Imaging device holding member and housing

Abstract

To provide an imaging device holding member for efficiently cooling an imaging device.SOLUTION: An imaging device holding member to which an imaging device can be removably mounted is formed of a thermal conduction member at least partially. The imaging device is thermally connected to a heat absorption surface of a Peltier module with a heat release surface and a heat absorption surface via the imaging device holding member. The heat release surface of the Peltier module releases heat by the heat release unit thermally connected to the heat release surface of the Peltier module.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an imaging device holding member and a housing.

Background Art

[0002] In imaging devices, as performance such as image quality and sensitivity improves, the power consumption and heat generation of electronic components tend to increase. On the other hand, since the temperature rise inside the imaging device due to heat generation of the electronic components also leads to failures and deterioration of image quality, a cooling mechanism is required in high-performance imaging devices. In particular, when the imaging device is used by being housed inside a housing for outdoor use, since the housing has a sealed structure, there has been a problem that heat stays inside the housing and the temperature inside the imaging device rises.

[0003] To solve such problems, Patent Document 1 and Patent Document 2 disclose techniques for cooling the inside of a housing that houses an imaging device using a Peltier module.

[0004] In Patent Document 1, air whose temperature is adjusted using a Peltier module is blown into the housing, making it possible to adjust the temperature inside the housing within a predetermined range. Patent Document 2 provides an adiabatic constant-temperature box inside a camera housing that covers a lens unit and a camera module. Then, by sending air whose temperature is adjusted using a Peltier module into the constant-temperature box, it is possible to keep the inside of the constant-temperature box at a desired temperature.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, in the technologies disclosed in Patent Document 1 and Patent Document 2 described above, the imaging device is cooled by applying the air inside the cooled housing to the imaging device, and thus, the heat transfer of the air cools the imaging device. Therefore, first, it is necessary to cool the entire air inside the housing, and there is a problem in that the heat dissipation efficiency is deteriorated as compared with the case of directly cooling the imaging device.

[0007] Therefore, an object of the present invention is to provide an imaging device holding member capable of efficiently cooling an imaging device.

Means for Solving the Problems

[0008] In order to achieve the above object, an imaging device holding member according to one aspect of the present invention is an imaging device holding member to which an imaging device can be detachably attached, and at least a part of the imaging device holding member is composed of a heat conductive member, and the imaging device is thermally connected to the heat absorption surface of a Peltier module having a heat dissipation surface and a heat absorption surface via the imaging device holding member, and heat of the heat dissipation surface of the Peltier module is dissipated by a heat dissipation unit thermally connected to the heat dissipation surface of the Peltier module.

Effects of the Invention

[0009] According to the present invention, the imaging device can be efficiently cooled.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Mode for Carrying Out the Invention

[0011] Hereinafter, preferred embodiments of the present invention will be described in detail based on the accompanying drawings. However, the embodiments of the present invention are not limited to the following embodiments. The same or equivalent components, members, and processes shown in each drawing are denoted by the same reference numerals, and repeated explanations are appropriately omitted. Also, some of the members that are not important for the description in each drawing are omitted from the display.

[0012] <Embodiment 1> Hereinafter, an imaging device holding member 100 to which an imaging device 101 can be detachably attached according to Embodiment 1 will be described. FIG. 1 is an example of a perspective view of the imaging device holding member 100 according to Embodiment 1.

[0013] The imaging device holding member 100 is a member (sheet metal member) having a substantially L-shape to which the imaging device 101 with the lens 102 attached can be detachably attached. The main material of the imaging device holding member 100 is composed of a heat conductive member such as an aluminum alloy or a copper alloy. Note that the imaging device 101 is attached (mounted) to the longitudinal side of the imaging device holding member 100 having a substantially L-shape as shown in FIG. 1. Also, although the imaging device holding member 100 has an L-shape, the bending angle at this time is not limited to a right angle. Note that it is formed in an L-shape at an angle considering manufacturing errors and design tolerances.

[0014] Note that in this embodiment, the imaging device 101 is a lens exchangeable imaging device (camera) with the lens 102 attached, but it is not limited to this, and the imaging device detachably attached to the imaging device holding member 100 may be an integrated lens imaging device.

