Inspection device and inspection method

The inspection apparatus and method effectively address the inefficiencies in detecting object defects by analyzing temperature changes induced by pressure using infrared imaging, enabling precise defect identification.

JP2025093004APending Publication Date: 2025-06-23PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
JP2023208472
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-12-11
Publication Date
2025-06-23

AI Technical Summary

Technical Problem

Existing inspection methods lack efficiency in detecting the state of objects, particularly in identifying defects such as leaks, through temperature changes induced by pressure application.

Method used

An inspection apparatus and method that utilize an infrared camera to capture temperature image data of an object under pressure, analyzing this data to generate an analysis image representing temperature changes, and using this image to inspect the object's state for defects.

Benefits of technology

Facilitates accurate inspection of an object's state by detecting temperature changes caused by pressure, enabling the identification of defects like leaks with high precision.

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Abstract

To provide an inspection device that makes it easy to inspect a state of an object.SOLUTION: An inspection device for inspecting a state of an object, comprises: an input unit which obtains image data; a processor which analyzes the image data; and an output unit which outputs a control signal from the processor. The processor controls a pressurizing system to apply a pressure to the object via the output unit. The processor obtains, via the input unit, a plurality of temperature image data sets generated by a photographing apparatus photographing the object in time series while the pressure is applied to the object. The processor performs analysis processing on the plurality of temperature image data sets to generate an analysis image corresponding to a temperature change of the object, and inspects the state of the object based on the analysis image.SELECTED DRAWING: Figure 1
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Description

Technical Field

[0001] The present disclosure relates to an inspection apparatus and an inspection method.

Background Art

[0002] Patent Document 1 discloses a shield check apparatus that detects clogging of a shield plate using the infrared thermography method. The image processing unit of the shield check apparatus includes an infrared camera and a data processing unit. The infrared camera captures an image of the temperature distribution at each through-hole portion of the shield plate to which warm air is supplied and takes it in as image data. The shield check apparatus detects clogging of the shield plate using the image data.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides an inspection apparatus that facilitates inspecting the state of an object.

Means for Solving the Problems

[0005] An inspection apparatus according to an aspect of the present disclosure is an inspection apparatus for inspecting the state of an object, an input unit that acquires image data, a processor that analyzes the image data, and an output unit that outputs a control signal from the processor, wherein the processor controls a pressurization system via the output unit to apply pressure to the object, acquires a plurality of temperature image data generated by a photographing device photographing the object in time series while pressure is being applied to the object via the input unit, Performing analysis processing on a plurality of temperature image data to generate an analysis image corresponding to the temperature change of the object, Inspecting the state of the object based on the analysis image.

[0006] An inspection method according to an aspect of the present disclosure is an inspection method for inspecting the state of an object, Controlling a pressure system to apply pressure to the object, Obtaining a plurality of temperature image data generated by photographing the object in time series by a photographing device while pressure is being applied to the object, Performing analysis processing on the plurality of temperature image data to generate an analysis image corresponding to the temperature change of the object, Inspecting the state of the object based on the analysis image, and includes.

Effect of the Invention

[0007] According to the present disclosure, it is possible to facilitate the inspection of the state of the object.

Brief Description of the Drawings

[0008]

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Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments will be described in detail with reference to the drawings as appropriate. However, overly detailed descriptions may be omitted. For example, detailed descriptions of well-known matters and redundant descriptions of substantially the same configurations may be omitted. This is to avoid making the following description unnecessarily redundant and to facilitate the understanding of those skilled in the art. Note that the inventors provide the accompanying drawings and the following description to enable those skilled in the art to fully understand the present disclosure, and do not intend to limit the subject matter described in the claims thereby.

[0010] Hereinafter, the inspection system according to the embodiment will be described with reference to the drawings.

[0011] [1. Embodiment 1] [1-1. Configuration] [1-1-1. Configuration of Inspection System] FIG. 1 is a block diagram showing a configuration example of an inspection system 1 according to Embodiment 1 of the present disclosure. The inspection system 1 includes an inspection device 10, an infrared camera 17, a pressurization system 18, a control box 15, a power supply 16, and a notification device 19.

[0012] The inspection system 1 inspects the state of the object 90 using a thermography method for capturing a temperature image of the object 90. The inspection system 1 applies pressure to the object 90 by the pressurization system 18 and captures temperature images in time series using the infrared camera 17.

