG. 2, the curing board 1 has a board body 2 that covers the surface to be cured and an anti-slip layer 5 provided on the surface of the board body 2 opposite to the surface to be cured. The board body 2 includes a cushion layer 3 and a board material layer 4. In the curing board 1, the cushion layer 3, the board material layer 4, and the anti-slip layer 5 are laminated in this order.
[0020] The cushion layer 3 absorbs the impact applied to the surface to be cured, such as the indoor floor surface, the elevator floor surface, or the floor surface at a construction site, etc., and protects them. Therefore, the curing board 1 is strong against impact and has excellent shock buffering properties. The cushion layer 3 is, for example, a sheet containing a cushioning material such as a foaming agent. In the present embodiment, as the cushion layer 3, a sheet made of foamed polyethylene is used.
[0021] The board material layer 4 is a layer for ensuring the strength of the curing board 1. The board material layer 4 is, for example, a sheet containing paperboard. In the present embodiment, as the board material layer 4, paperboard formed from base paper for paper tubes is used. The cushion layer 3 and the board material layer 4 are bonded together using an adhesive. However, the cushion layer 3 and the board material layer 4 may be bonded together by a method other than an adhesive such as heat welding.
[0022] The anti-slip layer 5 is composed of a film of linear low density polyethylene (abbreviation: LLDPE). The anti-slip layer 5 is attached to the board material layer 4 by laminating. The thickness of the anti-slip layer 5 is, for example, 30 μm. However, the thickness of the anti-slip layer 5 is only an example and is not limited to the above thickness.
[0023] The slip resistance value (C.S.R’) of the surface of the anti-slip layer 5 is preferably 0.60 or more and 0.70 or less in both the dry state and the water-sprayed state. By the slip resistance value being within this range, the curing board 1 has excellent anti-slip properties in both the dry state and the water-sprayed state.
[0024] As shown in FIG. 3, the surface of the anti-slip layer 5 is embossed. In the present embodiment, honeycomb-shaped irregularities are formed on the surface of the anti-slip layer 5 by embossing. Thereby, the anti-slip property of the curing board 1 is further improved.
[0025] The curing board 1 is used by facing the surface on the cushion layer 3 side toward the surface to be cured such as the indoor floor surface, the elevator floor surface, or the floor surface at a construction site, etc., and covering the surface to be cured. When in use, the curing board 1 is spread out according to the area of the surface to be cured, arranged vertically and horizontally, and also used by fastening the joints with a curing tape or the like.
[0026] Hereinafter, the effects of the curing board 1 will be described based on examples. Note that the curing board 1 is not limited by the following examples.
[0027] <Example> As an example, a curing board 1 was used in which an anti-slip layer 5 composed of a linear low density polyethylene film (manufactured by Toyobo Co., Ltd., trade name: Pyren (trademark) film - OT) was laminated on the board body 2. Honeycomb-shaped embossing was performed on the surface (i.e., the anti-slip layer 5) of the curing board 1 of the example.
[0028] <Comparative Example 1> As Comparative Example 1, a commercially available major board (registered trademark, manufactured by MF Corporation) is used. A polyethylene film is laminated on the surface of the major board. Honeycomb-shaped embossing is applied to the surface of the major board (i.e., the polyethylene film).
[0029] <Comparative Example 2> As Comparative Example 2, a commercially available curing board S (manufactured by Shin Koushu Co., Ltd.) is used. A polyethylene film with anti-slip processing is laminated on the surface of the curing board S.
[0030] For the above-described Examples, Comparative Example 1, and Comparative Example 2, the following slip resistance test was conducted. The test method and test results are as follows.
[0031] <Test Method> Test site: G&U Technical Research Center, ISO / IEC 17025 Measurement Test Laboratory Test item: Slip resistance test (Coefficient of Static Friction (C.S.R') measurement test) Standard: JIS A 1454 Test conditions: Rubber plate hardness 72 - 80
[0032] <Results>
Table 1
[0033] As shown in Table 1, the slip resistance values in the dry state were 0.66 for the Example, 0.68 for Comparative Example 1, and 0.60 for Comparative Example 2, showing equivalent values. On the other hand, the slip resistance values in the water-sprayed state were 0.45 for Comparative Example 1 and 0.48 for Comparative Example 2, while the Example showed a high value of 0.65. As this result shows, it is clear that the curing board of the Example has excellent anti-slip properties in the water-sprayed state (i.e., when the surface is wet), compared to the curing boards of Comparative Example 1 and Comparative Example 2.
[0034] In the curing board 1 of this embodiment, an anti-slip layer 5 is provided on the surface of the board body 2 opposite to the surface to be cured. The anti-slip layer 5 is composed of a linear low-density polyethylene film. Therefore, compared with curing boards with other types of polyethylene films provided on the surface, the curing board 1 has excellent anti-slip properties not only in the dry state but also in the state where the surface is wet. In addition, since the anti-slip layer 5 of the curing board 1 is composed of a linear low-density polyethylene film, it has excellent waterproof properties.
[0035] In the curing board 1 of this embodiment, the slip resistance value of the surface of the anti-slip layer 5 is 0.60 or more and 0.70 or less in both the dry state and the water-sprayed state. Therefore, even when a person operates on the curing board 1 with the surface of the curing board 1 being wet, it is possible to surely prevent the person from slipping.
[0036] In the curing board 1 of this embodiment, the anti-slip layer 5 is embossed. Therefore, unevenness is formed on the surface of the anti-slip layer 5, and the anti-slip property of the curing board 1 is further improved.
[0037] In the curing board 1 of this embodiment, the cushion layer 3 includes a cushioning material, and the board material layer 4 is provided between the cushion layer 3 and the anti-slip layer 5 and includes cardboard. Therefore, the curing board 1 is resistant to impact, has excellent shock buffering properties, and can maintain its strength.
[0038] <Other embodiments> In the curing board 1 of this embodiment, the folding line 1a is provided on the curing board 1, but if it is a size that does not particularly affect portability, the folding line 1a may not be provided. In addition, the board body 2 is not limited to the configuration as described above. For example, the board body 2 may include another layer in addition to the cushion layer 3 and the board material layer 4. Also, the anti-slip layer 5 may be provided not only on one side of the board body 2 (that is, the side opposite to the surface to be cured) but also on both sides.
[0039] Also, in the curing board 1 of the present embodiment, although the uneven shape formed by the embossing on the surface of the anti-slip layer 5 was a honeycomb shape, the uneven shape formed by the embossing may be other shapes such as a mesh shape and a lattice shape in plan view. Further, it is not always necessary to perform embossing on the surface of the anti-slip layer 5.
Explanation of Signs
[0040] 1 Curing board 1a Fold 2 Board body 3 Cushion layer 4 Board material layer 5 Anti-slip layer
Claims
1. A curing board for covering and protecting a surface to be cured, comprising a board body covering the surface to be cured, and a non-slip layer provided on a surface of the board body opposite to the surface to be cured and made of a linear low-density polyethylene film.
2. The curing board according to claim 1, wherein a slip resistance value of a surface of the non-slip layer is 0.60 or more and 0.70 or less in both a dry state and a water-sprayed state.
3. The curing board according to claim 1, wherein the non-slip layer is embossed.
4. The board body includes a cushion layer and a board material layer, the cushion layer includes a cushioning material, and the board material layer is provided between the cushion layer and the non-slip layer and includes cardboard. The curing board according to claim 1.
Citation Information
Patent Citations
Curing board
JP2017002539A
Curing board
JP2021080637A