Bonding device

Abstract

To provide a bonding device in which a space saving is realized.SOLUTION: A bonding device comprises: a base; an operation stage that is arranged on the base, and holds a substrate; a bonding head that is held by the operation stage and crimps a component to the substrate; a head stand that is arranged on the base, and supports the bonding head with respect to the operation stage in a manner to enable lifting; a cover frame that is arranged on the base, and mounts a covers for defining an operation space for housing the operation stage, the bonding head, and the head stand; a head lifting part that lifts the bonding head; and a coupling part that couples the head lift part and the bonding head. The head lifting part is supported by the cover frame.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a bonding apparatus.

Background Art

[0002] For example, Patent Document 1 discloses a bonding apparatus having a bonding head that holds a component and a driving unit that drives the bonding head in the height direction. By lowering the bonding head that holds the component toward the substrate by the driving unit, the component is pressure-bonded to the substrate.

[0003] The bonding apparatus described in Patent Document 1 has a first column that supports the bonding head and a second column that supports the driving unit, respectively. Thereby, deformation of the first column due to the reaction force acting on the bonding head is suppressed, displacement of the bonding head supported by the first column is prevented, and highly accurate bonding is realized.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, since the bonding apparatus described in Patent Document 1 needs to provide two robust and heavy columns on the base, it is an obstacle to realizing space saving.

[0006] Therefore, an object of the present disclosure is to solve the above problems and provide a bonding apparatus that realizes space saving.

[0007] The bonding apparatus according to one aspect of the present disclosure includes a base, a work stage disposed on the base for holding a substrate, a bonding head for pressing a component onto the substrate held on the work stage, a head stand disposed on the base for supporting the bonding head in a state where it can move up and down with respect to the work stage, a cover frame disposed on the base for mounting a cover that defines a work space for accommodating the work stage, the bonding head, and the head stand, a head lifting / lowering unit for lifting and lowering the bonding head, and a connecting unit for connecting the head lifting / lowering unit and the bonding head. The head lifting / lowering unit is supported by the cover frame.

Advantages of the Invention

[0008] According to the present disclosure, a bonding apparatus that realizes space saving can be provided.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4A

Figure 4B

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Modes for Carrying Out the Invention

[0010] (Embodiment 1) The bonding apparatus 10 according to Embodiment 1 of the present disclosure will be described.

[0011] FIG. 1 is a plan view schematically showing the bonding apparatus 10 according to Embodiment 1 of the present disclosure. In FIG. 1, the horizontal directions orthogonal to each other are defined as the X direction / Y direction, and the vertical direction (height direction) orthogonal to both the X direction and the Y direction is defined as the Z direction.

[0012] As shown in FIG. 1, the bonding apparatus 10 is an apparatus for pressing a component P onto a substrate S (see also FIG. 8).

[0013] In the present embodiment, the component P is a chip-shaped member, such as a memory chip or an IC chip on which an integrated circuit including transistors is formed on a semiconductor. The substrate S is a plate-shaped member, such as a semiconductor wafer.

[0014] The bonding apparatus 10 includes a component supply unit 24, a work stage 25, a bonding unit 26, a cover 28, a base 29, and a control unit 80. The bonding unit 26 includes a head stand 42, a bonding head 40, a head lifting unit 44, and a connecting unit 46. The component supply unit 24, the work stage 25, and the head stand 42 are arranged on the base 29 (see FIGS. 2 and 3). Note that the illustration of the component supply unit 24 is omitted in FIGS. 2 and 3.

[0015] The work stage 25 is a table for holding the substrate S and holding the substrate S even while pressing the component P. The work stage 25 is configured by, for example, an XY table device and positions the substrate S at a predetermined position. The component supply unit 24 supplies the component P supported by a carrier such as a tray or an adhesive sheet.

[0016] The bonding head 40 holds the component P and presses it against the substrate S held on the work stage 25 for bonding. The bonding head 40 includes a bonding tool 40T that presses the component P against the substrate S (see FIG. 3). The bonding tool 40T of the present embodiment has a function of holding the component P by vacuum suction, and bonds the component P to the substrate S using heat or ultrasonic vibration during pressurization.

[0017] The bonding head 40 is supported on the side surface of the head stand 42 so as to be movable in the X direction. The head stand 42 has a linear motor 54 (see FIG. 4A) as an X-direction moving device (moving device) that moves the bonding head 40 in the X direction, and can move the bonding head 40 to an arbitrary position in the X direction. Thereby, the bonding head 40 moves above the component supply unit 24 to pick up the component P, and moves above the substrate S held on the work stage 25 to bond the held component P to the substrate S.

[0018] A control unit 80 is housed in the internal space of the base 29. The control unit 80 is a member that controls each component of the bonding device 10. The control unit 80 is composed of, for example, a microcomputer including a processor and a memory storing a computer program executed by the processor.