[0015] The imaging device 101 is attached to the imaging device holding member 100 via an adjustment member 103 in order to facilitate attachment and detachment to and from the imaging device holding member 100. The adjustment member 103 is preferably made of a material with high thermal conductivity such as an aluminum alloy or a copper alloy. The adjustment member 103 is configured to be able to move the attachment position with respect to the imaging device holding member 100 back and forth in the optical axis direction. Also, the imaging device 101 is attached (fixed) to the imaging device holding member 100 via the adjustment member 103 by fastening means such as screws (not shown). When using the adjustment member 103, the adjustment member 103 functions as a part of the imaging device holding member 100. Note that the imaging device 101 may be directly attached to the imaging device holding member 100 without using the adjustment member 103.

[0016] Also, in the present embodiment, the imaging device 101 is composed of at least one computer including a CPU, a memory, etc. of the imaging device 101, and one or more control boards (control units) that control the entire imaging device 101 are not shown and their description is omitted. One or more of the control boards (control units) are arranged inside the imaging device 101. Note that the control board may be arranged separately from the imaging device 101 and protected by a sheet metal member or the like in, for example, the housing 108.

[0017] The imaging device holding member 100 includes a heat dissipation unit 106 composed of a first fin 104 and a first fan 105. In the present embodiment, a Peltier module 107 (not shown in FIG. 1) is sandwiched between the imaging device holding member 100 and the heat dissipation unit 106. That is, in the optical axis OA direction, the Peltier module 107 is arranged between the short side of the imaging device holding member 100 and the heat dissipation unit 106. The heat dissipation unit 106 has a function of dissipating heat from the heat dissipation surface of the Peltier module 107 described later.

[0018] The Peltier module 107 is configured to have a heat dissipation surface and a heat absorption surface. When the Peltier module 107 is arranged, the heat dissipation surface of the Peltier module 107 is located on the heat dissipation unit 106 side in the optical axis OA direction, and the heat absorption surface is located on the imaging device holding member 100 side in the optical axis OA direction. By arranging in such a manner, the Peltier module 107 and the heat dissipation unit 106 are thermally connected. Further, the Peltier module 107 and the imaging device holding member 100 are thermally connected. Also, the Peltier module 107 is wired (connected) to a power supply unit (not shown) via lead wires that the Peltier module 107 has.

[0019] The imaging device 101 of Embodiment 1 is attached to an imaging device holding member 100 made of a heat conductive member via an adjustment member 103 made of a material with high thermal conductivity as described above. Thereby, the imaging device holding member 100 is thermally connected to the heat absorption surface of the Peltier module 107. That is, the imaging device 101 is thermally connected to the heat absorption surface of the Peltier module 107 via the adjustment member 103 and the imaging device holding member 100.

[0020] From the above heat path, the Peltier module 107 enables the imaging device 101 to be cooled by heat conduction. On the other hand, the heat of the heat dissipation surface of the Peltier module 107 is transmitted to the first fin 104 and is dissipated by heat exchange with the outside air by the first fan 105.

[0021] Note that in Embodiment 1, as described above, the heat dissipation unit 106 is composed of the first fin 104 and the first fan 105, but it is not limited thereto as long as it has a function of dissipating the heat of the heat dissipation surface of the Peltier module 107.

[0022] FIG. 2 is a cross-sectional perspective view showing the imaging device holding member 100 housed in the housing 108 according to Embodiment 1. When the imaging device 101 is installed outdoors or the like, for the purpose of protecting the imaging device 101, the imaging device 101 is housed in the housing 108.

[0023] The housing 108 is composed of a housing casing (main body part) 109 and a housing lid (lid part) 110. The housing casing 109 and the housing lid 110 function as an exterior part. After attaching the imaging device holding member 100 to the housing casing 109, by coronally attaching the housing lid 110, the imaging device holding member 100 is housed inside the housing 108. Incidentally, the imaging device holding member 100 is fixed to the housing 108 by fastening means such as screws (not shown). Further, the housing casing 109 is provided with one or more air inlets 115 and one or more air outlets 116.

[0024] The housing lid 110 is fixed to the housing casing 109 in a state where the inside of the housing casing is sealed by fastening means such as screws (not shown), for example. Also, the housing lid 110 may be held so as to be openable and closable with respect to the housing casing 109 using a hinge or the like.