[0013] The object 90 is, for example, a member such as a plate, film, tube, container, chamber, etc. The object 90 may be a joined member manufactured by joining two or more members. The state of the object 90 includes information regarding the structure of features, defects, etc. inside or outside the object 90. A defect is, for example, a factor that causes the judgment criteria defined by design, standards, specifications, etc. not to be satisfied due to its existence, and includes, for example, scratches, holes, unevenness, etc. existing inside or outside the object 90. Further, the defect includes a decrease in the sealing property, airtightness, or liquid tightness of the object 90, the presence of leaks, etc.

[0014] In the illustrated example, the inspection system 1 uses thermography to detect the presence or absence of a leak as the state of the object 90. If there is a leak in the object 90, the inspection system 1 can detect the presence or absence of the leak. The inspection system 1 may detect the region R where there is a leak.

[0015] The infrared camera 17 captures a shooting region including at least a part of the object 90 in time series to generate a plurality of temperature image data. The infrared camera 17 includes, for example, an infrared sensor that detects infrared rays having a wavelength of 3 μm to 15 μm. The frame rate of the infrared camera 17 is, for example, 50 Hz (or 50 fps), but is not limited thereto.

[0016] The pressurization system 18 is configured to be able to apply pressure to the object 90. The pressurization system 18 includes a pressurization device 181, a regulator 182, and a valve 183. The pressurization device 181 is, for example, a compressor or a pressure pump. The valve 183 is, for example, an electromagnetic, solenoid, air-operated, direct-acting, or pilot-operated control valve. In the illustrated example, the valve 183 is of the normally closed (NC) type, but the valve of the present embodiment is not limited thereto. For example, the valve 183 may be of the normally open (NO) type.

[0017] The power supply 16 supplies power to the infrared camera 17 and the valve 183. The control box 15 includes a control circuit that controls the power supply 16 based on a control signal from the inspection device 10.

[0018] In the illustrated example, the inspection device 10 controls the opening and closing of the valve 183 via the control box 15 and the power supply 16, and adjusts the pressure applied from the pressurization device 181 to the object 90. Different from the illustrated example, the inspection device 10 may adjust the pressure applied from the pressurization device 181 to the object 90 by controlling the pressurization device 181.

[0019] The notification device 19 notifies information externally. For example, the notification device 19 is controlled by the inspection device 10 and notifies the user of information indicating the inspection result of the state of the object 90. The notification device 19 may include a light source such as an LED, a display, a visual notification device such as a display, etc. The notification device 19 may include an auditory notification device such as a speaker.

[0020] [1-1-2. Configuration of the inspection device] FIG. 2 is a block diagram showing a configuration example of the inspection device 10 in FIG. 1. The inspection device 10 includes a processor 11, a storage device 12, and an interface 13.

[0021] The processor 11 is composed of a CPU, an MPU, etc., and controls the entire inspection device 10 by executing various programs stored in the storage device 12. The processor 11 controls imaging operations such as the start and stop of imaging of the infrared camera 17. Further, the processor 11 controls the opening and closing of the valve 183 via the control box 15 and the power supply 16, and adjusts the pressure applied to the object 90 from the pressurizing device 181. Furthermore, as will be described later, the processor 11 analyzes the temperature image data stored in the storage device 12 and detects the state of the object 90.

[0022] The storage device 12 is a recording medium that records various information including data and programs necessary to realize the functions of the inspection device 10. The storage device 12 is realized, for example, by a semiconductor storage device such as a flash memory or a solid state drive (SSD), a magnetic storage device such as a hard disk drive (HDD), or other recording media alone or in combination thereof. The storage device 12 is not limited to a built-in storage device installed in the same housing as the processor 11, and may be, for example, an external type, a network-attached storage (NAS) type storage device, etc. The storage device 12 may include a volatile memory such as SRAM or DRAM.

[0023] The interface 13 connects the inspection device 10 to external devices such as the infrared camera 17, the control box 15, and the notification device 19. The interface 13 may be a communication circuit that performs data communication according to an existing wired communication standard or wireless communication standard.