[0019] Subsequently, with reference to FIG. 2, the structure of the cover frame 30 will be described in more detail.

[0020] FIG. 2 is a perspective view of the bonding device 10. In FIG. 2, the illustration of the cover 28 is omitted so that the inside of the bonding device 10 can be seen.

[0021] As shown in FIG. 2, the cover frame 30 is composed of a plurality of columns 31A to 31H and a plurality of beams 32A to 32D. The cover frame 30, together with the base 29, is a frame structure that defines a work space K in which the crimping operation of the component P to the substrate S is performed.

[0022] The cover frame 30 has a plurality of cover plates and a top plate (both not shown) that constitute the cover 28 attached thereto. The cover 28 separates the working space K inside the cover frame 30 from other spaces. Note that the working space K may communicate with other spaces.

[0023] The plurality of columns 31A to 31H are arranged at the edge of the base 29 and extend upward from the base 29. In the present embodiment, the columns 31A to 31D are arranged at the four corners of the base 29. The columns 31A to 31H are arranged so as to surround the bonding head 40.

[0024] Between the columns 31A and 31C, the columns 31E and 31G are arranged, and between the columns 31B and 31D, the columns 31F and 31H are arranged.

[0025] The plurality of columns 31A to 31H support the plurality of beams 32A to 32D from below. The beam 32A and the beam 32B extend along the X direction and are connected to each other by the beams 32C and 32D that extend along the Y direction. Therefore, the plurality of beams 32A to 32D form the upper frame of the cover frame 30. By the upper frame formed by the plurality of beams 32A to 32D, the plurality of columns 31A to 31H are fixedly connected to each other.

[0026] The cover frame 30 further includes a load receiving bar 33 for fixing the head lifting part 44. In the example shown in FIG. 2, both ends of the load receiving bar 33 are fixed to the beams 32C and 32D. The head lifting part 44 is fixed in a state of being suspended from the load receiving bar 33 and is supported by the load receiving bar 33.

[0027] The load receiving bar 33 is fixed to the beam 32C at one end and to the beam 32D at the other end. The load receiving bar 33 is fixed near the center in the Y direction of the beam 32C and near the center in the Y direction of the beam 32D. When viewed from the X direction, the load receiving bar 33 is located between the columns 31E, 31F and the columns 31G, 31H.

[0028] The load-bearing bar 33 is fixed to the lower parts of the columns 32C and 32D. With such a configuration, space is secured above the plurality of columns 32A to 32D, facilitating the provision of other structures such as a fan that generates a downflow.

[0029] The cover frame 30 has a symmetric structure in the X direction and also has a symmetric structure in the Y direction.

[0030] Subsequently, with reference to FIGS. 3 to 8, the structure of the bonding portion 26 will be described in more detail.

[0031] FIG. 3 is a perspective view of a main part of the bonding apparatus 10 including the bonding portion 26. FIGS. 4A and 4B are side views of the bonding portion 26. As shown in FIG. 3, the bonding portion 26 includes a bonding head 40, a head stand 42, a head lifting / lowering portion 44, and a connecting portion 46.

[0032] The bonding head 40 presses a component onto the substrate S by means of a bonding tool 40T. The bonding tool 40T is, for example, a thermocompression bonding tool or an ultrasonic tool.

[0033] The head stand 42 is disposed on the base 29 and is a frame structure that supports the bonding head 40 in a vertically movable state. In the present embodiment, the head stand 42 further has a function of moving the bonding head 40 in the X direction. The head stand 42 has a portal shape having a pair of leg portions 51 and an X frame 52.

[0034] The pair of leg portions 51 are members that are fixed to the base 29 and support both ends of the X frame 52 extending in the X direction from below. The leg portions 51 are located inside the columns 31A to 31H of the cover frame 30.

[0035] Two guide rails 52A extending in the X direction are mounted on the X frame 52.

[0036] As shown in FIGS. 4A and 4B, a moving base 53 is disposed on the front side surface of the X frame 52. The moving base 53 is a member that connects the bonding head 40 to the X frame 52. When viewed from the X direction, on one side, the X frame 52 is mounted, and on the other side, the bonding head 40 is mounted.

[0037] The moving base 53 has a slide portion 53A that is slidably mounted on the guide rail 52A of the X frame 52. Therefore, the moving base 53 is movable in the X direction with respect to the X frame 52. Further, the moving base 53 has a slide portion 53B that slidably fits with the guide rail 40A of the bonding head 40. The guide rail 40A of the bonding head 40 extends in the Z direction. Therefore, the bonding head 40 is movable up and down with respect to the moving base 53. That is, via the moving base 53, the bonding head 40 is supported by the X frame 52 in a state where it can move up and down.