[0025] As shown in FIG. 2, the inside of the housing 108 is divided into a first region 113 and a second region 114 by a partition plate 112. The first region 113 is a region for housing the imaging device 101, and it is desirable to form a sealed structure (sealed space) that prevents raindrops and dust from entering from the outside of the housing 108. A heat dissipation unit 106 is installed in the second region 114. Further, the air inlet 115 and the air outlet 116 are located on the second region 114 side. The second region 114 in the present embodiment is configured as an open structure (open space) for dissipating heat from the first fins 104 by the first fan 105 via the air inlet 115 and the air outlet 116.

[0026] When using the imaging device 101 inside the housing 108, in order to prevent the housing casing 109 from being reflected in the video, it is important to bring the lens 102 as close as possible to the housing front window 111. Therefore, as described above, by moving the mounting position of the adjustment member 103 with respect to the imaging device holding member 100 back and forth in the direction of the optical axis OA, it is possible to bring the lens 102 closer to the housing front window 111.

[0027] In Embodiment 1, the configuration in the case where the imaging device holding member 100 is housed in the housing 108 was shown. However, it may be used without being housed in the housing 108, in a state where the imaging device 101 is held by the imaging device holding member 100 (the imaging device holding member 100 alone).

[0028] Also, in Embodiment 1, assuming the case of cooling the imaging device 101, the heat absorption surface side of the Peltier module 107 was arranged on the imaging device 101 side and the heat radiation surface side was arranged on the heat radiation unit 106 side. Here, the Peltier module has the characteristic that when the polarity of the current applied to the Peltier module is reversed, the relationship between the heat absorption surface and the heat radiation surface is reversed.

[0029] Utilizing this characteristic, a control unit (not shown) controls a power supply unit (not shown) to which the Peltier module 107 is connected, and for example, may reverse the polarity of the current applied to the Peltier module 107 in cold weather.

[0030] For example, the control unit reverses the polarity of the current applied to the Peltier module 107 according to the temperature of the ambient air. At this time, for example, a sensor or the like capable of measuring temperature is arranged on the imaging device 101 or the housing 108 to measure the temperature of the ambient air. Then, when the temperature of the ambient air becomes lower than a preset threshold value, the control unit may reverse the polarity of the current applied to the Peltier module 107. Thereby, the heat absorption surface of the Peltier module 107 can be made on the heat radiation unit 106 side and the heat radiation surface can be made on the imaging device 101 side. By doing so, the Peltier module 107 can also be used as a heater (heating unit) for heating the imaging device 101.

[0031] When the temperature of the ambient air reaches or exceeds a predetermined threshold set in advance by heating the imaging device 101 or when a certain period of time has elapsed after reaching or exceeding the predetermined threshold, it is preferable to reverse the polarity of the current applied to the Peltier module 107. That is, when it is considered that the ambient air has been sufficiently warmed up, the control unit reverses the polarity of the current applied to the Peltier module 107 again, making the heat dissipation surface of the Peltier module 107 face the heat dissipation unit 106 side and the heat absorption surface face the imaging device 101 side.

[0032] In this way, the Peltier module 107 can also function as a temperature adjustment means for adjusting the temperature of the imaging device 101 by heat conduction according to the temperature of the ambient air. In other words, the Peltier module 107 also functions as a temperature adjustment means that can adjust the temperature of the imaging device 101 by reversing the polarity of the current applied to the Peltier module 107 according to the temperature of the ambient air.

[0033] Note that, not limited to the control unit (not shown) of the imaging device 101, for example, the polarity of the current applied to the Peltier module 107 may be reversed by an operation of a user or the like from a client device (information processing device) constituted by a PC or the like. In that case, while the client device is connected to the imaging device 101 so as to be communicable by wire or wirelessly, a signal for reversing the polarity of the current applied to the Peltier module 107 is transmitted by an operation of a user or the like, and the polarity of the current applied to the Peltier module 107 is reversed. At this time, for example, the transmitted signal is received by a control unit (not shown) of the imaging device 101, and the control unit controls a power supply unit (not shown) based on the received signal to reverse the polarity of the current applied to the Peltier module.

[0034] As described above, by using the imaging device holding member 100 according to Embodiment 1, it becomes possible to efficiently cool an imaging device housed in a detachable module such as the housing 108.