[0024] The interface 13 is an example of an input unit that connects the inspection device 10 and the infrared camera 17 in order to input information such as temperature image data from the infrared camera 17 to the inspection device 10. Further, the interface 13 is an example of an output unit that connects the inspection device 10 and an external device in order to output information such as a control signal from the processor 11 to external devices such as the valve 183, the control box 15, and the notification device 19. Such an input unit and output unit may be integrally realized as the input / output shared interface 13 as shown in FIG. 2, or may be realized as a plurality of interface circuits.

[0025] [1-2. Operation] [1-2-1. Overall Operation] Hereinafter, the operation of the inspection device 10 will be described. The processor 11 of the inspection device 10 according to the present embodiment acquires temperature image data captured while pressure is applied to the object 90, and analyzes the acquired temperature image data to detect a defect in the object 90.

[0026] FIG. 3 is a flowchart illustrating the operation of the inspection device 10. Each process shown in this flowchart is executed by, for example, the processor 11 of the inspection device 10.

[0027] In FIG. 3, the processor 11 executes a temperature image acquisition process S1 and a defect detection process S2. Details of the temperature image acquisition process S1 and the defect detection process S2 will be described later.

[0028] When the processor 11 determines that there is a defect as a result of the defect detection process S2 (Yes in S3), it causes the notification device 19 to perform a notification operation (S4). As a result, the user can know that the object 90 has a defect. The notification operation includes, for example, emitting a warning sound from a speaker, lighting or flashing a light source such as an LED. Alternatively, the processor 11 may cause information indicating that there is a defect to be displayed on a display, which is an example of the notification device 19.

[0029] When it is determined in step S3 that there is no defect (No in S3), and after step S4, the processor 11 causes information indicating the analysis result, determination result, etc. to be displayed on a display, which is an example of the notification device 19 (S5).

[0030] Next, the processor 11 stores information indicating the analysis result, determination result, etc. in the storage device 12 (S6).

[0031] [1-2-2. Temperature Image Acquisition Process] FIG. 4 is a flowchart illustrating the details of the temperature image acquisition process S1 shown in FIG. 3.

[0032] In FIG. 4, first, the processor 11 starts photographing the object 90 with the infrared camera 17 (S101). The infrared camera 17 photographs a photographing area including at least a part of the object 90.

[0033] Next, the processor 11 causes the pressurization system 18 to start pressurizing the object 90 (S102). For example, the processor 11 transmits a control signal to the valve 183 via the control box 15 and the power supply 16 to open the valve 183, and transmits the pressure from the pressurizing device 181 to the object 90. In the example shown in FIG. 1, the object 90 is a hollow structure, and the pressurizing device 181 pressurizes the inside of the object 90 by sending gas, compressed air, liquid, etc. into the object 90.

[0034] Next, the processor 11 acquires temperature image data indicating a temperature image corresponding to the temperature of the object 90 from the infrared camera 17 (S103). Step S103 is executed while pressure is being applied to the object 90. The acquired temperature image data is stored in the storage device 12. In step S103, the processor 11 acquires the temperature image data captured before the start of pressurization and the temperature image data captured after the start of pressurization. Alternatively, the processor 11 may acquire only the temperature image data captured after the start of pressurization.

[0035] FIG. 5 is a schematic diagram illustrating a temperature image 30 indicated by the temperature image data acquired in step S103. The temperature image 30 in FIG. 5 is a temperature image obtained by photographing a tube made of synthetic resin, which is an example of the object 90. In the tube of FIG. 5, a small hole (leakage point) is formed at a predetermined position for a leak detection test, and pressure is applied from the path indicated by the arrow in FIG. 5.

[0036] When the hole, which is the leakage point existing in the object 90, is small, or when there is no hole and there is only an internal scratch in the object 90, even if there are defects such as holes and scratches in the object 90, they may not be detected only by analyzing the temperature image 30. The inspection apparatus 10 according to the present embodiment enables detection of such defects through the process described later.

[0037] That is, the inventor has obtained the knowledge that there is a relationship between the pressure applied to the object 90 and the temperature of the region (defect region) of the object 90 having defects such as holes and scratches, and has arrived at the technical idea regarding the inspection apparatus 10 that detects defects by utilizing this relationship. FIG. 6 is a graph showing the relationship between the pressure applied to the object 90 and the temperature of the object 90.

[0038] The horizontal axis of the graph in FIG. 6 represents the number of frames of the temperature image data generated by the infrared camera 17 from the start of photographing. Therefore, the horizontal axis of the graph in FIG. 6 indicates information corresponding to the time from the start of photographing.