[0038] The guide rail 40A and the slide portion 53B constitute a head guide 55 that guides the bonding head 40 in the Z-axis direction. Note that in the head guide 55 of the present embodiment, the guide rail 40A is provided on the bonding head 40, but the slide portion 53B may be provided on the bonding head 40 and the guide rail 40A may be provided on the moving base 53. The attachment position and orientation of the guide rail 40A and the slide portion 53B are adjusted so that the head guide 55 is in an ideal state of guiding the bonding head 40 in a direction perpendicular to the XY plane.

[0039] The moving base 53 is driven in the X direction by a linear motor 54. The linear motor 54 is composed of a stator 54A provided on the side surface of the X frame 52 sandwiched by the guide rails 52A and a mover 54B provided on the side surface of the moving base 53 on the X frame 52 side. The linear motor 54 is controlled by the control unit 80.

[0040] In this embodiment, the head stand 42 composed of the X frame 52 and the leg portion 51 has higher rigidity than the cover frame 30.

[0041] Returning to FIG. 3, the head lifting / lowering unit 44 is a driving device that raises and lowers the bonding head 40 with respect to the work stage 25. The head lifting / lowering unit 44 is connected to the bonding head 40 via a connecting portion 46 described later.

[0042] The head lifting / lowering unit 44 includes a fixing member 61, a lifting / lowering member 62, and a Z driving unit 63.

[0043] As shown in FIGS. 4A and 4B, the fixing member 61 is a member fixed to the load receiving bar 33. The fixing member 61 does not move up and down with respect to the load receiving bar 33 and the work stage 25.

[0044] The upper end portion of the fixing member 61 has a fixed portion 61D having a plane extending in the XY direction, and the fixed portion 61D is fixed in surface contact with the lower portion of the load receiving bar 33. With such a configuration, the fixing member 61 can be stably fixed to the load receiving bar 33.

[0045] The fixing member 61 has a guide rail 61A extending in the Z direction on the side surface of the main body portion extending downward from the fixed portion 61D. The lifting / lowering member 62 is slidably connected to the guide rail 61A.

[0046] The elevating member 62 is a member that can be elevated with respect to the fixed member 61 and the Z driving unit 63. The elevating member 62 has a slide portion 62A that slidably fits with the guide rail 61A of the fixed member 61, and a nut 62B into which the feed screw 63B of the Z driving unit 63 is inserted. As the slide portion 62A slides along the guide rail 61A, the elevating member 62 moves up and down. The slide portion 62A and the guide rail 61A constitute an elevating guide 64 that guides the movement of the elevating member 62 of the head elevating unit 44 along the Z axis. The attachment position and orientation of the guide rail 61A and the slide portion 62A are adjusted so that the elevating guide 64 guides the elevating member 62 in a state parallel to the elevating direction of the bonding head 40 guided by the head guide 55 and perpendicular to the XY plane.

[0047] The lower end portion of the elevating member 62 has a guide rail 62C that extends horizontally in the X direction at the lower part. A connecting portion 46 described later is slidably connected to the guide rail 62C. Therefore, the connecting portion 46 is movable in the X direction with respect to the elevating member 62.

[0048] In this embodiment, the elevating member 62 is a plate-shaped member that extends along the XZ plane and has a substantially triangular shape in which the dimension in the X direction increases as it goes downward (see also FIG. 3). In FIG. 4A, the position (Y coordinate) of the elevating member 62 in the Y direction is substantially the same as the position (Y coordinate) of the bonding head 40 in the Y direction, and the elevating member 62 is located directly above the bonding head 40.

[0049] The Z driving unit 63 is fixed to the fixed member 61. The Z driving unit 63 is a device that drives the elevating member 62 in the Z direction so that the elevating member 62 moves up and down with respect to the fixed member 61. Specifically, the Z driving unit 63 has a motor 63A and a feed screw 63B. When the motor 63A is driven, the feed screw 63B rotates, and the nut 62B of the elevating member 62 moves up and down along the feed screw 63B. It is preferable to use a servo motor as the motor 63A. In this embodiment, the feed screw 63B and the nut 62B of the elevating member 62 have a ball screw structure.

[0050] Next, with reference to FIGS. 5 and 6, the detailed structure of the connecting portion 46 will be described.

[0051] FIG. 5 is a perspective view of the connecting portion 46. FIG. 6 is a cross-sectional view of the connecting portion 46.

[0052] As shown in FIGS. 5 and 6, the connecting portion 46 includes a first base 71, a second base 72, a base connecting portion 73, a Y connecting shaft 74, and an X connecting shaft 75.

[0053] The first base 71 is a member connected to the bonding head 40, and the second base 72 is a member connected to the head lifting portion 44. The base connecting portion 73 is a member that connects the first base 71 and the second base 72 to each other.

[0054] As shown in FIG. 6, the first base 71 has a recess 71A that opens upward. The base connecting portion 73 is disposed within the recess 71A. When viewed from the Z direction, the base connecting portion 73 has a frame-like shape with an opening 73A that penetrates vertically in the center.