[0035] <Embodiment 2> In Embodiment 1, an example was given in which the imaging device holding member 100 is composed of a single heat conduction member such as an aluminum alloy or a copper alloy. However, the imaging device holding member only needs to be at least partially composed of a heat conduction member. In Embodiment 2, an example of implementation in the case of a member configured by combining a plurality of components including a heat conduction member will be described. In addition, the same components as those in Embodiment 1 in Embodiment 2 are denoted by the same reference numerals, and their descriptions are omitted. Also, descriptions of the same configurations (such as the arrangement positions of each member) as those in Embodiment 1 are omitted.

[0036] FIG. 3 is a perspective view of the imaging device holding member 200 according to Embodiment 2. As shown in FIG. 3, the imaging device holding member 200 of Embodiment 2 is composed of a heat receiving member 2001, a heat radiating member 2002, and a heat pipe 2003. Although four heat pipes 2003 are provided as shown in FIG. 3 in Embodiment 2, one or more heat pipes 2003 may be provided. One side of the heat pipe 2003 is attached to the heat receiving member 2001, and the other side of the heat pipe 2003 is attached to the heat radiating member 2002. With such a configuration, the heat receiving member 2001 and the heat radiating member 2002 are thermally connected to the heat pipe 2003.

[0037] FIG. 4 is a cross-sectional perspective view showing the imaging device holding member 200 housed in the housing 108 according to Embodiment 2. Further, the imaging device 101 may be used in a state where the imaging device 101 is not housed in the housing 108 and the imaging device 101 is held by the imaging device holding member 200 (the imaging device holding member 200 alone).

[0038] The heat-receiving member 2001 is attached to one side of the heat pipe 2003, specifically, one end (one end side) as described above. The heat-receiving member 2001 holds the imaging device 101 and is thermally connected to the imaging device 101. The heat-radiating member 2002 is attached to the other side of the heat pipe 2003, specifically, the other end (the other end side) as described above. The heat-radiating member 2002 is thermally connected to the heat-absorbing surface of the Peltier module 107. Thus, the imaging device 101 in the second embodiment is thermally connected to the heat-absorbing surface of the Peltier module 107 via the heat-receiving member 2001, the heat pipe 2003, and the heat-radiating member 2002.

[0039] In addition, when using the adjustment member 103, the imaging device 101 is thermally connected to the heat-absorbing surface of the Peltier module 107 via the adjustment member 103, the heat-receiving member 2001, the heat pipe 2003, and the heat-radiating member 2002.

[0040] As described above, in the second embodiment, the imaging device 101 is thermally connected to the heat-absorbing surface of the Peltier module 107 via the imaging device holding member 200 or the like, enabling efficient cooling of the imaging device 101 by heat conduction.

[0041] In the second embodiment, the heat-conducting member of the imaging device holding member 200 is a heat pipe, but it is not limited thereto. For example, a member with a high thermal conductivity compared to members such as resin, such as a graphite sheet or a vapor chamber, may be used. For example, assume a case where a graphite sheet is used for the heat-conducting member of the imaging device holding member 200. In that case, attach the graphite sheet to the surface of the sheet metal member (imaging device holding member) having the same or a similar shape as the imaging device holding member 200 in the first embodiment and contacting the imaging device 101 or the adjustment member 103 so as to be thermally connected to the Peltier module.

[0042] Also, in Embodiment 2 as in Embodiment 1, a control unit (not shown) controls a power supply unit (not shown) to which the Peltier module 107 is connected, and may reverse the polarity of the current applied to the Peltier module 107 during cold weather. As a result, the heat absorption surface of the Peltier module 107 can be on the side of the heat dissipation unit 106, and the heat dissipation surface can be on the side of the imaging device 101. Thus, also in Embodiment 2, the Peltier module 107 can function as an adjustment means for adjusting the temperature of the imaging device 101.

[0043] <Embodiment 3> In Embodiments 1 and 2, an example was given of cooling the imaging device 101 only by heat conduction through the imaging device holding member 100 and the imaging device holding member 200.