[0039] The vertical axis on the left side of the graph in FIG. 6 indicates the temperature of the object 90. In the graph of FIG. 6, the temperature of the area of the object 90 without defects such as holes and scratches (hereinafter referred to as the "Sound area") is indicated by a dotted line, and the temperature of the defective area with defects (also referred to as the "Non-Sound area") is indicated by a solid line. The vertical axis on the right side of the graph in FIG. 6 indicates the pressure inside the object 90. In the graph of FIG. 6, the output pressure of the pressurization system 18 is indicated by a broken line. The output pressure of the pressurization system 18 is, for example, the discharge pressure of the pressurization device 181 when the pressurization device 181 is a pressurization pump.

[0040] As shown in FIG. 6, in the present embodiment, the output pressure of the pressurization system 18 continuously increases to a predetermined pressure and then is maintained at the predetermined pressure for a period of, for example, a period longer than a predetermined period.

[0041] When such pressure is applied to the object 90, elastic deformation occurs in the object 90, and the temperature of the object 90 changes due to the thermoelastic effect. Since pressure concentrates in the defective area with defects such as holes and scratches, heat generation occurs, and the degree of temperature rise in the defective area due to the pressure increase is larger than the degree of temperature rise in the sound area. When the pressure rises and leakage starts, the pressure applied to the defective area where the leakage occurs significantly decreases compared to before the leakage. Therefore, heat absorption occurs in the defective area, and the temperature of the defective area rapidly drops compared to the sound area. When the leakage continues, the temperature of the defective area may become lower than the temperature of the sound area. The graph in FIG. 6 shows data in a case where the temperature of the defective area has become lower than the temperature of the sound area in this way.

[0042] Based on such findings, the operation of the inspection device 10 for detecting defects will be further described below.

[0043] [1-2-3. Defect Detection Process] FIG. 7 is a flowchart illustrating the details of the defect detection process S2 shown in FIG. 3.

[0044] In FIG. 7, first, the processor 11 determines one of the temperature image data acquired in the temperature image acquisition process S1 as a reference frame (reference temperature image data) (S201).

[0045] The reference frame is, for example, temperature image data generated by photographing the imaging region before the start of pressurization of the object 90 or before the output pressure of the pressurization system 18 reaches a predetermined value. Alternatively, the reference frame may be temperature image data generated by photographing the imaging region after a sufficient amount of time has elapsed after the stop of pressurization. In these cases, the reference frame is temperature image data generated by photographing the imaging region at the time or near the time when the pressure applied to the imaging region (object 90) by the pressurization system 18 is the lowest.

[0046] The processor 11 calculates the difference between each of the plurality of temperature image data acquired in step S1 and the reference frame determined in step S201, and generates a plurality of difference images (S202).

[0047] FIGS. 8A, 8B, and 8C are schematic diagrams each showing an example of the difference images 31a, 31b, and 31c. The difference image 31a in FIG. 8A shows the difference between the temperature image data of the 165th frame and the reference frame. The difference image 31b in FIG. 8B shows the difference between the temperature image data of the 210th frame and the reference frame. The difference image 31c in FIG. 8C shows the difference between the temperature image data of the 380th frame and the reference frame. In these examples, the temperature image data of the 140th frame is used as the reference frame.

[0048] Referring to the graph in FIG. 6 and the difference image 31a in FIG. 8A, in the difference image 31a showing the state of the 165th frame, a defective region where the temperature has risen rapidly compared to the healthy part is shown in a whitish color. Thus, it can be seen that at the 165th frame, although there is no leak, pressure is concentrated in the defective region and heat generation is occurring.

[0049] In the differential image 31b of FIG. 8B showing the state of the 210th frame, a leak has started, and the pressure applied to the defective region, which is the leak location, has decreased significantly compared to before the leak. Therefore, heat absorption occurs in the defective region, and the temperature of the defective region drops rapidly, which appears as black dots in the differential image 31b.

[0050] In the differential image 31c of FIG. 8C showing the state of the 380th frame, while the pressure inside the healthy part is high, the leak continues, so the temperature of the defective region and its surroundings is lower than that of the healthy part.