[0055] The base connecting portion 73 is connected to the first base 71 by two Y connecting shafts 74 that extend in the Y direction. The lower end portion of the second base 72 is a convex portion 72A that protrudes downward. The convex portion 72A is connected to the base connecting portion 73 by an X connecting shaft 75 that extends in the X direction while being inserted into the opening 73A. The base connecting portion 73 is rotatable with respect to the first base 71 around the Y connecting shaft 74, and is rotatable with respect to the second base 72 around the X connecting shaft 75.

[0056] With such a configuration, even if one of the bases 71 and 72 rotates around the X-axis or the Y-axis, the rotation is absorbed by the base connecting portion 73 and is difficult to be transmitted to the other base 72 or 71. Therefore, the rotation (moment) of the head lifting portion 44 connected to the second base 72 around the X-axis or the Y-axis is difficult to be transmitted to the bonding head 40 connected to the first base 71 via the connecting portion 46. That is, the bases 71 and 72 are connected by a universal joint portion including the X connecting shaft 75, the Y connecting shaft 74, and the base connecting portion 73.

[0057] As shown in FIG. 5, the first base 71 has a guide rail 76 extending in the Y direction and a slide portion 77 slidably fitted to the guide rail 76. The slide portion 77 is fixed to the bonding head 40. The guide rail 76 has a length in the Y direction that fits within the range of the bonding head 40 when viewed from the Z direction. With such a configuration, the first base 71 and the bonding head 40 are connected in a slidable structure in the Y direction.

[0058] The second base 72 further has a slide portion 78 slidably fitted to the guide rail 62C of the lifting member 62. The second base 72 and the head lifting portion 44 are connected in a slidable structure in the X direction.

[0059] As described above, the connecting portion 46 connects the bonding head 40 and the head lifting portion 44 so as to be relatively movable in the X direction and the Y direction, and further connects them so as to be relatively rotatable around the X-axis and the Y-axis. Therefore, the connecting portion 46 has a four-degree-of-freedom structure that provides four degrees of freedom with respect to the movement of the bonding head 40 with respect to the head lifting portion 44.

[0060] Here, the lifting of the bonding head 40 will be described with reference to FIGS. 4A and 4B.

[0061] As shown in FIGS. 4A and 4B, the bonding head 40 is movable between a moving height Z1 and a working height Z2. The moving height Z1 is the height at which the bonding head 40 moves in the X direction. The working height Z2 is the height at which the bonding head 40 presses the component P it holds against the substrate S. Note that the working height Z2 varies depending on the dimensions of the substrate S and the component P and the number of stacked components P.

[0062] The operation of the bonding head 40 descending from the moving height Z1 to the working height Z2 will be described. When the motor 63A of the Z drive unit 63 is driven, the feed screw 63B rotates, and the lifting member 62 descends together with the nut 62B inserted into the feed screw 63B.

[0063] As the lifting member 62 descends, the bonding head 40 connected to the lifting member 62 also descends. At this time, the bonding head 40 descends toward the work stage 25 while being guided by the guide rail 40A and the slide portion 53B of the moving base 53 (FIG. 4B).

[0064] On the other hand, in the operation of the bonding head 40 ascending from the working height Z2 to the moving height Z1, the motor 63A of the Z drive unit 63 is driven, the lifting member 62 ascends with respect to the fixing member 61, and the bonding head 40 connected to the lifting member 62 also ascends.

[0065] Subsequently, with reference to FIG. 7, the movement of the bonding head 40 in the X direction will be described.

[0066] FIG. 7 is a front view of the bonding unit 26. As shown in FIG. 7, the bonding head 40 is movable between a receiving position P1, a working position P2, and a head maintenance position P3. The receiving position P1 is the position where the bonding head 40 receives the component P from the component supply unit 24. The working position P2 is the position where the bonding head 40 presses the component P against the substrate S on the work stage 25. The head maintenance position P3 is the position where an operator reaches inside the bonding apparatus 10 to perform maintenance on the bonding head 40 and the like.

[0067] When the linear motor 54 is driven, the slide portion 53A of the moving base 53 (see FIG. 4A) slides in the X direction along the guide rail 52A of the X frame 52. As a result, the bonding head 40 connected to the moving base 53 also moves in the X direction.

[0068] As the bonding head 40 moves, the connecting portion 46 slides in the X direction with respect to the guide rail 62C of the lifting member 62. That is, the bonding head 40 moves in the X direction with respect to the X frame 52, the head lifting portion 44, and the work stage 25 together with the moving base 53 and the connecting portion 46.