[0044] Here, for example, when the imaging device 101 is housed inside the housing 108 and the heat dissipation method of the imaging device 101 is forced air cooling, most of the exhaust heat of the imaging device 101 is dissipated to the air inside the housing 108. In that case, in addition to cooling the imaging device 101 by heat conduction as exemplified in Embodiments 1 and 2, it is necessary to cool the air inside the housing 108.

[0045] In Embodiment 3, an example of implementation will be described in the case of providing a heat transfer path through the air inside the housing 108 in addition to heat conduction through the imaging device holding member 100 when cooling the imaging device 101 housed in the housing 108.

[0046] FIG. 5 is a cross-sectional view of the imaging device holding member 100 according to Embodiment 3. Note that the same components as those in Embodiment 1 are denoted by the same reference numerals, and their descriptions are omitted. Also, the imaging device holding member 100 may be a member configured by combining a plurality of components including a heat conductive member, like the imaging device holding member 200 shown in Embodiment 2.

[0047] When the imaging device 101 and the Peltier module 107 are in a driving state, the imaging device holding member 100 has a temperature gradient inside. In the imaging device holding member 100 of Embodiment 3, the portion in contact with the imaging device 101, which is the heat source, is defined as a high-temperature portion 100H where the temperature is above the average, and the portion in contact with the heat absorption surface of the Peltier module 107 is defined as a low-temperature portion 100L where the temperature is below the average.

[0048] In Embodiment 3, the imaging device holding member 100 has a second fin 301 that is thermally connected to the low-temperature portion 100L. The second fin 301 is provided with a second fan 302, and the air inhaled by the second fan 302 passes through the protrusions of the second fin 301 and is cooled by exchanging heat with the second fin 301.

[0049] Further, the housing 108 has a duct 303 attached (fixed) to the housing lid 110. And an air passage A is formed by the housing lid 110 and the duct 303. When the housing lid 110 is attached to the housing casing 109, one end of the duct 303 is connected to the discharge port (exhaust port) of the second fan 302. With such a configuration, the air cooled by the second fin 301 can be exhausted into the housing 108. Specifically, by the second fan 302, the air around the second fin 302 (the air around the second fin) passes through the duct 303 from the discharge port of the second fan, that is, through the air passage A. Then, the air (cooling air) that has passed through the duct 303 is exhausted into the housing 108 (the region where the imaging device holding member 100 is disposed) through an exhaust port formed at the other end of the duct 303 through which the air can be exhausted.

[0050] As described above, in Embodiment 3, the air cooled by the second fin 301 is discharged into the housing 108, making it possible to cool the air inside the housing 108.

[0051] As described above, in the third embodiment, in addition to heat conduction through the imaging device holding member 100, the air inside the housing 108 can be cooled by discharging the cooled air into the housing 108, so that the imaging device can be cooled more efficiently.

[0052] In addition, in this embodiment, although the air passage A is formed by the duct 303 and the housing lid 110, any form may be adopted as long as it is connected to the discharge port of the second fan 302 and has a function of discharging air into the housing 108.

[0053] Also, in the third embodiment as well as in the first embodiment, a control unit (not shown) controls a power supply unit (not shown) to which the Peltier module 107 is connected, and in cold weather, the polarity of the current applied to the Peltier module 107 may be reversed. Thereby, the heat absorption surface of the Peltier module 107 can be on the side of the heat dissipation unit 106, and the heat dissipation surface can be on the side of the imaging device 101. Thus, also in the third embodiment, the Peltier module 107 can function as an adjusting means for adjusting the temperature of the imaging device 101.

[0054] As described above, the preferred embodiments of the present invention have been described, but the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist thereof.

[0055] The disclosure of this embodiment includes the following configurations.

[0056] (Configuration 1) An imaging device holding member capable of detachably mounting an imaging device, at least a part of the imaging device holding member is composed of a heat conductive member, the imaging device is thermally connected to the heat absorption surface of a Peltier module having a heat dissipation surface and a heat absorption surface via the imaging device holding member, The heat of the heat dissipation surface of the Peltier module is dissipated by a heat dissipation unit that is thermally connected to the heat dissipation surface of the Peltier module. An imaging device holding member characterized by this.