[0051] Returning to FIG. 7, the processor 11 extracts the maximum contrast image with the maximum contrast from the plurality of differential images generated in step S202 (S203). Alternatively, the processor 11 may extract an image group with a contrast equal to or higher than a predetermined threshold value, and determine one of this image group as the maximum contrast image.

[0052] Next, the processor 11 performs a filtering process on the maximum contrast image extracted in step S203 (S204). The filtering process is, for example, image processing such as local equalization (smoothing) filtering, high-pass filtering, low-pass filtering, etc. The filtering process may include a process of adjusting the tone curve. The processor 11 performs processes such as edge enhancement, shading adjustment, and contrast adjustment by the filtering process.

[0053] Next, the processor 11 performs a binarization process on the image after the filtering process in step S204 (S205).

[0054] The processor 11 determines whether there is a defect in the object 90 using the binarized image obtained in step S205 (S206).

[0055] Instead of step S206, a person such as a user may determine whether there is a defect in the object 90 based on the image after the binarization process.

[0056] [1-3. Results of Defect Detection Processing Using Other Objects] Although an example in which the object 90 is a tube made of synthetic resin has been described, the object 90 may be other members such as a plate, a film, a container, a chamber, etc. For example, the object 90 may be a resin box 90a as shown in FIG. 9.

[0057] FIG. 9 is a schematic diagram showing a visible image 32 obtained by photographing the box 90a with a camera. In the box 90a of FIG. 9, a small hole (leakage point) is opened at a predetermined position for the leak detection test, and pressure is applied from the path indicated by the arrow in FIG. 9.

[0058] FIG. 10 is a schematic diagram showing a temperature image 33 indicated by the temperature image data acquired in step S103 when the process of FIG. 3 is performed on the box 90a. A part of the lower side of the box 90a is not shown in FIG. 10.

[0059] FIGS. 11A, 11B, 11C, and 11D are schematic diagrams showing the difference images 34a, 34b, 34c, and 34d generated in step S202, respectively. The difference image 34a in FIG. 11A shows the difference between the temperature image data of the 192nd frame taken before the start of pressurization and the reference frame. In the example of the box 90a, the temperature image data of the 1st frame is used as the reference frame.

[0060] The difference image 34b in FIG. 11B shows the difference between the temperature image data of the 263rd frame corresponding to the time when the output pressure of the pressurization system 18 is 0.25 MPa and the reference frame. The difference image 34c in FIG. 11C shows the difference between the temperature image data of the 320th frame corresponding to the time when the output pressure of the pressurization system 18 is 0.3 MPa and the reference frame. The difference image 34d in FIG. 11D shows the difference between the temperature image data of the 425th frame corresponding to the time when the output pressure of the pressurization system 18 is 0.35 MPa and the reference frame.

[0061] Also in the case where the object 90 is a tube in the box 90a, in the defective region which is the leakage location, heat absorption occurs due to the leakage, the temperature of the defective region drops rapidly, and this appears as pixels with low brightness (black) in the differential images 34b, 34c, and 34d. Therefore, the processor 11 can detect whether there is a defect in the box 90a by using the maximum contrast image (see S203 in FIG. 7).

[0062] [1-4. Effects, etc.] As described above, the inspection apparatus 10 according to the present embodiment includes an interface 13 that acquires image data and a processor 11 that analyzes the image data. The interface 13 outputs a control signal from the processor 11. The interface 13 is an example of the input unit and the output unit of the present disclosure. The processor 11 controls the pressurization system 18 via the interface 13 to apply pressure to the object 90 (S102). The processor 11 acquires, via the interface 13, a plurality of temperature image data generated by the infrared camera 17, which is an example of an imaging device, imaging the object 90 in time series while pressure is being applied to the object 90 (S103). The processor 11 performs analysis processing on the plurality of temperature image data to generate an analysis image corresponding to the temperature change of the object 90, and inspects the state of the object 90 based on the analysis image (S2).

[0063] According to this configuration, it is possible to facilitate the inspection of the state of the object 90. For example, the inspection apparatus 10 can accurately inspect the state of the object 90 based on the temperature change that occurs in the object 90 in response to the pressure change.

[0064] In the process of inspecting the state of the object 90, the processor 11 may detect the portion where the pressure is applied by detecting the temperature change of the object 90 based on the analysis image. Since the degree of temperature rise in the defective region due to the pressure increase is larger than the degree of temperature rise in the healthy portion, according to this configuration, it is possible to accurately inspect the presence or absence of a defect as the state of the object 90.