[0069] Here, the center of the fixing member 61 fixed to the load receiving bar 33 when viewed from the Y direction is defined as the fixed position P4. When viewed from the Y direction, the X-direction position (X coordinate) of the motor 63A and the feed screw 63B, that is, the X-direction position of the output shaft of the Z drive unit 63, coincides with the X-direction position (X coordinate) of the fixed position P4. Also, when viewed from the Y direction, the X-direction position (X coordinate) of the fixed position P4, the output shaft of the Z drive unit 63, and the work position P2 coincide.

[0070] With reference to FIG. 8, the force acting on the bonding head 40 during the crimping operation will be described. FIG. 8 is a side view of the bonding portion 26 showing the reaction force acting on the bonding head 40.

[0071] First, the bonding head 40 receives and holds the component P at the receiving position P1. The bonding head 40 holding the component P moves to the work position P2 (see FIG. 7). The work stage 25 supporting the substrate S moves below the bonding head 40 at the work position P2. The work stage 25 further moves in the X and Y directions and rotates around the Z axis in order to align the bonding head 40 with the mounting position of the component P on the substrate S.

[0072] Subsequently, the bonding head 40 descends in the Z direction and presses the held component P onto the substrate S. As shown in FIG. 8, when pressing the component P, the bonding head 40 receives an upward reaction force R1.

[0073] The reaction force R1 acts on the load receiving bar 33 via the connecting portion 46 and the head lifting portion 44. When the reaction force R1 acts on the load receiving bar 33, the load receiving bar 33 and the cover frame 30 that fixes the load receiving bar 33 are deformed (see the dashed line).

[0074] When the cover frame 30 is deformed, the posture of the head lifting portion 44 also changes and an ideal state (a state in which the lifting and lowering direction of the bonding head 40 guided by the head guide 55 is parallel and the lifting member 62 is guided perpendicular to the XY plane) cannot be maintained. When this occurs, torsion occurs between the lifting and lowering direction of the lifting member 62 by the lifting guide 64 and the lifting and lowering direction of the bonding head 40 by the head guide 55. If the bonding head 40 and the lifting member 62 are fixedly coupled, a large lateral force acts on the bonding head 40 due to the moment caused by the torsion, and due to this force, the bonding head 40 and the head stand 42 that supports the bonding head 40 on the base 29 are deformed. The deformation of the bonding head 40 and the head stand 42 causes displacement of the bonding tool 40T in micrometer units, which is a factor in reducing the bonding accuracy.

[0075] In contrast, in the bonding apparatus 10 of the present embodiment, since the bonding head 40 and the head lifting / lowering unit 44 are connected by a connecting unit 46 having a four-degree-of-freedom structure, even if the above-mentioned torsion occurs, the connecting unit 46 follows the torsion and deforms and displaces, suppressing the generation of a moment acting on the bonding head 40. As a result, the deformation of the bonding head 40 and the head stand 42 can be suppressed to such an extent that it can be ignored, so that the bonding accuracy can be maintained at a high level. Note that due to the above-mentioned torsion, a force in the XY direction component derived from the pressing force from the head lifting / lowering unit 44 slightly acts on the bonding head 40, but the deformation of the bonding head 40 and the head stand 42 is almost non-existent or extremely small and can be ignored, so there is no fear of affecting the bonding accuracy.

[0076] Also, in the bonding apparatus 10 of the present embodiment, the head lifting / lowering unit 44 is fixed to the cover frame 30, and the bonding head 40 and the head lifting / lowering unit 44 are connected by a connecting unit 46 having a four-degree-of-freedom structure. Since the cover frame 30 has low rigidity, it easily deforms when receiving the reaction force from the bonding head 40 and the above-mentioned torsion occurs, but the connecting unit 46 follows the torsion and deforms and displaces, so that the bonding accuracy can be maintained at a high level. Conventionally, a robust and heavy load-bearing dedicated column was installed on the base 29, but in the present invention, instead of such a robust column, a cover frame 30 for mounting a cover and a top plate is used as a substitute, so that the bonding apparatus 10 can be miniaturized and space-saving.

[0077] [Summary] Summarizing the above description, the features of the present disclosure will be described.

[0078] In the bonding apparatus 10 according to Embodiment 1, the bonding head 40 is supported by the cover frame 30 via the connecting unit 46 and the head lifting / lowering unit 44 in addition to the head stand 42. By utilizing the existing cover frame 30 as a frame structure for supporting the bonding head 40, it is not necessary to provide a new structure on the base 29. Therefore, the space on the base 29 can be effectively utilized, and the space-saving of the bonding apparatus 10 can be realized.

[0079] Furthermore, even if torsion occurs between the bonding head 40 and the head lifting / lowering unit 44, the connecting portion 46 can displace in the horizontal direction or rotate around the horizontal axis, thereby suppressing the generation of a moment acting on the bonding head 40. Therefore, deformation of the bonding head 40 and the head stand 42 due to the moment can be suppressed, and horizontal displacement of the bonding head 40 and the component P can be suppressed.

[0080] [Effect 1] According to the bonding apparatus 10 according to Embodiment 1, the following effects can be achieved.