[0057] (Configuration 2) A heat dissipation unit including a first fin and a first fan, wherein heat of the heat dissipation surface of the Peltier module is dissipated by being thermally connected to the heat dissipation surface of the Peltier module. The imaging device holding member according to Configuration 1, characterized in that

[0058] (Configuration 3) The imaging device holding member according to Configuration 1 or 2, further comprising adjustment means for adjusting the mounting position of the imaging device in the optical axis direction.

[0059] (Configuration 4) The adjustment means is made of a material having a high thermal conductivity, The imaging device is thermally connected to the heat absorption surface of the Peltier module via the adjustment means and the imaging device holding member. The imaging device holding member according to Configuration 3, characterized in that

[0060] (Configuration 5) The heat conduction member is composed of one or more heat pipes. The imaging device holding member according to any one of Configurations 1 to 4, characterized in that

[0061] (Configuration 6) The heat conduction member is at least one of a graphite sheet or a vapor chamber. The imaging device holding member according to any one of Configurations 1 to 4, characterized in that

[0062] (Configuration 7) A heat dissipation member thermally connected to the Peltier module, A heat receiving member for holding the imaging device, and further comprising: The heat receiving member is attached to one side of the heat pipe, and the heat dissipation member is attached to the other side of the heat pipe, so that the imaging device is thermally connected to the Peltier module. The imaging device holding member according to Configuration 5, characterized in that

[0063] (Configuration 8) The imaging device holding member has a temperature gradient, The imaging device holding member according to any one of Configurations 1 to 7, wherein a second fin and a second fan are thermally connected to a low-temperature portion of the imaging device holding member.

[0064] (Configuration 9) The imaging device holding member according to Configuration 8, wherein air around the second fin is exhausted into a region where the imaging device holding member is disposed through a duct connected to an exhaust port of the second fan by the second fan thermally connected to the low-temperature portion.

[0065] (Configuration 10) The imaging device holding member according to Configuration 9, wherein the low-temperature portion is a portion in contact with the heat absorption surface of the Peltier module.

[0066] (Configuration 11) The imaging device holding member according to Configuration 9 or 10, wherein one end of the duct is connected to an exhaust port of the second fan, and an exhaust port capable of exhausting the air into a region where the imaging device holding member is disposed is formed at the other end of the duct.

[0067] (Configuration 12) The imaging device holding member according to any one of Configurations 1 to 11, wherein the imaging device holding member is housed in a housing.

[0068] (Configuration 13) A housing for housing an imaging device, an imaging device holding member to which the imaging device can be detachably attached, a Peltier module having a heat dissipation surface and a heat absorption surface, a heat dissipation unit that dissipates heat from the heat dissipation surface of the Peltier module, and is provided with, at least a part of the imaging device holding member is constituted by a heat conductive member, The imaging device is thermally connected to the heat absorption surface of the Peltier module via the imaging device holding member, and is characterized by the housing.

[0069] (Configuration 14) The imaging device further includes an adjustment member that is made of a material with high thermal conductivity and is adjustable in the optical axis direction with respect to the mounting position of the imaging device on the imaging device holding member. The imaging device is thermally connected to the heat absorption surface of the Peltier module via the adjustment member and the imaging device holding member, and the housing according to Configuration 13 is characterized in that.

[0070] (Configuration 15) The heat conduction member is at least one of a heat pipe, a graphite sheet, or a vapor chamber, and the housing according to Configuration 13 or 14 is characterized in that.

[0071] (Configuration 16) A partition plate disposed in the housing forms a first region for accommodating the imaging device holding member and a second region for accommodating the heat dissipation unit, and the housing according to any one of Configurations 13 to 15 is characterized in that.

[0072] (Configuration 17) The housing according to any one of Configurations 13 to 16 is characterized in that it has temperature adjustment means for adjusting the temperature of the imaging device by reversing the polarity of the current applied to the Peltier module according to the temperature of the ambient air.

[0073] (Configuration 18) The housing according to any one of Configurations 13 to 17 is characterized in that the housing is composed of a main body for housing the imaging device and a lid portion fixed to the main body.

[0074] (Configuration 19) The imaging device holding member has a temperature gradient. A second fin and a second fan are provided at the low-temperature portion of the imaging device holding member. The imaging device holding member further includes a duct that is attached to the lid portion and connected to the exhaust port of the second fan. The housing according to Configuration 18, wherein the second fan exhausts the air around the second fin into the housing through the duct.