[0065] The processor 11 may inspect the presence or absence of a leak in the object 90 as the state of the object 90 by detecting the temperature change of the object 90 based on the analyzed image. According to this configuration, the presence or absence of a leak as the state of the object 90 can be accurately inspected.

[0066] In the process of inspecting the state of the object 90, the processor 11 may detect that there is a leak from a specific region when the temperature of a part of the region of the object 90 rises and then drops while pressure is being applied to the object 90. According to this configuration, based on a specific temperature change, the presence or absence of a leak can be accurately inspected.

[0067] The processor 11 may generate an analyzed image based on the difference between each of a plurality of temperature image data and the reference temperature image data generated by photographing the object 90. For example, the reference temperature image data is information generated by photographing the object 90 before applying pressure to the object 90.

[0068] The information indicating the inspection result of the state of the object 90 may be notified to the notification device 19. Thereby, the user can know the inspection result of the state of the object 90.

[0069] The processor 11 may control the pressurization system via the interface 13 to continuously increase the pressure to a predetermined pressure and then control to maintain the predetermined pressure for a predetermined period. According to this configuration, the inspection device 10 can accurately inspect the state of the object 90 based on the temperature change generated in the object 90 by such pressure.

[0070] [2. Embodiment 2] In Embodiment 2, in the execution of the process of FIG. 3, the processor 11 executes the defect detection process S2a by discrete Fourier transform of FIG. 12 instead of the defect detection process S2 by the difference method according to Embodiment 1.

[0071] In FIG. 12, first, the processor 11 acquires the analysis time and the set frequency related to the discrete Fourier transform (S211). The analysis time and the set frequency are input by the user, for example, and are stored in advance in the storage device 12. The analysis time includes, for example, the analysis start time and the analysis end time. Alternatively, instead of the analysis time, the processor 11 may acquire setting information regarding which frame number after the start of shooting (for example, the 143rd frame to the 243rd frame, or all frames after the 140th frame) is to be used for analysis.

[0072] Next, the processor 11 determines the analysis start frame (starting frame) based on the analysis time acquired in step S211 (S212). The starting frame is, for example, temperature image data generated by shooting the shooting area a predetermined time after the start of pressurization. For example, when shooting the starting frame, it is set so that the temperature of the defective area is higher than the temperature of the healthy part at that time.

[0073] Next, the processor 11 performs a discrete Fourier transform on the temperature image data captured within the analysis time after the capture of the starting frame (S213), and extracts a phase image showing the phase characteristics at the set frequency (S214).

[0074] FIG. 13 is a schematic diagram illustrating the phase image 35 obtained in step S214. The set frequency set in the case where the phase image 35 is acquired is 0.5 Hz, but the set frequency of the present embodiment is not limited to this. For example, in the pass / fail determination process S2a, by adjusting the set frequency, a phase image including desired information of the user such as the surface structure and internal structure of the object 90 can be obtained.

[0075] Returning to FIG. 12, the processor 11 performs a filtering process on the phase image extracted in step S214 (S215). The filtering process is, for example, a local equalization (smoothing) filter process, a high-pass filter process, or a low-pass filter process. The filtering process may include a process of adjusting a tone curve. Further, the filtering process may include a background removal process. The processor 11 performs processes such as edge enhancement, shading adjustment, and contrast adjustment by the filtering process.

[0076] The processor 11 performs a binarization process on the image after the filtering process in step S215 (S216).

[0077] The processor 11 determines whether there is a defect in the object 90 using the binarized image obtained in step S216 (S217). The defect detection process S217 may be the same process as the defect detection process S206 in FIG. 7.

[0078] In the above, an example of extracting a phase image in step S214 has been described. However, the information extracted by performing a discrete Fourier transform on the temperature image data is not limited to the phase image. The processor 11 only needs to perform a discrete Fourier transform on the temperature image data and extract at least one of a phase image, an amplitude image, a real part image, and an imaginary part image. FIGS. 14 to 16 are diagrams showing the amplitude image 36, the real part image 37, and the imaginary part image 38 extracted in this way, respectively. The set frequency in the case where these images were acquired is 0.5 Hz. Also in these images, since there are differences in brightness, contrast, etc. between the defect region and the healthy part, the processor 11 can detect the defect.