[0081] The bonding apparatus 10 of Embodiment 1 includes a base 29, a work stage 25, a bonding head 40, a head stand 42, a cover frame 30, a head lifting / lowering unit 44, and a connecting portion 46. The work stage 25 is disposed on the base 29 and holds the substrate S. The bonding head 40 presses the component P onto the substrate S held by the work stage 25. The head stand 42 is disposed on the base 29 and supports the bonding head 40 in a state where it can be lifted and lowered with respect to the work stage 25. The cover frame 30 is disposed on the base 29 and is equipped with a cover that defines a work space K for housing the work stage 25, the bonding head 40, and the head stand 42. The head lifting / lowering unit 44 raises and lowers the bonding head 40. The connecting portion 46 connects the head lifting / lowering unit 44 and the bonding head 40. The head lifting / lowering unit 44 is supported by the cover frame 30.

[0082] With such a configuration, as a frame structure for supporting the bonding head 40, in addition to the head stand 42, the existing cover frame 30 can be utilized. By utilizing the existing cover frame 30, it is not necessary to provide a dedicated structure for supporting the bonding head 40 on the base 29, so that the bonding apparatus 10 can be miniaturized and space-saving. In addition, the space on the base 29 can be effectively utilized.

[0083] In the bonding apparatus 10 of Embodiment 1, the cover frame 30 includes a plurality of columns 31A to 31H arranged on the base 29 outside the work stage 25, and a load receiving bar 33 indirectly supported by the plurality of columns 31A to 31H. The load receiving bar 33 extends in the X direction (first direction) intersecting the Z direction (height direction). The head lifting unit 44 is supported by the load receiving bar 33.

[0084] With such a configuration, the cover frame 30 can stably support the bonding head 40 via the load receiving bar 33.

[0085] In the bonding apparatus 10 of Embodiment 1, the plurality of columns 31A to 31H are arranged on the base 29 so as to surround the bonding head 40.

[0086] With such a configuration, the cover frame 30 can suppress the bias of force, and the cover frame 30 can more stably support the bonding head 40.

[0087] In the bonding apparatus 10 of Embodiment 1, the head lifting unit 44 includes a fixing member 61 fixed to the cover frame 30, a lifting member 62 that moves up and down with respect to the fixing member 61, and a Z drive unit 63 (first drive unit) that drives the lifting member 62 in the height direction.

[0088] With such a configuration, both the fixation to the load receiving bar 33 and the lifting function of the bonding head 40 can be realized.

[0089] In the bonding apparatus 10 of Embodiment 1, the head stand 42 includes an X frame 52 (first frame) extending in the X direction and legs 51 that support the X frame 52 on the base 29. The bonding head 40 is supported by the X frame 52 in a liftable state.

[0090] With such a configuration, the head stand 42 can support the bonding head 40 in a liftable and stable manner.

[0091] The bonding apparatus 10 of Embodiment 1 further includes a moving base 53 that is movable in the X direction with respect to the X frame 52, and a linear motor 54 (moving device) that drives the moving base 53 in the X direction. The bonding head 40 is mounted on the moving base 53 so as to be movable up and down.

[0092] With such a configuration, the bonding head 40 is movable not only in the lifting direction (Z direction) but also in the X direction.

[0093] In the bonding apparatus 10 of Embodiment 1, the connecting portion 46 connects the head lifting portion 44 and the bonding head 40 so as to be relatively rotatable around the X direction (first horizontal direction) and the Y direction (second horizontal direction) that intersect in the horizontal plane.

[0094] With such a configuration, the rotation of the head lifting portion 44 around the XY axes is absorbed by the connecting portion 46.

[0095] In the bonding apparatus 10 of Embodiment 1, the connecting portion 46 connects the head lifting portion 44 and the bonding head 40 so as to be relatively movable in the X direction and the Y direction.

[0096] With such a configuration, the movement of the head lifting portion 44 in the XY directions is absorbed by the connecting portion 46.

[0097] In the bonding apparatus 10 of Embodiment 1, the connecting portion 46 includes a first base 71 (first connecting base), a second base 72 (second connecting base), and a base connecting portion 73 (flexible joint portion). The first base 71 is slidably connected to the bonding head 40 in the Y direction. The second base 72 is slidably connected to the head lifting portion 44 in the X direction. The base connecting portion 73 is connected to the first base 71 so as to be rotatable around an axis extending in the Y direction, and is connected to the second base 72 so as to be rotatable around an axis extending in the X direction.

[0098] With such a configuration, the movement of the head lifting unit 44 in the XY directions and the rotation around the XY axes are absorbed by the connecting portion 46.

[0099] Note that the present disclosure is not limited to the above-described embodiments and can be implemented in various other modes.

[0100] Although the example in which the load receiving bar 33 is supported by the beams 32C and 32D has been described, the present disclosure is not limited thereto. The load receiving bar 33 may be directly supported by the columns 31A to 31H.