Explanation of Signs

[0075] 100 Imaging device holding member 101 Imaging device 102 Lens 103 Adjusting member 104 First fin 105 First fan 106 Heat dissipation unit 107 Peltier module 108 Housing

Claims

1. An imaging device holding member to which an imaging device can be detachably attached, at least a part of the imaging device holding member is composed of a heat conduction member, the imaging device is thermally connected to the heat absorption surface of a Peltier module having a heat dissipation surface and a heat absorption surface via the imaging device holding member, The heat of the heat dissipation surface of the Peltier module is dissipated by a heat dissipation unit that is thermally connected to the heat dissipation surface of the Peltier module. An imaging device holding member characterized by this.

2. The heat dissipation unit includes a first fin and a first fan. The imaging device holding member according to claim 1, characterized by this.

3. The imaging device holding member according to claim 1, further comprising adjustment means for making it possible to adjust the mounting position of the imaging device in the optical axis direction.

4. The adjustment means is made of a material with high thermal conductivity, The imaging device is thermally connected to the heat absorption surface of the Peltier module via the adjustment means and the imaging device holding member. The imaging device holding member according to claim 3, characterized by this.

5. The heat conduction member is composed of one or more heat pipes. The imaging device holding member according to claim 1, characterized by this.

6. The heat conduction member is at least one of a graphite sheet or a vapor chamber. The imaging device holding member according to claim 1, characterized by this.

7. A heat dissipation member thermally connected to the Peltier module, and a heat receiving member for holding the imaging device. The imaging device holding member according to claim 5, further comprising: the heat receiving member is attached to one side of the heat pipe, and the heat dissipation member is attached to the other side of the heat pipe, whereby the imaging device is thermally connected to the Peltier module.

8. The imaging device holding member has a temperature gradient, A second fin and a second fan are thermally connected to the low temperature part of the imaging device holding member. The imaging device holding member according to claim 1, characterized by this.

9. The air around the second fin is exhausted into the area where the imaging device holding member is arranged via a duct connected to the exhaust port of the second fan by the second fan thermally connected to the low temperature part. The imaging device holding member according to claim 8, characterized by this.

10. ​ The imaging device holding member according to claim 9, wherein the low-temperature portion is a portion that contacts the heat absorption surface with the Peltier module.

11. The imaging device holding member according to claim 9, wherein one end of the duct is connected to the exhaust port of the second fan, and an exhaust port capable of exhausting the air into the region where the imaging device holding member is disposed is formed at the other end of the duct.

12. The imaging device holding member according to claim 1, wherein the imaging device holding member is housed in a housing.

13. A housing for housing an imaging device, an imaging device holding member detachably attachable to the imaging device, a Peltier module having a heat dissipation surface and a heat absorption surface, and a heat dissipation unit that dissipates the heat of the heat dissipation surface of the Peltier module, wherein at least a part of the imaging device holding member is constituted by a heat conduction member, and the imaging device is thermally connected to the heat absorption surface of the Peltier module via the imaging device holding member.

14. The housing according to claim 13, further comprising an adjustment member that is made of a material having a high thermal conductivity and is adjustable in the optical axis direction for the mounting position of the imaging device with respect to the imaging device holding member, wherein the imaging device is thermally connected to the heat absorption surface of the Peltier module via the adjustment member and the imaging device holding member.

15. The housing according to claim 13, wherein the heat conduction member is at least one of a heat pipe, a graphite sheet, or a vapor chamber.

16. The housing according to claim 13, wherein a first region for housing the imaging device holding member and a second region for housing the heat dissipation unit are formed by a partition plate disposed in the housing.

17. The housing according to claim 13, having temperature adjustment means capable of adjusting the temperature of the imaging device by inverting the polarity of the current applied to the Peltier module according to the temperature of the ambient air.

18. The housing according to claim 13, wherein the housing is constituted by a main body portion for housing the imaging device and a lid portion fixed to the main body portion.

19. The imaging device holding member has a temperature gradient, a second fin and a second fan are provided at the low-temperature portion of the imaging device holding member, A duct attached to the lid portion and connected to the exhaust port of the second fan; and The second fan is characterized in that air around the second fins is exhausted into the housing through the duct, according to the housing of claim 18.

Images