[0079] Also, in the above, an example where the object 90 is a synthetic resin tube has been described, but the object 90 may be other members such as a plate, a film, a container, a chamber, etc. For example, the object 90 may be a resin box 90a (see FIG. 9). FIGS. 17A, 17B, 17C, and 17D are diagrams showing a phase image 39a, an amplitude image 39b, a real part image 39c, and an imaginary part image 39d extracted by performing a discrete Fourier transform on the temperature image data of the box 90a, respectively. The set frequency in the case where these images were obtained was 0.1 Hz.

[0080] [3. Other Embodiments] As described above, embodiments have been described as examples of the technology in the present disclosure. However, the technology in the present disclosure is not limited to this, and is also applicable to embodiments in which changes, substitutions, additions, omissions, etc. are appropriately made. It is also possible to combine the respective components described in the above embodiments to form a new embodiment. Therefore, hereinafter, modification examples as other embodiments will be exemplified.

[0081] [3-1. First Modification Example] In Embodiment 1, an example in which the defect detection process S2 includes a filter process S204 and a binarization process S205 has been described. However, the processor 11 only needs to be able to inspect the state of the object 90, and at least one of the filter process S204 and the binarization process S205 may be omitted.

[0082] Similarly, in Embodiment 2, at least one of the filter process S215 and the binarization process S216 may be omitted.

[0083] [3-2. Second Modification Example] In Embodiment 2, an example of extracting a phase image by performing a discrete Fourier transform on a temperature image has been described, but the present disclosure is not limited to this. The processor 11 may extract a phase image by performing, for example, a Fourier transform instead of a discrete Fourier transform.

[0084] [3-3. Third Modification Example] In Embodiment 2, unlike the pressure that is maintained constant after increasing to a predetermined pressure as described in Embodiment 1, the output pressure of the pressurization system 18 may be a pulsating pressure (increasing and decreasing) at a predetermined pulsation frequency. For example, the pulsation frequency and the set frequency obtained in step S211 are set to match. That is, the processor 11 may control the pressurization system 18 via the interface 13 to control the pressure to pulsate at a predetermined pulsation frequency.

[0085] Due to the pulsation of the pressure, the volume change of the substance constituting the object 90 occurs repeatedly, and heat generation and heat absorption due to the thermoelastic effect occur repeatedly. The frequencies of heat generation and heat absorption are adjusted to match the set frequency. The processor 11 performs a Fourier transform on the temperature image data of the object 90 that repeats heat generation and heat absorption, and analyzes the frequency characteristics that match the set frequency and the pulsation frequency, thereby enabling the state of the object 90 to be accurately inspected.

[0086] [4. Aspect Example] Hereinafter, aspects of the present disclosure will be exemplified.

[0087] <Aspect 1> An inspection device for inspecting the state of an object, An input unit that acquires image data, A processor that analyzes the image data, An output unit that outputs a control signal from the processor, and The processor Controls a pressurization system via the output unit to apply pressure to the object, Acquires a plurality of temperature image data generated by a photographing device photographing the object in time series while the pressure is being applied to the object via the input unit, Performs an analysis process on the plurality of temperature image data to generate an analysis image corresponding to the temperature change of the object, Inspects the state of the object based on the analysis image, Inspection device.

[0088] <Aspect 2> The inspection device according to aspect 1, wherein in the process of inspecting the state of the object, the processor detects a temperature change of the object based on the analyzed image to detect a portion where the pressure is applied.

[0089] <Aspect 3> The inspection device according to aspect 1 or 2, wherein the processor inspects the presence or absence of a leak in the object as the state of the object by detecting a temperature change of the object based on the analyzed image.

[0090] <Aspect 4> The inspection device according to aspect 3, wherein in the process of inspecting the state of the object, when the temperature of a partial region of the object rises and then drops while the pressure is being applied to the object, the processor detects that there is a leak from the region.

[0091] <Aspect 5> The inspection device according to any one of aspects 1 to 4, wherein the processor generates the analyzed image based on a difference between each of the plurality of temperature image data and reference temperature image data generated by photographing the object.

[0092] <Aspect 6> The inspection device according to aspect 5, wherein the reference temperature image data is information generated by photographing the object before applying the pressure to the object.