[0101] Although the example in which the load receiving bar 33 extends in the X direction has been described, the present disclosure is not limited thereto. The load receiving bar 33 may extend in the XY plane. By extending the load receiving bar 33 in the X direction, it can be made shorter as compared with the case where it is extended in the Y direction in the bonding apparatus 10.

[0102] Although the example in which the head lifting unit 44 is supported by the load receiving bar 33 has been described, the present disclosure is not limited thereto. The head lifting unit 44 may be fixed to other portions of the cover frame 30.

[0103] Although the example in which the connecting portion 46 has a four-degree-of-freedom structure has been described, the present disclosure is not limited thereto. When the guide rail 62C and the guide rail 52A are adjusted to be parallel, the connecting portion 46 may have a three-degree-of-freedom structure that connects the head lifting unit 44 and the bonding head 40 so as to be relatively rotatable around the X and Y axes and relatively slidable in the X direction. In this case, if the bonding head 40 has a structure symmetric with respect to the YZ plane, the connecting portion 46 may not be relatively rotatable around the Y axis. When the bonding head 40 is fixed in the X direction as in the first modification, the connecting portion 46 may have a two-degree-of-freedom structure that connects the head lifting unit 44 and the bonding head 40 so as to be relatively rotatable around the X and Y axes.

[0104] (First Modification) FIG. 9 is a side view of the bonding portion 126 in Modification 1, and FIG. 10 is a front view of the bonding portion 126 in Modification 1. In Modification 1, descriptions overlapping with those in Embodiment 1 are omitted, and components identical or equivalent to those in Embodiment 1 are denoted by the same reference numerals.

[0105] As shown in FIGS. 9 and 10, the bonding portion 126 in Modification 1 differs from the bonding portion 26 in Embodiment 1 in that the bonding head 40 is fixed in the X direction. The bonding head 40 is located at the working position P2.

[0106] As shown in FIG. 9, in Modification 1, the head stand 42 has an X frame 152 instead of the X frame 52 in Embodiment 1. The X frame 152 has a slide portion 153B that fits with the guide rail 40A of the bonding head 40 on the side surface of the front side (+Y side). The bonding head 40 is mounted on the slide portion 153B so as to be able to move up and down.

[0107] In Modification 1, the moving base 53 and the guide rail 52A extending in the X direction are omitted.

[0108] As shown in FIG. 10, in Modification 1, the head lifting / lowering portion 44 has a lifting / lowering member 162 instead of the lifting / lowering member 62 in Embodiment 1. The lifting / lowering member 162 is a plate-like member extending along the XZ plane and has a rectangular shape.

[0109] A guide rail 162C is provided at the lower end of the lifting / lowering member 162, to which the connecting portion 46 is slidably connected. The guide rail 162C is shorter than the guide rail 62C in Embodiment 1. Even when the bonding head 40 is fixed in the X direction, by providing the guide rail 162C, the connecting portion 46 can be displaced in the X direction. Therefore, even if torsion occurs between the bonding head 40 and the head lifting / lowering portion 44, the connecting portion 46 can be displaced in the X direction, suppressing the generation of a moment acting on the bonding head 40.

[0110] In the bonding apparatus according to the first aspect, there are provided a base, a work stage disposed on the base for holding a substrate, a bonding head for pressing a component onto the substrate held by the work stage, a head stand disposed on the base for supporting the bonding head in a vertically movable state with respect to the work stage, a cover frame disposed on the base for mounting a cover that defines a work space for accommodating the work stage, the bonding head, and the head stand, a head lifting / lowering unit for lifting and lowering the bonding head, and a connecting unit for connecting the head lifting / lowering unit and the bonding head. The head lifting / lowering unit is supported by the cover frame.

[0111] As the bonding apparatus according to the second aspect, in the bonding apparatus according to the first aspect, the cover frame has a plurality of columns disposed on the base outside the work stage, and a load receiving bar directly or indirectly supported by the plurality of columns and extending in a first direction intersecting the height direction. The head lifting / lowering unit is supported by the load receiving bar.

[0112] As the bonding apparatus according to the third aspect, in the bonding apparatus according to the second aspect, the plurality of columns are disposed on the base so as to surround the bonding head.

[0113] As the bonding apparatus according to the fourth aspect, in the bonding apparatus according to any one of the first to third aspects, the head lifting / lowering unit has a fixing member fixed to the cover frame, a lifting / lowering member that moves up and down with respect to the fixing member, and a first driving unit that drives the lifting / lowering member in the height direction.

[0114] As the bonding apparatus according to the fifth aspect, in the bonding apparatus according to any one of the first to fourth aspects, the head stand has a first frame extending in a first direction intersecting the height direction, and legs for supporting the first frame on the base. The bonding head is supported by the first frame in a vertically movable state.

[0115] As the bonding apparatus in the sixth aspect, in the bonding apparatus in the fifth aspect, the first frame has a connecting portion, and the bonding head is mounted on the connecting portion so as to be movable up and down.

[0116] As the bonding apparatus in the seventh aspect, in the bonding apparatus in the fifth aspect, it further has a moving base movable in a first direction with respect to the first frame and a moving device for driving the moving base in the first direction, and the bonding head is mounted on the moving base so as to be movable up and down.

[0117] As the bonding apparatus in the eighth aspect, in the bonding apparatus in any one of the first to seventh aspects, the connecting portion connects the head lifting portion and the bonding head so as to be relatively rotatable around a first horizontal direction and a second horizontal direction intersecting in a horizontal plane.

[0118] As the bonding apparatus in the ninth aspect, in the bonding apparatus in the eighth aspect, the connecting portion connects the head lifting portion and the bonding head so as to be relatively movable in the first horizontal direction and the second horizontal direction.

[0119] As the bonding apparatus in the tenth aspect, in the bonding apparatus in the ninth aspect, the connecting portion has a first connecting base slidably connected to the bonding head in a second horizontal direction, a second connecting base slidably connected to the head lifting portion in a first horizontal direction, and a universal joint portion connected to the first connecting base so as to be rotatable around an axis extending in the first horizontal direction or the second horizontal direction and connected to the second connecting base so as to be rotatable around an axis extending in the second horizontal direction or the first horizontal direction.

[0120] The present disclosure is fully described in connection with preferred embodiments with reference to the accompanying drawings, but various modifications and corrections will be apparent to those skilled in this art. Such modifications and corrections should be understood to be included therein as long as they do not depart from the scope of the present invention according to the appended claims.

Industrial Applicability

[0121] The present disclosure is applicable to a bonding apparatus for bonding components to a substrate.

Description of Reference Numerals

[0122] 10 Bonding apparatus 25 Work stage 26 Bonding unit 29 Base 30 Cover frame 31A~31H Support columns 33 Load receiving bar 40 Bonding head 42 Head stand 44 Head lifting / lowering unit 46 Connecting part 52 X-frame 53 Moving base 54 Linear motor 61 Fixed member 62 Lifting / lowering member 63 Z-driving unit

Claims

1. A base, A work stage disposed on the base for holding a substrate, A bonding head for pressing components onto the substrate held on the work stage, A head stand disposed on the base for supporting the bonding head in a state where it can move up and down with respect to the work stage, A cover frame disposed on the base for mounting a cover that defines a work space for accommodating the work stage, the bonding head, and the head stand, A head lifting / lowering unit for lifting and lowering the bonding head, A connecting portion for connecting the head lifting / lowering unit and the bonding head, Comprising, The head lifting / lowering unit is supported by the cover frame, A bonding apparatus.

2. The cover frame has a plurality of struts disposed on the base outside the work stage, and a load receiving bar directly or indirectly supported by the plurality of struts and extending in a first direction intersecting the height direction, The head lifting / lowering unit is supported by the load receiving bar, The bonding apparatus according to Claim 1.

3. The plurality of struts are disposed on the base so as to surround the bonding head, The bonding apparatus according to Claim 2.

4. The head lifting / lowering unit has a fixing member fixed to the cover frame, a lifting / lowering member that moves up and down with respect to the fixing member, and a first driving unit that drives the lifting / lowering member in the height direction, The bonding apparatus according to Claim 1.

5. The head stand has a first frame extending in a first direction intersecting the height direction, and legs for supporting the first frame on the base, The bonding head is supported by the first frame in a state where it can move up and down, The bonding apparatus according to Claim 1.

6. The first frame has a connecting portion, The bonding head is mounted on the connecting portion so as to be able to move up and down, The bonding apparatus according to Claim 5.

7. Further comprising a moving base movable in the first direction with respect to the first frame, and a moving device for driving the moving base in the first direction, The bonding head is mounted on the moving base so as to be able to move up and down, The bonding apparatus according to Claim 5.

8. The connecting portion connects the head lifting / lowering unit and the bonding head so as to be relatively rotatable around a first horizontal direction and a second horizontal direction intersecting in a horizontal plane, The bonding device according to any one of claims 1 to 7.

9. The connecting portion connects the head lifting portion and the bonding head so as to be relatively movable in the first horizontal direction and the second horizontal direction. The bonding device according to claim 8.

10. The connecting portion a first connecting base slidably connected to the bonding head in the second horizontal direction, a second connecting base slidably connected to the head lifting portion in the first horizontal direction, and a universal joint portion connected to the first connecting base so as to be rotatable about an axis extending in the first horizontal direction or the second horizontal direction, and connected to the second connecting base so as to be rotatable about an axis extending in the second horizontal direction or the first horizontal direction. The bonding device according to claim 9.

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