[0093] <Aspect 7> The inspection device according to any one of aspects 1 to 4, wherein the processor performs a Fourier transform on the plurality of temperature image data to generate the analyzed image.

[0094] <Aspect 8> The inspection device according to aspect 7, wherein the analyzed image is at least one of a phase image, an amplitude image, a real part image, and an imaginary part image at a predetermined frequency of the plurality of temperature image data subjected to Fourier transform.

[0095] <Aspect 9> The inspection apparatus according to aspect 8, wherein the processor controls the pressurization system via the output unit, and controls the pressure to continuously increase to a predetermined pressure and then maintain the predetermined pressure for a predetermined period.

[0096] <Aspect 10> The inspection apparatus according to aspect 8, wherein the processor controls the pressurization system via the output unit, and controls the pressure to pulsate at the predetermined frequency.

[0097] <Aspect 11> The inspection apparatus according to any one of aspects 1 to 10, which causes a notification device to notify information indicating the inspection result of the state of the object.

[0098] <Aspect 12> An inspection method for inspecting the state of an object, comprising: controlling a pressurization system to apply pressure to the object; acquiring a plurality of temperature image data generated by photographing the object in time series by a photographing device while the pressure is being applied to the object; performing an analysis process on the plurality of temperature image data to generate an analysis image corresponding to the temperature change of the object; and inspecting the state of the object based on the analysis image. Inspection method.

Industrial Applicability

[0099] The present disclosure is applicable to an inspection apparatus.

Description of Symbols

[0100] 1 Inspection system 10 Inspection apparatus 11 Processor 12 Storage device 13 Interface (input unit, output unit) 15 Control box 16 Power supply 17 Infrared camera (imaging device) 18 Pressurization system 181 Pressurizing device 182 Regulator 183 Valve 19 Notification device 90 Object

Claims

1. An inspection apparatus for inspecting the state of an object, comprising: An input unit for acquiring image data; A processor for analyzing the image data; An output unit for outputting a control signal from the processor, wherein the processor: Controls a pressurization system via the output unit to apply pressure to the object; Acquires a plurality of temperature image data generated by a photographing device photographing the object in time series while the pressure is being applied to the object via the input unit; Performs an analysis process on the plurality of temperature image data to generate an analysis image corresponding to the temperature change of the object; Inspects the state of the object based on the analysis image. Inspection apparatus.

2. The inspection apparatus according to claim 1, wherein the processor detects a portion where the pressure is applied by detecting a temperature change of the object based on the analysis image in the process of inspecting the state of the object.

3. The inspection apparatus according to claim 1, wherein the processor inspects the presence or absence of a leak in the object as the state of the object by detecting a temperature change of the object based on the analysis image.

4. The inspection apparatus according to claim 3, wherein the processor detects that there is a leak from the region when the temperature of a part of the region of the object rises and then drops while the pressure is being applied to the object in the process of inspecting the state of the object.

5. The inspection apparatus according to claim 1, wherein the processor generates the analysis image based on the difference between each of the plurality of temperature image data and reference temperature image data generated by photographing the object.

6. The inspection device according to claim 5, wherein the reference temperature image data is information generated by photographing the object before applying the pressure to the object.

7. The inspection device according to claim 1, wherein the processor performs a Fourier transform on the plurality of temperature image data to generate the analysis image.

8. The inspection device according to claim 7, wherein the analysis image is at least one of a phase image, an amplitude image, a real part image, and an imaginary part image at a predetermined frequency of the plurality of temperature image data subjected to Fourier transform.

9. The inspection device according to claim 8, wherein the processor controls a pressurization system via the output unit to continuously increase the pressure to a predetermined pressure and then maintain the predetermined pressure for a predetermined period.

10. The inspection device according to claim 8, wherein the processor controls a pressurization system via the output unit to control the pressure to pulsate at the predetermined frequency.

11. The inspection device according to any one of claims 1 to 10, which causes a notification device to notify information indicating an inspection result of a state of the object.

12. An inspection method for inspecting a state of an object, comprising: controlling a pressurization system to apply pressure to the object; acquiring a plurality of temperature image data generated by a photographing device photographing the object in time series while the pressure is being applied to the object; performing an analysis process on the plurality of temperature image data to generate an analysis image corresponding to a temperature change of the object; inspecting the state of the object based on the analysis image. Inspection method.

Citation Information

Patent Citations

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